Texas Instruments | LM98519 10-bit 65 MSPS 6 Channel Imaging Signal Processor (Rev. C) | Datasheet | Texas Instruments LM98519 10-bit 65 MSPS 6 Channel Imaging Signal Processor (Rev. C) Datasheet

Texas Instruments LM98519 10-bit 65 MSPS 6 Channel Imaging Signal Processor (Rev. C) Datasheet
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LM98519
SNAS425C – OCTOBER 2007 – REVISED OCTOBER 2014
LM98519 10-bit 65 MSPS 6 Channel Imaging Signal Processor
1 Features
3 Description
•
•
The LM98519 is a fully integrated, high performance
10-Bit, 65 MSPS signal processing solution for digital
color copiers, scanners, and other image processing
applications. High-speed signal throughput is
achieved with an innovative six channel architecture
utilizing Correlated Double Sampling (CDS), or
Sample and Hold (SH) type sampling. 1x or 2x gain
settings are available in the CDS/SH input stage.
Each channel has a dedicated 1x to 10x (8 bit) PGA
that allows accurate gain adjustment of each channel.
The Digital White Level auto calibration loop can
automatically set the PGA value to achieve a
selected white target level. Each channel also has a
±4-bit coarse and ±10-bit fine analog offset correction
DAC that allows offset correction before the sampleand-hold amplifier. These correction values can be
controlled by an automated Digital Black Level
correction loop. The PGA and offset DACs for each
channel are programmed independently allowing
unique values of gain and offset for each of the six
channels. A 2-to-1 multiplexing scheme routes the
signals to three 65-MHz high performance ADCs. The
fully differential processing channels achieve
exceptional noise immunity, having a very low noise
floor of -67.5 dB. The 10-bit analog-to-digital
converters have excellent dynamic performance
making the LM98519 transparent in the image
reproduction chain.
1
•
•
•
•
•
•
•
•
•
3.3-V Single Supply Operation
CDS or S/H Processing with Negative Input Signal
Polarity
32.5-MHz Channel Rate
Enhanced ESD Protection on Host Interface Pins:
SHP, SHD, CLPIN, BLKCLP, AGC_ONB, MCLK,
RESETB, SENB, SCLK, SDI, SDO
Low Power CMOS Design
4-Wire Serial interface
2 Channel Symmetrical Architecture
Independent Gain and Offset Correction for Each
Channel
Digital Black Level Calibration for Each Channel
Digital White Level Calibration for Each Channel
Programmable Input Clamp
2 Applications
•
•
•
•
Digital Color Copiers
Scanners
Image Processing Polarity applications
Key Specifications
– Maximum Input Level:
– 1.19 Vp-p (CDS Gain = 1.0)
– 0.58 Vp-p (CDS Gain = 2.1)
– Input Sample Rate:
– 5 to 32.5 MSPS – 6ch Mode
– 10 to 32.5 MSPS – 3ch Mode
– PGA Gain Range: 1x to 10x (0 to 20 dB)
– CDS/SH Gain Settings: 1x or 2.1x
– Total Channel Gain: 1x to 20x (0 to 26 dB)
– PGA Gain Resolution: 8 Bits – Analog
– ADC Resolution: 10 Bits
– ADC Sampling Rate: 10 to 65 MSPS
– SNR: 67.5 dB (Gain = 1x)
– Offset DAC Range:
– ±111 mV or ±60 mV – FDAC
– ±277 mV – CDAC
– Offset DAC Resolution:
– ±10 Bits – FDAC
– ±4 Bits – CDAC
– Supply Voltage: 3.0 V to 3.6 V
– Power Dissipation: 1.04 W (Typical)
Device Information(1)
PART NUMBER
LM98519
PACKAGE
BODY SIZE (NOM)
TQFP (80)
12.00 mm × 12.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
Red
CDAC
+/- 4
FDAC
+/- 10
1x or 2.1x gain
White Level Loop
Black Level Loop
8
OSR1
Input
Bias
OSR2
Input
Bias
Σ
CDS/
SH
PGA
Σ
CDS/
SH
PGA
10
M
U
X
8
FDAC
CDAC
10
ADC
White Level Loop
Black Level Loop
+/- 10
+/- 4
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM98519
SNAS425C – OCTOBER 2007 – REVISED OCTOBER 2014
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
7
1
1
1
2
3
5
Absolute Maximum Ratings ...................................... 5
Handling Ratings....................................................... 5
Recommended Operating Conditions....................... 6
Thermal Information .................................................. 6
Electrical Characteristics........................................... 7
Serial Interface Timing ............................................ 10
Detailed Description ............................................ 15
7.1
7.2
7.3
7.4
Overview .................................................................
Functional Block Diagrams .....................................
Feature Description.................................................
Device Functional Modes........................................
15
15
17
27
7.5 Programming........................................................... 33
7.6 Register Maps ......................................................... 41
8
Application and Implementation ........................ 49
8.1 Design Requirements.............................................. 49
8.2 Detailed Design Procedure ..................................... 49
9
Power Supply Recommendations...................... 50
9.1 Over Voltage Protection on OS Inputs.................... 50
10 Layout................................................................... 51
10.1 Layout Guidelines ................................................. 51
10.2 Layout Example .................................................... 52
11 Device and Documentation Support ................. 53
11.1
11.2
11.3
11.4
Documentation Support ........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
53
53
53
53
12 Mechanical, Packaging, and Orderable
Information ........................................................... 53
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C
Page
•
Added, updated, or revised the following sections: Device Information Table, Application and Implementation; Power
Supply Recommendations; Layout; Device and Documentation Support; Mechanical, Packaging, and Ordering
Information ............................................................................................................................................................................. 1
•
Changed 68 db to 67.5 db in Description section. ................................................................................................................. 1
Changes from Revision A (April 2013) to Revision B
•
2
Page
Changed layout of National data sheet to TI format............................................................................................................... 1
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SNAS425C – OCTOBER 2007 – REVISED OCTOBER 2014
5 Pin Configuration and Functions
VSSA
VREFTIN1
VREFBIN1
VREFTIN2
VREFBIN2
65
64
63
62
61
VDDA
OSR1
67
66
VSSA
OSR2
69
68
VDDA
OSG1
71
VSSA
OSG2
73
72
70
VDDA
OSB1
75
74
VSSA
OSB2
76
VCLP EXT
78
77
SHP/SAMPLE
VCLP INT
80
79
80-Pin
PFC Package
(Top View)
SHD/HOLD
VDDD
VSSD
CLPIN
BLKCLP
IBIAS
VSSD
AGC_ONB
1
60
2
59
VREFBOUT
VREFTOUT
3
58
VDDA
4
57
VREF
5
56
VSSA
6
55
VSSD
7
54
VDDD
8
53
SDO
MCLK
VSSO
VDDO
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
9
52
SENB
51
50
SDI
SCLK
12
49
RESETB
13
48
VDDO
14
47
VSSO
15
46
DR9
16
45
DR8
17
44
DR7
18
43
DR6
19
42
DR5
20
41
DR4
38
39
40
DR2
DR3
DR0
DR1
36
37
VDDO
34
35
DG9
32
33
DG7
DG8
VSSO
30
31
DG5
28
29
DG3
DG4
26
27
DG2
25
DG0
DG1
23
24
VSSO
VDDO
21
22
DB9
VREG
11
DG6
LM98519
80-PIN TQFP
(Top View)
10
Pin Functions (1)
PIN
(1)
TYPE
DESCRIPTION
NUMBER
NAME
1
SHD/ HOLD
DI
Data Clamp Pulse
2, 54
VDDD
PI
Digital Power Supply
3, 7, 55
VSSD
PI
Digital Power Supply Ground
4
CLPIN
DI
Input Pulse That Invokes an Input Clamp Switch
5
BLKCLP
DI
Input Pulse that Invokes a Black Clamp Calibration Loop
Pulldown 108kΩ
6
IBIAS
AO
Optional IBIAS resistor connection. To minimize device to device power
consumption variation, connect an 11k Ohm 1% resistor to VSSA. If no resistor is
used, the internal bias and power supply currents will be subject to normal device to
device variation.
8
AGC_ONB
DI
Input Pulse that Invokes the White Calibration Loop. Tie high to disable White
Clamp. Pulse Low to initiate White Clamp. (Active Low)
Pulldown 108kΩ
A – Analog, D – Digital, P – Power, I – Input, O – Output, PD – Pull-down resistor to VSSD, PU – Pull-up resistor to VDDD
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Pin Functions(1) (continued)
PIN
TYPE
NUMBER
NAME
DESCRIPTION
9
MCLK
DI
Master Clock Input
10, 23, 35, 47
VSSO
PI
Output Driver Power Supply Ground
11, 24, 36, 48
VDDO
PI
Output Driver Power Supply
12-21
DB0–DB9
DO
Bit 0 – Bit 9 of the Blue Channel
22
VREG
PO
Decoupling connection for VREG – Internal Voltage for Logic
25-34
DG0–DG9
DO
Bit 0 – Bit 9 of the Green Channel
37-46
DR0–DG9
DO
Bit 0 – Bit 9 of the Red Channel
39
DR2 (TESTO0)
DO
Bit 2 of Red Channel Data or TESTO0 timing monitor output (Timing monitor output
selected by setting Register 0x00, Bit 1 = 1)
40
DR3 (TESTO1)
DO
Bit 3 of Red Channel Data or TESTO1 timing monitor output (Timing monitor output
selected by setting Register 0x00, Bit 1 = 1)
49
RESETB
DI
Master Reset Input (Active Low)
Pulldown 108 kΩ
50
SCLK
DI
Serial Clock for the 4-wire Serial Interface
51
SDI
DI
Serial Input Data for the 4-wire Serial Interface
52
SENB
DI
Serial Enable (Active Low) for the 4-wire Serial Interface
Pulldown 108 kΩ
53
SDO
DO
Serial Output Data for the 4-wire Serial Interface
56, 65, 69, 73,
77
VSSA
PI
Analog Power Supply Ground
57
VREF
AO
Reference Voltage Bypass
58, 67, 71, 75
VDDA
PI
Analog Power Supply
59
VREFTOUT
AO
Top Reference Bypass. Connect to bypass capacitors (see applications section) and
VREFTINx. – Approx. 2.23 V output (2)
60
VREFBOUT
AO
Bottom Reference Bypass. Connect to bypass capacitors (see applications section)
and VREFBINx. – Approx. 0.98 V output (2)
61
VREFBIN2
AI
Bottom Reference Input Voltage for the ADC. Connect to VREFBOUT.
62
VREFTIN2
AI
Top Reference Input Voltage for the ADC. Connect to VREFTOUT.
63
VREFBIN1
AI
Bottom Reference Input Voltage for the AFE. Connect to VREFBOUT.
64
VREFTIN1
AI
Top Reference Input Voltage for the AFE. Connect to VREFTOUT.
66
OSR1
AI
Input Voltage 1 for the Red Channel
68
OSR2
AI
Input Voltage 2 for the Red Channel
70
OSG1
AI
Input Voltage 1 for the Green Channel
72
OSG2
AI
Input Voltage 2 for the Green Channel
74
OSB1
AI
Input Voltage 1 for the Blue Channel
76
OSB2
AI
Input Voltage 2 for the Blue Channel
78
VCLP_EXT
AI
External Clamp Voltage
79
VCLP_INT
AO
Internally Supplied V-Clamp Voltage
80
SHP/ SAMPLE
DI
Pedestal Clamp Pulse
(2)
4
Voltages provided for debugging only. Not an ensured specification.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply Voltage
–0.3
4.2
V
Voltage at any Pin (except VREG)
–0.3
VDDD + 0.3
V
Voltage at VREG Pin
–0.3
2.1
V
Input Current at any Pin (2)
±25
mA
Package Input Current (2)
±50
mA
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
When the input voltage (VIN) at any pin exceeds the power supplies [VIN < (GND – 0.3 V) or VIN > (VDDA + 0.3 V)], the DC current at
that pin should be limited to ±25 mA. The 50 mA DC maximum package input current means that a maximum of two pins can
simultaneously have input currents that equal 25 mA.
6.2 Handling Ratings
Tstg
Storage temperature range
V(ESD)
Electrostatic discharge
(1)
(3)
(4)
UNIT
150
°C
2500
Human body model (HBM, rated for the following pins
only: SHP, SHD, CLPIN, BLKCLP, AGC_ONB, MCLK,
RESETB, SENB, SCLK, SDI, SDO). (3)
7500
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins (4)
(2)
MAX
–65
Human body model (HBM), per ANSI/ESDA/JEDEC
JS-001 (2)
Machine model (MM)
(1)
MIN
V
250
1000
Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each
pin. Charged device model (CDM) simulates a pin slowly acquiring charge (such as from a device sliding down the feeder in an
automated assembler) then rapidly being discharged.
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 2500-V HBM allows
safe manufacturing with a standard ESD control process.
Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 7500-V HBM allows
safe manufacturing with a standard ESD control process
Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 1000-V CDM allows safe
manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Analog Supply Voltage Range
3.0
3.6
V
Digital Supply Voltage Range
3.0
3.6
V
Output Supply Voltage Range
2.25
VDDD
V
Voltage at any Digital I/O Pin
0
VDDD
V
Voltage at any Analog Input Pin
0
VDDA
V
Voltage at any Data Output Pin
0
VDDO
V
Specified Temperature Range
0
70
°C
DC Power Supply Voltage Relationships (1)
(1)
VDDD ≥ VDDA, VDDD ≥ VDDO
Static voltage levels on VDDD must be at the same voltage or slightly higher than VDDO or VDDA. Therefore, driving all three power
supplies from a common linear voltage regulator is recommended. Please see the following diagram.
VIN
VDDD
Vreg
+
+
VDDA
+
+
VDDLVDS
+
6.4 Thermal Information
LM98519
THERMAL METRIC (1)
PFC
UNIT
80 TERMINALS
RθJA
(1)
6
Junction-to-ambient thermal resistance
32
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics
The following specifications apply for VDDA = VDDD = VDDO = 3.3 V; FMCLK = 65 Ms/s and TA =+25°C unless otherwise
noted. Boldface limits apply for TA = TMIN to TMAX. All other limits apply for TA =+25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
–2.4
–0.75 to
0.9
MAX
UNIT
ADC/AFE
Resolution
No missing codes
Gain = 1x
10
INL
–0.99
DNL
Noise Floor (SNR) (1)
lsb
–0.55 to
0.7
Gain = 6x
–0.65 to
0.85
Gain = 1x
67.5
Gain = 6x
55
1.5
lsb
dB
Peak-to-peak, CDS gain = 1x
1.12
1.19
1.29
Peak-to-peak, CDS gain = 2.1x
0.55
0.58
0.62
Analog Input Leakage (Osx inputs)
GND < Vin < VDDA
Source Follower Enabled – OVP off
–330
±25
140
Input Clamp Impedance
From bench and design
Conversion Ratio
CDS/SH Gain Setting = 1x
PGA gain setting = Min
(Typical values by design) (2)
Analog Input Range
RCLAMP
1.95
–1.85 to
2.0
Gain = 6x
Gain = 1x
bits
V
nA
Ω
43
0.78
0.85
Conversion Ratio
Color to Color Error
0.26%
Conversion Ratio
Ch1 to Ch2 Error
0.13%
0.92
lsb/mV
Crosstalk – Color to Color
R1,B1 to G1; R1,G1 to B1, etc.
R2, B2, to G2; R2, G2, to B2, etc.
Gain = 20x setting
0.8%
Crosstalk – Ch1 to Ch2
R1 to R2, R2 to R1, G1 to G2, G2
to G1, B1 to B2, B2 to B1
Gain = 20x setting
0.3%
PD
3.3 V
1041
1271
mW
IDDA
3.3 V
257
mA
3.3 V
58
mA
3.3 V
70
mA
153
201
mW
20
20.9
dB
IDDD
Active Mode Power Consumption
IDDO
Power-Down Mode
Power Consumption
PD
3.3 V – MCLK Active
PGA (8 bits) Gain = 283/(283-M)
PGA Gain Range (3)
Max Setting/Min Setting
PGA Max Stepsize
Largest PGA Step
19.5
0.3
PGA Monotonicity
dB
Monotonic
PGA Error (Difference from ideal
curve)
1.15%
CDS/SH
CDS/SH Gain
(1)
(2)
(3)
Gain at 2x / Gain at 1x
2
2.1
2.13
V/V
SNR = 20log(1024/Output Noise(lsb rms)) with input = DC
For conversion ratio min/max, variation and error, Conversion ratio is: (Digital Max – Digital Min)/(Vin Max – Vin Min). Measured at gain
setting of 1x
PGA gain range is: [(ADC_OUT(PGA at 1111111111)) / (ADC_OUT(PGA at 0000000000))]
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Electrical Characteristics (continued)
The following specifications apply for VDDA = VDDD = VDDO = 3.3 V; FMCLK = 65 Ms/s and TA =+25°C unless otherwise
noted. Boldface limits apply for TA = TMIN to TMAX. All other limits apply for TA =+25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
Large FDAC range
102
110.5
120
Small FDAC range
51
59.5
68
UNIT
OFFSET FDAC (±10 bits)
DAC Full Scale (input referred)
DAC Monotonicity
±mV
Monotonic
OFFSET CDAC (±4 bits)
DAC Full Scale (input referred)
255
277
DAC Monotonicity
300
±mV
Monotonic
LOGIC I/O DC PARAMETERS
VIH
Logic Input Voltage High
SHP, SHD, CLPIN, BLKCLP,
AGC_ONB, MCLK, SCLK, SDI,
SENB
VIL
Logic Input Voltage Low
SHP, SHD, CLPIN, BLKCLP,
AGC_ONB, MCLK, SCLK, SDI,
SENB
IIN
Logic Input Leakage
VOH
Logic Output Voltage High
VOL
Logic Output Voltage Low
VRES
Power On Reset Threshold
2.0
V
0.8
Excludes AGC_ONB, BLKCLP,
SENB, RESETB due to pull-ups or
pull-downs on those pins
–100
65
VDDD = 3.6 V, Iout = -0.5 mA
3.3
3.56
VDDD = 3.0 V, Iout = -0.5 mA
2.7
2.9
100
nA
V
VDDD = 3.6 V, Iout = 1.6 mA
0.11
0.2
VDDD = 3.0 V, Iout = 1.6 mA
0.11
0.2
From simulation
1.18
1.5
6 channel mode
10
65
3 channel mode
10
32.5
V
V
AFE/ADC TIMING
fMCLK
MCLK frequency
MCLK Duty Cycle
Input Sampling Rate
tRESET
RESETB Pulse Width
tRESET_CLR RESETB Clear Time
tSHD
8
SHP/SHD high period
45%
55%
6 Channel Mode
5
32.5
3 Channel Mode
10
32.5
MCLK Present Mode
MCLK Idle Mode
2
tMCLK
ns
MCLK Idle Mode (ensured by
design)
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MS/s
50
MCLK Present Mode (ensured by
design)
Ensured by design
MHz
8.2
3
tMCLK
10
ns
ns
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Electrical Characteristics (continued)
The following specifications apply for VDDA = VDDD = VDDO = 3.3 V; FMCLK = 65 Ms/s and TA =+25°C unless otherwise
noted. Boldface limits apply for TA = TMIN to TMAX. All other limits apply for TA =+25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
9
13
SH2 Mode
10.5
14.5
SH1b Mode
2.4
5
CDSb Mode
1.8
4
SH3 Mode – ADC Rate MCLK
tMCS_MIN
MCLK high to SAMPLE high
(Minimum) (4)
SH3 Mode – ADC Rate MCLK
tHMC_MIN
tMCH_MIN
HOLD high to MCLK high
(Minimum) (4)
MCLK high to HOLD high
(Minimum) (4)
3.5
–0.7
3
SH1b Mode
–2.1
2
CDS Mode
–3.1
1
1
5
5
6.9
0.2
1
SH3 Mode – ADC Rate MCLK
Aperture delay
tAD
4
Aperture delay variation
tBCLPINB,
tBLKCLP
CLPIN/BLKCLP Pulse Width
tIS
CLPIN/BLKCLP Setup
tIH
CLPIN/BLKCLP Hold
tC_B
tLAT(2)
(high or low)
ns (5)
ns (5)
ns
ns
2
tMCLK
3
ns
3
ns
6 Channel mode
16
3 Channel mode
10
6 Channel Mode
6 Channel Mode, ADC Rate MCLK
11
Channel 1 Latency
6 Channel Mode, Pixel Rate MCLK
5
6 Channel Mode
6 Channel Mode, ADC Rate MCLK
12
Channel 2 Latency
6 Channel Mode, Pixel Rate MCLK
5.5
3 Channel Mode Latency
3 Channel Mode ADC=Pixel Rate
MCLK
11
CLPIN neg. edge to BLKCLP start
tLAT(1)
tLAT
0.7
SH2 Mode
UNIT
Pixels
tMCLK
tMCLK
tMCLK
Pixel Rate MCLK:
tOD
(4)
(5)
(6)
Output Data Delay
6 Channel Mode – Channel 1
2
5.2
8
6 Channel Mode – Channel 2
2
5
8
6 Channel Mode – Channel 1
3
6
9
6 Channel Mode – Channel 2
3
6
9
3 Channel Mode
2
5.4
9
ns (6)
ADC Rate MCLK:
ns
Refer to Sampling Timing Diagrams
Measured with AFEPHASE = 11. For other AFEPHASE settings,these sample input timings will shift earlier with respect to MCLK as
follows. (tHMC will increase by these amounts, tMCH will decrease by these amounts):
(a) AFEPHASE = 10 – Earlier by ¼ pixel period
(b) AFEPHASE = 01 – Earlier by ½ pixel period
(c) AFEPHASE = 00 – Earlier by ¾ pixel period
In Pixel Rate MCLK mode, the output data delay for Channel 2 data may be different under certain conditions of low MCLK duty cycle (<
50%). In that case the approximate output data delay tOD will increase by the following: (50 – MCLK Duty Cycle Percent)/100 * TMCLK
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6.6 Serial Interface Timing
MIN
TYP
MAX
UNIT
tCP
SCLK period
50
ns
tWH
SCLK High width
20
ns
tWL
SCLK Low width
20
ns
tIS
SDI Setup time
5
ns
tIH
SDI Hold time
5
ns
tSENSC
SENB low before SCLK rising
5
ns
tSCSEN
SENB high after SCLK rising
5
ns
tSENW
SENB high width (1)
tOD
(1)
10
SDO Output delay
50
ns
5
tMCLK
2
10
ns
SENB high pulse width should be > 50 ns when MCLK is not supplied. It should be > 5 MCLK when MCLK_ALIVE bit is set to 1 and
MCLK is supplied.
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tRESET _CLR
MCLK
Reset
Internal
VDDA
VRES
Figure 1. POR - Power On Reset
tRESET
tRESET_CLR
MCLK
RESETB
Figure 2. RESETB Input Timing
90%
MCLK
90%
10%
10%
tR
tIH
CLPIN/
BLKCLP
tIS
tF
90%
90%
10%
10%
Note: CLPIN and BLKCLP are sampled or latched on the rising edge of MCLK by default .
Figure 3. Input Setup and Hold Timing
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Pixel(n)
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Pixel(n+1)
OSR1/2
OSG1/2
OSB1/2
tAD
tAD
SAMPLE
tSHD
HOLD
tMCH
tCL
tCH
tMCLK
tHMC
MCLK
tLAT(2)
tLAT(1)
tOD
tOD
DATA
Ch.1(n)
Ch.2(n) Ch1.(n+1)Ch2.(n+1)
Above timing relationships between SAMPLE, HOLD and MCLK are for AFEPHASE = 11.
For other AFEPHASE settings, the sampling timing can move earlier by ¼, ½ or ¾ pixel period with respect to
MCLK, but the latency as shown above will remain constant.
Figure 4. Output Latency and Timing – 6 Channel Mode – ADC Rate MCLK
Pixel(n)
OSR1/2
OSG1/2
OSB1/2
Pixel(n+1)
tAD
tAD
SAMPLE
tSHD
HOLD
tHMC
tMCH
tCL
tCH
tMCLK
MCLK
tLAT(2)
tLAT(1)
tOD2
tOD1
DATA
Ch.1(n) Ch.2(n) Ch.1(n+1)
Above timing relationships between SAMPLE, HOLD and MCLK are for AFEPHASE = 11.
For other AFEPHASE settings, the sampling timing can move earlier by ¼, ½, or ¾ pixel
period with respect to MCLK, but the latency as shown above will remain constant.
Figure 5. Output Latency and Timing – 6 Channel Mode – Pixel Rate MCLK
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Pixel(n+1)
Pixel(n)
OSR1
OSG1
OSB1
tAD
tAD
SAMPLE
tSHD
HOLD(n)
HOLD
tHMC
tCL
tMCH
tCH
MCLK
tMCLK
tLAT
tOD
DATA
Data(n)
Data(n+1)
Above timing relationships between SAMPLE, HOLD, and MCLK are for AEPHASE = X1.
For other AEPHASE setting X0, the sampling timing can move earlier by ½ pixel period with respect to MCLK,
but the latency as shown above will remain constant.
Figure 6. Output Latency and Timing – 3 Channel Mode
tOD
MCLK
DOUT
Output data is updated on the rising edge of MCLK. Data can be latched using the falling edge
of MCLK.
Figure 7. Data Capture Timing – 6 Channel – ADC Rate MCLK
MCLK
DOUT
tOD
tOD
Output data is updated on both edges of MCLK. Due to the internal timing delays in the LM98519,
from MCLK to DOUT, the data can be safely latched using both edges of MCLK.
Figure 8. Data Capture Timing – 6 Channel – Pixel Rate MCLK
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tOD
MCLK
DOUT
Output data is updated on the rising edge of MCLK and can be latched using the falling
edge of MCLK.
Figure 9. Data Capture Timing – 3 Channel
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7 Detailed Description
7.1 Overview
The LM98519 is a fully integrated, high performance 10-Bit, 65 MSPS signal processing solution for digital color
copiers, scanners, and other image processing applications. High-speed signal throughput is achieved with an
innovative six channel architecture utilizing Correlated Double Sampling (CDS), or Sample and Hold (SH) type
sampling.
7.2 Functional Block Diagrams
Red
CDAC
+/- 4
FDAC
+/- 10
1x or 2.1x gain
White Level Loop
Black Level Loop
8
OSR1
OSR2
Input
Bias
Input
Bias
Σ
Σ
CDS/
SH
CDS/
SH
PGA
10
M
U
X
10
ADC
PGA
8
FDAC
CDAC
White Level Loop
Black Level Loop
+/- 10
+/- 4
Figure 10. Channel Block Diagram
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Functional Block Diagrams (continued)
Figure 11. Chip Block Diagram
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7.3 Feature Description
7.3.1 Input Clamping and Biasing Circuitry
Many sensor input signals will be at a different common mode voltage than that of the LM98519 input circuitry. In
these applications, AC coupling is used to block the DC voltage difference between the source and the AFE
inputs. Input clamp circuits are used to set the AFE input at the proper common mode voltage.
Initial coarse clamping should be done using the PIB (Passive Input Bias) and/or AIB (Active Input Bias) circuitry.
Setting the PIB enable bit connects 1-kΩ pull-up and pull-down resistors to the inputs to rapidly charge them to
VDDA/2. Setting the AIB bit connects the VCLPEXT reference voltage to the inputs via low impedance switches.
Either method will bring the input voltage very close to the desired level of VDDA/2.
The AIB and PIB must be disabled during normal operations.
During image capture, black level clamping is done by connecting the input pins to an internal reference voltage
through a low impedance switch. The clamp is turned on periodically to correct any droop in the DC input voltage
and minimize conversion errors.
The clamp switch will be turned on during the “Black” portion of the input signal when the input is at a known
voltage level. The clamp will connect the inputs to a reference level of approximately 1.65 V. Optionally, a
customer supplied reference voltage can be applied at the VCLPEXT pin. Clamp timing is controlled by the
CLPIN input signal in combination with the register bit ANDen and the internal SAMPLE timing signal.
CLPIN can directly control the internal Clamp, or the combination of CLPIN and SAMPLE can be used. Clamping
only during SAMPLE ensures that the input is clamped to the “Black” level rather than the average of “Black”,
“Reset” and reset noise feed through signals.
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Feature Description (continued)
1 per OS input
Note: Switches are closed when control input = 1.
750 Ω
1 kΩ
4.7 uF
OS
To SH/CDS
CCD
1 kΩ
OVP_int
0x01, b4
PIB
0x00, b6
RDIV
0x04, b7
VCLPEXT
10 uF
AIB
0x00, b7
ClpMode
0x02, b0
MUX
0
1
Configuration register
control bits
SAMP CLK
CLPIN
R1
Vclamp
Buffer
R1
VCLPINT
VCLP Buff
0x00, b2
Figure 12. Input Protection and Clamping and Biasing Circuit
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Feature Description (continued)
CCD Power Up
Dummy Pixel(s)
Optical Black Pixels
Valid Pixels
Sensor
Outputs
VDDA /2
OSR1/2
OSG1/2 0 V
OSB1/2
(B)
(C)
0.7 V
(A)
CLPIN
(C)
BLKCLP
tCLPIN
tBLKCLP
MCLK
Internal
Sample
Timing
Clamp
Switch
Control
Clamp Control = 1
Clamp
Switch
Control
Clamp Control = 0
PIB
and/or
AIB
OVP
(B)
(A)
Note: Waveforms not to scale.
Waveforms not to scale
Figure 13. Input Protection Clamping and Biasing – Operation Example
Input clamping happens in two stages as indicated by A and B in Figure 13:
(A) During initial system power up, the OVP clamp circuit should be enabled by register setting (Register
0x01, Bit 4 = 1). This provides a path for current to flow as the sensor is powered up, and the large common
mode voltage output of the sensor reaches a steady state value. Once the sensor voltages have stabilized,
the OVP circuit can be disabled. At this point the OS inputs will still be approximately 0.7 V above ground.
Settling to 99% of final voltage will take approximately 18 ms for a 4.7-µF capacitance, assuming a 750-Ω
diode/switch impedance.
(B) Then, the PIB and/or AIB circuits should be enabled to bring the OS inputs up to approximately VDDA/2
volts. After the OS voltages have charged to this level, the PIB and AIB biasing should be turned off. Settling
to within 1mV of VDDA/2 will take approximately 18 ms for a 4.7-µF capacitance, assuming a 500-Ω
charging resistance.
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Feature Description (continued)
(C) During image acquisition, accurate DC clamping is provided by the CLPIN switch. This switch is enabled
when the CLPIN input is asserted. In most applications, the Clamp Control bit (Register 0x02, Bit 0) should
be set to gate the CLPIN signal with the internal sampling pulse. This will ensure that clamping is only done
during the image portion of the optical black pixels. Settling to 1 mV for a 10 mV ΔV between the pedestal
and black will take:
(1/(%dwell) × 1/(% samp time) × Rsw × Cin × 5)
Settling Time = (1/(32/7600 pixels)) × 1/(50%) × 40 Ω × 4.7 µF × 5 = 447 ms.
(1)
(2)
Smaller input capacitors will result in proportionally smaller settling times for all clamping modes.
7.3.2 Input Connections for 3 Channel Operation
For three channel only applications, the unused inputs should be connected with 10-kΩ resistors to VCLP_EXT
to minimize noise coupling into the active inputs.
OSR1
OSR2
OSG1
OSB1
OSB2
VCLP_EXT
OSG2
10 kΩ
Figure 14. Input Connections for 3 Channel Operation
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Feature Description (continued)
7.3.3 AFE References
A low noise reference structure is incorporated in the LM98519. Outputs (VREFTOUT approx. 2.23 V,
VREFBOUT approx. 0.98V) and inputs (VREFTIN1, VREFTIN2, VREFBIN1, VREFBIN2) are provided to allow
decoupling capacitors to be connected. VREFTOUT should be connected to VREFTIN1 and VREFTIN2.
VREFBOUT should be connected to VREFBIN1 and VREFBIN2. Recommended capacitance is 1.0 µF between
the top and bottom reference source, with 0.1 µF to AGND from both the top and bottom reference source.
Connection and decoupling capacitor traces should all be as short as possible, and digital signals should be kept
away from this area. Internal connections from VREFTOUT to VREFTIN1,2 and VREFBOUT to VREFBIN1,2 are
present to reduce the impedance between outputs and inputs, but external connections should still be used for
the best performance
VREFTOUT
0.1 μF
VREFTIN1
VREFTIN2
1 μF
+
0.1 μF
VREFBIN1
VREFBIN2
VREFBOUT
0.1 μF
Figure 15. Reference Decoupling Example
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Feature Description (continued)
7.3.4 Offset Control
Analog offset is provided before the ADC.
Two offset DACs are used to provide a coarse (CDAC) and fine (FDAC) offset that is applied prior to the
CDS/SH stage.
• The offset CDAC (Coarse DAC) provides ±277 mV with ±4 bits of resolution in offset binary format.
• The offset FDAC (Fine DAC) provides ±111 mV (Large FDAC range) or ±60 mV (Small FDAC range) with
±10 bits of resolution in offset binary format. The FDAC range is controlled by the FDAC range bit for each
color channel, in Register 0x03h, bits 3, 4, 5.
Table 1. Offset Binary Format
CDAC (±4 bit) Offset Binary Format
FDAC (±10 bit) Offset Binary Format
Hex.
Dec.
Offset Voltage
(mV)
Hex.
Dec.
Offset Voltage
(mV)
Offset Voltage
(mV)
1F
+15
+277
7FF
+1023
+111
+60
11
+1
+18.5
401
+1
+0.109
+0.059
10
0
0
400
0
0
0
0F
–1
–18.5
3FF
–1
–0.109
–0.059
01
–15
–277
001
–1023
–111
–60
00
–16
–277
000
–1024
–111
–60
Table 2. CDAC Step Sizes
CDS/SH+PGA Gain
CDAC LSB
ADC LSB
1x
1
15.7
10x
1
157
20x
1
314
Table 3. FDAC Step Sizes
FDAC Range
CDS/SH+PGA Gain
FDAC LSB
ADC LSB
Small
1x
1
0.05
Small
10x
1
0.50
Small
20x
1
1.00
Large
1x
1
0.09
Large
10x
1
0.93
Large
20x
1
1.8
7.3.5 Black Level Calibration (Offset)
Black level correction may be performed through one of two available methods: automatic or manual.
7.3.5.1 Manual Offset Adjustment
The manual method is intended for use with processing systems where the desired black level correction loop is
external to the LM98519. In this mode the external processor controls the Black Level Offset registers.
Offset adjustment should be done using the average data from multiple Black pixels. The offset will be adjusted
to set the Black pixel data as close as possible to the desired target value.
First the CDAC is adjusted until the error is reduced as much as possible given the CDAC step size for the
current channel gain. (1 CDAC lsb = (15.7 to 314) ADC lsb depending on gain). Once the error is minimized with
the CDAC, the FDAC is used to further converge the Black pixel data towards the target value.
After changing the channel gain, it may be desirable to repeat the offset adjustment.
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7.3.5.2 Automatic Offset Adjustment
NOTE
During Automatic Offset Adjustment, the CDAC and FDAC register settings are Read
Only.
During automatic black level calibration, the CDAC (coarse analog offset DAC) is used to bring the black level as
close to the target as possible given the CDAC resolution.
Then the FDAC (Fine analog offset DAC) is applied to further converge the output to the desired black level
target.
Two basic modes are available:
• CDAC and FDAC enabled – Used to converge to accurate Black target level as quickly as possible.
• FDAC Only mode – Used to maintain Black target level while avoiding large changes to offset. In FDAC only
mode, the CDAC value is fixed, and the automatic adjustments only affect the FDAC.
CDAC and FDAC mode should be used to set the gain after power up and between scanning operations. FDAC
Only mode should be used during scanning, to prevent large changes in offset from occurring in the image data.
When using CDAC and FDAC mode, the value stored in Registers 0x25 and 0x26 is used to optimize trading of
CDAC and FDAC steps. The default value is 321 decimal. To achieve the best trading, this value can be
changed to 314 decimal. If the large FDAC range is enabled, this value should be changed to 184 decimal.
Use of the automatic mode involves enabling the black level offset auto-calibration bit in the black level clamp
control register through the serial interface.
The ADC output value is averaged over the programmed number of pixels and subtracted from the desired black
level code stored in the target black level register. The result of the subtraction may then be integrated by a
preset scaling factor, effectively smoothing any sharp transitions present in the black level signal, before the
resulting calculated offset is finally applied. The offset integration scaling factor is stored in the black level loop
control register. The integration scaling values range from offset/2 to offset/128.
High Speed mode can be enabled to provide rapid initial convergence, with slower, more accurate convergence
to the target value. High Speed mode is enabled by setting Register 0x23, Bit 1 = 1. The High Speed Mode
offset integration value is set at Register 0x23, Bit 4. Two other parameters control the regions of operation
around the target black value. The High Speed Mode Threshold and Hysteresis registers control the points
where the transition from High Speed Mode to normal mode is made. When operating in High Speed Mode, the
chip will transition to normal mode when Black Error < High Speed Threshold. When operating in Normal Mode,
the chip will transition to High Speed Mode when Black Error > (High Speed Threshold + Hysteresis).
In automatic mode, the black level is determined from the ADC output during the Optical Black Pixels. The
BLKCLP input pin is used to identify when the black pixels are being input to the IC. The rising edge of the
BLKCLP input signal signals the beginning of the Optical Black Pixels. Alternatively, the Auto BLKCLP Pulse
Generation (Register 0x23h, Bit 3) can be set to 1 to generate this signal internally. In that case, the BLKCLP
pulse will begin 16 (6 channel mode) or 10 (3 channel mode) pixels after the falling edge of the CLPIN signal.
Regardless of the source providing the BLKCLP start signal, the BLKCLP pulse duration is controlled by the Pixel
Averaging setting in the BLKCLP_CTRL Register (0x24h, Bits 5:3).
NOTE
At high gain settings, it is possible that the Automatic Offset Adjustment may reach the full
scale CDAC setting and fail to recover. In this case, the Automatic Offset Adjustment
should be disabled, the CDAC and FDAC settings should be centered, and then the
Automatic Offset Adjustment should be enabled.
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Dummy Pixels
Optical Black Pixels
Valid Pixels
Valid Pixels
OSR1/2
OSG1/2
OSB1/2
CLPIN
(input)
CLPIN
(internal)
BLKCLP
(input)
BLKCLP
(internal)
tCLPIN
tBLKCLP
MCLK
Note: tBLKCLP is controlled by BLKCLP_CTRL Register (0x24h, Bits 7:3)
Figure 16. Black Calibration Timing – Manual BLKCLP
Valid Pixels
Dummy Pixels
Optical Black Pixels
Valid Pixels
OSR1/2
OSG1/2
OSB1/2
tC_B
CLPIN
(input)
CLPIN
(internal)
BLKCLP
(internal)
tCLPIN
tBLKCLP
MCLK
Note: tBLKCLP is controlled by BLKCLP_CTRL Register (0x24h, Bits 7:3)
Figure 17. Black Calibration Timing – Automatic BLKCLP
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7.3.5.3 Gain Control
The PGA provides a range from 1x to 10x gain with 8 bits of resolution. The gain curve is nominally:
Gain = 283/(283-M)
where
•
M is the 8-bit gain setting value from 0 to 255
(3)
In addition, the CDS/SH stage provides a 1x or 2.1x gain, giving an overall channel gain of 1x to 20x (0 dB to 26
dB).
20
Gain
15
10
5
253
239
225
211
197
183
169
155
141
127
113
99
85
71
57
43
29
15
1
0
Gain Setting
(1)
Min gain=1.0, max gain=10, max step=0.300dB; CDS Gain set to 2x.
(2)
Red = gain in dB; Black = Gain by Ratio
(3)
PGA Gain = 283/(283-M); M = 0 to 255
Figure 18. LM98519 8-Bit PGA Gain Curve
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7.3.5.4 White Level Calibration (AGC - Automatic Gain Control)
10
OSx
SH Gain
PGA
10
ADC Output
ADC
8
x1 or x2
Gain Control Logic
Note: CDS/SH Gain Bit Shared
between Even/Odd Channels
Target White Level
Figure 19. White Level Calibration
During Automatic Gain Adjustment, the PGA and CDS/SH gain settings are Read Only.
The white calibration loop allows the LM98519 to automatically set the gain for the desired maximum ADC
output. A digital input pin or configuration register bit is used to start the loop. This would normally be done once
per page, or as needed for the particular system design. When triggered, the loop processes the output data
during the defined white pixel range. The pixel range can be selected from a minimum of 1 pixel to a maximum of
65535 pixels. The starting pixel can be selected via the PK_DET_ST register at 0x2Ah, 0x2Bh and is referred to
the rising edge of either the CLPIN or BLKCLP signal. The number of pixels is selected by the PK_DET_WID
register at 0x2Ch, 0x2Dh.
During processing, a moving window average is performed. The size of the window is set by the PK_AVE
register at 0x29, Bits 2:0. The window size is adjustable from 1 (no averaging) to 32 pixels. As each window
average is calculated, the value is compared to the previous Peak White value (at the start of the line, the initial
Peak White value is set to 0). If the new average is larger than the previous Peak White value, the Peak White
value is replaced with the new average value. The window position is then incremented by 1 pixel and the
process is repeated until the window average has processed all PK_DET_WID pixels.
If the AGC_ONB input is pulsed, the white calibration loop will operate for a fixed number of lines at the
beginning of the scan. This duration is selected via the AGCDuration register at 0x2Eh. Valid settings are from 1
to 255 decimal. A duration setting of 0 will cause the loop to not run.
CLPIN or
BLKCLP
WHTCLP
White Pixels
PK_DET_ST
PK_DET_WID
AGC_ON
Bit
AGC_ONB
Pin
Figure 20. AGC Loop
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When the AGC_ONB input is pulsed, the register bit AGC_ON is set. The AGC_ON bit is cleared when the loop
is terminated, which is when the number of lines allocated for the loop are exhausted. The AGC_ONB pin should
be asserted for minimum of two pixels and should be deasserted before the loop is complete and the AGC_ON
register bit is cleared.
Register 0x01, Bit 5 selects the polarity of the AGC_ONB input. The default is 0 for active low.
When the AGC loop begins operation, the AGC STATUS at Register 0x33, will be automatically cleared (as long
as the serial interface mode bit at Register 0x01, Bit 3 is set to 1, MCLK present). At the end of the AGC loop
operation, the AGC STATUS register can be read to check that the loop successfully converged for all channels.
The status value should be 0x00 to indicate no Convergence Errors.
While the AGC loop is operating, a timing source is needed to provide a consistent reference point at the
beginning of each line of pixels. Register 0x28, Bit 5 is used to select either the CLPIN or BLKCLP as the timing
source. If Bit 5 = 0, the timing reference is the rising edge of CLPIN. If Bit 5 = 1, the timing reference is the rising
edge of BLKCLP. The register setting PK_DET_ST selects the number of pixel after this timing reference that
pixel averaging begins. The register setting PK_DET_WID selects the number of pixels after PK_DET_ST that
are processed.
The purpose of the white loop is to find the correct gain setting so the brightest white pixels are at a specific ADC
code target. The target value is set in the AGCTargetMSB and AGCTargetLSB registers. The target value is
calculated from the register value as shown:
AGC_TARG = 512d + (AGCTargetMSB[7:0]+AGCTargetLSB[7])
(4)
Table 4. AGC Target Values
AGCTargetMSB
(REGISTER 0x2F)
AGCTargetLSB
(REGISTER 0x30)
AGC_TARG
BINARY
AGC_TARG
DECIMAL
11111111
1
1111111111
1023
11111111
0
1111111110
1022
10000000
1
1100000001
769
10000000
0
1100000000
768
00000000
1
1000000001
513
00000000
0
1000000000
512
7.3.6 Operating Mode Description
The white loop provides two different techniques for converging to the target value, Binary Search, and
Incremental Search.
The Binary Search algorithm is intended to provide a rapid convergence to the target value. During initial
operation, large changes in the channel gain are allowed. After each line, the allowed change is reduced
significantly. For final convergence, the algorithm switches to the Incremental Search mode, to achieve low error.
The Incremental or Linear Search algorithm is intended to provide a low error, but will converge more slowly than
the Binary method. The changes (if any) in channel gain are always done in 1 lsb increments to provide low
overshoot and high accuracy of convergence.
7.4 Device Functional Modes
7.4.1 AFEPHASEn Details for SHP/SHD Input Mode
The SHP (sample reference) and SHD (sample signal) inputs are combined with the selected AFEPHASEn
signal to generate the internal CLAMP and SAMPLE signals respectively. The SHP signal is ANDed with
AFEPHASEn. The SHD signal is ANDed with the inverted AFEPHASEn signal.
The best performance will be achieved by selecting the AFEPHASEn timing that has the high period completely
overlapping the SHP input timing, and the low period completely overlapping the SHD timing.
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Device Functional Modes (continued)
7.4.2 AFEPHASEn Details for SAMPLE and HOLD Input Mode
In Sample/Hold mode, the SAMPLE and HOLD inputs are used. The rising edge of SAMPLE defines the start of
the sample control pulse, and the rising edge of HOLD defines the end of the sample control pulse. This sample
control pulse is then gated by the low period of the AFEPHASEn signal to generate the resulting SAMPLE signal
used internally.
The AFEPHASEn signal which has the low period overlapping the sample control pulse will give the best
performance.
7.4.3 AFEPHASEn: 6 Channel and 3 Channel Modes
In 6 Channel Mode, there are two full cycles of MCLK and ADCCLK for each sensor pixel period. This allows the
two AFE channels to be multiplexed into the single ADC. In this mode, there are 4 possible AFEPHASEn timings
available.
In 3 Channel Mode, there is only one cycle of MCLK and ADCCLK per pixel period. Because of this, there are
only 2 choices for AFEPHASEn, as shown in Figure 21 through Figure 23.
7.4.4 LM98519 AFEPHASE Synchronization
There are three main modes of operation for the LM98519
1. 6 channel mode using ADC Rate MCLK – Clock Doubler is bypassed
2. 6 channel mode using Pixel Rate MCLK – Clock Doubler is used
3. 3 channel mode using Pixel Rate MCLK – Clock Doubler is bypassed
In case #1, where an ADC rate (2x of pixel rate) clock is input, the LM98519 needs one additional signal to
ensure synchronization between the internal sampling phases and the pixel rate input signal.
This synchronization is done using the CLPIN input signal in combination with MCLK. The CLPIN input generates
an internal reset signal that sets the internal AFEPHASE state machine into a known relationship with MCLK and
CLPIN. This ensures the AFEPHASE sampling is synchronized to the host sensor timing.
Figure 21 through Figure 23 indicate the phase relationship between MCLK and AFEPHASE when CLPIN is
used for synchronization.
28
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Device Functional Modes (continued)
T
(Note 1)
Typical
CCD Out
MCLK
mclk_int
CLPIN
(Notes 6,7)
4.5 MCLK
AFEPHASE
= 0,0
AFEPHASE
= 0,1
AFEPHASE
= 1,0
AFEPHASE
= 1,1
6.0 MCLK
(Note 2)
SAMPLE
Sample timing for
AFEPHASE = 1,1
(Notes 3,4,5)
HOLD
1) T = MCLK Period = 1/2 Pixel Period
2) Rising edge of SAMPLE must be at least 8 ns before rising edge of HOLD
3) Rising edge of HOLD can be up to t MCH after rising edge of MCLK (AFEPHASE = 1,1)
4) In SH1a,SH1b modes, the rising edge of HOLD can be up to t HMC before the rising edge of MCLK (AFEPHASE = 1,1)
5) In SH2 mode, HOLD can be up to t HMC ns before the rising edge of MCLK (AFEPHASE=1,1)
6) CLPIN must be high or low for at least 2 input MCLK cycles
7) CLPIN is latched by the rising or falling edge of MCLK selectable by Register 0x04h, Bit 5.
Figure 21. 6 Channel Mode – ADC Rate MCLK
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Device Functional Modes (continued)
T
Note 1
Typical
CCD Out
MCLK
mclk_int
CLPIN
(Notes 6,7)
2.75 MCLK
AFEPHASE
= 0,0
AFEPHASE
= 0,1
AFEPHASE
= 1,0
AFEPHASE
= 1,1
3.5 MCLK
Note 2
SAMPLE
Sample timing for
AFEPHASE = 1,1
Notes 3,4,5
HOLD
1) T = MCLK Period = Pixel Period
2) Rising edge of SAMPLE must be at least 8 ns before rising edge of HOLD
3) Rising edge of HOLD can be up to tMCH after falling edge of MCLK (AFEPHASE = 1,1)
4) In SH1a,SH1b modes, the rising edge of HOLD can be up to tHMC before the falling edge of MCLK (AFEPHASE = 1,1)
5) In SH2 mode, HOLD can be up to tHMC before the rising edge of MCLK (AFEPHASE=1,1)
6) CLPIN must be high or low for at least 2 input MCLK cycles
7) CLPIN is latched by the rising or falling edge of MCLK selectable by Register 0x04h, Bit 5.
Figure 22. 6 Channel Mode – Pixel Rate MCLK
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Device Functional Modes (continued)
T
Note 1
Typical
CCD Out
MCLK
CLPIN
(Notes 6,7)
3.5 MCLK
AFEPHASE
= X,0
AFEPHASE
= X,1
4.0 MCLK
SAMPLE:
Sample timing for
AFEPHASE
= X,1
Note 2
Notes 3,4,5
HOLD
1) T = MCLK Period = Pixel Period
2) Rising edge of SAMPLE must be at least 8 ns before rising edge of HOLD
3) Rising edge of HOLD can be up to tMCH after falling edge of MCLK (AFEPHASE = 1,1)
4) In SH1a, SH1b modes, the rising edge of HOLD can be up to tHMC before the rising edge of MCLK (AFEPHASE = 1,1)
5) In SH2 mode, HOLD can be up to tHMC before the rising edge of MCLK (AFEPHASE = 1,1)
6) CLPIN must be high or low for at least 2 input MCLK cycles
7) CLPIN is latched by the rising or falling edge of MCLK selectable by Register 0x04h, Bit 5.
Figure 23. 3 Channel Mode – Pixel Rate = ADC Rate MCLK
7.4.5 Sampling Timing Diagrams
NOTE
4 (6 Channel Mode) or 2 (3 Channel Mode) AFEPHASE settings are available to provide
flexibility of sample timing.
For ease of use, AFEPHASE = 11 is the default setting in 6 channel mode, and AFEPHASE = X1 is the default
setting for 3 channel mode, as shown in select diagrams. Specified values for these timings are measured at
AFEPHASE = 11. For other AFEPHASE settings,these sample input timings will shift earlier with respect to
MCLK as follows:
• AFEPHASE = 10 – Earlier by ¼ pixel period
• AFEPHASE = 01 – Earlier by ½ pixel period
• AFEPHASE = 00 – Earlier by ¾ pixel period
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Device Functional Modes (continued)
tMCS
tMCH
tHMC
CCD Output
MCLK
SAMPLE
HOLD
tSHD
(Assumes rising edges of external pulses are active)
Figure 24. SH3 Timing Mode – ADC Rate Clock Input (Pixel Rate MCLK not Supported in SH3)
tMCS
tHMC
CCD Output
AFEPHASE01
MCLK
SAMPLE
HOLD
tSHD
(Assumes rising edges of external pulses are active)
Figure 25. SH2 Timing Mode – ADC Rate Clock Input
tMCS
tHMC
CCD Output
AFEPHASE01
MCLK
SAMPLE
HOLD
tSHD
(Assumes rising edges of external pulses are active)
Figure 26. SH2 Timing Mode – Pixel Rate Clock Input
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Device Functional Modes (continued)
tMCS
tMCS
tHMC
tHMC
CCD Output
AFEPHASE01
MCLK
SAMPLE
HOLD
tSHD
tSHD
(Assumes external pulses are active high)
Figure 27. SH1b/CDSb Timing Mode – ADC Rate Clock Input
tMCS
tMCS
tHMC
tHMC
CCD Output
AFEPHASE01
MCLK
SHP
SHD
tSHD
tSHD
(Assumes external pulses are active high)
Figure 28. SH1b/CDSb Timing Mode – Pixel Rate Clock Input
7.5 Programming
7.5.1 Using Black Pixel Average
In most applications, the Black Pixel Average bit should be set.
During loop operation, the ADC_MAX or average maximum ADC value is found during the white pixels. The
Black Pixel Average value is then subtracted from this ADC_MAX value to find the present white value. This
ADC_WHT value is then used for comparison to the target white pixel value TARG_WHT. This is done to
eliminate the effects that changes in the system gain will have on the Black Pixel Average value. As gain is
increased or decreased, the previously calibrated Black Pixel Average value will change also. When the white
loop operation is complete, the gain is set to provide the proper white level referenced to the Black Pixel Average
value. Then the Black Loop will be run once more to set the Black Pixel Average at the desired level, and the
White level will still be calibrated to the proper level.
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Programming (continued)
In addition, the following registers should be initialized before starting the loop:
Table 5. Initialize Registers Before Loop
REGISTER
FUNCTION
PK_DET_ST
(0x2Ah, 0x2Bh)
Start of the white pixel averaging in pixels from rising edge of CLPIN or BLKCLP
PK_DET_WID
(0x2Ch, 0x2Dh)
Number of pixels in each line over which white pixels are averaged
AGCDuration
(0x2Eh)
Duration in number of lines the loop should run. If set to 0, the loop will not run. Valid settings are 1 to 255.
AGCTarget
(0x2Fh, 0x30h)
AGC target, between 512 to 1023
AGCTolerance
(0x31h)
Allowed error margin from the target value
AGC_BLKINT
(0x32h)
Black Offset Integration, if used
AGC_CONFIG
(0x28h)
Select reference edge CLPIN or BLKCLP rising edge, Enable/Disable
AGC_ONB Pin, Incremental Search Enable, Black Offset Enable
After all registers are initialized, the AGC_ON bit (0x28h, b0) can be set, or the AGC_ONB pin can be pulsed to
start the white loop.
7.5.2 Sample Timing Control
Sample timing is controlled through the combination of the selected internal AFEPHASEn signal, and one or
several user inputs.
The input timing control pins can operate in two different modes:
SAMPLE and HOLD (Used with S/H mode sampling only)
In this mode, the rising edge of the SAMPLE signal controls the start of the sampling, while the rising edge of
HOLD stops sampling and holds the signal. This mode cannot be used with CDS operation.
SHP and SHD (Used with CDS and S/H modes of sampling)
In this mode, the SHP pulse is used to sample the reference level of the signal, while the SHD pulse is used to
sample the signal (brightness) information when CDS mode is used. If CDS is turned off, then SHD is used to
control the signal sample timing and SHP is not used.
The different input timing modes are selected by bits in Registers 0x00, 0x02, and 0x04, as shown in Table 6:
Table 6. Input Timing Modes
MODE
REG
0x04[1]
REG
0x02[7]
SH3 (Default)
0
SH2
(1)
(2)
(3)
34
REG
0x02[3:2]
REG
0x02[1]
REG
0x00[0]
1
0
0
Sample and Hold mode, clocked by SAMPLE
and HOLD clocks (2)
1
1
0
0
Sample and Hold mode, clocked by SAMPLE
and HOLD clocks (3)
SH1a
1
0
1
0
Sample and Hold mode, clocked by
AFEPHASE (3)
SH1b
1
1
1
0
Sample and Hold mode, clocked by SHD (3)
CDSa
1
0
1
1
CDS mode, sampled by AFEPHASE (3)
CDSb
1
1
1
1
CDS mode, sampled by SHP and SHD
clocks (3)
See (1)
DESCRIPTION
AFEPHASE bits should be set to “11” in SH3 mode (both 3ch and 6ch operation)
AFEPHASE is automatically set by the HOLD input timing. Only ADC Rate MCLK is allowed.
AFEPHASE is synchronized by MCLK and CLPIN inputs
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In modes SH1a and CDSa, the internal Sample or Clamp and Sample timing signals are generated from the
selected AFEPHASEn signal.
In modes SH1b and CDSb, the input SHD or SHD and SHP signals are ‘gated’ by the internal AFEPHASEn
signal to create the internal Sample and Clamp signals.
In mode SH2, the SAMPLE and HOLD timing signals are directly input to the sampling stage of the AFE.
Subsequent stages are still clocked by the selected AFEPHASEn and MCLK.
In mode SH3, the SAMPLE and HOLD timing signals are directly input to the sampling stage of the AFE, and
are also used to set the internal AFEPHASE timing for subsequent stages. In this mode, CLPIN is not
required to set the AFEPHASE timing. SH3 mode only supports ADC Rate MCLK.
Please refer to the timing diagrams in Figure 21 through Figure 23 to see the relationship between the sample
timing inputs and the internal AFEPHASEn signal.
7.5.3 Timing Monitor Outputs
In timing monitor mode, the internal CLAMP and SAMPLE (CDS Mode) or SAMPLE (S/H Mode) timing signals
are output on the DR[3:2] pins. This enables easy confirmation of the actual internal timing configuration. Timing
monitor mode is enabled by setting Register 0x00, Bit 1 = 1.
Table 7 describes the signals present on the DR[2] and DR[3] outputs in the different timing modes:
Table 7. Signal Presets
SAMPLE MODE
DR[2]
DR[3]
PGA Sample B (active low)
SH2, SH3
SH Sample Signal
SH1a, SH1b
SH Sample Signal
SH Sample Signal
CDSa, CDSb
Sample Signal Level
Sample Reference Level
7.5.4 Output Data Test Pattern Generation
Special test patterns will be generated to help in testing data processing. Four basic types of waveform can be
generated and they are:
• Fixed Pattern
• Horizontal Gradation Pattern (main scan)
• Vertical Gradation Pattern (sub-scan)
• Lattice Pattern
By varying the parameters, waveforms of different timing and amplitude can be created. Parameters for the test
patterns are programmable and the following registers are defined:
Table 8. Register Definitions for Test Pattern Parameters
REGISTER
DEFINITION
PK_DET_ST
This register defines the start of the Valid Pixel region from the rising edge of CLMPIN or BLKCLP, in Pixels.
PK_DET_WID
This register defines the duration (pixels) of the Valid Pixel region.
PATSW
Enable/Disable test pattern output.
PATMODE
Sets which test pattern mode is used:
•
00 = Fixed code
•
01 = Horizontal Gradation
•
10 = Vertical Gradation
•
11 = Lattice
PATREGSEL
Test pattern can be initiated on a single color or all three colors at the same time. When only one color is selected, the
other colors are set to maximum 1023 code.
•
00 = All colors
•
01 = Red
•
10 = Green
•
11 = Blue
TESTPLVL
Output code 0 to 1023. In Fixed Pattern it is code output during the Valid Pixel range. During Horizontal Gradation and
Vertical Gradation it is used as the initial code. In Lattice Pattern it is the level during the Valid Pixel range except for the
first pixel every PATW pixels in the horizontal range and for first line every PATW lines.
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Table 8. Register Definitions for Test Pattern Parameters (continued)
REGISTER
DEFINITION
PATW
Gradation pitch, this is interval at which the pattern Code Step provided in PATS register is applied.
PATS
Pattern Code Step, this contains the code step increment applied every PATW interval.
LINE_INT
Test pattern output delay. This defines the delays in number of lines between Red to Green and Green to Blue. This
sequence is fixed, R->G->B, and when this register is 0, all colors switch simultaneously. This delay is used only on the
initial start and the sequence of colors is fixed.
7.5.5 Fixed Pattern
Outputs fixed code in the TESTPLVL register during Valid Pixel range.
7.5.6 Horizontal Gradation
Code in the TESTPLVL is outputted initially in the PATW pixels of the Valid Pixel region, and then code is
incremented by PATS value every PATW pixels for the rest of the active region. If the code reaches the
maximum (less than or equal to 1023), it is reset to the initial value in TESTPLVL and pattern repeated. Same
sequence is repeated for the all the lines.
7.5.7 Vertical Gradation
Code in the TESTPLVL is outputted initially in the first PATW lines of the scan and fixed for all of the Valid Pixel
region, and then the code is incremented by PATS value every PATW lines and the new code is applied during
active region till the next increment. This is repeated till code reaches the maximum (less than or equal to 1023)
then the code is reset to the initial value and the sequence repeated.
7.5.8 Lattice Pattern
This is combination of Horizontal and Vertical Gradation pattern. Here the register PATW defines interval in
pixels for horizontal scan and in lines for the vertical scan. At start of the test the output is set to PATS level for
the whole first line and every line at PATW interval. In rest of the lines of the output goes to PATS for the first
pixel then goes TESTPLVL for PATW-1 pixels, then goes back to PATS for one pixel and then to TESTPLVL for
PATW-1 pixels, the cycle repeats till the end of line.
All test pattern generation continues once initiated by setting of PATSW till it is reset.
CLPIN/BLKLP
MCLK
TESTPLVL
ADC_OUT
0x000
PK_DET_ST
PK_DET_WID
FIXED TEST PATTERN
PK_DET_ST
PK_DET_WID
TESTPLVL = Start Code
PK_DET_ST = Start of Pixel Area in # of Pixels
PK_DET_WID = Pixel Area Width in # of Pixels
Figure 29. Fixed Test Pattern
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CLPIN/BLKLP
PATW
PATS
TESTPLVL
ADC_OUT
0x000
PK_DET_ST
PK_DET_WID
PK_DET_ST
PK_DET_WID
TESTPLVL = Start Code
PK_DET_ST = Start of Pixel Area in # of Pixels
PK_DET_WID = Pixel Area Width in # of Pixels
PATS = Pattern Step in Codes
PATW = Pattern Pitch in # of pixels
GRADATION (main scan) PATTERN
Figure 30. Gradation (Main Scan) Pattern
CLPIN/BLKLP
PATW
PATW
PATS
PATS
TESTPLVL
ADC_OUT
0x000
PK_DET_ST
PK_DET_WID
GRADATION (sub scan) TEST PATTERN
TESTPLVL = Start Code
PK_DET_ST = Start of Pixel Area in # of Pixels
PK_DET_WID = Pixel Area Width in # of Pixels
PATW = Pattern Pitch in # of Lines
PATS = Pattern Step in # of Codes
Figure 31. Gradation (Sub Scan) Test Pattern
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CLPIN/BLKLP
TESTPLVL
PATS
ADC_OUT
0x000
PATW
PK_DET_ST
CLPIN/BLKLP
PK_DET_ST
Valid Pixel Area
1 pixel
Valid Pixel Area
PK_DET_WID
Valid Pixel Area
Valid Pixel Area
PK_DET_WID
PATS
ADC_OUT
0x000
PATW in Lines
LATTICE PATTERN
TESTPLVL = All of Valid Pixel area except where PATS is defined
PK_DET_ST = Start of Valid Pixel Area in # of Pixels
PK_DET_WID = Valid Pixel Area Duration in # of Pixels
PATW = Pattern Pitch in # of pixels for the main scan, and in # of lines for the sub-scan
PATS = Pattern Step in # of Codes. Asserted for 1 pixel every PATW pixels in main scan
For 1 line every PATW lines during sub-scan
Figure 32. Lattice Pattern
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7.5.9 Serial Interface
The serial control interface is based on the common microwire interface with a few specific timing details, as
shown below. Bits A5, A4, A3, A2, A1, A0 select the configuration register currently being written to or read
within the flat register space.
NOTE
The serial interface is initially configured to work in the absence of MCLK. Once MCLK is
established, the configuration can be changed to work with MCLK. This is done by setting
the Serial Interface Mode bit in Register 0x01, bit 3 = 1. Operation with MCLK will reduce
any timing restrictions required in the non-MCLK mode. In addition, the Auto Clear of AGC
Status will only work in MCLK Present mode.
7.5.10 Serial Write
tSENW
tCP
SENB
tSENSC
tW
tSENSC
SCLK
X
X
tIH
SDI
tW
X
tIS
0 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
X
0 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0
X
SDO
HiZ
Figure 33. Serial Write
•
•
•
•
•
•
•
•
The positive edge of SCLK is used to receive data on SDI.
Last 15 bits of data before SEN toggled high will be loaded into AFE.
A command whose length is less than 15 bits will be discarded.
SDO will be Hi-Z during write operation.
At the second cycle shown above, either read or write command is possible.
The MODE bit must be “0” when writing to registers.
A Write command consists of one MODE bit, 6 address bits and 8 data bits.
While SEN is high, the AFE will accept either high or low with respect to SCLK and SDI.
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7.5.11 Serial Read
tSENW
tCP
SENB
tSENSC
tW
tSENSC
SCLK
X
tIH
SDI
tW
X
1 A5 A4 A3 A2 A1 A0
X
tIS
1 A5 A4 A3 A2 A1 A0
X
SDO
X
D7 D6 D5 D4 D3 D2 D1 D0
tOD
Figure 34. Serial Read
•
•
•
•
•
•
•
•
•
•
40
The positive edge of SCLK is used to receive data on SDI.
Last 15 bits of data before SEN goes high will be loaded.
Command whose length is less than 15 bits will be discarded.
Readout data will appear on SDO at the second cycle above.
The readout data is clocked at the positive edge of SCLK.
SDO is Hi-Z except when read out data appears on SDO.
At the second cycle shown above, either read or write command is possible.
The MODE bit must be “1” when reading from registers.
A Read command will contain one MODE bit, 6 address bits, and 8 dummy data bits which are ignored.
While SEN is high, the AFE will accept either high or low with respect to SCLK and SDI.
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7.6 Register Maps
7.6.1 Configuration Registers
Table 9. Register Summary
HEX ADDRESS
(A5-A0)
REGISTER NAME
COMMENTS
0x00 to 0x06
Configuration 0 to 6
Configuration settings
0x07
Device Revision
0x08
GA_R1
0x09
C_OFFS_R1
0x0A
F_OFFS_R1_MSB
0x0B
F_OFFS_R1_LSB
0x0C
GA_R2
0x0D
C_OFFS_R2
0x0E
F_OFFS_R2_MSB
0x0F
F_OFFS_R2_LSB
OS_R1 Channel Gain and Offset Registers
(CDS / SH Gain is NOT located here)
OS_R2 Channel Gain and Offset Registers
0x10 to 0x13
OS_G1 Channel Gain and Offset Registers
0x14 to 0x17
OS_G2 Channel Gain and Offset Registers
0x18 to 0x1B
OS_B1 Channel Gain and Offset Registers
0x1C to 0x1F
OS_B2 Channel Gain and Offset Registers
0x20
TARG_BLK_R
0x21
TARG_BLK_G
0x22
TARG_BLK_B
0x23
Black Level Loop Control
0x24
Black Level Loop Settings
0x25
CDAC Threshold for BLK LP MSB
0x25
CDAC Threshold for BLK LP LSB
0x27
Fast Mode
0x28
White Level Loop Control
0x29
PK_AVG
0x2A
PK_DET_ST_MSB
0x2B
PK_DET_ST_LSB
0x2C
PK_DET_WID_MSB
0x2D
PK_DET_WID_LSB
0x2E
AGCDuration
0x2F
AGCTargetMSB
0x30
AGCTargetLSB
0x31
AGCTolerance
0x32
AGC_BLKINT
0x33
AGC STATUS
0x34 to 0x37
TBD
0x38
Test Pattern Mode
0x39
Test Pattern Settings 1
0x3A
Test Pattern Settings 2
0x3B
PATW
0x3C
PATS
0x3D
LINE_INTVL
0x3E
Reserved
0x3F
Reserved
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7.6.2 Configuration Register Details
Table 10. Configuration Registers Details
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x00 - 0x07 CONFIGURATION REGISTERS
0x00
ANLG_CONFG
0x28
Main Configuration
•
[7] = Active Input Bias (AIB) - Used for initial DC biasing of OS inputs. Disabled during
image capture.
– (0:Disabled, 1:OSx connected to VREF_EXT during input clamping)
•
[6] = Passive Input Bias (PIB) - Used for initial DC biasing of OS inputs. Disabled during
image capture.
– (0:Disabled, 1:Osx connected to Vdd/2 resistor ladder during input clamping)
•
[5] = Source Follower Enable - Used to provide higher impedance at OS inputs. Should
be enabled for most applications.
– (0:Disabled, 1:Enabled)
•
[4] = Analog Power Down
– (0:Normal, 1:Powered Down)
•
[3] = Input Mode Select
– (0:3-channel; 1:6-channel)
– In 3-ch mode, OSR1, OSG1, OSB1 inputs are used.
•
[2] = VCLP Internal Buffer Disable
– (0:Enable VCLP Buffer, 1:Disable VCLP Buffer)
•
[1] = Sample Timing Pulses routed to TESTO outputs
– (0:Tristate, 1:Enable)
– CDSa & CDSb modes:
– SH SAMPLE Timing routed to TESTO_0
– SH CLAMP Timing routed to TESTO_1
– SH1a & SH1b modes:
– SH SAMPLE Timing routed to TESTO_0 & TESTO_1
– SH1a & SH1b modes:
– SH SAMPLE Timing routed to TESTO_0 & TESTO_1
– SH2 & SH3 modes:
– SH SAMPLE Timing routed to TESTO_0
– PGA SAMPLE Timing routed to TESTO_1
•
[0] = Sampling Mode Control
– See Table 6 in Sample Timing Control.
0x01
INTF_CONFG
0x10
Interface Configuration
•
[7:6] = Reserved
•
[5] = AGC_ON pin polarity
– 0 = Active LOW, 1= Active HIGH
•
[4] = OVP Input Protection Enable (clamp signal inputs to 1 diode drop)
– (0:Disabled, 1:Enabled)
•
[3] = Serial Interface Mode – *In MCLK idle mode the AGC Status Auto Clear will not
function. Set to MCLK present to utilize this feature.
– (0:MCLK idle, 1:MCLK present)
•
[2:1] = Reserved – Set to 00
•
[0] = Red/Blue data swap
– (0:normal, 1:R/B swapped)
42
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x02
CLP_CONFG
Sample Timing
Control
0x9C
Clamp Control
•
[7] = Sampling Mode Control
– See Table 6 in Sample Timing Control.
•
[6] = SAMPLE edge selection
– (0: Rising, 1:Falling)
•
[5] = HOLD edge selection
– (0: Rising, 1:Falling)
•
[4] = SHP/SHD input polarity select
– (0:Active Low, 1:Active High)
•
[3:2] = AFEPHASEn setting (00 to 11)
– (Default is 11 in 6 channel mode)
– (Default is X1 in 3 channel mode) Value is 11, but upper bit is ignored in 3 channel
mode.
•
[1] = Sampling Mode Control
– See Table 6 in Sample Timing Control.
•
[0] = Clamp Control
– (0:CLPIN input, 1:Clamp gated by internal sampling pulse)
0x03
CDSG_CONFIG
CDS / SH Gain
Enable
FDAC Range Select
0x00
FDAC Range, CDS Gain Selection
•
[7:6] = Reserved
•
[5] = Blue Channel FDAC Range Select
•
[4] = Green Channel FDAC Range Select
•
[3] = Red Channel FDAC Range Select
– 0: 1 CDAC LSB = 314 FDAC LSBs (Range = +/- 64 mV)
– 1: 1 CDAC LSB = 184 FDAC LSBs (Range = +/- 117 mV)
•
[2] = Blue Channels 1 & 2 Gain Enable (0:1x; 1:2.1x-typ)
•
[1] = Green Channels 1 & 2 Gain Enable (0:1x; 1:2.1x-typ)
•
[0] = Red Channels 1 & 2 Gain Enable (0:1x; 1:2.1x-typ)
0x04
Main Configuration 4
0x00
•
•
•
•
•
•
•
0x05
Main Configuration 5
0x77
•
•
•
•
[7] = pbufen (passive buffer enable)
– 0: disable resistor divider at VCLP_ext
– 1: enable resistor divider at VCLP_ext
[6] = pd_ref
– Power down VREFT/VREFB buffer only
– 0: buffer = power up
– 1: buffer = power down
[5] = CLPIN Sampling Edge Select
– 0: sampled by the rising edge of MCLK
– 1: sampled by the falling edge of MCLK
[4] = Digital Inputs Sampling Edge Select
– 0: sampled by the rising edge of MCLK
– 1: sampled by the falling edge of MCLK
[3:2] = Clock Range Select (TXCLK and ADCCLK are the same frequency. In 6 channel
mode, TXCLK and ADCCLK are 2x the pixel rate.)
– 11,10: TXCLK/ADCCLK running at 10MHz – 20 MHz
– 01: TXCLK/ADCCLK running at 20MHz – 40 MHz
– 00: TXCLK/ADCCLK running at 40MHz – 65 MHz
[1] = Sampling Mode Control
– See Table 6 in Sample Timing Control.
– 1: SH3 mode is disabled.
– 0: SH3 mode is enabled
[0] = clock doubler select
– 1: TXCLK and ADCCLK are 2x MCLK
– 0: TXCLK and ADCCLK are same freq. as MCLK
[7:3] = Reserved (Must be kept with power on default value)
[2] = Output Enable for Blue Channels
[1] = Output Enable for Green Channels
[0] = Output Enable for Red Channels (0:Disable, 1: Enable)
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x06
SRESET
0x00
Soft Reset
•
[1] = FSM Reset, programmable registers are not disturbed.
•
[0] = REG Reset, reset all FSM, except micro-wire interface and programmable
registers
0x07
Device Revision
0x10
Read Only
This number reflects the device revision and updated every time any major or minor change
is made to the silicon.
0x08 – 0x0F Red CHANNEL PGA GAIN, CDAC and FDAC OFFSETS
0x08
GA_R1
0x00
•
[7:0] = Red Channel 1 PGA Gain
– Gain = 283/(283 - [7:0])
– Gain range is from 1x to 10x
0x09
C_OFFS_R1
0x10
•
[4:0] = Red Channel 1 Offset DAC Code
– Offset binary format
0x0A
F_OFFS_R1
0x80
•
[7:0] = Red Channel 1 Fine Offset DAC code [10:3]
– Offset binary format
0x0B
F_OFFS_R1 LSB
0x00
•
•
[7:5] = Red Channel 1 Fine Offset DAC code [2:0]
[4:0] = Reserved
0x0C
GA_R2
0x00
•
[7:0] = Red Channel 2 PGA Gain
– Gain = 283/(283 - [7:0])
– Gain range is from 1x to 10x
0x0D
C_OFFS_R2
0x10
•
[4:0] = Red Channel 2 Offset DAC Code
– Offset binary format
0x0E
F_OFFS_R2
0x80
•
[7:0] = Red Channel 2 Fine Offset DAC code [10:3]
– Offset binary format
0x0F
F_OFFS_R2 LSB
0x00
•
•
[7:5] = Red Channel 2 Fine Offset DAC code [2:0]
[4:0] = Reserved
0x10 – 0x17 GREEN CHANNEL PGA GAIN, CDAC and FDAC OFFSETS
0x10
GA_G1
0x00
•
[7:0] = Green Channel 1 PGA Gain
– Gain = 283/(283 - [7:0])
– Gain range is from 1x to 10x
0x11
C_OFFS_G1
0x10
•
[4:0] = Green Channel 1 Offset DAC Code
– Offset binary format
0x12
F_OFFS_G1
0x80
•
[7:0] = Green Channel 1 Fine Offset DAC code [10:3]
– Offset binary format
0x13
F_OFFS_G1 LSB
0x00
•
•
[7:5] = Green Channel 1 Fine Offset DAC code [2:0]
[4:0] = Reserved
0x14
GA_G2
0x00
•
[7:0] = Green Channel 2 PGA Gain
– Gain = 283/(283 - [7:0])
– Gain range is from 1x to 10x
0x15
C_OFFS_G2
0x10
•
[4:0] = Green Channel 2 Offset DAC Code
– Offset binary format
0x16
F_OFFS_G2
0x80
•
[7:0] = Green Channel 2 Fine Offset DAC code [10:3]
– Offset binary format
0x17
F_OFFS_G2 LSB
0x00
•
•
[7:5] = Green Channel 2 Fine Offset DAC code [2:0]
[4:0] = Reserved
44
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x18 – 0x1F BLUE CHANNEL PGA GAIN, CDAC and FDAC OFFSETS
0x18
GA_B1
0x00
•
[7:0] = Blue Channel 1 PGA Gain
– Gain = 283/(283 - [7:0])
– Gain range is from 1x to 10x
0x19
C_OFFS_B1
0x10
•
[4:0] = Blue Channel 1 Offset DAC Code
– Offset binary format
0x1A
F_OFFS_B1
0x80
•
[7:0] = Blue Channel 1 Fine Offset DAC code [10:3]
– Offset binary format
0x1B
F_OFFS_B1 LSB
0x00
•
•
[7:5] = Blue Channel 1 Fine Offset DAC code [2:0]
[4:0] = Reserved
0x1C
GA_B2
0x00
•
[7:0] = Blue Channel 2 PGA Gain
– • Gain = 283/(283 - [7:0])
– • Gain range is from 1x to 10x
0x1D
C_OFFS_B2
0x10
•
[4:0] = Blue Channel 2 Offset DAC
– Offset binary format Code
0x1E
F_OFFS_B2
0x80
•
[7:0] = Blue Channel 2 Fine Offset DAC code [10:3]
– Offset binary format
0x1F
F_OFFS_B2 LSB
0x00
•
•
[7:5] = Blue Channel 2 Fine Offset DAC code [2:0]
[4:0] = Reserved
0x20 - 0x27 BLACK LEVEL OFFSET CALIBRATION REGISTERS
0x20
TARG_BLK_R
0x20
•
•
[7] = Reserved
[6:0] = Target black level – Red Channel
0x21
TARG_BLK_G
0x20
•
•
[7] = Reserved
[6:0] = Target black level – Green Channel
0x22
TARG_BLK_B
0x20
•
•
[7] = Reserved
[6:0] = Target black level – Blue Channel
0x23
BLKCLP_CTL0
0x0C
Black Level Loop Control
•
[7:6] = # of lines black clamp compensation applied.
– 00 – infinite # of lines (default)
– 01 – 16 lines
– 10 – 32 lines
– 11 – 64 lines
•
[5] = Reserved
•
[4] = High Speed Mode Offset Integration Select
– 1: Divide-by-2
– 0: Divide-by-4/3
•
[3] = Auto BLKCLP Pulse Generation (0:Disable, 1:Enable
•
[2] = Auto black loop Enable (0:Disable. 1:Enable)
•
[1] = High Speed Mode Enable
•
[0] = Auto black loop mode
– 1: Update FDAC offset correction only
– 0: Update CDAC and FDAC Offset Corrections
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x24
BLKCLP_CTRL1
0x84
Digital Black Level Clamp Control
•
[7:3] = Pixel Averaging o 00000 4 pixels o 00001 8 pixels
– 00010 12 pixels
– 00011 16 pixels
– 00100 20 pixels
– 00101 24 pixels
– 00110 28 pixels
– 10000 32 pixels
– 10001 64 pixels
– 10010 96 pixels
– 10011 128 pixels
– 10100 160 pixels
– 10101 192 pixels
– 10110 224 pixels
– 10111 256 pixels
– 11000 288 pixels
– 11001 320 pixels
– 11010 352 pixels
– 11011 384 pixels
– 11100 416 pixels
– 11101 448 pixels
– 11110 480 pixels
– 11111 512 pixels
– other combinations are Reserved
•
[2:0] = Offset Integration
– 000:Divide-by-2
– 001:Divide-by-4
– 010:Divide-by-8
– 011:Divide-by-16
– 100:Divide-by-32
– 101:Divide-by-64
– 110:Divide-by-128
– Reserved
0x25
CDAC_THLD_MSB
0x50
CDAC Threshold for BLK LP MSB Default value is 321d, so loop will change FDAC by 321
to compensate for change of 1 in CDAC.
To optimize even further, this can be changed to 314d.
If FDAC is set to the large range, then this value should be changed to 184d.
•
[7:0] = Threshold[9:2]
0x26
CDAC_THLD_LSB
0x40
CDAC Threshold for BLK LP LSB
•
[7:6] = Threshold[1:0]
•
[5:0] = Reserved. Set to 0.
0x27
High Speed Mode
0x88
•
•
46
[7:5] = High Speed Mode Hysteresis
[4:0] = High Speed Mode Threshold
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x28 – 0x37 WHITE LEVEL GAIN CALIBRATION REGISTERS
0x28
AGC_CONFG
0x00
•
•
•
•
•
•
[7] = Incremental Search Enable
– 0: Binary Search
– 1: Incremental Search
[6] = Black Offset Enable
– 0: Do not Use BLK_AVG during White Level Gain Calibration Loop
– 1: Use BLK_AVG as offset during White Level Gain Calibration Loop
(Recommended)
[5] = CLPIN or BLKCLP White Loop Trigger Select
– 0: CLPIN initiates White Loop each line
– 1: BLKCLP initiates White Loop each line
[4] = AGC_ON pin disable
– = 0 Enable use of AGC_ON pin
– = 1 Disable use of AGC_ON pin to start white calb.loop.
[3:1] = Reserved
[0] = AGC_ON. Write to 1 to enable White Level Loop. (0:Ready, 1:Enabled)
– White Loop can also be enabled by asserting AGC_ON pin of pin is enabled via.
Register 0x28, b4.
0x29
PK_AVE
0x04
Number of pixels in running average during white calibration loop
•
[2:0] =
– 000: No average (1 pixel)
– 001: 2 pixels
– 010: 4 pixels
– 011: 8 pixels
– 100: 16 pixels
– 101: 32 pixels
0x2A
PK_DET_ST_MSB
0x00
Starting pixel for peak detection. 16 bit value. Number of pixels after rising edge trigger
event. (CLPIN or BLKCLP) (0 to 65535)
0x2B
PK_DET_ST_LSB
0x00
0x2C
PK_DET_WID_MSB
0x00
0x2D
PK_DET_WID_LSB
0x00
0x2E
AGCDuration
0x10
•
[7:0] = Number of lines for AGC to operate. Loop will run continuously if AGC_ON pin is
held high. (0 to 255)
0x2F
AGCTargetMSB
0xE0
•
[7:0] = MSB of Target Value for AGC loop (Default AGCTarget=960d) AGC_TARG =
512d + (AGCTargetMSB[7:0],AGCTargetLSB[7])
0x30
AGCTargetLSB
0x00
•
•
[7] = LSb of Target Value for AGC loop
[6:0] = Reserved
0x31
AGCTolerance
0x28
•
•
[7:6] = Reserved
[5:0] = Allowable error for AGC loop
Duration of peak detection after PK_DET_ST. 16 bit value
(0 to 65535)
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Table 10. Configuration Registers Details (continued)
ADDR
(HEX)
REGISTER
NAME
DEFAULT
(HEX)
DESCRIPTION
0x32
AGC_BLKINT
0x00
AGC Offset Integration
•
[2:0] = Offset Integration setting for the Black Level Loop while the AGC is on (i.e. white
level loop)
– 000:Divide-by-2
– 001:Divide-by-4
– 010:Divide-by-8
– 011:Divide-by-16
– 100:Divide-by-32
– 101:Divide-by-64
– 110:Divide-by-128
– Reserved
0x33
AGC STATUS
0x00
AGC Status – Read Only
•
[7:6] = 0
•
[5] = Convergence Error
•
[4] = Convergence Error
•
[3] = Convergence Error
•
[2] = Convergence Error
•
[1] = Convergence Error
•
[0] = Convergence Error
Blue Ch2
Blue Ch1
Green Ch2
Green Ch1
Red Ch2
Red Ch1
0x34
Reserved
0x32
Must be kept with Power-on-default values.
0x35
Reserved
0x54
Must be kept with Power-on-default values.
0x36
Reserved
0x00
Must be kept with Power-on-default values.
0x37
Reserved
0x00
Must be kept with Power-on-default values.
0X38 to 0X3F USER TEST PATTERNS REGISTERS
0x38
TEST_PAT_CTL
0x00
Test Pattern Mode
•
[7] = Test Pattern Enable (PATSW)
– (0:Normal Data Output, 1:Test Pattern Output Enabled)
•
[6:5] = Test Pattern Mode Select (PTRMODE)
– 00:Fixed Code
– 01:Gradation Pattern (Main Scanning)
– 10:Gradation Pattern (Sub Scanning)
– 11:Grid Pattern
•
[4:3] = Test Pattern Output Channel (PTRGBSEL)
– 00:All colors
– 01:Red (Other color data at 1023d)
– 10:Green (Other color data at 1023d)
– 11:Blue (Other color data at 1023d)
•
[2:0] = Reserved
0x39
TESTPLVL_MSB
0x00
•
[7:0] = 8 MSb of fixed output code (TESTPLVL)
0x3A
TESTPLVL_LSB
0x00
•
[7:6] = 2 LSb of fixed output code (TESTPLVL)
0x3B
PATW
0x00
•
[7:0] = Gradation Pattern Pitch (0 to 255 lines)
0x3C
PATS
0x00
•
[7:0] = Gradation Pattern Increment Step (0 to 255)
0x3D
LINE_INTVL
0x00
•
[3:0] = Test Pattern Output Color Delay, Red to Green, Green to Blue (0 to 15 line
delay)
0x3E
Reserved
0x3F
Reserved
48
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Design Requirements
See Figure 36 for an example circuit and the required minimum circuitry around the LM98519.
All power supply voltages should be provided from clean linear regulator outputs, NOT switching power supplies.
8.2 Detailed Design Procedure
1. 3.3-V Power for Analog, Digital, and Outputs (VDDA, VDDD, and VDDO) supplies. It is recommended to use
a common LDO regulator for al 3.3 V supplies, using EMI filter devices and dedicated coupling to isolate any
noise between buses.
2. Input Timing Signals (Ground referenced logic signal with: 2.0 V < VHigh < 3.3 V)
(a) MCLK: Continuous clock signal at pixel rate or ADC rate of LM98519
(b) CLPIN: Once per scan line signal used to control input clamp for DC restoration of AC coupled CCD
input signals
(c) BLKCLP: Once per scan line signal used to indicate beginning of black pixels for Black (Offset) Level
Calibration
(d) AGC_ONB – Input signal used to initiate start of White (Gain) Calibration
(e) SHP/SAMPLE: Once per pixel signal used to control pixel sample timing
(f) SHD/HOLD: Once per pixel signal used to control pixel sample timing
3. CCD signals at OS Inputs – These are connected to the outputs from the CCD sensor emitter follower buffer
circuits. The signals are AC coupled to the AFE inputs using 0.1 uF capacitors.
4. Serial control interface from data processing module to LM98519 (Ground referenced logic signal with: 2.0 V
< Vhigh < 3.3 V):
(a) SENB – Serial enable to LM98519
(b) SCLK – Serial clock input to LM98519
(c) SDI – Data input to LM98519
(d) SDO – Data output from LM98519
5. Serialized data lines connected to FPGA or chip on data processing module
6. Adjust and reconfigure the configuration register settings as needed
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9 Power Supply Recommendations
9.1 Over Voltage Protection on OS Inputs
The OS inputs are protected from damage caused by transients from the sensor circuitry during power up/down.
When the chip has just been powered up, the protective clamp circuits are enabled by setting Register 0x01, Bit
4 to 1. This clamps the OS inputs to VSSA with internal PMOS devices. The protective clamp circuits are
disabled by setting the OVPB enable bit to 0.
The maximum voltage and input current specifications for the OS inputs when OVP is enabled are the same as
those listed in Absolute Maximum Ratings.
Positive input signals will be clamped by the internal switch through a diode to VSSA. Negative input signals will
be clamped by the internal ESD protection diode to one diode drop below VSSD. Typically this will be about 0.7
V below ground.
Table 11. OVP Enable Bit Settings
50
OVP ENABLE BIT
(Register 0x01, Bit 4)
OVER VOLTAGE PROTECTION
INPUT CLAMPING
0
Disabled
1
Enabled
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10 Layout
10.1 Layout Guidelines
1. Use Figure 35 configuration for powering the device.
VIN
VDDD
Vreg
+
+
VDDA
+
+
VDDLVDS
+
Figure 35. Recommended Setup for Powering Device
2. Place decoupling cap(s) next to every supply pin to the ground plane close by.
3. Use a multi-layer boards as shown in Figure 35 to ease routing, and to provide a low inductance ground
plane.
4. Beware of via inductance and when necessary increase the number and / or diameter of vias to reduce
inductance
5. Use ground plane “keep out” areas under sensitive nodes to minimize parasitic capacitance
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10.2 Layout Example
VCCD
***1u and 0.1u used for
VREGn and VREFOUT
decoupling
VDDO
VDDA
VDDD
R1 R2 R3
CA1
1u
CB1
0.1
SDO
SENB
SDI
SCLK
C1
***
C1, C2, C3, C4, C5, C12, C13,
C14, C20, C29
Q1
NPN BCE
RESETB
VDDO
U3
LM98519
VREFBOUT
VREFTOUT
VDDA
VREF
VSSA
VSSD
VDDD
SDO
SENB
SDI
SCLK
RESETB
VDDO
VSSO
DR9
DR8
DR7
DR6
DR5
DR4
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
C3
TBD
Q3
NPN BCE
C4
0.1u
0.1u C5
C7 0.1u
R13
C8 0.1u
0.1u C9
U3
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Phi1A
Phi2A
SH3
NC
SH2
OS4
ODB
OS2
OS1
ASS
CP
RS
Phi2A
Phi1A
VDD
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
DSS
Phi1A
Phi2A
NC
SH1
68
67
66
65
64
63
62
61
60
59
58
57
56
55
VCCD
10u
C11
1u
C12
0.1
R14 R15 R16
VDDO
R20
54
53
52
51
50
49
48
47
46
45
C10
DG9
DG8
DG7
DG6
DG5
DG4
DG3
DG2
DG1
DG0
C13
***
Q4
NPN BCE
DB9
OS3
ODG
OS5
OS6
ODR
DSS
Phi2B
Phi2A
Phi1A
VDD
NC
NC
NC
NC
DR3
DR2
DR1
DR0
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
R12
R11
C6 0.1u
DR3
DR2
DR1
DR0
VDDO
VSSO
DG9
DG8
DG7
DG6
DG5
DG4
DG3
DG2
DG1
DG0
VDDO
VSSO
VREG
DB9
VREFBIN2
VREFTIN2
VREFBIN1
VREFTIN1
VSSA
OSR1
VDDA
OSR2
VSSA
OSG1
VDDA
OSG2
VSSA
OSB1
VDDA
OSB2
VSSA
VCLPEXT
VCLPINT
SHP
SHD
VDDD
VSSD
CLPIN
BLKCLP
IBIAS
VSSD
AGC_ONB
MCLK
VSSO
VDDO
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
R9
Timing and Control
C2
TBD
R5
Processing ASIC
Q2
NPN BCE
DR9
DR8
DR7
DR6
DR5
DR4
R4
R1
11k 1%
VDDD
R23
Q5
NPN BCE
R24
MCLK
VDDA
R25
Q6
NPN BCE
R26
BLKCLP
+ C14
10
VDDO
C21 C22 C23
0.1 0.1 0.1
C17 C18 C19 C20
0.1 0.1 0.1 0.1
AGC_ONB
44
43
42
41
40
39
38
37
36
35
VDDD
+ C15
10
C24
0.1
+
C25
0.1
C16
10
CLPIN
R27
SHD
SHP
TCD2703D
Figure 36. LM98519 Typical Application
52
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Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: LM98519
LM98519
www.ti.com
SNAS425C – OCTOBER 2007 – REVISED OCTOBER 2014
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
11.2 Trademarks
All trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2007–2014, Texas Instruments Incorporated
Product Folder Links: LM98519
53
PACKAGE OPTION ADDENDUM
www.ti.com
1-Sep-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM98519VHB/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
TQFP
PFC
80
119
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Op Temp (°C)
Device Marking
(4/5)
0 to 70
LM98519VHB
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Sep-2015
Addendum-Page 2
PACKAGE OUTLINE
PFC0080A
TQFP - 1.2 mm max height
SCALE 1.250
PLASTIC QUAD FLATPACK
12.2
11.8
PIN 1 ID
B
80
A
61
1
60
14.2
TYP
13.8
12.2
11.8
20
41
40
21
76X 0.5
80X
4X 9.5
0.27
0.17
0.08
C A B
1.2 MAX
C
(0.13) TYP
SEATING PLANE
0.08
SEE DETAIL A
0.25
GAGE PLANE
0 -7
(1)
0.05 MIN
0.75
0.45
DETAIL A
DETAIL A
SCALE: 14
TYPICAL
4215165/B 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration MS-026.
www.ti.com
EXAMPLE BOARD LAYOUT
PFC0080A
TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
SYMM
61
80
80X (1.5)
1
60
80X (0.3)
SYMM
76X (0.5)
(13.4)
(R0.05) TYP
41
20
21
40
(13.4)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:6X
0.05 MAX
ALL AROUND
EXPOSED METAL
METAL
SOLDER MASK
OPENING
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
NON SOLDER MASK
DEFINED
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4215165/B 06/2017
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
6. For more information, see Texas Instruments literature number SLMA004 (www.ti.com/lit/slma004).
www.ti.com
EXAMPLE STENCIL DESIGN
PFC0080A
TQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
SYMM
80
61
80X (1.5)
1
60
80X (0.3)
SYMM
76X (0.5)
(13.4)
(R0.05) TYP
41
20
21
40
(13.4)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:6X
4215165/B 06/2017
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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