Texas Instruments | 2.7 V To 5.5 V 8-Channel 10-Bit 1.25-MSPS Serial Analog-to-Digital Converter (Rev. B) | Datasheet | Texas Instruments 2.7 V To 5.5 V 8-Channel 10-Bit 1.25-MSPS Serial Analog-to-Digital Converter (Rev. B) Datasheet

Texas Instruments 2.7 V To 5.5 V 8-Channel 10-Bit 1.25-MSPS Serial Analog-to-Digital Converter (Rev. B) Datasheet
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
features
D
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D
D
D
D
D
D
D
applications
D
D
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D
D
Fast Throughput Rate: 1.25 MSPS at 5 V,
625 KSPS at 3 V
Wide Analog Channel Input: 0 V to AVDD
Eight Analog Input Channels
Channel Auto-Scan
Differential Nonlinearity Error: < ±1 LSB
Integral Nonlinearity Error: < ±1 LSB
Signal-to-Noise and Distortion Ratio: 57 dB
Single 2.7-V to 5.5-V Supply Operation
Very Low Power: 40 mW at 5.5 V,
8 mW at 2.7 V
Autopower-Down: 300 µA Max
Software Power Down: 10 µA Max
Glueless Serial Interface to TMS320 DSPs
and (Q)SPI Compatible Microcontrollers
Programmable Internal Reference Voltage:
3.8-V Reference for 5-V Operation,
2.3-V Reference for 3-V Operation
Mass Storage and Hard Disk Drive
Automotive
Digital Servos
Process Control
General-Purpose DSP
Image Sensor Processing
DW OR PW PACKAGE
(TOP VIEW)
CH4
CH3
CH2
CH1
CH0
DVDD
DGND
FS
SCLK
SDIN
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
AIN
MO
CH5
CH6
CH7
AVDD
AGND
REF
CS
SDOUT
description
The TLV1570 is a 10-bit data acquisition system that combines an 8-channel input multiplexer (MUX), a
high-speed 10-bit ADC, an on-chip reference, and a high-speed serial interface. The device contains an on-chip
control register allowing control of channel selection, conversion start, reference voltage levels, and power
down via the serial port. The MUX is independently accessible, which allows the user to insert a signal
conditioning circuit such as an antialiasing filter or an amplifier, if required, between the MUX and the ADC.
Therefore one signal conditioning circuit can be used for all eight channels.
The TLV1570 operates from a single 2.7-V to 5.5-V power supply. The device accepts an analog input range
from 0 V to AVDD and digitizes the input at a maximum 1.25 MSPS throughput rate. Power dissipation is only
8 mW with a 2.7-V supply or 40 mW with a 5.5-V supply. The device features an autopower-down mode that
automatically powers down to 300 µA, 10 ns after a conversion is performed. With software power down
enabled, the device is further powered down to only 10 µA.
The TLV1570 communicates with digital microprocessors via a simple 4- or 5-wire serial port that interfaces
directly to Texas Instruments TMS320 DSPs, and SPI and QSPI compatible microcontrollers without using
additional glue logic.
A very high throughput rate, a simple serial interface, and low power consumption make the TLV1570 an ideal
choice for high-speed digital signal processing requiring multiple analog inputs.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
SMALL OUTLINE
(DW)
SMALL OUTLINE
(PW)
0°C to 70°C
TLV1570CDW
TLV1570CPW
– 40°C to 85°C
TLV1570IDW
TLV1570IPW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI and QSPI are trademarks of Motorola, Inc.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
functional block diagram
MO
AVDD
AIN
DVDD
REFERENCE
CH0
CH1
CH2
CH3
CH4
CH5
CH6
CH7
REF
REF+
MUX
10-BIT
SAR ADC
REF–
AGND
SCLK
SDIN
SDOUT
I/O REGISTERS
AND CONTROL LOGIC
FS
CS
AGND
DGND
Terminal Functions
TERMINAL
NAME
NO.
AGND
14
AIN
20
AVDD
CH0 – CH7
I/O
DESCRIPTION
Analog ground
I
15
ADC analog input
Analog supply voltage, 2.7 V to 5.5 V
5,4,3,2,1,
18,17,16
I
Analog input channels 0 – 7
CS
12
I
Chip select. A low level signal on CS enables the TLV1570. A high level signal on CS disables the device
and disconnects power to the TLV1570.
DGND
7
Digital ground
DVDD
6
Digital supply voltage, 2.7 V to 5.5 V
FS
8
I
Frame sync. The falling edge of the frame sync pulse from a DSP indicates the start of a serial data frame
shifted out of the TLV1570. FS is pulled high when interfaced to a microcontroller.
MO
19
O
On-chip MUX analog output
REF
13
I
Reference voltage input. The voltage applied to REF defines the input span of the TLV1570. In external
reference mode, a 0.1 µF decoupling capacitor must be placed between the reference and AGND. This is
not required for internal reference mode.
SCLK
9
I
Serial clock input. SCLK synchronizes the serial data transfer and is also used for internal data conversion.
SDIN
10
I
Serial data input used to configure the internal control register.
SDOUT
11
O
Serial data output. A/D conversion results are output at SDOUT.
2
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
detailed description
analog-to-digital converter
The TLV1570 ADC uses the SAR architecture described in this section. The CMOS threshold detector in the
successive-approximation conversion system determines the value of each bit by examining the charge on a
series of binary-weighted capacitors (see Figure 1). In the first phase of the conversion process, the analog input
is sampled by closing the SC switch and all ST switches simultaneously. This action charges all of the capacitors
to the input voltage.
SC
Threshold
Detector
To Output
Latches
512
Node 512
REF –
256
128
8
REF+
REF+
REF+
REF –
ST
REF –
ST
REF –
ST
4
2
REF+
REF –
ST
1
REF+
REF –
ST
1
REF+
REF –
ST
REF+
REF –
ST
ST
VI
NOTE: REF– is tied to AGND
Figure 1. Simplified Model of the Successive-Approximation System
In the next phase of the conversion process, all ST and SC switches are opened and the threshold detector
begins identifying bits by identifying the charge (voltage) on each capacitor relative to the reference (REF–)
voltage (REF– is tied to AGND). In the switching sequence, ten capacitors are examined separately until all ten
bits are identified and then the charge-convert sequence is repeated. In the first step of the conversion phase,
the threshold detector looks at the first capacitor (weight = 512). Node 512 of this capacitor is switched to the
REF+ voltage, and the equivalent nodes of all the other capacitors on the ladder are switched to REF–. If the
voltage at the summing node is greater than the trip point of the threshold detector (approximately one-half VCC),
a bit 0 is placed in the output register and the 512-weight capacitor is switched to REF–. If the voltage at the
summing node is less than the trip point of the threshold detector, a bit 1 is placed in the register and the
512-weight capacitor remains connected to REF+ through the remainder of the successive-approximation
process. The process is repeated for the 256-weight capacitor, the 128-weight capacitor, and so forth down the
line until all bits are counted.
With each step of the successive-approximation process, the initial charge is redistributed among the
capacitors. The conversion process relies on charge redistribution to count and weigh the bits from MSB to LSB.
In the case of the TLV1570, REF– is tied to ground and REF+ is connected to the REF input.
The TLV1570 can be programmed to use the on-chip internal reference (DI6=1). The user can select between
two values of internal reference, 2.3 V or 3.8 V, using the control bit DI5.
During internal reference mode, the reference voltage is not output on the REF pin. Therefore it cannot be
decoupled to analog ground (AGND), which acts as the negative reference for the ADC, using an external
capacitor. Hence this mode requires the ground noise to be very low. The REF pin can be left open in this mode.
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
sampling frequency, fs
The TLV1570 requires 16 SCLKs for each sampling and conversion, therefore the equivalent maximum
sampling frequency achievable with a given SCLK frequency is:
fs(MAX) = (1/16)fSCLK
power down
The TLV1570 offers two different power-down options. With autopower-down mode enabled, (DI4=0) the ADC
proceeds to power down if FS is not detected on the 17th falling SCLK edge of a cycle (a cycle starts with FS
being detected on a falling edge of SCLK) in DSP mode and after 16 SCLKs in µC mode. The TLV1570 will
recover from auto power down when FS goes high in DSP mode or when the next SCLK comes in µC mode.
In the case of software power down, the ADC goes to the software power-down state one cycle after CR.DI15
is set to 1. Unlike autopower down which recovers in 1 SCLK, software power down takes 16 SCLKs to recover.
Maximum power down dissipation current
300 µA
SOFTWARE
POWERDOWN
CS = DVDD
10 µA
Comparator
Power down
Powerdown
Clock buffer†
Power down
Powerdown
Reference
Active
Powerdown
Register
Not saved
Not saved
Minimum power down time
1 SCLK
1 µs
Minimum resume time
DESCRIPTION
Power down
Power up
AUTOPOWER DOWN
1 SCLK
800 ns
DSP mode
No FS present one SCLK after previous conversion completed
CR.DI15 set to 1
Microprocessor mode (FS = 1)
SCLK stopped after previous conversion completed
CR.DI15 set to 1
DSP mode
FS present
CR.DI15 set to 1
Microprocessor mode (FS = 1)
SCLK present
CR.DI15 set to 1
† Only in DSP mode is input buffer of clock in power-down mode.
‡ The software power down enable/disable bit is not acted until the start of the next cycle (see section configuring the TLV1570 for more information.
configuring the TLV1570
The TLV1570 is to be configured by writing the control bits to SDIN. The configuration will not take affect until
the next cycle. A new configuration is needed for each conversion. Once the channel input and other options
are selected, the conversion takes place in the next cycle. Conversion results are shifted out as conversion
progresses ( see Figure 2).
One Cycle
Second Cycle
17
32
SCLK
ts
SDIN
SDOUT
tconv
ts
Configure Data 1
tconv
Configure Data 2
Result 0
Result 1
Figure 2. TLV1570 Configuration Cycle Timing
4
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
configuration register (CR) definition
BIT
DESCRIPTION
5V
3V
X
X
X
X
Reads out values of the internal register, 1 – read. Only DI15 – DI1 are read out.
X
X
These two bits select the self-test voltage to be applied to the ADC input during next clock cycle:
X
X
X
X
X
X
X
X
X
X
Software power down:
DI15
DI14
DI13, DI12
0:
1:
Normal
Power down enabled
00:
Allow AIN to come in normally
01:
Apply AGND to AIN
10:
Apply VREF/2 to AIN
11:
N/A
Choose speed application
DI11
0:
High speed (higher power consumption)
1:
Low speed (lower power consumption)
This bit enables channel auto-scan function.
DI10
0:
1:
Autoscan disabled
Autoscan enabled
DI9 – DI7 These three bits select which of the eight
channels is to be used (if DI10 = 0).
DI9, DI8, DI7
DI9, DI8 These two bits select the channel swept
sequence used by auto scan mode (if DI10 = 1)
000:
Channel 0 selected as input
00:
Analog inputs CH0, CH1, CH2, ….., CH7
sequentially selected
001:
Channel 1 selected as input
01:
Analog inputs CH1, CH3, CH5, CH7
sequentially selected
010:
Channel 2 selected as input
10:
Analog inputs CH0, CH2, CH4, CH6
sequentially selected
011:
Channel 3 selected as input
11:
Analog inputs CH7, CH6, CH5, ….., CH0
sequentially selected
100:
Channel 4 selected as input
101:
Channel 5 selected as input
0:
No reset
110:
Channel 6 selected as input
1:
Reset autoscan sequence
111:
Channel 7 selected as input
DI7 Auto-scan reset
Selects Internal or external reference voltage:
DI6
0:
1:
External
Internal
Selects internal reference voltage value to be applied to the ADC during next conversion cycle.
DI5
0:
2.3 V
1:
3.8 V
X
X
Enables/disables autopower-down function:
DI4
1:
Enable
0:
Disable
X
X
X
X
DI2
Performance optimizer – linearity
0: AVDD = 5.5 V to 3.6 V
1: AVDD = 3.5 V to 2.7 V
Always write 0 (reserved bit)
X
X
DI1
Always write 0 (reserved bit)
X
X
DI0
Always write 0 (reserved bit)
X
X
DI3
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
initialization-software sequence
This sequence shows the default settings, unless otherwise specified. The ADC requires that the user write to
it every cycle. There is a cycle delay before control bits are implemented.
Example 1. Normal Sample Mode With Internal Reference
CYCLE
WRITE TO
SDIN
CHANNEL
SAMPLED
OUTPUT FROM
SDOUT
COMMENT
1st
0040h
N/A
Invalid
No analog input channel sampled
2nd
01C0h
N/A
Invalid
No analog input channel sampled
3rd
0040h
3
From Channel 3
4th
8040h
0
From Channel 0
Software power down enabled
5th
0040h
N/A
Invalid
Software power-down mode, no analog input channel sampled
Recovery time, no analog input channel sampled (16 SCLKs if AVDD = 5 V and
fCLK = 20 MHz)
Wait 800 ns
6th
0140h
N/A
7th
0040h
2
Invalid
Recovery time, no analog input channel sampled
From Channel 2
Example 2. Auto Scan Mode
CYCLE
WRITE TO
SDIN
CHANNEL
SAMPLED
OUTPUT FROM
SDOUT
COMMENT
1st
0480h
N/A
Invalid
Autoscan reset enabled, no analog input channel sampled
2nd
0480h
N/A
Invalid
No analog input channel sampled
3rd
0400h
0
From Channel 0
4th
0400h
1
From Channel 1
5th
0400h
2
From Channel 2
6th
0400h
3
From Channel 3
7th
0400h
4
From Channel 4
8th
0400h
5
From Channel 5
9th
0400h
6
From Channel 6
10th
0400h
7
From Channel 7
11th
0400h
0
From Channel 0
NOTE: If software power down is enabled during auto-scan mode, the next channel in the sequence is skipped.
6
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TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
initialization-software sequence (continued)
Example 3. Auto-Scan Mode
This example shows a change in sequence in the middle of the current sequence. The following shows that after
the initial autoscan reset, a reset is not necessary again when switching channel sequences.
