Texas Instruments | 1.2V to 3.6V, 12-Bit, Nanopower. 4-Wire, Micro Touch Screen Controller with SPI (Rev. B) | Datasheet | Texas Instruments 1.2V to 3.6V, 12-Bit, Nanopower. 4-Wire, Micro Touch Screen Controller with SPI (Rev. B) Datasheet

Texas Instruments 1.2V to 3.6V, 12-Bit, Nanopower. 4-Wire, Micro Touch Screen Controller with SPI (Rev. B) Datasheet
TSC2008
TS
C20
08
www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire
Micro TOUCH SCREEN CONTROLLER with SPI™
FEATURES
APPLICATIONS
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1
234
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4-Wire Touch Screen Interface
Single 1.2V to 3.6V Supply/Reference
Ratiometric Conversion
Effective Throughput Rate:
– Up to 20kHz (8-Bit) or 10kHz (12-Bit)
Preprocessing to Reduce Bus Activity
High-Speed SPI (up to 25MHz)
Simple Command-Based User Interface:
– TSC2046 Compatible
– 8- or 12-Bit Resolution
On-Chip Temperature Measurement
Touch Pressure Measurement
Digital Buffered PENIRQ
On-Chip, Programmable PENIRQ Pull-up
Auto Power-Down Control
Low Power (12-Bit, 8.2kHz Eq Rate):
– 30.4µA at 1.2V, fSCLK = 5MHz
– 35.5µA at 1.8V, fSCLK = 10MHz
– 44.6µA at 2.7V, fSCLK = 10MHz
Power-On, Software, and SureSet™ Resets
Enhanced ESD Protection:
– ±8kV HBM
– ±1kV CDM
– ±25kV Air Gap Discharge
– ±15kV Contact Discharge
1.5 x 2 WCSP-12 and 4 x 4 QFN-16 Packages
Cellular Phones
PDA, GPS, and Media Players
Portable Instruments
Point-of-Sale Terminals
Multi-Screen Touch Control Systems
DESCRIPTION
The TSC2008 is a very low-power touch screen
controller designed to work with power-sensitive,
handheld applications that are based on advanced
low-voltage processors. It works with a supply voltage
as low as 1.2V, which can be supplied by a
single-cell battery. It contains a complete, ultra-low
power, 12-bit, analog-to-digital (A/D) resistive touch
screen converter, including drivers and the control
logic to measure touch pressure.
In addition to these standard features, the TSC2008
offers
preprocessing
of
the
touch
screen
measurements to reduce bus loading, thus reducing
the consumption of host processor resources that can
then be redirected to more critical functions.
The TSC2008 supports an SPI serial bus and data
transmission. It offers programmable resolution of 8
or 12 bits to accommodate different screen sizes and
performance needs.
The TSC2008 is available in a 12-lead,
(1,555 ±0,055mm) x (2,055 ±0,055mm) 3 x 4 array,
wafer chip-scale package (WCSP), and a 16-pin,
4 x 4 QFN package. The TSC2008 is characterized
for the –40°C to +85°C industrial temperature range.
U.S. Patent No. 6246394; other patents pending.
VDD/REF
X+
XY+
Y-
Touch
Screen
Sensor
Drivers
Mux
SAR
ADC
TEMP
AUX
Internal
Clock
Preprocessing
PENIRQ
SPI
Serial
Interface
and
Control
CS
SCLK
SDI
SDO
GND
1
2
3
4
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SureSet is a trademark of Texas Instruments.
SPI is a trademark of Motorola Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2009, Texas Instruments Incorporated
TSC2008
SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
TYPICAL
INTEGRAL
LINEARITY
(LSB)
TSC2008
(1)
TYPICAL
GAIN
ERROR
(LSB)
±1.5
NO MISSING
CODES
RESOLUTION
(BITS)
0.7
PACKAGE
TYPE
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
16-Pin,
4x4
QFN
RGV
–40°C to +85°C
TSC2008I
12-Pin,
3 x 4 Matrix,
1.5 x 2
WCSP
YZG
ORDERING
NUMBER
TSC2008IRGVT
Small Tape
and Reel, 250
TSC2008IRGVR
Tape and
Reel, 2500
TSC2008IYZGT
Small Tape
and Reel, 250
TSC2008IYZGR
Tape and
Reel, 3000
11
–40°C to +85°C
TRANSPORT
MEDIA,
QUANTITY
TSC2008I
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
TSC2008
UNIT
Analog input X+, Y+, AUX to GND
–0.4 to VDD + 0.1
V
Analog input X–, Y– to GND
–0.4 to VDD + 0.1
V
–0.3 to +5
V
Digital input voltage to GND
–0.3 to VDD + 0.3
V
Digital output voltage to GND
–0.3 to VDD + 0.3
V
Power dissipation
(TJ Max - TA)/θJA
Voltage
Voltage range
VDD to GND
QFN package
Thermal impedance, θJA
WCSP
Low-K
High-K
47
°C/W
113
°C/W
62
°C/W
Operating free-air temperature range, TA
–40 to +85
°C
Storage temperature range, TSTG
–65 to +150
°C
Junction temperature, TJ Max
Lead temperature
IEC contact discharge
(2)
IEC air discharge (2)
(1)
(2)
2
+150
°C
Vapor phase (60 sec)
+215
°C
Infrared (15 sec)
+220
°C
X+, X–, Y+, Y–
±15
kV
X+, X–, Y+, Y–
±25
kV
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
Test method based on IEC standard 61000-4-2. Device powered by battery. Contact Texas Instruments for test details.
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ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted.
TSC2008
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
AUXILIARY ANALOG INPUT
Input voltage range
0
Input capacitance
VDD
12
Input leakage current
–1
V
pF
+1
µA
12
Bits
A/D CONVERTER
Resolution
Programmable: 8 or 12 bits
No missing codes
12-bit resolution
11
Integral linearity
Bits
LSB (1)
±1.5
Differential linearity
Offset error
Gain error
±1
LSB
VDD = 1.8V
–1.2
LSB
VDD = 3.0V
–3.1
LSB
VDD = 1.8V
0.7
LSB
VDD = 3.0V
0.1
LSB
TA = +25°C, VDD = 1.8V, setup command '10100000'
50
kΩ
TA = +25°C, VDD = 1.8V, setup command '10101000'
90
kΩ
6
Ω
TOUCH SENSORS
PENIRQ pull-up resistor, RIRQ
Switch
on-resistance
Y+, X+
Y–, X–
Switch drivers drive current (2)
Ω
5
100ms duration
50
mA
INTERNAL TEMPERATURE SENSOR
Temperature range
–40
Differential
method (3)
Resolution
TEMP1 (4)
Differential
method (3)
Accuracy
TEMP1 (4)
+85
°C
VDD = 3V
1.94
°C/LSB
VDD = 1.6V
1.04
°C/LSB
VDD = 3V
0.35
°C/LSB
VDD = 1.6V
0.19
°C/LSB
VDD = 3V
±2
°C/LSB
VDD = 1.6V
±2
°C/LSB
VDD = 3V
±3
°C/LSB
VDD = 1.6V
±3
°C/LSB
VDD = 1.2V
3.19
MHz
VDD = 1.8V
3.66
MHz
VDD = 2.7V
3.78
MHz
VDD = 3.6V
3.82
MHz
VDD = 1.2V
1.6
MHz
VDD = 1.8V
1.83
MHz
VDD = 2.7V
1.88
MHz
INTERNAL OSCILLATOR
8-bit
Internal clock frequency, fCCLK
12-bit
VDD = 3.6V
Frequency drift
(1)
(2)
(3)
(4)
1.91
MHz
VDD = 1.6V
0.0056
%/°C
VDD = 3.0V
0.012
%/°C
LSB means least significant bit. With VDD (REF) = +2.5V, 1LSB is 610µV.
Assured by design, but not production tested. Exceeding 50mA source current may result in device degradation.
Difference between TEMP1 and TEMP2 measurement; no calibration necessary.
Temperature drift is –2.1mV/°C.
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ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, unless otherwise noted.
TSC2008
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
DIGITAL INPUT/OUTPUT
Logic family
CMOS
VIH
VIL
Logic level
1.2V ≤ VDD < 3.6V
0.7 × VDD
VDD + 0.3
V
1.2V ≤ VDD < 1.6V
–0.3
0.2 × VDD
V
1.6V ≤ VDD ≤ 3.6V
–0.3
0.3 × VDD
V
–1
1
µA
IIL
CS, SCLK, and SDI pins
CIN
CS, SCLK, and SDI pins
10
pF
VOH
IOH = 2 TTL loads
VDD – 0.2
VDD
V
VOL
IOL = 2 TTL loads
0
0.2
V
ILEAK
Floating output
–1
1
µA
COUT
Floating output
10
pF
Data format
Straight Binary
POWER SUPPLY REQUIREMENTS
Power-supply voltage
VDD
Specified performance
12-bit,
fSCLK = 5MHz,
fADC = 2MHz,
PD[1:0] = 0,0
Quiescent supply current
(VDD with sensor off)
Power-down supply current
12-bit,
fSCLK = 10MHz,
fADC = 2MHz,
PD[1:0] = 0,0
VDD = 1.2V
VDD = 1.8V
3.6
V
69.6k eq rate (5)
1.2
285.0
320.0
µA
8.2k eq rate (5)
30.4
37.7
µA
82.6k eq rate (5)
344.0
425.0
µA
34.5
42.2
µA
84.8k eq rate (5)
461.0
570.0
µA
8.2k eq rate (5)
44.6
55.1
µA
CS = 1, SDI = SCLK = 1, PENIRQ = 1, PD[1:0] = 0,0
0
0.8
µA
VDD = 2.7V
8.2k eq rate
(5)
POWER ON/OFF SLOPE REQUIREMENTS (see Figure 37)
tVDD_OFF_RAMP
TA = –40°C to +85°C
2
kV/s
TA = –40°C to +85°C, VDD = 0V
1
s
TA = –20°C to +85°C, VDD = 0V
0.3
s
tVDD_ON_RAMP
TA = –40°C to +85°C
12
kV/s
tDEVICE_READY
TA = –40°C to +85°C
2
ms
tVDD_OFF
(5)
4
See the Throughput Rate and SPI Bus Traffic section for calculation information.
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PIN CONFIGURATION
YZG PACKAGE
WCSP-12
(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)
Y-
GND
NC
AUX
RGV PACKAGE(1)
4 x 4 QFN-16
(TOP VIEW)
VDD/REF
X+
Y+
X-
SCLK
GND
AUX
Y-
CS
SDI
SDO
PENIRQ
A
B
C
D
3
NC
13
NC
14
11
10
9
Rows
12
8
X-
7
Y+
6
X+
5
VDD/REF
TSC2008
PENIRQ
15
SDO
16
Thermal Pad
2
1
Columns
(1)
3
4
SCLK
(FRONT VIEW)
CS
2
SDI
NC
1
The thermal pad is internally connected to
the substrate. The thermal pad can be
connected to the analog ground or left
floating. Keep the thermal pad separate
from the digital ground, if possible.
PIN ASSIGNMENTS
PIN NO.
QFN
WCSP
PIN
NAME
1
—
NC
2
B1
3
I/O
A/D
DESCRIPTION
SDI
I
D
Serial data input
A1
CS
I
D
Chip select
4
A2
SCLK
I
D
Serial clock input
5
A3
VDD/REF
6
B3
X+
I
A
X+ channel input
7
C3
Y+
I
A
Y+ channel input
8
D3
X–
I
A
X– channel input
9
D2
Y–
I
A
Y– channel input
10
B2
GND
11
—
NC
12
C2
AUX
13
—
NC
No connection
14
—
NC
No connection
15
D1
PENIRQ
O
D
Pen touch interrupt output. Active low when pen is touched. The output remains low until conversion is
complete or pen touch is released. The rising edge signals the end of conversion (EOC).
16
C1
SDO
O
D
Serial data output
No connection
Supply voltage and external reference input
Ground
No connection
I
A
Auxiliary channel input. If not used, this input should be grounded.
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TIMING INFORMATION
The TSC2008 supports SPI programming in mode CPOL = 0 and CPHA = 0. The falling edge of SCLK is used to
change the output (MISO) data, and the rising edge is used to latch the input (MOSI) data. Eight SCLKs are
required to complete the command byte cycle, and an additional eight or 16 SCLKs are required for the data to
be read, depending on the mode used.
CS (SS)
tC(SCLK)
tWH(SCLK)
tF
tR
tWL(SCLK)
SCLK
tWH(CS)
tSU(SCLKF-CSR)
tSU(CSF-SCLK1R)
tH(SCLKF-SDOVALID)
SDO (MISO)
MSB OUT
tDIS(CSR-SDOZ)
BIT 1
BIT 0
BIT 1
BIT 0
tD(CSF-SDOVALID)
tSU(SDI-SCLKR)
tH(SDI-SCLKR)
SDI (MOSI)
MSB IN
NOTE: CPOL = 0, CPHA = 0, Byte 0 cycle requires 24 SCLKs, and Byte 1 cycle requires 8 SCLKs.
Figure 1. Detailed I/O Timing
CS
SCLK
tD(SCLKF-PENIRQF)
PENIRQ/BUSY
(TSC2008)
tSU(PENIRQR-SCLKR)
tD(SCLKR -PENIRQF)
Figure 2. PENIRQ Timing
6
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TIMING REQUIREMENTS (1)
All specifications typical at –40°C to +85°C, VDD = 1.6V, unless otherwise noted.
PARAMETER
tC(SCLK)
SPI serial clock cycle time
TEST CONDITIONS
SPI serial clock frequency
MAX
UNIT
182
ns
1.6 ≤ VDD < 2.7V, 40% to 60% duty cycle
62.5
ns
2.7V ≤ VDD ≤ 3.6V, 40% to 60% duty cycle
fSCLK
MIN
1.2V ≤ VDD < 1.6V, 40% to 60% duty cycle
40
ns
1.2V ≤ VDD < 1.6V, 10pF load
5.5
MHz
1.6 ≤ VDD < 2.7V, 10pF load
16
MHz
2.7V ≤ VDD ≤ 3.6V, 10pF load
25
MHz
tWH(SCLK)
SPI serial clock high time
0.4 × tC(SCLK)
0.6 × tC(SCLK)
ns
tWL(SCLK)
SPI serial clock low time
0.4 × tC(SCLK)
0.6 × tC(SCLK)
ns
tSU(CSF-SCLK1R)
tD(CSF-SDOVALID)
tH(SCLKF-SDOVALID)
tWH(CS)
Enable lead time
Slave access time
MISO data hold time
Sequential transfer delay
tSU(SDI-SCLKR)
MOSI data setup time
tH(SDI-SCLKR)
MOSI data hold time
tDIS(CSR-SDOZ)
Slave MISO disable time
1.2V ≤ VDD < 1.6V
22
1.6 ≤ VDD < 3.6V
14
ns
ns
1.2V ≤ VDD < 1.6V
55
ns
1.6 ≤ VDD < 3.6V
25
ns
40
80
ns
6
30
ns
1.2V ≤ VDD < 1.6V
1.6 ≤ VDD < 3.6V
1.2V ≤ VDD < 1.6V
50
ns
1.6 ≤ VDD < 3.6V
20
ns
1.2V ≤ VDD < 1.6V
25
ns
1.6 ≤ VDD < 3.6V
10
ns
5
ns
1.2V ≤ VDD < 1.6V
55
ns
1.6 ≤ VDD < 3.6V
25
ns
1.2V ≤ VDD < 1.6V
50
1.6 ≤ VDD < 3.6V
20
ns
tSU(SCLKF-CSR)
Enable lag time
tD(SCLKR-PENIRQF)
1.2V ≤ VDD < 1.6V
PENIRQ (used as BUSY)
delay from SCLK rising edge 1.6 ≤ VDD < 3.6V
tSU(PENIRQR-SCLKR)
Setup time from PENIRQ
1.2V ≤ VDD < 1.6V
(used as BUSY) to the rising
1.6 ≤ VDD < 3.6V
edge of SCLK
tD(RESET)
Reset period requirement
tR
Rise time
VDD = 3V, fSCLK = 25MHz
3
ns
tF
Fall time
VDD = 3V, fSCLK = 25MHz
3
ns
(1)
ns
55
ns
25
ns
50
ns
20
ns
200
ns
All input signals are specified with tR = tF = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2.
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TYPICAL CHARACTERISTICS
At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode,
non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
POWER-DOWN SUPPLY CURRENT
vs TEMPERATURE
SUPPLY CURRENT
vs TEMPERATURE
450
VDD = 3.0V
VDD = 3.6V
60
40
VDD = 1.6V
SPI = 5MHz
350
SPI = 2.5MHz
300
250
20
200
0
-40
-20
0
20
40
60
80
100
Temperature (°C)
20
40
Temperature (°C)
Figure 3.
Figure 4.
SUPPLY CURRENT
AUX CONVERSION
SUPPLY CURRENT
vs SUPPLY VOLTAGE
-40
650
0
-20
200
Supply Current (mA)
550
500
SPI = 10MHz
450
400
SPI = 5MHz
350
SPI = 2.5MHz
300
250
150
X,Y, Z Conversion at 200SSPS
Touch Sensor Modeled By:
2kW for X-Plane
2kW for Y-Plane
1kW for Z (Touch Resistance)
TA = +25°C
100
With MAV,
SPI = 5MHz
50
MAV Bypassed,
SPI = 5MHz
150
0
1.2
1.6
2.0
2.4
VDD (V)
2.8
3.2
1.2
3.6
1.6
2.0
2.4
VDD (V)
2.8
3.2
Figure 5.
Figure 6.
SUPPLY CURRENT (Part Not Addressed)
vs TEMPERATURE
SUPPLY CURRENT (Part Not Addressed)
vs SUPPLY VOLTAGE
30
3.6
100
90
25
SPI = 10MHz
80
SPI = 10MHz
Supply Current (mA)
Supply Current (mA)
80
100
200
20
15
SPI = 5MHz
10
70
60
50
SPI = 5MHz
40
30
SPI = 2.5MHz
20
5
SPI = 2.5MHz
10
0
0
-40
-20
0
20
40
Temperature (°C)
60
80
100
1.2
Figure 7.
8
60
250
600
Supply Current (mA)
SPI = 10MHz
400
80
Supply Current (mA)
Power-Down Supply Current (nA)
100
1.6
2.0
2.4
VDD (V)
2.8
3.2
3.6
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode,
non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
CHANGE IN GAIN
vs TEMPERATURE
CHANGE IN OFFSET
vs TEMPERATURE
2
2
VDD = 1.8V
Delta from +25°C (LSB)
Delta from +25°C (LSB)
VDD = 1.8V
1
0
-1
-2
1
0
-1
-2
-40
0
-20
20
40
Temperature (°C)
60
80
100
-40
20
40
Temperature (°C)
60
80
Figure 9.
Figure 10.
SWITCH ON-RESISTANCE
vs SUPPLY VOLTAGE
SWITCH ON-RESISTANCE
vs TEMPERATURE
100
6
11
X+, Y+: VDD = 3.0V to Pin
X-, Y-: Pin to GND
10
Y+
X+
5
9
Y+
8
RON (W)
RON (W)
0
-20
X+
7
YX-
4
6
Y-
5
3
X-
4
2
3
8
7
1.6
2.0
2.4
VDD (V)
2.8
3.2
3.6
-20
0
20
40
Temperature (°C)
60
Figure 11.
Figure 12.
SWITCH ON-RESISTANCE
vs TEMPERATURE
TEMP DIODE VOLTAGE
vs TEMPERATURE
850
X+, Y+: VDD = 1.8V to Pin
X-, Y-: Pin to GND
X+
YX-
5
4
3
750
80
100
Measurement Includes
A/D Converter Offset
and Gain Errors
800
Y+
6
RON (W)
-40
TEMP Diode Voltage (mV)
1.2
95.7mV
TEMP2
700
650
600
TEMP1
550
136mV
500
450
VDD = 1.8V
400
2
-40
-20
0
20
40
Temperature (°C)
60
80
100
-40
Figure 13.
-20
0
20
40
Temperature (°C)
60
80
100
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, VDD = +1.2V to +3.6V, PD1 = PD0 = 0, fSCLK = 10MHz, fADC = fOSC/2 = 2MHz, 12-bit mode,
non-continuous AUX measurement, and MAV filter enabled (see MAV Filter section), unless otherwise noted.
TEMP1 DIODE VOLTAGE
vs SUPPLY VOLTAGE
TEMP2 DIODE VOLTAGE
vs SUPPLY VOLTAGE
704
586
584
582
580
578
576
VDD = VREF = 1.8V
574
1.2
Internal Oscillator Clock Frequency (MHz)
TEMP2 Diode Voltage (mV)
Measurement Includes
A/D Converter Offset
and Gain Errors
1.6
2.0
Measurement Includes
A/D Converter Offset
and Gain Errors
702
700
698
696
694
692
VDD = VREF = 1.8V
690
2.4
VDD (V)
2.8
3.2
1.2
3.6
1.6
2.0
2.4
VDD (V)
2.8
3.2
3.6
Figure 15.
Figure 16.
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
3.40
Internal Oscillator Clock Frequency (MHz)
TEMP1 Diode Voltage (mV)
588
3.30
3.20
3.10
3.00
2.90
2.80
VDD = 1.2V
2.70
-40
-20
0
20
40
Temperature (°C)
60
80
3.70
3.69
3.68
3.67
3.66
3.65
3.64
3.63
3.62
3.61
VDD = 1.8V
3.60
100
-40
-20
0
Figure 17.
20
40
Temperature (°C)
60
80
100
Figure 18.
Internal Oscillator Clock Frequency (MHz)
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
3.90
3.85
3.80
3.75
VDD = 3.0V
3.70
-40
-20
0
20
40
Temperature (°C)
60
80
100
Figure 19.
10
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OVERVIEW
The TSC2008 is an analog interface circuit for a human interface touch screen device. All peripheral functions
are controlled through the command byte and onboard state machines. While maintaining similarity in hardware,
command, and software to its predecessor, the TSC2046 (or TSC2046E), the TSC2008 includes significant
improvements such as:
• Much stronger and more comprehensive electrostatic discharge (ESD) protection
• Uses only 1/13 power for equivalent performance
• 1/7 bus traffic
• 3/16 size
• Direct 1.8V interface
• Prudent reset scheme
• Saves 1/7 power if 8-bit SDO adjusted output mode used
The TSC2008 consists of the following blocks (refer to the block diagram on the front page):
• Touch Screen Sensor Drivers
• Auxiliary Input (AUX)
• Temperature Sensor
• Acquisition Activity Preprocessing
• Internal Conversion Clock
• SPI Interface
Communication with the TSC2008 is done via an SPI serial interface. The TSC2008 is an SPI slave device;
therefore, data are shifted into or out of the TSC2008 under the control of the host microprocessor, which also
provides the serial data clock.
Control of the TSC2008 and its functions is accomplished by writing to the command register of an internal state
machine. A simple command protocol (compatible with SPI) is used to address this register.
A typical application of the TSC2008 is shown in Figure 20.
1.8VDC
1mF to
10mF
0.1mF
Host
Processor
X+
VDD/REF
GND
PENIRQ
SDO
Y+
TSC2008
X-
CS
Y-
Auxilary Input
SDI
SCLK
GPIO
SDO
GND
SDI
AUX
Touch
Screen
SCLK
GPIO
GND
Figure 20. Typical Circuit Configuration
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TOUCH SCREEN OPERATION
A resistive touch screen operates by applying a voltage across a resistor network and measuring the change in
resistance at a given point on the matrix where the screen is touched by an input (stylus, pen, or finger). The
change in the resistance ratio marks the location on the touch screen.
The TSC2008 supports resistive 4-wire configurations, as shown in Figure 21. The circuit determines location in
two coordinate pair dimensions, although a third dimension can be added for measuring pressure.
4-WIRE TOUCH SCREEN COORDINATE PAIR MEASUREMENT
A 4-wire touch screen is typically constructed as shown in Figure 21. It consists of two transparent resistive
layers separated by insulating spacers.
Conductive Bar
Transparent Conductor (ITO)
Bottom Side
Y+
X+
Silver
Ink
Transparent
Conductor (ITO)
Top Side
XY-
ITO = Indium Tin Oxide
Insulating Material (Glass)
Figure 21. 4-Wire Touch Screen Construction
The 4-wire touch screen panel works by applying a voltage across the vertical or horizontal resistive network.
The A/D converter converts the voltage measured at the point where the panel is touched. A measurement of the
Y position of the pointing device is made by connecting the X+ input to a data converter chip, turning on the Y+
and Y– drivers, and digitizing the voltage seen at the X+ input. The voltage measured is determined by the
voltage divider developed at the point of touch. For this measurement, the horizontal panel resistance in the X+
lead does not affect the conversion because of the high input impedance of the A/D converter.
Voltage is then applied to the other axis, and the A/D converter converts the voltage representing the X position
on the screen. This process provides the X and Y coordinates to the associated processor.
Measuring touch pressure (Z) can also be done with the TSC2008. To determine pen or finger touch, the
pressure of the touch must be determined. Generally, it is not necessary to have very high performance for this
test; therefore, 8-bit resolution mode may be sufficient (however, data sheet calculations are shown using 12-bit
resolution mode). There are several different ways of performing this measurement. The TSC2008 supports two
methods. The first method requires knowing the X-plate resistance, the measurement of the X-Position, and two
additional cross panel measurements (Z2 and Z1) of the touch screen (see Figure 22). Equation 1 calculates the
touch resistance:
R TOUCH + RX−plate @
12
ǒ
Ǔ
XPostition Z 2
*1
4096 Z 1
(1)
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The second method requires knowing both the X-plate and Y-plate resistance, measurement of X-Position and
Y-Position, and Z1. Equation 2 also calculates the touch resistance:
RX−plate @ XPostition 4096
Y
R TOUCH +
*1 *R Y−plate @ 1* Position
4096
4096
Z1
ǒ
Ǔ
ǒ
Ǔ
(2)
Measure X-Position
X+
Y+
Touch
X-Position
Y-
X-
Measure Z1-Position
Y+
X+
Touch
Z1-Position
Y-
X-
Y+
X+
Touch
Z2-Position
X-
YMeasure Z2-Position
Figure 22. Pressure Measurement
When the touch panel is pressed or touched and the drivers to the panel are turned on, the voltage across the
touch panel will often overshoot and then slowly settle down (decay) to a stable dc value. This effect is a result of
mechanical bouncing caused by vibration of the top layer sheet of the touch panel when the panel is pressed.
This settling time must be accounted for, or else the converted value is incorrect. Therefore, a delay must be
introduced between the time the driver for a particular measurement is turned on, and the time a measurement is
made.
In some applications, external capacitors may be required across the touch screen for filtering noise picked up by
the touch screen (for example, noise generated by the LCD panel or back-light circuitry). The value of these
capacitors provides a low-pass filter to reduce the noise, but creates an additional settling time requirement when
the panel is touched. The settling time typically shows up as gain error. The TSC2008 has a built-in noise filter
(see the Preprocessing section). These capacitors can be reduced to minimal value or not installed.
The TSC2008 touch screen interface can measure position (X,Y) and pressure (Z).
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INTERNAL TEMPERATURE SENSOR
In some applications, such as battery recharging, an ambient temperature measurement is required. The
temperature measurement technique used in the TSC2008 relies on the characteristics of a semiconductor
junction operating at a fixed current level. The forward diode voltage (VBE) has a well-defined characteristic
versus temperature. The ambient temperature can be predicted in applications by knowing the +25°C value of
the VBE voltage and then monitoring the delta of that voltage as the temperature changes.
The TSC2008 offers two modes of temperature measurement. The first mode requires calibration at a known
temperature, but only requires a single reading to predict the ambient temperature. The TEMP1 diode, shown in
Figure 23, is used during this measurement cycle. This voltage is typically 580mV at +25°C with a 10µA current.
The absolute value of this diode voltage can vary by a few millivolts; the temperature coefficient (TC) of this
voltage is very consistent at –2.1mV/°C. During the final test of the end product, the diode voltage is stored at a
known room temperature, in system memory, for calibration purposes by the user. The result is an equivalent
temperature measurement resolution of 0.3°C/LSB (1LSB = 610µV with VREF = 2.5V).
VDD
TEMP2
TEMP1
+IN
GND
REF
Converter
-IN
GND
Figure 23. Functional Block Diagram of Temperature Measurement Mode
The second mode does not require a test temperature calibration, but uses a two-measurement (differential)
method to eliminate the need for absolute temperature calibration and for achieving 2°C/LSB accuracy. This
mode requires a second conversion of the voltage across the TEMP2 diode with a resistance 91 times larger
than the TEMP1 diode. The voltage difference between the first (TEMP1) and second (TEMP2) conversion is
represented by:
DV + kT
q @ ln(N)
(3)
Where:
N = the resistance ratio = 91.
k = Boltzmann's constant = 1.3807 × 10–23 J/K (joules/kelvins).
q = the electron charge = 1.6022 × 10–19 C (coulombs).
T = the temperature in kelvins (K).
This method can provide much improved absolute temperature measurement, but a lower resolution of
1.6°C/LSB. The resulting equation to solve for T is:
q @ DV
T+
k @ ln(N)
(4)
Where:
ΔV = VBE (TEMP2) – VBE(TEMP1) (in mV).
∴ T = 2.573 ⋅ ΔV (in K),
or T = 2.573 ⋅ ΔV – 273 (in °C).
Temperature 1 and/or temperature 2 measurements have the same timing as shown in Figure 30 to Figure 33.
14
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ANALOG-TO-DIGITAL CONVERTER
Figure 24 shows the analog inputs of the TSC2008. The analog inputs (X, Y, and Z touch panel coordinates, chip
temperature and auxiliary inputs) are provided via a multiplexer to the Successive Approximation Register (SAR)
analog-to-digital converter (ADC). The A/D architecture is based on capacitive redistribution architecture, which
inherently includes a sample-and-hold function.
VDD/REF
50kW
RIRQ
PENIRQ
90kW
Pen Touch
Median Value Filter
and
Averaging Filter
(MAV)
X+
TEMP2
TEMP1
Control
Logic
A[2:0]
GND
X-
VDD
Y+
+IN
Y-
+REF
Converter
-IN
-REF
GND
AUX
GND
Figure 24. Analog Input Section (Simplified Diagram)
A unique configuration of low on-resistance switches allows an unselected A/D converter input channel to
provide power and an accompanying pin to provide ground for driving the touch panel. By maintaining a
differential input to the converter and a differential reference input architecture, it is possible to negate errors
caused by the driver switch on-resistance.
Reference
The TSC2008 uses an external voltage reference applied to the VDD/REF pin. The upper reference voltage
range is the same as the supply voltage range, which allows for simple, 1.2V to 3.6V single-supply operation of
the chip.
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Reference Mode
There is a critical item regarding the reference when making measurements while the switch drivers are on. For
this discussion, it is useful to consider the basic operation of the TSC2008 (see Figure 20). This particular
application shows the device being used to digitize a resistive touch screen. A measurement of the current Y
position of the pointing device is made by connecting the X+ input to the A/D converter, turning on the Y+ and Y–
drivers, and digitizing the voltage on X+, as shown in Figure 25. For this measurement, the resistance in the X+
lead does not affect the conversion; it does affect the settling time, but the resistance is usually small enough
that this is not a concern. However, because the resistance between Y+ and Y– is fairly low, the on-resistance of
the Y drivers does make a small difference. Under the situation outlined so far, it would not be possible to
achieve a 0V input or a full-scale input regardless of where the pointing device is on the touch screen because
some voltage is lost across the internal switches. In addition, the internal switch resistance is unlikely to track the
resistance of the touch screen, providing an additional source of error.
VDD/REF
Y+
+IN
X+
+REF
Converter
-IN
-REF
Y-
GND
Figure 25. Simplified Diagram of Single-Ended Reference
This situation is resolved, as shown in Figure 26, by using the differential mode; the +REF and –REF inputs are
connected directly to Y+ and Y–, respectively. This mode makes the A/D converter ratiometric. The result of the
conversion is always a percentage of the external reference, regardless of how it changes in relation to the
on-resistance of the internal switches. Note that there is an important consideration regarding power dissipation
when using the ratiometric mode of operation (see the Power Dissipation section for more details).
VDD/REF
Y+
+IN
X+
+REF
Converter
-IN
-REF
Y-
GND
Figure 26. Simplified Diagram of Differential Reference
(Both Y Switches are Enabled, and X+ is the Analog Input)
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Touch Screen Settling
In some applications, external capacitors may be required across the touch screen to filter noise picked up by the
touch screen (that is, noise generated by the LCD panel or backlight circuitry). These capacitors provide a
low-pass filter to reduce the noise, but they also cause a settling time requirement when the panel is touched.
The settling time typically shows up as a gain error. The problem is that the input and/or reference has not
settled to its final steady-state value before the A/D converter samples the input(s) and provides the digital
output. Additionally, the reference voltage may continue to change during the measurement cycle.
There are two ways to resolve this issue. Option 1 is to stop or slow down the TSC2008 SCLK for the required
touch screen settling time. This option allows the input and reference to have stable values for the Acquire period
(three clock cycles of the TSC2008; see Figure 30). This option works for both the single-ended and the
differential modes. Option 2 is to operate the TSC2008 in the differential mode only for the touch screen
measurements and command the TSC2008 to remain on (touch screen drivers ON) and not go into power-down
(PD0 = 1). Several conversions are made, depending on the settling time required and the TSC2008 data rate.
Once the required number of conversions have been made, the processor commands the TSC2008 to go into its
power-down state on the last measurement. This process is required for X-Position, Y-Position, and Z-Position
measurements.
Touch Detect
The PENIRQ can be used as an interrupt to the host. RIRQ is an internal pull-up resistor with a programmable
value of either 50kΩ (default) or 90kΩ (which allows the total resistance from X+ to Y– to be as high as 30kΩ).
Write command '1010' (setup command) followed by data '1xx0' sets the pull-up resistor to 90kΩ. NOTE: The
first three bits must be '0's and the select bit is the last bit. To change the pull-up resistor back to 50kΩ, issue
write command '1010' followed by data '0xx0'.
An example for the Y-position measurement is detailed in Figure 27. The PENIRQ output is pulled high by an
internal pull-up resistor. While in power-down mode with PD0 = 0, the Y– driver is on and connected to GND,
and the PENIRQ output is connected to the X+ input. When the panel is touched, the X+ input is pulled to ground
through the touch screen, and PENIRQ output goes low because of the current path through the panel to GND,
initiating an interrupt to the processor. During the measurement cycle for X-, Y-, and Z-Position, the X+ input is
disconnected from the PENIRQ pull-down transistor to eliminate any pull-up resistor leakage current from flowing
through the touch screen, thus causing no errors.
If the last command byte written to the TSC2008 contains PD0 = 1, the pen-interrupt output function is disabled
and cannot detect when the panel is touched. In order to re-enable the pen-interrupt output function under these
circumstances, a command byte must be written to the TSC2008 with PD0 = 0.
If the last command byte contains PD0 = 0, then the pen-interrupt function is enabled at the end of a conversion.
The end of conversion (EOC) occurs on the rising edge of PENIRQ.
In both cases previously listed, it is recommended that whenever the host writes to the TSC2008, the master
processor masks the interrupt associated to PENIRQ. This masking prevents false triggering of interrupts when
the PENIRQ line is disabled in the cases previously listed.
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Connect to
Analog Supply
VDD/REF
PENIRQ
VDD
RIRQ
Pen Touch
Control
Logic
TEMP1
High when
the X+ or Y+
driver is on.
X+
TEMP2
Y+
Sense
GND
Y-
High when the X+ or Y+
driver is on, or when any
sensor connection/shortcircuit tests are activated.
ON
Vias go to system analog ground plane.
GND
GND
Figure 27. Example of a Pen-Touch Induced Interrupt via the PENIRQ Pin
Preprocessing
The TSC2008 has a fixed combined MAV filter (median value filter and averaging filter).
MAV Filter
If the acquired signal source is noisy because of the digital switching circuit, it may necessary to evaluate the
data without noise. In this case, the median value filter operation helps remove the noise. The array of seven
converted results is sorted first. The middle three values are then averaged to produce the output value of the
MAV filter.
The MAV filter is applied to all measurements for all analog inputs including the touch screen inputs, temperature
measurements TEMP1 and TEMP2, and auxiliary input AUX. To shorten the conversion time, the MAV filter may
be bypassed though the setup command; see Table 2 and Table 4.
7 measurements input
into temporary array
7
7 Acquired
Data
Sort by
descending order
Averaging output
from window of 3
7
3
Figure 28. MAV Filter Operation (Patent Pending)
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DIGITAL INTERFACE
The TSC2008 communicates through a standard SPI bus. The SPI allows full-duplex, synchronous, serial
communication between a host processor (the master) and peripheral devices (slaves). The SPI master
generates the synchronizing clock and initiates transmissions. The SPI slave devices depend on a master to start
and synchronize transmissions.
A transmission begins when initiated by a master SPI. The byte from the master SPI begins shifting in on the
slave SDI (MOSI—master out, slave in) pin under the control of the master serial clock. As the byte shifts in on
the SDI (MOSI) pin, a byte shifts out on the SDO (MISO—master in, slave out) pin to the master shift register.
The idle state of the TSC2008 serial clock is logic low, which corresponds to a clock polarity setting of 0 (typical
microprocessor SPI control bit CPOL = 0). The TSC2008 interface is designed so that with a clock phase bit
setting of 0 (typical microprocessor SPI control bit CPHA = 0), the master begins driving its MOSI pin and the
slave begins driving its MISO pin half an SCLK before the first serial clock edge. The CS (SS, slave select) pin
can remain low between transmissions.
Table 1. Standard SPI Signal Names vs Common Serial Interface Signal Names
SPI SIGNAL NAMES
COMMON SERIAL INTERFACE NAMES
SS (Slave Select)
CS (Chip Select)
MISO (Master In Slave Out)
SDO (Serial Data Out)
MOSI (Master Out Slave In)
SDI (Serial Data In)
As a comparison to the popular TSC2046 timing characteristics, a few differences between the interfaces are
worth notice:
1. Unlike the TSC2046, there is not a 15 SCLK cycle for the TSC2008.
2. There is an adjusted SDO timing that allows an 8-bit, back-to-back cycle.
3. The TSC2008 uses an internal conversion clock; therefore, the SPI serial clock (SCLK) can only affect the
acquiring period and I/O transfer.
4. The TSC2008 uses an internal clock to perform the conversion. PENIRQ rises when the conversion is
complete. If the host issues an SCLK before the conversion is complete, PENIRQ also rises, but the
conversion result is invalid.
5. If a new command is issued before a conversion is complete (indicated by EOC), then the conversion is
aborted.
6. Releasing the SPI bus (by raising CS) during the conversion is OK, but releasing the SPI during the I/O
transfer (for example, read result) aborts the data transfer.
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CONTROL BYTE
The control byte (on SDI), as shown in Table 2, provides the start conversion, addressing, A/D converter
resolution, configuration, and power-down of the TSC2008. Figure 30, Table 2, and Table 3 give detailed
information regarding the order and description of these control bits within the control byte.
Table 2. Order of the Control Bits in the Control Byte
BIT 7
(MSB)
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1
BIT 0
(LSB)
COMMENT
S
A2
A1
A0
MODE
SER/DFR
PD1
PD0
Excludes setup command
S
0
1
0
Pull-up
Bypass
Timing
Reset
Setup command
Table 3. Description of the Control Bits in the Control Byte
BIT
DESCRIPTION
7
Start Bit. When this bit = '1', it indicates this is one of the user commands. A new control byte can start every 16th clock cycle in
12-bit conversion mode or every 12th clock cycle in 8-bit conversion mode (see Figure 30 through Figure 33).
6-4
Bit[6:4] = A[2:0]. Channel select command if A[2:0] ≠
'010'.
These channel select bits, along with the SER/DFR bit,
control the setting of the multiplexer input, touch driver
switches, and reference inputs (see Table 4 and
Figure 30 through Figure 33).
Bit[6:4] = A[2:0]. Setup command if A[2:0] = '010'.
3
Mode Select Bit. This bit controls the number of bits for
the next conversion.
0: 12 bits (low)
1: 8 bits (high).
Pull-up Resistor Select Bit (1).
0: 50kΩ PENIRQ pull-up resistor (default).
1: 90kΩ PENIRQ pull-up resistor.
2
Single-Ended/Differential Reference Select Bit
(SER/DFR). Along with the channel select bits, A[2:0],
this bit controls the setting of the multiplexer input, touch
driver switches, and reference inputs (see Table 4).
Bypass Noise Filter Bit (1).
0: MAV noise filter enabled (default).
1: MAV noise filter bypassed.
1-0
(1)
20
Bit[1:0] = PD[1:0]. Power Down Mode Select Bits.
See Table 5 for details.
Bit 1: Timing Select Bit (1).
0: TSC2046-compatible timing for SDO during data read (default)
1: Adjusted SDO timing; MSB appears before 1st rising clock edge.
Bit 0: Software Reset Bit.
0: Nothing happens (default).
1: Software reset.
These bits configure the pull-up resistor value, control the filter bypass, and select the SDO output timing. The bits are static and the
values are stored in register bits that will only be reset to default by a reset condition (power-on reset, software reset, or SureSet) or
changed with the setup command.
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The control byte begins with a start bit followed by seven control bits. For the command to be valid, the start bit
must be '1'. Do not use '0' for the start bit; it is reserved for factory use.
Initiate Start—The first bit is the start bit (S), and must always be high to initiate the start of a user-controllable
control byte. When the start bit = '0', it is reserved for factory use.
Addressing and Command Decoding—The next three bits in the control byte following the start bit are three
addressing bits A[2:0] used to select the active input channel(s) of the input multiplexer (see Table 4 and
Figure 24), enable the touch screen drivers, select the reference inputs, or decode other commands.
Bit[6:4] = '010' is the setup command that is used to configure the TSC.
Bit[3:0] followed by the setup command are the configuration bits and are used to select the pull-up resistor
value, bypass the noise filter (in the preprocessing unit), select the SDO output timing, and perform the software
reset. Bit[3:1] are static—that is, they do not change once programmed unless either the device is powered off,
one of the reset conditions occur (power-on reset, software reset, or SureSet), or unless changed with the setup
command. Note that if any reset occurs, bit[3:1] is set to the default values listed in Table 3. Any function
decoded as shown in Table 4 (excluding the setup command) has no access to these four configuration bits.
Table 4. Converter Function Select (CFS) Information
(1)
A[2:0]
BIT 2
SER/DFR
+REF
–REF = –IN
INPUT TO
ADC = +IN
X-DRIVERS
Y-DRIVERS
DESCRIPTION
0h
Don't care
VDD
GND
TEMP1
All OFF
All OFF
Measure TEMP1
1h
1 (single-ended)
VDD
GND
X+
All OFF
All ON
Measure Y position
1h
0 (differential mode)
Y+
Y–
X+
All OFF
All ON
Measure Y position
2h
Used as noise filter
bypass
—
—
—
All OFF
All OFF
Setup command (2)
3h
1 (single-ended)
VDD
GND
X+
X– ON
Y+ ON
Measure Z1 position
3h
0 (differential mode)
Y+
X–
X+
X– ON
Y+ ON
Measure Z1 position
4h
1 (single-ended)
VDD
GND
Y–
X– ON
Y+ ON
Measure Z2 position
4h
0 (differential mode)
Y+
X–
Y–
X– ON
Y+ ON
Measure Z2 position
5h
1 (single-ended)
VDD
GND
Y+
All ON
All OFF
Measure X position
5h
0 (differential mode)
X+
X–
Y+
All ON
All OFF
Measure X position
6h
Don't care
VDD
GND
AUX
All OFF
All OFF
Measure AUX
7h
Don't care
VDD
GND
TEMP2
All OFF
All OFF
Measure TEMP2
(1)
(2)
Bit 2 is the SER/DFR control bit for all commands except for the setup command.
Use the setup command to configure the touch screen controller or access the software reset function.
MODE—The mode bit sets the resolution of the A/D converter. With this bit low, the next conversion has 12 bits
of resolution; with this bit high, the next conversion has eight bits of resolution.
SER/DFR—The SER/DFR bit controls the reference mode: either single-ended (high) or differential (low). The
differential mode is also referred to as the ratiometric conversion mode and is preferred for X-Position,
Y-Position, and Pressure-Touch measurements for optimum performance. The reference is derived from the
voltage at the switch drivers, which is almost the same as the voltage to the touch screen. In this case, a
reference voltage is not needed because the reference voltage to the A/D converter is the same as the voltage
across the touch screen. In single-ended mode, the converter reference voltage is always the difference between
the VREF and GND pins (see Table 4 and Figure 24 through Figure 26, for further information).
If X-Position, Y-Position, and Pressure-Touch are measured in the single-ended mode, then VDD is used as the
reference.
NOTE: The differential mode can only be used for X-Position, Y-Position, and Pressure-Touch measurements.
All other measurements require the single-ended mode.
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PD0 and PD1—The power-down bits select the power-down mode that the TSC2008 will be in after the current
command completes, as shown in Table 5.
It is recommended to set PD0 = '0' in each command byte to get the lowest power consumption possible. If
multiple X-, Y-, and Z-position measurements are performed sequentially (such as when averaging),
PD0 = '1' leaves the touch screen drivers on at the end of each conversion cycle.
Table 5. Power-Down and Internal Reference Selection
PD1
PD0
PENIRQ
DESCRIPTION
0
0
Enabled
Power-Down Between Conversions. When each conversion is finished, the
converter enters a low-power mode. At the start of the next conversion, the
device instantly powers up to full power. There is no need for additional delays to
ensure full operation, and the very first conversion is valid. The Y– switch is on
when in power-down.
0
1
Disabled
A/D converter on. PENIRQ disabled.
1
0
Enabled
A/D converter off. PENIRQ enabled.
1
1
Disabled
A/D converter on. PENIRQ disabled.
Variable Resolution
The TSC2008 provides either 8-bit or 12-bit resolution for the A/D converter. Lower resolution is often practical
for measuring slow changing signals such as touch pressure. Performing the conversions at lower resolution
reduces the amount of time it takes for the A/D converter to complete its conversion process, which also lowers
power consumption.
8- and 12-Bit Conversion
The TSC2008 provides both 12-bit or 8-bit conversion modes.
The 12-bit conversion mode can be done in 24 SCLKs per cycle or 16 SCLKs per cycle timing; see Figure 30
and Figure 31 for details. The 8-bit conversion can be done in 24 SCLKs per cycle (although this mode is
unlikely to be selected), 16 SCLKs per cycle, or even 8 SCLKs per cycle (when adjusted SDO timing is selected);
see Figure 32 and Figure 33 for details.
The 8-bit mode can be used when faster throughput is needed and the digital result is not as critical. By
switching to the 8-bit conversion mode, a conversion is complete four internal conversion clock cycles earlier and
also takes less time to transfer the result. The internal conversion clock runs at twice the speed (4MHz typical)
than the 12-bit conversion mode. This faster conversion and transfer saves power.
Conversion Clock and Conversion Time
The TSC2008 contains an internal clock that drives the state machines that perform the many functions of the
device. This clock is divided down to provide a clock that runs the A/D converter. The 8-bit ADC mode uses a
4MHz clock and the 12-bit ADC mode uses a 2MHz clock. The actual frequency of this internal clock is slower
than the name suggests, and varies with the supply voltage.
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Data Format
The TSC2008 output data are in Straight Binary format as shown in Figure 29. This figure shows the ideal output
code for the given input voltage and does not include the effects of offset, gain, or noise.
FS = Full-Scale Voltage = VREF(1)
1LSB = VREF(1)/4096
1LSB
11...111
Output Code
11...110
11...101
00...010
00...001
00...000
0V
Input Voltage
(2)
FS - 1LSB
(V)
(1)
Reference voltage at converter: +REF – (–REF). See Figure 24.
(2)
Input voltage at converter, after multiplexer: +IN – (–IN). See Figure 24.
Figure 29. Ideal Input Voltages and Output Codes
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12-BIT OPERATION TIMING
A single touch result can be easily achieved using 24 SCLKs per cycle operation when the 12-bit ADC mode is
used, as shown in Figure 30. However, because this operation uses slightly more bus bandwidth, a more efficient
method is to overlap the control bytes with the conversion result using 16 SCLKs per cycle operation; see
Figure 31.
CS
tACQ
SCLK
SDI
1
S
8
A2
A1
A0
SER/
MODE DFR
1
8
PD1 PD0
(START)
Idle
8
1
Conv
Acquire
Idle
HIGH: Disable or
(Enable and Not Touched)
HIGH: Disable or (Enable and Not Touched)
0
PENIRQ
1
New PENIRQ Definition
LOW: Enable and Touched
LOW: Enable and Touched
SDO
10
11
9
8
7
6
5
4
3
2
1
(MSB)
0
Zero Filled...
(LSB)
(1)
Drivers 1 and 2
(SER/DFR High)
Off
On
Off
(1, 2)
Drivers 1 and 2
(SER/DFR Low)
Off
On
Off
NOTES: (1) For Y-Position, Driver 1 is on X+ is selected, and Driver 2 is off. For X-Position, Driver 1 is off, Y+ is selected, and Driver 2 is on. Y- will turn on
when power-down mode is entered and PD0 = 0.
(2) Drivers will remain on if PD0 = 1 (no power down) until selected input channel, or power-down mode is changed, or CS is high.
Figure 30. Conversion Timing—12-Bit Mode, 24 SCLKs per Cycle, 8-Bit Bus Interface
The control bits for conversion n + 1 can be overlapped with conversion n to allow for a conversion every 16
clock cycles, as shown in Figure 31. After submitting the control bits, the TSC2008 uses the internal clock to
acquire data from seven conversions (see Figure 28). Deselecting the TSC2008 (CS = '1') during this time period
allows the host to communicate with the other peripherals using the same SPI bus before reading out the ADC
data.
CS
SCLK
1
8
8
1
1
8
n
SDI
S A2 A1 A0
SER/
MODE DFR
S A2 A1 A0
PD1 PD0
Control Bits
Idle
1
n+1
SER/
MODE DFR
PD1 PD0
Control Bits
Acquire Conv
HIGH: Disable or
(Enable and Not Touched)
LOW: Enable and Touched
New PENIRQ Definition
1
LOW: Enable and Touched
n
SDO
Idle
HIGH: Disable or (Enable and Not Touched)
1
PENIRQ
Acquire Conv
Idle
11 10 9
8
7
6
5
n+1
4
3
2
1
0
11 10 9
Figure 31. Conversion Timing—12-Bit Mode, 16 SCLKs per Cycle, 8-Bit Bus Interface, with Earliest Start
of New Command
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8-BIT OPERATION TIMING
If the 8-bit ADC mode produces an acceptable result, then 16 SCLKs per cycle operation can also be used, as
shown in Figure 32. If SDO is released one-half SCLK cycle earlier (with the SDO adjusted option), the fastest
transfer (eight SCLKs per cycle) is achievable; see Figure 33.
CS
SCLK
1
8
1
8
1
n
SDI
S A2 A1 A0
SER/
MODE DFR
S A2 A1 A0
PD1 PD0
Control Bits
1
SER/
MODE DFR
PD1 PD0
Control Bits
Acquire Conv
Idle
8
n+1
Acquire Conv
Idle
HIGH: Disable or
(Enable and Not Touched)
Idle
HIGH: Disable or (Enable and Not Touched)
New PENIRQ Definition
1
PENIRQ
1
LOW: Enable and Touched
n
LOW: Enable and Touched
SDO
7
6
5
4
3
2
n+1
1
0
7
6
5
Figure 32. Conversion Timing—8-Bit Mode, 16 SCLKs per Cycle, 8-Bit Bus Interface, without Adjusted
SDO Timing (TSC2046-Compatible)
CS
SCLK
1
8
1
8
n
SDI
S A2 A1 A0
SER/
MODE DFR
Control Bits
Idle
PD1 PD0
S A2 A1 A0
Acquire Conv
PD1 PD0
Acquire
Idle
Conv
Idle
HIGH: Disable or (Enable and Not Touched)
1
LOW: Enable and Touched
SDO
SER/
MODE DFR
Control Bits
HIGH: Disable or
(Enable and Not Touched)
PENIRQ
1
n+1
New PENIRQ Def
1
LOW: Enable and Touched
n
7
6
5
4
3
2
1
0
n+1
7
6
5
4
Figure 33. Conversion Timing—8-Bit Mode, 8 SCLKs per Cycle, 8-Bit Bus Interface, with Adjusted SDO
Timing
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POWER DISSIPATION
There are two major power modes for the TSC2008: full-power (PD0 = '1') and auto power-down (PD0 = '0').
Unlike its predecessor, the TSC2046/2046E (where operation is synchronous to SCLK and therefore power
depends on the SCLK frequency), the TSC2008 uses an internal clock for conversion and is asynchronous to
SCLK. TSC2008 power consumption depends on the sample rate and is minimally affected by the SCLK
frequency. Figure 30 shows a timing example using 12-bit resolution and 24 SCLKs per cycle. There are
approximately 2.5 SCLKs of acquisition time used at the end of the 8-bit command cycle. When the
preprocessing filter is on, the next six acquisition cycles are controlled by the internal conversion clock instead of
relying on the external SCLK. A conversion time follows each acquisition time. Because there are six more
conversions to be completed, and also because of the power used from preprocessing, the power consumption
when the filter is on is higher than the power consumed without the filter at the same output rate, as shown in
Figure 34. This timing sequence also applies to Figure 31 to Figure 33. Thus, using the TSC2008, power
consumption can be very low, even with a low SCLK frequency.
400
400
12-Bit AUX Conversion with MAV
SCLK = 16MHz
VDD = 1.8V
TA = +25°C
300
12-Bit AUX Conversion without MAV
SCLK = 16MHz
VDD = 1.8V
TA = +25°C
350
Supply Current (mA)
Supply Current (mA)
350
250
200
150
100
300
250
200
150
100
50
50
0
0
0
2
4
6
8
10
Sample Output Rate (kHz)
12
14
0
10
20
30
40
50
60
70
Sample Output Rate (kHz)
80
90
Figure 34. Sample Output Rate vs Supply Current (with and without MAV filter)
Another important consideration for power dissipation is the reference mode of the converter. In the single-ended
reference mode, the touch panel drivers are on only when the analog input voltage is being acquired (see
Figure 30 and Table 4). The external device (for example, a resistive touch screen), therefore, is only powered
during the acquisition period. In the differential reference mode, the external device must be powered throughout
the acquisition and conversion periods (see Figure 30). If the conversion rate is high, using this mode could
substantially increase power dissipation.
THROUGHPUT RATE AND SPI BUS TRAFFIC
Although the internal A/D converter has a sample rate of up to 200kSPS, the throughput presented at the bus is
much lower. The rate is reduced because preprocessing manages the redundant work of filtering out noise. The
throughput is further limited by the SPI bus bandwidth, which is determined by the supply voltage and what the
host processor can support. The effective throughput is approximately 20kSPS at 8-bit resolution, or 10kSPS at
12-bit resolution. The preprocessing saves a large portion of the SPI bandwidth for the system to use on other
devices.
Each sample and conversion takes 19 CCLK cycles (12-bit), or 16 CCLK cycles (8-bit). The TSC2008 contains
an internal clock that drives the state machines that perform the many functions of the device. This clock is
divided down to provide a clock that runs the A/D converter. The 8-bit ADC mode uses a 4MHz clock and the
12-bit ADC mode uses a 2MHz clock. The actual frequency of this internal clock is slower than the name
suggests, and varies with the supply voltage. For a typical internal 4MHz OSC clock, the frequency actually
ranges from 3.66MHz to 3.82MHz. For VDD = 1.2V, the frequency reduces to 3.19MHz, which gives a
3.19MHz/16 = 199kSPS raw A/D converter sample rate.
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12-Bit Operation
For 12-bit operation, sending the conversion result across the SPI bus takes 16 or 24 bus clocks (SCLK clock);
see Figure 31 and Figure 30. There is an additional SCLK to be added to accommodate the cycle overhead (time
between consecutive cycles) so that the total bus cycle time used for calculating the throughput is actually 17 or
25 bus clocks (SCLK clock), respectively. Using a TSC2046-compatible SDO output mode or an SDO-adjusted
output mode does not affect the transmission time.
Seven sample-and-conversions take (19 x 7) internal clocks to complete. The MAV filter loop requires 19 internal
clocks. For VDD = 1.2V, the complete processed data cycle time calculations are shown in Table 6. Because the
first acquisition cycle overlaps with the I/O cycle, four CCLKs must be deducted from the total CCLK cycles. The
total time required is (19 × 7 + 19) – 4 = 148 CCLKs plus I/O.
8-Bit Operation
For 8-bit operation, sending the conversion result across the SPI bus takes 8, 16, or 24 bus clocks (SCLK clock);
see Figure 33, Figure 32, and Figure 30. There is an additional SCLK to be added to accommodate the cycle
overhead (time between consecutive cycles) so that the total bus cycle time used for calculating the throughput is
actually 9, 17, or 25 bus clocks (SCLK clock), respectively. Sending the conversion result takes 17 or 25 SCLKs
using 8-bit resolution and a TSC2046-compatible SDO output mode. If an SDO-adjusted output mode is used
with 8-bit resolution, it takes only 9 or 17 SCLKs to send the result back to host.
Seven sample-and-conversions take (16 x 7) internal clocks to complete. The MAV filter loop takes 19 internal
clocks. For VDD = 1.2V, the complete processed data cycle time calculations are shown in Table 6. Because the
first acquisition cycle is overlapped with the I/O cycle, four CCLKs must be deducted from the total CCLK cycles.
The total time required is (16 × 7 + 19) – 4 = 127 CCLKs plus I/O.
Table 6. Measurement Cycle Time Calculations (1) (2)
fSCLK = 100kHz (Period = 10µs)
8-Bit
17 × 10µs + 127 × 322.6ns = 211.0µs
12-Bit
25 × 10µs + 148 × 645.2ns = 345.5µs
fSCLK = 1MHz (Period = 1µs)
8-Bit
17 × 1µs + 127 × 322.6ns = 58.0µs
12-Bit
25 × 1µs + 148 × 645.2ns = 120.5µs
fSCLK = 2MHz (Period = 500ns)
8-Bit
17 × 500ns + 127 × 322.6ns = 49.5µs
12-Bit
25 × 500ns + 148 × 645.2ns = 108.0µs
fSCLK = 2.5MHz (Period = 400ns)
8-Bit
17 × 400ns + 127 × 322.6ns = 47.8µs
12-Bit
25 × 400ns + 148 × 645.2ns = 105.5µs
fSCLK = 4MHz (Period = 250ns)
8-Bit
17 × 250ns + 127 × 322.6ns = 45.2µs
12-Bit
25 × 250ns + 148 × 645.2ns = 101.7µs
fSCLK = 10MHz (Period = 100ns)
8-Bit
17 × 100ns + 127 × 322.6ns = 42.7µs
12-Bit
25 × 100ns + 148 × 645.2ns = 98.0µs
fSCLK = 16MHz (Period = 62.5ns)
8-Bit
17 × 62.5ns + 127 × 322.6ns = 42.0µs
12-Bit
25 × 62.5ns + 148 × 645.2ns = 97.1µs
fSCLK = 25MHz (Period = 40ns)
(1)
(2)
8-Bit
17 × 40ns + 127 × 322.6ns = 41.7µs
12-Bit
25 × 40ns + 148 × 645.2ns = 96.5µs
8-bit mode cycle time is calculated based on SDO-adjusted output mode.
CCLK period used for calculation is worst-case at 1.2V supply, 322.6ns.
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As an example, use VDD = 1.2V and 12-bit mode with 2MHz SPI clock (fSCLK = 2MHz). The equivalent TSC
throughput is at least seven times faster than the effective throughput across the bus (9.26k x 7 = 64.82kSPS).
The supply current to the TSC for this rate and configuration is 240.08µA. To achieve an equivalent sample
throughput of 8.2kSPS using the device without preprocessing, the TSC2008 consumes only (8.2/64.82) ×
240.08µA = 30.37µA.
Table 7. Effective and Equivalent Throughput Rates
SUPPLY
VOLTAGE
SPI BUS
SPEED (fSCLK)
100kHz
1MHz
2MHz
2.5MHz
2.7V
4MHz
10MHz
16MHz
25MHz
100kHz
1MHz
2MHz
1.8V
2.5MHz
4MHz
10MHz
16MHz
100kHz
1MHz
2MHz
1.2V
2.5MHz
4MHz
5MHz
28
RESOLUTION
TSC
CONVERSION
CYCLE TIME
(µs)
EFFECTIVE
THROUGHPUT
(kSPS)
EQUIVALENT
THROUGHPUT
(kSPS)
NO.
OF
SCL
NO.
OF
CCLK
fCCLK
(kHz)
CCLK
PERIODS
(ns)
8-bit
204.3
4.89
34.26
17
127
3700
270.3
12-bit
330.0
3.03
21.21
25
148
1850
540.5
8-bit
51.3
19.48
136.39
17
127
3700
270.3
12-bit
105.0
9.52
66.67
25
148
1850
540.5
8-bit
42.8
23.35
163.46
17
127
3700
270.3
12-bit
92.5
10.81
75.68
25
148
1850
540.5
8-bit
41.1
24.32
170.22
17
127
3700
270.3
12-bit
90.0
11.11
77.78
25
148
1850
540.5
8-bit
38.6
25.92
181.47
17
127
3700
270.3
12-bit
86.3
11.59
81.16
25
148
1850
540.5
8-bit
36.0
27.76
194.31
17
127
3700
270.3
12-bit
82.5
12.12
84.85
25
148
1850
540.5
8-bit
35.4
28.26
197.81
17
127
3700
270.3
12-bit
81.6
12.26
85.82
25
148
1850
540.5
8-bit
35.0
28.57
199.98
17
127
3700
270.3
12-bit
81.0
12.35
86.42
25
148
1850
540.5
8-bit
205.3
4.87
34.10
17
127
3600
277.8
12-bit
332.2
3.01
21.07
25
148
1800
555.6
8-bit
52.3
19.13
133.90
17
127
3600
277.8
12-bit
107.2
9.33
65.28
25
148
1800
555.6
8-bit
43.8
22.84
159.90
17
127
3600
277.8
12-bit
94.7
10.56
73.90
25
148
1800
555.6
8-bit
42.1
23.77
166.36
17
127
3600
277.8
12-bit
92.2
10.84
75.90
25
148
1800
555.6
8-bit
39.5
25.30
177.09
17
127
3600
277.8
12-bit
88.5
11.30
79.12
25
148
1800
555.6
8-bit
37.0
27.04
189.30
17
127
3600
277.8
12-bit
84.7
11.80
82.62
25
148
1800
555.6
8-bit
36.3
27.52
192.62
17
127
3600
277.8
12-bit
83.8
11.94
83.55
25
148
1800
555.6
8-bit
211.0
4.74
33.18
17
127
3100
322.5
12-bit
345.5
2.89
20.26
25
148
1550
645.2
8-bit
58.0
17.25
120.76
17
127
3100
322.5
12-bit
120.5
8.3
58.10
25
148
1550
645.2
8-bit
49.5
20.22
141.51
17
127
3100
322.5
12-bit
108.0
9.26
64.82
25
148
1550
645.2
8-bit
47.8
20.93
146.54
17
127
3100
322.5
12-bit
105.5
9.48
66.36
25
148
1550
645.2
8-bit
45.2
22.12
154.81
17
127
3100
322.5
12-bit
101.7
9.83
68.81
25
148
1550
645.2
8-bit
44.4
22.54
157.77
17
127
3100
322.5
12-bit
100.5
9.95
69.66
25
148
1550
645.2
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RESET
The TSC2008 can be reset with three different methods: power-on reset (POR), software reset, and the
proprietary SureSet function. The configuration bits (see Table 3, bit[3:1]) accessible through the setup command
('010') are reset to the respective default values listed in Table 3 after any reset occurs (POR, software reset, or
SureSet).
Software Reset
The TSC2008 has a software reset command that can be issued by submitting the 8-bit command '1010 0001'
via the SPI, as shown in Figure 35. This command resets the device to the default configuration. All the settings
in the control byte are reset to default values (see Table 2 and Table 3).
tSU(CSF-SCLK1R)
tSU(SCLKF-CSR)
CS
tD(RESET)
SCLK
1
SDI
S
8
0
1
0
X
X
X
1
8
S A2 A1 A0
1
Control Bits
SER/
MODE DFR
PD1 PD0
Control Bits
Figure 35. Software Reset Timing
Table 8. Timing Requirements for Figure 35
PARAMETER
tSU(CSF-SCLK1R)
TEST CONDITIONS
Enable lead time
tSU(SCLKF-CSR)
Enable lag time
tD(RESET)
Reset period requirement
MIN
MAX
UNIT
1.2V ≤ VDD < 1.6V
22
ns
1.6 ≤ VDD < 3.6V
14
ns
1.2V ≤ VDD < 1.6V
50
ns
1.6 ≤ VDD < 3.6V
20
ns
200
ns
SureSet
The TSC2008 uses SureSet, a unique reset function. SureSet works in the same way as a hardware reset
except that it does not require a dedicated reset pin on the device. SureSet works independently from the
software reset and power-on reset. For example, the software reset works only after the interface (internal state
machine) is fully functional, whereas SureSet works without the interface. In the unlikely event that the host
becomes out-of-sync with the TSC2008, and forcing CS high does not reset the state machine, the host can
submit a 24-bit sequence (0x06D926) that resets the device to a default state (the same as the power-up state),
as shown in Figure 36. In order to reset the TSC2008, the device must be selected (CS low) before submitting
this sequence.
CS
SCLK
0
SDI
0
SPI Lockup
0
0
0
1
1
0
0
24-Bit SureSet Sequence
1
1
0
Reset Normal Operation
Figure 36. SureSet Timing
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Product Folder Link(s): TSC2008
29
TSC2008
SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com
Power-On Reset
During TSC2008 power up, an internal power-on reset (POR) is triggered if the power-supply ramping meets the
timing requirements shown in Figure 37 and listed in Table 9. The recommended and typical VDD off times are
shown in Figure 38. The POR brings the TSC2008 to the default working condition. If the system is not able to
meet the power ramping timing requirements, or if the system is not properly reset (even after a POR), then
including the SureSet reset in the initialization routine is recommended.
tVDD_ON_RAMP
tVDD_OFF_RAMP
1.2V to 3.6V
0.9V
tDEVICE_READY
VDD
0.3V
0V
tVDD_OFF
Figure 37. Power-On Reset Timing
Table 9. Timing Requirements for Figure 37
PARAMETER
TEST CONDITIONS
tVDD_OFF_RAMP
MIN
MAX
UNIT
TA = –40°C to +85°C
2
kV/s
TA = –40°C to +85°C
1
s
TA = –20°C to +85°C
0.3
s
tVDD_ON_RAMP
TA = –40°C to +85°C
12
kV/s
tDEVICE_READY
TA = –40°C to +85°C
2
ms
tVDD_OFF
VDD Off Time for Valid POR (s)
1.4
1.2
1.0
Recommended VDD Off Time
for TA = -40°C to +85°C
0.8
0.6
0.4
0.2
0
Typical VDD Off Time for Various Temperatures
-40
-20
0
20
40
Temperature (°C)
60
80
100
Figure 38. VDD Off Time vs Temperature
30
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Product Folder Link(s): TSC2008
TSC2008
www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009
LAYOUT
The following layout suggestions should obtain optimum performance from the TSC2008. Keep in mind that
many portable applications have conflicting requirements for power, cost, size, and weight. In general, most
portable devices have fairly clean power and grounds because most of the internal components are very low
power. This situation would mean less bypassing for the converter power and less concern regarding grounding.
However, each situation is unique and the following suggestions should be reviewed carefully.
For optimum performance, care should be taken with the physical layout of the TSC2008 circuitry. The basic
SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections,
and digital inputs that occur just before latching the output of the analog comparator. Therefore, during any single
conversion for an n-bit SAR converter, there are n windows in which large external transient voltages can easily
affect the conversion result. Such glitches might originate from switching power supplies, nearby digital logic, and
high power devices. The degree of error in the digital output depends on the reference voltage, layout, and the
exact timing of the external event. The error can change if the external event changes in time with respect to the
SCLK input.
With this in mind, power to the TSC2008 should be clean and well-bypassed. A 0.1µF ceramic bypass capacitor
should be placed as close to the device as possible. In addition, a 1µF to 10µF capacitor may also be needed if
the impedance of the connection between VDD/REF and the power supply is high.
A bypass capacitor is generally not needed on the VDD/REF pin because the internal reference is buffered by an
internal op amp. If an external reference voltage originates from an op amp, make sure that it can drive any
bypass capacitor that is used without oscillation.
The TSC2008 architecture offers no inherent rejection of noise or voltage variation with regard to using an
external reference input, which is of particular concern when the reference input is tied to the power supply. Any
noise and ripple from the supply appear directly in the digital results. While high-frequency noise can be filtered
out, voltage variation as a result of line frequency (50Hz or 60Hz) can be difficult to remove. Some package
options have pins labeled as VOID. Avoid any active trace going under any pin marked as VOID unless it is
shielded by a ground or power plane.
The GND pin should be connected to a clean ground point. In many cases, this point is the analog ground. Avoid
connections that are too near the grounding point of a microcontroller or digital signal processor. If needed, run a
ground trace directly from the converter to the power-supply entry or battery connection point. The ideal layout
includes an analog ground plane dedicated to the converter and associated analog circuitry.
In the specific case of use with a resistive touch screen, care should be taken with the connection between the
converter and the touch screen. Because resistive touch screens have fairly low resistance, the interconnection
should be as short and robust as possible. Loose connections can be a source of error when the contact
resistance changes with flexing or vibrations.
As indicated previously, noise can be a major source of error in touch-screen applications (for example,
applications that require a back-lit LCD panel). This electromagnetic interference (EMI) noise can be coupled
through the LCD panel to the touch screen and cause flickering of the converted A/D converter data. Several
things can be done to reduce this error, such as using a touch screen with a bottom-side metal layer connected
to ground, which couples the majority of noise to ground. Additionally, filtering capacitors, from Y+, Y–, X+, and
X– to ground, can also help. Note, however, that the use of these capacitors increases screen settling time and
requires a longer time for panel voltages to stabilize. The resistor value varies depending on the touch screen
sensor used. The PENIRQ pull-up resistor (RIRQ) may be adequate for most of sensors. If not used, the
general-purpose analog input to the converter (AUX) should be connected to the analog ground plane.
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Product Folder Link(s): TSC2008
31
TSC2008
SBAS406B – JUNE 2008 – REVISED MARCH 2009.......................................................................................................................................................... www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (December 2008) to Revision B ........................................................................................... Page
•
•
•
•
•
•
32
Deleted QFN (RGV) package availability status.................................................................................................................... 1
Changed product name in Ordering Information table from TSC2008I to TSC2008............................................................. 2
Added "I" to QFN package ordering numbers in Ordering Information table ........................................................................ 2
Changed Power On/Off Slope Requirements parameter names .......................................................................................... 4
Changed VDD off time test condition from –21°C to +85°C .................................................................................................. 4
Changed and moved Power-On Reset section ................................................................................................................... 30
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Copyright © 2008–2009, Texas Instruments Incorporated
Product Folder Link(s): TSC2008
PACKAGE OPTION ADDENDUM
www.ti.com
1-Dec-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TSC2008IRGVR
ACTIVE
VQFN
RGV
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TSC
2008I
TSC2008IRGVT
ACTIVE
VQFN
RGV
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
TSC
2008I
TSC2008IYZGR
ACTIVE
DSBGA
YZG
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TSC2008I
TSC2008IYZGT
ACTIVE
DSBGA
YZG
12
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
TSC2008I
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
1-Dec-2015
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TSC2008 :
• Automotive: TSC2008-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Feb-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TSC2008IRGVR
Package Package Pins
Type Drawing
VQFN
RGV
16
TSC2008IRGVT
VQFN
RGV
TSC2008IYZGR
DSBGA
YZG
TSC2008IYZGT
DSBGA
YZG
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
2500
330.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
16
250
180.0
12.4
4.25
4.25
1.15
8.0
12.0
Q2
12
3000
180.0
8.4
1.75
2.25
0.81
4.0
8.0
Q1
12
250
180.0
8.4
1.75
2.25
0.81
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Feb-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TSC2008IRGVR
VQFN
RGV
16
2500
367.0
367.0
35.0
TSC2008IRGVT
VQFN
RGV
16
250
210.0
185.0
35.0
TSC2008IYZGR
DSBGA
YZG
12
3000
210.0
185.0
35.0
TSC2008IYZGT
DSBGA
YZG
12
250
210.0
185.0
35.0
Pack Materials-Page 2
D: Max = 2.1 mm, Min = 2.04 mm
E: Max = 1.6 mm, Min = 1.539 mm
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