Texas Instruments | AFE5832 32-Channel Ultrasound AFE With 35-mW/Channel Power, 2.1 nV/√Hz Noise, 12-Bit, 40-MSPS or 10-Bit, 50-MSPS Output, Passive CW Mixer and LVDS Interface (Rev. A) | Datasheet | Texas Instruments AFE5832 32-Channel Ultrasound AFE With 35-mW/Channel Power, 2.1 nV/√Hz Noise, 12-Bit, 40-MSPS or 10-Bit, 50-MSPS Output, Passive CW Mixer and LVDS Interface (Rev. A) Datasheet

Texas Instruments AFE5832 32-Channel Ultrasound AFE With 35-mW/Channel Power, 2.1 nV/√Hz Noise, 12-Bit, 40-MSPS or 10-Bit, 50-MSPS Output, Passive CW Mixer and LVDS Interface (Rev. A) Datasheet
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AFE5832
SBOS887A – AUGUST 2017 – REVISED APRIL 2018
AFE5832 32-Channel Ultrasound AFE With 35-mW/Channel Power,
2.1 nV/√Hz Noise, 12-Bit, 40-MSPS or 10-Bit, 50-MSPS Output, Passive CW Mixer and
LVDS Interface
1
1 Features
•
•
•
•
•
•
•
32-Channel, AFE for Ultrasound Applications:
– Input Attenuator, LNA, LPF, ADC,
and CW Mixer
– Digital Time Gain Compensation (DTGC)
– Total Gain Range: 12 dB to 51 dB
– Linear Input Range: 800 mVPP
Input Attenuator With DTGC:
– 8-dB to 0-dB Attenuation With 0.125-dB Step
– Supports Matched Impedance for:
– 50-Ω to 800-Ω Source Impedance
Low-Noise Amplifier (LNA) With DTGC:
– 20-dB to 51-dB Gain With 0.125-dB Step
– Low Input Current Noise: 1.2 pA/√Hz
3rd-Order, Linear-Phase, Low-Pass Filter (LPF):
– 5 MHz, 7.5 MHz, 10 MHz, and 12.5 MHz
16 ADCs Converting at 12-Bit, 80 MSPS or 10-bit,
100 MSPS:
– Each ADC Converts Two Sets of Inputs at Half
Rate
– 12-Bit ADC: 72-dBFS SNR
– 10-Bit ADC: 61-dBFS SNR
Optimized for Noise and Power:
– 35 mW/Ch at 2.1 nV/√Hz, 40 MSPS
– 42 mW/Ch at 1.4 nV/√Hz, 40 MSPS
– 52 mW/Ch at 1.3 nV/√Hz, 40 MSPS
– 60 mW/Ch in CW Mode
Excellent Device-to-Device Gain Matching:
– ±0.5 dB (Typical)
•
•
•
Low Harmonic Distortion: –55 dBc
Fast and Consistent Overload Recovery
Continuous Wave (CW) Path With:
– Low Close-In Phase Noise of –151 dBc/Hz
at 1-kHz Frequency Offset Off 2.5-MHz Carrier
– Phase Resolution: λ / 16
– Supports 16X CW Clock
– 12-dB Suppression on Third and Fifth
Harmonics
LVDS Interface With a Speed Up to 1 Gbps
Small Package: 15-mm × 15-mm NFBGA-289
•
•
2 Applications
•
•
•
•
Medical Ultrasound Imaging
Nondestructive Evaluation Equipment
Sonar Imaging Equipment
Multichannel, High-Speed Data Acquisition
3 Description
The AFE5832 device is a highly-integrated, analog
front-end solution specifically designed for ultrasound
systems where high performance, low power, and
small size are required.
Device Information(1)
PART NUMBER
AFE5832
PACKAGE
NFBGA (289)
BODY SIZE (NOM)
15.00 mm × 15.00 mm
(1) For all available packages, see the package option addendum
at the end of the datasheet.
Simplified Block Diagram
SPI IN
SPI Logic
INP
ATTEN
8 dB
to
0 dB
3rd-Order LPF with
5 MHz, 7.5 MHz,
10 MHz, and 12.5 MHz
LNA
20 dB to
51 dB
10- or
12-Bit
ADC
Digital
Processing
LVDS
INM
Cross-Point
Switch
TGC Control
Signals
CW Mixer
Reference
DTGC Engine
16-Phase
Generator
CW Clocks
CW Current Outputs
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE5832
SBOS887A – AUGUST 2017 – REVISED APRIL 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Device and Documentation Support....................
1
1
1
2
3
4
6.1 Documentation Support ............................................ 4
6.2
6.3
6.4
6.5
6.6
7
Receiving Notification of Documentation Updates....
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
4
4
4
Mechanical, Packaging, and Orderable
Information ............................................................. 5
7.1 Tray Information ........................................................ 6
4 Revision History
Changes from Original (August 2017) to Revision A
Page
•
Changed Power and Noise values in the Title ...................................................................................................................... 1
•
Added values for Ultra low-power mode in Features section ................................................................................................ 1
2
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5 Description (continued)
The AFE5832 is an integrated analog front-end (AFE) optimized for medical ultrasound application. The device is
realized through a multichip module (MCM) with three dies: two voltage-controlled amplifier (VCA) dies and one
analog-to-digital converter (ADC) die. Each VCA die has 16 channels and the ADC die converts all of the 32
channels.
Each channel in the VCA die is configured in either of two modes: time gain compensation (TGC) mode or
continuous wave (CW) mode. In TGC mode, each channel includes an input attenuator (ATTEN), a low-noise
amplifier (LNA) with variable-gain, and a third-order, low-pass filter (LPF). The attenuator supports an attenuation
range of 8 dB to 0 dB, and the LNA supports gain ranges from 20 dB to 51 dB. The LPF cutoff frequency can be
configured at 5 MHz, 7.5 MHz, 10 MHz, or 12.5 MHz to support ultrasound applications with different
frequencies. In CW mode, each channel includes an LNA with a fixed gain of 18 dB, and a low-power passive
mixer with 16 selectable phase delays. Different phase delays can be applied to each analog input signal to
perform an on-chip beamforming operation. A harmonic filter in the CW mixer suppresses the third and fifth
harmonic to enhance the sensitivity of the CW Doppler measurement.
The ADC die has 16 physical ADCs. Each ADC converts two sets of outputs – one from each VCA die. The ADC
is configured to operate with a resolution of 12 bits or 10 bits. The ADC resolution can be traded off with
conversion rate, and operates at maximum speeds of 80 MSPS and 100 MSPS at 12-bit and 10-bit resolution,
respectively. The ADC is designed to scale its power with sampling rate. The output interface of the ADC comes
out through a low-voltage differential signaling (LVDS) which can easily interface with low-cost fieldprogrammable gate arrays (FPGAs).
The AFE5832 also allows various power and noise combinations to be selected for optimizing system
performance. Therefore, this device is a suitable ultrasound AFE solution for systems with strict battery-life
requirements.
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AFE5832
SBOS887A – AUGUST 2017 – REVISED APRIL 2018
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6 Device and Documentation Support
6.1 Documentation Support
6.1.1 Related Documentation
For related documentation see the following:
• AFE5818 16-Channel, Ultrasound, Analog Front-End with 140-mW/Channel Power, 0.75-nV/√Hz Noise, 14Bit, 65-MSPS or 12-Bit, 80-MSPS ADC, and Passive CW Mixer
• ADS8413 16-BIT, 2-MSPS, LVDS SERIAL INTERFACE, SAR ANALOG-TO-DIGITAL CONVERTER
• ADS8472 16-BIT, 1-MSPS, PSEUDO-BIPOLAR, FULLY DIFFERENTIAL INPUT, MICROPOWER
SAMPLING ANALOG-TO-DIGITAL CONVERTER WITH PARALLEL INTERFACE, REFERENCE
• CDCE72010 Ten Output High Performance Clock Synchronizer, Jitter Cleaner, and Clock Distributor
• CDCM7005 3.3-V High Performance Clock Synchronizer and Jitter Cleaner
• ISO724x High-Speed, Quad-Channel Digital Isolators
• LMK0480x Low-Noise Clock Jitter Cleaner with Dual Loop PLLs
• OPA1632 High-Performance, Fully-Differential Audio Operational Amplifier
• OPA2x11 1.1-nv/√Hz Noise, Low Power, Precision Operational Amplifier
• SN74AUP1T04 LOW POWER, 1.8/2.5/3.3-V INPUT, 3.3-V CMOS OUTPUT, SINGLE INVERTER GATE
• THS413x High-Speed, Low-Noise, Fully-Differential I/O Amplifiers
• MicroStar BGA Packaging Reference Guide
6.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
6.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
4
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7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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5
AFE5832
SBOS887A – AUGUST 2017 – REVISED APRIL 2018
www.ti.com
7.1 Tray Information
Figure 1. Tray Diagram, Section 1
6
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AFE5832
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Tray Information (continued)
Figure 2. Tray Diagram, Section 2
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7
PACKAGE OPTION ADDENDUM
www.ti.com
20-Apr-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
AFE5832ZBV
ACTIVE
Package Type Package Pins Package
Drawing
Qty
NFBGA
ZBV
289
126
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
0 to 85
AFE5832
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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