Texas Instruments | ADCxxDJxx00 Evaluation Module (Rev. A) | User Guides | Texas Instruments ADCxxDJxx00 Evaluation Module (Rev. A) User guides

Texas Instruments ADCxxDJxx00 Evaluation Module (Rev. A) User guides
ADCxxDJxx00 Evaluation Module
User's Guide
Literature Number: SLAU701A
May 2017 – Revised January 2018
Contents
1
Introduction ......................................................................................................................... 4
2
Equipment ........................................................................................................................... 6
2.1
2.2
3
Setup Procedure .................................................................................................................. 8
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
4
Evaluation Board Feature Identification Summary ...................................................................... 6
Required Equipment ......................................................................................................... 7
Install the High Speed Data Converter (HSDC) Pro Software ......................................................... 9
Install the Configuration GUI Software .................................................................................... 9
Connect the EVM and TSW14J57EVM ................................................................................... 9
Connect the Power Supplies to the Boards (Power Off) ............................................................... 9
Connect the Signal Generators to the EVM (*RF Outputs Disabled Until Directed) ................................ 9
Turn On the TSW14J57EVM Power and Connect to the PC ........................................................ 10
Turn On the ADCxxDJxx00EVM Power Supplies and Connect to the PC ......................................... 10
Turn On the Signal Generator RF Outputs ............................................................................. 10
Open the ADCxxDJxx00EVM GUI and Program the ADC and Clocks ............................................. 10
Calibrate the ADC Device on the EVM .................................................................................. 12
Open the HSDC Software and Load the FPGA Image to the TSW14J57EVM .................................... 13
Capture Data Using the HSDC Pro Software .......................................................................... 13
Device Configuration .......................................................................................................... 16
4.1
4.2
4.3
Supported JESD204B Device Features ................................................................................. 16
Tab Organization ........................................................................................................... 16
Low-Level Control .......................................................................................................... 17
5
Troubleshooting the ADCxxDJxx00EVM ................................................................................ 18
A
References ........................................................................................................................ 19
A.1
A.2
A.3
B
Technical Reference Documents......................................................................................... 19
TSW14J57EVM Operation ................................................................................................ 19
TSW14J56EVM Operation ................................................................................................ 19
HSDC Pro Settings for Optional ADC Device Configuration ..................................................... 20
B.1
B.2
Changing the Number of Frames per Multi-Frame (K) ................................................................ 20
Customizing the EVM for Optional Clocking Support ................................................................. 20
.................................................................................................................. 23
Revision History .......................................................................................................................... 23
C
Signal Routing
2
Contents
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
www.ti.com
List of Figures
.............................................................................................................
1-1.
EVM Orientation
2-1.
EVM Feature Locations ..................................................................................................... 6
3-1.
EVM Test Setup.............................................................................................................. 8
3-2.
Configuration GUI EVM Tab .............................................................................................. 11
3-3.
Configuration GUI ADC Control .......................................................................................... 12
3-4.
High Speed Data Converter Pro (HSDC) GUI.......................................................................... 14
3-5.
Additional Device Parameters Dialog Box .............................................................................. 15
.........................................................................................
5
4-1.
Low-Level Register Control Tab
B-1.
ADC12DJxx00EVM Clocking System Block Diagram ................................................................. 20
B-2.
External LMKCLK Configuration
B-3.
.........................................................................................
External DevCLK EVM Configuration....................................................................................
17
21
22
List of Tables
4-1.
Supported and Non-Supported Features of the JESD204B Device ................................................. 16
4-2.
Low-Level Controls ......................................................................................................... 17
............................................................................................................
.....................................................................................
5-1.
Troubleshooting
C-1.
ADCxxDJxx00EVM Signal Routing
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
List of Figures
18
23
3
Chapter 1
SLAU701A – May 2017 – Revised January 2018
Introduction
The ADCxxDJxx00EVM is an evaluation board used to evaluate the ADCxxDJxx00 family (ADC08DJ3200,
ADC12DJ2700 and ADC12DJ3200) of analog-to-digital converters (ADC) from Texas Instruments. The
ADCxxDJxx00 devices are dual-channel, 8 or 12-bit ADCs, capable of operating at sampling rates up to
3.2 Giga-samples per second (GSPS) in dual channel mode or 6.4 GSPS in single channel mode. The
ADCxxDJxx00EVM device output data is transmitted over a standard JESD204B high-speed serial
interface. This evaluation board also includes the following important features:
• Transformer-coupled signal input network allowing a single-ended signal source from 500 kHz to
9 GHz
• The LMX2582 clock synthesizer generates the ADC sampling clock
• The LMK04828 and LMX2582 onboard system clock generator generates SYSREF and FPGA
reference clocks for the high-speed serial interface
• Transformer-coupled clock input network to test the ADC performance with an external low-noise clock
source
• LM95233 temperature sensor
• High-speed serial data output over a High Pin Count FMC+ interface connector
NOTE: To improve signal routing quality, serial lane polarity is inverted with respect to the standard
FMC VITA-57 signal mapping. Signal mapping and polarity is shown in Table C-1).
•
Device register programming through USB connector and FTDI USB-to-SPI bus translator
K&L Microwave is a trademark of K&L Microwave.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
Rohde & Schwarz is a registered trademark of Rohde & Schwarz GmbH & Co..
Trilithic is a trademark of Trilithic, Inc..
4
Introduction
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
www.ti.com
Figure 1-1. EVM Orientation
The digital data from the ADCxxDJxx00EVM board is quickly and easily captured with the TSW14J57EVM
or TSW14J56EVM data capture boards.
NOTE: The TSW14J56EVM cannot be used for JMODES that use 16 data lanes, or serial rates
above 12 Gbps.
The TSW14J57EVM captures the high-speed serial data, decodes the data, stores the data in memory,
and then uploads it to a connected PC through a USB interface for analysis. The High-Speed Data
Converter Pro (HSDC Pro) software on the PC communicates with the hardware and processes the data.
With proper hardware selection in the HSDC Pro software, the TSW14J57 device is automatically
configured to support a wide range of operating speeds of the ADC12DJ3200EVM, but the device may not
cover the full operating range of the ADC device. Serial data rates of 12.8 Gbps down to 1 Gbps are
supported.
In the following sections of this document, the ADCxxDJxx00 evaluation board is referred to as the EVM
and the ADCxxDJxx00 device is referred to as the ADC device.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Introduction
5
Chapter 2
SLAU701A – May 2017 – Revised January 2018
Equipment
This section describes how to setup the EVM on the bench with the proper equipment to evaluate the full
performance of the ADC device.
2.1
Evaluation Board Feature Identification Summary
Figure 2-1. EVM Feature Locations
6
Equipment
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Required Equipment
www.ti.com
2.2
Required Equipment
The following equipment and documents are included in the EVM evaluation kit:
• Evaluation board (EVM)
• Mini-USB cable
• Power cable
The following equipment is not included in the EVM evaluation kit, but is required for evaluation of this
product:
• TSW14J57EVM or TSW14J56EVM data capture board and related items
• High-Speed Data Converter Pro software
• PC computer running Microsoft® Windows® XP, 7, or 8
• One low-noise signal generator for analog input. TI recommends the following generators:
– Keysight E8663D
– Rohde & Schwarz® SMA100A
• Bandpass filter for analog input signal (1910 MHz or desired frequency). The following filters are
recommended:
– Bandpass filter, greater than or equal to 60-dB harmonic attenuation, less than or equal to 5%
bandwidth, greater than 18-dBm power, less than 5-dB insertion loss
– Trilithic™ 5VH-series tunable BPF
– K&L Microwave™ BT-series tunable BPF
– TTE KC6 or KC7-series fixed BPF
• Signal-path cables, SMA or BNC (or both SMA and BNC)
By default, the ADCxxDJxx00EVM has an onboard clocking solution. A few small board modifications
enable external clocking. If external clocking is used, the following equipment is recommended.
• Two low-noise signal generators. TI recommends similar models to the analog input source.
• A bandpass filter for the DEVCLK input. TI recommends a filter similar to the analog-input path filter.
NOTE: The clock source used to drive the LMK04828 (labeled LMKCLK) must be equal in frequency
to the ADC sampling clock (labeled DEVCLK). The clock generators must be frequencylocked using a common 10-MHz reference.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Equipment
7
Chapter 3
SLAU701A – May 2017 – Revised January 2018
Setup Procedure
Figure 3-1. EVM Test Setup
NOTE: The HSDC Pro software must be installed before connecting the TSW14J57EVM to the PC
for the first time.
8
Setup Procedure
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Install the High Speed Data Converter (HSDC) Pro Software
www.ti.com
3.1
Install the High Speed Data Converter (HSDC) Pro Software
Download the most recent version of the HSDC Pro software from www.ti.com/tool/dataconverterpro-sw.
Follow the installation instructions to install the software.
3.2
Install the Configuration GUI Software
1. Download the Configuration GUI software from the EVM tool folder at ADC12DJxx00 GUI .
2. Extract files from the .zip file.
3. Run the executable file (setup.exe), and follow the instructions.
3.3
Connect the EVM and TSW14J57EVM
With the power off, connect the ADCxxDJxx00EVM to the TSW14J57EVM through the FMC connector as
shown in Figure 3-1. Ensure that the standoffs provide the proper height for robust connector connections.
3.4
Connect the Power Supplies to the Boards (Power Off)
1. Confirm that the power switch on the TSW14J57EVM is in the off position. Connect the power cable to
a 12-V DC (minimum 2 A) power supply. Ensure the proper supply polarity by confirming that the outer
surface of the barrel connector is GND and the inner portion of the connector is 12 V. Connect the
power cable to the EVM power connector.
2. Confirm that the power switch on the ADCxxDJxx00EVM is in the off position. Connect the power
cable to a 5-V DC (minimum 3 A) power supply. Ensure the proper supply polarity by confirming that
the outer surface of the barrel connector is GND and the inner portion of the connector is 5 V. Connect
the power cable to the EVM power connector.
CAUTION
Ensure the power connections to the EVMs are the correct polarity.
Failure to do so may result in immediate damage
Ensure the 12-V power supply is connected to the TSW14J57EVM and not
the ADCxxDJxx00EVM. Providing the ADCxxDJxx00EVM with 12 V may
result in immediate damage
Leave the power switches in the off position until directed later.
3.5
Connect the Signal Generators to the EVM (*RF Outputs Disabled Until Directed)
1. Connect a signal generator to the VIN input of the ADCxxDJxx00EVM through a bandpass filter and
attenuator at the SMA connector. This must be a low-noise signal generator. TI recommends a
Trilithic-tunable bandpass filter to filter the signal from the generator. Configure the signal generator for
1910 MHz, 0 dBm.
If External Clocking is Used (Optional)
a. Connect a signal generator to the DEVCLK input of the EVM through a bandpass filter. This signal
generator must be a low-noise signal generator. TI recommends a Trilithic-tunable bandpass filter
to filter the signal coming from the generator. Configure the signal generator for the desired clock
frequency in the range of 0.8 to 3.2 GHz. For best performance when using an RF signal
generator, the power input to the CLK SMA connector must be 9 dBm (2.2 Vpp into 50 Ω). The
signal generator must increase above 9 dB by an amount equal to any additional attenuation in the
clock signal path, such as the insertion loss of the bandpass filter. For example, if the filter
insertion loss is 2 dB, the signal generator must be set to 9 dBm + 2 dB = 11 dBm.
b. Connect a signal generator to the LMKCLK input of the EVM through a bandpass filter. Configure
the signal generator for the desired clock frequency in the range of 0.8 to 3.2 GHz. Set the output
power to approximately 6–9 dBm.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Setup Procedure
9
Turn On the TSW14J57EVM Power and Connect to the PC
www.ti.com
NOTE: 1. The LMKCLK frequency must be equal to the frequency of the DEVCLK.
2. Ensure that the DEVCLK and LMKCLK sources are frequency-locked using a common
10-MHz reference to ensure functionality. Frequency locking the input signal generator to
the other generators can also be done if coherent sampling is desired.
3. Do not turn on the RF output of any signal generator at this time.
4. When using the ADC in single-input mode, the device uses both edges of DEVCLK for
sampling.
3.6
Turn On the TSW14J57EVM Power and Connect to the PC
1. Turn on the power switch of the TSW14J57EVM.
2. Connect a mini-USB cable from the PC to the TSW14J57EVM.
3. If this is the first time connecting the TSW14J57EVM to the PC, follow the on-screen instructions to
automatically install the device drivers. See the TSW14J57EVM user's guide (SLWU092) for specific
instructions.
3.7
Turn On the ADCxxDJxx00EVM Power Supplies and Connect to the PC
1. Turn on the 5-V power supply to power up the EVM.
2. Connect the EVM to the PC with the mini-USB cable.
3.8
Turn On the Signal Generator RF Outputs
Turn on the RF signal output of the signal generator connected to VIN. If external clocking is used, turn on
the RF signal outputs connected to DEVCLK and LMKCLK.
3.9
Open the ADCxxDJxx00EVM GUI and Program the ADC and Clocks
The Device Configuration GUI is installed separately from the HSDC Pro installation and is a stand-alone
GUI.
10
Setup Procedure
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Open the ADCxxDJxx00EVM GUI and Program the ADC and Clocks
www.ti.com
Figure 3-2. Configuration GUI EVM Tab
Figure 3-2 and Figure 3-3 show the GUI open to the EVM tab and Control tab respectively. Tabs at the
top of the panel organize the configuration into device and EVM features with user-friendly controls and a
low-level tab for directly configuring the registers. The EVM has three configurable devices, namely the
ADCxxDJxx00, LMK04828, and LMX2582. The register map for each device is provided in the device data
sheet (SLVSD97, SNAS605, and SNAS680, respectively).
1. Open the ADC12DJxx00EVM GUI.
2. Select the onboard clock as the clock source.
3. Select Fs = 2700 MHz MSPS as the onboard Fs selection.
4. If using the ADC12DJ2700EVM or ADC12DJ3200EVM, select JMODE0 for the decimation and serial
data mode. If using the ADC08DJ3200EVM, select JMODE5 for the decimation and serial data mode.
5. Click Program Clocks and ADC (Note: This action will overwrite any previous device register settings.)
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Setup Procedure
11
Calibrate the ADC Device on the EVM
www.ti.com
3.10 Calibrate the ADC Device on the EVM
Figure 3-3. Configuration GUI ADC Control
1. With the EVM GUI open on the PC, navigate to the Control tab.
2. To calibrate the ADC, click Call Triggered/Running once, then click it again. This will stop and re-start
the Calibration engine.
NOTE: This calibrate button executes a calibration sequence that is required for full performance.
This calibration is performed automatically during the Section 3.9 step but must be
performed again, any time the sampling rate changes, after significant temperature change
of the ADC, or after exiting the power-down mode. See the ADCxxDJxx00 device data sheet,
(SLVSD97) , for details regarding the necessary calibration sequence.
3. To enable background calibration, use the following steps:
• Navigate to the JESD204B tab and click on JESD Block Enable to stop the JESD204B block.
• Navigate back to the Control tab and click on Enable Calibration Block to disable calibration and
allow setting changes.
• Click on Enable Background Cal.
• If background offset calibration is desired also, click on Enable Background Offset Cal.
• Click on Enable Calibration Block to re-enable the calibration subsystem
• Navigate to the JESD204B tab and click on JESD Block Enable to re-start the JESD204B block.
• Navigate back to the Control tab and click the Cal Triggered/Running button once, then click it
again. This restarts the Calibration engine.
12
Setup Procedure
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Open the HSDC Software and Load the FPGA Image to the TSW14J57EVM
www.ti.com
4. To disable background calibration, use the following steps:
• Navigate to the JESD204B tab and click on JESD Block Enable to stop the JESD204B block.
• Navigate back to the Control tab and click on Enable Calibration Block to disable calibration and
allow setting changes.
• If background offset calibration was enabled, click on Enable Background Offset Cal to disable the
feature.
• Click on Enable Background Cal to disable the feature.
• Click on Enable Calibration Block to re-enable the calibration subsystem.
• Navigate to the JESD204B tab and click on JESD Block Enable to re-start the JESD204B block.
• Navigate back to the Control tab and click the Cal Triggered/Running button once, then click it
again. This restarts the Calibration engine.
3.11 Open the HSDC Software and Load the FPGA Image to the TSW14J57EVM
1. Open the HSDC Pro software.
2. Click OK to confirm the serial number of the TSW14J57EVM device. If multiple TSWxxxxx boards are
connected, select the model and serial number for the one connected to the ADCxxDJxx00EVM.
3. If using the ADC12DJ2700EVM or the ADC12DJ3200EVM, select the ADC12DJxx00_JMODE0 device
from the ADC select drop-down in the top left corner. If using the ADC08DJ3200EVM, select
ADC12DJxx_JMODE5.
4. When prompted, click Yes to update the firmware.
NOTE: If the user configures the EVM with options other than the default register values, different
instructions may be required for selecting the device in HSDC Pro. See Appendix B for more
details.
5. Enter the ADC Output Data Rate (ƒ(SAMPLE)) as "5400M" or the desired output sample rate. This number
must be equal to the actual sampling rate of the device and must be updated if the sampling rate
changes.
3.12 Capture Data Using the HSDC Pro Software
The following steps show how to capture data using the HSDC Pro software (see Figure 3-4):
1. Select the test to perform.
2. Select the data view.
3. Select the channel to view.
4. Click the capture button to capture new data.
Additional tips:
• Use the Notch Frequency Bins from the Test Options file menu to remove bins around DC (eliminate
DC noise and offset) or the fundamental (eliminate phase noise from signal generators).
• Open the Capture Option dialog from the Data Capture Options file menu to change the capture depth
or to enable Continuous Capture or FFT averaging.
• For analyzing only a portion of the spectrum, use the Single Tone test with the Bandwidth Integration
Markers from the Test Options file menu. The Channel Power test is also useful.
• For analyzing only a subset of the captured data, set the Analysis Window (samples) setting to a value
less than the number of total samples captured and move the green or red markers in the small
transient data window at the top of the screen to select the data subset of interest.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Setup Procedure
13
Capture Data Using the HSDC Pro Software
www.ti.com
Capture Data
Select Device
Choose Data
Window
Select
Channel
Set FFT
Windowing
Choose Test
Check for Coherent Freq. Auto-Calculate
Select Size of Analysis Window
Enter Device Output Sample Rate
Click for Decimation and NCO Settings
Enter Target Input Frequency
Figure 3-4. High Speed Data Converter Pro (HSDC) GUI
When using decimation and NCO features, click the gear symbol to access the Additional Device
Parameters dialog box to enter the following details:
1. ADC Sampling Rate
2. ADC Input Signal Frequency
3. NCO Frequency
4. Decimation Factor
The HSDC Pro GUI will calculate the ADC Output Data Rate based on these inputs. The Fundamental
and Harmonic frequency locations will also be calculated and identified in the FFT display.
14
Setup Procedure
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Capture Data Using the HSDC Pro Software
www.ti.com
Enable Decimation/NCO
Frequency Calculations
Remember Parameters
for this Session
ADC Sample Rate
Before Decimation
ADC Input Frequency
NCO Frequency
Decimation Factor
Figure 3-5. Additional Device Parameters Dialog Box
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Setup Procedure
15
Chapter 4
SLAU701A – May 2017 – Revised January 2018
Device Configuration
The ADC device is programmable through the serial programming interface (SPI) bus accessible through
the FTDI USB-to-SPI converter located on the EVM. A GUI is provided to write instructions on the bus and
program the registers of the ADC device.
For more information about the registers in the ADC device, see the ADCxxDJxx00 device data sheet
(SLVSD97).
4.1
Supported JESD204B Device Features
The ADC device supports some configuration of the JESD204B interface. Due to limitations in the
TSW14J57EVM firmware, all JESD204B link features of the ADC device are not supported. Table 4-1 lists
the supported and non-supported features.
Table 4-1. Supported and Non-Supported Features of the JESD204B Device
JESD204B Feature
Supported by ADC Device
Supported by TSW14J57EVM
Supported by TSW14J56EVM
L = 1, 2, 4, 8 (1)
L = 1, 2, 4, 8 supported
L = 1, 2, 4, 8 supported
Total number of lanes
active
1, 2, 4, 8, 16
1, 2, 4, 8, 16
1, 2, 4, 8
Number of frames per
multiframe (K)
Kmin = 3–18, (1)
Kmax = 32, Kstep = 1 or 2
Most values of K supported,
constrained by requirement that
K × F = 4n
Most values of K supported,
constrained by requirement that
K × F = 4n
Number of lanes per link
(L)
Scrambling
Supported
Supported
Supported
Test patterns
PBRS7, PBRS11, PBRS15, Ramp,
D21.5, K28.5, Repeat ILA, Modified
RPAT, Long/Short Transport, Serial
Out 0, Serial Out 1, Bypass Lane ID,
ADC Test Pattern (1)
ILA, Ramp, Long/Short Transport
ILA, Ramp, Long/Short Transport
Speed
Lane rates from 0.8 to 12.8 Gbps (1)
Lane rates from 2 to 15 Gbps
ƒ(SAMPLE) parameter must be properly
set in HSDC Pro GUI.
Lane rates from 0.6 to 12.5 Gbps
ƒ(SAMPLE) parameter must be properly
set in HSDC Pro GUI.
(1)
4.2
Dependent on bypass or decimation mode and output rate selection. Always disable the JESD204 block before changing any of
the JESD204B settings. Once the settings are changed, re-enable the JESD204 block.
Tab Organization
Control of the ADC device features are available in the EVM, Control, JESD204B, NCO Configuration
tabs.
16
Device Configuration
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Low-Level Control
www.ti.com
4.3
Low-Level Control
The Low Level View tab, illustrated in Figure 4-1, allows configuration of the devices at the bit-field level.
At any time, the controls in Table 4-2 can be used to configure or read from the device.
Table 4-2. Low-Level Controls
Control
Description
Register map summary
Displays the devices on the EVM, registers for those devices, and the states of the registers
• Clicking on a register field allows individual bit manipulation in the register data cluster
• The value column shows the value of the register at the time the GUI was last updated
• The LR column shows the value of the register at the time the register was last read
Write register button
Write to the register highlighted in the register map summary with the value in the Write Data field
Write all button
Update all registers shown in the register map summary with the values shown in the Register Map
summary
Read register button
Read from the register highlighted in the Register Map summary and display the results in the
Read Data field
Can be used to re-synchronize the GUI with the state of the hardware
Read-all button
Read from all registers in the Register Map summary and display the current state of the hardware
Load Configuration button
Load a configuration file from disk and register address/data values in the file
Save Configuration button
Save a configuration file to disk that contains the current state of the configuration registers
Register Data cluster
Manipulate individual accessible bits of the register highlighted in the register map summary
Individual register cluster with
read or write register buttons
Perform a generic read or write command to the device shown in the Block drop-down box using
the address and write data information
Figure 4-1. Low-Level Register Control Tab
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Device Configuration
17
Chapter 5
SLAU701A – May 2017 – Revised January 2018
Troubleshooting the ADCxxDJxx00EVM
Table 5-1 lists some troubleshooting procedures.
Table 5-1. Troubleshooting
Issue
18
Troubleshoot
General problems
• Verify the test setup shown in Figure 3-1, and repeat the setup procedure as described in this
document.
• Check power supply to EVM and TSW14J57EVM. Verify that the power switch is in the on
position.
• Check signal and clock connections to EVM.
• Visually check the top and bottom sides of the board to verify that nothing looks discolored or
damaged.
• Ensure the board-to-board FMC+ connection is secure.
• Try pressing the CPU_RESET button on the TSW14J57EVM. Also try clicking Instrument
Options → Reset Board after changing the ADC configuration.
• Try power-cycling the external power supply to the EVM, and reprogram the LMK and ADC
devices.
TSW14J57 LEDs are not
correct
•
•
•
•
•
•
Configuration GUI is not
working properly
• Verify that the USB cable is plugged into the EVM and the PC.
• Check the computer device manager and verify that a USB serial device is recognized when
the EVM is connected to the PC.
• Verify that the green USB Status LED light in the top right corner of the GUI is lit. If it is not lit,
click the Reconnect FTDI button.
• Try restarting the configuration GUI.
Configuration GUI is not
able to connect to the EVM
• Use the free FT_PROG software from FTDI chip and verify that the onboard FTDI chip is
programmed with the product description ADCxxDJxx00_A0 .
HSDC Pro software is not
capturing good data or
analysis results are
incorrect.
• Verify that the TSW14J57EVM is properly connected to the PC with a mini-USB cable and that
the board serial number is properly identified by the HSDC software.
• Check that the proper ADC device mode is selected. The mode should match in HSDC Pro and
the ADC GUI.
• Check that the analysis parameters are properly configured.
HSDC Pro software gives a
time-out error when
capturing data
• Try to reprogram the LMK device and reset the JESD204 link.
• Verify that the ADC sampling rate is correctly set in the HSDC software.
• Try pressing the CPU_RESET button on the TSW14J57EVM. Also try clicking Instrument
Options → Reset Board after changing the ADC configuration. Try to recapture again.
• Select Instrument Options → Download Firmware and download
'TSW14J57REVD_FIRMWARE_10AX048.rbf'. Try to capture again.
Sub-optimal measured
performance
• Try clicking Cal Triggered/Running button 2× to re-calibrate the ADC in the current operating
conditions. It is located on the Control tab of the configuration GUI.
• Check that the spectral analysis parameters are properly configured.
• Verify that bandpass filters are used in the clock and input signal paths and that low-noise
signal sources are used.
Verify the settings of the configuration switches on the TSW14J57EVM.
Verify that the clock going to the CLK input is connected and the appropriate LEDs are blinking.
Verify that the ADC device internal registers are configured properly.
If LEDs are not blinking, reprogram the ADC EVM devices.
Try pressing the CPU_RESET button on the TSW14J57EVM.
Try capturing data in HSDC Pro to force an LED status update
Troubleshooting the ADCxxDJxx00EVM
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Appendix A
SLAU701A – May 2017 – Revised January 2018
References
This section provides references to technical documents and user's guides.
A.1
Technical Reference Documents
•
•
•
•
•
•
•
A.2
ADCxxDJxx00 device data sheet (SLVSD97)
TSW14J57EVM user’s guide (SLWU092)
TSW14J56EVM user’s guide (SLWU086)
User's guide for the High Speed Data Converter Pro Software, also available in the help menu of the
software (SLWU087)
LMK04828 data sheet (SNAS605)
LMX2582 data sheet (SNAS680)
FTDI USB to Serial Driver Installation Manual
(www.ftdichip.com/Support/Documents/InstallGuides.htm)
TSW14J57EVM Operation
Refer to the TSW14J57EVM user guide (SLWU092) for configuration and status information.
A.3
TSW14J56EVM Operation
Refer to the TSW14J56EVM user guide (SLWU086) for configuration and status information.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
References
19
Appendix B
SLAU701A – May 2017 – Revised January 2018
HSDC Pro Settings for Optional ADC Device Configuration
This appendix provides settings for optional ADC device configuration in HSDC Pro.
B.1
Changing the Number of Frames per Multi-Frame (K)
Changing the number of frames per multi-frame output by the JESD204 transmitter (ADC device) is
configured using the K parameter on the JESD204B tab in the Configuration GUI. This parameter must be
matched by the receiving device, and the SYSREF frequency must also be programmed to a compatible
frequency. Ensure that the K value complies with the K Min and Step values for the selected JMODE.
Refer to the ADCxxDJxx00 operating modes table in the ADCxxDJxx00 data sheet, (SLVSD97).
B.2
Customizing the EVM for Optional Clocking Support
Figure B-1 illustrates the ADCxxDJxx00EVM clocking system block diagram.
10-MHz Reference
To Enable Coherent Sampling
Signal
Generator
EVM
Opt
Sig Gen 1
Balun
Balun
10MHz
10-MHz
Reference
Reference
LMX2582
LMX_CLKB
DNI
DEVCLK
Opt
Sig Gen 2
ADC12DJxx00
Balun
10MHz
10-MHz
Reference
Reference
OSC out
SYSREF
LMK_CLK
FPGA_JESD_SYSREF
FPGA_JESD_CLK_A
LMK04828
FPGA_JESD_CLK_B
xo
CpOut1
CLKIN0
Figure B-1. ADC12DJxx00EVM Clocking System Block Diagram
20
HSDC Pro Settings for Optional ADC Device Configuration
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Customizing the EVM for Optional Clocking Support
www.ti.com
The LMK04828 provides a buffered copy of the onboard crystal oscillator (OSCout) to the LMX2582. By
default, the LMX2582 is configured to generate the ADC device clock using this 100-MHz reference and
the LMK04828 is used in clock distribution mode and provides the SYSREF and device clocks for the
FPGA. The EVM can be configured to use external clocks with the following steps (see Figure B-2):
1. Modify the hardware:
a. Remove C50 and C51, populate C49 and C52.
b. Remove R67, populate R70.
2. Connect the Signal Generators:
a. Connect the 10-MHz reference from Sig Gen 1 to Sig Gen 2.
b. Configure Sig Gen 2 to use the 10-MHz reference input from Sig Gen 1.
c. Sig Gen 1 connects to DEVCLK (J18). Set to the generator frequency to the desired FDEVCLK. Set
output level to +9 dBm.
d. Sig Gen 2 connects to LMKCLK (J22) with output level +6 dBm to +9 dBm. Set the generator
frequency as follows:
FLMKCLK = FDEVCLK
3. Program the GUI:
a. In the EVM tab, set the Clock Source to External.
b. Enter the Sampling Frequency (FDEVCLK) in step 2(b).
Figure B-2. External LMKCLK Configuration
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
HSDC Pro Settings for Optional ADC Device Configuration
Copyright © 2017–2018, Texas Instruments Incorporated
21
Customizing the EVM for Optional Clocking Support
www.ti.com
Figure B-3. External DevCLK EVM Configuration
The ADC12DJxx00EVM includes a reference clock input (CLKIN0) which allows the user to sync the
LMK04828 to an external 10-MHz reference allowing for coherent sampling
The LMX2582 and LMK04828 may be reconfigured to exercise more features, but this EVM is not
intended to be a full evaluation platform for these devices. For a full evaluation platform, see the
LMK04828 tool folder and LMX2582 tool folder.
22
HSDC Pro Settings for Optional ADC Device Configuration
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
Appendix C
SLAU701A – May 2017 – Revised January 2018
Signal Routing
Table C-1 provides the signal routing details for the ADCxxDJxx00EVM.
Table C-1. ADCxxDJxx00EVM Signal Routing
(1)
JESD204B Output
Link
LID
FMC(+) Pins
FMC(+) Signal Names (1)
DA0
A
0
A10,A11
DP3_M2C
DA1
A
1
C6,C7
DP0_M2C
DA2
A
2
A6,A7
DP2_M2C
DA3
A
3
A2,A3
DP1_M2C
DB0
B
0
B12,B13
DP7_M2C_INV
DB1
B
1
A14,A15
DP4_M2C_INV
DB2
B
2
B16,B17
DP6_M2C_INV
DB3
B
3
A18,A19
DP5_M2C_INV
DA4
A
4
Y14,Y15
DP12_M2C
DA5
A
5
Y10,Y11
DP10_M2C
DA6
A
6
B8,B9
DP8_M2C
DA7
A
7
B4,B5
DP9_M2C
DB4
B
4
Z12,Z13
DP11_M2C_INV
DB5
B
5
Z16,Z17
DP13_M2C_INV
DB6
B
6
Y18,Y19
DP14_M2C_INV
DB7
B
7
Y22,Y23
DP15_M2C_INV
Red items with _INV in the signal name are inverted with respect to standard FMC polarity.
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (May 2017) to A Revision ........................................................................................................... Page
•
Broadened scope of user guide from ADC12DJ3200 to include the ADC08DJ3200 and ADC12DJ2700 devices.
SLAU701A – May 2017 – Revised January 2018
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
.........
Signal Routing
4
23
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
testing other than that specifically described in the published documentation for a particular TI Resource.
You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY
RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2018, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising