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Texas Instruments DAC8x11 EVM Users (Rev. A) User guides
User's Guide
SLAU299A – November 2009 – Revised April 2016
DAC8x11 EVM
This document describes the setup and operation of the DAC8x11 Evaluation Module (EVM). It also
discusses the DAC eXerciser Program, a software tool used with the DAC8x11 EVM. Included are the
EVM schematic, bill of materials, and board layout.
1
2
3
4
5
6
7
8
Contents
EVM Overview ............................................................................................................... 2
1.1
Introduction .......................................................................................................... 2
Analog Interface.............................................................................................................. 2
Digital Interface .............................................................................................................. 3
Power Supplies .............................................................................................................. 3
4.1
DAC Power .......................................................................................................... 3
4.2
Stand-Alone Operation ............................................................................................. 3
EVM Operation ............................................................................................................... 4
5.1
Analog Output ....................................................................................................... 4
5.2
Digital Control ....................................................................................................... 4
5.3
SYNC ................................................................................................................. 4
5.4
Default Jumper Locations.......................................................................................... 4
Using the DAC8x11 EVM With DXP ..................................................................................... 4
6.1
Hardware............................................................................................................. 5
6.2
MMB0 Power Supplies ............................................................................................. 5
6.3
Software – Running DXP .......................................................................................... 6
6.4
DAC Output Update Options ...................................................................................... 7
Bill of Materials and EVM Schematic ..................................................................................... 8
7.1
Bill of Materials ...................................................................................................... 8
7.2
EVM Schematic ..................................................................................................... 9
Related Documentation from Texas Instruments ...................................................................... 10
List of Figures
.....................................................................................
.................................................................................
DAC8x11 EVM – Frequency/Amplitude and Update Rate Adjustments .............................................
DAC Output Update Options ...............................................................................................
DAC8x11 EVM ...............................................................................................................
1
MMB0 With DAC8x11 EVM Installed
5
2
Loading a DAC8x11 EVM Configuration
6
3
4
5
7
7
9
List of Tables
1
Analog Interface.............................................................................................................. 2
2
Digital Control ................................................................................................................ 3
3
J3 Power Input ............................................................................................................... 3
4
EVM Default Jumper Settings .............................................................................................. 4
5
Output Update Features .................................................................................................... 8
Microsoft, Windows are registered trademarks of Microsoft Corporation.
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DAC8x11 EVM
1
EVM Overview
1
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EVM Overview
Features
• Full-featured evaluation board for a variety of single-channel, 6-pin DAC8x11, 6- to 14-bit, serial input,
digital-to-analog converters
• Onboard reference and buffer circuits
• High-speed serial interface
• Modular design for use with a variety of DSP and DAC8x11 controller interface boards
1.1
Introduction
The DAC8x11 Evaluation Module is an evaluation board containing all the necessary components to
evaluate the 6-pin, SC70 series of high-performance, digital-to-analog converters from Texas Instruments.
The EVM is designed so that a single printed-circuit board (PCB) supports the entire family of high-speed,
12- and 16-bit serial DACs.
The modular EVM form factor allows for direct evaluation of the DAC's performance and operating
characteristics. This EVM is compatible with the 5-6K Interface Board (SLAU104) from Texas Instruments
as well as the HPA-MCU Interface Board (SLAU106). As part of a DAC8x11EVM-PDK kit, this EVM is
supported on the DXP Platform using the modular motherboard MMB0.
2
Analog Interface
For maximum flexibility, the DAC8x11 evaluation module (EVM) is designed for easy interfacing to multiple
analog sources. Samtec part numbers SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a
convenient 10-pin, dual-row, header/socket combination at J2 (Table 1). This header/socket provides
access to the analog input pins of the ADC. Consult Samtec at www.samtec.com, or call 1-800-SAMTEC9 for a variety of mating connector options.
Features:
• Full-featured evaluation board for a variety of single-channel, 6-pin DAC8x11, 6- to 14-bit, serial input,
digital-to-analog converters
• Onboard reference and buffer circuits
• High-speed serial interface
• Modular design for use with a variety of DSP and DAC8x11 controller interface boards
Table 1. Analog Interface
2
Pin Number
Signal
J2.2
DAC OUT_A12
J2.4
Unused
J2.6
Unused
J2.8
DAC OUT_A2
J2.10
Unused
J2.12
Unused
J2.14
Unused
J2.16
Unused
Description
Single DAC out option via JP3
Single DAC out option via JP3
J2.18
REF(-)
Unused
J2.20
REF(+)
External reference source input (2.5 V nominal, 2.525 V maximum)
J2.15
Unused
J2.1–J2.19 (odd)
AGND
DAC8x11 EVM
Analog ground connections (except J2.15)
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3
Digital Interface
The DAC8x11 EVM is designed for easy interfacing to multiple control platforms. Samtec part numbers
SSW-110-22-F-D-VS-K and TSM-110-01-T-DV-P provide a convenient 10-pin, dual-row, header/socket
combination at J1. This header/socket provides access to the digital control and serial data pins of the
DAC8x11 EVM. Consult Samtec at www.samtec.com or 1-800-SAMTEC-9 for a variety of mating
connector options.
Table 2. Digital Control
Pin Number
Signal
J1.1
CS
J1.3
SCLK
J1.5
SCLK(R)
J1.7
FS
Description
Active-low input to SYNC enables data transfer – jumper configurable (see schematic) via JP1
Serial clock
Serial clock return (for DSP host systems)
Frame synchronization for DSP host systems – default SYNC input through JP1 (see schematic)
J1.9
FS(R)
J1.11
DX
Frame synchronization return (for DSP host systems)
Serial data input
J1.13
DR
Serial data return (for DSP host systems)
J1.4
J1.10
GND
System (EVM) ground
J1.18
4
Power Supplies
The DAC8x11 EVM board requires a single, +5-VDC power supply for proper operation. This 5-V supply
powers the voltage reference (U2) and the external reference buffer (U3). When used in combination with
one of the DAP interface boards, J3 provides connection to the common power bus described in
document SLAA185. Table 3 shows the pinout of J3.
Table 3. J3 Power Input
Signal
Pin Number
Signal
Unused
1
2
Unused
+5VA
3
4
Unused
GND
5
6
GND
Unused
7
8
Unused
Unused
9
10
Unused
When power is supplied to J3, JP2 allows for one of two different DC voltages to be applied to the DAC
installed on the EVM. Review the schematic and PCB silkscreen for details.
4.1
DAC Power
JP2 allows the user to select the power supply used by the DAC installed in position U1 on the EVM. The
series of DACs supported on this EVM use a single input as both power and reference voltages. When
JP2 is in the default factory position (shunt on pins 1-2), power to the DAC comes from a precision 4.096V reference. When the shunt on JP2 is moved to pins 2-3, the user may apply an external
power/reference source to the DAC via J2 pin 20.
4.2
Stand-Alone Operation
When used as a stand-alone EVM, the analog power can be applied directly to J3 pin 3 referenced to pin
5. Optimal performance of the EVM requires a clean, well-regulated power source.
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3
EVM Operation
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CAUTION
The DACs that are compatible with this EVM have a variety of power supply
requirements. Check the appropriate data sheets, and verify all power supplies
are within the safe operating limits of the converter before applying power to
the EVM.
5
EVM Operation
5.1
Analog Output
The analog output from the EVM is applied directly to J2 (top or bottom side) via jumper JP3. The default
condition of the jumper has a shunt placed between pins 1-2, which applies the analog output to J2 pin 2.
Moving the shunt on JP3 to cover pins 2-3 applies the analog output to J2 pin 10.
5.2
Digital Control
The digital control signals can be applied directly to J1 (top or bottom side). The DAC8x11 EVM can also
be connected directly to a DSP or microcontroller capable of supplying the necessary serial control inputs.
Visit the product folder for the EVM or the installed device for a current list of compatible interface and/or
accessory boards.
5.3
SYNC
Jumper JP1 is provided to allow the source selection of the signal applied to the SYNC input of the DAC
installed on the EVM. The factory default condition for the EVM is to place a shunt jumper between pins 12 of JP1. This allows the Frame Sync (FS) signal from DSP host systems to be used as the SYNC input to
the DAC. This signal originates from J1.7. When the shunt on JP1 is moved to pins 2-3, a GPIO input
applied via J1.1 can be used to control the SYNC input to the DAC. This feature allows the possibility of
sharing the SPI bus with up to two DAC8x11 EVMs by stacking the boards together.
5.4
Default Jumper Locations
Table 4 provides a list of jumpers found on the EVM and their factory default conditions.
Table 4. EVM Default Jumper Settings
Jumper
6
Shunt Position Jumper Description
JP1
Pins 1-2
Controls SYNC (default is J1.7)
JP2
Pins 1-2
Controls DAC power/reference (default is U2, 4.096 V)
JP3
Pins 1-2
Controls analog output voltage (default is J2.2)
Using the DAC8x11 EVM With DXP
The DAC8x11 EVM is compatible with the DAC eXerciser Program (DXP) from Texas Instruments. DXP is
a tool that can generate the necessary control signals required to output various signals and waveforms
from the device installed on the DAC8x11 EVM. The DAC8x11 EVM-PDK kit combines one of the
DAC8411, DAC8311, DAC7311, DAC6311, or the DAC5311 EVM boards with the DSP-based modular
motherboard MMB0. The kit includes the DXP software for evaluation using any available USB port on a
Microsoft ® Windows® XP-based computer.
DXP is a program for controlling the digital input signals such as the clock, SYNC, and SDI. Wave tables
are built into the DSP software to allow Sine, Ramp, Triangle, and Square wave signals to be generated
by the DAC8x11. Straight DC outputs can also be obtained.
The DAC8x11 EVM-PDK is controlled by loading a DAC EVM configuration into the MMB0. For complete
information about installing and configuring DXP, see the DXP User's Guide, available for download from
the TI Web site. This section covers the specific operation of the DAC8x11 EVM-PDK.
4
DAC8x11 EVM
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6.1
Hardware
The hardware consists of two main components: the first is the DAC8x11 EVM itself and the other is a
modular motherboard called the MMB0. The MMB0 board houses a TMS320VC5507 DSP which controls
the serial interface to the device loaded on the EVM board.
The hardware needs to be configured such that the DAC8x11 EVM is plugged onto the MMB0 aligning
female connectors P1, P2, and P3 (bottom side of the DAC8x11 EVM) with male connectors J4, J7, and
J5 on the MMB0.
CAUTION
Exercise caution when assembling the DAC8x11 EVM and MMB0 boards as it
is possible to misalign the connectors.
Do not connect the MMB0 to your PC before installing the DXP software as described in the DXP User’s
Guide. Installing the software ensures that the necessary drivers are properly loaded to run the hardware.
Figure 1. MMB0 With DAC8x11 EVM Installed
6.2
MMB0 Power Supplies
Several power connections are required for the hardware to work properly. For the MMB0, a 6-V AC/DC
converter is all that is necessary. Ensure that J12 on the MMB0 board is closed before connecting the
AC/DC adapter to the DC In connector of the MMB0. This supply provides all power to the digital portion
of the DAC8x11 EVM as well as all necessary power for the DSP. Clean, well-regulated analog power for
the DAC8x11 EVM must be supplied externally via J14 – a 6-position screw terminal mounted in the lower
left corner of the MMB0 board.
