Texas Instruments | TCA9546A Low Voltage 4-Channel I2C and SMBus Switch with Reset Function (Rev. B) | Datasheet | Texas Instruments TCA9546A Low Voltage 4-Channel I2C and SMBus Switch with Reset Function (Rev. B) Datasheet

Texas Instruments TCA9546A Low Voltage 4-Channel I2C and SMBus Switch with Reset Function (Rev. B) Datasheet
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TCA9546A
SCPS205B – APRIL 2014 – REVISED NOVEMBER 2019
TCA9546A Low Voltage 4-Channel I2C and SMBus Switch with Reset Function
1 Features
2 Applications
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1
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1-of-4 Bidirectional translating switches
I2C Bus and SMBus compatible
Active-low reset input
Three address pins, allowing up to eight
TCA9546A devices on the I2C bus
Channel selection via I2C Bus, in any combination
Power-up with all switch channels deselected
Low RON switches
Allows voltage-level translation between
1.8-V, 2.5-V, 3.3-V, and 5-V buses
No glitch on power-up
Supports hot insertion
Low standby current
Operating power-supply voltage range of 1.65 V to
5.5 V
5.5 V Tolerant inputs
0 to 400-kHz Clock frequency
Latch-up performance exceeds 100 mA Per JESD
78
ESD Protection exceeds JESD 22
– 4000-V Human-body model (A114-A)
– 1500-V Charged-device model (C101)
Servers
Routers (telecom switching equipment)
Factory automation
Products with I2C slave address conflicts (multiple,
identical temp sensors)
3 Description
The TCA9546A is a quad bidirectional translating
switch controlled via the I2C bus. The SCL/SDA
upstream pair fans out to four downstream pairs, or
channels. Any individual SCn/SDn channel or
combination of channels can be selected, determined
by the contents of the programmable control register.
An active-low reset (RESET) input allows the
TCA9546A to recover from a situation in which one of
the downstream I2C buses is stuck in a low state.
Pulling RESET low resets the I2C state machine and
causes all the channels to be deselected, as does the
internal power-on reset function.
The pass gates of the switches are constructed such
that the VCC pin can be used to limit the maximum
high voltage, which will be passed by the TCA9546A.
This allows the use of different bus voltages on each
pair, so that 1.8-V, 2.5-V, or 3.3-V parts can
communicate with 5-V parts without any additional
protection. External pull-up resistors pull the bus up
to the desired voltage level for each channel. All I/O
pins are 5.5-V tolerant.
Device Information (1)
DEVICE NAME
TCA9546A
(1)
PACKAGE
BODY SIZE (NOM)
TSSOP (16)
5.00 mm x 4.40 mm
SOIC (16)
9.90 mm x 3.91 mm
For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Application Diagram
I2C or SMBus
Master
(e.g. Processor)
SDA
SCL
RESET
VCC
SD0
SC0
SD1
SC1
Channel 0
Slaves A0, A1...AN
Channel 1
Slaves B0, B1...BN
TCA9546A
Channel 2
A0
A1
A2
GND
SD2
SC2
Slaves C0, C1...CN
Channel 3
SD3
SC3
Slaves D0, D1...DN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TCA9546A
SCPS205B – APRIL 2014 – REVISED NOVEMBER 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1 Absolute Maximum Ratings ....................................
6.2 ESD Ratings..............................................................
6.3 Recommended Operating Conditions .....................
6.4 Thermal Information ..................................................
6.5 Electrical Characteristics..........................................
6.6 I2C Interface Timing Requirements..........................
6.7 Switching Characteristics.........................................
6.8 Interrupt and Reset Timing Requirements...............
6.9 Typical Characteristics ..............................................
4
4
4
4
5
6
6
7
7
Parameter Measurement Information .................. 8
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3
8.4
8.5
8.6
9
Feature Description.................................................
Device Functional Modes........................................
Programming...........................................................
Control Register ......................................................
11
11
11
14
Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application .................................................. 16
10 Power Supply Recommendations ..................... 19
10.1 Power-On Reset Requirements ........................... 19
11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Support Resources ...............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
4 Revision History
Changes from Revision A (February 2015) to Revision B
Page
•
Changed the Pin Configuration image appearance ............................................................................................................... 3
•
Changed VCC = 3.3 V to VCC = 2.5 V in Figure 15................................................................................................................ 16
Changes from Original (April 2014) to Revision A
Page
•
Added D package to the datasheet. ...................................................................................................................................... 1
•
Changed Handling Ratings table to ESD Ratings. ................................................................................................................ 4
•
Added D package to the Thermal Information table. ............................................................................................................. 4
2
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SCPS205B – APRIL 2014 – REVISED NOVEMBER 2019
5 Pin Configuration and Functions
D or PW Package
TSSOP and SOIC 16 Pins
Top View
A0
1
16
VCC
A1
2
15
SDA
RE SET
3
14
SCL
SD0
4
13
A2
SC0
5
12
SC3
SD1
6
11
SD3
SC1
7
10
SC2
GND
8
9
SD2
No t to scale
Pin Functions
PIN
(1)
DESCRIPTION
NAME
NO.
A0
1
Address input 0. Connect directly to VCC or ground.
A1
2
Address input 1. Connect directly to VCC or ground.
RESET
3
Active low reset input. Connect to VCC or VDPUM (1) through a pull-up resistor, if not used.
SD0
4
Serial data 0. Connect to VDPU0 (1) through a pull-up resistor.
SC0
5
Serial clock 0. Connect to VDPU0 (1) through a pull-up resistor.
SD1
6
Serial data 1. Connect to VDPU1 (1) through a pull-up resistor.
SC1
7
Serial clock 1. Connect to VDPU1 (1) through a pull-up resistor.
GND
8
Ground
SD2
9
Serial data 2. Connect to VDPU2 (1) through a pull-up resistor.
SC2
10
Serial clock 2. Connect to VDPU2 (1) through a pull-up resistor.
SD3
11
Serial data 3. Connect to VDPU3 (1) through a pull-up resistor.
SC3
12
Serial clock 3. Connect to VDPU3 (1) through a pull-up resistor.
A2
13
Address input 2. Connect directly to VCC or ground.
SCL
14
Serial clock line. Connect to VDPUM (1) through a pull-up resistor.
SDA
15
Serial data line. Connect to VDPUM (1) through a pull-up resistor.
VCC
16
Supply power
VDPUX is the pull-up reference voltage for the associated data line. VDPUM is the master I2C master reference voltage and VDPU0-VDPU3
are the slave channel reference voltages.
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6 Specifications
Absolute Maximum Ratings (1)
6.1
over operating free-air temperature range (unless otherwise noted)
VCC
MIN
MAX
Supply voltage range
–0.5
7
(2)
–0.5
UNIT
V
VI
Input voltage range
II
Input current
±20
7
mA
V
IO
Output current
±25
mA
Continuous current through VCC
±100
mA
Continuous current through GND
±100
mA
400
mW
Ptot
Total power dissipation
TA
Operating free-air temperature range
–40
85
°C
Tstg
Storage temperature range
-65
150
°C
(1)
(2)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±4000
Charged-device model (CDM), per JEDEC specification JESD22C101 (2)
±1500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
Recommended Operating Conditions (1)
6.3
VCC
MIN
MAX
1.65
5.5
SCL, SDA
0.7 × VCC
6
A2–A0, RESET
0.7 × VCC
VCC + 0.5
SCL, SDA
–0.5
0.3 × VCC
A2–A0, RESET
–0.5
0.3 × VCC
–40
85
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
TA
Operating free-air temperature
(1)
UNIT
UNIT
V
V
V
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6.4 Thermal Information
TCA9546A
THERMAL METRIC (1)
D
PW
16 PINS
16 PINS
RθJA
Junction-to-ambient thermal resistance
92.3
122.3
RθJCtop
Junction-to-case (top) thermal resistance
52.3
56.6
RθJB
Junction-to-board thermal resistance
50.1
57.4
ψJT
Junction-to-top characterization parameter
17.7
10.9
ψJB
Junction-to-board characterization parameter
49.8
66.8
(1)
4
UNIT
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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SCPS205B – APRIL 2014 – REVISED NOVEMBER 2019
Electrical Characteristics (1)
6.5
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VPORR
Power-on reset voltage, VCC
rising
No load,
VI = VCC or
GND (3)
VPORF
Power-on reset voltage, VCC
falling (4)
No load,
VI = VCC or
GND (3)
VCC
MIN TYP (2)
MAX
1.2
1.5
0.8
5V
VSWin = VCC,
ISWout = –100 μA
3 V to 3.6 V
1.6
IOL
SDA
1.65 V to 5.5 V
VOL = 0.6 V
2.8
1.4
1.0
1.8 V
1.65 V to 1.95 V
4.5
1.9
2.5 V
2.3 V to 2.7 V
VOL = 0.4 V
1
2.6
3.3 V
Switch output voltage
1.8
0.5
1.1
3
7
6
10
A2–A0
VI = VCC or GND (3)
±1
1.65 V to 5.5 V
±1
RESET
VI = VCC or GND (3)
IO = 0
tr,max = 300 ns
Operating mode
fSCL = 100 kHz
VI = VCC or GND (3)
IO = 0
tr,max = 1 µs
ICC
Low inputs
VI = GND (3)
IO = 0
Standby mode
High inputs
RESET
Cio(OFF)
(5)
(1)
(2)
(3)
(4)
(5)
SCL, SDA
A2–A0
Ci
μA
±1
fSCL = 400 kHz
ΔICC
mA
±1
SC3–SC0, SD3–SD0
Supply-current
change
V
0.8
SCL, SDA
II
V
3.6
4.5 V to 5.5 V
Vpass
UNIT
SCL, SDA
SC3–SC0, SD3–SD0
VI = VCC
IO = 0
5.5 V
50
3.6 V
20
2.7 V
11
1.65 V
6
5.5 V
35
3.6 V
14
2.7 V
5
1.65 V
2
5.5 V
1.6
2
3.6 V
1.0
1.3
2.7 V
0.7
1.1
1.65 V
0.4
0.55
5.5 V
1.6
2
3.6 V
1.0
1.3
2.7 V
0.7
1.1
1.65 V
0.4
0.55
SCL or SDA input at 0.6 V,
Other inputs at VCC or GND (3)
1.65 V to 5.5 V
2
15
SCL or SDA input at VCC – 0.6 V,
Other inputs at VCC or GND (3)
1.65 V to 5.5 V
2
15
VI = VCC or GND (3)
1.65 V to 5.5 V
VI = VCC or GND (3)
Switch OFF
μA
μA
4.5
6
4.5
5.5
15
19
6
8
1.65 V to 5.5 V
pF
pF
For operation between specified voltage ranges, refer to the worst-case parameter in both applicable ranges.
All typical values are at nominal supply voltage (1.8-V, 2.5-V, 3.3-V, or 5-V VCC), TA = 25°C.
RESET = VCC (held high) when all other input voltages, VI = GND.
The power-on reset circuit resets the I2C bus logic with VCC < VPORF.
Cio(ON) depends on internal capacitance and external capacitance added to the SCn lines when channels(s) are ON.
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Electrical Characteristics(1) (continued)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VO = 0.4 V
RON
IO = 15 mA
Switch on-state resistance
VO = 0.4 V
MIN TYP (2)
VCC
IO = 10 mA
MAX
4.5 V to 5.5 V
4
10
16
3 V to 3.6 V
5
13
20
2.3 V to 2.7 V
7
16
45
1.65 V to 1.95 V
10
25
70
UNIT
Ω
I2C Interface Timing Requirements
6.6
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 5)
STANDARD MODE
I2C BUS
MIN
MAX
100
fscl
I2C clock frequency
0
tsch
I2C clock high time
4
2
FAST MODE
I2C BUS
UNIT
MIN
MAX
0
400
0.6
4.7
kHz
μs
tscl
I C clock low time
tsp
I2C spike time
1.3
tsds
I2C serial-data setup time
250
100
ns
tsdh
I2C serial-data hold time
0 (1)
0 (1)
μs
50
2
μs
50
ns
ticr
I C input rise time
1000
20 + 0.1Cb
(2)
300
ns
ticf
I2C input fall time
300
20 + 0.1Cb
(2)
300
ns
tocf
I2C output fall time
300
20 + 0.1Cb
(2)
300
ns
10-pF to 400-pF bus
2
tbuf
I C bus free time between stop and start
4.7
1.3
μs
tsts
I2C start or repeated start condition setup
4.7
0.6
μs
tsth
I2C start or repeated start condition hold
4
0.6
μs
2
tsps
I C stop condition setup
tvdL(Data)
Valid-data time (high to low) (3)
SCL low to SDA output low valid
tvdH(Data)
Valid-data time (low to high) (3)
SCL low to SDA output high valid
Valid-data time of ACK condition
ACK signal from SCL low
to SDA output low
tvd(ack)
4
2
Cb
I C bus capacitive load
(1)
0.6
μs
1
1
μs
0.6
0.6
μs
1
1
μs
400
400
pF
A device internally must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH min of the SCL signal), in order to
bridge the undefined region of the falling edge of SCL.
Cb = total bus capacitance of one bus line in pF
Data taken using a 1-kΩ pullup resistor and 50-pF load (see Figure 5)
(2)
(3)
6.7
Switching Characteristics
over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 5)
PARAMETER
tpd
(1)
6
(1)
Propagation delay time
RON = 20 Ω, CL = 15 pF
RON = 20 Ω, CL = 50 pF
FROM
(INPUT)
TO
(OUTPUT)
SDA or SCL
SDn or SCn
MIN
MAX
0.3
1
UNIT
ns
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
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6.8
SCPS205B – APRIL 2014 – REVISED NOVEMBER 2019
Interrupt and Reset Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
tWL
trst
Pulse duration, RESET low
(1)
MAX
UNIT
6
RESET time (SDA clear)
tREC(STA)
(1)
MIN
ns
500
Recovery time from RESET to start
ns
0
ns
trst is the propagation delay measured from the time the RESET pin is first asserted low to the time the SDA pin is asserted high,
signaling a stop condition. It must be a minimum of tWL.
6.9 Typical Characteristics
800
1.8
VCC = 5.5V
VCC = 3.3V
VCC = 1.65V
1.6
ICC, Standby Mode (µA)
700
VOL (mV)
600
500
400
300
200
1.2
1
0.8
0.6
25ºC (Room Temperature)
85ºC
-40ºC
0.4
100
0.2
1.5
0
0
2
4
IOL
6
(mA)
8
10
12
2
2.5
3
D003
Figure 1. SDA Output Low Voltage (VOL) vs Load Current
(IOL) at Three VCC Levels
3.5
VCC (V)
4
4.5
5
5.5
D004
Figure 2. Standby Current (ICC) vs Supply Voltage (VCC) at
Three Temperature Points
30
6
25ºC (Room Temperature)
85ºC
-40º
5.8
5.6
25
5.4
20
RON (Ohm)
CIO(OFF) (pF)
1.4
5.2
5
4.8
15
10
4.6
4.4
25ºC (Room Temperature)
85ºC
-40ºC
5
4.2
0
4
0
0.5
1
1.5
2
2.5
3
VCC (V)
3.5
4
4.5
5
5.5
0
0.5
D006
Figure 3. Slave channel (SCn/SDn) capacitance (Cio(OFF)) vs.
Supply Voltage (VCC) at Three Temperature Points
1
1.5
2
2.5
3
VCC (V)
3.5
4
4.5
5
5.5
D001
Figure 4. ON-Resistance (RON) vs Supply Voltage (VCC) at
Three Temperatures
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7 Parameter Measurement Information
VCC
RL = 1 kΩ
SDn, SCn
DUT
CL = 50 pF
(See Note 1)
Copyright © 2016, Texas Instruments Incorporated
I2C PORT LOAD CONFIGURATION
Two Bytes for Complete
Device Programming
Stop
Start
Address
Address
Condition Condition
Bit 7
Bit 6
(P)
(S)
(MSB)
BYTE
DESCRIPTION
1
I2C address + R/W
2
Control register data
Address
Bit 1
tscl
R/W
Bit 0
(LSB)
ACK
(A)
Data
Bit 0
(LSB)
Data
Bit 7
(MSB)
ACK
(A)
Stop
Condition
(P)
tsch
0.7 × VCC
SCL
tvd(ACK)
or tvdL
tvdH
ticr
ticf
tbuf
tsp
0.3 × VCC
tsts
0.7 × VCC
SDA
0.3 × VCC
ticf
ticr
tsth
tsdh
tsds
tsps
Repeat
Start
Condition
Start or Repeat
Start Condition
Stop
Condition
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω,
tr/tf ≤ 30 ns.
C.
The outputs are measured one at a time, with one transition per measurement.
Figure 5. I2C Interface Load Circuit, Byte Descriptions, and Voltage Waveforms
8
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Parameter Measurement Information (continued)
Start
ACK or Read Cycle
SCL
SDA
30%
trst
50%
RESET
tREC
tWL
Figure 6. Reset Timing
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8 Detailed Description
8.1 Overview
The TCA9546A is a 4-channel, bidirectional translating I2C switch. The master SCL/SDA signal pair is directed to
four channels of slave devices, SC0/SD0-SC3/SD3. Any individual downstream channel can be selected as well
as any combination of the four channels.
The device offers an active-low RESET input which resets the state machine and allows the TCA9546A to
recover should one of the downstream I2C buses get stuck in a low state. The state machine of the device can
also be reset by cycling the power supply, VCC, also known as a power-on reset (POR). Both the RESET function
and a POR will cause all channels to be deselected.
The connections of the I2C data path are controlled by the same I2C master device that is switched to
communicate with multiple I2C slaves. After the successful acknowledgment of the slave address (hardware
selectable by A0 and A1 pins), a single 8-bit control register is written to or read from to determine the selected
channels.
The TCA9546A may also be used for voltage translation, allowing the use of different bus voltages on each
SCn/SDn pair such that 1.8-V, 2.5-V, or 3.3-V parts can communicate with 5-V parts. This is achieved by using
external pull-up resistors to pull the bus up to the desired voltage for the master and each slave channel.
8.2 Functional Block Diagram
SC0
SC1
7
SC2
10
SC3
12
SD0
4
SD1
6
SD2
9
SD3
11
GND
8
VCC
16
RESET
SCL
SDA
10
TCA9546A
5
3
Switch Control Logic
Power-On Reset
14
15
Input Filter
I2C
Bus Control
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1
A0
2
A1
13
A2
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8.3 Feature Description
The TCA9546A is a 4-channel, bidirectional translating switch for I2C buses that supports Standard-Mode (100
kHz) and Fast-Mode (400 kHz) operation. The TCA9546A features I2C control using a single 8-bit control register
in which the four least significant bits control the enabling and disabling of the 4 switch channels of I2C data flow.
Depending on the application, voltage translation of the I2C bus can also be achieved using the TCA9546A to
allow 1.8-V, 2.5-V, or 3.3-V parts to communicate with 5-V parts. Additionally, in the event that communication on
the I2C bus enters a fault state, the TCA9546A can be reset to resume normal operation using the RESET pin
feature or by a power-on reset which results from cycling power to the device.
8.4 Device Functional Modes
8.4.1
RESET Input
The RESET input is an active-low signal that may be used to recover from a bus-fault condition. When this signal
is asserted low for a minimum of tWL, the TCA9546A resets its registers and I2C state machine and deselects all
channels. The RESET input must be connected to VCC through a pull-up resistor.
8.4.2 Power-On Reset
When power is applied to VCC, an internal power-on reset holds the TCA9546A in a reset condition until VCC has
reached VPOR. At this point, the reset condition is released, and the TCA9546A registers and I2C state machine
are initialized to their default states, all zeroes, causing all the channels to be deselected. Thereafter, VCC must
be lowered below V POR to reset the device.
8.5 Programming
8.5.1 I2C Interface
The I2C bus is for two-way two-line communication between different ICs or modules. The two lines are a serial
data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pullup
resistor when connected to the output stages of a device. Data transfer can be initiated only when the bus is not
busy.
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high
period of the clock pulse, as changes in the data line at this time are interpreted as control signals (see Figure 7).
SDA
SCL
Data Line
Stable;
Data Valid
Change
of Data
Allowed
Figure 7. Bit Transfer
Both data and clock lines remain high when the bus is not busy. A high-to-low transition of the data line while the
clock is high is defined as the start condition (S). A low-to-high transition of the data line while the clock is high is
defined as the stop condition (P) (see Figure 8).
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Programming (continued)
SDA
SCL
S
P
Start Condition
Stop Condition
Figure 8. Definition of Start and Stop Conditions
A device generating a message is a transmitter; a device receiving is the receiver. The device that controls the
message is the master, and the devices that are controlled by the master are the slaves (see Figure 9).
SDA
SCL
Master
Transmitter/
Receiver
Slave
Receiver
Slave
Transmitter/
Receiver
Master
Transmitter/
Receiver
Master
Transmitter
I2C
Multiplexer
Slave
Figure 9. System Configuration
The number of data bytes transferred between the start and the stop conditions from transmitter to receiver is not
limited. Each byte of eight bits is followed by one acknowledge (ACK) bit. The transmitter must release the SDA
line before the receiver can send an ACK bit.
When a slave receiver is addressed, it must generate an ACK after the reception of each byte. Also, a master
must generate an ACK after the reception of each byte that has been clocked out of the slave transmitter. The
device that acknowledges must pull down the SDA line during the ACK clock pulse so that the SDA line is stable
low during the high pulse of the ACK-related clock period (see Figure 10). Setup and hold times must be taken
into account.
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Programming (continued)
Data Output
by Transmitter
NACK
Data Output
by Receiver
ACK
SCL From
Master
1
2
8
9
S
Clock Pulse for ACK
Start
Condition
Figure 10. Acknowledgment on the I2C Bus
Data is transmitted to the TCA9546A control register using the write mode shown in Figure 11.
Slave Address
SDA
S
1
1
1
0
Control Register
A2 A1 A0
Start Condition
0
A
X
X
X
X
B3 B2 B1 B0
R/W ACK From Slave
A
ACK From Slave
P
Stop Condition
Figure 11. Write Control Register
Data is read from the TCA9546A control register using the read mode shown in Figure 12.
Slave Address
SDA
S
1
1
1
0
Control Register
A2 A1 A0
Start Condition
1
R/W
A
0
0
0
0
ACK From Slave
B3 B2
B1 B0 NA
NACK From Master
P
Stop Condition
Figure 12. Read Control Register
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8.6 Control Register
8.6.1 Device Address
Following a start condition, the bus master must output the address of the slave it is accessing. The address of
the TCA9546A is shown in Figure 13. To conserve power, no internal pullup resistors are incorporated on the
hardware-selectable address pins, and they must be pulled high or low.
Slave Address
1
1
0
1
A2
A1
A0 R/W
Hardware
Selectable
Fixed
Figure 13. TCA9546A Address
The last bit of the slave address defines the operation to be performed. When set to a logic 1, a read is selected,
while a logic 0 selects a write operation.
8.6.2 Control Register Description
Following the successful acknowledgment of the slave address, the bus master sends a byte to the TCA9546A,
which is stored in the control register (see Figure 14). If multiple bytes are received by the TCA9546A, it will save
the last byte received. This register can be written and read via the I2C bus.
Channel Selection Bits
(Read/Write)
7
6
X
X
5
X
4
3
2
1
0
X
B3
B2
B1
B0
Channel 0
Channel 1
Channel 2
Channel 3
Figure 14. Control Register
8.6.3 Control Register Definition
One or several SCn/SDn downstream pairs, or channels, are selected by the contents of the control register (see
Table 1). This register is written after the TCA9546A has been addressed. The four LSBs of the control byte are
used to determine which channel or channels are to be selected. When a channel is selected, the channel
becomes active after a stop condition has been placed on the I2C bus. This ensures that all SCn/SDn lines are in
a high state when the channel is made active, so that no false conditions are generated at the time of
connection. A stop condition always must occur right after the acknowledge cycle.
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Control Register (continued)
Table 1. Control Register Write (Channel Selection), Control Register Read (Channel Status) (1)
B7
(1)
B6
B5
B4
B3
B2
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
0
0
0
0
X
0
1
0
0
B1
X
0
1
B0
Channel 0 disabled
1
Channel 0 enabled
X
X
X
X
X
X
0
0
0
1
COMMAND
0
Channel 1 disabled
Channel 1 enabled
Channel 2 disabled
Channel 2 enabled
Channel 3 disabled
Channel 3 enabled
No channel selected,
power-up/reset default state
Several channels can be enabled at the same time. For example, B3 =0, B2 = 1, B1 = 1, B0 = 0 means that channels 0 and 3 are
disabled, and channels 1 and 2 are enabled. Care should be taken not to exceed the maximum bus capacity.
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9 Application and Implementation
9.1 Application Information
Applications of the TCA9546A contains an I2C (or SMBus) master device and up to four I2C slave devices. The
downstream channels are ideally used to resolve I2C slave address conflicts. For example, if four identical digital
temperature sensors are needed in the application, one sensor can be connected at each channel: 0, 1, 2, and 3.
When the temperature at a specific location needs to be read, the appropriate channel can be enabled and all
other channels switched off, the data can be retrieved, and the I2C master can move on and read the next
channel.
In an application where the I2C bus contain many additional slave devices that do not result in I2C slave address
conflicts, these slave devices can be connected to any desired channel to distribute the total bus capacitance
across multiple channels. If multiple switches will be enabled simultaneously, additional design requirements
must be considered (See Design Requirements and Detailed Design Procedure).
9.2 Typical Application
A typical application of the TCA9546A contains anywhere from 1 to 5 separate data pull-up voltages, VDPUX , one
for the master device (VDPUM) and one for each of the selectable slave channels (VDPU0 – VDPU3). In the event
where the master device and all slave devices operate at the same voltage, then the pass voltage, Vpass = VDPUX.
Once the maximum Vpass is known, Vcc can be selected easily using Figure 16. In an application where voltage
translation is necessary, additional design requirements must be considered (See Design Requirements).
Figure 15 shows an application in which the TCA9546A can be used.
VDPUM = 1.65 V to 5.5 V
VCC = 2.5 V
VDPU0 = 1.65 V to 5.5 V
16
VCC
SDA
I2C/SMBus
Master
SCL
15
14
3
4
SDA
SD0
SCL
SC0
Channel 0
5
VDPU1 = 1.65 V to 5.5 V
RESET
SD1
6
SC1
7
VDPU2 = 1.65 V to 5.5 V
TCA9546A
SD2
SC2
Channel 1
9
Channel 2
10
VDPU3 = 1.65 V to 5.5 V
13
2
1
8
A2
A1
A0
SD3
GND
SC3
11
Channel 3
12
Figure 15. TCA9546A Typical Application Schematic
16
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Typical Application (continued)
9.2.1 Design Requirements
The A0, A1, and A2 pins are hardware selectable to control the slave address of the TCA9546A. These pins may
be tied directly to GND or VCC in the application.
If multiple slave channels will be activated simultaneously in the application, then the total IOL from SCL/SDA to
GND on the master side will be the sum of the currents through all pull-up resistors, Rp.
The pass-gate transistors of the TCA9546A are constructed such that the VCC voltage can be used to limit the
maximum voltage that is passed from one I2C bus to another.
Figure 16 shows the voltage characteristics of the pass-gate transistors (note that the graph was generated using
data specified in the Electrical Characteristics section of this data sheet). In order for the TCA9546A to act as a
voltage translator, the Vpass voltage must be equal to or lower than the lowest bus voltage. For example, if the
main bus is running at 5 V and the downstream buses are 3.3 V and 2.7 V, Vpass must be equal to or below 2.7 V
to effectively clamp the downstream bus voltages. As shown in Figure 16, Vpass(max) is 2.7 V when the TCA9546A
supply voltage is 4 V or lower, so the TCA9546A supply voltage could be set to 3.3 V. Pull-up resistors then can
be used to bring the bus voltages to their appropriate levels (see Figure 15).
9.2.2 Detailed Design Procedure
Once all the slaves are assigned to the appropriate slave channels and bus voltages are identified, the pull-up
resistors, Rp, for each of the buses need to be selected appropriately. The minimum pull-up resistance is a
function of VDPUX, VOL,(max), and IOL:
VDPUX - VOL(max)
Rp(min) =
IOL
(1)
The maximum pull-up resistance is a function of the maximum rise time, tr (300 ns for fast-mode operation, fSCL =
400 kHz) and bus capacitance, Cb:
tr
Rp(max) =
0.8473 ´ Cb
(2)
The maximum bus capacitance for an I2C bus must not exceed 400 pF for fast-mode operation. The bus
capacitance can be approximated by adding the capacitance of the TCA9546A, Cio(OFF), the capacitance of
wires/connections/traces, and the capacitance of each individual slave on a given channel. If multiple channels
will be activated simultaneously, each of the slaves on all channels will contribute to total bus capacitance.
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Typical Application (continued)
9.2.3 TCA9546A Application Curves
25
5
20
Rp(max) (kOhm)
4
Vpass (V)
Standard-mode
Fast-mode
25ºC (Room Temperature)
85ºC
-40ºC
3
2
15
10
5
1
0
0
0
0.5
1
Standard-mode
(fSCL kHz, tr
1.5
2
2.5
3
VCC (V)
3.5
4
4.5
5
0
5.5
50
100
150
200
250
Cb (pF)
D007
SPACE
(fSCL kHz, tr)
Standard-mode
(fSCL= 100 kHz, tr = 1 µs)
Figure 16. Pass-Gate Voltage (Vpass) vs Supply Voltage
(VCC) at Three Temperature Points
300
350
400
450
D008
Fast-mode
(fSCL= 400 kHz, tr= 300 ns)
Figure 17. Maximum Pull-Up resistance (Rp(max)) vs Bus
Capacitance (Cb)
1.8
1.6
Rp(min) (kOhm)
1.4
1.2
1
0.8
0.6
0.4
VDPUX > 2V
VDPUX <= 2
0.2
0
0
0.5
1
1.5
2
2.5
3
3.5
VDPUX (V)
4
4.5
5
5.5
D009
VOL = 0.2*VDPUX, IOL = 2 mA when VDPUX ≤ 2 V
VOL = 0.4 V, IOL = 3 mA when VDPUX > 2 V
Figure 18. Minimum Pull-Up Resistance (Rp(min)) vs Pull-Up Reference Voltage (VDPUX)
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10 Power Supply Recommendations
The operating power-supply voltage range of the TCA9546A is 1.65 V to 5.5 V applied at the VCC pin. When the
TCA9546A is powered on for the first time or anytime the device needs to be reset by cycling the power supply,
the power-on reset requirements must be followed to ensure the I2C bus logic is initialized properly.
10.1 Power-On Reset Requirements
In the event of a glitch or data corruption, TCA9546A can be reset to its default conditions by using the power-on
reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This
reset also happens when the device is powered on for the first time in an application.
A power-on reset is shown in Figure 19.
VCC
Ramp-Up
Ramp-Down
VCC_TRR
VCC drops below VPORF – 50 mV
Time
Time to Re-Ramp
VCC_FT
VCC_RT
Figure 19. VCC is Lowered Below the POR Threshold, Then Ramped Back Up to VCC
Table 2 specifies the performance of the power-on reset feature for TCA9546A for both types of power-on reset.
Table 2. Recommended Supply Sequencing And Ramp Rates (1)
MAX
UNIT
VCC_FT
Fall time
PARAMETER
See Figure 19
1
100
ms
VCC_RT
Rise time
See Figure 19
0.1
100
ms
VCC_TRR
Time to re-ramp (when VCC drops below VPORF(min) – 50 mV or
when VCC drops to GND)
See Figure 19
40
VCC_GH
Level that VCC can glitch down to, but not cause a functional
disruption when VCC_GW = 1 μs
See Figure 20
1.2
V
VCC_GW
Glitch width that will not cause a functional disruption when
VCC_GH = 0.5 × VCC
See Figure 20
10
μs
VPORF
Voltage trip point of POR on falling VCC
See Figure 21
0.8
1.25
V
VPORR
Voltage trip point of POR on rising VCC
See Figure 21
1.05
1.5
V
(1)
MIN
TYP
μs
All supply sequencing and ramp rate values are measured at TA = 25°C
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Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width
(VCC_GW) and height (VCC_GH) are dependent on each other. The bypass capacitance, source impedance, and
device impedance are factors that affect power-on reset performance. Figure 20 and Table 2 provide more
information on how to measure these specifications.
VCC
VCC_GH
Time
VCC_GW
Figure 20. Glitch Width and Glitch Height
VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the
registers and the I2C/SMBus state machine are initialized to their default states. The value of VPOR differs based
on the VCC being lowered to or from 0. Figure 21 and Table 2 provide more details on this specification.
VCC
VPORR
VPORF
Time
POR
Time
Figure 21. VPOR
20
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11 Layout
11.1 Layout Guidelines
For PCB layout of the TCA9546A, common PCB layout practices should be followed but additional concerns
related to high-speed data transfer such as matched impedances and differential pairs are not a concern for I2C
signal speeds. It is common to have a dedicated ground plane on an inner layer of the board and pins that are
connected to ground should have a low-impedance path to the ground plane in the form of wide polygon pours
and multiple vias. By-pass and de-coupling capacitors are commonly used to control the voltage on the VCC pin,
using a larger capacitor to provide additional power in the event of a short power supply glitch and a smaller
capacitor to filter out high-frequency ripple.
In an application where voltage translation is not required, all VDPUX voltages and VCC could be at the same
potential and a single copper plane could connect all of pull-up resistors to the appropriate reference voltage. In
an application where voltage translation is required, VDPUM, VDPU0, VDPU1, VDPU2, and VDPU3 may all be on the
same layer of the board with split planes to isolate different voltage potentials.
To reduce the total I2C bus capacitance added by PCB parasitics, data lines (SCn and SDn) should be a short as
possible and the widths of the traces should also be minimized (e.g. 5-10 mils depending on copper weight).
11.2 Layout Example
LEGEND
Partial Power Plane
VIA to Power Plane
Polygonal
Copper Pour
To I2C Master
VIA to GND Plane (Inner Layer)
VDPUM
By-pass/De-coupling
capacitors
GND
VCC
A1
SDA
RESET
SCL
SD0
SD1
SC1
VDPU3
A2
SC3
SD3
SC2
SD2
GND
VDPU1
VDPU2
To Slave Channel 2
GND
TCA9546A
A0
SC0
To Slave Channel 1
VCC
To Slave Channel 3
To Slave Channel 0
VDPU0
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation
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PACKAGE OPTION ADDENDUM
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29-Oct-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TCA9546ADR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
TCA9546A
TCA9546APWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PW546A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Oct-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TCA9546ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
TCA9546APWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Oct-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TCA9546ADR
SOIC
D
16
2500
367.0
367.0
38.0
TCA9546APWR
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
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EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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