Texas Instruments | ADC12C170: 12-Bit, 170 MSPS Analog to Digital Converter | User Guides | Texas Instruments ADC12C170: 12-Bit, 170 MSPS Analog to Digital Converter User guides

Texas Instruments ADC12C170: 12-Bit, 170 MSPS Analog to Digital Converter User guides
Evaluation Board User’s Guide for
ADC12C170: 12-Bit, 170 MSPS Analog to Digital Converter
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ADC12C170 Evaluation Board User’s Guide
Analog Input
FIN < 150 MHz
Analog Input
FIN > 150 MHz
Analog Input
Network
ADC
PD
Jumper
Clock
Buffer
(Reverse
Side)
CLK_SEL/DF
Jumper
PLD
MODE
Jumper
INV
Jumper
Clock
Input
FutureBus
Connector
5.0 V Power
Connector
Figure 1. ADC12C170 Evaluation Board Connector and Jumper Locations
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ADC12C170 Evaluation Board User’s Guide
The ADC12C170 Evaluation Board is designed to
support the ADC12C170 12-bit 170 Mega Sample Per
Second (MSPS) ADC.
ADC12C170XXEB, please follow the Quick Start Guide
in the WaveVision 4 User’s Guide to install the required
software and to connect the WaveVision 4.0 Digital
Interface
Board
to
the
PC
and
to the
ADC12C170XXEB.
The ADC12C170 Evaluation Board comes in two
versions:
3.1 Evaluation Board Jumper Positions
1.0 Introduction
1. ADC12C170HFEB (high frequency version)
for input frequencies greater than 150 MHz.
Please refer to Figure 1 for the exact jumper locations.
The ADC12C170XXEB jumpers should be configured
as follows:
2. ADC12C170LFEB (low frequency version) for
input frequencies less than 150 MHz.
1. J1 on the reverse of the board should be shorted.
2. MODE and INV jumpers on the front of the board
should be shorted. See Section 4.4 for more
detailed information regarding the function of the
MODE and INV jumpers.
3. The PD jumper places the ADC12C170 into either
powerdown or sleep mode. Table 1 below shows
how to select between the power state.
The digital data from the ADC12C170 can be captured
with a suitable instrument, such as a logic analyzer,
connected
through
the
FutureBus
connector
(schematic reference designator FB) on the
ADC12C170XXEB (where XX = HF or LF) or with
National Semiconductor’s WaveVision 4.0 Digital
Interface Board and associated WaveVision software
package, which allows fast and easy data acquisition
and analysis. The WaveVision hardware connects to a
host PC via a USB cable and is fully configured and
controlled by the latest WaveVision software. The
WaveVision software and WaveVision 4.0 ADC
evaluation hardware are available through the National
Semiconductor website:
(http://www.national.com/appinfo/adc/wv4.html).
2.0 Board Assembly
Each evaluation board is configured for single-ended
clock operation and is populated with an analog input
network which has been optimized for one of two
analog input frequencies ranges:
PD Jumper
Setting
Open
1-2
3-4
Mode
Normal Operation
Power-down
Sleep
Table 1. CLK_SEL/DF Selection Table
4. CLK_SEL/DF pin jumpers select the output data
format (2’s complement or offset binary) and clock
mode (single-ended or differential). Table 2 below
shows how to select between the clock modes and
output data formats.
Please note that the
ADC12C170XXEB
is
delivered
with
the
ADC12C170 clock input configured for singleended operation.
CLK_SEL/DF
Jumper
Setting
1-2
3-4
5-6
7-8*
1. ADC12C170HFEB (high frequency version)
for input frequencies greater than 170 MHz.
2. ADC12C170LFEB (low frequency version) for
input frequencies less than 170 MHz.
Clock Mode
Output Data
Format
Differential
Differential
Single-Ended
Single-Ended
2’s Complement
Offset Binary
2’s Complement
Offset Binary
* As assembled from factory.
Please refer to the input circuit configurations
described in the Analog Input Section (4.2) of this
guide.
The location and description of the components on the
ADC12C170 evaluation board can be found in Section
5.0 (Schematic) and Section 7.0 (Bill of Materials),
respectively, of this user’s guide.
3.0 Quick Start
The ADC12C170XXEB (where XX = HF or LF) enables
easy set up for evaluating the performance of the
ADC12C170.
If the WaveVision 4 data acquisition and data analysis
system is to be used for capturing data from the
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Table 2. CLK_SEL/DF Selection Table
3.2 Connecting Power and Signal Sources
1. To power the ADC12C170XXEB, connect a 5.0V
power supply capable of supplying up to 600mA to
the green power connector labeled “+5V” which is
located along the bottom edge of the
ADC12C170XXEB.
2. Use the FutureBus connector (FB) to connect the
ADC12C170XXEB to the instrument being used to
capture the data from the evaluation board. If the
WaveVision 4.0 Digital Interface Board is being
used for data capture, a 5.0V supply capable of
supplying up to 400mA is needed. See the
WaveVision 4 User’s Guide for details on installing
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ADC12C170 Evaluation Board User’s Guide
and operating the WaveVision 4.0 hardware and
software system.
3. Connect the clock and signal inputs to the
CLK_IN_SE and AIN_XX (where XX = HF or LF)
SMA connectors, respectively.
4.0 Functional Description
4.1 Clock Input
The clock used to sample the analog input should be
applied to the CLK_IN_SE SMA connector (if using the
single-ended clock mode).
To achieve the best noise performance (best SNR), a
low jitter clock source with total additive jitter less than
150 fs should be used. A low jitter crystal oscillator is
recommended, but a sinusoidal signal generator with
low phase noise, such as the HP8644B, can also be
used with a slight degradation in the noise
performance.
The noise performance of the
ADC12C170 can be improved further by making the
edge transitions of the clock signal entering the ADC
clock input (pin 11, CLK+) very sharp.
The
ADC12C170XXEB is assembled with a high speed
buffer gate (NC7WV125K8X, schematic reference
designator U2) in the clock input path to provide a
sharp clock edge to the clock inputs and improve the
noise performance of the ADC.
Placing a bandpass filter between the clock source and
the CLK_IN_SE SMA connector will further improve the
noise performance of the ADC by filtering out the
broadband noise of the clock source. All results in the
ADC12C170 datasheet are obtained with a tunable
bandpass filter made by Trilithic, Inc. (Indianapolis, IN)
in the clock signal path.
4.2 Analog Input
To obtain the best distortion results (best SFDR), the
analog input network on the evaluation board must be
optimized for the signal frequency being applied.
For analog input frequencies up to approximately 150
MHz, the circuit in Figure 2 is recommended. This is
the configuration of the assembled ADC12C170LFEB
as it is delivered from the factory. Frequencies above
150 MHz, the circuit in Figure 3 is recommended. This
is
the
configuration
of
the
assembled
ADC12C170HFEB as it is delivered from the factory.
A low noise signal generator such as the HP8644B is
recommended to drive the signal input of the
ADC12C170XXEB. A low pass filter must be used to
sufficiently suppress the harmonic distortion produced
by the signal generator and to allow accurate
measurement
of
the
ADC12C170
distortion
performance. In some cases, a second low pass filter
may be necessary. Alternatively, a bandpass filter can
be used to filter the distortion products of the signal
generator. The bandpass filter will further improve the
noise performance of the ADC by filtering the
broadband noise of the signal generator. Data shown
in the ADC12C170 datasheet was taken with a tunable
bandpass filter made by Trilithic (Indianapolis, IN) in the
analog signal path.
Figure 2. Analog Input Network of ADC12C170LFEB: FIN < 150 MHz
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ADC12C170 Evaluation Board User’s Guide
Figure 3. Analog Input Network of ADC12C170HFEB: FIN > 150 MHz
4.3 ADC Reference and Input Common Mode
The internal 1.0V reference on the ADC12C170 is used
to acquire all of the results in the ADC12C170
datasheet. It is recommended to use the internal
reference on the ADC12C170. However, if an external
reference is required, the ADC12C170 is capable of
accepting an external reference voltage between 0.9V
and 1.1V (1.0V recommended).
If an external
reference is to be used, the ADC12C170XXEB
includes a REF test point which can be used to apply
the external reference to the ADC.
It is recommended to use the voltage at the VRM pin
(pin 45) of the ADC12C170 to provide the 1.5V
common mode voltage required for the differential
analog inputs VIN+ and VIN-. The ADC12C170XXEB is
factory-assembled with VRM connected to the
transformer center-tap through a 49.9Ω resistor to
provide the necessary common mode voltage to the
differential analog input. If an external common mode
voltage is to be used, the ADC12C170XXEB includes a
VCM test point which can be used to apply the external
common mode voltage to the ADC.
from 1.8V CMOS to 3.3V CMOS, which is compatible
with the WaveVision 4.0 Digital Interface Board and
other data capture instruments which the user may
choose.
The ADC12C170XXEB has been designed to give the
user the flexibility to choose between passing the data
from the ADC to the capture instrument either with or
without latching the data in the PLD. Tables 3 and 4
show how to configure the PLD device through the
MODE and INV jumpers on the evaluation board to
enable the latching capability. The ADC12C170XXEB
is factory assembled with both the MODE and INV
jumpers shorted.
Short
Latch data with
DRDY signal
Open
Pass data
transparently
without latching
The data from the ADC12C170 in the PLD can be
latched either on the rising or falling edge of DRDY.
Table 4 shows how to choose which edge of DRDY will
be used to latch the ADC data into the PLD.
INV
Jumper
DRDY Latching
Edge
Short
Falling
Open
Rising
Table 4. PLD Latch Edge Selection Table
The ADC12C170XXEB uses a PLD device from Lattice
Semiconductor
(LC4032V-25TN48C,
schematic
reference designator U5) to translate the ADC output
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Data Transfer
Through PLD
Table 3. PLD Data Transfer Selection Table
4.4 Board Outputs
The digitized 12-bit output word from the
ADC12C170XXEB is available at pins B4 (MSB)
through B15 (LSB) on the FutureBus connector
(schematic reference designator FB). The data ready
(DRDY) signal which should be used to capture the
output data is available at pin D2 of the FutureBus
connector and the over-range (OVR) bit which
indicates that the input signal to the ADC has exceeded
the maximum digitizable signal amplitude is available at
pin B18 on the FutureBus connector.
See the
Evaluation Board schematic in Section 5.0 for details.
MODE
Jumper
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ADC12C170 Evaluation Board User’s Guide
4.5 Power requirements.
Power to the ADC12C170XXEB is supplied through the
green power connector labeled “+5V” which is located
along the bottom edge of the board. Voltage and
current requirements are:
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• +5V at 600mA (ADC12C170XXEB only)
• +5V at 1.0 A (ADC12C170XXEB and WaveVision
4.0 Digital Interface Board)
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ADC12C170 Evaluation Board User’s Guide
5.0 Evaluation Board Schematic
Figure 4. Signals
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ADC12C170 Evaluation Board User’s Guide
5.0 Schematic (cont.)
Figure 5. Power Distribution
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ADC12C170 Evaluation Board User’s Guide
6.0 Evaluation Board Layout
Figure 6. Layer 1 - Signal
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ADC12C170 Evaluation Board User’s Guide
6.0 Evaluation Board Layout (cont.)
Figure 7. Layer 2 - Ground
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ADC12C170 Evaluation Board User’s Guide
6.0 Evaluation Board Layout (cont.)
Figure 8. Layer 3 - Power
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ADC12C170 Evaluation Board User’s Guide
6.0 Evaluation Board Layout (cont.)
Figure 9. Layer 4 - Signal
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sm/c_0201
sm/c_1206
Manufacturer
Atmel
National Semiconductor
MA/COM
AMP
Panasonic - ECG
Panasonic - ECG
0.1uF
0.1uF SMD CAP CERAMIC 10V X5R 10%
sm/c_0402
Panasonic - ECG
0.01uF
0.01uF SMD CAP CERAMIC 16V X7R 10%
sm/c_0402
AVX Corporation
10uF
2pF
1uF
10uF
10uF SMD CAP CERAMIC 10V X5R 20%
2pF SMD CAP CERAMIC 50v +/-0.25pF
1uF SMD CAP CERAMIC 25V X7R 10%
10uF SMD CAP TANTALUM 6.3V 20%
sm/c_1206
sm/c_0402
sm/c_1206
sm/c_3216
Panasonic - ECG
Murata Electronics
Panasonic - ECG
Kemet
2.2uF
68uF
8x22 ohm
Ferrite Bead Core
Jumper 1x8
Jumper 2X2
Jumper 2X4
Shunt
PLD
3.3V Regulator
1.8V Regulator
Power Connector Terminal Block
Power Connector Plug
Bump-on Rubber Feet
Tinylogic Buffer
Kemet
2.2uF SMD CAP TANTALUM 16V 10%
sm/c_3216
Kemet
68uF SMD CAP TANTALUM 6.3V 10%
sm/c_7343
Panasonic -ECG
22 OHM SMD 8 RES ARRAY 5%
sm/r_0402 x 8
Panasonic -ECG
SMD FERRITE BEAD CORE 4.5X3.2X1.8
Samtec
JUMPER BLOCK USING 8 PIN SIP HEADER
Samtec
2X2 JUMPER BLOCK HEADER CUT TO SIZE FROM 2X6 HEADER
Samtec
2X4 JUMPER BLOCK HEADER CUT TO SIZE FROM 2X6 HEADER
FCI Electronic
PLACE SHUNT ACROSS PINS 7-8 ON CLK_SEL/DF JUMPER
Lattice Semiconductor
ispMACH PLD, 3.3V core
48-TQFP
National Semiconductor
1A LOW DROPOUT REGULATOR FOR 5V TO 3.3 V CONVERSION
SOT-223
MICROPOWER/LOW NOISE, 500 mA ULTRA LOW-DROPOUT REGULATOR
SOIC NARROW -8 National Semiconductor
Phoenix Contact
TERMINAL BLOCK 2POS 5.08mm
Phoenix Contact
TERMINAL BLOCK PLUG 2POS 5.08mm
3M
PLACE BUMP ONS AT THE 4 CORNERS, ON BOTTOM OF BOARD
Fairchild Semiconductor
TINYLOGIC ULP-A BUFFER WITH 3-STATE OUTPUT
8-LEAD US8, JEDEC MO-187, CA 3.1 mm WIDE
Murata Electronics
FILTER LC HIGH FREQ .2UF
1806
SOLDER SHORT ACROSS THE PADS OF "J1"
AND ACROSS PADS OF "MODE"
Vishay Dale
0 OHM SMD RESISTOR
sm/r_0402
Panasonic - ECG
1 kOHM SMD RESISTOR 1/16W 1%
sm/r_0402
Yageo Corporation
24.9 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Vishay Dale
33.2 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Yageo Corporation
49.9 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Emerson Network Power Connectivity
PCB MOUNTABLE SMA CONNECTOR
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28
29
6
2
Z1-6
J1, MODE
Noise Suppression Filter
Solder Short
30
31
32
33
34
35
2
11
2
2
3
2
R17, R19
R1-7, R12-13, R18, R20
R14-15
R26-27
R10, R24-25
AIN_HF,
CLK_IN_SE
0 ohms
1 kOHM
24.9 ohms
33.2 ohms
49.9 ohms
SMA Input
PCB Footprint
SOIC-8
48-LLP
ADC12C170 Evaluation Board User’s Guide
Description
2K SERIAL EEPROM 1.8V
12-Bit, 170 MSPS Analog/Digital Converter
BALUN TRANSFORMER
Z-PACK 2mm FB (Futurebus+) RIGHT ANGLE HEADER CONNECTOR
0.1uF SMD CAP CERAMIC 6.3V X5R 10%
0.1uF SMD CAP CERAMIC 25V X7R 10%
7.0 Evaluation Board Bill of Materials
- 13 -
Part Name
24C02
ADC12170
ETC1-1-13
AMP_5223514-1
0.1uF
0.1uF
7.1 ADC12C170HFEB (For Fin > 150 MHz)
N
Item Quantity Schematic Reference
1
1
U6
2
1
ADC
3
2
T6, T10
4
4
FB
5
1
C75
6
8
C2, C14, C20, C22,
C24, C61, C66, C83
7
26
C9, C15-18,
C26-27, C29, C31, C33,
C35, C37, C39, C41,
C43, C45, C47, C49-51,
C53, C59, C71, C72,
C73, C76
8
17
C10, C12, C28, C30, C32,
C34, C36, C38, C40, C42
C44, C46, C55-58, C77
9
1
C13
10
1
C74
11
4
C4, C6, C63-64
12
12
C1, C3, C8, C19, C21, C23,
C48, C52, C54, C60, C65, C82
13
1
C11
14
2
C5, C62
15
2
R8-9
16
2
L1, L2
17
1
JTAG
18
1
PD
19
1
CLK_SEL/DF
20
1
21
1
U5
22
2
U1, U4
23
1
U3
24
1
+5V
25
1
26
4
MT1-4
27
1
U2
PCB Footprint
SOIC-8
48-LLP
CD542
sm/c_0201
sm/c_1206
Manufacturer
Atmel
National Semiconductor
MINI CIRCUITS
AMP
Panasonic - ECG
Panasonic - ECG
0.1uF
0.1uF SMD CAP CERAMIC 10V X5R 10%
sm/c_0402
Panasonic - ECG
0.01uF
0.01uF SMD CAP CERAMIC 16V X7R 10%
sm/c_0402
AVX Corporation
10uF
15pF
1uF
10uF
10uF SMD CAP CERAMIC 10V X5R 20%
15pF SMD CAP CERAMIC 50v NP0 5%
1uF SMD CAP CERAMIC 25V X7R 10%
10uF SMD CAP TANTALUM 6.3V 20%
sm/c_1206
sm/c_0402
sm/c_1206
sm/c_3216
Panasonic - ECG
Panasonic - ECG
Panasonic - ECG
Kemet
2.2uF
68uF
8x22 ohm
Ferrite Bead Core
Jumper 1x8
Jumper 2X2
Jumper 2X4
Shunt
PLD
3.3V Regulator
1.8V Regulator
Power Connector Terminal Block
Power Connector Plug
Bump-on Rubber Feet
Tinylogic Buffer
Kemet
2.2uF SMD CAP TANTALUM 16V 10%
sm/c_3216
Kemet
68uF SMD CAP TANTALUM 6.3V 10%
sm/c_7343
Panasonic -ECG
22 OHM SMD 8 RES ARRAY 5%
sm/r_0402 x 8
Panasonic -ECG
SMD FERRITE BEAD CORE 4.5X3.2X1.8
Samtec
JUMPER BLOCK USING 8 PIN SIP HEADER
Samtec
2X2 JUMPER BLOCK HEADER CUT TO SIZE FROM 2X6 HEADER
Samtec
2X4 JUMPER BLOCK HEADER CUT TO SIZE FROM 2X6 HEADER
FCI Electronic
PLACE SHUNT ACROSS PINS 7-8 ON CLK_SEL/DF JUMPER
Lattice Semiconductor
ispMACH PLD, 3.3V core
48-TQFP
National Semiconductor
1A LOW DROPOUT REGULATOR FOR 5V TO 3.3 V CONVERSION
SOT-223
MICROPOWER/LOW NOISE, 500 mA ULTRA LOW-DROPOUT REGULATOR
SOIC NARROW -8 National Semiconductor
Phoenix Contact
TERMINAL BLOCK 2POS 5.08mm
Phoenix Contact
TERMINAL BLOCK PLUG 2POS 5.08mm
3M
PLACE BUMP ONS AT THE 4 CORNERS, ON BOTTOM OF BOARD
Fairchild Semiconductor
TINYLOGIC ULP-A BUFFER WITH 3-STATE OUTPUT
8-LEAD US8, JEDEC MO-187, CA 3.1 mm WIDE
Murata Electronics
FILTER LC HIGH FREQ .2UF
1806
SOLDER SHORT ACROSS THE PADS OF "J1"
AND ACROSS PADS OF "MODE"
Vishay Dale
0 OHM SMD RESISTOR
sm/r_0402
Panasonic - ECG
1 kOHM SMD RESISTOR 1/16W 1%
sm/r_0402
Yageo Corporation
24.9 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Vishay Dale
33.2 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Yageo Corporation
49.9 OHM SMD RESISTOR 1/16W 1%
sm/r_0402
Emerson Network Power Connectivity
PCB MOUNTABLE SMA CONNECTOR
-
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28
29
6
2
Z1-6
J1, MODE
Noise Suppression Filter
Solder Short
30
31
32
33
34
35
2
11
4
2
1
2
R17, R19
R1-7, R12-13, R18, R20
R14-15, R24-25
R26-27
R10
AIN_LF,
CLK_IN_SE
0 ohms
1 kOHM
24.9 ohms
33.2 ohms
49.9 ohms
SMA Input
ADC12C170 Evaluation Board User’s Guide
Description
2K SERIAL EEPROM 1.8V
12-Bit, 170 MSPS Analog/Digital Converter
WIDEBAND RF TRANSFORMER 0.4MHz - 800 MHz
Z-PACK 2mm FB (Futurebus+) RIGHT ANGLE HEADER CONNECTOR
0.1uF SMD CAP CERAMIC 6.3V X5R 10%
0.1uF SMD CAP CERAMIC 25V X7R 10%
7.0 Evaluation Board Bill of Materials (cont.)
- 14 -
Part Name
24C02
ADC12170
ADT1-1WT+
AMP_5223514-1
0.1uF
0.1uF
7.2 ADC12C170LFEB (For Fin < 150 MHz)
N
Item Quantity Schematic Reference
1
1
U6
2
1
ADC
3
1
T7
4
4
FB
5
1
C75
6
8
C2, C14, C20, C22,
C24, C61, C66, C83
7
26
C7, C9, C15-18, C25,
C26-27, C29, C31, C33,
C35, C37, C39, C41,
C43, C45, C47, C49-51,
C53, C59,
C73, C76
8
17
C10, C12, C28, C30, C32,
C34, C36, C38, C40, C42
C44, C46, C55-58, C77
9
1
C13
10
3
C74, C78-79
11
4
C4, C6, C63-64
12
12
C1, C3, C8, C19, C21, C23,
C48, C52, C54, C60, C65, C82
13
1
C11
14
2
C5, C62
15
2
R8-9
16
1
L1
17
1
JTAG
18
1
PD
19
1
CLK_SEL/DF
20
1
21
1
U5
22
2
U1, U4
23
1
U3
24
1
+5V
25
1
26
4
MT1-4
27
1
U2
ADC12C170 Evaluation Board User’s Guide
The ADC12C170 Evaluation Board is intended for product evaluation purposes only and is not intended for resale to end
consumers, is not authorized for such use and is not designed for compliance with European EMC Directive 89/336/EEC.
WaveVision is a trademark of National Semiconductor Corporation. National does not assume any responsibility for use of any
circuitry or software supplied or described. No circuit patent licenses are implied.
LIFE SUPPORT POLICY
NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:
1.
Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
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National does not assume any responsibility for any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change
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www.ti.com/wirelessconnectivity
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