CYCLE
WRITE TO
SDIN
CHANNEL
SAMPLED
OUTPUT FROM
SDOUT
COMMENT
1st
0480h
N/A
N/A
No analog input channel sampled
2nd
0480h
N/A
N/A
Autoscan reset enabled, no analog input channel sampled
3rd
0400h
0
From Channel 0
Start of sequence 0
4th
0700h
1
From Channel 1
Enable channel sequence 3 (no auto-scan reset required)
5th
0700h
7
From Channel 7
Start of sequence 3
6th
0700h
6
From Channel 6
7th
0700h
5
From Channel 5
8th
0700h
4
From Channel 4
9th
0700h
3
From Channel 3
10th
0700h
2
From Channel 2
11th
0700h
1
From Channel 1
12th
0700h
0
From Channel 0
Example 4. Auto-Scan Mode
This example shows a switch in sequence in the course of a sequence. The following shows that a particular
sequence does not have to be continued if remaining channels do not need to be sampled (i.e., only channel
1 through channel 5 sampled, not channels 6, 7, 8)
CYCLE
WRITE TO
SDIN
CHANNEL
SAMPLED
OUTPUT FROM
SDOUT
COMMENT
1st
0480h
N/A
N/A
No analog input channel sampled
2nd
0480h
N/A
N/A
Autoscan reset enabled, no analog input channel sampled
3rd
0400h
0
From Channel 0
4th
0400h
1
From Channel 1
5th
0400h
2
From Channel 2
6th
0400h
3
From Channel 3
7th
0400h
4
From Channel 4
8th
0480h
5
From Channel 5
Autoscan reset enabled
9th
0400h
0
From Channel 0
Sequence is reset to channel 0
10th
0400h
1
From Channel 1
11th
0400h
2
From Channel 2
The TLV1570 is a 800-ns 10-bit 8-analog input channel analog-to-digital converter with a throughput of up to
1.25 MSPS at 5 V and up to 625 KSPS at 3 V respectively. To run at its fastest conversion rate, it must be clocked
at 20 MHz at 5-V or 10 MHz at 3-V. The TLV1570 can be easily interfaced to microcontrollers, ASICs, DSPs,
or shift registers. The TLV1570 serial interface is designed to be fully compatible with serial peripheral interface
(SPI) and TMS320 DSP serial ports. No additional hardware is required to interface between the TLV1570 and
a microcontroller (µCs) with a SPI serial port or a TMS320 DSP. However, the speed is limited by the SCLK rate
of the µC or the DSP.
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
initialization-software sequence (continued)
The TLV1570 interfaces to a DSP over five lines: CS, SCLK, SDOUT, SDIN, and FS, and interfaces to a µC over
four lines: CS, SCLK, SDOUT, and SDIN. The FS input should be pulled high in µC mode. The device is in 3-state
and power-down mode when CS is high. After CS falls, the TLV1570 checks the FS input at the CS falling edge
to determine the operation mode. If FS is low, DSP mode is set, otherwise µC mode is set.
TLV1570
TMS320
CS
CS
XF
CLKX
SCLK
µC
TLV1570
I/O Terminal
SCLK
SCLK
CLKR
FSX
FS
FS
DVDD
FSR
SDIN
DX
SDIN
DX
SDOUT
DR
SDOUT
DR
Figure 4. µC to TLV1570 Interface
Figure 3. DSP to TLV1570 Interface
grounding and decoupling considerations
General practices should apply to the PCB design to limit high frequency transients and noise that are fed back
into the supply and reference lines (see Figure 5). This requires that the supply and reference pins be sufficiently
bypassed. In most cases 0.1 µF ceramic chip capacitors are adequate to keep the impedance low over a wide
frequency range. Since their effectiveness depends largely on the proximity to the individual supply pin. They
should be placed as close to the supply pins as possible.
To reduce high frequency and noise coupling, it is highly recommended that digital and analog ground be
shorted immediately outside the package. This can be accomplished by running a low impedance line between
DGND and AGND, under the package.
TLV1570
DVDD
AVDD
DGND
AGND
100 nF
100 nF
100 nF
REF
Figure 5. Placement of Decoupling Capacitors
power supply ground layout
Printed-circuit boards that use separate analog and digital ground planes offer the best system performance.
Wire-wrap boards do not perform well and should not be used. The two ground planes should be connected
together at the low-impedance power-supply source. The best ground connection may be achieved by
connecting the ADC AGND terminal to the system analog ground plane making sure that analog ground
currents are well managed.
8
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2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
simplified analog input analysis
Using the equivalent circuit in Figure 6, the time required to charge the analog input capacitance from 0 to VS
within 1/2 LSB, tch(1/2 LSB), can be derived as follows:
ǒ
Ǔ
The capacitance charging voltage is given by:
V
C(t)
+ VS 1–e–tchńRtCi
Where:
(1)
Rt = Rs + Ri
Ri = Ri(ADC) + Ri(MUX)
tch = Charge time
The input impedance Ri is 718 Ω at 5 V, and is higher (~1.25 kΩ) at 2.7 V. The final voltage to 1/2 LSB is given
by:
(2)
VC (1/2 LSB) = VS – (VS /2048)
ǒ
Ǔ
Equating equation 1 to equation 2 and solving for cycle time tc gives:
V
S
ǒ
Ǔ
* VSń2048 + VS 1–e–tchńRtCi
(3)
and time to change to 1/2 LSB (minimum sampling time) is:
tch (1/2 LSB) = Rt × Ci × ln(2048)
Where:
ln(2048) = 7.625
Therefore, with the values given, the time for the analog input signal to settle is:
tch (1/2 LSB) = (Rs + 718 Ω) × 15 pF × ln(2048)
(4)
This time must be less than the converter sample time shown in the timing diagrams. Which is 6x SCLK.
tch (1/2 LSB) ≤ 6x 1/f(SCLK)
(5)
Therefore the maximum SCLK frequency is:
Max(f(SCLK) ) = 6 / tch (1/2 LSB) = 6/(ln(2048) × Rt × Ci )
Driving Source†
TLC1570
MO
Rs
VS
VI
Ri(MUX)
AIN
Ri(ADC)
VC
Ci
15 pF
(6)
VI = Input Voltage at AIN
VS = External Driving Source Voltage
Rs = Source Resistance
Ri(ADC)= Input Resistance of ADC
Ri(MUX)= Input Resistance (MUX on resistance)
Ci = Input Capacitance
VC = Capacitance Charging Voltage
† Driving source requirements:
• Noise and distortion for the source must be equivalent to the resolution of the converter.
• Rs must be real at the input frequency.
Figure 6. Equivalent Input Circuit Including the Driving Source
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SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
definitions of specifications and terminology
integral nonlinearity (INL)
Integral nonlinearity refers to the deviation of each individual code from a line drawn from zero through full scale.
The point used as zero occurs 1/2 LSB before the first code transition. The full scale point is defined as level
1/2 LSB beyond the last code transition. The deviation is measured from the center of each particular code to
the true straight line between these two points.
differential nonlinearity (DNL)
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value.
A differential nonlinearity error of less than ±1 LSB ensures no missing codes.
zero offset
The major carry transition should occur when the analog input is at zero volts. Zero error is defined as the
deviation of the actual transition from that point.
gain error
The first code transition should occur at an analog value 1/2 LSB above negative full scale. The last transition
should occur at an analog value 1 1/2 LSB below the nominal full scale. Gain error is the deviation of the actual
difference between first and last code transitions and the ideal difference between first and last code transitions.
signal-to-noise ratio + distortion (SINAD)
SINAD is the ratio of the rms value of the measured input signal to the rms sum of all other spectral components
below the Nyquist frequency, including harmonics but excluding dc. The value for SINAD is expressed in
decibels.
effective number of bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N = (SINAD – 1.76)/6.02
It is possible to get a measure of performance expressed as N, the effective number of bits. Thus, effective
number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its
measured SINAD.
total harmonic distortion (THD)
Total harmonic distortion is the ratio of the rms sum of the first six harmonic components to the rms value of the
measured input signal and is expressed as a percentage or in decibels.
spurious free dynamic range (SFDR)
Spurious free dynamic range is the difference in dB between the rms amplitude of the input signal and the peak
spurious signal.
10
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TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage range, AGND to AVDD, DGND to DVDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to 6.5 V
Analog input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to AVDD+0.3 V
Reference input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . AVDD+0.3 V
Digital input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.3 V to DVDD+0.3 V
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C
Operating free-air temperature range, TA: TLV1570C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
TLV1570I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
power supplies
MIN
TYP
MAX
UNIT
Analog supply voltage, AVDD (see Note 1)
2.7
5.5
V
Digital supply voltage, DVDD (see Note 1)
2.7
5.5
V
NOTE 1: Abs (AVDD – DVDD) < 0.5 V
analog inputs
MIN
Analog input voltage, AIN
TYP
AGND
Reference input voltage,
voltage REF
MAX
UNIT
V
DVDD = 3.3 V to 2.7 V
55% AVDD
VREF
AVDD
DVDD = 5.5 V to 4.5 V
60% AVDD
AVDD
V
digital inputs
MIN
TYP
MAX
High-level input voltage, VIH
DVDD = 2.7 V to 5.5 V
Low-level input voltage, VIL
DVDD = 2.7 V to 5.5 V
0.8
DVDD = 5.5 V to 4.5 V
20
Input SCLK frequency
SCLK pulse duration,
duration clock high,
high tw(SCLKH)
(SCLKH)
low tw(SCLKL)
SCLK pulse duration
duration, clock low,
(SCLKL)
2.1
DVDD = 3.6 V to 2.7 V
1
DVDD = 5.5 V to 4.5 V
23
DVDD = 3.6 V to 2.7 V
46
DVDD = 5.5 V to 4.5 V
23
DVDD = 3.6 V to 2.7 V
46
UNIT
V
10
V
MHz
ns
ns
electrical characteristics,over recommended operating free-air temperature range, supply
voltages, and reference voltages (unless otherwise noted)
digital specifications (SDOUT at 25 pF)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Logic inputs
IIH
IIL
High-level input current
DVDD = 5 V,
VI = 5 V
Low-level input current
DVDD = 5 V,
VI = 0 V
CI
Input capacitance
Control inputs
5
1
µA
–1
µA
15
pF
Logic outputs
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
VOH
VOL
High-level output voltage
IOZH
IOZL
High-impedance-state output current
CO
Output capacitance
12
Low-level output voltage
IOH = 50 µA – 0.5 mA
IOL = 50 µA – 0.5 mA
DVDD–0.4
V
Low-impedance-state output current
5
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
0.4
V
1
µA
–1
µA
pF
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
electrical characteristics, over recommended operating free-air temperature range, supply
voltages, and reference voltages (unless otherwise noted) (continued)
dc specifications
PARAMETER
TEST CONDITIONS
MIN
Resolution
TYP
MAX
10
UNIT
Bits
Accuracy
Integral nonlinearity, INL
± 0.6
Best fit
LSB
± 0.65
±1
Offset error
± 0.1
± 0.15
%FSR
Gain error
± 0.1
± 0.2
%FSR
15
20
pF
±1
µA
265
780
Ω
Differential nonlinearity, DNL
EO
EG
±1
LSB
Analog input
Ci
Input capacitance
Ilkg
Input leakage current
Ri(MUX)
Ri(ADC)
Input MUX ON resistance
Input MUX ON resistance
VAIN = 0 V to AVDD
DVDD = 3 V,
AVDD = 3 V
DVDD = 5 V,
DVDD = 3 V,
AVDD = 5 V
AVDD = 3 V
235
450
Ω
158
465
Ω
DVDD = 5 V,
AVDD = 5 V
140
268
Ω
Voltage reference
REF
Internal reference voltage
Internal reference mode, VDD = 3 V
2.08
2.26
2.48
V
Internal reference mode, VDD = 5 V
3.48
3.82
4.15
V
Temperature coefficient
100
ri
Input resistance
External reference mode
Ci(VR)
Input capacitance
External reference mode
ppm/°C
3
kΩ
300
pF
Power supply
IDD + IREF
PD
Operating supply current
dissipation
Power dissi
ation
AVDD = 2.7 V,
AVDD = 5.5 V,
DVDD = 2.7 V, fSCLK = 10 MHz†
DVDD = 5.5 V, fSCLK = 20 MHz‡
AVDD = 2.7 V,
DVDD = 2.7 V
AVDD = 5.5 V,
DVDD = 5.5 V
AVDD = 2
2.7
7V
Software
Supply
y current in
power down
IDD + IREF
AVDD = 5
5.5
5V
Auto
IDD + IREF
3
5
7.2
8.5
mA
8
13
mW
mW
40
47
CS = AVDD
3
10
CS = AGND
500
CS = AVDD
3
CS = AGND
2000
10
mA
µA
µA
AVDD = 2.7V
175
275
µA
AVDD = 5.5V
200
300
µA
† IREF = 0.7 mA typ.
‡ IREF = 1.5 mA typ.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
electrical characteristics, over recommended operating free-air temperature range, supply
voltages, and reference voltages (unless otherwise noted) (continued)
ac specifications
PARAMETER
TEST CONDITIONS
fi = 100 kHz,,
70% of FS
SNR
Signal to noise ratio
Signal-to-noise
fi = 50 kHz,,
90% of FS
fi = 100 kHz,,
70% of FS
SINAD
Signal to noise ratio + distortion
Signal-to-noise
fi = 50 kHz,,
90% of FS
fi = 100 kHz,,
70% of FS
THD
Total harmonic distortion
fi = 50 kHz
90% of FS
fi = 100 kHz,,
70% of FS
SFDR
Spurious free dynamic range
Spurious-free
fi = 50 kHz,,
90% of FS
fi = 100 kHz,,
70% of FS
ENOB
Effective number of bits
fi = 50 kHz,,
90% of FS
14
MIN
TYP
MAX
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
58
61
Internal reference
53
56
fs = 625 KSPS,,
AVDD = 3 V
External reference
56
61
Internal reference
53
55
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
61
Internal reference
56
fs = 625 KSPS,,
AVDD = 3 V
External reference
61
Internal reference
55
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
55
58
Internal reference
53
55
fs = 625 KSPS,,
AVDD = 3 V
External reference
53
58
Internal reference
52
54
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
59
Internal reference
55
fs = 625 KSPS,,
AVDD = 3 V
External reference
60
Internal reference
55
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
–60
–55
Internal reference
–70
–58
fs = 625 KSPS,,
AVDD = 3 V
External reference
–60
–55
Internal reference
–66
–58
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
–64
Internal reference
–72
fs = 625 KSPS,,
AVDD = 3 V
External reference
–63
Internal reference
–68
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
–63
–57
Internal reference
–73
–59
fs = 625 KSPS,,
AVDD = 3 V
External reference
–61
–57
Internal reference
–68
–60
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
–66
Internal reference
–75
fs = 625 KSPS,,
AVDD = 3 V
External reference
–65
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
8.8
9.3
Internal reference
8.6
8.9
fs = 625 KSPS,,
AVDD = 3 V
External reference
8.6
9.3
Internal reference
8.4
8.8
fs = 1.25 MSPS,,
AVDD = 5 V
External reference
9.5
Internal reference
8.9
fs = 625 KSPS,,
AVDD = 3 V
External reference
9.5
Internal reference
8.9
POST OFFICE BOX 655303
Internal reference
• DALLAS, TEXAS 75265
UNIT
dB
dB
dB
dB
–70
dB
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
ac specifications (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Analog Input
Channel-to-channel crosstalk
BW
BW
– 75
–1 dB full-scale input sine wave
Full power bandwidth
Full-power
12
–3 dB full-scale input sine wave
Small-signal bandwidth
–1 dB
15
–3 dB
fs
MHz
25
MHz
20
MHz
35
AVDD = 5 V
AVDD = 3 V
Sampling rate
dB
15
MHz
0.0625
1.25
0.0625
0.625
MSPS
timing requirements†
PARAMETER
tc(SCLK)
(SCLK)
SCLK cycle time
tw(1)
Pulse duration, chip select
TEST CONDITIONS
MIN
DVDD = 5.5 V to 4.5 V
50
DVDD = 3.6 V to 2.7 V
100
TYP
MAX
UNIT
ns
100
ns
6
SLCK
cycles
10
SLCK
cycles
t(s)
Sampling period
t(conv)
Conversion period
tsu(1)
th(1)
Setup time, FS to SCLK falling edge in DSP mode
5
ns
Hold time, FS to SCLK falling edge in DSP mode
2
ns
tsu(2)
th(2)
Setup time, FS to CS falling edge in DSP mode
5.5
ns
Hold time, FS to CS falling edge in DSP mode
9
ns
td(1)
td(2)
Delay time, FS falling edge to next SCLK falling edge in DSP mode
6
ns
Delay time, SCLK rising edge after CS falling edge in µC mode
4
td(3)
Delay time, output after SCLK rising edge in µC mode and DSP
mode
tsu(3)
th(3)
Setup time, serial input data to SCLK falling edge
10
Hold time, serial input data to SCLK falling edge
4
tr
Rise time
† Specifications subject to change without notice.
3
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
ns
10
20
ns
ns
ns
200
ns
15
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
PARAMETER MEASUREMENT INFORMATION
tc(SCLK)
1
2
3
SCLK
tw(1)
CS
tsu(1)
th(1)
td(1)
FS
tsu(2)
tsu(3)
th(2)
th(3)
DI15
SDIN
DI14
DI13
MSB
td3
0
SDOUT
0
Figure 7. DSP Mode Timing Diagrams
td(2)
1
2
3
4
SCLK
tw(1)
CS
FS
tsu(3)
SDIN
DI15
th(3)
DI14
DI13
DI12
MSB
td(3)
SDOUT
0
0
Figure 8. µC Mode Timing Diagrams
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
0
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
ANALOG MUX INPUT RESISTANCE
vs
FREE-AIR TEMPERATURE
TOTAL SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
350
8
AVDD = 5.5 V
AVDD = 2.7 V, AIN = 2 V
I CC Total Supply Current – mA
Analog Mux Input Resistance
300
250
AVDD = 5.5 V, AIN = 3.8 V
200
150
100
50
0
–45
AVDD = 2.7 V
4
2
0
–45
90
25
6
TA – Free-Air Temperature – °C
90
Figure 10
Figure 9
SUPPLY CURRENT
vs
CLOCK FREQUENCY (SCLK)
GAIN
vs
INPUT FREQUENCY
8
1
7
VDD = 5.5 V
0
6
–1
5
4
Gain – dB
I CC – Supply Current – mA
25
TA – Free-Air Temperature – °C
VDD = 2.7 V
VDD = 5 V, AIN = 90% of FS,
REF = 5 V, TA = 25°C
––2
3
–3
2
–4
1
0
2.5
–5
5
6.2
7.5
10
12.5
15.4
18
20
0
f – Clock Frequency – MHz
1
10
100
f – Input Frequency – MHz
Figure 11
Figure 12
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 2.7 V, Internal REF = 2.3 V,
SCLK = 10 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 13
INL – Integral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
0.8
VCC = 2.7 V, Internal REF = 2.3 V,
SCLK = 10 MHz,
TA = 25°C
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
Samples
Figure 14
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1023
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 2.7 V, External REF = 2.7 V,
SCLK = 10 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 15
INL – Integral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 2.7 V, External REF = 2.7 V,
SCLK = 10 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
511
0
1023
Samples
Figure 16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
19
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
0.8
0.6
VCC = 5.5 V, Internal REF = 3.8 V,
SCLK = 20 MHz,
TA = 25°C
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 17
INL – Integral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 5.5 V, Internal REF = 3.8 V,
SCLK = 20 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0
511
Samples
Figure 18
20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1023
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
0.8
0.6
VCC = 5.5 V, External REF = 5.5 V,
SCLK = 20 MHz,
TA = 25°C
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 19
INL – Integral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 5.5 V, External REF = 5.5 V,
SCLK = 20 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 20
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
21
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
DNL – Differential Nonlinearity – LSB
TYPICAL CHARACTERISTICS
DIFFERENTIAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
0.8
0.6
VCC = 5.5 V, External REF = 3.3 V,
SCLK = 20 MHz,
TA = 25°C
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
–1
0
511
1023
Samples
Figure 21
INL – Integral Nonlinearity – LSB
INTEGRAL NONLINEARITY ERROR
vs
DIGITAL OUTPUT CODE
1
VCC = 5.5 V, External REF = 3.3 V,
SCLK = 20 MHz,
TA = 25°C
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0
511
Samples
Figure 22
22
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1023
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY
12
AVDD = DVDD = 3 V,
External REF = 3 V
ENOB – Effective Number of Bits – BITS
ENOB – Effective Number of Bits – BITS
12
10
8
6
4
2
AVDD = DVDD = 5 V,
External REF = 5 V
10
8
6
4
2
0
0
0
50
100
150
200
250
0
300
100
Figure 23
400
500
600
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY
10
10
9
9
ENOB – Effective Number of Bits – BITS
ENOB – Effective Number of Bits – BITS
300
Figure 24
EFFECTIVE NUMBER OF BITS
vs
INPUT FREQUENCY
8
7
6
5
4
3
2
AVDD = DVDD = 3 V,
Internal REF = 2.3 V
1
200
f – Input Frequency – kHz
f – Input Frequency – kHz
0
8
7
6
5
4
3
2
AVDD = DVDD = 5 V,
Internal REF = 3.8 V
1
0
0
50
100
150
200
250
300
0
100
f – Input Frequency – kHz
200
300
400
500
600
f – Input Frequency _ kHz
Figure 25
Figure 26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
23
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
FFT – Fast Fourier Transform – dB
FAST FOURIER TRANSFORM
vs
FREQUENCY
AIN = 200 kHz,
SCLK = 20 MHz,
AVDD = DVDD = 3 V,
Internal REF = 2.3 V
0
–20
–40
–60
–80
–100
–120
0
100
200
300
400
500
600
500
600
Frequency – KHz
Figure 27
FFT – Fast Fourier Transform – dB
FAST FOURIER TRANSFORM
vs
FREQUENCY
AIN = 200 kHz,
SCLK = 20 MHz,
AVDD = DVDD = 5 V,
Internal REF = 3.8 V
0
–20
–40
–60
–80
–100
–120
0
100
200
300
400
Frequency – KHz
Figure 28
24
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
TYPICAL CHARACTERISTICS
FFT – Fast Fourier Transform – dB
FAST FOURIER TRANSFORM
vs
FREQUENCY
AIN = 200 kHz,
SCLK = 20 MHz,
AVDD = DVDD = External REF = 3 V
0
–20
–40
–60
–80
–100
–120
0
100
200
300
400
500
600
Frequency – KHz
Figure 29
FFT – Fast Fourier Transform – dB
FAST FOURIER TRANSFORM
vs
FREQUENCY
AIN = 200 kHz,
SCLK = 20 MHz,
AVDD = DVDD = External REF = 5 V
0
–20
–40
–60
–80
–100
–120
0
100
200
300
400
500
600
Frequency – KHz
Figure 30
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
25
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
0
0
0
0
DO9 DO8 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
0
0
0
0
0
SDOUT
SDIN
FS
CS
SCLK
0
Previous Conversion Output
DI5
DI4
1
2
3
ts
4
5
6
DI15 DI14 DI13 DI12 DI11 DI10
7
DI9
8
DI8
9
DI7
DI6
Configure
12
10
11
t conv
13
DI3
14
DI2
15
DI1
16
DI0
1
2
3
4
5
DI15 DI14 DI13 DI12 DI11
0
TYPICAL CHARACTERISTICS
Figure 31. Typical Timing Diagram for DSP Application
26
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLV1570
2.7 V TO 5.5 V 8-CHANNEL 10-BIT 1.25-MSPS
SERIAL ANALOG-TO-DIGITAL CONVERTER
SLAS169B – DECEMBER 1997– REVISED OCTOBER 2000
0
0
0
0
0
DO0
DO1
D02
D03
D04
DO5
DO6
DO7
DO8
DO9
0
0
0
0
0
0
SDOUT
Previous Conversion Output
DI4
SDIN
FS
CS
SCLK
1
2
3
ts
4
5
6
DI15 DI14 DI13 DI12 DI11 DI10
7
DI9
8
DI8
DI7
Configure
DI6
DI5
12
11
9
10
t conv
13
DI3
14
DI2
15
DI1
16
DI1
1
DI15
2
DI14
3
DI13
4
DI12
5
DI11
TYPICAL CHARACTERISTICS
Figure 32. Typical Timing Diagram for µC Application
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
27
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TLV1570CDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLV1570C
TLV1570CDWR
ACTIVE
SOIC
DW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TLV1570C
TLV1570CPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TV1570
TLV1570CPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TV1570
TLV1570CPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TV1570
TLV1570CPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
TV1570
TLV1570IDW
ACTIVE
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TLV1570I
TLV1570IPW
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TY1570
TLV1570IPWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TY1570
TLV1570IPWR
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TY1570
TLV1570IPWRG4
ACTIVE
TSSOP
PW
20
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TY1570
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Jun-2014
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLV1570CDWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.3
2.7
12.0
24.0
Q1
TLV1570CPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
TLV1570IPWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Feb-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLV1570CDWR
SOIC
DW
20
2000
350.0
350.0
43.0
TLV1570CPWR
TSSOP
PW
20
2000
350.0
350.0
43.0
TLV1570IPWR
TSSOP
PW
20
2000
350.0
350.0
43.0
Pack Materials-Page 2
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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