Texas Instruments | DLPC200 DLP Digital Controller for the DLP5500 DMD (Rev. F) | Datasheet | Texas Instruments DLPC200 DLP Digital Controller for the DLP5500 DMD (Rev. F) Datasheet

Texas Instruments DLPC200 DLP Digital Controller for the DLP5500 DMD (Rev. F) Datasheet
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DLPC200
DLPS014F – APRIL 2010 – REVISED MAY 2018
DLPC200 DLP Digital Controller for the DLP5500 DMD
1 Features
3 Description
•
The DLPC200 performs image processing and
control and DMD data formatting to drive the 0.55
XGA DMD (DLP5500).
1
•
•
•
•
Required for Reliable Operation of the DLP5500
DMD
Stream Data Realtime With Two 24-Bit Input Ports
(RGB888)
– Port 1 Supports HDMI Input
– Port 2 Supports Input Via an Expansion Card
High-Speed Pattern Sequence Mode
– Download Pattern Data Directly to Device
– 1-Bit Binary Pattern Rates to 5000 Hz
– 8-Bit Grayscale Pattern Rates to 700 Hz
– 1-to-1 Input Mapping to Micromirrors
– Programmable Reordering of Patterns
Easy Synchronization With Cameras and Sensors
– Three Configurable Output Triggers
– Two Configurable Input Triggers
Multiple Configuration Interfaces
– Supports EDID Via I2C
– USB and SPI Device Control
This digital controller gives users reliable,
independent high-speed micromirror control. It is
used for structured light, display, and other spatial
light modulation (SLM) applications. Solid state
illumination (SSI) technology provides pattern rates
up to 5000 Hz binary or 700 Hz 8-bit grayscale.
This easily-programmable device allows users to
interface and synchronize the chipset to external
sources (for example, sensor, camera, and
processor) enabling 3D machine vision applications
with high accuracy. Multiple configuration interfaces
offer flexibility for external and embedded input
sources. Because the DLPC200 conveniently loads
and stores custom patterns it is ideal for advanced
light control applications.
Device Information(1)
PART NUMBER
DLPC200
•
BODY SIZE (NOM)
BGA (780)
29.00 mm × 29.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
PACKAGE
Industrial
– 3D Machine Vision and Quality Control
– 3D Imaging Microscopes
– 3D Printers
Medical
– Ophthalmology
– 3D Scanners
– Vascular Imaging
User Synchronous
User NVM
DRAM
User Memory
Port 1
Interface
Program/User Flash Interface
24-Bit Video/Data Control
TI
TFP401A
Expansion
Port
Connector
EDID
I2C Interface
Port 2 24-Bit Video/Data Control
Cypress
CY7C68013
DLPC200
Port 2 PSI Interface
DLPC200
Program RAM
Micromirror Data Interface
Micromirror Control Interface
Illumination
R, G, B, IR Enable
Optics
LED SPI Interface
LED
Driver
LED Lit Status
USB Interface
DLPA200 Control Interface
PROM
DLPR200USB
DLP5500
SYNC1
PROM
SYNC2
DLPA200
SYNC3
DLPR200F
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLPC200
DLPS014F – APRIL 2010 – REVISED MAY 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 5
Specifications....................................................... 20
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
6.13
6.14
6.15
6.16
Absolute Maximum Ratings .................................... 20
Handling Ratings..................................................... 20
Recommended Operating Conditions..................... 20
Thermal Information ................................................ 20
I/O Electrical Characteristics................................... 21
Video Input Pixel Interface Timing Requirements... 21
I2C Interface Timing Requirements......................... 23
USB Read Interface Timing Requirements............. 25
USB Write Interface Timing Requirements ............. 26
SPI Slave Interface Timing Requirements ............ 27
Parallel Flash Interface Timing Requirements ...... 28
Serial Flash Interface Timing Requirements......... 30
Static RAM Interface Timing Requirements.......... 31
DMD Interface Timing Requirements.................... 31
DLPA200 Interface Timing Requirements ............ 32
DDR2 SDR Memory Interface Timing
Requirements........................................................... 33
6.17 Video Input Pixel Interface – Image Sync and
Blanking Requirements............................................ 34
7
Detailed Description ............................................ 35
7.1
7.2
7.3
7.4
8
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
35
35
35
36
Application and Implementation ........................ 37
8.1 Application Information............................................ 37
8.2 Typical Application .................................................. 37
9
Power Supply Recommendations...................... 45
9.1 Power-Up Requirements......................................... 45
9.2 Power-Down Requirements .................................... 45
10 Layout................................................................... 46
10.1 Layout Guidelines ................................................. 46
10.2 Layout Example .................................................... 46
10.3 Thermal Considerations ........................................ 47
11 Device and Documentation Support ................. 48
11.1
11.2
11.3
11.4
11.5
11.6
11.7
Device Support......................................................
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
48
48
48
49
49
49
49
12 Mechanical, Packaging, and Orderable
Information ........................................................... 49
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (August 2014) to Revision F
Page
•
Updated system diagram ....................................................................................................................................................... 1
•
Added "(does not tristate)" to pin function entry SLAVE_SPI_MISO ..................................................................................... 8
•
Deleted the active low indicator in the SLAVE_SPI_ACK in SPI Slave Interface Timing Requirements............................. 27
•
Changed SPI Timing Figure to reflect that the SLAVE_SPI_MISO signal does not tristate ............................................... 27
•
Changed SPI Timing Figure to reflect that SLAVE_SPI_ACK is an active high signal........................................................ 27
•
Removed active low indicator from the SLAVE_SPI_ACK signal in SPI Slave Interface ................................................... 40
•
Added clarifying note on the operation of the SLAVE_SPI_MOSI signal in SPI Slave Interface......................................... 40
•
Changed Numonyx to Micron (formerly Numonyx) .............................................................................................................. 41
•
Added note regarding requiring separate programming files targeting 64 Mb and 128 Mb serial flash devices ................. 41
•
Changed 64 Mb Micron (formerly Numonyx) serial flash status to Obsolete ...................................................................... 41
•
Changed 64 Mb Winbond serial flash status to Obsolete ................................................................................................... 41
•
Added Micron 128 Mb serial flash ........................................................................................................................................ 41
•
Added Macronix 128 Mb serial flash and noted MCU 2.3.1 or greater required.................................................................. 41
Changes from Revision D (March 2012) to Revision E
Page
•
Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
•
Updated descriptions in Pin Functions table .......................................................................................................................... 6
2
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DLPS014F – APRIL 2010 – REVISED MAY 2018
•
Added Grounding scheme for Video Port 1 signals if not used ............................................................................................ 6
•
Added Grounding scheme for video port 2 signals if not used ............................................................................................. 7
•
Added Connection scheme for EDID and USB if not used ................................................................................................... 8
•
Added Connection scheme for LED illumination Control if not used .................................................................................. 15
•
Added recommendation for 1-kΩ pullup to 3.3 V ................................................................................................................ 15
•
Changed from "recommend grounding" to "recommend 10-kΩ pulldown to DGND" for RSVD_S1, RSVD_S2,
RSVD_S3, RSVD_X11, RSVD_S20, and RSVD_S21 ......................................................................................................... 17
•
Changed description for RSVD_S0 from "do not connect" to "can be left open, recommend 10-kΩ pullup to 2.5 V"......... 17
•
Changed pin description for RSVD_x15 and RSVD_X13 from "do not connect" to "do not leave open, required:
49.4-Ω pullup to 1.8 V" ......................................................................................................................................................... 17
•
Changed pin description for RSVD_X14 and RSVD_X12 from "do not connect" to "do not leave open, required:
49.9-Ω pulldown to DGND"................................................................................................................................................... 17
•
Changed from "do not connect" to "can be left open, recommend 10-kΩ pullup to 1.8 V" for RSVD_S4 ........................... 17
•
Changed pin description for RSVD_S18 and RSVD_S19 from "do not connect" to "can be left open, recommend 10kΩ pullup to 2.5 V"................................................................................................................................................................ 18
•
Deleted Case Temperature thermal resistance.................................................................................................................... 20
•
Changed Micron MT47H32M16-25E replaces now obsolete MT47H32M16R .................................................................... 43
•
Added Note about LED enabling after initilization is complete............................................................................................. 45
•
Added Heat Sink section ...................................................................................................................................................... 47
Changes from Revision C (February 2012) to Revision D
•
Page
Changed the ADV time line in Figure 6................................................................................................................................ 28
Changes from Revision B (December 2010) to Revision C
Page
•
Changed typo on pin number for PORT1_D10 Pin ................................................................................................................ 6
•
Changed typo on pin number for USB_CLK Pin .................................................................................................................... 8
•
Changed I/O type to B2 for USB interface data bus Pins ....................................................................................................... 8
•
Added pin number A15 to PINFUNCTIONS table.................................................................................................................. 8
•
Changed I/O type to B2 for Flash/SRAM data Pins .............................................................................................................. 11
•
Corrected the I/O type to O3 on CFG_CSO terminal pin...................................................................................................... 16
•
Added pin number AB17, U7, U8, and AD15 to Pin Functions table ................................................................................... 17
•
Changed location of Absolute Maximum Ratings and Recommended Operating Conditions Tables in document............. 20
•
Changed MIN and MAX TJ values in Recommended Operating Conditions ....................................................................... 20
•
Added VCC33 and VREF_B2-4 pins to Recommended Operating Conditions ............................................................................ 20
•
Changed Input Port Interface figure ..................................................................................................................................... 22
•
Changed SPI Slave Interface Timing Requirements table ................................................................................................... 27
•
Added SPI Timing diagram................................................................................................................................................... 27
•
Changed RSTsignal timing in Parallel Flash Write Timing diagram..................................................................................... 29
•
Changed signal notations in Serial Flash Interface Timing Requirements table.................................................................. 30
•
Changed signal notations in Flash Memory Interface Timing diagram ................................................................................ 30
•
Changed signal notations in DLPA200 I/F Timing diagram.................................................................................................. 32
•
Changed Typical Application diagram .................................................................................................................................. 38
•
Changed paragraph about read mode in Parallel Flash Memory Interface ......................................................................... 41
•
Deleted SRAM Interface Timing diagram and provided reference to the OEM data sheet ................................................. 41
•
Replaced "DAD" with "DLPA200" ......................................................................................................................................... 43
•
Changed location of Device Marking in document ............................................................................................................... 48
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DLPS014F – APRIL 2010 – REVISED MAY 2018
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Changes from Revision A (May 2010) to Revision B
Page
•
Changed typo on pin number for MEM_D43 Pin ................................................................................................................. 14
•
Changed typo on pin number for MEM_D62 Pin ................................................................................................................. 14
•
Added part number used for EEPROM ................................................................................................................................ 40
•
Changed part number for Winbond part............................................................................................................................... 41
•
Added new section for Power-Down Requirements ............................................................................................................. 45
Changes from Original (April 2010) to Revision A
Page
•
Added / changed pin names, updated descriptions in Pin Functions table ........................................................................... 6
•
Changed junction temperature and notated need for heat sink ........................................................................................... 20
•
Deleted unused types, updated values in I/O Characteristics table..................................................................................... 21
•
Changed parameter names to match figure......................................................................................................................... 34
•
Added new section for Power-Up Requirements ................................................................................................................. 45
•
Changed TI Lit Number from DLPS012 to DLPZ004 in Related Documents ...................................................................... 48
4
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DLPS014F – APRIL 2010 – REVISED MAY 2018
5 Pin Configuration and Functions
BGA
780 PINS
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DLPC200
DLPS014F – APRIL 2010 – REVISED MAY 2018
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Pin Functions
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
PORT 1 VIDEO DATA AND CONTROL (2)
PORT1_CLK
J2
Pixel clock (if not used, apply 10-kΩ pulldown to DGND)
PORT1_VSYNC
N3
PORT1_CLK
Vertical sync; weak pullup applied
PORT1_HSYNC
P1
PORT1_CLK
Horizontal sync; weak pullup applied
PORT1_IVALID
P2
PORT1_CLK
Data valid (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D0
D2
PORT1_CLK
Pixel data – Blue 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D1
D3
PORT1_CLK
Pixel data – Blue 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D2
F5
PORT1_CLK
Pixel data – Blue 2 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D3
D1
PORT1_CLK
Pixel data – Blue 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D4
F3
PORT1_CLK
Pixel data – Blue 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D5
G4
PORT1_CLK
Pixel data – Blue 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D6
F1
PORT1_CLK
Pixel data – Blue 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D7
G3
PORT1_CLK
Pixel data – Blue 7 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D8
H5
PORT1_CLK
Pixel data – Green 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D9
H4
PORT1_CLK
Pixel data – Green 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D10
G2
PORT1_CLK
Pixel data – Green 2 (if not used, apply 10-kΩ pulldown to DGND)
I3
PORT1_D11
J4
PORT1_CLK
Pixel data – Green 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D12
H3
PORT1_CLK
Pixel data – Green 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D13
J3
PORT1_CLK
Pixel data – Green 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D14
K3
PORT1_CLK
Pixel data – Green 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D15
L1
PORT1_CLK
Pixel data – Green 7 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D16
L3
PORT1_CLK
Pixel data – Red 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D17
L4
PORT1_CLK
Pixel data – Red 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D18
M4
PORT1_CLK
Pixel data – Red 2 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D19
K1
PORT1_CLK
Pixel data – Red 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D20
M1
PORT1_CLK
Pixel data – Red 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D21
K2
PORT1_CLK
Pixel data – Red 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D22
M2
PORT1_CLK
Pixel data – Red 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_D23
M3
PORT1_CLK
Pixel data – Red 7 (if not used, apply 10-kΩ pulldown to DGND)
PORT1_HPD
E15
PORT1_SYNCDET
J22
(1)
(2)
6
B2
HDMI hotplug detect, (if not used, apply 10-kΩ pulldown to DGND)
HDMI input sync detect, (if not used, apply 10-kΩ pulldown to
DGND)
See I/O Electrical Characteristics for more detail.
24-bit data is mapped according to RGB888 pixel format. See Figure 13.
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DLPS014F – APRIL 2010 – REVISED MAY 2018
Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
PORT 2 VIDEO DATA AND CONTROL (2)
PORT2_CLK
Y2
Pixel clock (if not used, apply 10-kΩ pulldown to DGND)
PORT2_VSYNC
AF2
PORT2_CLK
Vertical sync; weak pullup applied
PORT2_HSYNC
AB6
PORT2_CLK
Horizontal sync; weak pullup applied
PORT2_IVALID
W1
PORT2_CLK
Data valid (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D0
Y1
PORT2_CLK
Pixel data – Blue 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D1
AE1
PORT2_CLK
Pixel data – Blue 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D2
U2
PORT2_CLK
Pixel data – Blue 2 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D3
AD12
PORT2_CLK
Pixel data – Blue 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D4
AB1
PORT2_CLK
Pixel data – Blue 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D5
V3
PORT2_CLK
Pixel data – Blue 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D6
U5
PORT2_CLK
Pixel data – Blue 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D7
T3
PORT2_CLK
Pixel data – Blue 7 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D8
AD1
PORT2_CLK
Pixel data – Green 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D9
AA3
PORT2_CLK
Pixel data – Green 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D10
R6
PORT2_CLK
Pixel data – Green 2 (if not used, apply 10-kΩ pulldown to DGND)
I1
PORT2_D11
W3
PORT2_CLK
Pixel data – Green 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D12
AB5
PORT2_CLK
Pixel data – Green 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D13
AD3
PORT2_CLK
Pixel data – Green 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D14
AD5
PORT2_CLK
Pixel data – Green 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D15
AD4
PORT2_CLK
Pixel data – Green 7 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D16
AE5
PORT2_CLK
Pixel data – Red 0 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D17
AC11
PORT2_CLK
Pixel data – Red 1 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D18
AB8
PORT2_CLK
Pixel data – Red 2 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D19
AC7
PORT2_CLK
Pixel data – Red 3 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D20
AG4
PORT2_CLK
Pixel data – Red 4 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D21
AE4
PORT2_CLK
Pixel data – Red 5 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D22
AF5
PORT2_CLK
Pixel data – Red 6 (if not used, apply 10-kΩ pulldown to DGND)
PORT2_D23
AF3
PORT2_CLK
Pixel data – Red 7 (if not used, apply 10-kΩ pulldown to DGND)
Alternate sync for port 1; treated as Vsync; weak pullup applied
SYNC IN/SYNC OUT
PORT1_Trig_in
F2
I3
PORT1_CLK
PORT1_Sync_out
H6
O3
Async
PORT2_Trig_in
AB7
I1
PORT2_CLK
Y3
O1
Async
PORT2_Sync_out
Reserved for future use
Alternate sync for port 2; treated as vsync; weak pullup applied
Reserved for future use
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
CONTROL INTERFACES (I2C, USB, SPI)
USB clock input (48 MHz), feeds a PLL (if not used, apply 10-kΩ
pulldown to DGND)
USB_CLK
B15
I3
USB_CTRL0
B17
I3
USB_CLK
USB I/F FIFO programmable level (if not used, apply 10-kΩ pulldown
to DGND)
USB_CTRL1
A26
I3
USB_CLK
USB I/F FIFO-full flag (if not used, apply 10-kΩ pulldown to DGND)
USB_CTRL2
D22
I3
USB_CLK
USB I/F FIFO-empty flag (if not used, apply 10-kΩ pulldown to
DGND)
USB_CTRL3
C19
I3
USB_CLK
Reserved for future use (if not used, apply 10-kΩ pulldown to DGND)
USB_CTRL4
D16
I3
USB_CLK
Reserved for future use (if not used, apply 10-kΩ pulldown to DGND)
USB_CTRL5
G17
I3
USB_CLK
Reserved for future use (if not used, apply 10-kΩ pulldown to DGND)
USB_FD0
G16
USB_FD1
C26
B2
USB_CLK
USB interface data bus (if not used, apply 10-kΩ pulldown to DGND)
USB_FD2
F17
USB_FD3
C22
USB_FD4
E18
USB_FD5
B18
USB_FD6
F18
USB_FD7
E19
USB_FD8
B23
USB_FD9
D25
USB_FD10
C21
USB_FD11
D24
USB_FD12
B19
USB_FD13
E25
USB_FD14
G18
USB_FD15
C15
USB_PA02
D23
O3
USB_CLK
USB I/F FIFO output enable for reads (if not used, apply 10-kΩ
pullup to 3.3 V)
USB_PA04
G15
O3
USB_CLK
USB I/F FIFO address(0) (if not used, apply 10-kΩ pullup to 3.3 V)
USB_PA05
A22
O3
USB_CLK
USB I/F FIFO address(1) (if not used, apply 10-kΩ pullup to 3.3 V)
USB_PA06
A25
O3
USB_CLK
USB I/F FIFO packet end trigger
USB_RDY0
C16
O3
USB_CLK
USB I/F FIFO read enable (if not used, apply 10-kΩ pullup to 3.3 V)
USB_RDY1
C17
O3
USB_CLK
USB I/F FIFO write enable (if not used, apply 10-kΩ pullup to 3.3 V)
USB_RDY2
B26
O3
USB_CLK
Reserved for future use (if not used, apply 10-kΩ pullup to 3.3 V)
USB_RSVD_14
A15
I3
USB_CLK
Reserved for future use (if not used, apply 10-kΩ pulldown to DGND)
I2C_SCL
C25
B2
I2C_SDA
D18
B2
EDID_I2C_SCL
F8
B2
EDID_I2C_SDA
D6
B2
SLAVE_SPI_CLK
B14
I3
SLAVE_SPI_CS
C14
I3
SLAVE_SPI_CLK
Slave SPI chip select; weak pullup applied
SLAVE_SPI_MISO
D14
O3
SLAVE_SPI_CLK
Slave SPI data OUT (does not tristate)
SLAVE_SPI_MOSI
E14
I3
SLAVE_SPI_CLK
Slave SPI data IN; weak pullup applied
SLAVE_SPI_SOP
F21
I3
SLAVE_SPI_CLK
Reserved for future use
SLAVE_SPI_ACK
D20
O3
SLAVE_SPI_CLK
Slave SPI data busy
8
Master I2C clock - 400 kHz. Requires external pullup
I2C_SCL
Master I2C data - 400 kHz. Requires external pullup
HDMI EDID I2C clock. 400 kHz. Requires external pullup (if EDID is
not used, must be pulled up to 3.3 V through a 47-kΩ resistor)
EDID_I2C_SCL
HDMI EDID I2C data. 400-kHz. Requires external pullup (if EDID is
not used, must be pulled up to 3.3 V through a 47-kΩ resistor.)
Slave SPI clock
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DLPS014F – APRIL 2010 – REVISED MAY 2018
Pin Functions (continued)
PIN
NUMBER
I/O
TYPE (1)
DMD_DAT_AP1
AB27
O4
DMD_DAT_AN1
AB28
O4
DMD_DAT_AP3
Y25
O4
DMD_DAT_AN3
Y26
O4
DMD_DAT_AP5
W25
O4
DMD_DAT_AN5
W26
O4
DMD_DAT_AP7
W28
O4
DMD_DAT_AN7
W27
O4
DMD_DAT_AP9
V27
O4
DMD_DAT_AN9
V28
O4
DMD_DAT_AP11
V25
O4
DMD_DAT_AN11
V26
O4
DMD_DAT_AP13
V23
O4
DMD_DAT_AN13
V24
O4
DMD_DAT_AP15
T26
O4
DMD_DAT_AN15
U27
O4
DMD_DCLK_AP
T25
O4
DMD data clock. LVDS clock for data bus A
DMD_DCLK_AN
U28
O4
DMD data clock. LVDS clock for data bus A
DMD_SCTRL_AP
R25
O4
DMD_SCTRL_AN
R26
O
DMD_DAT_BP1
AC24
O4
DMD_DAT_BN1
AC25
O4
DMD_DAT_BP3
AC26
O4
DMD_DAT_BN3
AD26
O4
DMD_DAT_BP5
AE27
O4
DMD_DAT_BN5
AE28
O4
DMD_DAT_BP7
AD27
O4
DMD_DAT_BN7
AD28
O4
DMD_DAT_BP9
Y23
O4
DMD_DAT_BN9
Y24
O4
DMD_DAT_BP11
AC27
O4
DMD_DAT_BN11
AC28
O4
DMD_DAT_BP13
AB25
O4
DMD_DAT_BN13
AB26
O4
DMD_DAT_BP15
AA25
O4
DMD_DAT_BN15
AA26
O4
DMD_DCLK_BP
U25
O4
DMD_DCLK_BN
U26
O4
DMD_SCTRL_BP
T21
O4
DMD_SCTRL_BN
T22
O4
DMD_DCLK_AP,
DMD_DCLK_AN
DMD_PWRDN
P26
O3
ASYNC
DMD power down (active-low)
RST_IRQ
M25
I3
ASYNC
DLPA200 interrupt (active-low)
RST_OE
M28
O3
ASYNC
DLPA200 output enable
RST_RST
H24
O3
ASYNC
DLPA200 reset
RST_STROBE
G28
O3
NAME
CLOCK SYSTEM
DESCRIPTION
DMD_DCLK_AP,
DMD_DCLK_AN
DMD data pins. LVDS pins for data bus A
DMD INTERFACE
DMD_DCLK_AP,
DMD_DCLK_AN
DMD data serial-control signal bus A (LVDS)
DMD_DCLK_BP,
DMD_DCLK_BN
DMD data pins. LVDS pins for data bus B
DMD data clock. LVDS clock for data bus B
DMD data serial-control signal bus B (LVDS)
DLPA200 strobe
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
O3
RST_STROBE
DLPA200 voltage select
O3
RST_STROBE
DLPA200 mode select
O3
RST_STROBE
DLPA200 address
DESCRIPTION
DMD INTERFACE (CONTINUED)
RST_SEL0
G27
RST_SEL1
G26
RST_MODE0
L24
RST_MODE1
L23
RST_A0
K25
RST_A1
J26
RST_A2
J25
RST_A3
K26
SCP_DMD_RST_DO
G25
O3
SCP_DMD_RST_CL
SCP data out (write data)
K
SCP_DMD_RST_DI
H26
I3
SCP_DMD_RST_CL
SCP data in (read data)
K
SCP_DMD_EN
L25
O3
SCP_DMD_RST_CL
DMD SCP chip select
K
SCP_RST_EN
H23
O3
SCP_DMD_RST_CL
DLPA200 SCP chip select
K
SCP_DMD_RST_CLK
H25
O3
FLASH_CE
D12
O3
ASYNC
FLASH_SRAM_A0
D13
O3
FLASH_SRAM_WE
DMD/DLPA200 SCP clock, 125 kHz
STATIC RAM INTERFACE
FLASH_SRAM_A1
A11
FLASH_SRAM_A2
C11
FLASH_SRAM_A3
D11
FLASH_SRAM_A4
A12
FLASH_SRAM_A5
B12
FLASH_SRAM_A6
D10
FLASH_SRAM_A7
A10
FLASH_SRAM_A8
B10
FLASH_SRAM_A9
B8
FLASH_SRAM_A10
C8
FLASH_SRAM_A11
A7
FLASH_SRAM_A12
B7
FLASH_SRAM_A13
A4
FLASH_SRAM_A14
D7
FLASH_SRAM_A15
C6
FLASH_SRAM_A16
D8
FLASH_SRAM_A17
B6
FLASH_SRAM_A18
C7
FLASH_SRAM_A19
A8
FLASH_SRAM_A20
C4
FLASH_SRAM_A21
B3
FLASH_SRAM_A22
A3
FLASH_SRAM_A23
C5
FLASH_SRAM_A24
D5
FLASH_SRAM_A25
B4
FLASH_SRAM_A26
D4
10
Flash chip enable
Flash/SRAM address
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
STATIC RAM INTERFACE (CONTINUED)
FLASH_SRAM_D0
E11
FLASH_SRAM_D1
F10
FLASH_SRAM_D2
E10
FLASH_SRAM_D3
G9
FLASH_SRAM_D4
E8
FLASH_SRAM_D5
E7
FLASH_SRAM_D6
E5
FLASH_SRAM_D7
E4
FLASH_SRAM_D8
F11
FLASH_SRAM_D9
E12
B2
FLASH_SRAM_WE
Flash/SRAM data
FLASH_SRAM_D10
F12
FLASH_SRAM_D11
G12
FLASH_SRAM_D12
G13
FLASH_SRAM_D13
H13
FLASH_SRAM_D14
F14
FLASH_SRAM_D15
G14
FLASH_SRAM_OE
C10
O3
Flash output enable
FLASH_SRAM_RDY
C13
I3
Flash wait
FLASH_SRAM_RST
C12
O3
Flash reset
FLASH_SRAM_WE
A6
O3
Flash write enable
SRAM_CE
B11
O3
SRAM chip enable
SRAM_LB
D9
O3
SRAM lower byte enable
SRAM_UB
C9
O3
SRAM upper byte enable
MEM_CLK_P0
R2
O5
DDR2 memory, differential memory clock
MEM_CLK_N0
R1
O5
DDR2 memory, differential memory clock
MEM_CLK_P1
U3
O5
DDR2 memory, differential memory clock
MEM_CLK_N1
U4
O5
DDR2 memory, differential memory clock
MEM_CLK_P2
AC5
O5
DDR2 memory, differential memory clock
MEM_CLK_N2
AC4
O5
DDR2 memory, differential memory clock
MEM_CLK_P3
AE14
O5
DDR2 memory, differential memory clock
MEM_CLK_N3
AF14
O5
DDR2 memory, differential memory clock
MEM_CKE0
AF12
O5
MEM_BA0
Y19
O5
MEM_CLK
MEM_BA1
AD21
O5
MEM_CLK
MEM_BA2
AE7
O5
MEM_CLK
SDRAM INTERFACE
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
SDRAM INTERFACE (CONTINUED)
MEM_A0
AD24
MEM_A1
AF21
MEM_A2
AG23
MEM_A3
AE8
MEM_A4
AG12
MEM_A5
AF23
MEM_A6
AC17
MEM_A7
AA16
MEM_A8
AE23
MEM_A9
AE22
MEM_A10
AE16
MEM_A11
AD25
MEM_A12
AF19
MEM_A13
AH10
MEM_A14
AA8
O5
MEM_CLK
DDR2 memory, multiplexed row and column address. The memory
in the kit is 512 Mb in ×16 mode, 8 Meg × 16 bits × 4 banks. Only
A(12:0) and BA(1:0) are currently used. A(15:13) and BA(2) are
reserved for future use (RFU).
MEM_A15
AD11
MEM_CAS
AG19
O5
MEM_CLK
Column address strobe, active low
MEM_RAS
AE20
O5
MEM_CLK
Row address strobe, active low
MEM_CS0
AF13
O5
MEM_CLK
Chip select, active low
MEM_WE
AG25
O5
MEM_CLK
Write enable, active low
MEM_ODT
AH12
O5
MEM_CLK
MEM_DM0
W2
O5
MEM_CLK
MEM_DM1
AE2
O5
MEM_CLK
MEM_DM2
AH6
O5
MEM_CLK
MEM_DM3
AF7
O5
MEM_CLK
MEM_DM4
AE13
O5
MEM_CLK
MEM_DM5
AH18
O5
MEM_CLK
MEM_DM6
AF24
O5
MEM_CLK
MEM_DM7
AG26
O5
MEM_CLK
MEM_DS0
AB2
B1
MEM_CLK_P0
MEM_DS1
AE3
B1
MEM_CLK_N0
MEM_DS2
AD7
B1
MEM_CLK_P1
MEM_DS3
AE10
B1
MEM_CLK_N1
MEM_DS4
AF11
B1
MEM_CLK_P2
MEM_DS5
AF17
B1
MEM_CLK_N2
MEM_DS6
AE18
B1
MEM_CLK_P3
MEM_DS7
AF26
B1
MEM_CLK_N3
12
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DLPS014F – APRIL 2010 – REVISED MAY 2018
Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
SDRAM INTERFACE (CONTINUED)
MEM_D0
R3
B1
MEM_D1
R4
B1
MEM_D2
T4
B1
MEM_D3
R5
B1
MEM_D4
U1
B1
MEM_D5
V4
B1
MEM_D6
V2
B1
MEM_D7
V1
B1
MEM_D8
U6
B1
MEM_D9
Y4
B1
MEM_D10
AC2
B1
MEM_D11
AC1
B1
MEM_D12
AC3
B1
MEM_D13
AD2
B1
MEM_D14
AB3
B1
MEM_D15
AA4
B1
MEM_D16
AE6
B1
MEM_D17
AF4
B1
MEM_D18
AG3
B1
MEM_D19
AH3
B1
MEM_D20
AF6
B1
MEM_D21
AH4
B1
MEM_D22
AD8
B1
MEM_D23
AG6
B1
MEM_D24
AB9
B1
MEM_D25
AD10
B1
MEM_D26
AG7
B1
MEM_D27
AH7
B1
MEM_D28
AC8
B1
MEM_D29
AA10
B1
MEM_D30
AG8
B1
MEM_D31
AH8
B1
MEM_DS0,
MEM_DS1
MEM_DS2,
MEM_DS3
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
SDRAM INTERFACE (CONTINUED)
MEM_D32
AF8
B1
MEM_D33
AE9
B1
MEM_D34
AF10
B1
MEM_D35
AG10
B1
MEM_D36
AE12
B1
MEM_D37
AE11
B1
MEM_D38
AG11
B1
MEM_D39
AH11
B1
MEM_D40
AC15
B1
MEM_D41
AF15
B1
MEM_D42
AG17
B1
MEM_D43
AH17
B1
MEM_D44
AF16
B1
MEM_D45
AB16
B1
MEM_D46
AE17
B1
MEM_D47
AG18
B1
MEM_D48
AH19
B1
MEM_D49
AD17
B1
MEM_D50
AG21
B1
MEM_D51
AH21
B1
MEM_D52
AG22
B1
MEM_D53
AH22
B1
MEM_D54
AH23
B1
MEM_D55
AE19
B1
MEM_D56
AF25
B1
MEM_D57
AF20
B1
MEM_D58
AD18
B1
MEM_D59
AE21
B1
MEM_D60
AE25
B1
MEM_D61
AH25
B1
MEM_D62
AF22
B1
MEM_D63
AE24
B1
14
MEM_DS4,
MEM_DS5
MEM_DS6,
MEM_DS7
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DLPS014F – APRIL 2010 – REVISED MAY 2018
Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
LED DRIVER INTERFACE
PWM0
C27
O3
Async
PWM signal used to control the LED current (if not used, apply 10kΩ pulldown to DGND)
PWM1
D28
O3
Async
PWM signal used to control the LED current (if not used, apply 10kΩ pulldown to DGND)
PWM2
D27
O3
Async
PWM signal used to control the LED current (if not used, apply 10kΩ pulldown to DGND)
PWM3
D26
O3
Async
PWM signal used to control the LED current (if not used, apply 10kΩ pulldown to DGND)
LED_IR_EN
E28
O3
Async
IR LED enable strobe. Controlled by programmable DMD sequence
timing (active high), (if not used, apply 1-kΩ pulldown to DGND)
LED_RED_EN
F28
O3
Async
RED LED enable strobe. Controlled by programmable DMD
sequence timing (active high), (if not used, apply 1-kΩ pulldown to
DGND)
LED_GRN_EN
E27
O3
Async
Green LED enable strobe. Controlled by programmable DMD
sequence timing (active high), (if not used, apply 1-kΩ pulldown to
DGND)
LED_BLU_EN
F27
O3
Async
Blue LED enable strobe. Controlled by programmable DMD
sequence timing (active high), (if not used, apply 1-kΩ pulldown to
DGND)
LED_SUBFRAME
E26
O3
Async
Subframe signal used by LED driver. Controlled by programmable
DMD sequence timing (active high), (if not used, apply 1-kΩ
pulldown to DGND)
SYNC_0
F26
O3
Async
Extra strobe. Controlled by programmable DMD sequence timing
(active-high)
SYNC_1
F25
O3
Async
Extra strobe. Controlled by programmable DMD sequence timing
(active-high)
SYNC_2
F24
O3
Async
Extra strobe. Controlled by programmable DMD sequence timing
(active-high)
LED_EN
L28
O3
Async
LED driver enable. Active-low output control to external LED drive
logic, recommend 1-kΩ pullup to 3.3 V
LED_SYNC
M21
O3
Async
Reserved for future use; weak pullup applied
LED_SYNCEN
C24
O3
Async
Inverted LED_LIT signal (if not used, apply 10-kΩ pulldown to
DGND)
LED_LIT
J28
I3
Async
LED driver status, (if not used, apply 1-kΩ pulldown to DGND)
LED_SENS
K27
I3
Async
Reserved for future use (if not used, apply 1-kΩ pulldown to DGND)
LED_SPI_CLK
N26
O3
Async
LED SPI master clock (if not used, apply 1-kΩ pullup to 3.3 V)
LED_SPI_CS
M26
O3
LED_SPI_CLK
LED SPI master chip select (if not used, apply 1-kΩ pullup to 3.3 V)
LED_SPI_DIR
P25
O3
LED_SPI_CLK
LED SPI master driver direction (if not used, apply 1-kΩ pullup to 3.3
V)
LED_SPI_MISO
L27
I3
LED_SPI_CLK
LED SPI master data IN (if not used, apply 1-kΩ pullup to 3.3 V)
LED_SPI_MOSI
L26
O3
LED_SPI_CLK
LED SPI master data OUT; weak pullup applied
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Pin Functions (continued)
PIN
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
CFG_CSO
E2
O3
CFG_DCLK
Chip-select output for an external serial configuration device. Active
low
CFG_CLK
P3
O3
CFG_DCLK
Configuration serial EPROM data clock
CFG_ASDI
N7
I3
CFG_DCLK
Data input from an external serial configuration device. Provides
configuration data for the device
CFG_ASDO
F4
O3
CFG_DCLK
Serial data output. This pin sends address and control information to
the external PROM during configuration.
