Texas Instruments | AFE58JD16 16-Channel Ultrasound AFE with 90-mW/Channel Power, 1-nV/√Hz Noise, 14-Bit, 65-MSPS or 12-Bit, 80-MSPS ADC and Passive CW Mixer (Rev. A) | Datasheet | Texas Instruments AFE58JD16 16-Channel Ultrasound AFE with 90-mW/Channel Power, 1-nV/√Hz Noise, 14-Bit, 65-MSPS or 12-Bit, 80-MSPS ADC and Passive CW Mixer (Rev. A) Datasheet

Texas Instruments AFE58JD16 16-Channel Ultrasound AFE with 90-mW/Channel Power, 1-nV/√Hz Noise, 14-Bit, 65-MSPS or 12-Bit, 80-MSPS ADC and Passive CW Mixer (Rev. A) Datasheet
Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
AFE58JD16
SBAS737A – AUGUST 2015 – REVISED MAY 2016
AFE58JD16 16-Channel Ultrasound AFE with 90-mW/Channel Power,
1-nV/√Hz Noise, 14-Bit, 65-MSPS or 12-Bit, 80-MSPS ADC and Passive CW Mixer
1
1 Features
•
•
•
•
•
•
•
•
•
•
•
16-Channel, AFE for Ultrasound Applications:
– Input Attenuator, LNA, LPF, ADC, and
CW Mixer
– Digital Time Gain Compensation (DTGC)
– Total Gain Range: 6 dB to 45 dB
– Linear Input Range: 1 VPP
Input Attenuator with DTGC:
– 8-dB to 0-dB Attenuation with 0.125-dB Step
– Supports Matched Impedance for:
– 50-Ω to 800-Ω Source Impedance
Low-Noise Amplifier (LNA) with DTGC:
– 14-dB to 45-dB Gain with 0.125-dB Step
– Low Input Current Noise: 1.2 pA/√Hz
3rd-Order, Linear-Phase, Low-Pass Filter (LPF):
– 10 MHz, 15 MHz, 20 MHz, and 25 MHz
Analog-to-Digital Converter (ADC):
– 14-Bit ADC: 75-dBFS SNR at 65 MSPS
– 12-Bit ADC: 72-dBFS SNR at 80 MSPS
LVDS Interface with a Maximum Speed Up to
1 GBPS
Optimized for Noise and Power:
– 90 mW/Ch at 1 nV/√Hz, 65 MSPS
– 55 mW/Ch at 1.45 nV/√Hz, 40 MSPS
– 59 mW/Ch in CW Mode
Excellent Device-to-Device Gain Matching:
– ±0.5 dB (Typical)
Low Harmonic Distortion: –60-dBc Level
Fast and Consistent Overload Recovery
Continuous Wave (CW) Path with:
•
•
•
– Low Close-In Phase Noise of –148 dBc/Hz
at 1-kHz frequency
– Phase Resolution: λ / 16
– Supports 16X, 8X, 4X, and 1X CW Clocks
Digital Features:
– Digital I/Q Demodulator after ADC:
– Fractional Decimation Filter M = 1 to 63
with 0.25X Increment Step
– Data Throughput Reduction After
Decimation
– On-Chip RAM with 32 Preset Profiles
5-Gbps JESD Interface:
– JESD204B Subclass 0, 1, and 2
– 2, 4, or 8 Channels per JESD Lane
Small Package: 15-mm × 15-mm NFBGA-289
2 Applications
•
•
•
•
Medical Ultrasound Imaging
Nondestructive Evaluation Equipment
Sonar Imaging Equipment
Multichannel, High-Speed Data Acquisition
3 Description
The AFE58JD16 is a highly-integrated, analog frontend (AFE) solution specifically designed for
ultrasound systems where high performance, low
power, and small size are required.
To request a full datasheet or other design resources:
request AFE58JD16
Device Information(1)
PART NUMBER
AFE58JD16
PACKAGE
nFBGA (289)
BODY SIZE (NOM)
15.00 mm × 15.00 mm
(1) For all available packages, see the package option addendum
at the end of the datasheet.
Simplified Block Diagram
SPI IN
SPI Logic
INP
ATTEN
8 dB
to
0 dB
3rd-Order LPF with
10 MHz, 15 MHz,
20 MHz, and 25 MHz
LNA
14 dB to
45 dB
12- or
14-Bit
ADC
Digital
Processing and
Demodulator
LVDS
or
JESD
INM
1 of 16 Channels
16 x 16
Cross-Point
Switch
TGC Control
Signals
CW Mixer
Reference
DTGC Engine
16-Phase
Generator
CW Clocks
CW Current Outputs
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE58JD16
SBAS737A – AUGUST 2015 – REVISED MAY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Device and Documentation Support....................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
7
Documentation Support ...........................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
4
4
Mechanical, Packaging, and Orderable
Information ............................................................. 4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (August 2015) to Revision A
•
2
Page
Added link to request full data sheet ...................................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
AFE58JD16
www.ti.com
SBAS737A – AUGUST 2015 – REVISED MAY 2016
5 Description (continued)
The AFE58JD16 is an integrated analog front-end (AFE) optimized for medical ultrasound application. The
AFE58JD16 is a multichip module (MCM) device with two dies: VCA and ADC_CONV. Each die has total of 16
channels.
Each channel in the VCA die can be configured in two modes: time gain compensation (TGC) mode and
continuous wave (CW) mode. In TGC mode, each channel includes an input attenuator (ATTEN), a low-noise
amplifier (LNA) with variable-gain, and a third-order, low-pass filter (LPF). The attenuator supports an attenuation
range of 8 dB to 0 dB, and the LNA supports gain ranges from 14 dB to 45 dB. The LPF cutoff frequency can be
configured at 10 MHz, 15 MHz, 20 MHz, or 25 MHz to support ultrasound applications with different frequencies.
In CW mode, each channel includes an LNA with a fixed gain of 18 dB, and a low-power passive mixer with 16
selectable phase delays. Different phase delays can be applied to each analog input signal to perform an on-chip
beamforming operation. A harmonic filter in the CW mixer suppresses the third and fifth harmonic to enhance the
sensitivity of the CW Doppler measurement. CW mode supports three clock modes: 16X, 8X, and 4X.
Each channel of the ADC_CONV die has a high-performance analog-to-digital converter (ADC) with a
programmable resolution of 14 bits or 12 bits. The ADC achieves 75-dBFS signal-to-noise ratio (SNR) in 14-bit
mode, and 72-dBFS SNR in 12-bit mode. This ADC provides excellent SNR at low-channel gain. The devices
operate at maximum speeds of 65 MSPS and 80 MSPS, providing 14-bit and 12-bit output, respectively. The
ADC is designed to scale power with sampling rate. The output interface of the ADC is a low-voltage differential
signaling (LVDS) or JESD interface that can easily interface with low-cost field-programmable gate arrays
(FPGAs).
The AFE58JD16 includes an optional digital demodulator and JESD204B data packing blocks after the 12- or 14bit ADC. The digital in-phase and quadrature (I/Q) demodulator with programmable fractional decimation filters
accelerates computationally-intensive algorithms at low power. The device also supports an optional JESD204B
interface that runs up to 5 Gbps and further reduces the circuit-board routing challenges in high-channel count
systems.
The AFE58JD16 also allows various power and noise combinations to be selected for optimizing system
performance. Therefore, these devices are suitable ultrasound AFE solutions for systems with strict battery-life
requirements. The AFE58JD16 is available in a 15-mm × 15-mm NFBGA-289 package (ZAV package, S-PBGAN289) and is specified for operation from –40°C to +85°C. The device pinout is also similar to the AFE5818
family.
Copyright © 2015–2016, Texas Instruments Incorporated
Submit Documentation Feedback
3
AFE58JD16
SBAS737A – AUGUST 2015 – REVISED MAY 2016
www.ti.com
6 Device and Documentation Support
6.1 Documentation Support
6.1.1 Related Documentation
AFE5818 Data Sheet, SBAS687
ADS8413 Data Sheet, SLAS490
ADS8472 Data Sheet, SLAS514
CDCE72010 Data Sheet, SCAS858
CDCM7005 Data Sheet, SCAS793
ISO7240 Data Sheet, SLLS868
LMK04803 Data Sheet, SNAS489
OPA1632 Data Sheet, SBOS286
OPA2211 Data Sheet, SBOS377
SN74AUP1T04 Data Sheet, SCES800
THS4130 Data Sheet, SLOS318
MicroStar BGA Packaging Reference Guide, SSYZ015
WEBENCH® Filter Designer
6.2 Trademarks
All trademarks are the property of their respective owners.
6.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
6.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
4
Submit Documentation Feedback
Copyright © 2015–2016, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
AFE58JD16ZAV
ACTIVE
Package Type Package Pins Package
Drawing
Qty
NFBGA
ZAV
289
126
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
AFE58JD16
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising