Texas Instruments | DLP® 0.45 WVGA NIR Chipset flyer | Selection guides | Texas Instruments DLP® 0.45 WVGA NIR Chipset flyer Selection guides

Texas Instruments DLP® 0.45 WVGA NIR Chipset flyer Selection guides
DLP® 0.45 WXGA NIR Chipset
DLP4500NIR & DLPC350
Introducing the first ever Texas Instruments (TI) DLP® chipset optimized for use with near infrared (NIR) light. This cost
effective, programmable light steering solution is ideal for use in industrial sensing equipment for the field or production line
and can enable new markets for spectrometers, single pixel cameras, laser marking equipment, NIR projection and more.
How the DLP 0.45 WXGA NIR Chipset Works
DLP NIRscanTM: Get Started Today
TI offers a dedicated DLP 0.45 WXGA NIR Chipset which consists
of the DLP4500NIR digital micromirror device (DMD) and DLPC350
Digital Controller. The complete chipset is designed to give
engineers fast, easy and reliable control of the DMD to speed
product development. The DLP4500NIR is optimized for light
steering solutions in the near infrared range including:
The DLP NIRscan evaluation module (EVM) featuring the 0.45
WXGA NIR Chipset contains everything a designer needs to
start developing a DLP-based spectrometer right out of the box.
• Spectroscopy
• Single Pixel Cameras
• Laser Marking
• 3D Machine Vision
• Pattern Projection
• Optical Choppers
• Microscopes
DLP-based spectrometer optical engine
• 1350 – 2450 nm wavelength range
• >30,000:1 signal to noise ratio for <1 second measurements
• Single-element Extended InGaAs Detector
• Dimensions: 7 ½” L x 4 ½” W x 3 ¾” H
Electronics
• AM3358 SitaraTM Cortex-A8 Microprocessor
• ADS1255 Very Low Noise Delta-Sigma ADC
The DMD is a programmable, high speed spatial light modulator.
Each micromirror of the DMD can be individually deflected about
a hinged axis. The deflection angle of each micromirror (±12°) is
controlled by changing the binary state of the underlying CMOS
memory cell followed by application of a mirror reset pulse.
Convenient and reliable operation of the DMD is orchestrated by
the DMD controller, with micromirror driver circuitry integrated into
the DMD. In addition, TI offers firmware for the Digital Controller to
enable advanced control of the DMD for pattern and high speed
light steering applications.
Transmittance sampling module including halogen lamp
• Compatible with reflective or fiber-based sampling modules
• 3 disposable cuvettes to jump start development
Embedded Linux operating system based on BeagleBone
Black architecture running web server
• Connect through USB or Ethernet—no download required!
• Open source code available
Available reference design from TI Designs
DLP 0.45 WXGA NIR Chipset
DLP4500NIR Key Features
• Optimized for 700-2500 nm light
• Over 1 million micromirrors
(912 x 1140 array)
• Side illuminated for simplified optics
• Polarization independent aluminum
micromirrors
DLPC350 Key Features
• Convenient, reliable DMD control
• High speed pattern rates up to
4225 Hz
• Pixel accurate Pattern Sequence
Mode
• Two configurable I/O triggers
www.ti.com/dlpnirscan
Spectroscopy Using DLP Technology
In a spectrometer, the DMD acts as a programmable wavelength filter. In a typical configuration,
broadband light enters through a slit, and a grating is used to disperse the wavelengths of light
across the micromirror array. Columns of micromirrors are then used to select which wavelengths
are directed onto a single element detector, and micromirror rows apply an attenuation factor.
The DMD facilitates a spectrometer architecture that uses a larger, single detector to displace an
expensive array detector.
This powerful and programmable design architecture enables analysis of liquids and solids with
higher performance at lower price points while using a smaller form factor suited for both field
analysis and inline manufacturing processes.
Performance:
Cost:
• Capture more light from a sample
• Better signal-to-noise ratio (SNR)
User Flash
• Low power, more portable solutions
Programmability:
• Utilize lower cost single element detectors
• Consistent unit-to-unit performance in volume production
Portability:
USB
Wi-Fi / BT
• Robust architecture
• Temperature-independent switching characteristics
DMD
accurate
Controller
• More flexible, faster,
measurements
• “Optimize as you go” analysis
• Measure diverse substances with a single end equipment
DMD
SD Card
Embedded
Processor
Ethernet
Block Diagram of Spectrometer
using
Technology
Power Op
BufferDLP
Thermistor
Amp
TEC
InGaAs
Detector
Amp
Signal Amp
Difference
Amp
User Flash
Wavelength
Selected by DMD
Power Op
Amp
ADC
Wi-Fi / BT
Amplifier
DMD
Controller
USB
SD Card
Input Module OptionEmbedded
Processor
Sample
DMD
Ethernet
Lamp
Slit
Diffraction
Grafting
Power Op
Amp
TEC
InGaAs
Detector
Buffer
Amp
Wavelength
Selected by DMD
Thermistor
Signal Amp
Difference
Amp
Power Op
Amp
ADC
Amplifier
DMD
Controller
DMD
Lamp
Driver
TEC
Driver
Power Supply
Embedded
ADC
Input
Module OptionProcessor
Sample
DLP® Chipset
DLP
Lamp
Slit
LEGEND
DLP & MEMS
Processor
Interface
RF/IF
Amplifier
Diffraction
Grafting
DMD
Controller
DMD
Lamp
Driver
TEC
Driver
ADC
Logic
Power
ADC/DAC
Clocks
Other
Embedded
Processor
DLP
Power Supply
DLP® Chipset
LEGEND
For questions please visit
e2e.ti.com
DLP & MEMS
Processor
Interface
RF/IF
Amplifier
For more information visit
ti.com/dlp
© 2014 Texas Instruments Inc., DLP, the DLP logo and the platform bar are trademarks of Texas Instruments.
Logic
Power
ADC/DAC
Clocks
Other
SLYC130
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2014, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising