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Texas Instruments ADS8900BEVM-PDK (Rev. A) User guides
User's Guide
SBAU269A – October 2016 – Revised July 2017
ADS8900BEVM-PDK
This user's guide describes the characteristics, operation, and use of the ADS8900B evaluation module
(EVM) performance demonstration kit (PDK). This kit is an evaluation platform for the ADS8900B, which is
a 20-bit, 1-MSPS, fully-differential input, successive approximation register (SAR) analog-to-digital
converter (ADC) that featuresan enhanced serial multiSPI™ digital interfacean enhanced serial multiSPI™
digital interface. The EVM-PDK eases the evaluation of the ADS8900B device with hardware, software,
and computer connectivity through the universal serial bus (USB) interface. This user's guide includes
complete circuit descriptions, schematic diagrams, and a bill of materials.
The following related documents are available through the Texas Instruments web site at www.ti.com.
Related Documentation
Device
Literature Number
ADS8900B
SBAS728
OPA625
SBOS688
OPA376
SBOS406
OPA378
SBOS417
REF5050
SBOS410
TPS7A4700
SBVS204
multiSPI is a trademark of Texas Instruments.
Microsoft, Windows are registered trademarks of Microsoft Corporation.
LabVIEW is a trademark of National Instruments.
All other trademarks are the property of their respective owners.
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1
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6
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8
Contents
Overview ...................................................................................................................... 4
1.1
ADS8900BEVM-PDK Features ................................................................................... 4
1.2
ADS8900BEVM Features .......................................................................................... 4
Analog Interface.............................................................................................................. 5
2.1
Connectors for Differential Signal Source ....................................................................... 5
2.2
ADC Differential Input Signal Driver .............................................................................. 5
2.3
Onboard ADC Reference .......................................................................................... 8
Digital Interfaces ............................................................................................................. 8
3.1
multiSPI™ for ADC Digital IO ..................................................................................... 8
Power Supplies .............................................................................................................. 9
ADS8900BEVM-PDK Initial Setup ....................................................................................... 10
5.1
Default Jumper Settings .......................................................................................... 10
5.2
EVM Graphical User Interface (GUI) Software Installation .................................................. 11
ADS8900BEVM-PDK Operation ......................................................................................... 15
6.1
EVM GUI Global Settings for ADC Control .................................................................... 17
6.2
Register Map Configuration Tool ................................................................................ 19
6.3
Time Domain Display Tool ....................................................................................... 20
6.4
Spectral Analysis Tool ............................................................................................ 21
6.5
Histogram Tool .................................................................................................... 23
6.6
Linearity Analysis Tool ............................................................................................ 24
6.7
Reference Settling Analysis ...................................................................................... 25
Using the ADS8900BEVM With the Precision Signal Injector (PSIEVM) ........................................... 27
7.1
Precision Signal Injector Overview .............................................................................. 27
7.2
PSIEVM Graphical User Interface (GUI) ....................................................................... 27
7.3
Jumper Settings ................................................................................................... 28
7.4
Connecting the ADS8900BEVM to the PSIEVM .............................................................. 30
Bill of Materials, PCB Layout, and Schematics......................................................................... 33
8.1
Bill of Materials .................................................................................................... 33
8.2
PCB Layout ........................................................................................................ 36
8.3
Schematics ......................................................................................................... 40
List of Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
2
.................................................................................. 6
Common-Mode Selection Jumpers........................................................................................ 7
ADS8900BEVM-PDK Jumper Locations ................................................................................ 10
ADS8900B Software Installation Prompts .............................................................................. 11
Device Driver Installation Wizard Prompts .............................................................................. 12
LabVIEW Run-Time Engine Installation ................................................................................. 13
ADS8900BEVM-PDK Folder Post-Installation ......................................................................... 14
EVM-PDK Hardware Setup and LED Indicators ....................................................................... 15
Launch the EVM GUI Software........................................................................................... 16
EVM GUI Global Input Parameters ...................................................................................... 17
Register Map Configuration ............................................................................................... 19
Time Domain Display Tool Options ...................................................................................... 20
Spectral Analysis Tool ..................................................................................................... 22
Histogram Analysis Tool .................................................................................................. 23
Linearity Analysis Tool..................................................................................................... 25
Reference Settling Tool ................................................................................................... 26
PSIEVM...................................................................................................................... 27
PSIEVM GUI with Labels.................................................................................................. 28
Jumper Settings Illustration ............................................................................................... 29
OPA625 Differential Input Driving Path
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ADS8900BEVM Connected to PSIEVM................................................................................. 30
21
PSIEVM GUI ................................................................................................................ 31
22
ADS8900BEVM GUI ....................................................................................................... 32
23
ADS8900BEVM PCB Layer 1: Top Layer
24
25
26
27
28
29
..............................................................................
ADS8900BEVM PCB Layer 2: GND Plane .............................................................................
ADS8900BEVM PCB Layer 3: Power Planes ..........................................................................
ADS8900BEVM PCB Layer 4: Bottom Layer ...........................................................................
Schematic Diagram (Page 1) of the ADS8900BEVM PCB ...........................................................
Schematic Diagram (Page 2) of the ADS8900BEVM PCB ...........................................................
Schematic Diagram (Page 3) of the ADS8900BEVM PCB ...........................................................
36
37
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43
List of Tables
1
J7 and J3 SMA Connectors Description .................................................................................. 5
2
J4 and J6 Headers Description ............................................................................................ 5
3
J1 and J2 Configuration per Input Common-Mode ...................................................................... 7
4
Default Jumper Configurations ........................................................................................... 10
5
External Source Requirements for Evaluation of the ADS8900B .................................................... 21
6
External Source Requirements for ADS8900B Evaluation ........................................................... 24
7
Jumper Settings ............................................................................................................ 28
8
PSIEVM Parameters ....................................................................................................... 30
9
Expected Results ........................................................................................................... 32
10
ADS8900BEVM Bill of Materials
.........................................................................................
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3
Overview
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Overview
The ADS8900BEVM-PDK is a platform for evaluating the performance of the ADS8900B SAR ADC, which
is a fully-differential input, 20-bit, 1-MSPS device. The evaluation kit includes the ADS8900BEVM board
and the Precision Host Interface (PHI) controller board that enables the accompanying computer software
to communicate with the ADC over USB for data capture and analysis.
The ADS8900BEVM board includes the ADS8900B SAR ADC, all the peripheral analog circuits, and
components required to extract optimum performance from the ADC.
The PHI board primarily serves three functions:
• Provides a communication interface from the EVM to the computer through a USB port
• Provides the digital input and output signals necessary to communicate with the ADS8900B
• Supplies power to all active circuitry on the ADS8900BEVM board
Along with the ADS8900BEVM and PHI controller board, this evaluation kit includes an A-to-micro-B USB
cable to connect to a computer.
1.1
ADS8900BEVM-PDK Features
The ADS8900BEVM-PDK includes the following features:
• Hardware and software required for diagnostic testing as well as accurate performance evaluation of
the ADS8900B ADC
• USB powered—no external power supply is required
• The PHI controller that provides a convenient communication interface to the ADS8900B ADC over
USB 2.0 (or higher) for power delivery as well as digital input and output
• Easy-to-use evaluation software for Microsoft® Windows® 7, Windows 8, 64-bit operating systems
• The software suite includes graphical tools for data capture, histogram analysis, spectral analysis,
linearity analysis, and reference settling analysis. This suite also has a provision for exporting data to a
text file for post-processing.
1.2
ADS8900BEVM Features
The ADS8900BEVM includes the following features:
• Onboard low-noise and low distortion ADC input drivers optimized to meet ADC performance
• Onboard precision 5.0-V voltage reference with a low-pass filter
• Jumper-selectable 0-V and 2.5-V input common-mode options allow unipolar and bipolar inputs
• Onboard ultralow noise low-dropout (LDO) regulator for excellent 5.2-V single-supply regulation of all
operation amplifiers and voltage reference
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2
Analog Interface
As an analog interface, the evaluation board uses operational amplifiers in a variety of configurations to
drive the ADS8900B input signal and reference inputs. This section covers driver details including jumper
configuration for different input signal common modes and board connectors for a differential signal
source.
2.1
Connectors for Differential Signal Source
The ADS8900BEVM is designed for easy interfacing to an external analog differential source via a
subminiature version A (SMA) connector or 100-mil headers. J7 and J3 are SMA connectors that allow
analog source connectivity through coaxial cables. Also, 100-mil jumper cables or mini-grabbers can be
used to connect analog sources to the J4:2 and J6:2 pins.
NOTE: The input does not support single-ended signals. The external source must be differential or
balanced keeping the negative and positive inputs to the board symmetric such that Vs(+) =
–Vs(–) at any given time.
Table 1. J7 and J3 SMA Connectors Description
Pin Number
Signal
Description
J3
Vs(–)
Negative differential board input,
1-kΩ input impedance
J7
Vs(+)
Positive differential board input,
1-kΩ input impedance
Table 2. J4 and J6 Headers Description
2.2
Pin Number
Signal
Description
J4:3
TEST 0.23 V
Do not use: diagnostic use only
J4:2
Vs(–)
Negative differential board input,
1-kΩ input impedance
J4:1
AGND
Analog ground
J6:3
AGND
Analog ground
J6:2
Vs(+)
Positive differential board input,
1-kΩ input impedance
J6:1
TEST 4.77 V
Do not use: diagnostic use only
ADC Differential Input Signal Driver
The differential signal inputs of the ADS8900B are not dynamically high impedance. SAR ADC inputs
terminate in switched-capacitor networks that create large instantaneous current loads when the switches
are closed that effectively make the ADC inputs dynamically low impedance. Thus, the evaluation board
has low impedance on board drivers that maintain ADC performance with maximum loading at the full
device throughput of 1-MSPS for signal.
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Input Signal Path
Figure 1 shows the signal path for the differential signal applied at the board inputs. The board input
impedance is 1-kΩ with 10-nF differential filtering that keeps noise in external cabling common. The
overall signal path bandwidth is limited to 160-kHz by the anti-aliasing filter formed from a 1-kΩ resistor
and 1-nF capacitor at the amplifier feedback. Finally, the two OPA625 operational amplifiers drive the
ADS8900B differential inputs with 2.2-Ω impedance up to 7-MHz that properly drives the low dynamic
impedance of the ADC inputs at 1-MSPS.
J3
.
.
.
1-nF
1-kŸ
3
RS
J4
1-kŸ
2
±
1
OPA625
VS (-)
2.2-Ÿ
+
Note: External source
must be balanced
VS(+) = -VS(-)
External
Differential
Source
AINP
10-nF
ADC
OPA625_CM
10-nF
10-nF
+
VS (+)
3
OPA625
J6
2
RS
1-kŸ
±
AINN
2.2-Ÿ
1
1-kŸ
.
.
.
1-nF
J7
Figure 1. OPA625 Differential Input Driving Path
2.2.2
Input Common-Mode Jumper Configuration
The ADS8900BEVM board accommodates three external source common-mode options: 0 V, 2.5 V, and
floating with jumpers J1 and J2; see Figure 2 and Table 3.
J2 selects the OPA625 common-mode as 2.5 V (J2:OPEN) or 1.25 V (J2:CLOSED). J1 increases the
OPA625 common-mode by almost 100 mV to avoid amplifier output saturation with full-scale external
source signal amplitude. R1 is installed as 280 kΩ, allowing full-scale external source signals for external
source impedance (RS) between 0 Ω and 32 Ω, with 0-V common mode. R1 must be changed to
compensate for larger external source impedance (RS) values or for 2.5-V external source common-mode,
as explained in Section 2.2.3.
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J1
R1
280kŸ
OPA625_CM
5.0V
OPA376
Gain = 1
20kŸ
10kŸ
20kŸ
J2
Figure 2. Common-Mode Selection Jumpers
Table 3. J1 and J2 Configuration per Input Common-Mode
J1 Setting
(R1 Comp)
J2 Setting
CLOSED
CLOSED
CLOSED
2.2.3
External Signal
Common-Mode
Differential Source Type
CLOSED
0V
Bipolar: If R1 = 280 kΩ, RS range is 0 Ω to 32 Ω
OPEN
2.5 V
Unipolar: must change R1 to match RS
OPEN
Floating
AC-coupled bipolar: If R1 = 280 kΩ, no RS restriction
R1 Setting vs Source Impedance
The external source impedance (RS) adds up to the 1 kΩ of the input resistor, thereby moving the output
common-mode of the OPA625 amplifiers. To compensate for this change in output common-mode, R1
can be modified according to the particular external source impedance value used with the evaluation
board to allow full-scale input range without saturating the OPA625 amplifiers.
The board is shipped with R1 as 280 kΩ that allows an external source impedance (RS) range between
0 Ω to 32 Ω for a 0-V common-mode configuration (J1:closed and J2:closed). For floating or ac-coupled
signals, the input common-mode is set by the OPA625 amplifiers themselves and R1 must remain at
280 kΩ for any given source impedance. The ADC common-mode for 0-V input common-mode setting is
calculated using Equation 1.
5 × (sr•À//tr•À)
s•À
p
ADC_ VCM =
× l1 +
(sr•À//tr•À) + (R 1 //tr•À)
s•À + R S
(1)
In the case of unipolar input signals with a 2.5-V common-mode, the ADC common-mode is calculated
using Equation 2.
5 × tr•À
s•À
2.5 × s•À
ADC_ VCM =
× l1 +
p F l
p
tr•À + (R1 // tr•À)
s•À + R S
s•À + R S
(2)
For Equation 1 and Equation 2 the value of R1 must be calculated to satisfy Equation 3:
2.5 V Q ADC_VCM Q 2.6 V
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Onboard ADC Reference
The EVM does not include a provision for driving the reference input of the ADS8900B from an external
source. The reference input signal path is entirely self-contained on the ADS8900BEVM and consists of
the REF5050, a 5.0-V precision voltage reference. The output of the REF5050 is filtered by a 10-kΩ and
10-µF low-pass filter. The low-pass filtered output functions as an input to the internal reference buffer of
the ADS8900B ADC. This internal reference driver offers zero-offset, low-noise, and is optimized for a 1LSB voltage regulation under maximum loading conditions at full device throughput of 1 MSPS.
3
Digital Interfaces
As noted in Section 1, the EVM interfaces with the PHI that, in turn, communicates with the computer over
USB. There are two devices on the EVM with which the PHI communicates: the ADS8900B ADC (over
SPI or multiSPI) and the EEPROM (over I2C). The EEPROM comes pre-programmed with the information
required to configure and initialize the ADS8900BEVM-PDK platform. Once the hardware is initialized, the
EEPROM is no longer used.
3.1
multiSPI™ for ADC Digital IO
The ADS8900BEVM-PDK supports all the interface modes as detailed in the ADS8900B datasheet (TBD).
In addition to the standard SPI modes, (with single-, dual-, and quad-SDO lanes), the multiSPI modes
support single- and dual-data output rates and the four possible clock source settings as well. The PHI is
capable of operating at a 3.3-V logic level and is directly connected to the digital I/O lines of the ADC.
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4
Power Supplies
The PHI provides multiple power-supply options for the EVM, derived from the USB supply of the
computer.
The EEPROM on the ADS8900BEVM use a 3.3-V power supply generated directly by the PHI. The ADC
and analog input drive circuits are powered by the TPS7A4700 onboard the EVM, which is a low-noise
linear regulator that uses the 5.5-V supply out of a switching regulator on the PHI to generate a much
cleaner 5.2-V output. The 3.3 V supply to the digital section of the ADC is provided directly by an LDO on
the PHI.
The power supply for each active component on the EVM is bypassed with a ceramic capacitor placed
close to that component. Additionally, the EVM layout uses thick traces or large copper fill areas, where
possible, between bypass capacitors and their loads to minimize inductance along the load current path.
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ADS8900BEVM-PDK Initial Setup
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ADS8900BEVM-PDK Initial Setup
This section explains the initial hardware and software setup procedure that must be completed for the
proper operation of the ADS8900BEVM-PDK.
5.1
Default Jumper Settings
Jumper settings are determined by common mode and source impedance of the external source that
provides a differential signal to the board. Remove shunts from J4 and J6 and set J2 and J1 according to
the external source as described in Section 2.
Figure 3. ADS8900BEVM-PDK Jumper Locations
Table 4 explains the functionality of each of these jumpers and their default configurations. No shunts are
required on any location at the EVM for normal operation. Remove any shunts that may be present at
locations J3 through J6.
Table 4. Default Jumper Configurations
10
Reference Designator
Default Configuration
Description
J3
Open
Location to feed external AVDD supply to the ADS8900BEVM-PDK
J4
Open
Unassembled by default
J5
Open
Location for external trigger signal (3.3-V logic)
J6
Open
Alternate location for analog input to the ADS8900BEVM-PDK
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5.2
EVM Graphical User Interface (GUI) Software Installation
Download the latest version of the EVM GUI installer from the Tools and Software folder of the ADS8900B
and run the GUI installer to install the EVM GUI software on the user’s computer.
CAUTION
Manually disable any antivirus software running on the computer before
downloading the EVM GUI installer onto the local hard disk. Otherwise,
depending on the antivirus settings, an error message may appear or the
installer.exe file may be deleted.
Accept the license agreements and follow the on-screen instructions to complete the installation.
Figure 4. ADS8900B Software Installation Prompts
As a part of the ADS8900BEVM GUI installation, a prompt with a Device Driver Installation will appear on
the screen. Click Next to proceed.
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Figure 5. Device Driver Installation Wizard Prompts
NOTE: A notice may appear on the screen stating that Widows cannot verify the publisher of this
driver software. Select Install this driver software anyway.
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The ADS8900BEVM-PDK requires LabVIEW™ Run-Time Engine and may prompt for the installation of
this software, if not already installed.
Figure 6. LabVIEW Run-Time Engine Installation
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After these installations, verify that C:\Program Files (x86)\Texas Instruments\ADS8900BEVM is as shown
in Figure 7.
Figure 7. ADS8900BEVM-PDK Folder Post-Installation
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6
ADS8900BEVM-PDK Operation
The following instructions are a step-by-step guide to connecting the ADS8900BEVM-PDK to the
computer and evaluating the performance of the ADS8900B:
1. Connect the ADS8900BEVM to the PHI. Install the two screws as indicated in Figure 8.
2. Use the provided USB cable to connect the PHI to the computer.
• LED D5 on the PHI lights up, indicating that the PHI is powered up.
• LEDs D1 and D2 on the PHI start blinking to indicate that the PHI is booted up and communicating
with the PC. The resulting LED indicators are shown in Figure 8.
Figure 8. EVM-PDK Hardware Setup and LED Indicators
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3. Launch the ADS8900BEVM GUI software, as shown in Figure 9.
Figure 9. Launch the EVM GUI Software
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6.1
EVM GUI Global Settings for ADC Control
Although the EVM GUI does not allow direct access to the levels and timing configuration of the ADC
digital interface, the EVM GUI does give users high-level control over virtually all functions of the
ADS8900B including interface modes, sampling rate, and number of samples to be captured.
Figure 10 identifies the input parameters of the GUI (as well as their default values) through which the
various functions of the ADS8900B can be exercised. These settings are global because they persist
across the GUI tools listed in the top left pane (or from one page to another).
Figure 10. EVM GUI Global Input Parameters
The host configuration options in this pane allow the user to choose from various SPI and multiSPI host
interface options available on the ADS8900B. The host always communicates with the ADS8900B using
the standard SPI protocol over the single SDI lane, irrespective of the mode selected for data capture.
The drop-down boxes under the Interface Configuration sub-menu allow the user to select the data
capture protocol. The SDO Width drop-down allows selection between Single-, Dual- and Quad-SDO
lanes. The SDO Mode drop-down allows selection between Standard SPI and multiSPI modes.
In SPI mode, the SDI Mode drop-down allows selection between the four SPI protocol combinations for
CPOL and CPHA.
In multiSPI mode, the Clock Source drop-down allows selection between Source and System
Synchronous modes; the Data Rate drop-down allows selection between SDR and DDR modes. Detailed
descriptions of each of these modes is available in the ADS8900B datasheet (TBD). The selected data
capture protocol is summarized in the Protocol Selected indicator box.
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The user can select SCLK Frequency and Sampling Rate on this paneand is dependent of the protocol
selected. The GUI allows the user to enter the targeted values for these two parameters and the GUI
computes the best values that can be achieved, considering the timing constraints of the selected device
protocol.
The user can specify a target SCLK frequency (in Hz) and the GUI tries to match this frequency as closely
as possible by changing the PHI PLL settings and the achievable frequency may differ from the target
value entered. Similarly, the sampling rate of the ADC can be adjusted by modifying the Target Sampling
Rate argument (also in Hz). The achievable ADC sampling rate can differ from the target value, depending
on the applied SCLK frequencyand selected Device Mode and the closest match achievable is displayed.
This pane, therefore, allows the user to try various settings available on the ADS8900B in an iterative
fashion until the user converges to the best settings for the corresponding test scenario.
The final option in this pane is the selection for the Update Mode. The default value is Immediate,
indicating that the interface settings selection made by the user is applied to configure both the host and
the ADS8900B instantly. Manual indicates that the selection made is made only when the user finalizes
their choices and is ready to configure the device.
The Device Reset button functions as a Master RESET to both the ADS8900BEVM and the GUI. When
the button is pressed, the ADC RESETs to the RESET configuration explained in the datasheet (TBD).
The GUI also updates the Interface Configuration settings and the Register Map to reflect the device
RESET state.
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6.2
Register Map Configuration Tool
The register map configuration tool allows the user to view and modify the registers of the ADS8900B.
This tool can be selected by clicking on the Register Map Config radio button at the Pages section of the
left pane, as indicated in Figure 11. On power-up, the values on this page correspond to the Host
Configuration Settings that enable ADC sampling at the maximum sampling rate specified for the ADC.
The register values can be edited by double-clicking the corresponding value field. If interface mode
settings are affected by the change in register values, this change reflects on the left pane immediately.
The effect of changes in the register value reflect on the ADS8900B device on ADS8900BEVM-PDK
based on the Update Mode selection, as described in Section 6.1.
Figure 11. Register Map Configuration
Section 6.3 through Section 6.7 describe the data collection and analysis features of the ADS8900BEVMPDK GUI.
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Time Domain Display Tool
The time domain display tool allows visualization of the ADC response to a given input signal. This tool is
useful for both studying the behavior and debugging any gross problems with the ADC or drive circuits.
The user can trigger a capture of the data of the selected number of samples from the ADS8900B, as per
the current interface mode settings using the Capture button as indicated in Figure 12. The sample
indices are on the x-axis and there are two y-axes showing the corresponding output codes as well as the
equivalent analog voltages based on the specified reference voltage. Switching pages to any of the
Analysis tools described in the subsequent sections, triggers calculations to be performed on the same set
of data.
Figure 12. Time Domain Display Tool Options
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6.4
Spectral Analysis Tool
The spectral analysis tool is intended to evaluate the dynamic performance (SNR, THD, SFDR, SINAD,
and ENOB) of the ADS8900B SAR ADC through single-tone sinusoidal signal FFT analysis using the 7term Blackman-Harris window setting. Alternatively, the window setting of None can be used to search for
noise spurs over frequency in dc inputs.
For dynamic performance evaluation, the external differentialsingle-ended source must have better
specifications than the ADC itself to ensure that the measured system performance is not limited by the
performance of the signal source. Therefore, the external reference source must meet the source
requirements mentioned in Table 5.
Table 5. External Source Requirements for Evaluation of the ADS8900B
Specification Description
Specification Value
Signal frequency
2 kHz
External source type
Balanced differential
External source common-mode
0 V or floating
(see Section 2.2.2 for jumper settings)
External source impedance (RS)
10 Ω–30 Ω
External source differential impedance
(RS_DIFF = 2 × RS)
20 Ω–60 Ω
Source differential signal
(VPP Amplitude for –0.1 dBFS)
(2 × RS × 4.45 × 10–3) + 8.9 V
or
(RS_DIFF × 4.45 × 10–3) + 8.9 V
Maximum noise
10 µVRMS
Maximum SNR
110 dB
Maximum THD
–130 dB
For 2-kHz SNR and ENOB evaluation at a maximum throughput of 1 MSPS, the number of samples must
be 32768 or 65536. More samples brings the noise floor so low that the external source phase noise can
dominate the SNR and ENOB calculations. On the contrary, for THD and SFDR evaluation, a much larger
number of samples must be used to reduce the noise floor below –140 dBc to analyze noise-free
harmonics and spurs in the order of –120 dBc. Such analysis requires at least 262144 samples.
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Figure 13. Spectral Analysis Tool
Finally, the FFT tool includes windowing options that are required to mitigate the effects of non-coherent
sampling (this discussion is beyond the scope of this document). The 7-Term Blackman Harris window is
the default option and has sufficient dynamic range to resolve the frequency components of up to a 24-bit
ADC. Note that the None option corresponds to not using a window (or using a rectangular window) and is
not recommended.
22
ADS8900BEVM-PDK
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6.5
Histogram Tool
Noise degrades ADC resolution and the histogram tool can be used to estimate effective resolution, which
is an indicator of the number of bits of ADC resolution losses resulting from noise generated by the
various sources connected to the ADC when measuring a dc signal. The cumulative effect of noise
coupling to the ADC output from sources such as the input drive circuits, the reference drive circuit, the
ADC power supply, and the ADC itself is reflected in the standard deviation of the ADC output code
histogram that is obtained by performing multiple conversions of a dc input applied to a given channel.
The histogram corresponding to a dc input is displayed on clicking the Capture button, as shown in
Figure 14:
Figure 14. Histogram Analysis Tool
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ADS8900BEVM-PDK Operation
6.6
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Linearity Analysis Tool
The linearity analysis tool measures and generates the DNL and INL plots over code for the specific
ADS8900B installed in the evaluation board. A 2-kHz sinusoidal input signal is required, which is slightly
saturated (35 mV outside the full-scale range at each input or 0.13 dBFS) with very low distortion. The
external source linearity must be better than the ADC linearity. The measured system performance must
reflect the linearity errors of the ADC and must not be limited by the performance of the signal source. To
make sure that the DNL and INL of the ADC are correctly measured, the external source must meet the
requirements in Table 6.
Table 6. External Source Requirements for ADS8900B Evaluation
Specification Description
Specification Value
Signal frequency
2 kHz
External source type
Balanced differential
External source common mode
0 V or floating
(see Section 2.2.2 for jumper settings)
External source impedance (RS)
10 Ω–30 Ω
External source differential impedance
(RS_DIFF = 2 × RS)
20 Ω–60 Ω
Source differential signal
(VPP amplitude for –0.1 dBFS)
(2 × RS × 4.57 × 10–3) + 9.14 V
or
(RS_DIFF × 4.57 × 10–3) + 9.14 V
Maximum noise
30 µVRMS
Maximum SNR
100 dB
Maximum THD
–130 dB
The number-of-hits setting depends on the external noise source. For a 110-dB SNR external source with
approximately 10 µVrms of noise, the total number of hits must be 512. For a source with 100-dB SNR,
the recommended number of hits is 1024.
NOTE: This analysis can take a couple of minutes to run and the evaluation board must remain
undisturbed during the complete duration of the analysis.
24
ADS8900BEVM-PDK
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Figure 15. Linearity Analysis Tool
6.7
Reference Settling Analysis
The ADS8900B ADC has an integrated reference buffer that is optimized to drive the reference of the
ADC at the maximum possible load presented by the ADC. The buffer helps in maintaining the ADC
reference within 1 LSB of its nominal voltage during burst mode of data conversion. This requirement
applies from the very first sample captured in each burst. The Reference Settling tool helps showcase this
performance of the ADC. Provide a low-noise dc differential input to the ADC. Set the parameters for the
Reference Settling test. The various test parameters are:
• Samples: This parameter defines the number of consecutive samples to be captured in a single burst.
• Min Interset Delay (ms): This parameter defines the time interval between two consecutive bursts. No
ADC conversion activity takes place in this time.
• Number of sets to average: This parameter defines number of bursts to capture that are averaged to
arrive at the Reference Settling number.
• Initial samples to ignore: This parameter defines the number of samples to ignore in each burst from
the beginning.
The tool captures the defined number of burst captures and performs the vertical averaging on the burst
mode data. The difference between maximum and minimum codes from the averaged data defines the
Reference Settling error.
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Figure 16. Reference Settling Tool
26
ADS8900BEVM-PDK
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Using the ADS8900BEVM With the Precision Signal Injector (PSIEVM)
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7
Using the ADS8900BEVM With the Precision Signal Injector (PSIEVM)
7.1
Precision Signal Injector Overview
The Precision Signal Injector (PSI) is a platform for evaluating the performance of successive
approximation register analog-to-digital converters (SAR ADCs). The board provides a low-distortion, lownoise, 2-kHz input signal for driving the input of the ADC and pairs with most of TI’s SAR ADC Evaluation
Modules (EVMs). The board is powered over a USB cable which also provides a user interface connection
to a PC.
Figure 17. PSIEVM
7.2
PSIEVM Graphical User Interface (GUI)
The PSI GUI gives the user control over the signal being applied to the ADC. Through the PSI GUI, the
user is able to control the input signal amplitude, common mode, frequency, and type (single ended or
differential). Download the latest version of the PSIEVM GUI installer from the Tools and Software folder
of the ADS8900BEVM-PDK and run the GUI installer to install the EVM GUI software.
PSI GUI Operation:
1. Select either Single Ended or Differential in order to ensure the output from the PSIEVM is the type the
ADC takes as an input. The plot on the GUI will adjust to match the output signal.
2. Adjust the signal amplitude, common mode, and frequency by either typing in the desired values or by
using the up and down arrows next to the text boxes. Click on Set next to the parameter to change the
output.
3. Enable the output by clicking Output Enable. A green light will appear on the PSI GUI showing the
output is enabled.
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Connected to EVM
Amplitude
Setting
Output Plot
Offset/
Common Mode
Frequency
Setting
Output Enabled
AC/DC Mode
Output Type Selection
Figure 18. PSIEVM GUI with Labels
7.3
Jumper Settings
Put the PSIEVM in the jumper settings shown in Table 7 and Figure 19 for operation with the
ADS8900BEVM.
Table 7. Jumper Settings
Designator
28
ADS8900BEVM-PDK
Position
JP1 and JP3
Filter
JP4
Ground
JP7
Open
JP8
DIF_VCM
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USB
Power Stage
MSP430
U14
U13
U15
JP7
OPEN = WP
C85
ANALOG
OUT -
C86
DIF_VCM
SE_VCM
JP8
JP4
GND
FLT
JP3
ANALOG
OUT +
FLT
BP
JP1
BP
SINGLE
ENDED
Figure 19. Jumper Settings Illustration
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Using the ADS8900BEVM With the Precision Signal Injector (PSIEVM)
7.4
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Connecting the ADS8900BEVM to the PSIEVM
Connect the PSIEVM to the ADS8900BEVM by connecting P4 and P5 on the PSIEVM to J7 and J3,
respectively, on the ADS8900BEVM as shown in Figure 20.
USB Cable
PSIEVM
USB Cable
PHI
ADS8900BEVM
J7
P4
J3
P5
Figure 20. ADS8900BEVM Connected to PSIEVM
7.4.1
Example Operation of ADS8900BEVM and PSIEVM
Once the ADS8900BEVM and the PSIEVM are properly connected, the PSIEVM can be used to test the
performance of the ADS8900BEVM. The parameters set on the PSI GUI should match that of the
ADS8900BEVM operating parameters, set the parameters to those shown in Table 8. Enable the output
on the PSI GUI and use the ADS8900BEVM to acquire the signal. Figure 21 and Figure 22 show the PSI
and ADS8900BEVM GUIs for these parameters. Table 9 shows expected results for this setup.
Table 8. PSIEVM Parameters
30
Parameter
Value
PSI GUI Output Type
Differential
ADS8900BEVM Max Input Range
(–VREF to +VREF) –5 V to 5 V
PSI GUI Amplitude
9.8 Vpp
PSI GUI Common Mode
0V
PSI GUI Frequency
2 kHz
ADS8900BEVM-PDK
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Figure 21. PSIEVM GUI
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Figure 22. ADS8900BEVM GUI
Table 9. Expected Results
Measurement
32
ADS8900BEVM-PDK
Value
SNR
100.8 dB
THD
–123.5 dB
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Bill of Materials, PCB Layout, and Schematics
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8
Bill of Materials, PCB Layout, and Schematics
This section contains the ADS8900BEVM bill of materials, PCB layout, and the EVM schematics.
8.1
Bill of Materials
Table 10 lists the ADS8900BEVM BOM.
Table 10. ADS8900BEVM Bill of Materials
Manufacturer Part
Number
Qty
Reference Designators
Manufacturer
Description
PA006
1
!PCB
Any
Printed Circuit Board for Evaluation of ADS8900B
PHI-EVM-CONTROLLER
(Edge# 6591636 rev. B)
1
!PCB2
Texas Instruments
USB Controller Board for ADC EVMs (Kit Item)
C3216X5R1E476M160AC
2
C1, C3
TDK
CAP, CERM, 47 µF, 25 V, +/- 20%, X5R, 1206
GRM188R71E105KA12D
9
C2, C5, C6, C8, C32, C36,
Murata
C38, C40, C43
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0603
GRM21BR71A106KE51L
7
C4, C21, C23, C26, C41,
C44, C48
Murata
CAP, CERM, 10 µF, 10 V, +/- 10%, X7R, 0805
C0603C104J3RACTU
1
C7
Kemet
CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603
ZRB18AD71A106KE01L
5
C13, C39, C45, C50, C51
Murata
CAP, CERM, 10 µF, 10 V, +/- 10%, X7T, 0603
GRM1885C1H102FA01J
3
C16, C31, C42
Murata
CAP, CERM, 1000 pF, 50 V, +/- 1%, C0G/NP0, 0603
C2012X7S1A226M125AC
1
C20
TDK
CAP, CERM, 22 µF, 10 V, +/- 20%, X7S, 0805
C0805C103F1GACTU
3
C34, C35, C37
Kemet
CAP, CERM, 0.01 µF, 100 V, +/- 1%, C0G/NP0, 0805
GRM155R71C104KA88D
2
C47, C49
Murata
CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0402
APT2012LZGCK
1
D1
Kingbright
LED, Green, SMD
CUS05S40,H3F
1
D2
Toshiba
Diode, Schottky, 40 V, 0.5 A, SOD-323
PMSSS 440 0025 PH
4
H1, H2, H3, H4
B&F Fastener Supply
MACHINE SCREW PAN PHILLIPS 4-40
1891
4
H5, H6, H7, H8
Keystone
3/16 Hex Female Standoff
9774050360R
2
H9, H10
Wurth Elektronik
ROUND STANDOFF M3 STEEL 5MM
RM3X4MM 2701
2
H14, H15
APM HEXSEAL
Machine Screw Pan PHILLIPS M3
87898-0204
2
J1, J2
Molex
Header, 2.54 mm, 2x1, Gold, R/A, SMT
142-0701-801
2
J3, J7
Johnson
Connector, End launch SMA, 50 ohm, SMT
TSM-103-01-L-SV
3
J4, J6, J8
Samtec
Header, 100mil, 3x1, Gold, SMT
QTH-030-01-L-D-A
1
J5
Samtec
Header(Shrouded), 19.7mil, 30x2, Gold, SMT
THT-14-423-10
1
LBL1
Brady
Thermal Transfer Printable Labels, 0.650" W x 0.200" H - 10,000 per roll
RG2012P-2803-B-T5
1
R1
Susumu Co Ltd
RES, 280 k, 0.1%, 0.125 W, 0805
ERJ-3RSFR10V
1
R2
Panasonic
RES, 0.1, 1%, 0.1 W, 0603
RG1608P-103-B-T5
1
R5
Susumu Co Ltd
RES, 10.0 k, 0.1%, 0.1 W, 0603
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Bill of Materials, PCB Layout, and Schematics
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Table 10. ADS8900BEVM Bill of Materials (continued)
Manufacturer Part
Number
ERJ-2RKF1002X
Qty
Reference Designators
Manufacturer
Description
4
R6, R23, R28, R65
Panasonic
RES, 10.0 k, 1%, 0.1 W, 0402
ERJ-2GE0R00X
17
R7, R11, R12, R32, R34,
R35, R37, R40, R42, R43,
R46, R47, R49, R51, R52,
R63, R64
Panasonic
RES, 0, 5%, 0.063 W, 0402
ERJ-3RQFR22V
2
R8, R58
Panasonic
RES, 0.22, 1%, 0.1 W, 0603
RG1608P-203-B-T5
3
R10, R15, R20
Susumu Co Ltd
RES, 20.0 k, 0.1%, 0.1 W, 0603
ERJ-3GEY0R00V
5
R19, R24, R57, R59, R60
Panasonic
RES, 0, 5%, 0.1 W, 0603
RG1608P-4990-B-T5
1
R21
Susumu Co Ltd
RES, 499, 0.1%, 0.1 W, 0603
RC0603FR-071RL
1
R33
Yageo America
RES, 1.00, 1%, 0.1 W, 0603
RG1608P-101-B-T5
2
R38, R44
Susumu Co Ltd
RES, 100, 0.1%, 0.1 W, 0603
RG1608P-102-B-T5
4
R41, R45, R54, R55
Susumu Co Ltd
RES, 1.00 k, 0.1%, 0.1 W, 0603
CRCW06032R21FKEA
2
R48, R50
Vishay-Dale
RES, 2.21, 1%, 0.1 W, 0603
881545-2
3
SH-J1, SH-J2, SH-J3
TE Connectivity
Shunt, 100mil, Gold plated, Black
5016
5
TP1, TP2, TP3, TP4, TP5
Keystone
Test Point, Compact, SMT
5015
2
TP6, TP7
Keystone
Test Point, Miniature, SMT
REF5050AIDGKT
1
U1
Texas Instruments
Low Noise, Very Low Drift, Precision Voltage Reference, -40 to 125 degC, 8-pin VSSOP (DGK),
Green (RoHS & no Sb/Br)
TPS7A4700RGW
1
U2
Texas Instruments
36-V, 1-A, 4.17-µVRMS, RF LDO Voltage Regulator, RGW0020A
OPA376AIDBVR
1
U3
Texas Instruments
Low-Noise, Low Quiescent Current, Precision Operational Amplifier e-trim Series, DBV0005A
BR24G32FVT-3AGE2
1
U8
Rohm
I2C BUS EEPROM (2-Wire), TSSOP-B8
OPA625IDBVR
2
U9, U10
Texas Instruments
High-Bandwidth, High-Precision, Low THD+N, 16-Bit and 18-Bit Analog-to-Digital Converter (ADC)
Drivers, DBV0006A
ADS8900BIRGER
1
U11
Texas Instruments
20-Bit, 1-MSPS SAR ADC with Integrated Reference Buffer, LDO, and Enhanced Serial Interface,
RGE0024H
C0603C104J3RACTU
0
C9, C10, C17
Kemet
CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R, 0603
EMK212BJ475KG-T
0
C11
Taiyo Yuden
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X5R, 0805
GRM188R71E105KA12D
0
C12
Murata
CAP, CERM, 1 µF, 25 V, +/- 10%, X7R, 0603
ZRB18AD71A106KE01L
0
C14, C15, C24, C27, C28,
C29, C52, C53
Murata
CAP, CERM, 10 µF, 10 V, +/- 10%, X7T, 0603
C0603C100F5GAC7867
0
C18
Kemet
CAP, CERM, 10 pF, 50 V, +/- 1%, C0G/NP0, 0603
C0603C224J3RAC7867
0
C19, C54
Kemet
CAP, CERM, 0.22 µF, 25 V, +/- 5%, X7R, 0603
GRM188R71A105KA61D
0
C22
Murata
CAP, CERM, 1uF, 10V, +/-10%, X7R, 0603
GRM21BR71A106KE51L
0
C25
Murata
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM155R71C104KA88D
0
C30
Murata
CAP, CERM, 0.1 µF, 16 V, +/- 10%, X7R, 0402
34
ADS8900BEVM-PDK
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Table 10. ADS8900BEVM Bill of Materials (continued)
Manufacturer Part
Number
Qty
Reference Designators
Manufacturer
Description
GRM32ER71A476KE15L
0
C33
Murata
CAP, CERM, 47 µF, 10 V, +/- 10%, X7R, 1210
C2012X7S1A226M125AC
0
C55, C57
TDK
CAP, CERM, 22 µF, 10 V, +/- 20%, X7S, 0805
GMK212BJ474KG-T
0
C56
Taiyo Yuden
CAP, CERM, 0.47 µF, 35 V, +/- 10%, X5R, 0805
N/A
0
FID1, FID2, FID3, FID4,
FID5, FID6
N/A
102-1092-BL-00100
0
H12
CNC Tech
ERJ-2GE0R00X
0
R3, R4, R9, R13, R14,
R18, R53, R61, R62
Panasonic
RG1608P-102-B-T5
0
R16, R29
Susumu Co Ltd
RES, 1.00 k, 0.1%, 0.1 W, 0603
RG1608P-4991-B-T5
0
R17
Susumu Co Ltd
RES, 4.99 k, 0.1%, 0.1 W, 0603
RG1608P-2491-B-T5
0
R22
Susumu Co Ltd
RES, 2.49 k, 0.1%, 0.1 W, 0603
ERJ-3RQFR22V
0
R25, R26
Panasonic
RES, 0.22 ohm, 1%, 0.1W, 0603
RG1608P-303-B-T5
0
R27
Susumu Co Ltd
RES, 30.0 k, 0.1%, 0.1 W, 0603
RG1608P-4990-B-T5
0
R30
Susumu Co Ltd
RES, 499, 0.1%, 0.1 W, 0603
CRCW06034R75FKEA
0
R31
Vishay-Dale
RES, 4.75, 1%, 0.1 W, 0603
ERJ-3RQFR22V
0
R36, R39
Panasonic
RES, 0.22, 1%, 0.1 W, 0603
ERJ-6GEYJ4R7V
0
R36
Panasonic
RES, 4.7, 5%, 0.125 W, 0805
LM7705MM/NOPB
0
U4
Texas Instruments
Low Noise Negative Bias Generator, 8-pin Mini SOIC, Pb-Free
OPA378AIDBVT
0
U5
Texas Instruments
Low-Noise, 900 kHz, RRIO, Precision Operational Amplifier, Zerø-Drift Series, 2.2 to 5.5 V, -40 to
125 degC, 5-pin SOT23 (DBV0005A), Green (RoHS & no Sb/Br)
OPA625IDBVR
0
U6
Texas Instruments
High-Bandwidth, High-Precision, Low THD+N, 16-Bit and 18-Bit Analog-to-Digital Converter (ADC)
Drivers, DBV0006A
REF6025AIDGK
0
U7
Texas Instruments
High-Precision Voltage Reference with Integrated High-Bandwidth Buffer, DGK0008A
Fiducial mark. There is nothing to buy or mount.
CABLE USB A MALE-B MICRO MALE 1M (Kit Item)
RES, 0, 5%, 0.063 W, 0402
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Bill of Materials, PCB Layout, and Schematics
8.2
www.ti.com
PCB Layout
Figure 23 through Figure 26 illustrate the EVM PCB layout.
Figure 23. ADS8900BEVM PCB Layer 1: Top Layer
36
ADS8900BEVM-PDK
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Figure 24. ADS8900BEVM PCB Layer 2: GND Plane
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Bill of Materials, PCB Layout, and Schematics
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Figure 25. ADS8900BEVM PCB Layer 3: Power Planes
38
ADS8900BEVM-PDK
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Figure 26. ADS8900BEVM PCB Layer 4: Bottom Layer
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Bill of Materials, PCB Layout, and Schematics
8.3
www.ti.com
Schematics
Figure 27 through Figure 29 illustrate the EVM schematics.
40
ADS8900BEVM-PDK
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1
2
3
5.2V
4
5
6
5.2V
D2
C15
DNP
10μF
DNPC12
1μF
DNP
4
AGND
5
AGND
R22
DNP
2.49k
1
3
R17
DNP
4.99k
DNPC9
0.1μF
V+
DNP
V-
4
CUS05S40,H3F
U6
OPA625IDBVR
A
C19
1
DNP
0.22μF
AGND
5.2V
2
5
5V
U5
OPA378AIDBVT
3
6
R16
DNP
1.00k
REFOUT
2
AGND
A
C17
R31
DNP
4.75
DNP
0.1μF
AGND
AGND
AGND
AGND
R30
DNP
499
R29
DNP
1.00k
C10
DNP
C18
0.1μF
DNP
AGND
10pF
R27
DNP
30.0k
EVM_DVDD
REF_BUF
5V
R33
1.00
R23
10.0k
DNPC28 DNPC29 DNPC27 DNPC24
10μF
10μF
10μF
10μF
C20
22μF
B
R32
RST
5.2V
C39
AGND
J3
142-0701-801
6
2
3
4
5
OPA625_CM_P
3
V+
4
AGND
2
C51
-0.2V 10μF
AGND
AGND
AGND
3
2
1
1
0.01μF
6
AGND
U9
OPA625IDBVR
V+
4
AINP
AINM
REFBUFOUT
REFP
REFM
REFM
AGND
-0.2V
R54
1.00k
1.00k
C42
REFIN
NC
RVDD
2 RST
CS
SCLK
SDI
RVS
24
23
22
21
SDO-0
SDO-1
SDO-2
SDO-3
20
19
18
17
GND
GND
11
15
EP
5.2V
R50
SCLK
SDI
0
R40
SCLK_RTN
0
R47
SDI
RVS
0
R43
SDO-0
0
R46
SDO-1
0
R49
SDO-2
0
R51
EVM_DVDD
R57
0
EVM_ID_SDA
EVM_ID_SCL
EVM_PRSNT_N
SDO-3
0
AGND
C44
10μF
MP1
MP2
R52
2.21
C50
CS
0
R37
0
R42
25
AGND
CONVST
0
R35
AGND
0
R28
C36
1μF
GND
GND
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
GND
GND
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
AGND
C
EVM_ID_PWR
R60
0
MP3
MP4
C48
10μF
AGND
AGND
10.0k
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
B
EVM_REG_5V5
J5
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
58
60
QTH-030-01-L-D-A
AGND
AGND
COMPONENTS MARKED 'DNP' SHOULD NOT BE POPULATED.
10μF
AGND
AGND
2
3
4
5
AGND
R55
3
6
12
1
ADS8900BIRGER
AGND
REFOUT
AGND
R59
1
V-
C43
1μF
2
R62
DNP
0
3
C23
10μF
R18
DNP
0
10μF
5
-0.2V
0
4
8
AGND
C45
C41
10μF
RST
5
7
C37
5.2V
OPA625_CM_N
100
J7
142-0701-801
REF_BUF
0.01μF
CONVST
DVDD
AGND
TEST_4.3V
4.5V
DECAP
DECAP
9
10
1000pF
C35
0.01μF
TSM-103-01-L-SV
REFOUT
13
14
AGND
AGND
R44
AGND
EVM_DVDD
R53
DNP
0
U11
16
C34
2.21
1.00k
C31
1.00k
R38
100
AGND
AGND
R48
R41
R45
AGND
J6
1 μF
EVM_DVDD
C40
1
1 μF
2
1
C26
10μF
AGND
C38
V-
C32
1μF
AGND
J4
TSM-103-01-L-SV
TEST_0.2V
3
C
AGND
U10
OPA625IDBVR
-0.2V
0
AGND
10μF
5
R24
1
HOST_A1_IO6
0
R34
EVM_ID_PWR
EVM_ID_PWR
AGND
EVM_ID_PWR
C49
1000pF
R65
10.0k
U8
1
D
TP3
5016
LDO_IN_5V5
TP2
5016
5.2V
EVM_DVDD EVM_ID_PWR
0.1μF
J8
A0
VCC
8
2
A1
WP
7
WP
3
A2
SCL
6
EVM_ID_SCL
4
VSS
SDA
5
EVM_ID_SDA
AGND
1
2
3
C47
0.1μF
D
TSM-103-01-L-SV
AGND
BR24G32FVT-3AGE2
TP1
5016
AGND
AGND
TP7
5015
TP5
5016
TP6
5015
AGND
AGND
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
1
2
3
PA006
Orderable:
TID #:
N/A
Rev: C
Number: PA006
SVN Rev: Version control disabled
Drawn By: Rafael Ordonez
Engineer: Shridhar More
4
5
Designed for: Public
Mod. Date: 5/5/2016
Project Title: ADS91xx_ADS89xx_EVM-PDK
Sheet Title: ADC and Drivers
Assembly Variant: 003
Sheet: 1 of 3
File: PA006C_Schematic1.SchDoc
Size: B
Contact: http://www.ti.com/support
http://www.ti.com
© Texas Instruments 2016
6
Figure 27. Schematic Diagram (Page 1) of the ADS8900BEVM PCB
SBAU269A – October 2016 – Revised July 2017
Submit Documentation Feedback
ADS8900BEVM-PDK
Copyright © 2016–2017, Texas Instruments Incorporated
41
Bill of Materials, PCB Layout, and Schematics
1
www.ti.com
2
3
4
5
6
LDO_IN_5V5
+3.3V_flt
R36
DNP
0.22
5.2V
R39
DNP
0.22
DNPC54
DNPC11
0.22μF
4.7μF
1
8
CF+
CF-
4
VDD
DNP
VOUT
6
CRES
7
VSS
VSS
2
5
R6
10.0k
R56
DNP
4.7
DNPC30
DNPC57
0.1μF
22μF
LM7705MM/NOPB
DNPC55
22μF
DNPC52 DNPC53
10μF
10μF
DNPC56
0.47μF
AGND
AGND
AGND
A
R64
0
R58
D1
APT2012LZGCK
AGND
DNPC14
10μF
AGND
EVM_DVDD
-0.2V
1
AGND
A
SD
Green
U4
3
+3.3V_flt
0.22
C13
10μF
2
R61
DNP
0
AGND
AGND
AGND
AGND
AGND
AGND
B
B
5.2V
LDO_IN_5V5
EVM_REG_5V5
U2
U7
5.2V
1
20
REFOUT
DNPC25
10μF
1
VIN
OUT_S
5
2
EN
OUT_F
6
4
3
AGND
DNP
SS
FILT
GND_S
8
GND_F
7
R25
DNP
0.22
3
R2
0.1
IN
IN
SENSE
EN
R19
15
16
13
0
LDO_EN
C5
14
DNPC33
47μF
OUT
OUT
C3
AGND
47μF
1μF
0603
DNPC22
REF6025AIDGK
1μF R26
DNP
0.22
AGND
NR
19
18
17
2
NC
NC
NC
NC
7
21
GND
PAD
AGND
6P4V2
6P4V1
3P2V
1P6V
0P8V
0P4V
0P2V
0P1V
R4
DNP
0
R9
DNP
0
R12
4
5
6
8
9
10
11
12
0
R13
DNP
0
R14
DNP
0
R11
TPS7A4700RGW
C
AGND
AGND
AGND
R20
20.0k
C1
47μF
AGND
C16
1000pF
AGND
C21
10μF
AGND
C
COMPONENTS MARKED 'DNP' SHOULD NOT BE POPULATED.
C8
0
R7
1μF
0
R3
DNP
0
5.2V
J1
87898-0204
C7
AGND
5
0.1μF
OPA625_CM_P
0
R21
499
AGND
R1
4
1
U3
OPA376AIDBVR
V+
V-
R15
U1A
REFOUT
6
5
20.0k
R5
10.0k
C6
1μF
AGND
D
TP4
5016
280k
3
2
OPA625_CM_N
R63
AGND
R8
0.22
GND
VIN
TEMP
2
3
C2
1μF
REF5050AIDGKT
R10
20.0k
J2
87898-0204
4
5.2V
VOUT
TRIM/NR
AGND
AGND
AGND
AGND
AGND
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
1
2
D
C4
10μF
3
PA006
Orderable:
TID #:
N/A
Rev: C
Number: PA006
SVN Rev: Version control disabled
Drawn By: Rafael Ordonez
Engineer: Shridhar More
4
5
Designed for: Public
Mod. Date: 2/12/2016
Project Title: ADS91xx_ADS89xx_EVM-PDK
Sheet Title: LDO and Reference
Assembly Variant: 003
Sheet: 2 of 3
File: PA006C_Schematic2.SchDoc
Size: B
Contact: http://www.ti.com/support
http://www.ti.com
© Texas Instruments 2016
6
Figure 28. Schematic Diagram (Page 2) of the ADS8900BEVM PCB
42
ADS8900BEVM-PDK
SBAU269A – October 2016 – Revised July 2017
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
Bill of Materials, PCB Layout, and Schematics
www.ti.com
1
2
H1
H2
H3
H4
PMSSS 440 0025 PH
PMSSS 440 0025 PH
PMSSS 440 0025 PH
PMSSS 440 0025 PH
3
4
5
6
H12
MECH
DNP
102-1092-BL-00100
CABLE USB A MALE-B MICRO MALE 1M (Kit Item)
A
A
H5
H6
H7
H8
1891
1891
1891
1891
H14
H15
RM3X4MM 2701
DNP
DNP
DNP
FID1
FID2
FID3
DNP
DNP
DNP
FID4
FID5
FID6
H10
9774050360R
9774050360R
Logo2
Logo3
PCB
LOGO
PCB
LOGO
PCB
LOGO
Pb-Free Symbol
Texas Instruments
FCC disclaimer
Logo1
PCB Number: PA006
PCB Rev: C
RM3X4MM 2701
H9
SH-J1
Printed Circuit Board for Evaluation of ADS9110
SH-J2
B
B
DNP
PCB: PHI-EVM-CONTROLLER
(Edge# 6591636 rev. B)
USB Controller Board for ADC EVMs (Kit Item)
SH-J3
Label Table
Variant
001
LBL1
PCB Label
Size: 0.65" x 0.20 "
ZZ1
Label Assembly Note
This Assembly Note is for PCB labels only
C
Label Text
ADS9110EVM-PDK
002
ADS9120EVM-PDK
003
ADS8900BEVM-PDK
004
ADS8910BEVM-PDK
005
ADS8920BEVM-PDK
ZZ2
Assembly Note
These assemblies are ESD sensitive, ESD precautions shall be observed.
C
ZZ3
Assembly Note
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
ZZ4
Assembly Note
These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.
ZZ5
Assembly Note
Place H14 and H15 screws in H9 and H10 standoffs
ZZ6
Assembly Note
Place H1, H2, H3, H4 screws in H5, H6, H8, H9 standoffs
ZZ7
Assembly Note
Mount Shuts at: J2, J4:1-2, and J6:2-3
D
D
Texas Instruments and/or its licensors do not warrant the accuracy or completeness of this specification or any information contained therein. Texas Instruments and/or its licensors do not
warrant that this design will meet the specifications, will be suitable for your application or fit for any particular purpose, or will operate in an implementation. Texas Instruments and/or its
licensors do not warrant that the design is production worthy. You should completely validate and test your design implementation to confirm the system functionality for your application.
1
2
3
Orderable:
PA006
TID #:
N/A
Rev: C
Number: PA006
SVN Rev: Version control disabled
Drawn By: Rafael Ordonez
Engineer: Shridhar More
4
5
Designed for: Public
Mod. Date: 2/12/2016
Project Title: ADS91xx_ADS89xx_EVM-PDK
Sheet Title:
Assembly Variant: 003
Sheet: 3 of 3
File: PA006C_Hardware.SchDoc
Size: B
Contact: http://www.ti.com/support
http://www.ti.com
© Texas Instruments 2016
6
Figure 29. Schematic Diagram (Page 3) of the ADS8900BEVM PCB
SBAU269A – October 2016 – Revised July 2017
Submit Documentation Feedback
ADS8900BEVM-PDK
Copyright © 2016–2017, Texas Instruments Incorporated
43
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (October 2016) to A Revision .................................................................................................... Page
•
44
Added Using the ADS8900BEVM With the Precision Signal Injector (PSIEVM) section. ...................................... 27
Revision History
SBAU269A – October 2016 – Revised July 2017
Submit Documentation Feedback
Copyright © 2016–2017, Texas Instruments Incorporated
STANDARD TERMS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1
For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES
Texas Instruments Incorporated (‘TI”) technical, application or other design advice, services or information, including, but not limited to,
reference designs and materials relating to evaluation modules, (collectively, “TI Resources”) are intended to assist designers who are
developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you
(individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of
this Notice.
TI’s provision of TI Resources does not expand or otherwise alter TI’s applicable published warranties or warranty disclaimers for TI
products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections,
enhancements, improvements and other changes to its TI Resources.
You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your
applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications
(and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You
represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1)
anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that
might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you
will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any
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You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include
the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO
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RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or
endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
TI RESOURCES ARE PROVIDED “AS IS” AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR
REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO
ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF
MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL
PROPERTY RIGHTS.
TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT
LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF
DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL,
COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR
ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE
POSSIBILITY OF SUCH DAMAGES.
You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice.
This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services.
These include; without limitation, TI’s standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation
modules, and samples (http://www.ti.com/sc/docs/sampterms.htm).
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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