Texas Instruments | AFE4405 Ultra-Small, Integrated AFE with FIFO for Wearable, Optical Heart-Rate Monitoring and Bio-Sensing (Rev. C) | Datasheet | Texas Instruments AFE4405 Ultra-Small, Integrated AFE with FIFO for Wearable, Optical Heart-Rate Monitoring and Bio-Sensing (Rev. C) Datasheet

Texas Instruments AFE4405 Ultra-Small, Integrated AFE with FIFO for Wearable, Optical Heart-Rate Monitoring and Bio-Sensing (Rev. C) Datasheet
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AFE4405
SBAS768C – APRIL 2016 – REVISED JULY 2019
AFE4405 Ultra-Small, Integrated AFE with FIFO for
Wearable, Optical Heart-Rate Monitoring and Bio-Sensing
1 Features
2 Applications
•
•
1
•
•
•
•
•
•
•
•
•
Transmitter:
– Supports Common Anode LED Configuration
– Dynamic Range: 100 dB
– 8-Bit Programmable LED Current to 50 mA
(Extendable to 100 mA)
– Programmable LED On-Time
– Simultaneous Support of 3 LEDs for Optimized
SpO2, HRM, or Multi-Wavelength HRM
Receiver:
– Supports 2 Time-Multiplexed Photodiode
Inputs
– 24-Bit Representation of the Current Input from
the Photodiode in Twos Complement Format
– Individual DC Offset Subtraction DAC
(±15.75-µA Range) at TIA Input for Each LED,
Ambient
– Digital Ambient Subtraction at ADC Output
– Transimpedance Gain: 10 kΩ to 2 MΩ
– Dynamic Range: 100 dB
– Dynamic Power-Saving Mode to Reduce
Receiver Current to 200 µA
Pulse Frequency: 5 SPS to 1000 SPS
Flexible Pulse Sequencing and Timing Control
Flexible Clock Options:
– External Clocking:
4-MHz to 60-MHz Input Clock
– Internal Clocking: 4-MHz Oscillator
FIFO with 240 Sample Depth:
– Programmable Partitioning Across Phases
I2C, SPI Interfaces: Selectable by Pin
Operating Temperature Range: –20°C to +70°C
2.6-mm × 2.1-mm DSBGA, 0.4-mm Pitch
Supplies: Rx: 2 V to 3.6 V, Tx: 3 V to 5.25 V,
IO: 1.8 V to 3.6 V
Optical Heart-Rate Monitoring (HRM) for
Wearables, Hearables
Heart-Rate Variability (HRV)
Pulse Oximetry (SpO2) Measurements
Maximum Oxygen Consumption (VO2 Max)
Calorie Expenditure
•
•
•
•
3 Description
The AFE4405 is an analog front-end (AFE) for optical
bio-sensing applications, such as heart-rate
monitoring (HRM) and saturation of peripheral
capillary oxygen (SpO2). The device supports three
switching light-emitting diodes (LEDs) and up to two
photodiodes. The current from the photodiode is
converted into voltage by the transimpedance
amplifier (TIA) and digitized using an analog-to-digital
converter (ADC). The ADC code can be stored in a
240-sample first in, first out (FIFO) block with
programmable depth. The FIFO depth can be
partitioned to accommodate the phases that must be
stored. The FIFO can be read out using either an I2C
or a SPI interface. The AFE also has a fullyintegrated LED driver with an 8-bit current control.
The device has a high dynamic range transmit-andreceive circuitry that helps with the sensing of very
small signal levels.
To request a full data sheet or other design
resources: request AFE4405
Device Information(1)
PART NUMBER
AFE4405
PACKAGE
DSBGA (30)
BODY SIZE (NOM)
2.60 mm × 2.10 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Block Diagram
TX_SUP
RX_SUP
INP
PD1
Offset
DAC
LED1
LED2
LED3
TX1
TX2
TX3
TX_SUP
LDO
CF
ILED
INM
I2C_SPI_SEL
RF
TIA
NoiseReduction
Filter (x4)
+
ADC
FIFO
SPI, I2C
Interface
SPI Interface
I2C Interface
RESETZ
RF
INP2
PD2
INM2
Timing Engine
ADC_RDY
PROG_OUT1
CF
4-MHz Oscillator
CLK
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE4405
SBAS768C – APRIL 2016 – REVISED JULY 2019
www.ti.com
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (May 2016) to Revision C
•
Changed the Mechanical Packaging images ......................................................................................................................... 4
Changes from Revision A (May 2016) to Revision B
•
2
Page
Added link to request full data sheet ...................................................................................................................................... 1
Changes from Original (April 2016) to Revision A
•
Page
Page
Released to production........................................................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
Product Folder Links: AFE4405
AFE4405
www.ti.com
SBAS768C – APRIL 2016 – REVISED JULY 2019
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
Product Folder Links: AFE4405
3
AFE4405
SBAS768C – APRIL 2016 – REVISED JULY 2019
www.ti.com
PACKAGE OUTLINE
YZ0030-C01
DSBGA - 0.5 mm max height
SCALE 5.000
DIE SIZE BALL GRID ARRAY
2.095
2.035
B
A
BALL A1
CORNER
2.595
2.535
0.5 MAX
C
SEATING PLANE
BALL TYP
0.19
0.13
0.05 C
1.6
TYP
0.85
F
E
2
TYP
D
0.4
TYP
SYMM
C
B
A
30X
0.015
0.25
0.21
C A B
1
2
3
4
5
PKG
0.4 TYP
4222550/D 07/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
4
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
Product Folder Links: AFE4405
AFE4405
www.ti.com
SBAS768C – APRIL 2016 – REVISED JULY 2019
EXAMPLE BOARD LAYOUT
YZ0030-C01
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.85)
(0.4) TYP
30X (
0.23)
1
3
2
4
5
A
(0.4) TYP
B
C
PKG SYMM
D
E
F
PKG
LAND PATTERN EXAMPLE
SCALE:30X
( 0.23)
METAL
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4222550/D 07/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
Product Folder Links: AFE4405
5
AFE4405
SBAS768C – APRIL 2016 – REVISED JULY 2019
www.ti.com
EXAMPLE STENCIL DESIGN
YZ0030-C01
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.85)
(0.4) TYP
30X ( 0.25)
(R0.05) TYP
1
2
4
3
5
A
(0.4) TYP
B
METAL
TYP
C
PKG SYMM
D
E
F
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:35X
4222550/D 07/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
6
Submit Documentation Feedback
Copyright © 2016–2019, Texas Instruments Incorporated
Product Folder Links: AFE4405
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
AFE4405YZR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
DSBGA
YZ
30
3000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
-20 to 70
AFE4405
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
AFE4405YZR
Package Package Pins
Type Drawing
SPQ
DSBGA
3000
YZ
30
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
8.4
Pack Materials-Page 1
2.16
B0
(mm)
K0
(mm)
P1
(mm)
2.66
0.6
4.0
W
Pin1
(mm) Quadrant
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AFE4405YZR
DSBGA
YZ
30
3000
210.0
185.0
35.0
Pack Materials-Page 2
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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