Texas Instruments | VSP3200, VSP3210 16-Bit CCD/CIS Processsor (Rev. B) | Datasheet | Texas Instruments VSP3200, VSP3210 16-Bit CCD/CIS Processsor (Rev. B) Datasheet

Texas Instruments VSP3200, VSP3210 16-Bit CCD/CIS Processsor (Rev. B) Datasheet
Not Recommended For New Designs
VSP
VSP3200
VSP3210
320
0
www.ti.com
CCD SIGNAL PROCESSOR FOR
SCANNER APPLICATIONS
FEATURES
DESCRIPTION
F INTEGRATED TRIPLE-CORRELATED
DOUBLE SAMPLER
F OPERATION MODE SELECTABLE:
1-Channel, 3-Channel CCD Mode, 8Msps
F PROGRAMMABLE GAIN AMPLIFIER:
0dB to +13dB
F SELECTABLE OUTPUT MODES:
Normal/Demultiplexed
F OFFSET CONTROL RANGE: ±500mV
F +3V, +5V Digital Output
F LOW POWER: 300mW (typ)
The VSP3200 and VSP3210 are complete CCD image
processors that operate from single +5V supplies.
This complete image processor includes three Correlated Double Samplers (CDSs) and Programmable
Gain Amplifiers (PGAs) to process CCD signals.
The VSP3200 is interface compatible with the
VSP3210, which is a 16-bit, one-chip product.
The VSP3210 is pin-to-pin compatible with VSP3100,
when in demultiplexed output mode.
The VSP3200 and VSP3210 can be operated from 0°C
to +85°C, and are available in LQFP-48 packages.
F LQFP-48 SURFACE-MOUNT PACKAGE
CLP
CK1 CK2
ADCCK
TP0
VREF
Reference
Circuit
CM
Timing Generator
Clamp
REFP
RINP
PGA
CDS
REFN
AGND
10
6
10-Bit
DAC
OE
VDRV
Clamp
16-Bit
A/D
Converter
GINP
10
MUX
PGA
CDS
16
Digital
Output
Control
B0-B15
(A0-A2, D0-D9)
6
10-Bit
DAC
Clamp
BINP
CDS
Offset
Register
10
PGA
3
Gain
Control
Register
10-Bit
DAC
R
G
R
Configuration
Register
B
8
10
P/S
G
6
Register
Port
WRT
B
RD
6
SCLK
SD
VSP3200
Copyright © 2000, Texas Instruments Incorporated
SBMS012A
Printed in U.S.A. November, 2000
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
VSP3200Y
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
VSP3200Y
VSP3200YG4
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
VSP3200Y
VSP3210Y/2K
NRND
LQFP
PT
48
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 85
VSP3210Y
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
VSP3210Y/2K
Package Package Pins
Type Drawing
LQFP
PT
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
17.4
Pack Materials-Page 1
9.5
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.5
2.0
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Sep-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
VSP3210Y/2K
LQFP
PT
48
2000
367.0
367.0
38.0
Pack Materials-Page 2
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