Texas Instruments | TPA6166A2 Audio Amplifier with Jack Detection | User Guides | Texas Instruments TPA6166A2 Audio Amplifier with Jack Detection User guides

Texas Instruments TPA6166A2 Audio Amplifier with Jack Detection User guides
User's Guide
SLOU381 – March 2014
TPA6166A2 Multimedia Headset Interface
This user’s guide describes the characteristics, operation, and use of the TPA6166A2EVM evaluation
module (EVM). This document includes schematic diagrams, a printed circuit board (PCB) layout, and a
bill of materials.
1
2
3
4
5
6
7
8
9
10
11
Contents
Introduction ................................................................................................................... 2
Description .................................................................................................................... 2
Applications ................................................................................................................... 2
Features ....................................................................................................................... 2
Electrical Performance Specification ...................................................................................... 2
Schematic ..................................................................................................................... 3
Operation ..................................................................................................................... 5
7.1
Summary of Operation Instructions .............................................................................. 5
7.2
Install and Run the Graphical User Interface ................................................................... 5
7.3
EVM Connections and Power Up ................................................................................. 6
7.4
Input and Output Connections .................................................................................... 7
7.5
Plug In a Supported Accessory ................................................................................... 8
7.6
PurePath Console GUI Evaluation ............................................................................... 8
Device Evaluation Options.................................................................................................. 8
8.1
Current Measurement Connections .............................................................................. 8
EVM Assembly Drawings and PCB Layout .............................................................................. 9
List of Materials ............................................................................................................. 12
Related Documentation from Texas Instruments ...................................................................... 14
List of Figures
1
2
3
4
5
6
7
8
9
10
11
............................................................................................... 3
TPA6166A2EVM Schematic ............................................................................................... 4
PurePath Console ........................................................................................................... 5
Established I2C Connection (Shown with Green Indicator Light) ...................................................... 6
TPA6166A2 Panel Details .................................................................................................. 8
TPA6166A2EVM Silk Screen Top Layer ................................................................................. 9
TPA6166A2EVM X-Ray Silk Screen Layer .............................................................................. 9
TPA6166A2EVM Top Copper ............................................................................................ 10
TPA6166A2EVM Copper Layer 2 ........................................................................................ 10
TPA6166A2EVM Copper Layer 3 ........................................................................................ 11
TPA6166A2EVM Bottom Copper ........................................................................................ 11
TPA6166A2EVM Schematic
List of Tables
1
Supply Specifications........................................................................................................ 2
2
TPA6166A2 Jumper Settings
3
.............................................................................................. 6
TPA6166A2EVM List of Materials........................................................................................ 12
DirectPath, PurePath are trademarks of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
1
Introduction
1
www.ti.com
Introduction
The TPA6166A2 evaluation module (TPA6166A2EVM) is a complete multimedia headset interface with
headphone amplifier, and microphone pre-amp and bias, as well as advanced headset detection circuitry.
All components and the evaluation module are Pb-free.
2
Description
The TPA6166A2EVM consists of a TPA6166A2 device and all necessary components to evaluate it. The
EVM connects to a PC through a USB interface. It is controlled by easy-to-use, intuitive, graphical user
interface (GUI)-based software.
3
Applications
This EVM is used in the following applications:
• Smart phones and wireless handsets
• Portable tablets
4
Features
The following features are available through this EVM:
• Ultra low power, high performance DirectPath™ Class-G headphone amplifier
• Fully differential Mic pre-amp with variable gain
• Choice of two Mic Bias voltages: 2 V and 2.6 V
• Advanced accessory insertion, removal, and type detection
5
Electrical Performance Specification
Table 1 lists the required power supply specifications.
Table 1. Supply Specifications
2
Supply voltage range, VDD
1.7 V – 1.9 V
Microphone Supply voltage,
MICVDD
2.4 V – 3.6 V
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
SLOU381 – March 2014
Submit Documentation Feedback
Schematic
www.ti.com
6
Schematic
Figure 1 and Figure 2 illustrate the EVM schematics.
MIC OUTPUT
HPINL
Shield
R2
C1
2
1.0k
C3
R1
4700pF/50V
2
3
1
Shield
HEADPHONE
INPUTS
3
MICOUT
1
0.47uF/16V
1.0k
R7
0.0
3
+1.8V
R10
0.0
0.47uF/16V
C6
1
C5
1.0uF/10V
2.2uF/10V
GND
GND
1
C8
+1.8V
R4
1
SDA1
3
TO U2
R3
1
3
TO U3
C7
SCL
DNP
33pF/50V
DNP
GND
C4
GND
GND
A2
B4
C20
C13
FB1 2
1
U1
C12
33pF/50V
TPA6166A2YFF
B5
C11
120ohms/1.2A
10pF/50V
RING1
10pF/50V
DNP
GND
33pF/50V
DNP
GND
GND
GND
B1
1.0ufd/10V
+1.8V
A5
R8
D4
E4
1
3
C15
10pF/50V
C5
SCL
2
TIP
C10
A4
E1
GND
IRQ2
E3
A3
D1
2.7k
2
10pF/50V
+1.8V
GND
SCL1
33pF/50V
GND
D5
SDA
SDA
C4
GND
2.7k
2
FB2 2
120ohms/1.2A
C14
1.0uF/10V
R5
D2
100k
C2
0.0
E5
IRQ
JP1
B3
JACK-SENSE
IRQ
C1
GND
C3 A1 B2 D3 E2
C9
1.0uF/10V
GND
GND
1
C16
GND
33pF/50V
R6
0.0
GND
R9 DNP
GND
J1
FB3 2
120ohms/1.2A
2
C22
C17
10pF/50V
10pF/50V
33pF/50V
DNP
DNP
C21
GND
GND
0.0
1
C23
33pF/50V
10pF/50V
5
3
GND
FB4 2
120ohms/1.2A
C18
LEFT
Shield
Shield
HPINR
+3.0V
C2
GND
2
RIGHT
4
1
C24
C19
GND
DNP
GND
GND
10pF/50V
33pF/50V
RING2
SLEEVE
DNP
GND
GND
GND
MOUNTING HARDWARE
GND
GND
GND
GND
M3x5 M3x5 M3x5 M3x5
M3x12 M3x12 M3x12 M3x12
STANDOFFS
SCREWS
Figure 1. TPA6166A2EVM Schematic
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
3
Schematic
www.ti.com
3.0V
JP2
3VIN
2
GND
GND
1.8V
2
C25
C26
10.0uF/10V
0.1uF/16V
GND
3
5
1
POWER
SUPPLY
INPUTS
+
3
C28
1.0uF/25V
10.0uF/10V
GND TPS73630MDBVREP
3.0V/400mA
GND
C27
4
GND
GND
FROM
U1
JP3
1.8VIN
+1.8V
1
+3.3V
VR2
+5V
C29
C31
10.0uF/10V
0.1uF/16V
JP4
GND
5
+5V-USB
+
3
C32
SDA1
1.0uF/25V
10.0uF/10V
GND
R19
220k
C33
4
GND TPS73618MDBVREP
1.8V/400mA
GND
+5V
1
2
3
2
C30
GND
5VIN
+1.8V-PS
1
10uF/6.3V
5.0V
+3.0V
1
VR1
+5V
SDA2
5
4
SCL2
6
3
7
2
8
1
GND
C41
2
VR3
10.0uF/10V
+3.3V
R17
330
5
2
+
3
0.1uF/16V
C36
4
10.0uF/10V
R18
330
GND
GND
C42
0.1uF/16V
GND
GND
+3.3V
C37
R20
1.0uF/25V
4.99k
TPS73633MDBVREP
GND
+1.8V-PS
GND
1
C35
IRQ2
PCA9306DCT
0.1uF/16V
3
C34
SCL1
U2
+1.8V-PS
R21
3.3V/400mA
GND
C45
GND
0.1uF/16V
1
GND
C44
4.99k
18pF/50V
+3.3V
GND
2
C46
GND
Y1
6.0MHz
+3.3V
U3
+3.3V
1
18pF/50V
JP5
R11
1
1
8
2
2
7
3
6
4
5
GND
Q1
B
15k
0.1uF/16V
+5V-USB
1
5v
DataData+
ID_NC
GND
1
FB5
3.09k
+3.3V
4
5
1
FB6
41
40
39
38
37
33
R16
100k
S1
GND
2
+3.3V
USB
RESET
JP6
GND
DIR
B
6
5
4
+3.3V
31
30
TAS1020BPFB
29
9
28
10
27
11
26
12
25
GND
GND
13
14
15
16 17
18
19
20
21 22
23
24
USB-IRQ
+3.3V
+3.3V
GND
R23
C49
0.1uF/16V
A
VCCB
32
U5
8
600 Ohms/2A
GND
42
34
7
1
GND
43
4
6
47pF/50V
44
35
5
47pF/50V
45
36
DM
C40
46
3
DP
C39
47
2
PUR
2
GND
48
1
GND
GND
GND
1000pF/50V
VCCA
SN74AVC1T45DBV
GND
R13
27.4
GND
100pF/50V C48
USB
R14
3
R22
GND
27.4
2
600 Ohms/2A
2
3
0.1uF/16V
GND
R12
1.50k
2
C43
C47
64K
40V,1A
E
USB
C38
U4
C
+5V
GND
USB-IRQ
R15
4.99k
C50
C51
C52
C53
0.1uF/16V
0.1uF/16V
0.1uF/16V
0.1uF/16V
C54
2.00k
0.1uF/16V
GND
GND
GND
GND
GND
GND
Figure 2. TPA6166A2EVM Schematic
4
TPA6166A2 Multimedia Headset Interface
SLOU381 – March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Operation
www.ti.com
7
Operation
This section describes how to operate the TPA6166A2EVM.
7.1
Summary of Operation Instructions
Follow the procedures below to quickly set up the TPA6166A2EVM and begin evaluation (upon
connecting to the USB):
1. Install the GUI. Use a PC running Microsoft® Windows® XP or higher. See Section 7.2 for details.
2. Connect the EVM to the PC and power up the EVM. Use a micro-USB cable. See Section 7.3 for
details.
3. Run the GUI.
4. Connect inputs and outputs. See Section 7.4 for details.
5. Plug in a supported accessory. See Section 7.5 for details.
6. Use the GUI to control the evaluation. See Section 7.6 for details.
7.2
Install and Run the Graphical User Interface
Download the PurePath™ Console from www.ti.com. Once the PurePath Console is installed, select the
TPA6166A2 plugin to start the GUI. The front panel of the GUI looks like Figure 3. Refer to Section 7.6 for
a detailed description of the GUI. Connect the EVM before running the GUI.
Figure 3. PurePath Console
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
5
Operation
7.3
www.ti.com
EVM Connections and Power Up
The EVM is configured to power up from the USB by default. If the EVM is not in this mode, ensure that
jumpers are inserted between the middle pin and the USB pin of the following jumpers: JP2, JP3 and JP4.
Then, using a micro-USB cable, connect the EVM to a PC running Windows XP or higher.
The EVM powers itself from the USB (5.0 V) and generates 3.0-V and 1.8-V supplies for the TPA6166A2
using on-board voltage regulators as well as a 3.3 V for the TAS1020B chip which is used to convert USB
to I2C and vice versa.
Alternatively, to power the TPA6166A2 using external power supplies, use the jumper settings in Table 2.
It is not possible to power the TAS1020B chip from an external 3.3-V supply.
Table 2. TPA6166A2 Jumper Settings
Jumper
Connect Middle Pin To
JP4
5.0-V pin of jumper
Function
Use external 5.0-V supply instead of USB power
JP2
3.0-V pin of jumper
Use external 3.0-V supply instead of 3.0 V from on-board regulator
JP3
1.8-V pin of jumper
Use external 1.8-V supply instead of 1.8 V from on-board regulator
Once the USB cable is connected to the PC, the I2C status indicator in the bottom half of the GUI should
turn green as shown in Figure 4.
Figure 4. Established I2C Connection (Shown with Green Indicator Light)
6
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
SLOU381 – March 2014
Submit Documentation Feedback
Operation
www.ti.com
7.4
7.4.1
Input and Output Connections
Headphone Input
For headphone amplifier evaluation, connect the left and right signal sources to HPINL (black) and HPINR
(red) RCA input connectors on the EVM.
7.4.2
Microphone Output
For microphone pre-amp and mic-bias evaluation, connect the microphone output available on the
MICOUT (black) RCA connector to the measurement equipment or external amplifier system.
7.4.3
I2C Connection
By default, pins SDA and SCL of the TPA6166A2 are driven by the on-board TAS1020B which is
controlled by the GUI running on the PC through the USB. If the EVM is not in this default mode, insert
jumpers between the middle-pin and USB pin of the following jumpers: SDA, SCL.
To use an external I2C master instead of the on-board TAS1020B, remove the jumpers between the
middle-pin and USB pin of jumpers SDA and SCL and connect the external I2C signals between the
middle-pin and GND of jumpers SDA and SCL. Ensure that SDA and SCL are not swapped. Ensure that
the I2C master does not have pull up resistors or that the I2C master’s pull-up resistors pull up SDA and
SCL to 1.8 V. Voltages greater than 1.8 V may cause device damage.
7.4.4
IRQ Connection
By default, the IRQ pin of the TPA6166A2 is connected to the on-board TAS1020B which is controlled by
the GUI running on the PC through the USB. If the EVM is not in this default mode, insert a jumper
between the middle-pin and the USB pin of the IRQ jumper.
To stop the IRQ signal from going to the on-board TAS1020B and to process it using an external device,
remove the jumper between the middle-pin and the USB pin of jumper IRQ, and connect the middle-pin
and GND of jumper IRQ to the external device. Ensure that IRQ does not have pull-up resistors or that the
I2C master’s pull-up resistors pull up IRQ to 1.8 V. Voltages greater than 1.8 V may cause device damage.
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
7
Device Evaluation Options
7.5
www.ti.com
Plug In a Supported Accessory
Connect a supported accessory to the 3.5-mm jack J1. For a list of supported accessories, refer to the
TPA6166A2 data sheet (SLAS997) under Accessory detection. As soon as the accessory is inserted, the
GUI should indicate the type of accessory inserted.
7.6
PurePath Console GUI Evaluation
Use the PurePath Console GUI to control the device during evaluation. This section gives a short
description of the main features of the GUI.
The GUI window consists of the following tabs: EVM, Block Diagram, TPA6166A2, Direct I2C Read/Write,
Registers, and Scripting.
Figure 5. TPA6166A2 Panel Details
8
Device Evaluation Options
8.1
Current Measurement Connections
One or both of the jumpers JP2 and JP3 can be removed and current meters can be installed to measure
TPA6166A2 current consumption
8
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
SLOU381 – March 2014
Submit Documentation Feedback
EVM Assembly Drawings and PCB Layout
www.ti.com
9
EVM Assembly Drawings and PCB Layout
Figure 6 through Figure 11 illustrate the TPA6166A2EVM assembly drawings and PCB layout.
Figure 6. TPA6166A2EVM Silk Screen Top Layer
Figure 7. TPA6166A2EVM X-Ray Silk Screen Layer
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
9
EVM Assembly Drawings and PCB Layout
www.ti.com
Figure 8. TPA6166A2EVM Top Copper
Figure 9. TPA6166A2EVM Copper Layer 2
10
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
SLOU381 – March 2014
Submit Documentation Feedback
EVM Assembly Drawings and PCB Layout
www.ti.com
Figure 10. TPA6166A2EVM Copper Layer 3
Figure 11. TPA6166A2EVM Bottom Copper
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
11
List of Materials
10
www.ti.com
List of Materials
Table 3 lists the BOM for the TPA6166A2EVM.
Table 3. TPA6166A2EVM List of Materials
Item
MFG Part Number
MFG
Qty
Ref Designators
Description
1
TPA6166A2YFF
TEXAS INSTRUMENTS
1
U1
3.5mm JACK DETECT AND HEADSET INTERFACE IC WCSP25-YFF ROHS
2
PCA9306DCTR
TEXAS INSTRUMENTS
1
U2
DUAL BIDIR I2C BUS AND SMBUS VOLT LEVEL TRANS SSOP8-DCT ROHS
3
SN74AVC1T45DBVR
TEXAS INSTRUMENTS
1
U3
1BIT DUAL SUPPLY XCVR W/CONFIG VOLTAGE SOT23-DBV6 ROHS
4
24LC64-I/SN
MICROCHIP
1
U4
64K I2C SERIAL EEPROM SOP8-D ROHS
5
TAS1020BPFB
TEXAS INSTRUMENTS
1
U5
USB STREAMING CONTROLLER TQFP48-PFB ROHS
6
TPS73630MDBVREP
TEXAS INSTRUMENTS
1
VR1
VOLT REG 3.0V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
7
TPS73618MDBVREP
TEXAS INSTRUMENTS
1
VR2
VOLT REG 1.8V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
8
TPS73633MDBVREP
TEXAS INSTRUMENTS
1
VR3
VOLT REG 3.3V 400MA LDO CAP FREE NMOS SOT23-DBV5 ROHS
9
MMBT2222A-7-F
DIODES INC.
1
Q1
TRANSISTOR NPN GENERAL PURPOSE 40V 1A SOT23 DBV3 ROHS
10
FQ1045A-6.000
FOX
1
Y1
CRYSTAL SMT 6.0MHz 30ppm FQ1045A ROHS
11
0603YD474KAT2A
AVX
2
C1, C2
CAP SMD0603 CERM 0.47UFD 16V 10% X5R ROHS
12
GRM188R71H472KA01D
MURATA
1
C3
CAP SMD0603 CERM 4700PFD 50V 10% X7R ROHS
13
GRM0335C1H100JA01D
MURATA
0
C4, C10, C11, C20, C21, C22, C23, C24
CAP SMD0201 CERM 10pF 50V NPO 5% ROHS
14
C1005X5R1A225K
TDK CORP
1
C5
CAP SMD0402 CERM 2.2UFD 10V 10% X5R ROHS
15
C1005X5R1A105K
TDK CORP
4
C6, C7, C8, C9
CAP SMD0402 CERM 1.0UFD 10V 10% X5R ROHS
16
GRM1555C1H330JA01D
MURATA
8
C12, C13, C14, C15, C16, C17, C18, C19
CAP SMD0402 CERM 33PFD 5% 50V COG ROHS
17
LMK107BJ106MALTD
TAIYO YUDEN
3
C25, C30, C34
CAP SMD0603 CERM 10.0UFD 10V 20% X5R ROHS
18
GRM188R71C104KA01D
MURATA
14
C26, C31, C35, C38, C41, C42, C43, C44, C49, C50, C51,
C52, C53, C54
CAP SMD0603 CERM 0.1UFD 16V 10% X7R ROHS
19
AVE106M16A12T-F
CORNELL DUBILIER
3
C27, C32, C36
CAP ALUM-ELECT SMD-AVE TYPE A 10UFD 16V 20% ROHS
20
TMK107BJ105KA-T
TAIYO YUDEN
3
C28, C33, C37
CAP SMD0603 CERM 1.0UFD 25V 10% X5R ROHS
21
GRM188R60J106ME47D
MURATA
1
C29
CAP SMD0603 CERM 10UFD 6.3V 20% X5R ROHS
22
GRM1885C1H470JA01D
MURATA
2
C39, C40
CAP SMD0603 CERM 47PFD 50V 5% COG ROHS
23
C1608C0G1H180J
TDK CORP.
2
C45, C46
CAP SMD0603 CERM 18PFD 50V 5% COG ROHS
24
GRM1885C1H101JA01D
MURATA
1
C47
CAP SMD0603 CERM 100PFD 50V 5% COG ROHS
25
C1608C0G1H102J
TDK CORP.
1
C48
CAP SMD0603 CERM 1000PFD 50V 5% COG ROHS
26
ERJ-2GEJ102X
PANASONIC
2
R1, R2
RESISTOR SMD0402 1.0K OHMS 5% THICK FILM 1/16W ROHS
27
CRCW04022K70JNED
VISHAY
2
R3, R4
RESISTOR SMD0402 2.7K OHMS 5% THICK FILM 1/16W ROHS
28
ERJ-2GEJ104
PANASONIC
1
R5
RESISTOR SMD0402 THICK FILM 100K OHMS 1/16W 5% ROHS
29
RMCF0402ZT0R00
STACKPOLE ELECTRONICS
3
R6, R8, R10
ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS
30
ERJ-3GEY0R00V
PANASONIC
1
R7
RESISTOR SMD0603 0.0 OHM 5% THICK FILM 1/10W ROHS
31
RMCF0402ZT0R00
STACKPOLE ELECTRONICS
0
R9
ZERO OHM JUMPER SMT 0402 0 OHM 1/16W,5% ROHS
32
ERJ-3GEYJ153V
PANASONIC
1
R11
RESISTOR SMD0603 15K OHM 5% THICK FILM 1/10W ROHS
33
ERJ-3EKF1501V
PANASONIC
1
R12
RESISTOR SMD0603 1.50K OHM 1% THICK FILM 1/10W ROHS
34
CRCW060327R4FKEA
VISHAY
2
R13, R14
RESISTOR SMD0603 27.4 OHM 1/10W 1% ROHS
35
ERJ-3EKF4991V
PANASONIC
3
R15, R20, R21
RESISTOR SMD0603 4.99K OHM 1% THICK FILM 1/10W ROHS
36
RMCF0603JT100K
STACKPOLE ELECTRONICS
1
R16
RESISTOR SMD0603 100K OHMS 5% 1/10W ROHS
12
TPA6166A2 Multimedia Headset Interface
SLOU381 – March 2014
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
List of Materials
www.ti.com
Table 3. TPA6166A2EVM List of Materials (continued)
Item
MFG Part Number
MFG
Qty
Ref Designators
Description
37
ERJ-3GEYJ331V
PANASONIC
2
R17, R18
RESISTOR SMD0603 330 OHMS 5% 1/10W ROHS
38
ERJ-3EKF2203V
PANASONIC
1
R19
RESISTOR SMD0603 220K 1% THICK FILM 1/10W ROHS
39
ERJ-3EKF3091V
PANASONIC
1
R22
RESISTOR SMD0603 3.09K OHM 1% THICK FILM 1/10W ROHS
40
RMCF0603FT2K00
STACKPOLE ELECTRONICS
1
R23
RESISTOR SMD0603 2.00K OHMS 1% 1/10W ROHS
41
MPZ1005S121C
TDK
4
FB1, FB2, FB3, FB4
FERRITE BEAD, 120 Ohms 1.2A 100MHz SM0402 ROHS
42
MPZ2012S601A
TDK
2
FB5, FB6
FERRITE BEAD SMD0805 600 Ohms 2A ROHS
43
SJ-43515TS-SMT
CUI STACK
1
J1
JACK AUDIO-STEREO MINI(3.5MM 3-COND SMT-RA ROHS
44
PBC02SAAN
SULLINS
3
JP1, JP5, JP6
HEADER THRU MALE 2 PIN 100LS 120 TAIL GOLD ROHS
45
PBC03SAAN
SULLINS
6
IRQ, JP2, JP3, JP4, SCL, SDA
HEADER THRU MALE 3 PIN 100LS 120 TAIL GOLD ROHS
46
PBC01SAAN
SULLINS
5
TIP, RING1, RING2, SLEEVE, JACK-SENSE
HEADER THRU MALE 1 PIN GOLD ROHS
47
PJRAN1X1U01X
SWITCHCRAFT
2
HPINL, MICOUT
JACK, RCA 3-PIN PCB-RA BLACK ROHS
48
PJRAN1X1U03X
SWITCHCRAFT
1
HPINR
JACK, RCA 3-PIN PCB-RA RED ROHS
49
ZX62WD1-B-5PC
HIROSE
1
USB
JACK USB FEMALE TYPEB MICRO SMT-RA 5PIN ROHS
50
5001
KEYSTONE ELECTRONICS
3
GNDx3
PC TESTPOINT, BLACK, ROHS
51
TL1015AF160QG
E-SWITCH
1
S1
SWITCH, MOM, 160G SMT 4X3MM ROHS
52
3760-2
POMONA
3
1.8V, 3.0V, 5.0V
BINDING POST, RED 60V/15A TIN ROHS
53
3760-0
POMONA
1
GND
BINDING POST, BLACK 60V/15A TIN ROHS
54
24434
KEYSTONE ELECTRONICS
4
STANDOFFS
Standoff, Hex, 12mm, M3, Aluminum
56
MPMS 003 0005 PH
BUILDING FASTENER
4
STANDOFF SCREWS
MACHINE SCREW PAN PHILLIPS M3
57
969102-0000-DA
3M
6
IRQ, JP2, JP3, JP4, SCL, SDA
SHUNT BLACK AU FLASH 0.100LS OPEN TOP ROHS
TOTAL
125
Special Notes to this Bill of Materials
SN1
These assemblies are ESD sensitive, observe ESD precautions.
SN2
These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
SN3
These assemblies must comply with workmanship standards IPC-A-610 Class 2.
SN4
Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG's components.
SLOU381 – March 2014
Submit Documentation Feedback
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
13
Related Documentation from Texas Instruments
11
www.ti.com
Related Documentation from Texas Instruments
Refer to the following related documentation for more information about the TPA6166A2:
TPA6166A2 data sheet, SLAS997.
14
TPA6166A2 Multimedia Headset Interface
Copyright © 2014, Texas Instruments Incorporated
SLOU381 – March 2014
Submit Documentation Feedback
ADDITIONAL TERMS AND CONDITIONS, WARNINGS, RESTRICTIONS, AND DISCLAIMERS FOR
EVALUATION MODULES
Texas Instruments Incorporated (TI) markets, sells, and loans all evaluation boards, kits, and/or modules (EVMs) pursuant to, and user
expressly acknowledges, represents, and agrees, and takes sole responsibility and risk with respect to, the following:
1.
User agrees and acknowledges that EVMs are intended to be handled and used for feasibility evaluation only in laboratory and/or
development environments. Notwithstanding the foregoing, in certain instances, TI makes certain EVMs available to users that do not
handle and use EVMs solely for feasibility evaluation only in laboratory and/or development environments, but may use EVMs in a
hobbyist environment. All EVMs made available to hobbyist users are FCC certified, as applicable. Hobbyist users acknowledge, agree,
and shall comply with all applicable terms, conditions, warnings, and restrictions in this document and are subject to the disclaimer and
indemnity provisions included in this document.
2. Unless otherwise indicated, EVMs are not finished products and not intended for consumer use. EVMs are intended solely for use by
technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical
mechanical components, systems, and subsystems.
3. User agrees that EVMs shall not be used as, or incorporated into, all or any part of a finished product.
4. User agrees and acknowledges that certain EVMs may not be designed or manufactured by TI.
5. User must read the user's guide and all other documentation accompanying EVMs, including without limitation any warning or
restriction notices, prior to handling and/or using EVMs. Such notices contain important safety information related to, for example,
temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or
contact TI.
6. User assumes all responsibility, obligation, and any corresponding liability for proper and safe handling and use of EVMs.
7. Should any EVM not meet the specifications indicated in the user’s guide or other documentation accompanying such EVM, the EVM
may be returned to TI within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE
EXCLUSIVE WARRANTY MADE BY TI TO USER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR
STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. TI SHALL
NOT BE LIABLE TO USER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES RELATED TO THE
HANDLING OR USE OF ANY EVM.
8. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which EVMs might be or are used. TI currently deals with a variety of customers, and therefore TI’s arrangement with
the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services with respect to the handling or use of EVMs.
9. User assumes sole responsibility to determine whether EVMs may be subject to any applicable federal, state, or local laws and
regulatory requirements (including but not limited to U.S. Food and Drug Administration regulations, if applicable) related to its handling
and use of EVMs and, if applicable, compliance in all respects with such laws and regulations.
10. User has sole responsibility to ensure the safety of any activities to be conducted by it and its employees, affiliates, contractors or
designees, with respect to handling and using EVMs. Further, user is responsible to ensure that any interfaces (electronic and/or
mechanical) between EVMs and any human body are designed with suitable isolation and means to safely limit accessible leakage
currents to minimize the risk of electrical shock hazard.
11. User shall employ reasonable safeguards to ensure that user’s use of EVMs will not result in any property damage, injury or death,
even if EVMs should fail to perform as described or expected.
12. User shall be solely responsible for proper disposal and recycling of EVMs consistent with all applicable federal, state, and local
requirements.
Certain Instructions. User shall operate EVMs within TI’s recommended specifications and environmental considerations per the user’s
guide, accompanying documentation, and any other applicable requirements. Exceeding the specified ratings (including but not limited to
input and output voltage, current, power, and environmental ranges) for EVMs may cause property damage, personal injury or death. If
there are questions concerning these ratings, user should contact a TI field representative prior to connecting interface electronics including
input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate
operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the applicable EVM user's guide prior
to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During
normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained
at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass
transistors, and current sense resistors which can be identified using EVMs’ schematics located in the applicable EVM user's guide. When
placing measurement probes near EVMs during normal operation, please be aware that EVMs may become very warm. As with all
electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in
development environments should use EVMs.
Agreement to Defend, Indemnify and Hold Harmless. User agrees to defend, indemnify, and hold TI, its directors, officers, employees,
agents, representatives, affiliates, licensors and their representatives harmless from and against any and all claims, damages, losses,
expenses, costs and liabilities (collectively, "Claims") arising out of, or in connection with, any handling and/or use of EVMs. User’s
indemnity shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if EVMs fail to perform as
described or expected.
Safety-Critical or Life-Critical Applications. If user intends to use EVMs in evaluations of safety critical applications (such as life support),
and a failure of a TI product considered for purchase by user for use in user’s product would reasonably be expected to cause severe
personal injury or death such as devices which are classified as FDA Class III or similar classification, then user must specifically notify TI
of such intent and enter into a separate Assurance and Indemnity Agreement.
RADIO FREQUENCY REGULATORY COMPLIANCE INFORMATION FOR EVALUATION MODULES
Texas Instruments Incorporated (TI) evaluation boards, kits, and/or modules (EVMs) and/or accompanying hardware that is marketed, sold,
or loaned to users may or may not be subject to radio frequency regulations in specific countries.
General Statement for EVMs Not Including a Radio
For EVMs not including a radio and not subject to the U.S. Federal Communications Commission (FCC) or Industry Canada (IC)
regulations, TI intends EVMs to be used only for engineering development, demonstration, or evaluation purposes. EVMs are not finished
products typically fit for general consumer use. EVMs may nonetheless generate, use, or radiate radio frequency energy, but have not been
tested for compliance with the limits of computing devices pursuant to part 15 of FCC or the ICES-003 rules. Operation of such EVMs may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
General Statement for EVMs including a radio
User Power/Frequency Use Obligations: For EVMs including a radio, the radio included in such EVMs is intended for development and/or
professional use only in legally allocated frequency and power limits. Any use of radio frequencies and/or power availability in such EVMs
and their development application(s) must comply with local laws governing radio spectrum allocation and power limits for such EVMs. It is
the user’s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations.
Any exceptions to this are strictly prohibited and unauthorized by TI unless user has obtained appropriate experimental and/or development
licenses from local regulatory authorities, which is the sole responsibility of the user, including its acceptable authorization.
U.S. Federal Communications Commission Compliance
For EVMs Annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant
Caution
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause
harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
Changes or modifications could void the user's authority to operate the equipment.
FCC Interference Statement for Class A EVM devices
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial
environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to
cause harmful interference in which case the user will be required to correct the interference at its own expense.
FCC Interference Statement for Class B EVM devices
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment
generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If
this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and
on, the user is encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
Industry Canada Compliance (English)
For EVMs Annotated as IC – INDUSTRY CANADA Compliant:
This Class A or B digital apparatus complies with Canadian ICES-003.
Changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate the
equipment.
Concerning EVMs Including Radio Transmitters
This device complies with Industry Canada licence-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this
device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired
operation of the device.
Concerning EVMs Including Detachable Antennas
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain
approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should
be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.
This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum
permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list, having a gain
greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.
Canada Industry Canada Compliance (French)
Cet appareil numérique de la classe A ou B est conforme à la norme NMB-003 du Canada
Les changements ou les modifications pas expressément approuvés par la partie responsable de la conformité ont pu vider l’autorité de
l'utilisateur pour actionner l'équipement.
Concernant les EVMs avec appareils radio
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est
autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout
brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain
maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à
l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente
(p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante.
Le présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le manuel
d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne non inclus dans
cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de l'émetteur.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
spacer
Important Notice for Users of EVMs Considered “Radio Frequency Products” in Japan
EVMs entering Japan are NOT certified by TI as conforming to Technical Regulations of Radio Law of Japan.
If user uses EVMs in Japan, user is required by Radio Law of Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal Affairs and
Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for Enforcement of Radio Law of
Japan,
Use EVMs only after user obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs, or
Use of EVMs only after user obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect
to EVMs. Also, do not transfer EVMs, unless user gives the same notice above to the transferee. Please note that if user does not
follow the instructions above, user will be subject to penalties of Radio Law of Japan.
http://www.tij.co.jp
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 本開発キットは技術基準適合証明を受けておりません。 本製品の
ご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。
日本テキサス・インスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
http://www.tij.co.jp
Texas Instruments Japan Limited
(address) 24-1, Nishi-Shinjuku 6 chome, Shinjuku-ku, Tokyo, Japan
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising