Texas Instruments | 16-Bit, 250kSPS 6-Channel Simultaneous Sampling SAR Analog-to-Digital Converters (Rev. C) | Datasheet | Texas Instruments 16-Bit, 250kSPS 6-Channel Simultaneous Sampling SAR Analog-to-Digital Converters (Rev. C) Datasheet

Texas Instruments 16-Bit, 250kSPS 6-Channel Simultaneous Sampling SAR Analog-to-Digital Converters (Rev. C) Datasheet
AD
ADS8365
®
S8
36
5
www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
16-Bit, 250kSPS, 6-Channel, Simultaneous Sampling
SAR ANALOG-TO-DIGITAL CONVERTERS
FEATURES
1
•
•
•
•
•
2
•
DESCRIPTION
Six Input Channels
Fully Differential Inputs
Six Independent 16-Bit ADCs
4µs Total Throughput per Channel
Low Power:
200mW in Normal Mode
5mW in Nap Mode
50µW in Power-Down Mode
TQFP-64 Package Package
The ADS8365 includes six, 16-bit, 250kSPS
analog-to-digital converters (ADCs) with six fully
differential input channels grouped into three pairs for
high-speed simultaneous signal acquisition. Inputs to
the sample-and-hold amplifiers are fully differential
and are maintained differential to the input of the
ADC.
This
architecture
provides
excellent
common-mode rejection of 80dB at 50kHz, which is
important in high-noise environments.
The ADS8365 offers a flexible, high-speed parallel
interface with a direct address mode, a cycle, and a
FIFO mode. The output data for each channel is
available as a 16-bit word.
APPLICATIONS
•
•
•
Motor Control
Multi-Axis Positioning Systems
3-Phase Power Control
CH A0+
CH A0-
CDAC
S/H
Amp
Comp
SAR
HOLDA
CH A1+
Interface
CDAC
CH A1S/H
Amp
A0
A1
A2
Comp
Conversion
and
Control
CH B0+
ADD
NAP
CDAC
CH B0S/H
Amp
RD
WR
CS
Comp
FD
EOC
CLK
SAR
FIFO
Register
and
6x
HOLDB
CH B1+
16
CDAC
CH B1-
RESET
BYTE
Comp
S/H
Amp
Data
Input/Output
CH C0+
CDAC
CH C0S/H
Amp
Comp
SAR
HOLDC
CH C1+
CH C1-
CDAC
Comp
S/H
Amp
REFIN
REFOUT
Internal
2.5V
Reference
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2008, Texas Instruments Incorporated
ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION (1)
PRODUCT
MAXIMUM
NO
INTEGRAL MISSING
LINEARITY CODES
ERROR
ERROR PACKAGEPACKAGE
(LSB)
(LSB)
LEAD
DESIGNATOR
ADS8365
(1)
±4
14
TQFP-64
PAG
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
–40°C to +85°C
ADS8365AI
ORDERING
NUMBER
TRANSPORT
MEDIA,
QUANTITY
ADS8365IPAG
Tray, 160
ADS8365IPAGR
Tape and
Reel, 1500
For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
Supply voltage, AGND to AVDD
Supply voltage, BGND to BVDD
ADS8365
UNIT
–0.3 to 6
V
–0.3 to 6
V
Analog input voltage range
AGND – 0.3 to AVDD + 0.3
V
Reference input voltage range
AGND – 0.3 to AVDD + 0.3
V
Digital input voltage range
BGND – 0.3 to BVDD + 0.3
V
±0.3
V
Ground voltage differences, AGND to BGND
Voltage differences, BVDD to AGND
–0.3 to 6
V
Input current to any pin except supply
–20 to 20
mA
Power dissipation
See Dissipation Ratings Table
Operating virtual junction temperature range, TJ
–40 to +150
°C
Operating free-air temperature range, TA
–40 to +85
°C
Storage temperature range, TSTG
–65 to +150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
BOARD
PACKAGE
RθJC
RθJA
DERATING
FACTOR ABOVE
TA = +25°C
Low-K (1)
PAG
8.6°C/W
68.5°C/W
14.598mW/°C
1824mW
1168mW
949mW
High-K (2)
PAG
8.6°C/W
42.8°C/W
23.364mW/°C
2920mW
1869mW
1519mW
(1)
(2)
2
TA ≤ +25°C
POWER RATING
TA = +70°C
POWER RATING
TA = +85°C
POWER RATING
The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two-layer board with 2-ounce copper traces on top
of the board.
The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes, and 2-ounce copper traces on the top and bottom of the board.
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ADS8365
www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
RECOMMENDED OPERATING CONDITIONS
Supply voltage, AVDD to AGND
MIN
NOM
MAX
UNIT
4.75
5
5.25
V
3.6
V
Low-voltage levels
2.7
5V logic levels
4.5
5
5.5
V
Reference input voltage
1.5
2.5
2.6
V
Operating common-mode signal, –IN
2.2
2.5
2.8
V
0
±VREF
V
–40
+125
°C
Supply voltage, BVDD to BGND
Analog inputs, +IN – (–IN)
Operating junction temperature range, TJ
ELECTRICAL CHARACTERISTICS: 100kSPS
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
±VREF
V
ANALOG INPUT
Full-scale range
FSR +IN – (–IN)
Operating common-mode signal
2.2
2.8
V
Ω
Input resistance
–IN = VREF
750
Input capacitance
–IN = VREF
25
pF
Input leakage current
–IN = VREF
±1
nA
Differential input resistance
–IN = VREF
1500
Ω
Differential input capacitance
–IN = VREF
15
pF
At dc
84
dB
VIN = ±1.25VPP at 50kHz
80
dB
10
MHz
16
Bits
Common-mode rejection ratio
Bandwidth
CMRR
BW FS sinewave, –3dB
DC ACCURACY
Resolution
No missing codes
Integral linearity error
NMC
14
Bits
INL
±1.5
Differential nonlinearity
DNL
±1.5
Bipolar offset error
VOS
±1
±2.3
0.2
1
Bipolar offset error match
Bipolar offset error drift
Gain error
Only pair-wise matching
TCVOS
Gain error drift
Only pair-wise matching
TCGERR
Noise
Power-supply rejection ratio
PSRR 4.75V < AVDD < 5.25V
LSB
LSB
0.8
GERR Referenced to VREF
Gain error match
±4
mV
mV
ppm/°C
±0.05
±0.25
0.005
0.05
%FSR
%FSR
2
ppm/°C
60
µVrms
–87
dB
SAMPLING DYNAMICS
Conversion time per ADC
Acquisition time
tCONV 50kHz ≤ fCLK ≤ 5MHz
tAQ fCLK = 5MHz
3.2
320
800
ns
Aperture delay
5
Aperture delay matching
100
Aperture jitter
(1)
0.05
ns
ps
50
Clock frequency
µs
ps
5
MHz
All typical values are at +25°C.
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ADS8365
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ELECTRICAL CHARACTERISTICS: 100kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
AC ACCURACY
Total harmonic distortion
Spurious-free dynamic range
THD VIN = ±2.5VPP at 50kHz
–94
dB
SFDR VIN = ±2.5VPP at 50kHz
95
dB
SNR VIN = ±2.5VPP at 10kHz
88
dB
SINAD VIN = ±2.5VPP at 10kHz
87
dB
Signal-to-noise ratio
Signal-to-noise + distortion
Channel-to-channel isolation
Effective number of bits
ENOB
95
dB
14.3
Bits
VOLTAGE REFERENCE OUTPUT
Reference voltage output
VOUT
2.475
2.5
Initial accuracy
Output voltage temperature drift
dVOUT/dT
f = 0.1Hz to 10Hz, CL = 10µF
Output voltage noise
Power-supply rejection ratio
f = 10Hz to 10kHz, CL = 10µF
2.525
V
±1
%
±20
ppm/°C
40
µVPP
8
µVrms
PSRR
60
dB
ROUT
2
kΩ
1.25
mA
100
µs
Output impedance
Short-circuit current
ISC
Turn-on settling time
to 0.1% at CL = 0pF
VOLTAGE REFERENCE INPUT
Reference voltage input
VIN
1.5
Reference input resistance
2.5
2.6
100
Reference input capacitance
V
MΩ
5
Reference input current
pF
1
µA
V
DIGITAL INPUTS (2)
Logic family
CMOS
High-level input voltage
VIH
0.7 × BVDD
BVDD + 0.3
Low-level input voltage
VIL
–0.3
0.3 × BVDD
V
Input current
IIN VI = BVDD or GND
±50
nA
Input capacitance
CI
5
pF
DIGITAL OUTPUTS (2)
Logic family
CMOS
High-level output voltage
VOH BVDD = 4.5V, IOH = –100µA
Low-level output voltage
VOL BVDD = 4.5V, IOL = 100µA
High-impedance state output current
IOZ CS = BVDD, VI = BVDD or GND
Output capacitance
CO
Load capacitance
CL
4.44
V
0.5
V
±50
nA
5
pF
30
pF
V
DIGITAL INPUTS (3)
Logic family
LVCMOS
High-level input voltage
VIH BVDD = 3.6V
2
BVDD + 0.3
Low-level input voltage
VIL BVDD = 2.7V
–0.3
0.8
V
Input current
IIN VI = BVDD or GND
±50
nA
Input capacitance
CI
(2)
(3)
4
5
pF
Applies for 5.0V nominal supply: BVDD (min) = 4.5V and BVDD (max) = 5.5V.
Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
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www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS: 100kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 2MHz, and
fSAMPLE = 100kSPS, unless otherwise noted.
ADS8365
PARAMETER
DIGITAL OUTPUTS
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
(4)
Logic family
LVCMOS
High-level output voltage
VOH BVDD = 2.7V, IOH = –100µA
Low-level output voltage
VOL BVDD = 2.7V, IOL = 100µA
High-impedance state output current
IOZ CS = BVDD, VI = BVDD or GND
Output capacitance
CO
Load capacitance
CL
BVDD – 0.2
V
0.2
V
±50
nA
5
pF
30
pF
4.75
5.25
V
Low-voltage levels
2.7
3.6
V
5V logic levels
4.5
5.5
V
45
mA
µA
DATA FORMAT
Data format
Bit DB4 = 1
Binary two's complement
Bit DB4 = 0
Straight binary coding
POWER SUPPLY
Analog supply voltage
AVDD
Buffer I/O supply voltage
BVDD
Analog operating supply current
AIDD
Buffer I/O operating supply current
BIDD
Power dissipation
(4)
38
BVDD = 3V
60
90
BVDD = 5V
100
150
µA
BVDD = 3V
190
225
mW
BVDD = 5V
190
225
mW
Nap mode enabled
5
mW
Powerdown enabled
50
µW
Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
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ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS: 250kSPS
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
±VREF
V
ANALOG INPUT
Full-scale range
FSR +IN – (–IN)
Operating common-mode signal
2.2
2.8
V
Ω
Input resistance
–IN = VREF
750
Input capacitance
–IN = VREF
25
pF
Input leakage current
–IN = VREF
±1
nA
Differential input resistance
–IN = VREF
1500
Ω
Differential input capacitance
–IN = VREF
15
pF
At dc
84
dB
VIN = ±1.25VPP at 50kHz
80
dB
10
MHz
16
Bits
Common-mode rejection ratio
CMRR
Bandwidth
BW FS sinewave, –3dB
DC ACCURACY
Resolution
No missing codes
NMC
Integral linearity error
14
INL
Differential nonlinearity
DNL Specified for 14 bit
Bipolar offset error
VOS
Bipolar offset error match
Bipolar offset error drift
TCVOS
Gain error drift
Only pair-wise matching
TCGERR
Noise
Power-supply rejection ratio
PSRR 4.75V < AVDD < 5.25V
LSB
LSB
±1
±2.3
0.2
1
0.8
GERR Referenced to VREF
Gain error match
±8
±1.5
Only pair-wise matching
Gain error
Bits
±3
mV
mV
ppm/°C
±0.05
±0.25
0.005
0.05
%FSR
%FSR
2
ppm/°C
60
µVrms
–87
dB
SAMPLING DYNAMICS
tCONV 50kHz ≤ fCLK ≤ 5MHz
Conversion time per ADC
Acquisition time
tAQ fCLK = 5MHz
3.2
320
µs
250
kSPS
800
ns
Throughput rate
Aperture delay
5
Aperture delay matching
100
Aperture jitter
ps
50
Clock frequency
0.05
ns
ps
5
MHz
AC ACCURACY
Total harmonic distortion
Spurious-free dynamic range
THD VIN = ±2.5VPP at 50kHz
–94
dB
SFDR VIN = ±2.5VPP at 50kHz
95
dB
SNR VIN = ±2.5VPP at 10kHz
88
dB
SINAD VIN = ±2.5VPP at 10kHz
87
dB
Signal-to-noise ratio
Signal-to-noise + distortion
Channel-to-channel isolation
Effective number of bits
(1)
6
ENOB
95
dB
14.3
Bits
All typical values are at +25°C.
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ADS8365
www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS: 250kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
2.475
2.5
2.525
V
±1
%
UNIT
VOLTAGE REFERENCE OUTPUT
Reference voltage output
VOUT
Initial accuracy
Output voltage temperature drift
dVOUT/dT
Output voltage noise
Power-supply rejection ratio
Output impedance
Short-circuit current
±20
ppm/°C
f = 0.1Hz to 10Hz, CL = 10µF
40
µVPP
f = 10Hz to 10kHz, CL = 10µF
8
µVrms
PSRR
60
dB
ROUT
2
kΩ
1.25
mA
100
µs
ISC
Turn-on settling time
to 0.1% at CL = 0pF
VOLTAGE REFERENCE INPUT
Reference voltage input
VIN
1.5
Reference input resistance
2.5
2.6
100
Reference input capacitance
V
MΩ
5
Reference input current
pF
1
µA
V
DIGITAL INPUTS (2)
Logic family
CMOS
High-level input voltage
VIH
0.7 × BVDD
BVDD + 0.3
Low-level input voltage
VIL
–0.3
0.3 × BVDD
V
Input current
IIN VI = BVDD or GND
±50
nA
Input capacitance
CI
5
pF
DIGITAL OUTPUTS (2)
Logic family
CMOS
High-level output voltage
VOH BVDD = 4.5V, IOH = –100µA
Low-level output voltage
VOL BVDD = 4.5V, IOL = 100µA
High-impedance state output current
IOZ CS = BVDD, VI = BVDD or GND
Output capacitance
CO
Load capacitance
CL
4.44
V
0.5
V
±50
nA
5
pF
30
pF
DIGITAL INPUTS (3)
Logic family
LVCMOS
High-level input voltage
VIH BVDD = 3.6V
2
BVDD + 0.3
V
Low-level input voltage
VIL BVDD = 2.7V
–0.3
0.8
V
Input current
IIN VI = BVDD or GND
±50
nA
Input capacitance
CI
5
pF
DIGITAL OUTPUTS (3)
Logic family
LVCMOS
High-level output voltage
VOH BVDD = 2.7V, IOH = –100µA
Low-level output voltage
VOL BVDD = 2.7V, IOL = 100µA
High-impedance state output current
IOZ CS = BVDD, VI = BVDD or GND
Output capacitance
CO
Load capacitance
CL
(2)
(3)
BVDD – 0.2
V
0.2
V
±50
nA
5
pF
30
pF
Applies for 5.0V nominal supply: BVDD (min) = 4.5V and BVDD (max) = 5.5V.
Applies for 3.0V nominal supply: BVDD (min) = 2.7V and BVDD (max) = 3.6V.
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ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS: 250kSPS (continued)
Over recommended operating free-air temperature range at –40°C to +85°C, AVDD = 5V, BVDD = 3V, VREF = internal +2.5V, fCLK = 5MHz, and
fSAMPLE = 250kSPS, unless otherwise noted
ADS8365
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
DATA FORMAT
Data format
Bit DB4 = 1
Binary two's complement
Bit DB4 = 0
Straight binary coding
POWER SUPPLY
Analog supply voltage
AVDD
Buffer I/O supply voltage
BVDD
Analog operating supply current
AIDD
Buffer I/O operating supply current
BIDD
Power dissipation
4.75
5.25
V
Low-voltage levels
2.7
3.6
V
5V logic levels
4.5
5.5
V
40
48
mA
BVDD = 3V
150
225
µA
BVDD = 5V
250
375
µA
BVDD = 3V
200
240
mW
BVDD = 5V
201
241
mW
Nap mode enabled
5
mW
Powerdown enabled
50
µW
EQUIVALENT INPUT CIRCUIT
AVDD
BVDD
RON
750W
AIN
AGND
Equivalent Analog Input Circuit
8
Diode Turn-on Voltage: 0.35V
C(SAMPLE)
20pF
DIN
BGND
Equivalent Digital Input Circuit
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ADS8365
www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
PIN CONFIGURATION
BVDD
BGND
54
RESET
55
A2
56
ADD
57
A0
58
A1
59
HOLDB
60
HOLDA
HOLDC
61
AGND
62
AVDD
63
REFIN
64
REFOUT
CH A0-
CH A0+
PAG PACKAGE
TQFP-64
(TOP VIEW)
53
52
51
50
49
CH A1-
1
48
D0
CH A1+
2
47
D1
AVDD
3
46
D2
AGND
4
45
D3
SGND
5
44
D4
CH B0+
6
43
D5
CH B0-
7
42
D6
AVDD
8
41
D7
AGND
9
40
D8
ADS8365
34
D14
33
D15
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
BGND
17
CS
15
16
WR
SGND
CH C0+
RD
D13
CLK
35
FD
14
EOC
D12
AGND
BVDD
D11
36
BGND
37
13
BYTE
12
AVDD
AVDD
CH B1+
AGND
D10
NAP
D9
38
CH C1+
39
11
CH C0-
10
CH C1-
SGND
CH B1-
TERMINAL FUNCTIONS
TERMINAL
NO.
I/O (1)
CH A1–
1
AI
Inverting input channel A1
CH A1+
2
AI
Noninverting input channel A1
AVDD
3
P
Analog power supply
AGND
4
P
Analog ground
SGND
5
P
Signal Ground
CH B0+
6
AI
Noninverting input channel B0
CH B0–
7
AI
Inverting input channel B0
AVDD
8
P
Analog power supply
AGND
9
P
Analog ground
SGND
10
P
Signal ground
CH B1–
11
AI
Inverting input channel B1
CH B1+
12
AI
Noninverting input channel B1
AVDD
13
P
Analog power supply
AGND
14
P
Analog ground
SGND
15
P
Signal ground
CH C0+
16
AI
Noninverting input channel C0
CH C0–
17
AI
Inverting input channel C0
CH C1–
18
AI
Inverting input channel C1
NAME
(1)
DESCRIPTION
AI = Analog Input, AO = Analog Output, DI = Digital Input, DO = Digital Output, DIO = Digital Input/Output, and P = Power Supply
Connection.
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TERMINAL FUNCTIONS (continued)
TERMINAL
NO.
I/O (1)
CH C1+
19
AI
Noninverting input channel C1
NAP
20
DI
Nap mode.Low level or unconnected = normal operation; high level = Nap mode.
AGND
21
P
Analog ground
AVDD
22
P
+5V power supply
BYTE
23
DI
2 x 8 output capability (active high)
BVDD
24
P
Power supply for digital interface from 3V to 5V
BGND
25
P
Buffer digital ground
FD
26
DO
First data (A0 data)
EOC
27
DO
End of conversion (active low)
CLK
28
DI
An external CMOS compatible clock can be applied to the CLK input to synchronize the conversion process to an
external source.
RD
29
DI
Read (active low)
WR
30
DI
Write (active low)
CS
31
DI
Chip select (active low)
BGND
32
P
Buffer digital ground
D15
33
DO
Data bit 15 (MSB)
D14
34
DO
Data bit 14
D13
35
DO
Data bit 13
D12
36
DO
Data bit 12
D11
37
DO
Data bit 11
D10
38
DO
Data bit 10
D9
39
DO
Data bit 9
D8
40
DO
Data bit 8
D7
41
DIO
Data bit 7 (software input 7)
D6
42
DIO
Data bit 6 (software input 6)
D5
43
DIO
Data bit 5 (software input 5)
D4
44
DIO
Data bit 4 (software input 4)
D3
45
DIO
Data bit 3 (software input 3)
D2
46
DIO
Data bit 2 (software input 2)
D1
47
DIO
Data bit 1 (software input 1)
D0
48
DIO
Data bit 0 (software input 0) (LSB)
BGND
49
P
Buffer digital ground
BVDD
50
P
Power supply for digital interface from 3V to 5V
RESET
51
DI
Global reset (active low)
ADD
52
DI
Address mode select
A2
53
DI
Address line 3
A1
54
DI
Address line 2
A0
55
DI
Address line 1
HOLDA
56
DI
Hold command A (active low)
HOLDB
57
DI
Hold command B (active low)
HOLDC
58
DI
Hold command C (active low)
AVDD
59
P
Analog power supply
AGND
60
P
Analog ground
REFOUT
61
AO
Reference output; attach 0.1µF and 10µF capacitors
REFIN
62
AI
Reference input
CH A0+
63
AI
Noninverting input channel A0
CH A0–
64
AI
Inverting input channel A0
NAME
10
DESCRIPTION
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TIMING INFORMATION
tC1
CLK
1
2
16
17
18
20
19
1
2
tW1
CONVERSION
tCONV
tD1
ACQUISITION
tACQ
HOLDX
tW3
tW2
EOC
CS
tD4
tD5
tW6
RD
tW5
tD7
tD6
D15–D8
Bits 15–8
Bits 15–8
D7–D0
Bits 7–0
Bits 7–0
BYTE
Figure 1. Read and Convert Timing
CS
WR
WR or CS
DB7:0
tD10
tW6
tD11
Figure 2. Write Timing
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TIMING CHARACTERISTICS (1) (2) (3) (4)
Over recommended operating free-air temperature range, TMIN to TMAX, AVDD = 5V, REFIN = REFOUT, VREF = internal +2.5V,
fCLK = 5MHz, fSAMPLE = 250kSPS, and BVDD = 2.7 to 5V, unless otherwise noted,
SYMBOL
DESCRIPTION
MAX
UNIT
tACQ
Acquisition time
0.8
µs
tCONV
Conversion time
3.2
µs
tC1
tD1
Cycle time of CLK
(5)
ns
10
ns
BVDD = 5V
20
ns
BVDD = 3V
40
ns
tD4
Delay time of falling edge of RD after falling edge of CS
0
ns
tD5
Delay time of rising edge of CS after rising edge of RD
0
ns
BVDD = 5V
40
ns
BVDD = 3V
60
ns
BVDD = 5V
5
ns
BVDD = 3V
10
ns
BVDD = 5V
50
ns
BVDD = 3V
60
ns
BVDD = 5V
10
ns
BVDD = 3V
20
ns
BVDD = 5V
10
ns
BVDD = 3V
20
ns
BVDD = 5V
10
ns
BVDD = 3V
20
ns
60
ns
BVDD = 5V
15
ns
BVDD = 3V
30
ns
BVDD = 5V
20
ns
BVDD = 3V
30
ns
BVDD = 5V
20
ns
BVDD = 3V
40
ns
BVDD = 5V
30
ns
BVDD = 3V
40
ns
BVDD = 5V
50
ns
BVDD = 3V
70
ns
Delay time of data valid after falling edge of RD
Delay time of data hold from rising edge of RD
tD8
Delay time of RD high after CS low
tD9
Delay time of RD low after address setup
tD10
Delay time of data valid to WR low
tD11
Delay time of WR or CS high to data release
tW1
Pulse width CLK high time or low time
tW2
Pulse width of HOLDX high time to be recognized again
tW3
Pulse width of HOLDX low time
tW4
12
200
Delay time of first hold after RESET
tD7
(5)
Delay time of rising edge of CLK after falling edge of HOLDX
TYP
tD2
tD6
(1)
(2)
(3)
(4)
MIN
Pulse width of RESET
tW5
Pulse width of RD high time
tW6
Pulse width of RD and CS both low time
Assured by design.
All input signals are specified with rise time and fall time = 5ns (10% to 90% of BVDD ) and timed from a voltage level of (VIL + VIH )/2.
See Figure 1.
BYTE is asynchronous; when BYTE is 0, bits 15 to 0 appear at DB15 to DB0. When BYTE is 1, bits 15 to 8 appear on DB7 to DB0. RD
may remain LOW between changes in BYTE.
Only important when synchronization to clock is important.
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TYPICAL CHARACTERISTICS
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
INTEGRAL LINEARITY ERROR
vs CODE (100kSPS)
DIFFERENTIAL LINEARITY ERROR
vs CODE (100kSPS)
2.0
4
3
1.5
1.0
1
DNL (LSB)
INL (LSB)
2
0
1
0.5
0
2
-0.5
3
4
-1.0
0
Figure 4.
MINIMUM AND MAXIMUM INL OF ALL CHANNELS
vs TEMPERATURE (100kSPS)
MINIMUM AND MAXIMUM INL OF ALL CHANNELS
vs TEMPERATURE (250kSPS)
1.5
1.5
1.0
1.0
Max
INL (LSB)
0
-0.5
-1.0
Max
0.5
Min
0
-0.5
-1.0
-1.5
-1.5
-2.0
-2.0
-2.5
Min
-2.5
-50
-25
0
25
50
Temperature (°C)
75
100
-50
-25
0
25
50
Temperature (°C)
75
100
Figure 5.
Figure 6.
MINIMUM AND MAXIMUM DNL OF ALL CHANNELS
vs TEMPERATURE (100kSPS)
MINIMUM AND MAXIMUM DNL OF ALL CHANNELS
vs TEMPERATURE (250kSPS)
3.0
3.0
2.5
2.5
Max
2.0
Max
2.0
1.5
DNL (LSB)
1.5
DNL (LSB)
8192 16384 24576 32768 40960 49152 57344 65535
Code
Figure 3.
0.5
INL (LSB)
0
8192 16384 24576 32768 40960 49152 57344 65535
Code
1.0
0.5
0
-0.5
0.5
0
-0.5
Min
-1.0
1.0
Min
-1.0
-1.5
-1.5
-2.0
-2.0
-50
-25
0
25
50
Temperature (°C)
75
100
-50
Figure 7.
-25
0
25
50
Temperature (°C)
75
100
Figure 8.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
FREQUENCY SPECTRUM
(16384 point FFT, fIN = 45kHz, –0.2dB)
0
0
-20
-20
-40
-40
Amplitude (dB)
Amplitude (dB)
FREQUENCY SPECTRUM
(16384 point FFT, fIN = 10kHz, –0.2dB)
-60
-80
-100
-80
-100
-120
-120
-140
-140
-160
-160
0
25
50
75
Frequency (kHz)
100
125
0
25
50
75
Frequency (kHz)
100
Figure 9.
Figure 10.
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-NOISE + DISTORTION
vs INPUT FREQUENCY (ALL CHANNELS)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY (ALL CHANNELS)
100
125
120
115
SFDR and THD (dB)
95
SNR and SINAD (dB)
-60
90
SNR
85
SINAD
80
75
110
SFDR
105
THD
100
95
90
85
70
80
1
10
Frequency (kHz)
100
1
10
Frequency (kHz)
100
Figure 11.
Figure 12.
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-NOISE + DISTORTION
vs TEMPERATURE (ALL CHANNELS)
SPURIOUS-FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs TEMPERATURE (ALL CHANNELS)
90.0
107
89.5
105
SFDR and THD (dB)
SINAD and SNR (dB)
89.0
88.5
88.0
87.5
SNR
87.0
86.5
SINAD
86.0
SFDR
103
101
THD
99
97
85.5
85.0
95
-50
-25
0
25
50
Temperature (°C)
75
100
-50
Figure 13.
14
-25
0
25
50
Temperature (°C)
75
100
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, AVDD = +5V, BVDD = +3V, VREF = internal +2.5V, fCLK = 5MHz, and fSAMPLE = 250kSPS, unless otherwise noted.
OFFSET OF ALL CHANNELS
vs TEMPERATURE
OFFSET MATCHING OF CHANNEL PAIRS
vs TEMPERATURE
0.25
-0.8
0.20
0.15
C0
A0
A1
-1.0
C1
-1.1
Offset Matching (mV)
Offset (mV)
-0.9
B0
-1.2
B1
0.10
0.05
B
0
A
-0.05
-0.10
-0.15
-1.3
C
-0.20
-1.4
-0.25
-50
-25
0
25
50
Temperature (°C)
75
-50
0
-25
25
50
Temperature (°C)
75
100
Figure 15.
Figure 16.
GAIN ERROR OF ALL CHANNELS
vs TEMPERATURE
GAIN-ERROR MATCHING OF CHANNEL PAIRS
vs TEMPERATURE
100
100
B1
A0
B0
A1
50
Gain Match (ppm FSR)
Gain Error (ppm FSR)
100
0
C1
C0
-50
-100
-150
50
B
C
0
A
-50
-100
-150
-50
-25
0
25
50
Temperature (°C)
75
100
-50
-25
0
25
50
Temperature (°C)
Figure 17.
Figure 18.
REFERENCE VOLTAGE OUTPUT
vs TEMPERATURE
ANALOG SUPPLY CURRENT
vs TEMPERATURE
2.498
75
100
42
40
250kSPS
38
IDDA (mA)
VREFOUT (V)
2.496
2.494
36
100kSPS
34
2.492
32
2.490
30
-50
-25
0
25
50
Temperature (°C)
75
100
-50
Figure 19.
-25
0
25
50
Temperature (°C)
75
100
Figure 20.
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INTRODUCTION
The ADS8365 is a high-speed, low-power,
six-channel simultaneous sampling and converting,
16-bit ADC that operates from a single +5V supply.
The input channels are fully differential with a typical
common-mode rejection of 80dB. The ADS8365
contains six 4µs successive approximation ADCs, six
differential sample-and-hold amplifiers, an internal
+2.5V reference with REFIN and REFOUT pins, and a
high-speed parallel interface. There are six analog
inputs that are grouped into three channel pairs (A, B,
and C). There are six ADCs, one for each input that
can be sampled and converted simultaneously, thus
preserving the relative phase information of the
signals on both analog inputs. Each pair of channels
has a hold signal (HOLDA, HOLDB, and HOLDC) to
allow simultaneous sampling on each channel pair,
on four or on all six channels. The part accepts a
differential analog input voltage in the range of –VREF
to +VREF, centered on the common-mode voltage
(see the Analog Input section). The ADS8365 also
accepts bipolar input ranges when a level shift circuit
is used at the front end (see Figure 26).
A conversion is initiated on the ADS8365 by bringing
the HOLDX pin low for a minimum of 20ns. HOLDX
low places the sample-and-hold amplifiers of the X
channels in the hold state simultaneously and the
conversion process is started on each channel. The
EOC output goes low for half a clock cycle when the
conversion is latched into the output register. The
data can be read from the parallel output bus
following the conversion by bringing both RD and CS
low. Conversion time for the ADS8365 is 3.2µs when
a 5MHz external clock is used. The corresponding
acquisition time is 0.8µs. To achieve the maximum
output data rate (250kSPS), the read function can be
performed during the next conversion. NOTE: This
mode of operation is described in more detail in the
Timing and Control section of this data sheet.
5ns. The average delta of repeated aperture delay
values (also known as aperture jitter) is typically
50ps. These specifications reflect the ability of the
ADS8365 to capture ac input signals accurately at the
exact same moment in time.
REFERENCE
Under normal operation, REFOUT (pin 61) can be
directly connected to REFIN (pin 62) to provide an
internal +2.5V reference to the ADS8365. The
ADS8365 can operate, however, with an external
reference in the range of 1.5V to 2.6V, for a
corresponding full-scale range of 3.0V to 5.2V, as
long as the input does not exceed the AVDD + 0.3V
limit.
The reference output of the ADS8365 has an
impedance of 2kΩ. The high impedance reference
input can be driven directly. For an external resistive
load, an additional buffer is required. A load
capacitance of 0.1µF to 10µF should be applied to
the reference output to minimize noise. If an external
reference is used, the three input buffers provide
isolation between the external reference and the
CDACs. These buffers are also used to recharge all
the capacitors of all CDACs during conversion.
ANALOG INPUT
The analog input is bipolar and fully differential. There
are two general methods of driving the analog input
of the ADS8365: single-ended or differential, as
shown in Figure 21 and Figure 22. When the input is
single-ended, the –IN input is held at the
common-mode voltage. The +IN input swings around
the same common voltage and the peak-to-peak
amplitude is the (common-mode + VREF) and the
(common-mode –VREF). The value of VREF determines
the range over which the common-mode voltage may
vary (see Figure 23).
SAMPLE AND HOLD
Single-Ended Input
The sample-and-hold amplifiers on the ADS8365
allow the ADCs to accurately convert an input sine
wave of full-scale amplitude to 16-bit resolution. The
input bandwidth of the sample-and-hold amplifiers is
greater than the Nyquist rate (Nyquist = 1/2 of the
sampling rate) of the ADC, even when the ADC is
operated at its maximum throughput rate of 250kSPS.
The typical small-signal bandwidth of the
sample-and-hold amplifiers is 10MHz. Typical
aperture delay time (or the time it takes for the
ADS8365 to switch from the sample to the hold mode
following the negative edge of the HOLDX signal) is
-VREF to +VREF
peak-to-peak
ADS8365
Common
Voltage
Differential Input
VREF
peak-to-peak
Common
Voltage
ADS8365
VREF
peak-to-peak
Figure 21. Methods of Driving the ADS8365
Single-Ended or Differential
16
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+IN
CM +VREF
+VREF
CM Voltage
-IN = CM Voltage
-VREF
t
CM -VREF
CM +1/2VREF
Single-Ended Inputs
+IN
+VREF
CM Voltage
-VREF
CM -1/2VREF
-IN
t
Differential Inputs
NOTES:
Common−mode voltage (Differential mode) =
(+IN) ) (−IN)
. Common−mode voltage (Single−ended mode) = −IN
2
The maximum differential voltage between +IN and –IN of the ADS8365 is VREF. See Figure 23 and Figure 24 for a
further explanation of the common voltage range for single-ended and differential inputs.
Figure 22. Using the ADS8365 in the Single-Ended and Differential Input Modes
5
AVDD = 5V
Common-Mode Voltage Range (V)
Common-Mode Voltage Range (V)
5
3.8
4
3
2.7
Single-Ended Input
2.3
2
1.2
1
0
-1
1.0
1.5
2.0
VREF (V)
2.6
2.5
AVDD = 5V
4.55
4
4.0
3
Differential Input
2
1
1.0
0.45
0
-1
3.0
1.0
1.5
2.0
VREF (V)
2.6
2.5
3.0
Figure 23. Single-Ended Input: Common-Mode
Voltage Range vs VREF
Figure 24. Differential Input: Common-Mode
Voltage Range vs VREF
When the input is differential, the amplitude of the
input is the difference between the +IN and –IN input,
or: (+IN) – (–IN). The peak-to-peak amplitude of each
input is ±1/2VREF around this common voltage.
However, since the inputs are 180° out-of-phase, the
peak-to-peak amplitude of the differential voltage is
+VREF to –VREF. The value of VREF also determines
the range of the voltage that may be common to both
inputs, as shown in Figure 24.
In each case, care should be taken to ensure that the
output impedance of the sources driving the +IN and
–IN inputs are matched. Often, a small capacitor
(20pF) between the positive and negative input helps
to match the impedance. Otherwise, a mismatch may
result in offset error, which will change with both
temperature and input voltage.
The input current on the analog inputs depends on a
number of factors, such as sample rate or input
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voltage. Essentially, the current into the ADS8365
charges the internal capacitor array during the
sampling period. After this capacitance has been fully
charged, there is no further input current. The source
of the analog input voltage must be able to charge
the input capacitance (25pF) to a 16-bit settling level
within three clock cycles if the minimum acquisition
time is used. When the converter goes into the hold
mode, the input impedance is greater than 1GΩ.
Care must be taken regarding the absolute analog
input voltage. The +IN and –IN inputs should always
remain within the range of AGND – 0.3V to AVDD +
0.3V.
BIPOLAR INPUTS
The differential inputs of the ADS8365 were designed
to accept bipolar inputs (–VREF and +VREF) around the
common-mode voltage (2.5V), which corresponds to
a 0V to 5V input range with a 2.5V reference. By
using a simple op amp circuit featuring four,
high-precision external resistors, the ADS8365 can
be configured to accept a bipolar input range. The
conventional ±2.5V, ±5V, and ±10V input ranges
could be interfaced to the ADS8365 using the resistor
values shown in Figure 26.
R1
The OPA365 is a good choice for driving the analog
inputs in a 5V, single-supply application.
4kW
TRANSITION NOISE
20kW
1.2kW
The transition noise of the ADS8365 itself is low, as
shown in Figure 25 These histograms were
generated by applying a low-noise dc input and
initiating 8000 conversions. The digital output of the
ADC will vary in output code due to the internal noise
of the ADS8365; this feature is true for all 16-bit,
successive approximation register (SAR) type ADCs.
Using a histogram to plot the output codes, the
distribution should appear bell-shaped, with the peak
of the bell curve representing the nominal code for
the input value. The ±1σ , ±2σ , and ±3σ distributions
represent the 68.3%, 95.5%, and 99.7%, respectively,
of all codes. The transition noise can be calculated by
dividing the number of codes measured by 6, yielding
the ±3σ distribution, or 99.7%, of all codes.
Statistically, up to three codes could fall outside the
distribution when executing 1000 conversions.
Remember, in order to achieve this low-noise
performance, the peak-to-peak noise of the input
signal and reference must be < 50µV.
4000
3500
3290
Bipolar
Input
+IN
OPA227
1.2kW
-IN
R2
ADS8365
OPA227
BIPOLAR INPUT
R1
R2
±10V
±5V
±2.5V
1kW
2kW
4kW
5kW
10kW
20kW
REFOUT (pin 61)
2.5V
Figure 26. Level Shift Circuit for Bipolar Input
Ranges
TIMING AND CONTROL
The ADS8365 uses an external clock (CLK, pin 28)
that controls the conversion rate of the CDAC. With a
5MHz external clock, the ADC sampling rate is
250kSPS which corresponds to a 4µs maximum
throughput time. Acquisition and conversion take a
total of 20 clock cycles.
3379
Occurrences
3000
2500
2000
1500
1000
603
649
5 00
37
42
0
32782
32783
32784 32785
Code
32786
32787
Figure 25. 8000 Conversion Histogram of a DC
Input
18
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THEORY OF OPERATION
and all the output registers, aborts any
conversion in process, and closes the
sampling switches. The reset signal must stay
low for at least 20ns (see Figure 27, tW4). The
reset signal should be back high for at least
20ns (Figure 27, tD2) before starting the next
conversion (negative hold edge).
The ADS8365 contains six 16-bit ADCs that can
operate simultaneously in pairs. The three hold
signals (HOLDA, HOLDB, and HOLDC) initiate the
conversion on the specific channels. A simultaneous
hold on all six channels can occur with all three hold
signals strobed together. The converted values are
saved in six registers. For each read operation, the
ADS8365 outputs 16 bits of information (16 data or 3
channel
address,
data
valid,
and
some
synchronization information). The address/mode
signals (A0, A1, and A2) select how the data are read
from the ADS8365. These address/mode signals can
define a selection of a single channel, a cycle mode
that cycles through all channels, or a FIFO mode that
sequences the data determined by the order of the
hold signals. The FIFO mode will allow the six
registers to be used by a single-channel pair;
therefore, three locations for CH X0 and three
locations for CH X1 can be updated before they are
read from the device.
EOC End of conversion goes low when new data
from the internal ADC are latched into the
output registers, which usually happens 16.5
clock cycles after hold initiated the conversion.
It remains low for half a clock cycle. If more
than one channel pair is converted
simultaneously, the A-channels get stored to
the registers first (16.5 clock cycles after hold),
followed by the B-channels one clock cycle
later, and finally the C-channels another clock
cycle later. If a reading (both RD and CS are
low) is in process, then the latch process is
delayed until the read operation is finished.
FD
EXPLANATION OF CLOCK, RESET, FD, AND
EOC PINS
First data or A0 data are high if channel A0 is
chosen to be read next. In FIFO mode, the
channel (X0) that is written to the FIFO first is
latched into the A0 register. For example,
when the FIFO is empty, FD is 0. The first
result latched into the FIFO register A0 is,
therefore, chosen to be read next, and FD
rises. After the first channel is read (one to
three read cycles, depending on BYTE and
ADD), FD goes low again.
Clock An external clock has to be provided for the
ADS8365. The maximum clock frequency is
5MHz. The minimum clock cycle is 200ns (see
Figure 1, tC1), and the clock has to remain high
(Figure 1, tW1) or low for at least 60ns.
RESET Bringing the RESET signal low will reset the
ADS8365. Resetting clears the control register
tC1
CLK
tW1
tD1
HOLD A
tW3
HOLD B
tD2
tW2
HOLD C
tW4
RESET
Figure 27. Start of the Conversion
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START OF A CONVERSION AND READING
DATA
The ADS8365 can also convert one channel
continuously (see Figure 28). Therefore, HOLDA and
HOLDC are kept high all the time. To gain acquisition
time, the falling edge of HOLDB takes place just
before the rising edge of clock. One conversion
requires 20 clock cycles. Here, data are read after the
next conversion is initiated by HOLDB. To read data
from channel B, A1 is set high and A2 is low. Since
A0 is low during the first reading (A2 A1 A0 = 010),
data B0 are put to the output. Before the second RD,
A0 switches high (A2 A1 A0 = 011) so that data from
channel B1 are read, as shown in Table 1. However,
reading data during the conversion or on a falling
hold edge might cause a loss in performance.
By bringing one, two, or all three of the HOLDX
signals low, the input data of the corresponding
channel X are immediately placed in the hold mode
(5ns). The conversion of this channel X follows with
the next rising edge of clock. If it is important to
detect a hold command during a certain clock-cycle,
then the falling edge of the hold signal has to occur at
least 10ns before the rising edge of clock, as shown
in Figure 27, tD1. The hold signal can remain low
without initiating a new conversion. The hold signal
must be high for at least 15ns (as shown in
Figure 27, tW2) before it is brought low again, and
hold must stay low for at least 20ns (Figure 27, tW3).
Table 1. Address Control for RD Functions
Once a particular hold signal goes low, further
impulses of this hold signal are ignored until the
conversion is finished or the device is reset. When
the conversion is finished (after 16 clock cycles) the
sampling switches close and sample the selected
channel. The start of the next conversion must be
delayed to allow the input capacitor of the ADS8365
to be fully charged. This delay time depends on the
driving amplifier, but should be at least 800ns.
CONVERSION
CLK
1
2
A2
A1
A0
CHANNEL TO BE READ
0
0
0
CH A0
0
0
1
CH A1
0
1
0
CH B0
0
1
1
CH B1
1
0
0
CH C0
1
0
1
CH C1
1
1
0
Cycle mode reads registers CH A0
to CH C1 on successive transitions
of the read line
1
1
1
FIFO mode
ACQUISITION
16
17
18
19
20
1
2
HOLD B
EOC
CS
RD
A0
Figure 28. Timing of One Conversion Cycle
20
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Reading data (RD and CS)
CS being low tells the ADS8365 that the bus on the
board is assigned to the ADS8365. If an ADC shares
a bus with digital gates, there is a possibility that
digital (high-frequency) noise will be coupled into the
ADC. If the bus is just used by the ADS8365, CS can
be hardwired to ground. Reading data at the falling
edge of one of the HOLDX signals might cause noise.
In general, the channel/data outputs are in tri-state.
Both CS and RD must be low to enable these
outputs. RD and CS must stay low together for at
least 40ns (see Figure 1, tD6) before the output data
are valid. RD must remain HIGH for at least 30ns
(see Figure 1, tW5) before bringing it back low for a
subsequent read command.
BYTE
The new data are latched into its output register 16.5
clock cycles after the start of a conversion (next rising
edge of clock after the falling edge of HOLDX). Even
if the ADS8365 is forced to wait until the read
process is finished (RD signal going high) before the
new data are latched into its output register, the
possibility still exists that the new data was latched to
the output register just before the falling edge of RD.
If a read process is initiated around 16.5 clock cycles
after the conversion started, RD and CS should stay
low for at least 50ns (see Figure 1, tW6) to get the
new data stored to its register and switched to the
output.
If there is only an 8-bit bus available on a board, then
BYTE can be set high (see Figure 29). In this case,
the lower eight bits can be read at the output pins
D15 to D8 or D7 to D0 at the first RD signal, and the
higher bits after the second RD signal. If the
ADS8365 is used in the cycle or the FIFO mode, then
the address and data valid information is added to the
data (if ADD is high). In this case, the address will be
read first, then the lower eight bits, and finally the
higher eight bits. If BYTE is low, then the ADS8365
operates in the 16-bit output mode. Here, data are
read between pins DB15 and DB0. As long as ADD is
low, with every RD impulse, data from a new channel
are brought to the output. If ADD is high and the
cycle or the FIFO mode is chosen; the first output
word contains the address, while the second output
word contains the 16-bit data.
CS
RD
BYTE
A0
A0
A1
A1
B0
B0
LOW
HIGH
LOW
HIGH
LOW
HIGH
B1
C0
C1
A0
D7 – D0
Figure 29. Reading Data in Cycling Mode
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ADD Signal
In the cycle and the FIFO mode, it might be desirable
to have address information with the 16-bit output
data. Therefore, ADD can be set high. In this case,
two RD signals (or three readings if the part is
operated with BYTE being high) are necessary to
read data of one channel, while the ADS8365
provides channel information on the first RD signal
(see Table 2 and Table 3).
Soft Trigger Mode
Signals NAP, ADD, A0, A1, A2, RESET, HOLDA,
HOLDB, and HOLDC are accessible through the data
bus and control word. Bits NAP, ADD, A0, A1 and A2
are in an OR configuration with hardware pins. When
software configuration is used, these pins must be
connected to ground. Conversely, the RESET,
HOLDA, HOLDB, and HOLDC bits are in a NAND
configuration with the hardware pins. When software
configuration is used, these pins must be connected
to BVDD.
If conversion timing between ADCs is not critical, Soft
Trigger mode can allow all three HOLDX signals to
be triggered simultaneously. This simultaneous
triggering can be done by tying all three HOLDX pins
high, and issuing a write (CS and WR low) with the
DB0, DB1, DB2, and DB7 bits low, and the reset bit
(DB3) high. Writing a low to the reset bit (DB3) while
the RESET pin is high forces a device reset, and all
HOLDX signals that occur during that time are
ignored.
The HOLDX signals start conversion automatically on
the next clock cycle. The format of the two words that
can be written to the ADS8365 are shown in Table 4.
Bits DB5 and DB4 do not have corresponding
hardware pins. Bit DB5 = 1 enables Powerdown
mode. Bit DB4 = 1 inverts the MSB of the output
data, putting the output data in two's complement
format. When DB4 is low, the data is in straight
binary format.
Table 2. Overview of the Output Formats Depending on Mode When ADD = 0
ADD = 0
BYTE = 0
BYTE = 1
A2 A1 A0
1st RD
2nd RD
1st RD
2nd RD
3rd RD
000
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
001
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
010
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
011
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
100
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
101
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
110
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
111
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
Table 3. Overview of the Output Formats Depending on Mode When ADD = 1
ADD = 1
BYTE = 0
BYTE = 1
A2 A1 A0
1st RD
2nd RD
1st RD
2nd RD
3rd RD
000
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
001
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
010
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
011
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
100
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
101
DB15...DB0
No 2nd RD
DB7...DB0
DB15...DB8
No 3rd RD
110
1000 0000 0000 DV A2 A1 A0
DB15...DB0
DV A2 A1 A0 DB3 DB2 DB0
DB7...DB0
DB15...DB8
111
1000 0000 0000 DV A2 A1 A0
DB15...DB0
DV A2 A1 A0 DB3 DB2 DB0
DB7...DB0
DB15...DB8
DB0 (LSB)
Table 4. Control Register Bits
22
DB7 (MSB)
DB6
DB5
DB4
DB3
DB2
DB1
1
NAP
PD
Invert MSB
ADD
A2
A1
A0
0
X
X
X
RESET
HOLDA
HOLDB
HOLDC
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NAP AND POWERDOWN MODE CONTROL
In order to minimize power consumption when the
ADS8365 is not in use, two low-power options are
available. Nap mode minimizes power without
shutting down the biasing circuitry and internal
reference, allowing immediate recovery after it is
disabled. It can be enabled by either the NAP pin
going high, or setting DB6 in the data register high.
Enabling Powerdown mode results in lower power
consumption than Nap mode, but requires a short
recovery period after disabling. It can only be enabled
by setting DB5 in the data register high.
GETTING DATA
Flexible Output Modes: A0 A1, and A2.
The ADS8365 has three different output modes that
are selected with A2, A1, and A0. The A2, A1 and A0
pins are held with a transparent latch that triggers on
a falling edge of the RD pin negative-ANDed with the
CS pin (that is, if either RD or CS is low, the falling
edge of the other will latch A0-2).
When (A2, A1, A0) = 000 to 101, a particular channel
can be directly addressed (see Table 1 and
Figure 30). The channel address should be set at
least 10ns (see Figure 30, tD9) before the falling edge
of RD and should not change as long as RD is low. In
this standard address mode, ADD will be ignored, but
should be connected to either ground or supply.
When (A2, A1, A0) = 110, the interface is running in a
cycle mode (see Figure 29). Here, data 7 down to
data 0 of channel A0 is read on the first RD signal,
and data 15 down to data 8 on the second as BYTE
is high. Then A1 on the second RD, followed by B0,
CLK
16
17
18
19
B1, C0, and finally, C1 before reading A0 again. Data
from channel A0 are brought to the output first after a
reset signal, or after powering up the device. The
third mode is a FIFO mode that is addressed with
(A2, A1, A0 = 111). Data of the channel that is
converted first is read first. So, if a particular channel
pair is most interesting and is converted more
frequently (for example, to get a history of a particular
channel pair), then there are three output registers
per channel available to store data.
If all the output registers are filled up with unread
data and new data from an additional conversion
must be latched in, then the oldest data is discarded.
If a read process is going on (RD signal low) and new
data must be stored, then the ADS8365 waits until
the read process is finished (RD signal going high)
before the new data gets latched into its output
register. Again, with the ADD signal, it can be chosen
whether the address should be added to the output
data.
New data is always written into the next available
register. At t0 (see Figure 31), the reset deletes all the
existing data. At t1, the new data of the channels A0
and A1 are put into registers 0 and 1. At t2, a dummy
read (RD low) is performed to latch the address data
correctly. At t3, the read process of channel A0 data
is finished; therefore, these data are dumped and A1
data are shifted to register 0. At t4, new data are
available, this time from channels B0, B1, C0, and
C1. These data are written into the next available
registers (registers 1, 2, 3, and 4).
20
1
2
tD1
HOLD X
tACQ
EOC
CS
tD8
tD7
RD
tD9
A0
Figure 30. Timing for Reading Data
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RESET
EOC
Conversion
Channels B and C
Conversion
Channel A
Conversion
Channel C
RD
Register 5
empty
empty
empty
empty
empty
CH C1
Register 4
empty
empty
empty
CH C1
empty
CH C0
Register 3
empty
empty
empty
CH C0
CH C1
CH C1
Register 2
empty
empty
empty
CH B1
CH C0
CH C0
Register 1
empty
CH A1
empty
CH B0
CH B1
CH B1
Register 0
empty
CH A0
CH A1
CH A1
CH B0
CH B0
t0
t2
t1
t3
t4
t5
t6
Figure 31. Functionality Diagram of the FIFO Registers
On t5, the new read process of channel A1 data is
finished. The new data of channel C0 and C1 at t6
are put on top (registers 4 and 5).
In Cycle mode and in FIFO mode, the ADS8365
offers the ability to add the address of the channel to
the output data. Since there is only a 16-bit bus
available (or 8-bit bus in the case BYTE is high), an
additional RD signal is necessary to get the
information (see Table 2 and Table 3).
In FIFO mode, a dummy read signal (RD) is required
after a reset signal to set the address bits
appropriately; otherwise, the first conversion will not
be valid. This is only necessary in FIFO mode.
The Output Code (DB15 …DB0)
In the standard address mode (A2 A1 A0 =
000…101), the ADS8365 has a 16-bit output word on
pins DB15…DB0, if BYTE = 0. If BYTE = 1, then two
RD impulses are necessary to first read the lower
bits, and then the higher bits on either DB7…DB0 or
DB15...DB8.
If the ADS8365 operates in Cycle or in FIFO mode
and ADD is set high, then the address of the channel
(A2A1A0) and a data valid (DV) bit are added to the
data. If BYTE = 0, then the data valid and the
address of the channel is active during the first RD
impulse (1000 0000 0000 DV A2 A1 A0). During the
24
second RD, the 16-bit data word can be read
(DB15…DB0). If BYTE = 1, then three RD impulses
are needed. On the first RD impulse, data valid, the
three address bits, and data bits DB3…DB0 (DV, A2,
A1, A0, DB3, DB2, DB1, DB0) are read, followed by
the eight lower bits of the 16-bit data word
(db7…db0), and finally the higher eight data bits
(DB15…DB8). 1000 0000 0000 is added before the
address in case BYTE = 0, and DB3…DB0 is added
after the address if BYTE = 1. This provides the
possibility to check if the counting of the RD signals
inside the ADS8365 are still tracking with the external
interface (see Table 2 and Table 3).
The data valid bit is useful for the FIFO mode. Valid
data can simply be read until the data valid bit equals
0. The three address bits are listed in Table 5. If the
FIFO is empty, 16 zeroes are loaded to the output.
Table 5. Address Bit in the Output Data
DATA FROM ...
A2
A1
A0
Channel A0
0
0
0
Channel A1
0
0
1
Channel B0
0
1
0
Channel B1
0
1
1
Channel C0
1
0
0
Channel C1
1
0
1
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0111111111111111
65535
0111111111111110
65534
0111111111111101
65533
0000000000000001
32769
0000000000000000
32768
1111111111111111
32767
1000000000000010
Step
Digital Output Code
Binary Two's Complement (BTC)
2
1000000000000001
1
1000000000000000
0
2.499962V
VNFS = VCM - VREF = 0V
0.000038V
2.500038V
VPFS = VCM + VREF = 5V
VPFS - 1LSB = 4.999924V
VBPZ = 2.5V
0.000076V
4.999848V
Unipolar Analog Input Voltage
0.000152V
1LSB = 76V
VCM = 2.5V
16-BIT
VREF = 2.5V
Bipolar Input, Binary Two’s Complement Output: (BTC)
Negative Full-Scale Code = VNFS = 8000H, Vcode = VCM - VREF
Bipolar Zero Code
= VBPZ = 0000H, Vcode = VCM
Positive Full-Scale Code = VPFS = 7FFFH, Vcode = (VCM + VREF) - 1LSB
Figure 32. Ideal Conversion Characteristics (Condition: Single-Ended, VCM = chXX– = 2.5V, VREF = 2.5V)
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LAYOUT
For optimum performance, care should be taken with
the physical layout of the ADS8365 circuitry. This
recommendation is particularly true if the CLK input is
approaching the maximum throughput rate.
The basic SAR architecture is sensitive to glitches or
sudden changes on the power supply, reference,
ground connections, and digital inputs that occur just
prior to latching the output of the analog comparator.
Thus, driving any single conversion for an n-bit SAR
converter, there are n windows in which large
external transient voltages can affect the conversion
result. Such glitches might originate from switching
power supplies, nearby digital logic, or high-power
devices. The degree of error in the digital output
depends on the reference voltage, layout, and the
exact timing of the external event. Their error can
change if the external event changes in time with
respect to the CLK input.
capacitor and a 5Ω or 10Ω series resistor may be
used to low-pass filter a noisy supply. On average,
the ADS8365 draws very little current from an
external reference because the reference voltage is
internally buffered. A bypass capacitor of 0.1µF and
10µF are suggested when using the internal
reference (tie pin 61 directly to pin 62).
GROUNDING
The AGND pins should be connected to a clean
ground point. In all cases, this point should be the
analog ground. Avoid connections that are too close
to the grounding point of a microcontroller or digital
signal processor. If required, run a ground trace
directly from the converter to the power-supply entry
point. The ideal layout includes an analog ground
plane dedicated to the converter and associated
analog circuitry. Three signal ground pins (SGND) are
the input signal grounds that are on the same
potential as analog ground.
With this information in mind, power to the ADS8365
should be clean and well-bypassed. A 0.1µF ceramic
bypass capacitor should be placed as close to the
device as possible. In addition, a 1µF to 10µF
capacitor is recommended. If needed, an even larger
26
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APPLICATION INFORMATION
Different connection diagrams to DSPs or microcontrollers are shown in Figure 33 through Figure 39.
5V
5V
2.048V
REF3220
AVDD
REFIN
100nF
5V
V+
-IN
REFOUT
100kW
20kW
OPA343
SENSE
OUT
100W
0.5V to 4.5V
CH A0+
VIN
A0
+IN
100kW
40kW
REF 2
100W
1nF
CH A02.5V
40kW
±10V
VREF
REF 1
INA159
ADS8365
100W
VIN
A1
CH A1+
OUT
-IN
INA159
+IN
100W
1nF
CH A1-
REF 1/2
CH B0+
CH B0CH B1+
CH B1CH C0+
CH C0100W
VIN
C1
INA159
+IN
CH C1+
OUT
-IN
100W
1nF
CH C1-
REF 1/2
SGND
AGND
Figure 33. ±10V Input Range By Using the INA159
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3.3V
ADS8365
BVDD
BVDD
HOLDA
HOLDB
26
30
23
55
HOLDC
FD
WR
A0
ADD
A1
BYTE
A2
CS
DVDD
56
PWM1
57
PWM2
58
PWM3
54
EA0
53
EA1
52
31
EA2
EA3
8:1
OE
RD
EOC
CLK
RESET
IS
29
RE
27
EXT_INT1
28
MCLKX
51
DATA [0]
...
DATA [15]
C28xx
ADC_RST (MFSX)
D0
...
D15
48
...
33
VSS
BGND
Figure 34. Typical C28xx Connection (Hardware Control)
BVDD
3.3V
ADS8365
56
57
58
26
23
55
54
HOLDA
C28xx
DVDD
BVDD
HOLDB
A2
HOLDC
A1
FD
8:1
ADD
BYTE
CS
A0
RD
53
A1
WR
52
A2
EOC
CLK
DATA [0]
...
DATA [15]
31
OE
29
A0
IS
RE
30
WE
27
EXT_INT1
28
MCLKX
48
...
33
BGND
D0
...
D15
VSS
Figure 35. Typical C28xx Connection (Software Control)
28
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3.3V
ADS8365
BVDD
BVDD
HOLDA
30
53
52
23
54
WR
HOLDB
A1
HOLDC
DVDD
56
TOUT1
57
A2
58
A1
8:1
A2
ADD
CS
BYTE
A0
RD
EOC
CLK
RESET
31
A0
IS
OE
55
BE0
29
RE
27
INT0
28
TOUT0
51
DATA [0]
...
DATA [15]
C67xx
DB_CNTL0 (ED27)
D0
...
D15
48
...
33
VSS
BGND
Figure 36. Typical C67xx Connection (Cycle Mode—Hardware Control)
BVDD
3.3V
ADS8365
56
57
58
26
23
55
54
HOLDA
C67xx
DVDD
BVDD
HOLDB
HOLDC
A2
A1
FD
8:1
ADD
BYTE
CS
A0
RD
31
OE
29
RE
30
53
A1
WR
52
A2
EOC
CLK
DATA [0]
...
DATA [15]
A0
IS
WE
27
INT0
28
TOUT0
48
...
33
BGND
D0
...
D15
VSS
Figure 37. Typical C67xx Connection (Software Control)
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
29
ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
3.3V
ADS8365
BVDD
BVDD
HOLDA
HOLDB
26
54
53
52
30
23
55
HOLDC
FD
DVDD
56
TOUT0
57
A2
58
A1
8:1
A0
CS
A1
C54xx
31
A0
OE
IS
29
A2
RD
WR
30
27
ADD
EOC
BYTE
CLK
<1
I/OSTRB
(1G32)
28
INT0
51
BCLKX1
RESET
XF
DATA [0]
...
DATA [15]
D0
...
D15
48
...
33
VSS
BGND
Figure 38. Typical C54xx Connection (FIFO Mode—Hardware Control)
3.3V
ADS8365
BVDD
BVDD
HOLDA
30
52
54
53
23
55
29
WR
HOLDB
ADD
HOLDC
A1
CS
A2
RESET
BYTE
EOC
A0
CLK
RD
DATA [0]
...
DATA [7]
MSP430x1xx
DVDD
56
TACLK (P1.0)
57
58
31
P1.1
51
P1.2
27
P1.3 (ADC_INT)
28
SMCLK (P1.4)
48
...
41
BGND
P2.0
...
P2.7
VSS
Figure 39. Typical MSP430x1xx Connection (Cycle Mode—Hardware Control)
30
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
ADS8365
www.ti.com.................................................................................................................................................... SBAS362C – AUGUST 2006 – REVISED MARCH 2008
Part Change Notification # 20071210003
The ADS8365 device underwent a silicon change under Texas Instruments Part Change Notification (PCN)
number 20071210003. Details of this change can be obtained from the Product Information Center at Texas
Instruments or by contacting your local sales/distribution office. Devices with a date code of 81x and higher are
covered by this PCN.
Submit Documentation Feedback
Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
31
ADS8365
SBAS362C – AUGUST 2006 – REVISED MARCH 2008.................................................................................................................................................... www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (November 2006) to Revision C ........................................................................................... Page
•
32
Added Part Change Notification information........................................................................................................................ 31
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Copyright © 2006–2008, Texas Instruments Incorporated
Product Folder Link(s): ADS8365
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
ADS8365IPAG
ACTIVE
TQFP
PAG
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
-40 to 85
ADS8365AI
ADS8365IPAGG4
ACTIVE
TQFP
PAG
64
160
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
-40 to 85
ADS8365AI
ADS8365IPAGR
ACTIVE
TQFP
PAG
64
1500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-4-260C-72 HR
-40 to 85
ADS8365AI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS8365IPAGR
Package Package Pins
Type Drawing
TQFP
PAG
64
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1500
330.0
24.4
Pack Materials-Page 1
13.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
13.0
1.5
16.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS8365IPAGR
TQFP
PAG
64
1500
350.0
350.0
43.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF006A – JANUARY 1995 – REVISED DECEMBER 1996
PAG (S-PQFP-G64)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
48
0,08 M
33
49
32
64
17
0,13 NOM
1
16
7,50 TYP
Gage Plane
10,20
SQ
9,80
12,20
SQ
11,80
0,25
0,05 MIN
1,05
0,95
0°– 7°
0,75
0,45
Seating Plane
0,08
1,20 MAX
4040282 / C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
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• DALLAS, TEXAS 75265
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