CFG_STATUS
M6
O3
CFG_DCLK
Configuration status pin
CFG_DONE
P24
O3
CFG_DCLK
Configuration-done status pin. Signal goes high at the end of
configuration.
CFG_MSEL0
N22
I3
Async
Configuration-mode selection signals
NAME
DESCRIPTION
SYSTEM INTERFACES
CFG_MSEL1
P23
CFG_MSEL2
M22
CFG_MSEL3
P22
CFG_CE
R8
I3
Async
Chip enable. Active-low
CFG_EN
P4
I3
Async
Configuration control. Configuration starts when a low-to-high
transition is detected at this pin.
CFG_CEO
P28
O3
Async
REF_CLK
J27
I3
RESET
A14
I3
Async
Device reset (active-low)
PWR_GOOD
A23
I3
Async
System power-good indicator
N4
B2
GPIO
RSVD_H11
L2
B2
GPIO
RSVD_H12
K4
B2
GPIO
RSVD_H6
G1
B2
GPIO
RSVD_H5
G5
B2
GPIO
RSVD_H4
G6
B2
GPIO
RSVD_H2
E1
B2
GPIO
RSVD_H1
C2
B2
GPIO
RSVD_T0
E22
RSVD_T1
D21
RSVD_T2
A21
RSVD_T3
C18
RSVD_T4
B22
RSVD_T5
B21
RSVD_T6
D17
50-MHz reference clock, 3.3 V
RESERVED
RSVD_H10
RSVD_T7
E21
RSVD_TC
M24
These I/Os can be left open or unconnected for normal operation.
RSVD_D0
A17
I3
Reserved for future use, do not connect
RSVD_D1
D15
O3
Reserved for future use, do not connect
RSVD_D2
E17
I3
Reserved for future use, do not connect
RSVD_D3
F15
O3
Reserved for future use, do not connect
RSVD_H3
E3
I3
Reserved for future use, can be left open, recommend grounding
RSVD_H7
H7
I3
Reserved for future use, can be left open, recommend grounding
RSVD_H8
L5
I3
Reserved for future use, can be left open, recommend grounding
RSVD_H9
M5
I3
Reserved for future use, can be left open, recommend grounding
16
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DLPS014F – APRIL 2010 – REVISED MAY 2018
Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
RESERVED (CONTINUED)
RSVD_H13
J1
I3
Reserved for future use, can be left open, recommend grounding
RSVD_P0
P7
I4
Reserved for future use, do not connect
RSVD_P1
P6
O2
Reserved for future use, do not connect
RSVD_P2
P8
I4
Reserved for future use, do not connect
RSVD_P3
P5
I4
Reserved for future use, do not connect
RSVD_G0
C23
O3
Reserved for future use, do not connect
RSVD_G1
F19
O3
Reserved for future use, do not connect
RSVD_G2
M27
O3
Reserved for future use, do not connect
RSVD_G3
N21
O3
Reserved for future use, do not connect
RSVD_G4
P27
O3
Reserved for future use, do not connect
RSVD_G5
A18
O3
Reserved for future use, do not connect
RSVD_G6
A19
O3
Reserved for future use, do not connect
RSVD_S1
AG14
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_S2
AG15
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_S3
AH14
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_X11
AH15
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_S20
Y27
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_S21
Y28
Unused input only, can be left open, recommend 10-kΩ pulldown to
DGND
RSVD_X9
AA22
Reserved for future use, do not connect
RSVD_S0
AA24
Reserved for future use, can be left open, recommend 10-kΩ pullup
to 2.5 V
RSVD_X10
AB23
Reserved for future use, do not connect
RSVD_X6
AB24
Reserved for future use, do not connect
RSVD_X3
AC21
Reserved for future use, do not connect
RSVD_X15
AA17
Reserved, do not leave open, required: 49.4-Ω pullup to 1.8 V
RSVD_X14
AB17
Reserved, do not leave open, required: 49.9-Ω pulldown to DGND
RSVD_X13
U7
Reserved, do not leave open, required: 49.4-Ω pullup to 1.8V
RSVD_X12
U8
Reserved, do not leave open, required: 49.9-Ω pulldown to DGND
RSVD_X2
AE15
Reserved for future use, do not connect
RSVD_X0
AF18
Reserved for future use, do not connect
RSVD_X1
AD15
Reserved for future use, do not connect
RSVD_X8
AF27
Reserved for future use, do not connect
RSVD_X4
AF9
Reserved for future use, do not connect
RSVD_S4
AH26
Reserved for future use, can be left open, recommend 10-kΩ pullup
to 1.8 V
RSVD_S5
B25
Reserved for future use, do not connect
RSVD_S6
C20
Reserved for future use, do not connect
RSVD_S8
D19
Reserved for future use, do not connect
RSVD_X5
E24
Reserved for future use, do not connect
RSVD_S10
F22
Reserved for future use, do not connect
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O
TYPE (1)
CLOCK SYSTEM
DESCRIPTION
RESERVED (CONTINUED)
RSVD_S11
K28
Reserved for future use, do not connect
RSVD_S14
N25
Reserved for future use, do not connect
RSVD_X7
R24
Reserved for future use, do not connect
RSVD_S16
R27
Reserved for future use, do not connect
RSVD_S17
R28
Reserved for future use, do not connect
RSVD_S18
U23
Reserved for future use, can be left open, recommend 10-kΩ pullup
to 2.5 V
RSVD_S19
U24
Reserved for future use, can be left open, recommend 10-kΩ pullup
to 2.5 V
POWER AND GROUND (3)
P1P2V
PWR
N/A
1.2-V core power
P2P5V_DPLL
PWR
N/A
2.5-V filtered power for internal PLL
P1P8V
PWR
N/A
1.8-V I/O power
P2P5V
PWR
N/A
2.5-V I/O power
P3P3V
PWR
N/A
3.3-V I/O power
GND
PWR
N/A
Common digital ground
GNDA
PWR
N/A
Common PLL ground
(3)
18
Unused inputs should be pulled down to ground through an external resistor.
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Power and Ground Pins
PIN
NAME
DESCRIPTION
NUMBER
INPUT POWER AND GROUND PINS
VCC_1P2V
VCC_2P5V
VCC_1P8V
VCC_3P3V
K9, K11, K13, K15, K17, K19, L10, L12, L14, L16, L18, L20,
M9, M11, M13, M15, M17, M19, N10, N12, N14, N16, N18,
N20, P9, P11, P13, P15, P17, P19, R10, R12, R14, R16,
1.2-V power supply for core logic
R18, R20, T9, T11, T13, T15, T17, T19, U10, U12, U14,
U16, U18, U20, V9, V11, V13, V15, V17, V19, W10, W12,
W14, W16, W18, W20
AA28, AG28, T24, T28, W24
2.5-V power supply for I/Os on bank 5
AA1, AG1, T1, T5, W5, AA11, AD6, AD9, AD13, AH2, AH5,
AH9, AH13, AA18, AD16, AD20, AD23, AH16, AH20, AH24, 1.8-V power supply for I/Os on banks 2, 3, 4
AH27
B1, H1, K5, N1, N5, B28, H28, K24, N24, N28 A16, A20,
A24, A27, E16, E20, E23, H18, A2, A5, A9, A13, E6, E9,
E13, H11
3.3-V power supply for I/Os on banks 1, 6, 7, 8
VCCA
Y8, J21, J8, Y21
2.5-V power supply for the internal PLL analog supply
VCCD_PLL
Y9, J20, J9, Y20
1.2-V power supply for the internal PLL digital supply
VREF_B2
T7, T8, AB4
DDR2 VREF 0.9 V. The SDRAM specification provides
guidelines on how these references should be connected. It is
not just any 0.9-V source on the board.
VREF_B3
AB13, AB11, Y10
DDR2 VREF 0.9 V. The SDRAM specification provides
guidelines on how these references should be connected. It is
not just any 0.9-V source on the board.
VREF_B4
AB20, AC18, AA15
DDR2 VREF 0.9 V. The SDRAM specification provides
guidelines on how these references should be connected. It is
not just any 0.9-V source on the board.
DGND
DGND2
NC
K10, K12, K14, K16, K18, K20, L9, L11, L13, L15, L17, L19,
M10, M12, M14, M16, M18, M20, N9, N11, N13, N15, N17,
N19, P10, P12, P14, P16, P18, P20, R9, R11, R13, R15,
R17, R19, T10, T12, T14, T16, T18, T20, U9, U11, U13,
U15, U17, U19, V10, V12, V14, V16, V18, V20, W9, W11,
W13, W15, W17, W19, AA2, AA27, AC6, AC9, AC13, AC16, Common ground
AC20, AC23, AF1, AF28, AG2, AG5, AG9, AG13, AG16,
AG20, AG24, AG27, B2, B5, B9, B13, B16, B20, B24, B27,
C1, C28, F6, F9, F13, F16, F20, F23, H2, H27, J11, J18,
K6, K23, N2, N6, N23, N27, T2, T6, T23, T27, W6, W23,
Y11, Y18
H9, H20, AA9, AA20
Analog ground return for the PLL (This should not be
connected to the common ground GND.)
C3, F7, G7, G8, G10, G11, G19, G20, G21, G22, G23, G24,
H8, H10, H12, H14, H15, H16, H17, H19, H21, H22, J5, J6,
J7, J10, J12, J13, J14, J15, J16, J17, J19, J23, J24, K7, K8,
K21, K22, L6, L7, L8, L21, L22, M7, M8, M23, N8, P21, R7,
R21, R22, R23, U21, U22, V5, V6, V7, V8, V21, V22, W4,
No-connect pins
W7, W8, W21, W22, Y5, Y6, Y7, Y12, Y13, Y14, Y15, Y16,
Y17, Y22, AA5, AA6, AA7, AA12, AA13, AA14, AA19, AA21,
AA23, AB10, AB12, AB14, AB15, AB18, AB19, AB21, AB22,
AC10, AC12, AC14, AC19, AC22, AD14, AD19, AD22,
AE26
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6 Specifications
6.1 Absolute Maximum Ratings (1)
Over operating free-air temperature range (unless otherwise noted)
VCC12
VCCIO18
VCCA25_DPLL
Supply voltage
(2)
VCCD_PLL1-4
(3)
VI
Input voltage
TJ
Operating junction temperature
(1)
(2)
(3)
(1.8 V, 2.5 V, 3.3 V)
MIN
MAX
–0.5
1.8
UNIT
–0.5
3.9
–0.5
3.75
–0.5
1.8
–0.5
3.95
V
–40
125
°C
V
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND, and at the device, not at the power supply.
Applies to external input and bidirectional buffers.
6.2 Handling Ratings
Tstg
Electrostatic
discharge
V(ESD)
(1)
(2)
MIN
MAX
UNIT
–65
150
°C
–2000
2000
–500
500
Storage temperature range
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins (2)
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
VCC12
1.2-V supply voltage, core logic
VCC18
1.8-V supply voltage, HSTL output buffers
VCCA25_DPLL
2.5-V analog voltage for PLL regulator
VCCD_PLL1-4
1.2-V supply voltage, for PLL
VCC33
VREF_B2-4
VI
Input voltage
VO
Output voltage
tRamp
Power supply ramp time
TJ
Operating junction temperature (1)
(1)
MIN
NOM
MAX
UNIT
1.15
1.2
1.25
V
1.71
1.8
1.89
V
2.375
2.5
2.625
V
1.15
1.2
1.25
V
3.3-V supply voltage
3.135
3.3
3.465
V
0.9-V reference voltage, for DDR2 SDRAM
0.833
0.9
0.969
V
–0.5
3.6
V
0
VCCIO
V
50 µs
3 ms
—
–20
85
°C
Heat sink not required for 0°C to 55°C, but for 55°C to 85°C, TI recommends a low-profile (15-mm) heat sink.
6.4 Thermal Information
DLPC200
THERMAL METRIC
(1)
BGA
UNIT
780 PINS
RθJA
Junction-to-ambient thermal resistance
Natural convection
16.9
100 CFM
13.5
200 CFM
11.8
400 CFM
10.5
RθJC(top)
Junction-to-case (top) thermal resistance
3.3
RθJB
Junction-to-board thermal resistance
5.9
(1)
20
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 I/O Electrical Characteristics
All inputs and outputs are LVCMOS
I/O TYPE (1)
TEST CONDITIONS
VIL(V)
VIH(V)
MIN
MAX
MIN
VOH(V)
MAX
VOL(V)
MIN
MAX
UNIT
I1
Input LVCMOS
VCCIO = 1.8 V
–0.3
0.35 × VCCIO
0.65 × VCCIO
2.25
V
I2
Input LVCMOS
VCCIO = 2.5 V
–0.3
0.7
1.7
VCCIO + 0.3
V
I3
Input LVCMOS
VCCIO = 3.3 V
–0.3
0.8
1.7
3.6
V
I4
Input LVTTL
VCCIO = 3.3 V
–0.3
0.8
1.7
3.6
O1
Output LVCMOS
VCCIO = 1.8 V
VCCIO – 0.45
0.45
V
O2
Output LVTTL
VCCIO = 3.3 V
2.4
0.45
V
O3
Output LVCMOS
VCCIO = 3.3 V
VCCIO – 0.2
0.2
V
O4
Output LVDS
VCCIO = 3.3 V
VCCIO – 0.3
0.3
V
O5
Output SSTL-18
Class I
VCCIO = 1.8 V
1.484
0.398
V
B1
Bidirectional SSTL18 Class I
VCCIO = 1.8 V
1.484
0.398
V
B2
Bidirectional
LVCMOS
VCCIO = 3.3 V
VCCIO – 0.2
0.2
V
(1)
0.844
1.094
0.8
1.7
–0.3
3.6
V
Cross reference to I/O assignments
6.6 Video Input Pixel Interface Timing Requirements
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
80
MHz
ƒpclock
Clock frequency, PORTx_CLK
tp_wh
Pulse duration, high
45% to 55% reference points (signal)
5.6
ns
tp_wl
Pulse duration, low
45% to 55% reference points (signal)
5.6
ns
tp_su
Setup time, PORTx_D(23–0) valid before PORTx_CLK
See
(1)
1.5
ns
tp_h
Hold time, PORTx_D(23–0) valid after PORTx_CLK
See
(1)
1.5
ns
tp_su
Setup time, PORTx_VSYNC valid before PORTx_CLK
See
(1)
1.5
ns
tp_h
Hold time, PORTx_VSYNC valid after PORTx_CLK
See
(1)
1.5
ns
tp_su
Setup time, PORTx_HSYNC valid before PORTx_CLK
See
(1)
1.5
ns
tp_h
Hold time, PORTx_HSYNC valid after PORTx_CLK
See
(1)
1.5
ns
1.5
ns
1.5
ns
tp_su
Setup time, PORTx_IVALID valid before PORTx_CLK
See
(1)
tp_h
Hold time, PORTx_IVALID valid after PORTx_CLK
See
(1)
(1)
PCLK may be inverted from that shown in Figure 1. In that case, the same specifications in the table are valid except now referenced to
the falling edge of the clock. If the falling edge of PCLK is used, a USB or SPI command must be sent to tell the DLPC200 to use the
falling edge of PCLK.
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tp_clkper
tp_wl
tp_wh
PORTx_CLK
tp_h
tp_su
PORTx_D(23:0),
PORTx_VSYNC,
PORTx_HSYNC,
PORTx_IVALID
1 Frame
tp_vsw
PORTx_VSYNC
(This diagram assumes the VSYNC
active edge is the Rising edge)
tp_vbp
tp_vfp
PORTx_HSYNC
PORTx_IVALID
1 Line
tp_hsw
PORTx_HSYNC
(This diagram assumes the HSYNC
active edge is the Rising edge)
tp_hbp
tp_hfp
PORTx_IVALID
PORTx_D(23:0)
P0
P1
P2
P3
P
n-2
P
n-1
Pn
PORTx_CLK
Figure 1. Input Port Interface
See Pin Configuration and Functions for the proper connection schema if a video input port will not be used.
22
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6.7 I2C Interface Timing Requirements
MIN
MAX
UNIT
ƒscl
I2C clock frequency
PARAMETER
0
400
kHz
tsch
I2C clock high time
1
ms
tscl
I2C clock low time
1
ms
2
tsp
I C spike time
tsds
I2C serial-data setup time
100
20
ns
tsdh
I2C serial-data hold time
100
ns
2
ticr
I C input rise time
tocf
I2C output fall time
100
tbuf
I2C bus free time between stop and start conditions
tsts
50 pF
30
ns
ns
200
ns
1.3
ms
I2C start or repeat start condition setup
1
ms
tsth
I2C start or repeat start condition hold
1
ms
tsph
I2C stop condition setup
1
tvd
tsch
Valid-data time
SCL low to SDA output valid
Valid-data time of ACK condition
ACK signal from SCL low to SDA (out) low
I2C bus capacitive load
0
ms
1
ms
1
ms
100
pF
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VCC
RL = 1 kW
SDA
DUT
CL = 50 pF
(see Note A)
SDA LOAD CONFIGURATION
Three Bytes for Complete
Device Programming
Stop
Condition
(P)
Start
Address
Address
Condition
Bit 7
Bit 6
(S)
(MSB)
Address
Bit 1
tscl
R/W
Bit 0
(LSB)
ACK
(A)
Data
Bit 7
(MSB)
Data
Bit 0
(LSB)
Stop
Condition
(P)
tsch
0.7 × VCC
SCL
0.3 × VCC
ticr
tPHL
ticf
tbuf
tsts
tPLH
tsp
0.7 × VCC
SDA
0.3 × VCC
ticf
ticr
tsth
tsdh
tsds
tsps
Repeat
Start
Condition
Start or
Repeat
Start
Condition
Stop
Condition
VOLTAGE WAVEFORMS
BYTE
DESCRIPTION
1
I2C address
2, 3
P-port data
Figure 2. I2C Interface Load Circuit and Voltage Waveforms
24
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6.8 USB Read Interface Timing Requirements
PARAMETER
tCL
1 / CLKOUT frequency
tAV
Delay from clock to valid address
tSTBL
MIN
TYP
MAX
20.8
UNIT
ns
10.7
ns
Clock to USB_RDY0 LOW
11
ns
tSTBH
Clock to USB_RDY0 HIGH
11
ns
tSCSL
Clock to USB_PA02 LOW
13
ns
tDSU
Data setup to clock
tDH
Data hold time
tACC1
Valid USB_PA04 to valid USB_FDC
9.6
ns
0
ns
43
ns
tCL
USB_CLK
tAV
USB_PA04
tSTBH
tSTBL
USB_RDY0
tSCSL
USB_PA02
tACC1
USB_FDC[15..0]
tDSU
tDH
Data_In
Figure 3. USB Read Timing
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6.9 USB Write Interface Timing Requirements
MIN
MAX
UNIT
tAV
Delay from clock to valid address
PARAMETER
0
10.7
ns
tSTBL
Clock to USB_RDY1 pulse LOW
0
11.2
ns
tSTBH
Clock to USB_RDY1 pulse HIGH
0
11.2
ns
tSCSL
Clock to USB_PA02 pulse LOW
13
ns
tON1
Clock to data turn on
0
13.1
ns
tOFF1
Clock to data hold time
0
13.1
ns
tCL
USB_CLK
tAV
USB_PA04
tSTBL
tSTBH
USB_RDY1
tSCSL
USB_PA02
tOFF1
tON1
USB_FDC[15..0]
Data_In
Figure 4. USB Write Timing
See Pin Configuration and Functions for the proper connection schema if the USB interface will not be used.
26
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6.10 SPI Slave Interface Timing Requirements
PARAMETER
ƒclock
Clock frequency, SLAVE_SPI_CLK
tp_clkper
Clock period, SLAVE_SPI_CLK
tp_wh
MIN
MAX
UNIT
5
MHz
200
ns
Pulse duration high, SLAVE_SPI_CLK
10
ns
tp_wl
Pulse duration low, SLAVE_SPI_CLK
10
ns
tc_su
Setup time, SLAVE_SPI_CS
6
ns
tc_h
Hold time, SLAVE_SPI_CS
3
ns
ti_su
Setup time, SLAVE_SPI_MOSI
10
ns
ti_h
Hold time, SLAVE_SPI_MOSI
10
ns
to_su
Setup time, SLAVE_SPI_MISO
10
ns
to_h
Hold time, SLAVE_SPI_MISO
10
ns
ta_su
Setup time, SLAVE_SPI_ACK
7
ns
ta_h
Hold time, SLAVE_SPI_ACK
7
ns
SLAVE_SPI_CS
tp_clkper
...
SLAVE_SPI_CLK
xxx
x
x
xxxxx
tp_wh
Word n: bit-1
SLAVE_SPI_MOSI
SLAVE_SPI_MISO
tp_wl
Does Not Tristate
ti_su
Word n: bit-2
to_su
Word n: bit-1
ti_h
Word n: bit-8
...
Word n: bit-8
to_h
Word n: bit-2
xxxx
xxxx
...
Does Not Tristate
ta_su
SLAVE_SPI_ACK
ta_h
Figure 5. SPI Timing
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6.11 Parallel Flash Interface Timing Requirements
MAX
UNIT
tAVAV
Read cycle time
PARAMETER
MIN
110
ns
tAVQV
Address to output valid
110
ns
tELQV
CE low to output valid
110
ns
tGLQV
OE low to output valid
tPHQV
RST high to output valid
tGLTV
OE low to WAIT valid
tPHWL
RST high recovery to WE low
tELWL
CE setup to WE low
tWLWH
25
ns
150
ns
17
ns
150
ns
0
ns
WE write pulse width low
50
ns
tDVWH
Data setup to WE high
50
ns
tAVWH
Address setup to WE high
50
ns
tWHEH
CE hold from WE high
0
ns
tPWDHX
Data hold from WE high
0
ns
tWHAX
Address hold from WE high
0
ns
tAVQV
tAVAV
Address
ADV
tELQV
CE
tGLQV
OE
tGLTV
WAIT
Data
tPHQV
RST
Figure 6. Parallel Flash Read Timing
28
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tAVWH
tWHAX
Address
tELWL
tWHEH
CE
tWLWH
WE
OE
tDVWH
tPWDHX
Data
tPHWL
RST
Figure 7. Parallel Flash Write Timing
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6.12 Serial Flash Interface Timing Requirements
The DLPC200 controller flash memory interface consists of a SPI flash serial interface at 33.3 MHz (nominal).
PARAMETER
MIN
dc
MAX
UNIT
33
MHz
ƒclock
Clock frequency, CFG_CLK
tp_clkper
Clock period, CFG_CLK
tp_wh
Pulse duration low, CFG_CLK
6
ns
tp_wl
Pulse duration high, CFG_CLK
6
ns
tp_su
Setup time – CFG_ASDI/CFG_ASDO valid before CFG_CLK rising edge
2
ns
tp_h
Hold time – CFG_ASDI/CFG_ASDO valid after CFG_CLK rising edge
5
ns
30.03
ns
tp_clkper
tp_wl
tp_wh
CFG_CLK
tp_h
tp_su
CFG_DATA
Figure 8. Flash Memory Interface Timing
30
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6.13 Static RAM Interface Timing Requirements
The DLPC200 controller static RAM (SRAM) interface consists of a high performance CMOS SRAM organized as 128K
words by 16 bits (2 Mb).
PARAMETER
tRC
Read cycle time
tAA
Address to data valid
tOHA
Data hold from address change
tWC
Write cycle time
tSCE
MIN
MAX
UNIT
10
ns
10
ns
3
ns
10
ns
CE low to write end
7
ns
tAW
Address setup to write end
7
ns
tHA
Address hold from write end
0
ns
tSA
Address setup to write start
0
ns
tPWE
WE pulse duration
7
ns
tSD
Data setup to write end
5
ns
tHD
Data hold from write end
0
ns
6.14 DMD Interface Timing Requirements
The DLPC200-DMD interface consists of a 200 MHz (nominal) DDR output-only interface with LVDS signaling.
PARAMETER
MIN
TYP
MAX
200
UNIT
ƒclock
Clock frequency, DCLK_A and DCLK_B
tp_clkper
Clock period, DCLK_A and DCLK_B
MHz
tp_wh
tp_wl
tskew
Channel B relative to channel A
tp_su
Output setup time – D_A(0:15) and D_B(0:15) relative to both rising and falling
edges of DCLK_A and DCLK_B, respectively
0.35
ns
tp_h
Output hold time – D_A(0:15) and D_B(0:15) relative to both rising and falling
edges of DCLK_A and DCLK_B, respectively
0.35
ns
5
ns
Pulse duration low, DCLK_A and DCLK_B
1.25
ns
Pulse duration high, DCLK_A and DCLK_B
1.25
–1.25
ns
1.25
ns
tp_clkper
DMD_DAT(14:0)
DMD_SCTRL
tp_su
tp_h
DMD_CLK
tp_wl
tp_wh
Figure 9. DMD I/F Timing
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6.15 DLPA200 Interface Timing Requirements
The DLPC200 interface to the DLPA200 consists of a 125 kHz (nominal) serial communications port (SCP).
PARAMETER
MIN
TYP
MAX
UNIT
125
125
kHz
ƒclock
Clock frequency
tp_clkper
Clock period
8
us
tp_wh
Pulse duration low
4
us
tp_wl
Pulse duration high
4
us
tp_su
SCPDI setup time
7.3
ns
tp_h
SCPDI hold time
5.7
ns
tp_clkper
tp_wl
tp_wh
SCP_DMD_RST_CLK
tp_h
tp_su
SCP_DMD_RST_DATA
Figure 10. DLPA200 I/F Timing
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6.16 DDR2 SDR Memory Interface Timing Requirements
PARAMETER
MIN
MAX
5
8
ns
CK high pulse duration (1)
2.4
4.16
ns
tCL
CK low pulse duration (1)
2.4
4.16
ns
tCMS
Command setup
200
ps
tCMH
Command hold
275
ps
tAS
Address setup
400
ps
tAH
Address hold
400
ps
tDS
Write data setup
1.5
ns
tDH
Write data hold
1.5
ns
tAC
Read data access time
tOH
Read data hold time
tLZ
Read data low-impedance time
tHZ
Read data high-impedance time
tCYCLE
Cycle time reference
tCH
(1)
–450
–900
UNIT
450
ps
340
ps
450
ps
450
ps
Output setup/hold numbers already account for controller clock jitter. Only routing skew and memory setup/hold need be considered in
system timing analysis.
tCYCLE
MEM_CLK
tCH
tCL
tAS
tAH
MEM_A(15:0)
MEM_BA(2:0)
MEM_DMx
MEM_RAS
MEM_CAS
MEM_WE
MEM_CS
MEM_CKE
tCMS
tCMH
tDS
tDH
MEM_D(63:0)
Figure 11. SDR Memory I/F Write Timing
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tCYCLE
MEM_CLK
tCH
tCL
tAS
tAH
MEM_A(15:0)
MEM_BA(2:0)
MEM_DMx
MEM_RAS
MEM_CAS
MEM_WE
MEM_CS
MEM_CKE
tCMS
tCMH
tAC
tOH
Valid Data
MEM_DQ(63:0)
tLZ
tHZ
Figure 12. SDR Memory I/F Read Timing
6.17 Video Input Pixel Interface – Image Sync and Blanking Requirements
Figure 13 shows how pixels should be mapped to the input data bus for both port 1 and port 2.
PARAMETER
tp_vsw
Vertical sync duration
tp_vbp
MIN
MAX
UNIT
1
clocks
Vertical back porch
14
lines
tp_vfp
Vertical front porch
2
lines
tp_hsw
Horizontal sync duration
1
clocks
tp_hbp
Horizontal back porch
64
clocks
tp_hfp
Horizontal front porch
75
clocks
24-Bit Input Bus, RGB888
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
PORTx_D(23:0) of the Input Pixel Data Bus
Default Bus Assignment Mapping
R7
R6
R5
R4
R3
R2
R1
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
B6
B5
B4
B3
B2
B1
B0
RGB888 Format
Figure 13. Pixel Mapping
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7 Detailed Description
7.1 Overview
In DLP-based solutions, image data is 100% digital from the DLPC200 inputs to the image on the DMD. Patterns
stay in digital form and are not converted into an analog signal. The DLPC200 controller processes the digital
input and converts the data into a format needed by the DMD. The DMD steers light by using binary pulseduration modulation (PWM) for each micromirror. For further details, refer to DMD data sheet (DLPS013 for the
DLP5500 DMD).
The DLPC200 only accepts 1024 × 768 (XGA) formatted data for both video and structured light modes. The
functionality of this controller is well-suited for techniques such as structured light, additive manufacturing, or
digital exposure.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Frame Rates
The digital input interface levels for image data are nominally 1.8 or 3.3 V. Port 1 input is 3.3 V and port 2 input is
1.8 V.
DLPR200F firmware is provided by TI to support the operation of video and structured light mode.
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Feature Description (continued)
Table 1. Frame Rates
MODE
Structured light
MIN
MAX
1 bit per pixel
6
5000
8 bits per pixel
6
700
6
60
Video
UNIT
Hz
Hz
7.4 Device Functional Modes
The DLPC200 has two basic functional mode types: video and structured light.
7.4.1 Video Modes
The controller accepts RGB-8-8-8 input to port 1 or port 2 through a selectable MUX. XGA video information is
displayed on the DMD at 6 to 60 fps.
An internal pattern generator can generate RGB-8-8-8 video patterns into an internal selectable MUX for
verification and debug purposes.
7.4.2 Structured Light Modes
The DLPC200 provides two structured light modes: static image buffer and real-time structured light.
7.4.2.1 Static Image Buffer Mode
Image data can be loaded into parallel flash memory to load to DDR2 memory at startup to be displayed, or can
be loaded over USB or the SPI port directly to DDR2 memory to be displayed. Binary (1-bit) or grayscale (8-bit)
patterns can be displayed. The memory will hold 960 binary patterns or 120 grayscale patterns.
7.4.2.2 Real Time Structured Light Mode
RGB-8-8-8 60 fps data can be input into port 1 or port 2 and reinterpreted as up to 24 binary (1-bit) patterns or
three grayscale (8-bit) patterns. The specified number of patterns is displayed equally during the exposure time
specified. Any unused RGB-8-8-8 data in the video frame must be filled with data, usually 0s.
For example, during one video frame (16.67 ms), 12 binary patterns of the 24 RGB bits are requested to be
displayed during half of the video frame time (exposure time = 8.33 ms). Each of the eight red bits and the four
most significant green bits are displayed as a binary pattern for 694 µs each. The remaining bits are ignored and
the remaining 8.33 ms of the frame will be dark.
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8 Application and Implementation
8.1 Application Information
The DLPC200 is used in conjunction with the DLPA200 driver to drive to the DLP5500 (0.55-inch XGA DMD).
This combination can be used for a number of applications from 3D printers to microscopes.
The most common application is for 3D structured light measurement applications. In this application, patterns
(binary, grayscale, or even full color) are projected onto the target and the distortion of the patterns are recorded
by an imaging device to extract 3D (x, y, z) surface information.
8.2 Typical Application
A schematic is shown in Figure 14 for projecting RGB and IR structured light patterns onto a measurement
target. Typically, an imaging device is triggered through one of the three syncs to record the data as each pattern
is displayed.
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Port 1 HSYNC
Port 1 Data Valid
HDMI
Port 1 Clock
I2C Interface
Port 2 DATA( 23:0 )
Port 2 Data Valid
Port 2 Clock
Port 2 SPI Interface
USB Interface
DLPR200USB PROM
Illumination
Optics
GREEN ENABLE
BLUE ENABLE
Projection
Optics
INFRARED ENABLE
LED SPI Interface
LED Lit Status
Micromirror
Resets
DLPA200 Interface
Port 2 Interface
Expansion Port
Connector
Port 2 VSYNC
Port 2 HSYNC
Micromirror Data Interface
Micromirror Control Interface
RED ENABLE
Illumination Interface
Port 1 VSYNC
Port 1 Interface
Port 1 DATA( 23:0 )
DMD Interface
Typical Application (continued)
DLPA200 Control Interface
SYNC OUT 1
User SYNC Interface
SDRAM Interface
DLPR200USB
SYNC OUT 2
SYNC OUT 3
FLASH_SRAM_RST
FLASH_CE
User Flash / SRAM Interface
FLASH_SRAM_WE
FLASH_SRAM_OE
SRAM_CE
SRAM_LB, SRAM_UB
DLPR200F PROM
Configuration Interface
DLPR200F
RESET
Figure 14. Typical RGB + IR Structured Light Application
8.2.1 Design Requirements
All applications using the DLP 0.55-inch XGA chipset require the DLPC200 controller, the DLPA200 driver, and
the DLP5500 DMD for correct operation. The system also requires user supplied SRAM and a configuration
PROM programmed with the DLPR200F program file and a 50-MHz oscillator is for operation.
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Typical Application (continued)
8.2.2 Detailed Design Procedure
8.2.2.1 DLPC200 System Interfaces
The DLPC200 supports the following interfaces: extended display identification data (EDID), USB, SPI, parallel
flash, serial flash, DDR2 SDRAM, and two RGB888 input ports, which are described in the following subsections.
8.2.2.1.1 DLPC200 Master, I2C Interface for EDID Programming
The DLPC200 controller I2C interface is only used to program the HDMI EDID. Upon plugging in an HDMI
source, the DMD resolution is compared to the HDMI output resolution programmed in the HDMI EDID PROM. If
the two resolutions do not match, then the HDMI EDID is adjusted to match the DMD resolution.
The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be
connected to a positive supply through a pullup resistor when connected to the output stages of a device. Data
transfer may be initiated only when the bus is not busy.
I2C communication with this device is initiated by a master sending a Start condition, a high-to-low transition on
the SDA input/output while the SCL input is high. After the Start condition, the device address byte is sent, MSB
first, including the data direction bit (R/W).
After receiving the valid address byte, this device responds with an ACK, a low on the SDA input/output during
the high of the ACK-related clock pulse.
On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain
stable during the high pulse of the clock period, as changes in the data line at this time are interpreted as control
commands (Start or Stop). A Stop condition (a low-to-high transition on the SDA input/output while the SCL input
is high) is sent by the master.
Any number of data bytes can be transferred from the transmitter to the receiver between the Start and Stop
conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before
the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK
clock pulse so that the SDA line is stable low during the high pulse of the ACK-related clock period. Setup and
hold times must be met to ensure proper operation.
Table 2. Recommended EDID PROM Devices
PART NUMBER
MANUFACTURER
24LC02B
Microchip Technology
8.2.2.1.2 USB Interface
The USB interface consists of a single-chip integrated USB 2.0 transceiver, smart SIE, and enhanced 8051
microprocessor running at 48 MHz (nominal) that supports USB 2.0.
8.2.2.1.3 Bus Protocol
USB is a polled bus. The host controller (typically at PC) initiates all data transfers. Each transaction begins
when the PC sends a packet. Communications are always through the bulk transfer mode, and 512 bytes of data
are always written/read at a time. The packet consists of the following:
• Header (6 bytes)
• Data (505 bytes)
• Checksum (1 byte)
The USB device that is addressed selects itself by decoding the appropriate address fields. The direction of data
transfer, either read or write, is specified in the packet header. The source of the transaction then sends a data
packet or indicates it has no data to transfer. At the end of either a single packet transfer or a multi-packet
transfer, the destination responds with a handshake packet indicating whether the transfer was successful.
The packet header consists of:
• CMD1 – Indicates if packet is write/write response or read/read response
• CMD2 – Groups major functions together
• CMD3 – Provides more information about packet grouping defined in CMD2
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•
•
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CMD4 – Used to indicate location of data in a multi-packet transfer
Len_MSB:Len_LSB – Valid number of bytes of data transferred in packet data
Header
CMD1
1 byte
CMD2
1 byte
CMD3
1 byte
CMD4
1 byte
Len_LSB
1 byte
Len_MSB
1 byte
Data
Checksum
0-505 bytes
1 byte
Figure 15. USB Data Packet
As discussed previously, the header describes whether the data transaction is to be a read or write and
designates the data endpoint. The data portion of the packet carries the payload and is followed by a
handshaking mechanism, checksum, that reports if the data was received successfully, or if the endpoint is
stalled or not available to accept data.
Table 3. Recommended USB Devices
PART NUMBER
MANUFACTURER
CY7C68013A
Cypress
24LC128I/SN
Microchip Technology
8.2.2.1.4 SPI Slave Interface
The DLPC200 controller SPI interface consists of a 5-MHz input.
The SPI bus specifies five logic signals.
• SLAVE_SPI_CLK – Serial clock (output from master)
• SLAVE_SPI_MOSI – Master output, slave input (output from master)
• SLAVE_SPI_MISO – Master input, slave output (output from slave, does not tristate)
• SLAVE_SPI_CS – Slave select (active low; output from master)
• SLAVE_SPI_ACK – Holdoff signal to indicate that the slave is processing commands and cannot accept new
input (output from slave)
The master pulls the slave-select low. During each SPI clock cycle, a full-duplex data transmission occurs:
• The master sends a bit on the MOSI line; the slave reads it from that same line.
• The slave sends a bit on the MISO line; the master reads it from that same line.
Transmissions involve two shift registers, one in the master and one in the slave; they are connected in a ring.
Data is shifted out with the most significant bit first, while shifting a new least significant bit into the same
register.
After that register has been shifted out, the master and slave have exchanged register values. If there is more
data to exchange, the shift registers are loaded with new data and the process repeats. Transmissions may
involve any number of clock cycles.
When there is no more data to be transmitted, the master stops toggling its clock. Transmissions consist of
packet commands/responses similar to the protocol defined for the USB interface. The SPI slave supports
variable-length command and response packets, and a master can initiate multiple such transmissions as
needed.
NOTE
The SLAVE_SPI_MOSI signal dose not tristate. To use the controller's slave SPI interface
in a multi-slave SPI bus an external tristate buffer, like SN74LVC1G125, must be used on
the SLAVE_SPI_MOSI signal.
8.2.2.1.5 Parallel Flash Memory Interface
The controller parallel flash memory interface supports a high-speed NOR device with a 16-bit data bus and up
to 1 GB of memory.
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To perform an asynchronous read, an address is driven onto the address bus, and CE is asserted. WE and RST
must already have been deasserted. WAIT is configured to be active low and is set to a deasserted state. ADV
must be held low throughout the read cycle. CLK is not used for asynchronous reads and is ignored. After OE is
asserted, the data is driven onto DQ[15:0] after an initial access time tAVQV or tGLQV delay.
The WAIT signal indicates data valid when the device is operating in asynchronous mode (RCR.15 = 0). The
WAIT signal is only deasserted when data is valid on the bus. When the device is operating in asynchronous
non-array read mode, such as read status, read ID, or read query, the WAIT signal is also deasserted when data
is valid on the bus. WAIT behavior during asynchronous non-array reads at the end of the word line works
correctly only on the first data access.
To perform a write operation, both CE and WE are asserted while RST and OE are deasserted. During a write
operation, address and data are latched on the rising edge of WE or CE, whichever occurs first. When the device
is operating in write operations, WAIT is set to a deasserted state as determined by RCR.10.
Table 4. Recommended Parallel Flash Devices
PART NUMBER
JS28F00AP30BF
STATUS
MANUFACTURER
SIZE
End of Life
Micron
(formerly Numonyx)
1 Gb
8.2.2.1.6 Serial Flash Memory Interface
Table 5 shows the serial flash parts that have been tested by TI and found to work properly with the DLPC200.
NOTE
The 64 Mb devices originally tested to work with the DLPC200 are now obsolete.
Active devices currently available are only 128 Mb and require a firmware build targeting a
128 Mb part or they will not configure and run the DLPC200.
Devices tested to work with the DLPC200 are listed in Table 5.
Programming file builds for the latest firmware version targeting 64 Mb parts (for backward
compatibility with older serial flash devices) and 128 Mb parts (for currently active serial
flash devices) are provided on ti.com under DLPC200 Configuration and Support
Firmware.
Table 5. Recommended Serial Flash Devices
PART NUMBER
STATUS
MANUFACTURER
SIZE
M25P64
Obsolete
Micron
(formerly Numonyx)
64 Mb
W25X64
Obsolete
Winbond
64 Mb
MT25QL128AB
Active
Micron
128 Mb
MX25L12835F
[Requires firmware rev 2.3.1 or greater]
Active
Macronix
128 Mb
8.2.2.1.7 SRAM Interface
Table 6 shows the Static RAM devices that were tested by TI and found to work properly with the DLPC200. See
the recommended SRAM data sheet for read and write cycle timing information.
Table 6. Recommended Static RAM Devices
PART NUMBER
STATUS
MANUFACTURER
SIZE
CY7C1011DV33
Active
Cypress
2 Mb
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8.2.2.1.8 DDR2 SDR Memory Interface
The DDR2 SDRAM is a high-speed CMOS, static dynamic random-access memory. It is internally configured as
a multibank DRAM. The controller DDR-2 memory interface consists of four 32-Mb by 16-bit wide, DDR2
interfaces with double-data-rate signaling, operating at 133.33 MHz (nominal). A bidirectional data strobe (DQS,
DQS) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe
transmitted by the DDR2 SDRAM during READ commands and by the memory controller during WRITE
commands. DQS is edge-aligned with data for READ commands and center-aligned with data for WRITE
commands.
The DDR2 SDRAM operates from a differential clock (CK and CK); the crossing of CK going high and CK going
low is referred to as the positive edge of CK. Commands (address and control signals) are registered at every
positive edge of CK. Input data is registered on both edges of DQS, and output data is referenced to both edges
of DQS as well as to both edges of CK. Read and write accesses to the DDR2 SDRAM are burst-oriented;
accesses start at a selected location and continue for a programmed number of locations in a programmed
sequence.
Accesses begin with the registration of an ACTIVATE command, which is then followed by a READ or WRITE
command. The address bits registered coincident with the ACTIVATE command are used to select the bank and
row to be accessed. The address bits registered coincident with the READ or WRITE command are used to
select the bank and the starting column location for the burst access.
8.2.2.1.9 Projector Image and Control Port Signals
The DLPC200 provides two input ports for graphics and motion video inputs. The following listed signals support
the two input interface modes.
Following are the two input image interface modes, signal descriptions, and pins needed on the DLPC200.
•
•
PORT 1, 28 pins (HDMI connector)
– PORT1_D(23-0) – Projector data
– PORT1_VSYNC – Vertical sync
– PORT1_HSYNC – Horizontal sync
– PORT1_IVALID – Data enable
– PORT1_CLK – Projector clock (rising edge or falling edge, to capture input data)
PORT 2, 28 pins (expansion connector)
– PORT2_D(23-0) – Projector data
– PORT2_VSYNC – Vertical sync
– PORT2_HSYNC – Horizontal sync
– PORT2_IVALID – Data enable
– PORT2_CLK – Projector clock (rising edge or falling edge, to capture input data)
Two control interfaces, USB and SPI, are provided to configure the DLPC200, as well as to transmit pattern data
to memory for structured light mode. Following are the pins needed for the SPI and USB control interfaces.
•
•
42
USB, 48 MHz
– USB_CLK – USB clock
– USB_CTRL1 – FIFO full flag
– USB_CTRL2 – FIFO empty flag
– USB_FD(15–0) – USB data
– USB_PA02 – FIFO output enable for reads
– USB_PA04 – FIFO address bit
– USB_PA05 – FIFO address bit
– USB_RDY1 – Write enable
– USB_RDY0 – Read enable
SPI, 5 MHz
– SLAVE_SPI_CLK – SPI clock
– SLAVE_SPI_ACK – Busy signal that holds off additional transactions until the slave has completed
processing data
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– SLAVE_SPI_MISO – Output from slave
– SLAVE_SPI_MOSI – Output from master
– SLAVE_SPI_CS – Slave select
Images are displayed via control of the DMD and DLPA200. The DLPC200 DMD interface consists of a 200-MHz
(nominal) half-bus DDR output-only interface with LVDS signaling. The serial communications port (SCP), 125kHz nominal, is used to read or write control data to both the DMD and the DLPA200. The following listed signals
support data transfer to the DMD and DLPA200.
•
•
DMD, 200 MHz
– DMD_CLK_AP, DMD_CLK_AN – DMD clock for A
– DMD_CLK_BP, DMD_CLK_BN – DMD clock for B
– DMD_DAT_AP, DMD_DAT_AN(1, 3, 5, 7, 9, 11, 13, 15) – Data bus A (odd-numbered pins are used for
half-bus)
– DMD_DAT_BP, DMD_DAT_BN(1, 3, 5, 7, 9, 11, 13, 15) – Data bus B (odd-numbered pins are used for
half-bus)
– DMD_SCRTL_AP, DMD_SCRTL_AN – S-control for A
– DMD_SCRTL_BP, DMD_SCRTL_BN – S-control for B
DLPA200, 125 kHz
– SCP_DMD_RST_CLK – SCP clock
– SCP_DMD_EN – Enable DMD communication
– SCP_RST_EN – Enable DLPA200 communication
– SCP_DMD_RST_DI – Input data
– SCP_DMD_RST_DO – Output data
8.2.2.1.10 SDRAM Memory
The DLPC200 requires an external DDR2 SDRAM. The DLPC200 supports the use of four 512-Mb SDRAMs.
The requirements for the SDRAMs are:
• SDRAM type: DDR2
• Speed: 133 MHz minimum
• 16-bit interface size: 32 Mb
• Supply voltage: 1.8 V
Table 7 lists the recommended SDRAM devices that have been tested by TI and found to work properly with the
DLPC200.
Table 7. Recommended SDRAM Devices
PART NUMBER
STATUS
MANUFACTURER
SIZE
MT47H32M16R
Obsolete
Micron
512 Mb
MT47H32M16-25E
Active
Micron
512 Mb
8.2.3 Application Curve
The DLPC200 is used to control the DLP5500 0.5-inch XGA DMD. This device can be used for numerous
applications in the visible range of the spectrum such as 3D printing or structured light. Figure 16 shows singlepass window transmission for 0° and 30° angles of incidence. The area from 420 to 700 nm (light blue) is the
range specified for operation of the DLP5500.
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Figure 16. Window Transmission Curve for the DLP5500
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9 Power Supply Recommendations
9.1 Power-Up Requirements
Details about the chip power-up requirements are included in the DLPZ004 chipset data sheet. For the
DLPC200, there is a 50-MHz reference clock that must meet the specifications listed in Table 8. Additionally, at
power-up, the 3.3-V supply must be stable for 2 s before the global reset (RESET) occurs, and then
PWR_GOOD occurs within 20 ms.
The latest revision of the firmware (#DLPR200) does not enable the LEDs over the LED Control interface until
initialization is complete and any solution loaded in flash is running.
Table 8. Reference Clock Oscillator Requirements
PART NUMBER
FREQUENCY STABILITY
FREQUENCY
SUPPLY VOLTAGE
ASV-50.000MHZ-E-J-T
±20 ppm (0.002% or ±0.001 MHz)
50 MHz
3.3 V
9.2 Power-Down Requirements
Details about the chip power-down requirements are included in the DLPZ004 chipset data sheet. For the
DLPC200, there is a minimum 1-ms delay from the time when PWR_GOOD goes low until any of the supplied
voltages can drop below their minimum valid values (see Table 9). This is required so that the DMD can be
parked. See Table 9 for more details.
VCC_min
VCC
> 1 ms
PWR_GOOD
Figure 17.
Table 9. Supply Voltages and Minimum Values
VCC
VCC_min
1.2
1.14
1.8
1.71
2.5
2.375
3.3
3.135
UNIT
V
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10 Layout
10.1 Layout Guidelines
10.1.1 Impedance Requirements
Signals should be routed to have a matched impedance of 50 Ω ±10% except for LVDS differential pairs
(DMD_DAT_Xnn, DMD_DCKL_Xn, and DMD_SCTRL_Xn) and DDR2 differential clock pairs (MEM_CLK_nn),
which should be matched to 100 Ω ±10% across each pair.
10.1.2 PCB Signal Routing
When designing a PCB board for the DLPC200 the following are recommended:
Maintain signal trace corners no sharper than 45°. Adjacent signal layers should have the predominate traces
routed orthogonal to each other. TI recommends that critical signals be hand routed in the following order: DDR2
Memory, DMD (LVDS signals), then DLPA200 signals.
TI does not recommend signal routing on power or ground planes.
TI does not recommend ground plane slots.
Do not allow high speed signal traces to cross over slots in adjacent power and/or ground planes.
Table 10. Important Signal Trace Constraints
Signal
Constraints
P-to-N length <12 mils (0.31 mm)
Trace width: 30 mil (0.76 mm)
DDR2 differential clock pairs
Length within ±150 mils (3.81 mm) relative to DDR2 differential clock
Maximum termination signal recommended trace length <0.5 inch (12.7 mm)
DDR2 data
P-to-N data, clock, and SCTRL: <10 mils (0.25 mm); Pair-to-pair <10 mils (0.25 mm); Bundle-to-bundle
<2000 mils (50 mm, for example DMD_DAT_Ann to DMD_DAT_Bnn)
Trace width: 4 mil (0.1 mm)
Trace spacing: In ball field – 4 mil (0.11 mm); PCB etch – 14 mil (0.36 mm)
Maximum recommended trace length <6 inches (150 mm)
LVDS (DMD_DAT_xnn,
DMD_DCKL_xn, and
DMD_SCTRL_xn)
Table 11. Power Trace Widths and Spacing
Signal Name
Minimum Trace
Width
Minimum Trace
Spacing
GND
Maximize
5 mil (0.13 mm)
Maximize trace width to connecting pin as a minimum
P3P3V
400 mil (10.2 mm)
10 mil (0.25 mm)
Create mini plane and connect to devices as necessary with multiple
vias
P5V, P2P5V, P1P8V,
P1P5V, P1P2V
50 mil (1.3 mm)
10 mil (0.25 mm)
Create mini planes and connect to devices as necessary with
multiple vias
P5V, P3P3V, P2P5V,
P1P8V, P1P5V, P1P2V
30 mil (0.76 mm)
10 mil (0.25 mm)
Stub width to connecting IC pins; maximize width when possible
VREF_Bn
200 mil (5.1 mm)
30 mil (0.76 mm)
Stub width to connecting IC pins; maximize width when possible
Layout Requirements
10.1.3 Fiducials
For automatic component insertion fiducials, use 0.05-inch copper with a 0.1-inch cutout (antipad). Fiducials for
optical auto insertion are placed on three corners of both sides of the PCB.
10.2 Layout Example
For LVDS (and other differential signal) pairs and groups, it is important to match trace lengths. In the area of the
dashed lines, Figure 18 shows correct matching of signal pair lengths with serpentine sections to maintain the
correct impedance.
46
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Layout Example (continued)
Figure 18. Mitering LVDS Traces to Match Lengths
10.3 Thermal Considerations
The underlying thermal limitation for the DLPC200 is that the maximum operating junction temperature (TJ) not
be exceeded (see Recommended Operating Conditions). This temperature depends on operating ambient
temperature, airflow, PCB design (including the component layout density and the amount of copper used),
power dissipation of the DLPC200, and power dissipation of surrounding components. The DLPC200 package is
designed primarily to extract heat through the power and ground planes of the PCB; thus, copper content and
airflow over the PCB are important factors.
10.3.1 Heat Sink
A heat sink not required for operation between 0°C and 55°C ambient, but is required for operation between
55°C and 85°C, TI recommends a low-profile (15-mm) heat sink. See Thermal Information for thermal resistance
with different airflow values without a heat sink.
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DLPC200
DLPS014F – APRIL 2010 – REVISED MAY 2018
www.ti.com
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Device Marking
Device marking should be as shown in the following.
Marking key:
Line 1: TI reference number
Line 2: Device name
Line 3: DLP® logo
Line 4: Date code
Line 5: Country of origin
Line 6: Assembly lot number
Line 7: Trace code
11.2 Documentation Support
Related documents:
• DLP5500 0.55 XGA DMD data sheet
• DLPA200 DMD micromirror driver
• DLPC200 API Reference Manual
• DLPC200 API Programmer's Guide
• IC Package Thermal Metrics application report
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
48
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DLPC200
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11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
DLP is a registered trademark of Texas Instruments.
11.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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49
PACKAGE OPTION ADDENDUM
www.ti.com
9-Apr-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
DLPC200ZEW
ACTIVE
Package Type Package Pins Package
Drawing
Qty
BGA
ZEW
780
5
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
Call TI
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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