Texas Instruments | AFE4900 Ultra-low Power, Integrated AFE for Wearable Optical, Electrical Bio-sensing with FIFO (Rev. B) | Datasheet | Texas Instruments AFE4900 Ultra-low Power, Integrated AFE for Wearable Optical, Electrical Bio-sensing with FIFO (Rev. B) Datasheet

Texas Instruments AFE4900 Ultra-low Power, Integrated AFE for Wearable Optical, Electrical Bio-sensing with FIFO (Rev. B) Datasheet
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AFE4900
SBAS861B – AUGUST 2017 – REVISED JULY 2019
AFE4900 Ultra-low Power, Integrated AFE for
Wearable Optical, Electrical Bio-sensing with FIFO
1 Features
2 Applications
•
•
•
•
•
•
•
•
•
Synchronized PPG, ECG for blood pressure
estimation
HRM for wearables, hearables
Heart-rate variability (HRV)
Pulse oximetry (SpO2) measurements
•
•
•
3 Description
The AFE4900 device is an analog front-end (AFE) for
synchronized
electrocardiogram
(ECG),
photoplethysmogram (PPG) signal acquisition. The
device can also be used for optical bio-sensing
applications, such as heart-rate monitoring (HRM)
and saturation of peripheral capillary oxygen (SpO2).
The PPG signal chain supports up to four switching
light-emitting diodes (LEDs) and up to three
photodiodes (PDs). The LEDs can be switched on
using a fully integrated LED driver. The current from
the photodiode is converted into voltage by the
transimpedance amplifier (TIA) and digitized using an
analog-to-digital converter (ADC). The ECG signal
chain has an instrumentation amplifier (INA) with a
programmable gain that interfaces to the same ADC.
A right-leg drive (RLD) amplifier set can be used to
the bias for the ECG input pins. AC and dc lead-off
detect schemes are supported. The ADC codes from
the PPG and ECG phases can be stored in a 128sample first in, first out (FIFO) block and read out
using either an I2C or a serial programming interface
(SPI) interface.
Device Information(1)
PART NUMBER
PACKAGE
AFE4900
BODY SIZE (NOM)
DSBGA (30)
2.60 mm × 2.10 mm
(1) For all available packages, see the package option addendum
at the end of the datasheet.
SPACE
Simplified Block Diagram
TX_SUP
INP1
CONTROL1
TX1
TX_ SUP
LED3
LED2
LED1
RX_SUP
LED4
TX2
TX3
TX4
Offset DAC
Cf
PD1
1.8-V LDOs
ALDO_1V8, DLDO_1V8
INM1
ILED
Rf
TIA
INP2
Noise Reduction
filter (x4)
PD2
Threshold
Detection
Rf
INM2
ADC
Cf
THR_DET_RDY
I2C_SPI_SEL
Decimation
SPI/
I2C Interface
FIFO
INP3
SPI
I2C
RESETZ
PD3
INM3
4 MHz
Oscillator
INA
Timing Engine
ADC_RDY
PROG_OUT1
INP_ECG
Electrodes
•
Synchronized PPG, ECG signal acquisition at
data rates up to 1 kHz
ECG signal chain:
– Standalone ECG acquisition up to 4 kHz
– Input bias: 1-lead ECG with RLD bias
– Programmable INA gain: 2.15 to 12.92
– Input noise (1 Hz to 150 Hz): 2.5 µVrms at
1 kHz, 1.25 µVrms at 4-kHz data rate
– AC, DC lead-off detect: 12.5-nA to 100-nA
– IEC 60601 Test report available on request
PPG receiver:
– Supports three time-multiplexed PD inputs
– 24-Bit representation of current from PD
– DC offset subtraction DAC (Up to ±126-µA) at
TIA input for each LED, ambient
– Digital ambient subtraction at ADC output
– Noise filtering with programmable bandwidth
– Transimpedance gain: 10 kΩ to 2 MΩ
– Dynamic range up to 100 dB
– Receiver operates in PPG-only mode at
approximately 1-μA/Hz sampling rate
– Power-down mode: approximately 0 μA
PPG transmitter:
– Four LEDs in common anode configuration
– 8-Bit LED current up to 200 mA
– Mode to fire two LEDs in parallel
– Programmable LED on-time
– Simultaneous support of three LEDs for SpO2,
or multiwavelength HRM
– Average current of 30 μA adequate for a
typical heart-rate monitoring scenario:
– 20-mA Setting, 60-μs pulse duration,
25-Hz sampling rate
Clocking using an external or internal clock
FIFO with 128-sample depth for ECG and PPG
I2C, SPI interfaces: selectable by pin
2.6-mm × 2.1-mm, 0.4-mm Pitch DSBGA package
Supplies:
– Rx: 1.8 V to 1.9 V (LDO bypass),
2.0 V to 3.6 V (LDO enabled)
– Tx: 3 V to 5.25 V
– IO: 1.7 V to Rx_SUP
Interface circuit
1
128 kHz
Oscillator
AC/DC
Lead-off
Detect
INM_ECG
CLK
ENABLE_PTT
RLD_OUT
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE4900
SBAS861B – AUGUST 2017 – REVISED JULY 2019
www.ti.com
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (February 2019) to Revision B
Page
•
Changed the values of Programmable INA Gain in Features section.................................................................................... 1
•
Changed the Mechanical Packaging images ......................................................................................................................... 4
Changes from Original (August 2017) to Revision A
Page
•
Changed the values of Programmable INA Gain in Features section.................................................................................... 1
•
Added "IEC 60601 Test Report Available on Request" in Features section .......................................................................... 1
2
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Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: AFE4900
AFE4900
www.ti.com
SBAS861B – AUGUST 2017 – REVISED JULY 2019
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
5.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
5.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: AFE4900
3
AFE4900
SBAS861B – AUGUST 2017 – REVISED JULY 2019
www.ti.com
PACKAGE OUTLINE
YZ0030-C01
DSBGA - 0.5 mm max height
SCALE 5.000
DIE SIZE BALL GRID ARRAY
2.095
2.035
B
A
BALL A1
CORNER
2.595
2.535
0.5 MAX
C
SEATING PLANE
BALL TYP
0.19
0.13
0.05 C
1.6
TYP
0.85
F
E
2
TYP
D
0.4
TYP
SYMM
C
B
A
30X
0.015
0.25
0.21
C A B
1
2
3
4
5
PKG
0.4 TYP
4222550/D 07/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
4
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Product Folder Links: AFE4900
AFE4900
www.ti.com
SBAS861B – AUGUST 2017 – REVISED JULY 2019
EXAMPLE BOARD LAYOUT
YZ0030-C01
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.85)
(0.4) TYP
30X (
0.23)
1
3
2
4
5
A
(0.4) TYP
B
C
PKG SYMM
D
E
F
PKG
LAND PATTERN EXAMPLE
SCALE:30X
( 0.23)
METAL
0.05 MAX
METAL UNDER
SOLDER MASK
0.05 MIN
( 0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4222550/D 07/2019
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
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Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: AFE4900
5
AFE4900
SBAS861B – AUGUST 2017 – REVISED JULY 2019
www.ti.com
EXAMPLE STENCIL DESIGN
YZ0030-C01
DSBGA - 0.5 mm max height
DIE SIZE BALL GRID ARRAY
(0.85)
(0.4) TYP
30X ( 0.25)
(R0.05) TYP
1
2
4
3
5
A
(0.4) TYP
B
METAL
TYP
C
PKG SYMM
D
E
F
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:35X
4222550/D 07/2019
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
6
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Copyright © 2017–2019, Texas Instruments Incorporated
Product Folder Links: AFE4900
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jul-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
AFE4900YZR
ACTIVE
DSBGA
YZ
30
3000
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-20 to 70
AFE4900
AFE4900YZT
ACTIVE
DSBGA
YZ
30
250
Green (RoHS
& no Sb/Br)
SAC396
Level-1-260C-UNLIM
-20 to 70
AFE4900
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jul-2019
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
AFE4900YZR
DSBGA
YZ
30
3000
178.0
9.2
AFE4900YZT
DSBGA
YZ
30
250
178.0
9.2
Pack Materials-Page 1
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2.27
2.72
0.78
4.0
8.0
Q1
2.27
2.72
0.78
4.0
8.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Jul-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
AFE4900YZR
DSBGA
YZ
30
3000
220.0
220.0
35.0
AFE4900YZT
DSBGA
YZ
30
250
220.0
220.0
35.0
Pack Materials-Page 2
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