Texas Instruments | DDC1128 128-Channel, Current-Input Analog-to-Digital Converter (Rev. A) | Datasheet | Texas Instruments DDC1128 128-Channel, Current-Input Analog-to-Digital Converter (Rev. A) Datasheet

Texas Instruments DDC1128 128-Channel, Current-Input Analog-to-Digital Converter (Rev. A) Datasheet
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DDC1128
SLASE36A – MARCH 2014 – REVISED MAY 2016
DDC1128 128-Channel, Current-Input Analog-to-Digital Converter
1 Features
3 Description
•
The DDC1128 is a 20-bit, 128-channel, current-input
analog-to-digital (A/D) converter. It combines both
current-to-voltage and A/D conversion so that 128
separate low-level current output devices, such as
photodiodes, can be directly connected to its inputs
and digitized.
1
•
•
•
•
•
•
•
•
•
Single-Chip Solution to Directly Measure
128 Low-Level Currents
Proven High-Precision, True Integrating
Architecture with 100% Charge Collection
Easy Upgrade for Existing DDC Family
Applications
Low Power: 3 mW/channel at 3 kSPS
Extremely Linear:
INL = ±0.025% of Reading ±1 ppm of FSR
Low Noise: 6.3 ppm of FSR
Adjustable Full-Scale Range
Adjustable Speed
– Data Rates up to 6 kSPS with 20-bit
Performance
– Integration Times as low as 160 μs
Daisy-Chainable Serial Interface
In-Package Bypass Capacitors Simplify PCB
Design Area and Design Complexity
For each of the 128 inputs, the DDC1128 uses the
proven dual switched integrator front-end. This
configuration
allows
for
continuous
current
integration: while one integrator is being digitized by
the onboard A/D converter, the other is integrating
the input current. This architecture provides both a
stable offset and a loss-less collection of the input
current. Adjustable integration times range from
160μs to 1s, allowing currents from fAs to μAs to be
continuously measured with outstanding precision.
The DDC1128 has a serial interface designed for
daisy-chaining in multi-device systems. Simply
connect the output of one device to the input of the
next to create the chain. Common clocking feeds all
the devices in the chain so that the digital overhead
in a multi-DDC1128 system is minimal.
2 Applications
•
•
•
The DDC1128 operates from a +5 V analog supply
and a 2.7 V to 3.6 V digital supply, it is specified from
0°C to 70°C operating temperature and it is available
in a 9 x 9 mm2 192-ball BGA, which includes on
board bypass capacitors to help minimize the external
component requirements and further reduce board
space.
CT Scanner DAS
Photodiode Sensors
X-Ray Detection Systems
To request a full data sheet or other design
resources: request DDC1128
Device Information
ORDER NUMBER
PACKAGE
BODY SIZE
DDC1128
NFBGA (192)
9.00 mm x 9.00 mm
SPACER
Simplified Schematic
REF3040 OPA350
VREF
Buffer
AVDD
DVDD
VREF
IN1
Configuration
and
Control
CLK
CONV
DIN_CFG
CLK_CFG
RESET
To/From
Controller
DVALID
Serial
Interface
DCLK
DIN
DOUT
IN128
DDC1128
QGND
AGND DGND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DDC1128
SLASE36A – MARCH 2014 – REVISED MAY 2016
www.ti.com
4 Revision History
Changes from Original (March 2014) to Revision A
•
2
Page
Added link to request full data sheet ...................................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
Product Folder Links: DDC1128
DDC1128
www.ti.com
SLASE36A – MARCH 2014 – REVISED MAY 2016
5 Device and Documentation Support
5.1 Trademarks
All trademarks are the property of their respective owners.
5.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
Product Folder Links: DDC1128
3
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DDC1128ZKLR
ACTIVE
NFBGA
ZKL
192
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC1128
DDC1128ZKLT
ACTIVE
NFBGA
ZKL
192
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC1128
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DDC1128ZKLR
NFBGA
ZKL
192
1000
330.0
16.4
9.3
9.3
2.15
12.0
16.0
Q1
DDC1128ZKLT
NFBGA
ZKL
192
250
180.0
16.4
9.3
9.3
2.15
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DDC1128ZKLR
NFBGA
ZKL
192
1000
350.0
350.0
43.0
DDC1128ZKLT
NFBGA
ZKL
192
250
213.0
191.0
55.0
Pack Materials-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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