Texas Instruments | DAC5652A Dual, 10-Bit, 275-MSPS Digital-to-Analog Converter (Rev. F) | Datasheet | Texas Instruments DAC5652A Dual, 10-Bit, 275-MSPS Digital-to-Analog Converter (Rev. F) Datasheet

Texas Instruments DAC5652A Dual, 10-Bit, 275-MSPS Digital-to-Analog Converter (Rev. F) Datasheet
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DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
DAC5652A Dual, 10-Bit, 275-MSPS Digital-to-Analog Converter
1 Features
3 Description
•
•
•
•
The DAC5652A is a monolithic, dual-channel, 10-bit,
high-speed digital-to-analog converter (DAC) with onchip voltage reference.
1
•
•
•
•
•
•
•
10-Bit Dual Transmit DAC
275 MSPS Update Rate
Single Supply: 3.0 V to 3.6 V
High Spurious-Free Dynamic Range (SFDR): 80
dBc at 5 MHz
High Third-Order Two-Tone Intermodulation
(IMD3): 78 dBc at 15.1 MHz and 16.1 MHz
Independent or Single Resistor Gain Control
Dual or Interleaved Data
On-Chip 1.2-V Reference
Low Power: 290 mW
Power-Down Mode: 9 mW
Packages:
– 48-Pin Thin-Quad Flat Pack (TQFP)
– 48-Pin Very-Thin-Quad Flat No-Leads (VQFN)
2 Applications
•
•
•
•
•
Cellular Base Transceiver Station Transmit
Channel
– CDMA: W-CDMA, CDMA2000, IS-95
– TDMA: GSM, IS-136, EDGE/UWC-136
Medical/Test Instrumentation
Arbitrary Waveform Generators (ARB)
Direct Digital Synthesis (DDS)
Cable Modem Termination System (CMTS)
Functional Block Diagram
WRTB
WRTA
CLKB
CLKA
DEMUX
IOUTA1
Latch A
Operating with update rates of up to 275 MSPS, the
DAC5652A offers exceptional dynamic performance,
tight-gain, and offset matching characteristics that
make it suitable in either I/Q baseband or direct IF
communication applications.
Each DAC has a high-impedance, differential-current
output, suitable for single-ended or differential
analog-output configurations. External resistors allow
scaling of the full-scale output current for each DAC
separately or together, typically between 2 mA and
20 mA. An accurate on-chip voltage reference is
temperature-compensated and delivers a stable 1.2-V
reference voltage. Optionally, an external reference
may be used.
The DAC5652A has two, 10-bit, parallel input ports
with separate clocks and data latches. For flexibility,
the DAC5652A also supports multiplexed data for
each DAC on one port when operating in the
interleaved mode.
The DAC5652A has been specifically designed for a
differential transformer-coupled output with a 50-Ω
doubly-terminated load. For a 20-mA full-scale output
current, both a 4:1 impedance ratio (resulting in an
output power of 4 dBm) and 1:1 impedance ratio
transformer (–2-dBm output power) are supported.
The DAC5652A is available in 48-pin TQFP and 48pin VQFN packages. The TQFP package offers pin
compatibility between family members that provides
10-bit (DAC5652A), 12-bit (DAC5662), and 14-bit
(DAC5672) resolution. The TQFP package is also pin
compatible to the DAC2900 and AD9763 dual DACs.
The device is characterized for operation over the
industrial temperature range of –40°C to +85°C.
10−b DAC
IOUTA2
DA[9:0]
BIASJ_A
Device Information(1)
PART NUMBER
DAC5652A
BODY SIZE (NOM)
7 mm × 7 mm
VQFN (48)
6 mm × 6 mm
IOUTB1
Latch B
DB[9:0]
PACKAGE
TQFP (48)
10−b DAC
IOUTB2
MODE
(1) For all available packages, see the package option addendum
at the end of the data sheet.
BIASJ_B
GSET
1.2 V Reference
EXTIO
SLEEP
DVDD
DGND
AVDD
AGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
7
1
1
1
2
4
6
Absolute Maximum Ratings ...................................... 6
ESD Ratings ............................................................ 6
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 6
Electrical Characteristics: DC .................................. 7
Electrical Characteristics: AC................................... 8
Electrical Characteristics: Digital Input..................... 9
Electrical Characteristics: Power Supply .................. 9
Switching Characteristics......................................... 9
Typical Characteristics .......................................... 10
Detailed Description ............................................ 12
7.1 Overview ................................................................. 12
7.2 Functional Block Diagram ....................................... 12
7.3 Feature Description................................................. 13
7.4 Device Functional Modes........................................ 15
8
Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Application ................................................. 22
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Examples................................................... 24
11 Device and Documentation Support ................. 27
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
27
27
27
27
27
27
12 Mechanical, Packaging, and Orderable
Information ........................................................... 27
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (May 2018) to Revision F
Page
•
Added VQFN package text to Description section ................................................................................................................. 1
•
Changed text in Description section to clarify that pin compatibility is only available for TQFP package ............................. 1
Changes from Revision D (August 2012) to Revision E
Page
•
Added Device Information, ESD Ratings, Recommended Operating Conditions tables; and Detailed Description,
Applications and Implementation, Power-Supply Recommendations, Layout, Device and Documentation Support,
and Mechanical, Packaging, and Orderable Information sections; existing content moved to new sections ........................ 1
•
Added new VQFN-48 package and associated content......................................................................................................... 1
Changes from Revision C (June 2011) to Revision D
Page
•
Deleted the VIH MAX value of 3.3 V ....................................................................................................................................... 9
•
Deleted the VIL MIN value of 0 V............................................................................................................................................ 9
Changes from Revision B (December 2010) to Revision C
•
Added Thermal Information table ........................................................................................................................................... 6
Changes from Revision A (May 2009) to Revision B
•
2
Page
Page
Changed the non-printing µ symbols in the Digital Input section of the Electrical Characteristics table (units column)
to the correct µ symbols recognized by the PDF processor .................................................................................................. 9
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SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
Changes from Original (September 2007) to Revision A
Page
•
Added internal pulldown to DA and DB pin descriptions........................................................................................................ 5
•
Added GSET to Absolute Maximum Ratings table................................................................................................................. 6
•
Added "The pullup and pulldown circuitry is approximately equivalent to 100 kΩ" to Digital Inputs section ....................... 13
•
Added resistor values to Figure 13....................................................................................................................................... 13
•
Added resistor values to Figure 14....................................................................................................................................... 13
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3
DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
www.ti.com
5 Pin Configuration and Functions
MODE
AVDD
IOUTA1
IOUTA2
BIASJ_A
EXTIO
GSET
BIASJ_B
IOUTB2
IOUTB1
AGND
SLEEP
48
47
46
45
44
43
42
41
40
39
38
37
PFB Package
48-Pin TQFP
Top View
DB0
DA4
6
31
DB1
DA3
7
30
DB2
DA2
8
29
DB3
DA1
9
28
DB4
DA0
10
27
DB5
NC
11
26
DB6
NC
12
25
DB7
Not to scale
DB8
DB9
DVDD
DGND
WRTB/SELECTIQ
CLKB/RESETIQ
CLKA/CLKIQ
WRTA/WRTIQ
DVDD
DGND
NC
NC
24
NC
32
23
33
5
22
4
DA5
21
DA6
20
NC
19
34
18
3
17
NC
DA7
16
NC
35
15
36
2
14
1
DA8
13
DA9
4
NC
NC
DA0
DA1
DA2
DA3
DA4
DA5
DA6
DA7
DA8
DA9
48
47
46
45
44
43
42
41
40
39
38
37
RSL Package
48-Pin VQFN
Top View
NC
1
36
MODE
NC
2
35
AVDD
DGND
3
34
IOUTA1
DVDD
4
33
IOUTA2
WRTA/WRTIQ
5
32
BIASJ_A
CLKA/CLKIQ
6
31
EXTIO
CLKB/RESETIQ
7
30
GSET
WRTB/SELECTIQ
8
29
BIASJ_B
DGND
9
28
IOUTB2
DVDD
10
27
IOUTB1
DB9
11
26
AGND
DB8
12
25
SLEEP
Thermal
13
14
15
16
17
18
19
20
21
22
23
24
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0
NC
NC
NC
NC
Pad
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Not to scale
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DAC5652A
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SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
Pin Functions
PIN
I/O
DESCRIPTION
NAME
TQFP
VQFN
AGND
38
26
I
Analog ground
AVDD
47
35
I
Analog supply voltage
BIASJ_A
44
32
O
Full-scale output current bias for DACA
BIASJ_B
41
29
O
Full-scale output current bias for DACB
CLKA/CLKIQ
18
6
I
Clock input for DACA, CLKIQ in interleaved mode
CLKB/RESETIQ
19
7
I
Clock input for DACB, RESETIQ in interleaved mode
DA0
10
46
I
Data port A0 (LSB). Internal pulldown.
DA1
9
45
I
Data port A1. Internal pulldown.
DA2
8
44
I
Data port A2. Internal pulldown.
DA3
7
43
I
Data port A3. Internal pulldown.
DA4
6
42
I
Data port A4. Internal pulldown.
DA5
5
41
I
Data port A5. Internal pulldown.
DA6
4
40
I
Data port A6. Internal pulldown.
DA7
3
39
I
Data port A7. Internal pulldown.
DA8
2
38
I
Data port A8. Internal pulldown.
DA9
1
37
i
Data port A9 (MSB). Internal pulldown.
DB0
32
20
I
Data port B0 (LSB). Internal pulldown.
DB1
31
19
I
Data port B1. Internal pulldown.
DB2
30
18
I
Data port B2. Internal pulldown.
DB3
29
17
I
Data port B3. Internal pulldown.
DB4
28
16
I
Data port B4. Internal pulldown.
DB5
27
15
I
Data port B5. Internal pulldown.
DB6
26
14
I
Data port B6. Internal pulldown.
DB7
25
13
I
Data port B7. Internal pulldown.
DB8
24
12
I
Data port B8. Internal pulldown.
DB9
23
11
I
Data port B9 (MSB). Internal pulldown.
DGND
15, 21
3, 9
I
Digital ground
DVDD
16, 22
4, 10
I
Digital supply voltage
EXTIO
43
31
I/O
GSET
42
30
I
Gain-setting mode: H – 1 resistor, L – 2 resistors. Internal pullup.
IOUTA1
46
34
O
DACA current output. Full-scale with all bits of DA high.
IOUTA2
45
33
O
DACA complementary current output. Full-scale with all bits of DA low.
IOUTB1
39
27
O
DACB current output. Full-scale with all bits of DB high.
IOUTB2
40
28
O
DACB complementary current output. Full-scale with all bits of DB low.
MODE
48
36
I
Mode Select: H – Dual Bus, L – Interleaved. Internal pullup.
11-14, 3336
1,2, 21-24,
47, 48
—
Factory use only. Pins must be connected to DGND or left unconnected.
SLEEP
37
25
I
Sleep function control input: H – DAC in power-down mode, L – DAC in
operating mode. Internal pulldown.
WRTA/WRTIQ
17
5
I
Input write signal for PORT A (WRTIQ in interleaving mode)
WRTB/SELECTIQ
20
8
I
Input write signal for PORT B (SELECTIQ in interleaving mode)
NC
Internal reference output (bypass with 0.1 μF to AGND) or external reference
input
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DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Voltage
MIN
MAX
AVDD (measured with respect to AGND)
–0.5
4
DVDD (measured with respect to DGND)
–0.5
4
Between AGND and DGND
–0.5
0.5
Between AVDD and DVDD
–4
4
DA[9:0] and DB[9:0]
–0.5
DVDD + 0.5
MODE, SLEEP, CLKA, CLKB, WRTA, WRTB
–0.5
DVDD + 0.5
–1
AVDD + 0.5
–0.5
AVDD + 0.5
IOUTA1, IOUTA2, IOUTB1, IOUTB2
EXTIO, BIASJ_A, BIASJ_B, GSET
Current
Temperature
(1)
Peak input current (any input)
20
Peak total input current (all inputs)
–30
UNIT
V
mA
Operating free-air, TA
–40
85
°C
Storage, Tstg
–65
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
AVDD
Analog supply voltage
3
3.3
3.6
V
DVDD
Digital supply voltage
3
3.3
3.6
V
1.25
V
275
MHz
85
°C
Output voltage compliance range (1)
–1
Clock input frequency
TA
(1)
Operating free-air temperature
–40
The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown,
resulting in reduced reliability of the DAC5652A device. The upper limit of the output compliance is determined by the load resistors and
full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity.
6.4 Thermal Information
DAC5652A
THERMAL METRIC (1)
PFB (TQFP)
RSL (VQFN)
48 PINS
48 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
65.3
27.0
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.4
17.3
°C/W
RθJB
Junction-to-board thermal resistance
28.6
9.6
°C/W
ψJT
Junction-to-top characterization parameter
0.4
0.2
°C/W
ψJB
Junction-to-board characterization parameter
28.4
9.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
2.2
°C/W
(1)
6
For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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6.5
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
Electrical Characteristics: DC
dc specifications over TA, AVDD = DVDD = 3.3 V, I(OUTFS) = 20 mA, and independent gain set mode (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESOLUTION
Resolution
10
Bits
DC ACCURACY (1)
INL
Integral nonlinearity
DNL
Differential nonlinearity
1 LSB = I(OUTFS)/210, TMIN to TMAX
–1
±0.25
1
LSB
–0.5
±0.16
0.5
LSB
ANALOG OUTPUT
Offset error
Midscale value (internal reference)
±0.05
%FSR
Offset mismatch
Midscale value (internal reference)
±0.03
%FSR
Gain error
With internal reference
±0.75
%FSR
Minimum full-scale output current (2)
Maximum full-scale output current
2
(2)
Gain mismatch
20
With internal reference
Output voltage compliance range (3)
RO
Output resistance
CO
Output capacitance
mA
–2
0.2
–1
mA
2
%FSR
1.25
V
300
kΩ
5
pF
REFERENCE OUTPUT
Reference voltage
Reference output current
1.14
(4)
1.2
1.26
V
100
nA
REFERENCE INPUT
V(EXTIO)
Input voltage
RI
Input resistance
CI
0.1
1.25
V
1
MΩ
Small signal bandwidth
300
kHz
Input capacitance
100
pF
TEMPERATURE COEFFICIENTS
Offset drift
Gain drift
2
With external reference
±20
With internal reference
±40
ppm of
FSR/°C
±20
ppm/°C
Reference voltage drift
(1)
(2)
(3)
(4)
ppm of
FSR/°C
Measured differentially through 50 Ω to AGND.
Nominal full-scale current, I(OUTFS), equals 32x the I(BIAS) current.
The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown,
resulting in reduced reliability of the DAC5652A device. The upper limit of the output compliance is determined by the load resistors and
full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity.
Use an external buffer amplifier with high-impedance input to drive any external load.
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DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
6.6
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Electrical Characteristics: AC
ac specifications over TA, AVDD = DVDD = 3.3 V, I(OUTFS) = 20 mA, independent gain set mode, differential 1:1 impedance
ratio transformer coupled output, and 50-Ω doubly terminated load (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG OUTPUT
fclk
Maximum output update
rate (1)
ts
Output settling time to 0.1%
(DAC)
tr
tf
275
20
ns
Output rise time 10% to 90%
(OUT)
1.4
ns
Output fall time 90% to 10%
(OUT)
1.5
ns
Output noise
Midscale transition
MSPS
I(OUTFS) = 20 mA
55
I(OUTFS) = 2 mA
30
1st Nyquist zone, TA = 25°C,
fDATA = 50 MSPS, fOUT = 1 MHz, I(OUTFS) = 0 dB
79
1st Nyquist zone, TA = 25°C,
fDATA = 50 MSPS, fOUT = 1 MHz, I(OUTFS) = –6 dB
78
1st Nyquist zone, TA = 25°C,
fDATA = 50 MSPS, fOUT = 1 MHz, I(OUTFS) = –12 dB
73
1st Nyquist zone, TA = 25°C,
fDATA = 100 MSPS, fOUT = 5 MHz, I(OUTFS) = 0 dB
80
1st Nyquist zone, TA = 25°C,
fDATA = 100 MSPS, fOUT = 20 MHz, I(OUTFS) = 0 dB
76
pA/√Hz
AC LINEARITY
SFDR
Spurious-free dynamic range
1st Nyquist zone, TMIN to TMAX,
fDATA = 200 MSPS, fOUT = 20 MHz, I(OUTFS) = 0 dB
SNR
IMD3
IMD
Signal-to-noise ratio
Third-order two-tone
intermodulation
Four-tone intermodulation
Channel isolation
(1)
8
dBc
61
70
1st Nyquist zone, TA = 25°C,
fDATA = 200 MSPS, fOUT = 41 MHz, I(OUTFS) = 0 dB
67
1st Nyquist zone, TA = 25°C,
fDATA = 275 MSPS, fOUT = 20 MHz
70
1st Nyquist zone, TA = 25°C,
fDATA = 100 MSPS, fOUT = 5 MHz, I(OUTFS) = 0 dB
63
dB
1st Nyquist zone, TA = 25°C,
fDATA = 160 MSPS, fOUT = 20 MHz, I(OUTFS) = 0 dB
62
dB
Each tone at –6 dBFS, TA = 25°C,
fDATA = 200 MSPS, fOUT = 45.4 MHz and 46.4 MHz
61
Each tone at –6 dBFS, TA = 25°C,
fDATA = 100 MSPS, fOUT = 15.1 MHz and 16.1 MHz
78
Each tone at –12 dBFS, TA = 25°C
fDATA = 100 MSPS, fOUT = 15.6, 15.8, 16.2, and
16.4 MHz
76
Each tone at –12 dBFS, TA = 25°C
fDATA = 165 MSPS, fOUT = 19.0, 19.1, 19.3, and
19.4 MHz
55
Each tone at –12 dBFS, TA = 25°C
fDATA = 165 MSPS, fOUT = 68.8, 69.6, 71.2, and
72.0 MHz
70
TA = 25°C, fDATA = 165 MSPS
fOUT (CH1) = 20 MHz, fOUT (CH2) = 21 MHz
90
dBc
dBc
dBc
Specified by design and bench characterization. Not production tested.
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6.7
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
Electrical Characteristics: Digital Input
digital specifications over TA, AVDD = DVDD = 3.3 V, and I(OUTFS) = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIH
High-level input voltage
VIL
Low-level input voltage
2
V
IIH
High-level input current
±50
µA
IIL
Low-level input current
±10
µA
IIH(GSET)
High-level input current, GSET pin
7
µA
IIL(GSET)
Low-level input current, GSET pin
–80
µA
IIH(MODE)
High-level input current, MODE pin
–30
µA
IIL(MODE)
Low-level input current, MODE pin
–80
µA
CI
Input capacitance
5
pF
0.8
V
6.8 Electrical Characteristics: Power Supply
power supply specifications over TA, AVDD = DVDD = 3.3 V, I(OUTFS) = 20 mA, fDATA = 200 MSPS, fOUT = 1 MHz, and
independent gain set mode (unless otherwise noted)
PARAMETER
I(AVDD)
Supply current, analog
I(DVDD)
Supply current, digital
TEST CONDITIONS
MIN
TYP
MAX
Including output current through load
resistor
75
90
Sleep mode with clock
2.5
Sleep mode without clock
2.5
Sleep mode with clock
Sleep mode without clock
mA
12
20
11.3
18
mA
0.6
290
Power dissipation
UNIT
Sleep mode with clock
360
45.5
Sleep mode without clock
9.2
fDATA = 275 MSPS, fOUT = 20 MHz
310
mW
APSRR
Analog power supply rejection ratio
–0.2
–0.01
0.2
%FSR/V
DPSRR
Digital power supply rejection ratio
–0.2
0
0.2
%FSR/V
TYP
MAX
6.9
Switching Characteristics
digital specifications over TA, AVDD = DVDD = 3.3 V, and I(OUTFS) = 20 mA (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
UNIT
TIMING - DUAL BUS MODE
tsu
Input setup time
1
th
Input hold time
1
tLPH
Input clock pulse high time
tLAT
Clock latency (WRTA/B to outputs)
tPD
Propagation delay time
ns
ns
1
4
ns
4
clk
1.5
ns
TIMING - SINGLE BUS INTERLEAVED MODE
tsu
Input setup time
0.5
ns
th
Input hold time
0.5
ns
tLAT
Clock latency (WRTA/B to outputs)
tPD
Propagation delay time
4
4
1.5
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ns
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0.5
0.4
0.3
0.2
0.1
0.0
−0.1
−0.2
−0.3
−0.4
−0.5
0
100
200
300
400
500
600
700
800
900
Input Code
1000
G001
DNL − Differential Nonlinearity Error − LSB
INL − Integral Nonlinearity Error − LSB
6.10 Typical Characteristics
0.25
0.20
0.15
0.10
0.05
0.00
−0.05
−0.10
−0.15
−0.20
−0.25
0
100
200
300
400
500
600
700
800
900
Input Code
Figure 1. Integral Nonlinearity vs Input Code
SFDR − Spurious-Free Dynamic Range − dBc
SFDR − Spurious-Free Dynamic Range − dBc
100
fdata = 52 MSPS
Dual Bus Mode
95
90
85
−6 dBfS
0 dBfS
80
75
−12 dBfS
70
65
60
fdata = 78 MSPS
Dual Bus Mode
95
90
85
−6 dBfS
80
75
−12 dBfS
70
0 dBfS
65
60
0
4
8
12
16
20
fout − Output Frequency − MHz
0
5
10
15
20
25
fout − Output Frequency − MHz
G003
Figure 3. Spurious-Free Dynamic Range vs Output
Frequency
30
G004
Figure 4. Spurious-Free Dynamic Range vs Output
Frequency
100
SFDR − Spurious-Free Dynamic Range − dBc
100
SFDR − Spurious-Free Dynamic Range − dBc
G002
Figure 2. Differential Nonlinearity vs Input Code
100
fdata = 100 MSPS
Dual Bus Mode
95
90
85
−6 dBfS
80
0 dBfS
75
−12 dBfS
70
65
60
fdata = 165 MSPS
Dual Bus Mode
95
90
85
80
0 dBfS
−6 dBfS
75
70
−12 dBfS
65
60
0
5
10
15
20
25
fout − Output Frequency − MHz
30
35
0
5
10 15 20 25 30 35 40 45 50 55 60
fout − Output Frequency − MHz
G005
Figure 5. Spurious-Free Dynamic Range vs Output
Frequency
10
1000
G006
Figure 6. Spurious-Free Dynamic Range vs Output
Frequency
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Typical Characteristics (continued)
0
0
fdata = 78 MSPS
fOUT = 15 MHz
Dual Bus Mode
fdata = 165 MSPS
fOUT = 30.1 MHz
Dual Bus Mode
−20
Power − dBm
Power − dBm
−20
−40
−60
−80
−40
−60
−80
−100
0.0
7.8
15.6
23.4
31.2
−100
0.0
39.0
16.5
f − Frequency − MHz
33.0
49.5
66.0
82.5
f − Frequency − MHz
G007
G008
Figure 7. Single-Tone Spectrum
Figure 8. Single-Tone Spectrum
95
100
95
90
Two-Tone IMD3 − dBc
Two-Tone IMD3 − dBc
90
85
80
75
70
85
80
75
70
65
60
fdata = 78 MSPS
Dual Bus Mode
fout2 = fout1 + 1 MHz
65
60
50
0
5
10
15
20
25
30
35
fout1 − Output Frequency − MHz
0
G009
30
40
50
G010
fdata = 165 MSPS
−10 fout1 = 30.1 MHz
fout2 = 31.1 MHz
Dual Bus Mode
−30
Power − dBm
−30
Power − dBm
20
Figure 10. Two-Tone IMD3 vs Output Frequency
fdata = 78 MSPS
fout1 = 20.1 MHz
fout2 = 21.1 MHz
Dual Bus Mode
−50
−70
−90
−110
19.0
10
fout1 − Output Frequency − MHz
Figure 9. Two-Tone IMD3 vs Output Frequency
−10
fdata = 165 MSPS
Dual Bus Mode
fout2 = fout1 + 1 MHz
55
−50
−70
−90
19.5
20.0
20.5
21.0
21.5
−110
29.0
22.0
f − Frequency − MHz
29.5
30.0
30.5
31.0
31.5
32.0
f − Frequency − MHz
G011
Figure 11. Two-Tone Spectrum
G012
Figure 12. Two-Tone Spectrum
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7 Detailed Description
7.1 Overview
The architecture of the DAC5652A uses a current steering technique to enable fast switching and a high update
rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to
deliver a full-scale output current of up to 20 mA. An internal decoder addresses the differential current switches
each time the DAC is updated, and a corresponding output current is formed by steering all currents to either
output summing node, IOUT1 or IOUT2. The complementary outputs deliver a differential output signal, which
improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise),
and doubles the peak-to-peak output signal swing by a factor of two, as compared to single-ended operation.
The segmented architecture results in a significant reduction of the glitch energy and improves the dynamic
performance (SFDR) and DNL. The current outputs maintain a very high output impedance of greater
than 300 kΩ.
When pin 42 (GSET) is high (simultaneous gain set mode), the full-scale output current for DACs is determined
by the ratio of the internal reference voltage (1.2 V) and an external resistor (RSET) connected to BIASJ_A. When
GSET is low (independent gain set mode), the full-scale output current for each DAC is determined by the ratio
of the internal reference voltage (1.2 V) and separate external resistors (RSET) connected to BIASJ_A and
BIASJ_B. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC output current
that can range from 2 mA to 20 mA, depending on the value of RSET.
The DAC5652A is split into a digital and an analog portion, each of which is powered through its own supply pin.
The digital section includes edge-triggered input latches and the decoder logic, while the analog section
comprises both the current source array with its associated switches, and the reference circuitry.
7.2 Functional Block Diagram
WRTB
WRTA
CLKB
CLKA
DEMUX
IOUTA1
Latch A
10−b DAC
IOUTA2
DA[9:0]
BIASJ_A
IOUTB1
Latch B
DB[9:0]
10−b DAC
IOUTB2
MODE
BIASJ_B
GSET
1.2 V Reference
EXTIO
SLEEP
DVDD
12
DGND
AVDD
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7.3 Feature Description
7.3.1 Digital Inputs
The data input ports of the DAC5652A accept a standard positive coding with data bits DA9 and DB9 being the
most significant bits (MSB). The converter outputs support a clock rate of up to 275 MSPS. The best
performance is typically achieved with a symmetric duty cycle for write and clock; however, the duty cycle may
vary as long as the timing specifications are met. Similarly, the setup and hold times may be chosen within their
specified limits.
All digital inputs of the DAC5652A are CMOS compatible. Figure 13 and Figure 14 show schematics of the
equivalent CMOS digital inputs of the DAC5652A. The pullup and pulldown circuitry is approximately equivalent
to 100 kΩ. The 10-bit digital data input follows the offset positive binary coding scheme. The DAC5652A is
designed to operate with a digital supply (DVDD) of 3 V to 3.6 V.
DVDD
DA[9:0]
DB[9:0]
SLEEP
CLKA/B
WRTA/B
400W
Internal
Digital In
100kW
DGND
Figure 13. CMOS/TTL Digital Equivalent Input With Internal Pulldown Resistor
DVDD
100kW
GSET
MODE
400W
Internal
Digital In
DGND
Figure 14. CMOS/TTL Digital Equivalent Input With Internal Pullup Resistor
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Feature Description (continued)
7.3.2 References
7.3.2.1 Internal Reference
The DAC5652A has an on-chip reference circuit which comprises a 1.2-V bandgap reference and two control
amplifiers, one for each DAC. The full-scale output current, I(OUTFS), of the DAC5652A is determined by the
reference voltage, VREF, and the value of resistor RSET. I(OUTFS) is calculated by:
V
REF
I
+ 32 I
+ 32
OUTFS
REF
R
SET
(1)
The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is
determined by the ratio of VREF and RSET (see Equation 9). The full-scale output current, I(OUTFS), results from
multiplying IREF by a fixed factor of 32.
