Texas Instruments | DAC161S055 Precision 16-Bit, Buffered Voltage-Output DAC (Rev. B) | Datasheet | Texas Instruments DAC161S055 Precision 16-Bit, Buffered Voltage-Output DAC (Rev. B) Datasheet

Texas Instruments DAC161S055 Precision 16-Bit, Buffered Voltage-Output DAC (Rev. B) Datasheet
DAC161S055
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SNAS503B – NOVEMBER 2010 – REVISED JANUARY 2012
DAC161S055 Precision 16-Bit, Buffered Voltage-Output DAC
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FEATURES
DESCRIPTION
•
•
•
•
The DAC161S055 is a precision 16-bit, buffered
voltage output Digital-to-Analog Converter (DAC) that
operates from a 2.7V to 5.25V supply with a separate
I/O supply pin that operates down to 1.7V. The onchip precision output buffer provides rail-to-rail output
swing and has a typical settling time of 5 µsec. The
external voltage reference can be set between 2.5V
and VA (the analog supply voltage), providing the
widest dynamic output range possible.
1
2
•
•
•
16-bit DAC with a Two-buffer SPI Interface
Asynchronous Load DAC and Reset Pins
Compatibility with 1.8V Controllers
Buffered Voltage Output with Rail-to-Rail
Capability
Wide Voltage Reference Range of +2.5V to VA
Wide Temperature Range of −40°C to +105°C
Packaged in a 16-pin WQFN
APPLICATIONS
•
•
•
•
•
•
•
Process Control
Automatic Test Equipment
Programmable Voltage Sources
Communication Systems
Data Acquisition
Industrial PLCs
Portable Battery Powered Instruments
KEY SPECIFICATIONS
•
•
•
•
•
•
Resolution (Specified Monotonic) 16 bits
INL ±3 LSB (max)
Very Low Output Noise 120 nV/√Hz (typ)
Glitch Impulse 7 nV-s (typ)
Output Settling Time 5 µs (typ)
Power Consumption 5.5 mW at 5.25 V (max)
The 4-wire SPI compatible interface operates at clock
rates up to 20 MHz. The part is capable of Diasy
Chain and Data Read Back. An on board power-onreset (POR) circuit ensures the output powers up to a
known state.
The DAC161S055 features a power-up value pin
(MZB), a load DAC pin (LDACB) and a DAC clear
(CLRB) pin. MZB sets the startup output voltage to
either GND or mid-scale. LDACB updates the output,
allowing multiple DACs to update their outputs
simultaneously. CLRB can be used to reset the
output signal to the value determined by MZB.
The DAC161S055 has a power-down option that
reduces power consumption when the part is not in
use. It is available in a 16-lead WQFN package.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2012, Texas Instruments Incorporated
DAC161S055
SNAS503B – NOVEMBER 2010 – REVISED JANUARY 2012
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BLOCK DIAGRAM
VA Referenced Input
VA
MZB
VDDIO
VREF
CLRB
SDO
FIFO/
SPI/
INTERFACE
SDI
SCLK
16
CLR PRE
LOAD
16
PRE
REG
CLR PRE
LOAD
R-DAC
DAC
REG
Bypass
VOUT
BUF
CSB
10k
WRAL
WRUP
COMMANDS
GND
SWB
SEL_HIZ
LDACB
SEL_10K
VDDIO Referenced Inputs
CLR
COMMAND
VA
1
VOUT
2
VDDIO
MZB
CLRB
LDACB
16
15
14
13
CONNECTION DIAGRAM
12
CSB
11
SDI
WQFN 16
8
SDO
NC
9
7
4
GND
NC
6
SCLK
VREF
10
5
3
NC
NC
DAP
PIN DESCRIPTIONS
Pin #
WQFN-16
ESD Structure
Type
VDDIO
16
ESD
Clamp
Power
SPI, CLRB, LDACB Supply Voltage.
VA
1
ESD
Clamp
Power
Analog Supply Voltage.
Pin Name
2
Function and Connection
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PIN DESCRIPTIONS (continued)
Pin Name
Pin #
WQFN-16
ESD Structure
Type
Function and Connection
TO OUT DRIVE
VOUT
2
Analog Output
DAC output.
VREF
6
Analog Input
GND
7
Ground
SDI
11
Digital Input
SPI data input .
CSB
12
Digital Input
Chip select signal for SPI interface. On the falling edge of
CSB the chip begins to accept data and output data with
the SCLK signal. This pin is active low.
SCLK
10
Digital Input
Serial data clock for SPI Interface.
Voltage Reference Input.
Ground (Analog and Digital).
TO OUT DRIVE
SDO
9
Digital Output
Data Out for daisy chain or data read back verification.
LDACB
13
Digital Input
Load DAC signal. This signal transfers DAC data from
the SPI input register to the DAC output register. The
signal is active low.
CLRB
14
Digital Input
Asynchronous Reset. If this pin is pulled low, the output
will be updated to its power up condition set by the MZB
pin. This pin is active low.
MZB
15
Digital Input
Power up at Zero/Mid-scale. Tie this pin to GND to power
up to Zero or to VA to power up to mid-scale.
NC
DAP
3,4,5,8
DAP
No connect pins. Connect to GND in board layout will
result in the lowest amount of coupled noise.
Attach die attach paddle to GND for best noise
performance.
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
−0.3V to 6.0V
Supply Voltage, VA
−0.3V to VA+0.3V
Supply Voltage VDDIO
6V, −0.3V
Any pin relative to GND
Voltage on MZB or VREF Input Pin
Voltage on any other Input Pin
(3)
−0.3V to VA+0.3V
(3)
−0.3V to VDDIO+0.3V
Voltage on VOUT (3)
Voltage on SDO
−0.3V to VA+0.3V
(3)
Input Current at Any Pin
−0.3V to VDDIO+0.3V
(3)
5mA
Output Current Source or Sink by Vout
10mA
Output Current Source or Sink by SDO
3mA
Total Package Input and Output Current
20mA
ESD Susceptibility
Human Body Model
Machine Model
Charged Device Model (CDM)
3000V
250V
1250V
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+150°C
For soldering specifications: see product folder at www.ti.com and SNOA549
(1)
(2)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
The Electrical characteristics tables list specifications under the listed Recommended Conditions except as otherwise modified or
specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are NOT specified.
When the input voltage (VI) at any pin exceeds the power supplies (VI < GND or VI > VDD) the current at that pin must be limited to
5mA and VI has to be within the Absolute Maximum Rating for that pin. The 20mA package input current rating limits the number of pins
that can safely exceed the power supplies with current flow to four.
RECOMMENDED OPERATING CONDITIONS
(1) (2)
−40°C to +105°C
Operating Temperature Range
Supply Voltage, VA
+2.7V to 5.25V
Supply Voltage VDDIO
+1.7 V to VA
Reference Voltage VREF
+2.5V to VA
Digital Input Voltage
0 to VDDIO
Output Load
0 to 200 pF
Package Thermal Resistance
θJA (3)
θJC
(1)
(2)
(3)
4
41°C/W
6.5°C/W
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
The Electrical characteristics tables list specifications under the listed Recommended Conditions except as otherwise modified or
specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are NOT specified.
The maximum power dissipation is a function of TJ(MAX) and θJA. The maximum allowable power dissipation at any ambient temperature
is PD=(TJ(MAX)-TA)/θJA
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ELECTRICAL CHARACTERISTICS
The following specifications apply for VA = 2.7V to 5.25V, VDDIO = VA, VREF = 2.5V to VA, RL = 10k to GND, CL = 200 pF to
GND, fSCLK = 20 MHz, input code range 512 to 65023. Boldface limits apply for TMIN ≤ TA ≤ TMAX: all other limits apply to TA
= 25°C, unless otherwise specified. (1) (2) (3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
STATIC PERFORMANCE
N
Resolution
16
INL
Integral Non-Linearity
No load. From code 512 to
Full Scale - 512. VA=5V, VREF=4.096V
DNL
Differential Non-Linearity
No load. From code 512 to
Full Scale - 512. VA=5V, VREF=4.096V
Bits
±1
-1
ZE
Zero Code Error
4
FSE
Full Scale Error
-15
OE
Offset Error
-11
Offset Error Drift
GE
Gain Error
Gain Temperature Coefficient
±1
±3
1.1
LSB
15
mV
15
mV
11
±4
No load. From code 512 to
Full Scale - 512. VA=5V, VREF=4.096V
No load. From code 512 to
Full Scale - 512. VA=5V, VREF=4.096V
mV
µV/°C
±0.05
-25
LSB
% of FS
25
±2
mV
ppm FS/°C
REFERENCE INPUT CHARACTERISTICS
VREF
Reference Input Voltage Range
VA = 2.7V to 5.25V
2.5
Reference Input Impedance
VA
12.5
V
kΩ
ANALOG OUTPUT CHARACTERISTICS
Output Voltage Range
No load.
DC Output Impedance
ZCO
FSO
CL
Zero Code Output
Full Scale Output
Maximum Capacitive Load
0.015
VA-0.04
V
Ω
2
VA=3V, IOUT=200 µA; VREF=2.5
3
VA=3V, IOUT=1mA; VREF=2.5
4
VA=5V, IOUT=200 µA; VREF=4.096
4
VA=5V, IOUT=1mA; VREF=4.096
4
VA=3V, IOUT=200 µA; VREF=2.5
2.495
VA=3V, IOUT=1mA; VREF=2.5
2.494
VA=5V, IOUT=200 µA; VREF=4.096
4.091
VA=5V, IOUT=1mA; VREF=4.096
4.089
mV
V
Parallel R = 10KΩ
500
pF
Series R = 50Ω
15
µF
RL
Minimum Resistive Load
10
kΩ
ISC
Short Circuit Current
VA = +5V, VREF=4.096
353
mA
tPU
Power-up Time
From Power Down Mode
25
ms
ANALOG OUTPUT DYNAMIC CHARCTERISTICS
SR
ts
(1)
(2)
(3)
Voltage Output Slew Rate
Positive and negative
2
V/µs
Voltage Output Settling Time
1/4 scale to 3/4 scale VREF= VA = +5V,
settle to ±1 LSB.
5
µs
Digital Feedthrough
Code 0, all digital inputs from GND to
VDDIO
1
nV-s
Major Code Transition Analog
Glitch Impulse
VA=5V, VREF=2.5V. Transition from midscale − 1LSB to mid-scale.
7
nV-s
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The recommended Operating
Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
The Electrical characteristics tables list specifications under the listed Recommended Conditions except as otherwise modified or
specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are NOT specified.
Typical values represent most likely parametric norms at specific conditions (Example VA; specific temperature) and at the
recommended Operating Conditions at the time of product characterizations and are NOT specified.
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ELECTRICAL CHARACTERISTICS (continued)
The following specifications apply for VA = 2.7V to 5.25V, VDDIO = VA, VREF = 2.5V to VA, RL = 10k to GND, CL = 200 pF to
GND, fSCLK = 20 MHz, input code range 512 to 65023. Boldface limits apply for TMIN ≤ TA ≤ TMAX: all other limits apply to TA
= 25°C, unless otherwise specified.(1) (2) (3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Output Noise
Spot noise at 20 kHz
120
nV/√Hz
Integrated Output Noise
1Hz to 10 kHz
18
µV
DIGITAL INPUT CHARACTERISTICS
IIN
Input Current
VIL
Input Low Voltage
VIH
Input High Voltage
VILMZB
VIHMZB
CIN
MZB Input Low Voltage
MZB Input High Voltage
±1
VDDIO=5V
0.8
VDDIO=3V
0.8
VDDIO=1.8V
0.4
VDDIO=5V
2.1
VDDIO=3V
2.1
VDDIO=1.8V
1.4
µA
V
V
VA=5V
0.8
V
VA=3V
0.8
V
VA=5V
2.1
VA=3V
2.1
Input Capacitance
V
V
4
pF
DIGITAL OUTPUT CHARACTERISTICS
VOL
Output Low Voltage
Isink=200 µA; VDDIO>3V
400
Isink=2mA;VDDIO>3V
400
Isink=200 µA; VDDIO=1.8V
400
Isink=2mA;VDDIO=1.8V
VOH
Output High Voltage
lOZH, lOZL
COUT
400
Isink=200 µA; VDDIO>3V
VDDIO - 0.2
Isink=2mA;VDDIO>3V
VDDIO - 0.2
Isink=200 µA; VDDIO=1.8V
VDDIO - 0.2
Isink=2mA;VDDIO=1.8V
mV
V
1.15
TRI-STATE Leakage Current
<1n
TRI-STATE Output Capacitance
±1µ
4
A
pF
POWER REQUIREMENTS
VA
Analog Supply Voltage Range
2.7
5.25
V
VDDIO
Digital Supply Voltage Range
1.7
VA
V
IVA
6
VA Supply Current
No load. SCLK Idle. All digital inputs at
GND or VDDIO. VA=5V
0.75
No load. SCLK Idle. All digital inputs at
GND or VDDIO. VA=3.3V
0.62
0.5
IREF
Reference Current
IPDVA
VA Power Down Supply Current
All digital inputs at GND or VDDIO
IPDVO
VDDIO Power Down Supply
Current
All digital inputs at GND or VDDIO
IPDVR
VREF Power Down Supply
Current
1
1
mA
mA
350
3
1
µA
1
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DIGITAL INTERFACE TIMING CHARACTERISTICS
These specifications apply for VA = 2.7V to 5.25V, VDDIO = 1.7V to VA, CL = 200 pF. Boldface limits apply for TA = −40°C
to 105°C. All other limits apply to TA = 25°C, unless otherwise specified.
Symbol
fSCLK
Parameter
SCLK Frequency
tH
SCLK High Time
tL
SCLK Low Time
tCSB
Conditions
0
25
20
25
tCSH
CSB Hold Time after the 24th Falling
Edge of SCLK
tZSDO
CSB Falling Edge to SDO Valid
Units
10
MHz
75
VDDIO=2.7V to 5.25V
CSB Set-up Time Prior to SCLK Rising
edge
Max
20
15
VDDIO=1.7V to 2.7V
CSB High Pulse width
Typ
0
VDDIO=2.7V to 5.25V
tCSS
tSDOZ
Min
VDDIO=1.7V to 2.7V
40
10
0
CSB Rising Edge to SDO HiZ
VDDIO=1.8V
40
VDDIO=3V
10
VDDIO=5V
6
VDDIO=1.8V
75
VDDIO=3V
40
VDDIO=5V
27
tCLRS
CSB Rising Edge to CLRB Falling
Edge
CLRB must not transition anytime CSB
is low.
5
tLDACS
CSB Rising Edge to LDACB Falling
Edge
LDACB must not transition anytime CSB
is low.
5
tLDAC
LDACB Low Time
10
2.5
tCLR
CLRB Low Time
10
2.5
tDS
SDI Data Set-up Time prior to SCLK
Rising Edge
10
tDH
SDI Data Hold Time after SCLK Rising
Edge
0
tDO
SDO Output Data Valid
ns
VDDIO=1.7
62
VDDIO=3.3
25
VDDIO=5
15
TIMING DIAGRAMS
1
2
21
tL
22
23
24
tH
|
SCLK
|
|
1/fSCLK
SDO
D23
PD23
| |
SDI PD0
D0
|
tCSB
| | | | |
CS
PD0
Figure 1. DAC161S055 Input/Output Waveforms
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50%
SCLK
CSB
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CSB 50%
50%
50%
50%
50%
LDACB
tCSH
tCSS
CSB 50%
tLDACS
50%
tLDAC
50%
SCLK
SDO
50%
SDO
tDO
tZSDO
SCLK
tSDOZ
50%
CSB 50%
SDI
50%
CLRB
tDS
tCLRS
tDH
50%
tCLR
Figure 2. Timing Parameter Specifics
TRANSFER CHARACTERISTICS
FSE
65535 x VA
65536
GE = FSE - ZE
FSE = GE + ZE
OUTPUT
VOLTAGE
ZE
0
0
65535
DIGITAL INPUT CODE
Figure 3. Input/Output Transfer Characteristic
8
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SPECIFICATION DEFINITIONS
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1
LSB, which is VREF / 65536.
DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital
inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the data bus.
FULL-SCALE ERROR is the difference between the actual output voltage with a full scale code (FFFh) loaded
into the DAC and the value of VREF x 65535 / 65536.
GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and
Full-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error.
GLITCH IMPULSE is the energy injected into the analog output when the input code to the DAC register
changes. It is specified as the area of the glitch in nanovolt-seconds.
INTEGRAL NON_LINEARITY (INL) is a measure of the deviation of each individual code from a straight line
through the input to output transfer function. The deviation of any given code from this straight line is measured
from the center of that code value. The end point method is used. INL for this product is specified over a limited
range, per the Electrical Tables.
LEAST SIGNIFICANT BIT (MSB) is the bit that has the smallest value or weight of all bits in a word. This value
is LSB = VREF / 2n where VREF is the reference voltage for this product, and "n" is the DAC resolution in bits,
which is 16 for the DAC161S055.
MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output
stability maintained, although some ringing may be present.
MONOTONICITY is the condition of being monotonic, where the DAC output never decreases when the input
code increases.
MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is
1/2 of VREF.
OFFSET ERROR is the difference between zero voltage and a where a straight line fit to the actual transfer
function intersects the y axis.
SETTLING TIME is the time for the output to settle to within 1 LSB of the final value after the input code is
updated.
WAKE-UP TIME is the time for the output to recover after the device is commanded to the active mode from any
of the power down modes.
ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 0000h has been
entered.
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TYPICAL PERFORMANCE CHARACTERISTICS
DNL at VA = 3.0V
0.75
0.75
0.50
0.50
0.25
0.00
-0.25
0.25
0.00
-0.25
-0.50
-0.50
-0.75
-0.75
-1.00
-1.00
0
16,384
32,768
49,152
65,536
0
32,768
49,152
OUTPUT CODE
Figure 4.
Figure 5.
0.75
0.50
0.50
INL (LSBs)
0.75
0.25
0.00
65,536
INL at VA = 5.0V
1.00
-0.25
0.25
0.00
-0.25
-0.50
-0.50
-0.75
-0.75
-1.00
-1.00
0
16,384
32,768
49,152
65,536
0
32,768
49,152
OUTPUT CODE
Figure 6.
Figure 7.
DNL vs. Supply
65,536
INL vs. Supply
1.0
0.7
0.5
-DNL
+DNL
INL (LSBs)
0.4
16,384
OUTPUT CODE
0.8
INL (LSBs)
16,384
OUTPUT CODE
INL at VA = 3.0V
1.00
INL (LSBs)
DNL at VA = 5.0V
1.00
DNL (LSBs)
DNL (LSBs)
1.00
0.2
0.0
-0.2
-0.4
-INL
+INL
0.0
-0.5
-0.6
-0.8
2.65
10
3.30
3.95
4.60
5.25
-1.0
2.65
3.30
3.95
4.60
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
Figure 8.
Figure 9.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
DNL vs. VREF, VA=5V
INL vs. VREF, VA=5V
1.100
0.8
0.7
0.576
-DNL
+DNL
0.2
-INL
+INL
INL (LSBs)
DNL (LSBs)
0.4
0.0
0.051
-0.2
-0.4
-0.475
-0.6
-0.8
2.00
2.65
3.30
3.95
4.60
5.25
-1.000
2.00
2.65
3.30
3.95
4.60
5.25
VREF(V)
VREF(V)
Figure 10.
Figure 11.
DNL vs. Temperature, VA=5V, VREF=4.096
INL vs. Temperature, VA=5V, VREF=4.096
0.8
1.00
0.7
0.75
0.0
-0.2
0.25
-DNL
+DNL
0.00
-0.25
-0.4
-0.50
-0.6
-0.75
-0.8
-50 -30 -10 10 30 50 70 90 110
-1.00
-50 -30 -10 10 30 50 70 90 110
4.4
ZERO CODE ERROR (mV)
0.50
-DNL
+DNL
INL (LSBs)
0.2
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 12.
Figure 13.
Zero Code Error vs. IOUT
-0.08
VA=3V
VA=5V
Full Scale Error vs. IOUT
VA=3V
VA=5V
FULL SCALE ERROR (%FS)
DNL (LSBs)
0.4
-0.10
3.3
-0.12
2.2
-0.14
1.1
0.0
200
-0.16
400
600
800
1,000
-0.18
200
400
600
800
LOAD CURRENT ( A)
LOAD CURRENT ( A)
Figure 14.
Figure 15.
1,000
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
IVA vs VA
890
460
230
NO CLOCK, 5V
CLOCKING, 5V
NO CLOCK, 3.3V
CLOCKING, 3.3V
790
740
690
0
3
4
5
640
-50
6
-10
Figure 16.
Figure 17.
IREF vs VREF
VA CURRENT ( A)
380
240
120
110
IREF vs TEMPERATURE
335
NO CLOCK, 5V
CLOCKING, 5V
NO CLOCK, 3.3V
CLOCKING, 3.3V
290
245
1.8
2.4
3.0
3.6
200
-50
4.2
-10
70
TEMPERATURE °C
Figure 18.
Figure 19.
Settling Time
5
2.0
2.30
1.5
1.0
VOUT
CSB
101
102
103
CSB (V)
2.5
OUTPUT VOLTAGE (V)
3.0
1.65
110
POR
3.5
2.95
1.00
100
30
SUPPLY VOLTAGE (VREF)
3.60
VOUT (V)
70
TEMPERATURE °C
0
0.5
0.0
104
TIME ( S)
VA
VOUT
4
3
2
1
0
0
10
20
30
40
TIME (ms)
Figure 20.
12
30
SUPPLY VOLTAGE (VA)
360
SUPPLY CURRENT ( A)
IVA vs TEMPERATURE
840
690
VA CURRENT ( A)
SUPPLY CURRENT ( A)
920
Figure 21.
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TYPICAL PERFORMANCE CHARACTERISTICS (continued)
5V Glitch Response
1.275
Mid Scale-1 to Mid Scale
OUTPUT VOLTAGE (V)
1.270
1.265
1.260
1.255
1.250
1.245
1.240
2,000
2,500
3,000
3,500
4,000
TIME (ns)
Figure 22.
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FUNCTIONAL DESCRIPTION
DAC ARCHITECTURE OVERVIEW
The DAC161S055 uses a resistor array to convert the input code to an analog signal, which in turn is buffered by
the rail-to-rail output amplifier. The resistor array is factory trimmed to achieve 16-bit accuracy.
An SPI interface shifts the input codes into the device. The acquired input code is stored in the PREREG
register. After the input code is transferred to the DACREG register it affects the state of the resistor array and
the output level of the DAC. The transfer can be initiated by the type of write command used, by a software
LDAC command or by the state of the LDACB pin.
The user can control the power up state of the output using the MZB pin and the power down state of the output
using the CONFIG register. Additionally, there are external pins and CONFIG register bits that also control
clearing the DAC.
NOTE
Although the DAC161S055 is a single channel device, the instruction set is for
multichannel DACs. The user must address channel 0 (A2,A1,A0={000}).
OUTPUT AMPLIFIER
The output buffer amplifier is a rail to rail type which buffers the signal produced by the resistor array and drives
the external load. All amplifiers, including rail to rail amplifiers, exhibit a loss of linearity as the output nears the
power rails (in this case GND and VA). Thus the linearity of the part is specified over less than the full output
range. The user can program the CONFIG register to power down the amplifier and either place it in the high
impedance state (HiZ), or have the output terminated by an internal 10 kΩ pull-down resistor.
REFERENCE
An external reference source is required to produce an output. The reference input is not internally buffered and
presents a resistive load to the external source. Loading presented by the VREF pin varies by about 12.5%
depending on the input code. Thus a low impedance reference should be used for best results.
SERIAL INTERFACE
The 4-wire interface is compatible with SPI, QSPI and MICROWIRE, as well as most DSPs. See the TIMING
DIAGRAMS for timing information about the read and write sequences. The serial interface is the four signals
CSB, SCLK, SDI and SDO.
A bus transaction is initiated by the falling edge of the CSB. Once CSB is low, the input data is sampled at the
SDI pin by the rising edge of the SCLK. The output data is put out on the SDO pin on the falling edge of SCLK.
At least 24 SCLK cycles are required for a valid transfer to occur. If CSB is raised before 24th rising edge of the
SCLK, the transfer is aborted. If the CSB is held low after the 24th falling edge of the SCLK, the data will
continue to flow through the FIFO and out the SDO pin. Once CSB transitions high, the internal controller will
decode the most recent 24 bits that were received before the rising edge of CSB. The DAC will then change
state depending on the instruction sent and the state of the LDACB pin.
CSB
SCLK
1
2
3
4
SDI
D23
D22
D21
D20
23
D1
24
D0
HiZ
SDO
14
HiZ
Preceeding Transfer Data
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The acquired data is shifted into an internal 24 bit shift register (MSB first) which is configured as a 24 bit deep
FIFO. As the data is being shifted into the FIFO via the SDI pin, the prior contents of the register are being
shifted out through the SDO output. While CSB is high, SDO is in a high-Z state. At the falling edge of CSB, SDO
presents the MSB of the data present in the shift register. SDO is updated on every subsequent falling edge of
SCLK (note — the first SDO transition will happen on the first falling edge AFTER the first rising edge of SCLK
when CSB is low).
The 24 bits of data contained in the FIFO are interpreted as an 8 bit COMMAND word followed by 16 bits of
DATA. The general format of the 24 bit data stream is shown below. The full Instruction Set is tabulated in
Section INSTRUCTION SET.
CSB
SDI
COMMAND
8 bits
DATA
16 bits
1.4.1 SPI Write
SPI write operation is the simplest transaction available to the user. There is no handshaking between master
and the slave (DAC161S055), and the master is the source of all signals required for communication: SCLK,
CSB, SDI. The format of the data transfer is described in the section 1.4. The user instruction set is shown in
Section INSTRUCTION SET.
SPI Read
The read operation requires all 4 wires of the SPI interface: SCLK, SCB, SDI, SDO. The simplest READ
operation occurs automatically during any valid transaction on the SPI bus since SDO pin of DAC161S055
always shifts out the contents of the internal FIFO. Therefore the user can verify the data being shifted in to the
FIFO by initiating another transaction and acquiring data at SDO. This allows for verification of the FIFO contents
only.
The 3 internal registers (PREREG, DACREG, CONFIG) can be accessed by the user through the Register Read
commands: RDDO, RDIN, RDCO respectively (see Section INSTRUCTION SET). These operations require 2
SPI transaction to recover the register data. The first transaction shifts in the Register Read command; an 8 bit
command byte followed by 16 bit “dummy” data. The Register Read command will cause the transfer of contents
of the internal register into the FIFO. The second transaction will shift out the FIFO contents; an 8 bit command
byte (which is a copy of previous transaction) followed by the register data. The Register Read operation is
shown in the figure below.
CSB
SDI
SDO
HiZ
RDDO/RDCO/RDIN
8 bits
'RQ¶W &DUH
16 bits
Prior Command
8 bits
Prior Data
16 bits
Next Command
8 bits
HiZ
RDDO/RDCO/RDIN
8 bits
Next Data
16 bits
REG DATA
16 bits
HiZ
SPI Daisy Chain
It is possible to control multiple DACs or other SPI devices with a single master equipped with one SPI interface.
This is accomplished by connecting the DACs in a Daisy Chain. The scheme is depicted in the figure below. An
arbitrary length of the chain and an arbitrary number of control bits for other devices in the chain is possible since
individual DAC devices do not count the data bits shifted in. Instead, they wait to decode the contents of their
respective shift registers until CSB is raised high.
A typical bus cycle for this scheme is initiated by the falling CSB. After the 24 SCLK cycles new data starts to
appear at the SDO pin of the first device in the chain, and starts shifting into the second device. After 72 SCLK
cycles following the falling CSB edge, all three devices in this example will contain new data in their input shift
registers. Raising CSB will begin the process of decoding data in each DAC. When in the Daisy Chain the full
READ and WRITE capability of every device is maintained.
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SYNC
CLK
(1)
(2)
(3)
SPI/QSPI
MICROWIRE
CSB
CSB
CSB
MASTER
SCLK
SCLK
SCLK
SDI
MOSI
SDO
DAC161S055
SDI
SDO
SDI
DAC161S055
SDO
DAC161S055
MISO
A sample of SPI data transfer appropriate for a 3 DAC Daisy Chain is shown in the figure below.
72 Clock Cycles
SYNC
MOSI
DATA (3)
DATA (2)
DATA (1)
POWER-UP DEFAULT OUTPUT
It is possible to power up the DAC with the output either at GND or midscale. This functionality is achieved by
connecting the MZB pin either to GND or to VA (note, the MZB pin is referenced to VA, not VDDIO). Usually this
function is hardwired in the application, but can also be controlled by a GPIO pin of the µC. To power up with
output at zero, tie the MZB pin low. To power up with output at midscale, tie MZB high. The MZB pin is level
sensitive.
CHANGING DAC OUTPUT
There are multiple different ways to affect the DAC output. The CONFIG register can be changed so that a write
to the PREREG is seen instantly at the output. The LDAC function or LDACB pin updates the output instantly.
Finally, the type of write command (WRUP, WRAL, WR) can affect if the output updates instantly or not.
Write-Through and Write-Block Modes
Using the SWB bit of the CONFIG register, the user can set the part in WRITE-BLOCK or WRITE-THROUGH
mode.
If the DAC channel is configured in the WRITE-BLOCK mode (SWB=0, default), the DAC input DATA is held in
the PREREG until the controller forces the transfer of DATA from PREREG to DACREG register. Only DATA in
DACREG register is converted to the equivalent analog output. The transfer from PREREG into DACREG can be
forced by both software and hardware LDAC commands. The Data Writing commands WRUP and WRAL update
both PREREG and DACREG at the same time regardless of the channel mode. WRITE-BLOCK mode is used in
multi device or multi channel applications. A user can preload all DAC channels with desired data, in multiple SPI
transactions, and then issue a single software LDAC command (or toggle the LDACB pin) to simultaneously
update all analog outputs.
If the DAC channel is configured in WRITE-THROUGH mode (SWB=1) the controller updates both PREREG and
DACREG registers simultaneously. Therefore in WRITE-THROUGH mode the channel output is updated as soon
as the SPI transfer is completed i.e. upon the rising edge of CSB.
LDAC Function
The LDACB (Load DAC) pin provides a easy way to synchronize several DACs and update the output without
any SPI latency. If the LDACB is asserted low, the content of the PREREG register is instantaneously moved
into the DACREG register. The LDACB pin is level sensitive. If the LDACB pin is held low continuously, the DAC
output will update as soon as the CSB pin goes high.
16
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CSB
SCLK
2
1
3
4
23
24
LDACB
LDACB must not transition here (may be
held low for whole transaction)
The DAC Configuration command LDAC (see Section INSTRUCTION SET below) will also update the DAC
output as soon as it is received. The effect of hardware LDACB or software LDAC is the same i.e. data is
transferred from the PREREG to DACREG and output of the DAC is updated.
Write Commands
There are three write commands available in the DAC command set. Issuing a WR command causes the DAC to
update either the PREREG or the DACREG depending on the setting of the SWB bit (see Section Write-Through
and Write-Block Modes). Issuing a WRUP command causes the specified channels output (for multiple channel
parts) to update immediately, regardless of the SWB bit setting. Issuing a WRAL command causes all channels
(for multiple channel parts) to update immediately with the same data, regardless of the SWB bit setting.
CLEAR FUNCTION
The CLRB pin provides a easy way to reset the DAC161S055 output. If the CLRB pin goes low, VOUT
instantaneously slews to the value indicated by the MZB pin, either zero or midscale. The CLRB pin is level
sensitive.
CSB
SCLK
1
2
3
4
23
24
CLRB
CLRB must not be asserted here
Clear function can also be accessed via the software instruction CLR, see Section INSTRUCTION SET below.
The effect of hardware CLRB or software CLR is the same.
POWER ON RESET
An on-chip power on reset circuit (POR) ensures that the DAC always powers on in the same state. The
registers will be loaded with the defaults shown in Section INSTRUCTION SET. The output state will be
controlled by the state of the MZB pin.
POWER DOWN
Power down is achieved by writing the PD instruction and setting the appropriate bit to a logic '1'. In the PD
command, it is possible to specify if the output is left in a high impedance (HIZ) state or if it is pulled to GND
through a 10K resistor. During power down, the output amplifier is disabled and the resistor ladder is
disconnected from Vref. The SPI interface remains active. To exit power down, write the PD command again,
setting the appropriate bit to a logic '0'. Note that the SPI interface and the registers are all active during power
down.
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INTERNAL REGISTERS
There are 3 registers that are accessible to the user. The data registers (PREREG and DACREG) are both
readable and writable from the command set. The CONFIG register is only readable from the command set. Bits
in the CONFIG register are set by the commands detailed in Section INSTRUCTION SET.
MSB
LSB
Bit15–0:
MSB
LSB
Bit15–0:
LSB
Bit7–3:
Bit2:
Bit1:
Bit0:
18
PREREG: DAC Preload Data Register(16Bits)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PRD15
PRD14
PRD13
PRD12
PRD11
PRD10
PRD9
PRD8
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
PRD7
PRD6
PRD5
PRD4
PRD3
PRD2
PRD1
PRD0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
16
16 bit data word to be converted. Bit 15 has a weight of 1/2*Vref. Bit 0 has a weight of Vref/2 .
DACREG: DAC Output Data Register(16Bits)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IND15
IND14
IND13
IND12
IND11
IND10
IND9
IND8
Bit15
Bit14
Bit13
Bit12
Bit11
Bit10
Bit9
Bit8
R/W
R/W
R/W
R/W
R/W
R/W
IND7
IND6
IND5
IND4
IND3
IND2
R/W
IND1
R/W
IND0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
16
16 bit data word to be converted. Bit 15 has a weight of 1/2*Vref. Bit 0 has a weight of Vref/2 .
CONFIG: DAC Configuration Reporting Register (8 Bits)
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
IND7
IND6
IND5
IND4
IND3
IND2
IND1
IND0
Bit7
Bit6
Bit5
Bit4
Bit3
Bit2
Bit1
Bit0
Reserved. Read value is undefined and should be discarded.
SWB: Set Write Block bit
0: Channel is in WRITE THROUGH mode.
1: Channel is in WRITE BLOCK mode.
0: Channel is either active or SEL_HIZ is set.
1: Channel is powered down and output is terminated by a 10K resistor to GND.
0: Channel is either active or SEL_10K is set.
1: Channel is powered down and output is in high impedance state.
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INSTRUCTION SET
The instruction set for the DAC161S055 is common to the family of single and multi channel devices (DAC16xS055). The DAC161S055 has only a single
channel — Channel 0.
NOTE
DATA WRITING and REGISTER READING instructions encode the channel address as a binary triplet (A2,A1,A0) as the
last three LSBs of the command byte. DAC CONFIGURATION instructions encode the channel selection by a bit set in the
data bytes. For example, when executing the LDAC instruction a payload of {0100 0001} in the least significant byte of the
instruction indicates channels 6 and 0 are targeted.
MNEMONIC
Command Byte[7:0]
DATA[15:8]
DATA [7:0]
Description
DEFAULT
DAC Configuration
NOP
0
0
0
0
0
0
0
0
xxxx xxxx
xxxx xxxx
No Operation
CLR
0
0
0
0
0
0
0
1
xxxx xxxx
xxxx xxxx
Clear internal registers, return to Power-Up
default state
LDAC
0
0
0
1
1
0
0
0
xxxx xxxx
CHANNEL[7:0]
Software LOAD DAC. A '1' causes data stored in
the specified channel's PREREG to be transferred
to DACREG and the output updated.
SWB
0
0
1
0
1
0
0
0
xxxx xxxx
CHANNEL[7:0]
Set WRITE BLOCK or WRITE THROUGH for the
selected channels.
00FFh
0: WRITE THROUGH
1: WRITE BLOCK
PD
0
0
1
1
0
0
0
0
CHANNEL[7:0]
CHANNEL[7:0]
Sets SEL_10K or SEL_HIZ. Upper 8 bits PD Hi-Z; 0000h
Lower 8-bits PD 10K; if both are 1's; PD -> 10K
1: Upper 8 bits: SEL_HIZ
1: Lower 8 bits: SEL_10K
1: Both upper and lower: SEL_10K
Data Writing
WR
0
0
0
0
1
A2
A1
A0
DACDATA[15:8]
DACDATA[7:0]
Write to specified channel. WRITE BLOCK or
WRITE TRHOUGH setting controls destination
register (PREREG or DACREG).
WRUP
0
0
0
1
0
A2
A1
A0
DACDATA[15:8]
DACDATA[7:0]
Update specified channel's DACREG and
PREREG regardless of WRITE BLOCK or WRITE
THROUGH setting.
WRAL
0
0
1
0
0
0
0
0
DACDATA[15:8]
DACDATA[7:0]
Update all channel's DACREG and PREREG
regardless of WRITE BLOCK or WRITE
THROUGH setting.
<Reserved>
1
0
0
0
0
x
x
x
RDDO
1
0
0
0
1
A2
A1
A0
DACDATA[15:8]
DACDATA[7:0]
Register Reading
<Reserved>
Read PREREG register.
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MNEMONIC
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Command Byte[7:0]
DATA[15:8]
RDCO
1
0
0
1
0
A2
A1
A0
0000 0000
RDIN
1
0
0
1
1
A2
A1
A0
DACDATA[15:8]
20
DATA [7:0]
Description
0000 0,swb,sel_10k, sel_hiz
Read CONFIG register.
DACDATA[7:0]
Read DACREG register.
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DEFAULT
0004h
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APPLICATIONS INFORMATION
SAMPLE INSTRUCTION SEQUENCE
The following table shows an example instruction sequence to illustrate the usage of different modes of operation
of the DAC. This sequence is for a one channel DAC.
Step
Instruction
8-bit Command
16 bit Payload
Comments
1
CLR
0000 0001
0000 0000 0000 0000
Clear device - return to Power-Up Default State
2
WR
0000 1000
0100 0000 0000 0000
Write 1/4 FS into channel 0. Since device by default is in
WRITE-BLOCK mode the data will be written into PREREG,
and DAC output will not update
3
LDAC
0001 1000
xxxx xxxx 0000 0001
Issue LDAC command to channel 0. Data is transferred from
PREREG into DACREG and DAC output updates to 1/4 FS
4
SWB
0010 1000
xxxx xxxx 1111 1110
Set channels 1 to 7 to WRITE-BLOCK mode, and channel 0 to
WRITE-THROUGH mode
5
WR
0000 1000
1111 1111 1111 1111
DAC output updates immediately to FS since the channel is
set to write through mode.
6
PD
0011 0000
0000 0001 0000 0000
Power down the device, and set the channel 0 DAC output to
the HIZ state
USING REFERENCES AS POWER SUPPLIES
Although the DAC has a separate reference and analog power pin, it is still possible to use a reference to drive
both. This arrangement will avoid a separate voltage regulator for VA and will provide a more stable voltage
source. The LM4140 has an initial accuracy of 0.1%, is capable of driving 8mA and comes in a 4.096V version.
Bypassing both the input and the output will improve noise performance.
Input
Voltage
LM41204.096
C3
0.022 PF
C2
0.022 PF
C1
0.1 PF
VREF VA
DAC161S055
CSB
VOUT = 0V to 4.095V
SDI
SCLK
SDO
Figure 23. Using the LM4120 as a power supply
A LOW NOISE EXAMPLE
A LM4050 powered off of a battery is a good choice for very low noise prototype circuits. The minimum value for
R must be chosen so that the LM4050 does not draw more than its 15mA rating. Note the largest current through
the LM4050 will occur when the DAC is shutdown. The maximum resistor value must allow the LM4050 to draw
more than its minimum current for regulation plus the maximum VREF current.
4.5V
Battery
(3 AA)
9V
Battery
R
VZ
0.47 PF
LM4050-4.1
VREF VA
DAC161S055
CSB
VOUT
SDI
SCLK
SDO
Figure 24. Using the LM4050 in a low noise circuit
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LAYOUT, GROUNDING AND BYPASSING
For best accuracy and minimum noise, the printed circuit board containing the DAC should have separate analog
and digital areas. These areas are defined by the locations of the analog and digital power planes. Both power
planes should be in the same board layer. There should be a single ground plane. Frequently a single ground
plane design will utilize a fencing technique to prevent the mixing of analog and digital ground currents. Separate
ground planes should only be used if the fencing technique proves inadequate. The separate ground planes
must be connected in a single place, preferably near the DAC. Special care is required to specify that digital
signals with fast edge rates do not pass over split ground planes. The fast digital signals must always have a
continuous return path below their traces.
When possible, the DAC power supply should be bypassed with a 10µF and a 0.1µF capacitor placed as close
as possible to the device with the 0.1µF closest to the supply pin. The 10µF capacitor should be a tantalum type
and the 0.1µF capacitor should be a low ESL, low ESR type. Sometime, the loading requirements of the
regulator driving the DAC do not allow such capacitance to be placed on the regulator output. In those cases,
bypass should be as large as allowed by the regulator using a low ESL, low ESR capacitance. In the LM4120
example above, the supply is bypassed with 0.022µF ceramic capacitors. The DAC should be fed with power
that is only used for analog circuits.
Avoid crossing analog and digital signals and keep the clock and data lines on the component side of the board.
The clock and data lines should have controlled impedances.
22
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PACKAGE OPTION ADDENDUM
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13-Sep-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC161S055CISQ/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
161S055
DAC161S055CISQE/NOPB
ACTIVE
WQFN
RGH
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
161S055
DAC161S055CISQX/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
161S055
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Sep-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DAC161S055CISQ/NOPB WQFN
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
RGH
16
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
DAC161S055CISQE/NOP
B
WQFN
RGH
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
DAC161S055CISQX/NOP
B
WQFN
RGH
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC161S055CISQ/NOPB
WQFN
RGH
16
1000
210.0
185.0
35.0
DAC161S055CISQE/NOP
B
WQFN
RGH
16
250
210.0
185.0
35.0
DAC161S055CISQX/NOP
B
WQFN
RGH
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RGH0016A
WQFN - 0.8 mm max height
SCALE 3.000
PLASTIC QUAD FLATPACK - NO LEAD
4.1
3.9
B
A
0.5
0.3
PIN 1 INDEX AREA
0.3
0.2
4.1
3.9
DETAIL
OPTIONAL TERMINAL
TYPICAL
DIM A
OPT 1 OPT 1
(0.1)
(0.2)
C
0.8 MAX
SEATING PLANE
0.05
0.00
0.08
2.6 0.1
5
SEE TERMINAL
DETAIL
(A) TYP
8
EXPOSED
THERMAL PAD
12X 0.5
4
9
17
4X
1.5
SYMM
1
12
16X
PIN 1 ID
(OPTIONAL)
16
SYMM
13
16X
0.3
0.2
0.1
0.05
C A B
0.5
0.3
4214978/B 01/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RGH0016A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 2.6)
SYMM
16
13
16X (0.6)
(R0.05)
TYP
1
12
16X (0.25)
SYMM
17
(3.8)
(1)
12X (0.5)
9
4
( 0.2) TYP
VIA
8
5
(1)
(3.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
SOLDER MASK
OPENING
METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214978/B 01/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RGH0016A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
4X ( 1.15)
(0.675) TYP
16
13
17
16X (0.6)
1
12
(0.675)
TYP
16X (0.25)
SYMM
(3.8)
12X (0.5)
9
4
EXPOSED METAL
TYP
8
5
(R0.05)
TYP
SYMM
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 17
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214978/B 01/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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