Texas Instruments | AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors (Rev. D) | Datasheet | Texas Instruments AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors (Rev. D) Datasheet

Texas Instruments AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors (Rev. D) Datasheet
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AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
AFE1256 256-Channel, Analog Front-End for Digital X-Ray, Flat-Panel Detectors
1 Features
•
•
•
•
•
1
•
•
•
•
2 Application
Flat-Panel, X-Ray Detector
256 Channels
On-Chip, 16-Bit ADC
Photodiode Short Immunity
Column Short Immunity
High Performance:
– Noise: 758 e-RMS with 28-pF Sensor
Capacitor in 1.2-pC Range
– Integral Nonlinearity:
±2 LSB with Internal 16-Bit ADC
– Minimum Scan Time:
– 37.9 µs in Normal Mode
– 20 µs in 2x Binning Mode
Integration:
– Eight Selectable Full-Scale Ranges:
0.15 pC (Min) to 9.6 pC (Max)
– Built-In Correlated Double Sampler
– 2x Binning (Averages Charge of Two Adjacent
Channels) for Faster Throughput
– Pipelined Integrate and Read: Allows Data
Read During Integration
Flexibility:
– Electron and Hole Integration
Low Power:
– 2.9 mW/Ch with ADC
– 2.3 mW/Ch without ADC
– 0.1 mW/Ch in Nap Mode
– Total Power-Down Feature
22-mm × 5-mm Gold-Bump Die,
Suitable for TCP and COF
3 Description
The AFE1256 is a 256-channel, analog front-end
(AFE) designed to suit the requirements of flat-panel
detectors (FPDs) based on digital X-ray systems. The
device includes 256 integrators, a programmable gain
amplifier (PGA) for full-scale, charge-level selection, a
correlated double sampler (CDS) with dual banking,
256:4 analog multiplexers, and four 16-bit,
successive-approximation register (SAR) analog-todigital converters (ADCs) onboard. Serial data from
the ADCs are available in SPI™ format.
Hardware-selectable integration polarity allows for the
integration of positive or negative charge and
provides more flexibility in system design. The Nap
feature enables substantial power saving. This power
savings is especially useful in battery-powered
systems.
The device is available as a 22-mm × 5-mm goldbumped die and a 38-mm × 28-mm, COF-314 TDS
package in singulated forms.
To request a full data sheet or other design
resources: request AFE1256
Device Information(1)
ORDER NUMBER
PACKAGE
BODY SIZE
AFE1256GBTD
Gold-bump die (533)
22 mm × 5 mm
AFE1256TDS
COF (314)
38 mm × 28 mm
(1) For all available packages, see the package option addendum
at the end of the data sheet.
(2) Product-preview device.
space
AFE1256 Schematic
REFP, REFM
Integrators and
CDS
Mux
16-Bit
ADC[3:0]
ADC
ADC
ADC
TFT Switch
Pixel
Capacitor
[255:0]
Device
Reference
Voltage
SPI
Interface
SDO[3:0]
[255:0]
Timing and Control
STI, CLK, A_BZ, RST, IRST, SHR, SHS, LPF_ON
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
Table of Contents
1
2
3
4
5
Features ..................................................................
Application .............................................................
Description .............................................................
Revision History.....................................................
Device and Documentation Support....................
1
1
1
2
3
5.1 Trademarks ............................................................... 3
5.2 Electrostatic Discharge Caution ................................ 3
5.3 Glossary .................................................................... 3
6
Mechanical, Packaging, and Orderable
Information ............................................................. 3
6.1 Tray Dimensions ....................................................... 4
6.2 GBTD Die.................................................................. 5
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (August 2015) to Revision D
•
Page
Added link to request full data sheet ...................................................................................................................................... 1
Changes from Revision B (April 2014) to Revision C
Page
•
Changed document status from Mixed to Production Data ................................................................................................... 1
•
Deleted TDQ package from document ................................................................................................................................... 1
•
Changed last paragraph of Description section .................................................................................................................... 1
•
Deleted second row from Device Information table ............................................................................................................... 1
•
Changed Tray Dimensions section: deleted Figure 1 ........................................................................................................... 4
Changes from Revision A (March 2014) to Revision B
•
Changed TDS package to Production Data .......................................................................................................................... 1
Changes from Original (October 2013) to Revision A
•
2
Page
Page
Made changes to product preview data sheet ...................................................................................................................... 1
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
5 Device and Documentation Support
5.1 Trademarks
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
5.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
5.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
3
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
6.1 Tray Dimensions
Tray dimensions for the TDS package is shown in Figure 1.
Figure 1. TDS Tray Dimensions
4
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
6.2 GBTD Die
Figure 2 does not take into account the scribe seal.
Figure 2. GBTD Die Mechanical Data
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
5
AFE1256
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
www.ti.com
GBTD Die (continued)
Figure 3 provides the tray dimensions for the GBTD die.
Figure 3. GBTD Die Tray Dimension Details
6
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
AFE1256
www.ti.com
SBAS630D – OCTOBER 2013 – REVISED MAY 2016
GBTD Die (continued)
Dies are placed active side up (bumps up) into waffle pack. The waffle pack notch is at the upper right, as shown
in Figure 4.
Figure 4. GBTD Die, Pin 1 Location
Submit Documentation Feedback
Copyright © 2013–2016, Texas Instruments Incorporated
Product Folder Links: AFE1256
7
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
AFE1256GBTD
ACTIVE
AFE1256TDS
ACTIVE
Package Type Package Pins Package
Drawing
Qty
COF
TDS
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
0
39
Green (RoHS
& no Sb/Br)
AU
Level-1-260C-UNLIM
0 to 85
AFE1256
314
35
Green (RoHS
& no Sb/Br)
AU
Level-1-260C-UNLIM
0 to 85
AFE1256TDS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-May-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
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