Texas Instruments | 14-Bit, Quad, Ultra Low Glitch, Voltage Output DAC w/2.5V, 2ppm/°C Int Ref (Rev. B) | Datasheet | Texas Instruments 14-Bit, Quad, Ultra Low Glitch, Voltage Output DAC w/2.5V, 2ppm/°C Int Ref (Rev. B) Datasheet

Texas Instruments 14-Bit, Quad, Ultra Low Glitch, Voltage Output DAC w/2.5V, 2ppm/°C Int Ref (Rev. B) Datasheet
DA
DAC8164
C8
164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
14-Bit, Quad Channel, Ultra-Low Glitch, Voltage Output
DIGITAL-TO-ANALOG CONVERTER with 2.5V, 2ppm/°C Internal Reference
Check for Samples: DAC8164
FEATURES
DESCRIPTION
• Relative Accuracy: 1LSB
• Glitch Energy: 0.15nV-s
• Internal Reference:
– 2.5V Reference Voltage (enabled by default)
– 0.004% Initial Accuracy (typ)
– 2ppm/°C Temperature Drift (typ)
– 5ppm/°C Temperature Drift (max)
– 20mA Sink/Source Capability
• Power-On Reset to Zero-Scale
• Ultra-Low Power Operation: 1mA at 5V
• Wide Power Supply Range: +2.7V to +5.5V
• 14-Bit Monotonic Over Temperature Range
• Settling Time: 10μs to ±0.006% Full-Scale
Range (FSR)
• Low-Power Serial Interface with
Schmitt-Triggered Inputs: Up to 50MHz
• On-Chip Output Buffer Amplifier with
Rail-to-Rail Operation
• 1.8V to 5.5V Logic Compatibility
• Temperature Range: –40°C to +105°C
The DAC8164 is a low-power, voltage-output,
four-channel, 14-bit digital-to-analog converter (DAC).
The device includes a 2.5V, 2ppm/°C internal
reference (enabled by default), giving a full-scale
output voltage range of 2.5V. The internal reference
has an initial accuracy of 0.004% and can source up
to 20mA at the VREFH/VREFOUT pin. The device is
monotonic, provides very good linearity, and
minimizes undesired code-to-code transient voltages
(glitch). The DAC8164 uses a versatile 3-wire serial
interface that operates at clock rates up to 50MHz.
The interface is compatible with standard SPI™,
QSPI™, Microwire™, and digital signal processor
(DSP) interfaces.
APPLICATIONS
The DAC8164 is drop-in and functionally compatible
with the DAC7564 and DAC8564, and functionally
compatible with the DAC7565, DAC8165 and
DAC8565. All these devices are available in a
TSSOP-16 package.
1
234
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•
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Portable Instrumentation
Closed-Loop Servo-Control
Process Control, PLCs
Data Acquisition Systems
Programmable Attenuation
PC Peripherals
RELATED
DEVICES
Pin and
Functionally
Compatible
Functionally
Compatible
The DAC8164 incorporates a power-on-reset circuit
that ensures the DAC output powers up at zero-scale
and remains there until a valid code is written to the
device. The device contains a power-down feature,
accessed over the serial interface, that reduces the
current consumption of the device to 1.3μA at 5V.
Power consumption is 2.6mW at 3V, reducing to
1.4μW in power-down mode. The low power
consumption, internal reference, and small footprint
make this device ideal for portable, battery-operated
equipment.
IOVDD
AVDD
VREFL
DAC8164
16-BIT
14-BIT
12-BIT
DAC8564
DAC8164
DAC7564
Data Buffer A
DAC Register A
14-Bit DAC
VOUTA
Data Buffer B
DAC Register B
14-Bit DAC
VOUTB
Data Buffer C
DAC Register C
14-Bit DAC
VOUTC
Data Buffer D
DAC Register D
14-Bit DAC
VOUTD
Buffer
Control
Register
Control
SYNC
SCLK
24-Bit Shift Register
DIN
DAC8565
DAC8165
2.5V
Reference
Control Logic
Power-Down
Control Logic
DAC7565
GND
A0
A1
LDAC
ENABLE
VREFH/VREFOUT
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
RELATIVE
ACCURACY
(LSB)
DIFFERENTIAL
NONLINEARITY
(LSB)
REFERENCE
DRIFT
(ppm/°C)
PACKAGELEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
DAC8164A
±4
±1
25
TSSOP-16
PW
–40°C to +105°C
DAC8164
DAC8164B
±2
±1
25
TSSOP-16
PW
–40°C to +105°C
DAC8164B
DAC8164C
±4
±1
5
TSSOP-16
PW
–40°C to +105°C
DAC8164
DAC8164D
±2
±1
5
TSSOP-16
PW
–40°C to +105°C
DAC8164D
(1)
PACKAGE
MARKING
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
DAC8164
UNIT
–0.3 to +6
V
Digital input voltage to GND
–0.3 to +VDD + 0.3
V
VOUT to GND
–0.3 to +VDD + 0.3
V
VREF to GND
–0.3 to +VDD + 0.3
V
Operating temperature range
–40 to +125
°C
Storage temperature range
–65 to +150
°C
+150
°C
AVDD to GND
Junction temperature range (TJ max)
Power dissipation
Thermal impedance, θJA
Thermal impedance, θJC
ESD rating
(1)
2
(TJ max – TA)/θJA
W
+118
°C/W
+29
°C/W
Human body model (HBM)
4000
V
Charged device model (CDM)
1500
V
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute
maximum conditions for extended periods may affect device reliability.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS
At AVDD = 2.7V to 5.5V and –40°C to +105°C range (unless otherwise noted).
DAC8164
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
±1
±4
LSB
STATIC PERFORMANCE (1)
Resolution
14
Relative accuracy
Measured by the line
passing through
codes 120 and 16200
Differential nonlinearity
14-bit monotonic
DAC8164A, DAC8164C
Bits
±1
±2
LSB
±0.3
±1
LSB
Offset error
±5
±8
Offset error drift
±1
DAC8164B, DAC8164D
Measured by the line passing through codes 120 and
16200.
Full-scale error
Gain error
Gain temperature coefficient
PSRR
Power-supply rejection ratio
mV
μV/°C
±0.2
±0.5
% of FSR
±0.05
±0.2
% of FSR
AVDD = 5V
±1
AVDD = 2.7V
±2
ppm of
FSR/°C
1
mV/V
Output unloaded
OUTPUT CHARACTERISTICS (2)
Output voltage range
Output voltage settling time
0
To ±0.006% FSR, 0080h to 3F40h, RL = 2kΩ,
0pF < CL < 200pF
8
RL = 2kΩ, CL = 500pF
10
V
μs
12
Slew rate
Capacitive load stability
VREF
2.2
RL = ∞
V/μs
470
pF
RL = 2kΩ
1000
Code change glitch impulse
1LSB change around major carry
0.15
nV-s
Digital feedthrough
SCLK toggling, SYNC high
0.15
nV-s
Channel-to-channel dc crosstalk
Full-scale swing on adjacent channel
0.25
LSB
Channel-to-channel ac crosstalk
1kHz full-scale sine wave, outputs unloaded
–100
dB
DC output impedance
At mid-code input
Short-circuit current
Power-up time
1
Ω
50
mA
Coming out of power-down mode, AVDD = 5V
2.5
Coming out of power-down mode, AVDD = 3V
5
μs
AC PERFORMANCE (2)
SNR
87
dB
THD
–78
dB
79
dB
SFDR
TA = +25°C, BW = 20kHz, VDD = 5V, fOUT = 1kHz.
First 19 harmonics removed for SNR calculation.
SINAD
DAC output noise density
TA = +25°C, at mid-code input, fOUT = 1kHz
DAC output noise
TA = +25°C, at mid-code input, 0.1Hz to 10Hz
77
dB
120
nV/√Hz
μVPP
6
REFERENCE
Internal reference current consumption
AVDD = 5.5V
360
μA
AVDD = 3.6V
348
μA
80
μA
External reference current
External VREF = 2.5V, if internal reference is disabled,
all four channels active
Reference input range VREFH voltage
VREFL < VREFH, AVDD – (VREFH + VREFL) /2 > 1.2V
0
AVDD
Reference input range VREFL voltage
VREFL < VREFH, AVDD – (VREFH + VREFL) /2 > 1.2V
0
AVDD/2
Reference input impedance
(1)
(2)
31
V
V
kΩ
Linearity calculated using a reduced code range of 120 to 16200; output unloaded.
Ensured by design or characterization; not production tested.
Copyright © 2008–2011, Texas Instruments Incorporated
3
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
At AVDD = 2.7V to 5.5V and –40°C to +105°C range (unless otherwise noted).
DAC8164
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
REFERENCE OUTPUT
Output voltage
TA = +25°C
2.4975
2.5
2.5025
V
Initial accuracy
TA = +25°C
–0.1
±0.004
0.1
%
DAC8164A, DAC8164B (3)
5
25
DAC8164C, DAC8164D (4)
2
5
Output voltage temperature drift
Output voltage noise
ppm/°C
μVPP
f = 0.1Hz to 10Hz
12
TA = +25°C, f = 1MHz, CL = 0μF
50
TA = +25°C, f = 1MHz, CL = 1μF
20
TA = +25°C, f = 1MHz, CL = 4μF
16
Load regulation, sourcing (5)
TA = +25°C
30
μV/mA
Load regulation, sinking (5)
TA = +25°C
15
μV/mA
Output voltage noise density
(high-frequency noise)
Output current load capability (6)
Line regulation
TA = +25°C
Long-term stability/drift (aging) (5)
TA = +25°C, time = 0 to 1900 hours
Thermal hysteresis (5)
First cycle
nV/√Hz
±20
mA
10
μV/V
50
ppm
100
Additional cycles
ppm
25
LOGIC INPUTS (6)
±1
Input current
VINL
Logic input LOW voltage
VINH
Logic input HIGH voltage
μA
2.7V ≤ IOVDD ≤ 5.5V
0.3 × IOVDD
1.8V ≤ IOVDD ≤ 2.7V
0.1 × IOVDD
2.7V ≤ IOVDD ≤ 5.5V
0.7 × IOVDD
1.8V ≤ IOVDD ≤ 2.7V
0.95 × IOVDD
V
V
Pin capacitance
3
pF
V
POWER REQUIREMENTS
AVDD
2.7
5.5
IOVDD
1.8
5.5
V
10
20
μA
AVDD = IOVDD = 3.6V to 5.5V
VINH = IOVDD and VINL = GND
1
1.6
AVDD = IOVDD = 2.7V to 3.6V
VINH = IOVDD and VINL = GND
0.95
1.5
AVDD = IOVDD = 3.6V to 5.5V
VINH = IOVDD and VINL = GND
1.3
3.5
AVDD = IOVDD = 2.7V to 3.6V
VINH = IOVDD and VINL = GND
0.5
2.5
AVDD = IOVDD = 3.6V to 5.5V
VINH = IOVDD and VINL = GND
3.6
8.8
AVDD = IOVDD = 2.7V to 3.6V
VINH = IOVDD and VINL = GND
2.6
5.4
AVDD = IOVDD = 3.6V to 5.5V
VINH = IOVDD and VINL = GND
4.7
19
AVDD = IOVDD = 2.7V to 3.6V
VINH = IOVDD and VINL = GND
1.4
9
IOIDD
(6)
Normal mode
IDD
(7)
All power-down modes
Normal mode
Power
Dissipation
(7)
All power-down modes
mA
μA
mW
μW
TEMPERATURE RANGE
Specified performance
(3)
(4)
(5)
(6)
(7)
4
–40
+105
°C
Reference is trimmed and tested at room temperature, and is characterized from –40°C to +120°C.
Reference is trimmed and tested at two temperatures (+25°C and +105°C), and is characterized from –40°C to +120°C.
Explained in more detail in the Application Information section of this data sheet.
Ensured by design or characterization; not production tested.
Input code = 8192, reference current included, no load.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
PIN CONFIGURATIONS
PW PACKAGE
TSSOP-16
(Top View)
VOUTA
1
16
LDAC
VOUTB
2
15
ENABLE
VREFH/VREFOUT
3
14
A1
AVDD
4
13
A0
DAC8164
VREFL
5
12
IOVDD
GND
6
11
DIN
VOUTC
7
10
SCLK
VOUTD
8
9
SYNC
PIN DESCRIPTIONS
PIN
NAME
1
VOUTA
Analog output voltage from DAC A
DESCRIPTION
2
VOUTB
Analog output voltage from DAC B
3
VREFH/
VREFOUT
Positive reference input / reference output 2.5V if internal reference used.
4
AVDD
Power-supply input, 2.7V to 5.5V
5
VREFL
Negative reference input
6
GND
Ground reference point for all circuitry on the part
7
VOUTC
Analog output voltage from DAC C
8
VOUTD
Analog output voltage from DAC D
9
SYNC
Level-triggered control input (active low). This input is the frame synchronization signal for the input data. When SYNC
goes low, it enables the input shift register, and data are sampled on subsequent falling clock edges. The DAC output
updates following the 24th clock. If SYNC is taken high before the 24th clock edge, the rising edge of SYNC acts as
an interrupt, and the write sequence is ignored by the DAC8164. Schmitt-Trigger logic input.
10
SCLK
Serial clock input. Data can be transferred at rates up to 50MHz. Schmitt-Trigger logic input.
11
DIN
12
IOVDD
13
A0
Address 0—sets device address; see Table 5.
14
A1
Address 1—sets device address; see Table 5.
15
ENABLE
16
LDAC
Serial data input. Data are clocked into the 24-bit input shift register on each falling edge of the serial clock input.
Schmitt-Trigger logic input.
Digital input-output power supply
The enable pin (active low) connects the SPI interface to the serial port
Load DACs; rising edge triggered, loads all DAC registers
Copyright © 2008–2011, Texas Instruments Incorporated
5
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
6
DB0
LDAC
DIN
SYNC
SCLK
ENABLE
t8
1
t11
t4
DB23
t5
t6
t3
t1
t2
t10
24
t7
t13
t12
t14
t9
t15
DB23
SERIAL WRITE OPERATION
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TIMING REQUIREMENTS (1)
(2)
At AVDD = IOVDD= 2.7V to 5.5V and –40°C to +105°C range (unless otherwise noted).
DAC8164
PARAMETER
t1
(3)
SCLK cycle time
t2
SCLK HIGH time
t3
SCLK LOW time
t4
SYNC to SCLK rising edge setup time
t5
Data setup time
t6
Data hold time
t7
SCLK falling edge to SYNC rising edge
t8
Minimum SYNC HIGH time
t9
24th SCLK falling edge to SYNC falling edge
t10
SYNC rising edge to 24th SCLK falling edge
(for successful SYNC interrupt)
t11
ENABLE falling edge to SYNC falling edge
t12
24th SCLK falling edge to ENABLE rising edge
t13
24th SCLK falling edge to LDAC rising edge
t14
LDAC rising edge to ENABLE rising edge
t15
LDAC HIGH time
(1)
(2)
(3)
TEST CONDITIONS
MIN
IOVDD = AVDD = 2.7V to 3.6V
40
IOVDD = AVDD = 3.6V to 5.5V
20
IOVDD = AVDD = 2.7V to 3.6V
20
IOVDD = AVDD = 3.6V to 5.5V
10
IOVDD = AVDD = 2.7V to 3.6V
20
IOVDD = AVDD = 3.6V to 5.5V
10
IOVDD = AVDD = 2.7V to 3.6V
0
IOVDD = AVDD = 3.6V to 5.5V
0
IOVDD = AVDD = 2.7V to 3.6V
5
IOVDD = AVDD = 3.6V to 5.5V
5
IOVDD = AVDD = 2.7V to 3.6V
4.5
IOVDD = AVDD = 3.6V to 5.5V
4.5
IOVDD = AVDD = 2.7V to 3.6V
0
IOVDD = AVDD = 3.6V to 5.5V
0
IOVDD = AVDD = 2.7V to 3.6V
40
IOVDD = AVDD = 3.6V to 5.5V
20
IOVDD = AVDD = 2.7V to 3.6V
130
IOVDD = AVDD = 3.6V to 5.5V
130
IOVDD = AVDD = 2.7V to 3.6V
15
IOVDD = AVDD = 3.6V to 5.5V
15
IOVDD = AVDD = 2.7V to 3.6V
15
IOVDD = AVDD = 3.6V to 5.5V
15
IOVDD = AVDD = 2.7V to 3.6V
10
IOVDD = AVDD = 3.6V to 5.5V
10
IOVDD = AVDD = 2.7V to 3.6V
50
IOVDD = AVDD = 3.6V to 5.5V
50
IOVDD = AVDD = 2.7V to 3.6V
10
IOVDD = AVDD = 3.6V to 5.5V
10
IOVDD = AVDD = 2.7V to 3.6V
10
IOVDD = AVDD = 3.6V to 5.5V
10
TYP
MAX
UNIT
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
All input signals are specified with tR = tF = 3ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See the Serial Write Operation timing diagram.
Maximum SCLK frequency is 50MHz at IOVDD = VDD = 3.6V to 5.5V and 25MHz at IOVDD = AVDD = 2.7V to 3.6V.
Copyright © 2008–2011, Texas Instruments Incorporated
7
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: Internal Reference
At TA = +25°C, unless otherwise noted.
INTERNAL REFERENCE VOLTAGE
vs
TEMPERATURE (Grades A and B)
2.503
2.503
2.502
2.502
2.501
2.501
VREF (V)
VREF (V)
INTERNAL REFERENCE VOLTAGE
vs
TEMPERATURE (Grades C and D)
2.500
2.499
2.500
2.499
2.498
2.498
10 Units Shown
2.497
-40
-20
0
20
40
60
80
100
13 Units Shown
2.497
-40
120
-20
0
20
Temperature (°C)
40
60
80
100
120
Temperature (°C)
Figure 1.
Figure 2.
REFERENCE OUTPUT TEMPERATURE DRIFT
(–40°C to +120°C, Grades C and D)
REFERENCE OUTPUT TEMPERATURE DRIFT
(–40°C to +120°, Grades A and B)
40
30
Typ: 5ppm/°C
Max: 25ppm/°C
Typ: 2ppm/°C
Max: 5ppm/°C
Population (%)
Population (%)
30
20
20
10
10
0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
1
5.0
3
Temperature Drift (ppm/°C)
5
7
Figure 3.
11
13
15
17
19
Figure 4.
REFERENCE OUTPUT TEMPERATURE DRIFT
(0°C to +120°C, Grades C and D)
LONG-TERM
STABILITY/DRIFT
(1)
200
40
Typ: 1.2ppm/°C
Max: 3ppm/°C
150
100
Drift (ppm)
30
Population (%)
9
Temperature Drift (ppm/°C)
20
10
50
0
-50
Average
-100
-150
-200
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
Temperature Drift (ppm/°C)
Figure 5.
(1)
8
300
600
900
1200
Time (Hours)
1500
1800
1900
20 Units Shown
0
Figure 6.
Explained in more detail in the Application Information section of this data sheet.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: Internal Reference (continued)
At TA = +25°C, unless otherwise noted.
INTERNAL REFERENCE NOISE DENSITY
vs
FREQUENCY
INTERNAL REFERENCE NOISE
0.1Hz TO 10Hz
300
250
VNOISE (5mV/div)
VN (nV/ÖHz)
12mV (peak-to-peak)
200
Reference Unbuffered
CREF = 0mF
150
100
50
CREF = 4.8mF
0
10
100
1k
10k
100k
Time (2s/div)
1M
Frequency (Hz)
Figure 7.
Figure 8.
INTERNAL REFERENCE VOLTAGE
vs
LOAD CURRENT (Grades C and D)
INTERNAL REFERENCE VOLTAGE
vs
LOAD CURRENT (Grades A and B)
2.505
2.505
2.504
2.504
2.503
2.503
2.502
+120°C
2.501
VREF (V)
VREF (V)
2.502
2.500
2.499
+25°C
2.498
2.501
+25°C
2.500
2.499
2.498
-40°C
2.497
+120°C
2.497
-40°C
2.496
2.496
2.495
-25
-20 -15 -10
0
-5
5
10
15
20
2.495
-25
25
-20 -15 -10
0
-5
ILOAD (mA)
5
10
15
20
25
ILOAD (mA)
Figure 9.
Figure 10.
INTERNAL REFERENCE VOLTAGE
vs
SUPPLY VOLTAGE (Grades C and D)
INTERNAL REFERENCE VOLTAGE
vs
SUPPLY VOLTAGE (Grades A and B)
2.503
2.503
+120°C
2.502
-40°C
+120°C
2.501
VREF (V)
VREF (V)
2.502
2.500
2.501
+25°C
2.500
+25°C
2.499
2.499
2.498
-40°C
2.498
2.5
3.0
3.5
4.0
4.5
5.0
5.5
2.5
3.0
3.5
4.0
AVDD (V)
AVDD (V)
Figure 11.
Figure 12.
Copyright © 2008–2011, Texas Instruments Incorporated
4.5
5.0
5.5
9
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
LE (LSB)
1
0
-1
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
6144
8192
10240 12288 14336 16384
0
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Figure 13.
Figure 14.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
2
1
1
0
Channel C, AVDD = 5V, External VREF = 4.99V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 5V, External VREF = 4.99V
-1
-2
0
2048
Digital Input Code
LE (LSB)
LE (LSB)
4096
2
-1
DLE (LSB)
0
-2
2048
Channel B, AVDD = 5V, External VREF = 4.99V
1
-1
0
10
2
Channel A, AVDD = 5V, External VREF = 4.99V
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 15.
Figure 16.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
LE (LSB)
0
-2
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
4096
6144
8192
10240 12288 14336 16384
0
6144
8192
10240 12288 14336 16384
Figure 17.
Figure 18.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
2
1
1
0
Channel C, AVDD = 5V, External VREF = 4.99V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 5V, External VREF = 4.99V
-1
-2
0
4096
Digital Input Code
2
-1
2048
Digital Input Code
LE (LSB)
LE (LSB)
0
-1
2048
Channel B, AVDD = 5V, External VREF = 4.99V
1
-1
0
DLE (LSB)
2
Channel A, AVDD = 5V, External VREF = 4.99V
1
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 19.
Figure 20.
Copyright © 2008–2011, Texas Instruments Incorporated
11
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
LE (LSB)
0
-2
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
6144
8192
10240 12288 14336 16384
0
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Figure 21.
Figure 22.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
2
1
1
0
Channel C, AVDD = 5V, External VREF = 4.99V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 5V, External VREF = 4.99V
-1
-2
0
2048
Digital Input Code
LE (LSB)
LE (LSB)
4096
2
-1
DLE (LSB)
0
-1
2048
Channel B, AVDD = 5V, External VREF = 4.99V
1
-1
0
12
2
Channel A, AVDD = 5V, External VREF = 4.99V
1
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 23.
Figure 24.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
OFFSET ERROR
vs TEMPERATURE
FULL-SCALE ERROR
vs TEMPERATURE
4
0.50
AVDD = 5V
Internal VREF Enabled
Full-Scale Error (mV)
3
Offset Error (mV)
AVDD = 5V
Internal VREF Enabled
Ch C
2
1
Ch D
Ch A
0
Ch B
-1
-40
-20
20
0
40
60
80
100
Ch C
0.25
Ch D
0
-0.50
-40
120
-20
0
Temperature (°C)
60
40
Figure 25.
Figure 26.
SOURCE AND SINK
CURRENT CAPABILITY
SOURCE AND SINK
CURRENT CAPABILITY
80
100
120
5.5
DAC Loaded with 3FFFh
4.5
3.5
Analog Output Voltage (V)
Analog Output Voltage (V)
20
Temperature (°C)
5.5
AVDD = 5V, Ch A
Internal Reference Disabled
2.5
1.5
0.5
DAC Loaded with 3FFFh
4.5
3.5
AVDD = 5V, Ch B
Internal Reference DIsabled
2.5
1.5
0.5
DAC Loaded with 0000h
DAC Loaded with 0000h
-0.5
-0.5
0
5
10
15
20
0
5
10
15
ISOURCE/SINK (mA)
ISOURCE/SINK (mA)
Figure 27.
Figure 28.
SOURCE AND SINK
CURRENT CAPABILITY
SOURCE AND SINK
CURRENT CAPABILITY
5.5
20
5.5
DAC Loaded with 3FFFh
4.5
3.5
Analog Output Voltage (V)
Analog Output Voltage (V)
Ch B
Ch A
-0.25
AVDD = 5V, Ch C
Internal Reference Disabled
2.5
1.5
0.5
DAC Loaded with 3FFFh
4.5
3.5
AVDD = 5V, Ch D
Internal Reference Disabled
2.5
1.5
0.5
DAC Loaded with 0000h
DAC Loaded with 0000h
-0.5
-0.5
0
5
10
15
20
0
5
10
ISOURCE/SINK (mA)
ISOURCE/SINK (mA)
Figure 29.
Figure 30.
Copyright © 2008–2011, Texas Instruments Incorporated
15
20
13
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
1400
1300
AVDD = 5.5V
Internal VREF Included
Power-Supply Current (mA)
Power-Supply Current (mA)
POWER-SUPPLY CURRENT
vs TEMPERATURE
1200
1100
1000
900
2048
4096
6144 8192 10240 12288 14336 16384
Digital Input Code
1100
1000
900
20
0
-20
Figure 32.
POWER-SUPPLY CURRENT
vs
POWER-SUPPLY VOLTAGE
POWER-DOWN CURRENT
vs POWER-SUPPLY VOLTAGE
100
120
1.2
AVDD = 2.7V to 5.5V
Internal VREF Included
1090
Power-Down Current (mA)
AVDD = 2.7V to 5.5V
Internal VREF Included
DAC Loaded with 2000h
1080
1070
1060
1.0
0.8
0.6
0.4
0.2
2.7
3.1
3.5
3.9
4.3
4.7
5.1
2.7
5.5
3.1
3.5
3.9
AVDD (V)
4.7
Figure 33.
Figure 34.
POWER-DOWN CURRENT
vs TEMPERATURE
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
3200
5.1
5.5
AVDD = IOVDD = 5.5V, Internal VREF Included
AVDD = 5.5V
Power-Supply Current (mA)
2.5
2.0
1.5
1.0
0.5
0
-40
4.3
AVDD (V)
3.0
Power-Down Current (mA)
80
Figure 31.
1050
SYNC Input (all other digital inputs = GND)
2800
2400
Sweep from
0V to 5.5V
2000
1600
Sweep from
5.5V to 0V
1200
800
-20
0
20
40
60
Temperature (°C)
Figure 35.
14
60
40
Temperature (°C)
1100
Power-Supply Current (mA)
1200
800
-40
800
0
AVDD = 5.5V
Internal VREF Included
DAC Loaded with 2000h
1300
80
100
120
0
1
2
3
4
5
6
VLOGIC (V)
Figure 36.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
-40
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
-40
Channel A, AVDD = 5V, External VREF = 4.99V
-1dB FSR Digital Input, fS = 225kSPS
Measurement Bandwidth = 20kHz
-50
-60
THD (dB)
-60
THD (dB)
Channel B, AVDD = 5V, External VREF = 4.99V
-1dB FSR Digital Input, fS = 225kSPS
Measurement Bandwidth = 20kHz
-50
-70
THD
THD
-70
-80
-80
3rd Harmonic
3rd Harmonic
-90
-90
2nd Harmonic
2nd Harmonic
-100
-100
0
-40
1
2
3
4
5
0
3
4
Figure 37.
Figure 38.
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
TOTAL HARMONIC DISTORTION
vs OUTPUT FREQUENCY
-40
5
Channel D, AVDD = 5V, External VREF = 4.99V
-1dB FSR Digital Input, fS = 225kSPS
Measurement Bandwidth = 20kHz
-50
-60
THD (dB)
-60
THD (dB)
2
fOUT (kHz)
Channel C, AVDD = 5V, External VREF = 4.99V
-1dB FSR Digital Input, fS = 225kSPS
Measurement Bandwidth = 20kHz
-50
1
fOUT (kHz)
-70
THD
-70
-80
THD
-80
3rd Harmonic
3rd Harmonic
-90
-90
2nd Harmonic
2nd Harmonic
-100
-100
0
1
2
3
4
5
0
1
2
3
fOUT (kHz)
fOUT (kHz)
Figure 39.
Figure 40.
4
5
POWER-SUPPLY CURRENT
HISTOGRAM
60
Occurrence (%)
50
AVDD = 5.5V
Internal VREF Included
40
30
20
10
0
950
1000
1050
1100
1150
1200
Power-Supply Current (mA)
Figure 41.
Copyright © 2008–2011, Texas Instruments Incorporated
15
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
SIGNAL-TO-NOISE RATIO
vs OUTPUT FREQUENCY
96
All Channels, AVDD = 5V, External VREF = 4.99V
-1dB FSR Digital Input, fS = 225kSPS
Measurement Bandwidth = 20kHz
Channel B
Channel C
92
AVDD = 5V, External VREF = 4.99V
fOUT = 1kHz, fS = 225kSPS
Measurement Bandwidth = 20kHz
-20
-40
Gain (dB)
94
SNR (dB)
POWER SPECTRAL DENSITY
0
90
Channel A
-60
-80
88
-100
Channel D
86
-120
84
-140
0
1
2
3
4
5
0
fOUT (kHz)
5
10
Frequency (Hz)
15
Figure 42.
Figure 43.
FULL-SCALE SETTLING TIME:
5V RISING EDGE
FULL-SCALE SETTLING TIME:
5V FALLING EDGE
Trigger Pulse 5V/div
AVDD = 5V
Ext VREF = 4.096V
From Code: 0000h
To Code: 3FFFh
Rising Edge
1V/div
Zoomed Rising Edge
1mV/div
20
Trigger Pulse 5V/div
AVDD = 5V
Ext VREF = 4.096V
From Code: 3FFFh
To Code: 0000h
Falling
Edge
1V/div
Time (2ms/div)
Zoomed Falling Edge
1mV/div
Time (2ms/div)
Figure 44.
Figure 45.
HALF-SCALE SETTLING TIME:
5V RISING EDGE
HALF-SCALE SETTLING TIME:
5V FALLING EDGE
Trigger Pulse 5V/div
Trigger Pulse 5V/div
AVDD = 5V
Ext VREF = 4.096V
From Code: 3000h
To Code: 1000h
Rising
Edge
1V/div
AVDD = 5V
Ext VREF = 4.096V
From Code: 1000h
To Code: 3000h
Zoomed Rising Edge
1mV/div
Time (2ms/div)
Figure 46.
16
Falling
Edge
1V/div
Zoomed Falling Edge
1mV/div
Time (2ms/div)
Figure 47.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
GLITCH ENERGY:
5V, 1LSB STEP, FALLING EDGE
VOUT (500mV/div)
AVDD = 5V
Int VREF = 2.5V
From Code: 07FFh
To Code: 0800h
Glitch: 0.09nV-s
AVDD = 5V
Int VREF = 2.5V
From Code: 0800h
To Code: 07FFh
Glitch: 0.1nV-s
Time (2ms/div)
Figure 48.
Figure 49.
GLITCH ENERGY:
5V, 16LSB STEP, RISING EDGE
GLITCH ENERGY:
5V, 16LSB STEP, FALLING EDGE
AVDD = 5V
Int VREF = 2.5V
From Code: 0800h
To Code: 0810h
Glitch: 0.3nV-s
VOUT (1mV/div)
Time (2ms/div)
AVDD = 5V
Int VREF = 2.5V
From Code: 0810h
To Code: 0800h
Glitch: 0.2nV-s
Time (5ms/div)
Figure 50.
Figure 51.
GLITCH ENERGY:
5V, 64LSB STEP, RISING EDGE
GLITCH ENERGY:
5V, 64LSB STEP, FALLING EDGE
AVDD = 5V
Int VREF = 2.5V
From Code: 2000h
To Code: 2040h
Glitch: 0.1nV-s
VOUT (2.5mV/div)
Time (5ms/div)
VOUT (2.5mV/div)
VOUT (1mV/div)
VOUT (500mV/div)
GLITCH ENERGY:
5V, 1LSB STEP, RISING EDGE
AVDD = 5V
Int VREF = 2.5V
From Code: 2040h
To Code: 2000h
Glitch: 0.1nV-s
Time (2ms/div)
Time (2ms/div)
Figure 52.
Figure 53.
Copyright © 2008–2011, Texas Instruments Incorporated
17
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 5V (continued)
At TA = +25°C, external reference used, DAC output not loaded, and all DAC codes in straight binary data format, unless
otherwise noted.
DAC OUTPUT NOISE DENSITY
vs
FREQUENCY (1)
1200
DAC OUTPUT NOISE DENSITY
vs
FREQUENCY (2)
400
Internal Reference Enabled
No Load at VREFH/VREFOUT Pin
1000
DAC = Full-Scale
Internal Reference Enabled
4.8mF versus No Load at VREFH/VREFOUT Pin
350
Noise (nV/ÖHz)
Noise (nV/ÖHz)
300
800
600
Mid-Scale
400
Full Scale
250
200
No Load on Reference
150
100
Zero Scale
200
4.8mF Capacitor
On Reference
50
0
0
10
100
1k
10k
100k
10
1M
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
Figure 54.
Figure 55.
DAC OUTPUT NOISE
0.1Hz TO 10Hz
VNOISE (2mV/div)
6mV (peak-to-peak)
DAC = Mid-Scale
Internal Reference Enabled
Time (2s/div)
Figure 56.
(1)
(2)
18
Explained in more detail in the Application Information section of this data sheet.
See the Application Information section for more information.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 3.6V
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
POWER-SUPPLY CURRENT
vs
LOGIC INPUT VOLTAGE
POWER-SUPPLY CURRENT
vs
TEMPERATURE
1400
2400
Power-Supply Current (mA)
Power-Supply Current (mA)
AVDD = IOVDD = 3.6V, Internal VREF Included
SYNC Input (all other digital inputs = GND)
2000
1600
Sweep from 0V to 3.6V
1200
1300
1200
1100
1000
Sweep from
3.6V to 0V
0.5
1.0
1.5
2.0
2.5
3.0
3.5
900
800
-40
800
0
AVDD = 3.6V
Internal VREF Included
DAC Loaded with 2000h
4.0
-20
0
20
40
60
80
100
120
Temperature (°C)
VLOGIC (V)
Figure 57.
Figure 58.
POWER-SUPPLY CURRENT
HISTOGRAM
80
AVDD = 3.6V
Internal VREF Included
Occurrence (%)
60
40
20
0
900
950
1000
1050
1100
1150
1200
Power-Supply Current (mA)
Figure 59.
Copyright © 2008–2011, Texas Instruments Incorporated
19
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
LE (LSB)
1
0
-1
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
6144
8192
10240 12288 14336 16384
0
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Figure 60.
Figure 61.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
2
1
1
0
Channel C, AVDD = 2.7V, Internal VREF = 2.5V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 2.7V, Internal VREF = 2.5V
-1
-2
0
2048
Digital Input Code
LE (LSB)
LE (LSB)
4096
2
-1
DLE (LSB)
0
-2
2048
Channel B, AVDD = 2.7V, Internal VREF = 2.5V
1
-1
0
20
2
Channel A, AVDD = 2.7V, Internal VREF = 2.5V
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 62.
Figure 63.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
LE (LSB)
0
-2
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
4096
6144
8192
10240 12288 14336 16384
0
6144
8192
10240 12288 14336 16384
Figure 64.
Figure 65.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
2
1
1
0
Channel C, AVDD = 2.7V, Internal VREF = 2.5V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 2.7V, Internal VREF = 2.5V
-1
-2
0
4096
Digital Input Code
2
-1
2048
Digital Input Code
LE (LSB)
LE (LSB)
0
-1
2048
Channel B, AVDD = 2.7V, Internal VREF = 2.5V
1
-1
0
DLE (LSB)
2
Channel A, AVDD = 2.7V, Internal VREF = 2.5V
1
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+25°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 66.
Figure 67.
Copyright © 2008–2011, Texas Instruments Incorporated
21
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
LE (LSB)
0
-2
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
6144
8192
10240 12288 14336 16384
0
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Figure 68.
Figure 69.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
2
1
1
0
Channel C, AVDD = 2.7V, Internal VREF = 2.5V
0
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
DLE (LSB)
-2
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
2048
4096
6144
8192
10240 12288 14336 16384
Channel D, AVDD = 2.7V, Internal VREF = 2.5V
-1
-2
0
2048
Digital Input Code
LE (LSB)
LE (LSB)
4096
2
-1
DLE (LSB)
0
-1
2048
Channel B, AVDD = 2.7V, Internal VREF = 2.5V
1
-1
0
22
2
Channel A, AVDD = 2.7V, Internal VREF = 2.5V
1
DLE (LSB)
DLE (LSB)
LE (LSB)
2
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (+105°C)
0
2048
4096
6144
8192
10240 12288 14336 16384
Digital Input Code
Digital Input Code
Figure 70.
Figure 71.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
OFFSET ERROR
vs TEMPERATURE
FULL-SCALE ERROR
vs TEMPERATURE
4
0.50
AVDD = 2.7V
Internal VREF Enabled
Full-Scale Error (mV)
3
Offset Error (mV)
AVDD = 2.7V
Internal VREF Enabled
Ch C
2
1
Ch D
Ch B
0
Ch A
-1
-40
-20
20
0
40
60
80
100
Ch C
0.25
Ch D
0
-0.50
-40
120
-20
0
Temperature (°C)
20
Figure 72.
Figure 73.
SOURCE AND SINK
CURRENT CAPABILITY
SOURCE AND SINK
CURRENT CAPABILITY
80
100
120
3.0
DAC Loaded with 3FFFh
DAC Loaded with 3FFFh
2.5
2.0
Analog Output Voltage (V)
Analog Output Voltage (V)
60
40
Temperature (°C)
3.0
AVDD = 2.7V, Ch A
Internal Reference Enabled
1.5
1.0
0.5
2.5
2.0
AVDD = 2.7V, Ch B
Internal Reference Enabled
1.5
1.0
0.5
DAC Loaded with 0000h
DAC Loaded with 0000h
0
0
0
5
10
15
20
0
5
ISOURCE/SINK (mA)
10
15
20
ISOURCE/SINK (mA)
Figure 74.
Figure 75.
SOURCE AND SINK
CURRENT CAPABILITY
SOURCE AND SINK
CURRENT CAPABILITY
3.0
3.0
DAC Loaded with 3FFFh
DAC Loaded with 3FFFh
2.5
2.0
Analog Output Voltage (V)
Analog Output Voltage (V)
Ch B
Ch A
-0.25
AVDD = 2.7V, Ch C
Internal Reference Enabled
1.5
1.0
0.5
2.5
2.0
AVDD = 2.7V, Ch D
Internal Reference Enabled
1.5
1.0
0.5
DAC Loaded with 0000h
DAC Loaded with 0000h
0
0
0
5
10
ISOURCE/SINK (mA)
Figure 76.
Copyright © 2008–2011, Texas Instruments Incorporated
15
20
0
5
10
15
20
ISOURCE/SINK (mA)
Figure 77.
23
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
1600
AVDD = 2.7V
Internal VREF Included
AVDD = 2.7V, Internal VREF Included
SYNC Input (all other digital inputs = GND)
Power-Supply Current (mA)
Power-Supply Current (mA)
1300
POWER-SUPPLY CURRENT
vs LOGIC INPUT VOLTAGE
1200
1100
1000
900
1400
1200
Sweep from 0V to 2.7V
Sweep from
2.7V to 0V
1000
800
800
0
2048
4096
6144 8192 10240 12288 14336 16384
Digital Input Code
0
0.5
1.0
1.5
2.0
2.5
3.0
VLOGIC (V)
Figure 78.
Figure 79.
FULL-SCALE SETTLING TIME:
2.7V RISING EDGE
FULL-SCALE SETTLING TIME:
2.7V FALLING EDGE
Trigger Pulse 2.7V/div
Trigger Pulse 2.7V/div
AVDD = 2.7V
Int VREF = 2.5V
From Code: 3FFFh
To Code: 0000h
Rising
Edge
0.5V/div
AVDD = 2.7V
Int VREF = 2.5V
From Code: 0000h
To Code: 3FFFh
Zoomed Rising Edge
1mV/div
Falling
Edge
0.5V/div
Time (2ms/div)
Zoomed Falling Edge
1mV/div
Time (2ms/div)
Figure 80.
Figure 81.
HALF-SCALE SETTLING TIME:
2.7V RISING EDGE
HALF-SCALE SETTLING TIME:
2.7V FALLING EDGE
Trigger Pulse 2.7V/div
Trigger Pulse 2.7V/div
AVDD = 2.7V
Int VREF = 2.5V
From Code: 3000h
To Code: 1000h
AVDD = 2.7V
Int VREF = 2.5V
From Code: 1000h
To Code: 3000h
Rising
Edge
0.5V/div
Zoomed Rising Edge
1mV/div
Time (2ms/div)
Figure 82.
24
Falling
Edge
0.5V/div
Zoomed Falling Edge
1mV/div
Time (2ms/div)
Figure 83.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
GLITCH ENERGY:
2.7V, 1LSB STEP, FALLING EDGE
VOUT (500mV/div)
AVDD = 2.7V
Int VREF = 2.5V
From Code: 07FFh
To Code: 0800h
Glitch: 0.02nV-s
AVDD = 2.7V
Int VREF = 2.5V
From Code: 0800h
To Code: 07FFh
Glitch: 0.02nV-s
Time (2ms/div)
Figure 84.
Figure 85.
GLITCH ENERGY:
2.7V, 16LSB STEP, RISING EDGE
GLITCH ENERGY:
2.7V, 16LSB STEP, FALLING EDGE
AVDD = 2.7V
Int VREF = 2.5V
From Code: 0800h
To Code: 0810h
Glitch: 0.01nV-s
VOUT (1mV/div)
Time (2ms/div)
VOUT (1mV/div)
AVDD = 2.7V
Int VREF = 2.5V
From Code: 0810h
To Code: 0800h
Glitch: 0.01nV-s
Time (5ms/div)
Figure 86.
Figure 87.
GLITCH ENERGY:
2.7V, 64LSB STEP, RISING EDGE
GLITCH ENERGY:
2.7V, 64LSB STEP, FALLING EDGE
VOUT (2.5mV/div)
Time (5ms/div)
AVDD = 2.7V
Int VREF = 2.5V
From Code: 2000h
To Code: 2040h
Glitch: 0.1nV-s
VOUT (2.5mV/div)
VOUT (500mV/div)
GLITCH ENERGY:
2.7V, 1LSB STEP, RISING EDGE
AVDD = 2.7V
Int VREF = 2.5V
From Code: 2040h
To Code: 2000h
Glitch: 0.1nV-s
Time (2ms/div)
Time (2ms/div)
Figure 88.
Figure 89.
Copyright © 2008–2011, Texas Instruments Incorporated
25
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7V (continued)
At TA = +25°C, internal reference used, and DAC output not loaded, all DAC codes in straight binary data format, unless
otherwise noted
POWER-SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs TEMPERATURE
1300
2.0
AVDD = 2.7V
Internal VREF Included
DAC Loaded with 2000h
AVDD = 2.7V
Power-Down Current (mA)
Power-Supply Current (mA)
1400
1200
1100
1000
900
800
-40
-20
0
20
40
60
Temperature (°C)
Figure 90.
26
80
100
120
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
Figure 91.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER (DAC)
VREF
The DAC8164 architecture consists of a string DAC
followed by an output buffer amplifier. Figure 92
shows a block diagram of the DAC architecture.
VREFH
50kW
RDIVIDER
VREF
2
50kW
R
62kW
DAC
Register
REF(+)
Resistor String
REF(-)
VOUTX
R
To Output Amplifier
(2x Gain)
VREFL
Figure 92. DAC8164 Architecture
The input coding to the DAC8164 is straight binary,
so the ideal output voltage is given by Equation 1.
DIN
VOUTX = 2 ´ VREFL + (VREFH - VREFL) ´
16384
(1)
R
where DIN = decimal equivalent of the binary code
that is loaded to the DAC register; it can range from 0
to 16383. X represents channel A, B, C, or D.
R
RESISTOR STRING
The resistor string section is shown in Figure 93. It is
simply a string of resistors, each of value R. The
code loaded into the DAC register determines at
which node on the string the voltage is tapped off to
be fed into the output amplifier by closing one of the
switches connecting the string to the amplifier. It is
monotonic because it is a string of resistors.
Figure 93. Resistor String
OUTPUT AMPLIFIER
The output buffer amplifier is capable of generating
rail-to-rail voltages on its output, giving an output
range of 0V to AVDD. It is capable of driving a load of
2kΩ in parallel with 1000pF to GND. The source and
sink capabilities of the output amplifier can be seen in
the Typical Characteristics. The slew rate is 2.2V/μs,
with a full-scale settling time of 8μs with the output
unloaded.
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DAC8164
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www.ti.com
INTERNAL REFERENCE
VREF
The DAC8164 includes a 2.5V internal reference that
is enabled by default. The internal reference is
externally available at the VREFH/VREFOUT pin. A
minimum 100nF capacitor is recommended between
the reference output and GND for noise filtering.
Reference
Disable
The internal reference of the DAC8164 is a bipolar
transistor-based,
precision
bandgap
voltage
reference. Figure 94 shows the basic bandgap
topology. Transistors Q1 and Q2 are biased such that
the current density of Q1 is greater than that of Q2.
The difference of the two base-emitter voltages
(VBE1 – VBE2) has a positive temperature coefficient
and is forced across resistor R1. This voltage is
gained up and added to the base-emitter voltage of
Q2, which has a negative temperature coefficient. The
resulting output voltage is virtually independent of
temperature. The short-circuit current is limited by
design to approximately 100mA.
Enable/Disable Internal Reference
The internal reference in the DAC8164 is enabled by
default and operates in automatic mode; however, the
reference can be disabled for debugging, evaluation
purposes, or when using an external reference. A
serial command that requires a 24-bit write sequence
(see the Serial Interface section) must be used to
disable the internal reference, as shown in Table 1.
During the time that the internal reference is disabled,
the DAC functions normally using an external
reference. At this point, the internal reference is
disconnected from the VREFH/VREFOUT pin (3-state
output). Do not attempt to drive the VREFH/VREFOUT
pin externally and internally at the same time
indefinitely.
Q1
1
N
Q2
R1
R2
Figure 94. Simplified Schematic of the Bandgap
Reference
To then enable the internal reference, either perform
a power-cycle to reset the device, or write the 24-bit
serial command shown in Table 2. These actions put
the internal reference back into the default mode. In
the default mode, the internal reference powers down
automatically when all DACs power down in any of
the power-down modes (see the Power-Down Modes
section); the internal reference powers up
automatically when any DAC is powered up.
The DAC8164 also provides the option of keeping the
internal reference powered on all the time, regardless
of the DAC(s) state (powered up or down). To keep
the internal reference powered on, regardless of the
DAC(s) state, write the 24-bit serial command shown
in Table 3.
Table 1. Write Sequence for Disabling Internal Reference
(internal reference always powered down—012000h)
DB23
0
DB16
0
0
0
0
0
0
1
DB13
0
0
1
DB0
0
0
0
0
0
0
0
0
0
0
0
X
X
|———————————————– Data Bits –——————————————|
Table 2. Write Sequence for Enabling Internal Reference
(internal reference powered up to default mode—010000h)
DB23
0
DB16
0
0
0
0
0
0
1
DB0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
X
X
|———————————————– Data Bits –——————————————|
Table 3. Write Sequence for Enabling Internal Reference
(internal reference always powered up—011000h)
DB23
0
DB16
0
0
0
0
0
0
1
DB12
0
0
0
1
DB0
0
0
0
0
0
0
0
0
0
0
X
X
|———————————————– Data Bits –——————————————|
28
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
SERIAL INTERFACE
The DAC8164 has a 3-wire serial interface (SYNC,
SCLK, and DIN) compatible with SPI, QSPI, and
Microwire interface standards, as well as most DSPs.
See the Serial Write Operation timing diagram for an
example of a typical write sequence.
The DAC8164 input shift register is 24 bits wide,
consisting of eight control bits (DB23 to DB16) and 14
data bits (DB15 to DB2). Bits DB0 and DB1 are
ignored by the DAC and should be treated as don't
care bits. All 24 bits of data are loaded into the DAC
under the control of the serial clock input, SCLK.
DB23 (MSB) is the first bit that is loaded into the DAC
shift register, and is followed by the rest of the 24-bit
word pattern, left-aligned. This configuration means
that the first 24 bits of data are latched into the shift
register and any further clocking of data is ignored.
The DAC8164 receives all 24 bits of data and
decodes the first eight bits to determine the DAC
operating/control mode. The 14 bits of data that
follow are decoded by the DAC to determine the
equivalent analog output, while the last two bits (DB1
and DB0) are ignored. The data format is straight
binary with all '0's corresponding to 0V output and all
'1's corresponding to full-scale output (that is, VREF –
1 LSB). For all documentation purposes, the data
format and representation here is a true 14-bit pattern
(that is, 3FFFh for full-scale), even if the usable 14
bits of data are extracted from a left-justified 16-bit
data format that the DAC8164 requires.
The write sequence begins by bringing the SYNC line
low. Data from the DIN line are clocked into the 24-bit
shift register on each falling edge of SCLK. The serial
clock frequency can be as high as 50MHz, making
the DAC8164 compatible with high-speed DSPs. On
the 24th falling edge of the serial clock, the last data
bit is clocked into the shift register and the shift
register locks. Further clocking does not change the
shift register data. After 24 bits are locked into the
shift register, the eight MSBs are used as control bits
and the following 14 LSBs are used as data. After
receiving the 24th falling clock edge, the DAC8164
decodes the eight control bits and 14 data bits to
perform the required function, without waiting for a
SYNC rising edge. A new write sequence starts at the
next falling edge of SYNC. A rising edge of SYNC
before the 24-bit sequence is complete resets the SPI
interface; no data transfer occurs. After the 24th
falling edge of SCLK is received, the SYNC line may
be kept LOW or brought HIGH. In either case, the
minimum delay time from the 24th falling SCLK edge
to the next falling SYNC edge must be met in order to
properly begin the next cycle. To assure the lowest
power consumption of the device, care should be
taken that the levels are as close to each rail as
possible. Refer to the Typical Characteristics section
for Figure 36, Figure 57, and Figure 79 (Supply
Current vs Logic Input Voltage).
IOVDD AND VOLTAGE TRANSLATORS
The IOVDD pin powers the the digital input structures
of the DAC8164. For single-supply operation, it can
be tied to AVDD. For dual-supply operation, the IOVDD
pin provides interface flexibility with various CMOS
logic families and should be connected to the logic
supply of the system. Analog circuits and internal
logic of the DAC8164 use AVDD as the supply
voltage. The external logic high inputs translate to
AVDD by level shifters. These level shifters use the
IOVDD voltage as a reference to shift the incoming
logic HIGH levels to AVDD. IOVDD is ensured to
operate from 2.7V to 5.5V regardless of the AVDD
voltage, assuring compatibility with various logic
families. Although specified down to 2.7V, IOVDD
operates at as low as 1.8V with degraded timing and
temperature performance. For lowest power
consumption, logic VIH levels should be as close as
possible to IOVDD, and logic VIL levels should be as
close as possible to GND voltages.
INPUT SHIFT REGISTER
The input shift register (SR) of the DAC8164 is 24
bits wide, as shown in Table 4, and consists of eight
control bits (DB23 to DB16), 14 data bits (DB15 to
DB2), and two don't care bits. The first two control
bits (DB23 and DB22) are the address match bits.
The DAC8164 offers hardware-enabled addressing
capability, allowing a single host to talk to up to four
DAC8164s through a single SPI bus without any glue
logic, enabling up to 16-channel operation. The state
of DB23 should match the state of pin A1; similarly,
the state of DB22 should match the state of pin A0. If
there is no match, the control command and the data
(DB21...DB0) are ignored by the DAC8164. That is, if
there is no match, the DAC8164 is not addressed.
Address matching can be overridden by the
broadcast update.
Table 4. Data Input Register Format
DB23
A1
DB12
A0
LD1
LD0
0
DAC Select 1
DAC Select 0
PD0
D13
D12
D11
D10
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
DB11
D9
DB0
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DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
LD1 (DB21) and LD0 (DB20) control the loading of
each analog output with the specified 14-bit data
value or power-down command. Bit DB19 must
always be '0'. The DAC channel select bits (DB18,
DB17) control the destination of the data (or
power-down command) from DAC A through DAC D.
The final control bit, PD0 (DB16), selects the
power-down mode of the DAC8164 channels as well
as the power-down mode of the internal reference.
DB21 = 0 and DB20 = 1: Single-channel update.
The data buffer and DAC register corresponding to a
DAC selected by DB18 and DB17 update with the
contents of SR data (or power-down).
The DAC8164 supports a number of different load
commands. The load commands include broadcast
commands to address all the DAC8164s on an SPI
bus. The load commands are summarized as follows:
DB21 = 1 and DB20 = 1: Broadcast update. All the
DAC8164s on the SPI bus respond, regardless of
address matching. If DB18 = 0, SR data are ignored
and any channels from all DAC8164s update with
previously stored data (or power-down). If DB18 = 1,
SR data (or power-down) update any channels of all
DAC8164s in the system. This broadcast update
feature allows the simultaneous update of up to 16
channels.
DB21 = 1 and DB20 = 0: Simultaneous update. A
channel selected by DB18 and DB17 updates with
the SR data; simultaneously, all the other channels
update with previously stored data (or power-down)
from data buffers.
DB21 = 0 and DB20 = 0: Single-channel store. The
data buffer corresponding to a DAC selected by
DB18 and DB17 updates with the contents of SR
data (or power-down).
Refer to Table 5 for more information.
Table 5. Control Matrix for the DAC8164
DB23
DB22
DB21
DB20
DB19
DB18
DB17
DB16
DB15
DB14
DB13-DB2
DB1-DB0
A1
A0
LD 1
LD 0
0
DAC Sel 1
DAC Sel 0
PD0
MSB
MSB-1
MSB-2...LSB
Don't
Care
(Address Select)
0/1
DESCRIPTION
0/1
A0 and A1 should
correspond to the
package address
set via pins 13
and 14
This address selects one of four possible
devices on a single SPI data bus based on the
address pin(s) state of each device.
See Below
0
0
0
0
0
0
Data
X
Write to buffer A with data
0
0
0
0
1
0
Data
X
Write to buffer B with data
0
0
0
1
0
0
Data
X
Write to buffer C with data
0
0
0
1
1
0
Data
X
Write to buffer D with data
0
0
0
(00, 01, 10, or 11)
1
X
Write to buffer (selected by DB17 and DB18)
with power-down command
0
1
0
(00, 01, 10, or 11)
0
X
Write to buffer with data and load DAC
(selected by DB17 and DB18)
0
1
0
(00, 01, 10, or 11)
1
X
Write to buffer with power-down command and
load DAC (selected by DB17 and DB18)
1
0
0
(00, 01, 10, or 11)
0
X
Write to buffer with data (selected by DB17 and
DB18) and then load all DACs simultaneously
from their corresponding buffers
1
0
0
(00, 01, 10, or 11)
1
X
Write to buffer with power-down command
(selected by DB17 and DB18) and then load all
DACs simultaneously from their corresponding
buffers
See Table 6
0
Data
See Table 6
0
Data
See Table 6
0
Broadcast Modes
30
X
X
1
1
0
0
X
X
X
X
Simultaneously update all channels of all
DAC8164 devices in the system with data
stored in each channels data buffer
X
X
1
1
0
1
X
0
Data
X
Write to all devices and load all DACs with SR
data
X
X
1
1
0
1
X
1
X
Write to all devices and load all DACs with
power-down command in SR
See Table 6
0
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
SYNC INTERRUPT
LDAC FUNCTIONALITY
In a normal write sequence, the SYNC line stays low
for at least 24 falling edges of SCLK and the
addressed DAC register updates on the 24th falling
edge. However, if SYNC is brought high before the
24th falling edge, it acts as an interrupt to the write
sequence; the shift register resets and the write
sequence is discarded. Neither an update of the data
buffer contents, DAC register contents, nor a change
in the operating mode occurs (as shown in
Figure 95).
The DAC8164 offers both a software and hardware
simultaneous
update
function.
The
DAC
double-buffered architecture has been designed so
that new data can be entered for each DAC without
disturbing the analog outputs.
POWER-ON RESET TO ZERO-SCALE
The DAC8164 contains a power-on reset circuit that
controls the output voltage during power-up. On
power-up, the DAC registers are filled with zeros and
the output voltages are set to zero-scale; they remain
that way until a valid write sequence and load
command are made to the respective DAC channel.
The power-on reset is useful in applications where it
is important to know the state of the output of each
DAC while the device is in the process of powering
up.
No device pin should be brought high before power is
applied to the device. The internal reference is
powered on by default and remains that way until a
valid reference-change command is executed.
DAC8164 data updates are synchronized with the
falling edge of the 24th SCLK cycle, which follows a
falling edge of SYNC. For such synchronous updates,
the LDAC pin is not required and it must be
connected to GND permanently. The LDAC pin is
used as a positive edge triggered timing signal for
asynchronous DAC updates. To do an LDAC
operation, single-channel store(s) should be done
(loading DAC buffers) by setting LD0 and LD1 to '0'.
Multiple single-channel updates can be done in order
to set different channel buffers to desired values and
then make a rising edge on LDAC. Data buffers of all
channels must be loaded with desired data before an
LDAC rising edge. After a low-to-high LDAC
transition, all DACs are simultaneously updated with
the contents of the corresponding data buffers. If the
contents of a data buffer are not changed by the
serial interface, the corresponding DAC output
remains unchanged after the LDAC trigger.
ENABLE PIN
For normal operation, the enable pin must be driven
to a logic low. If the enable pin is driven high, the
DAC8164 stops listening to the serial port. However,
SCLK, SYNC, and DIN must not be kept floating, but
must be at some logic level. This feature can be
useful for applications that share the same serial port.
24th Falling Edge
24th Falling Edge
CLK
SYNC
DIN
DB23
DB0
DB23
Invalid/Interrupted Write Sequence:
Output/Mode Does Not Update on the 24th Falling Edge
DB0
Valid Write Sequence:
Output/Mode Updates on the 24th Falling Edge
Figure 95. SYNC Interrupt Facility
Copyright © 2008–2011, Texas Instruments Incorporated
31
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
POWER-DOWN MODES
The DAC8164 has two separate sets of power-down
commands. One set is for the DAC channels and the
other set is for the internal reference. For more
information on powering down the reference, see the
Enable/Disable Internal Reference section.
DAC Power-Down Commands
The DAC8164 uses four modes of operation. These
modes are accessed by setting three bits (PD2, PD1,
and PD0) in the shift register. Table 6 shows how to
control the operating mode with data bits PD0
(DB16), PD1 (DB15), and PD2 (DB14).
Table 6. DAC Operating Modes
PD0
(DB16)
PD1
(DB15)
PD2
(DB14)
0
X
X
Normal operation
1
0
1
Output typically 1kΩ to GND
1
1
0
Output typically 100kΩ to GND
1
1
1
Output high-impedance
DACs. However, for the three power-down modes,
the supply current falls to 1.3μA at 5.5V (0.5μA at
3.6V). Not only does the supply current fall, but the
output stage also switches internally from the output
of the amplifier to a resistor network of known values.
The advantage of this switching is that the output
impedance of the device is known while it is in
power-down mode. As described in Table 6, there are
three different power-down options. VOUT can be
connected internally to GND through a 1kΩ resistor, a
100kΩ resistor, or open circuited (High-Z). The output
stage is shown in Figure 96. In other words, DB16,
DB15, and DB14 = '111' represent a power-down
condition with Hi-Z output impedance for a selected
channel. '101' represents a power-down condition
with 1kΩ output impedance, and '110' represents a
power-down condition with 100kΩ output impedance.
DAC OPERATING MODES
The DAC8164 treats the power-down condition as
data; all the operational modes are still valid for
power-down. It is possible to broadcast a power-down
condition to all the DAC8164s in a system; it is also
possible to simultaneously power-down a channel
while updating data on other channels.
When the PD0 bit is set to '0', the device works
normally with its typical current consumption of 1mA
at 5.5V with an input code = 8192. The reference
current is included with the operation of all four
32
www.ti.com
Resistor
String
DAC
Amplifier
Power-Down
Circuitry
VOUTX
Resistor
Network
Figure 96. Output Stage During Power-Down
All analog channel circuitries are shut down when the
power-down mode is exercised. However, the
contents of the DAC register are unaffected when in
power down. The time required to exit power-down is
typically 2.5μs for VDD = 5V, and 5μs for VDD = 3V.
See the Typical Characteristics for more information.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
OPERATING EXAMPLES: DAC8164
For the following examples, ensure that DAC pins A0 and A1 are both connected to ground. Pins A0 and A1
must always match data bits DB22 and DB23 within the SPI write sequence/protocol. X = don't care; value can
be either '0' or '1'.
Example 1: Write to Data Buffer A Through Buffer D; Load DAC A Through DAC D Simultaneously
• 1st: Write to data buffer A:
DB23
(A1)
0
•
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
1
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
0
D13
D12
D11
D10-D0
X
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
3rd: Write to data buffer C:
DB23
(A1)
0
•
DB21
(LD1)
0
2nd: Write to data buffer B:
DB23
(A1)
0
•
DB22
(A0)
0
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
4th: Write to data buffer D and simultaneously update all DACs:
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
1
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
1
DB16
(PD0)
0
The DAC A, DAC B, DAC C, and DAC D analog outputs simultaneously settle to the specified values upon
completion of the 4th write sequence. (The DAC voltages update simultaneously after the 24th SCLK falling edge
of the fourth write cycle).
Example 2: Load New Data to DAC A Through DAC D Sequentially
• 1st: Write to data buffer A and load DAC A: DAC A output settles to specified value upon completion:
DB23
(A1)
0
•
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
1
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
3rd: Write to data buffer C and load DAC C: DAC C output settles to specified value upon completion:
DB23
(A1)
0
•
DB21
(LD1)
0
2nd: Write to data buffer B and load DAC B: DAC B output settles to specified value upon completion:
DB23
(A1)
0
•
DB22
(A0)
0
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
4th: Write to data buffer D and load DAC D: DAC D output settles to specified value upon completion:
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
1
DB16
(PD0)
0
DB15
DB14
DB13
DB12-DB2
DB1-DB0
D13
D12
D11
D10-D0
X
After completion of each write cycle, DAC analog output settles to the voltage specified.
Copyright © 2008–2011, Texas Instruments Incorporated
33
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
Example 3: Power-Down DAC A and DAC B to 1kΩ and Power-Down DAC C and DAC D to 100kΩ
Simultaneously
• 1st: Write power-down command to data buffer A: DAC A to 1kΩ.
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
0
1
X
X
X
DB15
DB14
DB13
DB12-DB2
DB1-DB0
0
1
X
X
X
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
0
X
X
X
2nd: Write power-down command to data buffer B: DAC B to 1kΩ.
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
1
DB16
(PD0)
1
3rd: Write power-down command to data buffer C: DAC C to 100kΩ.
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
1
4th: Write power-down command to data buffer D: DAC D to 100kΩ and simultaneously update all DACs.
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
1
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
1
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
0
X
X
X
The DAC A, DAC B, DAC C, and DAC D analog outputs simultaneously power-down to each respective specified
mode upon completion of the fourth write sequence.
Example 4: Power-Down DAC A Through DAC D to High-Impedance Sequentially
• 1st: Write power-down command to data buffer A and load DAC A: DAC A output = Hi-Z:
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
1
X
X
X
2nd: Write power-down command to data buffer B and load DAC B: DAC B output = Hi-Z:
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
1
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
1
X
X
X
3rd: Write power-down command to data buffer C and load DAC C: DAC C output = Hi-Z:
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
1
X
X
X
4th: Write power-down command to data buffer D and load DAC D: DAC D output = Hi-Z:
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
1
DB16
(PD0)
1
DB15
DB14
DB13
DB12-DB2
DB1-DB0
1
1
X
X
X
The DAC A, DAC B, DAC C, and DAC D analog outputs sequentially power-down to high-impedance upon
completion of the first, second, third, and fourth write sequences, respectively.
34
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
Example 5: Power-Down All Channels Simultaneously while Reference is Always Powered Up
• 1st: Write sequence for enabling the DAC8164 internal reference all the time:
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
0
0
0
1
X
X
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
1
1
X
X
X
X
2nd: Write sequence to power-down all DACs to high-impedance:
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
1
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
1
The DAC A, DAC B, DAC C, and DAC D analog outputs sequentially power-down to high-impedance upon
completion of the first and second write sequences, respectively.
Example 6: Write a Specific Value to All DACs while Reference is Always Powered Down
• 1st: Write sequence for disabling the DAC8164 internal reference all the time (after this sequence, the
DAC8164 requires an external reference source to function):
DB23
(A1)
0
•
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
0
0
1
0
X
X
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
D13
D12
D11
D10
D9–D0
X
2nd: Write sequence to write specified data to all DACs:
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
1
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
0
The DAC A, DAC B, DAC C, and DAC D analog outputs simultaneously settle to the specified values upon
completion of the fourth write sequence. (The DAC voltages update simultaneously after the 24th SCLK falling
edge of the fourth write cycle). Reference is always powered-down.
Example 7: Write a Specific Value to DAC A, while Reference is Placed in Default Mode and All Other
DACs are Powered Down to High-Impedance
• 1st: Write sequence for placing the DAC8164 internal reference into default mode. Alternately, this step can
be replaced by performing a power-on reset (see the Power-On Reset section):
DB23
(A1)
0
•
DB21
(LD1)
0
DB20
(LD0)
0
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
0
0
0
0
X
X
2nd: Write sequence to power-down all DACs to high-impedance (after this sequence, the DAC8164 internal
reference powers down automatically):
DB23
(A1)
0
•
DB22
(A0)
0
DB22
(A0)
0
DB21
(LD1)
1
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
1
0
DB16
(PD0)
1
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
1
1
X
X
X
X
3rd: Write sequence to power-up DAC A to a specified value (after this sequence, the DAC8164 internal
reference powers up automatically):
DB23
(A1)
0
DB22
(A0)
0
DB21
(LD1)
0
DB20
(LD0)
1
DB19
0
DB18
DB17
(DAC Sel 1) (DAC Sel 0)
0
0
DB16
(PD0)
0
DB15
DB14
DB13
DB12
DB11-DB2
DB1-DB0
D13
D12
D11
D10
D9–D0
X
The DAC B, DAC C, and DAC D analog outputs simultaneously power-down to high-impedance, and DAC A
settles to the specified value upon completion.
Copyright © 2008–2011, Texas Instruments Incorporated
35
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
APPLICATION INFORMATION
INTERNAL REFERENCE
The internal reference of the DAC8164 does not
require an external load capacitor for stability
because it is stable with any capacitive load.
However, for improved noise performance, an
external load capacitor of 150nF or larger connected
to the VREFH/VREFOUT output is recommended.
Figure 97 shows the typical connections required for
operation of the DAC8164 internal reference. A
supply bypass capacitor at the AVDD input is also
recommended.
DAC8164
150nF
AVDD
1
VOUTA
LDAC 16
2
VOUTB
ENABLE 15
3
VREFH/VREFOUT
A1 14
4
AVDD
A0 13
5
VREFL
6
GND
7
VOUTC
SCLK 10
8
VOUTD
SYNC
0.1mF
IOVDD 12
DIN 11
9
Temperature Drift
The internal reference is designed to exhibit minimal
drift error, defined as the change in reference output
voltage over varying temperature. The drift is
calculated using the box method described by
Equation 2:
Drift Error =
VREF_MAX - VREF_MIN
VREF ´ TRANGE
6
´ 10 (ppm/°C)
(2)
Where:
VREF_MAX = maximum reference voltage observed
within temperature range TRANGE.
VREF_MIN = minimum reference voltage observed
within temperature range TRANGE.
VREF = 2.5V, target value for reference output
voltage.
The internal reference (grades C and D) features an
exceptional typical drift coefficient of 2ppm/°C
from –40°C to +120°C. Characterizing a large number
of units, a maximum drift coefficient of 5ppm/°C
(grades C and D) is observed. Temperature drift
results are summarized in the Typical Characteristics.
Noise Performance
Figure 97. Typical Connections for Operating the
DAC8164 Internal Reference
Supply Voltage
The internal reference features an extremely low
dropout voltage. It can be operated with a supply of
only 5mV above the reference output voltage in an
unloaded condition. For loaded conditions, refer to
the Load Regulation section. The stability of the
internal reference with variations in supply voltage
(line regulation, dc PSRR) is also exceptional. Within
the specified supply voltage range of 2.7V to 5.5V,
the variation at VREFH/VREFOUT is less than 10μV/V;
see the Typical Characteristics.
36
Typical 0.1Hz to 10Hz voltage noise can be seen in
Figure 8, Internal Reference Noise. Additional filtering
can be used to improve output noise levels, although
care should be taken to ensure the output impedance
does not degrade the ac performance. The output
noise spectrum at VREFH/VREFOUT without any
external components is depicted in Figure 7, Internal
Reference Noise Density vs Frequency. Another
noise density spectrum is also shown in Figure 7.
This spectrum was obtained using a 4.8μF load
capacitor at VREFH/VREFOUT for noise filtering.
Internal reference noise impacts the DAC output
noise; see the DAC Noise Performance section for
more details.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
Load Regulation
Thermal Hysteresis
Load regulation is defined as the change in reference
output voltage as a result of changes in load current.
The load regulation of the internal reference is
measured using force and sense contacts as shown
in Figure 98. The force and sense lines reduce the
impact of contact and trace resistance, resulting in
accurate measurement of the load regulation
contributed solely by the internal reference.
Measurement results are summarized in the Typical
Characteristics. Force and sense lines should be
used for applications that require improved load
regulation.
Thermal hysteresis for a reference is defined as the
change in output voltage after operating the device at
+25°C, cycling the device through the operating
temperature range, and returning to +25°C.
Hysteresis is expressed by Equation 3:
Output Pin
Contact and
Trace Resistance
VOUT
Force Line
IL
Sense Line
Meter
Load
Figure 98. Accurate Load Regulation of the
DAC8164 Internal Reference
Long-Term Stability
Long-term stability/aging refers to the change of the
output voltage of a reference over a period of months
or years. This effect lessens as time progresses (see
Figure 6, the typical long-term stability curve). The
typical drift value for the internal reference is 50ppm
from 0 hours to 1900 hours. This parameter is
characterized by powering-up and measuring 20 units
at regular intervals for a period of 1900 hours.
Copyright © 2008–2011, Texas Instruments Incorporated
VHYST =
|VREF_PRE - VREF_POST|
VREF_NOM
6
´ 10 (ppm/°C)
(3)
Where:
VHYST = thermal hysteresis.
VREF_PRE = output voltage measured at +25°C
pre-temperature cycling.
VREF_POST = output voltage measured after the
device cycles through the temperature range
of –40°C to +120°C, and returns to +25°C.
DAC NOISE PERFORMANCE
Typical noise performance for the DAC8164 with the
internal reference enabled is shown in Figure 54 to
Figure 56. Output noise spectral density at the VOUT
pin versus frequency is depicted in Figure 54 for
full-scale, midscale, and zero-scale input codes. The
typical noise density for midscale code is 120nV/√Hz
at 1kHz and 100nV/√Hz at 1MHz. High-frequency
noise can be improved by filtering the reference noise
as shown in Figure 55, where a 4.8μF load capacitor
is connected to the VREFH/VREFOUT pin and
compared to the no-load condition. Integrated output
noise between 0.1Hz and 10Hz is close to 6μVPP
(midscale), as shown in Figure 56.
37
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
BIPOLAR OPERATION USING THE DAC8164
The DAC8164 is designed for single-supply
operation, but a bipolar output range is also possible
using the circuit in either Figure 99 or Figure 100.
The circuit shown gives an output voltage range of
±VREF. Rail-to-rail operation at the amplifier output is
achievable using an OPA703 as the output amplifier.
The output voltage for any input code can be
calculated with Equation 4:
VO =
D
VREF ´
´
16384
R1 + R2
R1
- VREF ´
V
R2
10kW
AV
H
DD
REF
OPA703
AVDD
0.1mF
VREFL
-6V
GND
3-Wire
Serial Interface
R1
Figure 99. Bipolar Output Range Using External
Reference at 5V
where D represents the input code in decimal
(0–16383).
R2
10kW
AV
DD
With VREFH = 5V, R1 = R2 = 10kΩ.
10 ´ D
16384
±5V
VOUT
VREFH DAC8164
10mF
R2
(4)
VO =
+6V
R1
10kW
+6V
R1
10kW
- 5V
(5)
This result has an output voltage range of ±5V with
0000h corresponding to a –5V output and 3FFFh
corresponding to a +5V output, as shown in
Figure 99. Similarly, using the internal reference, a
±2.5V output voltage range can be achieved, as
Figure 100 shows.
OPA703
AVDD
±2.5V
VOUT
VREFH DAC8164
150nF
VREFL
GND
-6V
3-Wire
Serial Interface
Figure 100. Bipolar Output Range Using Internal
Reference
38
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
DAC8164 to Microwire Interface
MICROPROCESSOR INTERFACING
DAC SPI Interfacing
Care must be taken with the digital control signals
that are applied directly to the DAC, especially with
the SYNC pin. The SYNC pin must not be toggled
without having a full SCLK pulse in between. If this
condition is violated, the SPI interface locks up in an
erroneous state, causing the DAC to behave
incorrectly and have errors. The DAC can be
recovered from this faulty state by writing a valid SPI
command or using the SYNC pin correctly;
communication will then be restored. Avoid glitches
and transients on the SYNC line to ensure proper
operation.
Figure 102 shows an interface between the DAC8164
and any Microwire-compatible device. Serial data are
shifted out on the falling edge of the serial clock and
are clocked into the DAC8164 on the rising edge of
the SK signal.
Microwireä
DAC8164
CS
SYNC
SK
SCLK
SO
DIN
(1)
NOTE: (1) Additional pins omitted for clarity.
Figure 102. DAC8164 to Microwire Interface
DAC8164 to an 8051 Interface
Figure 101 shows a serial interface between the
DAC8164 and a typical 8051-type microcontroller.
The setup for the interface is as follows: TXD of the
8051 drives SCLK of the DAC8164, while RXD drives
the serial data line of the device. The SYNC signal is
derived from a bit-programmable pin on the port of
the 8051; in this case, port line P3.3 is used. When
data are to be transmitted to the DAC8164, P3.3 is
taken low. The 8051 transmits data in 8-bit bytes;
thus, only eight falling clock edges occur in the
transmit cycle. To load data to the DAC, P3.3 is left
low after the first eight bits are transmitted; then, a
second write cycle is initiated to transmit the second
byte of data. P3.3 is taken high following the
completion of the third write cycle. The 8051 outputs
the serial data in a format that has the LSB first. The
DAC8164 requires its data with the MSB as the first
bit received. The 8051 transmit routine must therefore
take this requirement into account, and mirror the
data as needed.
80C51/80L51(1)
DAC8164(1)
P3.3
SYNC
TXD
SCLK
RXD
DIN
NOTE: (1) Additional pins omitted for clarity.
Figure 101. DAC8164 to 80C51/80L51 Interface
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164 to 68HC11 Interface
Figure 103 shows a serial interface between the
DAC8164 and the 68HC11 microcontroller. SCK of
the 68HC11 drives the SCLK of the DAC8164, while
the MOSI output drives the serial data line of the
DAC. The SYNC signal derives from a port line
(PC7), similar to the 8051 diagram.
68HC11(1)
DAC8164(1)
PC7
SYNC
SCK
SCLK
MOSI
DIN
NOTE: (1) Additional pins omitted for clarity.
Figure 103. DAC8164 to 68HC11 Interface
The 68HC11 should be configured so that its CPOL
bit is '0' and its CPHA bit is '1'. This configuration
causes data appearing on the MOSI output to be
valid on the falling edge of SCK. When data are
being transmitted to the DAC, the SYNC line is held
low (PC7). Serial data from the 68HC11 are
transmitted in 8-bit bytes with only eight falling clock
edges occurring in the transmit cycle. (Data are
transmitted MSB first.) In order to load data to the
DAC8164, PC7 is left low after the first eight bits are
transferred; then, a second and third serial write
operation are performed to the DAC. PC7 is taken
high at the end of this procedure.
39
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
LAYOUT
A precision analog component requires careful layout,
adequate bypassing, and clean, well-regulated power
supplies.
The DAC8164 offers single-supply operation, and is
often used in close proximity with digital logic,
microcontrollers, microprocessors, and digital signal
processors. The more digital logic present in the
design and the higher the switching speed, the more
difficult it is to keep digital noise from appearing at
the output.
As a result of the single ground pin of the DAC8164,
all return currents (including digital and analog return
currents for the DAC) must flow through a single
point. Ideally, GND would be connected directly to an
analog ground plane. This plane would be separate
from the ground connection for the digital
components until they were connected at the
power-entry point of the system.
40
The power applied to VDD should be well-regulated
and low noise. Switching power supplies and dc/dc
converters often have high-frequency glitches or
spikes riding on the output voltage. In addition, digital
components can create similar high-frequency spikes
as their internal logic switches states. This noise can
easily couple into the DAC output voltage through
various paths between the power connections and
analog output.
As with the GND connection, VDD should be
connected to a power-supply plane or trace that is
separate from the connection for digital logic until
they are connected at the power-entry point. In
addition, a 1μF to 10μF capacitor and 0.1μF bypass
capacitor are strongly recommended. In some
situations, additional bypassing may be required,
such as a 100μF electrolytic capacitor or even a Pi
filter made up of inductors and capacitors—all
designed to essentially low-pass filter the supply and
remove the high-frequency noise.
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
PARAMETER DEFINITIONS
With the increased complexity of many different
specifications listed in product data sheets, this
section summarizes selected specifications related to
digital-to-analog converters.
STATIC PERFORMANCE
Static performance parameters are specifications
such as differential nonlinearity (DNL) or integral
nonlinearity (INL). These are dc specifications and
provide information on the accuracy of the DAC. They
are most important in applications where the signal
changes slowly and accuracy is required.
Resolution
Generally, the DAC resolution can be expressed in
different forms. Specifications such as IEC 60748-4
recognize the numerical, analog, and relative
resolution. The numerical resolution is defined as the
number of digits in the chosen numbering system
necessary to express the total number of steps of the
transfer characteristic, where a step represents both
a digital input code and the corresponding discrete
analogue output value. The most commonly-used
definition of resolution provided in data sheets is the
numerical resolution expressed in bits.
Full-Scale Error
Full-scale error is defined as the deviation of the real
full-scale output voltage from the ideal output voltage
while the DAC register is loaded with the full-scale
code. Ideally, the output should be VDD – 1 LSB. The
full-scale error is expressed in percent of full-scale
range (%FSR).
Offset Error
The offset error is defined as the difference between
actual output voltage and the ideal output voltage in
the linear region of the transfer function. This
difference is calculated by using a straight line
defined by two codes. Since the offset error is defined
by a straight line, it can have a negative or positve
value. Offset error is measured in mV.
Zero-Code Error
The zero-code error is defined as the DAC output
voltage, when all '0's are loaded into the DAC
register. Zero-scale error is a measure of the
difference between actual output voltage and ideal
output voltage (0V). It is expressed in mV. It is
primarily caused by offsets in the output amplifier.
Least Significant Bit (LSB)
Gain Error
The least significant bit (LSB) is defined as the
smallest value in a binary coded system. The value of
the LSB can be calculated by dividing the full-scale
output voltage by 2n, where n is the resolution of the
converter.
Gain error is defined as the deviation in the slope of
the real DAC transfer characteristic from the ideal
transfer function. Gain error is expressed as a
percentage of full-scale range (%FSR).
Most Significant Bit (MSB)
Full-scale error drift is defined as the change in
full-scale error with a change in temperature.
Full-scale error drift is expressed in units
of %FSR/°C.
The most significant bit (MSB) is defined as the
largest value in a binary coded system. The value of
the MSB can be calculated by dividing the full-scale
output voltage by 2. Its value is one-half of full-scale.
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or integral nonlinearity (INL) is
defined as the maximum deviation between the real
transfer function and a straight line passing through
the endpoints of the ideal DAC transfer function. DNL
is measured in LSBs.
Differential Nonlinearity (DNL)
Differential nonlinearity (DNL) is defined as the
maximum deviation of the real LSB step from the
ideal 1LSB step. Ideally, any two adjacent digital
codes correspond to output analog voltages that are
exactly one LSB apart. If the DNL is less than 1LSB,
the DAC is said to be monotonic.
Copyright © 2008–2011, Texas Instruments Incorporated
Full-Scale Error Drift
Offset Error Drift
Offset error drift is defined as the change in offset
error with a change in temperature. Offset error drift
is expressed in μV/°C.
Zero-Code Error Drift
Zero-code error drift is defined as the change in
zero-code error with a change in temperature.
Zero-code error drift is expressed in μV/°C.
Gain Temperature Coefficient
The gain temperature coefficient is defined as the
change in gain error with changes in temperature.
The gain temperature coefficient is expressed in ppm
of FSR/°C.
41
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
Power-Supply Rejection Ratio (PSRR)
Channel-to-Channel DC Crosstalk
Power-supply rejection ratio (PSRR) is defined as the
ratio of change in output voltage to a change in
supply voltage for a full-scale output of the DAC. The
PSRR of a device indicates how the output of the
DAC is affected by changes in the supply voltage.
PSRR is measured in decibels (dB).
Channel-to-channel dc crosstalk is defined as the dc
change in the output level of one DAC channel in
response to a change in the output of another DAC
channel. It is measured with a full-scale output
change on one DAC channel while monitoring
another DAC channel remains at midscale; it is
expressed in LSB.
Monotonicity
Monotonicity is defined as a slope whose sign does
not change. If a DAC is monotonic, the output
changes in the same direction or remains at least
constant for each step increase (or decrease) in the
input code.
DYNAMIC PERFORMANCE
Dynamic performance parameters are specifications
such as settling time or slew rate, which are important
in applications where the signal rapidly changes
and/or high frequency signals are present.
Slew Rate
The output slew rate (SR) of an amplifier or other
electronic circuit is defined as the maximum rate of
change of the output voltage for all possible input
signals.
SR = max
Channel-to-Channel AC Crosstalk
AC crosstalk in a multi-channel DAC is defined as the
amount of ac interference experienced on the output
of a channel at a frequency (f) (and its harmonics),
when the output of an adjacent channel changes its
value at the rate of frequency (f). It is measured with
one channel output oscillating with a sine wave
frequency of 1kHz, while monitoring the amplitude of
1kHz harmonics on an adjacent DAC channel output
(kept at zero scale); it is expressed in dB.
Signal-to-Noise Ratio (SNR)
Signal-to-noise ratio (SNR) is defined as the ratio of
the root mean-squared (RMS) value of the output
signal divided by the RMS values of the sum of all
other spectral components below one-half the output
frequency, not including harmonics or dc. SNR is
measured in dB.
DVOUT(t)
Dt
Where ΔVOUT(t) is the output produced by the
amplifier as a function of time t.
Output Voltage Settling Time
Settling time is the total time (including slew time) for
the DAC output to settle within an error band around
its final value after a change in input. Settling times
are specified to within ±0.003% (or whatever value is
specified) of full-scale range (FSR).
Total Harmonic Distortion (THD)
Total harmonic distortion + noise is defined as the
ratio of the RMS values of the harmonics and noise
to the value of the fundamental frequency. It is
expressed in a percentage of the fundamental
frequency amplitude at sampling rate fS.
Spurious-Free Dynamic Range (SFDR)
Digital-to-analog glitch impulse is the impulse injected
into the analog output when the input code in the
DAC register changes state. It is normally specified
as the area of the glitch in nanovolts-second (nV-s),
and is measured when the digital input code changes
by 1LSB at the major carry transition.
Spurious-free dynamic range (SFDR) is the usable
dynamic range of a DAC before spurious noise
interferes or distorts the fundamental signal. SFDR is
the measure of the difference in amplitude between
the fundamental and the largest harmonically or
non-harmonically related spur from dc to the full
Nyquist bandwidth (half the DAC sampling rate, or
fS/2). A spur is any frequency bin on a spectrum
analyzer, or from a Fourier transform, of the analog
output of the DAC. SFDR is specified in decibels
relative to the carrier (dBc).
Digital Feedthrough
Signal-to-Noise plus Distortion (SINAD)
Digital feedthrough is defined as impulse seen at the
output of the DAC from the digital inputs of the DAC.
It is measured when the DAC output is not updated. It
is specified in nV-s, and measured with a full-scale
code change on the data bus; that is, from all '0's to
all '1's and vice versa.
SINAD includes all the harmonic and outstanding
spurious components in the definition of output noise
power in addition to quantizing any internal random
noise power. SINAD is expressed in dB at a specified
input frequency and sampling rate, fS.
Code Change/Digital-to-Analog Glitch Energy
42
Copyright © 2008–2011, Texas Instruments Incorporated
DAC8164
www.ti.com
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
DAC Output Noise Density
Full-Scale Range (FSR)
Output
noise
density
is
defined
as
internally-generated random noise. Random noise is
characterized as a spectral density (nV/√Hz). It is
measured by loading the DAC to midscale and
measuring noise at the output.
Full-scale range (FSR) is the difference between the
maximum and minimum analog output values that the
DAC is specified to provide; typically, the maximum
and minimum values are also specified. For an n-bit
DAC, these values are usually given as the values
matching with code 0 and 2n.
DAC Output Noise
DAC output noise is defined as any voltage deviation
of DAC output from the desired value (within a
particular frequency band). It is measured with a DAC
channel kept at midscale while filtering the output
voltage within a band of 0.1Hz to 10Hz and
measuring its amplitude peaks. It is expressed in
terms of peak-to-peak voltage (Vpp).
Copyright © 2008–2011, Texas Instruments Incorporated
43
DAC8164
SBAS410B – FEBRUARY 2008 – REVISED MAY 2011
www.ti.com
REVISION HISTORY
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (February 2008) to Revision B
Page
•
Changed Output Voltage parameter min/max values from 2.4995 and 2.5005 to 2.4975 and 2.5025, respectively ........... 4
•
Changed Initial Accuracy parameter min/max values from –0.02 and 0.02 to –0.1 and 0.1, respectively ........................... 4
•
Changed values for SCLK High TIme parameter from 20 and 10 to 10 and 20. ................................................................. 7
•
Added DAC SPI Interfacing subsection to Microprocessor Interfacing section .................................................................. 39
44
Copyright © 2008–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC8164IAPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
DAC
8164
DAC8164IBPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
DAC
8164
B
DAC8164ICPW
LIFEBUY
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
0 to 0
DAC
8164
DAC8164IDPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 105
DAC
8164
D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
18-Feb-2019
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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