Texas Instruments | DAC5672-EP (Rev. A) | Datasheet | Texas Instruments DAC5672-EP (Rev. A) Datasheet

Texas Instruments DAC5672-EP (Rev. A) Datasheet
DAC5672-EP
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SGLS339A – JUNE 2006 – REVISED OCTOBER 2006
DUAL 14-BIT 200-MSPS DIGITAL-TO-ANALOG CONVERTER
FEATURES
•
•
•
•
•
•
•
•
•
•
(1)
Controlled Baseline
– One Assembly
– One Test Site
– One Fabrication Site
Extended Temperature Performance of
–55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree (1)
14-Bit Dual Transmit Digital-to-Analog
Converter (DAC)
200-MSPS Update Rate
Single Supply: 3 V to 3.6 V
High Spurious-Free Dynamic Range (SFDR):
84 dBc at 5 MHz
High Third-Order Two-Tone Intermodulation
(IMD3): 79 dBc at 15.1 MHz and 16.1 MHz
•
•
•
•
•
•
•
•
WCDMA Adjacent Channel Leakage Ratio
(ACLR): 78 dB at Baseband
WCDMA ACLR: 73 dB at 30.72 MHz
Independent or Single Resistor Gain Control
Dual or Interleaved Data
On-Chip 1.2-V Reference
Low Power: 330 mW
Power-Down Mode: 9 mW
Package: 48-Pin Thin-Quad Flat Pack (TQFP)
APPLICATIONS
•
•
•
•
•
Cellular Base Transceiver Station Transmit
Channel
– CDMA: W-CDMA, CDMA2000, IS-95
– TDMA: GSM, IS-136, EDGE/UWC-136
Medical/Test Instrumentation
Arbitrary Waveform Generators (ARB)
Direct Digital Synthesis (DDS)
Cable Modem Termination System (CMTS)
Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION
The DAC5672 is a monolithic, dual-channel, 14-bit, high-speed digital-to-analog converter (DAC) with on-chip
voltage reference.
Operating with update rates of up to 200 MSPS, the DAC5672 offers exceptional dynamic performance, tight
gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication
applications.
Each DAC has a high-impedance, differential-current output, suitable for single-ended or differential
analog-output configurations. External resistors allow scaling the full-scale output current for each DAC
separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature
compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.
The DAC5672 has two 14-bit parallel input ports with separate clocks and data latches. For flexibility, the
DAC5672 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.
The DAC5672 has been specifically designed for a differential transformer-coupled output with a 50-Ω
doubly-terminated load. For a 20-mA full-scale output current, both a 4:1 impedance ratio (resulting in an output
power of 4 dBm) and 1:1 impedance ratio transformer (–2 dBm output power) are supported.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
DAC5672-EP
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SGLS339A – JUNE 2006 – REVISED OCTOBER 2006
DESCRIPTION (CONTINUED)
The DAC5672 is available in a 48-pin thin quad flat pack (TQFP) package. Pin compatibility between family
members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5672 is pin
compatible to the DAC2904 and AD9767 dual DACs. The device is characterized for operation over the military
temperature range of –55°C to 125°C.
FUNCTIONAL BLOCK DIAGRAM
WRTB
WRTA
CLKB
CLKA
DEMUX
IOUTA1
Latch A
14−b DAC
DA[13:0]
IOUTA2
BIASJ_A
IOUTB1
Latch B
DB[13:0]
14−b DAC
MODE
IOUTB2
BIASJ_B
GSET
1.2 V Reference
EXTIO
SLEEP
DVDD
DGND
AVDD
AGND
AVAILABLE OPTIONS
PACKAGED DEVICES
48-PIN TQFP
TA
DAC5672MPFBREP
–55 C to 125 C
2
DAC5672MPFBEP
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MODE
AVDD
IOUTA1
IOUTA2
BIASJ_A
EXTIO
GSET
BIASJ_B
IOUTB2
IOUTB1
AGND
SLEEP
DEVICE INFORMATION
1
48 47 46 45 44 43 42 41 40 39 38 37
36
2
35
3
34
4
33
5
32
Top View
48-Pin TQFP
PFB Package
6
7
31
30
8
29
9
28
10
27
11
26
25
12
13 14 15 16 17 18 19 20 21 22 23 24
DB0 (LSB)
DB1
DB2
DB3
DB4
DB5
DB6
DB7
DB8
DB9
DB10
DB11
DA1
DA0 (LSB)
DGND
DVDD
WRTA/WRTIQ
CLKA/CLKIQ
CLKB/RESETIQ
WRTB/SELECTIQ
DGND
DVDD
DB13 (MSB)
DB12
DA13 (MSB)
DA12
DA11
DA10
DA9
DA8
DA7
DA6
DA5
DA4
DA3
DA2
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NO.
AGND
38
I
Analog ground
AVDD
47
I
Analog supply voltage
BIASJ_A
44
O
Full-scale output current bias for DACA
BIASJ_B
41
O
Full-scale output current bias for DACB
CLKA/CLKIQ
18
I
Clock input for DACA, CLKIQ in interleaved mode
CLKB/RESETIQ
19
I
Clock input for DACB, RESETIQ in interleaved mode
1–14
I
Data port A. DA13 is MSB and DA0 is LSB.
DB[13:0]
23–36
I
Data port B. DB13 is MSB and DB0 is LSB.
DGND
15, 21
I
Digital ground
DVDD
16, 22
I
Digital supply voltage
EXTIO
43
I/O
GSET
42
I
Gain-setting mode: H = 1 resistor, L = 2 resistors. Internal pullup.
IOUTA1
46
O
DACA current output. Full scale with all bits of DA high.
IOUTA2
45
O
DACA complementary current output. Full scale with all bits of DA low.
IOUTB1
39
O
DACB current output. Full scale with all bits of DB high.
IOUTB2
40
O
DACB complementary current output. Full scale with all bits of DB low.
MODE
48
I
Mode select: H = dual bus, L = interleaved. Internal pullup.
SLEEP
37
I
Sleep function control input: H = DAC in power-down mode, L = DAC in operating mode.
Internal pulldown.
WRTA/WRTIQ
17
I
Input write signal for PORT A (WRTIQ in interleaving mode)
WRTB/SELECTIQ
20
I
Input write signal for PORT B (SELECTIQ in interleaving mode)
DA[13:0]
Internal reference output (bypass with 0.1 µF to AGND) or external reference input
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PFB PACKAGE THERMAL CHARACTERISTICS
PARAMETER
POWERPAD CONNECTED TO PCB THERMAL PLANE
Thermal resistance, junction to ambient
63.7°C/W
Thermal resistance, junction to case
19.6°C/W
1000
Wirebond Voiding Fail Mode
Years Estimated Life
100
10
Electromigration Fail Mode
1
0.1
100
110
120
130
140
Continuous TJ − 5C
Figure 1. DAC5672MPFB Operating Life Derating Chart
4
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150
160
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ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
UNIT
Supply voltage range
AVDD (2)
–0.5 V to 4 V
DVDD (3)
–0.5 V to 4 V
Voltage between AGND and DGND
–0.5 V to 0.5 V
Voltage between AVDD and DVDD
–0.5 V to 0.5 V
Supply voltage range
DA[13:0] and DB[13:0] (3)
–0.5 V to DVDD + 0.5 V
MODE, CLKA, CLKB, WRTA, WRTB (3)
–0.5 V to DVDD + 0.5 V
IOUTA1, IOUTA2, IOUTB1, IOUTB2 (2)
–1 V to AVDD + 0.5 V
EXTIO, BIASJ_A, BIASJ_B, SLEEP (2)
–0.5 V to AVDD + 0.5 V
Peak input current (any input)
20 mA
Peak total input current (all inputs)
–30 mA
Operating free-air temperature range
–55 C to 125 C
Storage temperature range
–65 C to 150 C
Lead temperature
(1)
(2)
(3)
1,6 mm (1/16 in) from the case for 10 s
260
C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Measured with respect to AGND
Measured with respect to DGND
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
DC Specifications
Resolution
DC
14
Bits
Accuracy (1)
INL
Integral nonlinearity
1 LSB = IOUTFS/214
DNL
Differential nonlinearity
1 LSB = IOUTFS/214
TA = 25°C
–4
1.1
4
TA = –55°C and 125°C
–5
1.1
5
TA = 25°C
–3
0.75
3
TA = –55°C and 125°C
–4
0.75
4
LSB
LSB
Analog Output
Offset error
Mid-scale value
0.03
%FSR
Offset mismatch
Mid-scale value
0.03
%FSR
With external reference at 1.25 V
0.25
With internal reference
0.25
Gain error
Minimum full-scale output current (2)
2
Maximum full-scale output current (2)
20
Gain mismatch
Output resistance
CO
Output capacitance
(1)
(2)
(3)
mA
mA
With external reference
–2
0.2
2
With internal reference
–2
0.2
2
Output voltage compliance range (3)
RO
%FSR
–0.8
1.25
%FSR
V
300
kΩ
5
pF
Measured differentially through 50 Ω to AGND.
Nominal full-scale current, IOUTFS, equals 32× the IBIAS current.
The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown,
resulting in reduced reliability of the DAC5672 device. The upper limit of the output compliance is determined by the load resistors and
full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity.
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ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set mode
(unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX
UNIT
Reference Output
Reference voltage
1.14
1.2
Reference output current (4)
1.26
V
100
nA
Reference Input
VEXTI
Input voltage
0.1
1.25
V
O
RI
Input resistance
CI
1
MΩ
Small signal bandwidth
300
kHz
Input capacitance
100
pF
Temperature Coefficients
Offset drift
Gain drift
With external reference
20
With internal reference
40
ppm of
FSR/ C
20
ppm/ C
Reference voltage drift
(4)
ppm of
FSR/ C
2
Use an external buffer amplifier with high-impedance input to drive any external load.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, fDATA = 200 MSPS, fOUT = 1 MHz,
independent gain set mode (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Power Supply
AVDD
Analog supply voltage
3
3.3
3.6
V
DVDD
Digital supply voltage
3
3.3
3.6
V
Including output current through load
resistor
75
90
Sleep mode with clock
2.5
6
Sleep mode without clock
2.5
IAVDD
IDVDD
Supply current, analog
Supply current, digital
Sleep mode with clock
Sleep mode without clock
25
38
13.4
18
6
mA
0.6
330
Power dissipation
mA
Sleep mode with clock
53
Sleep mode without clock
9.2
fDATA = 200 MSPS, fOUT = 20 MHz
350
390
mW
APSRR
Analog power-supply rejection ratio
–0.2
–0.01
0.2
%FSR/V
DPSRR
Digital power-supply rejection ratio
–0.2
0
0.2
%FSR/V
TA
Operating free-air temperature
–55
125
°C
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ELECTRICAL CHARACTERISTICS
AC specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA, independent gain set
mode, differential 1:1 impedance ratio transformer coupled output, 50-Ω doubly terminated load (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
200
275 (1)
MAX
UNIT
Analog Output
fclk
Maximum output update rate
ts
Output settling time to 0.1% (DAC)
tr
tf
MSPS
20
ns
Output rise time 10% to 90% (OUT)
1.4
ns
Output fall time 90% to 10% (OUT)
1.5
ns
Output noise
Mid-scale transition
IOUTFS = 20 mA
55
IOUTFS = 2 mA
30
pA/√Hz
AC Linearity (estimates based on measurements of preliminary parts)
SFDR
SNR
ACLR
IMD3
IMD
Spurious-free dynamic range
Signal-to-noise ratio
Adjacent channel leakage ratio
Third-order two-tone
intermodulation
Four-tone intermodulation
Channel isolation
(1)
1st Nyquist zone, TA = 25 C, fDATA = 50 MSPS,
fOUT = 1 MHz, IOUTFS = 0 dB
83
1st Nyquist zone, TA = 25 C, fDATA = 50 MSPS,
fOUT = 1 MHz, IOUTFS = –6 dB
80
1st Nyquist zone, TA = 25 C, fDATA = 50 MSPS,
fOUT = 1 MHz, IOUTFS = –12 dB
79
1st Nyquist zone, TA = 25 C, fDATA = 100 MSPS,
fOUT = 5 MHz
84
1st Nyquist zone, TA = 25 C, fDATA = 100 MSPS,
fOUT = 20 MHz
79
1st Nyquist zone, TA = 25 C, fDATA = 200 MSPS,
fOUT = 20 MHz
68
75
1st Nyquist zone, TA = –55 C to 125 C,
fDATA = 200 MSPS,
fOUT = 20 MHz
65
75
1st Nyquist zone, TA = 25 C, fDATA = 200 MSPS,
fOUT = 41 MHz
72
1st Nyquist zone, TA = 25 C, fDATA = 100 MSPS,
fOUT = 5 MHz
77
1st Nyquist zone, TA = 25 C, fDATA = 160 MSPS,
fOUT = 20 MHz
70
W-CDMA signal with 3.84-MHz bandwidth,
fDATA = 61.44 MSPS, IF = 15.360 MHz
75
W-CDMA signal with 3.84-MHz bandwidth,
fDATA = 122.88 MSPS, IF = 30.72 MHz
73
W-CDMA signal with 3.84-MHz bandwidth,
fDATA = 61.44 MSPS, baseband
78
W-CDMA signal with 3.84-MHz bandwidth,
fDATA = 122.88 MSPS, baseband
78
Each tone at –6 dBFS, TA = 25 C,
fDATA = 200 MSPS, fOUT = 45.4 MHz and 46.4 MHz
65
Each tone at –6 dBFS, TA = 25 C,
fDATA = 100 MSPS, fOUT = 15.1 MHz and 16.1 MHz
79
Each tone at –12 dBFS, TA = 25 C,
fDATA = 100 MSPS,
fOUT = 15.6, 15.8, 16.2, and 16.4 MHz
79
Each tone at –12 dBFS, TA = 25 C,
fDATA = 165 MSPS,
fOUT = 68.8, 69.6, 71.2, and 72 MHz
61
Each tone at –12 dBFS, TA = 25 C,
fDATA = 165 MSPS,
fOUT = 19, 19.1, 19.3, and 19.4 MHz
73
TA = 25 C, fDATA = 165 MSPS, fOUT (CH1) = 20 MHz,
fOUT (CH2) = 21 MHz
95
dBc
dB
dB
dBc
dBc
dBc
Specified by design. Not production tested.
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ELECTRICAL CHARACTERISTICS
Digital specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA
(unless otherwise noted)
PARAMETER
MIN
TYP MAX
UNIT
Digital Input
VIH
High-level input voltage
2
3.3
V
VIL
Low-level input voltage
0
0.8
V
IIH
High-level input current
50
A
IIL
Low-level input current
10
A
IIH(GSET)
High-level input current, GSET pin
7
A
IIL(GSET)
Low-level input current, GSET pin
–80
A
IIH(MODE)
High-level input current, MODE pin
–30
A
IIL(MODE)
Low-level input current, MODE pin
–80
A
CI
Input capacitance
5
pF
SWITCHING CHARACTERISTICS
Digital specifications over operating free-air temperature range, AVDD = DVDD = 3.3 V, IOUTFS = 20 mA
(unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
Timing – Dual-Bus Mode
tsu
Input setup time
1
th
Input hold time
1
tLPH
Input clock pulse high time
tLAT
Clock latency (WRTA/B to
tPD
Propagation delay time
ns
ns
1
outputs) (1)
4
ns
4
clk
1.5
ns
ns
Timing – Single-Bus Interleaved Mode
tsu
Input setup time
0.5
th
Input hold time
0.5
tLAT
Clock latency (WRTA/B to outputs) (1)
tPD
Propagation delay time
(1)
8
4
1.5
Specified by design
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4
clk
ns
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INL − Integral Nonlinearity Error − LSB
TYPICAL CHARACTERISTICS
INTEGRAL NONLINEARITY
vs
INPUT CODE
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
0
2000
4000
6000
8000
10000
12000
14000
Input Code
16000
G001
DNL − Differential Nonlinearity Error − LSB
Figure 2.
DIFFERENTIAL NONLINEARITY
vs
INPUT CODE
1.0
0.8
0.6
0.4
0.2
0.0
−0.2
−0.4
−0.6
−0.8
−1.0
0
2000
4000
6000
8000
10000
Input Code
12000
14000
16000
G002
Figure 3.
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TYPICAL CHARACTERISTICS (continued)
SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
100
SFDR − Spurious-Free Dynamic Range − dBc
SFDR − Spurious-Free Dynamic Range − dBc
100
95
0 dBfS
90
−6 dBfS
85
80
−12 dBfS
75
70
65
fdata = 52 MSPS
Dual Bus Mode
60
0 dBfS
90
−6 dBfS
85
80
−12 dBfS
75
70
65
fdata = 78 MSPS
Dual Bus Mode
60
0
4
8
12
16
20
fout − Output Frequency − MHz
0
5
G003
15
20
25
Figure 4.
Figure 5.
SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
SPURIOUS-FREE DYNAMIC RANGE
vs
OUTPUT FREQUENCY
30
G004
SFDR − Spurious-Free Dynamic Range − dBc
100
95
0 dBfS
90
85
−6 dBfS
80
−12 dBfS
75
70
65
fdata = 100 MSPS
Dual Bus Mode
60
95
90
0 dBfS
85
80
−6 dBfS
75
−12 dBfS
70
65
fdata = 165 MSPS
Dual Bus Mode
60
0
5
10
15
20
25
30
fout − Output Frequency − MHz
35
0
5
G005
Figure 6.
10
10
fout − Output Frequency − MHz
100
SFDR − Spurious-Free Dynamic Range − dBc
95
10 15 20 25 30 35 40 45 50 55 60
fout − Output Frequency − MHz
Figure 7.
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TYPICAL CHARACTERISTICS (continued)
SINGLE-TONE SPECTRUM
SINGLE-TONE SPECTRUM
0
0
fdata = 78 MSPS
fOUT = 15 MHz
Dual Bus Mode
fdata = 165 MSPS
fOUT = 30.1 MHz
Dual Bus Mode
−20
Power − dBm
Power − dBm
−20
−40
−60
−80
−40
−60
−80
−100
0.0
7.8
15.6
23.4
31.2
−100
0.0
39.0
16.5
f − Frequency − MHz
33.0
49.5
66.0
82.5
f − Frequency − MHz
G007
G008
Figure 8.
Figure 9.
TWO-TONE IMD3
vs
OUTPUT FREQUENCY
TWO-TONE IMD3
vs
OUTPUT FREQUENCY
95
100
95
90
85
Two-Tone IMD3 − dBc
Two-Tone IMD3 − dBc
90
80
75
70
85
80
75
70
65
60
fdata = 78 MSPS
Dual Bus Mode
fout2 = fout1 + 1 MHz
65
fdata = 165 MSPS
Dual Bus Mode
fout2 = fout1 + 1 MHz
55
60
50
0
5
10
15
20
25
30
fout1 − Output Frequency − MHz
35
0
G009
Figure 10.
10
20
30
40
fout1 − Output Frequency − MHz
50
G010
Figure 11.
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TYPICAL CHARACTERISTICS (continued)
TWO-TONE SPECTRUM
TWO-TONE SPECTRUM
fdata = 165 MSPS
fdata = 78 MSPS
fout1 = 20.1 MHz
fout2 = 21.1 MHz
Dual Bus Mode
−10
−10 fout1 = 30.1 MHz
fout2 = 31.1 MHz
Dual Bus Mode
−30
Power − dBm
Power − dBm
−30
−50
−70
−90
−50
−70
−90
−110
19.0
19.5
20.0
20.5
21.0
21.5
−110
29.0
22.0
29.5
f − Frequency − MHz
30.0
30.5
31.0
31.5
G011
G012
Figure 12.
Figure 13.
POWER
vs
FREQUENCY
POWER
vs
FREQUENCY
−20
−20
fdata = 122.88 MSPS
Baseband Signal
Dual Bus Mode
−40
Power − dBm
Power − dBm
−40
−60
−80
−100
fdata = 61.44 MSPS
IF = 15.36 MHz
ACLR = 75.18 dB
Dual Bus Mode
−60
−80
−100
−120
0
1
2
3
4
5
6
7
8
9
10
−120
7.6
f − Frequency − MHz
10.1
12.6
15.1
17.6
20.1
22.6
f − Frequency − MHz
G014
G013
Figure 14.
12
32.0
f − Frequency − MHz
Figure 15.
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TYPICAL CHARACTERISTICS (continued)
POWER
vs
FREQUENCY
POWER
vs
FREQUENCY
−20
−40
Power − dBm
Power − dBm
−40
−20
fdata = 122.88 MSPS
IF = 15.36 MHz
ACLR = 77.16 dB
Dual Bus Mode
−60
−80
−100
−120
7.6
fdata = 122.88 MSPS
IF = 30.72 MHz
ACLR = 72.7 dB
Dual Bus Mode
−60
−80
−100
10.1
12.6
15.1
17.6
20.1
22.6
−120
23.0
25.5
f − Frequency − MHz
28.0
30.5
33.0
35.5
38.0
f − Frequency − MHz
G015
G016
Figure 16.
Figure 17.
DIGITAL INPUTS AND TIMING
Digital Inputs
The data input ports of the DAC5672 accept a standard positive coding with data bits DA13 and DB13 being the
most significant bits (MSBs). The converter outputs are specified to support a clock rate up to 200 MSPS. The
best performance is typically achieved with a symmetric duty cycle for write and clock; however, the duty cycle
may vary as long as the timing specifications are met. Similarly, the setup and hold times may be chosen within
their specified limits.
All digital inputs of the DAC5672 are CMOS compatible. Figure 18 and Figure 19 show schematics of the
equivalent CMOS digital inputs of the DAC5672. The 14-bit digital data input follows the offset positive binary
coding scheme. The DAC5672 is designed to operate with a digital supply (DVDD) of 3 V to 3.6 V.
DVDD
DA[13:0]
DB[13:0]
SLEEP
CLKA/B
WRTA/B
Internal
Digital In
DGND
Figure 18. CMOS/TTL Digital Equivalent Input With Internal Pulldown Resistor
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DIGITAL INPUTS AND TIMING (continued)
DVDD
Internal
Digital In
GSET
MODE
DGND
Figure 19. CMOS/TTL Digital Equivalent Input With Internal Pullup Resistor
Input Interfaces
The DAC5672 features two operating modes selected by the MODE pin (see Table 1).
• For dual-bus input mode, the device essentially consists of two separate DACs. Each DAC has its own
separate data input bus, clock input, and data write signal (data latch-in).
• In single-bus interleaved mode, the data must be presented interleaved at the A-channel input bus. The
B-channel input bus is not used in this mode. The clock and write input are now shared by both DACs.
Table 1. Operating Modes
MODE PIN
MODE pin connected to DGND
MODE pin connected to DVDD
BUS INPUT
Single-bus interleaved mode, clock and write input equal for both DACs
Dual-bus mode, DACs operate independently
Dual-Bus Data Interface and Timing
In dual-bus mode, the MODE pin is connected to DVDD. The two converter channels within the DAC5672
consist of two independent, 14-bit, parallel data ports. Each DAC channel is controlled by its own set of write
(WRTA, WRTB) and clock (CLKA, CLKB) lines. The WRTA/B lines control the channel input latches and the
CLKA/B lines control the DAC latches. The data is first loaded into the input latch by a rising edge of the
WRTA/B line.
The internal data transfer requires a correct sequence of write and clock inputs, since essentially two clock
domains having equal periods (but possibly different phases) are input to the DAC5672. This is defined by a
minimum requirement of the time between the rising edge of the clock and the rising edge of the write inputs.
This essentially implies that the rising edge of CLKA/B must occur at the same time or before the rising edge of
the WRTA/B signal. A minimum delay of 2 ns must be maintained if the rising edge of the clock occurs after the
rising edge of the write. Note that these conditions are satisfied when the clock and write inputs are connected
externally. Note that all specifications were measured with the WRTA/B and CLKA/B lines connected together.
14
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DIGITAL INPUTS AND TIMING (continued)
DA[13:0]/DB[13:0]
Valid Data
tsu
th
t1ph
WRTA/WRTB
CLKA/CLKB
tsettle
tpd
tLAT
IOUT
or
IOUT
Figure 20. Dual-Bus Mode Operation
Single-Bus Interleaved Data Interface and Timing
In single-bus interleaved mode, the MODE pin is connected to DGND. Figure 21 shows the timing diagram. In
interleaved mode, the A and B channels share the write input (WRTIQ) and update clock (CLKIQ and internal
CLKDACIQ). Multiplexing logic directs the input word at the A-channel input bus to either the A-channel input
latch (SELECTIQ is high) or to the B-channel input latch (SELECTIQ is low). When SELECTIQ is high, the data
value in the B-channel latch is retained by presenting the latch output data to its input again. When SELECTIQ
is low, the data value in the A-channel latch is retained by presenting the latch output data to its input.
In interleaved mode, the A-channel input data rate is twice the update rate of the DAC core. As in dual-bus
mode, it is important to maintain a correct sequence of write and clock inputs. The edge-triggered flip-flops latch
the A- and B-channel input words on the rising edge of the write input (WRTIQ). This data is presented to the Aand B-DAC latches on the following falling edge of the write inputs. The DAC5672 clock input is divided by a
factor of two before it is presented to the DAC latches.
Correct pairing of the A- and B-channel data is done by RESETIQ. In interleaved mode, the clock input CLKIQ is
divided by two, which would translate to a nondeterministic relation between the rising edges of the CLKIQ and
CLKDACIQ. RESETIQ ensures, however, that the correct position of the rising edge of CLKDACIQ, with respect
to the data at the input of the DAC latch, is determined. CLKDACIQ is disabled (low) when RESETIQ is high.
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DIGITAL INPUTS AND TIMING (continued)
DA[13:0]
Valid Data
tsu
th
SELECTIQ
WRTIQ
CLKIQ
RESETIQ
tsettle
tpd
tLAT
IOUT
or
IOUT
Figure 21. Single-Bus Interleaved-Mode Operation
16
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APPLICATION INFORMATION
Theory of Operation
The architecture of the DAC5672 uses a current steering technique to enable fast switching and high update
rate. The core element within the monolithic DAC is an array of segmented current sources that are designed to
deliver a full-scale output current of up to 20 mA. An internal decoder addresses the differential current switches
each time the DAC is updated and a corresponding output current is formed by steering all currents to either
output summing node, IOUT1 or IOUT2. The complementary outputs deliver a differential output signal, which
improves the dynamic performance through reduction of even-order harmonics, common-mode signals (noise),
and double the peak-to-peak output signal swing by a factor of two, as compared to single-ended operation.
The segmented architecture results in a significant reduction of the glitch energy and improves the dynamic
performance (SFDR) and DNL. The current outputs maintain a very high output impedance of greater than
300 kΩ.
When pin 42 (GSET) is high (simultaneous gain set mode), the full-scale output current for both DACs is
determined by the ratio of the internal reference voltage (1.2 V) and an external resistor RSET) connected to
BIASJ_A. When GSET is low (independent gain set mode), the full-scale output current for each DAC is
determined by the ratio of the internal reference voltage (1.2 V) and separate external resistors RSET) connected
to BIASJ_A and BIASJ_B. The resulting IREF is internally multiplied by a factor of 32 to produce an effective DAC
output current that can range from 2 mA to 20 mA, depending on the value of RSET.
The DAC5672 is split into a digital and an analog portion, each of which is powered through its own supply pin.
The digital section includes edge-triggered input latches and the decoder logic, while the analog section
comprises both the current source array with its associated switches, and the reference circuitry.
DAC Transfer Function
Each of the DACs in the DAC5672 has a set of complementary current outputs, IOUT1 and IOUT2. The full-scale
output current, IOUTFS, is the summation of the two complementary output currents:
I
+I
)I
OUTFS
OUT1
OUT2
(1)
The individual output currents depend on the DAC code and can be expressed as:
Code
I
+I
OUT1
OUTFS
16384
I
OUT2
+I
OUTFS
ǒ Ǔ
Code Ǔ
ǒ16383 * 16384
(2)
(3)
where Code is the decimal representation of the DAC data input word. Additionally, IOUTFS is a function of the
reference current IREF, which is determined by the reference voltage and the external setting resistor RSET).
V
REF
I
+ 32 I
+ 32
OUTFS
REF
R
SET
(4)
In most cases, the complementary outputs drive resistive loads or a terminated transformer. A signal voltage
develops at each output according to:
V
+I
R
OUT1
OUT1
LOAD
(5)
V
+I
R
OUT2
OUT2
LOAD
(6)
The value of the load resistance is limited by the output compliance specification of the DAC5672. To maintain
specified linearity performance, the voltage for IOUT1 and IOUT2 must not exceed the maximum allowable
compliance range.
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APPLICATION INFORMATION (continued)
The total differential output voltage is:
V
+V
*V
OUTDIFF
OUT1
OUT2
(2 Code * 16383)
V
+
I
OUTDIFF
OUTFS
16384
(7)
R
LOAD
(8)
Analog Outputs
The DAC5672 provides two complementary current outputs, IOUT1 and IOUT2. The simplified circuit of the analog
output stage representing the differential topology is shown in Figure 22. The output impedance of IOUT1 and
IOUT2 results from the parallel combination of the differential switches, along with the current sources and
associated parasitic capacitances.
AVDD
S(1)
S(1)C
IOUT1
IOUT2
RLOAD
RLOAD
S(2)
S(2)C
S(N)
S(N)C
Current Source Array
Figure 22. Analog Outputs
The signal voltage swing that may develop at the two outputs, IOUT1 and IOUT2, is limited by a negative and
positive compliance. The negative limit of –1 V is given by the breakdown voltage of the CMOS process and
exceeding it compromises the reliability of the DAC5672 (or even causes permanent damage). With the
full-scale output set to 20 mA, the positive compliance equals 1.2 V. Note that the compliance range decreases
to about 1 V for a selected output current of IOUTFS = 2 mA. Care must be taken that the configuration of
DAC5672 does not exceed the compliance range to avoid degradation of the distortion performance and integral
linearity.
Best distortion performance is typically achieved with the maximum full-scale output signal limited to
approximately 0.5 VPP. This is the case for a 50-Ω doubly-terminated load and a 20-mA full-scale output current.
A variety of loads can be adapted to the output of the DAC5672 by selecting a suitable transformer while
maintaining optimum voltage levels at IOUT1 and IOUT2. Furthermore, using the differential output configuration in
combination with a transformer is instrumental for achieving excellent distortion performance. Common-mode
errors, such as even-order harmonics or noise, can be substantially reduced. This is particularly the case with
high output frequencies.
For those applications requiring the optimum distortion and noise performance, it is recommended to select a
full-scale output of 20 mA. A lower full-scale range of 2 mA may be considered for applications that require low
power consumption, but can tolerate a slight reduction in performance level.
18
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APPLICATION INFORMATION (continued)
Output Configurations
The current outputs of the DAC5672 allow for a variety of configurations. As mentioned previously, utilizing the
converter’s differential outputs yield the best dynamic performance. Such a differential output circuit may consist
of an RF transformer or a differential amplifier configuration. The transformer configuration is ideal for most
applications with ac coupling, while operational amplifiers are suitable for a dc-coupled configuration.
The single-ended configuration may be considered for applications requiring a unipolar output voltage.
Connecting a resistor from either one of the outputs to ground converts the output current into a
ground-referenced voltage signal. To improve on the dc linearity by maintaining a virtual ground, an I-to-V or
operational amplifier configuration may be considered.
Differential With Transformer
Using an RF transformer provides a convenient way of converting the differential output signal into a
single-ended signal while achieving excellent dynamic performance. The appropriate transformer must be
carefully selected based on the output frequency spectrum and impedance requirements.
The differential transformer configuration has the benefit of significantly reducing common-mode signals, thus
improving the dynamic performance over a wide range of frequencies. Furthermore, by selecting a suitable
impedance ratio (winding ratio), the transformer can provide optimum impedance matching while controlling the
compliance voltage for the converter outputs.
Figure 23 and Figure 24 show 50-Ω doubly-terminated transformer configurations with 1:1 and 4:1 impedance
ratios, respectively. Note that the center tap of the primary input of the transformer has to be grounded to enable
a dc-current flow. Applying a 20-mA full-scale output current would lead to a 0.5-VPP output for a 1:1 transformer
and a 1-VPP output for a 4:1 transformer. In general, the 1:1 transformer configuration has slightly better output
distortion, but the 4:1 transformer has 6-dB higher output power.
50 Ω
1:1
IOUT1
100 Ω
AGND
RLOAD
50 Ω
IOUT2
50 Ω
Figure 23. Driving a Doubly-Terminated 50-Ω Cable Using a 1:1 Impedance Ratio Transformer
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APPLICATION INFORMATION (continued)
100 Ω
4:1
IOUT1
RLOAD
50 Ω
AGND
IOUT2
100 Ω
Figure 24. Driving a Doubly-Terminated 50-Ω Cable Using a 4:1 Impedance Ratio Transformer
Single-Ended Configuration
Figure 25 shows the single-ended output configuration, where the output current IOUT1 flows into an equivalent
load resistance of 25 Ω. Node IOUT2 must be connected to AGND or terminated with a resistor of 25 Ω to AGND.
The nominal resistor load of 25 Ω gives a differential output swing of 1 VPP when applying a 20-mA full-scale
output current.
IOUT1
RLOAD
50 Ω
IOUT2
50 Ω
25 Ω
AGND
Figure 25. Driving a Doubly-Terminated 50-Ω Cable Using a Single-Ended Output
20
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APPLICATION INFORMATION (continued)
Reference Operation
Internal Reference
The DAC5672 has an on-chip reference circuit which comprises a 1.2-V bandgap reference and two control
amplifiers, one for each DAC. The full-scale output current, IOUTFS, of the DAC5672 is determined by the
reference voltage, VREF, and the value of resistor RSET. IOUTFS can be calculated by:
V
REF
I
+ 32 I
+ 32
OUTFS
REF
R
SET
(9)
The reference control amplifier operates as a V-to-I converter producing a reference current, IREF, which is
determined by the ratio of VREF and RSET (see Equation 9). The full-scale output current, IOUTFS, results from
multiplying IREF by a fixed factor of 32.
Using the internal reference, a 2-kΩ resistor value results in a full-scale output of approximately 20 mA.
Resistors with a tolerance of 1% or better should be considered. Selecting higher values, the output current can
be adjusted from 20 mA down to 2 mA. Operating the DAC5672 at lower than 20-mA output currents may be
desirable for reasons of reducing the total power consumption, improving the distortion performance, or
observing the output compliance voltage limitations for a given load condition.
It is recommended to bypass the EXTIO pin with a ceramic chip capacitor of 0.1 F or more. The control
amplifier is internally compensated and its small signal bandwidth is approximately 300 kHz.
External Reference
The internal reference can be disabled by simply applying an external reference voltage into the EXTIO pin that,
in this case, functions as an input. The use of an external reference may be considered for applications that
require higher accuracy and drift performance or to add the ability of dynamic gain control.
While a 0.1- F capacitor is recommended to be used with the internal reference, it is optional for the external
reference operation. The reference input, EXTIO, has a high input impedance (1 MΩ) and can easily be driven
by various sources. Note that the voltage range of the external reference must stay within the compliance range
of the reference input.
Gain Setting Option
The full-scale output current on the DAC5672 can be set two ways — either for each of the two DAC channels
independently or for both channels simultaneously. For the independent gain set mode, the GSET pin (pin 42)
must be low (that is, connected to AGND). In this mode, two external resistors are required — one RSET
connected to the BIASJ_A pin (pin 44) and the other to the BIASJ_B pin (pin 41). In this configuration, the user
has the flexibility to set and adjust the full-scale output current for each DAC independently, allowing for the
compensation of possible gain mismatches elsewhere within the transmit signal path.
Alternatively, bringing the GSET pin high (that is, connected to AVDD), the DAC5672 switches into the
simultaneous gain set mode. Now the full-scale output current of both DAC channels is determined by only one
external RSET resistor connected to the BIASJ_A pin. The resistor at the BIASJ_B pin may be removed;
however, this is not required since this pin is not functional in this mode and the resistor has no effect on the
gain equation.
Sleep Mode
The DAC5672 features a power-down function that can reduce the total supply current to approximately 3.1 mA
over the specified supply range if no clock is present. Applying a logic high to the SLEEP pin initiates the
power-down mode, while a logic low enables normal operation. When left unconnected, an internal active
pulldown circuit enables the normal operation of the converter.
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PACKAGE OPTION ADDENDUM
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31-May-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DAC5672MPFBEP
ACTIVE
TQFP
PFB
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
DAC5672EP
DAC5672MPFBREP
ACTIVE
TQFP
PFB
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
DAC5672EP
V62/06639-01XE
ACTIVE
TQFP
PFB
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
DAC5672EP
V62/06639-02XE
ACTIVE
TQFP
PFB
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-55 to 125
DAC5672EP
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
31-May-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DAC5672-EP :
• Catalog: DAC5672
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DAC5672MPFBREP
Package Package Pins
Type Drawing
TQFP
PFB
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
9.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.6
1.5
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC5672MPFBREP
TQFP
PFB
48
1000
350.0
350.0
43.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF019A – JANUARY 1995 – REVISED JANUARY 1998
PFB (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
36
0,08 M
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
9,20
SQ
8,80
Gage Plane
0,25
0,05 MIN
0°– 7°
1,05
0,95
Seating Plane
0,75
0,45
0,08
1,20 MAX
4073176 / B 10/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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