Texas Instruments | ADS900: SpeedPlus? 10-Bit, 20MHz, 3V Supply Analog-To-Digital Converter (Rev. A) | Datasheet | Texas Instruments ADS900: SpeedPlus? 10-Bit, 20MHz, 3V Supply Analog-To-Digital Converter (Rev. A) Datasheet

Texas Instruments ADS900: SpeedPlus? 10-Bit, 20MHz,  3V Supply Analog-To-Digital Converter (Rev. A) Datasheet
ADS900
ADS
900
E
SBAS058A – MAY 2001
10-Bit, 20MHz, +3V Supply
ANALOG-TO-DIGITAL CONVERTER
TM
FEATURES
DESCRIPTION
●
●
●
●
●
●
The ADS900 is a high-speed pipelined Analog-to-Digital
Converter (ADC). This complete converter includes a high
bandwidth track-and-hold, a 10-bit quantizer, and an internal reference.
The ADS900 employs digital error correction techniques to
provide excellent differential linearity for demanding imaging applications. Its low distortion and high SNR give the
extra margin needed for telecommunications, video and
test instrumentation applications.
This high-performance ADC is specified for performance
at a 20MHz sampling rate. The ADS900 is available in an
SSOP-28 package.
+2.7V TO +3.7V SUPPLY OPERATION
INTERNAL REFERENCE
LOW POWER: 52mW at +3V
SINGLE-ENDED INPUT RANGE: 1V to 2V
WIDEBAND TRACK/HOLD: 350MHz
SSOP-28 PACKAGE
APPLICATIONS
●
●
●
●
●
●
PORTABLE INSTRUMENTATION
IF AND BASEBAND COMMUNICATIONS
CABLE MODEMS
SET-TOP BOXES
PORTABLE TEST EQUIPMENT
COMPUTER SCANNERS
CLK
LVDD
ADS900
Timing
Circuitry
2V
IN
1V
T/H
IN
(Opt.)
Pipeline
A/D
Error
Correction
3-State
Outputs
10-Bit
Digital
Data
Internal
Reference
LpBy CM LnBy
1VREF
Pwrdn
OE
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1997, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
www.ti.com
ABSOLUTE MAXIMUM RATINGS
ELECTROSTATIC
DISCHARGE SENSITIVITY
+VS ....................................................................................................... +6V
Analog Input ............................................................................... +VS +0.3V
Logic Input ................................................................................. +VS +0.3V
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature ..................................................................... +150°C
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER
ADS900E
SSOP-28
324
–40°C to +85°C
"
"
"
"
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(1)
TRANSPORT
MEDIA
ADS900E
ADS900E
ADS900E
ADS900E/1K
Rails
Tape and Reel
NOTE: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /1K indicates 1000 devices per reel). Ordering 1000 pieces
of “ADS900E/1K” will get a single 1000-piece Tape and Reel.
ELECTRICAL CHARACTERISTICS
At TA = +25°C, VS = LVDD = +3V, Single-Ended Input, Sampling Rate = 20MHz, unless otherwise specified.
ADS900E
PARAMETER
Resolution
Specified Temperature Range
ANALOG INPUT
Single-Ended Full Scale Input Range
Differential Full Scale Input Range
Common-Mode Voltage
Analog Input Bias Current
Input Impedance
CONDITIONS
TEMP
2
TYP
MAX
UNITS
Bits
°C
10
Ambient Air
–40
+85
(1Vp-p)
(0.5Vp-pX 2)
+1.0
+1.25
+2.0
+1.75
DIGITAL INPUTS
Logic Family
High Input Voltage, VIH
Low Input Voltage, VIL
High Input Current, IIH
Low Input Current, IIL
Input Capacitance
CONVERSION CHARACTERISTICS
Start Conversion
Sample Rate
Data Latency
MIN
Full
1.5
1
1.25 || 5
V
V
V
µA
MΩ || pF
TTL/HCT COMPATIBLE CMOS
2.0
VDD
0.8
±10
±10
5
V
V
µA
µA
pF
RISING EDGE OF CONVERT CLOCK
10k
20M
5
Samples/s
Clk Cyc
ADS900
SBAS058A
ELECTRICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +3V, Single-Ended Input, Sampling Rate = 20MHz, unless otherwise specified.
ADS900E
PARAMETER
DYNAMIC CHARACTERISTICS
Differential Linearity Error
f = 500kHz
(Largest Code Error)
f = 10MHz
(Largest Code Error)
No Missing Codes
Integral Nonlinearity Error, f = 500kHz
Spurious Free Dynamic Range(1)
f = 500kHz (–1dBFS(2) input)
f = 10MHz (–1dBFS(2) input)
Two-Tone Intermodulation Distortion(3)
f = 4.5MHz and 5.0MHz (–7dBFS each tone)
Signal-to-Noise Ratio (SNR)
f = 500kHz (–1dBFS input)
f = 10MHz (–1dBFS input)
Signal-to-(Noise + Distortion) (SINAD)
f = 500kHz (–1dBFS input)
f = 3.58MHz (–1dBFS input)
f = 10MHz (–1dBFS input)
Differential Gain Error
Differential Phase Error
Output Noise
Aperture Delay Time
Aperture Jitter
Analog Input Bandwidth
Small Signal
Full Power
Overvoltage Recovery Time(4)
DIGITAL OUTPUTS
Logic Family
Logic Coding
High Output Voltage, VOH
Low Output Voltage, VOL
3-State Enable Time
3-State Disable Time
Internal Pull-Down
Power-Down Enable Time
Power-Down Disable Time
Internal Pull-Down
ACCURACY
Gain Error
Input Offset
Power Supply Rejection (Gain)
Power Supply Rejection (Offset)
Internal Positive Reference Voltage
Internal Negative Reference Voltage
POWER SUPPLY REQUIREMENTS
Supply Voltage: +VS
Supply Current: +IS
Power Dissipation
Power Dissipation (Power Down)
Thermal Resistance, θJA
SSOP-28
CONDITIONS
TEMP
MIN
±0.7
±0.7
Guaranteed
±3.5
Full
Full
Full
Full
Full
Full
Full
Full
Full
UNITS
±1.0
LSBs
LSBs
LSBs
dBFS(2)
dBFS
50
dBc
49
49
dB
dB
48
48
48
2.3
1
0.2
2
7
dB
dB
dB
%
degrees
LSBs rms
ns
ps rms
350
100
2
MHz
MHz
ns
TTL/HCT COMPATIBLE CMOS
Straight Offset Binary
+2.4
LVDD
+0.4
20
40
2
10
50
133
18
50
V
V
ns
ns
kΩ
ns
ns
kΩ
45
44
NTSC, PAL
NTSC, PAL
Input Grounded
–20dBFS Input
0dBFS Input
1.5X FS Input
MAX
53
53
47
+25°C
Full
Full
TYP
+25°C
+25°C
+25°C
CL = 15pF
OE = L
OE = H
PwrDn = L
PwrDn = H
fS = 2.5MHz
Referred to Ideal Midscale
∆ VS = +10%
Operating
Operating
Operating, +3V
+3V
+25°C
Full
Full
Full
Full
Full
Full
Full
Full
25°C
Full
+2.7
8
15
55
62
+1.75
+1.25
±10
±60
%FS
mV
dB
dB
V
V
+3
18
54
52
10
+3.7
22
66
V
mA
mW
mW
mW
89
°C/W
NOTES: (1) Spurious Free Dynamic Range refers to the magnitude of the largest harmonic. (2) dBFS means dB relative to full scale. (3) Two-tone intermodulation
distortion is referred to the largest fundamental tone. This number will be 6dB higher if it is referred to the magnitude of the two-tone fundamental envelope. (4) No
rollover of bits.
ADS900
SBAS058A
3
PIN CONFIGURATION
PIN DESCRIPTIONS
Top View
SSOP
+VS
1
28
+VS
LVDD
2
27
IN
LSB Bit 10
3
26
CM
Bit 9
4
25
LnBy
Bit 8
5
24
IN
Bit 7
6
23
1VREF
Bit 6
7
22
NC
Bit 5
8
21
LpBy
Bit 4
9
20
GND
Bit 3 10
19
GND
Bit 2 11
18
+VS
MSB Bit 1 12
17
Pwrdn
GND 13
16
OE
GND 14
15
CLK
ADS900
PIN
DESIGNATOR
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
+VS
LVDD
Bit 10
Bit 9
Bit 8
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
GND
GND
CLK
OE
Pwrdn
+VS
GND
GND
LpBy
NC
1VREF
IN
LnBy
CM
IN
+VS
DESCRIPTION
Analog Supply
Output Logic Driver Supply Voltage
Data Bit 10 (D0) (LSB)
Data Bit 9 (D1)
Data Bit 8 (D2)
Data Bit 7 (D3)
Data Bit 6 (D4)
Data Bit 5 (D5)
Data Bit 4 (D6)
Data Bit 3 (D7)
Data Bit 2 (D8)
Data Bit 1 (D9) (MSB)
Analog Ground
Analog Ground
Convert Clock Input
Output Enable, Active Low
Power Down Pin
Analog Supply
Analog Ground
Analog Ground
Positive Ladder Bypass
No Connection
1V Reference Output
Complementary Input
Negative Ladder Bypass
Common-Mode Voltage Output
Analog Input
Analog Supply
TIMING DIAGRAM
N+2
N+1
Analog In
N+4
N+3
N
tD
N+5
tL
tCONV
N+6
N+7
tH
Clock
5 Clock Cycles
t2
Data Out
N–5
N–4
N–3
N–2
N–1
N
Data Invalid
SYMBOL
tCONV
tL
tH
tD
t1
t2
4
N+1
N+2
t1
DESCRIPTION
MIN
Convert Clock Period
Clock Pulse Low
Clock Pulse High
Aperture Delay
Data Hold Time, CL = 0pF
New Data Delay Time, CL = 15pF max
50
24
24
TYP
MAX
UNITS
100µs
ns
ns
ns
ns
ns
ns
25
25
2
3.9
12
ADS900
SBAS058A
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = LVDD = +3V, Single-Ended Input, Sampling Rate = 20MHz, unless otherwise specified.
SPECTRAL PERFORMANCE
SPECTRAL PERFORMANCE
0
0
fIN = 500kHz
fIN = 3MHz
–20
Amplitude (dB)
Amplitude (dB)
–20
–40
–60
–80
–40
–60
–80
–100
–100
0
2
4
6
8
10
0
2
4
Frequency (MHz)
SPECTRAL PERFORMANCE
10
0
fIN = 9MHz
–20
f1 = 3.5MHz at –7dBFS
f2 = 3.4MHz at –7dBFS
Magnitude (dBFS)
–20
–40
–60
–80
–40
–60
–80
–100
–100
0
2
4
6
8
10
0
2
4
Frequency (MHz)
6
8
10
Frequency (MHz)
DIFFERENTIAL LINEARITY ERROR
DIFFERENTIAL LINEARITY ERROR
2.0
2.0
fIN = 500kHz
fIN = 10MHz
1.0
Error (LSB)
1.0
DLE (LSB)
8
TWO-TONE INTERMODULATION
0
Amplitude (dB)
6
Frequency (MHz)
0.0
0.0
–1.0
–1.0
–2.0
–2.0
0
256
512
Output Code
ADS900
SBAS058A
768
1024
0
256
512
768
1024
Output Code
5
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = LVDD = +3V, Single-Ended Input, Sampling Rate = 20MHz, unless otherwise specified.
SWEPT POWER SFDR
INTEGRAL LINEARITY ERROR
60
10.0
fIN = 500kHz
50
SFDR (dBFS, dBc)
ILE (LSB)
5.0
0
40
dBFS
30
20
–5.0
dBc
10
0
–10.0
0
200
400
600
800
–80
1000
–60
–40
–20
–10
0
UNDERSAMPLING (With Differential Input)
DYNAMIC PERFORMANCE vs INPUT FREQUENCY
0
54
fIN = 20MHz
fS = 16MHz
–20
Amplitude (dB)
53
SFDR, SNR (dB)
–30
Input Amplitude
Output Code
SFDR
52
51
–40
–60
–80
SNR
50
–100
–120
49
0.1
1
10
0
100
2
4
6
8
Frequency (MHz)
Frequency (MHz)
DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE
SPURIOUS FREE DYNAMIC RANGE (SFDR)
vs TEMPERATURE
0.8
60
fIN = 500kHz
SFDR (dBFS)
DLE (LSBs)
fIN = 500kHz
0.7
fIN = 10MHz
0.6
0.5
fIN = 10MHz
50
45
–50
–25
0
25
50
Temperature (°C)
6
55
75
100
–50
–25
0
25
50
75
100
Temperature (°C)
ADS900
SBAS058A
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = LVDD = +3V, Single-Ended Input, Sampling Rate = 20MHz, unless otherwise specified.
SIGNAL-TO-NOISE RATIO (SNR) vs TEMPERATURE
POWER DISSIPATION vs TEMPERATURE
55
65
fIN = 10MHz
fIN = 500kHz
45
40
–50
60
Power (mW)
SNR (dB)
50
55
50
–25
0
25
50
75
100
–50
–25
0
Temperature (°C)
GAIN ERROR vs TEMPERATURE
50
75
100
OFFSET ERROR vs TEMPERATURE
6.5
–25
6.0
–30
Offset Error (mV)
Gain (%FSR)
25
Temperature (°C)
5.5
5.0
–35
–40
4.5
–45
–50
–25
0
25
50
75
100
–50
–25
Temperature (°C)
0
25
50
75
100
Temperature (°C)
OUTPUT NOISE HISTOGRAM (DC Input)
500
Counts
400
300
200
100
0
N-3
N-2
N-1
N
N+1
N+2
N+3
Output Code
ADS900
SBAS058A
7
THEORY OF OPERATION
Op Amp
Bias
The ADS900 is a high speed sampling ADC that utilizes a
pipeline architecture. The fully differential topology and
digital error correction guarantee 10-bit resolution. The
track-and-hold circuit is shown in Figure 1. The switches are
controlled by an internal clock which has a non-overlapping
two phase signal, φ1 and φ2. At the sampling time the input
signal is sampled on the bottom plates of the input capacitors. In the next clock phase, φ2, the bottom plates of the
input capacitors are connected together and the feedback
capacitors are switched to the op amp output. At this time the
charge redistributes between CI and CH, completing one
track-and-hold cycle. The differential output is a held DC
representation of the analog input at the sample time. In the
normal mode of operation, the complementary input is tied
to the common-mode voltage. In this case, the track-andhold circuit converts a single-ended input signal into a fully
differential signal for the quantizer. Consequently, the input
signal gets amplified by a gain or two, which improves the
signal-to-noise performance. Other parameters such as smallsignal and full-power bandwidth, and wideband noise are
also defined in this stage.
IN
IN
φ1
CH
φ2
CI
IN
IN
(Opt.)
φ1
φ2
OUT
φ1
OUT
φ1
CI
φ2
CH
φ1
φ1
Input Clock (50%)
Op Amp
Bias
VCM
Internal Non-overlapping Clock
φ1
φ2
φ1
FIGURE 1. Input Track-And-Hold Configuration with
Timing Signals.
Digital Delay
Input
T/H
(Opt.)
2-Bit
Flash
STAGE 1
φ1
VCM
2-Bit
DAC
+
Σ
–
x2
Digital Delay
STAGE 2
B1 (MSB)
2-Bit
DAC
B2
Digital Error Correction
2-Bit
Flash
+
Σ
–
x2
B3
B4
B5
B6
B7
B8
B9
Digital Delay
2-Bit
Flash
STAGE 8
B10 (LSB)
2-Bit
DAC
+
Σ
–
x2
STAGE 9
2-Bit
Flash
Digital Delay
FIGURE 2. Pipeline A/D Architecture.
8
ADS900
SBAS058A
The pipelined quantizer architecture has 9 stages with each
stage containing a two-bit quantizer and a two bit Digitalto-Analog Converter (DAC), as shown in Figure 2. Each
two-bit quantizer stage converts on the edge of the subclock, which is the same frequency of the externally applied
clock. The output of each quantizer is fed into its own delay
line to time-align it with the data created from the following
quantizer stages. This aligned data is fed into a digital error
correction circuit which can adjust the output data based on
the information found on the redundant bits. This technique
provides the ADS900 with excellent differential linearity
and guarantees no missing codes at the 10-bit level.
The ADS900 includes an internal reference circuit that
provides the bias voltages for the internal stages (for details
see “Internal Reference”). A midpoint voltage is established
by the built-in resistor ladder that is made available at pin 26
“CM”. This voltage can be used to bias the inputs up to the
recommended common-mode voltage or used to level shift
the input driving circuitry. The ADS900 can be used in both
a single-ended or differential input configuration. When
operated in single-ended mode, the reference midpoint (pin
26) should be tied to the inverting input, pin 24.
To accommodate a bipolar signal swing, the ADS900 operates with a common-mode voltage (VCM) which is derived
from the internal references. Due to the symmetric resistor
ladder inside the ADS900, the VCM is situated between the
top and bottom reference voltage. The following equation
can be used for calculating the common-mode voltage level.
VCM = (REFT +REFB)/2
SINGLE-ENDED INPUT
(IN = 1.5V DC)
+FS (IN = +2V)
+FS –1LSB
+FS –2LSB
+3/4 Full Scale
+1/2 Full Scale
+1/4 Full Scale
+1LSB
Bipolar Zero (IN +1.5V)
–1LSB
–1/4 Full Scale
–1/2 Full Scale
–3/4 Full Scale
–FS +1LSB
–FS (IN = +1V)
1111111111
1111111111
1111111110
1110000000
1100000000
1010000000
1000000001
1000000000
0111111111
0110000000
0100000000
0010000000
0000000001
0000000000
APPLICATIONS
DRIVING THE ANALOG INPUTS
Figure 3 shows an example of an ac-coupled, single-ended
interface circuit using high-speed op amps that operate on
dual supplies (OPA650, OPA658, OPA680 and OPA681).
The common-mode reference voltage (VCM), here +1.5V,
biases the bipolar, ground-referenced input signal. The capacitor C1 and resistor R1 form a high-pass filter with the
–3dB frequency set at
f–3dB = 1/(2 π R1 C1)
(2)
+3V
+5V
VIN
OPA65x
OPA68x
RS
C1
0.1µF
IN
IN
–5V
R1
1kΩ
ADS900
CM
1.5V
402Ω
VCM
0.1µF
402Ω
(1)
DIGITAL OUTPUT DATA
The 10-bit output data is provided at CMOS logic levels.
There is a 5.0 clock cycle data latency from the start convert
signal to the valid output data. The standard output coding
is Straight Offset Binary where a full scale input signal
corresponds to all “1’s” at the output. The digital outputs of
the ADS900 can be set to a high impedance state by driving
the OE (pin 16) with a logic “HI”. Normal operation is
achieved with pin 16 “LO” or Floating due to internal pulldown resistor. This function is provided for testability
STRAIGHT OFFSET BINARY
(SOB)
PIN 12
FLOATING or LO
purposes but is not recommended to be used dynamically.
The capacitive loading on the digital outputs should be kept
below 15pF.
FIGURE 3. AC-Coupled Driver.
The values for C1 and R1 are not critical in most applications
and can be set freely. The values shown correspond to a
–3dB corner frequency of 1.6kHz.
Figure 4 depicts a circuit that can be used in single-supply
applications. The common-mode voltage biases the op amp
up to the appropriate common-mode voltage, for example
VCM = +1.5V. With the use of capacitor CG the DC gain for
the non-inverting op amp input is set to +1V/V. As a result
the transfer function is modified to
VOUT = VIN {(1 + RF /RG) + VCM}
(3)
Again, the input coupling capacitor C1 and resistor R1 form
a high-pass filter. At the same time the input impedance is
defined by R1. Resistor RS isolates the op amp’s output from
the capacitive load to avoid gain peaking or even oscillation.
It can also be used to establish a defined roll-off for the
wideband noise. Its value is usually between 10Ω and 100Ω.
DIFFERENTIAL MODE OF OPERATION
Some minor performance improvements in SFDR and THD
can be realized by operating the ADS900 in its optional
differential configuration. A RF-transformer with a center
tap provides the best method of performing a single-ended to
differential conversion and interface directly to the ADS900.
TABLE I. Coding Table for the ADS900.
ADS900
SBAS058A
9
As a passive component, a transformer can be used to stepup the signal amplitude without adding noise or distortion.
At the same time it electrically isolates the front-end from
the converter. In order to achieve optimum performance and
to bias the converter inputs up to the correct common-mode
voltage the mid-reference pin “CM” can be tied directly to
the center tap of the transformer.
input signal swings 1Vp-p centered around a typical common-mode voltage of +1.5V. This voltage can be derived
from the internal bottom reference (REFB = +1.25V) and
then fed back through a resistor divider (R1, R2) to level shift
the driving op amp (OPA680). A capacitor across R2 will
shunt most of the wideband noise to ground. Depending on
the configured gain the values of resistors R1 and R2 must be
adjusted since the offsetting voltage (VOS) is amplified by
the non-inverting gain, 1+(RF/RIN). This example assumes
the sum of R1 and R2 to be 5kΩ, drawing only 250µA from
the bottom reference. Considerations for the selection of a
Figure 6 shows an example for a single-ended DC-coupled
interface circuit using one high-speed op amp to level-shift
the ground-referenced input signal to condition it for the
input requirements of the ADS900. With a +3V supply the
+3V
+5V
C1
0.1µF
RS
50Ω
VIN
IN
OPA68x
R1
1kΩ
22pF
ADS900
IN
CM
VCM = 1.5V
RF
402Ω
0.1µF
RG
402Ω
CG
0.1µF
FIGURE 4. Driver Circuit Using Single Supply.
+3V
RS
VIN
T1
OPA65x
22pF
RT
R1
IN
ADS900
IN
CM
22pF
R2
0.1µF
RF Transformer: Minicircuits TT1-6
FIGURE 5. Single-Ended to Differential Drive Circuit Using a Transformer.
+5V
RF
+3V
VCM = 1.5V
RIN
RS
VIN
ADS900
IN
OPA680
22pF
IN
CM
REFB
+1.25V
VOS
+1.5V
0.1µF
R2
R1
0.1µF
0.1µF
I = 250µA
FIGURE 6. Single-Ended DC-Coupled Input Circuit.
10
ADS900
SBAS058A
proper op amp should include its output swing, input common-mode range, and bias current. It should be noted that
any DC voltage difference between the inputs, IN and IN,
will show up as an offset at the output. At the same time an
offset adjustment can be accomplished.
mended to meet the rated performance specifications. However, the ADS900 performance is tolerant to duty cycle
variations of as much as ±10% without degradation. For
applications operating with input frequencies up to Nyquist
or undersampling applications, special considerations must
be made to provide a clock with very low jitter. Clock jitter
leads to aperture jitter (tA) which can be the ultimate limitation in achieving good SNR performance. The following
equation shows the relationship between aperture jitter,
input frequency and the signal-to-noise ratio:
INTERNAL REFERENCE
The ADS900 features an internal pipeline reference that
provides fixed reference voltages for the internal stages. As
shown in Figure 7 a buffer for each the top and bottom
reference is connected to the resistor ladder, which has a
nominal resistance of 4kΩ (±15%). The two outputs of the
buffers are brought out at pin 21 (LpBy) and pin 25 (LnBy),
primarily to connect external bypass capacitors, typically
0.1µF, which will improve the performance. The buffers can
drive limited external loads, for example for level shifting of
the converter’s interface circuit, however, the current draw
should be limited to approximately 1mA.
SNR = 20log10 [1/(2 π fIN tA)]
(4)
For example, in the case of a 10MHz full-scale input signal
and an aperture jitter of tA = 20ps the SNR is clock jitter
limited to 58dB.
DIGITAL OUTPUTS
The digital outputs of the ADS900 are standard CMOS
stages and designed to be compatible to both high speed
TTL and CMOS logic families. The logic thresholds are for
low-voltage CMOS: VOL = 0.4V, VOH = 2.4V, which allows
the ADS900 to directly interface to 3V-logic. The digital
outputs of the ADS900 uses a dedicated digital supply pin
(pin 2, LVDD) see Figure 8. By adjusting the voltage on
LVDD, the digital output levels will vary respectively. It is
recommended to limit the fan-out to one to keep the capacitive loading on the data lines below the specified 15pF. If
necessary, external buffers or latches may be used which
provide the added benefit of isolating the ADC from any
digital activities on the bus coupling back high frequency
noise and degrading the performance.
Derived from the top reference of +1.75V is an additional
voltage of +1.0V. Note that this voltage, available on pin 23,
is not buffered and care should be taken when external loads
are applied. In normal operation, this pin is left unconnected
and no bypassing components are required.
CLOCK INPUT REQUIREMENTS
The clock input of the ADS900 is designed to accommodate
either +5V or +3V CMOS logic levels. To drive the clock
input with a minimum amount of duty cycle variation and
support maximum sampling rates (20Msps) high speed or
advanced CMOS logic should be used (HC/HCT, AC/ACT).
When digitizing at high sampling rates, a 50% duty cycle
along with fast rise and fall times (2ns or less) are recom-
ADS900
+1.75V
21
REFT
LpBy
0.1µF
2kΩ
CM
2.1kΩ
23
26
+1VREF
2.8kΩ
0.1µF
2kΩ
+1.25V
REFB
25
LnBy
0.1µF
FIGURE 7. Internal Reference Structure and Recommended Reference Bypassing.
ADS900
SBAS058A
11
POWER-DOWN MODE
The ADS900’s low power consumption can be reduced even
further by initiating a power down mode. For this, the Power
Down Pin (Pin 17) must be tied to a logic “High” reducing
the current drawn from the supply by about 70%. In normal
operation the power-down mode is disabled by an internal
pull-down resistor (50kΩ).
During power-down the digital outputs are set in 3-state.
With the clock applied, the converter does not accurately
process the sampled signal. After removing the power-down
condition the output data from the following 5 clock cycles
is invalid (data latency).
DECOUPLING AND GROUNDING
CONSIDERATIONS
The ADS900 has several supply pins, one of which is
dedicated to only supply the output driver (LVDD). The
remaining supply pins are not divided into analog and digital
supply pins since they are internally connected on the chip.
For this reason it is recommended to treat the converter as an
analog component and to power it from the analog supply
only. Digital supply lines often carry high levels of noise
which can couple back into the converter and limit the
performance.
Because of its fast switching architecture, the converter also
generates high frequency transients and noise that are fed
back into the supply and reference lines. This requires that
the supply and reference pins be sufficiently bypassed.
Figure 9 shows the recommended decoupling scheme for the
analog supplies. In most cases 0.1µF ceramic chip capacitors
are adequate to keep the impedance low over a wide frequency range. Their effectiveness largely depends on the
proximity to the individual supply pin. Therefore they should
be located as close to the supply pins are possible.
12
+VS
+LVDD
Digital
Output
Stage
ADS900
FIGURE 8. Independent Supply Connection for Output
Stage.
ADS900
+VS
1
GND
13 14
0.1µF
+VS
18
0.1µF
GND
19 20
+VS
28
0.1µF
FIGURE 9. Recommended Bypassing for Analog Supply
Pins.
ADS900
SBAS058A
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
ADS900E
ACTIVE
SSOP
DB
28
ADS900E/1K
ACTIVE
SSOP
DB
ADS900E/1KG4
ACTIVE
SSOP
ADS900EG4
ACTIVE
SSOP
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
28
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
28
CU NIPDAU
Level-2-260C-1 YEAR
50
Green (RoHS &
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-May-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
ADS900E/1K
Package Package Pins
Type Drawing
SSOP
DB
28
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.2
10.5
2.5
12.0
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-May-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
ADS900E/1K
SSOP
DB
28
1000
346.0
346.0
33.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising