Texas Instruments | DAC7513: Low-Power Rail-To-Rail Output 12-Bit Serial Input D/A Converter (Rev. A) | Datasheet | Texas Instruments DAC7513: Low-Power Rail-To-Rail Output 12-Bit Serial Input D/A Converter (Rev. A) Datasheet

Texas Instruments DAC7513: Low-Power Rail-To-Rail Output 12-Bit Serial Input D/A Converter (Rev. A) Datasheet
DAC7513
DAC
751
3
SBAS157A – OCTOBER 2000 – REVISED MARCH 2003
Low-Power, Rail-to-Rail Output, 12-Bit Serial Input
DIGITAL-TO-ANALOG CONVERTER
FEATURES
DESCRIPTION
● microPOWER OPERATION: 115µA at 5V
● POWER-ON RESET TO ZERO
● POWER SUPPLY: +2.7V to +5.5V
● ENSURED MONOTONIC BY DESIGN
● SETTLING TIME: 10µs to 1LSB
● LOW-POWER SERIAL INTERFACE WITH
SCHMITT-TRIGGERED INPUTS
● ON-CHIP OUTPUT BUFFER AMPLIFIER,
RAIL-TO-RAIL OPERATION
● SYNC INTERRUPT FACILITY
● SOT23-8 AND MSOP-8 PACKAGES
The DAC7513 is a low-power, single, 12-bit buffered voltage
output Digital-to-Analog Connector (DAC). The on-chip precision output amplifier allows rail-to-rail output swing to be
achieved. The DAC7513 uses a versatile 3-wire serial interface that operates at clock rates up to 30MHz and is compatible with standard SPI™, QSPI™, Microwire™, and DSP interfaces.
The DAC7513 requires an external reference voltage to set
the output range of the DAC, this allows the DAC7513 to be
used in a multiplying mode. The DAC7513 incorporates a
power-on reset circuit which ensures that the DAC output
powers up at 0V and remains there until a valid write takes
place to the device. The DAC7513 contains a power-down
feature, accessed over the serial interface, that reduces the
current consumption of the device to 200nA at 5V.
APPLICATIONS
●
●
●
●
●
●
The low-power consumption of this part in normal operation
makes it ideally suited to portable battery-operated equipment. The power consumption is 0.5mW at 5V reducing to
1µW in power-down mode.
PROCESS CONTROL
DATA ACQUISITION SYSTEMS
CLOSED-LOOP SERVO-CONTROL
PC PERIPHERALS
PORTABLE INSTRUMENTATION
PROGRAMMABLE ATTENUATION
The DAC7513 is available in an SOT23-8 package and an
MSOP-8 package.
SPI and QSPI are registered trademarks of Motorola.
Microwire is a registered trademark of National Semiconductor.
VDD
VFB
VREF
Ref (+)
VOUT
12-Bit DAC
12
DAC Register
12
SYNC
CLK
DIN
Shift Register
Power-Down
Control Logic
Resistor
Network
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2000, 2003 Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
VDD to GND ........................................................................... –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +VDD + 0.3V
VOUT to GND .......................................................... –0.3V to +VDD + 0.3V
Operating Temperature Range ...................................... –40°C to +105°C
Storage Temperature Range ......................................... –65°C to +150°C
Junction Temperature Range (TJ max) ........................................ +150°C
SOT23 Package:
Power Dissipation .................................................... (TJ max – TA)/θJA
θJA Thermal Impedance ......................................................... 240°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
MSOP Package:
Power Dissipation .......................................................... (TJ max – TA)/θJA
θJA Thermal Impedance ......................................................... 206°C/W
θJC Thermal Impedance .......................................................... 44°C/W
Lead Temperature, Soldering:
Vapor Phase (60s) ............................................................... +215°C
Infrared (15s) ........................................................................ +220°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PACKAGE/ORDERING INFORMATION
PRODUCT
DAC7513E
"
DAC7513N
"
MINIMUM
RELATIVE DIFFERENTIAL
ACCURACY NONLINEARITY
(LSB)
(LSB)
PACKAGE-LEAD
SPECIFICATION
PACKAGE
TEMPERATURE PACKAGE
DESIGNATOR(1)
RANGE
MARKING
±8
±1
MSOP-8
DGK
–40°C to +105°C
D13E
"
"
"
"
"
"
±8
±1
SOT23-8
DCN
–40°C to +105°C
D13N
"
"
"
"
"
"
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
DAC7513E/250
DAC7513E/2K5
DAC7513N/250
DAC7513N/3K
Tape and Reel, 250
Tape and Reel, 2500
Tape and Reel, 250
Tape and Reel, 3000
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PIN CONFIGURATIONS
Top View
2
MSOP-8
SOT23-8
8
SYNC
VDD
1
7
SCLK
VREF
2
VFB
VOUT
VOUT
1
VFB
2
VREF
3
6
DIN
VDD
4
5
GND
DAC7513
8
GND
7
DIN
3
6
SCLK
4
5
SYNC
DAC7513
DAC7513
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SBAS157A
MARKING ARTWORK
Top View
MSOP-8
SOT23-8
D13N
YMLL
D13E
Pin 1
Identifier
Pin 1
Lot
Trace Code
Bottom View
Pin 1
YMLL
Model Code
(4 Characters Max.)
