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Texas Instruments TPA6111A2MSOPEVM - User guides
 User’s Guide
2000
Mixed-Signal Products
SLOU087
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright  2000, Texas Instruments Incorporated
Information About Cautions and Warnings
Preface
Read This First
Information About Cautions and Warnings
This book may contain cautions and warnings.
This is an example of a caution statement.
A caution statement describes a situation that could potentially
damage your software or equipment.
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection.
Please read each caution and warning carefully.
Related Documentation From Texas Instruments
TI Plug-N-Play Audio Amplifier Evaluation Platform (literature
number SLOU011) provides detailed information on the evaluation
platform and its use with TI audio evaluation modules.
TPA6111A2 150-mW Stereo Audio Power Amplifier (literature
number SLOS313) this is the data sheet for the TPA6111A2 audio
amplifier integrated circuit.
Read This First
iii
Running Title—Attribute Reference
FCC Warning
This equipment is intended for use in a laboratory test environment only. It
generates, uses, and can radiate radio frequency energy and has not been
tested for compliance with the limits of computing devices pursuant to subpart
J of part 15 of FCC rules, which are designed to provide reasonable protection
against radio frequency interference. Operation of this equipment in other
environments may cause interference with radio communications, in which
case the user at his own expense will be required to take whatever measures
may be required to correct this interference.
iv
Running Title—Attribute Reference
Contents
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.3
TPA6111A2 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-1
1-2
1-3
1-3
2
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2
Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3
Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.1 TPA6111A2 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . .
2.4.2 TPA6111A2 MSOP EVM Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.4.3 TPA6111A2 MSOP Audio Power Amplifier Evaluation Module Parts List . . . .
2.4.4 TPA6111A2 MSOP EVM PCB Layers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2-1
2-2
2-3
2-4
2-5
2-5
2-5
2-6
2-6
Figures
1–1
2–1
2–2
2–3
2–4
2–5
2–6
2–7
2–8
The TI TPA6111A2 Audio Amplifier Evaluation Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick Start Platform Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quick Start Module Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM Connected as a Stereo Headphone Amplifier . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM Silkscreen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM Top Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TPA6111A2 MSOP EVM Bottom Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1-3
2-2
2-4
2-5
2-5
2-6
2-7
2-7
2-7
Tables
2–1
2–2
2–3
Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6111A2 MSOP EVM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Platform Jumper and Switch Settings for the TPA6111A2 MSOP EVM . . . . . . . . . . . . . . . 2-3
TPA6111A2 MSOP EVM Parts List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
Contents
v
Running Title—Attribute Reference
vi
Chapter 1
Introduction
This chapter provides an overview of the Texas Instruments (TI) TPA6111A2
MSOP audio amplifier evaluation module (SLOP339). It includes a list of EVM
features, a brief description of the module illustrated with a pictorial diagram,
and a list of EVM specifications.
Topic
Page
1.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2
1.2
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
1.3
TPA6111A2 MSOP EVM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
Introduction
1-1
Features
1.1 Features
The TI TPA6111A2 MSOP audio amplifier evaluation module and the TI
plug-n-play audio amplifier evaluation platform include the following features:
TPA6111A2 MSOP Stereo Audio Power Amplifier Evaluation Module
Dual channel, single-ended operation
150-mW output power into 8 Ω at 5 V
2.5-V to 5.5-V operation
Very low distortion:
THD+N is less than 0.006% at 1 kHz and less than 0.07% from 20
Hz to 20 kHz into 10-kΩ loads.
Less than 0.02% at 1 kHz and less than 0.4% from 20 Hz to 20 kHz
into 32-Ω loads.
Less than 0.05% at 1 kHz and less than 0.8% from 20 Hz to 20 kHz
into 8-Ω loads.
Extremely low current consumption in shutdown mode
Internal thermal and short-circuit protection
Internal pop reduction circuitry
Quick and Easy Configuration With the TI Plug-N-Play Audio Amplifier
Evaluation Platform
Evaluation module is designed to simply plug into the platform,
automatically making all signal, control, and power connections
Platform provides flexible power options
Jumpers on the platform select power and module control options
Switches on the platform route signals
Platform provides quick and easy audio input and output connections
Platform Power Options
Onboard 9-V battery
External 5-V–15-V (VCC) supply inputs
External regulated VDD supply input
Socket for on-board 5-V VDD voltage regulator EVM
Onboard overvoltage and reverse polarity power protection
Platform Audio Input and Output Connections
1-2
Left and right RCA phono jack inputs
Miniature stereo phone jack input
Left and right RCA phono jack outputs
Left and right compression speaker terminal outputs
Miniature stereo headphone jack output
Introduction
Description
1.2 Description
The TPA6111A2 MSOP audio power amplifier evaluation module is a
complete, low-power stereo audio power amplifier for high-fidelity line-level
output, headphone, and small speaker applications. It consists of the TI
TPA6111A2 150-mW stereo audio power amplifier IC in a very small MSOP
package, along with a small number of other parts mounted on a circuit board
that is approximately one and a quarter inches square (see Figure 1–1).
Figure 1–1. The TI TPA6111A2 Audio Amplifier Evaluation Module
Shutdown
VDD
S1
GND
+
C5
IN1
GND
R1
C1
R2 R5
U1
C1
TEXAS
INSTRUMENTS
C3
C4
R3
R4
IN2
GND
Vo1
GND
SLOP339
TPA6111A2 MSOP EVM
GND
Vo2
† Due to the very small size of the MSOP IC package, the standard part number TPA6111A2 is
replaced with the code TIAJA.
Single in-line header pins are mounted to the underside of the module circuit
board to allow the EVM to be plugged into the TI plug-n-play audio amplifier
evaluation platform, or to be wired directly into existing circuits and equipment
when used stand-alone.
The platform has room for a single TPA6111A2 evaluation module and it is a
convenient vehicle for demonstrating TI’s audio power amplifier and related
evaluation modules. The EVMs simply plug into the platform, which automatically provides power to the modules, interconnects them correctly, and
connects them to a versatile array of standard audio input and output jacks and
connectors. Easy-to-use configuration controls allow the platform and EVMs
to quickly model many possible end-equipment configurations.
There is nothing to build, nothing to solder, and nothing but the speakers
included with the platform to hook up.
1.3 TPA6111A2 MSOP EVM Specifications
Supply voltage range, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 V to 5.5 V
Supply current, IDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 mA, max
Continuous output power, PO: 8 Ω, VDD = 5 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 mW
Audio input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDD + 0.3 Vpp, max
Minimum load impedance, RL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ω
Introduction
1-3
1-4
Introduction
Chapter 2
Operation
Follow the steps in this chapter to quickly prepare the TPA6111A2 MSOP audio
amplifier EVM for use. Using the TPA6111A2 MSOP EVM with the TI
plug-n-play is a quick and easy way to connect power, signal and control
inputs, and signal outputs to the EVM using standard connectors. However,
the audio amplifier evaluation module can be used stand-alone by making
connections directly to the module pins, and it can be wired directly into
existing circuits or equipment.
The platform switch and jumper settings shown in Table 2–1 are typical for the
TPA6111A2 MSOP EVM and will cause the TPA6111A2 IC to shut down/mute
when a plug is removed from platform headphone jack J10.
Table 2–1. Typical TI Plug-N-Play Platform Jumper and Switch Settings for the
TPA6111A2 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA6111A2
X
Hi
X
See Note 2
U5
Notes:
1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
Topic
Page
2.1
Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
2.2
Quick Start List for Platform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–3
2.3
Quick Start List for Stand-Alone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
2.4
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
Operation
2-1
Precautions
2.1 Precautions
Power Supply Input Polarity and Maximum Voltage
Always ensure that the polarity and voltage of the external power
connected to VCC power input connector J1, J2, and/or VDD power
input connector J6 are correct. Overvoltage or reverse-polarity
power applied to these terminals can open onboard soldered-in
fuses and cause other damage to the platform, installed evaluation
modules, and/or the power source.
Inserting or Removing EVM Boards
Do not insert or remove EVM boards with power applied—damage
to the EVM board, the platform, or both may result.
Figure 2–1. Quick Start Platform Map
1 10
6b
C1+
On
Off
JP3
ICC
VR2
JP4
VR1
F2
U6
+
LED2
VDD
U2
U1
Left
Out
J5
Left
In
Stereo
Headphone
9
Output
HP Out
J10
5
Left
Out
2
+
R4
J9
+
S3
HP
Source
GND
R3
–
Hi
Spk(U2-U4) C3 C2
JP8
U5
U5
JP7
HP(U5)
U2-U4
Polarity
Lo
TP1
TEXAS
INSTRUMENTS
1997
3
Mode
Mute
JP6
U4
****CAUTION****
Do not insert or remove
EVM boards with power
applied
Plug-N-Play Audio Amplifier
Evaluation Platform
SLOP097 Rev. C.1
Speaker
Output
+
On
Conditioning
8
+ Right –
Out
U3
Off
S2
J4
Stereo
In
Audio
Input
6a
J8
J7 Right
Out
JP5
IDD
LED1
VCC
Audio
Power
Amps
DC
Power
In/Out
J6
VDD
In/Out
D1
D2
D3
J3
Right
In
R2
R1
Signal Conditioning
2-2
POWER
B1
SUPPLY
S1
Pwr
Batt
J1
D4 J2
AC/DC
In
6b
JP2 AC/DC
(J2)
JP1
VCC(J1)
DC
SOURCE
VCC
In
+
Power
Input
F1
6b
6b
R5
4
Operation
Quick Start List for Platform
2.2 Quick Start List for Platform
Follow these steps when using the TPA6111A2 MSOP EVM with the TI
plug-n-play audio amplifier evaluation platform (see the platform user’s guide,
SLOU011, for additional details). Numbered callouts for selected steps are
shown in Figure 2–1 and details appear in Chapter 3.
Platform preparations
1) Ensure that all external power sources are set to off and that the platform
power switch S1 is set to off.
2) Install a TPA6111A2 MSOP module in platform socket U5, taking care to
align the module pins correctly.
3) Use switch S2 to select or bypass the signal conditioning EVM (U1).
4) Set control signal polarity jumper JP7 to Hi.
5) Set HP source switch S3 to U5 to route the output signal to the headphone
Jack (J10).
Table 2–2. Platform Jumper and Switch Settings for the TPA6111A2 MSOP EVM
EVM
JP6
JP7
JP8
S2
S3
TPA6111A2
X
Hi
X
See Note 2
U5
Notes:
1) X = Don’t care
2) Set S2 to ON when signal conditioning board is installed in U1; set S2 to OFF when
no signal conditioning board is installed.
Power supply
6) Select and connect the power supply:
a) Connect an external regulated power supply set to a voltage between
2.5 V and 5.5 V to platform VDD power input connector J6, taking care
to observe marked polarity, or
b) Install 3-V to 5-V voltage regulator EVM (SLVP097 or equiv.) in platform socket U6. Install a 9-V battery in B1 or connect a 7 V – 12 V power source to a platform VCC power input J1 or J2 and jumper the appropriate power input (see platform user’s guide).
Inputs and outputs
7) Ensure that signal source level is set to minimum.
8) Connect the audio source to left and right RCA phono jacks J3 and J5 or
stereo miniature phone jack J4.
9) Connect 32-Ω headphones to headphone jack J10.
Power-up
10) Verify correct voltage and input polarity and set the external power supply
to ON. If VCC and an on-board regulator EVM are used to provide VDD, set
platform power switch S1 to on.
Platform LED2 lights indicating the presence of VDD, and the evaluation
modules installed on the platform begin operation.
11) Adjust the signal source level as needed.
Operation
2-3
Quick Start List for Stand-Alone
2.3 Quick Start List for Stand-Alone
Follow these steps to use the TPA6111A2 MSOP EVM stand-alone or when
connecting it into existing circuits or equipment. Connections to the
TPA6111A2 MSOP module header pins can be made via individual sockets,
wire-wrapping, or soldering to the pins, either on the top or the bottom of the
module circuit board (see Figure 2–2). Details appear in Chapter 3.
Figure 2–2. Quick Start Module Map
2
Shutdown
5
4
VDD
S1
C5
IN1
GND
R1
C1
R2 R5
U1
C1
TEXAS
INSTRUMENTS
C3
4
GND
+
6
GND
Vo2
6
C4
R3 R4
IN2
GND
Vo1
GND
SLOP339
TPA6111A2 MSOP EVM
† Due to the very small size of the MSOP IC package, the standard part number TPA6111A2 is
replaced with the code TIAJA.
Power supply
1) Ensure that all external power sources are set to off.
2) Connect an external regulated power supply set to 5 V to the module VDD
and GND pins, taking care to observe marked polarity.
Inputs and outputs
3) Ensure that the signal source level is set to minimum.
4) Connect the audio source to the module IN1, IN2, and GND pins, taking
care to observe marked polarity.
5) Connect the shutdown (S1) pin to VDD through a normally open switch.
6) Connect 32-Ω headphones to the module VO1, and VO2 pins through 33
µF to 1000 µF output-coupling capacitors (see Figure 2– 3) and return to
the GND pin, or
7) For line output, connections to the VO1 and VO2 pins must be made
through 33 µF to 1000 µF output-coupling capacitors and returned to
GND.
Power-up
8) Verify correct voltage and input polarity and set the external power supply
to on.
The EVM should begin operation.
9) Adjust the signal source level as needed.
2-4
Operation
References
2.4 References
2.4.1
TPA6111A2 MSOP EVM Connected as a Stereo Headphone Amplifier
Figure 2–3. TPA6111A2 MSOP EVM Connected as a Stereo Headphone Amplifier
5 VDC
Shutdown
NO
Shutdown
VDD
S1
Audio
Input
(Right)
GND
+
C5
IN1
GND
R1
C1
R2 R5
U1
C1
TEXAS
INSTRUMENTS
C3
Audio
Input
(Left)
+
GND
Vo2
+
33 µF –
1000 µF
C4
R3 R4
IN2
GND
Vo1
GND
SLOP339
TPA6111A2 MSOP EVM
33 µF –
1000 µF
† Due to the very small size of the MSOP IC package, the standard part number TPA6111A2 is replaced with the code TIAJA.
2.4.2
TPA6111A2 MSOP EVM Schematic Diagram
Figure 2–4. TPA6111A2 MSOP EVM Schematic Diagram
Shutdown
(VDD to
Shutdown)
NO
R1
82 kΩ
Vo1
1
S1
VDD
Vo1
R5
80 kΩ
2
Audio Input 1
C1
1 µF
8
R2
20 kΩ
TPA6111A2
MSOP
IN 1
+
C5
1 µF
GND
7
Vo2
Bypass
6
Vo2
IN 2
4
R3
20 kΩ
C4
10 µF
VDD
2.5 to 5.5 V
3
C2
1 µF
C3
1 µF
VDD
GND
Shutdown
5
R4
82 kΩ
Audio Input 2
Operation
2-5
TPA6111A2 MSOP Audio Power Amplifier Evaluation Module Parts List
2.4.3
TPA6111A2 MSOP Audio Power Amplifier Evaluation Module Parts List
Table 2–3. TPA6111A2 MSOP EVM Parts List
Reference
Description
Size
EVM
Qty.
MFG.
Part Number
Vendor/Number
R2, R3
Resistor, 20 kΩ, 1/16 W,
5%, SMD
0603
3
Panasonic
ERJ-3GSYJ203
Digi-Key
P20KGCT–ND
R1, R4, R5
Resistor, 82 kΩ, 1/16 W,
5%, SMD
0603
2
Panasonic
ERJ-3GSYJ823
Digi-Key
P82KGCT–ND
C1–C4
Capacitor, 1 µF, ±10%,
Nonpolarized, SMD
0603
4
Murata
GRM39-Y5V105Z10
Newark
C5
Capacitor, 10 µF, 6.3 V,
SMD
A
1
Panasonic
ECS-TOJY106R
Digi-Key
PCS1106CT-ND
S1
(SHUTDOWN)
Switch, momentary
SMD
1
Panasonic
P8048SCT-ND
Digi-Key
P8048SCT-ND
U1
IC, TPA6111A2, APA,
150 mW, 2-channel
MSOP-8
1
TI
TPA6111A2DGN
PnP pins
Terminal post headers
11
Sullins
2.4.4
Digi-Key
S1022-36-ND
TPA6111A2 MSOP EVM PCB Layers
The following illustrations depict the TPA6111A2 EVM PCB layers and silkscreen. These drawings are not to scale. Gerber plots can be obtained from ant
TI sales office.
Figure 2–5. TPA6111A2 MSOP EVM PCB
2-6
Operation
TPA6111A2 MSOP EVM PCB Layers
Figure 2–6. TPA6111A2 MSOP EVM Silkscreen
Figure 2–7. TPA6111A2 MSOP EVM Top Layer
Figure 2–8. TPA6111A2 MSOP EVM Bottom Layer
Operation
2-7
2-8
Operation
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