Texas Instruments | ADS131E08S Eight-Channel, 24-Bit, Analog Front-End with Fast Power-Up Time (Rev. A) | Datasheet | Texas Instruments ADS131E08S Eight-Channel, 24-Bit, Analog Front-End with Fast Power-Up Time (Rev. A) Datasheet

Texas Instruments ADS131E08S Eight-Channel, 24-Bit, Analog Front-End with Fast Power-Up Time (Rev. A) Datasheet
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ADS131E08S
SBAS705A – JUNE 2015 – REVISED JANUARY 2016
ADS131E08S Eight-Channel, 24-Bit, Analog Front-End with Fast Power-Up Time
1 Features
3 Description
•
•
•
The ADS131E08S is a multichannel, simultaneous
sampling, 24-bit, delta-sigma (ΔΣ), analog-to-digital
converter (ADC) with built-in programmable gain
amplifiers (PGAs), an internal reference, and an
internal oscillator. The ADC wide dynamic range,
scalable data rates, and internal fault detect monitors
make the ADS131E08S very attractive in industrial
power
monitoring,
control,
and
protection
applications. Fast power-up time allows data to be
available within 3 ms of power being applied to the
device for line-powered power applications. True
high-impedance inputs enable the ADS131E08S to
directly interface with a resistor-divider network or a
voltage transformer to measure line voltage, or a
current transformer or Rogowski coil to measure line
current. With high integration levels and exceptional
performance, the ADS131E08S enables the creation
of scalable industrial power systems at a significantly
reduced size, power, and overall cost.
Power-Up Time: 3 ms
Eight Differential Simultaneous Sampling Inputs
High Performance:
– Dynamic Range at 1 kSPS: 118 dB
– Crosstalk: –125 dB
– THD: –100 dB at 50 Hz and 60 Hz
Low Power Consumption: 2 mW/Channel
Data Rates: 1, 2, 4, 8, 16, 32, and 64 kSPS
Gain Options: 1, 2, 4, 8, and 12
Internal Voltage Reference: 8 ppm/°C Drift
Supply Range:
– Analog:
– 2.7 V to 5.25 V (Unipolar)
– ±2.5 V (Bipolar)
– Digital: 1.7 V to 3.6 V
Fault Detection and Device Self-Testing Capability
SPI™ Compatible Data Interface and Four GPIOs
Package: 64-Pin TQFP
Operating Temperature Range: –40°C to +105°C
1
•
•
•
•
•
•
•
•
•
2 Applications
•
Industrial Power Applications:
– Circuit Breakers, Protection Relays, Power
Monitoring
Data Acquisition Systems
•
Power Application: Three-Phase Voltage and
Current Connection
Current
Sensing
Channel 1
PGA
û
ADC
Voltage
Sensing
Channel 2
PGA
û
ADC
Current
Sensing
Channel 3
PGA
û
ADC
Channel 4
PGA
û
ADC
Line A
Line B
Voltage
Sensing
EMI
Filters
and
Input
MUX
Device
Voltage
Reference
The complete analog front-end (AFE) solution is
available in a 64-pin TQFP package and is specified
over the industrial temperature range of –40°C to
+105°C.
Device Information(1)
PART
NUMBER
ADS131E08S
PACKAGE
TQFP (64)
BODY SIZE (NOM)
10.00 mm × 10.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Oscillator
Control
and
SPI Interface
Channel 5
PGA
û
ADC
Voltage
Sensing
Channel 6
PGA
û
ADC
Fault
Detection
Current
Sensing
Channel 7
PGA
û
ADC
Test
Channel 8
PGA
û
ADC
Current
Sensing
The ADS131E08S has an individual input multiplexer
per channel that can be independently connected to
the internally-generated signals for test, temperature,
and fault detection. Fault detection can be
implemented internal to the device, using the
integrated
comparators
with
digital-to-analog
converter (DAC)-controlled trigger levels. The
ADS131E08S can operate at data rates as high as
64 kSPS.
Line C
Line N
Voltage
Sensing
Op
Amp
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
ADS131E08S
SBAS705A – JUNE 2015 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Device Comparison ...............................................
Pin Configuration and Functions .........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
1
1
1
2
3
3
5
Absolute Maximum Ratings ...................................... 5
ESD Ratings.............................................................. 5
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 6
Electrical Characteristics........................................... 7
Timing Requirements ................................................ 9
Switching Characteristics .......................................... 9
Typical Characteristics ............................................ 10
8
Parameter Measurement Information ................ 13
9
Detailed Description ............................................ 14
8.1 Noise Measurements .............................................. 13
9.1
9.2
9.3
9.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description ................................................
Device Functional Modes........................................
14
15
16
25
9.5 Programming........................................................... 27
9.6 Register Map........................................................... 36
10 Application and Implementation........................ 46
10.1 Application Information.......................................... 46
10.2 Typical Application ................................................ 53
10.3 Initialization Set Up .............................................. 57
11 Power Supply Recommendations ..................... 58
11.1
11.2
11.3
11.4
Power-Up Timing .................................................. 58
Recommended External Capacitor Values ........... 59
Device Connections for Unipolar Power Supplies 59
Device Connections for Bipolar Power Supplies .. 60
12 Layout................................................................... 61
12.1 Layout Guidelines ................................................. 61
12.2 Layout Example .................................................... 62
13 Device and Documentation Support ................. 63
13.1
13.2
13.3
13.4
13.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
63
63
63
63
63
14 Mechanical, Packaging, and Orderable
Information ........................................................... 63
4 Revision History
Changes from Original (October 2015) to Revision A
•
2
Page
Released to production .......................................................................................................................................................... 1
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5 Device Comparison
PRODUCT
# OF INPUTS
REFERENCE OPTIONS
RESOLUTION (Bits)
POWER-UP TIME (ms)
ADS130E08
8
Internal, external
16
128
ADS131E04
4
Internal, external
24
128
ADS131E06
6
Internal, external
24
128
ADS131E08
8
Internal, external
24
128
ADS131E08S
8
Internal only
24
3
6 Pin Configuration and Functions
59 DGND
50 DVDD
51 DGND
52 CLKSEL
53 AVSS1
54 AVDD1
55 VCAP3
56 AVDD
57 AVSS
58 AVSS
59 AVDD
60 OPAMPP
61 OPAMPN
62 NC
63 OPAMPOUT
64 NC
PAG Package
64-Pin TQFP
Top View
IN8N
1
48 DVDD
IN8P
2
47 DRDY
IN7N
3
46 GPIO4
IN7P
4
45 GPIO3
IN6N
5
44 GPIO2
IN6P
6
43 DOUT
IN5N
7
42 GPIO1
IN5P
8
41 DAISY_IN
IN4N
9
40 SCLK
AVSS 32
RESV1 31
VCAP2 30
33 DGND
NC 29
IN1P 16
VCAP1 28
34 DIN
NC 27
IN1N 15
VCAP4 26
35 PWDN
VREFN 25
IN2P 14
VREFP 24
36 RESET
AVSS 23
IN2N 13
AVDD 22
37 CLK
AVDD 21
IN3P 12
AVSS 20
38 START
AVDD 19
IN3N 11
TESTN 18
39 CS
TESTP 17
IN4P 10
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Pin Functions
PIN
NAME
NO.
FUNCTION
AVDD
19, 21, 22,
56, 59
Supply
Analog supply; decouple each AVDD pin to AVSS with a 1-µF capacitor
AVDD1
54
Supply
Charge pump analog supply; decouple AVDD1 to AVSS1 with a 1-µF capacitor
AVSS
20, 23, 32,
57, 58
Supply
Analog ground
AVSS1
53
Supply
Charge pump analog ground; decouple AVDD1 to AVSS1 with a 1-µF capacitor
CS
39
Digital input
Serial peripheral interface (SPI) chip select; active low
CLK
37
Digital input
Master clock input; connect to DGND if unused
CLKSEL
52
Digital input
Master clock select
Daisy-chain input; connect to DGND if unused
DAISY_IN
DESCRIPTION
41
Digital input
33, 49, 51
Supply
Digital ground
DIN
34
Digital input
SPI data input
DOUT
43
Digital output
SPI data output
DRDY
47
Digital output
Data ready; active low; connect to DGND with a 10-kΩ resistor if unused
DVDD
48, 50
Supply
GPIO1
42
Digital input/output
General-purpose input/output pin 1; connect to DGND with a 10-kΩ resistor if
unused
GPIO2
44
Digital input/output
General-purpose input/output pin 2; connect to DGND with a 10-kΩ resistor if
unused
GPIO3
45
Digital input/output
General-purpose input/output pin 3; connect to DGND with a 10-kΩ resistor if
unused
GPIO4
46
Digital input/output
General-purpose input/output pin 4; connect to DGND with a 10-kΩ resistor if
unused
IN1N (1)
15
Analog input
Negative analog input 1
IN1P (1)
16
Analog input
Positive analog input 1
IN2N (1)
13
Analog input
Negative analog input 2
IN2P (1)
14
Analog input
Positive analog input 2
(1)
11
Analog input
Negative analog input 3
IN3P (1)
12
Analog input
Positive analog input 3
IN4N (1)
9
Analog input
Negative analog input 4
DGND
IN3N
IN4P
(1)
Digital power supply; decouple each DVDD pin to DGND with a 1-µF capacitor
10
Analog input
Positive analog input 4
IN5N (1)
7
Analog input
Negative analog input 5
IN5P (1)
8
Analog input
Positive analog input 5
(1)
5
Analog input
Negative analog input 6
IN6P (1)
6
Analog input
Positive analog input 6
IN7N (1)
3
Analog input
Negative analog input 7
IN7P (1)
4
Analog input
Positive analog input 7
(1)
1
Analog input
Negative analog input 8
IN8P (1)
2
Analog input
Positive analog input 8
27, 29, 62,
64
—
IN6N
IN8N
NC
No connection, leave floating; can be connected to AVDD or AVSS with a 10-kΩ
or higher resistor
OPAMPN
61
Analog input
OPAMPOUT
63
Analog output
OPAMPP
60
Analog input
Op amp noninverting input; leave floating if unused and power-down the op amp
PWDN
35
Digital input
Power-down; active low
RESET
36
Digital input
System reset; active low
RESV1
31
Digital input
Reserved for future use; must tie to logic low; connect to DGND
SCLK
40
Digital input
SPI clock
(1)
4
Op amp inverting input; leave floating if unused and power-down the op amp
Op amp output; leave floating if unused and power-down the op amp
Connect any unused or powered down analog input pins to AVDD.
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Pin Functions (continued)
PIN
NAME
NO.
FUNCTION
DESCRIPTION
START
38
Digital input
TESTN (1)
18
Analog input/output
Start conversion
Test signal, negative pin; connect to DGND with a 10-kΩ resistor if unused
TESTP (1)
17
Analog input/output
Test signal, positive pin; connect to DGND with a 10-kΩ resistor if unused
VCAP1
28
Analog output
Analog bypass capacitor; connect a 470-pF capacitor to AVSS
VCAP2
30
Analog output
Analog bypass capacitor; connect a 270-nF capacitor to AVSS
VCAP3
55
Analog output
Analog bypass capacitor; connect a 270-nF capacitor to AVSS
VCAP4
26
Analog output
Analog bypass capacitor; connect a 270-nF capacitor to AVSS
VREFN
25
Analog input
VREFP
24
Analog output
Negative reference voltage; connect to AVSS
Positive reference voltage output; connect a 330-nF capacitor to VREFN
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
AVDD to AVSS
–0.3
5.5
V
DVDD to DGND
–0.3
3.9
V
AVSS to DGND
–3.0
0.2
V
Analog input voltage
AVSS – 0.3
AVDD + 0.3
V
Digital input voltage
DGND – 0.3
DVDD + 0.3
V
Digital output voltage
DGND – 0.3
DVDD + 0.3
V
Continuous input current to any pin except supply pins (2)
–10
10
mA
Junction temperature, TJ
–40
150
°C
Storage temperature, Tstg
–60
150
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Input pins are diode-clamped to the power-supply rails. Input signals that can swing beyond the supply rails must be current limited to 10
mA or less.
7.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±500
UNIT
V
JEDEC document JEP155 states that 500 V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250 V CDM allows safe manufacturing with a standard ESD control process.
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7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
POWER SUPPLY
AVDD
Analog power supply
AVDD to AVSS
2.7
5.0
5.25
V
DVDD
Digital power supply
DVDD to DGND
1.7
1.8
3.6
V
Analog to digital supply
AVDD to DVDD
–2.1
3.6
V
–VREF / Gain
VREF / Gain
V
ANALOG INPUTS
VIN
Differential input voltage
VIN = V(AINP) – V(AINN)
VCM
Common-mode input voltage
VCM = (V(AINP) – V(AINN)) / 2
See the Input Common-Mode Range section
V
VOLTAGE REFERENCE INPUTS
REFN
Negative reference input
AVSS
V
EXTERNAL CLOCK SOURCE
fCLK
Master clock rate
CLKSEL pin = 0,
(AVDD – AVSS) = 3 V
1.7
2.048
2.25
CLKSEL pin = 0,
(AVDD – AVSS) = 5 V
1.0
2.048
2.25
MHz
DIGITAL INPUTS
Input voltage
DGND – 0.1
DVDD + 0.1
V
–40
105
°C
TEMPERATURE RANGE
TA
Operating ambient temperature
7.4 Thermal Information
ADS131E08S
THERMAL METRIC (1)
PAG (TQFP)
UNIT
64 PINS
RθJA
Junction-to-ambient thermal resistance
46.2
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
5.8
°C/W
RθJB
Junction-to-board thermal resistance
19.6
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
19.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
°C/W
(1)
6
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
Minimum and maximum specifications apply from TA = –40°C to +105°C. Typical specifications are at TA = 25°C. All
specifications are at DVDD = 1.8 V, AVDD = 5 V, AVSS = 0 V, VREF = 4.0 V, external fCLK = 2.048 MHz, data rate = 4 kSPS,
and gain = 1 (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ANALOG INPUTS
Ci
Input capacitance
IIB
Input bias current
PGA output in normal range
DC input impedance
20
pF
5
nA
200
MΩ
PGA PERFORMANCE
BW
Gain settings
1, 2, 4, 8, 12
Bandwidth
See Table 3
V/V
ADC PERFORMANCE
DR
Data rate
fCLK = 2.048 MHz
Resolution
DR = 1 kSPS, 2 kSPS, 4 kSPS, 8 kSPS, and
16 kSPS
1
24
DR = 32 kSPS and 64 kSPS
16
4
64
kSPS
Bits
CHANNEL PERFORMANCE (DC Performance)
INL
Integral nonlinearity
Dynamic range
Offset error (1)
EO
Full-scale, best fit
10
Data rate = 4 kSPS, gain = 1
Gain settings other than 1
Gain = 1
Gain error
Excluding voltage reference error
Gain drift
Excluding voltage reference drift
dB
See the Noise Measurements section
–100
Offset error drift (1)
EG
ppm
116
–450
–800
0.2
2.5
µV
µV/°C
0.1%
Gain match between channels
3
ppm/°C
0.2
% of FS
CHANNEL PERFORMANCE (AC Performance)
CMRR
Common-mode rejection ratio
fCM = 50 Hz or 60 Hz (2)
PSRR
Power-supply rejection ratio
fPS = 50 Hz or 60 Hz
–80
Crosstalk
fIN = 50 Hz or 60 Hz
–125
SNR
THD
Signal-to-noise ratio
Total harmonic distortion
–110
fIN = 50 Hz or 60 Hz, amplitude = –0.5 dBFS,
normalized
108
fIN = 50 Hz or 60 Hz, amplitude = –15 dBFS,
normalized
115
fIN = 50 Hz or 60 Hz, amplitude = –0.5 dBFS
–102
fIN = 50 Hz or 60 Hz, amplitude = –15 dBFS
–107
dB
dB
–113
dB
dB
dBc
INTERNAL VOLTAGE REFERENCE
VREF
Output voltage (1)
TA = 25°C, VREF = 2.4 V, VREF_4V = 0
TA = 25°C, VREF = 4 V, VREF_4V = 1
2.4
3.88
4
V
4.12
Accuracy
TA = 25°C
Temperature drift
TA = –40°C ≤ TA ≤ 105°C
±0.2%
8
ppm/°C
Power-up time
VCAP1 = 470 pF, VREFP = 330 nF, settled
to 0.2%
1
ms
INTERNAL OSCILLATOR
Internal oscillator clock frequency
Internal oscillator accuracy (1)
2.048
TA = 25°C
–40°C ≤ TA ≤ +105°C
Power-up time
Internal oscillator power consumption
(1)
(2)
MHz
±1%
±3%
20
µs
120
µW
Minimum and maximum values are specified by design and characterization data.
CMRR is measured with a common-mode signal of (AVSS + 0.3 V) to (AVDD – 0.3 V). The values indicated are the minimum of the
eight channels.
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Electrical Characteristics (continued)
Minimum and maximum specifications apply from TA = –40°C to +105°C. Typical specifications are at TA = 25°C. All
specifications are at DVDD = 1.8 V, AVDD = 5 V, AVSS = 0 V, VREF = 4.0 V, external fCLK = 2.048 MHz, data rate = 4 kSPS,
and gain = 1 (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OPERATIONAL AMPLIFIER
Integrated noise
0.1 Hz to 250 Hz
Noise density
2 kHz
GBP
Gain bandwidth product
50-kΩ || 10-pF load
100
kHz
SR
Slew rate
50-kΩ || 10-pF load
0.25
V/µs
Load current
THD
Total harmonic distortion
VCM
Common-mode input range
9
µVRMS
120
nV/√Hz
50
fIN = 100 Hz
µA
70
AVSS + 0.7
Quiescent current consumption
dB
AVDD – 0.3
V
20
µA
±30
mV
FAULT DETECT AND ALARM
Comparator threshold accuracy
SYSTEM MONITORS
Analog supply reading error
2%
Digital supply reading error
Device wake-up
2%
From standby mode
31.25
µs
TEMPERATURE SENSOR
Offset voltage
TA = 25°C (3)
Temperature coefficient (3)
144
mV
400
µV/°C
SELF-TEST SIGNAL
fCLK / 221
Signal frequency
Hz
fCLK / 220
±1
Signal voltage
mV
±2
Accuracy
±2%
DIGITAL INPUTS AND OUTPUTS
High-level input voltage (1)
VIH
DVDD = 1.7 V to 1.8 V
DVDD – 0.2 V
DVDD = 1.8 V to 3.6 V
0.8 DVDD
V
DVDD = 1.7 V to 1.8 V
VIL
Low-level input voltage (1)
VOH
High-level output voltage (1)
IOH = –500 µA
VOL
Low-level output voltage (1)
IOL = 500 µA
IIN
Input current
0 V < VDigitalInput < DVDD
DVDD = 1.8 V to 3.6 V
DGND – 0.1
DVDD + 0.1
V
DGND + 0.2
V
0.2 DVDD
V
0.9 DVDD
V
–10
0.1 DVDD
V
10
µA
SUPPLY CURRENT (Operational Amplifier Turned Off)
IAVDD
Analog supply current
IDVDD
Digital supply current
AVDD – AVSS = 3 V
5.1
AVDD – AVSS = 5 V
5.8
DVDD = 3.3 V
1
DVDD = 1.8 V
0.4
Normal mode, AVDD – AVSS = 3 V
16
Standby mode, AVDD – AVSS = 3 V
2
mA
mA
POWER DISSIPATION (8 Channels Powered Up)
Power dissipation
(3)
8
Power-down mode, AVDD – AVSS = 3 V
mW
10
Normal mode, AVDD – AVSS = 5 V (1)
29.7
Standby mode, AVDD – AVSS = 5 V
4.2
Power-down mode, AVDD – AVSS = 5 V
20
µW
32.9
mW
µW
See the Temperature Sensor (TempP, TempN) section for more information.
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7.6 Timing Requirements
over operating ambient temperature range and DVDD = 1.7 V to 3.6 V (unless otherwise noted)
2.7 V ≤ DVDD ≤ 3.6 V
tCLK
Master clock period
tCSSC
Delay time, first SCLK rising edge after CS falling edge
tSCLK
1.7 V ≤ DVDD ≤ 2.0 V
MIN
MAX
MIN
MAX
444
588
444
588
UNIT
ns
6
17
ns
SCLK period
50
66.6
ns
tSPWH, L
Pulse duration, SCLK high or low
15
25
ns
tDIST
Setup time, DIN valid before SCLK falling edge
10
10
ns
tDIHD
Hold time, DIN valid after SCLK falling edge
10
11
ns
tCSH
Pulse duration, CS high
2
2
tCLK
tSCCS
Delay time, CS rising edge after final SCLK falling edge
4
4
tCLK
tSDECODE
Command decode time
4
4
tCLK
tDISCK2ST
Setup time, DAISY_IN valid before SCLK falling edge
10
10
ns
tDISCK2HT
Hold time, DAISY_IN valid after SCLK falling edge
10
10
ns
7.7 Switching Characteristics
over operating ambient temperature range, DVDD = 1.7 V to 3.6 V, and load on DOUT = 20 pF || 100 kΩ (unless otherwise
noted)
2.7 V ≤ DVDD ≤ 3.6 V
PARAMETER
MIN
tCSDOD
Propagation delay time, CS falling edge to DOUT driven
tDOST
Propagation delay time, SCLK rising edge to valid new DOUT
tDOHD
Hold time, SCLK falling edge to invalid DOUT
tCSDOZ
Propagation delay time, CS rising edge to DOUT high
impedance
MAX
10
1.7 V ≤ DVDD ≤ 2.0 V
MIN
MAX
UNIT
20
17
10
ns
32
10
10
ns
ns
20
ns
NOTE: SPI settings are CPOL = 0 and CPHA = 1.
Figure 1. Serial Interface Timing
(1)
n = Number of channels × resolution + 24 bits. Number of channels is 8; resolution is 24-bit.
Figure 2. Daisy-Chain Interface Timing
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7.8 Typical Characteristics
10
2200
8
2000
6
1800
4
1600
Occurences
2
0
−2
−4
1400
1200
1000
800
600
−6
400
−8
200
−10
0
1
2
3
4
5
6
Time (s)
7
8
9
0
10
−9
−8
−7
−6
−5
−4
−3
−2
−1
0
1
2
3
4
5
6
7
8
9
Input-Referred Noise (µV)
at TA = 25°C, AVDD = 3 V, AVSS = 0 V, DVDD = 1.8 V, internal VREFP = 2.4 V, VREFN = AVSS, external fCLK = 2.048 MHz,
data rate = 8 kSPS, and gain = 1 (unless otherwise noted)
G003
Input−Referred Noise (µV)
Data rate = 1 kSPS, gain = 1
G004
Data rate = 1 kSPS, gain = 1
Figure 3. Input-Referred Noise
Figure 4. Noise Histogram
-70
−90
Gain = 1
Gain = 2
Gain = 4
Gain = 8
Gain = 12
−95
−105
THD (dB)
CMRR (dB)
−100
PGA Gain
1
2
4
-80
8
12
-85
-75
−110
−115
-90
-95
−120
-100
−125
-105
−130
10
100
Frequency (Hz)
1000
G005
-110
10
20
Data rate = 4 kSPS, VIN = AVDD – 0.3 V to AVSS + 0.3 V
G=4
G=8
G = 12
Integral Nonlinearity (ppm)
Power−Supply Rejection Ratio (dB)
110
G=1
G=2
100
95
90
85
80
10
100
Frequency (Hz)
1000
G007
14
12
10
8
6
4
2
0
−2
−4
−6
−8
−10
−12
−14
D006
Gain = 1
Gain = 2
Gain = 4
Gain = 8
Gain = 12
−1
−0.8 −0.6 −0.4 −0.2 0
0.2 0.4 0.6
Input (Normalized to Full−Scale)
Figure 7. PSRR vs Frequency
10
500 700 1000
Figure 6. Total Harmonic Distortion vs Frequency
Figure 5. Common-Mode Rejection Ratio vs Frequency
105
30 40 50 70 100
200 300
Frequency (Hz)
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1
G008
Figure 8. INL vs PGA Gain
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Typical Characteristics (continued)
at TA = 25°C, AVDD = 3 V, AVSS = 0 V, DVDD = 1.8 V, internal VREFP = 2.4 V, VREFN = AVSS, external fCLK = 2.048 MHz,
data rate = 8 kSPS, and gain = 1 (unless otherwise noted)
0
−40°C
+105°C
+25°C
16
-20
-40
8
Amplitude (dBFS)
Integral Nonlinearity (ppm)
24
0
−8
−16
−24
-60
-80
-100
-120
-140
-160
−1
−0.8 −0.6 −0.4 −0.2 0
0.2 0.4 0.6
Input (Normalized to Full−Scale)
0.8
1
-180
G009
0
100
200
300
Frequency (Hz)
400
500
D010
Gain = 1, THD = –101.5 dB, SNR = 111 dB,
data rate = 1 kSPS, 16384 points
Figure 10. THD FFT Plot
0
0
-20
-20
-40
-40
Amplitude (dBFS)
Amplitude (dBFS)
Figure 9. INL vs Temperature
-60
-80
-100
-120
-60
-80
-100
-120
-140
-140
-160
-160
-180
-180
0
400
800
1200
Frequency (Hz)
1600
0
2000
4000
D011
Gain = 1, THD = –100 dB, SNR = 107 dB,
data rate = 4 kSPS, 16384 points
8000 12000 16000 20000 24000 28000 32000
Frequency (Hz)
D017
Gain = 1, THD = –100 dB, SNR = 76 dB,
data rate = 64 kSPS, 16384 points
Figure 11. THD FFT Plot
Figure 12. FFT Plot
350
0.5
AVDD = 5 V
AVDD = 3 V
AVDD = 5 V
AVDD = 3 V
300
Offset Drift (uV/oC)
Offset (mV)
0.4
0.3
0.2
250
200
150
100
0.1
50
0
0
1
2
3
4
5
6
7
PGA Gain
8
9
10
11
12
1
2
D012
Figure 13. Offset vs PGA Gain (Absolute Value)
3
4
5
6
7
PGA Gain
8
9
10
11
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Figure 14. Offset Drift vs PGA Gain
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Typical Characteristics (continued)
at TA = 25°C, AVDD = 3 V, AVSS = 0 V, DVDD = 1.8 V, internal VREFP = 2.4 V, VREFN = AVSS, external fCLK = 2.048 MHz,
data rate = 8 kSPS, and gain = 1 (unless otherwise noted)
32
4.02
AVDD = 3 V
AVDD = 5 V
28
4.015
4.01
4.005
20
Vref (V)
Power (mW)
24
16
12
8
3.99
3.985
3.98
4
0
4
3.995
3.975
0
1
2
3
4
5
6
Number of Channels Disabled
7
8
G014
3.97
-40
-20
0
20
40
60
Temperature (oC)
80
100
120
D015
AVDD = 5 V, AVSS = 0 V, VREF = 4 V
Figure 15. Channel Power
12
Figure 16. Internal VREF vs Temperature
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8 Parameter Measurement Information
8.1 Noise Measurements
Adjust the data rate and PGA gain to optimize the ADS131E08S noise performance. When averaging is
increased by reducing the data rate, noise drops correspondingly. Increasing the PGA gain reduces the inputreferred noise, which is particularly useful when measuring low-level signals. Table 1 summarizes the
ADS131E08S noise performance with a 3-V analog power supply. Table 2 summarizes the ADS131E08S noise
performance with a 5-V analog power supply. Data are representative of typical noise performance at TA = 25°C.
Data shown are the result of averaging the readings from multiple devices and are measured with the inputs
shorted together. A minimum of 1000 consecutive readings are used to calculate the RMS noise for each
reading. For the two highest data rates, noise is limited by the ADC quantization noise and does not have a
Gaussian distribution. Table 1 and Table 2 show measurements taken with an internal reference. Data are
representative of the ADS131E08S noise performance shown in both effective number of bits (ENOB) and
dynamic range when using a low-noise external reference (such as the REF5025). ENOB data in Table 1 and
Table 2 are calculated using Equation 1 and dynamic range data in Table 1 and Table 2 are calculated using
Equation 2.
ENOB
0.7071u VREF
VRMS _ Noise u Gain
Log2 u
Dynamic Range
20 u Log10 u
(1)
0.7071u VREF
VRMS _ Noise u Gain
(2)
Table 1. Input-Referred Noise, 3-V Analog Supply, and 2.4-V Reference
PGA GAIN
DR BITS
(CONFIG1
Register)
OUTPUT
DATA
RATE
(kSPS)
–3-dB
BANDWIDTH
(Hz)
DYNAMIC
RANGE (dB)
000
64
16768
74.1
001
32
8384
010
16
011
x1
x2
ENOB
DYNAMIC
RANGE (dB)
12.31
74.1
89.6
14.89
4192
102.8
8
2096
100
4
101
110
x4
ENOB
DYNAMIC
RANGE (dB)
12.30
74.0
89.6
14.88
17.07
102.3
108.2
18.0
1048
111.4
2
524
1
262
x8
ENOB
DYNAMIC
RANGE (dB)
12.29
74.0
89.4
14.85
16.99
100.6
107.4
17.9
18.6
109.4
114.6
19.1
117.7
19.6
x12
ENOB
DYNAMIC
RANGE (dB)
ENOB
12.29
73.9
12.27
88.6
14.71
87.6
14.55
16.72
97.1
16.12
94.2
15.65
105.2
17.5
101.6
16.9
98.9
16.5
18.4
107.4
18.1
103.5
17.4
100.5
17.0
113.7
19.0
111.4
18.6
107.7
18.0
104.9
17.5
116.8
19.5
114.5
19.1
110.7
18.5
108.0
18.0
Table 2. Input-Referred Noise, 5-V Analog Supply, and 4-V Reference
PGA GAIN
DR BITS
(CONFIG1
Register)
OUTPUT
DATA
RATE
(kSPS)
–3-dB
BANDWIDTH
(Hz)
DYNAMIC
RANGE (dB)
000
64
16768
74.7
001
32
8384
010
16
011
x1
x2
ENOB
DYNAMIC
RANGE (dB)
12.41
74.7
90.3
15.01
4192
104.3
8
2096
100
4
101
110
x4
ENOB
DYNAMIC
RANGE (dB)
12.41
74.7
90.3
15.00
17.33
104.0
112.3
18.7
1048
116.0
2
524
1
262
x8
ENOB
DYNAMIC
RANGE (dB)
12.41
74.7
90.2
14.99
17.28
103.1
111.6
18.6
19.3
115.2
119.1
19.8
122.1
20.4
x12
ENOB
DYNAMIC
RANGE (dB)
ENOB
12.41
74.6
12.39
89.9
14.93
89.4
14.85
17.12
100.5
16.70
98.1
16.30
109.7
18.3
106.3
17.7
103.8
17.3
19.2
113.1
18.8
109.5
18.3
106.9
17.8
118.2
19.7
116.2
19.4
112.6
18.8
109.9
18.3
121.3
20.2
119.1
19.9
115.6
19.3
112.9
18.8
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9 Detailed Description
9.1 Overview
The ADS131E08S is a low-power, 8-channel, simultaneously-sampling, 24-bit, delta-sigma (ΔΣ), analog-to-digital
converter (ADC) with an integrated programmable gain amplifier (PGA) and short start-up time. The analog
device performance across a scalable data rate makes the device well-suited for smart-grid and other industrial
power monitor, control, and protection applications.
The ADS131E08S has a programmable multiplexer that allows for various internal monitoring signal
measurements including temperature, supply, and input short for device noise testing. The PGA gain can be
chosen from one of five settings: 1, 2, 4, 8, or 12. The ADCs in the device offer data rates of 1 kSPS, 2 kSPS,
4 kSPS, 8 kSPS, 16 kSPS, 32 kSPS, and 64 kSPS. The device communicates using a serial peripheral interface
(SPI)-compatible interface. The device provides four general-purpose I/O (GPIO) pins for general use. Use
multiple devices to easily add channels to the system and synchronize them with the START pins.
Program the internal reference to either 2.4 V or 4 V. The internal oscillator generates a 2.048-MHz clock. Use
the integrated comparators, with programmable trigger-points, for input overrange or underrange detection. A
detailed diagram of the ADS131E08S is provided in the Functional Block Diagram section.
14
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9.2 Functional Block Diagram
AVDD AVDD1
VREFP
Test Signal
Temperature
Fault Detect
Supply Check
VREFN
DVDD
Reference
DRDY
IN1P
EMI
Filter
û
ADC1
PGA1
IN1N
SPI
IN2P
EMI
Filter
PGA2
û
ADC2
EMI
Filter
PGA3
û
ADC3
PGA4
û
ADC4
PGA5
û
ADC5
CS
SCLK
DIN
DOUT
IN2N
IN3P
IN3N
CLKSEL
IN4P
EMI
Filter
IN4N
Control
Oscillator
CLK
MUX
GPIO1
IN5P
EMI
Filter
GPIO2
GPIO3
IN5N
GPIO4
IN6P
PGA6
û
ADC6
EMI
Filter
PGA7
û
ADC7
EMI
Filter
PGA8
û
ADC8
EMI
Filter
IN6N
PWDN
IN7P
RESET
IN7N
START
IN8P
IN8N
Operational
Amplifier
AVSS AVSS1
OPAMPOUT
OPAMPN
OPAMPP
DGND
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9.3 Feature Description
9.3.1 Electromagnetic Interference (EMI) Filter
An RC filter at the input functions as an EMI filter on all channels. The –3-dB filter bandwidth is approximately
3 MHz.
9.3.2 Input Multiplexer
The ADS131E08S input multiplexers are very flexible and provide many configurable signal-switching options.
Figure 17 shows a diagram of the multiplexer on a single channel of the device. INxP and INxN are separate for
each of the eight blocks. This flexibility allows for significant device and sub-system diagnostics, calibration, and
configuration. Switch settings for each channel are selected by writing the appropriate values to the CHnSET
registers (see the CHnSET registers in the Register Map section for details). The output of each multiplexer is
connected to the individual channel PGA.
Device
MUX
INT_TEST
TESTP
INT_TEST
MUX[2:0] = 101
TestP
TempP
MvddP(1)
MUX[2:0] = 100
MUX[2:0] = 011
MUX[2:0] = 000
INxP
MUX[2:0] = 001 (VREFP + VREFN)
EMI
Filter
2
MUX[2:0] = 000
INxN
MvddN(1)
TempN
To PGA
MUX[2:0] = 001
To PGA
MUX[2:0] = 011
MUX[2:0] = 100
MUX[2:0] = 101
TestN
INT_TEST
TESTN
INT_TEST
(1)
MVDD monitor voltage supply depends on channel number; see the Power-Supply Measurements (MVDDP, MVDDN)
section.
Figure 17. Input Multiplexer Block for One Channel
16
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Feature Description (continued)
9.3.2.1 Device Noise Measurements
Setting CHnSET[2:0] = 001 sets the common-mode voltage of [(V(VREFP) + V(VREFN)) / 2] to both channel inputs.
Use this setting to test inherent device noise in the user system.
9.3.2.2 Test Signals (TestP and TestN)
Setting CHnSET[2:0] = 101 provides internally-generated test signals for use in sub-system verification at powerup. The test signals are controlled through register settings (see the CONFIG2: Configuration Register 2 section
for details). TEST_AMP controls the signal amplitude and TEST_FREQ controls the switching frequency of the
test signal. The test signals are multiplexed and transmitted out of the device at the TESTP and TESTN pins.
The INT_TEST register bit (in the CONFIG2: Configuration Register 2 section) deactivates the internal test
signals so that the test signal can be driven externally. This feature allows the test or calibration of multiple
devices with the same signal.
9.3.2.3 Temperature Sensor (TempP, TempN)
Setting CHnSET[2:0] = 100 sets the channel input to the temperature sensor. This sensor uses two internal
diodes with one diode having a current density 16 times that of the other, as shown in Figure 18. The difference
in diode current densities yields a difference in voltage that is proportional to absolute temperature.
Figure 18. Temperature Sensor Implementation
The internal device temperature tracks the PCB temperature closely because of the low thermal resistance of the
package to the PCB. Self-heating of the ADS131E08S causes a higher reading than the temperature of the
surrounding PCB. Setting the channel gain to 1 is recommended when the temperature measurement is taken.
The scale factor of Equation 3 converts the temperature reading to °C. Before using this equation, the
temperature reading code must first be scaled to μV.
§ VTemperature (PV) 144,000 PV ·
Temperature (q C) ¨¨
¸¸
400 PV / q C
©
¹
(3)
9.3.2.4 Power-Supply Measurements (MVDDP, MVDDN)
Setting CHnSET[2:0] = 011 sets the channel inputs to different device supply voltages. For channels 1, 2, 5, 6, 7,
and 8 (MVDDP – MVDDN) is [0.5 × (AVDD – AVSS)]; for channels 3 and 4 (MVDDP – MVDDN) is
DVDD / 4. Set the gain to 1 to avoid saturating the PGA when measuring power supplies.
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Feature Description (continued)
9.3.3 Analog Input
The analog inputs to the device connect directly to an integrated low-noise, low-drift, high input impedance,
programmable gain amplifier. The amplifier is located following the individual channel multiplexer.
The ADS131E08S analog inputs are fully differential. The differential input voltage (VINxP – VINxN) can span from
–VREF / gain to VREF / gain. See the Data Format section for an explanation of the correlation between the analog
input and digital codes. There are two general methods of driving the ADS131E08S analog inputs: pseudodifferential or fully-differential, as shown in Figure 19, Figure 20, and Figure 21.
VREF / Gain
to
VREF / Gain
VREF / Gain
Peak-to-Peak
Device
Device
Common
Voltage
Common
Voltage
a) Psuedo-Differential Input
VREF / Gain
Peak-to-Peak
b) Differential Input
Figure 19. Methods of Driving the ADS131E08S: Pseudo-Differential or Fully Differential
INxP
INxN
INxP
VCM
VCM
INxN
Figure 20. Pseudo-Differential Input Mode
Figure 21. Fully-Differential Input Mode
Hold the INxN pin at a common voltage, preferably at mid supply, to configure the fully differential input for a
pseudo-differential signal. Swing the INxP pin around the common voltage –VREF / gain to VREF / gain and remain
within the absolute maximum specifications. Verify that the differential signal at the minimum and maximum
points meets the common-mode input specification discussed in the Input Common-Mode Range section.
Configure the signals at INxP and INxN to be 180° out-of-phase centered around a common voltage to use a
fully-differential input method. Both the INxP and INxN inputs swing from the common voltage + ½ VREF / gain to
the common voltage – ½ VREF / gain. The differential voltage at the maximum and minimum points is equal to
–VREF / gain to VREF / gain. Use the ADS131E08S in a differential configuration to maximize the dynamic range
of the data converter. For optimal performance, the common voltage is recommended to be set at the midpoint of
the analog supplies [(AVDD + AVSS) / 2].
If any of the analog input channels are not used, then power-down these pins using register bits to conserve
power. See the SPI Command Definitions section for more information on how to power-down individual
channels. Tie any unused or powered down analog input pins directly to AVDD.
18
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9.3.4 PGA Settings and Input Range
Each channel has its own configurable programmable gain amplifier (PGA) following its multiplexer. The PGA is
designed using two operational amplifiers in a differential configuration, as shown in Figure 22. Set the gain to
one of five settings (1, 2, 4, 8, and 12) using the CHnSET registers for each individual channel (see the CHnSET
registers in the Register Map section for details). The ADS131E08S has CMOS inputs and therefore has
negligible current noise. Table 3 shows the typical small-signal bandwidth values for various gain settings.
From Mux
Amp
R2
30 k
R1
60 k
(for Gain = 2)
To ADC
R2
30 k
Amp
From Mux
Figure 22. PGA Implementation
Table 3. PGA Gain versus Bandwidth
GAIN
NOMINAL BANDWIDTH AT TA = 25°C (kHz)
1
237
2
146
4
96
8
48
12
32
The PGA resistor string that implements the gain has 120 kΩ of resistance for a gain of 2. This resistance
provides a current path across the PGA outputs in the presence of a differential input signal. This current is in
addition to the quiescent current specified for the device in the presence of a differential signal at the input.
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9.3.4.1 Input Common-Mode Range
The usable input common-mode range of the analog front-end depends on various parameters, including the
maximum differential input signal, supply voltage, and PGA gain. The common-mode range, VCM, is defined in
Equation 4:
AVDD - 0.3 V -
Gain ´ VMAX_DIFF
2
> VCM > AVSS + 0.3 V +
Gain ´ VMAX_DIFF
2
where:
•
•
VMAX_DIFF = maximum differential signal at the PGA input and
VCM = common-mode voltage
(4)
For example:
If AVDD – AVSS = 3.3 V, gain = 2, and VMAX_DIFF = 1000 mV,
Then 1.3 V < VCM < 2.0 V
9.3.5 ΔΣ Modulator
Power Spectral Density (dB)
Each ADS131E08S channel has its own delta-sigma (ΔΣ) ADC. The ΔΣ converters use second-order modulators
optimized for low-power applications. The modulator samples the input signal at the modulator rate of (fMOD =
fCLK / 2). As with any ΔΣ modulator, the ADS131E08S noise is shaped until fMOD / 2, as shown in Figure 23.
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
−120
−130
−140
−150
−160
0.001
0.01
0.1
Normalized Frequency (fIN/fMOD)
1
G001
Figure 23. Modulator Noise Spectrum Up to 0.5 × fMOD
9.3.6 Clock
The ADS131E08S provides two different device clocking methods: internal and external. Internal clocking using
the internal oscillator is ideally-suited for non-synchronized, low-power systems. The internal oscillator is trimmed
for accuracy at room temperature. The accuracy of the internal oscillator varies over the specified temperature
range; see the Electrical Characteristics table for details. External clocking is recommended when synchronizing
multiple ADS131E08S devices or when synchronizing to an external event because the internal oscillator clock
performance can vary over temperature. Clock selection is controlled by the CLKSEL pin and the CLK_EN
register bit. Provide the external clock any time after the analog and digital supplies are present.
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The CLKSEL pin selects either the internal oscillator or external clock. The CLK_EN bit in the CONFIG1 register
enables and disables the oscillator clock to be output on the CLK pin. A truth table for the CLKSEL pin and the
CLK_EN bit is shown in Table 4. The CLK_EN bit is useful when multiple devices are used in a daisy-chain
configuration. During power-down, the external clock is recommended to be shut down to save power.
Table 4. CLKSEL Pin and CLK_EN Bit
CLKSEL PIN
CLK_EN BIT
CLOCK SOURCE
CLK PIN STATUS
0
X
External clock
Input: external clock
1
0
Internal oscillator
3-state
1
1
Internal oscillator
Output: internal oscillator
9.3.7 Digital Decimation Filter
The digital filter receives the modulator output bit stream and decimates the data stream. The decimation ratio
determines the number of samples taken to create the output data word, and is set by the modulator rate divided
by the data rate (fMOD / fDR). By adjusting the decimation ratio, a tradeoff can be made between resolution and
data rate: higher decimation allows for higher resolution (thus creating lower data rates) and lower decimation
decreases resolution but enables wider bandwidths with higher data rates. Higher data rates are typically used in
power applications that implement software re-sampling techniques to help with channel-to-channel phase
adjustment for voltage and current.
The digital filter on each channel consists of a third-order sinc filter. An input step change takes three conversion
cycles for the filter to settle. Adjust the decimation ratio of the sinc3 filters using the DR[2:0] bits in the CONFIG1
register (see the Register Map section for details). The data rate setting is a global setting that sets all channels
to the same data rate.
The sinc filter is a variable decimation rate, third-order, low-pass filter. Data are supplied to this section of the
filter from the modulator at the rate of fMOD. The sinc3 filter attenuates the high-frequency modulator noise, then
decimates the data stream into parallel data. The decimation rate affects the overall converter data rate.
Equation 5 shows the scaled sinc3 filter Z-domain transfer function.
½H(z)½ =
1 - Z-N
3
1 - Z-1
(5)
The sinc3 filter frequency domain transfer function is shown in Equation 6.
3
sin
H(f) =
Npf
fMOD
N ´ sin
pf
fMOD
where:
•
N = decimation ratio
(6)
3
The sinc filter has notches (or zeroes) that occur at the output data rate and multiples thereof. At these
frequencies, the filter has infinite attenuation. Figure 24 illustrates the sinc filter frequency response and
Figure 25 illustrates the sinc filter roll-off. Figure 26 and Figure 27 illustrate the filter transfer function until fMOD / 2
and fMOD / 16, respectively, at different data rates. Figure 28 illustrates the transfer function extended until 4 fMOD.
Figure 28 illustrates that the ADS131E08S passband repeats itself at every fMOD. Note that the digital filter
response and filter notches are proportional to the master clock frequency.
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0
0
-20
-0.5
-40
-1
Gain (dB)
Gain (dB)
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-60
-80
-1.5
-2
-100
-2.5
-120
-3
-140
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
0
5
0.05
0.1
Figure 24. Sinc Filter Frequency Response
0
DR[2:0] = 110
0.25
0.3
0.35
DR[2:0] = 110
-20
DR[2:0] = 000
-40
DR[2:0] = 000
-40
Gain (dB)
Gain (dB)
0.2
Figure 25. Sinc Filter Roll-Off
0
-20
0.15
Normalized Frequency (fIN/fDR)
Normalized Frequency (fIN/fDR)
-60
-80
-60
-80
-100
-100
-120
-120
-140
-140
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5
0
0.01
Normalized Frequency (fIN/fMOD)
0.03
0.04
0.05
0.06
0.07
Normalized Frequency (fIN/fMOD)
Figure 26. Transfer Function of Decimation Filters Until
fMOD / 2
10
0.02
DR[2:0] = 000
Figure 27. Transfer Function of Decimation Filters Until
fMOD / 16
DR[2:0] = 110
-10
Gain (dB)
-30
-50
-70
-90
-110
-130
0
0.5
1
1.5
2
2.5
3
3.5
4
Normalized Frequency (fIN/fMOD)
Figure 28. Transfer Function of Decimation Filters
Until 4 fMOD for DR[2:0] = 000 and DR[2:0] = 110
22
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9.3.8 Voltage Reference
The ADS131E08S uses an internal voltage reference and does not provide the option of connecting an external
reference voltage. Figure 29 shows a simplified block diagram of the internal reference. There are two internal
reference voltage options generated with respect to AVSS: 2.4 V and 4 V. Connect VREFN to AVSS.
470 pF
VCAP1
R1
(1)
Bandgap
2.4 V or 4 V
R3
VREFP
(1)
330 nF
R2
(1)
VREFN
AVSS
To ADC Reference Inputs
(1)
For VREF = 2.4 V: R1 = 12.5 kΩ, R2 = 25 kΩ, and R3 = 25 kΩ.
For VREF = 4 V: R1 = 10.5 kΩ, R2 = 15 kΩ, and R3 = 35 kΩ.
Figure 29. Internal Reference Implementation
The external band-limiting capacitors, connected to VCAP1 and between the VREFP and VREFN nodes,
determine the amount of reference noise contribution. Although limiting the bandwidth through larger capacitor
sizes helps keep noise at a minimum, using large capacitors increases the power-up time of the ADC. Using the
capacitor values shown in Figure 29 is recommended to optimize the power-up time of the device.
ADC Output (Code)
The internal band gap (VCAP1 pin) used to create the internal reference voltage requires a capacitor to filter
noise. As a result of limited drive strength, the size of the capacitor on VCAP1 sets the power-up time of the
device. Figure 30 shows the accuracy of the first 200 conversion samples with different capacitors on VCAP1
following power-up. Larger capacitors on VCAP1 help filter broadband noise but add to the power-up time. To
generate the plot of Figure 30, the ADC input voltage is fixed at 1 V during power-up and the ADC output
conversion result is tracked to show the VCAP1 power-up time.
2122000
2121600
2121200
2120800
2120400
2120000
2119600
2119200
2118800
2118400
2118000
2117600
2117200
2116800
2116400
2116000
VCAP1 Value
330 nF
150 nF
2.2 uF
470 pF
0
20
40
60
80
100 120
ADC Sample
140
160
180
200
D016
Figure 30. VCAP1 Power-Up Time versus External Capacitor Value
Use the VREF_4V bit in the CONFIG2 register to set the internal reference to either 4 V or 2.4 V. By default, the
reference powers up as 4 V for a 5-V system (or ±2.5-V supplies). In a 3-V system (or ±1.5-V supplies), configure
the internal reference to 2.4 V immediately following power-up. No damage occurs to the device when the
ADS131E08S is set to a 4-V reference when using a 3-V supply system. The internal reference saturates until
programmed to 2.4 V.
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9.3.9 Input Out-of-Range Detection
The ADS131E08S has integrated comparators to detect out-of-range conditions on the input signals. The basic
principle is to compare the input voltage against a threshold voltage set by a 3-bit digital-to-analog converter
(DAC) based off the analog power supply. The comparator trigger threshold level is set by the COMP_TH[2:0]
bits in the FAULT register.
If the ADS131E08S is powered from a ±2.5-V supply and COMP_TH[2:0] = 000 (95% and 5%), the high-side
trigger threshold is set at 2.25 V [equal to AVSS + (AVDD – AVSS) × 95%] and the low-side threshold is set at
–2.25 V [equal to AVSS + (AVDD – AVSS) × 5%]. The threshold calculation formula applies to unipolar as well
as to bipolar supplies.
A fault condition can be detected by setting the appropriate threshold level using the COMP_TH[2:0] bits. To
determine which of the inputs is out of range, read the FAULT_STATP and FAULT_STATN registers individually
or read the FAULT_STATx bits as part of the output data stream; see the Data Output (DOUT) section.
9.3.10 General-Purpose Digital I/O (GPIO)
The ADS131E08S has a total of four general-purpose digital I/O (GPIO) pins available. Configure the digital I/O
pins as either inputs or outputs through the GPIOC bits. The GPIOD bits in the GPIO register indicate the level of
the pins. The GPIO logic high voltage level is set by the voltage level of DVDD. When reading the GPIOD bits,
the data returned are the logic level of the pins, whether they are programmed as inputs or outputs. When the
GPIO pin is configured as an input, a write to the corresponding GPIOD bit has no effect. When configured as an
output, a write to the GPIOD bit sets the output level.
If configured as inputs, the GPIO pins must be driven to a defined state. The GPIO pins are set as inputs after
power-up or after a reset. Figure 31 shows the GPIO pin structure. Connect unused GPIO pins directly to DGND
through 10-kΩ resistors.
Figure 31. GPIO Pin Implementation
24
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9.4 Device Functional Modes
9.4.1 Power-Down
Power-down all on-chip circuitry by pulling the PWDN pin low. To exit power-down mode, take the PWDN pin
high. The internal oscillator and reference require time to come out of power-down mode. During power-down,
the external clock is recommended to be shut down to save power.
9.4.2 Reset
There are two methods to reset the ADS131E08S: pull the RESET pin low, or send the RESET command. When
using the RESET pin, driving the pin low forces the device into reset. Follow the minimum pulse duration timing
specifications before taking the RESET pin back high. The RESET command takes effect on the eighth SCLK
falling edge. After the device is reset, 18 tCLK cycles are required to complete initialization of the configuration
registers to the default states and start the conversion cycle.
9.4.3 Conversion Mode
Set the START pin high (for a minimum of 2 tCLK) or send the START command to begin conversions. When the
START pin is held low, or if the START command is not sent, conversions are halted and the new data-ready
indicator (the DRDY signal) does not issue.
When using the START command to control conversions, hold the START pin low.
In multiple device configurations, the START pin is used to synchronize devices (see the Multiple Device
Configuration section for more details).
9.4.3.1 START Pin Low-to-High Transition or START Command Sent
When the START pin is pulled high or when the START command is sent, the device ADCs begin converting the
input signals and the data ready indicator, DRDY, is pulled high. The next DRDY falling edge indicates that data
are ready. The settling time (tSETTLE) is the time required for the converter to output fully-settled data when the
START signal is pulled high or the START command is issued. Figure 32 shows the timing diagram and Table 5
shows the settling time for different data rates. The settling time depends on fCLK and the decimation ratio
(controlled by the DR[2:0] bits in the CONFIG1 register). Table 5 lists the settling time as a function of tCLK.
START
§ §
§ §
DIN
START
DRDY
tSETTLE
Figure 32. Settling Time for the Initial Conversion
Table 5. Settling Time for Different Data Rates
DR[2:0]
SETTLING TIME
UNIT
000
152
tCLK
001
296
tCLK
010
584
tCLK
011
1160
tCLK
100
2312
tCLK
101
4616
tCLK
110
9224
tCLK
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9.4.3.2 Input Signal Step
When the device is converting and there is a step change on the input signal, a delay of 3 tDR is required for the
output data to settle. Settled data are available on the fourth DRDY pulse. Data are available to read at each
DRDY low transition prior to the 4th DRDY pulse, but are recommended to be ignored. Figure 33 shows the
required wait time for complete settling for an input step or input transient event on the analog input.
START
Analog
Input
Input Transient
DRDY
4 x tDR
Figure 33. Settling Time for the Input Transient
9.4.3.3 Continuous Conversion Mode
When the START pin is pulled high or the START command is issued, conversions continue indefinitely until the
START pin is taken low or the STOP command is transmitted, as shown in Figure 34. When the START pin is
pulled low or the STOP command is issued, the conversion in progress completes and the DRDY output
transitions from high to low indicating that the latest data are available. Figure 35 and Table 6 illustrate the timing
of where the START pin can be brought low or the STOP command can be sent relative to a completed
conversion to halt further conversions. If the START pin is pulled low or if the STOP command is sent after the
tDSHD time, then an additional conversion takes place and completes before further conversions are halted. To
continuously run the converter without commands, tie the START pin high.
START Pin
or
or
(1)
DIN
(1)
START
Command
STOP
Command
tDR
DRDY
(1)
tSETTLE
START and STOP commands take effect on the seventh SCLK falling edge.
Figure 34. Continuous Conversion Mode
(1)
START and STOP commands take effect on the seventh SCLK falling edge at the end of the transmission.
Figure 35. START to DRDY Timing
26
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Table 6. Timing Characteristics for Figure 35 (1)
MIN
UNIT
tSDSU
Setup time; set the START pin low or send the STOP command before the
DRDY falling edge to halt further conversions
16
tCLK
tDSHD
Delay time; set the START pin low or send the STOP command to complete
the current conversion and halt further conversions
16
tCLK
(1)
START and STOP commands take effect on the seventh SCLK falling edge at the end of the transmission.
9.5 Programming
9.5.1 SPI Interface
The SPI-compatible serial interface consists of four signals: CS, SCLK, DIN, and DOUT. The interface is used to
read conversion data, read and write registers, and control the ADS131E08S operation. The DRDY output is
used as a status signal to indicate when ADC data are ready for readback. DRDY goes low when new data are
available.
9.5.1.1 Chip Select (CS)
Chip select (CS) selects the ADS131E08S for SPI communication. CS must remain low for the duration of the
serial communication. After the serial communication is finished, wait four or more tCLK cycles before taking CS
high; see the Timing Requirements section. When CS is taken high, the serial interface is reset, SCLK and DIN
are ignored (SCLK clears DRDY even when CS is high; see Figure 38 for more details), and DOUT enters a
high-impedance state. DRDY asserts when data conversion is complete, regardless of whether CS is high or low.
9.5.1.2 Serial Clock (SCLK)
Use SCLK as the SPI serial clock to shift in commands and shift out data from the device. The serial clock
(SCLK) features a Schmitt-triggered input and clocks data on the DIN and DOUT pins into and out of the
ADS131E08S.
Care must be taken to prevent glitches on SCLK when CS is low. Glitches as small as 1 ns in duration can be
interpreted as a valid serial clock. An instruction on DIN is decoded every eight serial clocks. If instructions are
suspected of being interrupted erroneously, toggle CS high and back low to reset the SPI interface, placing the
device in normal operation.
For a single device, the minimum speed needed for SCLK depends on the number of channels, number of bits of
resolution, and output data rate. (For multiple cascaded devices, see the Standard Configuration section.) The
SCLK rate limitation, as described by Equation 7, applies to RDATAC mode.
tSCLK < (tDR – 4 tCLK) / (NBITS × 8 + 24)
where
•
NBITS = resolution of data for the current data rate; 16 or 24
(7)
For example, if the ADS131E08S is used with an 8-kSPS mode (24-bit resolution), the minimum SCLK speed is
1.755 MHz to shift out all the data.
Data retrieval can be done either by putting the device in read data continuous mode (RDATAC mode) or
reading on demand using the read data command (RDATA). The SCLK rate limitation, as described by
Equation 7, applies to RDATAC mode. When using the RDATA command, the limitation applies if data must be
read in between two consecutive DRDY signals. This calculation assumes that there are no other commands
issued in between data captures.
There are two methods for transmitting SCLKs to the ADS131E08S to meet the decode timing specification
(tSDECODE) illustrated in Figure 1 for multiple byte commands:
1. SCLK can be transmitted in 8-bit bursts with a gap between bursts to maintain the tSDECODE timing
specification. The maximum SCLK frequency is specified in Figure 1.
2. A continuous SCLK stream can be sent when CS is low. Verify that the SCLK speed meets the tSDECODE
timing requirement. This method is not to be confused with a free-running SCLK where SCLK also operates
when CS is high. A free-running SCLK operation is not supported by this device.
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Programming (continued)
9.5.1.3 Data Input (DIN)
Use the data input pin (DIN) along with SCLK to send commands and register data to the ADS131E08S. The
device latches data on DIN on the SCLK falling edge.
9.5.1.4 Data Output (DOUT)
Use the data output pin (DOUT) with SCLK to read conversions and register data from the ADS131E08S. Data
on DOUT are shifted out on the SCLK rising edge. DOUT goes to a high-impedance state when CS is high. In
read data continuous mode (see the SPI Command Definitions section for more details), the DOUT output line
can also be used to indicate when new data are available. If CS is low when new data are ready, a high-to-low
transition on the DOUT line occurs synchronously with a high-to-low transition on DRDY, as shown in Figure 36.
This feature can be used to minimize the number of connections between the device and system controller.
CS
DOUT
Data
DRDY
Figure 36. Using DOUT as DRDY
9.5.1.5 Data Ready (DRDY)
DRDY is an output signal that transitions from high to low to indicate that new conversion data are ready. DRDY
behavior is determined by whether the device is in RDATAC mode or if the RDATA command is being used to
read data on demand. See the RDATAC: Start Read Data Continuous Mode and RDATA: Read Data sections
for further details. The CS signal has no effect on the data-ready signal.
When reading data with the RDATA command, the read operation can overlap the next DRDY occurrence
without data corruption.
Figure 37 shows the relationship between DRDY, DOUT, and SCLK during data retrieval. DOUT transitions on
the SCLK rising edge. DRDY goes high on the first SCLK falling edge regardless of whether data are being
retrieved from the device or a command is being sent through the DIN pin. Data starts with the MSB of the status
word and then proceeds to the ADC channel data in sequential order (channel 1, channel 2, and so forth). Data
for powered down channels appear in the data stream as 0s and are to be ignored.
CS
DRDY
SCLK
DOUT
MSB
MSB-1
MSB-2
Figure 37. DRDY Behavior with Data Retrieval
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Programming (continued)
The DRDY signal is cleared on the first SCLK falling edge regardless of the state of CS. This condition must be
taken into consideration if the SPI bus is used to communicate with other devices on the same bus. Figure 38
shows a behavior diagram for DRDY when SCLKs are sent with CS high. Figure 38 shows that no data are
clocked out, but the DRDY signal is cleared.
CS
DRDY
SCLK
Figure 38. DRDY and SCLK Behavior when CS is High
9.5.2 Data Retrieval
Data retrieval can be accomplished in one of two methods. The read data continuous command (see the
RDATAC: Start Read Data Continuous Mode section) can be used to set the device in a mode to read the data
continuously without having to send a command. The read data command (see the RDATA: Read Data section)
can be used to read only one data output from the device (see the SPI Command Definitions section for more
details). Conversion data are read out serially on DOUT. The MSB of the status word is clocked out on the first
SCLK rising edge, followed by the ADC channel data. DRDY returns to high on the first SCLK falling edge. DIN
remains low for the entire read operation.
9.5.2.1 Status Word
A status word precedes data readback and provides information on the state of the ADS131E08S. The status
word is 24 bits long and contains the values for FAULT_STATP, FAULT_STATN, and the GPIO data bits. The
content alignment is shown in Figure 39.
FAULT_STATP[7:0]
GPIO[7:4]
FAULT_STATN[7:0]
§ §
0
§
0
§ §
1
§
1
§ §
DOUT
§
SCLK
Figure 39. Status Word Content
NOTE
The status word length is always 24 bits. The length does not change for 32-kSPS and
64-kSPS data rates.
9.5.2.2 Readback Length
The number of bits in the data output depends on the number of channels and the number of bits per channel.
The data format for each channel data are twos complement and MSB first.
For the ADS131E08S with 32-kSPS and 64-kSPS data rates, the number of data bits is: 24 status bits + 16 bits
per channel × 8 channels = 152 bits.
For all other data rates, the number of data bits is: 24 status bits + 24 bits per channel × 8 channels = 216 bits.
When channels are powered down using the user register setting, the corresponding channel output is set to 0.
However, the sequence of channel outputs remains the same.
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Programming (continued)
The ADS131E08S also provides a multiple data readback feature. Data can be read out multiple times by simply
providing more SCLKs, in which case the MSB data byte repeats after reading the last byte. The DAISY_IN bit in
the CONFIG1 register must be set to 1 for multiple read backs.
9.5.2.3 Data Format
The DR[2:0] bits in the CONFIG1 register sets the output resolution for the ADS131E08S. When DR[2:0] = 000
or 001, the 16 bits of data per channel are sent in binary twos complement format, MSB first. The size of one
code (LSB) is calculated using Equation 8.
1 LSB = (2 × VREF / Gain) / 216 = FS / 215
(8)
A positive full-scale input [VIN ≥ (FS – 1 LSB) = (VREF / Gain – 1 LSB)] produces an output code of 7FFFh and a
negative full-scale input (VIN ≤ –FS = –VREF / Gain) produces an output code of 8000h. The output clips at these
codes for signals that exceed full-scale.
Table 7 summarizes the ideal output codes for different input signals.
Table 7. 16-Bit Ideal Output Code versus Input Signal
INPUT SIGNAL, VIN
V(INxP) - V(INxN)
IDEAL OUTPUT CODE (1)
≥ FS (215 – 1) / 215
7FFFh
FS / 215
0001h
0
0000h
15
(1)
–FS / 2
FFFFh
≤ –FS
8000h
Excludes the effects of noise, INL, offset, and gain errors.
When DR[2:0] = 010, 011, 100, 101, or 110, the ADS131E08S outputs 24 bits of data per channel in binary twos
complement format, MSB first. The size of one code (LSB) is calculated using Equation 9.
1 LSB = (2 × VREF / Gain) / 224 = FS / 223
(9)
A positive full-scale input [VIN ≥ (FS – 1 LSB) = (VREF / Gain – 1 LSB)] produces an output code of 7FFFFFh and
a negative full-scale input (VIN ≤ –FS = –VREF / Gain) produces an output code of 800000h. The output clips at
these codes for signals that exceed full-scale.
Table 8 summarizes the ideal output codes for different input signals.
Table 8. 24-Bit Ideal Output Code versus Input Signal
INPUT SIGNAL, VIN
V(INxP) - V(INxN)
23
≥ FS (2
23
– 1) / 2
23
FS / 2
(1)
30
IDEAL OUTPUT CODE (1)
7FFFFFh
000001h
0
000000h
–FS / 223
FFFFFFh
≤ –FS
800000h
Excludes the effects of noise, INL, offset, and gain errors.
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9.5.3 SPI Command Definitions
The ADS131E08S provides flexible configuration control. The commands, summarized in Table 9, control and
configure device operation. The commands are stand-alone, except for the register read and register write
operations that require a second command byte to include additional data. CS can be taken high or held low
between commands but must stay low for the entire command operation (including multibyte commands).
System commands and the RDATA command are decoded by the ADS131E08S on the seventh SCLK falling
edge. The register read and write commands are decoded on the eighth SCLK falling edge. Make sure to follow
the SPI timing requirements when pulling CS high after issuing a command.
Table 9. Command Definitions
COMMAND
DESCRIPTION
FIRST BYTE
SECOND BYTE
SYSTEM COMMANDS
WAKEUP
Wake-up from standby mode
0000 0010 (02h)
STANDBY
Enter standby mode
0000 0100 (04h)
RESET
Reset the device
0000 0110 (06h)
START
Start or restart (synchronize) conversions
0000 1000 (08h)
STOP
Stop conversions
0000 1010 (0Ah)
OFFSETCAL
Channel offset calibration
0001 1010 (1Ah)
DATA READ COMMANDS
RDATAC
Enable read data continuous mode.
This mode is the default mode at power-up. (1)
0001 0000 (10h)
SDATAC
Stop read data continuous mode
0001 0001 (11h)
RDATA
Read data by command
0001 0010 (12h)
REGISTER READ COMMANDS
RREG
Read n nnnn registers starting at address r rrrr
001r rrrr (2xh) (2)
000n nnnn (2)
WREG
Write n nnnn registers starting at address r rrrr
010r rrrr (4xh) (2)
000n nnnn (2)
(1)
(2)
When in RDATAC mode, the RREG command is ignored.
n nnnn = number of registers to be read or written – 1. For example, to read or write three registers, set n nnnn = 0 (0010). r rrrr = the
starting register address for read and write commands.
9.5.3.1 WAKEUP: Exit STANDBY Mode
The WAKEUP command exits the low-power standby mode; see the STANDBY: Enter STANDBY Mode section.
Be sure to allow enough time for all circuits in STANDBY mode to power-up (see the Electrical Characteristics
table for details). There are no SCLK rate restrictions for this command and it can be issued at any time.
Following the WAKEUP command, wait 4 tCLK cycles before sending another command.
9.5.3.2 STANDBY: Enter STANDBY Mode
The STANDBY command enters low-power standby mode. All circuits in the device are powered down except for
the reference section. The standby mode power consumption is specified in the Electrical Characteristics table.
There are no SCLK rate restrictions for this command and it can be issued at any time. Do not send any other
command other than the WAKEUP command after the device enters standby mode.
9.5.3.3 RESET: Reset Registers to Default Values
The RESET command resets the digital filter and returns all register settings to their default values; see the
Reset section for more details. There are no SCLK rate restrictions for this command and it can be issued at any
time. 18 tCLK cycles are required to execute the RESET command. Do not send any commands during this time.
9.5.3.4 START: Start Conversions
The START command starts data conversions. Tie the START pin low to control conversions by the START and
STOP commands. If conversions are in progress, this command has no effect. The STOP command is used to
stop conversions. If the START command is immediately followed by a STOP command, then there must be a
gap of 4 tCLK cycles between the commands. The current conversion completes before further conversions are
halted. There are no SCLK rate restrictions for this command and it can be issued at any time.
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9.5.3.5 STOP: Stop Conversions
The STOP command stops conversions. Tie the START pin low to control conversions by the START and STOP
commands. When the STOP command is sent, the conversion in progress completes and further conversions
are stopped. If conversions are already stopped, this command has no effect.
9.5.3.6 OFFSETCAL: Channel Offset Calibration
The OFFSETCAL command is used to cancel the offset of each channel. The OFFSETCAL command is
recommended to be issued every time there is a change in PGA gain settings.
When the OFFSETCAL command is issued, the device configures itself to the lowest data rate (DR = 110,
1 kSPS) and performs the following steps for each channel:
• Short the analog inputs of each channel together and connect them to mid-supply [(AVDD + AVSS) / 2)
• Reset the digital filter (requires a filter settling time = 4 tDR)
• Collect 16 data points for calibration = 15 tDR
Total calibration time = (19 tDR × 8) + 1 ms = 153 ms.
9.5.3.7 RDATAC: Start Read Data Continuous Mode
The RDATAC command enables read data continuous mode. In this mode, conversion data are retrieved from
the device without the need to issue subsequent RDATA commands. This mode places the conversion data in
the output register with every DRDY falling edge so that the data can be shifted out directly. Shift out all data
from the device before data are updated with a new DRDY falling edge to avoid losing data. The read data
continuous mode is the default mode of the device.
Figure 40 shows the ADS131E08S data output protocol when using RDATAC mode.
DRDY
CS
SCLK
N SCLKS
DOUT
STAT
CH1
CH2
CH3
CH4
CH5
CH6
CH7
CH8
24-Bit
N-Bit
N-Bit
N-Bit
N-Bit
N-Bit
N-Bit
N-Bit
N-Bit
DIN
NOTE: X SCLKs = (N bits)(8 channels) + 24 bits. N-bit is dependent upon the DR[2:0] registry bit settings (N = 16 or 24).
Figure 40. ADS131E08S SPI Bus Data Output (Eight Channels)
32
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RDATAC mode is stopped by the stop read data continuous (SDATAC) command. If the device is in RDATAC
mode, an SDATAC command must be issued before any other commands can be sent to the device. There are
no SCLK rate restrictions for this command. However, subsequent data retrieval SCLKs or the SDATAC
command must wait at least 4 tCLK cycles for the command to execute. RDATAC timing is shown in Figure 41.
There is a keep out zone of 4 tCLK cycles around the DRDY pulse where this command cannot be issued in. If no
data are retrieved from the device and CS is held low, a high-to-low DOUT transition occurs synchronously with
DRDY. To retrieve data from the device after the RDATAC command is issued, make sure either the START pin
is high or the START command is issued. Figure 41 shows the recommended way to use the RDATAC
command. Read data continuous mode is ideally-suited for applications such as data loggers or recorders where
registers are set one time and do not need to be reconfigured.
START
DRDY
tUPDATE(1)
CS
SCLK
RDATAC
DIN
Hi-Z
DOUT
Status Register + n-Channel Data
(1)
Next Data
tUPDATE = 4 / fCLK. Do not read data during this time.
Figure 41. Reading Data in RDATAC Mode
9.5.3.8 SDATAC: Stop Read Data Continuous Mode
The SDATAC command stops the read data continuous mode. There are no SCLK rate restrictions for this
command, but wait at least 4 tCLK cycles before issuing any further commands. Use the read data (RDATA)
command to read data when in SDATAC mode.
9.5.3.9 RDATA: Read Data
Use the RDATA command to read conversion data when not in read data continuous mode. Issue this command
after DRDY goes low to read the conversion result (in stop read data continuous mode). There are no SCLK rate
restrictions for this command, and there is no wait time needed for subsequent commands or data retrieval
SCLKs. To use the RDATA command, the device must be actively converting (the START pin must be held high
or the START command must be issued). When reading data with the RDATA command, the read operation can
overlap the next DRDY occurrence without data corruption. RDATA can be sent multiple times after new data are
available, thus supporting multiple data readback. Figure 42 illustrates the recommended way to use the RDATA
command. RDATA is best suited for systems where register settings must be read or the user does not have
precise control over timing. Reading data using the RDATA command is recommended to avoid data corruption
when the DRDY signal is not monitored.
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START
DRDY
CS
SCLK
RDATA
DIN
DOUT
RDATA
Hi-Z
Status Register + N-Channel Data (216 Bits)
Figure 42. RDATA Usage
9.5.3.10 RREG: Read from Register
The RREG command reads the contents of one or more device configuration registers. When the device is in
read data continuous mode, an SDATAC command must be issued before the RREG command can be issued.
The RREG command can be issued at any time. The RREG command is a two-byte command on DIN followed
by the register data output on DOUT. The command is constructed as follows:
First byte: 001r rrrr, where r rrrr is the starting register address.
Second byte: 000n nnnn, where n nnnn is the number of registers to read – 1.
The 17th SCLK rising edge of the operation clocks out the MSB of the first register, as shown in Figure 43.
However, because this command is a multibyte command, there are SCLK rate restrictions depending on how
the SCLKs are issued; see Figure 1. CS must be low for the entire command.
CS
1
9
17
25
SCLK
DIN
DOUT
BYTE 1
BYTE 2
REG DATA
REG DATA + 1
Figure 43. RREG Command Example: Read Two Registers Starting from Register 00h (ID Register)
(BYTE 1 = 0010 0000, BYTE 2 = 0000 0001)
34
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9.5.3.11 WREG: Write to Register
The WREG command writes data to one or more device configuration registers. The WREG command is a twobyte command followed by the register data input. The command is constructed as follows:
First byte: 010r rrrr, where r rrrr is the starting register address.
Second byte: 000n nnnn, where n nnnn is the number of registers to write – 1.
After the two command bytes, the register data follows (in MSB-first format), as shown in Figure 44. For multiple
register writes across reserved registers (0Dh–11h), these registers must be included in the register count and
the default setting of the reserved register must be written. The WREG command can be issued at any time.
However, because this command is a multibyte command, there are SCLK rate restrictions depending on how
the SCLKs are issued; see Figure 1. CS must be low for the entire command.
CS
1
9
17
25
SCLK
DIN
BYTE 1
BYTE 2
REG DATA 1
REG DATA 2
DOUT
Figure 44. WREG Command Example: Write Two Registers Starting from 00h (ID Register)
(BYTE 1 = 0100 0000, BYTE 2 = 0000 0001)
9.5.3.12 Sending Multibyte Commands
The ADS131E08S serial interface decodes commands in bytes and requires 4 tCLK cycles to decode and execute
each command. This timing requirement can place restrictions on the SCLK speed and operational modes. For
example:
Assuming CLK is 2.048 MHz, then tSDECODE (4 tCLK) is 1.96 µs. When SCLK is 16 MHz, one byte can be
transferred in 0.5 µs. This byte transfer time does not meet the tSDECODE specification; therefore, a delay of
1.46 µs (1.96 µs – 0.5 µs) must be inserted after the first byte and before the second byte. If SCLK is 4 MHz,
one byte is transferred in 2 µs. Because this transfer time exceeds the tSDECODE specification (2 µs >
1.96 µs), the processor can send subsequent bytes without delay.
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9.6 Register Map
Table 10 describes the various ADS131E08S registers.
Table 10. Register Map (1)
ADDRESS
REGISTER
RESET
VALUE
(Hex)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
1
1
REV_ID
1
0
0
1
0
DEVICE SETTINGS (Read-Only Registers)
00h
ID
D2
GLOBAL SETTINGS ACROSS CHANNELS
01h
CONFIG1
D4
1
DAISY_IN
CLK_EN
1
0
02h
CONFIG2
E0
1
1
1
INT_TEST
0
TEST_AMP0
TEST_FREQ[1:0]
03h
CONFIG3
E8
1
1
VREF_4V
0
OPAMP_REF
PDB_OPAMP
0
0
04h
FAULT
00
0
0
0
0
0
COMP_TH[2:0]
DR[2:0]
CHANNEL-SPECIFIC SETTINGS
05h
CH1SET
10
PD1
GAIN1[2:0]
0
MUX1[2:0]
06h
CH2SET
10
PD2
GAIN2[2:0]
0
MUX2[2:0]
07h
CH3SET
10
PD3
GAIN3[2:0]
0
MUX3[2:0]
08h
CH4SET
10
PD4
GAIN4[2:0]
0
MUX4[2:0]
09h
CH5SET
10
PD5
GAIN5[2:0]
0
MUX5[2:0]
0Ah
CH6SET
10
PD6
GAIN6[2:0]
0
MUX6[2:0]
0Bh
CH7SET
10
PD7
GAIN7[2:0]
0
MUX7[2:0]
0Ch
CH8SET
10
PD8
GAIN8[2:0]
0
MUX8[2:0]
FAULT DETECT STATUS REGISTERS (Read-Only Registers)
12h
FAULT_STATP
00
IN8P_FAULT
IN7P_FAULT
IN6P_FAULT
IN5P_FAULT
IN4P_FAULT
IN3P_FAULT
IN2P_FAULT
IN1P_FAULT
13h
FAULT_STATN
00
IN8N_FAULT
IN7N_FAULT
IN6N_FAULT
IN5N_FAULT
IN4N_FAULT
IN3N_FAULT
IN2N_FAULT
IN1N_FAULT
0F
GPIOD4
GPIOD3
GPIOD2
GPIOD1
GPIOC4
GPIOC3
GPIOC2
GPIOC1
GPIO SETTINGS
14h
(1)
36
GPIO
When using multiple register write commands, registers 0Dh, 0Eh, 0Fh, 10h, and 11h must be written to 00h.
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9.6.1 Register Descriptions
9.6.1.1 ID: ID Control Register (Factory-Programmed, Read-Only) (address = 00h) [reset = D2h]
This register is programmed during device manufacture to indicate device characteristics.
Figure 45. ID: ID Control Register
7
1
R-1h
6
1
R-1h
5
REV_ID
R-1h
4
1
R-1h
3
0
R-0h
2
0
R-0h
1
1
R-1h
0
0
R-0h
LEGEND: R = Read only; -n = value after reset
Table 11. ID: ID Control Register Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Reserved
R
3h
Reserved.
Always reads 1.
5
REV_ID
R
0h
Device family identification.
This bit indicates the device family.
0 = ADS131E08S
1 = Reserved
4
Reserved
R
1h
Reserved.
Always reads 1.
3-2
Reserved
R
0h
Reserved.
Always reads 0.
1
Reserved
R
1h
Reserved.
Always reads 1.
0
Reserved
R
0h
Reserved.
Always reads 0.
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9.6.1.2 CONFIG1: Configuration Register 1 (address = 01h) [reset = D4h]
This register configures each ADC channel sample rate.
Figure 46. CONFIG1: Configuration Register 1
7
1
R/W-1h
6
DAISY_IN
R/W-1h
5
CLK_EN
R/W-0h
4
1
R/W-1h
3
0
R/W-0h
2
1
DR[2:0]
R/W-4h
0
LEGEND: R/W = Read/Write; -n = value after reset
Table 12. CONFIG1: Configuration Register 1 Field Descriptions
Bit
Field
Type
Reset
Description
7
Reserved
R/W
1h
Reserved.
Must be set to 1. This bit reads high.
6
DAISY_IN
R/W
1h
Daisy-chain and multiple data readback mode.
This bit determines which mode is enabled.
0 = Daisy-chain mode
1 = Multiple data readback mode
5
CLK_EN
R/W
0h
CLK connection (1).
This bit determines if the internal oscillator signal is connected to
the CLK pin when the CLKSEL pin = 1.
0 = Oscillator clock output disabled
1 = Oscillator clock output enabled
4
Reserved
R/W
1h
Reserved.
Must be set to 1. This bit reads high.
3
Reserved
R/W
0h
Reserved.
Must be set to 0. This bit reads low.
DR[2:0]
R/W
4h
Output data rate.
These bits determine the output data rate and resolution; see
Table 13 for details.
2-0
(1)
Additional power is consumed when driving external devices.
Table 13. Data Rate Settings
(1)
38
DR[2:0]
RESOLUTION
DATA RATE (kSPS) (1)
000
16-bit output
64
001
16-bit output
32
010
24-bit output
16
011
24-bit output
8
100
24-bit output
4
101
24-bit output
2
110
24-bit output
1
111
Do not use
NA
Where fCLK = 2.048 MHz. Data rates scale with master clock frequency.
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9.6.1.3 CONFIG2: Configuration Register 2 (address = 02h) [reset = 00h]
This register configures the test signal generation; see the Input Multiplexer section for more details.
Figure 47. CONFIG2: Configuration Register 2
7
1
R/W-1h
6
1
R/W-1h
5
1
R/W-1h
4
INT_TEST
R/W-0h
3
0
R/W-0h
2
TEST_AMP
R/W-0h
1
0
TEST_FREQ[1:0]
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 14. CONFIG2: Configuration Register 2 Field Descriptions
Bit
Field
Type
Reset
Description
7-5
Reserved
R/W
1h
Reserved.
Must be set to 1. This bit reads high.
4
INT_TEST
R/W
0h
Test signal source.
This bit determines the source for the test signal.
0 = Test signals are driven externally
1 = Test signals are generated internally
3
Reserved
R/W
0h
Reserved.
Must be set to 0. This bit reads low.
2
TEST_AMP
R/W
0h
Test signal amplitude.
These bits determine the calibration signal amplitude.
0 = 1 × –(V(VREFP) – V(VREFN)) / 2400
1 = 2 × –(V(VREFP) – V(VREFN)) / 2400
TEST_FREQ[1:0]
R/W
0h
Test signal frequency.
These bits determine the test signal frequency.
00 = Pulsed at fCLK / 221
01 = Pulsed at fCLK / 220
10 = Not used
11 = At dc
1-0
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9.6.1.4 CONFIG3: Configuration Register 3 (address = 03h) [reset = E8]
This register configures the reference and internal amplifier operation.
Figure 48. CONFIG3: Configuration Register 3
7
1
R/W-1h
6
1
R/W-1h
5
VREF_4V
R/W-1h
4
0
R/W-0h
3
OPAMP_REF
R/W-0h
2
PDB_OPAMP
R/W-0h
1
0
R/W-0h
0
0
R-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 15. CONFIG3: Configuration Register 3 Field Descriptions
40
Bit
Field
Type
Reset
Description
7-6
Reserved
R/W
1h
Reserved.
Must be set to 1. This bit reads high.
5
VREF_4V
R/W
1h
Internal reference voltage.
This bit determines the reference voltage, VREFP.
0 = VREFP is set to 2.4 V
1 = VREFP is set to 4 V
4
Reserved
R/W
0h
Reserved.
Must be set to 0. This bit reads low.
3
OPAMP_REF
R/W
0h
Op amp reference.
This bit determines whether the op amp noninverting input
connects to the OPAMPP pin or to the internally-derived supply
(AVDD + AVSS) / 2.
0 = Noninverting input connected to the OPAMPP pin
1 = Noninverting input connected to (AVDD + AVSS) / 2
2
PDB_OPAMP
R/W
0h
Op amp power-down.
This bit powers down the op amp.
0 = Power-down op amp
1 = Enable op amp
1
Reserved
R/W
0h
Reserved.
Must be set to 0. Reads back as 0.
0
Reserved
R
0h
Reserved.
Reads back as either 1 or 0.
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9.6.1.5 FAULT: Fault Detect Control Register (address = 04h) [reset = 00h]
This register configures the fault detection operation.
Figure 49. FAULT: Fault Detect Control Register
7
6
COMP_TH[2:0]
R/W-0h
5
4
0
R/W-0h
3
0
R/W-0h
2
0
R/W-0h
1
0
R/W-0h
0
0
R/W-0h
LEGEND: R/W = Read/Write; -n = value after reset
Table 16. FAULT: Fault Detect Control Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
COMP_TH[2:0]
R/W
0h
Fault detect comparator threshold.
These bits determine the fault detect comparator threshold level
setting. See the Input Out-of-Range Detection section for a
detailed description.
Comparator high-side threshold.
000 = 95%
001 = 92.5%
010 = 90%
011 = 87.5%
100 = 85%
101 = 80%
110 = 75%
111 = 70%
Comparator low-side threshold.
000 = 5%
001 = 7.5%
010 = 10%
011 = 12.5%
100 = 15%
101 = 20%
110 = 25%
111 = 30%
4-0
Reserved
R/W
00h
Reserved.
Must be set to 0. This bit reads low.
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9.6.1.6 CHnSET: Individual Channel Settings (address = 05h to 0Ch) [reset = 10h]
This register configures the power mode, PGA gain, and multiplexer settings for the channels; see the Input
Multiplexer section for details. CHnSET are similar to CH1SET, corresponding to the respective channels (see
Table 10).
Figure 50. CHnSET (1): Individual Channel Settings
7
PDn
R/W-0h
6
5
GAINn[2:0]
R/W-1h
4
3
0
R/W-0h
2
1
MUXn[2:0]
R/W-0h
0
LEGEND: R/W = Read/Write; -n = value after reset
(1)
n = 1 to 8.
Table 17. CHnSET: Individual Channel Settings Field Descriptions
Bit
Field
Type
Reset
Description
7
PDn
R/W
0h
Power-down (n = individual channel number).
This bit determines the channel power mode for the
corresponding channel.
0 = Normal operation
1 = Channel power-down
GAINn[2:0]
R/W
1h
PGA gain (n = individual channel number).
These bits determine the PGA gain setting.
000 = Do not use
001 = 1
010 = 2
011 = Do not use
100 = 4
101 = 8
110 = 12
111 = Do not use
3
Reserved
R/W
0h
Reserved.
Must be set to 0. This bit reads low.
2-0
MUXn[2:0]
R/W
0h
Channel input (n = individual channel number).
These bits determine the channel input selection.
000 = Normal input
001 = Input shorted to (AVDD + AVSS) / 2 (for offset or noise
measurements)
010 = Do not use
011 = MVDD for supply measurement
100 = Temperature sensor
101 = Test signal
110 = Do not use
111 = Do not use
6-4
42
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9.6.1.7 FAULT_STATP: Fault Detect Positive Input Status (address = 12h) [reset = 00h]
This register stores the status of whether the positive input on each channel has a fault or not. Faults are
determined by comparing the input pin to a threshold set by Table 16; see the Input Out-of-Range Detection
section for details.
Figure 51. FAULT_STATP: Fault Detect Positive Input Status
7
IN8P_FAULT
R-0h
6
IN7P_FAULT
R-0h
5
IN6P_FAULT
R-0h
4
IN5P_FAULT
R-0h
3
IN4P_FAULT
R-0h
2
IN3P_FAULT
R-0h
1
IN2P_FAULT
R-0h
0
IN1P_FAULT
R-0h
LEGEND: R = Read only; -n = value after reset
Table 18. FAULT_STATP: Fault Detect Positive Input Status Field Descriptions
Bit
Field
Type
Reset
Description
7
IN8P_FAULT
R
0h
IN8P threshold detect.
0 = Channel 8 positive input pin does not exceed threshold set
1 = Channel 8 positive input pin exceeds threshold set
6
IN7P_FAULT
R
0h
IN7P threshold detect.
0 = Channel 7 positive input pin does not exceed threshold set
1 = Channel 7 positive input pin exceeds threshold set
5
IN6P_FAULT
R
0h
IN6P threshold detect.
0 = Channel 6 positive input pin does not exceed threshold set
1 = Channel 6 positive input pin exceeds threshold set
4
IN5P_FAULT
R
0h
IN5P threshold detect.
0 = Channel 5 positive input pin does not exceed threshold set
1 = Channel 5 positive input pin exceeds threshold set
3
IN4P_FAULT
R
0h
IN4P threshold detect.
0 = Channel 4 positive input pin does not exceed threshold set
1 = Channel 4 positive input pin exceeds threshold set
2
IN3P_FAULT
R
0h
IN3P threshold detect.
0 = Channel 3 positive input pin does not exceed threshold set
1 = Channel 3 positive input pin exceeds threshold set
1
IN2P_FAULT
R
0h
IN2P threshold detect.
0 = Channel 2 positive input pin does not exceed threshold set
1 = Channel 2 positive input pin exceeds threshold set
0
IN1P_FAULT
R
0h
IN1P threshold detect.
0 = Channel 1 positive input pin does not exceed threshold set
1 = Channel 1 positive input pin exceeds threshold set
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9.6.1.8 FAULT_STATN: Fault Detect Negative Input Status (address = 13h) [reset = 00h]
This register stores the status of whether the negative input on each channel has a fault or not. Faults are
determined by comparing the input pin to a threshold set by Table 16; see the Input Out-of-Range Detection
section for details.
Figure 52. FAULT_STATN: Fault Detect Negative Input Status
7
IN8N_FAULT
R-0h
6
IN7N_FAULT
R-0h
5
IN6N_FAULT
R-0h
4
IN5N_FAULT
R-0h
3
IN4N_FAULT
R-0h
2
IN3N_FAULT
R-0h
1
IN2N_FAULT
R-0h
0
IN1N_FAULT
R-0h
LEGEND: R = Read only; -n = value after reset
Table 19. FAULT_STATN: Fault Detect Negative Input Status Field Descriptions
Bit
44
Field
Type
Reset
Description
7
IN8N_FAULT
R
0h
IN8N threshold detect.
0 = Channel 8 negative input pin does not exceed threshold set
1 = Channel 8 negative input pin exceeds threshold set
6
IN7N_FAULT
R
0h
IN7N threshold detect.
0 = Channel 7 negative input pin does not exceed threshold set
1 = Channel 7 negative input pin exceeds threshold set
5
IN6N_FAULT
R
0h
IN6N threshold detect.
0 = Channel 6 negative input pin does not exceed threshold set
1 = Channel 6 negative input pin exceeds threshold set
4
IN5N_FAULT
R
0h
IN5N threshold detect.
0 = Channel 5 negative input pin does not exceed threshold set
1 = Channel 5 negative input pin exceeds threshold set
3
IN4N_FAULT
R
0h
IN4N threshold detect.
0 = Channel 4 negative input pin does not exceed threshold set
1 = Channel 4 negative input pin exceeds threshold set
2
IN3N_FAULT
R
0h
IN3N threshold detect.
0 = Channel 3 negative input pin does not exceed threshold set
1 = Channel 3 negative input pin exceeds threshold set
1
IN2N_FAULT
R
0h
IN2N threshold detect.
0 = Channel 2 negative input pin does not exceed threshold set
1 = Channel 2 negative input pin exceeds threshold set
0
IN1N_FAULT
R
0h
IN1N threshold detect.
0 = Channel 1 negative input pin does not exceed threshold set
1 = Channel 1 negative input pin exceeds threshold set
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9.6.1.9 GPIO: General-Purpose IO Register (address = 14h) [reset = 0Fh]
This register controls the format and state of the four GPIO pins.
Figure 53. GPIO: General-Purpose IO Register
7
6
5
4
3
GPIOD[4:1]
R/W-0h
2
1
0
GPIOC[4:1]
R/W-Fh
LEGEND: R/W = Read/Write; -n = value after reset
Table 20. GPIO: General-Purpose IO Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
GPIOD[4:1]
R/W
0h
GPIO data.
These bits are used to read and write data to the GPIO ports.
When reading the register, the data returned correspond to the
state of the GPIO external pins, whether they are programmed
as inputs or outputs. As outputs, a write to the GPIOD sets the
output value. As inputs, a write to the GPIOD has no effect.
3-0
GPIOC[4:1]
R/W
Fh
GPIO control (corresponding to GPIOD).
These bits determine if the corresponding GPIOD pin is an input
or output.
0 = Output
1 = Input
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10 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
10.1.1 Multiple Device Configuration
The ADS131E08S provides configuration flexibility when multiple devices are used in a system. The serial
interface typically needs four signals: DIN, DOUT, SCLK, and CS. With one additional chip select signal per
device, multiple devices can be operated on the same SPI bus. The number of signals needed to interface to N
devices is 3 + N.
10.1.1.1 Synchronizing Multiple Devices
When using multiple devices, the devices can be synchronized using the START signal. The delay time from the
rising edge of the START signal to the falling edge of the DRDY signal is fixed for a given data rate (see the
Conversion Mode section for more details on the settling times). Figure 54 shows the behavior of two devices
when synchronized with the START signal.
Device
START
CLK
START1
DRDY
DRDY1
CLK
Device
START2
DRDY
DRDY2
CLK
CLK
START
DRDY1
DRDY2
Figure 54. Synchronizing Multiple Converters
To use the internal oscillator in a daisy-chain configuration, one device must be set as the master for the clock
source with the internal oscillator enabled (CLKSEL pin = 1) and the internal oscillator clock must be brought out
of the device by setting the CLK_EN register bit to 1. The master device clock is used as the external clock
source for the other devices.
There are two ways to connect multiple devices with an optimal number of interface pins: standard configuration
and daisy-chain configuration.
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Application Information (continued)
10.1.1.2 Standard Configuration
Figure 55a shows a configuration with two ADS131E08s devices cascaded. Together, the devices create a
system with 16 channels. DOUT, SCLK, and DIN are shared. Each device has its own chip select. When a
device is not selected by the corresponding CS being driven to logic 1, the DOUT pin of this device is highimpedance. This structure allows the other device to take control of the DOUT bus. This configuration method is
suitable for the majority of applications where extra I/O pins are available.
10.1.1.3 Daisy-Chain Configuration
Daisy-chain mode is enabled by setting the DAISY_IN bit in the CONFIG1 register. Figure 55b shows the daisychain configuration. In this mode SCLK, DIN, and CS are shared across multiple devices. The DOUT pin of
device 1 is connected to the DAISY_IN pin of device 0, thereby creating a daisy-chain for the data. Connect the
DAISY_IN pin of device 1 to DGND if not used. The daisy-chain timing requirements for the SPI interface are
illustrated in Figure 2. Data from the ADS131E08S device 0 appear first on DOUT, followed by a don’t care bit,
and then the status and data words from the ADS131E08S device 1.
The internal oscillator output cannot be enabled because all devices in the chain operate by sharing the same
DIN pin, thus an external clock must be used.
START(1)
CLK
START
CLK
INT
DRDY
CS
GPO0
START(1)
CLK
START
DRDY
CLK
CS
INT
GPO
GPO1
Device 0
SCLK
SCLK
DIN
MOSI
DOUT
MISO
Device 0
DAISY_IN
SCLK
SCLK
DIN
MOSI
DOUT
MISO
Host Processor
START
CLK
Host Processor
DOUT
DRDY
CS
START
SCLK
CS
SCLK
CLK
DIN
Device 1
DRDY
DIN
DOUT
Device 1
DAISY_IN
b) Daisy-Chain Configuration
a) Standard Configuration
(1)
To reduce pin count, set the START pin low and use the START command to synchronize and start conversions.
Figure 55. Multiple Device Configurations
There are several items to be aware of when using daisy-chain mode:
1. One extra SCLK must be issued between each data set (see Figure 56)
2. All devices are configured to the same register values because the CS signal is shared
3. Device register readback is only valid for device 0 in the daisy-chain. Only ADC conversion data can be read
back from device 1 through device N, where N is the last device in the chain.
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Application Information (continued)
The more devices in the chain, the more challenging adhering to setup and hold times becomes. A star-pattern
connection of SCLK to all devices, minimizing the trace length of DOUT, and other printed circuit board (PCB)
layout techniques helps to mitigate this challenge with signal delays. Placing delay circuits (such as buffers)
between DOUT and DAISY_IN are options to help reduce signal delays. One other option is to insert a D flip-flop
between DOUT and DAISY_IN clocked on an inverted SCLK. Figure 56 shows a timing diagram for daisy-chain
mode.
DOUT
MSB1
DAISY_IN
CLKS
DOUT
1
0
LSB1
2
3
n
MSB0
n+1
LSB0
n+2
XX
Data From First Device (ADS131E08S)
n+3
MSB1
LSB1
Data From Second Device (ADS131E08S)
NOTE: n = (number of channels) × (resolution) + 24 bits. The number of channels is 8. Resolution is 16 bits or 24 bits.
Figure 56. Daisy-Chain Data Word
The maximum number of devices that can be daisy-chained depends on the data rate that the devices are
operated at. The maximum number of devices can be calculated with Equation 10.
fSCLK
NDEVICES =
fDR (NBITS)(NCHANNELS) + 24
where:
•
•
NBITS = device resolution (depends on DR[2:0] setting)
NCHANNELS = number of channels powered up in the device
(10)
For example, when the ADS131E08S is operated in 24-bit, 8-kSPS data rate with fSCLK = 10 MHz, up to six
devices can be daisy-chained together.
10.1.2 Power Monitoring Specific Applications
All channels of the ADS131E08S are exactly identical, yet independently configurable, thus giving the user the
flexibility of selecting any channel for voltage or current monitoring. An overview of a system configured to
monitor voltage and current is illustrated in Figure 57. Also, the simultaneously sampling capability of the device
allows the user to monitor both the current and the voltage at the same time. The full-scale differential input
voltage of each channel is determined by the PGA gain setting (see the CHnSET: Individual Channel Settings
section) for the respective channel and VREF (see the CONFIG3: Configuration Register 3 section).
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Application Information (continued)
Neutral
Phase C
Phase B
Phase A
+1.5 V
+1.8 V
AVDD
DVDD
INP1
A
N
INN1
INP2
INN2
B
INP3
INN3
N
INP4
Device
INN4
INP5
C
INN5
N
INP6
INN6
INN8
INN7
INP8
INP7
AVSS
1.5 V
Figure 57. Overview of a Power-Monitoring System
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Application Information (continued)
10.1.3 Current Sensing
Figure 58 illustrates a simplified diagram of typical configurations used for current sensing with a Rogowski coil,
current transformer (CT), or an air coil that outputs a current or voltage. In the case of a current output
transformer, the burden resistors (R1) are used for current-to-voltage conversion. The output of the burden
resistors is connected to the ADS131E08S INxP and INxN inputs through an antialiasing RC filter for current
sensing. In the case of a voltage output transformer for current sensing (such as certain types of Rogowski coils),
the output terminals of the transformer are directly connected to the ADS131E08S INxP and INxN inputs through
an antialiasing RC filter. The input network must be biased to mid-supply if using a unipolar-supply analog
configuration (AVSS = 0 V, AVDD = 2.7 V to 5.5 V). The common-mode bias voltage [(AVDD + AVSS) / 2] can
be obtained from the ADS131E08S by either configuring the internal op amp in a unity-gain configuration using
the RF resistor and setting the OPAMP_REF bit of the CONFIG3 register to 1, or generated externally with a
resistor divider network between the positive and negative supplies.
Select the value of resistor R1 for the current output transformer and turns ratio of the transformer such that the
ADS131E08S full-scale differential input voltage range is not exceeded. Likewise, select the output voltage for
the voltage output transformer to not exceed the full-scale differential input voltage range. In addition, the
selection of the resistors (R1 and R2) and turns ratio must not saturate the transformer over the full operating
dynamic range. Figure 58a illustrates differential input current sensing and Figure 58b illustrates single-ended
input voltage sensing. Use separate external op amps to source and sink current because the internal op amp
has very limited current sink and source capability. Additionally, separate op amps for each channel help isolate
individual phases from one another to limit crosstalk.
10.1.4 Voltage Sensing
Figure 59 illustrates a simplified diagram of commonly-used differential and single-ended methods of voltage
sensing. A resistor divider network is used to step down the line voltage to within the acceptable ADS131E08S
input range and then connect to the inputs (INxP and INxN) through an antialiasing RC filter formed by resistor
R3 and capacitor C. The common-mode bias voltage [(AVDD + AVSS) / 2] can be obtained from the
ADS131E08S by either configuring the internal op amp in a unity-gain configuration using the RF resistor and
setting the OPAMP_REF bit of the CONFIG3 register, or generated externally by using a resistor divider network
between the positive and negative supplies.
In either of the cases illustrated in Figure 59 (Figure 59a for a differential input and Figure 59b for a single-ended
input), the line voltage is divided down by a factor of [R2 / (R1 + R2)]. Values of R1 and R2 must be carefully
chosen so that the voltage across the ADS131E08S inputs (INxP and INxN) does not exceed the range of the
ADS131E08S over the full operating dynamic range. Use separate external op amps to source and sink current
because the internal op amp has very limited current sink and source capability. Additionally, separate op amps
for each channel help isolate individual phases from one another to limit crosstalk.
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Application Information (continued)
N
Device
L
I
R2
INxP
R1
EMI
Filter
C
To PGA
R1
INxN
R2
I
+
OPAMP_REF
+
OPAMPOUT
-
(AVDD + AVSS)
2
-
Rf
OPAMPN
OPAMPP
(a) Current Output CT with Differential Input
N
Device
L
Voltage
Output CT
R2
INxP
EMI
Filter
C
To PGA
+
OPAMPOUT
-
Rf
+
INxN
OPAMP_REF (AVDD + AVSS)
2
OPAMPN
OPAMPP
(b) Voltage Output CT with Single-Ended Input
Figure 58. Simplified Current-Sensing Connections
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Application Information (continued)
N
Device
L
R1
R3
INxP
R2
EMI
Filter
C
R2
INxN
R3
OPAMPOUT
+
-
+
R1
To PGA
OPAMP_REF (AVDD + AVSS)
2
-
RF
OPAMPN
OPAMPP
(a) Voltage Sensing with Differential Input
Device
N
L
R1
R3
R2
INxP
EMI
Filter
C
To PGA
+
OPAMPOUT
-
+
INxN
OPAMP_REF (AVDD + AVSS)
2
-
RF
OPAMPN
OPAMPP
(b) Voltage Sensing with Single-Ended Input
Figure 59. Simplified Voltage-Sensing Connections
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10.2 Typical Application
Figure 60 shows the ADS131E08S being used as part of an electronic trip unit (ETU) in a circuit breaker or
protection relay. Delta-sigma (ΔΣ), analog-to-digital converters (ADCs), such as the ADS131E08S, are ideal for
this application because these devices provide a wide dynamic range. The fast power-up time of the
ADS131E08S makes the device an ideal candidate for line-powered circuit breaker applications.
The system measures voltages and currents output from a breaker enclosure. In this example, the first three
inputs measure line voltage and the remaining five inputs measure line current from the secondary winding of a
current transformer (CT). A voltage divider steps down the voltage from the output of the breaker. Several
resistors are used to break up power consumption and are used as a form of fault protection against any
potential resistor short-circuit. After the voltage step down, RC filters are used for antialiasing and diodes protect
the inputs from overrange.
-2.5 V
2.5 V
2.5 V
RDiv1
RDiv1
RDiv1
RDiv1
RDiv1
RFilt
RDiv1
IN1P
Voltage Output
AVDD
CCom
RDiv2
CDif
RDiv2
RFilt
IN1N
CCom
-2.5 V
2.5 V
Breaker Enclosure
-2.5 V
2.5 V
Device
RFilt
IN4P
CCom
Current Output
RBurden
RBurden
CDif
RFilt
IN4N
CCom
-2.5 V
2.5 V
AVSS
-2.5 V
Figure 60. ETU Block Diagram: High-Resolution and Fast Power-Up Analog Front-End for Air Circuit
Breaker or Molded Case Circuit Breaker and Protection Relay
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Typical Application (continued)
10.2.1 Design Requirements
Table 21 summarizes the design requirements for the circuit breaker front-end application.
Table 21. ETU Circuit Breaker Design Requirements
DESIGN PARAMETER
VALUE
ADC power-up
< 3 ms
Number of voltage inputs
3
Voltage input range
10 V to 750 V
Number of current inputs
5
Current input range
50 mA to 25 A
Dynamic range with fixed gain
> 500
Accuracy
±1%
10.2.2 Detailed Design Procedure
The line voltage is stepped down to a voltage range within the measurable range of the ADC. The reference
voltage determines the range in which the ADC can measure signals. The ADS131E08S has two integrated lowdrift reference voltage options: 2.4 V and 4 V.
Equation 11 describes the transfer function for the voltage divider at the input in Figure 60. Using multiple series
resistors, RDIV1, and multiple parallel resistors, RDIV2, allows for power and heat to be dissipated among several
circuit elements and serves as protection against a potential short-circuit across a single resistor. The number of
resistors trade off with nominal accuracy because each additional element introduces an additional source of
tolerance.
VIN
§
·
0.5 u RDiv2
VPhase u ¨
¸
© 6 u RDiv1 0.5 u RDiv2 ¹
(11)
The step-down resistor, RDiv2, dominates the measurement error produced by the resistor network. Using input
PGAs on the ADS131E08S helps to mitigate this error source by allowing RDiv2 to be made smaller and then
amplifying the signal to near full-scale using the ADS131E08S PGA.
For this design, RDiv1 is set to 200 kΩ and RDiv2 is set to 2.4 kΩ to provide proper signal attenuation at a sufficient
power level across each resistor. The input saturates at values greater than ±750 V when using the
ADS131E08S internal 2.4-V reference and a PGA gain of 2.
The ADS131E08S measures the line current by creating a voltage across the burden resistance (RBurden in
Figure 60) in parallel with the secondary winding of a CT. As with the voltage measurement front-end, multiple
resistors (RDiv1) that are used to step down a voltage share the duty of dissipating power. In this design, RBURDEN
is set to 33 Ω. Used with a 1:500 turns ratio CT, the ADC input saturates with a line current over 25 A when the
ADC is configured using the internal 2.4-V reference and a PGA gain of 2.
Diodes protect the ADS131E08S inputs from overvoltage and current. Diodes on each input shunt to either
supply if the input voltage exceeds the safe range for the device. On current inputs, a diode shunts the inputs if
current on the secondary winding of the CT threatens to damage the device.
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The combination of RFilt, CCom, and CDif form the antialiasing filters for each of the inputs. The differential
capacitor CDif improves the common-mode rejection of the system by sharing its tolerance between the positive
and negative input. The antialiasing filter requirement is not strict because the nature of a ΔΣ converter (with
oversampling and digital filter) attenuates a significant proportion of out-of-band noise. In addition, the input
PGAs have intentionally low bandwidth to provide additional antialiasing. The component values used in this
design are RFilt = 1 kΩ, CCom = 47 pF, and CDif = 0.015 μF. This first-order filter produces a relatively flat
frequency response beyond 2 kHz, capable of measuring greater than 30 harmonics at a 50-Hz or 60-Hz
fundamental frequency. The 3-dB cutoff frequency of the filter is 5.3 kHz for each input channel.
The ETU in a circuit breaker or protection relay can be powered from the line. In this case, fast power-up is
required to allow the ADC to begin making measurements shortly after power is restored. The ADS131E08S is
designed to fully power-up and collect data in less than 3 ms.
Each analog system block introduces errors from input to output. Protection CTs in the 5P accuracy class can
introduce as much as ±1% current error from input to output. CTs in the 10P accuracy class can introduce as
much as ±3% error. The burden resistor also introduces errors in the form of resistor tolerance and temperature
drift. For the voltage input, error comes from the divider network in the form of resistor tolerance and temperature
drift. Finally, the converter introduces errors in the form of offset error, gain error, and reference error. All of these
specifications can drift over temperature.
10.2.3 Application Curves
Accuracy is measured using a system designed in a similar way to that illustrated in Figure 60. The CT used for
the current input is CT1231 (a 0.3 class, solid core, 5:2500 turns transformer). In each case, data are taken for
three channels over one cycle of the measured waveform and the RMS input-referred signal is compared to the
output to calculate the error. The equation used to derive the measurement error is shown in Equation 12. Data
are taken using both the 2.4-V and 4-V internal reference voltages. In all cases, measured accuracy is within
±1%.
§ Measured Actual ·
Measurement Accuracy(%) ¨
¸ u 100
Actual
©
¹
(12)
0.35
0.22
0.18
Ch 1
Ch 2
Ch 3
0.325
Measurement Error (%)
Measurement Error (%)
0.2
0.16
0.14
0.12
0.1
0.08
0.275
0.25
0.225
0.2
0.175
0.15
0.06
0.04
1000 700 500
0.3
Ch 1
Ch 2
Ch 3
300 200
100 70 50 40 30
AC Input Voltage (V)
20
10
0.125
1000 700 500
D018
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2,
VREF = 2.4 V, measurement accuracy is absolute value
Figure 61. Input Voltage vs ADC Measurement Error:
2.4-V Reference
300 200
100 70 50 40 30
AC Input Voltage (V)
20
10
D019
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2,
VREF = 4 V, measurement accuracy is absolute value
Figure 62. Input Voltage vs ADC Measurement Error:
4-V Reference
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0.2
0.2
Ch 1
Ch 2
Ch 3
0
-0.1
-0.2
-0.3
-0.4
0
-0.1
-0.2
-0.3
-0.5
-0.6
2520
Ch 1
Ch 2
Ch 3
0.1
Measurement Error (%)
Measurement Error (%)
0.1
10 87 6 5 4 3 2
1 0.7 0.5 0.3 0.2
AC Current Input (A)
0.1
0.04
-0.4
4030 20
D020
10 7 6 5 4 3 2
1
0.5 0.3 0.2
AC Current Input (A)
0.1
0.04
D020
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2,
VREF = 2.4 V
One 50-Hz line cycle , 4-kSPS data rate, 80 samples, gain = 2,
VREF = 4 V
Figure 63. Input Current vs ADC Measurement Error:
2.4-V Reference
Figure 64. Input Current vs ADC measurement Error:
4-V Reference
For a step-by-step design procedure, circuit schematics, bill of materials, PCB files, simulation results, and test
results, see High Resolution, Fast Startup Analog Front End for Air Circuit Breaker Design Guide (TIDUB80).
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10.3 Initialization Set Up
10.3.1 Setting the Device Up for Basic Data Capture
This section outlines the procedure to configure the device to capture data. Follow the steps shown in Figure 65
to put the ADS131E08S in a configured state to acquire data within the specified 3-ms power-up time. For details
on the timings for commands, see the appropriate sections in this document. The flow chart of Figure 65 details
the initial ADS131E08S configuration and setup.
Power-up
Analog + Digital Supply
SET
/PWDN = 1
START = 1
If CLKSEL = 0
Provide CLK
CLKSEL Pin State
If CLKSEL = 1
Wait 20 µs for Oscillator
power-up
SET
/RESET = 1
// Analog and Digital supply can come up together
// Can come up with Power Supply
// If external CLK, wait 50 µs before providing CLK
// Can come up with Power Supply
// Follow power-up timing
Use Default Register
Settings?
Yes
tSTABLE wait time
No
Set START = 0
Send SDATAC Command
// Registers can be written during tSTABLE wait time
// Device wakes up in RDATAC mode
// Changing register settings can occur during tSTABLE wait time.
Configure Registers
using WREG command
// Changing register settings can occur during tSTABLE wait time.
Send RDATAC command
Set START = 1
Capture Data
// Put device back in RDATAC mode
// Start conversions again
// Changing register settings can occur during tSTABLE wait time.
// Monitor for DRDY to shift data out
Figure 65. Initial Flow at Power-Up
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11 Power Supply Recommendations
11.1 Power-Up Timing
Settled data from the ADS131E08S are available within 3 ms of power-up if a strict timing sequence is followed.
Before device power-up, all digital and analog inputs must be held low. Provide the master clock 50 µs after the
analog and digital supplies reach 90% of their nominal values, shown as tPCLK in Figure 66. Pull the RESET pin
high following the tPRST timing to bring the ADC digital filters out of a reset state and to begin the conversion
process.
Settled data are available at the first DRDY falling edge, shown as tSETTLE in Figure 66. These data are from the
settled digital filter; however, the first data set may not be a settled representation of the input because additional
time is required for the reference and critical voltage nodes to settle to their final values. The tSTABLE timing adds
the recommended wait time for settled data to be available at the ADC output. When the tSTABLE time has
passed, the next DRDY falling edge indicates a valid conversion result of the input signal where both the digital
filter and node voltages are settled.
90%
AVDD
tPCLK
CLK
tPRST
§
§
RESET
tSETTLE
tSTABLE
§
§
DRDY
Figure 66. Power-Up Timing Diagram
Table 22. Power-Up Sequence Timing
MIN
tPCLK
tPRST
Delay time, first external CLK rising edge after AVDD reaches 90%
50
Delay time, internal oscillator start-up after AVDD reaches 90%
20
MAX
UNIT
µs
Delay time, RESET rising edge after first CLK rising edge
2
tCLK
(1)
2312
tCLK
2.2
ms
tSETTLE
Settling time, first settled data after RESET rising edge
tSTABLE
Settling time, valid data after RESET rising edge
(1)
TYP
Timing is for the 4-kSPS data rate; see Table 5 for digital filter settling times for different data rates.
To deviate from the default register settings, write to the ADS131E08S registers after pulling the RESET pin high.
Changes to any of the registers delay the tSETTLE start point until the register write is complete. If the data rate is
changed following the RESET pin going high, the tSETTLE timing takes on the settling characteristics of Table 5
relative to the completion of the command.
58
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11.2 Recommended External Capacitor Values
The ADS131E08S power-up time is set by the time required for the critical voltage nodes to settle to their final
values. The analog supplies (AVDD and AVSS), digital supply (DVDD), and internal node voltages (VCAPx pins)
must be up and stable when the data converter samples are taken to ensure performance. The combined current
sourcing capability of the supplies and size of the bypass capacitors dictate the ramp rate of AVDD, AVSS, and
DVDD. The VCAPx voltages are charged internally using the supply voltages. Table 23 lists the internal node
voltages, their function, and recommended capacitor values to optimize the power-up time.
Table 23. Recommended External Capacitor Values
PIN
FUNCTION
RECOMMENDED
CAPACITOR VALUE
28
Band-gap voltage for the ADC
470 pF to AVSS
VCAP2
30
Modulator common-mode
270 nF to AVSS
VCAP3
55
PGA charge pump
270 nF to AVSS
VCAP4
26
Reference common-mode
270 nF to AVSS
VREFP
24
Reference voltage after the internal buffer
330 nF to AVSS
1 µF each to AVSS
NAME
NO.
VCAP1
AVDD
19, 21, 22, 56, 59
Analog supply
AVDD1
54
Internal PGA charge pump analog supply
1 µF to AVSS1
AVSS
20, 23, 32, 57, 58
Analog supply
1 µF each to AVDD
AVSS1
53
Internal PGA charge pump analog supply
1 µF to AVDD1
DVDD
48, 50
Digital supply
1 µF each to DGND
11.3 Device Connections for Unipolar Power Supplies
Figure 67 shows the ADS131E08S connected to a unipolar supply. In this example, the analog supply (AVDD) is
referenced to the analog ground (AVSS) and the digital supply (DVDD) is referenced to the digital ground
(DGND). The ADS131E08S supports an analog supply range of AVDD = 2.7 V to 5.25 V when operated in
unipolar supply mode.
3V
3V
1.8 V
1 F
1 F
1 F
AVSS
AVSS1
AVDD1
AVDD
DVDD
VREFP
VREFN
330 nF
VCAP1
RESV1
VCAP2
Device
VCAP3
VCAP4
AVSS1 AVSS
DGND
270 nF
270 nF
270 nF
470 pF
NOTE: Place the supply, reference, and VCAP1 to VCAP4 capacitors as close to the package as possible.
Figure 67. Unipolar Power Supply Operation
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11.4 Device Connections for Bipolar Power Supplies
Figure 68 shows the ADS131E08S connected to a bipolar supply. In this example, the analog supply (AVDD) is
referenced to the analog ground (AVSS) and the digital supply (DVDD) is referenced to the digital ground
(DGND). The ADS131E08S supports an analog supply range of AVDD and AVSS = ±1.5 V to ±2.5 V when
operated in bipolar supply mode.
2.5 V
2.5 V 1.8 V
1 F
1 F
0.1 F
AVSS
AVSS1
AVDD1
AVDD
DVDD
VREFP
VREFN
Device
RESV1
VCAP1
330 nF
-2.5 V
VCAP2
VCAP3
VCAP4
AVSS1
AVSS
DGND
270 nF
270 nF
270 nF
470 pF
2.5 V
2.5 V
NOTE: Place the supply, reference, and VCAP1 to VCAP4 capacitors as close to the package as possible.
Figure 68. Bipolar Power Supply Operation
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12 Layout
12.1 Layout Guidelines
Use a low-impedance connection for ground so that return currents flow undisturbed back to their respective
sources. For best performance, dedicate an entire PCB layer to a ground plane and do not route any other signal
traces on this layer. Keep connections to the ground plane as short and direct as possible. When using vias to
connect to the ground layer, use multiple vias in parallel to reduce impedance to ground.
A mixed-signal layout sometimes incorporates separate analog and digital ground planes that are tied together at
one location; however, separating the ground planes is not necessary when analog, digital, and power-supply
components are properly placed. Proper placement of components partitions the analog, digital, and powersupply circuitry into different PCB regions to prevent digital return currents from coupling into sensitive analog
circuitry. If ground plane separation is necessary, then make the connection at the ADC. Connecting individual
ground planes at multiple locations creates ground loops, and is not recommended. A single ground plane for
analog and digital avoids ground loops.
Bypass supply pins with a low-equivalent series resistance (ESR) ceramic capacitor. The placement of the
bypass capacitors must be as close as possible to the supply pins using short, direct traces. For optimum
performance, the ground-side connections of the bypass capacitors must also be low-impedance connections.
The supply current flows through the bypass capacitor terminal first and then to the supply pin to make the
bypassing most effective (also known as a Kelvin connection). If multiple ADCs are on the same PCB, use wide
power-supply traces or dedicated power-supply planes to minimize the potential of crosstalk between ADCs.
If external filtering is used for the analog inputs, use C0G-type ceramic capacitors when possible. C0G
capacitors have stable properties and low-noise characteristics. Ideally, route differential signals as pairs to
minimize the loop area between the traces. Route digital circuit traces (such as clock signals) away from all
analog pins. The internal reference output return shares the same pin as the AVSS power supply. To minimize
coupling between the power-supply trace and reference return trace, route the two traces separately; ideally, as
a star connection at the AVSS pin.
Short, direct interconnections must be made on analog input lines and stray wiring capacitance must be avoided,
particularly between the analog input pins and AVSS. These analog input pins are high-impedance and are
extremely sensitive to extraneous noise. Treat the AVSS pin as a sensitive analog signal and connect directly to
the supply ground with proper shielding. Leakage currents between the PCB traces can exceed the input bias
current of the ADS131E08S if shielding is not implemented. Keep digital signals as far as possible from the
analog input signals on the PCB.
The SCLK input of the serial interface must be free from noise and glitches. Even with relatively slow SCLK
frequencies, short digital signal rise and fall times can cause excessive ringing and noise. For best performance,
keep the digital signal traces short, using termination resistors as needed, and make sure all digital signals are
routed directly above the ground plane with minimal use of vias. Figure 69 shows the ideal placement of system
components.
Ground Fill or
Ground Plane
Supply
Generation
Interface
Transceiver
Microcontroller
Device
Optional: Split
Ground Cut
Signal
Conditioning
(RC Filters
and
Amplifiers)
Ground Fill or
Ground Plane
Optional: Split
Ground Cut
Ground Fill or
Ground Plane
Connector
or Antenna
Ground Fill or
Ground Plane
Figure 69. System Component Placement
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12.2 Layout Example
Figure 70 shows an example layout of the ADS131E08S requiring a minimum of two PCB layers. The example
circuit is shown for either a unipolar analog supply connection or a bipolar analog supply connection. In this
example, polygon pours are used as supply connections around the device. If a three- or four-layer PCB is used,
the additional inner layers can be dedicated to route power traces. The PCB is partitioned with analog signals
routed from the left, digital signals routed to the right, and power routed above and below the device.
Via to AVSS pour or plane.
DGND
DVDD
DGND
CLKSEL
AVSS1
AVDD1
AVSS
AVSS
VCAP3
AVDD
AVDD
RLDREF
RLDINV
RLDIN
RLDOUT
WCT
Via to digital ground pour or plane.
Input filtered with differential and common-mode
capacitors.
IN8N
DVDD
IN8P
DRDY
IN7N
GPIO4
IN7P
GPIO3
IN6N
GPIO2
IN6P
DOUT
IN5N
GPIO1
IN5P
DAISY_IN
ADS131E08S
IN4N
SCLK
AVSS
RESV1
VCAP2
NC
VCAP1
NC
VCAP4
VREFP
VREFN
DGND
AVSS
DIN
IN1P
AVDD
PWDN
IN1N
AVDD
RESET
IN2P
AVSS
CLK
IN2N
AVDD
START
IN3P
TESTN_
PACE_OUT2
CS
IN3N
TESTP_
PACE_OUT1
IN4P
Long digital input lines terminated with resistors to prevent
reflection.
Reference, VCAP, and power-supply decoupling capacitors
close to pins.
Figure 70. ADS131E08S Layout Example
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13 Device and Documentation Support
13.1 Documentation Support
13.1.1 Related Documentation
ADS131E04, ADS131E06, ADS131E08 Data Sheet, SBAS561
REF5025 Data Sheet,
13.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.3 Trademarks
E2E is a trademark of Texas Instruments.
SPI is a trademark of Motorola.
All other trademarks are the property of their respective owners.
13.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Jan-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS131E08SPAG
ACTIVE
TQFP
PAG
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
ADS131E08S
ADS131E08SPAGR
ACTIVE
TQFP
PAG
64
1500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
ADS131E08S
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jan-2016
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
PAG (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
48
0,08 M
33
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
1,05
0,95
0°– 7°
0,75
0,45
Seating Plane
0,08
1,20 MAX
4040282 / C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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