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Texas Instruments AMC7832EVM (Rev. A) User guides
User's Guide
SLAU544A – February 2014 – Revised September 2016
AMC7832EVM User’s Guide
This user's guide describes the characteristics, operation, and use of the AMC7832 evaluation module
(EVM). This user’s guide also discusses the proper setup and configuration of software and hardware and
reviews various aspects of program operation. A complete circuit description, schematic diagram, and bill
of materials are also included.
1
2
3
4
5
6
Contents
Overview ...................................................................................................................... 3
1.1
AMC7832EVM Kit Contents ....................................................................................... 3
1.2
Related Documentation from TI ................................................................................... 3
AMC7832EVM Hardware Setup ........................................................................................... 4
2.1
Theory of Operation for AMC7832 Hardware ................................................................... 4
2.2
Signal Definitions of J6 (10-Pin Male Connector Socket) ..................................................... 5
2.3
Theory of Operation for SDM-USB-DIG Platform .............................................................. 6
AMC7832EVM Software Setup ............................................................................................ 7
3.1
Operating Systems for AMC7832EVM Software ............................................................... 7
3.2
AMC7832EVM Software Installation ............................................................................. 7
AMC7832EVM Hardware Overview ....................................................................................... 9
4.1
Electrostatic Discharge Warning .................................................................................. 9
4.2
Connecting the Hardware.......................................................................................... 9
4.3
Connecting the USB Cable to the SDM-USB-DIG ............................................................ 10
4.4
AMC7832EVM Power Configurations .......................................................................... 10
4.5
ADC Signal Pins ................................................................................................... 11
4.6
DAC Signal Pins ................................................................................................... 11
4.7
GPIO Signal Pins .................................................................................................. 12
AMC7832EVM Software Overview ...................................................................................... 13
5.1
Starting the AMC7832EVM Software ........................................................................... 13
5.2
AMC7832EVM Software Features .............................................................................. 14
AMC7832EVM Documentation ........................................................................................... 22
6.1
AMC7832EVM Board Schematic................................................................................ 22
6.2
AMC7832EVM PCB Components Layout...................................................................... 24
6.3
AMC7832 Test Board Bill of Materials ......................................................................... 25
List of Figures
1
AMC7832EVM Hardware Setup ........................................................................................... 4
2
AMC7832 Test Board Block Diagram ..................................................................................... 4
3
SDM-USB-DIG Platform Block Diagram .................................................................................. 6
4
AMC7832EVM Installer Directory
5
AMC7832EVM Install Path ................................................................................................. 8
6
Typical Hardware Connections on the AMC7832EVM ................................................................ 10
7
Confirmation of SDM-USB-DIG Platform Driver Installation .......................................................... 10
8
AMC7832EVM GUI Location ............................................................................................. 13
9
AMC7832EVM GUI – Power On ......................................................................................... 13
10
Software Reset Button..................................................................................................... 14
11
Low Level Configuration Page............................................................................................ 14
.........................................................................................
7
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12
ADC Page ................................................................................................................... 15
13
ADC Block Activation Sequence ......................................................................................... 15
14
ADC Channel MUX
15
DAC Page ................................................................................................................... 17
16
Program DAC Registers ................................................................................................... 17
17
DAC Read ................................................................................................................... 18
18
ALARMS Page
19
Enable Low Limit and High Limit Fields ................................................................................. 19
20
CH-FALR-CT Menu ........................................................................................................ 19
21
Clear DAC Options ......................................................................................................... 19
22
GPIO Page .................................................................................................................. 20
23
GPIO Write or Read
24
Board Schematic ........................................................................................................... 23
25
AMC7832EVM PCB Components Layout............................................................................... 24
........................................................................................................
.............................................................................................................
.......................................................................................................
16
18
21
List of Tables
2
1
Contents of AMC7832EVM Kit ............................................................................................. 3
2
Related Documentation ..................................................................................................... 3
3
J6 Signal Definition .......................................................................................................... 5
4
Default Jumper Settings .................................................................................................... 9
5
AMC7832EVM Jumper and Shunt Resistor Settings .................................................................. 11
6
AMC7832EVM ADC Signal Connections ............................................................................... 11
7
AMC7832EVM DAC Signal Connections ............................................................................... 12
8
AMC7832EVM DAC Range Connections ............................................................................... 12
9
AMC7832EVM GPIO Signal Definition .................................................................................. 12
10
Conversion Rates .......................................................................................................... 16
11
Bill of Materials
.............................................................................................................
AMC7832EVM User’s Guide
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Overview
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1
Overview
This EVM features the AMC7832 device, a highly integrated, low-power, complete analog monitoring and
control solution that includes a 17-channel (12-bit) ADC, 12-channel (12-bit) DAC, eight GPIOs, and a
local temperature sensor. The DACs include a flexible output range that allows the device to be fully
compatible with a large array of biasing technologies, such as LDMOS, GaAs, and GaN. The devices also
feature programmable out-of-range alarms, an internal reference, and a low-power, SPI-compatible serial
interface.
1.1
AMC7832EVM Kit Contents
Table 1 details the contents of the EVM kit. Contact the TI Product Information Center nearest you if any
component is missing. TI highly recommends to verify that the user has the latest versions of the related
software at the TI website, www.ti.com.
Table 1. Contents of AMC7832EVM Kit (1)
(1)
1.2
ITEM
QUANTITY
AMC7832EVM PCB evaluation board
1
SDM-USB-DIG platform PCB
1
USB extender cable
1
The 24-V wall adapter is not included with the evaluation module (EVM). Optionally, a 24-V (750-mA)
center-positive wall adapter can be separately purchased to interface to the onboard 2.1 x 5.5-mm DC
jack. In the case that a wall adapter is not available, external terminal blocks are included, which can
interface with external supplies.
Related Documentation from TI
The following document provides information regarding TI integrated circuits used in the assembly of the
AMC7832EVM. This user's guide is available from the TI website under literature number SLAU544. A
letter appended to the literature number corresponds to the document revision that is current at the time of
the writing of this document. Newer revisions may be available from the TI website at www.ti.com, or call
the TI Literature Response Center at (800) 477-8924 or the Product Information Center at (972) 644-5580.
When ordering, identify the document by both title and literature number.
Table 2. Related Documentation
DOCUMENT
LITERATURE NUMBER
AMC7832 Product Data Sheet
SLAS836
SDM-USB-DIG Platform User’s Guide
SBOU136
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3
AMC7832EVM Hardware Setup
2
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AMC7832EVM Hardware Setup
This section provides the overall system setup for the EVM. A PC runs software that communicates with
the SDM-USB-DIG platform, which generates the power and digital signals used to communicate with the
EVM board. An optional +24-V wall supply can provide power through the J5 connector to provide power
to on-board power regulators (LDOs) that regulate the analog and digital supplies. By default, on-board
connectors are included on the EVM board for external supplies. Figure 1 displays the system setup for
the AMC7832EVM.
Personal
Computer
(PC)
External Power
Or
Optional +24-V Wall Adapter
USB Bus
from
Computer
SDM-USBDIG
J1 Connection or
Terminal Blocks
20-pin
Connector
AMC7832EVM
Figure 1. AMC7832EVM Hardware Setup
2.1
Theory of Operation for AMC7832 Hardware
A block diagram of the AMC7832EVM test board is displayed in Figure 2. The EVM board provides
testpoints for the supplies, internal reference, ground connections, SPI inputs, ADC inputs, and DAC
outputs.
Optional:
LDO Regulated
Power
Default:
External Power
(Terminal Blocks)
Power
20-Pin
Conn. To
SDMUSB-DIG
SPI
8 GPIO
Connection
AMC7832
12-CH DAC
Vout
17-CH ADC
Input
Figure 2. AMC7832 Test Board Block Diagram
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2.2
Signal Definitions of J6 (10-Pin Male Connector Socket)
The AMC7832EVM includes a 20-pin connector socket used to communicate between the EVM and the
SDM-USB-DIG platform. Although the I2C pins are brought out to the J12 header, the I2C communication
lines (I2C_SCL and I2C_SDA) are not used. The pin out of the J6 connector is shown in Table 3.
Table 3. J6 Signal Definition
PIN ON J3
SIGNAL
DESCRIPTION
1
SCL
I2C clock signal (SCL)
2
DIG_GPIO2
GPIO – control output or measure input
3
DIG_GPIO0
GPIO – control output or measure input
4
DIG_GPIO3
GPIO – control output or measure input
5
SDA
I2C data signal (SDA)
6
DIG_GPIO4
GPIO – control output or measure input
7
DIG_GPIO1
GPIO – control output or measure input
8
DIG_GPIO5
GPIO – control output or measure input
9
MOSI
SPI data output (MOSI)
10
DIG_GPIO6
GPIO – control output or measure input
11
VDUT
Switchable DUT power supply: +3.3 V, +5 V, Hi-Z (disconnected).
Note: when VDUT is Hi-Z all digital I/O are Hi-Z as well.
12
DIG_GPIO7
GPIO – control output or measure input
13
SCLK
SPI Clock Signal (SCLK)
14
DIG_GPIO8
GPIO – control output or measure input
15
GND
Power Return (GND)
16
DIG_GPIO9
GPIO – control output or measure input
17
CS
SPI chip select signal (CS)
18
DIG_GPIO10
GPIO – control output or measure input
19
MISO
SPI data input (MISO)
20
DIG_GPIO11
GPIO – control output or measure input
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Theory of Operation for SDM-USB-DIG Platform
The SDM-USB-DIG platform is a general-purpose data acquisition system that is used on select TI EVMs.
The core component of the platform is the MSP430F5528, an ultra-low power 16-bit MCU. The
microcontroller receives information from the host PC and translates it into I2C, SPI, or other digital I/O
patterns. The connected device (in this case, the AMC7832 device) connects to the I/O interface of the
platform. During digital I/O transactions, the platform obtains information from the AMC7832 device and
sends to the host PC for interpretation. A block diagram of the platform is shown in Figure 3.
3.3-V
Regulator
SDM-USB-DIG
+3.3 V
To Computer
and Power
Supplies
USB Bus
from
Computer
USB
+5.0 V
MSP430F5528
Microcontroller
Level
Translators
I2C
SPI
GPIO
To EVM
Power on
Reset
USB +5.0 V
+3.3 V
Power
Switching
Vdut
(Hi-Z, 3.3 V, or 5 V)
Switched Power
Figure 3. SDM-USB-DIG Platform Block Diagram
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3
AMC7832EVM Software Setup
This section provides the procedure for EVM software installation.
3.1
Operating Systems for AMC7832EVM Software
The EVM software was tested on the Microsoft® Windows® XP and Windows 7 operating systems with the
United States and European regional settings. The software should also be compatible with other
Windows operating systems.
3.2
AMC7832EVM Software Installation
The software is available through the EVM product folder on the TI website. After the software is
downloaded on the PC, navigate to the AMC7832EVM_Installer folder, and run the setup.exe file, as
shown in Figure 4. When the software is launched, an installation dialog opens and prompts the user to
select an installation directory. If left unchanged, the software location defaults to C:\Program Files
(x86)\AMC7832EVM on Windows 7 machines, as shown in Figure 5. For Windows XP machines, the path
location can be found at C:\Program Files\AMC7832EVM. The software installation automatically copies
the required drivers for the SDM-USB-DIG and AMC7832EVM to the PC. After the software is installed,
connecting the SDM-USB-DIG to a USB port may launch a driver installation dialog. Choose the ‘Install
this driver software anyway’ option to continue with installation. (Note: On XP machines, choose to have
the system automatically find the driver or software.)
Figure 4. AMC7832EVM Installer Directory
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Figure 5. AMC7832EVM Install Path
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4
AMC7832EVM Hardware Overview
The subsequent sections provide detailed information on the EVM hardware, and jumper configuration
settings. To use the onboard supplies set the AVDD and IOVDD jumper connections to the default
configuration listed in Table 4. The table also displays the default configurations of all jumper connections
on the AMC7832EVM. Connect the USB extender cable from the SDM-USB-DIG to the PC, and the +24V wall adapter to the J1 terminal.
Table 4. Default Jumper Settings (1)
JUMPER
(1)
4.1
DEFAULT POSITION
FUNCTION
JP1
Shunt on 1-2
Selecting DAC Range
• 1-2: (DAC range 0 to 5 V or 0 to 10 V)
• 2-3: (DAC range –10 to 0 V)
JP2
Shunt on 1-2
Selecting DAC Range
• 1-2: (DAC range 0 to 5 V or 0 to 10 V)
• 2-3: (DAC range –10 to 0 V)
JP3
Shunt on 1-2
Selecting Internal or External AVDD
• 1-2: Internal 5-V Supply
• 2-3: External Supply
JP4
Shunt on 2-3
Selecting DAC Range
• 1-2: (DAC range –10 to 0 V)
• 2-3: (DAC range 0 to 5 V or 0 V to 10 V)
JP5
Shunt on 2-3
Selecting DAC Range
• 1-2: (DAC range –10 to 0 V)
• 2-3: (DAC range 0 to 5 V or 0 to 10 V)
JP6
Shunt on 1-2
Selecting Internal or External IOVDD
• 1-2: Internal 3.3-V supply
• 2-3: External supply
Table 4 lists the default connections for the 24-V supply. Refer to Table 5 for24-V wall adapter
connections.
Electrostatic Discharge Warning
Many of the components on the AMC7832EVM are susceptible to damage by electrostatic discharge
(ESD). Customers are advised to observe proper ESD handling precautions when unpacking and handling
the EVM, including the use of a grounded wrist strap at an approved ESD workstation.
4.2
Connecting the Hardware
To connect the SDM-USB-DIG to the EVM board, align and firmly connect the female and male ends of
the 20-pin connectors (see Figure 6). Verify the connection is snug, as loose connections may cause
intermittent operation.
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Figure 6. Typical Hardware Connections on the AMC7832EVM
4.3
Connecting the USB Cable to the SDM-USB-DIG
Figure 7 shows the typical response when connecting the SDM-USB-DIG platform to a USB port of a PC
for the first time. The PC usually responds with a popup dialog window that states Found New Hardware,
USB Device. The popup window then changes to Found New Hardware, Virtual COM Port (CDC). This
popup indicates that the device is ready for use. The CDC driver is used for communication between the
SDM-USB-DIG and PC.
Figure 7. Confirmation of SDM-USB-DIG Platform Driver Installation
4.4
AMC7832EVM Power Configurations
This section describes the various power configurations that can be used by the EVM.
The AMC7832EVM provides terminal blocks for external supplies as well as (optional) onboard power
conditioning to convert a 24-V supply into a +12-V, -12-V, and 5-V supply. Jumpers JP3 and JP6 can be
configured to use external supplies through the J2 and J11 terminal blocks or the jumpers can be
configured for the onboard regulated supplies. Additionally, the AVCC and AVEE inputs are, by default,
connected to external terminal blocks, but can be configured to use the onboard regulated supplies by
populating the shunt resistors as shown in Table 5.
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Additionally, IOVDD is supplied by the SDM-USB-DIG, but can be externally sourced by setting the JP6
jumper, and connecting an external source to the J11 terminal block.
Table 5. AMC7832EVM Jumper and Shunt Resistor Settings
SIGNAL
JUMPER
DEFAULT POSITION
AVDD
JP3
Shunt on 1-2
Selecting Internal or External AVDD
• 1-2: Internal 5-V supply
• 2-3: External supply
IOVDD
JP6
Shunt on 1-2
Selecting Internal or External IOVDD
• 1-2: Internal 3.3-V supply
• 2-3: External supply
AVCC
R44, R48, R55
AVEE
4.5
R73, R74, R75
FUNCTION
R44 – Not populated
+12-V LDO supply
R48 – Not populated
+5-V LDO supply (default)
R55 – 0-Ω shunt
External supply
R73 – 0-Ω shunt
External supply
R74 – Not populated
GND
R75 – Not populated
–12-V LDO supply (default)
ADC Signal Pins
The AMC7832 device contains 17 ADC single-ended channels, 12 of which have bipolar inputs (ADC0
through ADC11) and have an input range of –12.5 to 12.5 V. The unipolar inputs, (ADC12 through
ADC16), have a range of 0 to 5 V. These signal pins are connected to the J4 connector, which is
described in Table 6.
Table 6. AMC7832EVM ADC Signal Connections
4.6
NAME
CONNECTOR
DESCRIPTION
ADC0
J4-1
ADC Channel 0 Input
ADC1
J4-2
ADC Channel 1 Input
ADC2
J4-3
ADC Channel 2 Input
ADC3
J4-4
ADC Channel 3 Input
ADC4
J4-5
ADC Channel 4 Input
ADC5
J4-6
ADC Channel 5 Input
ADC6
J4-12
ADC Channel 6 Input
ADC7
J4-13
ADC Channel 7 Input
ADC8
J4-14
ADC Channel 8 Input
ADC9
J4-15
ADC Channel 9 Input
ADC10
J4-16
ADC Channel 10 Input
ADC11
J4-17
ADC Channel 11 Input
LV_ADC12
J4-7
ADC Channel 12 Input
LV_ADC13
J4-8
ADC Channel 13 Input
LV_ADC14
J4-9
ADC Channel 14 Input
LV_ADC15
J4-10
ADC Channel 15 Input
LV_ADC16
J4-11
ADC Channel 16 Input
DAC Signal Pins
The 12 DAC voltage outputs of the AMC7832 device are accessible through the J5, J7, J9, and J10
connectors, as shown in Table 7. The DAC voltage ranges are configurable through software and
hardware. Table 4 describes the selectable voltage ranges and jumper configurations for JP1, JP2, JP4,
and JP5.
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Table 7. AMC7832EVM DAC Signal Connections
NAME
CONNECTOR
DESCRIPTION
DACC0
J9-1
DAC-C0 output
DACC1
J9-3
DAC-C1 output
DACD2
J10-1
DAC-D2 output
DACD3
J10-3
DAC-D3 output
DACD4
J10-5
DAC-D4 output
DACD5
J10-7
DAC-D5 output
DACB6
J7-1
DAC-B6 output
DACB7
J7-3
DAC-B7 output
DACA8
J5-1
DAC-A8 output
DACA9
J5-3
DAC-A9 output
DACA10
J5-5
DAC-A10 output
DACA11
J5-7
DAC-A11 output
Table 8. AMC7832EVM DAC Range Connections
JUMPER
DEFAULT POSITION
JP1
Shunt on 1-2
JP2
Shunt on 1-2
JP4
JP5
4.7
CONNECTION
GND
REFOUT2
GND
Shunt on 2-3
2-3: (DAC Range –10 to 0 V)
1-2: (DAC Range 0 to 5 V or 0 to 10 V)
REFOUT2
2-3: (DAC Range –10 to 0 V)
REFOUT1
1-2: (DAC Range –10 to 0 V)
GND
2-3: (DAC Range 0 to 5 V or 0 to 10 V)
REFOUT1
Shunt on 2-3
FUNCTION
1-2: (DAC Range 0 to 5 V or 0 to 10 V)
GND
1-2: (DAC Range –10 to 0 V)
2-3: (DAC Range 0 to 5 V or 0 to 10 V)
GPIO Signal Pins
The 8 GPIO signals on the EVM can be measured on the J8 header. A signal description of the J8 header
is provided in Table 9.
Table 9. AMC7832EVM GPIO Signal Definition
NAME
CONNECTOR
DESCRIPTION
GPIO0
J8-1
General Purpose I/O (GPIO0)
GPIO1
J8-2
General Purpose I/O (GPIO1)
GPIO2
J8-3
General Purpose I/O (GPIO2)
GPIO3
J8-4
General Purpose I/O (GPIO3)
GPIO4
J8-5
General Purpose I/O (GPIO4)
GPIO5
J8-6
General Purpose I/O (GPIO5)
GPIO6
J8-7
General Purpose I/O (GPIO6)
GPIO7
J8-8
General Purpose I/O (GPIO7)
NOTE: External 10-kΩ pullup resistors are required for GPIO4 to GPIO7 operation.
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5
AMC7832EVM Software Overview
This section discusses how to use the AMC7832EVM software.
5.1
Starting the AMC7832EVM Software
After the hardware connections are established and jumper settings configured, launch the software
located in the AMC7832EVM folder of the Start All Programs menu, and select the AMC7832EVM icon.
Figure 8. AMC7832EVM GUI Location
If the SDM-USB-DIG is properly connected to the AMC7832EVM, the GUI should automatically power on
the system and display CONNECTED: Power On in the upper right area of the GUI (see Figure 9).
Figure 9. AMC7832EVM GUI – Power On
If the SDM-USB-DIG has a faulty connection, or is not connected at all, the GUI launches in simulation
mode. In simulation mode, NOT CONNECTED: Simulating is displayed in the top right area of the GUI. If
this text appears while the SDM-USB-DIG device is connected, then unplug the SDM-USB-DIG and close
the GUI. Reconnect the SDM-USB-DIG, and ensure that the connectors are correctly aligned. After doing
those steps, verify the USB extender cable is properly connected to both the SDM-USB-DIG and PC, and
relaunch the GUI. This issue can also occur if the CDC driver is installed incorrectly. The AMC7832EVM
software may need to be reinstalled.
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AMC7832EVM Software Features
The following subsections describe the functionality of each page of the AMC7832EVM GUI.
5.2.1
Software Reset
The AMC7832 Software Reset button, shown in Figure 10, resets the AMC7832 device and resets all
registers to their default setting.
Figure 10. Software Reset Button
5.2.2
AMC7832EVM Low Level Configuration Page
The AMC7832EVM features a register map page that allows access to low-level communication by
directly writing to and reading from the AMC7832 device’s registers. Selecting a register on the Register
Map list presents a description of the values in that register and also displays information such as the
register’s address, default value, size, and current value. The register values can be modified through the
Hex Write Register field, or set through Boolean checkboxes in the Register Data column, as displayed in
Figure 11.
Figure 11. Low Level Configuration Page
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This low-level configuration page also provides the option to save the register map settings as a
configuration file, which is done by pressing the Save Config button. Additionally, the configuration files
can be accessed through the Load Config button.
5.2.3
AMC7832EVM ADC Page
This page provides insight into the functionality of the AMC7832 device’s (17) channel 12-bit ADC. The
ADC block includes 12 high-voltage bipolar ADC channels featuring a –12.5-V to 12.5-V input range, and
5 low-voltage unipolar analog channels that accept a range of 0-V to 5-V. The high-voltage channels are
labeled as (ADC0 through ADC11), while the low-voltage channels are printed as (LV_ADC12 through
LV_ADC16). Figure 12 displays the ADC Page.
Figure 12. ADC Page
To completely activate the ADC block, the Enable Reference Block must be enabled, along with the
Enable Internal Reference Buffer and Power ADC Block. This sequence is shown in Figure 13.
Figure 13. ADC Block Activation Sequence
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After the device is configured, individual channels can be enabled by selecting their respective ADC MUX
button, as shown in Figure 14.
Figure 14. ADC Channel MUX
To trigger conversions, press the Start Conv button or automatically trigger conversions before every read
by enabling the auto-trigger checkbox. The ADC data registers, displayed on the right side of the GUI, are
updated with the converted results when the Read ADC button is pressed.
Most of the controls listed within the ADC image are used to setup the ADC configuration register. These
include the conversion rate and conversion mode parameters, which are selectable through their
respective drop-down list. The selectable conversion rates are listed in Table 10.
Table 10. Conversion Rates
CONVERSION RATE
THROUGHPUT (ADC0 THROUGH ADC11)
(SINGLE-CHANNEL AUTO MODE)
THROUGHPUT (LVADC12 THROUGH LVADC16)
(SINGLE-CHANNEL AUTO MODE)
00
29 kSPS
87 kSPS
01
29 kSPS
43.5 kSPS
10
29 kSPS
29 kSPS
11
14.5 kSPS
14.5 kSPS
The conversion mode can be either auto or direct mode. In direct mode, the analog inputs, specified in the
ADC channel registers, are converted sequentially one time. In auto mode, the analog inputs are
converted sequentially and repeatedly. After a conversion is completed, the ADC multiplexer returns to the
first channel and repeats the process.
The internal local temperature sensor is accessible through the LT Sensor button and is updated after a
conversion is triggered and the Read ADC button is pressed.
5.2.4
AMC7832EVM DAC Page
The DAC page gives the user an interface to observe and control the different data registers, modes, and
configurations available for each individual DAC channel.
To fully activate the DAC block, set the Enable Reference Block. To set the DAC channels individually,
select their respective checkbox in the Power DACs column (see Figure 15).
16
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Figure 15. DAC Page
The 12 DAC channels are broken up into different DAC banks, where each channel within a bank shares
a common programmable voltage range, which is selectable through the Program Range column. The
default range upon startup is the 0-V to 10-V range, but it should be noted that this range is not fully
realizable because AVCC is connected to the +5-V LDO supply. For default operation, it is better to select
the 0-V to 5-V range. If the 0-V to 10-V range is desired, populate the correct shunt resistor for AVCC,
shown in Table 5, to connect the AVCC supply to +12-V.
NOTE: Special care must be taken when selecting the –10-V to 0-V range, as this requires an
external jumper modification and also requires that the user select the appropriate Output
Reference button. The Output Reference 1 button sets the negative voltage range for DAC
Banks A and B, while the Output Reference 2 button sets the negative range for DAC Banks
C and D. The DAC voltage range jumper settings are displayed in Table 8. Ensure that the
AMC7832EVM board is powered off before selecting different jumper positions.
The DAC page also displays two input fields in the Program Values column (see Figure 16).
Figure 16. Program DAC Registers
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Either one of these windows can be programmed with the desired DAC output voltage or hexadecimal
value. When these values are entered, they are instantly written to the internal DAC buffer register.
Pressing the Register Update button shifts the contents of the DAC buffer stage to the DAC latch stage,
which then updates the DAC output voltage.
The Read Back column allows the user to read back the register contents of either the latch or buffer
stage, which is selectable through the Boolean checkbox below the Read DACs button, as shown in
Figure 17. The results are read back after the Read DACs button is pressed.
Figure 17. DAC Read
5.2.5
AMC7832EVM ALARMS Page
The AMC7832 ALARMS page gives the user access to the programmable out-of-range alarms for the
internal temperature sensor and low-voltage ADC channels (ADC12 through ADC16). Figure 18 displays
the ALARMS page of the AMC7832EVM. The page displays the name of each alarm, shown in the Alarm
Name column, and provides information such as the value, high limit, low limit, and alarm status, along
with other additional options.
Figure 18. ALARMS Page
To use the ALARMS page, enable the ADC channel or temperature sensor in the ADCs page of the GUI.
Achieve this by enabling the appropriate channel’s mux. After the channels are active, the Low Limit and
High Limit fields are available to edit (see Figure 19).
18
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Figure 19. Enable Low Limit and High Limit Fields
The Write Settings button is used to write the values from the Low Limit and High Limit fields into the
device. The Read Alarm button is used to read the state of the active channels. When an alarm is
triggered, the Alarm Status will display the text ‘Tripped’ in red. If the channel values are within the range
of the alarm thresholds the status will display ‘No Alarm’ in black text.
Figure 20 displays the False Alarm protection, CH-FALR-CT drop-down list, which contains integer values
that are related to the consecutive number of samples required for the alarm to activate. The list defaults
to 16 consecutive samples, and therefore requires 16 conversions with an over range value before the
alarm is triggered.
Figure 20. CH-FALR-CT Menu
The CLR, ALARM OUT, and DACs to CLR column, as shown in Figure 21, allow the user to tie DAC
output behavior to alarm events. By selecting the CLR checkbox, the alarm events are able to force the
DACs into a clear state, regardless of which DAC operation mode is active, auto or manual. The DAC
channels to clear are selectable under the DACs to CLR column.
Figure 21. Clear DAC Options
The ALARM OUT checkbox allows the device to create an external signal on GPIO1 that goes low (active)
when an alarm event is detected. The general-purpose I/O, more specifically GPIO1 must be configured
for ALARMOUT for this function to take effect.
The ALARMIN-ALR checkbox gives the user the ability to clear the DACs with an active low input signal
through GPIO0. Just as with GPIO1, GPIO0 must be configured for ALARMIN for this function to take
effect.
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The ALARMIN-ALR-OUT checkbox enables the propagation of alarm signals by allowing the user to input
an active-low signal to the ALARMIN pin, which then creates an active low signal on the ALARMOUT pin.
These functions need to be set in the GPIO configuration register, which is available for configuration in
the GPIO page of the AMC7832EVM GUI.
5.2.6
AMC7832EVM GPIO Page
The AMC7832 GPIO page features the first four (GPIO0 to GPIO3) general-purpose I/O of the AMC7832
device. These four GPIOs are also configurable for other specific functions, including the ability to
externally trigger conversions, enable alarms, and provide an output indicating conversion completion. The
GPIO page also provides a detailed description textbox that gives more information about the different
GPIO pins as the user hovers over the pulldown list under the GPIO Block column (see Figure 22).
Figure 22. GPIO Page
Use the GPIO Block section of the GPIO tab, as shown in Figure 23, to set the various GPIO functions.
The drop-down menu defaults to general-purpose I/O. To perform a write or read, set the W/R Function
pulldown to either Write or Read. The W/R value enables the user to input or observe the Boolean value
of the GPIO register. Press the Generate Write/Read button to write to or read from the GPIO pin.
20
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Figure 23. GPIO Write or Read
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6
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AMC7832EVM Documentation
This section contains the schematic diagrams and complete bill of materials for the AMC7832EVM. Documentation information for the SDM-USBDIG platform can be found in the SDM-USB-DIG Platform User’s Guide, SBOU136, available at the TI website at www.ti.com.
6.1
AMC7832EVM Board Schematic
USE WALL WART
T1094-P5P-ND
Vsupply = 19 to 30 V
Vsupply
U1
26
1
C1
22 μF
3
2
C2
4.7 μF
C3
4.7 μF
R1
R4
49.9 kΩ 174 kΩ
27
R5
SS/TR
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
STSEL
VADJ
INH/UVLO
178k 31
RT/CLK
1
PJ-102A
VIN
D1
MMSZ4689-V
5.1 V
R6
R7
24.9 kΩ 13.7 kΩ
CSS1 DNI 28
RSS1 DNI 29
2
GND
35
GND
AGND
PWRGD
AGND
6
7
21
22
23
24
38
41
PWR_FAULT
AGND
AGND
AGND
AGND
AGND
AGND
AGND
AGND
GND_PT
GND_PT
PGND
PGND
PGND
PGND
PGND
PGND
PH
PH
PH
PH
PH
PH
PH
PH
2
3
25
DNC
DNC
DNC
POS14V
10
11
12
13
14
15
39
C4
47μF
C5
47 μF
C6
10 μF
GND
1
4
5
30
32
33
34
37
9
8
16
17
18
19
20
40
C7
1 μF
15
16
R2
DNI
13
GND
RSET1
165 kΩ
36
U2
DNI
R8
Vdut
AGND
4
5
6
8
9
10
11
12
0
R9
0
R10
DNI
IN
IN
OUT
OUT
EN
SENSE
NR
6P4V2
6P4V1
3P2V
1P6V
0P8V
0P4V
0P2V
0P1V
NC
NC
NC
NC
GND
PAD
1
20
+12_LDO
C8
47 μF
3
R3
750 Ω
C9
10 μF
+12 V to EVM
GND
14
D2
Green
19
18
17
2
C10
1 μF
7
GND
TPS7A4700RGW
GNDs meet here
J1
GND
R11
0
R12
DNI
R13
0
R14
DNI
R15
0
R16
DNI
LMZ35003RKG
GND
GND
U3
15
16
C11
10 μF
C16
C17
4.7 μF
C18
4.7 μF
2.2 μF
R17
DNI
R19
Vdut
GND
Vsupply
C12
1 μF
13
R26
174 kΩ
26
27
31
R29
13.7 kΩ
29
DNI
CSS2
RSS2 DNI
28
6
7
21
22
23
24
38
41
VIN
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
INH/UVLO
CLK
STSEL
RT
VOUT_PT
VOUT_PT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
A_VOUT
VADJ
2
3
25
35
GND
GND
GND
GND
GND
GND
GND
DNC
DNC
DNC
DNC
EN
SENSE
1
20
+5_LDO
C13
47 μF
3
C14
10 μF
R18
300 Ω
R20
DNI
R21
DNI
R22
0
R23
DNI
R24
DNI
R25
0
R27
DNI
R28
DNI
4
5
6
8
9
10
11
12
NR
6P4V2
6P4V1
3P2V
1P6V
0P8V
0P4V
0P2V
0P1V
+5 V to EVM
NC
NC
NC
NC
GND
PAD
GND
14
D3
Green
C15
1 μF
19
18
17
2
GND
7
TPS7A4700RGW
GND
16
17
18
19
20
40
30
GND
SS
PH
PH
PH
PH
PH
PH
PH
PH
OUT
OUT
0
U4
GND
IN
IN
8
9
1
4
5
32
33
34
37
U5
NEG14V
C19
47 μF
15
16
C20
47 μF
C23
10 μF
GND
36
R30
DNI
C24
1 μF
GND
RSET2
165 kΩ
10
11
12
13
14
15
39
Vdut
GND
R34
0
R35
4.99 kΩ
13
4
5
6
8
9
10
11
12
IN
IN
OUT
OUT
EN
FB
NR/SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
GND
PAD
TPS7A3301RGW
Vout
1
20
3
–12_LDO
C21
1 μF
C22
47 μF
R31
1.5 MΩ
R33
162 kΩ
14
C25
10 μF
R32
750 Ω
C26
1 μF
19
18
17
2
–12 V to EVM
GND
D4
Green
GND
7
GND
GND
LMZ34002RKG
GND
GND
22
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TP2
TP3
TP4
TP5
AVEE
TP1
JP1
1
+5_LDO
TP6
C27
10 μF
JP3
C28
1 μF
GND
1
C29
0.1 μF
3
GND
R37
AVss_B
JP2
AVDD
2
4
R39
AVss_D
C30
0.1 μF
GND
C31
0.1 μF
C32
0.1 μF
0
0
R38
AVss_C
2
1
3
1
2
2
J2
AVDD
GND
0
R36
AVss_A
3
0
C33
0.1 μF
GND
DACC1
DACC0
AVss_C
GND
C34
59
0.1 μF
57
54
52
53
56
DVDD
64
63
60
58
62
U6
AMC7832IPAP
61
TP7
55
DACD5
DACD4
DACD3
DACD2
AVss_D
AVCC
R40
0
C35
C36
C37
C38
C39
C40
C41
C42
C43
C44
C45
GND
R48
AVCC
C53
0.1 μF
1
2
3
GND
32
REF_CMP
C65
0.1 μF
AVEE
17
AVEE
TP9
GND
R73
0W
C66
65
AVEE
DAP
0.1 μF
21
DACA11
DACA10
DACA9
DACA8
AVss_A
GND
GND
–12_LDO
0W
AGND3
DACC_0
DACC_1
AVSS_C
AVCC_CD
25
DNI
R42
0
R45
0
R47
0
R52
0
R57
0
R61
0
R65
0
R69
0
R41
0
R43
0
R46
0
R50
0
R54
0
R59
0
R63
0
R67
R71
0
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
AVDD
C54
34
31
C60
0.1 μF
C61
0.1 μF
C55
C56
C57
C58
J4
C59
470 pF 470 pF 470 pF 470 pF 470 pF 470 pF
THERM1
33
GND
GND
23
R75
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
TP10
30
DNI
18
19
22
24
20
R74
AGND2
AVCC_AB
C64
1 μF
AVDD2
AVDD1
REF_CMP
C62
4.7 μF
DACB_7
DACB_6
AVSS_B
C63
10 μF
RESET
SDO
SDI
SCLK
CS
GPIO0/ALARMIN
GPIO1/ALARMOUT
GPIO2/ADCTRIG
GPIO3/DAV
GPIO4
GPIO5
GPIO6
GPIO7
REF_OUT1
GND
4
5
6
7
8
9
10
11
12
13
14
15
16
27
DACB7
29
DACB6
28
AVss_B
J3
C52
1 μF
/RESET
0
0
0
0
0
0
0
0
0
0
0
0
VRANGE_B
C51
10 μF
R49
R51
R53
R56
R58
R60
R62
R64
R66
R68
R70
R72
ADC_0
ADC_1
ADC_2
ADC_3
ADC_4
ADC_5
LV_ADC12
LV_ADC13
LV_ADC14
LV_ADC15
LV_ADC16
ADC_6
ADC_7
ADC_8
ADC_9
ADC_10
ADC_11
DGND
VRANGE_A
0W
AVCC
GND
AVEE
SDO
SDI
SCLK
CS
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
TP8
0W
R55
IOVDD
26
DNI
1
DACA_11
DACA_10
DACA_9
DACA_8
AVSS_A
+5_LDO
C50
0.1 μF
DNI R44
470 pF 470 pF 470 pF 470 pF 470 pF 470 pF 470 pF 470 pF 470 pF 470 pF 470 pF GND
AGND1
GND
+12_LDO
DVDD
REF_OUT2
3
VRANGE_C
2
C49 IOVDD
0.1 μF
DACD_5
DACD_4
DACD_3
DACD_2
AVSS_D
C48
0.1 μF
C47
1 μF
VRANGE_D
GND
DVDD
C46
10 μF
GND
C67
C73
DNI
C68
DNI
C69
DNI
C70
DNI
C71
DNI
C72
DNI
0.1 μF
AVCC
GND
DACA8
IOVDD
TP12
2
TP11
R78
R79
R80
R81
3
1
3
5
7
9
11
13
15
17
19
1
I2C_CLK
DACA11
3
1
DACB6
JP5
DACB7
GND
TP17
3
TP18
2
4
6
8
10
12
14
DVDD
U7
4
C74
10 μF
I2C_CLK
I2C_SDA
C75
1 μF
C76
0.1 μF
C77
DNI
GND
0
R84
0
R85
0
R86
0
R87
0
R88
0
R89
0
R90
0
R91
0
R92
0
J5
1
2
3
4
J7
1
2
3
4
J9
1
2
3
4
5
6
7
8
J10
V+
VO
NC
GND
3
1
DACD5
AMC7832EVM User’s Guide
23
THERM1
C78
DNI
DNI
C79
DNI
C80
DNI
C81
DNI
C82
DNI
C83
DNI
TP19 TP20 TP21 TP22 TP23
Vdut
SCLK
Vdut
R83
1
2
3
4
5
6
7
8
2
5
1
3
5
7
9
11
13
DACD2
DACD4
IOVDD
2
1
Vdut
SDO
SDI
CS
DACC1
DNI -Temperature Circuit -User Option
J11
1
2
DACC0
DACD3
JP6
IOVDD
GND
0
J8
1
2
3
4
5
6
7
8
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
GND
J12
0
R77
GND
CS
SDO
TP15 TP16
R76
TP13
I2C_SDA
/RESET
SDI
Vdut
SCLK
TP14
DACA10
JP4
2
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GPIO5
GPIO6
GPIO7
R82
10.0 kΩ
10.0 kΩ
10.0 kΩ
10.0 kΩ
10.0 kΩ
J6
2
4
6
8
10
12
14
16
18
20
DACA9
GND
GND
GND
GND
GND
GND
Figure 24. Board Schematic
SLAU544A – February 2014 – Revised September 2016
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6.2
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AMC7832EVM PCB Components Layout
Figure 25 shows the layout of the components for the AMC7832EVM board.
Figure 25. AMC7832EVM PCB Components Layout
24
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6.3
AMC7832 Test Board Bill of Materials
Table 11. Bill of Materials
ITEM
QTY
REF DES
DESCRIPTION
1
1
Printed Circuit Board
Any
6573508
2
1
C1
CAP, AL, 22uF, 35V, ±20%, 1 ohm, SMD
Panasonic
EEE-FC1V220P
3
4
C2, C3, C17, C18
CAP, CERM, 4.7uF, 50V, ±10%, X7R, 1210
MuRata
GRM32ER71H475KA88L
4
7
C4, C5, C8, C13, C19,
C20, C22
CAP, CERM, 47uF, 16V, ±10%, X5R, 1210
MuRata
GRM32ER61C476KE15L
5
11
C6, C9, C11, C14, C23,
CAP, CERM, 10uF, 25V, ±10%, X5R, 1210
C25, C27, C46, C51, C63,
C74
MuRata
GRM32DR61E106KA12L
6
12
C7, C10, C12, C15, C21, CAP, CERM, 1uF, 25V, ±10%, X5R, 0603
C24, C26, C28, C47, C52,
C64, C75
MuRata
GRM188R61E105KA12D
7
1
C16
MuRata
GRM32ER72A225KA35L
8
16
C29, C30, C31, C32, C33, CAP, CERM, 0.1uF, 50V, ±10%, X7R, 0603
C34, C48, C49, C50, C53,
C60, C61, C65, C66, C67,
C76
MuRata
GCM188R71H104KA57B
9
17
C35,
C40,
C45,
C58,
C36, C37, C38, C39, CAP, CERM, 470pF, 50V, ±10%, X7R, 0603
C41, C42, C43, C44,
C54, C55, C56, C57,
C59
Kemet
C0603C471K5RACTU
10
1
C62
CAP, CERM, 4.7uF, 10V, ±10%, X5R, 0603
Kemet
C0603C475K8PACTU
11
0
C68, C69, C70, C71, C72, DNI
C73, C77, C78, C79, C80,
C81, C82, C83, CSS1,
CSS2
12
1
D1
Diode, Zener, 5.1V, 500mW, SOD-123
VishaySemiconductor
MMSZ4689-V
13
3
D2, D3, D4
LED, Green, SMD
Lumex
SML-LX0603GW-TR
14
1
J1
Connector, DC Jack 2.1X5.5 mm, TH
CUI Inc.
PJ-102A
15
2
J2, J11
Terminal Block, 6A, 3.5mm Pitch, 2-Pos, TH
On-Shore
Technology
ED555/2DS
16
1
J3
Terminal Block, 6A, 3.5mm Pitch, 3-Pos, TH
On-Shore
Technology
ED555/3DS
17
1
J4
Header, 100mil, 17x1, Vertical, Gold, TH
Samtec
TSW-117-08-G-S
18
3
J5, J8, J10
Header, TH, 100mil, 8x1, Gold plated, 230 mil Samtec, Inc.
above insulator
TSW-108-07-G-S
19
1
J6
Receptacle, 50mil 10x2, R/A, TH
853-43-020-20-001000
20
2
J7, J9
Header, TH, 100mil, 4x1, Gold plated, 230 mil Samtec, Inc.
above insulator
TSW-104-07-G-S
21
1
J12
Header, 100mil, 7x2, Vertical, Gold, SMT
TSM-107-02-L-DV-P
22
5
JP1, JP2, JP4, JP5, JP6
Header, TH, 100mil, 3x1, Gold plated, 230 mil Samtec
above insulator
TSW-103-07-G-S
23
1
JP3
Header, TH, 100mil, 2x2, Gold plated, 230 mil Samtec
above insulator
TSW-102-07-G-D
24
1
R1
RES, 49.9k ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-0749K9L
25
0
R2, R10, R12, R14, R16, DNI
R17, R20, R21, R23, R24,
R27, R28, R30, R44, R55,
R73, R74, RSS1, RSS2
26
2
R3, R32
RES, 750 ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW0603750RFKEA
27
2
R4, R26
RES, 174k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW0603174KFKEA
28
1
R5
RES, 178k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW0603178KFKEA
29
1
R6
RES, 24.9k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060324K9FKEA
CAP, CERM, 2.2uF, 100V, ±10%, X7R, 1210
MANUFACTURER
Mill-Max
Samtec
SLAU544A – February 2014 – Revised September 2016
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Copyright © 2014–2016, Texas Instruments Incorporated
PART NUMBER
AMC7832EVM User’s Guide
25
AMC7832EVM Documentation
www.ti.com
Table 11. Bill of Materials (continued)
ITEM
QTY
30
2
R7, R29
RES, 13.7k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060313K7FKEA
31
57
R8, R9, R11, R13, R15,
R19, R22, R25, R34, R36
- R43, R45 - R54, R56 R72, R75, R76, R77, R83
- R92
RES, 0 ohm, 5%, 0.1W, 0603
Panasonic
ERJ-3GEY0R00V
32
1
R18
RES, 300 ohm, 1%, 0.1W, 0603
Yageo America
RC0603FR-07300RL
33
1
R31
RES, 1.5Meg ohm, 5%, 0.125W, 0805
Vishay-Dale
CRCW08051M50JNEA
34
1
R33
RES, 162k ohm, 1%, 0.125W, 0805
Vishay-Dale
CRCW0805162KFKEA
35
1
R35
RES, 4.99k ohm, 1%, 0.25W, 1206
Vishay-Dale
CRCW12064K99FKEA
36
5
R78, R79, R80, R81, R82
RES, 10.0k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW060310K0FKEA
37
2
RSET1, RSET2
RES, 165k ohm, 1%, 0.1W, 0603
Vishay-Dale
CRCW0603165KFKEA
38
8
TP1, TP9, TP11, TP12,
TP13, TP14, TP15, TP16
Test Point, TH, Miniature, Yellow
Keystone
5004
39
10
TP2, TP3, TP4, TP5, TP6, Test Point, TH, Miniature, Red
TP7, TP8, TP10, TP17,
TP18
Keystone
5000
40
5
TP19, TP20, TP21, TP22,
TP23
Test Point, TH, Miniature, Black
Keystone
5001
41
1
U1
7-V to 50-V Input, 2.5-A Step-Down,
Integrated Power Solution, RKG0041A
Texas Instruments
LMZ35003RKG
42
2
U2, U3
36-V, 1-A, 4.17-µVRMS, RF LDO Voltage
Regulator, RGW0020A
Texas Instruments
TPS7A4700RGW
43
1
U4
4.5-V to 40-V Input, 15-W, Negative Output,
Integrated Power Solution, RKG0041A
Texas Instruments
LMZ34002RKG
44
1
U5
–36-V, –1-A, Ultralow-Noise Negative Voltage
Regulator, Adjustable, RGW0020A
Texas Instruments
TPS7A3301RGW
45
1
U6
12-Bit ANALOG MONITOR AND CONTROL
(AMC) SOLUTION with Multichannel ADC,
Bipolar DACs and Temperature Sensors,
PAP0064G
Texas Instruments
AMC7832IPAP
46
0
U7
DNI
47
6
SH-JP1, SH-JP2, SH-JP3, Shunt, 100mil, Gold plated, Black
SH-JP4, SH-JP5, SH-JP6
3M
969102-0000-DA
48
4
H1, H2, H3, H4
3M
SJ-5303 (CLEAR)
26
REF DES
AMC7832EVM User’s Guide
DESCRIPTION
Bumpon, Hemisphere, 0.44 X 0.20, Clear
MANUFACTURER
PART NUMBER
DNI
SLAU544A – February 2014 – Revised September 2016
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Copyright © 2014–2016, Texas Instruments Incorporated
Revision History
www.ti.com
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (February 2014) to A Revision .................................................................................................. Page
•
•
•
•
•
•
•
•
•
Deleted row "+24-V wall supply" from Table 1, and added Note 1. ................................................................ 3
Changed text "An optional +24-V wall supply..." in Section 2 ....................................................................... 4
Changed "+24-V Wall Adapter" block in Figure 1 ..................................................................................... 4
Changed "Default" and "Optional" blocks in Figure 2 ................................................................................ 4
Added Note 1 to Table 4 ................................................................................................................. 9
Changed the second paragraph in Section 4.4 ...................................................................................... 10
Changed the DEFAULT POSITION of R48, R55, R73, and R75 in Table 5..................................................... 11
On the second page of the schematic; removed 'DNI' label and added '0 Ω' label to R55 and R73, added 'DNI' label to
R48 and R75. ............................................................................................................................ 22
Updated Figure 25. ...................................................................................................................... 24
SLAU544A – February 2014 – Revised September 2016
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Copyright © 2014–2016, Texas Instruments Incorporated
Revision History
27
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
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FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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