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CAUTION
When using external power supplies applied to J14 on the MMB0, ensure that
all shorting blocks from J13 are completely removed. Permanent damage to the
MMB0 may occur otherwise.
From left to right, the J14 screw terminal connections are –VA, +VA, +5VA, -5VA, +5VD, and GND. The
DAC8x11 board has power requirements as described in Section 4. The analog +5VA may be applied
directly to the screw terminals at J14 on the MMB0 (referenced to the GND terminal).
For convenience to the DAC8x11 EVM user, the +5VA required for the analog power to the EVM may be
provided through the MMB0. This can be accomplished by placing a shunt jumper on J13B (+5 to +5VA),
which connects the digital 5-V supply to the analog supply input. Due to switching noise, overall
performance of the device installed on the EVM may be compromised.
6.3
Software – Running DXP
Install DXP on a laptop or personal computer running Windows XP or Windows 7 as per the detailed
instruction in the DXP User's Guide (SBAU146). Run the DXP program by clicking on the DXP icon on
your desktop, or by browsing to your installation directory.
Before you can generate signals with DXP, a DAC EVM configuration file must be loaded. To load a
configuration file, select the desired DAC from the configuration list under the DAC menu. Choose the
DAC configuration file for the device installed on the EVM as shown in Figure 2.
Figure 2. Loading a DAC8x11 EVM Configuration
6
DAC8x11 EVM
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The DXP software defaults to output a 1-kHz sine wave from the DAC; other waveform options include
Square, Saw tooth, Triangle, and DC output options as described in the DXP User's Guide. The frequency
and amplitude of the output waveform is controlled by sliders on the DXP interface. The DAC update rate
can also be modified as shown in Figure 3.
Figure 3. DAC8x11 EVM – Frequency/Amplitude and Update Rate Adjustments
6.4
DAC Output Update Options
The DXP software also allows the user to choose several DAC output update options. These are shown in
Figure 4.
Figure 4. DAC Output Update Options
Details on these options are shown in Table 5.
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Bill of Materials and EVM Schematic
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Table 5. Output Update Features
Options
Detailed Description
Frame Sync
The DXP software defaults to Frame Sync update mode. In this mode, the SYNC input of the DAC loaded on the
EVM is controlled by the Frame Sync output of the MMB0. JP1 on the DAC8x11 EVM must be shorted pins 1-2 to
use this option.
Latch with DSP Timer
N/A
Latch with External
Timer
N/A
Update Rate
User Input – enter the desired DAC update rate, 1MSPS is the default
7
Bill of Materials and EVM Schematic
The following table contains a complete bill of materials for the DAC8x11 EVM. The schematic diagram is
also provided for reference.
7.1
Bill of Materials
Designators
Description
Manufacturer
Mfg. Part Number
C1, C2
0.1 µF, 0603, Ceramic, 50V, X7R, 10%
Murata
GRM188R71H104KA93D
C3
0.47 µF, 0603, Ceramic, 25V, X7R, 10%
Murata
GRM188R71E474KA12D
C4, C6
1 µF, 0603, Ceramic, 16V, X5R, 10%
TDK
C1608X5R1C105K
C5
10 µF, 0805, Ceramic, 10V, X5R, 10%
Taiyo Yuden
LMK212BJ106KD-T
C7
10 µF, 0603, Ceramic, 6.3V, X5R, 20%
TDK
C1608X5R0J106M
J1 J2 (Top Side)
10 Pin, Dual Row, SM Header (20 Pos.)
Samtec
TSM-110-01-T-DV-P
J3 (Top Side)
5 Pin, Dual Row, SM Header (10 Pos.)
Samtec
TSM-105-01-T-DV-P
J1 J2 (Bottom Side)
10 Pin, Dual Row, SM Header (20 Pos.)
Samtec
SSW-110-22-F-D-VS-K
J3 (Bottom Side)
