Texas Instruments | AFE2257 256-Channel, analog front-end for digital X-ray, flat-panel detectors | Datasheet | Texas Instruments AFE2257 256-Channel, analog front-end for digital X-ray, flat-panel detectors Datasheet

Texas Instruments AFE2257 256-Channel, analog front-end for digital X-ray, flat-panel detectors Datasheet
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AFE2257
SBAS984 – MARCH 2019
AFE2257
256-Channel, analog front-end for digital X-ray, flat-panel detectors
1 Features
2 Applications
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1
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256 Channels
On-chip, 16-bit ADC
Photodiode short immunity
High performance:
– Noise: < 600 electrons
– Low correlated noise
– Full-channel integral nonlinearity:
±2 LSB with internal 16-Bit ADC
– Scan time: < 20 µs to > 250 µs
Integration:
– Programmable full-scale input charge range:
< 1 pC to > 25 pC
– Internal timing generator (TG)
– Built-in correlated double sampler
– Pipelined integrate-and-read for improved
throughput—data-read during integration
– Serial LVDS output
Simple power-supply scheme:
– AVDD1 = 1.85 V
– AVDD2 = 3.3 V or 4.75 V
Low power consumption
Nap and total power-down modes
Pin compatible to AFE2256
Flat-panel, X-ray detectors
Charge detectors
Capacitance measurement
3 Description
The AFE2257 is a 256-channel charge readout IC
(ROIC) designed for flat-panel detector (FPD) based
digital x-ray systems. The device includes 256
integrators, correlated double samplers (CDSs) with
dual banking, and 256:4 analog multiplexers.
The device also features four 16-bit successiveapproximation
register
(SAR)
analog-to-digital
converters (ADCs). Serial data from the ADCs are
available in low-voltage differential signaling (LVDS)
format.
The device optimizes the overall x-ray system
performance using features such as multiple power
modes and in-system debug options. The nap and
power-down modes enable substantial power
savings, and are especially useful in battery-powered
systems.
Device Information(1)
PART NUMBER
AFE2257
PACKAGE
COF (TDU) 320
BODY SIZE (NOM) (2)
38.00 mm × 28.00 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
(2) L x W (mm × mm)
AFE2257 Block Diagram
VREF
AFE2257
Reference
Voltage
16-Bit
ADC[3:0]
Integrators
and CDS
TFT Switch
Pixel Cap
[255:0]
DCLK_P,
DCLK_M
ADC
MUX
ADC
ADC
LVDS
Serializer
DOUT_P,
DOUT_M
FCLK_P,
FCLK_M
255 to 0
Timing and Control
SPI
MCLK, SYNC, TP_SEL
Copyright © 2018, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE2257
SBAS984 – MARCH 2019
www.ti.com
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
2
DATE
REVISION
NOTES
March 2019
*
Initial release.
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: AFE2257
AFE2257
www.ti.com
SBAS984 – MARCH 2019
5 Device and Documentation Support
5.1 Documentation Support
5.1.1 Related Documentation
TPS7A8300 2-µA, 6-μVRMS, RF, LDO Voltage Regulator
5.2 Trademarks
All trademarks are the property of their respective owners.
5.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2019, Texas Instruments Incorporated
Product Folder Links: AFE2257
3
PACKAGE OPTION ADDENDUM
www.ti.com
3-Apr-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
AFE2257TDU
ACTIVE
Package Type Package Pins Package
Drawing
Qty
COF
TDU
320
35
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
AU
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
0 to 85
AFE2257TDU
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OUTLINE
TDU0320A
COF - 0.8 mm max height
CHIP ON FLEX
38 0.05
CUT LINE
2.45
SEE DETAIL A
0.2
(6.89)
5.886
0.05
4.919
0.2
SEE DETAIL B
PG1
PP1
GLASS
SIDE
PCB
SIDE
(17.5)
SYMM
DIE
25.5 0.05
CUT LINE
28 0.05
CUT LINE
PP50
PG270
COPPER SIDE UP
(1.578)
9.159
0.05
2X (1.244)
2X (0.29)
2X
(0.536)
2X (0.37)
(0.5) TYP
TRACE PITCH
(0.05) TYP
(0.1) TYP
TRACE PITCH
(0.05) TYP
TRACE WIDTH
0.076 MAX
(0.5)
2X (0.219)
2X
(0.256)
(0.25) TYP
TRACE WIDTH
DETAIL B
B 10.000
DETAIL A
A 15.000
0.8 MAX
1.5 MAX
TYP
DIE
SOLDER RESIST
COPPER
SIDE VIEW
POLYIMIDE
STIFFENER
NOT TO SCALE
4221694/B 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Flip chip application only.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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