Using the internal reference, a 2-kΩ resistor value results in a full-scale output of approximately 20 mA. Resistors
with a tolerance of 1% or better should be considered. Selecting higher values, the output current can be
adjusted from 20 mA down to 2 mA. Operating the DAC5652A at lower than 20-mA output currents may be
desirable for reasons of reducing the total power consumption, improving the distortion performance, or
observing the output compliance voltage limitations for a given load condition.
It is recommended to bypass the EXTIO pin with a ceramic chip capacitor of 0.1 µF or more. The control
amplifier is internally compensated and its small signal bandwidth is approximately 300 kHz.
7.3.2.2 External Reference
The internal reference can be disabled by simply applying an external reference voltage into the EXTIO pin,
which in this case functions as an input. The use of an external reference may be considered for applications that
require higher accuracy and drift performance or to add the ability of dynamic gain control.
While a 0.1-µF capacitor is recommended to be used with the internal reference, it is optional for the external
reference operation. The reference input, EXTIO, has a high input impedance (1 MΩ) and can be driven by
various sources. Note that the voltage range of the external reference must stay within the compliance range of
the reference input.
14
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7.4 Device Functional Modes
7.4.1 Input Interfaces
The DAC5652A features two operating modes selected by the MODE pin, as shown in Table 1.
• For dual-bus input mode, the device essentially consists of two separate DACs. Each DAC has its own
separate data input bus, clock input, and data write signal (data latch-in).
• In single-bus interleaved mode, the data must be presented interleaved at the A-channel input bus. The Bchannel input bus is not used in this mode. The clock and write input are now shared by both DACs.
Table 1. Operating Modes
MODE PIN
MODE PIN CONNECTED TO DGND
MODE PIN CONNECTED TO DVDD
Bus input
Single-bus interleaved mode, clock and write input equal for both DACs
Dual-bus mode, DACs operate independently
7.4.1.1 Dual-Bus Data Interface and Timing
In dual-bus mode, the MODE pin is connected to DVDD. The two converter channels within the DAC5652A
consist of two independent, 10-bit, parallel data ports. Each DAC channel is controlled by its own set of write
(WRTA, WRTB) and clock (CLKA, CLKB) lines. The WRTA/B lines control the channel input latches and the
CLKA/B lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the
WRTA/B line.
The internal data transfer requires a correct sequence of write and clock inputs, since essentially two clock
domains having equal periods (but possibly different phases) are input to the DAC5652A. This is defined by a
minimum requirement of the time between the rising edge of the clock and the rising edge of the write inputs.
This essentially implies that the rising edge of CLKA/B must occur at the same time or before the rising edge of
the WRTA/B signal. A minimum delay of 2 ns must be maintained if the rising edge of the clock occurs after the
rising edge of the write. Note that these conditions are satisfied when the clock and write inputs are connected
externally. Note that all specifications were measured with the WRTA/B and CLKA/B lines connected together.
DA[9:0]/DB[9:0]
Valid Data
tsu
th
tLPH
WRTA/WRTB
CLKA/CLKB
ts
tPD
tLAT
IOUT
or
IOUT
Figure 15. Dual-Bus Mode Operation
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7.4.1.2 Single-Bus Interleaved Data Interface and Timing
In single-bus interleaved mode, the MODE pin is connected to DGND. Figure 16 shows the timing diagram. In
interleaved mode, the A- and B-channels share the write input (WRTIQ) and update clock (CLKIQ and internal
CLKDACIQ). Multiplexing logic directs the input word at the A-channel input bus to either the A-channel input
latch (SELECTIQ is high) or to the B-channel input latch (SELECTIQ is low). When SELECTIQ is high, the data
value in the B-channel latch is retained by presenting the latch output data to its input again. When SELECTIQ is
low, the data value in the A-channel latch is retained by presenting the latch output data to its input.
In interleaved mode, the A-channel input data rate is twice the update rate of the DAC core. As in dual-bus
mode, it is important to maintain a correct sequence of write and clock inputs. The edge-triggered flip-flops latch
the A- and B-channel input words on the rising edge of the write input (WRTIQ). This data is presented to the Aand B-DAC latches on the following falling edge of the write inputs. The DAC5652A clock input is divided by a
factor of two before it is presented to the DAC latches.
Correct pairing of the A- and B-channel data is done by RESETIQ. In interleaved mode, the clock input CLKIQ is
divided by two, which would translate to a non-deterministic relation between the rising edges of the CLKIQ and
CLKDACIQ. RESETIQ ensures, however, that the correct position of the rising edge of CLKDACIQ with respect
to the data at the input of the DAC latch is determined. CLKDACIQ is disabled (low) when RESETIQ is high.
DA[9:0]
Valid Data
tsu
th
SELECTIQ
WRTIQ
CLKIQ
RESETIQ
ts
tPD
tLAT
IOUT
or
IOUT
Figure 16. Single-Bus Interleaved Mode Operation
16
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7.4.2 Gain Setting Option
The full-scale output current on the DAC5652A can be set two ways: either for each of the two DAC channels
independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42)
must be low (that is, connected to AGND). In this mode, two external resistors are required — one RSET
connected to the BIASJ_A pin (pin 44) and the other to the BIASJ_B pin (pin 41). In this configuration, the user
has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the
compensation of possible gain mismatches elsewhere within the transmit signal path.
Alternatively, bringing the GSET pin high (that is, connected to AVDD), the DAC5652A switches into the
simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one
external RSET resistor connected to the BIASJ_A pin. The resistor at the BIASJ_B pin may be removed; however,
this is not required since this pin is not functional in this mode and the resistor has no effect on the gain equation.
7.4.3 Sleep Mode
The DAC5652A features a power-down function that can reduce the total supply current to approximately 3.1 mA
over the specified supply range if no clock is present. Applying a logic high to the SLEEP pin initiates powerdown mode, whereas a logic low enables normal operation. When left unconnected, an internal active pulldown
circuit enables the normal operation of the converter.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DAC5652A is a 10-bit dual DAC with max update rate of 275 MSPS. The DAC supports two different modes
of operation: dual bus and single bus. In dual-bus mode, the DAC provides two independent transmit paths that
can be programmed for two different update rates. In single-bus mode, the interleaved data for both channels are
applied at the A-channel input bus. The B-channel input bus is not used in this mode. The clock and write input
are now shared by both DACs. Thus, two different input signals can be transmitted from the two channels, but
the update rate for both channels is the same.
8.1.1 DAC Transfer Function
Each of the DACs in the DAC5652A has a set of complementary current outputs, IOUT1 and IOUT2. The fullscale output current, IOUTFS, is the summation of the two complementary output currents:
I
+I
)I
OUTFS
OUT1
OUT2
(2)
The individual output currents depend on the DAC code and can be expressed as:
I
I
OUT1
+I
OUTFS
OUT2
+I
OUTFS
Ǔ
ǒCode
1024
* CodeǓ
ǒ10231024
(3)
(4)
where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the
reference current IREF, which is determined by the reference voltage and the external setting resistor (RSET).
V
REF
I
+ 32 I
+ 32
OUTFS
REF
R
SET
(5)
In most cases, the complementary outputs drive resistive loads or a terminated transformer. A signal voltage
develops at each output according to:
V
+I
R
OUT1
OUT1
LOAD
(6)
V
+I
R
OUT2
OUT2
LOAD
(7)
The value of the load resistance is limited by the output compliance specification of the DAC5652A. To maintain
specified linearity performance, the voltage for IOUT1 and IOUT2 must not exceed the maximum allowable
compliance range.
The total differential output voltage is:
V
+V
*V
OUTDIFF
OUT1
OUT2
(2 Code * 1023)
V
+
OUTDIFF
1024
18
(8)
I
OUTFS
R
LOAD
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Application Information (continued)
8.1.1.1 Analog Outputs
The DAC5652A provides two complementary current outputs, IOUT1 and IOUT2. The simplified circuit of the
analog output stage representing the differential topology is shown in Figure 17. The output impedance of IOUT1
and IOUT2 results from the parallel combination of the differential switches, along with the current sources and
associated parasitic capacitances.
AVDD
S(1)
IOUT1
RLOAD
S(1)C
IOUT2
S(2)
S(2)C
S(N)
S(N)C
Current Source Array
RLOAD
Figure 17. Analog Outputs
The signal voltage swing that may develop at the two outputs, IOUT1 and IOUT2, is limited by a negative and
positive compliance. The negative limit of –1 V is given by the breakdown voltage of the CMOS process and
exceeding it compromises the reliability of the DAC5652A (or even causes permanent damage). With the fullscale output set to 20 mA, the positive compliance equals 1.2 V. Note that the compliance range decreases to
about 1 V for a selected output current of I(OUTFS) = 2 mA. Care must be taken that the configuration of
DAC5652A does not exceed the compliance range to avoid degradation of the distortion performance and
integral linearity.
Best distortion performance is typically achieved with the maximum full-scale output signal limited to
approximately 0.5 VPP. This is the case for a 50-Ω doubly-terminated load and a 20-mA full-scale output current.
A variety of loads can be adapted to the output of the DAC5652A by selecting a suitable transformer while
maintaining optimum voltage levels at IOUT1 and IOUT2. Furthermore, using the differential output configuration
in combination with a transformer is instrumental for achieving excellent distortion performance. Common-mode
errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with
high output frequencies.
For those applications requiring the optimum distortion and noise performance, it is recommended to select a fullscale output of 20 mA. A lower full-scale range of 2 mA may be considered for applications that require low
power consumption, but can tolerate a slight reduction in performance level.
8.1.2 Output Configurations
The current outputs of the DAC5652A allow for a variety of configurations. As mentioned previously, utilizing the
converter’s differential outputs yield the best dynamic performance. Such a differential output circuit may consist
of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most
applications with ac coupling, while op amps are suitable for a dc-coupled configuration.
The single-ended configuration may be considered for applications requiring a unipolar output voltage.
Connecting a resistor from either one of the outputs to ground converts the output current into a groundreferenced voltage signal. To improve on the dc linearity by maintaining a virtual ground, an I-to-V or op-amp
configuration may be considered.
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Application Information (continued)
8.1.3 Differential With Transformer
Using an RF transformer provides a convenient way of converting the differential output signal into a singleended signal while achieving excellent dynamic performance. The appropriate transformer must be carefully
selected based on the output frequency spectrum and impedance requirements.
The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus
improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable
impedance ratio (winding ratio) the transformer can provide optimum impedance matching while controlling the
compliance voltage for the converter outputs.
Figure 18 and Figure 19 show 50-Ω doubly-terminated transformer configurations with 1:1 and 4:1 impedance
ratios, respectively. Note that the center tap of the primary input of the transformer has to be grounded to enable
a dc-current flow. Applying a 20-mA full-scale output current would lead to a 0.5-VPP output for a 1:1 transformer
and a 1-VPP output for a 4:1 transformer. In general, the 1:1 transformer configuration has a better output
distortion, but the 4:1 transformer has 6 dB higher output power.
50 Ω
1:1
IOUT1
100 Ω
RLOAD
50 Ω
AGND
IOUT2
50 Ω
Figure 18. Driving a Doubly-Terminated 50-Ω Cable Using a 1:1 Impedance Ratio Transformer
100 Ω
4:1
IOUT1
AGND
RLOAD
50 Ω
IOUT2
100 Ω
Figure 19. Driving a Doubly-Terminated 50-Ω Cable Using a 4:1 Impedance Ratio Transformer
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Application Information (continued)
8.1.4 Single-Ended Configuration
Figure 20 shows the single-ended output configuration, where the output current IOUT1 flows into an equivalent
load resistance of 25 Ω. Node IOUT2 must be connected to AGND or terminated with a resistor of 25 Ω to
AGND. The nominal resistor load of 25 Ω gives a differential output swing of 1 VPP when applying a 20-mA fullscale output current.
IOUT1
RLOAD
50 Ω
IOUT2
50 Ω
25 Ω
AGND
Figure 20. Driving a Doubly-Terminated 50-Ω Cable Using a Single-Ended Output
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8.2 Typical Application
A typical application for the DAC5652A is a dual- or single-carrier transmitter. The DAC is provided with some
input digital baseband signal, and outputs an analog carrier. A design example for a single-carrier transmitter is
described in this section.
WRT B
WRT A
CLK B
CLK A
50
DE-MUX
14-Bit
ADC
LATCH A
1:1
Output
50
100
DA[13:0]
50
FPGA
50
DB[13:0]
14-Bit
ADC
LATCH A
1:1
Output
50
100
50
EXTIO
1.2-V Reference
0.1 …F
Figure 21. Single-Carrier Transmitter
8.2.1 Design Requirements
The requirements for this design are to generate a single WCDMA signal at an intermediate frequency of 30.72
MHz. The ACLR needs to be better than 72 dBc.
Table 2. Design Parameters
FEATURE
SPECIFICATION
Number of carriers
1
AVDD and DVDD
3.3 V
Clock rate
122.88 MSPS
Input data
WCDMA with IF at 30.72 MHz
ACPR
> 72 dB
8.2.2 Detailed Design Procedure
The single WCDMA carrier signal with an intermediate frequency (IF) of 30.72 MHz must be created in the digital
processor at a sample rate of 122.88 MSPS for the DAC. These 10-bit samples are placed on the 10-bit CMOS
input port of the DAC.
A CMOS DAC clock must be generated from a clock source at 122.88 MHz. This clock must be provided to the
CLK pin of the DAC. The IOUTA and IOUTB differential connections must be connected to a transformer in order
to provide a single-ended output. A typical 1:1 impedance transformer is used on the device EVM. The
DAC5672A evaluation module (EVM) provides a good reference for this design example.
22
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8.2.3 Application Curve
Figure 22 presents a spectrum analyzer plot shows the adjacent channel power ratio (ACPR) for the transformeroutput, single-carrier signal with an intermediate frequency of 30.72 MHz. The results meet the system
requirements for a minimum of 72-dBc ACPR.
Figure 22. ACPR Performance
9 Power Supply Recommendations
Power the device with the nominal supply voltages as indicated in the Recommended Operating Conditions.
In most instances, the best performance is achieved with LDO supplies. However, the supplies may be driven
with direct outputs from a DC/DC switcher, as long as the noise performance of the switcher is acceptable.
For best performance:
• Use at least two power layers.
• Avoid placing digital supplies and clean supplies on adjacent board layers.
• Use a ground layer between noisy and clean supplies, if possible.
• Decouple all supply pins as close to the pins as possible, using small-value capacitors, with larger, bulk
capacitors placed further away.
10 Layout
10.1 Layout Guidelines
Use the DAC5652AEVM layout as a reference to obtain the best performance. A sample layout is shown in
Figure 23 through Figure 26. Some important layout recommendations are:
1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board.
This may be virtually divided down the middle of the device package when doing placement and layout.
2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This keeps
coupling from the digital circuits to the analog outputs to a minimum.
3. Keep decoupling capacitors close to the power pins of the device.
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DAC5652A
SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
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10.2 Layout Examples
Figure 23 through Figure 26 show the layout examples.
Digital Signal
Analog Output
Digital Signal
Figure 23. Layout Example: Top Layer (Layer 1)
Figure 24. Layout Example: Single Ground Plane (Layer 2)
24
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Layout Examples (continued)
Digital Power Plane
Analog Power Plane
Figure 25. Layout Example: Power Plane (Layer 3)
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Layout Examples (continued)
Decoupling Capacitors
Figure 26. Layout Example: Bottom Layer (Layer 4)
26
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DAC5652A
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SLAS535F – SEPTEMBER 2007 – REVISED OCTOBER 2018
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
DAC5652AEVM User's Guide
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC5652AIPFB
ACTIVE
TQFP
PFB
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC5652AI
DAC5652AIPFBR
ACTIVE
TQFP
PFB
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DAC5652AI
DAC5652AIRSLR
ACTIVE
VQFN
RSL
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DA5652A
DAC5652AIRSLT
ACTIVE
VQFN
RSL
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
DA5652A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2018
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Oct-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC5652AIPFBR
TQFP
PFB
48
1000
330.0
16.4
9.6
9.6
1.5
12.0
16.0
Q2
DAC5652AIRSLR
VQFN
RSL
48
2500
330.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
DAC5652AIRSLT
VQFN
RSL
48
250
180.0
16.4
6.3
6.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Oct-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC5652AIPFBR
TQFP
PFB
48
1000
367.0
367.0
38.0
DAC5652AIRSLR
VQFN
RSL
48
2500
367.0
367.0
35.0
DAC5652AIRSLT
VQFN
RSL
48
250
210.0
185.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF019A – JANUARY 1995 – REVISED JANUARY 1998
PFB (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
36
0,08 M
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,25
0,05 MIN
0°– 7°
1,05
0,95
Seating Plane
0,75
0,45
0,08
1,20 MAX
4073176 / B 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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