Texas Instruments | ADC10731/32/34/38 10-Bit Serial I/O ADC w/Mux, Sample/Hld & Ref (Rev. D) | Datasheet | Texas Instruments ADC10731/32/34/38 10-Bit Serial I/O ADC w/Mux, Sample/Hld & Ref (Rev. D) Datasheet

Texas Instruments ADC10731/32/34/38 10-Bit   Serial I/O ADC w/Mux, Sample/Hld & Ref (Rev. D) Datasheet
ADC10731, ADC10732, ADC10734, ADC10738
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SNAS081D – MAY 1999 – REVISED MARCH 2013
ADC10731/ADC10732/ADC10734/ADC10738 10-Bit Plus Sign Serial I/O A/D Converters
with Mux, Sample/Hold and Reference
Check for Samples: ADC10731, ADC10732, ADC10734, ADC10738
FEATURES
DESCRIPTION
•
•
•
•
•
•
•
•
The ADC10731, ADC10732 and ADC10734 are
obsolete or on lifetime buy and included for
reference only.
1
2
0V to Analog Supply Input Range
Serial I/O (MICROWIRE Compatible)
Software or Hardware Power Down
Analog Input Sample/Hold Function
Ratiometric or Absolute Voltage Referencing
No Zero or Full Scale Adjustment Required
No Missing Codes Over Temperature
TTL/CMOS Input/Output Compatible
APPLICATIONS
•
•
•
Medical Instruments
Portable and Remote Instrumentation
Test Equipment
KEY SPECIFICATIONS
•
•
•
•
•
•
•
Resolution 10 Bits Plus Sign
Single Supply 5 V
Power Consumption 37 mW (Max)
In Power Down Mode 18 μW
Conversion Time 5 μs (Max)
Sampling Rate 74 kHz (Max)
Band-Gap Reference 2.5V ±2% (Max)
This series of CMOS 10-bit plus sign successive
approximation A/D converters features versatile
analog input multiplexers, sample/hold and a 2.5V
band-gap reference. The 1-, 2-, 4-, or 8-channel
multiplexers can be software configured for singleended or differential mode of operation.
An input sample/hold is implemented by a capacitive
reference ladder and sampled-data comparator. This
allows the analog input to vary during the A/D
conversion cycle.
In the differential mode, valid outputs are obtained
even when the negative inputs are greater than the
positive because of the 10-bit plus sign output data
format.
The serial I/O is configured to comply with the
MICROWIRE serial data exchange standard for easy
interface to the COPS and HPC families of
controllers, and can easily interface with standard
shift registers and microprocessors.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
ADC10731, ADC10732, ADC10734, ADC10738
SNAS081D – MAY 1999 – REVISED MARCH 2013
www.ti.com
ADC10738 Simplified Block Diagram
Connection Diagrams
The ADC10731, ADC10732 and ADC10734 are obsolete in all packages. They are in this data sheet for
reference only.
Top View
Figure 1. ADC10731 16-Pin SOIC Package
See Package Number DW0016B
2
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Top View
Figure 2. ADC10734 20-Pin SOIC Package
See Package Number DW0020B
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Product Folder Links: ADC10731 ADC10732 ADC10734 ADC10738
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SNAS081D – MAY 1999 – REVISED MARCH 2013
Top View
Top View
Figure 3. ADC10732 20-Pin SOIC Package
See Package Number DW0020B
Figure 4. ADC10738 24-Pin SOIC Package
See Package Number DW0024B
Figure 5. SSOP Package
See Package Number DB0020A
Table 1. Pin Descriptions
Pin Name
Description
CLK
The clock applied to this input controls the successive approximation conversion time
interval, the acquisition time and the rate at which the serial data exchange occurs. The
rising edge loads the information on the DI pin into the multiplexer address shift register. This
address controls which channel of the analog input multiplexer (MUX) is selected. The falling
edge shifts the data resulting from the A/D conversion out on DO. CS enables or disables
the above functions. The clock frequency applied to this input can be between 5 kHz and 3
MHz
DI
This is the serial data input pin. The data applied to this pin is shifted by CLK into the
multiplexer address register. Table 2, Table 3, Table 4 show the multiplexer address
assignment.
DO
The data output pin. The A/D conversion result (DB0-SIGN) are clocked out by the failing
edge of CLK on this pin.
CS
This is the chip select input pin. When a logic low is applied to this pin, the rising edge of
CLK shifts the data on DI into the address register. This low also brings DO out of TRISTATE after a conversion has been completed
PD
This is the power down input pin. When a logic high is applied to this pin the A/D is powered
down. When a low is applied the A/D is powered up.
SARS
This is the successive approximation register status output pin. When CS is high this pin is in
TRI-STATE. With CS low this pin is active high when a conversion is in progress and active
low at all other times.
CH0–CH7
These are the analog inputs of the MUX. A channel input is selected by the address
information at the DI pin, which is loaded on the rising edge of CLK into the address register
(see Table 2, Table 3, Table 4).
The voltage applied to these inputs should not exceed AV+ or go below GND by more than
50 mV. Exceeding this range on an unselected channel will corrupt the reading of a selected
channel.
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Table 1. Pin Descriptions (continued)
Pin Name
Description
COM
This pin is another analog input pin. It can be used as a “pseudo ground” when the analog
multiplexer is single-ended.
VREF+
This is the positive analog voltage reference input. In order to maintain accuracy, the voltage
range VREF (VREF = VREF+–VREF−) is 0.5 VDCto 5.0 VDC and the voltage at VREF+ cannot
exceed AV+ +50 mV.
VREF−
The negative voltage reference input. In order to maintain accuracy, the voltage at this pin
must not go below GND − 50 mV or exceed AV+ + 50 mV.
AV+, DV+
These are the analog and digital power supply pins. These pins should be tied to the same
power supply and bypassed separately. The operating voltage range of AV+ and DV+ is
4.5 VDC to 5.5 VDC.
DGND
This is the digital ground pin.
AGND
This is the analog ground pin.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2) (3)
Supply Voltage (V+ = AV+ = DV+)
6.5V
Total Reference Voltage (VREF+–VREF−)
6.5V
+
V + 0.3V to −0.3V
Voltage at Inputs and Outputs
Input Current at Any Pin (4)
30 mA
Package Input Current (4)
120 mA
Package Dissipation at TA = 25°C (5)
ESD Susceptibility (6)
500 mW
Human Body Model
2500V
Machine Model
150V
N packages (10 seconds)
Soldering Information
SOIC Package
260°C
Vapor Phase (60 seconds)
215°C
Infrared (15 seconds)
220°C
−40°C to +150°C
Storage Temperature
(1)
(2)
(3)
(4)
(5)
(6)
All voltages are measured with respect to GND, unless otherwise specified.
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
When the input voltage (VIN) at any pin exceeds the power supplies (VIN < GND or VIN > AV+ or DV+), the current at that pin should be
limited to 30 mA. The 120 mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of 30 mA to four.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, θJA and the ambient temperature,
TA. The maximum allowable power dissipation at any temperature is PD = (TJmax − TA)/θJA or the number given In the Absolute
Maximum Ratings, whichever is lower. For this device, TJmax = 150°C. The typical thermal resistance (θJA) of these Paris when board
mounted can be found in the following Power Dissipation table:
The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin.
Operating Ratings (1) (2)
TMIN ≤ TA ≤ TMAX
Operating Temperature Range
−40°C ≤ TA ≤ +85°C
Supply Voltage (V+ = AV+ = DV+)
+4.5V to +5.5V
VREF+
AV+ +50 mV to −50 mV
VREF−
AV+ +50 mV to −50 mV
+0.5V to V+
VREF (VREF+–VREF−)
(1)
(2)
4
Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured
specifications and test conditions, see the Electrical Characteristics table. The ensured specifications apply only for the test conditions
listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
All voltages are measured with respect to GND, unless otherwise specified.
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SNAS081D – MAY 1999 – REVISED MARCH 2013
Electrical Characteristics
The following specifications apply for V+ = AV+ = DV+ = +5.0 VDC, VREF+ = 2.5 VDC, VREF− = GND, VIN− = 2.5V for Signed
Characteristics, VIN− = GND for Unsigned Characteristics and fCLK = 2.5 MHz unless otherwise specified. Boldface limits
apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C. (1) (2) (3) (4)
Parameter
Test Conditions
Typ (5)
Limits (6)
Units
(Limits)
SIGNED STATIC CONVERTER CHARACTERISTICS
10 + Sign
Bits
TUE
Resolution with No Missing Codes
Total Unadjusted Error (7)
±2.0
LSB (max)
INL
Positive and Negative Integral Linearity Error
±1.25
LSB (max)
Positive and Negative Full-Scale Error
±1.5
LSB (max)
Offset Error
Offset Error
Power Supply Sensitivity
V+ = +5.0V ±10%
+ Full-Scale Error
− Full-Scale Error
DC Common Mode Error
VIN+ = VIN− = VIN where
5.0V ≥ VIN ≥ 0V
(8)
Multiplexer Chan to Chan Matching
±1.5
LSB (max)
±0.2
±1.0
LSB (max)
±0.2
±1.0
LSB (max)
±0.1
±0.75
LSB (max)
±0.1
±0.33
LSB (max)
±0.1
LSB
UNSIGNED STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
10
Bits
TUE
Total Unadjusted Error (7)
VREF+ = 4.096V
±0.75
INL
Integral Linearity Error
VREF+ = 4.096V
±0.50
Full-Scale Error
VREF+ = 4.096V
±1.25
LSB (max)
Offset Error
VREF+ = 4.096V
±1.25
LSB (max)
+
LSB
LSB
Offset Error
V = +5.0V ±10%
±0.1
LSB
Full-Scale Error
VREF+ = 4.096V
±0.1
LSB
DC Common Mode Error (8)
VIN+ = VIN− = VIN where
+5.0V ≥ VIN ≥ 0V
±0.1
LSB
Multiplexer Channel to Channel Matching
