Texas Instruments | DLPC6401 DLP® Data Processor (Rev. C) | Datasheet | Texas Instruments DLPC6401 DLP® Data Processor (Rev. C) Datasheet

Texas Instruments DLPC6401 DLP® Data Processor (Rev. C) Datasheet
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DLPC6401
DLPS031C – DECEMBER 2013 – REVISED AUGUST 2015
DLPC6401 DLP® Data Processor
1 Features
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Provides a 30-Bit Input Pixel Interface:
– YUV, YCrCb, or RGB Data Format
– 8, 9, or 10 Bits per Color
– Pixel Clock Support up to 150 MHz
Provides a Single Channel, LVDS Based,
Flat-Panel Display (FPD)-Link Compatible Input
Interface:
– Supports Sources up to a 90-MHz Effective
Pixel Clock Rate
– Four Demodulated Pixel-Mapped Modes
Supported for 8, 9, 10 YUV, YCrCb, or RGB
Formatted Inputs
Supports 45- to 120-Hz Frame Rates
Full Support for Diamond 0.45 WXGA
High-Speed, Double Data Rate (DDR) Digital
Micromirror Device (DMD) Interface
149.33-MHz ARM926™ Microprocessor
Microprocessor Peripherals:
– Programmable Pulse-Width Modulation (PWM)
and Capture Timers
– Two I2C Ports
– Two UART Ports (for Debug Only)
– 32 KB of Internal RAM
– Dedicated LED PWM Generators
Image Processing:
– Auto-Lock for Standard, Wide, and Black
Border
– 1D Keystone Correction
– Programmable Degamma
On-Screen Display (OSD)
Splash Screen Display Support
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Integrated Clock Generation Circuitry
– Operates on a Single 32-MHz Crystal
– Integrated Spread Spectrum Clocking
Integrated 64-Mb Frame Memory Eliminates the
Need for External High-Speed Memory
External Memory Support: Parallel Flash for
Microprocessor and PWM Sequence
System Control:
– DMD Power and Reset Driver Control
– DMD Horizontal and Vertical Image Flip
JTAG Boundary Scan Test Support
419-Pin Plastic Ball Grid Array Package
2 Applications
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Battery Powered Mobile Accessory HD Projector
Battery Powered Smart HD Accessory
Screenless Display - Interactive Display
Mobile Cinema
Gaming Display
3 Description
The DLPC6401 digital controller, part of the DLP4500
(.45 WXGA) chipset, supports reliable operation of
the DLP4500 digital micromirror device (DMD). The
DLPC6401 controller provides a convenient, multifunctional interface between system electronics and
the DMD, enabling small form factor and high
resolution HD displays.
Device Information
PART NUMBER
DLPC6401
PACKAGE
BGA (419)
(1)
ARRAY SIZE (PIXELS)
23.00 mm × 23.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DLPC6401
DLPS031C – DECEMBER 2013 – REVISED AUGUST 2015
www.ti.com
Typical Application Diagram
2
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DLPS031C – DECEMBER 2013 – REVISED AUGUST 2015
Table of Contents
1
2
3
4
5
6
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 3
Pin Configuration and Functions ......................... 4
Specifications....................................................... 12
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
Absolute Maximum Ratings .................................... 12
ESD Ratings............................................................ 12
Recommended Operating Conditions..................... 13
Thermal Information ................................................ 13
Electrical Characteristics......................................... 14
Electrical Characteristics (Normal Mode)................ 15
System Oscillators Timing Requirements ............... 15
Test and Reset Timing Requirements .................... 16
JTAG Interface: I/O Boundary Scan Application
Timing Requirements............................................... 16
6.10 Port 1 Input Pixel Interface Timing Requirements 17
6.11 Port 2 Input Pixel Interface (FPD-Link Compatible
LVDS Input) Timing Requirements .......................... 17
6.12 Synchronous Serial Port (SSP) Interface Timing
Requirements........................................................... 18
6.13 Programmable Output Clocks Switching
Characteristics ......................................................... 18
6.14 Synchronous Serial Port (SSP) Interface Switching
Characteristics ......................................................... 19
6.15 JTAG Interface: I/O Boundary Scan Application
Switching Characteristics......................................... 19
7
Detailed Description ............................................ 23
7.1
7.2
7.3
7.4
8
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
23
23
24
29
Application and Implementation ........................ 30
8.1 Application Information............................................ 30
8.2 Typical Application ................................................. 30
9
Power Supply Recommendations...................... 33
9.1
9.2
9.3
9.4
System Power Regulation ......................................
System Power-Up Sequence ..................................
Power-On Sense (POSENSE) Support ..................
System Environment and Defaults..........................
33
33
34
34
10 Layout................................................................... 36
10.1 Layout Guidelines ................................................. 36
10.2 Layout Example .................................................... 42
10.3 Thermal Considerations ........................................ 43
11 Device and Documentation Support ................. 45
11.1
11.2
11.3
11.4
11.5
Device Support......................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
45
47
47
47
47
12 Mechanical, Packaging, and Orderable
Information ........................................................... 47
12.1 Package Option Addendum .................................. 48
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (June 2015) to Revision C
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Updated the Device Markings graphic.................................................................................................................................. 46
Changes from Revision A (January 2014) to Revision B
Page
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
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Removed V(ESD) values from Electrical Characteristics table .............................................................................................. 14
Changes from Original (December 2013) to Revision A
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Removed product preview banner.......................................................................................................................................... 1
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DLPS031C – DECEMBER 2013 – REVISED AUGUST 2015
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5 Pin Configuration and Functions
ZFF PACKAGE
419-PIN BGA
TOP VIEW
4
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DLPS031C – DECEMBER 2013 – REVISED AUGUST 2015
Pin Functions
PIN (1)
NAME
I/O
NO.
POWER
(2)
TYPE
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
Async
External reset output, LOW true. This output is
asserted low immediately upon asserting power-up
reset (POSENSE) low and remains low while
POSENSE remains low. EXT_ARSTZ continues to
be held low after the release of power-up reset (that
is, POSENSE set high) until released by software.
EXT_ARSTZ is also asserted low approximately 5
µs after the detection of a PWRGOOD or any
internally-generated reset. In all cases, it remains
active for a minimum of 2 ms after the reset
condition is released by software. Note, the ASIC
contains a software register that can be used to
independently drive this output.
Async
Power Good is an active-high signal with hysteresis
that is generated by an external power supply or
voltage monitor. A high value indicates all power is
within operating voltage specifications and the
system is safe to exit its reset state. A transition from
high to low should indicate that the controller or
DMD supply voltage will drop below their rated
minimum level within the next 0.5 ms (POSENSE
must remain active high during this interval). This is
an early warning of an imminent power loss
condition. This warning is required to enhance longterm DMD reliability. A DMD park sequence,
followed by a full controller reset, is performed by the
DLPC6401 when PWRGOOD goes low for a
minimum of 4 µs protecting the DMD. This minimum
de-assertion time is used to protect the input from
glitches. Following this, the DLPC6401 is held in its
reset state as long as PWRGOOD is low.
PWRGOOD must be driven high for typical
operation. The DLPC6401 device acknowledges
PWRGOOD as active after it is driven high for a
minimum of 625 ns. Uses hysteresis.
Async
Power-On Sense is an active-high input signal with
hysteresis that is generated by an external voltage
monitor circuit. POSENSE must be driven inactive
(low) when any of the controller supply voltages are
below minimum operating voltage specifications.
POSENSE must be active (high) when all controller
supply voltages remain above minimum
specifications.
Async
Power On or Power Off is an active-high signal that
indicates the power of the system. Power On or
Power Off is high when the system is in power-up
state, and low when the system is in standby. Power
On or Power Off can also be used to power on or off
an external power supply.
CONTROL
EXT_ARST
PWRGOOD
POSENSE
POWER_ON_OFF
H20
H19
VDD33
VDDC
I4
H
I4
H
G21
N21
O1
VDD33
B2
INIT_DONE
F19
VDD33
B2
Async
Prior to transferring part of code from parallel flash
content to internal memory, the internal memory is
initialized and a memory test is performed. The
result of this test (pass or fail) is recorded in the
system status. If memory test fails, the initialization
process is halted. INIT_DONE is asserted twice to
indicate an error situation. See Figure 12.
I2C_ADDR_SEL
F21
VDD33
B2
Async
This signal is sampled during power-up. If the signal
is low, the I2C addresses are 0x34 and 0x35. If the
signal is low, the I2C are 0x3A and 0x3B.
I2C1_SCL
J3
VDD33
B2
Requires an external pullup to
3.3 V. The minimum
acceptable pullup value is
1 kΩ.
N/A
I2C clock. Bidirectional, open-drain signal. I2C slave
clock input from the external processor. This bus
supports 400 kHz.
I2C1_SDA
J4
VDD33
B2
Requires an external pullup to
3.3 V. The minimum
acceptable pullup value is
1 kΩ.
I2C1_SCL
I2C data. Bidirectional, open-drain signal. I2C slave
to accept command or transfer data to and from the
external processor. This bus supports 400 kHz.
(1)
(2)
For instructions on handling unused pins, see General Handling Guidelines for Unused CMOS-Type Pins.
I/O Type: I = Input, O = Output, B = Bidirectional, and H = Hysteresis. See Table 1 for subscript explanation.
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Pin Functions (continued)
PIN
(1)
NAME
I2C0_SCL
I2C0_SDA
I/O
NO.
M2
POWER
(2)
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
B8
Requires an external pullup to
3.3 V. The minimum
acceptable pullup value is 1
kΩ. This input is not
5-V tolerant.
N/A
I2C bus 0, clock; I2C master for on-board peripherals
such as temperature sensor. This bus supports 400kHz, fast-mode operation.
Requires an external pullup to
3.3 V. The minimum
acceptable pullup value is 1
kΩ. This input is not
5-V tolerant.
I2C0_SCL
I2C bus 0, data; I2C master for on-board peripherals
such as temperature sensor. This bus supports 400kHz, fast-mode operation.
TYPE
VDD33
M3
VDD33
B8
MOSC
A14
VDD33
I10
N/A
System clock oscillator input (3.3-V LVCMOS). Note
that the MOSC must be stable a maximum of 25 ms
after POSENSE transitions from high to low.
MOSCN
A15
VDD33
O10
N/A
MOSC crystal return
SYSTEM CLOCK
PORT 1: PARALLEL VIDEO AND GRAPHICS INPUT (3) (4) (5)
P1A_CLK
W15
VDD33
I4
Includes an internal pulldown
N/A
Port 1 input data pixel write clock 'A'
P1B_CLK
AB17
VDD33
I4
Includes an internal pulldown
N/A
Port 1 input data pixel write clock 'B'
P1C_CLK
Y16
VDD33
I4
Includes an internal pulldown
N/A
Port 1 input data pixel write clock 'C'
Includes an internal pulldown
P1A_CLK
Port 1 vertical sync. Uses hysteresis
P1_VSYNC
Y15
VDD33
B1
H
P1_HSYNC
AB16
VDD33
B1
H
Includes an internal pulldown
P1A_CLK
Port 1 horizontal sync. Uses hysteresis
P1_DATEN
AA16
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 data enable
P1_FIELD
W14
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 field sync. Required for interlaced sources
only (and not progressive)
P1_A_9
AB20
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 128)
P1_A_8
AA19
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 64)
P1_A_7
Y18
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 32)
P1_A_6
W17
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 16)
P1_A_5
AB19
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 8)
P1_A_4
AA18
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 4)
P1_A_3
Y17
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 2)
P1_A_2
AB18
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 1)
P1_A_1
W16
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 0.5)
P1_A_0
AA17
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 A channel input pixel data (bit weight 0.25)
P1_B_9
U21
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 128)
P1_B_8
U20
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 64)
P1_B_7
V22
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 32)
P1_B_6
U19
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 16)
P1_B_5
V21
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 8)
P1_B_4
W22
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 4)
P1_B_3
W21
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 2)
P1_B_2
AA20
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 1)
P1_B_1
Y19
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 0.5)
P1_B_0
W18
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 B channel input pixel data (bit weight 0.25)
P1_C_9
P21
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 128)
P1_C_8
P22
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 64)
(3)
(4)
(5)
6
Port 1 can be used to support multiple source options for a given product (that is, HDMI, BT656). To do so, the data bus from both
source components must be connected to the same port 1 pins and control given to the DLPC6401 to tri-state the inactive source. Tying
them together like this causes some signal degradation due to reflections on the tri-stated path.
The A, B, and C input data channels of port 1 can be internally swapped for optimum board layout.
Sources feeding less than the full 10-bits per color component channel should be MSB justified when connected to the DLPC6401 and
LSBs tied off to 0. For example, an 8-bit per color input should be connected to bits 9:2 of the corresponding A, B, or C input channel.
BT656 are 8 or 10 bits in width. If a BT656-type input is used, the data bits must be MSB justified as with the other types of input
sources on either of the A, B, or C data input channels.
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Pin Functions (continued)
PIN
(1)
I/O
(2)
INTERNAL TERMINATION
CLK SYSTEM
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 32)
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 16)
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 8)
R22
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 4)
P1_C_3
T21
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 2)
P1_C_2
T20
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 1)
P1_C_1
T19
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 0.5)
P1_C_0
U22
VDD33
I4
Includes an internal pulldown
P1A_CLK
Port 1 C channel input pixel data (bit weight 0.25)
NAME
NO.
POWER
TYPE
P1_C_7
R19
VDD33
P1_C_6
R20
VDD33
P1_C_5
R21
P1_C_4
DESCRIPTION
PORT 2: FPD-LINK COMPATIBLE VIDEO AND GRAPHICS INPUT (6)
RCK_IN_P
Y9
VDD33_FPD
I5
Includes weak internal
pulldown
N/A
Positive differential input signal for clock, FPD-Link
receiver
RCK_IN_N
W9
VDD33_FPD
I5
Includes weak internal
pulldown
N/A
Negative differential input signal for clock, FPD-Link
receiver
RA_IN_P
AB10
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Positive differential input signal for data channel A,
FPD-Link receiver
RA_IN_N
AA10
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Negative differential input signal for data channel A,
FPD-Link receiver
RB_IN_P
Y11
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Positive differential input signal for data channel B,
FPD-Link receiver
RB_IN_N
W11
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Negative differential input signal for data channel B,
FPD-Link receiver
RC_IN_P
AB12
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Positive differential input signal for data channel C,
FPD-Link receiver
RC_IN_N
AA12
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Negative differential input signal for data channel C,
FPD-Link receiver
RD_IN_P
Y13
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Positive differential input signal for data channel D,
FPD-Link receiver
RD_IN_N
W13
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Negative differential input signal for data channel D,
FPD-Link receiver
RE_IN_P
AB14
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Positive differential input signal for data channel E,
FPD-Link receiver
RE_IN_N
AA14
VDD33_FPD
I5
Includes weak internal
pulldown
RCK_IN
Negative differential input signal for data channel E,
FPD-Link receiver
(6)
Port 2 is a single-channel FPD-Link compatible input interface. FPD-Link is a defacto industry standard FPD interface, which uses the
high-bandwidth capabilities of LVDS signaling to serialize video and graphics data down to a couple wires to provide a low-wire count
and low-EMI interface. Port 2 supports source rates up to a maximum effective clock of 90 MHz. The port 2 input pixel data must adhere
to one of four supported data mapping formats (see Table 2). Given that port 2 inputs contain weak pulldown resistors, they can be left
floating when not used.
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Pin Functions (continued)
PIN
(1)
NAME
I/O
NO.
(2)
POWER
TYPE
VDD_DMD
O7
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
DMD_DCLK
DMD data pins. DMD data pins are DDR signals that
are clocked on both edges of DMD_DCLK.
All 24 DMD data signals are use to interface to the
DLP4500.
DMD INTERFACE
DMD_D0
A8
DMD_D1
B8
DMD_D2
C8
DMD_D3
D8
DMD_D4
B11
DMD_D5
C11
DMD_D6
D11
DMD_D7
E11
DMD_D8
C7
DMD_D9
B10
DMD_D10
E7
DMD_D11
D10
DMD_D12
A6
DMD_D13
A12
DMD_D14
B12
DMD_D15
C12
DMD_D16
D12
DMD_D17
B7
DMD_D18
A10
DMD_D19
D7
DMD_D20
B6
DMD_D21
E9
DMD_D22
C10
DMD_D23
C6
DMD_DCLK
A9
VDD_DMD
O7
N/A
DMD_LOADB
B9
VDD_DMD
O7
DMD_DCLK
DMD data load signal (active-low)
DMD_SCTRL
C9
VDD_DMD
O7
DMD_DCLK
DMD data serial control signal
DMD_TRC
D9
VDD_DMD
O7
DMD_DCLK
DMD data toggle rate control
DMD_DRC_BUS
D5
VDD_DMD
O7
DMD_SAC_CLK
DMD reset control bus data
DMD_DRC_STRB
C5
VDD_DMD
O7
DMD_SAC_CLK
DMD reset control bus strobe
Requires a 30 to 51-kΩ
external pullup resistor to
VDD_DMD.
DMD_DRC_OE
B5
VDD_DMD
O7
DMD_SAC_BUS
D6
VDD_DMD
O7
DMD_SAC_CLK
DMD stepped-address control bus data
DMD_SAC_CLK
A5
VDD_DMD
O7
N/A
DMD stepped-address control bus clock
DMD_PWR_EN
G20
VDD_DMD
O2
Async
DMD Power Enable control. This signal indicates to
an external regulator that the DMD is powered.
O
Async
DMD drive strength adjustment precision reference.
A ±1% external precision resistor should be
connected to this pin.
EXRES
A3
Async
DMD data clock (DDR)
DMD reset control enable (active low)
FLASH INTERFACE
PM_CS_0
U3
VDD33
O2
Async
Reserved for future use. On the PCB, connect to
VDD33 through a pullup resistor.
PM_CS_1
U2
VDD33
O2
Async
Boot flash (active low). Required for boot memory
PM_CS_2
U1
VDD33
O2
Async
Reserved for future use. On the PCB, connect to
VDD33 through a pullup resistor.
8
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Pin Functions (continued)
PIN
(1)
NAME
I/O
NO.
PM_ADDR_22
V3
PM_ADDR_21
W1
PM_ADDR_20
W2
PM_ADDR_19
Y1
PM_ADDR_18
AB2
PM_ADDR_17
AA3
PM_ADDR_16
Y4
PM_ADDR_15
W5
PM_ADDR_14
AB3
PM_ADDR_13
AA4
PM_ADDR_12
Y5
PM_ADDR_11
W6
PM_ADDR_10
AB4
PM_ADDR_9
AA5
PM_ADDR_8
Y6
PM_ADDR_7
W7
PM_ADDR_6
AB5
PM_ADDR_5
AA6
PM_ADDR_4
Y7
PM_ADDR_3
AB6
PM_ADDR_2
W8
PM_ADDR_1
AA7
PM_ADDR_0
AB7
POWER
(2)
TYPE
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
B2
VDD33
O2
Async
Flash memory address bit
PM_WE
V2
VDD33
O2
Async
Write enable (active low)
PM_OE
U4
VDD33
O2
Async
Output enable (active low)
PM_BLS_1
AA8
VDD33
O2
Async
Upper byte(15:8) enable
PM_BLS_0
AB8
VDD33
O2
Async
Lower byte(7:0) enable
PM_DATA_15
M1
PM_DATA_14
N1
PM_DATA_13
N2
PM_DATA_12
N3
VDD33
B2
Async
Data bits, upper byte
PM_DATA_11
N4
PM_DATA_10
P1
PM_DATA_9
P2
PM_DATA_8
P3
VDD33
B2
Async
Data bits, lower byte
VDD33
O2
Async
PM_DATA_7
P4
PM_DATA_6
R2
PM_DATA_5
R3
PM_DATA_4
R4
PM_DATA_3
T1
PM_DATA_2
T2
PM_DATA_1
T3
PM_DATA_0
T4
LED DRIVER INTERFACE
LEDR_PWM
K2
LEDG_PWM
K3
LEDB_PWM
K4
LEDR_EN
L3
LEDG_EN
L4
LEDB_EN
K1
LED red PWM output enable control
LED green PWM output enable control
LED blue PWM output enable control
LED red PWM output
VDD33
O2
Async
LED green PWM output
LED blue PWM output
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Pin Functions (continued)
PIN
(1)
NAME
I/O
NO.
(2)
POWER
TYPE
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
PERIPHERAL INTERFACE
UART_TXD
L19
VDD33
O2
Async
Transmit data output. Reserved for debug messages
UART_RXD
L21
VDD33
I4
Async
Receive data input. Reserved for debug messages
UART_RTS
M19
VDD33
O2
Async
Ready to send hardware flow control output.
Reserved for debug messages
UART_CTS
L20
VDD33
I4
Async
Clear to send hardware flow control input. Reserved
for debug messages
GENERAL PURPOSE I/O (GPIO)
(7)
GPIO_37
K21
VDD33
B2
Async
None
GPIO_36
G1
VDD33
B2
Async
None
GPIO_35
H4
VDD33
B2
Async
None
GPIO_34
H3
VDD33
B2
Async
None
GPIO_33
H2
VDD33
B2
Async
None
GPIO_32
F22
VDD33
B2
Async
None
GPIO_31
G19
VDD33
B2
Async
None
GPIO_29
F20
VDD33
B2
Async
None
GPIO_28
E22
VDD33
B2
Async
None
GPIO_27
E21
VDD33
B2
Async
None
GPIO_25
D22
VDD33
B2
Async
None
GPIO_24
E20
VDD33
B2
Async
None
GPIO_23
D21
VDD33
B2
Async
None
GPIO_21
N20
VDD33
B2
Async
None
GPIO_20
N19
VDD33
B2
Async
None
GPIO_19
D18
VDD33
B2
Async
None
GPIO_18
C18
VDD33
B2
Async
None
GPIO_15
B19
VDD33
B2
Async
None
GPIO_14
B18
VDD33
B2
Async
None
GPIO_13
L2
VDD33
B2
Async
None
GPIO_12
M4
VDD33
B2
Async
None
GPIO_11
A19
VDD33
B2
Async
None
GPIO_10
C17
VDD33
B2
Async
None
GPIO_06
A18
VDD33
B2
Async
None
GPIO_05
D16
VDD33
B2
Async
None
GPIO_04
C16
VDD33
B2
Async
None
GPIO_03
B16
VDD33
B2
Async
None
GPIO_02
A17
VDD33
B2
Async
None
GPIO_00
C15
VDD33
B2
Async
None
OTHER INTERFACES
FAN_LOCKED
B17
VDD33
B2
Async
Feedback from fan to indicate fan is connected and
running
FAN_PWM
D15
VDD33
B2
Async
Fan PWM speed control
BOARD LEVEL TEST AND DEBUG
TDI
P18
VDD33
I4
Includes internal pullup
TCK
JTAG serial data in (8)
TCK
R18
VDD33
I4
Includes internal pullup
N/A
JTAG serial data clock (8)
TMS1
V15
VDD33
I4
Includes internal pullup
TCK
JTAG test mode select (8)
TDO1
L18
VDD33
O1
TCK
JTAG serial data out (8)
(7)
(8)
10
GPIO signals must be configured by software for input, output, bidirectional, or open-drain. Some GPIOs have one or more alternate use
modes, which are also software configurable. The reset default for all optional GPIOs is as an input signal. However, any alternate
function connected to these GPIO pins with the exception of general-purpose clocks and PWM generation, are reset. An external pullup
to the 3.3-V supply is required for each signal configured as open-drain. External pullup or pulldown resistors may be required to ensure
stable operation before software is able to configure these ports.
All JTAG signals are LVCMOS-compatible.
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Pin Functions (continued)
PIN
(1)
I/O
NAME
NO.
POWER
(2)
TYPE
TRST
V17
VDD33
I4
H
RTCK
G18
VDD33
O2
V6
VDD33
I4
H
ICTSEN
(9)
INTERNAL TERMINATION
CLK SYSTEM
DESCRIPTION
Async
JTAG, RESET (active low). This pin should be pulled
high (or left unconnected) when the JTAG interface
is in use for boundary scan. Connect this pin to
ground otherwise. Failure to tie this pin low during
normal operation causes startup and initialization
problems. (8)
Includes internal pullup
N/A
Includes internal pull down.
External pulldown
recommended for added
protection.
Async
JTAG return clock (9)
IC Tri-State Enable (active high). Asserting high tristates all outputs except the JTAG interface.
For instructions on handling unused pins, see General Handling Guidelines for Unused CMOS-Type Pins.
Functional Pin Descriptions (Reserved Pins)
PIN (1)
I/O
(2)
CLK
SYSTEM
DESCRIPTION
Includes internal pulldown
N/A
Connect directly to ground on the PCB.
I4
Includes an internal pulldown
N/A
VDD33
I4
Includes an internal pullup
N/A
D1, J2
VDD33
I4
RESERVED
F1, F2, G2,
G3, G4
VDD33
O2
RESERVED
F3, J1, M21
VDD33
O2
N/A
RESERVED
H20, M18,
M20
VDD33
O1
N/A
RESERVED
H21, H22,
J19, J20,
J21, J22,
K19, K20
VDD33
B2
RESERVED
C1, D2, F4
VDD33
B2
N/A
RESERVED
E3, E2
VDD33
—
Async
NAME
NO.
POWER
TYPE
RESERVED
V7
VDD33
I4
H
RESERVED
N22, M22,
P19, P20
VDD33
RESERVED
V16
RESERVED
(1)
(2)
INTERNAL TERMINATION
Reserved (1)
N/A
Includes internal pulldown
Includes internal pulldown
N/A
N/A
Leave these pins unconnected (1)
Reserved (1)
Reserved
For instructions on handling unused pins, see General Handling Guidelines for Unused CMOS-Type Pins.
I/O Type: I indicates input, O indicates output, B indicates bidirectional, and H indicates hysteresis. See Table 1 for subscript
explanation.
Table 1. I/O Type Subscript Definition
I/O
SUBSCRIPT
ESD STRUCTURE
DESCRIPTION
1
3.3-V LVCMOS I/O buffer, with 4-mA drive
ESD diode to VDD33 and GND
2
3.3-V LVCMOS I/O buffer, with 8-mA drive
ESD diode to VDD33 and GND
3
3.3-V LVCMOS I/O buffer, with 12-mA drive
ESD diode to VDD33 and GND
4
3.3-V LVCMOS receiver
ESD diode to VDD33 and GND
5
3.3-V LVDS receiver (FPD-Link I/F)
ESD diode to VDD33 and GND
6
None
N/A
7
1.9-V LPDDR output buffer (DMD I/F)
ESD diode to VDD_DMD and GND
8
3.3-V I2C with 12-mA sink
ESD diode to VDD33 and GND
10
OSC 3.3-V I/O compatible LVCMOS
ESD diode to VDD33 and GND
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6 Specifications
6.1 Absolute Maximum Ratings
over recommended operating free-air temperature (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDDC (core 1.2-V power)
–0.5
1.7
VDD33 (CMOS I/O)
–0.5
3.8
VDD_DMD (DMD driver power)
–0.5
2.3
VDD12_FPD (FPD-Link LVDS interface 1.2-V power)
–0.5
1.7
VDD33_FPD (FPD-Link LVDS interface 3.3-V power)
–0.5
3.8
VDD12_PLLD (DDR clock generator – digital)
–0.5
1.7
VDD12_PLLM (master clock generator – digital)
–0.5
1.7
VDD_18_PLLD (DDR clock generator – analog)
–0.5
2.3
VDD_18_PLLM (master clock generator – analog)
–0.5
2.3
OSC (BC1850)
–0.3
3.6
LVCMOS (BT3350)
–0.5
3.6
I2C (BT3350)
–0.5
3.6
LVDS (BT3350)
–0.5
3.6
DMD LPDDR (BC1850)
–0.3
2.0
LVCMOS (BT3350)
–0.5
3.6
I2C (BT3350)
–0.5
3.6
0
115
°C
–40
125
°C
ELECTRICAL
Supply voltage (2)
Input voltage (3)
VI
VO
Output voltage
V
ENVIRONMENTAL
TJ
Operating junction temperature
Tstg
Storage temperature
(1)
(2)
(3)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values are with respect to GND.
Applies to external input and bidirectional buffers.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
12
Electrostatic
discharge
(1)
UNIT
±2000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±500
Machine model (MM)
±150
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
I/O (1)
MIN
NOM
MAX
UNIT
VDD33
3.3-V supply voltage, I/O
3.135
3.3
3.465
V
VDD_DMD
1.9-V supply voltage, I/O
1.8
1.9
2
V
VDD_18_PLLD
1.8-V supply voltage, PLL analog
1.71
1.8
1.89
V
VDD_18_PLLM
1.8-V supply voltage, PLL analog
1.71
1.8
1.89
V
VDD12
1.2-V supply voltage, core logic
1.116
1.2
1.26
V
VDD12_PLLD
1.2-V supply voltage, PLL digital
1.116
1.2
1.26
V
VDD12_PLLM
1.2-V supply voltage, PLL digital
1.116
1.2
1.26
V
VI
Input voltage
OSC (10)
0
VDD33
3.3-V LVCMOS (1, 2, 3, 4)
0
VDD33
3.3-V I2C (8)
0
VDD33
3.3-V LVDS (5)
VO
Output voltage
0.6
2.2
3.3-V LVCMOS (1, 2, 3, 4)
0
VDD33
3.3-V I2C (8)
0
VDD33
1.9-V LPDDR (7)
0
VDD_DMD
V
V
TA
Operating ambient temperature range
See
(2)
0
55
°C
TC
Operating top-center case temperature
See
(3) (4)
0
104
°C
TJ
Operating junction temperature
0
105
°C
(1)
(2)
(3)
(4)
The number inside each parenthesis for the I/O refers to the type defined in the I/O type subscript definition section.
Assumes a minimum 1-m/s airflow along with the JEDEC thermal resistance and associated conditions as listed www.ti.com/packaging.
Thus, this is an approximate value that varies with environment and PCB design.
Maximum thermal values assume maximum power of 3 W.
Assume ψJT equals 0.33 C/W.
6.4 Thermal Information (1)
DLPC6401
THERMAL METRIC
(1)
ZFF (BGA)
UNIT
419 PINS
ψJT
(1)
Junction-to-top characterization parameter
0.33
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics Application
Report, SPRA953.
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6.5 Electrical Characteristics (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
OSC (10)
High-level input
threshold voltage
VIH
VIL
TYP
3.3-V LVCMOS (1, 2, 3, 4)
2
V
OSC (10)
0.8
3.3-V LVCMOS (1, 2, 3, 4)
0.8
Receiver input
impedance
3.3-V LVDS (5)
Vidth
Input differential
threshold
3.3-V LVDS (5)
|Vid|
Absolute input
differential voltage
3.3-V LVDS (5)
VICM
Input common mode
voltage range
Hysteresis (VT+ – VT–)
VOH
High-level output
voltage
VOL
Low-level output
voltage
VDDH = 3.3 V
132
Ω
–200
200
mV
200
600
mV
90
110
3.3-V LVDS (5)
At minimum absolute
input differential voltage
0.7
2.1
3.3-V LVDS (5)
At max absolute input
differential voltage
0.9
1.9
V
3.3-V LVCMOS (1, 2, 3, 4)
400
3.3-V I2C (8)
550
High-level input current
IOH = Max rated
1.9-V DMD LPDDR (7)
IOH = –0.1 mA
2.8
1.9-V DMD LPDDR (7)
IOL = 0.1 mA
3.3-V LVCMOS (1, 2, 3)
IOL = Max rated
0.4
3.3-V I2C (8)
IOL = 3-mA sink
0.4
V
0.9 × VDD_DMD
0.1 × VDD_DMD
IOH
IOL
Low-level input current
High-level output
current
Low-level output
current
VIH = VDD33
10
3.3 V LVCMOS (1 to 4) (with
internal pulldown)
VIH = VDD33
200
3.3 V I2C (8)
VIH = VDD33
µA
10
–10.0
3.3-V LVCMOS (1 to 4) (without
internal pullup)
VOH = VDD33
–10
3.3-V LVCMOS (1 to 4) (with
internal pullup)
VOH = VDD33
–200
3.3-V I2C (8)
VOH = VDD33
1.9-V DMD LPDDR (7)
VO = 1.5 V
–4
3.3-V LVCMOS (1)
VO = 2.4 V
–4
3.3-V LVCMOS (2)
VO = 2.4 V
–8
3.3-V LVCMOS (3)
VO = 2.4 V
–12
1.9-V DMD LPDDR (7)
VO = 0.4 V
4
3.3-V LVCMOS (1)
VO = 0.4 V
4
3.3-V LVCMOS (2)
VO = 0.4 V
8
3.3-V LVCMOS (3)
VO = 0.4 V
12
µA
3.3-V I2C (8)
IOZ
High-impedance
leakage current
CI
Input capacitance
(including package)
14
–10
mA
mA
3
3.3-V LVCMOS (1, 2, 3)
–10
10
3.3-V I2C (8)
–10
10
3.3-V LVCMOS (2)
2.8
3.3
4
3.3-V LVCMOS (4)
2.7
3.4
4.2
3
3.2
3.5
3.3-V I2C (8)
(1)
V
10.0
3.3-V LVCMOS (1 to 4) (without
internal pulldown)
OSC (10)
IIL
mV
3.3-V LVCMOS (1, 2, 3)
OSC (10)
IIH
V
1
3.3-V I C (8)
RI
UNIT
2.4
2
VHYS
MAX
2
3.3-V I2C (8)
Low-level input
threshold voltage
MIN
µA
pF
The number inside each parenthesis for the I/O refers to the type defined in Table 1.
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6.6 Electrical Characteristics (Normal Mode)
over operating free-air temperature range (unless otherwise noted)
TEST CONDITION (1)
PARAMETER
MIN
TYP
MAX (2)
UNIT
ICC12
Supply voltage, 1.2-V core power
Normal mode
600
1020
mA
ICC19_DMD
Supply voltage, 1.9-V I/O power (DMD LPDDR)
Normal mode
30
50
mA
ICC33
Supply voltage, 3.3-V (I/O) power
Normal mode
40
70
mA
ICC12_FPD
FPD-Link LVDS I/F supply voltage, 1.2-V power
Normal mode
60
100
mA
ICC33_FPD
FPD-Link LVDS I/F supply voltage, 3.3-V power
Normal mode
50
85
mA
ICC12_PLLD
Supply voltage, PLL digital power (1.2 V)
Normal mode
9
15
mA
ICC12_PLLM
Supply voltage, master clock generator PLL digital
power (1.2 V)
Normal mode
9
15
mA
ICC18_PLLD
Supply voltage, PLL analog power (1.8 V)
Normal mode
10
16
mA
ICC18_PLLM
Supply voltage, master clock generator PLL analog
power (1.8 V)
Normal mode
10
16
mA
PTOT
Total power
Normal mode
1225
2200
mW
(1)
(2)
Normal mode refers to ASIC operation during full functionality, active product operation. Typical values correspond to power dissipated
on nominal process devices operating at nominal voltage and 70°C junction temperature (approximately 25°C ambient) displaying typical
video-graphics content from a high-frequency source. Maximim values correspond to power dissipated on fast process devices
operating at high voltage and 105°C junction temperature (approximately 55°C ambient) displaying typical video-graphics content from a
high-frequency source. The increased power dissipation observed on fast process devices operated at maximum recommended
temperature is primarily a result of increased leakage current.
Maximum power values are estimates and may not reflect the actual final power consumption of DLPC6401 ASIC.
6.7 System Oscillators Timing Requirements
over operating free-air temperature range (unless otherwise noted)
MIN
ƒclock
Clock frequency, MOSC (1)
(1)
MAX
UNIT
31.9968 32.0032
MHz
tc
Cycle time, MOSC
tw(H)
Pulse duration (2), MOSC, high
50% to 50% reference points (signal)
12.5
ns
tw(L)
Pulse duration (2), MOSC, low
50% to 50% reference points (signal)
12.5
ns
(2)
tt
Transition time
tjp
Period jitter (2), MOSC (that is, the deviation in period from ideal period due solely to high-frequency
jitter – not spread spectrum clocking)
(1)
(2)
, MOSC, tt = tf / tr
31.188
20% to 80% reference points (signal)
–100
31.256
ns
7.5
ns
100
ps
The frequency range for MOSC is 32 MHz with ±100 PPM accuracy. (This includes impact to accuracy due to aging, temperature, and
trim sensitivity.) The MOSC input cannot support spread spectrum clock spreading.
Applies only when driven by an external digital oscillator.
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6.8 Test and Reset Timing Requirements
MIN
tW1(L)
Pulse duration, inactive low, PWRGOOD
50% to 50% reference points (signal)
tt1
Transition time, PWRGOOD, tt1 = tf / tr
20% to 80% reference points (signal)
tW2(L)
Pulse duration, inactive low, POSENSE
50% to 50% reference points (signal)
tt2
Transition time, POSENSE, tt2 = tf / tr
20% to 80% reference points (signal)
tPH
Power hold time, POSENSE remains active after
PWGOOD is deasserted
20% to 80% reference points (signal)
MAX
4
UNIT
µs
625
500
µs
µs
1
500
µs
µs
6.9 JTAG Interface: I/O Boundary Scan Application Timing Requirements
MIN
ƒclock
Clock frequency, TCK
tC
Cycle time, TCK
tW(H)
Pulse duration, high
tW(L)
MAX
UNIT
10
MHz
100
ns
50% to 50% reference points (signal)
40
ns
Pulse duration, low
50% to 50% reference points (signal)
40
ns
tt
Transition time, tt = tf / tr
20% to 80% reference points (signal)
tSU
Setup time, TDI valid before TCK↑
8
ns
th
Hold time, TDI valid after TCK↑
2
ns
tSU
Setup time, TMS1 valid before TCK↑
8
ns
th
Hold time, TMS1 valid after TCK↑
2
ns
16
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6.10 Port 1 Input Pixel Interface Timing Requirements
MIN
MAX
UNIT
12
150
MHz
6.666
83.33
ƒclock
Clock frequency, P1A_CLK, P1B_CLK, P1C_CLK
tc
Cycle time, P1A_CLK, P1B_CLK, P1C_CLK
tw(H)
Pulse duration, high
50% to 50% reference points (signal)
2.3
tw(L)
Pulse duration, low
50% to 50% reference points (signal)
2.3
tjp
Clock period jitter, P1A_CLK, P1B_CLK, P1C_CLK
(that is, the deviation in period from ideal period)
Max ƒclock
tt
Transition time, tt = tf / tr, P1A_CLK, P1B_CLK, P1C_CLK
20% to 80% reference points (signal)
tt
Transition time, tt = tf / tr, P1_A(9-0), P1_B(9-0) , P1_C(90), P1_HSYNC, P1_VSYNC, P1_DATEN
tt
Transition time, tt = tf / tr, ALF_HSYNC, ALF_VSYNC,
ALF_CSYNC (2)
SETUP AND HOLD TIMES
ns
ns
ns
(1)
ps
0.6
2
ns
20% to 80% reference points (signal)
0.6
3
ns
20% to 80% reference points (signal)
0.6
3
ns
See
(3)
tsu
Setup time, P1_A(9-0), valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_A(9-0), valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_B(9-0), valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_B(9-0), valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_C(9-0), valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_C(9-0), valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_VSYNC, valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_VSYNC, valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_HSYNC, valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_HSYNC, valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_FIELD, valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_FIELD, valid after P1x_CLK↑↓
0.8
ns
tsu
Setup time, P1_DATEN, valid before P1x_CLK↑↓
0.8
ns
th
Hold time, P1_DATEN, valid after P1x_CLK↑↓
0.8
ns
(1)
(2)
(3)
Use the following formula to obtain the jitter: Maximum clock jitter = ±[(1 / ƒclock) – 5414 ps].
ALF_CSYNC, ALF_VSYNC and ALF_HSYNC are asynchronous signals.
Setup and hold times should be considered the same regardless of clock used [P1A_CLK, P1B_CLK, P1C_CLK].
6.11 Port 2 Input Pixel Interface (FPD-Link Compatible LVDS Input) Timing
Requirements (1) (2) (3) (4) (5) (6)
MIN
MAX
UNIT
20
90
MHz
Cycle time, P2_CLK (LVDS input clock)
11.1
50
ns
Clock or data slew rate (ƒpxck < 90 MHz)
0.3
Clock or data slew rate (ƒpxck > 90 MHz)
0.5
ƒclock
Clock frequency, P2_CLK (LVDS input clock)
tc
tslew
tstartup
(1)
(2)
(3)
(4)
(5)
(6)
Link start-up time (internal)
V/ns
V/ns
1
ms
Minimize crosstalk and match traces on the PCB as close as possible.
Maintain the common mode voltage as close to 1.2 V as possible.
Maintain the absolute input differential voltage as high as possible.
The LVDS open input detection is related to a low common mode voltage only. It is not related to a low-differential swing.
LVDS power 3.3-V supply (VDD33_FPD) noise level should be below 100 mVPP.
LVDS power 1.2-V supply (VDD12_FPD) noise level should be below 60 mVPP.
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6.12 Synchronous Serial Port (SSP) Interface Timing Requirements
MIN
tsu
Setup time, SSP0_RXD valid before SSP0_ CLK↓
10
th
Hold time, SSP0_RXD valid after SSP0_ CLK↓
10
tt
Transition time (1), SSP0_RXD, tt = tf / tr
tsu
Setup time, SSP1_RXD valid before SSP1_ CLK↓
10
th
Hold time, SSP1_RXD valid after SSP1_ CLK↓
10
tt
Transition time (1), SSP1_RXD, tt = tf / tr
(1)
MAX
UNIT
ns
ns
4
ns
ns
ns
4
ns
20% to 80% reference points (signal)
6.13 Programmable Output Clocks Switching Characteristics
over operating free-air temperature range, CL (min timing) = 5 pF, CL (max timing) = 50 pF (unless otherwise noted) (see
Figure 5)
PARAMETER
ƒclock Clock frequency, OCLKC (1)
(1)
FROM
(INPUT)
TO (OUTPUT)
N/A
OCLKC
MIN
MAX
UNIT
0.7759
48
MHz
1288.8
tc
Cycle time, OCLKC
N/A
OCLKC
20.83
tw(H)
Pulse duration, high 50% to 50% reference points (signal)
N/A
OCLKC
(tc / 2) – 2
ns
tw(L)
Pulse duration, low (2) 50% to 50% reference points (signal)
N/A
OCLKC
(tc / 2) – 2
ns
ƒclock Clock frequency, OCLKD
(1)
N/A
OCLKD
0.7759
48
tc
Cycle time, OCLKD
N/A
OCLKD
20.83
1288.8
tw(H)
Pulse duration, high (2) 50% to 50% reference points (signal)
N/A
OCLKD
(tc / 2) – 2
tw(L)
ns
ns
N/A
OCLKD
(tc / 2) – 2
N/A
OCLKE
0.7759
48
tc
Cycle time, OCLKE
N/A
OCLKE
20.83
1288.8
tw(H)
Pulse duration, high (2) 50% to 50% reference points (signal)
N/A
OCLKE
(tc / 2) – 2
ns
N/A
OCLKE
(tc / 2) – 2
ns
(1)
(2)
18
Pulse duration, low
(2)
50% to 50% reference points (signal)
MHz
ƒclock Clock frequency, OCLKE (1)
tw(L)
Pulse duration, low
(2)
ns
50% to 50% reference points (signal)
ns
MHz
ns
The frequency of OCLKC through OCLKE is programmable.
The duty cycle of OCLKC through OCLKE is within ±2 ns of 50%.
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6.14 Synchronous Serial Port (SSP) Interface Switching Characteristics
over recommended operating conditions, CL (min timing) = 5 pF, CL (max timing) = 35 pF (unless otherwise noted) (see
Figure 10)
PARAMETER
FROM (INPUT)
TO (OUTPUT)
MIN
MAX
UNIT
N/A
SSP0_CLK
0.287
9333
kHz
Cycle time, SSP0_CLK
N/A
SSP0_CLK
0.107
3483
us
Pulse duration, high 50% to 50% reference points
(signal)
N/A
SSP0_CLK
48
ns
tw(L)
Pulse duration, low 50% to 50% reference points
(signal)
N/A
SSP0_CLK
48
ns
tpd
Output propagation, clock to Q, SSP0_TXD
SSP0_CLK↑
SSP0_TXD
ƒclock
Clock frequency, SSP1_CLK
N/A
SSP1_CLK
2.296 74667
tc
Cycle time, SSP1_CLK
N/A
SSP1_CLK
0.013
tw(H)
Pulse duration, high 50% to 50% reference points
(signal)
N/A
SSP1_CLK
5.85
ns
tw(L)
Pulse duration, low 50% to 50% reference points
(signal)
N/A
SSP1_CLK
5.85
ns
tpd
Output propagation, clock to Q, SSP1_TXD
SSP1_CLK↑
SSP1_TXD
–2
ƒclock
Clock frequency, SSP0_CLK
tc
tw(H)
(1)
(2)
(1) (2)
(1) (2)
–5
5
ns
kHz
436
us
2
ns
SSP output timing supports both positive and negative clocking polarity. Figure 10 shows only positive clocking polarity. When the clock
polarity is configured through software to be negative, the data is transferred and captured on the opposite edge of the clock shown.
The maximum rates shown apply to master mode operation only. Slave mode operation is limited to 1/6 of these rates.
6.15
JTAG Interface: I/O Boundary Scan Application Switching Characteristics
Over operating free-air temperature range, CL (min timing) = 5 pF, CL (max timing) = 85 pF (unless otherwise noted)
PARAMETER
tpd
FROM (INPUT)
TO (OUTPUT)
TCK↓
TDO1
Output propagation, clock to Q
MIN
MAX
UNIT
12
ns
tt
tt
tc
tw(H)
TYP
3
tw(L)
MOSC
50%
50%
80%
20%
50%
80%
20%
Figure 1. System Oscillators
Power Up
tt1
80%
50%
20%
PWRGOOD
80%
50%
20%
tt1
80%
50%
20%
tw1(L)
80%
50%
20%
POSENSE
tt2
DC Power Supplies
PWRGOOD has no impact on operation for 60 ms after rising edge of POSENSE.
Figure 2. Power Up
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Power Down
tt1
PWRGOOD
80%
50%
20%
tt2
POSENSE
tt2
80%
50%
20%
80%
50%
20%
tw2(L)
tPH
DC Power Supplies
Figure 3. Power Down
tt
tc
tw(H)
TCK
(input)
tw(L)
50%
50%
tsu
TDI
TMS1
(inputs)
80%
20%
50%
th
Valid
tpd(max)
TDO1
(outputs)
Valid
Figure 4. I/O Boundary Scan
OCLKC
OCLKD
OCLKE
tw(H)
50%
tt
tt
tc
tw(L)
50%
80%
20%
50%
80%
20%
Figure 5. Programmable Output Clocks
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tt
tc
tw(H)
Px_CLK
(input)
50%
tw(L)
50%
tsu
Px_Data and
Px_Control
(inputs)
80%
20%
50%
th
Valid
Figure 6. Input Port 1 Interface
Differential V(D0) - V(D1)
Vid(max)
Vid(min)
0V
-Vid(min)
-Vid(max)
0.3 UI
200ps
200ps
0.3 UI
Teye=0.4 UI
1UI
0
Figure 7. Input Port 2 (LVDS) Interface
Figure 8. (LVDS) Link Start-Up Timing
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Figure 9. (LVDS) Clock – Data Skew Definition
tt
tc
tw(H)
SSP_CLK
(ASIC output)
tw(L)
50%
50%
tsu
SSP_TXD
(ASIC inputs)
80%
20%
50%
th
Valid
tpd(min)
Valid
tpd(max)
SSP_RXD
(ASIC outputs)
Valid
Valid
Figure 10. Synchronous Serial Port Interface
DMD_D(23:0)
DMD_SCTRL
DMD_TRC
DMD_LOADB
tp1_h
tp1_su
DMD_DCLK
tp1_cwl
tp1_cwh
No relationship
DMD_SAC_CLK
tp2_cwl
tp2_cwh
tp2_su
tp2_h
DMD_SAC_BUS
DMD_DAD_OEZ
DMD_DAD_BUS
DMD_DAD_STRB
Figure 11. DMD LPDDR Interface
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7 Detailed Description
7.1 Overview
The DLPC6401 is the display controller for the DLP4500 (.45 WXGA) DMD. DLPC6401 is part of the chipset
comprised of the DLPC6401 controller and DLP4500 (.45 WXGA) DMD. Both the controller and the DMD must
be used in conjunction with each other for reliable operation of the DLP4500 (.45 WXGA) DMD. The DLPC6401
display controller provides interfaces and data- and image-processing functions that are optimized for small form
factor, high-resolution, and high-brightness display applications. Applications include pico projectors, smart
projectors, screenless displays, interactive displays, wearable displays, and digital signage. Standalone
projectors must include a separate front-end chip to interface to the outside world (for example, video decoder,
HDMI receiver, triple ADC, or USB I/F chip).
7.2 Functional Block Diagram
AC
Power
DC
Power Supply
Analog
Front End
Parallel
Port
30-bit Parallel
Port +
10-bit BT656
30
x
30
USB/SD/MMC
(All Multimedia
Formats)
DC
regulators
and LED
Drivers
I2C
VGA
Component
Video
CVBS
I2C
Multimedia
Chip
30-bit LVDS
Input Port
30
Test Pattern
Generator
30
x
x
x
Front End
Processing
Edge-adaptive
Deinterlacer
2D Y/C Decoder
Color Space
Conversion
Brightness
x
x
x
x
x
x
x
Image Processing
Degamma
Primary Color Correction
Chroma Interpolation
Scaler
1D Keystone
On-screen Display
Overlap Color Processing
x
x
Formatter
SpatialTemporal
Multiplexing
Diamond
DMD
Formatting
DMD
I/F
LEDs
DDR,
80 ± 120 MHz
0.45 inch
WXGA
LVDS
Embedded RAM 64Mb
JTAG
Syncs
Input Clock/
Sync generator
JTAG
Peripherals
Autolock
ARM
I2C
UART
SSP
GPIO
UART
SSP
GPIO
(Keypad)
(Fans)
Flash
I/F
Internal Clock Circuit
CLOCK
I2C
EEPROM
Tilt Sensor
(I2C,PWM)
Parallel
Flash
Temp sensor
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7.3 Feature Description
Table 2. (LVDS) Receiver Supported Pixel Mapping Modes (1)
MAPPING SELECTION 1
MAPPING SELECTION 2
MAPPING SELECTION 3
MAPPING SELECTION
4 (2) [18-Bit Mode]
RDA(6)
Map to GRN(4)
Map to GRN(2)
Map to GRN(0)
Map to GRN(4)
RDA(5)
Map to RED(9)
Map to RED(7)
Map to RED(5)
Map to RED(9)
RDA(4)
Map to RED(8)
Map to RED(6)
Map to RED(4)
Map to RED(8)
RDA(3)
Map to RED(7)
Map to RED(5)
Map to RED(3)
Map to RED(7)
RDA(2)
Map to RED(6)
Map to RED(4)
Map to RED(2)
Map to RED(6)
RDA(1)
Map to RED(5)
Map to RED(3)
Map to RED(1)
Map to RED(5)
RDA(0)
Map to RED(4)
Map to RED(2)
Map to RED(0)
Map to RED(4)
RDB(6)
Map to BLU(5)
Map to BLU(3)
Map to BLU(1)
Map to BLU(5)
RDB(5)
Map to BLU(4)
Map to BLU(2)
Map to BLU(0)
Map to BLU(4)
RDB(4)
Map to GRN(9)
Map to GRN(7)
Map to GRN(5)
Map to GRN(9)
RDB(3)
Map to GRN(8)
Map to GRN(6)
Map to GRN(4)
Map to GRN(8)
RDB(2)
Map to GRN(7)
Map to GRN(5)
Map to GRN(3)
Map to GRN(7)
RDB(1)
Map to GRN(6)
Map to GRN(4)
Map to GRN(2)
Map to GRN(6)
RDB(0)
Map to GRN(5)
Map to GRN(3)
Map to GRN(1)
Map to GRN(5)
LVDS RECEIVER INPUT
RA Input Channel
RB Input Channel
RC Input Channel
RDC(6)
Map to DEN
RDC(5)
Map to VSYNC
RDC(4)
Map to HSYNC
RDC(3)
Map to BLU(9)
Map to BLU(7)
Map to BLU(5)
Map to BLU(9)
RDC(2)
Map to BLU(8)
Map to BLU(6)
Map to BLU(4)
Map to BLU(8)
RDC(1)
Map to BLU(7)
Map to BLU(5)
Map to BLU(3)
Map to BLU(7)
RDC(0)
Map to BLU(6)
Map to BLU(4)
Map to BLU(2)
Map to BLU(6)
RDD(5)
Map to BLU(3)
Map to BLU(9)
Map to BLU(7)
No mapping
RDD(4)
Map to BLU(2)
Map to BLU(8)
Map to BLU(6)
No mapping
RDD(3)
Map to GRN(3)
Map to GRN(9)
Map to GRN(7)
No mapping
RDD(2)
Map to GRN(2)
Map to GRN(8)
Map to GRN(6)
No mapping
RDD(1)
Map to RED(3)
Map to RED(9)
Map to RED(7)
No mapping
RDD(0)
Map to RED(2)
Map to RED(8)
Map to RED(6)
No mapping
RD Input Channel
RDD(6)
Map to field (option 1 if applicable)
RE Input Channel
RDE(6)
RDE(5)
(1)
(2)
24
Map to field (option 2 if applicable)
Map to BLU(1)
Map to BLU(9)
No mapping
RDE(4)
Map to BLU(0)
Map to BLU(8)
No mapping
RDE(3)
Map to GRN(1)
Map to GRN(9)
No mapping
RDE(2)
Map to GRN(0)
Map to GRN(8)
No mapping
RDE(1)
Map to RED(1)
Map to RED(9)
No mapping
RDE(0)
Map to RED(0)
Map to RED(8)
No mapping
Mapping options are selected by software.
If mapping option 4 is the only mapping mode needed, and if, and only if, a 'Field 1' or 'Field 2' input is not needed, then the board
layout can leave the LVDS inputs for RD and RE channels floating.
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7.3.1 System Reset Operation
7.3.1.1 Power-Up Reset Operation
Immediately following a power-up event, DLPC6401 hardware automatically brings up the master PLL and
places the ASIC in normal power mode. It then follows the standard system reset procedure (see System Reset
Operation).
7.3.1.2 System Reset Operation
Immediately following any type of system reset (power-up reset, PWRGOOD reset, watchdog timer timeout, and
so on), the DLPC6401 device automatically returns to NORMAL power mode and returns to the following state.
• All GPIO tri-state and as a result, all GPIO-controlled voltage switches default to enabling power to all ASIC
supply lines. (Assume these outputs are externally pulled-high.)
• The master PLL remains active (it is reset only after a power-up reset sequence) and most of the derived
clocks are active. However, only those resets associated with the ARM9 processor and its peripherals are
released. (The ARM9 is responsible for releasing all other resets.)
• ARM9 associated clocks default to their full clock rates. (Boot-up is a full speed.)
• All front-end derived clocks are disabled.
• The PLL feeding the DDR DMD I/F (PLLD) defaults to its power-down mode and all derived clocks are
inactive with corresponding resets asserted. (The ARM9 is responsible for enabling these clocks and
releasing associated resets.)
• DMD I/O (except DMD_DAD_OEZ) defaults to its outputs in a logic low state. DMD_DAD_OEZ defaults tristated, but should be pulled high through an external 30- to 51-kΩ pullup resistor on the PCB.
• All resets output by the DLPC6401 device remain asserted until released by the ARM9 (after boot-up).
• The ARM9 processor boots-up from external flash.
When the ARM9 boots-up, the ARM9 API:
• Configures the programmable DDR clock generator (DCG) clock rates (that is, the DMD LPDDR I/F rate)
• Enables the DCG PLL (PLLD) while holding divider logic in reset
• When the DCG PLL locks, ARM9 software sets DMD clock rates
• API software then releases DCG divider logic resets, which in turn, enable all derived DCG clocks
• Releases external resets
Application software then typically waits for a wake-up command (through the soft power switch on the projector)
from the end user. When the projector is requested to wake-up, the software places the ASIC back in normal
mode, re-initialize clocks, and resets as required.
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RESETZ
(INIT_BUSY)
(ERR IRQ)
INIT_DONE
100 ms (max)
5 ms (max)
0 ms (min)
3 µs (min)
2
I C or DBI-C
(SCL, SDA, CSZ
t1
t2
t3 t4
t5
t6
•
t2: device drives INIT_DONE high within 5 ms after reset is release. Indicates auto-initialization is busy
•
t3: I2C or DBI-C access to DLPC6401 device does not start until the INIT_BUSY flag (on INIT_DONE) goes low.
This can occur within 100 ms, but may take several seconds
•
t5: an active high pulse on INIT_DONE following the initialization period indicates a detected error condition. The
device reports the source of the error in the system status.
Figure 12. Internal Memory Test Diagram
7.3.1.3 Spread Spectrum Clock Generator Support
The DLPC6401 device supports limited, internally-controlled, spread spectrum clock spreading on the DMD
interface. The purpose is to frequency spread all signals on the high-speed, external interfaces to reduce EMI
emissions. Clock spreading is limited to triangular waveforms. The DLPC6401 device provides modulation
options of 0%, ±0.5%, and ±1.0% (center-spread modulation).
7.3.1.4 GPIO Interface
The DLPC6401 device provides 38 software-programmable, general-purpose I/O pins. Each GPIO pin is
individually configurable as either input or output. In addition, each GPIO output can be either configured as
push-pull or open-drain. Some GPIO have one or more alternate-use modes, which are also software
configurable. The reset default for all GPIO is as an input signal. However, any alternate function connected to
these GPIO pins, with the exception of general-purpose clocks and PWM generation, will be reset. When
configured as open-drain, the outputs must be externally pulled-up (to the 3.3-V supply). External pullup or
pulldown resistors may be required to ensure stable operation before software is able to configure these ports.
7.3.1.5 Source Input Blanking
Vertical and horizontal blanking requirements for both input ports are defined as follows (see Video Timing
Parameter Definitions).
• Minimum port 1 vertical blanking:
– Vertical back porch: 370 µs
– Vertical front porch: 2 lines
– Total vertical blanking: 370 µs + 3 lines
• Minimum port 2 vertical blanking:
– Vertical back porch: 370 µs
– Vertical front porch: 0 lines
– Total vertical blanking: 370 µs + 3 lines
• Minimum port 1 and port 2 horizontal blanking:
– Horizontal back porch (HBP): 10 pixels
– Horizontal front porch (HFP): 0 pixels
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– Total horizontal blanking (THB):
– 0.45 WXGA DMD: Roundup (154286 / Source_APPL, 0)
– 0.4 XGA DMD: Roundup (144686 / Source_APPL, 0) pixels
7.3.1.6 Video and Graphics Processing Delay
The DLPC6401 device introduces a fixed number of field and frame delays. For optimum audio and video
synchronization, this delay must be matched in the audio path. Table 3 defines the video delay to support audio
matching.
Frame and fields in Table 3 refer to source frames and fields.
Table 3. Primary Channel and Video-Graphics Processing Delay
SOURCE
2D VIDEO
DECODER
DE-INTERLACING
FORMATTER
BUFFER
TOTAL
DELAY
10 to 47 Hz
Non-interlaced graphics
Disabled
{0 frames}
Disabled
{0 frames}
Enabled
{1 frame}
1 frame
47 to 63 Hz
Non-interlaced graphics
Disabled
{0 frames}
Disabled
{0 frames}
Enabled
{1 frame}
1 frame
63 to 120 Hz
Non-interlaced graphics
Disabled
{0 frames}
Disabled
{0 frames}
Enabled
{1 frame}
1 frame
100 to 120 Hz
Display at native rate graphics
Disabled
{0 frames}
Disabled
{0 frames}
Enabled
{1 frame}
1 frame
50 to 60 Hz interlaced
SDTV video (NTSC, PAL, SECAM)
Enabled
{0 fields}
Edge adaptive de-interlacing enabled
{0 fields}
Enabled
{1 field}
1 field
60 Hz interlaced
HDTV video (480i, 1080i)
Disabled
{0 fields}
Edge adaptive de-interlacing enabled
{0 fields}
Enabled
{1 field}
1 field
24 to 30 Hz interlaced
HDTV video (480i, 1080i)
Disabled
{0 fields}
Edge adaptive de-interlacing enabled
{0 fields}
Enabled
{1 field}
1 field
60 Hz progress
HDTV video (480p, 720p)
Disabled
{0 frames}
N/A
{0 frames}
Enabled
{1 frame}
1 frame
24 to 30 Hz Progress
HDTV video (480p, 720p)
Disabled
{0 frames}
N/A
{0 frames}
Enabled
{1 frame}
1 frame
63 to 87 Hz
Interlaced graphics
≤1280 APPL and ≤75 MHz
Disabled
{0 fields}
Edge adaptive de-interlacing enabled
{0 fields}
Enabled
{1 field}
1 field
63 to 87 Hz
Interlaced graphics
>1280 APPL or >75 MHz
Disabled
{0 fields}
Field-dependent scaling enabled
{0 fields}
Enabled
{1 field}
1 field
7.3.2 Program Memory Flash/SRAM Interface
The DLPC6401 device provides three external program memory chip selects:
• PM_CSZ_0 – Available for optional SRAM or flash device (≤128 Mb)
• PM_CSZ_1 – Dedicated CS for boot flash device (that is standard NOR-type flash, ≤128 Mb)
• PM_CSZ_2 – Available for optional SRAM or flash device (≤128 Mb)
Flash and SRAM access timing is software programmable up to 31 wait states. Wait state resolution is 6.7 ns in
normal mode and 53.57 ns in low-power modes. Table 4 shows wait state program values for typical flash
access times.
Table 4. Wait State Program Values for Typical Flash Access Times
NORMAL MODE (1)
LOW-POWER MODE (1)
Formula to Calculate the Required Wait
State Value
= Roundup (Device_Access_Time / 6.7 ns)
= Roundup (Device_Access_Time / 53.57 ns)
Max Supported Device Access Time
207 ns
1660 ns
(1)
Assumes a maximum single direction trace length of 75 mm.
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Note that when another device such as an SRAM or additional flash is used in conjunction with the boot flash,
care must be taken to keep stub length short and located as close as possible to the flash end of the route.
The DLPC6401 device provides enough Program Memory Address pins to support a flash or SRAM device up to
128 Mb. For systems not requiring this capacity, up to two address pins can be used as GPIO instead.
Specifically, the two most significant address bits (that is PM_ADDR_22 and PM_ADDR_21) are shared on pins
GPIO_16 and GPIO_17 respectively. Like other GPIO pins, these pins float in a high-impedance input state
following reset; therefore, if these GPIO pins are to be reconfigured as Program Memory Address pins, they
require board-level pulldown resistors to prevent any Flash address bits from floating until software is able to
reconfigure the pins from GPIO to Program Memory Address. Also note, that until software reconfigures the pins
from GPIO to Program Memory Address, upper portions of flash memory are not accessible.
Table 5 shows typical GPIO_16 and GPIO_17 pin configurations for various flash sizes.
Table 5. Typical GPIO_16 and GPIO_17 Pin Configurations for Various Flash Sizes
FLASH SIZE
GPIO_36 PIN CONFIGURATION
GPIO_35 PIN CONFIGURATION
32 Mb or less
GPIO_17
GPIO_16
64 Mb
GPIO_17
128 Mb
(1)
PM_ADDR_22(*)
PM_ADDR_21(*) (1)
(1)
PM_ADDR_21(*) (1)
(*) = Board-level pulldown resistor required
7.3.2.1 Calibration and Debug Support
The DLPC6401 device contains a test point output port, TSTPT_(7:0), which provides selected system calibration
support as well as ASIC debug support. These test points are inputs while reset is applied and switch to outputs
when reset is released. The state of these signals is sampled upon the release of system reset and the captured
value configures the test mode until the next time reset is applied. Each test point includes an internal pulldown
resistor and thus external pullups are used to modify the default test configuration. The default configuration
(x00) corresponds to the TSTPT(7:0) outputs being driven low for reduce switching activity during normal
operation. For maximum flexibility, TI recommends an option to jumper to an external pullup for TSTPT(0). Note
that adding a pullup to TSTPT(7:1) may have adverse affects for normal operation and TI does not recommend
it. Note that these external pullups are sampled only after a 0-to-1 transition on POSENSE and thus changing
their configuration after reset has been released does not have any affect until the next time reset is asserted
and released. Table 6 defines the test mode selection for two programmable scenarios defined by TSTPT_(0):
Table 6. Test Mode Selection
TSTPT(3:0) CAPTURE
VALUE
(1)
(2)
NO SWITCHING
ACTIVITY
ARM AHB DEBUG SIGNAL SET
x0
x1
TSTPT(0)
0
ARM9 HREADY
TSTPT(1)
0
HSEL for all external program memory
TSTPT(2)
0
ARM9 HTRANS (1)
TSTPT(3)
0
PFC HREADY OUT (ARM9 R/W)
TSTPT(4)
0
PFC EMI (2) request (ARM9 R/W)
TSTPT(5)
0
PFC EMI (2) request accept (ARM9 R/W)
TSTPT(6)
0
PFC EMI (2) access done (ARM9 R/W)
TSTPT(7)
0
ARM9 Gate_The_Clk
These are only the default output selections. Software can reprogram the selection at any time.
PFC EMI is the parallel flash controller external memory interface
7.3.2.2 Board-Level Test Support
The in-circuit tri-state enable signal (ICTSEN) is a board-level test control signal. By driving ICTSEN to a logichigh state, all ASIC outputs (except TDO1 and TDO2) are tri-stated.
The DLPC6401 device also provides JTAG boundary scan support on all I/O signals, non-digital I/O, and a few
special signals. Table 7 defines these exceptions.
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Table 7. DLPC6401 – Signals Not Covered by JTAG
SIGNAL NAME
PKG BALL
TDO2
M18
TMS2
V16
MOSC
A14
MOSCN
A15
VPGM
D17
EXRES
A3
RA_IN_P
AB10
RA_IN_N
AA10
RB_IN_P
Y11
RB_IN_N
W11
RC_IN_P
AB12
RC_IN_N
AA12
RD_IN_P
Y13
RD_IN_N
W13
RE_IN_P
AB14
RE_IN_N
AA14
RCK_IN_P
Y9
RCK_IN_N
W9
7.4 Device Functional Modes
DLPC6401 has two functional modes (ON/OFF) controlled by a single pin PROJ_ON:
• When pin PROJ_ON is set high, the projector automatically powers up and an image is projected from the
DMD.
• When pin PROJ_ON is set low, the projector automatically powers down to save power.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DLCP6401 controller is required to be coupled with DLP4500 DMD to provide a reliable display solution for
various data and video display applications. The DMDs are spatial light modulators which reflect incoming light
from an illumination source to one of two directions, with the primary direction being into a projection or collection
optic. Each application is derived primarily from the optical architecture of the system and the format of the data
coming into the DLCP6401. Applications of interest include accessory projectors, smart projectors, screenless
display, embedded in display devices like notebooks, laptops, tablets, and hot spots. Other applications include
wearable (near-eye or head mounted) displays, interactive displays, low-latency gaming displays, and digital
signage.
8.2 Typical Application
A common application when using the DLPC6401 is for creating a pico-projector that can be used as an
accessory to a smartphone, tablet, or laptop. The DLPC6401 in the pico-projector receives images from a
multimedia front-end within the product as shown in Figure 13.
VGA
Composite, Component,
SVideo
Analog
Front End
HDMI
HDMI
Receiver/
Display Port
Receiver
Display Port
Parallel
Flash
I2C (R, G, B, HS, VS, clk)
I2C
(WiFi Display)
Generic Front End Hardware
12V DC Supply
DLPC6401
DLP Controller ASICLVDS
(Internal Frame Memory)
DDR
24
(23mm x 23mm)
GPIO
Port
I2C
DLP4500 DMD
(.45 WXGA)
I2C
Port 1
30 bit Parallel
Port 2
LVDS (Flat Panel Display
Link Compatible)
Multimedia
Front End
EPROM
I2C
IR USB
RS232
LED
LED
Discrete LED Driver
DLP specific hardware
Regulators to generate different
power supply used in system.
3.3V, 5V, 1.2V, 1.9V, 8.5V, -10V, 16V
Figure 13. Typical Application Diagram
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Typical Application (continued)
8.2.1 Design Requirements
A pico-projector is created by using a DLP chipset comprised of DLP4500 DMD and a DLPC6401 controller. The
DLPC6401 controller does the digital image processing and the DLP4500 DMD is the display device for
producing the projected image. In addition to the these DLP chips in the chipset, other chips may be needed.
Typically a Flash part is needed to store the software and firmware. Additionally, a discrete LED driver solution is
required to provide the LED driver functionality for LED illumination. The illumination light that is applied to the
DMD is typically from red, green, and blue LEDs. These are often contained in three separate packages, but
sometimes more than one color of LED die may be in the same package to reduce the overall size of the picoprojector. DLPC6401 controller provides either parallel- or LVDS-interface to connect the DLPC6401 controller to
the multimedia front-end for receiving images and video.
8.2.1.1 Recommended MOSC Crystal Oscillator Configuration
Table 8. Crystal Port Characteristics
PARAMETER
NOMINAL
UNIT
MOSC to GND capacitance
3.9
pF
MOSCZ to GND capacitance
3.8
pF
Table 9. Recommended Crystal Configuration (1)
PARAMETER
RECOMMENDED
Crystal circuit configuration
UNIT
Parallel resonant
Crystal type
Fundamental (first harmonic)
Crystal nominal frequency
Crystal frequency temperature stability
Overall crystal frequency tolerance (including accuracy, stability,
aging, and trim sensitivity)
32
MHz
±30
PPM
±100
PPM
Crystal ESR
50 (max)
Ω
Crystal load
10
pF
7 (max)
pF
Crystal shunt load
RS drive resistor (nominal)
100
RFB feedback resistor (nominal)
Ω
1
MΩ
CL1 external crystal load capacitor (MOSC)
See
(1)
pF
CL2 external crystal load capacitor (MOSCN)
See
(1)
pF
PCB layout
(1)
TI recommends a ground isolation ring around the crystal.
Typical drive level with the TCX 9C32070001 crystal (ESRmax = 30 Ω) = 160 µW
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MOSC
MOSCN
CL = Crystal load capacitance (Farads)
CL1 = 2 * (CL ± CStray-MOSC)
CL2 = 2 * (CL ± CStray-MOSCN)
CStray-MOSC = Sum of Package & PCB capacitance at
the crystal pin associated with ASIC signal MOSC.
CStray-MOSCN = Sum of Package & PCB capacitance at
the crystal pin associated with ASIC signal MOSCN.
RFB
RS
Crystal
CL1
CL2
Figure 14. Recommended Crystal Oscillator Configuration
It is assumed that the external crystal oscillator will stabilize within 50 ms after stable power is applied.
8.2.2 Detailed Design Procedure
For connecting the DLPC6401 controller and the DLP4500 DMD together, see the reference design schematic.
Layout guidelines should be followed to achieve a reliable projector. To complete the DLP system, an optical
module or light engine is required that contains the DLP4500 DMD, associated illumination sources, optical
elements, and necessary mechanical components.
8.2.3 Application Curve
1
0.9
Relative Output
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
1
2
3
4
5
6
7
8
LED Current (A)
Figure 15. Relative Output vs LED Current
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9 Power Supply Recommendations
9.1 System Power Regulation
Table 10 shows the recommended power delivery budget for DC offset and AC noise as observed at the
corresponding DLPC6401 power pins.
Table 10. Recommended Power Delivery Budget for DC Offset and AC Noise
ASIC POWER RAIL
VDDC
USAGE
NOMINAL
VOLTAGE
TOTAL SUPPLY
MARGIN (1)
ASIC core
1.2 V
±5%
VDD12_PLLM/ VDD12_PLLD
Internal PLLs
1.2 V
±5%
VDD_18_PLLM/ VDD18_PLLD
Internal PLLs
1.8 V
±5% (2)
DMD LPDDR I/O
1.9 V
±5%
LVCMOS I/O
3.3 V
±5%
VDD12_FPD
FPD-Link LVDS I/F
1.2 V
±5%
VDD33_FPD
FPD-Link LVDS I/F
3.3 V
±5%
VDD_DMD
VDD33
(1)
(2)
Total supply margin = DC offset budget + AC noise budget
When possible, TI suggests that a tighter supply tolerance (±3%) be used for the 1.8-V power to the
PLLs to improve system noise immunity
TI strongly recommends that the VDD_18_PLLM and VDD_18_PLLD power feeding internal PLLs be derived
from an isolated linear regulator to minimize the AC noise component. It is acceptable for VDD12_PLLM and
VDD12_PLLD to be derived from the same regulator as the core VDD12, but they should be filtered.
9.2 System Power-Up Sequence
Although the DLPC6401 device requires an array of power supply voltages (1.2 V, 1.8 V, 1.9 V, and 3.3 V), there
are no restrictions regarding the relative order of power supply sequencing. This is true for both power-up and
power-down scenarios. Similarly, there is no minimum time between powering-up and powering-down the
different supplies feeding the DLPC6401 device. However, note that it is not uncommon for there to be powersequencing requirements for the devices that share the supplies with the DLPC6401 device. For example:
• 1.2-V core power should be applied whenever any I/O power is applied. This ensures the state of the
associated I/O that are powered are controlled to a known state. Thus, TI recommends to apply core power
first. Other supplies should be applied only after the 1.2-V ASIC core has ramped up.
• All ASIC power should be applied before POSENSE is asserted to ensure proper power-up initialization is
performed. 1.8-V PLL power, 1.9-V I/O power, and 3.3-V I/O power should remain applied as long as 1.2-V
core power is applied and POSENSE is asserted.
It is assumed that all DLPC6401 device power-up sequencing is handled by external hardware. It is also
assumed that an external power monitor will hold the DLPC6401 device in system reset during power-up (that is,
POSENSE = 0). It should continue to assert system reset until all ASIC voltages have reached minimum
specified voltage levels. During this time, all ASIC I/O are either tri-stated or driven low. The master PLL (PLLM)
is released from reset upon the low-to-high transition of POSENSE, but the DLPC6401 device keeps the rest of
the ASIC in reset for an additional 100 ms to allow the PLL to lock and stabilize its outputs. After this 100-ms
delay, ARM9-related internal resets are de-asserted, causing the microprocessor to begin its boot-up routine.
Figure 16 shows the recommended DLPC6401 system power-up sequence.
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System Power-Up Sequence (continued)
1.2 V
(VDDC ASIC Core)
3.3 V
(VDD33 ASIC I/O)
1.2 V and 1.8 V
(ASIC PLL)
1.2 V and 3.3 V
(FPD-Link
VDD12_FPD and
VDD33_FPD)
1.9 V
(VDD_DMD)
POSENSE
Figure 16. System Power-Up Sequence
9.3 Power-On Sense (POSENSE) Support
It is difficult to set up a power monitor to trip exactly on the ASIC minimum supply voltage specification. Thus for
practical reasons, TI recommends that the external power monitor generating POSENSE target its threshold to
90% of the minimum supply voltage specifications and ensure that POSENSE remain low a sufficient amount of
time for all supply voltages to reach minimum ASIC requirements and stabilize. Note that the trip voltage for
detecting the loss of power is not critical for POSENSE and thus may be as low as 50% of rated supply voltages.
In addition, the reaction time to respond to a low voltage condition is not critical for POSENSE; however,
PWRGOOD does have much more critical requirements in these areas.
9.4 System Environment and Defaults
9.4.1 DLPC6401 System Power-Up and Reset Default Conditions
Following system power-up, the DLPC6401 device performs a power-up initialization routine that defaults the
ASIC to its normal power mode, in which ARM9-related clocks are enabled at their full rate and associated resets
are released. Most other clocks default to disabled state with associated resets asserted until released by the
processor. These same defaults are also applied as part of all system reset events (watch dog timer timeout, and
so on) that occur without removing or cycling power.
Following power-up or system reset initialization, the ARM9 boots from an external flash memory after which it
enables the rest of the ASIC clocks. When system initialization is complete, application software determines if
and when to enter low-power mode.
9.4.2 1.2-V System Power
The DLPC6401 device can support a power delivery system with a single 1.2-V power source derived from a
switching regulator. The DLPC6401 main core should receive 1.2-V power directly from the regulator output and
the internal ASIC PLLs (VDDC, VDD12_PLLD, and VDD12_PLLM) should receive individually-filtered versions
of this 1.2-V power. For specific filter recommendations, see PCB Layout Guidelines for Internal ASIC Power.
9.4.3 1.8-V System Power
A single 1.8-V power source should be used to supply both DLPC6401 internal PLLs. To keep this power as
clean as possible, TI recommends that this power be sourced by a linear regulator that is individually filtered for
each PLL (VDD_18_PLLD and VDD_18PLLM). For specific filter recommendations, see PCB Layout Guidelines
for Internal ASIC Power.
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System Environment and Defaults (continued)
9.4.4 1.9-V System Power
To maximize signal integrity, TI recommends to use an independent linear regulator to source the 1.9-V supply
that supports the DMD interface (VDD_DMD). To achieve maximum performance, this supply must be tightly
regulated to operating within a 1.9-V ±0.1 V range.
9.4.5 3.3-V System Power
The DLPC6401 device can support a power delivery system with a single 3.3-V power sources derived from a
switching regulator. This 3.3-V power supplies all of the LVCMOS I/O. 3.3-V power should remain active in all
power modes (VDD33) for which 1.2-V core power is applied.
9.4.6 FPD-Link Input LVDS System Power
The DLPC6401 device supports an FPD-Link compatible, LVDS input for an additional method of inputting video
or graphics data for display. This interface has some special ASIC power considerations that are separate from
the other ASIC 1.2- or 3.3-V power rails. Figure 17 shows a FPD-Link 1.2-V power pin (VDD12_FPD)
configuration example.
0.1 Ÿ '&/1 Ÿ DW 2 Mhz Ferrite
Ex. TDK HF70ACB201209-TL
1.2 V rail
10 uF
FPD12
(1.2 V)
0.1 uF
Figure 17. FPD-Link
In addition, TI recommends to place 0.1-µF low equivalent series resistor (ESR) capacitors to ground as close to
the FPD-Link lower pins of the ASIC as possible. FPD-Link 3.3-V power pins (FPD33) should also use external
capacitors in the same manner as for VDD12_FPD pins.
When FPD-Link is not used, the user can omit the previously mentioned filtering. However, the corresponding
voltages must still be provided to avoid potential long-term reliability issues.
9.4.7 Power Good (PWRGOOD) Support
The PWRGOOD signal is defined as an early warning signal that alerts the ASIC 500 µs before DC supply
voltages drop below specifications. This allows the ASIC to park the DMD ensuring the integrity of future
operation. For practical reasons, TI recommends that the monitor sensing PWRGOOD be on the input side of
supply regulators.
9.4.8 5-V Tolerant Support
The DLPC6401 device does not support any 5-V tolerant I/O. However, note that source signals ALF_HSYNC,
ALF_VSYNC, and I2C typically have 5-V requirements and special measures must be taken to support them. TI
recommends the use of a 5- to 3.3-V level shifter.
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10 Layout
10.1 Layout Guidelines
TI recommends 2-ounce copper (2.6-mil) power and ground planes in the PCB design to achieve needed thermal
connectivity.
10.1.1 PCB Layout Guidelines for Internal ASIC Power
TI recommends the following guidelines to achieve desired ASIC performance relative to internal PLLs:
• The DLPC6401 device contains two PLLs (PLLM and PLLD), each of which has a dedicated 1.2-V digital and
1.8-V analog supply. These 1.2-V PLL pins should be individually isolated from the main 1.2-V system supply
through a ferrite bead. The impedance of the ferrite bead should be much greater than that of the capacitor at
frequencies where noise is expected. Specifically the impedance of the ferrite bead must be less than 0.5 Ω
in the frequency range of 100 to 300 kHz and greater than 10 Ω in the frequency range >100 MHz.
• As a minimum, 1.8-V analog PLL power and ground pins should be isolated using an LC-filter with a ferrite
serving as the inductor and a 0.1-µF capacitor on the ASIC side of the ferrite. TI recommends that this 1.8-V
PLL power be supplied from a dedicated linear regulator and each PLL should be individually isolated from
the regulator. The same ferrite recommendations described for the 1.2-V digital PLL supply apply to the 1.8-V
analog PLL supplies.
• When designing the overall supply filter network, take care to ensure no resonance occurs. Particularly take
care around the 1- to 2-mHz band, as this coincides with the PLL natural loop frequency.
Signal VIA
PCB Pad
VIA to Common Analog
/
Digital Board Power Plane
ASIC Pad
F
E
D
VIA to Common Analog
/
Digital Board Ground Plane
C
B
A
Local
Decoupling
for the PLL
Digital Supply
22
0.1uF
10.0uF
PLLM_
VDD
PLLM_
VAD
PLLM_
VAS
PLLM_
VSS
MOSC
N
15
PLLD_
VSS
MOSC
14
MOSC
Crystal
Oscillator
FB
FB
0.1uF
PLLD_
VDD
PLLD_
VAD
PLLD_
VAS
13
0.1uF
10.0uF
10.0uF
FB
FB
0.1uF
12
10.0uF
Figure 18. PLL Filter Layout
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Layout Guidelines (continued)
High-frequency decoupling is required for both 1.2-V and 1.8-V PLL supplies and should be provided as close as
possible to each of the PLL supply package pins. TI recommends placing decoupling capacitors under the
package on the opposite side of the board. Use high-quality, low-ESR, monolithic, surface mount capacitors.
Typically 0.1 µF for each PLL supply should be sufficient. The length of a connecting trace increases the
parasitic inductance of the mounting, and thus, where possible, there should be no trace, allowing the via to butt
up against the land itself. Additionally, the connecting trace should be made as wide as possible. Further
improvement can be made by placing vias to the side of the capacitor lands or doubling the number of vias.
The location of bulk decoupling depends on the system design. Typically, a good ceramic capacitor in the 10-µF
range is adequate.
10.1.2 PCB Layout Guidelines for Quality Auto-Lock Performance
One of the most important factors in getting good performance from Auto-Lock is to design the PCB with the
highest-quality signal integrity possible. TI recommends the following:
• Place the ADC chip as close to the VESA/video connectors as possible.
• Avoid crosstalk to the analog signals by keeping them away from digital signals.
• Do not place the digital ground or power planes under the analog area between the VESA connector to the
ADC chip.
• Avoid crosstalk onto the RGB analog signals. Separate them from the VESA Hsync and Vsync signals.
• Analog power should not be shared with the digital power directly.
• Try to keep the trace lengths of the RGB as equal as possible.
• Use good quality (1%) termination resistors for the RGB inputs to the ADC.
• If the green channel must be connected to more than the ADC green input and ADC sync-on-green input,
provide a good-quality high-impendence buffer to avoid adding noise to the green channel.
10.1.3 DMD Interface Considerations
The DMD interface is modeled after the low-power DDR memory (LPDDR) interface. To minimize power
dissipation, the LPDDR interface is defined to be unterminated. This makes good PCB signal integrity
management imperative. In particular, impedance control and crosstalk mitigation is critical to robust operation.
LPDDR board design recommendations include 3× design rules (that is, trace spacing = 3× trace width), ±10%
impedance control, and signal routing directly over a neighboring reference plane (ground or 1.9-V plane).
DMD interface performance is also a function of trace length, so even with good board design, the length of the
line limits performance. The DLPC6401 device works over a very-narrow range of DMD signal routing lengths at
120 MHz only. The device provides the option to reduce the interface clock rate to facilitate a longer interface
(this includes 106.7-MHz, 96-MHz, 87.7-MHz, and 80-MHz programming options). However, note that reducing
the interface clock rate has the impact of increasing DMD load time, which in turn reduces image quality. Even
with a clock reduction, the edge rates required to achieve the fastest clock rates still exist and cause overshoot
and undershoot issues if there is excessive crosstalk, or the line is too short. Thus, ensuring positive timing
margin requires attention to many factors.
As an example, DMD interface system timing margin can be calculated as follows:
Setup margin = (DLPC6401 output setup) – (DMD input setup) – (PCB routing mismatch) – (PCB SI degradation)
Hold-time margin = (DLPC6401 output hold) – (DMD input hold) – (PCB routing mismatch) – (PCB SI degradation)
(1)
(2)
Where PCB SI degradation is signal integrity degradation due to PCB effects, which include simultaneously
switching output (SSO) noise, crosstalk, and inter-symbol interference (ISI). The DLPC6401 I/O timing
parameters can be found in their corresponding tables. Similarly, PCB routing mismatch can be budgeted and
met through controlled PCB routing. However, PCB SI degradation is not so straightforward.
In an attempt to minimize the signal integrity analysis that would otherwise be required, the following PCB design
guidelines are provided as a reference of an interconnect system that satisfies both waveform quality and timing
requirements (accounting for both PCB routing mismatch and PCB SI degradation). Variation from these
recommendations may also work, but should be confirmed with PCB signal integrity analysis or lab
measurements.
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Layout Guidelines (continued)
PCB design:
●
Configuration:
Asymmetric dual stripline
●
Signal routing layer thickness (T):
1.0-oz copper (1.2 mil)
●
Single-ended signal impedance controlled:
50 Ω (±10%)
●
Differential signal impedance controlled:
100-Ω differential (±10%)
PCB Stackup:
●
Reference plane 1 is assumed to be a ground plane for proper return path.
●
Reference plane 2 is assumed to be the 1.9-V DMD I/O power plane or another ground plane.
●
Dielectric FR4, (Er):
4.3 at 1 GHz (nominal)
●
Signal trace distance to reference plane 1 (H1):
5 mil (nominal)
●
Signal trace distance to reference plane 2 (H2):
30.4 mil (nominal)
●
If additional routing layers are required, ensure they are adjacent to one of these reference planes
Reference Plane 1
H1
W
T
W
Trace
S
Trace
H2
Dielectric Er
H2
T
Trace
Trace
H1
Reference Plane 2
Figure 19. PCB Stackup Geometries
Flex design:
38
●
Configuration:
●
The reference plane is assumed to be a ground plane for proper return path.
●
Vias:
2-layer microstrip
Max 2 per signal
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Layout Guidelines (continued)
●
Single trace width:
4 mil (min)
●
Signal routing layer thickness (T):
0.5-oz copper (0.6 mil)
●
Single-ended signal impedance controlled:
50 Ω (±10%)
Table 11. General PCB Routing (Applies to All Corresponding PCB Signal)
PARAMETER
Line width (W) (1)
Minimum
Line spacing to other signals (S)
(1)
(2)
APPLICATION
SINGLE-ENDED SIGNALS
REQUIREMENT
UNIT
Escape routing in ball field
4
(0.1)
Minimum
mil
(mm)
PCB etch data or control
5
(0.13)
Minimum
mil
(mm)
PCB etch clocks
7
(0.18)
Minimum
mil
(mm)
Escape routing in ball field
4
(0.1)
Minimum
mil
(mm)
PCB etch data or control
2× the line width (2)
Minimum
mil
(mm)
PCB etch clocks
3x the line width
Minimum
mil
(mm)
Line width is expected to be adjusted to achieve impedance requirements
3× line spacing is recommended for all signals to help achieve the desired signal integrity
Table 12. DMD I/F, PCB Interconnect Length Matching Requirements (1) (2)
SIGNAL GROUP LENGTH MATCHING
(1)
(2)
I/F
SIGNAL GROUP
REFERENCE SIGNAL
MAX MISMATCH
UNIT
DMD (DDR)
DMD_TRC,
DMD_SCTRL,
DMD_LOADB
DMD_D(23:0)
DMD_DCLK
±200
(±5.08)
mil
(mm)
DMD (SDR)
DMD_SAC_BUS,
DMD_DAD_OEZ,
DMD_DAD_STRB,
DMD_DAD_BUS
DMD_SAC_CLK
±200
(± 5.08)
mil
(mm)
These values apply to the PCB routing only. They do not include any internal package routing mismatch associated with the DLPC6401
or the DMD. Additional margin can be attained if internal DLPC6401 package skew is taken into account.
To minimize EMI radiation, serpentine routes added to facilitate matching should be implemented on signal layers only, and between
reference planes.
Table 13. DMD I/F, PCB (1) Interconnect Min and Max Length Limitations (Note Operating Frequency
Dependencies) (2)
SIGNAL ROUTING LENGTH
BUS
DMD (DDR)
(1)
(2)
(3)
(4)
SIGNAL GROUP
DMD_DCLK,
DMD_TRC,
DMD_SCTRL,
DMD_LOADB
DMD_D(23:0)
MIN (3)
2480
(63)
MAX (3) (4)
UNIT
120 MHz
106.7 MHz
96 MHz
87.7 MHz
2953
(75)
3465
(88)
3937
(100)
3937
(100)
mil
(mm)
Signal lengths below the stated minimum likely result in excessive overshoot or undershoot (at any frequency).
PCB layout assumes 2× design rules (that is, line spacing = 2× line width). However, 3× design rules reduce crosstalk and significantly
help performance.
Minimum and maximum signal routing length includes escape routing.
DMD-DDR maximum signal length is a function of the DMD_DCLK rate.
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Table 13. DMD I/F, PCB() Interconnect Min and Max Length Limitations (Note Operating Frequency
Dependencies)() (continued)
SIGNAL ROUTING LENGTH
BUS
SIGNAL GROUP
DMD (SDR)
DMD_SAC_CLK,
DMD_SAC_BUS,
DMD_DAD_OEZ,
DMD_DAD_STRB,
DMD_DAD_BUS
MIN (3)
MAX (3) (4)
120 MHz
106.7 MHz
512
(13)
UNIT
96 MHz
87.7 MHz
5906
(150)
mil
(mm)
spacer
• Number of layer changes:
– Minimize layer changes
• Stubs:
– Stubs should be avoided
Termination requirements:
DMD DDR data:
Specifically: DMD_D(23-0)
External [5-Ω] series termination (at the transmitter)
DMD DDR clock
Specifically: DMD_DCLK
External [5-Ω] series termination
DMD TRC, SCTRL, load:
Specifically: DMD_TRC, DMD_SCTRL, DMD_LOADB
External [5-Ω] series termination (at the transmitter)
DMD SAC and
miscellaneous control:
Specifically: DMD_SAC_CLK, DMD_SAC_BUS, DMD_DAD_STRB,
DMD_DAD_BUS
External [5-Ω] series termination (at the transmitter)
DAD output enable:
Specifically: DMD_DAD_OEZ
External [0-Ω] series termination
Instead this signal must be externally pulled-up to VDD_DMD through a 30- to
51-kΩ resistor.
However, note that both the DLPC6401 output timing parameters and the DMD input timing parameters include
timing budget to account for their respective internal package routing skew. Thus, additional system margin can
be attained by comprehending the package variations and compensating for them in the PCB layout. To increase
system timing margin, TI recommends that DLPC6401 package variation be compensated for (by signal group),
but it may not be desirable to compensate for DMD package skew. Because, each DMD has a different skew
profile making the PCB layout DMD specific. Thus, if an OEM wants to use a common PCB design for different
DMDs, TI recommends that either the DMD package skew variation not be compensated for on the PCB or the
package lengths for all applicable DMDs be considered. Table 14 provides the DLPC6401 package output delay
at the package ball for each DMD I/F signal. DMD internal routing skew data is contained in the DMD data sheet.
Table 14. DLPC6401 DMD I/F Package Routing Length
40
SIGNAL
TOTAL DELAY (ps)
PACKAGE BALL
SIGNAL
TOTAL DELAY (ps)
PACKAGE BALL
DMD_D0
25.9
A8
DMD_D14
19
B12
DMD_D1
19.6
B8
DMD_D15
11.7
C12
DMD_D2
13.4
C8
DMD_D16
4.7
D12
DMD_D3
7.4
D8
DMD_D17
21.5
B7
DMD_D4
18.1
B11
DMD_D18
24.8
A10
DMD_D5
11.1
C11
DMD_D19
8.3
D7
DMD_D6
4.4
D11
DMD_D20
23.9
B6
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Table 14. DLPC6401 DMD I/F Package Routing Length (continued)
SIGNAL
TOTAL DELAY (ps)
PACKAGE BALL
SIGNAL
TOTAL DELAY (ps)
PACKAGE BALL
DMD_D7
0
E11
DMD_D21
1.6
E9
DMD_D8
14.8
C7
DMD_D22
10.7
C10
DMD_D9
18.4
B10
DMD_D23
16.7
C6
DMD_D10
6.4
E7
DMD_DCLK
24.8
A9
DMD_D11
4.8
D10
DMD_LOADB
18
B9
DMD_D12
29.8
A6
DMD_SCTRL
11.4
C9
DMD_D13
25.7
A12
DMD_TRC
4.6
D9
10.1.4 General Handling Guidelines for Unused CMOS-Type Pins
To avoid potentially damaging current caused by floating CMOS input-only pins, TI recommends that unused
ASIC input pins be tied through a pullup resistor to its associated power supply or a pulldown to ground. For
ASIC inputs with an internal pullup or pulldown resistors, it is unnecessary to add an external pullup or pulldown,
unless specifically recommended. Note that internal pullup and pulldown resistors are weak and should not be
expected to drive the external line.
Unused output-only pins can be left open.
When possible, TI recommends that unused bidirectional I/O pins be configured to their output state such that
the pin can be left open. If this control is not available and the pins may become an input, then they should be
pulled-up (or pulled-down) using an appropriate resistor.
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10.2 Layout Example
Figure 20. Layer 3
42
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Layout Example (continued)
Figure 21. Layer 4
10.3 Thermal Considerations
The underlying thermal limitation for the DLPC6401 device is that the maximum operating junction temperature
(TJ) not be exceeded (this is defined in the Recommended Operating Conditions). This temperature depends on
operating ambient temperature, airflow, PCB design (including the component layout density and the amount of
copper used), power dissipation of the DLPC6401 device, and power dissipation of surrounding components.
The DLPC6401 package is designed primarily to extract heat through the power and ground planes of the PCB,
thus copper content and airflow over the PCB are important factors.
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Thermal Considerations (continued)
The recommended maximum operating ambient temperature (TA) is provided primarily as a design target and is
based on maximum DLPC6401 power dissipation and RθJA at 1 m/s of forced airflow, where RθJA is the thermal
resistance of the package as measured using a JEDEC-defined standard test PCB. This JEDEC test PCB is not
necessarily representative of the DLPC6401 PCB, and thus the reported thermal resistance may not be accurate
in the actual product application. Although the actual thermal resistance may be different, it is the best
information available during the design phase to estimate thermal performance. However, after the PCB is
designed and the product is built, TI highly recommends that thermal performance be measured and validated.
To do this, the top-center case temperature should be measured under the worst-case product scenario
(maximum power dissipation, maximum voltage, and maximum ambient temperature) and validated not to
exceed the maximum recommended case temperature (TC). This specification is based on the measured φJT for
the DLPC6401 package and provides a relatively accurate correlation to junction temperature. Take care when
measuring this case temperature to prevent accidental cooling of the package surface. TI recommends a small
(approximately 40-gauge) thermocouple. The bead and the thermocouple wire should contact the top of the
package and be covered with a minimal amount of thermally-conductive epoxy. The wires should be routed
closely along the package and the board surface to avoid cooling the bead through the wires.
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11 Device and Documentation Support
11.1 Device Support
11.1.1 Device Nomenclature
11.1.1.1 Video Timing Parameter Definitions
Active Lines Per Frame (ALPF) Defines the number of lines in a frame containing displayable data: ALPF is a
subset of the TLPF.
Active Pixels Per Line (APPL) Defines the number of pixel clocks in a line containing displayable data: APPL is
a subset of the TPPL.
Horizontal Back Porch (HBP) Blanking Number of blank pixel clocks after horizontal sync, but before the first
active pixel. Note: HBP times are referenced to the leading (active) edge of the respective sync
signal.
Horizontal Front Porch Blanking (HFP) Number of blank pixel clocks after the last active pixel but before
horizontal sync.
Horizontal Sync (HS) Timing reference point that defines the start of each horizontal interval (line). The
absolute reference point is defined by the active edge of the HS signal. The active edge (either
rising or falling edge as defined by the source) is the reference from which all horizontal blanking
parameters are measured.
Total Lines Per Frame (TLPF) Defines the vertical period (or frame time) in lines: TLPF = Total number of lines
per frame (active and inactive)
Total Pixel Per Line (TPPL) Defines the horizontal line period in pixel clocks: TPPL = Total number of pixel
clocks per line (active and inactive)
Vertical Back Porch (VBP) Blanking Number of blank lines after vertical sync but before the first active line.
Vertical Front Porch (VFP) Blanking Number of blank lines after the last active line but before vertical sync.
Vertical Sync (VS) Timing reference point that defines the start of the vertical interval (frame). The absolute
reference point is defined by the active edge of the VS signal. The active edge (either rising or
falling edge as defined by the source) is the reference from which all vertical blanking parameters
are measured.
TPPL
Vertical Back Porch (VBP)
APPL
Horizontal
Back
Porch
(HBP)
ALPF
Horizontal
Front
Porch
(HFP)
TLPF
Vertical Front Porch (VFP)
Figure 22. Timing Parameter Diagram
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Device Support (continued)
11.1.1.2 Device Marking
Marking Definitions:
Line 1: DLP® device name
Line 2: Foundry part number
Line 3: SSSSSSYYWW-QQ: Package assembly information
SSSSSS: Manufacturing site
YYWW: Date code (YY = Year :: WW = Week)
QQ: Qualification level option – Engineering samples are marked in this field with a -ES suffix.
For example, TAIWAN1324-ES would be engineering samples built in Taiwan the 24th week of 2013.
Line 4: LLLLLLL e1: Manufacturing Lot Code for Semiconductor Wafers and Lead-free Solder Ball Marking
LLLLLLL: Manufacturing lot code
e1: Lead-free solder balls consisting of SnAgCu
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11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
DLP is a registered trademark of Texas Instruments.
ARM926 is a trademark of ARM.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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12.1 Package Option Addendum
12.1.1 Packaging Information
Orderable Device
DLPC6401ZFF
(1)
(2)
(3)
(4)
(5)
Status
(1)
ACTIVE
Package
Type
Package
Drawing
Pins
Package
Qty
BGA
ZFF
419
60
Eco Plan
TBD
(2)
Lead/Ball Finish
Call TI
MSL Peak Temp
(3)
Level-3-255C-168
HRS
Op Temp (°C)
Device Marking (4) (5)
0 to 55
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
space
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
space
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
space
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
space
Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for
release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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