GRS00035 Option 1
Lot Trace Code
GRS00035 Option 1
PIN DESCRIPTIONS
MSOP-8
SOT23-8
NAME
1
4
VDD
Power Supply Input, +2.7V to +5.5V
DESCRIPTION
2
3
VREF
Reference Voltage Input
3
2
VFB
Feedback connection for the output amplifier.
4
1
VOUT
5
8
SYNC
Level triggered control input (active LOW), this is the frame sychronization signal for the input data. When SYNC
goes LOW, it enables the input shift register and data is transferred in on the falling edges of the following clocks.
The DAC is updated following the 16th clock cycle unless SYNC is taken HIGH before this edge in which case
the rising edge of SYNC acts as an interrupt and the write sequence is ignored by the DAC7513.
6
7
SCLK
Serial Clock Input. Data can be transferred at rates up to 30MHz.
7
6
DIN
8
5
GND
Analog output voltage from DAC. The output amplifier has rail-to-rail operation.
Serial Data Input. Data is clocked into the 16-bit input shift register on the falling edge of the serial clock input.
Ground reference point for all circuitry on the part.
DAC7513
SBAS157A
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3
ELECTRICAL CHARACTERISTICS
VDD = +2.7V to +5.5V, RL = 2kΩ to GND, and CL = 200pF to GND, unless otherwise noted.
DAC7513E, N
PARAMETER
STATIC PERFORMANCE (1)
Resolution
Relative Accuracy
Differential Nonlinearity
Zero Code Error
Full-Scale Error
Gain Error
Zero Code Error Drift
Gain Temperature Coefficient
OUTPUT CHARACTERISTICS (2)
Output Voltage Range
Output Voltage Settling Time
Slew Rate
Capacitive Load Stability
Code Change Glitch Impulse
Digital Feedthrough
DC Output Impedance
Short-Circuit Current
Power-Up Time
REFERENCE INPUT
Reference Current
CONDITIONS
MIN
TYP
MAX
12
Tested Monotonic by Design
All Zeroes Loaded to DAC Register
All Ones Loaded to DAC Register
+5
–0.15
±8
±1
+20
–1.25
±1.25
–20
–5
0
1/4 Scale to 3/4 Scale Change
(400H to C00H)
RL = 2kΩ; 0pF < CL < 200pF
RL = 2kΩ; CL = 500pF
8
RL = ∞
RL = 2kΩ
1LSB Change Around Major Carry
VDD = +5V
VDD = +3V
Coming Out of Power-Down Mode
VDD = +5V
Coming Out of Power-Down Mode
VDD = +3V
VREF = VDD = +5V
VREF = VDD = +3.6V
Reference Input Range
Reference Input Impedance
UNITS
Bits
LSB
LSB
mV
% of FSR
% of FSR
µV/°C
ppm of FSR/°C
VREF
V
10
µs
12
1
470
1000
20
0.5
1
50
20
µs
V/µs
pF
pF
nV-s
nV-s
Ω
mA
mA
2.5
µs
5
µs
17
12
0
25
18
VDD
µA
µA
V
kΩ
±1
0.8
0.6
3
µA
V
V
V
V
pF
5.5
V
300
INPUTS (2)
LOGIC
Input Current
VINL, Input Low Voltage
VINL, Input Low Voltage
VINH, Input High Voltage
VINH, Input High Voltage
Pin Capacitance
POWER REQUIREMENTS
VDD
IDD (normal mode)
VDD = +3.6V to +5.5V
VDD = +2.7V to +3.6V
IDD (all power-down modes)
VDD = +3.6V to +5.5V
VDD = +2.7V to +3.6V
POWER EFFICIENCY
IOUT/IDD
VDD
VDD
VDD
VDD
=
=
=
=
+5V
+3V
+5V
+3V
2.4
2.1
2.7
DAC Active and Excluding Load Current
VIH = VDD and VIL = GND
VIH = VDD and VIL = GND
115
100
170
145
µA
µA
VIH = VDD and VIL = GND
VIH = VDD and VIL = GND
0.2
0.05
1
1
µA
µA
ILOAD = 2mA, VDD = +5V
93
TEMPERATURE RANGE
Specified Performance
–40
%
+105
°C
NOTES: (1) Linearity calculated using a reduced code range of 48 to 4047; output unloaded. (2) Ensured by design and characterization, not production tested.
4
DAC7513
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SBAS157A
TIMING CHARACTERISTICS(1, 2)
VDD = +2.7V to +5.5V, all specifications –40°C to +105°C, unless otherwise noted.
DAC7513E, N
PARAMETER
t1(3)
t2
t3
t4
t5
t6
t7
t8
DESCRIPTION
CONDITIONS
MIN
TYP
MAX
UNITS
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
50
33
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
13
13
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
22.5
13
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
0
0
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
5
5
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
4.5
4.5
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
0
0
ns
ns
VDD = 2.7V to 3.6V
VDD = 3.6V to 5.5V
50
33
ns
ns
SCLK Cycle Time
SCLK HIGH Time
SCLK LOW Time
SYNC to SCLK Rising
Edge Setup Time
Data Setup Time
Data Hold Time
SCLK Falling Edge to
SYNC Rising Edge
Minimum SYNC HIGH Time
NOTES: (1) All input signals are specified with tR = tF = 5ns (10% to 90% of VDD) and timed from a voltage level of (VIL + VIH)/2. (2) See Serial Write Operation timing
diagram, below. (3) Maximum SCLK frequency is 30MHz at VDD = +3.6V to +5.5V and 20MHz at VDD = +2.7V to +3.6V.
SERIAL WRITE OPERATION
t1
SCLK
t8
t3
t4
t2
t7
SYNC
t6
t5
DIN
DB15
DB0
DAC7513
SBAS157A
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5
TYPICAL CHARACTERISTICS: VDD = +5V
At TA = +25°C and +VDD = +5V, unless otherwise noted.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(+25°C)
LE (LSB)
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
1.0
1.0
0.5
0.5
DLE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(–40°C)
0.0
–0.5
–1.0
0.0
–0.5
–1.0
0
200H
400H
600H
800H
A00H
C00H
E00H
FFFH
0
200H
400H
600H
Code
E00H
FFFH
8
TUE (LSBs)
LE (LSB)
DLE (LSB)
C00H
TYPICAL TOTAL UNADJUSTED ERROR
16
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
1.0
0.5
0
–8
0.0
–0.5
–16
–1.0
0
200H
400H
600H
800H
A00H
C00H
E00H
FFFH
0
200H
400H
20
20
10
10
Error (mV)
30
0
–10
–20
–20
40
A00H C00H E00H FFFH
0
–10
0
800H
FULL-SCALE ERROR vs TEMPERATURE
ZERO-SCALE ERROR vs TEMPERATURE
30
–30
–40
600H
Code
Code
Error (mV)
A00H
Code
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(+105°C)
80
–30
–40
120
0
40
80
120
Temperature (°C)
Temperature (°C)
6
800H
DAC7513
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SBAS157A
TYPICAL CHARACTERISTICS: VDD = +5V (Cont.)
At TA = +25°C and +VDD = +5V, unless otherwise noted.
NOTE: All references to IDD include IREF current.
SOURCE AND SINK CURRENT CAPABILITY
IDD HISTOGRAM
3000
5
VREF tied to VDD.
2500
DAC Loaded with FFFH
4
VOUT (V)
Frequency
2000
1500
3
2
1000
1
500
DAC Loaded with 000H
0
190
180
170
160
150
140
130
120
110
90
100
80
70
60
50
0
0
5
10
15
ISOURCE/SINK (mA)
IDD (µA)
SUPPLY CURRENT vs CODE
SUPPLY CURRENT vs TEMPERATURE
300
500
VREF tied to VDD.
VREF tied to VDD.
250
400
IDD (µA)
IDD (µA)
200
300
200
150
100
100
50
0
0
0
200H
400H
600H
800H
A00H
C00H
–40
E00H FFFH
0
40
Code
120
POWER-DOWN CURRENT vs SUPPLY VOLTAGE
SUPPLY CURRENT vs SUPPLY VOLTAGE
100
300
90
VREF tied to VDD.
250
80
70
IDD (nA)
200
IDD (µA)
80
Temperature (°C)
150
100
60
+105°C
50
–40°C
40
30
20
50
+25°C
10
0
0
2.7
3.2
3.7
4.2
4.7
5.2
2.7
5.7
DAC7513
SBAS157A
3.2
3.7
4.2
4.7
5.2
5.7
VDD (V)
VDD (V)
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7
TYPICAL CHARACTERISTICS: VDD = +5V (Cont.)
At TA = +25°C and +VDD = +5V, unless otherwise noted.
NOTE: All references to IDD include IREF current.
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE
FULL-SCALE SETTLING TIME
2500
CLK (5V/div)
IDD (µA)
2000
1500
VOUT (1V/div)
1000
Full-Scale Code Change
000H to FFFH
Output Loaded with
2kΩ and 200pF to GND
500
0
0
1
2
3
4
5
Time (1µs/div)
VLOGIC (V)
FULL-SCALE SETTLING TIME
HALF-SCALE SETTLING TIME
CLK (5V/div)
CLK (5V/div)
VOUT (1V/div)
Full-Scale Code Change
FFFH to 000H
Output Loaded with
2kΩ and 200pF to GND
Half-Scale Code Change
400H to C00H
Output Loaded with
2kΩ and 200pF to GND
VOUT (1V/div)
Time (1µs/div)
Time (1µs/div)
HALF-SCALE SETTLING TIME
CLK (5V/div)
POWER-ON RESET TO 0V
Loaded with 2kΩ to VDD.
Half-Scale Code Change
C00H to 400H
Output Loaded with
2kΩ and 200pF to GND
VDD (1V/div)
VOUT (1V/div)
VOUT (1V/div)
Time (1µs/div)
8
Time (20µs/div)
DAC7513
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SBAS157A
TYPICAL CHARACTERISTICS: VDD = +5V (Cont.)
At TA = +25°C and +VDD = +5V, unless otherwise noted.
EXITING POWER-DOWN
(800H Loaded)
CODE CHANGE GLITCH
Loaded with 2kΩ
and 200pF to GND.
Code Change:
800H to 7FFH.
VOUT (20mV/div)
CLK (5V/div)
VOUT (1V/div)
Time (5µs/div)
Time (0.5µs/div)
TYPICAL CHARACTERISTICS: VDD = +2.7V
At TA = +25°C and +VDD = +2.7V, unless otherwise noted.
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(+25°C)
LE (LSB)
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
1.0
1.0
0.5
0.5
DLE (LSB)
DLE (LSB)
LE (LSB)
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(–40°C)
0.0
–0.5
–1.0
0.0
–0.5
–1.0
0
200H
400H
600H
800H
A00H
C00H
E00H
FFFH
0
200H
400H
600H
Code
C00H
E00H
FFFH
TYPICAL TOTAL UNADJUSTED ERROR
16
16.0
12.0
8.0
4.0
0.0
–4.0
–8.0
–12.0
–16.0
8
TUE (LSBs)
LE (LSB)
A00H
Code
LINEARITY ERROR AND
DIFFERENTIAL LINEARITY ERROR vs CODE
(+105°C)
1.0
DLE (LSB)
800H
0.5
0
–8
0
–0.5
–1.0
000H
–16
200H
400H
600H
800H
A00H
C00H
E00H
FFFH
200H
400H
600H
800H
A00H C00H E00H
FFFH
Code
Code
DAC7513
SBAS157A
0
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9
TYPICAL CHARACTERISTICS: VDD = +2.7V (Cont.)
At TA = +25°C and +VDD = +2.7V, unless otherwise noted.
NOTE: All references to IDD include IREF current.
FULL-SCALE ERROR vs TEMPERATURE
30
20
20
10
10
Error (mV)
Error (mV)
ZERO-SCALE ERROR vs TEMPERATURE
30
0
0
–10
–10
–20
–20
–30
–40
0
40
80
–30
–40
120
0
40
Temperature (°C)
IDD HISTOGRAM
3000
80
120
Temperature (°C)
SOURCE AND SINK CURRENT CAPABILITY
3
VDD = +3V
VREF tied to VDD.
2500
DAC Loaded with FFFH
2
VOUT (V)
Frequency
2000
1500
1000
1
DAC Loaded with 000H
500
0
190
180
170
160
150
140
130
120
110
90
100
80
70
60
50
0
0
5
10
15
ISOURCE/SINK (mA)
IDD (µA)
SUPPLY CURRENT vs CODE
SUPPLY CURRENT vs TEMPERATURE
300
500
VREF tied to VDD.
VREF tied to VDD.
250
400
IDD (µA)
IDD (µA)
200
300
200
150
100
100
50
0
0
0
200H
400H
600H
800H
A00H
C00H
E00H FFFH
10
–40
0
40
80
120
Temperature (°C)
Code
DAC7513
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SBAS157A
TYPICAL CHARACTERISTICS: VDD = +2.7V (Cont.)
At TA = +25°C and +VDD = +2.7V, unless otherwise noted.
NOTE: All references to IDD include IREF current.
SUPPLY CURRENT vs LOGIC INPUT VOLTAGE
FULL-SCALE SETTLING TIME
2500
CLK (2.7V/div)
IDD (µA)
2000
1500
1000
Full-Scale Code Change
000H to FFFH
Output Loaded with
2kΩ and 200pF to GND
500
VOUT (1V/div)
0
0
1
2
3
4
5
Time (1µs/div)
VLOGIC (V)
HALF-SCALE SETTLING TIME
FULL-SCALE SETTLING TIME
CLK (2.7V/div)
CLK (2.7V/div)
Full-Scale Code Change
FFFH to 000H
Output Loaded with
2kΩ and 200pF to GND
VOUT (1V/div)
VOUT (1V/div)
Half-Scale Code Change
400H to C00H
Output Loaded with
2kΩ and 200pF to GND
Time (1µs/div)
Time (1µs/div)
HALF-SCALE SETTLING TIME
POWER-ON RESET to 0V
CLK (2.7V/div)
Half-Scale Code Change
C00H to 400H
VOUT (1V/div)
Output Loaded with
2kΩ and 200pF to GND
Time (1µs/div)
Time (20µs/div)
DAC7513
SBAS157A
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11
TYPICAL CHARACTERISTICS: VDD = +2.7V (Cont.)
At TA = +25°C and +VDD = +2.7V, unless otherwise noted.
EXITING POWER-DOWN
(800H Loaded)
CODE CHANGE GLITCH
Loaded with 2kΩ
and 200pF to GND.
Code Change:
800H to 7FFH.
VOUT (20mV/div)
CLK (2.7V/div)
VOUT (1V/div)
Time (0.5µs/div)
Time (5µs/div)
THEORY OF OPERATION
DAC SECTION
R
The architecture consists of a string DAC followed by an
output buffer amplifier. Figure 1 shows a block diagram of the
DAC architecture.
R
DAC Register
VDD
VFB
REF (+)
Resistor String
REF (–)
VOUT
R
To Output
Amplifier
Output
Amplifier
GND
FIGURE 1. DAC7513 Architecture.
R
The input coding to the DAC7513 is straight binary, so the
ideal output voltage is given by:
V OUT = VREF
•
D
4096
R
(1)
where D = decimal equivalent of the binary code that is
loaded to the DAC register; it can range from 0 to 4095.
FIGURE 2. Resistor String.
RESISTOR STRING
OUTPUT AMPLIFIER
The resistor string shown in Figure 2 is simply a string of
resistors, each of value R. The code loaded into the DAC
register determines at which node on the string the voltage
is tapped off to be fed into the output amplifier by closing one
of the switches connecting the string to the amplifier. It is
ensured monotonic because it is a string of resistors.
The output buffer amplifier is capable of generating rail-to-rail
voltages on its output which gives an output range of
0V to VDD, it is capable of driving a load of 2kΩ in parallel with
1000pF to GND. The source and sink capabilities of the output
amplifier can be seen in the typical characteristics. The slew
rate is 1V/µs with a half-scale settling time of 8µs with the output
unloaded.
12
DAC7513
www.ti.com
SBAS157A
The inverting input of the output amplifier is brought out to the
VFB pin. This allows for better accuracy in critical applications
by tying the VFB point and the amplifier output together directly
at the load. Other signal conditioning circuitry can also be
connected between these points for specific applications.
SERIAL INTERFACE
The DAC7513 has a 3-wire serial interface SYNC, SCLK, and
DIN, which is compatible with SPI, QSPI, and Microwire
interface standards as well as most Digital Signal Processors
(DSPs). See the Serial Write Operation timing diagram for an
example of a typical write sequence.
The write sequence begins by bringing the SYNC line LOW,
data from the DIN line is clocked into the 16-bit shift register
on the falling edge of SCLK. The serial clock frequency can
be as high as 30MHz, making the DAC7513 compatible with
high-speed DSPs. On the 16th falling edge of the serial
clock, the last data bit is clocked in and the programmed
function is executed (i.e., a change in the DAC register
contents and/or a change in the mode of operation).
At this point, the SYNC line may be kept LOW or brought
HIGH. In either case, it must be brought HIGH for a minimum
of 33ns before the next write sequence so that a falling edge
of SYNC can initiate the next write sequence. As the SYNC
buffer draws more current when the SYNC signal is HIGH
than it does when it is LOW, SYNC must be idled LOW
between write sequences for lowest power operation of the
part. As mentioned above, however, it must be brought HIGH
again just before the next write sequence.
SYNC INTERRUPT
In a normal write sequence, the SYNC line is kept LOW for
at least 16 falling edges of SCLK and the DAC is updated on
the 16th falling edge. However, if SYNC is brought HIGH
before the 16th falling edge, this acts as an interrupt to the
write sequence. The shift register is reset and the write
sequence is seen as invalid. Neither an update of the DAC
register contents or a change in the operating mode occurs,
as shown in Figure 4.
POWER-ON RESET
The DAC7513 contains a power-on reset circuit that controls
the output voltage during power-up. Upon power up, the DAC
register is filled with zeros and the output voltage is 0V; it
remains there until a valid write sequence is made to the
DAC. This is useful in applications where it is important to
know the state of the output of the DAC while it is in the
process of powering up.
POWER-DOWN MODES
The DAC7513 contains four separate modes of operation,
which are programmable by setting two bits (PD1 and PD0)
in the control register. Table I shows how the state of the bits
corresponds to the mode of operation of the device.
INPUT SHIFT REGISTER
The input shift register is 16 bits wide, as shown in
Figure 3. The first two bits are don’t cares. The next two bits
(PD1 and PD0) are control bits that control which mode of
operation the part is in (normal mode or any one of three
power-down modes). There is a more complete description
of the various modes in the Power-Down Modes section. The
next 12 bits are the data bits. These are transferred to the
DAC register on the 16th falling edge of SCLK.
DB13
DB12
0
0
OPERATING MODE
Normal Operation
0
1
Power-Down Modes
Output 1kΩ to GND
1
0
Output 100kΩ to GND
1
1
High-Z
TABLE I. Modes of Operation for the DAC7513.
When both bits are set to 0, the part works normally with its
normal power consumption of 115µA at 5V. However, for the
three power-down modes, the supply current falls to 200nA
at 5V (50nA at 3V). Not only does the supply current fall, but
the output stage is also internally switched from the output of
the amplifier to a resistor network of known values. This has
DB15
X
DB0
X
PD1
PD0
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
FIGURE 3. Data Input Register.
CLK
SYNC
DIN
DB15
DB0
DB15
Invalid Write Sequence:
SYNC HIGH before 16th Falling Edge
DB0
Valid Write Sequence: Output Updates
on the 16th Falling Edge
FIGURE 4. SYNC Interrupt Facility.
DAC7513
SBAS157A
www.ti.com
13
the advantage that the output impedance of the part is known
while the part is in power-down mode. There are three
different options: the output is connected internally to GND
through a 1kΩ resistor; a 100kΩ resistor; or it is left opencircuited (High-Z). The output stage is illustrated in Figure 5.
All linear circuitry is shut down when the power-down mode
is activated, however, the contents of the DAC register are
unaffected when in power-down. The time to exit
power-down is typically 2.5µs for VDD = 5V, and 5µs for
VDD = 3V, (see the Typical Chacteristics for more information).
of data, and P3.3 is taken HIGH following the completion of
this cycle. The 8051 outputs the serial data in a format which
has the LSB first. The DAC7513 requires its data with the
MSB as the first bit received, thus, the 8051 transmit routine
must therefore take this into account and mirror the data as
needed.
DAC7513 TO Microwire INTERFACE
Figure 7 shows an interface between the DAC7513 and any
Microwire compatible device. Serial data is shifted out on the
falling edge of the serial clock and is clocked into the
DAC7513 on the rising edge of the SK signal.
VFB
MicrowireTM
Resistor
String DAC
Amplifier
Power-down
Circuitry
VOUT
DAC7513(1)
CS
SYNC
SK
SCLK
SO
DIN
NOTE: (1) Additional pins omitted for clarity.
Resistor
Network
FIGURE 7. DAC7513 to Microwire Interface.
DAC7513 TO 68HC11 INTERFACE
FIGURE 5. Output Stage During Power-Down.
Figure 8 shows a serial interface between the DAC7513 and
the 68HC11 microcontroller. SCK of the 68HC11 drives the
SCLK of the DAC7513, while the MOSI output drives the
serial data line of the DAC. The SYNC signal is derived from
a port line (PC7), similar to what was done for the 8051.
MICROPROCESSOR
INTERFACING
DAC7513 TO 8051 INTERFACE
Figure 6 shows a serial interface between the DAC7513 and
a typical 8051-type microcontroller. The setup for the interface is as follows: TXD of the 8051 drives SCLK of the
DAC7513, while RXD drives the serial data line of the part;
the SYNC signal is derived from a bit programmable pin on
the port. In this case, port line P3.3 is used. When data is to
be transmitted to the DAC7513, P3.3 is taken LOW. The
8051 transmits data only in 8-bit bytes; thus only eight falling
clock edges occur in the transmit cycle. To load data to the
DAC, P3.3 is left LOW after the first eight bits are transmitted,
a second write cycle is initiated to transmit the second byte
The 68HC11 must be configured so that its CPOL bit is a 0
and its CPHA bit is a 1, this configuration causes data
appearing on the MOSI output as valid on the falling edge of
SCK. When data is being transmitted to the DAC, the SYNC
line is taken LOW (PC7). Serial data from the 68HC11 is
transmitted in 8-bit bytes with only eight falling clock edges
occurring in the transmit cycle. Data is transmitted MSB first.
In order to load data to the DAC7513, PC7 is left LOW after
the first eight bits are transferred, and a second serial write
operation is performed to the DAC and PC7 is taken HIGH
at the end of this procedure.
68HC11(1)
80C51/80L51(1)
DAC7513(1)
P3.3
SYNC
TXD
SCLK
PC7
SYNC
SCK
SCLK
MOSI
RXD
DAC7513(1)
DIN
DIN
NOTE: (1) Additional pins omitted for clarity.
NOTE: (1) Additional pins omitted for clarity.
FIGURE 6. DAC7513 to 80C51/80L51 Interface.
14
FIGURE 8. DAC7513 to 68HC11 Interface.
DAC7513
www.ti.com
SBAS157A
BIPOLAR OPERATION USING THE DAC7513
APPLICATIONS
The DAC7513 has been designed for single-supply operation,
but a bipolar output range is also possible using the circuit in
Figure 10 which will give an output voltage range of ±VREF.
Rail-to-rail operation at the amplifier output is achievable using
an OPA703 as the output amplifier.
USING REF02 AS A POWER SUPPLY FOR THE
DAC7513
Due to the extremely low supply current required by the
DAC7513, an alternative option is to use a REF02 +5V
precision voltage reference to supply the required voltage to
the part, as shown in Figure 9. This is especially useful if the
power supply is quite noisy or if the system supply voltages
are at some value other than 5V. The REF02 will output a
steady supply voltage for the DAC7513; if the REF02 is
used, the current it needs to supply to the DAC7513 is
132µA. This is with no load on the output of the DAC, so
when the DAC output is loaded, the REF02 also needs to
supply the current to the load. The total current required (with
a 5kΩ load on the DAC output) is:
132µA + (5V/ 5kΩ) = 1.13mA
The output voltage for any input code can be calculated as
follows:

 R2  
 D   R1 + R2 
V O = VREF • 
 •
 − VREF •  R  


R
4096


 1  

1
where D represents the input code in decimal (0 to 4095).
With VREF = 5V, R1 = R2 = 10kΩ:
 10 •D 
VO = 
 – 5V
 4096 
(2)
(4)
This is an output voltage range of ±5V with 000H corresponding to a –5V output and FFFH corresponding to a +5V output.
