Texas Instruments | Mixed Signal Microcontroller, MSP430F417-DIE | Datasheet | Texas Instruments Mixed Signal Microcontroller, MSP430F417-DIE Datasheet

Texas Instruments Mixed Signal Microcontroller, MSP430F417-DIE Datasheet
MSP430F417-DIE
www.ti.com
SLAS891 – JULY 2012
MIXED SIGNAL MICROCONTROLLER
FEATURES
1
•
•
•
•
•
•
•
Low Supply-Voltage Range, 1.8 V to 3.6 V
Ultralow Power Consumption
Five Power-Saving Modes
Wake-Up From Standby Mode
Frequency-Locked Loop (FLL+)
16-Bit RISC Architecture
16-Bit Timer_A With Three or Five
Capture/Compare Registers
•
•
•
•
•
•
Integrated LCD Driver for 96 Segments
On-Chip Comparator
Brownout Detector
Supply Voltage Supervisor/Monitor −
Programmable Level Detection
Serial Onboard Programming, No External
Programming Voltage Needed, Programmable
Code Protection by Security Fuse
Bootstrap Loader in Flash Devices
DESCRIPTION
The Texas Instruments MSP430 family of ultra-low-power microcontrollers consists of several devices featuring
different sets of peripherals targeted for various applications. The architecture, combined with five low power
modes, is optimized to achieve extended battery life in portable measurement applications. The device features a
powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency.
The digitally controlled oscillator (DCO) allows wake-up from low-power modes to active mode in less than 6 μs.
The MSP430F417 is a microcontroller configuration with one or two built-in 16-bit timers, a comparator, 96 LCD
segment drive capability, and 48 I/O pins.
Typical applications include sensor systems that capture analog signals, convert them to digital values, and
process the data and transmit them to a host system. The comparator and timer make the configurations ideal
for industrial meters, counter applications and handheld meters.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
MSP430F417
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
MSP430F417TDE1
100
MSP430F417TDE2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
MSP430F417-DIE
SLAS891 – JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
11 mils.
Silicon with backgrind
Floating
AlCu/TiN
800 nm
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Copyright © 2012, Texas Instruments Incorporated
MSP430F417-DIE
www.ti.com
SLAS891 – JULY 2012
Table 1. Bond Pad Coordinates in Microns
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
DVCC
DESCRIPTION
1
91.95
2586.7
166.95
2661.7
P6.3
2
91.95
2470.75
166.95
2545.75
P6.4
3
91.95
2356.7
166.95
2431.7
P6.5
4
91.95
2241.7
166.95
2316.7
P6.6
5
91.95
2126.7
166.95
2201.7
P6.7
6
91.95
2011.7
166.95
2086.7
N/C
7
91.95
1896.7
166.95
1971.7
XIN
8
91.95
1483.4
166.95
1558.4
XOUT
9
91.95
1251.25
166.95
1326.25
AVSS2
10
91.95
1129.05
166.95
1204.05
N/C
11
91.95
1008.45
166.95
1083.45
P5.1/S0
12
91.95
896.5
166.95
971.5
P5.0/S1
13
91.95
787.45
166.95
862.45
P4.7/S2
14
91.95
674.2
166.95
749.2
P4.6/S3
15
91.95
559.6
166.95
634.6
P4.5/S4
16
91.95
440.95
166.95
515.95
P4.4/S5
17
264.05
91.95
339.05
166.95
P4.3/S6
18
376.5
91.95
451.5
166.95
P4.2/S7
19
905.5
91.95
980.5
166.95
P4.1/S8
20
1007.6
91.95
1082.6
166.95
P4.0/S9
21
1109.7
91.95
1184.7
166.95
P3.7/S10
22
1211.8
91.95
1286.8
166.95
P3.6/S11
23
1313.9
91.95
1388.9
166.95
P3.5/S12
24
1416
91.95
1491
166.95
P3.4/S13
25
1518.1
91.95
1593.1
166.95
P3.3/S14
26
1620.2
91.95
1695.2
166.95
P3.2/S15
27
1722.3
91.95
1797.3
166.95
P3.1/S16
28
1824.4
91.95
1899.4
166.95
P3.0/S17
29
1926.5
91.95
2001.5
166.95
P2.7/S18
30
2290.1
91.95
2365.1
166.95
P2.6/CAOUT/S19
31
2392.3
91.95
2467.3
166.95
P2.5/TA1CLK/S20
32
2494.4
91.95
2569.4
166.95
P2.4/TA1.4/S21
33
2681.55
263.5
2756.55
338.5
P2.3/TA1.3/S22
34
2681.55
737.3
2756.55
812.3
P2.2/TA1.2/S23
35
2681.55
839.4
2756.55
914.4
COM0
36
2681.55
941.5
2756.55
1016.5
P5.2/COM1
37
2681.55
1044.05
2756.55
1119.05
P5.3/COM2
38
2681.55
1146.15
2756.55
1221.15
P5.4/COM3
39
2681.55
1248.25
2756.55
1323.25
R03
40
2681.55
1350.35
2756.55
1425.35
P5.5/R13
41
2681.55
1452.45
2756.55
1527.45
P5.6/R23
42
2681.55
1554.55
2756.55
1629.55
P5.7/R33
43
2681.55
1656.65
2756.55
1731.65
P2.1/TA1.1
44
2681.55
1758.75
2756.55
1833.75
P2.0/TA0.2
45
2681.55
1860.85
2756.55
1935.85
P1.7/CA1
46
2681.55
2228.25
2756.55
2303.25
P1.6/CA0
47
2681.55
2341.95
2756.55
2416.95
Copyright © 2012, Texas Instruments Incorporated
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3
MSP430F417-DIE
SLAS891 – JULY 2012
www.ti.com
Table 1. Bond Pad Coordinates in Microns (continued)
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
P1.5/TA0CLK/ACLK
DESCRIPTION
48
2681.55
2464.1
2756.55
2539.1
P1.4/TA1.0
49
2456.25
2781.15
2531.25
2856.15
P1.3/TA1.0/SVSOUT
50
2350
2781.15
2425
2856.15
P1.2/TA0.1
51
2245.35
2781.15
2320.35
2856.15
P1.1/TA0.0/MCLK
52
2092
2781.15
2167
2856.15
P1.0/TA0.0
53
1991
2781.15
2066
2856.15
TDO/TDI
54
1803.2
2781.15
1878.2
2856.15
TDI/TCLK
55
1401.45
2766.8
1476.45
2841.8
TMS
56
1209.6
2781.15
1284.6
2856.15
TCK
57
1105.85
2781.15
1180.85
2856.15
RST/NMI
58
1003.75
2781.15
1078.75
2856.15
P6.0
59
842.45
2781.15
917.45
2856.15
P6.1
60
721.45
2781.15
796.45
2856.15
P6.2
61
600.45
2781.15
675.45
2856.15
AVSS1
62
475.95
2781.15
550.95
2856.15
DVSS
63
373.75
2781.15
448.75
2856.15
AVCC
64
260.9
2781.15
335.9
2856.15
4
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Copyright © 2012, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
21-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
MSP430F417TDE1
ACTIVE
0
100
TBD
Call TI
N / A for Pkg Type
MSP430F417TDE2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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