Texas Instruments | 14-Bit, Input-Buffered, 160-MSPS, Analog-to-Digital Converter with JESD204A Outp (Rev. B) | Datasheet | Texas Instruments 14-Bit, Input-Buffered, 160-MSPS, Analog-to-Digital Converter with JESD204A Outp (Rev. B) Datasheet

Texas Instruments 14-Bit, Input-Buffered, 160-MSPS, Analog-to-Digital Converter with JESD204A Outp (Rev. B) Datasheet
ADS61JB46
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SBAS611B – SEPTEMBER 2013 – REVISED OCTOBER 2013
14-Bit, Input-Buffered, 160-MSPS, Analog-to-Digital Converter
with JESD204A Output Interface
Check for Samples: ADS61JB46
FEATURES
APPLICATIONS
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2
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Output Interface:
– Single-Lane and Dual-Lane Interfaces
– Maximum Data Rate: 3.125 Gbps
– Meets JEDEC JESD204A Specification
– CML Outputs with Current Programmable
from 2 mA to 32 mA
Power Dissipation:
– 583 mW at 160 MSPS in Dual-Lane Mode
– Power Scales Down with Clock Rate
Input Interface: Buffered Analog Inputs
SNR at 185-MHz IF: –72.7 dBFS
Analog Input Dynamic Range: 2 VPP
Reference Support:
External and Internal (Trimmed)
Supply:
– Analog and Digital: 1.8 V
– Input Buffer: 3.3 V
Programmable Digital Gain: 0 dB to 6 dB
Output: Straight Offset Binary or
Twos Complement
Package: 6-mm × 6-mm QFN-40
Wireless Base-Station Infrastructures
Test and Measurement Instrumentation
DESCRIPTION
The ADS61JB46 is a high-performance, low-power,
single-channel, analog-to-digital converter with an
integrated JESD204A output interface. Available in a
6-mm × 6-mm QFN package, with both single-lane
and dual-lane output modes, the device offers an
unprecedented level of compactness. The output
interface is compatible to the JESD204A standard,
with an additional mode (as per the IEEE standard
802.3-2002 part 3, clause 36.2.4.12) to interface
seamlessly to the TI TLK family of SERDES
transceivers. Equally impressive is the inclusion of an
on-chip analog input buffer, providing isolation
between the sample-and-hold switches and higher
and more consistent input impedance.
The device is specified over the
temperature range (–40°C to +85°C).
industrial
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
ADS61JB46
SBAS611B – SEPTEMBER 2013 – REVISED OCTOBER 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS (1)
Supply voltage range
VALUE
UNIT
AVDD
–0.3 to +2.2
V
DRVDD
–0.3 to +2.2
V
IOVDD
–0.3 to +2.2
V
AVDD_3V
–0.3 to +3.9
V
Voltage between AGND and DRGND
Voltage applied to:
–0.3 to +0.3
V
External VCM pin
–0.3 to +2.2
V
Analog input pins
–0.3 to min (3, AVDD_3V + 0.3)
V
Digital input pins
–0.3 to AVDD + 0.3
V
Clock input pins
(2)
Operating free-air temperature range, TA
Junction temperature
(1)
(2)
–0.3 to AVDD + 0.3
V
–40 to +85
°C
+105
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP, CLKM is less than |0.3 V|).
This setting prevents the electrostatic discharge (ESD) protection diodes at the clock input pins from turning on.
THERMAL INFORMATION
THERMAL METRIC (1)
ADS61JB46
RHA (QFN)
θJA
Junction-to-ambient thermal resistance
θJCtop
Junction-to-case (top) thermal resistance
17
θJB
Junction-to-board thermal resistance
5.7
ψJT
Junction-to-top characterization parameter
0.2
ψJB
Junction-to-board characterization parameter
5.7
θJCbot
Junction-to-case (bottom) thermal resistance
1
(1)
2
UNITS
30.7
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLIES, ANALOG INPUTS, AND REFERENCE VOLTAGES
AVDD
Analog supply voltage
1.7
1.8
1.9
V
DRVDD
Digital supply voltage
1.7
1.8
1.9
V
IOVDD
CML buffer supply voltage
1.7
1.8
1.9
V
AVDD_3V
Analog buffer supply voltage
3.0
3.3
3.6
Differential input voltage range
2
Input common-mode voltage
VCM (output), internal reference mode (1)
VCM (input), external reference mode
V
VPP
VCM ± 0.05
V
1.95
V
1.4
V
CLOCK INPUT
In JESD204A single-lane mode
Input clock rate
In JESD204A dual-lane mode
Sine wave, ac-coupled
Input clock amplitude
differential (VCLKP – VCLKM)
15.625
156.3
MSPS
31.25
160
MSPS
0.2
3.0
VPP
LVPECL, ac-coupled
1.6
VPP
LVDS, ac-coupled
0.7
VPP
CMOS, single-ended, accoupled
1.5
V
Input clock duty cycle
35%
50%
65%
In single-lane mode
312.5
20x (sample
rate)
3125
Mbps
In dual-lane mode
312.5
10x (sample
rate)
1600
Mbps
DIGITAL OUTPUTS
Output data rate
CLOAD
Maximum external load capacitance from each pin to DRGND
RLOAD
External termination from each output pin to IOVDD
TA
Operating free-air temperature
(1)
5
pF
Ω
50
–40
+85
°C
Typical VCM reduces to 1.85 V after HIGH_SFDR_MODE (register address 02h) is written.
Table 1. HIGH_SFDR_MODE Summary
MODE
HIGH_SFDR_MODE
DESCRIPTION
Write register 02h, value 71h, to obtain best HD3 for input frequencies between 150 MHz to 250 MHz.
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ELECTRICAL CHARACTERISTICS
Typical values are at +25°C, minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX =
+85°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, clock frequency = 160 MSPS, 10x mode, 50%
clock duty cycle, –1-dBFS differential analog input, internal reference mode, and CML buffer current setting = 16 mA, unless
otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
REFERENCE VOLTAGES (Internal)
VCM analog input common-mode voltage (output)
VCM output current
(resulting in a VCM change of ±50 mV)
1.95
V
2.5
mA
REFERENCE VOLTAGES (External)
VCM reference voltage (input)
1.4 ± 0.1
V
ANALOG INPUT
Differential input voltage range
2.0
Differential input capacitance
VPP
3
Analog input bandwidth
pF
480
Analog input common-mode range
Analog input common-mode current
(per input pin)
MHz
VCM ± 0.05
V
1.6
µA
DC ACCURACY
EO
Offset error
–20
20
mV
EGREF
Gain error due to internal reference inaccuracy alone
–2.5
2.5
%FS
EGCHAN
Gain error of channel alone
5
Gain error temperature coefficient
PSRR
AC power-supply rejection ratio
50-mVPP signal on AVDD supply
%FS
0.006
mV/°C
> 30
dB
POWER-DOWN MODES
Complete power-down mode
10
mW
Fast recovery power-down mode
230
mW
Power with no clock
115
mW
±0.6
LSB
DNL
Differential nonlinearity
INL
Integral nonlinearity
–0.95
±2
±4.5
LSB
132
160
mA
POWER-SUPPLY CURRENTS
IAVDD
AVDD current
IAVDD_3V
AVDD_3V current
42
55
mA
IDRVDD
DRVDD current
79
100
mA
IIOVDD
IOVDD current (in 10x mode)
31
40
mA
583
700
mW
Total power
DYNAMIC PERFORMANCE (1) (2)
SFDR
SNR
Signal-to-noise ratio
SINAD
HD3
HD2
Spurious-free dynamic range
Signal-to-noise and distortion ratio
Third-order harmonic distortion
Second-order harmonic distortion
Worst spur (excluding HD2, HD3)
(1)
(2)
4
fIN = 10 MHz
fIN = 185 MHz
75
71.5
fIN = 10 MHz
fIN = 185 MHz
69.2
dBc
77
dBc
75
dBFS
72.7
dBFS
fIN = 10 MHz
72.1
dBFS
fIN = 185 MHz
71.5
dBFS
fIN = 10 MHz
fIN = 185 MHz
71.5
fIN = 10 MHz
fIN = 185 MHz
71.5
fIN = 10 MHz
fIN = 185 MHz
81
75
dBc
77
dBc
90
dBc
81
dBc
95
dBc
90
dBc
HIGH_SFDR_MODE is enabled.
fS = 156.25 MSPS, 20x mode.
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DIGITAL CHARACTERISTICS
The dc specifications refer to the condition where the digital outputs do not switch, but are permanently at a valid logic level
'0' or '1'.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUTS
VIH
High-level input voltage
VIL
Low-level input voltage
IIH
IIL
1.2
V
0.6
High-level input current
Low-level input current
V
0
μA
SCLK, SDATA, RESET, PDN, PDN_ANA
10
μA
SEN
10
μA
0
μA
SEN
SCLK, SDATA, RESET, PDN, PDN_ANA
DIGITAL OUTPUTS (SDOUT)
VOH
High-level output voltage
VOL
Low-level output voltage
DRVDD – 0.1
DRVDD
V
0
0.1
V
1.8
1.9
V
CML OUTPUTS (50-Ω single-ended external termination to IOVDD)
IOVDD supply range
1.7
High-level output voltage
IOVDD
V
Low-level output voltage
IOVDD – 0.4
V
0.4
V
IOVDD – 0.2
V
|VOD|
Output differential voltage
VOCM
Output common-mode voltage
Transmitter short-circuit current
Transmitter terminals shorted to any voltage
between –0.25 V and 1.45 V
–90
Single-ended output impedance
UI
Unit interval
TJ
Total jitter
tRISE,
tFALL
Rise time,
Fall time
50
mA
3200
UI
Ω
50
625
5-pF, single-ended load capacitance to ground
0.35
p-pUI
175
ps
WAKE-UP TIMING CHARACTERISTICS
PARAMETER
tWAKE
Wake-up time
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Time to valid data after coming out of complete power-down mode
50
μs
Time to valid data after coming out of fast-recovery power-down mode
50
μs
Time to valid data after coming out of software power-down mode
10
μs
5
μs
Time to valid data after stopping and restarting the input clock
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PARAMETRIC MEASUREMENT INFORMATION
JESD204A OUTPUT INTERFACE
The 14-bit analog-to-digital converter (ADC) output is padded with four zeros on the LSB side to form a 16-bit
output. Two 8B10B codes are formed; one from the eight MSBs and the other from the six LSBs and the two
padded zeros, as shown in Figure 1.
ADCOUT[13:6]
ADCOUT[5:0], 0, 0
8B10B Code 1
MSB Octet
8B10B Code 2
LSB Octet
Figure 1. ADC Output Mapping to Two 8B10B Codes
The two octets can be either transmitted on the same lane (single-lane interface, Figure 2) or on two lanes (duallane interface, Figure 3). By default, the device operates in single-lane interface.
Conversion Clock
(CLKP - CLKM)
CML Output Lane 1
(ADC_OUTP0 - ADC_OUTM0)
Dx.y
(ADC Data N, MSB Octet)
Dx.y
(ADC Data N, LSB Octet)
Dx.y
(ADC Data N+1, MSB Octet)
Dx.y
(ADC Data N+1, LSB Octet)
Figure 2. Single-Lane Interface Timing Diagram
Conversion Clock
(CLKP - CLKM)
CML Output Lane 1
(ADC_OUTP0 - ADC_OUTM0)
Dx.y
(ADC Data N, MSB Octet)
Dx.y
(ADC Data N+1, MSB Octet)
Dx.y
(ADC Data N+2, MSB Octet)
Dx.y
(ADC Data N+3, MSB Octet)
Dx.y
(ADC Data N, LSB Octet)
Dx.y
(ADC Data N+1, LSB Octet)
Dx.y
(ADC Data N+2, LSB Octet)
Dx.y
(ADC Data N+3, LSB Octet)
CML Output Lane 2
(ADC_OUTP1 - ADC_OUTM1)
Figure 3. Dual-Lane Interface Timing Diagram
6
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PARAMETRIC MEASUREMENT INFORMATION (continued)
A detailed dual-lane mode timing diagram is shown in Figure 4.
Sample
N
N+3
N+2
N+1
N+4
N+21
N+22
N+20
Input
Signal
tA
Input
Clock
CLKP
CLKM
20 Clock Cycles
(1)
tPDI
CML Output
Data Lane 1
N-21
N-20
N-19
N-18
N-17
N-1
N
N+1
N+2
N-21
N-20
N-19
N-18
N-17
N-1
N
N+1
N+2
CML Output
Data Lane 2
(1) These clock cycles comprise the ADC latency. At higher sampling frequencies, tPDI > 1 clock cycle and overall latency = ADC latency + 1.
Figure 4. Dual-Lane Mode Timing Diagram
PARAMETER
30 MSPS
40 MSPS
60 MSPS
160 MSPS
UNIT
TA
Aperture delay
560
560
560
560
ps
TJ
Aperture jitter (RMS)
125
125
125
125
fS
Latency
20
20
20
20
Clocks
33.3
26.2
18.9
15.3
ns
tPDI
Data propagation delay
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The receiver issues a synchronization request through the SYNC~P, SYNC~M pins whenever the frame
boundary of the output data stream must be synchronized to. Figure 5 shows how the transmission switches
from normal data (D) to code group synchronization symbols K28.5 symbols during and after a synchronization
request.
N+2
Sample
N
Input
Signal
Input
Clock
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N+1
CLKP
CLKM
tCLK-INT
Internal Clock
for Latching SYNC~
(CLK_INT)
tSYNC-SU
tSYNC-H
SYNC~ Input
(SYNC~P) - (SYNC~M)
tSYNC-PDI
SYNC~ Active Latency = 9 Clock Cycles
CML Output
Data Lane 1
N-21
N-20
N-19
N-18
N-17
N-16
N-15
N-14
N-13
N-12
K28.5
N-20
N-19
N-18
N-17
N-16
N-15
N-14
N-13
N-12
K28.5
CML Output
Data Lane 2
N-21
Figure 5. SYNC~ Active Timing Diagram
Table 2. SYNC~ Falling Edge Timing at 160 MSPS
PARAMETER
tCLK-INT
DESCRIPTION
TYP
UNIT
Delay from the input clock rising edge to the internal clock (CLK_INT)
rising edge used to latch the SYNC~ falling edge
10.5
ns
tSYNC-SU
SYNC~ active edge setup time
Minimum delay required from SYNC~ falling edge to CLK_INT rising
edge
2
ns
tSYNC-H
SYNC~ active edge hold time
Minimum delay required from CLK_INT rising edge to SYNC~ falling
edge
2
ns
SYNC~ active latency
Number of clocks for K28.5 to appear at the output after a SYNC~
request
9
clocks
SYNC~ data propagation delay
Similar to data propagation delay
tSYNC-PDI
8
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15.3
ns
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N+2
Input
Signal
Input
Clock
N+3
N+4
N+5
N+7
N+6
N+8
N+9
N+1
Sample
N
CLKP
CLKM
tCLK-INT
Internal Clock
for Latching SYNC
(CLK_INT)
tSYNCZ-SU
tSYNCZ-H
SYNC~ Input
(SYNC~P) - (SYNC~M)
SYNC~ De-Active Latency = 8 Clock Cycles
tSYNCZ-PDI
CML Output
Data Lane 1
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
N-12
N-11
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
K28.5
N-12
N-11
CML Output
Data Lane 2
Figure 6. SYNC~ De-Active Timing Diagram
Table 3. SYNC~ Rising Edge Timing at 160 MSPS
PARAMETER
DESCRIPTION
Delay from input clock rising edge to the internal clock (CLK_INT)
rising edge used to latch the SYNC~ rising edge
tCLK-INT
TYP
UNIT
10.5
ns
tSYNCZ-SU
SYNC~ active edge setup time
Minimum delay required from SYNC~ rising edge to CLK_INT rising
edge
2
ns
tSYNCZ-H
SYNC~ active edge hold time
Minimum delay required from CLK_INT rising edge to SYNC~ rising
edge
2
ns
SYNC~ de-active latency
Number of clocks for normal data to appear at the output after a
SYNC~ de-activate request
8
Clocks
SYNC~ de-active data
propagation delay
Similar to data propagation delay
tSYNCZ-PDI
15.3
ns
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4-LEVEL CONTROL
The DFS_EXTREF and MODE pins function as 4-level control pins in the device, as described in Table 4 and
Table 5. A simple scheme to generate a 4-level voltage is shown in Figure 7.
AVDD
(5/8) AVDD
3R
(5/8) AVDD
2R
AVDD
GND
(3/8) AVDD
3R
To Parallel Pin
(3/8) AVDD
GND
Figure 7. Simple Scheme to Configure 4-Level Control Pins
Table 4. DFS_EXTREF Pin (Pin 3)
DFS_EXTREF
DESCRIPTION
0
+150 mV / 0 mV
EXTREF = 0, DFS = 0
(3/8) AVDD
±150 mV
EXTREF = 1, DFS = 0
(5/8) AVDD
±150 mV
EXTREF = 1, DFS = 1
AVDD
0 mV / –150 mV
EXTREF = 0, DFS = 1
Key:
EXTREF:
0 = Internal reference mode,
1 = External reference mode
DFS:
0 = Twos complement output,
1 = Offset binary output
10
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PIN CONFIGURATION
OVR
DETECT0
DETECT1
DETECT2
DETECT3
ADC_OUTP0
ADC_OUTM0
IOVDD
ADC_OUTP1
ADC_OUTM1
RHA PACKAGE
QFN-40
(Top View)
40
39
38
37
36
35
34
33
32
31
SYNC~M
1
30
DRVDD
SYNC~P
2
29
DRGND
DFS_EXTREF
3
28
SDOUT_TEST1
PDN_ANA
4
27
DRVDD
AVDD
5
26
RESET
Thermal Pad
23
SEN_FALIGN_IDLE
AGND
9
22
AVDD
VCM
10
21
PDN
11
12
13
14
15
16
17
18
19
20
FAVDD
8
MODE
CLKM
AVDD
SDATA_TEST0
AVDD_3V
24
AGND
7
AVDD
CLKP
AGND
SCLK_SERF0_SCR
INM
25
INP
6
AGND
AGND
NOTE: The thermal pad is connected to DRGND.
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PIN FUNCTIONS
PIN
DESCRIPTION
NAME
NO.
ADC_OUTM0
34
CML output lane 1, negative output
ADC_OUTM1
31
CML output lane 2, negative output
ADC_OUTP0
35
CML output lane 1, positive output
ADC_OUTP1
32
CML output lane 2, positive output
AGND
5, 6, 9, 11, 14, 16,
AVDD
15, 18, 22
AVDD_3V
17
Analog supply for input buffer, 3.3 V
CLKM
8
Conversion clock, negative input
CLKP
7
Conversion clock, positive input
DETECT3
36
DETECT2
37
DETECT1
38
DETECT0
39
Analog ground
Analog supply, 1.8 V
Signal level-detect output pins in 1.8-V CMOS logic level.
These pins can be used to either output a 4-bit ADC code with low latency or to output a 16-level RMS power
estimate.
DFS_EXTREF
3
4-level analog control for data format selection and internal and external reference mode
DRGND
29
Digital ground
DRVDD
27, 30
FAVDD
20
Fuse supply, connect externally to AVDD, 1.8 V
INM
13
Analog input, Negative
INP
12
Analog input, Positive
IOVDD
33
CML buffer supply, 1.7 V to 1.9 V
MODE
19
4-level control for selecting the serial and parallel interface modes
OVR
40
Over-range output in 1.8-V CMOS logic levels.
PDN
21
Full chip power-down (also referred to as complete power-down mode)
PDN_ANA
4
Analog section power-down; JESD interface is still active. This mode is referred to as fast-recovery power-down
mode.
RESET
26
Serial interface RESET input. When using the serial interface mode, the internal registers must be initialized
through a hardware RESET by applying a high pulse on this pin or by using the S_RESET register bit; refer to the
Serial Interface section.
In parallel interface mode, the RESET pin must be permanently tied high. In this mode, the SEN_FALIGN_IDLE,
SCLK_SERF0_SCR, and SDATA_TEST0 pins function as parallel pins with their functionality described in
Table 6, Table 7, and Table 8, respectively.
SCLK_SERF0_SCR
25
Serial clock input in serial interface mode. In parallel interface mode, this pin provides a 4-level control for all
JESD modes (single-lane, dual-lane, and scrambling modes).
SDATA_TEST0
24
Serial data input in serial interface mode. In parallel interface mode, this pin provides a JESD test mode.
SDOUT_TEST1
28
Serial data out in serial interface mode. In parallel interface mode, this pin provides a JESD test mode.
SEN_FALIGN_IDLE
23
Serial enable input in serial interface mode. In parallel interface mode, this pin provides a 4-level control for JESD
modes.
SYNC~M
1
JESD synchronization request, negative input
SYNC~P
2
JESD synchronization request, positive input
VCM
10
Common-mode output for setting the input common-mode. 1.95 V, reference input in external reference mode.
12
Digital supply, 1.8 V
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IOVDD
SYNC~P
SYNC~M
DRVDD
DRGND
CLKP
CLKM
AVDD
AGND
AVDD_3 V
FUNCTIONAL BLOCK DIAGRAM
CLOCKGEN
PLL
10X, 20X
CML
Outputs
ADC_OUTP[0]
INP
Buffer
ADC_OUTM[0]
JESD204A
Digital
14-Bit ADC
ADC_OUTP[1]
INM
ADC_OUTM[1]
Signal Level
Detect
VCM
OVR
DETECT[3:0]
Control
Interface
Reference
PDN
PDN_ANA
DFS_EXTREF
SDATA_TEST0
SDOUT_TEST1
SEN_FALIGN_IDLE
SCLK_SERF0_SCR
RESET
CMOS
Outputs
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TYPICAL CHARACTERISTICS
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
0
0
SFDR = 74.8 dBc
SNR = 75.0 dBFS
SINAD = 72.3 dBFS
THD = 74.7 dBc
SFDR Non HD2, HD3
= 94.6 dBc
−20
−20
−40
Amplitude (dBFS)
Amplitude (dBFS)
−40
−60
−60
−80
−80
−100
−100
−120
SFDR = 74.0 dBc
SNR = 74.8 dBFS
SINAD = 71.8 dBFS
THD = 73.7 dBc
SFDR Non HD2, HD3
= 97.0 dBc
0
10
20
30
40
50
60
−120
70 76.8
Frequency (MHz)
0
40
50
60
70 76.8
Frequency (MHz)
G002
0
SFDR = 81.1 dBc
SNR = 72.9 dBFS
SINAD = 72.2 dBFS
THD = 79.9 dBc
SFDR Non HD2, HD3
= 89.87 dBc
−20
SFDR = 67.8 dBc
SNR = 71.0 dBFS
SINAD = 65.5 dBFS
THD = 65.9 dBc
SFDR Non HD2, HD3
= 83.44 dBc
−20
−40
Amplitude (dBFS)
−40
Amplitude (dBFS)
30
Figure 9. AMPLITUDE vs FREQUENCY
(70-MHz IF)
0
−60
−60
−80
−80
−100
−100
0
10
20
30
40
50
60
Frequency (MHz)
70 76.8
−120
0
G003
Figure 10. AMPLITUDE vs FREQUENCY
(190-MHz IF)
14
20
G001
Figure 8. AMPLITUDE vs FREQUENCY
(20-MHz IF)
−120
10
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10
20
30
40
50
60
Frequency (MHz)
70 76.8
G004
Figure 11. AMPLITUDE vs FREQUENCY
(300-MHz IF)
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SBAS611B – SEPTEMBER 2013 – REVISED OCTOBER 2013
TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
0
0
Each Tone at
−7 dBFS Amplitude
fIN1 = 190 MHz
fIN2 = 185 MHz
IMD3 = 79.9 dBFS
−10
−20
−30
−20
−30
−40
Amplitude (dBFS)
Amplitude (dBFS)
−40
−50
−60
−70
−50
−60
−70
−80
−80
−90
−90
−100
−100
−110
−110
−120
Each Tone at
−36 dBFS Amplitude
fIN1 = 190 MHz
fIN2 = 185 MHz
IMD3 = 106.9 dBFS
−10
0
10
20
30
40
50
60
−120
70 76.8
Frequency (MHz)
0
30
40
50
60
70 76.8
Frequency (MHz)
G006
Figure 13. AMPLITUDE vs FREQUENCY
(Two-Tone Input Signal)
95
100
Digital gain = 0 dB
Digital gain = 2 dB
Digital gain = 6 dB
90
Digital gain = 0 dB
Digital gain = 2 dB
Digital gain = 6 dB
98
96
SFDR Non HD2, HD3 (dB)
85
80
SFDR (dBc)
20
G005
Figure 12. AMPLITUDE vs FREQUENCY
(Two-Tone Input Signal)
75
70
65
60
94
92
90
88
86
84
55
50
10
82
0
50
100
150
200
250
300
350
400
450
500
Input Frequency (MHz)
80
0
100
150
200
250
300
350
400
450
Input Frequency (MHz)
G007
Figure 14. SPURIOUS-FREE DYNAMIC RANGE vs
INPUT FREQUENCY
50
500
G008
Figure 15. SPURIOUS-FREE DYNAMIC RANGE
(NON HD2, HD3) vs INPUT FREQUENCY
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
130
78.5
76
Input Frequency = 40MHz
Digital gain = 0 dB
Digital gain = 2 dB
Digital gain = 6 dB
75
SNR(dBFS)
SFDR(dBc)
SFDR(dBFS)
78
77.5
74
120
110
100
77
SNR (dBFS)
SNR (dBFS)
72
71
70
69
68
76.5
90
76
80
75.5
70
75
60
74.5
50
74
40
73.5
30
73
20
SFDR (dBc,dBFS)
73
67
66
65
72.5
−80
0
50
100
150
200
250
300
350
400
450
−40
−30
−20
−10
0
10
G010
G009
Figure 17. PERFORMANCE ACROSS INPUT AMPLITUDE
77
105
20 MHz
70 MHz
150 MHz
100
220 MHz
270 MHz
300 MHz
400 MHz
500 MHz
20 MHz
70 MHz
150 MHz
76
75
95
220 MHz
270 MHz
300 MHz
400 MHz
500 MHz
74
90
73
SNR (dBFS)
85
SFDR (dBc)
−50
Amplitude (dBFS)
Figure 16. SIGNAL-TO-NOISE RATIO vs INPUT FREQUENCY
80
75
70
72
71
70
69
65
68
60
67
55
66
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
Digital Gain (dB)
6
65
0
0.5
1
1.5
2
2.5
3
3.5
Digital Gain (dB)
G011
Figure 18. SPURIOUS-FREE DYNAMIC RANGE
vs DIGITAL GAIN
16
−60
500
Input Frequency (MHz)
50
−70
4
4.5
5
5.5
6
G012
Figure 19. SIGNAL-TO-NOISE RATIO vs DIGITAL GAIN
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
78
90
20 MHz
70 MHz
150 MHz
76
220 MHz
270 MHz
300 MHz
400 MHz
500 MHz
74
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.95 V
86
72
84
70
SFDR (dBc)
SINAD (dBFS)
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
88
68
66
82
80
78
64
76
62
60
74
58
72
Input Frequency = 190 MHz
56
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
70
−40
6
Digital Gain (dB)
−15
10
35
60
85
Temperature (°C)
G013
Figure 20. SIGNAL-TO-NOISE AND DISTORTION RATIO
vs DIGITAL GAIN
G014
Figure 21. SPURIOUS-FREE DYNAMIC RANGE
vs AVDD SUPPLY AND TEMPERATURE
73.9
88
AVDD = 1.7 V
AVDD = 1.75 V
AVDD = 1.8 V
73.7
AVDD = 1.85 V
AVDD = 1.9 V
AVDD = 1.95 V
AVDD_3V = 3 V
AVDD_3V = 3.1 V
AVDD_3V = 3.2 V
AVDD_3V = 3.3 V
87
86
AVDD_3V = 3.4 V
AVDD_3V = 3.5 V
AVDD_3V = 3.6 V
73.5
85
84
SFDR (dBc)
SNR (dBFS)
73.3
73.1
72.9
83
82
81
72.7
80
72.5
79
72.3
78
Input Frequency = 190 MHz
72.1
−40
−15
10
Input Frequency = 190 MHz
35
60
Temperature (°C)
85
77
−40
10
35
60
Temperature (°C)
G015
Figure 22. SIGNAL-TO-NOISE RATIO vs
AVDD SUPPLY AND TEMPERATURE
−15
85
G016
Figure 23. SPURIOUS-FREE DYNAMIC RANGE vs
AVDD_3V SUPPLY AND TEMPERATURE
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
89
73.8
AVDD_3V = 3 V
AVDD_3V = 3.1 V
AVDD_3V = 3.2 V
AVDD_3V = 3.3 V
73.6
AVDD_3V = 3.4 V
AVDD_3V = 3.5 V
AVDD_3V = 3.6 V
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
88
87
AVDD = 1.9 V
AVDD = 1.95 V
86
73.4
85
SFDR (dBc)
SNR (dBFS)
73.2
73
84
83
82
72.8
81
80
72.6
79
72.4
78
Input Frequency = 190 MHz
72.2
−40
−15
10
Input Frequency = 190 MHz
35
60
77
−40
85
Temperature (°C)
−15
10
35
60
85
Temperature (°C)
G017
Figure 24. SIGNAL-TO-NOISE RATIO vs
AVDD_3V SUPPLY AND TEMPERATURE
G018
Figure 25. SPURIOUS-FREE DYNAMIC RANGE vs
DRVDD SUPPLY AND TEMPERATURE
82
78
73.8
AVDD = 1.75 V
AVDD = 1.8 V
AVDD = 1.85 V
73.6
Input Frequency = 40MHz
AVDD = 1.9 V
AVDD = 1.95 V
SNR
SFDR
77.5
79
77
76
76.5
73
76
70
75.5
67
75
64
74.5
61
74
58
SNR (dBFS)
SNR (dBFS)
73.2
73
72.8
72.6
SFDR (dBc)
73.4
72.4
73.5
1.85
Input Frequency = 190 MHz
72.2
−40
−15
10
35
60
Temperature (°C)
85
1.91
1.94
1.97
Input Common−Mode Voltage (V)
2
55
G020
G001
Figure 26. SIGNAL-TO-NOISE RATIO vs
DRVDD SUPPLY AND TEMPERATURE
18
1.88
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Figure 27. PERFORMANCE vs
INPUT COMMON-MODE VOLTAGE
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
SNR
SFDR
Input Frequency = 40 MHz
74
87
77.5
76
73
84
77
74
72
81
76.5
72
71
78
76
70
70
75
75.5
68
69
72
75
66
68
69
74.5
64
67
66
74
62
63
73.5
1.2
1.88
1.91
1.94
1.97
2
Input Common−Mode Voltage (V)
SFDR (dBc)
SNR (dBFS)
78
66
1.85
1.25
88
84
74
82
73.5
80
73
78
72.5
76
72
74
71
1.2
SFDR (dBc)
SNR (dBFS)
74.5
72
71.5
1.25
1.3
1.35
1.4
1.45
1.5
1.55
1.6
1.65
External Reference Voltage (V)
1.45
1.5
1.55
1.6
1.65
60
1.7
External Reference Voltage (V)
75
86
75
1.4
G022
90
76
90
SNR
SFDR
75.5
1.35
78
Figure 29. PERFORMANCE vs
EXTERNAL REFERENCE VOLTAGE
76
Input Frequency = 190 MHz
1.3
G021
Figure 28. PERFORMANCE vs
INPUT COMMON-MODE VOLTAGE
SNR (dBFS)
SNR
SFDR
90
75
SNR (dBFS)
80
78.5
70
1.7
Input Frequency = 190MHz
SNR
SFDR
88
74
86
73
84
72
82
71
80
70
78
69
76
68
74
67
72
66
70
65
68
64
66
63
64
62
62
61
0.1
0.4
G023
Figure 30. PERFORMANCE vs
EXTERNAL REFERENCE VOLTAGE
0.7
1
1.3
1.6
1.9
2.2
2.5
2.8
3.1
60
3.4
Differential Clock Amplitude (Vpp)
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G024
Figure 31. PERFORMANCE vs
DIFFERENTIAL CLOCK AMPLITUDE
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SFDR (dBc)
Input Frequency = 190MHz
SFDR (dBc)
93
76
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
45
78
77.5
Input Frequency = 20MHz
SNR
THD
77
77.5
40
77
76.5
35
THD (dBc)
SNR (dBFS)
76
75.5
75.5
75
75
74.5
74.5
74
Code Occurrence (%)
76.5
76
74
73.5
30
25
20
15
10
73.5
73
5
70
80
73
8152
8151
8150
G025
8149
0
Input Clock Duty Cycle (%)
8148
60
8147
50
8146
40
8145
30
8144
20
8143
72.5
Output Codes (LSB)
Figure 32. PERFORMANCE vs
INPUT CLOCK DUTY CYCLE
0
0
fIN = 20 MHz
SFDR = 75 dBc
fPSRR = 10 MHz
50 − mVPP
Amplitude(fIN) = −1 dBFS
Amplitude(fPSRR) = −104 dBFS
Amplitude(fIN + fPSRR) = −96 dBFS
Amplitude(fIN − fPSRR) = −98 dBFS
Amplitude (dBFS)
−40
−40
−60
−80
−100
−100
15
30
45
Frequency (MHz)
60
75
−120
0
15
30
45
Frequency (MHz)
G054
Figure 34. POWER-SUPPLY REJECTION RATIO SPECTRUM
FOR AVDD SUPPLY
20
−60
−80
0
fIN = 20 MHz
SFDR = 74 dBc
fCM = 10 MHz
50 − mVPP
Amplitude(fIN) = −1 dBFS
Amplitude(fCM) = −94.6 dBFS
Amplitude(fIN + fCM) = −88 dBFS
Amplitude(fIN − fCM) = −89 dBFS
−20
Amplitude (dBFS)
−20
−120
G026
Figure 33. OUTPUT CODES HISTOGRAM WITH IDLE
CHANNEL INPUT
60
75
G055
Figure 35. COMMON-MODE REJECTION RATIO SPECTRUM
FOR AVDD SUPPLY
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TYPICAL CHARACTERISTICS (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
0.66
0.33
Total Power
AVDD Power
AVDD_3V Power
DRVDD Power
IOVDD Power
0.3
0.6
0.27
0.24
0.54
Power (W)
Power (W)
0.21
0.48
0.42
0.18
0.15
0.12
0.36
0.09
0.06
0.3
0.03
0.24
0
20
40
60
80
100
120
140
0
160
Sampling Speed (MSPS)
0
20
40
60
80
100
120
140
Sampling Speed (MSPS)
G056
Figure 36. TOTAL POWER vs SAMPLING SPEED
160
G057
Figure 37. POWER BREAK-UP vs SAMPLING SPEED
0.1
IOVDD Power
Dual−Lane(10x Mode)
Single−Lane(20x Mode)
0.09
0.08
Power (W)
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0
20
40
60
80
100
120
140
Sampling Speed (MSPS)
160
G058
Figure 38. IOVDD POWER vs SAMPLING SPEED
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TYPICAL CHARACTERISTICS: CONTOUR
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
79
140
fS - Sampling Frequency - MSPS
64
73
76
70
76
58
61
67
120
79
79
100
82
76
80
76
58
61
67
70
76
79
60
79
82
79
40
64
73
82
50
100
150
70
73
76
250
200
61
64
67
300
350
58
400
450
500
fIN - Input Frequency - MHz
65
60
70
75
80
SFDR - dBc
M0049-33
Figure 39. SFDR ACROSS INPUT AND SAMPLING FREQUENCIES
140
77
81
fS - Sampling Frequency - MSPS
85
73
120
89
100
77
85
81
73
80
89
81
89
60
77
89
40
50
100
85
150
81
200
77
250
69
300
350
400
450
500
fIN - Input Frequency - MHz
75
70
80
85
SFDR - dBc
M0049-34
Figure 40. SFDR ACROSS INPUT AND SAMPLING FREQUENCIES (6-dB Gain)
22
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SBAS611B – SEPTEMBER 2013 – REVISED OCTOBER 2013
TYPICAL CHARACTERISTICS: CONTOUR (continued)
At +25°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, IOVDD = 1.8 V, fS = 153.6 MSPS, sine-wave input clock,
1.5-VPP differential clock amplitude, 50% clock duty cycle, –1-dBFS differential analog input, 16-mA CML current, and 32kpoint FFT, unless otherwise noted. Note that after reset, the device is in 0-dB gain mode.
140
75
73
fS - Sampling Frequency - MSPS
74
72
71
70
120
69
68
100
75
73
74
72
71
70
80
69
68
67
66
60
75
40
74
50
100
71
72
73
150
69
70
250
200
68
300
67
65
66
400
350
64
450
500
fIN - Input Frequency - MHz
68
66
64
70
72
74
SNR - dBFS
M0048-33
Figure 41. SNR ACROSS INPUT AND SAMPLING FREQUENCIES
66
140
fS - Sampling Frequency - MSPS
69
68
120
67
66
100
69
68
70
67
80
66
65
60
68
69
70
40
50
100
150
67
250
200
300
64
450
65
400
350
500
fIN - Input Frequency - MHz
64
65
66
67
68
69
SNR - dBFS
70
M0048-34
Figure 42. SNR ACROSS INPUT AND SAMPLING FREQUENCIES (6-dB Gain)
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DEVICE CONFIGURATION
PARALLEL INTERFACE MODE
The device operates in parallel interface mode when a suitable voltage is applied on the MODE pin, as described
in Table 5. In parallel interface mode, the SEN, SDATA, SCLK, and SDOUT pins functionality differs from the
serial interface mode. In this mode, the SEN_FALIGN_IDLE and SCLK_SERF0_SCR pins turn into four levelcontrol pins for the JESD interface (as described in Table 6 and Table 7), whereas the SDATA_TEST0 and
SDOUT_TEST1 pins turn into 2-level control pins, as described in Table 8.
Table 5. MODE Pin (Pin 19)
MODE
DESCRIPTION
0
+150 mV/–0 mV
(3/8)AVDD
±150 mV
(5/8)AVDD
±150 mV
AVDD
+0 mV/–150 mV
Serial interface mode.
Pins 23, 24, and 25 are configured as SEN, SDATA, SCLK. Pins 36, 37, 38, and 39 are configured to output either
an early-signal estimate or a signal power estimate (selection is based on register settings).
Do not use
Parallel interface mode.
Pins 23, 24 and 25 are configured as parallel input pins for controlling the JESD204A modes. Pins 36, 37, 38, and
39 always output an early-signal estimate.
Do not use
Table 6. SEN_FALIGN_IDLE Pin, in Parallel Interface Mode (Pin 23)
SEN_FALIGN_IDLE
DESCRIPTION
0
+150 mV / 0 mV
FALIGN = 0, IDLE = 0
(3/8) AVDD
±150 mV
FALIGN = 1, IDLE = 0
(5/8) AVDD
±150 mV
FALIGN = 1, IDLE = 1
AVDD
0 mV / –150 mV
FALIGN = 0, IDLE = 1
Key:
FALIGN:
When the last octet of the current frame is the same as the last octet of the previous frame, then FALIGN determines
whether the last octet of the current frame is transmitted as is, or if the last octet is replaced by a K28.7 control symbol.
0 = Last octet transmitted as is
1 = Last octet is replaced with a K28.7 control symbol
IDLE:
IDLE determines the synchronization characters transmitted during and immediately after a SYNC event.
0 = The device transmits K28.5 as per the JESD204A specification
1 = The device alternately transmits K28.5 and D5.6/D16.2 characters as per the IEEE standard 802.3-2002 (part 3, clause
36.2.4.12). This setting is the case for both single- and dual-lane modes.
24
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Table 7. SCLK_SERF0_SCR Pin, in Parallel Interface Mode (Pin 25)
SCLK_SERF0_SCR
DESCRIPTION
0
+150 mV / 0 mV
SERF0 = 0, SCR = 0
(3/8) AVDD
±150 mV
SERF0 = 1, SCR = 0
(5/8) AVDD
±150 mV
SERF0 = 1, SCR = 1
AVDD
0 mV / –150 mV
SERF0 = 0, SCR = 1
Key:
SERF0: Output serialization factor.
0 = The device transmits two octets per frame (an entire ADC channel in a single lane) with an output serialization factor of 20
1 = The device transmits one octet per frame (one ADC channel over two lanes) with an output serialization factor of 10
0 = Scrambling disabled
1 = Scrambling enabled (as per JESD204A)
SCR:
Table 8. SDATA_TEST0 and SDOUT_TEST1 Pins, in Parallel Interface Mode (Pins 24 and 28)
TEST1
TEST0
0
0
Normal mode. JESD204A encoder input is ADC data.
MODE
0
1
JESD204A encoder input is B5B5. Output is a stream of D21.5 (alternating 1s and 0s).
1
0
JESD204A encoder input is FF00.
1
1
JESD204A encoder input is a pseudo random pattern 1 + X14 + X15 (regardless of whether the scrambler
is enabled or not).
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SERIAL INTERFACE
The analog-to-digital converter (ADC) has a set of internal registers that can be accessed by the serial interface
formed by the serial interface enable (SEN), serial interface clock (SCLK), and serial interface data (SDATA)
pins. Serially shifting bits into the device is enabled when SEN is low. SDATA serial data are latched at every
SCLK falling edge when SEN is active (low). The serial data are loaded into the register at every 16th SCLK
falling edge when SEN is low. If the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data
can be loaded in multiples of 16-bit words within a single active SEN pulse.
The first eight bits form the register address and the remaining eight bits are the register data. The interface can
function with SCLK frequencies from 20 MHz down to very low speeds (of few Hertz) and also with a non-50%
SCLK duty cycle.
Register Initialization
After power-up, the internal registers must be initialized to the default values. This initialization can be
accomplished in one of two ways:
1. Either through a hardware reset by applying a high-going pulse on RESET pin (of widths greater than 10 ns),
as shown in Figure 43,
or
2. By applying a software reset. Using the serial interface, set the S_RESET bit (bit D1 in register 00h) high.
This setting initializes the internal registers to the default values and then self-resets the S_RESET bit low. In
this case, the RESET pin is kept low.
Register Address
SDATA
A7
A6
A5
A4
A3
Register Data
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
tDH
tSCLK
tDSU
SCLK
tSLOADS
tSLOADH
SEN
RESET
Figure 43. Serial Interface Timing Diagram
Table 9. Timing Characteristics for Figure 43 (1)
PARAMETER
MIN
MAX
UNIT
20
MHz
fSCLK
SCLK frequency (= 1/ tSCLK)
tSLOADS
SEN to SCLK setup time
25
ns
tSLOADH
SCLK to SEN hold time
25
ns
tDS
SDATA setup time
25
ns
tDH
SDATA hold time
25
ns
(1)
26
> DC
TYP
Typical values are at TA = +25°C, minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX =
+85°C, AVDD = 1.8 V, AVDD_3V = 3.3 V, DRVDD = 1.8 V, and IOVDD = 1.8 V, unless otherwise noted.
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Serial Register Readout
The device includes an option where the contents of the internal registers can be read back. This readback may
be useful as a diagnostic check to verify the serial interface communication between the external controller and
the ADC.
1. First, set the SERIAL_READOUT register bit = 1. This setting also disables any further register writes
(except for writes to the SERIAL_READOUT register bit).
2. Initiate a serial interface cycle specifying the address of the register (A[7:0]) whose content must be read.
3. The device outputs the contents (D[7:0]) of the selected register on the SDOUT_TEST1 pin.
4. The external controller latches the contents at the SCLK falling edge.
5. To enable register writes, reset the SERIAL_READOUT register bit = 0.
Reset Timing
Figure 44 shows a reset timing diagram.
Power Supply
(AVDD, DRVDD)
t1
RESET
t2
t3
SEN
NOTE: A high-going pulse on the RESET pin is required for initialization through a hardware reset.
Figure 44. Reset Timing Diagram
Table 10. Timing Characteristics for Figure 44 (1)
PARAMETER
CONDITIONS
MIN
t1
Power-on delay
Delay from power-up of AVDD and DRVDD to RESET pulse active
t2
Reset pulse duration
Pulse duration of the active RESET signal that resets the serial registers
t3
Serial interface delay
Delay from RESET disable to SEN active
(1)
TYP
MAX
1
UNIT
ms
10
100
ns
Typical values are at TA = +25°C and minimum and maximum values are across the full temperature range of TMIN = –40°C to TMAX =
+85°C, unless otherwise noted.
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SERIAL INTERFACE REGISTER MAP
BIT LOCATION
REGISTER BIT NAME
ADDRESS
(Hex)
BIT
S_RESET
00
1
Software reset. This mode has the same function as a hardware reset.
SERIAL_READOUT
00
0
0 = Serial interface write (default)
1 = Serial readout
HIGH_SFDR_MODE
02
6:4, 0
DFS_OVERRIDE
3C
7
DESCRIPTION
Set these bits to obtain the best HD3 when the input frequency is between 150 MHz to
250 MHz.
This bit provides the override control mode for the DFS_EXTREF pin when controlling
the DFS select mode. This bit controls the DFS_EXTREF pin with the DFS_REG
register bit.
0 = DFS functionality determined by DFS_EXTREF pin
1 = DFS functionality determined by DFS_REG pin
This bit is the register bit for DFS control.
0 = Output format is twos complement.
1 = Output format is offset binary. This setting takes effect when DFS_OVERRIDE is set
to ‘1’.
DFS_REG
3C
6
CUSTOM_PAT[13:6]
3E
7:0
Eight MSBs of the 14-bit custom pattern can be programmed.
CUSTOM_PAT[5:0]
3F
7:2
Six LSBs of the 14-bit custom pattern can be programmed.
INT_REF_OVERRIDE
44
3
This bit is the override control for DFS_EXTREF pin when controlling the
internal/external reference select mode. This bit controls the DFS_EXTREF pin with the
INT_REF_REG register bit.
0 = Internal/external reference mode is determined by the DFS_EXTREF pin
1 = Internal/external reference mode is determined by the INT_REF_REG
This bit is the register bit for internal/external reference mode control.
INT_REF_REG
44
2
0 = Internal reference mode.
1 = External reference mode. This setting takes effect when INT_REF_OVERRIDE is
set to ‘1’.
S_PDN
44
6
Software power-down.
FINE_GAIN[3:0]
45
7:4
BYPASS_FINE_GAIN
45
0-dB to 6-dB digital gain in 0.5-dB steps (default gain is 0 dB). Refer to the Fine-Gain
Control section for further details.
Digital gain bypass. Digital gain is enabled by default. When this bit set to '1', digital gain
(fine gain) is bypassed.
These bits control the output test patterns.
ADC_TEST_PAT[2:0]
45
2:0
TXMIT_LINKDATA_EN
A0
0
S_FALIGN
A0
1
000 = ADC output data bus is input to JESD204A encoder block
001 = ADC bus is replaced by the minimum code (00000000000000 in offset binary).
010 = ADC bus replaced by the maximum code (11111111111111 in offset binary).
100 = ADC bus replaced by a ramping code pattern that increments by 1 LSB every four
clocks (and folds back to the minimum code when the maximum code is reached).
101 = ADC bus is replaced by custom patterns. The patterns are programmed by
registers 3E and 3F.
011, 110, 111 = Do not use
0 = Initial lane alignment sequence is not transmitted (default)
1 = Initial lane alignment sequence (as per JESD204A) is sent after the code group sync
in both single- and dual-lane interfaces
Software Frame Align control.
This bit enables frame alignment monitoring.
When scrambling is enabled and this bit is ‘1’, this bit is encoded as K28.7 when the last
scrambled octet in a frame equals FC.
S_FALIGN bit control is similar to the FALIGN pin control.
When this bit is 0 = There is no replacement.
1 = When scrambling is off, if the last octet in the previous frame is the same as the last
octet in the current frame, then the last octet in the current frame is replaced with a
frame alignment symbol K28.7
MFALIGN
28
A0
2
Multiframe align control.
This bit functions similarly to S_FALIGN, but refers to multiframe instead.
The multiframe alignment symbol is K28.3.
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BIT LOCATION
REGISTER BIT NAME
ADDRESS
(Hex)
DESCRIPTION
BIT
FLIP_ADC_BUS
A0
3
By default, the last octet in the frame is derived from the data octet on the LSB side. The
occurrence of consecutive last octets may be rare because the LSB octets usually
switch more (frame-to-frame) than the MSB octets. This condition can lead to an
infrequent occurrence of frame alignment symbols. To increase the rate of consecutive
last octets (and thereby the rate of frame and multiframe alignment symbols), this bit can
be set to '1'.
Setting this bit to '1' flips the bit order of the ADC inputs (N bits) to the JESD204A logic.
Note that the two zeros padded at the end to cause the JESD204A logic input to remain
unchanged.
TESTMODE_EN
A0
4
This bit enables the transmission of the test sequence mentioned in the JESD204A
document.
Software idle generation control.
Normally the output during code group synchronization is K28.5. When S_IDLE is set to
'1', the device output is a K28.5 comma followed by either a D5.6 or a D16.2 alignment
symbol. This configuration is as per IEEE standard 802.3-2002 (part 3, clause 36.2.4.12)
and enables compatibility with TI’s TLK family of devices.
This bit control is similar to the IDLE pin control (see Table 6).
S_IDLE
A0
5
S_TEST0
A0
6
S_TEST1
A0
7
These two bit controls are similar to the TEST1 and TEST0 pin controls.
CTRL_F
A1
0
This bit enables writes into register A6h, bits 7:0.
CTRL_K
A1
1
This bit enables writes into register A7h, bits 4:0.
S_SCR
A5
7
Software scrambling enable. This bit control is similar to the SCR pin control.
F[7:0]
A6
7:0
These bits control the number of octets per frame.
Default is set to 00000001 (2 – 1), which is two octets per frame (single-lane mode). For
a two-lane output (one octet per frame), set these bits to 00000000.
Note that in order to override default, CTRL_F must be set to '1'.
K[4:0]
A7
4:0
These bits control the number of frames per each multiframe (minus 1). Default depends
on value of bits F[7:0].
When F = 0 (10x mode), K = 16 (17 frames per multiframe)
When F = 1 (20x mode), K = 8 (nine frames per multiframe)
Note that to override the default value of bits K[4:0], CTRL_K must be set to '1'. When
CTRL_K is set to '1', the value programmed in bits A7[4:0] denotes the number of
frames per multiframe (minus 1). For example, to set the number of frames per
multiframe to 23, set CTRL_K = 1 and A7[4:0] = 10110.
CML_I[3:0]
B0
3:0
CML buffer current select. Default (0000) is 16 mA.
Current is calculated as: 16 mA +16 mA × bit 3 – 8 mA × bit 2 – 4 mA × bit 1 – 2 mA ×
bit 0
FORCE_OUT_LANE1
B4
3
This bit replaces the output of the 8b/10b coder (corresponding to the MSB octet) with a
10-bit word specified in the OUT_WORD_LANE1[9:0] bits.
B6
7:0
B7
7:6
B4
6
B8
7:4
B9
7:2
These bits are a 10-bit word replacing the output of the 8b/10b coder when
FORCE_OUT_LANE2 is set to ‘1’.
D6
0
This bit outputs a 4-bit ADC code with low latency on the DETECT[3:0] bits.
This bit outputs a 4-bit average power estimate of the input signal on the DETECT[3:0]
bits.
Power estimate is in dB scale in steps of approximately 1 dB. Refer to the Signal Power
Estimation section.
OUT_WORD_LANE1[9:0]
FORCE_OUT_LANE2
OUT_WORD_LANE2[9:0]
EN_SIG_EST
EN_PWR_EST
D6
5
SAMPLES_PWR_EST[2:0]
D6
4:2
These bits are a 10-bit word replacing the output of the 8b/10b coder when
FORCE_OUT_LANE1 is set to ‘1’.
This bit replaces the output of the 8b/10b coder (corresponding to the LSB octet) with a
10-bit word specified in the OUT_WORD_LANE2[9:0] bits.
These bits determine the number of samples to average for power estimation.
These bits are programmable from 1K to 16K.
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REGISTER MODES
A brief summary of different register modes and respective locations in the digital processing flow of the
ADS61JB46 is shown in Figure 45 and Figure 46.
ADC Digital Block
(Data Format,
Digital Gain)
ADC
FINE_GAIN[3:0]
DFS
ADC Test
Pattern
Generator
To
Frame to
Octet Conversion
JESD Test
Pattern
Generator
JESD
Test Mode
Generator
ADC_TEST_PAT[2:0]
TEST0, TEST1
TESTMODE_EN
Figure 45. Register Modes Before Frame to Octet Conversion Block
MSB octet
TXMIT_LINKDATA_EN
SYNC~
SYNC~
Decoder
To SERDES
TX
Controller
ILAS
Generator
OUT_WORD_LANE1[9:0]
8B, 10B
Coder
Frame to
Octet
Stream
Conversion
FORCE_OUT_LANE1
Scrambler
Alignment
Character
Generator
LSB octet
To SERDES
OUT_WORD_LANE2[9:0]
FLIP_ADC_BUS
SCR
SCR, FALIGN, MALIGN
FORCE_OUT_LANE2
Figure 46. Register Modes After Frame to Octet Conversion Block
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INITIAL LANE ALIGNMENT SEQUENCE
By default, the initial lane alignment sequence is not transmitted. To enable transmission of the initial lane
alignment sequence, for the two settings of F, the mapping of the link configuration fields to octets of the
JESD204A specification is shown in Table 11.
Table 11. Link Configuration Fields Mapping to Octets
CONFIGURATION
OCTET NO.
MSB
6
5
4
3
2
1
X
X
X
2
X
X
X
LID[4:0] = 00000
3
SCR[0], set
by S_SCR
X
X
L[4:0] = 00000
X
X
X
1
LSB
F = 1 (20x Mode)
0
DID[7:0] = 00000000
4
5
X
BID[3:0] = 0000
F[7:0] = 00000001
6
K[4:0] = 01000 (or programmed value of A7[4:0] if CTRL_K = 1)
M[7:0] = 00000000
7
X
N[4:0] = 01101
X
X
X
N'[4:0] = 01111
9
X
X
X
S[4:0] = 00000
10
HD[0] = 0
X
X
CF[4:0] = 00000
8
CS[1:0] = 00
11
RES1[7:0], set to all 0s
12
RES2[7:0], set to all 0s
13
FCHK[7:0]
F = 0 (10x Mode)
0
DID[7:0] = 00000000
1
X
X
X
2
X
X
X
LID[4:0] = 00000 for lane 1 and 00001 for lane 2
3
SCR[0], set
by S_SCR
X
X
L[4:0] = 00001
X
X
X
4
5
X
BID[3:0] = 0000
F[7:0] = 00000000
6
K[4:0] = 10000 (or programmed value of A7[4:0] if CTRL_K = 1)
M[7:0] = 00000000
7
X
N[4:0] = 01101
X
X
X
N'[4:0] = 01111
9
X
X
X
S[4:0] = 00000
10
HD[0] = 0
X
X
CF[4:0] = 00000
8
CS[1:0] = 00
11
RES1[7:0], set to all 0s
12
RES2[7:0], set to all 0s
13
FCHK[7:0]
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APPLICATION INFORMATION
THEORY OF OPERATION
The ADS61JB46 is a buffered analog input, ultralow power ADC with maximum sampling rates up to 160 MSPS.
The conversion process is initiated by a rising edge of the external input clock and the analog input signal is also
sampled. The sampled signal is sequentially converted by a series of small-resolution stages, with the outputs
combined in a digital correction logic block. At every clock edge the sample propagates through the pipeline,
resulting in a data latency of 20 clock cycles. The output is available as 14-bit data, coded in either straight offset
binary or binary twos complement format, with a JESD207A interface in CML logic levels.
ANALOG INPUTS
The analog input pins have analog buffers (running off of the AVDD3V supply) that internally drive the differential
sampling circuit. As a result of the analog buffer, the input pins present high input impedance to the external
driving source (10-kΩ dc resistance and 3-pF input capacitance). The buffer helps isolate the external driving
source from the switching currents of the sampling circuit. This buffering makes driving buffered inputs easier
when compared to an ADC without the buffer.
The input common-mode is set internally using a 5-kΩ resistor from each input pin to 1.95 V, so the input signal
can be ac-coupled to the pins. Each input pin (INP, INM) must swing symmetrically between (VCM + 0.5 V) and
(VCM – 0.5 V), resulting in a 2-VPP differential input swing.
The input sampling circuit has a high 3-dB bandwidth that extends up to 450 MHz (measured from the input pins
to the sampled voltage). Figure 47 shows an equivalent circuit for the analog input.
LPIN1
1 nH (±0.2 nH)
ROUTE1
15 W (±3 W)
INP_PIN
INP_ADC
5 pF (±0.5 pF)
CBUF1
0.5 pF
CESD1
5000 W (±600 W)
RVCM1
5 W (±2 W)
RBUF1
0.5 pF
CPBUF1
5000 W (±600 W)
RVCM2
LPIN2
1 nH (±0.2 nH)
ROUTE2
15 W (±3 W)
INM_PIN
INM_ADC
5 pF (±0.5 pF)
CBUF2
0.5 pF
CESD2
5 W (±2 W)
RBUF2
0.5 pF
CPBUF2
Figure 47. Analog Input Equivalent Circuit
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DRIVE CIRCUIT REQUIREMENTS
For optimum performance, the analog inputs must be driven differentially. This technique improves the commonmode noise immunity and even-order harmonic rejection. A small resistor (5 Ω) in series with each input pin is
recommended to damp out ringing caused by package parasitics.
Figure 48 and Figure 49 show the differential impedance (ZIN = RIN || CIN) at the ADC input pins. The presence of
the analog input buffer results in an almost constant input capacitance up to 1 GHz.
INP
CIN
RIN
INM
Note that at frequency (f), the real part of input impedance (input resistance) = RIN, the imaginary part of input impedance = 1 / (2 × πF ×
CIN), and input capacitance = CIN.
Figure 48. Analog Input Equivalent Impedance Model
Frequency - MHz
Frequency - MHz
Frequency - MHz
Figure 49. RIN and CIN versus Frequency
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EXAMPLE DRIVING CIRCUITS
Two example driving circuit configurations are shown in Figure 50 and Figure 51, one optimized for low input
frequencies and the other for high input frequencies. The presence of internal analog buffers makes the
ADS61JB46 simple to drive by absorbing any ADC kick-back noise. The mismatch in the transformer parasitic
capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two
identical RF transformers back-to-back helps minimize this mismatch and good performance is obtained in the
input frequency range of interest.
The drive circuit for low input frequencies (< 200 MHz) in Figure 50 uses two back-to-back connected ADT1-1
transformers terminated by 50 Ω near the ADC side. An additional termination resistor pair may be required
between the two transformers to improve even-order harmonic performance, as shown in drive circuit for high
input frequencies (> 200 MHz) in Figure 51. The center point of this termination is connected to ground to
improve the balance between the P (positive) and M (negative) sides. The example circuit in Figure 51 uses two
back-to-back connected ADTL2-18 transformers with a 200-Ω termination between them and a secondary 100 Ω
at the second transformer to obtain an effective 50 Ω (for a 50-Ω source impedance). The ac-coupling capacitors
allow the analog inputs to self-bias around the required common-mode voltage.
0.1 mF
5W
INP
0.1 mF
25 W
25 W
INM
5W
1:1
1:1
Figure 50. Drive Circuit with Low Bandwidth (for Low Input Frequencies)
0.1 mF
5W
INP
100 W
0.1 mF
50 W
50 W
100 W
INM
5W
1:2
2:1
Figure 51. Drive Circuit with High Bandwidth (for High Input Frequencies)
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CLOCK INPUT
The ADS61JB46 clock inputs can be driven differentially by a sine, LVPECL, or LVDS source with little or no
difference in performance between them. The common-mode voltage of the clock inputs is set to 0.95 V using
internal 5-kΩ resistors, as shown in Figure 52. This setting allows the use of transformer-coupled drive circuits for
a sine-wave clock or ac-coupling for LVPECL and LVDS clock sources (see Figure 53, Figure 54, and
Figure 55). For best performance, the clock inputs must be driven differentially, thereby reducing susceptibility to
common-mode noise. TI recommends keeping the differential voltage between clock inputs less than 1.8 VPP to
obtain best performance. For high input frequency sampling, TI recommends using a clock source with very low
jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in
performance with a non-50% duty cycle clock input.
Clock Buffer
LPKG
~ 2 nH
20 Ω
CLKP
CBOND
~ 1 pF
CEQ
RESR
~ 100 Ω
CEQ
5 kΩ
0.95V
LPKG
~ 2 nH
5 kΩ
20 Ω
CLKM
CBOND
~ 1 pF
RESR
~ 100 Ω
NOTE: CEQ is 1 pF to 3 pF and is the equivalent input capacitance of the clock buffer.
Figure 52. Internal Clock Buffer
0.1 μF
Zo
0.1 μF
CLKP
Differential
Sine-Wave
Clock Input
CLKP
Typical LVDS
Clock Input
RT
100 Ω
Zo
0.1 μF
CLKM
0.1 μF
CLKM
Figure 54. LVDS Clock Driving Circuit
Figure 53. Differential Sine-Wave Clock Driving
Circuit
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Zo
0.1 μF
CLKP
150 Ω
Typical LVPECL
Clock Input
100 Ω
Zo
0.1 μF
CLKM
150 Ω
Figure 55. LVPECL Clock Driving Circuit
FINE-GAIN CONTROL
The ADS61JB46 includes gain settings that can be used to obtain improved SFDR performance (compared to no
gain). The gain is programmable from 0 dB to 6 dB (in 0.5-dB steps). For each gain setting, the analog input fullscale range scales proportionally, as shown in Table 12.
SFDR improvement is achieved at the expense of SNR; for each gain setting, SNR degrades approximately 0.5
dB. SNR degradation is reduced at high input frequencies. As a result, fine gain is very useful at high input
frequencies because SFDR improvement is significant with marginal degradation in SNR. Therefore, fine gain
can be used to trade-off between SFDR and SNR. Note that the default gain after reset is 0 dB.
Table 12. Full-Scale Range Across Gains
FINE_GAIN[3:0]
GAIN (dB)
0000
0
TYPE
FULL-SCALE (VPP)
2.00
0001
0.5
1.89
0010
1
1.78
0011
1.5
1.68
0100
2
1.59
0101
2.5
1.5
Fine gain, programmable
(default after reset)
0110
3
0111
3.5
1.42
1.34
1000
4
1.26
1001
4.5
1.19
1010
5
1.12
1011
5.5
1.06
1100
6
1.00
1101
1110
Do not use
1111
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SIGNAL POWER ESTIMATION
The device includes a power estimation circuit that can be used to obtain a coarse power estimate (accurate to
within a dB) of the input signal averaged over a programmable number of samples. Enable the EN_PWR_EST
bit in order to make the power estimate available on the DETECT[3:0] pins. The states of the DETECT[3:0] bits
map to the input signal power as shown in Table 13.
Table 13. State of DETECT[3:0] Versus Input Signal Power
INPUT SIGNAL POWER
RANGE (dBFS)
DETECT[3:0]
INPUT SIGNAL POWER RANGE
(dBFS)
DETECT[3:0]
–Inf to –12.5
0001
–6.5 to –5.5
1000
–12.5 to –11.5
0010
–5.5 to –4.5
1001
–11.5 to –10.5
0011
–4.5 to –3.5
1010
–10.5 to –9.5
0100
–3.5 to –2.5
1011
–9.5 to –8.5
0101
–2.5 to –1.5
1100
–8.5 to –7.5
0110
–1.5 to 0
1101
–7.5 to –6.5
0111
0 to +1
1110
The number of samples used for computing the average power is set by SAMPLES_PWR_EST[2:0], as shown in
Table 14.
Table 14. Number of Samples Used for Power
Estimation
SAMPLES_PWR_EST[2:0]
NUMBER OF SAMPLES
000
1K
001
2K
010
4K
011
8K
100
16K
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DEFINITION OF SPECIFICATIONS
Analog Bandwidth: The analog input frequency at which the power of the fundamental is reduced by 3 dB with
respect to the low-frequency value.
Aperture Delay: The delay in time between the rising edge of the input sampling clock and the actual time at
which the sampling occurs. This delay is different across channels. The maximum variation is specified as
aperture delay variation (channel-to-channel).
Aperture Uncertainty (Jitter): The sample-to-sample variation in aperture delay.
Clock Pulse Duration and Duty Cycle: The duty cycle of a clock signal is the ratio of the time the clock signal
remains at a logic high (clock pulse duration) to the period of the clock signal. Duty cycle is typically expressed
as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle.
Maximum Conversion Rate: The maximum sampling rate at which certified operation is given. All parametric
testing is performed at this sampling rate unless otherwise noted.
Minimum Conversion Rate: The minimum sampling rate at which the ADC functions.
Differential Nonlinearity (DNL): An ideal ADC exhibits code transitions at analog input values spaced exactly 1
LSB apart. DNL is the deviation of any single step from this ideal value, measured in units of LSBs.
Integral Nonlinearity (INL): INL is the deviation of the ADC transfer function from a best-fit line determined by a
least-squares-curve fit of that transfer function, measured in units of LSBs.
Gain Error: Gain error is the deviation of the ADC actual input full-scale range from its ideal value. Gain error is
given as a percentage of the ideal input full-scale range. Gain error has two components: error resulting from
reference inaccuracy and error resulting from the channel. Both errors are specified independently as EGREF and
EGCHAN, respectively.
To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN.
For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5 / 100) × FSideal to (1 + 0.5 / 100) × FSideal.
Offset Error: Offset error is the difference, given in number of LSBs, between the ADC actual average idle
channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts.
Temperature Drift: The temperature drift coefficient (with respect to gain and offset error) specifies the change
per degree Celsius of the parameter from TMIN to TMAX. The coefficient is calculated by dividing the maximum
deviation of the parameter across the TMIN to TMAX range by the difference of TMAX – TMIN.
Signal-to-Noise Ratio (SNR): SNR is the ratio of the power of the fundamental (PS) to the noise floor power
(PN), excluding the power at dc and the first nine harmonics.
SNR = 10Log10
PS
PN
(1)
SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the
reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter fullscale range.
Signal-to-Noise and Distortion (SINAD): SINAD is the ratio of the power of the fundamental (PS) to the power
of all other spectral components including noise (PN) and distortion (PD), but excluding dc.
SINAD = 10Log10
PS
PN + PD
(2)
SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the
reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter fullscale range.
38
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Effective Number of Bits (ENOB): ENOB is a measure of the converter performance as compared to the
theoretical limit based on quantization noise.
ENOB =
SINAD - 1.76
6.02
(3)
Total Harmonic Distortion (THD): THD is the ratio of the power of the fundamental (PS) to the power of the first
nine harmonics (PD).
THD = 10Log10
PS
PN
(4)
THD is typically given in units of dBc (dB to carrier).
Spurious-Free Dynamic Range (SFDR): SFDR is the ratio of the power of the fundamental to the highest other
spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier).
Two-Tone Intermodulation Distortion (IMD3): IMD3 is the ratio of the power of the fundamental (at frequencies
f1 and f2) to the power of the worst spectral component at either frequency (2f1 – f2) or (2f2 – f1). IMD3 is either
given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or
dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range.
DC Power-Supply Rejection Ratio (DC PSRR): DC PSSR is the ratio of the change in offset error to a change
in analog supply voltage. DC PSRR is typically given in units of millivolts per volt.
AC Power-Supply Rejection Ratio (AC PSRR): AC PSRR is the measure of rejection of variations in the supply
voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the ADC
output code (referred to the input), then:
DVOUT
PSRR = 20Log 10
(Expressed in dBc)
DVSUP
(5)
Voltage Overload Recovery: The number of clock cycles taken to recover to less than 1% error after an
overload on the analog inputs. This overload recovery is tested by separately applying a sine-wave signal with a
6-dB positive and negative overload. The deviation of the first few samples after the overload (from the expected
values) is noted.
Common Mode Rejection Ratio (CMRR): CMRR is the measure of rejection of variation in the analog input
common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is
the resultant change of the ADC output code (referred to the input), then:
DVOUT
CMRR = 20Log10
(Expressed in dBc)
DVCM
(6)
Crosstalk (only for multichannel ADCs): Crosstalk is a measure of the internal coupling of a signal from
adjacent channel into the channel of interest. Crosstalk is specified separately for coupling from the immediate
neighboring channel (near-channel) and for coupling from a channel across the package (far-channel). Crosstalk
is usually measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of
the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the
adjacent channel input. Crosstalk is typically expressed in dBc (dB to carrier).
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SBAS611B – SEPTEMBER 2013 – REVISED OCTOBER 2013
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REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2013) to Revision B
Page
•
Changed document status from Product Preview to Production Data ................................................................................. 1
•
Changed Power-Down Modes, Fast recovery power-down mode, DNL, and INL parameter specifications in
Electrical Characteristics table .............................................................................................................................................. 4
•
Changed Power-Supply Currents, IIOVDD parameter name in Electrical Characteristics table .............................................. 4
•
Changed fS value in footnote 2 of Electrical Characteristics table ........................................................................................ 4
•
Changed CML Outputs, IOVDD supply range parameter minimum specification in Digital Characteristics table ............... 5
•
Changed description of DETECT[3:0], OVR, and RESET pins in Pin Functions table ...................................................... 12
•
Changed DAC to ADC in functional block diagram ............................................................................................................ 13
•
Deleted Differential Nonlinearity (DNL) and Integrated Nonlinearity (INL) curves from Typical Characteristics ................ 19
•
Changed legend in Figure 38 ............................................................................................................................................. 21
•
Changed footnote 1 in Table 9 ........................................................................................................................................... 26
•
Changed Serial Register Readout section into two sections: Serial Register Readout and Reset Timing ........................ 27
•
Changed number of clock cycles for data latency in Theory of Operation section ............................................................ 32
•
Changed 2-pF input capacitance to 3-pF input capacitance in Analog Inputs section ....................................................... 32
Changes from Original (September 2013) to Revision A
Page
•
Changed data rate value in 1st Features bullet .................................................................................................................... 1
•
Changed dual-lane mode value in 2nd Features bullet ........................................................................................................ 1
•
Changed 4th and 5th Features bullets ................................................................................................................................. 1
•
Added Recommended Operating Conditions table and Table 1 .......................................................................................... 3
•
Added Electrical Characteristics tables ................................................................................................................................ 4
•
Added Parametric Measurement Information section ........................................................................................................... 6
•
Added Pin Configuration section ........................................................................................................................................ 11
•
Added Functional Block Diagram section ........................................................................................................................... 13
•
Added Typical Characteristics sections .............................................................................................................................. 14
•
Added Device Configuration section ................................................................................................................................... 24
•
Added Application Information section ............................................................................................................................... 32
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS61JB46IRHAR
ACTIVE
VQFN
RHA
40
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
61JB46
ADS61JB46IRHAT
ACTIVE
VQFN
RHA
40
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-3-260C-168 HR
-40 to 85
61JB46
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
27-Aug-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
ADS61JB46IRHAR
VQFN
RHA
40
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
ADS61JB46IRHAT
VQFN
RHA
40
250
180.0
16.4
6.3
6.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS61JB46IRHAR
VQFN
RHA
40
2500
350.0
350.0
43.0
ADS61JB46IRHAT
VQFN
RHA
40
250
213.0
191.0
55.0
Pack Materials-Page 2
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