Texas Instruments | VSP2232 CCD Signal Processor for Digital Cameras (Rev. A) | Datasheet | Texas Instruments VSP2232 CCD Signal Processor for Digital Cameras (Rev. A) Datasheet

Texas Instruments VSP2232 CCD Signal Processor for Digital Cameras (Rev. A) Datasheet
Not Recommended For New Designs
SLAS320 − MAY 2001
FEATURES
D CCD Signal Processing
D
D
D
D
DESCRIPTION
The VSP2232 is a complete mixed-signal processing IC
for digital cameras that provides signal conditioning and
analog-to-digital conversion for the output of a CCD
array. The primary CCD channel provides correlated
double sampling (CDS) to extract the video information
from the pixels, a −6-dB to 42-dB gain with digital control
for varying illumination conditions, and black level
clamping for an accurate black level reference.
− Correlated Double Sampling (CDS)
− Programmable Black Level Clamping
Programmable Gain Amplifier (PGA)
− −6-dB to 42-dB Gain Ranging
10-Bit Digital Data Output
− Up to 36-MHz Conversion Rate
− No Missing Codes
76-dB Signal-to-Noise Ratio
Portable Operation
− Low Voltage: 2.7 V to 3.6 V
− Low Power: 130 mW (typ) at 3.0 V
− Standby Mode: 6 mW
Input signal clamping and offset correction of the input
CDS is also performed. The stable gain control is linear
in dB. Additionally, the black level is quickly recovered
after gain change.
The VSP2232Y is pin-to-pin compatible with the
VSP2262Y (12-bit 20 MHz) one-chip product.
The VSP2232Y is available in a 48-pin LQFP package
and operates from a single 3-V/3.3-V supply.
VSP2232 block diagram
CLPDM
SHP SHD
SLOAD SCLK SDATA
RESET
ADCCK
DRVDD
VCC
Serial Interface
Input
Clamp
Timing Control
Correlated
Double
Sampling (CDS)
CCD
Output
Signal
Preblanking
PBLK
Programmable
Gain Amplifier −6 to 42 dB
(PGA)
Optical Black (OB)
Level Clamping
COB
CPLOB
B(0−11)
Analog-to-Digital
Converter
Output
Latch
12-Bit
Digital
Output
Reference Voltage Generator
BYPP2 BYP BYPM REFN CM
REFP
DRVGND
GNDA
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright  2001, Texas Instruments Incorporated
www.ti.com
1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
VSP2232Y
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 85
VSP2232Y
VSP2232YG4
ACTIVE
LQFP
PT
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 85
VSP2232Y
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2019
Addendum-Page 2
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