VREF+ = 4.096V
±0.1
LSB
Power Supply Sensitivity
DYNAMIC SIGNED CONVERTER CHARACTERISTICS
S/(N+D)
Signal-to-Noise Plus Distortion Ratio
VIN = 4.85 VPP, and
fIN = 1 kHz to 15 kHz
67
dB
ENOB
Effective Number of Bits
VIN = 4.85 VPP, and
fIN = 1 kHz to 15 kHz
10.8
Bits
THD
Total Harmonic Distortion
VIN = 4.85 VPP, and
fIN = 1 kHz to 15 kHz
−78
dB
IMD
Intermodulation Distortion
VIN = 4.85 VPP, and
fIN = 1 kHz to 15 kHz
−85
dB
Full-Power Bandwidth
VIN = 4.85 VPP, where
S/(N + D) Decreases 3 dB
380
kHz
Multiplexer Chan to Chan Crosstalk
fIN = 15 kHz
−80
dB
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
Two on-chip diodes are tied to each analog input as shown below. They will forward-conduct for analog input voltages one diode drop
below ground or one diode drop greater than V+ supply. Be careful during testing at low V+ levels (+4.5V), as high level analog inputs
(+5V) can cause an input diode to conduct, especially at elevated temperatures, which will cause errors In the conversion result. The
specification allows 50 mV forward bias of either diode; this means that as long as the analog VIN does not exceed the supply voltage by
more than 50 mV, the output code will be correct. Exceeding this range on an unselected channel will corrupt the reading of a selected
channel. If AV+ and DV+ are minimum (4.5 VDC) and full scale must be ≤+4.55 VDC. See Figure 6
No connection exists between AV+ and DV+ on the chip.To ensure accuracy, it is required that the AV+ and DV+ be connected together
to a power supply with separate bypass filter at each V+ pin.
One LSB is referenced to 10 bits of resolution.
All the timing specifications are tested at the TTL logic levels, VIL = 0.8V for a falling edge and VIH = 2.0V for a rising. TRl-STATE
voltage level is forced to 1.4V.
Typicals are at TJ = TA = 25°C and represent most likely parametric norm.
Tested limits are ensured to AOQL (Average Outgoing Quality Level).
Total unadjusted error includes offset, full-scale, linearity, multiplexer, and hold step errors.
The DC common-mode error is measured in the differential multiplexer mode with the assigned positive and negative input channels
shorted together.
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Electrical Characteristics (continued)
The following specifications apply for V+ = AV+ = DV+ = +5.0 VDC, VREF+ = 2.5 VDC, VREF− = GND, VIN− = 2.5V for Signed
Characteristics, VIN− = GND for Unsigned Characteristics and fCLK = 2.5 MHz unless otherwise specified. Boldface limits
apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C.(1)(2)(3)(4)
Parameter
Test Conditions
Typ (5)
Limits (6)
Units
(Limits)
DYNAMIC UNSIGNED CONVERTER CHARACTERISTIC
S/(N+D)
Signal-to-Noise Plus Distortion Ratio
VREF+ = 4.096V,
VIN = 4.0 VPP, and
fIN =1 kHz to 15 kHz
60
dB
ENOB
Effective Bits
VREF+ = 4.096V,
VIN = 4.0 VPP, and
fIN = 1 kHz to 15 kHz
9.8
Bits
THD
Total Harmonic Distortion
VREF+ = 4.096V,
VIN = 4.0 VPP, and
fIN = 1 kHz to 15 kHz
−70
dB
IMD
Intermodulation Distortion
VREF+ = 4.096V,
VIN = 4.0 VPP, and
fIN = 1 kHz to 15 kHz
−73
dB
Full-Power Bandwidth
VIN = 4.0 VPP,
VREF+ = 4.096V,
where S/(N+D) decreases
3 dB
380
kHz
Multiplexer Chan to Chan Crosstalk
fIN = 15 kHz,
VREF+ = 4.096V
−80
dB
REFERENCE INPUT AND MULTIPLEXER CHARACTERISTICS
7
Reference Input Resistance
CREF
Reference Input Capacitance
MUX Input Capacitance
Off Channel Leakage Current
On Channel Leakage Current
kΩ(min)
9.5
kΩ(max)
−50
AV+ + 50mV
mV (min)
(max)
70
MUX Input Voltage
CIM
kΩ
5.0
pF
47
(9)
(9)
pF
On Channel = 5V and
Off Channel = 0V
−0.4
−3.0
μA (max)
On Channel = 0V and
Off Channel = 5V
0.4
3.0
μA (max)
On Channel = 5V and
Off Channel = 0V
0.4
3.0
μA (max)
On Channel = 0V and
Off Channel = 5V
−0.4
−3.0
μA (max)
2.5V ±0.5%
2.5V ±2%
V (max)
REFERENCE CHARACTERISTICS
VREFOut
Reference Output Voltage
ΔVREF/Δ
T
VREFOut Temperature Coefficient
ΔVREF/ΔI
Load Regulation, Sourcing
0 mA ≤ IL ≤ +4 mA
±0.003
±0.05
%/mA
(max)
Load Regulation, Sinking
0 mA ≤ IL ≤ −1 mA
±0.2
±0.6
%/mA
(max)
Line Regulation
5V ±10%
±0.3
±2.5
mV (max)
Short Circuit Current
VREFOut = 0V
13
22
mA (max)
Noise Voltage
10 Hz to 10 kHz,
CL = 100 μF
5
μV
±120
ppm/kHr
100
ms
L
ΔVREF/ΔI
L
ISC
±40
ΔVREF/Δt Long-term Stability
tSU
(9)
6
CL = 100 μF
Start-Up Time
ppm/°C
Channel leakage current is measured after the channel selection.
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Electrical Characteristics (continued)
The following specifications apply for V+ = AV+ = DV+ = +5.0 VDC, VREF+ = 2.5 VDC, VREF− = GND, VIN− = 2.5V for Signed
Characteristics, VIN− = GND for Unsigned Characteristics and fCLK = 2.5 MHz unless otherwise specified. Boldface limits
apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C.(1)(2)(3)(4)
Parameter
Test Conditions
Typ (5)
Limits (6)
Units
(Limits)
DIGITAL AND DC CHARACTERISTICS
VIN(1)
Logical “1” Input Voltage
V+ = 5.5V
2.0
V (min)
VIN(0)
Logical “0” Input Voltage
V+ = 4.5V
0.8
V (max)
IIN(1)
Logical “1” Input Current
VIN = 5.0V
0.005
+2.5
μA (max)
IIN(0)
Logical “0” Input Current
VIN = 0V
−0.005
−2.5
μA (max)
V = 4.5V, IOUT = −360
μA
2.4
V (min)
V+ = 4.5V, IOUT = −10 μA
4.5
V (min)
+
VOUT(1)
VOUT(0)
IOUT
Logical “1” Output Voltage
Logical “0” Output Voltage
TRI-STATE Output Current
+
V = 4.5V, IOUT = 1.6 mA
VOUT = 0V
VOUT = 5V
+
0.4
V (min)
−0.1
−3.0
μA (max)
+0.1
+3.0
μA (max)
+ISC
Output Short Circuit Source Current
VOUT = 0V, V = 4.5V
−30
−15
mA(min)
−ISC
Output Short Circuit Sink Current
VOUT= V+ = 4.5V
30
15
mA (min)
CS = HIGH, Power Up
0.9
1.3
mA (max)
CS = HIGH, Power Down
0.2
0.4
mA (max)
CS = HIGH, Power Down,
and CLK Off
0.5
50
μA (max)
CS = HIGH, Power Up
CS = HIGH, Power Down
2.7
3
6.0
15
mA (max)
μA (max)
0.6
mA (max)
2.5
MHz
(max)
kHz (min)
40
60
%(min)
%(max)
12
12
Clock
Cycles
5
5
μs (max)
4.5
4.5
Clock
Cycles
2
2
μs (max)
ID+
Digital Supply Current
(10)
(10)
IA+
Analog Supply Current
IREF
Reference Input Current
VREF+ = +2.5V and
CS = HIGH, Power Up
AC CHARACTERISTICS
fCLK
3.0
5
Clock Frequency
Clock Duty Cycle
tC
tA
Conversion Time
Acquisition Time
14
30
ns (min)
(1 tCLK
− 14 ns)
(1 tCLK
− 30 ns)
(max)
DI Set-Up Time, Set-Up Time from Data Valid on DI to
Rising Edge of Clock
16
25
ns (min)
tHDI
DI Hold Time, Hold Time of DI Data from Rising Edge of
Clock to Data not Valid on DI
2
25
ns (min)
tAT
DO Access Time from Rising Edge of CLK When CS is
“Low” during a Conversion
30
50
ns (min)
tAC
DO or SARS Access Time from CS , Delay from Falling
Edge of CS to Data Valid on DO or SARS
30
70
ns (max)
tDSARS
Delay from Rising Edge of Clock to Falling Edge of SARS
when CS is “Low”
100
200
ns (max)
tSCS
CS Set-Up Time, Set-Up Time from Falling Edge of CS to
Rising Edge of Clock
tSDI
(10) The voltage applied to the digital inputs will affect the current drain during power down. These devices are tested with CMOS logic
levels (logic Low = 0V and logic High = 5V). TTL levels increase the current, during power down, to about 300 μA.
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Electrical Characteristics (continued)
The following specifications apply for V+ = AV+ = DV+ = +5.0 VDC, VREF+ = 2.5 VDC, VREF− = GND, VIN− = 2.5V for Signed
Characteristics, VIN− = GND for Unsigned Characteristics and fCLK = 2.5 MHz unless otherwise specified. Boldface limits
apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C.(1)(2)(3)(4)
Parameter
Test Conditions
Typ (5)
Limits (6)
Units
(Limits)
tHDO
DO Hold Time, Hold Time of Data on DO after Falling
Edge of Clock
20
35
ns (max)
tAD
DO Access Time from Clock, Delay from Falling Edge of
Clock to Valid Data of DO
40
80
ns (max)
t1H, t0H
Delay from Rising Edge of CS to DO or SARS TRI-STATE
40
50
ns (max)
tDCS
Delay from Falling Edge of Clock to Falling Edge of CS
20
30
ns (min)
tCS(H)
CS “HIGH” Time for A/D Reset after Reading of
Conversion Result
1 CLK
1 CLK
cycle (min)
tCS(L)
ADC10731 Minimum CS “Low” Time to Start a Conversion
1 CLK
1 CLK
cycle (min)
tSC
Time from End of Conversion to CS Going “Low”
5 CLK
5 CLK
cycle (min)
tPD
Delay from Power-Down command to 10% of Operating
Current
1
tPC
Delay from Power-Up Command to Ready to Start a New
Conversion
10
CIN
Capacitance of Logic Inputs
7
pF
COUT
Capacitance of Logic Outputs
12
pF
μs
μs
Figure 6.
Power Dissipation
8
Part Number
Thermal Resistance
Package Type
ADC10731CIWM
90°C/W
M16B
ADC10732CIWM
80°C/W
M20B
ADC10734CIMSA
134°C/W
MSA20
ADC10734CIWM
80°C/W
M20B
ADC10738CIWM
75°C/W
M24B
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Figure 7. Transfer Characteristics
Figure 8. Simplified Error Curve vs Output Code
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Test Circuit
Figure 9. Leakage Current Test Circuit
10
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Typical Performance Characteristics
Analog Supply Current (IA+)
vs. Temperature
Analog Supply Current (IA+)
vs. Clock Frequency
Figure 10.
Figure 11.
Digital Supply Current (ID+)
vs. Temperature
Digital Supply Current (ID+)
vs. Clock Frequency
Figure 12.
Figure 13.
Offset Error
vs. Reference Voltage
Offset Error
vs. Temperature
Figure 14.
Figure 15.
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Typical Performance Characteristics (continued)
12
Linearity Error
vs. Clock Frequency
Linearity Error
vs. Reference Voltage
Figure 16.
Figure 17.
Linearity Error
vs. Temperature
10-Bit Unsigned
Signal-to-Noise + THD Ratio
vs. Input Signal Level
Figure 18.
Figure 19.
Spectral Response with
34 kHz Sine Wave
Power Bandwidth Response
with 380 kHz Sine Wave
Figure 20.
Figure 21.
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Typical Reference Performance Characteristics
Load Regulation
Line Regulation
Figure 22.
Figure 23.
Output Drift vs. Temperature
(3 Typical Parts)
Available Output Current
vs. Supply Voltage
Figure 24.
Figure 25.
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TRI-STATE TEST CIRCUITS AND WAVEFORMS
Figure 26.
Figure 27.
Figure 28.
Figure 29.
Timing Diagrams
Figure 30. DI Timing
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Figure 31. DO Timing
Figure 32. Delayed DO Timing
Figure 33. Hardware Power Up/Down Sequence
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Figure 34. Software Power Up/Down Sequence
Note: If CS is low during power up of the power supply voltages (AV+ and DV+) then CS needs to go high for tCS(H).
The data output after the first conversion is invalid.
The ADC10731 is obsolete. Information shown for reference only.
Figure 35. ADC10731 CS Low during Conversion
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Note: If CS is low during power up of the power supply voltages (AV+ and DV+) then CS needs to go high for tCS(H).
The data output after the first conversion is not valid.
The ADC10732 and the ADC10734 are obsolete. Information shown for reference only.
Figure 36. ADC10732, ADC10734 and ADC10738 CS Low during Conversion
Note: If CS is low during power up of the power supply voltages (AV+ and DV+) then CS needs to go high for tCS(H).
The data output after the first conversion is not valid.
The ADC10731 is obsolete. Information shown for reference only.
Figure 37. ADC10731 Using CS to Delay Output of Data after a Conversion has Completed
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Note: If CS is low during power up of the power supply voltages (AV+ and DV+) then CS needs to go high for tCS(H).
The data output after the first conversion is not valid.
The ADC10732 and the ADC10734 are obsolete. Information shown for reference only.
Figure 38. ADC10732, ADC10734 and ADC10738 Using CS to Delay Output of Data After a Conversion
has Completed
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Table 2. ADC10738 Multiplexer Address Assignment
MUX Address
MA0
MA1
MA2
Channel Number
MA3
MA4
PU
SING/
DIFF
ODD/
SIGN
SEL1
SEL0
1
1
0
0
0
1
1
0
0
1
1
1
0
1
0
1
1
0
1
1
1
1
1
0
0
1
1
1
0
1
1
1
1
1
0
1
1
1
1
1
1
0
0
0
0
1
0
0
0
1
1
0
0
1
0
1
0
0
1
1
1
0
1
0
0
1
0
1
0
1
1
0
1
1
0
1
0
1
1
1
0
X
X
X
X
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
MUX
MODE
COM
−
+
−
+
−
+
−
+
Single-Ended
−
+
−
+
−
+
−
+
−
+
+
−
+
−
−
+
−
−
+
Differential
+
−
+
−
+
Power Down (All Channels Disconnected)
Table 3. ADC10734 (Obsolete) Multiplexer Address Assignment
MUX Address
MA0
PU
MA1
MA2
SING/ DIFF ODD/ SIGN
Channel Number
MA3
MA4
SEL1
SEL0
1
1
0
0
0
1
1
0
0
1
1
1
1
0
0
1
1
1
0
1
1
0
0
0
0
1
0
0
0
1
1
0
1
0
0
1
0
1
0
1
0
X
X
X
X
CH0
CH1
CH2
CH3
MUX
MODE
COM
−
+
−
+
−
+
−
+
+
−
−
+
Single-Ended
+
−
−
+
Differential
Power Down (All Channels Disconnected)
Table 4. ADC10732 (Obsolete) Multiplexer Address Assignment
MUX Address
Channel Number
MA0
MA1
MA2
MA3
MA4
PU
SlNG/DIFF
ODD/SIGN
SEL1
SEL0
1
1
0
0
0
1
1
1
0
0
1
0
0
0
0
+
−
1
0
1
0
0
0
X
X
X
X
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CH0
CH1
+
COM
MUX
MODE
−
Single-Ended
−
+
−
Differential
+
Power Down (All Channels Disconnected)
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APPLICATIONS HINTS
The ADC10731, ADC10732 and ADC10734 are obsolete and discussed here for reference only.
The ADC10731/2/4/8 use successive approximation to digitize an analog input voltage. The DAC portion of the
A/D converters uses a capacitive array and a resistive ladder structure. The structure of the DAC allows a very
simple switching scheme to provide a versatile analog input multiplexer. This structure also provides a
sample/hold. The ADC10731/2/4/8 have a 2.5V CMOS bandgap reference. The serial digital I/O interfaces to
MICROWIRE and MICROWIRE+.
DIGITAL INTERFACE
There are two modes of operation. The fastest throughput rate is obtained when CS is kept low during a
conversion. The timing diagrams in Figure 35 and Figure 36 show the operation of the devices in this mode. CS
must be taken high for at least tCS(H) (1 CLK) between conversions. This is necessary to reset the internal logic.
Figure 37 and Figure 38 show the operation of the devices when CS is taken high while the ADC10731/2/4/8 is
converting. CS may be taken high during the conversion and kept high indefinitely to delay the output data. This
mode simplifies the interface to other devices while the ADC10731/2/4/8 is busy converting.
Getting Started with a Conversion
The ADC10731/2/4/8 need to be initialized after the power supply voltage is applied. If CS is low when the supply
voltage is applied then CS needs to be taken high for at least tCS(H)(1 clock period). The data output after the first
conversion is not valid.
Software and Hardware Power Up/Down
These devices have the capability of software or hardware power down. Figure 33 and Figure 34 show the timing
diagrams for hardware and software power up/down. In the case of hardware power down note that CS needs to
be high for tPC after PD is taken low. When PD is high the device is powered down. The total quiescent current,
when powered down, is typically 200 μA with the clock at 2.5 MHz and 3 μA with the clock off. The actual voltage
level applied to a digital input will effect the power consumption of the device during power down. CMOS logic
levels will give the least amount of current drain (3 μA). TTL logic levels will increase the total current drain to
200 μA.
These devices have resistive reference ladders which draw 600 μA with a 2.5V reference voltage. The internal
band gap reference voltage shuts down when power down is activated. If an external reference voltage is used, it
will have to be shut down to minimize the total current drain of the device.
ARCHITECTURE
Before a conversion is started, during the analog input sampling period, (tA), the sampled data comparator is
zeroed. As the comparator is being zeroed the channel assigned to be the positive input is connected to the
A/D's input capacitor. (The assignment procedure is explained in the Table 1 section.) This charges the input
32C capacitor of the DAC to the positive analog input voltage. The switches shown in the DAC portion of
Figure 39 are set for this zeroing/acquisition period. The voltage at the input and output of the comparator are at
equilibrium at this time. When the conversion is started, the comparator feedback switches are opened and the
32C input capacitor is then switched to the assigned negative input voltage. When the comparator feedback
switch opens, a fixed amount of charge is trapped on the common plates of the capacitors. The voltage at the
input of the comparator moves away from equilibrium when the 32C capacitor is switched to the assigned
negative input voltage, causing the output of the comparator to go high (“1”) or low (“0”). The SAR next goes
through an algorithm, controlled by the output state of the comparator, that redistributes the charge on the
capacitor array by switching the voltage on one side of the capacitors in the array. The objective of the SAR
algorithm is to return the voltage at the input of the comparator as close as possible to equilibrium.
The switch position information at the completion of the successive approximation routine is a direct
representation of the digital output. This data is then available to be shifted on the DO pin.
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Figure 39. Detailed Diagram of the ADC10738 DAC and Analog Multiplexer Stages
APPLICATIONS INFORMATION
Multiplexer Configuration
The design of these converters utilizes a sampled-data comparator structure, which allows a differential analog
input to be converted by the successive approximation routine.
The actual voltage converted is always the difference between an assigned “+” input terminal and a “−” input
terminal. The polarity of each input terminal or pair of input terminals being converted indicates which line the
converter expects to be the most positive.
A unique input multiplexing scheme has been utilized to provide multiple analog channels. The input channels
can be software configured into three modes: differential, single-ended, or pseudo-differential. Analog Input
Multiplexer Options illustrates the three modes using the 4-channel MUX of the ADC10734. The eight inputs of
the ADC10738 can also be configured in any of the three modes. The single-ended mode has CH0–CH3
assigned as the positive input with COM serving as the negative input. In the differential mode, the ADC10734
channel inputs are grouped in pairs, CH0 with CH1 and CH2 with CH3. The polarity assignment of each channel
in the pair is interchangeable. Finally, in the pseudo-differential mode CH0–CH3 are positive inputs referred to
COM which is now a pseudo-ground. This pseudo-ground input can be set to any potential within the input
common-mode range of the converter. The analog signal conditioning required in transducer-based data
acquisition systems is significantly simplified with this type of input flexibility. One converter package can now
handle ground-referred inputs and true differential inputs as well as signals referred to a specific voltage.
The analog input voltages for each channel can range from 50 mV below GND to 50 mV above V+ = DV+ = AV+
without degrading conversion accuracy. If the voltage on an unselected channel exceeds these limits it may
corrupt the reading of the selected channel.
Reference Considerations
The voltage difference between the VREF+ and VREF− inputs defines the analog input voltage span (the difference
between VIN(Max) and VIN(Min)) over which 1023 positive and 1024 negative possible output codes apply.
The value of the voltage on the VREF+ or VREF− inputs can be anywhere between AV+ + 50 mV and −50 mV, so
long as VREF+ is greater than VREF−. The ADC10731/2/4/8 can be used in either ratiometric applications or in
systems requiring absolute accuracy. The reference pins must be connected to a voltage source capable of
driving the minimum reference input resistance of 5 kΩ.
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The internal 2.5V bandgap reference in the ADC10731/2/4/8 is available as an output on the VREFOut pin. To
ensure optimum performance this output needs to be bypassed to ground with 100 μF aluminum electrolytic or
tantalum capacitor. The reference output can be unstable with capacitive loads greater than 100 pF and less
than 100 μF. Any capacitive loading less than 100 pF and greater than 100 μF will not cause oscillation. Lower
output noise can be obtained by increasing the output capacitance. A 100 μF capacitor will yield a typical noise
floor of
(1)
The pseudo-differential and differential multiplexer modes allow for more flexibility in the analog input voltage
range since the “zero” reference voltage is set by the actual voltage applied to the assigned negative input pin.
In a ratiometric system (Figure 40), the analog input voltage is proportional to the voltage used for the A/D
reference. This voltage may also be the system power supply, so VREF+ can also be tied to AV+. This technique
relaxes the stability requirements of the system reference as the analog input and A/D reference move together
maintaining the same output code for a given input condition.
For absolute accuracy (Figure 41), where the analog input varies between very specific voltage limits, the
reference pin can be biased with a time- and temperature-stable voltage source that has excellent initial
accuracy. The LM4040, LM4041 and LM185 references are suitable for use with the ADC10731/2/4/8.
The minimum value of VREF (VREF = VREF+–VREF−) can be quite small (see Typical Performance Characteristics)
to allow direct conversion of transducer outputs providing less than a 5V output span. Particular care must be
taken with regard to noise pickup, circuit layout and system error voltage sources when operating with a reduced
span due to the increased sensitivity of the converter (1 LSB equals VREF/1024).
The Analog Inputs
Due to the sampling nature of the analog inputs, at the clock edges short duration spikes of current will be seen
on the selected assigned negative input. Input bypass capacitors should not be used if the source resistance is
greater than 1 kΩ since they will average the AC current and cause an effective DC current to flow through the
analog input source resistance. An op amp RC active lowpass filter can provide both impedance buffering and
noise filtering should a high impedance signal source be required. Bypass capacitors may be used when the
source impedance is very low without any degradation in performance.
In a true differential input stage, a signal that is common to both “+” and “−” inputs is canceled. For the
ADC10731/2/4/8, the positive input of a selected channel pair is only sampled once before the start of a
conversion during the acquisition time (tA). The negative input needs to be stable during the complete conversion
sequence because it is sampled before each decision in the SAR sequence. Therefore, any AC common-mode
signal present on the analog inputs will not be completely canceled and will cause some conversion errors. For a
sinusoid common-mode signal this error is:
VERROR(max) = VPEAK (2 π fCM) (tC)
(2)
where fCM is the frequency of the common-mode signal, VPEAK is its peak voltage value, and tC is the A/D's
conversion time (tC = 12/fCLK). For example, for a 60 Hz common-mode signal to generate a ¼ LSB error (0.61
mV) with a 4.8 μs conversion time, its peak value would have to be approximately 337 mV.
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Analog Input Multiplexer Options
4 Single-Ended
2 Differential
4 Psuedo-Differential
2 Single-Ended and 1 Differential
Different Reference Configurations
Figure 40. Ratiometric Using the Internal Reference
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Figure 41. Absolute Using a 4.096V Span
Optional Adjustments
Zero Error
The zero error of the A/D converter relates to the location of the first riser of the transfer function (see Figure 7
Figure 8) and can be measured by grounding the minus input and applying a small magnitude voltage to the plus
input. Zero error is the difference between actual DC input voltage which is necessary to just cause an output
digital code transition from 000 0000 0000 to 000 0000 0001 and the ideal ½ LSB value (½ LSB = 1.22 mV for
VREF = + 2.500V).
The zero error of the A/D does not require adjustment. If the minimum analog input voltage value, VIN(Min), is not
ground, the effective “zero” voltage can be adjusted to a convenient value. The converter can be made to output
an all zeros digital code for this minimum input voltage by biasing any minus input to VIN(Min). This is useful for
either the differential or pseudo-differential input channel configurations.
Full-Scale
The full-scale adjustment can be made by applying a differential input voltage which is 1½ LSB down from the
desired analog full-scale voltage range and then adjusting the VREF voltage (VREF = VREF+– VREF−) for a digital
output code changing from 011 1111 1110 to 011 1111 1111. In bipolar signed operation this only adjusts the
positive full scale error.
Adjusting for an Arbitrary Analog Input
Voltage Range
If the analog zero voltage of the A/D is shifted away from ground (for example, to accommodate an analog input
signal which does not go to ground), this new zero reference should be properly adjusted first. A plus input
voltage which equals this desired zero reference plus ½ LSB is applied to selected plus input and the zero
reference voltage at the corresponding minus input should then be adjusted to just obtain the 000 0000 0000 to
000 0000 0001 code transition.
The full-scale adjustment should be made [with the proper minus input voltage applied] by forcing a voltage to
the plus input which is given by:
(3)
where VMAX equals the high end of the analog input range, VMIN equals the low end (the offset zero) of the
analog range. Both VMAX and VMIN are ground referred. The VREF (VREF = VREF+ − VREF−) voltage is then adjusted
to provide a code change from 011 1111 1110 to 011 1111 1111. Note, when using a pseudo-differential or
differential multiplexer mode where VREF+ and VREF− are placed within the V+ and GND range, the individual
values of VREF and VREF− do not matter, only the difference sets the analog input voltage span. This completes
the adjustment procedure.
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The Input Sample and Hold
The ADC10731/2/4/8's sample/hold capacitor is implemented in the capacitor array. After the channel address is
loaded, the array is switched to sample the selected positive analog input. The sampling period for the assigned
positive input is maintained for the duration of the acquisition time (tA) 4.5 clock cycles.
This acquisition window of 4.5 clock cycles is available to allow the voltage on the capacitor array to settle to the
positive analog input voltage. Any change in the analog voltage on a selected positive input before or after the
acquisition window will not effect the A/D conversion result.
In the simplest case, the array's acquisition time is determined by the RON (3 kΩ) of the multiplexer switches, the
stray input capacitance CS1 (3.5 pF) and the total array (CL) and stray (CS2) capacitance (48 pF). For a large
source resistance the analog input can be modeled as an RC network as shown in Figure 42. The values shown
yield an acquisition time of about 1.1 μs for 10-bit unipolar or 10-bit plus sign accuracy with a zero-to-full-scale
change in the input voltage. External source resistance and capacitance will lengthen the acquisition time and
should be accounted for. Slowing the clock will lengthen the acquisition time, thereby allowing a larger external
source resistance.
Figure 42. Analog Input Model
The signal-to-noise ratio of an ideal A/D is the ratio of the RMS value of the full scale input signal amplitude to
the value of the total error amplitude (including noise) caused by the transfer function of the ideal A/D. An ideal
10-bit plus sign A/D converter with a total unadjusted error of 0 LSB would have a signal-to-(noise + distortion)
ratio of about 68 dB, which can be derived from the equation:
S/(N + D) = 6.02(n) + 1.76
(4)
where S/(N + D) is in dB and n is the number of bits.
Note: Diodes are 1N914.
Note: The protection diodes should be able to withstand the output current of the op amp under current limit.
Figure 43. Protecting the Analog Inputs
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*1% resistors
Figure 44. Zero-Shift and Span-Adjust for Signed or Unsigned, Single-Ended
Multiplexer Assignment, Signed Analog Input Range of 0.5V ≤ VIN ≤ 4.5V
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REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 26
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADC10738CIWM/NOPB
ACTIVE
SOIC
DW
24
30
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
ADC10738
CIWM
ADC10738CIWMX/NOPB
ACTIVE
SOIC
DW
24
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
ADC10738
CIWM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADC10738CIWMX/NOPB
Package Package Pins
Type Drawing
SOIC
DW
24
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
10.8
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
15.9
3.2
12.0
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Dec-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADC10738CIWMX/NOPB
SOIC
DW
24
1000
367.0
367.0
45.0
Pack Materials-Page 2
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Buyers and others who are developing systems that incorporate TI products (collectively, “Designers”) understand and agree that Designers
remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have
full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products
used in or for Designers’ applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with
respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous
consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and
take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will
thoroughly test such applications and the functionality of such TI products as used in such applications.
TI’s provision of technical, application or other design advice, quality characterization, reliability data or other services or information,
including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to
assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any
way, Designer (individually or, if Designer is acting on behalf of a company, Designer’s company) agrees to use any particular TI Resource
solely for this purpose and subject to the terms of this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically
described in the published documentation for a particular TI Resource.
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third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
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INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF
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DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN
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Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949
and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements.
Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such
products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards
and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must
ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s noncompliance with the terms and provisions of this Notice.
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