5 Pin, Dual Row, SM Header (10 Pos.)
Samtec
SSW-105-22-F-D-VS-K
JP1, JP2, JP3
3 Pin 0.1inch, Header
Samtec
TSW-103-07-T-S
R1
NI
R2
10 kΩ, 0603, 1/10W, 1%
Yageo
RC0603FR-0710KL
R3, R4, R8, R9, R10
NI
R5, R6, R7, R11
0 Ω, 0603, 1/10W, 5%
Yageo
RC0603JR-070RL
R12
1.5 Ω, 0603, 1/10W, 5%
Yageo
RC0603JR-071R5L
TP1
TEST POINT PC MINI 0.040" D RED
Keystone
5000
TP2, TP3
TEST POINT PC MINI 0.040" D BLACK
Keystone
5001
U1
Various – See
TI
Various
U2
IC PREC V-REF 4.096V LN 8-SOIC
TI
REF5040AID
U3
IC OPAMP GP R-R 44MHZ SOT23-5
TI
OPA353NA/250
(1)
8
(1)
The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best performance. U1 may
be replaced with any device listed in the EVM Compatible Device Data Sheets table found at the end of this document.
DAC8x11 EVM
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7.2
EVM Schematic
Figure 5 illustrates the DAC8x11 EVM schematic.
+5VA
R3
NI
C4
1uF
R1
R4
NI
5
NI
U2
REF5040ID
R2
1
10K
JP2
6
3
1
4
C7
TP1
OPA353
2
AVdd
OUT TRIM
TEMP V+
NC
NC
NC
GND
U3
3
+5VA
5
2
8
7
1uF
C5
0.1uF
10uF
C3
0.1uF
0.47@F
4
C1
C2
C6
R11
0
1uF
TP3
U1
J2
1
3
5
7
9
11
13
15
17
19
4
2
4
6
8
10
12
14
16
18
20
OUT_A1
AVDD/VREF SYNC
1
/SYNC
R5
SCLK
R7
JP3
OUT_A
6
Vout
SCLK
GND
DIN
2
3
DIN
DAC8411
DAC8311
DAC7311
DAC6311
DAC5311
OUTPUT HEADER
+3.3VD+1.8VD +5VA
J1
R6
0
R9
R10
DUT
+REFin
JP1
0
R8
OUT_A2
5
0
VCC
CS
CLKX
CLKR
FSX
FSR
DX
DR
1
3
5
7
9
11
13
15
17
19
2
4
6
8
10
12
14
16
18
20
Serial Header
VSS
-5VA +3.3VA +5VD
J3
1
3
5
7
9
2
4
6
8
10
TP2
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Figure 5. DAC8x11 EVM
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9
Related Documentation from Texas Instruments
8
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Related Documentation from Texas Instruments
To obtain a copy of any of the following TI documents, call the Texas Instruments Literature Response
Center at (800) 477-8924 or the Product Information Center (PIC) at (972) 644-5580. When ordering,
identify this booklet by its title and literature number. Updated documents can also be obtained through
the TI Web site at www.ti.com
EVM-Compatible Device Data Sheets:
1. DAC5311, DAC6311, DAC7311, 1.8V to 5.5V, 80µA, 8-, 10-, 10-, and 12-Bit, Low-Power, SingleChannel, Digital-to-Analog Converters in SC70 Package (SBAS442)
2. DAC8311, 1.8V to 5.5V, 80µA, DAC8411, 14- and 16-Bit, Low-Power, Single-Channel, Digital-toAnalog Converters in SC70 Package (SBAS439)
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (November 2009) to A Revision ................................................................................................ Page
•
•
•
10
Changed SC70 DAC EVM to DAC8x11 EVM throughout the document. ......................................................... 1
Changed MMB0 With SC70 DACEVM Installed caption. ............................................................................ 5
Removed supplied power cable from the MMB0 Power Supplies section. ........................................................ 5
Revision History
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿6丁目24番1号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
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