Similarly, using VREF = 2.5V, ±2.5V output voltage raw can be
achieved.
The load regulation of the REF02 is typically 0.005%/mA,
which results in an error of 285µV for the 1.13mA current
drawn from it; this corresponds to a 0.2LSB error.
LAYOUT
+15
A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power supplies.
+5V
REF02
As the DAC7513 offers single-supply operation, it will often
be used in close proximity with digital logic, microcontrollers,
microprocessors, and digital signal processors. The more
digital logic present in the design and the higher the switching
speed, the more difficult it will be to achieve good performance from the converter.
132µA (IDD + IREF)
SYNC
3-Wire
Serial
Interface
(3)
VOUT = 0V to 5V
DAC7513
SCLK
Due to the single ground pin of the DAC7513, all return
currents, including digital and analog return currents, must
flow through the GND pin, which would, ideally, be connected
directly to an analog ground plane. This plane would be
separate from the ground connection for the digital components until they were connected at the power-entry point of
the system.
DIN
FIGURE 9. REF02 as Power Supply to the DAC7513.
R2
10kΩ
VREF
+5V
R1
10kΩ
OPA703
VFB
VREF
10µF
DAC7513
0.1µF
±5V
VOUT
–5V
3-Wire
Serial
Interface
FIGURE 10. Bipolar Operation with the DAC7513.
DAC7513
SBAS157A
www.ti.com
15
The power applied to VDD should be well regulated and low
noise. Switching power supplies and DC/DC converters will
often have high-frequency glitches or spikes riding on the
output voltage. In addition, digital components can create
similar high-frequency spikes as their internal logic switches
states; this noise can easily couple into the DAC output
voltage through various paths between the power connections and analog output. This is only true for the DAC7513 if
the power supply is also opted to be used as the source of
reference voltage for the DAC.
16
As with the GND connection, VDD should be connected to a
+5V power-supply plane or trace that is separate from the
connection for digital logic until they are connected at the
power-entry point. In addition, the 1µF to 10µF and 0.1µF
bypass capacitors are strongly recommended. In some situations, additional bypassing may be required, such as a
100µF electrolytic capacitor or even a Pi filter made up of
inductors and capacitors—all designed to essentially lowpass filter the +5V supply, removing the high-frequency
noise.
DAC7513
www.ti.com
SBAS157A
PACKAGE DRAWINGS
DGK (R-PDSO-G8)
PLASTIC SMALL-OUTLINE PACKAGE
0,38
0,25
0,65
8
0,08 M
5
0,15 NOM
3,05
2,95
4,98
4,78
Gage Plane
0,25
1
0°– 6°
4
3,05
2,95
0,69
0,41
Seating Plane
1,07 MAX
0,15
0,05
0,10
4073329/C 08/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC MO-187
DAC7513
SBAS157A
www.ti.com
17
PACKAGE DRAWINGS (Cont.)
DCN (R-PDSO-G8)
PLASTIC SMALL-OUTLINE
0,45
0,28
0,65
1,75 3,00
1,50 2,60
Index
Area
1,95 REF
3,00
2,80
1,45
0,90
0°–10°
–A–
1,30
0,90
0,15
0,00
0,20
0,09
0,60
0,10
C
4202106/A 03/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Foot length measured reference to flat foot surface
parallel to Datum A.
D. Package outline exclusive of mold flash, metal burr and
dambar protrusion/intrusion.
E. Package outline inclusive of solder plating.
F. A visual index feature must be located within the
cross-hatched area.
18
DAC7513
www.ti.com
SBAS157A
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DAC7513E/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 105
D13E
DAC7513E/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 105
D13E
DAC7513E/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 105
D13E
DAC7513E/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS CU NIPDAUAG Level-2-260C-1 YEAR
& no Sb/Br)
-40 to 105
D13E
DAC7513N/250
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
D13N
DAC7513N/250G4
ACTIVE
SOT-23
DCN
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
D13N
DAC7513N/3K
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
D13N
DAC7513N/3KG4
ACTIVE
SOT-23
DCN
8
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 105
D13N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Mar-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DAC7513E/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
DAC7513E/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Mar-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC7513E/250
VSSOP
DGK
DAC7513E/2K5
VSSOP
DGK
8
250
210.0
185.0
35.0
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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