Texas Instruments | Low-Power, 16-Bit, 1-MHz, Single/Dual Unipolar Input, ADCs w/ Serial Interface (Rev. C) | Datasheet | Texas Instruments Low-Power, 16-Bit, 1-MHz, Single/Dual Unipolar Input, ADCs w/ Serial Interface (Rev. C) Datasheet

Texas Instruments Low-Power, 16-Bit, 1-MHz, Single/Dual Unipolar Input, ADCs w/ Serial Interface (Rev. C) Datasheet
ADS8329
ADS8330
www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
LOW-POWER, 16-BIT, 1-MHz, SINGLE/DUAL UNIPOLAR INPUT,
ANALOG-TO-DIGITAL CONVERTERS WITH SERIAL INTERFACE
FEATURES
APPLICATIONS
• 2.7-V to 5.5-V Analog Supply, Low Power:
– 15.5 mW (1 MHz, +VA = 3 V, +VBD = 1.8 V)
• 1-MHz Sampling Rate 3 V ≤ +VA ≤ 5.5 V,
900-kHz Sampling Rate 2.7 V ≤ +VA ≤ 3 V
• Excellent DC Performance:
±1.0 LSB Typ, ±1.75 LSB Max INL
±0.5 LSB Typ, ±1 LSB Max DNL
16-Bit NMC Over Temperature
±0.5 mV Max Offset Error at 3 V
±1 mV Max Offset Error at 5 V
• Excellent AC Performance at fI = 10 kHz with
93 dB SNR, 105 dB SFDR, –102 dB THD
• Built-In Conversion Clock (CCLK)
• 1.65 V to 5.5 V I/O Supply:
SPI/DSP Compatible Serial
SCLK up to 50 MHz
• Comprehensive Power-Down Modes:
Deep Power-Down
Nap Power-Down
Auto Nap Power-Down
• Unipolar Input Range: 0 V to VREF
• Software Reset
• Global CONVST (Independent of CS)
• Programmable Status/Polarity EOC/INT
• 16-Pin 4 × 4 QFN and 16-Pin TSSOP Packages
• Multi-Chip Daisy Chain Mode
• Programmable TAG Bit Output
• Auto/Manual Channel Select Mode (ADS8330)
•
•
•
•
•
•
•
1
2
Communications
Transducer Interface
Medical Instruments
Magnetometers
Industrial Process Control
Data Acquisition Systems
Automatic Test Equipment
DESCRIPTION
The ADS8329 is a low-power, 16-bit, 1-MSPS
analog-to-digital converter (ADC) with a unipolar
input. The device includes a 16-bit capacitor-based
SAR ADC with inherent sample-and-hold.
The ADS8330 is based on the same core and
includes a 2-to-1 input MUX with programmable
option of TAG bit output. Both the ADS8329 and
ADS8330 offer a high-speed, wide voltage serial
interface and are capable of chain mode operation
when multiple converters are used.
These converters are available in 4 × 4 QFN and
16-pin TSSOP packages, and are fully specified for
operation over the industrial –40°C to +85°C
temperature range.
Low Power, High-Speed SAR Converter Family
Type/Speed
16-bit single-ended
14-bit single-ended
12-bit single ended
ADS8330
ADS8329
+IN1
NC
+IN0
COM
+IN
−IN
REF+
REF−
1 MSPS
ADS8327
ADS8329
Dual
ADS8328
ADS8330
Single
—
ADS7279
Dual
—
ADS7280
Single
—
ADS7229
Dual
—
ADS7230
OUTPUT
LATCH
and
3−STATE
DRIVER
SAR
+
_
500 kSPS
Single
SDO
CDAC
COMPARATOR
OSC
CONVERSION
and
CONTROL
LOGIC
FS/CS
SCLK
SDI
CONVST
EOC/INT/CDI
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2009, Texas Instruments Incorporated
ADS8329
ADS8330
SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
MAXIMUM
INTEGRAL
LINEARITY
(LSB)
MODEL
ADS8329I
±2.5
MAXIMUM
DIFFERENTIAL
LINEARITY
(LSB)
MAXIMUM
OFFSET
ERROR
(mV)
–1/+2
PACKAGE
TYPE
PACKAGE
DESIGNATOR
4 × 4 QFN-16
RSA
±0.8
4 × 4 QFN-16
±1.75
±1
–1/+2
±1
Tube, 90
ADS8329IPWR
Tape and reel, 2000
ADS8329IBRSAT
Small tape and reel, 250
ADS8329IBRSAR
Tape and reel, 3000
ADS8329IBPW
Tube, 90
ADS8329IBPWR
Tape and reel, 2000
ADS8330IRSAT
Small tape and reel, 250
ADS8330IRSAR
Tape and reel, 3000
PW
RSA
ADS8330IPW
Tube, 90
ADS8330IPWR
Tape and reel, 2000
ADS8330IBRSAT
Small tape and reel, 250
ADS8330IBRSAR
Tape and reel, 3000
PW
RSA
±0.5
–40°C to +85°C
TSSOP-16
(1)
Tape and reel, 3000
ADS8329IPW
–40°C to +85°C
4 × 4 QFN-16
±1.75
Small tape and reel, 250
RSA
±0.8
TSSOP-16
ADS8330IB
ADS8329IRSAT
ADS8329IRSAR
–40°C to +85°C
4 × 4 QFN-16
±2.5
TRANSPORT
MEDIA,
QUANTITY
PW
±0.5
TSSOP-16
ADS8330I
ORDERING
INFORMATION
–40°C to +85°C
TSSOP-16
ADS8329IB
TEMPERATURE
RANGE
ADS8330IBPW
Tube, 90
ADS8330IBPWR
Tape and reel, 2000
PW
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range, unless otherwise noted. (1)
UNIT
Voltage
Voltage range
+IN to AGND
–0.3 V to +VA + 0.3 V
–IN to AGND
–0.3 V to +VA + 0.3 V
+VA to AGND
–0.3 V to 7 V
+REF to AGND
–0.3 V to +VA + 0.3 V
–REF to AGND
–0.3 V to 0.3 V
+VBD to BDGND
–0.3 V to 7 V
AGND to BDGND
–0.3 V to 0.3 V
Digital input voltage to BDGND
–0.3 V to +VBD + 0.3 V
Digital output voltage to BDGND
–0.3 V to +VBD + 0.3 V
TA
Operating free-air temperature range
–40°C to +85°C
Tstg
Storage temperature range
–65°C to +150°C
Junction temperature (TJ max)
(1)
2
4 × 4 QFN-16
package
Power dissipation
TSSOP-16
package
Power dissipation
+150°C
(TJMax – TA)/θJA
θJA thermal impedance
+47°C/W
(TJMax – TA)/θJA
θJA thermal impedance
+86°C/W
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
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Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
ADS8329
ADS8330
www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C, +VA = 4.5 V to 5.5 V, +VBD = 1.65 V to 5.5 V, VREF = 5 V, and fSAMPLE = 1 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
ANALOG INPUT
Full-scale input voltage (1)
Absolute input voltage
+IN – (–IN) or (+INx – COM)
0
+VREF
+IN, +IN0, +IN1
AGND – 0.2
+VA + 0.2
–IN or COM
AGND – 0.2
AGND + 0.2
Input capacitance
Input leakage current
Input channel isolation, ADS8330 only
40
No ongoing conversion,
dc input
–1
At dc
109
VI = ±1.25 VPP at 50 kHz
101
V
45
pF
1
nA
dB
SYSTEM PERFORMANCE
Resolution
16
No missing codes
Bits
16
Bits
INL
Integral
linearity
ADS8329IB, ADS8330IB
DNL
Differential
linearity
ADS8329IB, ADS8330IB
–1
±0.4
1
ADS8329I, ADS8330I
–1
±0.5
2
EO
Offset error (3)
–1
±0.27
1
–1.25
±0.8
1.25
ADS8329I, ADS8330I
ADS8329IB, ADS8330IB
ADS8329I, ADS8330I
Offset error drift
EG
–1.75
±1.2
1.75
–2.5
±1.5
2.5
FSR = 5 V
Gain error
+0.4
–0.25
Gain error drift
CMRR
Common-mode rejection ratio
At dc
70
VI = 0.4 VPP at 1 MHz
50
Power-supply rejection ratio
At FFFFh output code (3)
LSB (2)
mV
ppm/°C
0.25
+0.75
Noise
PSRR
–0.04
LSB (2)
%FSR
ppm/°C
dB
33
µV RMS
78
dB
18
CCLK
SAMPLING DYNAMICS
tCONV
tSAMPLE1
tSAMPLE2
Conversion time
Acquisition time
Manual trigger
Auto trigger
3
Throughput rate
(1)
(2)
(3)
CCLK
3
1
MHz
Aperture delay
5
ns
Aperture jitter
10
ps
Step response
100
ns
Overvoltage recovery
100
ns
Ideal input span; does not include gain or offset error.
LSB means least significant bit.
Measured relative to an ideal full-scale input [+IN – (–IN)] of 4.096 V when +VA = 5 V.
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
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3
ADS8329
ADS8330
SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to 85°C, +VA = 4.5 V to 5.5 V, +VBD = 1.65 V to 5.5 V, VREF = 5 V, and fSAMPLE = 1 MHz, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC CHARACTERISTICS
THD
Total harmonic distortion (4)
SNR
Signal-to-noise ratio
VIN = 5 VPP at 10 kHz
–102
VIN = 5 VPP at 100 kHz
–95
VIN = 5 VPP at 10 kHz
SINAD
Signal-to-noise + distortion
SFDR
Spurious-free dynamic range
VIN = 5 VPP at 100 kHz
dB
93
ADS8329/30IB
90
ADS8329/30I
92
dB
90
VIN = 5 VPP at 10 kHz
92
VIN = 5 VPP at 100 kHz
90
VIN = 5 VPP at 10 kHz
105
VIN = 5 VPP at 100 kHz
97
–3dB small-signal bandwidth
dB
dB
30
MHz
CLOCK
Internal conversion clock frequency
SCLK external serial clock
21
22.9
Used as I/O clock only
24.5
50
As I/O clock and conversion clock
1
42
0.3
+VA
–0.1
0.1
MHz
MHz
EXTERNAL VOLTAGE REFERENCE INPUT
VREF
Input
reference
range
VREF[(REF+) – (REF–)]
5.5 V ≥ +VA ≥ 4.5 V
(REF–) – AGND
Resistance (5)
Reference input
40
V
kΩ
DIGITAL INPUT/OUTPUT
Logic family—CMOS
VIH
High-level input voltage
5.5 V ≥ +VBD ≥ 4.5 V
0.65 × (+VBD)
+VBD + 0.3
V
0.35 ×
(+VBD)
V
50
nA
VIL
Low-level input voltage
5.5 V ≥ +VBD ≥ 4.5 V
–0.3
II
Input current
VI = +VBD or BDGND
–50
CI
Input capacitance
5
VOH
High-level output voltage
5.5 V ≥ +VBD ≥ 4.5 V,
IO = 100 µA
VOL
Low-level output voltage
5.5 V ≥ +VBD ≥ 4.5 V,
IO = 100 µA
CO
Output capacitance
CL
Load capacitance
pF
+VBD – 0.6
+VBD
V
0
0.4
V
5
pF
30
pF
Data format—straight binary
POWER-SUPPLY REQUIREMENTS
Power-supply
voltage
+VBD
1.65
3.3
5.5
V
4.5
5
5.5
V
1-MHz Sample rate
7.0
7.8
NAP/Auto-NAP mode
0.3
0.5
4
50
+VA
Supply current
Deep power-down mode
Buffer I/O supply current
Power dissipation
1 MSPS
1.7
+VA = 5 V, +VBD = 5 V
44
48
+VA = 5 V, +VBD = 1.8 V
35
39.5
mA
nA
mA
mW
TEMPERATURE RANGE
TA
(4)
(5)
4
Operating free-air temperature
–40
+85
°C
Calculated on the first nine harmonics of the input frequency.
Can vary ±30%.
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Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
ADS8329
ADS8330
www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
ELECTRICAL CHARACTERISTICS
TA = –40°C to 85°C, +VA = 2.7 V to 3.6 V, +VBD = 1.65 V to 1.5×(+VA), VREF = 2.5 V, fSAMPLE = 1 MHz for 3 V ≤ +VA ≤ 3.6 V,
fSAMPLE = 900 kHz for 3 V < +VA ≤ 2.7 V using external clock (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
ANALOG INPUT
Full-scale input voltage (1)
+IN – (–IN) or (+INx – COM)
Absolute input voltage
0
+VREF
+IN, +IN0, +IN1
AGND – 0.2
+VA + 0.2
–IN or COM
AGND – 0.2
AGND + 0.2
Input capacitance
40
No ongoing conversion,
DC Input
Input leakage current
Input channel isolation, ADS8330 only
–1
At dc
108
VI = ±1.25 VPP at 50 kHz
101
V
45
pF
1
nA
dB
SYSTEM PERFORMANCE
Resolution
16
No missing codes
INL
Integral linearity
ADS8329IB,
ADS8330IB
Differential
linearity
Offset error (3)
EO
±1
1.75
–2.5
±1.5
2.5
ADS8329IB,
ADS8330IB
–1
±0.5
1
ADS8329I, ADS8330I
–1
±0.8
2
ADS8329IB,
ADS8330IB
–0.5
±0.05
0.5
ADS8329I, ADS8330I
–0.8
±0.2
0.8
–0.25
–0.04
Offset error drift
EG
FSR = 2.5 V
+0.8
Gain error
Gain error drift
CMRR
Common-mode rejection ratio
At dc
70
VI = 0.4 VPP at 1 MHz
50
Power-supply rejection ratio
At FFFFh output code
(3)
LSB (2)
LSB (2)
mV
ppm/°C
0.25
+0.5
Noise
PSRR
Bits
–1.75
ADS8329I, ADS8330I
DNL
Bits
16
%FSR
ppm/°C
dB
33
µV RMS
78
dB
18
CCLK
SAMPLING DYNAMICS
tCONV
tSAMPLE1
tSAMPLE2
Conversion time
Manual trigger
Acquisition time
Auto trigger
3
Throughput rate
(1)
(2)
(3)
CCLK
3
1
MHz
Aperture delay
5
ns
Aperture jitter
10
ps
Step response
100
ns
Overvoltage recovery
100
ns
Ideal input span, does not include gain or offset error.
LSB means least significant bit.
Measured relative to an ideal full-scale input [+IN – (–IN)] of 2.5 V when +VA = 3 V.
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
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5
ADS8329
ADS8330
SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to 85°C, +VA = 2.7 V to 3.6 V, +VBD = 1.65 V to 1.5×(+VA), VREF = 2.5 V, fSAMPLE = 1 MHz for 3 V ≤ +VA ≤ 3.6 V,
fSAMPLE = 900 kHz for 3 V < +VA ≤ 2.7 V using external clock (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DYNAMIC CHARACTERISTICS
THD
Total harmonic distortion (4)
SNR
Signal-to-noise ratio
SINAD
Signal-to-noise + distortion
SFDR
Spurious-free dynamic range
VIN = 2.5 VPP at 10 kHz
–102
VIN = 2.5 VPP at 100 kHz
–93
VIN = 2.5 VPP at 10 kHz
89
VIN = 2.5 VPP at 100 kHz
88
VIN = 2.5 VPP at 10 kHz
dB
dB
88.5
VIN = 2.5 VPP at 100 kHz
dB
88
VIN = 2.5 VPP at 10 kHz
104
VIN = 2.5 VPP at 100 kHz
94.2
–3dB small-signal bandwidth
dB
30
MHz
CLOCK
Internal conversion clock frequency
SCLK external serial clock
21
22.3
Used as I/O clock only
23.5
42
As I/O clock and conversion clock
1
42
fSAMPLE ≤ 500kSPS,
2.7 V ≤ +VA < 3V
0.3
2.525
fSAMPLE ≤ 500kSPS,
3 V ≤ +VA < 3.6V
0.3
3
fSAMPLE > 500kSPS,
2.7 V ≤ +VA < 3V
2.475
2.525
fSAMPLE > 500kSPS,
3 V ≤ +VA ≤ 3.6V
2.475
3
MHz
MHz
EXTERNAL VOLTAGE REFERENCE INPUT
VREF
Input reference
range
VREF[(REF+) –
(REF–)]
(REF–) – AGND
Resistance (5)
–0.1
Reference input
V
0.1
40
kΩ
DIGITAL INPUT/OUTPUT
Logic family—CMOS
VIH
High-level input voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V
0.65 × (+VBD)
+VBD + 0.3
VIL
Low-level input voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V
–0.3
0.35 × (+VBD)
V
II
Input current
VI = +VBD or BDGND
–50
50
nA
CI
Input capacitance
5
VOH
High-level output voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V,
IO = 100 µA
VOL
Low-level output voltage
(+VA × 1.5) V ≥ +VBD ≥ 1.65 V,
IO = 100 µA
CO
Output capacitance
CL
Load capacitance
V
pF
+VBD – 0.6
+VBD
V
0
0.4
V
5
pF
30
pF
Data format—straight binary
(4)
(5)
6
Calculated on the first nine harmonics of the input frequency.
Can vary ±30%.
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Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
ADS8329
ADS8330
www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
ELECTRICAL CHARACTERISTICS (continued)
TA = –40°C to 85°C, +VA = 2.7 V to 3.6 V, +VBD = 1.65 V to 1.5×(+VA), VREF = 2.5 V, fSAMPLE = 1 MHz for 3 V ≤ +VA ≤ 3.6 V,
fSAMPLE = 900 kHz for 3 V < +VA ≤ 2.7 V using external clock (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.65
+VA
1.5 × (+VA)
UNIT
POWER-SUPPLY REQUIREMENTS
+VBD
Power-supply
voltage
fs ≤ 1 MHz
+VA
fs ≤ 900 kHz
3
3.6
2.7
3.6
1-MHz sample rate,
3 V ≤ +VA ≤ 3.6 V
Supply current
5.1
Buffer I/O supply current
4.84
NAP/Auto-NAP mode
0.25
0.4
2
50
Power dissipation
1 MSPS, +VBD = 1.8 V
0.05
+VBD = 1.8 V, 3 V ≤ +VA ≤ 3.6 V
15.5
+VBD = 1.8 V, 2.7 V ≤ +VA ≤ 3 V
13.2
V
6.1
900-kHz sample rate,
2.7 V ≤ +VA ≤ 3 V
Deep power-down mode
V
mA
nA
mA
19
mW
TEMPERATURE RANGE
TA
Operating free-air temperature
–40
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
+85
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°C
7
ADS8329
ADS8330
SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C and +VA = +VBD = 5 V.
(1) (2)
PARAMETER
fCCLK
Frequency, conversion clock, CCLK
MIN
External,
fCCLK = 1/2 fSCLK
0.5
Internal,
fCCLK = 1/2 fSCLK
21
TYP
MAX
UNIT
21
MHz
22.9
24.5
tsu(CSF-EOC)
Setup time, falling edge of CS to EOC
th(CSF-EOC)
Hold time, falling edge of CS to EOC
twL(CONVST)
Pulse duration, CONVST low
tsu(CSF-EOS)
Setup time, falling edge of CS to EOS
20
ns
th(CSF-EOS)
Hold time, falling edge of CS to EOS
20
ns
tsu(CSR-EOS)
Setup time, rising edge of CS to EOS
20
ns
th(CSR-EOS)
Hold time, rising edge of CS to EOS
20
ns
tsu(CSF-SCLK1F)
Setup time, falling edge of CS to first falling
SCLK
5
ns
twL(SCLK)
Pulse duration, SCLK low
8
tc(SCLK) – 8
ns
twH(SCLK)
Pulse duration, SCLK high
8
tc(SCLK) – 8
ns
I/O Clock only
Cycle time, SCLK
CCLK
0
ns
40
ns
20
I/O and conversion clock
tc(SCLK)
1
I/O Clock, chain mode
I/O and conversion clock,
chain mode
23.8
2000
ns
20
23.8
2000
td(SCLKF-SDOINVALID)
Delay time, falling edge of SCLK to SDO
invalid
10-pF Load
td(SCLKF-SDOVALID)
Delay time, falling edge of SCLK to SDO
valid
10-pF Load
10
ns
td(CSF-SDOVALID)
Delay time, falling edge of CS to SDO
valid, SDO MSB output
10-pF Load
8.5
ns
tsu(SDI-SCLKF)
Setup time, SDI to falling edge of SCLK
8
ns
th(SDI-SCLKF)
Hold time, SDI to falling edge of SCLK
4
ns
td(CSR-SDOZ)
Delay time, rising edge of CS/FS to SDO
3-state
tsu(16th SCLKF-CSR)
Setup time, 16th falling edge of SCLK
before rising edge of CS/FS
td(SDO-CDI)
Delay time, CDI high to SDO high in daisy
chain mode
(1)
(2)
8
2
ns
5
10
10-pF Load, chain mode
ns
ns
16
ns
All input signals are specified with tr = tf = 1.5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See timing diagrams.
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Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
ADS8329
ADS8330
www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
TIMING CHARACTERISTICS
All specifications typical at –40°C to 85°C, +VA = 2.7 V, +VBD = 1.8 V (unless otherwise noted)
PARAMETER
fCCLK
Frequency, conversion clock, CCLK
(1) (2)
MIN
TYP
MAX
External, 3 V ≤ +VA ≤ 3.6 V,
fCCLK = 1/2 fSCLK
0.5
21
External, 2.7 V ≤ +VA ≤ 3 V,
fCCLK = 1/2 fSCLK
0.5
18.9
Internal,
fCCLK = 1/2 fSCLK
20
22.3
UNIT
MHz
23.5
tsu(CSF-EOC)
Setup time, falling edge of CS to EOC
1
CCLK
th(CSF-EOC)
Hold time, falling edge of CS to EOC
0
ns
twL(CONVST)
Pulse duration, CONVST low
40
ns
tsu(CSF-EOS)
Setup time, falling edge of CS to EOS
20
ns
th(CSF-EOS)
Hold time, falling edge of CS to EOS
20
ns
tsu(CSR-EOS)
Setup time, rising edge of CS to EOS
20
ns
th(CSR-EOS)
Hold time, rising edge of CS to EOS
20
ns
tsu(CSF-SCLK1F)
Setup time, falling edge of CS to first
falling SCLK
5
ns
twL(SCLK)
Pulse duration, SCLK low
8
tc(SCLK) – 8
ns
twH(SCLK)
Pulse duration, SCLK high
ns
tc(SCLK)
Cycle time, SCLK
8
tc(SCLK) – 8
All modes,
3 V ≤ +VA ≤ 3.6 V
23.8
2000
All modes,
2.7 V ≤ +VA < 3 V
26.5
2000
ns
td(SCLKF-SDOINVALID)
Delay time, falling edge of SCLK to SDO
invalid
10-pF Load
td(SCLKF-SDOVALID)
Delay time, falling edge of SCLK to SDO
valid
10-pF Load
16
10-pF Load,
2.7 V ≤ +VA ≤ 3 V
13
td(CSF-SDOVALID)
Delay time, falling edge of CS to SDO
valid, SDO MSB output
10-pF Load,
3 V ≤ +VA ≤ 3.6 V
11
7.5
ns
ns
ns
tsu(SDI-SCLKF)
Setup time, SDI to falling edge of SCLK
8
ns
th(SDI-SCLKF)
Hold time, SDI to falling edge of SCLK
4
ns
td(CSR-SDOZ)
Delay time, rising edge of CS/FS to SDO
3-state
tsu(16th SCLKF-CSR)
Setup time, 16th falling edge of SCLK
before rising edge of CS/FS
td(SDO-CDI)
Delay time, CDI high to SDO high in
daisy chain mode
(1)
(2)
8
10
10-pF Load, chain mode
ns
ns
23
ns
All input signals are specified with tr = tf = 1.5 ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
See timing diagrams.
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ADS8330
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PIN ASSIGNMENTS
ADS8329
RSA PACKAGE
(TOP VIEW)
AGND
COM
+IN0
15
14
13
2
11
+VA
CONVST
3
10
+VBD
EOC/INT/CDI
4
9
SCLK
8
NC
BDGND
SCLK
+IN1
7
9
12
SDO
4
1
6
EOC/INT/CDI
REF+ (REFIN)
SDI
+VBD
REF-
+IN
13
10
BDGND
3
8
CONVST
16
-IN
14
+VA
7
11
SDO
2
5
AGND
15
NC
6
RESERVED
SDI
12
5
1
FS/CS
REF+ (REFIN)
FS/CS
REF16
ADS8330
RSA PACKAGE
(TOP VIEW)
CAUTION: The thermal pad is internally connected to the substrate. This pad can be connected to the analog
ground or left floating. Keep the thermal pad separate from the digital ground, if possible.
ADS8329
PW PACKAGE
(TOP VIEW)
+VA
RESERVED
+IN
-IN
AGND
REFREF+ (REFIN)
NC
ADS8330
PW PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
+VA
+IN1
+IN0
COM
AGND
REFREF+ (REFIN)
NC
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
+VBD
SCLK
BDGND
SDO
SDI
FS/CS
EOC/INT/CDI
CONVST
NC = No internal connection
10
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ADS8329 Terminal Functions
NO.
QFN
TSSOP
I/O
AGND
NAME
15
5
—
Analog ground
BDGND
8
14
—
Interface ground
CONVST
3
9
I
Freezes sample and hold, starts conversion with next rising edge of internal clock
Status output. If programmed as EOC, this pin is low (default) when a conversion is in
progress. If programmed as an interrupt (INT), this pin is low for a preprogrammed
duration after the end of conversion and valid data are to be output. The polarity of
EOC or INT is programmable. This pin can also be used as a chain data input when
the device is operated in chain mode.
EOC/ INT/ CDI
DESCRIPTION
4
10
O
5
11
I
Frame sync signal for TMS320 DSP serial interface or chip select input for SPI
interface slave select (SS–).
+IN
13
3
I
Noninverting input
–IN
14
4
I
Inverting input, usually connected to ground
NC
2
8
—
REF+
1
7
I
External reference input.
REF–
16
6
I
Connect to AGND through individual via.
RESERVED
12
2
I
Connect to AGND or +VA
SCLK
9
15
I
Clock for serial interface
SDI
6
12
I
Serial data in
SDO
7
13
O
Serial data out
+VA
11
1
Analog supply, +2.7 V to +5.5 VDC.
+VBD
10
16
Interface supply
FS/CS
No connection.
ADS8330 Terminal Functions
NO.
NAME
QFN
TSSOP
I/O
15
5
—
Analog ground
BDGND
8
14
—
Interface ground
COM
14
4
I
Common inverting input, usually connected to ground
CONVST
3
9
I
Freezes sample and hold, starts conversion with next rising edge of internal clock
Status output. If programmed as EOC, this pin is low (default) when a conversion is in
progress. If programmed as an interrupt (INT), this pin is low for a preprogrammed
duration after the end of conversion and valid data are to be output. The polarity of
EOC or INT is programmable. This pin can also be used as a chain data input when
the device is operated in chain mode.
AGND
EOC/ INT/ CDI
DESCRIPTION
4
10
O
5
11
I
Frame sync signal for TMS320 DSP serial interface or chip select input for SPI
interface
+IN1
12
2
I
Second noninverting input.
+IN0
13
3
I
First noninverting input
NC
2
8
—
REF+
1
7
I
External reference input.
REF–
16
6
I
Connect to AGND through individual via.
SCLK
9
15
I
Clock for serial interface
SDI
6
12
I
Serial data in (conversion start and reset possible)
SDO
7
13
O
Serial data out
+VA
11
1
Analog supply, +2.7 V to +5.5 VDC.
+VBD
10
16
Interface supply
FS/CS
No connection.
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MANUAL TRIGGER / READ While Sampling
(use internal CCLK, EOC and INT polarity programmed as active low)
Nth
Nth
tCONV = 18 CCLKs
tSAMPLE1 = 3 CCLKs min
INT
(active low)
tSAMPLE1 = 3 CCLKs min
th(CSR-EOS)
th(CSF-EOC)
th(CSF-EOS)
EOS
twL(CONVST)
EOC
EOC
(active low)
EOS
EOC
CONVST
th(CSF-EOC)
tsu(CSF-EOC)
tsu(CSF-EOS)
CS/FS
1
SCLK
1 . . . . . . . . . . . . . . . . . . . . 16
SDO
td(CSR-EOS) = 20 ns min
Nth
Nth−1st
SDI
1101b
1101b
READ Result
READ Result
Figure 1. Timing for Conversion and Acquisition Cycles for Manual Trigger (Read while sampling)
AUTO TRIGGER / READ While Sampling
(use internal CCLK, EOC and INT polarity programmed as active low)
tCONV = 18 CCLKs
tSAMPLE2 = 3 CCLKs
Nth
tSAMPLE2 = 3 CCLKs
tCONV = 18 CCLKs
INT
(active low)
EOS
EOC
(active low)
EOC
EOS
EOS
EOC
CONVST = 1
th(CSF-EOS)
th(CSF-EOC)
tsu(CSF-EOS)
tsu(CSF-EOS)
CS/FS
SCLK
SDO
SDI
1 . . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . . .16
N − 2nd
N − 1st
1110b. . . . . . . . . . . . . .
CONFIGURE
th(CSF-EOC)
1
Nth
1101b
1101b
READ Result
READ Result
Figure 2. Timing for Conversion and Acquisition Cycles for Autotrigger (Read while sampling)
12
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MANUAL TRIGGER / READ While Converting
(use internal CCLK, EOC and INT polarity programmed as active low)
N − 1st
Nth
Nth
EOC
(active low)
EOS
EOC
twL(CONVST)
EOS
CONVST
tCONV = 18 CCLKs
N + 1st
tSAMPLE1 = 3 CCLKs min
INT
(active low)
th(CSF-EOS)
tsu(CSR-EOS)
tsu(CSF-EOS)
CS/FS
tsu(CSF-EOC)
th(CSF-EOC)
SCLK
1
1 . . . . . . . . . . . . . . . . . . . .16
SDO
N th
N − 1st
1101b
SDI
1101b
READ Result
READ Result
Figure 3. Timing for Conversion and Acquisition Cycles for Manual Trigger (Read while converting)
AUTO TRIGGER / READ While Converting
(use internal CCLK, EOC and INT polarity programmed as active low)
tCONV = 18 CCLKs
th(CSF-EOS)
tsu(CSF-EOS)
EOS
tCONV = 18 CCLKs
tSAMPLE2 = 3 CCLKs min
tSAMPLE2 = 3 CCLKs min
Nth
INT
(active low)
N + 1st
EOC
EOC
(active low)
EOS
EOS
EOC
CONVST = 1
th(CSR-EOS)
tsu(CSR-EOS)
th(CSF-EOS)
CS/FS
1 . . . . . . . . . . . . . . . . . . 16
SCLK
1 . . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . . 16
??
SDO
N−2nd
SDI
1110b . . . . . . . . . . . . . . .
tsu(CSR-EOS)
Nth
N−1st
1101b
CONFIGURE
READ Result
1101b
READ Result
Figure 4. Timing for Conversion and Acquisition Cycles for Autotrigger (Read while converting)
Copyright © 2006–2009, Texas Instruments Incorporated
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1
2
3
4
5
6
14
7
15
16
SCLK
tsu(CSF−SCLK1F)
tc(SCLK)
twH(SCLK)
twL(SCLK)
CS/FS
tsu(16thSCLK−CSR)
td(SCLKF−SDOINVALID)
td(CSR−SDOZ)
td(SCLKF−SDOVALID)
td(CSF−SDOVALID)
SDO
Hi−Z
MSB−1 MSB−2 MSB−3 MSB−4
MSB
MSB−5 MSB−6
LSB+2
LSB+1
LSB
th(SDI−SCLKF)
MSB
SDI
MSB−1 MSB−2 MSB−3 MSB−4 MSB−5
MSB−6
LSB+2
LSB+1
LSB
tsu(SDI−SCLKF)
Figure 5. Detailed SPI Transfer Timing
MANUAL TRIGGER / READ While Sampling
(use internal CCLK active high, EOC and INT active low, TAG enabled, auto channel select)
Nth CH1
Nth CH0
CONVST
twL(CONVST)
EOS
EOC
(active low)
EOC
twL(CONVST)
Nth CH0
Nth CH1
tCONV = 18 CCLKs
tCONV = 18 CCLKs
tSAMPLE1 = 3 CCLKs min
INT
(active low)
tsu(CSF-EOS)
th(CSF-EOC)
CS/FS
SCLK
1 . . . . . . . . . . . . . . . . . . . . . . . 16
17
1 . . . . . . . . . . . . . . . . . . . . . . . 16
17
td(CSR-EOS) = 20 ns MIN
SDO
Hi−Z
Nth CH0
N−1st CH1
TAG = 0
TAG = 1
SDI
1101b
Hi−Z
1101b
READ Result
READ Result
Figure 6. Simplified Dual Channel Timing
14
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TYPICAL CHARACTERISTICS
At –40°C to 85°C, VREF [REF+ – (REF–)] = 5 V when +VA = +VBD = 5 V or VREF [REF+ – (REF–)] = 2.5 V when
+VA = +VBD = 3 V, fSCLK = 42 MHz, or VREF = 2.5 when +VA = +VBD = 2.7 V, fSCLK = 37.8 MHz, fI = dc for dc
curves, fI = 100 kHz for ac curves with 5-V supply and fI = 10 kHz for ac curves with 3-V supply (unless
otherwise noted).
CROSSTALK
vs
FREQUENCY
DIFFERENTIAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
110
1
105
0.8
INTEGRAL NONLINEARITY
vs
FREE-AIR TEMPERATURE
2
+VA = 5 V
+VA = 5 V
INL - LSB
95
DNL - LSB
Crosstalk -dB
1.5
100
+VA = 3 V
0.6
+VA = 3 V
1
0.4
90
+VA = 5 V
0.5
0.2
85
+VA = 3 V
0
-40 -25
80
0
50
100
150
f - Frequency - kHz
200
5
20
35
50
65
0
-40
80
TA - Free-Air Temperature - °C
-25
-10 5
20 35 50 65
TA - Free-Air Temperature - °C
80
Figure 7.
Figure 8.
Figure 9.
DIFFERENTIAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
INTEGRAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
DIFFERENTIAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
2
1
1
+VA = 5 V
+VA = 5 V
+VA = 3 V
1.5
1
INL - LSB
0.5
0
MIN
MAX
MAX
0.5
0.5
DNL - LSB
MAX
DNL - LSB
-10
0
-0.5
MIN
0
MIN
-1
-0.5
-0.5
-1.5
-1
0.1
1
10
External Clock Frequency - MHz
-2
0.1
100
Figure 10.
10
1
External Clock Frequency - MHz
100
Figure 11.
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
-1
0.1
1
10
External Clock Frequency - MHz
100
Figure 12.
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SLAS516C – DECEMBER 2006 – REVISED JULY 2009 ................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS (continued)
INTEGRAL NONLINEARITY
vs
EXTERNAL CLOCK FREQUENCY
OFFSET VOLTAGE
vs
FREE-AIR TEMPERATURE
2
OFFSET VOLTAGE
vs
SUPPLY VOLTAGE
1
1
+VA = 3 V
1.5
MAX
0
MIN
Offset Voltage - mV
0.5
-0.5
0.8
0.5
Offset Voltage - mV
INL - LSB
1
+VA = 5 V
0
+VA = 3 V
-0.5
-1
0.6
0.4
0.2
-1.5
-2
0.1
1
10
External Clock Frequency - MHz
-1
-40
100
-25
-10
5
20 35 50 65
TA - Free-Air Temperature - °C
0
2.7
80
Figure 15.
GAIN ERROR
vs
FREE-AIR TEMPERATURE
GAIN ERROR
vs
SUPPLY VOLTAGE
POWER-SUPPLY REJECTION RATIO
vs
SUPPLY RIPPLE FREQUENCY
PSRR - Power Supply Rejection Ratio - dB
0.10
Gain Error - %FSR
+VA = 3 V
-0.06
-25 -10
5
20 35 50 65
TA - Free-Air Temperature - °C
3.2
3.7
4.2
4.7
-80
-78
-76
-74
+VA = 5 V
-72
+VA = 3 V
-70
5.2
0
20
+VA - Supply Voltage - V
40
60
f - Frequency - kHz
80
100
Figure 16.
Figure 17.
Figure 18.
SIGNAL-TO-NOISE RATIO
vs
INPUT FREQUENCY
SIGNAL-TO-NOISE AND DISTORTION
vs
INPUT FREQUENCY
TOTAL HARMONIC DISTORTION
vs
INPUT FREQUENCY
SINAD - Signal-To-Noise and Distortion - dB
SNR - Signal-To-Noise Ratio - dB
-0.10
2.7
80
95
+VA = 5 V
91
+VA = 3 V
87
85
20
40
60
80
fi - Input Frequency - kHz
100
Figure 19.
16
0
-0.05
-0.08
0
0.05
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-90
95
THD - Total Harmonic Distortion - dB
Gain Error - %FSR
+VA = 5 V
-0.04
89
5.2
Figure 14.
-0.02
93
3.7
4.2
4.7
+VA - Supply Voltage - V
Figure 13.
0
-0.10
-40
3.2
93
+VA = 5 V
91
89
+VA = 3 V
87
85
+VA = 3 V
-95
+VA = 5 V
-100
-105
-110
0
20
40
60
80
fi - Input Frequency - kHz
100
Figure 20.
0
20
40
60
80
fi - Input Frequency - kHz
100
Figure 21.
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www.ti.com ................................................................................................................................................... SLAS516C – DECEMBER 2006 – REVISED JULY 2009
TYPICAL CHARACTERISTICS (continued)
SIGNAL-TO-NOISE RATIO
vs
FULL-SCALE RANGE
110
104
102
100
+VA = 5 V
98
96
+VA = 3 V
94
SINAD - Signal-To-Noise and Distortion - dB
106
fi = 10 kHz
95
90
+VA = 3 V
+VA = 5 V
85
80
75
92
70
90
0
20
40
60
80
fi - Input Frequency - kHz
0
100
4
5
90
+VA = 3 V
+VA = 5 V
85
80
75
70
0
1
3
2
Full Scale Range - V
4
5
Figure 24.
TOTAL HARMONIC DISTORTION
vs
FULL-SCALE RANGE
SPURIOUS-FREE DYNAMIC RANGE
vs
FULL-SCALE RANGE
TOTAL HARMONIC DISTORTION
vs
FREE-AIR TEMPERATURE
-90
-95
+VA = 5 V
-100
+VA = 3 V
-105
1
0
2
3
Full Scale Range - V
4
5
110
-90
fi = 10 kHz
105
THD - Total Harmonic Distortion - dB
SFDR - Spurious Free Dynamic Range - dB
-85
+VA = 3 V
+VA = 5 V
100
95
90
85
80
0
1
2
3
Full Scale Range - V
4
+VA = 5 V
-95
-100
+VA = 3 V
-105
-110
-40 -25
5
-10 5
20
35 50 65
TA - Free-Air Temperature - °C
80
Figure 25.
Figure 26.
Figure 27.
SPURIOUS-FREE DYNAMIC RANGE
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE RATIO
vs
FREE-AIR TEMPERATURE
SIGNAL-TO-NOISE AND DISTORTION
vs
FREE-AIR TEMPERATURE
105
+VA = 3 V
100
+VA = 5 V
95
90
-40
-25
-10
5
20
35 50 65
TA - Free-Air Temperature - °C
93
Figure 28.
+VA = 5 V
91
+VA = 3 V
89
87
85
-40 -25
80
SINAD - Signal-To-Noise and Distortion - dB
95
110
SNR - Signal-To-Noise Ratio - dB
SFDR - Spurious Free Dynamic Range - dB
2
3
Full Scale Range - V
fi = 10 kHz
95
Figure 23.
fi = 10 kHz
-110
1
100
Figure 22.
-80
THD - Total Harmonic Distortion - dB
SIGNAL-TO-NOISE AND DISTORTION
vs
FULL-SCALE RANGE
100
108
SNR - Signal-To-Noise Ratio - dB
SFDR - Spurious Free Dynamic Range - dB
SPURIOUS-FREE DYNAMIC RANGE
vs
INPUT FREQUENCY
-10
5
20
35 50 65
TA - Free-Air Temperature - ºC
80
Figure 29.
Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): ADS8329 ADS8330
95
93
91
+VA = 5 V
89
+VA = 3 V
87
85
-40
-25
-10
5
20
35
50
65
80
TA - Free-Air Temperature - ºC
Figure 30.
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TYPICAL CHARACTERISTICS (continued)
EFFECTIVE NUMBER OF BITS
vs
FREE-AIR TEMPERATURE
INTERNAL CLOCK FREQUENCY
vs
SUPPLY VOLTAGE
24
15.50
+VA = 5 V
15
+VA = 3 V
14.50
14
-40
-25
-10
5
20
35
50
65
24
23.5
Internal Clock Frequency - MHz
Internal Clock Frequency - MHz
16
ENOB - Effective Number of Bits - Bits
INTERNAL CLOCK FREQUENCY
vs
FREE-AIR TEMPERATURE
23
22.5
22
21.5
21
2.7
80
3.2
22
21.5
TA - Free-Air Temperature - ºC
Figure 31.
Figure 32.
Figure 33.
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT
vs
SUPPLY VOLTAGE
6.5
6.0
5.5
5.0
3.2
360
320
280
240
200
2.7
3.7
4.2
4.7
5.2
+VA - Supply Voltage - V
PD Mode
Analog Supply Current - nA
7.0
80
10
NAP Mode
Analog Supply Current - mA
Analog Supply Current - mA
22.5
21
-40 -25 -10
5
20
35 50 65
TA - Free-Air Temperature - ºC
5.2
400
4.5
2.7
23
3.7
4.2
4.7
+VA - Supply Voltage - V
fs = 1 MSPS
7.5
23.5
3.2
3.7
4.2
4.7
+VA - Supply Voltage - V
8
6
4
2
0
2.7
5.2
3.2
3.7
4.2
4.7
+VA - Supply Voltage - V
5.2
Figure 34.
Figure 35.
Figure 36.
ANALOG SUPPLY CURRENT
vs
SAMPLE RATE
ANALOG SUPPLY CURRENT
vs
SAMPLE RATE
ANALOG SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
500
Auto NAP
+VA = 5 V
4
+VA = 3 V
3
2
1
0
1
10
100
Sample Rate - kHz
1000
Figure 37.
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Analog Supply Current - mA
6
5
7.5
PD Mode
Analog Supply Current - mA
Analog Supply Current - mA
7
400
300
+VA = 5 V
200
+VA = 3 V
100
0
fs = 1 MSPS
+VA = 5 V
7
6.5
6
5.5
+VA = 3 V
5
4.5
1
5
4
-40
Sample Rate - kHz
-10 5
20 35 50 65
TA - Free-Air Temperature - ºC
Figure 38.
Figure 39.
9
13
17
-25
80
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TYPICAL CHARACTERISTICS (continued)
ANALOG SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
0.4
Analog Supply Current - mA
NAP Mode
0.36
+VA = 5 V
0.32
0.28
+VA = 3 V
0.24
0.2
-40
-25 -10
5
20 35 50 65
TA - Free-Air Temperature - ºC
80
Figure 40.
INL
1.75
1.5
+VA = 5 V
INL - Bits
1.0
0.5
0
-0.5
-1.0
-1.5
-1.75
0
10000
20000
30000
40000
50000
60000
40000
50000
60000
Code
Figure 41.
DNL
1
+VA = 5 V
DNL - Bits
0.5
0
-0.5
-1
0
10000
20000
30000
Code
Figure 42.
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TYPICAL CHARACTERISTICS (continued)
INL
1.75
1.5
+VA = 3 V
INL - Bits
1.0
0.5
0
-0.5
-1.0
-1.5
-1.75
0
10000
20000
30000
Code
40000
50000
60000
Figure 43.
DNL
1
+VA = 3 V
DNL - Bits
0.5
0
-0.5
-1
0
10000
20000
30000
Code
40000
50000
60000
Figure 44.
FFT
0
5 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 45.
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TYPICAL CHARACTERISTICS (continued)
FFT
0
10 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 46.
FFT
0
100 kHz Input,
+VA = 3 V,
fs = 1 MSPS,
Vref = 2.5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 47.
FFT
0
5 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
Amplitude - dB
-20
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 48.
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TYPICAL CHARACTERISTICS (continued)
FFT
20
0
10 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
Amplitude - dB
-20
-40
-60
-80
-100
-120
-140
-160
0
100
200
300
400
500
f - Frequency - kHz
Figure 49.
FFT
0
100 kHz Input,
+VA = 5 V,
fs = 1 MSPS,
Vref = 5 V
-20
Amplitude - dB
-40
-60
-80
-100
-120
-140
-160
0
100
200
f - Frequency - kHz
300
400
500
Figure 50.
THEORY OF OPERATION
The ADS8329/30 is a high-speed, low power, successive approximation register (SAR) analog-to-digital
converter (ADC) that uses an external reference. The architecture is based on charge redistribution, which
inherently includes a sample/hold function.
The ADS8329/30 has an internal clock that is used to run the conversion but can also be programmed to run the
conversion based on the external serial clock, SCLK.
The ADS8329 has one analog input. The analog input is provided to two input pins: +IN and –IN. When a
conversion is initiated, the differential input on these pins is sampled on the internal capacitor array. While a
conversion is in progress, both +IN and –IN inputs are disconnected from any internal function.
The ADS8330 has two inputs. Both inputs share the same common pin, COM. The negative input is the same as
the –IN pin for the ADS8329. The ADS8330 can be programmed to select a channel manually or can be
programmed into the auto channel select mode to sweep between channel 0 and 1 automatically.
ANALOG INPUT
When the converter enters hold mode, the voltage difference between the +IN and –IN inputs is captured on the
internal capacitor array. The voltage on the –IN input is limited between AGND – 0.2 V and AGND + 0.2 V,
allowing the input to reject small signals which are common to both the +IN and –IN inputs. The +IN input has a
range of –0.2 V to VREF + 0.2 V. The input span [+IN – (–IN)] is limited to 0 V to VREF.
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The (peak) input current through the analog inputs depends upon a number of factors: sample rate, input
voltage, and source impedance. The current into the ADS8329/30 charges the internal capacitor array during the
sample period. After this capacitance has been fully charged, there is no further input current. The source of the
analog input voltage must be able to charge the input capacitance (45 pF) to a 16-bit settling level within the
minimum acquisition time (120 ns). When the converter goes into hold mode, the input impedance is greater than
1 GΩ.
Care must be taken regarding the absolute analog input voltage. To maintain linearity of the converter, the +IN
and –IN inputs and the span [+IN – (–IN)] should be within the limits specified. Outside of these ranges,
converter linearity may not meet specifications. To minimize noise, low bandwidth input signals with low-pass
filters should be used. Care should be taken to ensure that the output impedance of the sources driving the +IN
and –IN inputs are matched. If this is not observed, the two inputs could have different settling times. This may
result in an offset error, gain error, and linearity error which change with temperature and input voltage.
Device in Hold Mode
150 W
+IN
4 pF
40 pF
+VA
AGND
4 pF
150 W
−IN
40 pF
AGND
Figure 51. Input Equivalent Circuit
Driver Amplifier Choice
The analog input to the converter needs to be driven with a low noise, op-amp like the THS4031 or OPA365. An
RC filter is recommended at the input pins to low-pass filter the noise from the source. Two resistors of 20 Ω and
a capacitor of 470 pF are recommended. The input to the converter is a unipolar input voltage in the range 0 V to
VREF. The minimum –3dB bandwidth of the driving operational amplifier can be calculated to:
f3db = (ln(2) ×(n+1))/(2π × tACQ)
where n is equal to 16, the resolution of the ADC (in the case of the ADS8329/30). When tACQ = 120 ns
(minimum acquisition time), the minimum bandwidth of the driving amplifier is 15.6 MHz. The bandwidth can be
relaxed if the acquisition time is increased by the application. The OPA365, OPA827, or THS4031 from Texas
Instruments are recommended. The THS4031 used in the source follower configuration to drive the converter is
shown in the typical input drive configuration, Figure 52. For the ADS8330, a series resistor of 0Ω should be
used on the COM pin (or no resistor at all).
Bipolar to Unipolar Driver
In systems where the input is bipolar, the THS4031 can be used in the inverting configuration with an additional
DC bias applied to its + input so as to keep the input to the ADS8329/30 within its rated operating voltage range.
This configuration is also recommended when the ADS8329/30 is used in signal processing applications where
good SNR and THD performance is required. The DC bias can be derived from the REF3225 or the REF3240
reference voltage ICs. The input configuration shown in Figure 53 is capable of delivering better than 91 dB SNR
and –96 dB THD at an input frequency of 10 kHz. In case bandpass filters are used to filter the input, care should
be taken to ensure that the signal swing at the input of the bandpass filter is small so as to keep the distortion
introduced by the filter minimal. In such cases, the gain of the circuit shown in Figure 53 can be increased to
keep the input to the ADS8329/30 large to keep the SNR of the system high. Note that the gain of the system
from the + input to the output of the THS4031 in such a configuration is a function of the gain of the AC signal. A
resistor divider can be used to scale the output of the REF3225 or REF3240 to reduce the voltage at the DC
input to THS4031 to keep the voltage at the input of the converter within its rated operating range.
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Input
Signal
(0 V to 4 V)
5V
ADS8329
+VA
THS4031
20 W
+IN
470 pF
50 W
-IN
20 W
Figure 52. Unipolar Input Drive Configuration
5V
ADS8329
1V DC
+VA
THS4031
600 W
20 W
+IN
470 pF
Input
Signal
(-2 V to 2 V)
600 W
-IN
20 W
Figure 53. Bipolar Input Drive Configuration
REFERENCE
The ADS8329/30 can operate with an external reference with a range from 0.3 V to 5 V. A clean, low noise,
well-decoupled reference voltage on this pin is required to ensure good performance of the converter. A low
noise band-gap reference like the REF3240 can be used to drive this pin. A 22-µF ceramic decoupling capacitor
is required between the REF+ and REF– pins of the converter. These capacitors should be placed as close as
possible to the pins of the device. The REF– should be connected to its own via to the analog ground plane with
the shortest possible distance.
CONVERTER OPERATION
The ADS8329/30 has an oscillator that is used as an internal clock which controls the conversion rate. The
frequency of this clock is 21 MHz minimum. The oscillator is always on unless the device is in the deep
power-down state or the device is programmed for using SCLK as the conversion clock (CCLK). The minimum
acquisition (sampling) time takes 3 CCLKs (this is equivalent to 120 ns at 24.5 MHz) and the conversion time
takes 18 conversion clocks (CCLK) (≈780 ns) to complete one conversion.
The conversion can also be programmed to run based on the external serial clock, SCLK, if is so desired. This
allows a system designer to achieve system synchronization. The serial clock SCLK, is first reduced to 1/2 of its
frequency before it is used as the conversion clock (CCLK). For example, with a 42-MHz SCLK this provides a
21-MHz clock for conversions. If it is desired to start a conversion at a specific rising edge of the SCLK when the
external SCLK is programmed as the source of the conversion clock (CCLK) (and manual start of conversion is
selected), the setup time between CONVST and that rising SCLK edge should be observed. This ensures the
conversion is complete in 18 CCLKs (or 36 SCLKs). The minimum setup time is 20 ns to ensure synchronization
between CONVST and SCLK. In many cases the conversion can start one SCLK period (or CCLK) later which
results in a 19 CCLK (or 37 SCLK) conversion. The 20 ns setup time is not required once synchronization is
relaxed.
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The duty cycle of SCLK is not critical as long as it meets the minimum high and low time requirements of 8 ns.
Since the ADS8329/30 is designed for high-speed applications, a higher serial clock (SCLK) must be supplied to
be able to sustain the high throughput with the serial interface and so the clock period of SCLK must be at most
1 µs (when used as conversion clock (CCLK). The minimum clock frequency is also governed by the parasitic
leakage of the capacitive digital-to-analog (CDAC) capacitors internal to the ADS8329/30.
CFR_D10
Conversion Clock
(CCLK)
=1
OSC
=0
Divider
1/2
SPI Serial
Clock (SCLK)
Figure 54. Converter Clock
Manual Channel Select Mode
The conversion cycle starts with selecting an acquisition channel by writing a channel number to the command
register (CMR). This cycle time can be as short as 4 serial clocks (SCLK).
Auto Channel Select Mode
Channel selection can also be done automatically if auto channel select mode is enabled. This is the default
channel select mode. The dual channel converter, ADS8330, has a built-in 2-to-1 MUX. If the device is
programmed for auto channel select mode then signals from channel 0 and channel 1 are acquired with a fixed
order. Channel 0 is accessed first in the next cycle after the command cycle that configured CFR_D11 to 1 for
auto channel select mode. This automatic access stops the cycle after the command cycle that sets CFR_D11 to
0.
Start of a Conversion
The end of acquisition or sampling instance (EOS) is the same as the start of a conversion. This is initiated by
bringing the CONVST pin low for a minimum of 40 ns. After the minimum requirement has been met, the
CONVST pin can be brought high. CONVST acts independent of FS/CS so it is possible to use one common
CONVST for applications requiring simultaneous sample/hold with multiple converters. The ADS8329/30
switches from sample to hold mode on the falling edge of the CONVST signal. The ADS8329/30 requires 18
conversion clock (CCLK) edges to complete a conversion. The conversion time is equivalent to 1500 ns with a
12-MHz internal clock. The minimum time between two consecutive CONVST signals is 21 CCLKs.
A conversion can also be initiated without using CONVST if it is so programmed (CFR_D9 = 0). When the
converter is configured as auto trigger, the next conversion is automatically started 3 conversion clocks (CCLK)
after the end of a conversion. These 3 conversion clocks (CCLK) are used as the acquisition time. In this case
the time to complete one acquisition and conversion cycle is 21 CCLKs.
Table 1. Different Types of Conversion
MODE
SELECT CHANNEL
START CONVERSION
Auto Channel Select (1)
Auto Trigger
Automatic No need to write channel number to the CMR. Use internal sequencer for the
ADS8330.
Manual
(1)
Manual Channel Select
Write the channel number to the CMR.
Start a conversion based on the conversion
clock CCLK.
Manual Trigger
Start a conversion with CONVST.
Auto channel select should be used with auto trigger and also with the TAG bit enabled.
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Status Output EOC/INT
When the status pin is programmed as EOC and the polarity is set as active low, the pin works in the following
manner: The EOC output goes LOW immediately following CONVST going LOW when manual trigger is
programmed. EOC stays LOW throughout the conversion process and returns to HIGH when the conversion has
ended. The EOC output goes low for 3 conversion clocks (CCLK) after the previous rising edge of EOC, if auto
trigger is programmed.
This status pin is programmable. It can be used as an EOC output (CFR_D[7:6] = 1, 1) where the low time is
equal to the conversion time. This status pin can be used as INT. (CFR_D[7:6] = 1, 0) which is set LOW at the
end of a conversion is brought to HIGH (cleared) by the next read cycle. The polarity of this pin, used as either
function (EOC or INT), is programmable through CFR_D7.
Power-Down Modes
The ADS8329/30 has a comprehensive built-in power-down feature. There are three power-down modes: Deep
power-down mode, Nap power-down mode, and auto nap power-down mode. All three power-down modes are
enabled by setting the related CFR bits. The first two power-down modes are activated when enabled. A wakeup
command, 1011b, can resume device operation from a power-down mode. Auto nap power-down mode works
slightly different. When the converter is enabled in auto nap power-down mode, an end of conversion instance
(EOC) puts the device into auto nap power-down. The beginning of sampling resumes operation of the converter.
The contents of the configuration register is not affected by any of the power-down modes. Any ongoing
conversion when nap or deep power-down is activated is aborted.
+VA − Supply Current − mA
100
10
1
0.1
20
10020
20020
30020
40020
Settling Time − ns
Figure 55. Typical Analog Supply Current Drop vs Time After Power-Down
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Deep Power-Down Mode
Deep power-down mode can be activated by writing to configuration register bit CFR_D2. When the device is in
deep power-down mode, all blocks except the interface are in power-down. The external SCLK is blocked to the
analog block. The analog blocks no longer have bias currents and the internal oscillator is turned off. In this
mode, supply current falls from 7 mA to 4 nA in 100 ns. The wake-up time after a power-down is 1 µs. When bit
D2 in the configuration register is set to 0, the device is in deep power-down. Setting this bit to 1 or sending a
wake-up command can resume the converter from the deep power-down state.
Nap Mode
In nap mode the ADS8329/230 turns off biasing of the comparator and the mid-volt buffer. In this mode supply
current falls from 7 mA in normal mode to about 0.3 mA in 200 ns after the configuration cycle. The wake-up
(resume) time from nap power-down mode is 3 CCLKs (120 ns with a 24.5-MHz conversion clock). As soon as
the CFR_D3 bit in the control register is set to 0, the device goes into nap power-down mode, regardless of the
conversion state. Setting this bit to 1 or sending a wake-up command can resume the converter from the nap
power-down state.
Auto Nap Mode
Auto nap mode is almost identical to nap mode. The only difference is the time when the device is actually
powered down and the method to wake up the device. Configuration register bit D4 is only used to
enable/disable auto nap mode. If auto nap mode is enabled, the device turns off biasing after the conversion has
finished, which means the end of conversion activates auto nap power-down mode. Supply current falls from 7
mA in normal mode to about 0.3 mA in 200 ns. A CONVST resumes the device and turns biasing on again in 3
CCLKs (120 ns with a 24.5-MHz conversion clock). The device can also be woken up by disabling auto nap
mode when bit D4 of the configuration register is set to 1. Any channel select command 0XXXb, wake up
command or the set default mode command 1111b can also wake up the device from auto nap power-down.
NOTE:
1. This wake-up command is the word 1011b in the command word. This command sets bits
D2 and D3 to 1 in the configuration register but not D4. But a wake-up command does
remove the device from either one of these power-down states, deep/nap/auto nap
power-down.
2. Wake-up time is defined as the time between when the host processor tries to wake up the
converter and when a convert start can occur.
Table 2. Power-Down Mode Comparisons
TYPE OF
POWER-DOWN
POWER
CONSUMPTION:
5 V/3 V
Normal operation
7 mA/5.1 mA
Deep power-down
4 nA/2 nA
Nap power-down
Auto nap
power-down
0.3 mA/0.25 mA
ACTIVATED BY
ACTIVATION TIME
RESUME POWER BY
Setting CFR
100 ns
Woken up by command 1011b
Setting CFR
200 ns
Woken up by command 1011b to
achieve 6.6 mA since (1.3 + 12)/2 = 6.6
EOC (end of
conversion)
200 ns
Woken up by CONVST, any channel
select command, default command
1111b, or wake up command 1011b.
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RESUME
TIME
ENABLE
1 µs
Set CFR
3 CCLKs
Set CFR
3 CCLKs
Set CFR
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EOS
EOC
EOS
Converter
State
N+1
Converter State
EOC
N
CONVST
N+1 −th Sampling
N −th Conversion
N+1 −th Conversion
Read While Converting
20 ns MIN
1 CCLK MIN
CS
(For Read Result)
Read N−1 −th Result
Read While Sampling
0 ns MIN
20 ns MIN
CS
(For Read Result)
Read N −th Result
Figure 56. Read While Converting versus Read While Sampling (Manual Trigger)
Manual Trigger
Converter
State
Resume
N −th Sampling
>=3CCLK
N −th Conversion
Activation
Resume
=18 CCLK
N+1 −th Sampling
>=3CCLK
EOC
EOC
EOS
N+1
EOS
N
CONVST
N+1 −th Conversion
Activation
=18 CCLK
20 ns MIN
20 ns MIN
1 CCLK MIN
Read While Converting
Read N−1 −th
CS
Read N −th
Result
Result
20 ns MIN
20 ns MIN
Read While Sampling
Read N−1 −th
CS
20 ns MIN
0 ns MIN
20 ns MIN
Read N −th
Result
Result
20 ns MIN
20 ns MIN
Figure 57. Read While Converting versus Read While Sampling with Deep or Nap Power-Down
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40 ns MIN
Manual Trigger Case 1
N
N+1
Converter
State
Resume
N −th Sampling
EOS
POWERDOWN
N −th Conversion
>=3CCLK
Resume
=18 CCLK
EOC
EOS
EOC
(programmed
Active Low)
EOC
CONVST
N+1 −th Sampling
N+1 −th Conversion
>=3CCLK
=18 CCLK
6 CCLKs
POWERDOWN
6 CCLKs
Read While Converting
20 ns MIN
20 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
20 ns MIN
20 ns MIN
1 CCLK MIN
Read While Sampling
1 CCLK MIN
0 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
20 ns MIN
20 ns MIN
40 ns MIN
Manual Trigger Case 2 (wake up by CONVST)
N+1
Converter
State
N −th Sampling
N −th Conversion
>=3CCLK
POWER
DOWN
Resume
N+1 −th Sampling
>=3CCLK
=18 CCLK
EOC
EOS
Resume
EOS
N
EOC
(programmed
Active Low)
EOC
CONVST
N+1 −th Conversion
POWER
DOWN
=18 CCLK
Read While Converting
20 ns MIN
20 ns MIN
Read While Sampling
20 ns MIN
20 ns MIN
CS
20 ns MIN
Read N −th
Result
Read N−1 −th
Result
CS
0 ns MIN
20 ns MIN
Read N −th
Result
Read N−1 −th
Result
20 ns MIN
20 ns MIN
Figure 58. Read While Converting versus Read While Sampling with Auto Nap Power-Down
Total Acquisition + Conversion Cycle Time:
Automatic:
= 21 CCLKs
Manual:
≥ 21 CCLKs
Manual + deep
power-down:
≥ 4SCLK + 100 µs + 3 CCLK + 18 CCLK +16 SCLK + 1 µs
Manual + nap power-down: ≥ 4 SCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK
Manual + auto nap
power-down:
≥ 4 SCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK (use wakeup to resume)
Manual + auto nap
power-down:
≥ 1 CCLK + 3 CCLK + 3 CCLK + 18 CCLK +16 SCLK (use CONVST to resume)
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DIGITAL INTERFACE
The serial clock is designed to accommodate the latest high-speed processors with an SCLK frequency up to 50
MHz. Each cycle is started with the falling edge of FS/CS. The internal data register content which is made
available to the output register at the EOC presented on the SDO output pin at the falling edge of FS/CS. This is
the MSB. Output data are valid at the falling edge of SCLK with td(SCLKF-SDOVALID) delay so that the host processor
can read it at the falling edge. Serial data input is also read at the falling edge of SCLK.
The complete serial I/O cycle starts with the first falling edge of SCLK after the falling edge of FS/CS and ends
16 (see NOTE) falling edges of SCLK later. The serial interface is very flexible. It works with CPOL = 0 , CPHA =
1 or CPOL = 1, CPHA = 0. This means the falling edge of FS/CS may fall while SCLK is high. The same
relaxation applies to the rising edge of FS/CS where SCLK may be high or low as long as the last SCLK falling
edge happens before the rising edge of FS/CS.
NOTE:
There are cases where a cycle is 4 SCLKs or up to 24 SCLKs depending on the read
mode combination. See Table 3 for details.
Internal Register
The internal register consists of two parts, 4 bits for the command register (CMR) and 12 bits for configuration
data register (CFR).
Table 3. Command Set Defined by Command Register (CMR) (1)
D[15:12]
HEX
COMMAND
D[11:0]
(2)
WAKE UP FROM
AUTO NAP
MINIMUM SCLKs
REQUIRED
R/W
0000b
0h
Select analog input channel 0
Don't care
Y
4
W
0001b
1h
Select analog input channel 1 (2)
Don't care
Y
4
W
0010b
2h
Reserved
Reserved
–
–
–
0011b
3h
Reserved
Reserved
–
–
–
0100b
4h
Reserved
Reserved
–
–
–
0101b
5h
Reserved
Reserved
–
–
–
0110b
6h
Reserved
Reserved
–
–
–
0111b
7h
Reserved
Reserved
–
–
–
1000b
8h
Reserved
Reserved
–
–
–
1001b
9h
Reserved
Reserved
–
–
–
1010b
Ah
Reserved
Reserved
–
–
–
1011b
Bh
Wake up
Don't care
Y
4
W
1100b
Ch
Read CFR
Don't care
–
16
R
1101b
Dh
Read data
Don't care
–
16
R
1110
Eh
Write CFR
CFR value
–
16
W
1111b
Fh
Default mode (load CFR with default value)
Don't care
Y
4
W
(1)
(2)
When SDO is not in 3-state (FS/CS low and SCLK running), the bits from SDO are always part (depending on how many SCLKs are
supplied) of the previous conversion result.
These two commands apply to the ADS8330 only.
WRITING TO THE CONVERTER
There are two different types of writes to the register, a 4-bit write to the CMR and a full 16-bit write to the CMR
plus CFR. The command set is listed in Table 3. A simple command requires only 4 SCLKs and the write takes
effect at the 4th falling edge of SCLK. A 16-bit write or read takes at least 16 SCLKs (see Table 6 for exceptions
that require more than 16 SCLKs).
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Configuring the Converter and Default Mode
The converter can be configuring with command 1110b (write to the CFR) or command 1111b (default mode). A
write to the CFR requires a 4-bit command followed by 12-bits of data. A 4-bit command takes effect at the 4th
falling edge of SCLK. A CFR write takes effect at the 16th falling edge of SCLK.
A default mode command can be achieved by simply tying SDI to +VBD. As soon as the chip is selected at least
four 1s are clocked in by SCLK. The default value of the CFR is loaded into the CFR at the 4th falling edge of
SCLK.
CFR default values are all 1s (except for CFR_D1, this bit is ignored by the ADS8329 and is always read as a 0).
The same default values apply for the CFR after a power-on reset (POR) and SW reset.
READING THE CONFIGURATION REGISTER
The host processor can read back the value programmed in the CFR by issuing command 1100b. The timing is
similar to reading a conversion result except CONVST is not used and there is no activity on the EOC/INT pin.
The CFR value read back contains the first four MSBs of conversion data plus valid 12-bit CFR contents.
Table 4. Configuration Register (CFR) Map
SDI BIT
CFR - D[11 - 0]
DEFINITION
Channel select mode
D11 default = 1
D10 default = 1
D9 default = 1
D8 default = 1
D7 default = 1
D6 default = 1
D5 default = 1
D4 default = 1
D3 default = 1
D2 default = 1
D1 default =
0: ADS8329
1: ADS8330
D0 default = 1
0: Manual channel select enabled. Use channel select commands to
access a different channel.
1: Auto channel select enabled. All channels are sampled and
converted sequentially until the cycle after this bit is set to 0.
Conversion clock (CCLK) source select
0: Conversion clock (CCLK) = SCLK/2
1: Conversion clock (CCLK) = Internal OSC
Trigger (conversion start) select: start conversion at the end of sampling (EOS). If D9 = 0, the D4 setting is ignored.
0: Auto trigger automatically starts (4 internal clocks after EOC inactive)
1: Manual trigger manually started by falling edge of CONVST
Don't care
Don't care
Pin 10 polarity select when used as an output (EOC/INT)
0: EOC Active high / INT active high
1: EOC active low / INT active low
Pin 10 function select when used as an output (EOC/INT)
0: Pin used as INT
1: Pin used as EOC
Pin 10 I/O select for chain mode operation
0: Pin 10 is used as CDI input (chain mode enabled)
1: Pin 10 is used as EOC/INT output
Auto nap power-down enable/disable (mid voltage and comparator shut down between cycles). This bit setting is ignored if D9 = 0.
0: Auto nap power-down enabled (not activated)
1: Auto nap power-down disabled
Nap power-down (mid voltage and comparator shut down between cycles). This bit is set to 1 automatically by wake-up command.
0: Enable/activate device in nap power-down
1: Remove device from nap power-down (resume)
Deep power-down. This bit is set to 1 automatically by wake-up command.
0: Enable/activate device in deep power-down
1: Remove device from deep power-down (resume)
TAG bit enable. This bit is ignored by the ADS8329 and is always read 0.
0: TAG bit disabled.
1: TAG bit output enabled. TAG bit appears at the 17th SCLK.
Reset
0: System reset
1: Normal operation
READING CONVERSION RESULT
The conversion result is available to the input of the output data register (ODR) at EOC and presented to the
output of the output register at the next falling edge of CS or FS. The host processor can then shift the data out
via the SDO pin any time except during the quiet zone. This is 20 ns before and 20 ns after the end of sampling
(EOS) period. End of sampling (EOS) is defined as the falling edge of CONVST when manual trigger is used or
the end of the 3rd conversion clock (CCLK) after EOC if auto trigger is used.
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The falling edge of FS/CS should not be placed at the precise moment (minimum of at least one conversion
clock (CCLK) delay) at the end of a conversion (by default when EOC goes high), otherwise the data is corrupt. If
FS/CS is placed before the end of a conversion, the previous conversion result is read. If FS/CS is placed after
the end of a conversion, the current conversion result is read.
The conversion result is 16-bit data in straight binary format as shown in Table 4. Generally 16 SCLKs are
necessary, but there are exceptions where more than 16 SCLKS are required (see Table 6). Data output from
the serial output (SDO) is left adjusted MSB first. The trailing bits are filled with the TAG bit first (if enabled) plus
all zeros. SDO remains low until FS/CS is brought high again.
SDO is active when FS/CS is low. The rising edge of FS/CS 3-states the SDO output.
NOTE:
Whenever SDO is not in 3-state (when FS/CS is low and SCLK is running), a portion
of the conversion result is output at the SDO pin. The number of bits depends on how
many SCLKs are supplied. For example, a manual select channel command cycle
requires 4 SCLKs, therefore 4 MSBs of the conversion result are output at SDO. The
exception is SDO outputs all 1s during the cycle immediately after any reset (POR or
software reset).
If SCLK is used as the conversion clock (CCLK) and a continuous SCLK is used, it is not possible to clock out all
16 SDO bits during the sampling time (6 SCLKs) because of the quiet zone requirement. In this case it is better
to read the conversion result during the conversion time (36 SCLKs or 48 SCLKs in auto nap mode).
Table 5. Ideal Input Voltages and Output Codes
DESCRIPTION
ANALOG VALUE
DIGITAL OUTPUT
Full-scale range
VREF
STRAIGHT BINARY
Least significant bit (LSB)
VREF/65536
Full-scale
+VREF – 1 LSB
1111 1111 1111 1111
FFFF
Midscale
VREF/2
1000 0000 0000 0000
8000
Midscale – 1 LSB
VREF/2– 1 LSB
0111 1111 1111 1111
7FFF
Zero
0V
0000 0000 0000 0000
0000
BINARY CODE
HEX CODE
TAG Mode
The ADS8330 includes a feature, TAG, that can be used as a tag to indicate which channel sourced the
converted result. An address bit is added after the LSB read out from SDO indicating which channel the result
came from if TAG mode is enabled. This address bit is 0 for channel 0 and 1 for channel 1. The converter
requires more than the 16 SCLKs that are required for a 4 bit command plus 12 bit CFR or 16 data bits because
of the additional TAG bit.
Chain Mode
The ADS8329/30 can operate as a single converter or in a system with multiple converters. System designers
can take advantage of the simple high-speed SPI compatible serial interface by cascading them in a single chain
when multiple converters are used. A bit in the CFR is used to reconfigure the EOC/INT status pin as a
secondary serial data input, chain data input (CDI), for the conversion result from an upstream converter. This is
chain mode operation. A typical connection of three converters is shown in Figure 59.
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Micro Controller
INT
GPIO1
GPIO2
SDI SCLK CONVST
CS
ADS8329
#1
SDO
EOC/INT
SDOSCLK
GPIO3
SDI SCLK CONVST
CS
ADS8329
#3
CDI
SDO
SDI SCLK CONVST
CS
ADS8329
#2
CDI
SDO
Program device #1 CFR_D[7:5] = XX0b
SDI
Program device #2 and #3 CFR_D[7:5] = XX1b
Figure 59. Multiple Converters Connected Using Chain Mode
When multiple converters are used in chain mode, the first converter is configured in regular mode while the rest
of the converters downstream are configured in chain mode. When a converter is configured in chain mode, the
CDI input data goes straight to the output register, therefore the serial input data passes through the converter
with a 16 SCLK (if the TAG feature is disabled) or a 24 SCLK delay, as long as CS is active. See Figure 60 for
detailed timing. In this timing the conversion in each converters are done simultaneously.
INT #3
(active low)
Nth
EOS
EOC #1
(active low)
EOC
CONVST #1,
CONVST #2,
CONVST #3
EOS
Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC active low, and INT active low) CS held
low during the N times 16 bits transfer cycle.
tSAMPLE1 = 3 CCLKs min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
SDO #1,
CDI #2
1 . . . . . . . . . . . . . . . . . . 16
1 . . . . . . . . . . . . . . . . . . 16
1 . . . . . . . . . . . . . . . . . . 16
Hi-Z
Hi-Z
Nth from #1
td(CSR-EOS) = 20 ns min
CS/FS #2,
CS/FS #3
SDO #2,
CDI #3
SDO #3
td(SDO-CDI)
Hi-Z
Hi-Z
N − 1th from #2
Nth from #1
Nth from #1
td(SDO-CDI)
Hi-Z
Hi-Z
Nth from #3
SDI #1,
SDI #2,
SDI #3
1110............
CONFIGURE
N − 1th from #2
1101b
READ Result
Nth from #1
1101b
READ Result
Figure 60. Simplified Cascade Mode Timing with Shared CONVST and Continuous CS
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Care must be given to handle the multiple CS signals when the converters are operating in chain mode. The
different chip select signals must be low for the entire data transfer (in this example 48 bits for three converters).
The first 16-bit word after the falling chip select is always the data from the chip that received the chip select
signal.
Case 1: If chip select is not toggled (CS stays low), the next 16 bits are data from the upstream converter, and so
on. This is shown in Figure 60. If there is no upstream converter in the chain, as converter #1 in the example, the
same data from the converter is going to be shown repeatedly.
Case 2: If the chip select is toggled during a chain mode data transfer cycle, as illustrated in Figure 61, the same
data from the converter is read out again and again in all three discrete 16-bit cycles. This is not a desired result.
INT #1
(active low)
Nth
EOS
EOC #1
(active low)
EOC
CONVST #1,
CONVST #2,
CONVST #3
EOS
Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC, and INT polarity programmed as active low)
CS held low during the N times 16 bits transfer cycle.
tSAMPLE1 = 3 CCLKs min
td(EOS-CSF) = 20 ns min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
16
1
SDO #1,
CDI #2
1
16
Nth from #1
CS/FS #2
SCLK #2,
SDO #2,
CDI #3
N − 1th from #2
CS/FS #3
1
16
Nth from #1
Nth from #1
td(EOS-CSF) =
td(CSR-EOS) =
20 ns min
20 ns min
Nth from #1
td(EOS-CSF) =
20 ns min
Nth from #1
td(CSR-EOS) =
20 ns min
SDO #3
SDI #1,
SDI #2,
SDI #3
Nth from #3
1110............
CONFIGURE
N − 1th from #2
Nth from #1
1101b
1101b
READ Result
READ Result
Figure 61. Simplified Cascade Mode Timing with Shared CONVST and Discrete CS
Figure 62 shows a slightly different scenario where CONVST is not shared by the second converter. Converters
#1 and #3 have the same CONVST signal. In this case, converter #2 simply passes previous conversion data
downstream.
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Cascaded Manual Trigger/Read While Sampling
(Use internal CCLK, EOC active low and INT active low)
CS held low during the N times 16 bits transfer cycle.
Note : old data shown.
INT #1
(active low)
Nth
EOS
EOC #1
(active low)
EOC
CONVST #2 = 1
EOS
CONVST #1,
CONVST #3
tSAMPLE1 = 3 CCLKs min
tCONV = 18 CCLKs
td(CSR-EOS) = 20 ns min
CS/FS #1
SCLK #1,
SCLK #2,
SCLK #3
1 . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . .16
1 . . . . . . . . . . . . . . . . . .16
Hi-Z
SDO #1,
CDI #2
Hi-Z
Nth from #1
td(CSR-EOS) = 20 ns min
CS/FS #2,
CS/FS #3
td(SDO-CDI)
SDO #2,
CDI #3
Hi-Z
SDO #3
Hi-Z
Hi-Z
Nth from #1
N − 1th from #2
td(SDO-CDI)
SDI #1,
SDI #2,
SDI #3
Hi-Z
N − 1th from #2
Nth from #3
1110............
CONFIGURE
1101b
Nth from #1
1101b
READ Result
READ Result
Figure 62. Simplified Cascade Timing (Separate CONVST)
The number of SCLKs required for a serial read cycle depends on the combination of different read modes, TAG
bit, chain mode, and the way a channel is selected (that is, auto channel select). This is listed in Table 6.
Table 6. Required SCLKs For Different Read Out Mode Combinations
CHAIN MODE
AUTO CHANNEL
ENABLED CFR.D5 SELECT CFR.D11
TAG ENABLED CFR.D1
NUMBER OF SCLK PER SPI
READ
TRAILING BITS
0
0
0
16
None
0
0
1
≥17
MSB is TAG bit plus zero(s)
0
1
0
16
None
0
1
1
≥17
TAG bit plus 7 zeros
1
0
0
16
None
1
0
1
24
TAG bit plus 7 zeros
1
1
0
16
None
1
1
1
24
TAG bit plus 7 zeros
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SCLK skew between converters and data path delay through the converters configured in chain mode can affect
the maximum frequency of SCLK. The delay can also be affected by supply voltage and loading. It may be
necessary to slow down the SCLK when the devices are configured in chain mode.
ADS8329 # 3
CDI
SDO
Logic
D
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
2.7 ns
Serial data
output
Logic
Delay
Plus PAD
8.3 ns
Q
CLK
ADS8329 # 2
SDO
CDI
Logic
D
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
2.7 ns
Logic
Delay
Plus PAD
8.3 ns
Q
CLK
ADS8329 # 1
CDI
Serial data
input
SDO
Logic
Delay
Plus PAD
2.7 ns
D
Logic
Delay
< = 8 .3 ns
Logic
Delay
Plus PAD
8.3 ns
Q
CLK
SCLK input
Figure 63. Typical Delay Through Converters Configured in Chain Mode
RESET
The converter has two reset mechanisms, a power-on reset (POR) and a software reset using CFR_D0. These
two mechanisms are NOR-ed internally. When a reset (software or POR) is issued, all register data are set to the
default values (all 1s) and the SDO output (during the cycle immediately after reset) is set to all 1s. The state
machine is reset to the power-on state.
SW RESET
CDI
POR
SET
SAR Shift
Register
Intermediate
Latch
Output
Register
Conversion Clock
Latched by End Of
Conversion
SDO
SCLK
Latched by Falling Edge of CS
CS
EOC
EOC
Figure 64. Digital Output Under Reset Condition
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When the device is powered up, the POR sets the device to default mode when AVDD reaches 1.5V. When the
device is powered down, the POR circuit requires AVDD to remain below 125mV for at least 350ms to ensure
proper discharging of internal capacitors and to correct the behavior of the ADC when powered up again. If
AVDD drops below 400mV but remains above 125mV, the internal POR capacitor does not discharge fully and
the device requires a software reset to perform correctly after the recovery of AVDD (this condition is shown as
the undefined zone in Figure 65).
AVDD (V)
5.500
5.000
Specified Supply
Voltage Range
4.000
3.000
2.700
2.000
POR
Trigger Level
1.500
1.000
0.400
0.125
Undefined Zone
0
0.350
t (s)
Figure 65. Relevant Voltage Levels for POR
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APPLICATION INFORMATION
TYPICAL CONNECTION
Analog +5 V
4.7 mF
AGND
Ext Ref Input
22 mF
Analog Input
AGND
+VA REF+ REF− AGND IN+ IN−
Host
Processor
FS/CS
SDO
SDI
SCLK
Interface
Supply
+1.8 V
ADS8329
BDGND
CONVST
4.7 mF
EOC/INT
+VBD
Figure 66. Typical Circuit Configuration
Part Change Notification # 20071101001
The ADS8329 and ADS8330 devices underwent a silicon change under Texas Instruments Part Change
Notification (PCN) number 20071101001. Details on this part change can be obtained from the Product
Information Center at Texas Instruments or by contacting your local sales/distribution office. Devices with a date
code of 82xx and higher are covered by this PCN.
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (March 2008) to Revision C .................................................................................................. Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added 12- and 14-bit rows to family table ............................................................................................................................. 1
Added +REF to AGND and –REF to AGND rows to the Voltage range parameter of the Absolute Maximum Ratings
table ....................................................................................................................................................................................... 2
Changed conditions for 4.5-V Electrical Characteristics........................................................................................................ 3
Changed typ and max specifications for the VREF[(REF+) – (REF–)] parameter in the 4.5-V Electrical Characteristics ...... 4
Changed NAP/Auto-NAP and Deep power-down test conditions of the Supply Current parameter in the 4.5-V
Electrical Characteristics........................................................................................................................................................ 4
Changed conditions for the 2.7-V Electrical Characteristics.................................................................................................. 5
Changed VREF[(REF+) – (REF–)] parameter in the 2.7-V Electrical Characteristics ............................................................. 6
Changed NAP/Auto-NAP and Deep power-down test conditions of the Supply Current parameter in the
Power-Supply Requirements section of the 2.7-V Electrical Characteristics table................................................................ 7
Corrected typo in Figure 1 ................................................................................................................................................... 12
Changed SDO trace of Figure 2 .......................................................................................................................................... 12
Corrected typo in Figure 3 ................................................................................................................................................... 13
Changed SDO trace in Figure 4 .......................................................................................................................................... 13
Corrected typo in Figure 6 ................................................................................................................................................... 14
Added last sentence to Driver Amplifier Choice section...................................................................................................... 23
Updated Figure 52 ............................................................................................................................................................... 24
Updated Figure 53 ............................................................................................................................................................... 24
Changed fifth sentence of Deep Power-Down Mode section .............................................................................................. 27
Changed second sentence of Nap Mode section................................................................................................................ 27
Changed fifth sentence of Auto Nap Mode section ............................................................................................................. 27
Changed power consumption and activation time column values of Table 2...................................................................... 27
Added Figure 65 and corresponding paragraph to RESET section .................................................................................... 37
Changes from Revision A (March 2008) to Revision B .................................................................................................. Page
•
•
•
•
•
•
•
•
Added 16-Pin TSSOP to Features bullet to indicate new package availability ..................................................................... 1
Added 16-Pin TSSOP to third Description paragraph bullet to indicate new package availability ........................................ 1
Changed the Ordering Information table to reflect TSSOP package availability................................................................... 2
Changed Absolute Maximum Ratings table to reflect TSSOP package availability .............................................................. 2
Added pinouts for PW package for both ADS8329 and ADS8330...................................................................................... 10
Added TSSOP column to the ADS8329 Terminal Functions table...................................................................................... 11
Added TSSOP column to the ADS8330 Terminal Functions table...................................................................................... 11
Changed the Part Change Notification section.................................................................................................................... 38
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS8329IBPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
B
ADS8329IBRSAR
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IBRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IBRSATG4
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IRSAR
ACTIVE
QFN
RSA
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8329IRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8329I A
ADS8330IBPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
B
ADS8330IBPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
B
ADS8330IBPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
B
ADS8330IBRSAR
ACTIVE
QFN
RSA
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
ADS8330IBRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
ADS8330IPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
24-Aug-2018
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS8330IPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
ADS8330IRSAT
ACTIVE
QFN
RSA
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
ADS
8330I A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS8329IBRSAR
Package Package Pins
Type Drawing
QFN
RSA
16
ADS8329IBRSAT
QFN
RSA
ADS8329IPWR
TSSOP
PW
ADS8329IRSAR
QFN
ADS8329IRSAT
QFN
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3000
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
16
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
RSA
16
2000
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
RSA
16
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
ADS8330IBPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
ADS8330IBRSAR
QFN
RSA
16
3000
330.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
ADS8330IBRSAT
QFN
RSA
16
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
ADS8330IPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
ADS8330IRSAT
QFN
RSA
16
250
180.0
12.4
4.3
4.3
1.5
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8329IBRSAR
QFN
RSA
16
3000
350.0
350.0
43.0
ADS8329IBRSAT
QFN
RSA
16
250
210.0
185.0
35.0
ADS8329IPWR
TSSOP
PW
16
2000
350.0
350.0
43.0
ADS8329IRSAR
QFN
RSA
16
2000
350.0
350.0
43.0
ADS8329IRSAT
QFN
RSA
16
250
210.0
185.0
35.0
ADS8330IBPWR
TSSOP
PW
16
2000
350.0
350.0
43.0
ADS8330IBRSAR
QFN
RSA
16
3000
350.0
350.0
43.0
ADS8330IBRSAT
QFN
RSA
16
250
210.0
185.0
35.0
ADS8330IPWR
TSSOP
PW
16
2000
350.0
350.0
43.0
ADS8330IRSAT
QFN
RSA
16
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
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damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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