Texas Instruments | DS90UB948-Q1 2K FPD-Link III to OpenLDI Deserializer (Rev. B) | Datasheet | Texas Instruments DS90UB948-Q1 2K FPD-Link III to OpenLDI Deserializer (Rev. B) Datasheet

Texas Instruments DS90UB948-Q1 2K FPD-Link III to OpenLDI Deserializer (Rev. B) Datasheet
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DS90UB948-Q1
SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
DS90UB948-Q1 2K FPD-Link III to OpenLDI Deserializer
1 Features
3 Description
•
•
The DS90UB948-Q1 is a FPD-Link III deserializer
which, in conjunction with the DS90UB949A/949/947Q1 serializers, converts 1-lane or 2-lane FPD-Link III
streams into a FPD-Link (OpenLDI) interface. The
Deserializer is capable of operating over costeffective 50-Ω single-ended coaxial or 100-Ω
differential shielded twisted-pair (STP) cables. It
recovers the data from one or two FPD-Link III serial
streams and translates it into dual pixel FPD-Link (8
LVDS data lanes + clock) supporting video
resolutions up to 2K (2048x1080) with 24-bit color
depth. This provides a bridge between HDMI enabled
sources such as GPUs to connect to existing LVDS
displays or application processors.
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 2: –40°C to
+105°C Ambient Operating Temperature
Supports Pixel Clock Frequency up to 192 MHz
for up to 2K (2048x1080) Resolutions With 24-Bit
Color Depth
1-Lane or 2-Lane FPD-Link III Interface With DeSkew Capability
Single or Dual OpenLDI (LVDS) Transmitter
– Single Channel: Up to 96-MHz Pixel Clock
– Dual Channel: Up to 192-MHz Pixel Clock
– Configurable 18-Bit RGB or 24-Bit RGB
Four High-Speed GPIOs (up to 2 Mbps each)
Adaptive Receive Equalization
– Compensates for Channel Insertion Loss of up
to –15.3 dB at 1.7 GHz
– Provides Automatic Temperature and Cable
Aging Compensation
SPI Control Interfaces up to 3.3 Mbps
I2C (Master/Slave) With 1-Mbps Fast-Mode Plus
Image Enhancement (White Balance and
Dithering)
Supports 7.1 Multiple I2S (4 Data) Channels
2 Applications
•
Automotive Infotainment:
– Central Information Displays
– Rear Seat Entertainment Systems
– Digital Instrument Clusters
The FPD-Link III interface supports video and audio
data transmission and full duplex control, including
I2C and SPI communication, over the same
differential link. Consolidation of video data and
control over two differential pairs decreases the
interconnect size and weight and simplifies system
design. EMI is minimized by the use of low voltage
differential
signaling,
data
scrambling,
and
randomization. In backward compatible mode, the
device supports up to WXGA and 720p resolutions
with 24-bit color depth over a single differential link.
The device automatically senses the FPD-Link III
channels and supplies a clock alignment and de-skew
functionality without the need for any special training
patterns. This ensures skew phase tolerance from
mismatches in interconnect wires such as PCB trace
routing, cable pair-to-pair length differences, and
connector imbalances.
Device Information(1)
PART NUMBER
DS90UB948-Q1
PACKAGE
WQFN (64)
BODY SIZE (NOM)
9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Figure 1. Typical Application
FPD-Link III
2 lanes
HDMI
or
DP++
IN_CLK-/+
Mobile
Device
or
Graphics
Processor
IN_D0-/+
IN_D1-/+
FPD-Link
Open LDI
D3±
DOUT0+
RIN0+
DOUT0-
RIN0-
DOUT1+
RIN1+
D0±
DOUT1-
RIN1-
CLK1±
D2±
D1±
D4±
IN_D2-/+
CEC
DDC
HPD
DS90UB949-Q1
Serializer
Display
or
Graphics
Processor
D5±
DS90UB948-Q1
Deserializer
D6±
D7±
CLK2±
I2C
IDx
HS_GPIO
(SPI)
I2C
IDx
HS_GPIO
(SPI)
Copyright © 2018, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90UB948-Q1
SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 5
Specifications....................................................... 11
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
7
Absolute Maximum Ratings ....................................
ESD Ratings............................................................
Recommended Operating Conditions.....................
Thermal Information ................................................
DC Electrical Characteristics ..................................
AC Electrical Characteristics...................................
Timing Requirements for the Serial Control Bus ....
Switching Characteristics ........................................
Timing Diagrams and Test Circuits.........................
Typical Characteristics ..........................................
11
11
11
12
12
15
16
17
18
21
Detailed Description ............................................ 22
7.1
7.2
7.3
7.4
7.5
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Image Enhancement Features................................
22
22
23
40
48
7.6 Programming........................................................... 51
7.7 Register Maps ......................................................... 54
8
Application and Implementation ........................ 85
8.1 Application Information ......................................... 85
8.2 Typical Applications ................................................ 85
9
Power Supply Recommendations...................... 90
9.1 Power-Up Requirements and PDB Pin ................... 90
9.2 Power Sequence..................................................... 91
10 Layout................................................................... 93
10.1
10.2
10.3
10.4
Layout Guidelines .................................................
Ground ..................................................................
Routing FPD-Link III Signal Traces .....................
Layout Example ....................................................
93
93
93
95
11 Device and Documentation Support ................. 97
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
97
97
97
97
97
97
12 Mechanical, Packaging, and Orderable
Information ........................................................... 98
4 Revision History
Changes from Revision A (January 2016) to Revision B
Page
•
Changed PCLK frequency to support higher speed 192 MHz. ............................................................................................. 1
•
Changed "1.2 V" to "1.25 V" at top of DS90Ux940 Deserializer in Typ App.......................................................................... 1
•
Simplified the typical application by removing the power supplies nodes. ............................................................................ 1
•
Removed bolded pin description name for power supplies. .................................................................................................. 5
•
Added new pin description content to the Pin Functions table ............................................................................................. 5
•
Changed the description from VDDIO to V(I2C). .................................................................................................................. 6
•
Specified in current instead of resistor for all pulldown resistor ............................................................................................ 6
•
Removed 200-µA minimum ramp time for PDB pin description. ........................................................................................... 7
•
Added the description to clarify the INTB_IN that this pin can be an output driver................................................................ 7
•
Changed pin names from CAP_PLL0 and CAP_PLL1 to RES0 and RES1 respectively. .................................................... 9
•
Removed tablenote from the Absolute Maximum Ratings table: For soldering specifications, see product folder at
www.ti.com and SNOA549 .................................................................................................................................................. 11
•
Added Military/Aerospace tablenote to the Absolute Maximum Ratings table .................................................................... 11
•
Changed supply voltage maximum for the VDD33 from: 4 V to: 3.96 V ............................................................................. 11
•
Changed VDD12 abs max from 1.8V to 1.44V. .................................................................................................................. 11
•
Changed supply voltage for the VDDIO from: 4 V to: 3.96 V .............................................................................................. 11
•
Added the Added the open-drain voltage, CML output voltage, and FPD-Link III input voltage parameters to the
Absolute Maximum Ratings table , open-drain voltage, CML output voltage, and FPD-Link III input voltage
parameters to the Absolute Maximum Ratings table ........................................................................................................... 11
•
Added test conditions to the LVCMOS I/O voltage parameter ............................................................................................ 11
•
Spelled out all GPIOs pin name. .......................................................................................................................................... 11
•
Combined the ESD ratings into one ESD Ratings table ..................................................................................................... 11
•
Removed VDD18 test condition from the supply voltage parameter .................................................................................. 11
2
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SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
Revision History (continued)
•
Added the open-drain voltage parameter to the Recommended Operating Conditions table ............................................ 11
•
Changed open LDI clock frequency (dual link) maximum from: 170 MHz to: 192 MHz ..................................................... 11
•
Added the local I2C frequency parameter to the Recommended Operating Conditions table ........................................... 11
•
Added test conditions to the supply noise parameter ......................................................................................................... 12
•
Changed the total power consumption, normal operation test conditions ........................................................................... 12
•
Changed "VDD12 = 1.2 V" to "VDD12 = 1.2 V" ................................................................................................................... 12
•
Removed the checkerboard vs. PRBS pattern condition and combined typical and worst case together. ........................ 12
•
Added current specs for PCLK 192 MHz. ........................................................................................................................... 12
•
Deleted typical value for Vih and Vil in 3.3V LVCMOS I/O. ................................................................................................. 12
•
Split out the test conditions in the 3.3-V and 1.8-V LVCMOS I/O parameters .................................................................... 12
•
Added strap pin input current parameter to the DC Electrical Characteristics table ........................................................... 13
•
Deleted typical value for Vih and Vil in 1.8V LVCMOS I/O. ................................................................................................ 13
•
Deleted typical value for Vih and Vil in serial control bus ................................................................................................... 13
•
Added test conditions to the input high level and input low level parameters ..................................................................... 13
•
Changed "complimentary" to "complementary" ................................................................................................................... 14
•
Removed tablenote from the AC Electrical Characteristics table: This parameter is specified by characterization and
is not tested in production. .................................................................................................................................................. 15
•
Changed differential output eye height from: >300 mV to: 300 mV .................................................................................... 15
•
Removed tablenote from the Timing Requirements table: Parameter is specified by bench characterization and is
not tested in production. ...................................................................................................................................................... 16
•
Changed Cb fast mode plus maximum value from: 550 pF to: 200 pF ............................................................................... 16
•
Removed tablenote from the Switching Characteristics table: Parameter is specified by bench characterization and
is not tested in production. .................................................................................................................................................. 17
•
Changed Deserializer Eye Diagram graph in the Typical Characteristics section ............................................................... 21
•
Added paragraph explains HSCC mode. ............................................................................................................................. 25
•
Changed transmission distance section and insertion loss table. ....................................................................................... 31
•
Changed PCLK frequncy from 96 MHz to 192 MHz in the diagram "2-lane FPD-link Input, Link OpenLDI Output" in
the Data-Path Configurations graphic .................................................................................................................................. 41
•
Changed the resistor ratio value for both the Configuration Select (MODE_SEL0) and Configuration Select
(MODE_SEL1) tables. .......................................................................................................................................................... 42
•
Deleted repeated first paragraph LUT contents. ................................................................................................................. 48
•
Changed pullup power supply node from "VDDIO" to "V(I2C). ........................................................................................... 51
•
Updated register table format to the latest TI standards in the Register Maps section ....................................................... 54
•
Changed input value from 1.2 V to 1.2 V in typical application drawings ........................................................................... 85
•
Updated STP diagram. ........................................................................................................................................................ 86
•
Updated Coax diagram......................................................................................................................................................... 87
•
Simplified the diagram by removing power supplies node. ................................................................................................. 88
•
Added new design parameters to the Design Requirements section ................................................................................. 88
•
Changed VDD12 in Design Parameters 1.2 to 1.2 ............................................................................................................. 88
•
Changed CML Interconnect Guidelines section title to FPD-Link III Interconnect Guidelines ............................................ 89
•
Added AV Mute Prevention section ..................................................................................................................................... 89
•
Added Prevention of I2C Errors During Abrupt System Faults section ............................................................................... 90
•
Moved the Power Sequence graphic to the Power Supply Recommendations ................................................................... 91
•
Removed power supplies columns and changed the parameters in the Power-Up Sequencing Constraints table
according to the diagram. .................................................................................................................................................... 91
•
Moved the PCB Layout and Power System Considerations content to the Layout Guidelines section .............................. 93
•
Added Ground and Routing FPD-Link III Signal Traces sections to the Layout section...................................................... 93
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DS90UB948-Q1
SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
www.ti.com
Revision History (continued)
•
Added Added FPD-Link training videos to the Related Documentation section. ................................................................ 97
Changes from Original (October 2014) to Revision A
Page
•
Added shared pins description on SPI pins .......................................................................................................................... 6
•
Added shared pins description on GPIO pins ....................................................................................................................... 7
•
Added shared pins description on D_GPIO pins ................................................................................................................... 8
•
Added shared pins description on register only GPIO pins. Changed "Local register control only" to "I2C register
control only". .......................................................................................................................................................................... 8
•
Added shared pins description on slave mode I2S pins ....................................................................................................... 8
•
Added shared pins description on master mode I2S pins ..................................................................................................... 9
•
Added legend for I/O TYPE .................................................................................................................................................. 10
•
Moved Storage Temperature Range from ESD to Absolute Maximum Ratings table ........................................................ 11
•
Added ESD Ratings table..................................................................................................................................................... 11
•
Changed IDD12Z limit from 8mA to 30mA per PE re-characterization ............................................................................... 12
•
Changed VOS from 1.0V to 1.125V ...................................................................................................................................... 14
•
Changed VOS from 1.5V to 1.375V ...................................................................................................................................... 14
•
Changed Fast Plus Mode tSP maximum from 20ns to 50ns ................................................................................................ 16
•
Added Image Enhancement Features section .................................................................................................................... 48
•
Changed default value from "0" to "1" in register 0x01[2] ................................................................................................... 56
•
Added description to register 0x01[1] "Registers which are loaded by pin strap will be restored to their original strap
value when this bit is set. These registers show ‘Strap’ as their default value in this table." ............................................. 56
•
Added to 0x02[7] in Description column "A Digital reset 0x01[0] should be asserted after toggling Output Enable bit
LOW to HIGH" ..................................................................................................................................................................... 56
•
Added "Loaded from remote SER" in register 0x07[7:1] function column............................................................................ 59
•
Changed signal detect bit to reserved ................................................................................................................................. 65
•
Changed from Reserved to Rev-ID in register 0x1D Function column ............................................................................... 65
•
On register 0x22 added "(Loaded from remote SER)" ......................................................................................................... 69
•
Corrected in register 0x24[3] 0: Bist configured through "bit 0" to "bits 2:0" in description ................................................. 71
•
Added in register 0x24[2:1] additional description................................................................................................................ 71
•
Changed in register 0x24[1] description to "internal" .......................................................................................................... 71
•
Changed in register 0x24[2] description to "internal" .......................................................................................................... 71
•
On register 0x28 added "Loaded from remote SER" ........................................................................................................... 72
•
Added clarification description on register 0x37 MODE_SEL .............................................................................................. 75
•
Merged on 0x45 bits[7:4} and bits[3:0] default value: 0x08.................................................................................................. 78
•
Added Power Sequence section ......................................................................................................................................... 91
4
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SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
5 Pin Configuration and Functions
PDB
IDX
I2C_SDA
I2C_SCL
VDDL12_1
D0-
D0+
D1-
D1+
D2-
D2+
CLK1-
CLK1+
D3-
D3+
VDD25_CAP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
NKD Package
64-Pin WQFN
Top View
RES0
49
32
VDDP12_LVDS
MODE_SEL1
50
31
VDD33_B
VDDP12_CH0
51
30
D4-
VDDR12_CH0
52
29
D4+
RIN0+
53
28
D5-
RIN0-
54
27
D5+
CMF
55
26
D6-
VDD33_A
56
25
D6+
VDDR12_CH1
57
24
CLK2-
RIN1+
58
23
CLK2+
RIN1-
59
22
D7-
VDDP12_CH1
60
21
D7+
MODE_SEL0
61
20
VDD12_LVDS
CMLOUTP
62
19
D_GPIO0/MOSI
CMLOUTN
63
18
D_GPIO1/MISO
RES1
64
17
D_GPIO2/SPLK
DS90UB948-Q1
64 WQFN
Top Down View
8
9
10
11
12
13
14
15
16
SWC/GPIO1
I2S_DD/GPIO3
I2S_DC/GPIO2
I2S_DB/GPIO5_REG
I2S_DA/GPIO6_REG
I2S_CLK/GPIO8_REG
I2S_WC/GPIO7_REG
MCLK/GPIO9
D_GPIO3/SS
5
BISTEN
7
4
BISTC / INTB_IN
SDOUT/GPIO0 / PASS
3
VDDIO
6
2
VDDL12_0
1
LOCK
CAP_I2S
DAP
Pin Functions
PIN
NAME
NUMBER
I/O, TYPE
DESCRIPTION
OLDI OUTPUT PINS
CLK1–
CLK1+
37
36
O, LVDS
CLK2–
CLK2+
24
23
O, LVDS
Clock differential output pins
This pair requires an external 100-Ω termination for LVDS. Leave unused pins as No
Connect. Do not connect to an external pullup or pulldown. Unused LVDS outputs,
terminate with a single external 100-Ω termination at the end of the transmission line.
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DS90UB948-Q1
SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
www.ti.com
Pin Functions (continued)
PIN
NAME
NUMBER
I/O, TYPE
D0–
D0+
43
42
O, LVDS
D1–
D1+
41
40
O, LVDS
D2–
D2+
39
38
O, LVDS
D3–
D3+
35
34
O, LVDS
D4–
D4+
30
29
O, LVDS
D5–
D5+
28
27
O, LVDS
D6–
D6+
26
25
O, LVDS
D7–
D7+
22
21
O, LVDS
RIN0–
54
I/O
RIN0+
53
I/O
RIN1–
59
I/O
RIN1+
58
I/O
CMF
55
I/O
DESCRIPTION
Differential data output pins
This pair requires an external 100-Ω termination for LVDS. Leave unused pins as No
Connect. Do not connect to an external pullup or pulldown. Unused LVDS outputs,
terminate with a single external 100-Ω termination at the end of the transmission line.
FPD-LINK III INTERFACE
FPD-Link III RX Port 0 pins. The port receives FPD-Link III high-speed forward channel
video and control data and transmits back channel control data. It can interface with a
compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 51 and
Figure 52). It must be AC-coupled per Table 86. Leave unused pins as No Connect. Do
not connect to an external pullup or pulldown.
FPD-Link III RX Port 1 pins. The port receives FPD-Link III high-speed forward channel
video and control data and transmits back channel control data. It can interface with a
compatible FPD-Link III serializer TX through a STP or coaxial cable (see Figure 51 and
Figure 52). It must be AC-coupled per Table 86. Leave unused pins as No Connect. Do
not connect to an external pullup or pulldown.
Common mode filter – connect 0.1-µF capacitor to GND
I2C PINS
I2C_SDA
46
I/O, OD
I2C Data Input / Output Interface pin. See Serial Control Bus.
Open drain output; this pin must have an external pullup resistor to VI2C DO NOT
FLOAT.
Recommend a 2.2 kΩ or 4.7 kΩ pullup to 1.8 V or 3.3 V respectively. See I2C Bus
Pullup Resistor Calculation (SLVA689).
I2C Data Input / Output Interface pin. See Serial Control Bus.
Open drain output; this pin must have an external pullup resistor to VI2C DO NOT
FLOAT.
Recommend a 2.2 kΩ or 4.7 kΩ pullup to 1.8 V or 3.3 V respectively. See I2C Bus
Pullup Resistor Calculation (SLVA689).
I2C_SCL
45
I/O, OD
IDx
47
I, S
MOSI
(D_GPIO0)
19
I/O, PD
SPI Master Output, Slave Input pin (function programmed through register)
It is a multifunction pin (shared with D_GPIO0) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown.
MISO
(D_GPIO1)
18
I/O, PD
SPI Master Input, Slave Output pin (function programmed through register)
It is a multifunction pin (shared with D_GPIO1) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown.
SPLK
(D_GPIO2)
17
I/O, PD
SPI Clock pin (function programmed through register)
It is a multifunction pin (shared with D_GPIO2) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown.
SS
(D_GPIO3)
16
I/O, PD
SPI Slave Select pin (function programmed through register)
It is a multifunction pin (shared with D_GPIO0) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown.
I2C Serial Control Bus Device ID Address Select configuration pin Connect to an
external pullup to VDD18 and a pulldown to GND to create a voltage divider.
See Table 10.
SPI PINS
6
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SNLS477B – OCTOBER 2014 – REVISED NOVEMBER 2018
Pin Functions (continued)
PIN
NAME
NUMBER
I/O, TYPE
DESCRIPTION
CONTROL PINS
MODE_SEL0
61
I, S
Mode Select 0 configuration pin
Connect to external pullup to VDD33 and pulldown to GND to create a voltage divider.
See Configuration Select (MODE_SEL0) Table 8.
MODE_SEL1
50
I, S
Mode Select 1 configuration pin
Connect to external pullup to VDD33 and pulldown to GND to create a voltage divider.
See Configuration Select (MODE_SEL1) Table 9.
PDB
BISTEN
BISTC
(INTB_IN)
INTB_IN
(BISTC)
48
5
4
4
I, PD
Inverted Power-Down input pin
Typically connected to a processor GPIO with a pulldown. When PDB input is brought
HIGH, the device is enabled and internal registers and state machines are reset to
default values. Asserting PDB signal low will power down the device and consume
minimum power. The default function of this pin is PDB = LOW; POWER DOWN with
an weak (>100-kΩ) internal pulldown enabled. PDB should remain low until after power
supplies are applied and reach minimum required levels.
PDB = 1, device is enabled (normal operation)
PDB = 0, device is powered down
When the device is in the POWER DOWN state, the LVCMOS outputs are in tri-state,
the PLL is shut down, and IDD is minimized.
I, PD
BIST Enable pin
0: BIST mode is disabled
1: BIST mode is enabled
It is a configuration pin with a weak internal pulldown (3µA). If unused, tie to an external
pulldown. See Built-In Self Test (BIST) for more information.
I, PD
BIST Clock Select pin (function programmed through register)
0: PCLK
1: 33 MHz
It is a multifunction pin (shared with INTB_IN) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown.
I, PD
Interrupt Input pin (default function).
It is a multifunction pin (shared with BISTC) with a weak internal pulldown (3µA). Pin
function is programmed through registers. If unused, tie to an external pulldown. The
INTB_IN pin may act as an output driver and pull low when PDB is low (see Interrupt
Pin — Functional Description and Usage (INTB_IN)).
GPIO PINS
GPIO0
(SDOUT)
GPIO1
(SWC)
GPIO2
(I2S_DC)
GPIO3
(I2S_DD)
GPIO9
(MCLK)
7
8
10
9
15
I/O
General Purpose Input / Output 0 pin (default function)
default state: logic LOW
It is a multifunction pin (shared with SDOUT) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
General Purpose Input / Output 1 pin (default function)
default state: logic LOW
It is a multifunction pin (shared with SWC) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
General Purpose Input / Output 2 pin (default function)
default state: logic LOW
It is a multifunction pin (shared with I2S_DC) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
General Purpose Input / Output 3 pin (default function)
default state: logic LOW
It is a multifunction pin (shared with I2C_DD) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
General Purpose Input / Output 9 pin (default function)
default state: logic LOW
It is a multifunction pin (shared with MCLK) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
HIGH-SPEED GPIO PINS
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Pin Functions (continued)
PIN
NAME
D_GPIO0
(MOSI)
D_GPIO1
(MISO)
D_GPIO2
(SPLK)
D_GPIO3
(SS)
NUMBER
I/O, TYPE
19
18
17
16
DESCRIPTION
I/O
High-Speed General Purpose Input / Output 0 pin (default function)
default state: tri-state
Only available in Dual Link Mode. It is a multifunction pin (shared with MOSI) with a
weak internal pulldown (3 μA). Pin function is programmed through registers. See
General-Purpose I/O (GPIO). If unused, tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 1 pin (default function)
default state: tri-state
Only available in Dual Link Mode. It is a multifunction pin (shared with MISO) with a
weak internal pulldown (3 μA). Pin function is programmed through registers. See
General-Purpose I/O (GPIO). If unused, tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 2 pin (default function)
default state: tri-state
Only available in Dual Link Mode. It is a multifunction pin (shared with SPLK) with a
weak internal pulldown (3 μA). Pin function is programmed through registers. See
General-Purpose I/O (GPIO). If unused, tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 3 pin (default function)
default state: tri-state
Only available in Dual Link Mode. It is a multifunction pin (shared with SS) with a weak
internal pulldown (3 μA). Pin function is programmed through registers. See GeneralPurpose I/O (GPIO). If unused, tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 5 pin (default function)
I2C register control only
default state: logic LOW
It is a multifunction pin (shared with I2S_DB) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 6 pin (default function)
I2C register control only
default state: logic LOW
It is a multifunction pin (shared with I2S_DA) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 7 pin (default function)
I2C register control only
default state: logic LOW
It is a multifunction pin (shared with I2S_WC) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
I/O
High-Speed General Purpose Input / Output 8 pin (default function)
I2C register control only
default state: logic LOW
It is a multifunction pin (shared with I2S_CLK) with a weak internal pulldown (3 μA). Pin
function is programmed through registers. See General-Purpose I/O (GPIO). If unused,
tie to an external pulldown.
REGISTER ONLY GPIO PINS
GPIO5_REG
(I2S_DB)
GPIO6_REG
(I2S_DA)
GPIO7_REG
(I2S_WC)
GPIO8_REG
(I2S_CLK)
11
12
14
13
SLAVE MODE LOCAL I2S CHANNEL PINS
I2S_WC
(GPIO7_REG)
14
O
Slave Mode I2S Word Clock Output pin (function programmed through register)
It is a multifunction pin (shared with GPIO7_REG). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
I2S_CLK
(GPIO8_REG)
13
O
Slave Mode I2S Clock Output pin (function programmed through register)
NOTE: Disable I2S data jitter cleaner, when using these pins, through the register
bit I2S Control: 0x2B[7]=1
It is a multifunction pin (shared with GPIO8_REG). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
I2S_DA
(GPIO6_REG)
12
O
Slave Mode I2S Data Output pin (function programmed through register)
It is a multifunction pin (shared with GPIO6_REG). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
I2S_DB
(GPIO5_REG)
11
O
Slave Mode I2S Data Output pin (function programmed through register)
It is a multifunction pin (shared with GPIO5_REG). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
8
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Pin Functions (continued)
PIN
NAME
NUMBER
I/O, TYPE
DESCRIPTION
I2S_DC
(GPIO2)
10
O
Slave Mode I2S Data Output (function programmed through register)
It is a multifunction pin (shared with GPIO2). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
I2S_DD
(GPIO3)
9
O
Slave Mode I2S Data Output (function programmed through register)
It is a multifunction pin (shared with GPIO3). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
MASTER MODE LOCAL I2S CHANNEL PINS
SWC
(GPIO1)
8
O
Master Mode I2S Word Clock Output pin (function is programmed through registers)
(Pin is shared with GPIO1)
It is a multifunction pin (shared with GPIO1). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
SDOUT
(GPIO0)
7
O
Master Mode I2S Data Output pin (function is programmed through registers)
(Pin is shared with GPIO0)
It is a multifunction pin (shared with GPIO0). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
MCLK
(GPIO9)
15
O
Master Mode I2S System Clock Output pin (function is programmed through registers)
(Pin is shared with GPIO9)
It is a multifunction pin (shared with GPIO9). Pin function is programmed through
registers. See I2S Audio Interface. If unused, tie to an external pulldown.
1
O
Lock Status Output pin
LOCK = 1: PLL acquired lock to the reference clock input
LOCK = 0: PLL is unlocked
7
O
Normal mode status output pin (BISTEN = 0)
PASS = 1: No fault detected on input display timing
PASS = 0: Indicates an error condition or corruption in display timing. Fault condition
occurs:
1. DE length value mismatch measured once in succession
2. VSync length value mismatch measured twice in succession
BIST mode status output pin (BISTEN = 1)
PASS = 1: No error detected
PASS = 0: Error detected
VDD33_A,
VDD33_B
56
31
P
3.3-V (±10%) supply. Power to on-chip regulator. Requires 10-µF, 1-µF, 0.1-µF, and
0.01-µF capacitors to GND.
VDDIO
3
P
LVCMOS I/O power supply: 1.8 V (±5%) OR 3.3 V (±10%). Requires 10-µF, 1-µF, 0.1µF, and 0.01-µF capacitors to GND.
VDD12_LVDS
VDDP12_LVDS
VDDL12_0
VDDL12_1
VDDP12_CH0
VDDR12_CH0
VDDP12_CH1
VDDR12_CH1
20
32
6
44
51
52
60
57
P
1.2-V (±5%) supply. Requires 10-µF, 1-µF, 0.1-µF, and 0.01-µF capacitors to GND at
each VDD pin.
CAP_I2S
VDD25_CAP
2
33
D
Decoupling capacitor connection for on-chip regulator. Recommend to connect with a
0.1-μF decoupling capacitor to GND.
DAP
G
DAP is the large metal contact at the bottom side, located at the center of the WQFN
package. Connect to the ground plane (GND) with at least 32 vias.
CMLOUTP
CMLOUTN
62
63
O
Channel Monitor Loop-through Driver differential output pins Route to a test point or a
pad with 100-Ω termination resistor between pins for channel monitoring
(recommended). See Figure 48 or Figure 49.
RES0
RES1
49
64
-
Reserved pins. 0.1-µF decoupling capacitor could be placed to GND. May be left
floating as No Connect pins.
STATUS PINS
LOCK
PASS
POWER and GROUND
VSS
OTHER PINS
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The following definitions define the functionality of the I/O cells for each pin.
I/O
•
•
•
•
•
•
•
•
10
TYPE:
P = Power supply
G = Ground
D = Decoupling for an internal linear regulator
S = Configuration/Strap Input (All strap pins have internal pulldowns determined by IOZ specification. If the default strap value is
needed to be changed then an external resistor should be used.
I = Input
O = Output
I/O = Input/Output
PD = Internal pulldown
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage
Configuration input
voltage
(2)
MIN
MAX
UNIT
VDD33 (VDD33_A, VDD33_B)
–0.3
3.96
V
VDD12 (VDDL_0, VDDL_1, VDDP12_CH0, VDDR12_CH0,
VDDP12_CH1, , VDDR12_CH1, VDD12_LVDS, VDDP12_LVDS)
-0.3
1.44
V
VDDIO
–0.3
3.96
V
IDX, MODE_SEL0, MODE_SEL1
–0.3
3.96
V
PDB, BIST_EN
-0.3
3.96
V
LVCMOS I/O voltage GPIO0, GPIO1, GPIO2, GPIO3, D_GPIO0, D_GPIO1, D_GPIO2,
D_GPIO3, GPIO5_REG, GPIO6_REG, GPIO7_REG, GPIO8_REG, LOCK,
PASS, INTB_IN, MCLK
–0.3
V(VDDIO) +
0.3
V
Open-Drain voltage
I2C_SDA, I2C_SCL
–0.3
3.96
V
CML output voltage
CMLOUTP, CMLOUTN
-0.3
2.75
V
FPD-Link III input
voltage
RIN0+, RIN0-, RIN1+, RIN1-
–0.3
2.75
V
150
°C
150
°C
Junction temperature, TJ
Storage temperature range, Tstg
(1)
(2)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office or Distributors for availability and
specifications.
6.2 ESD Ratings
VALUE
V(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002 (1)
±8000
Charged-device model (CDM), per AEC Q100-011
±1250
ESD Ratings (IEC 61000-4-2)
RD = 330 Ω, CS = 150 pF
ESD Ratings (ISO10605)
RD = 330 Ω, CS = 150 and 330 pF
RD = 2 kΩ, CS = 150 and 330 pF
(1)
Contact Discharge
(RIN0+, RIN0-, RIN1+, RIN1–)
±8000
Air-gap Discharge
(RIN0+, RIN0-, RIN1+, RIN1–)
±15000
Contact Discharge (RIN0+, RIN0-, RIN1+,
RIN1-)
±8000
Air-gap Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)
±15000
UNIT
V
AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
Supply voltage
MIN
NOM
V(VDD33)
3
3.3
3.6
V
V(VDD12)
1.14
1.2
1.26
V
3
3.3
3.6
V
1.8
1.89
V
LVCMOS I/O supply
voltage
V(VDDIO) = 3.3 V
OR V(VDDIO) = 1.8 V
1.71
Open-drain voltage
I2C pins = V(I2C)
1.71
−40
Operating free air temperature, TA
25
MAX
UNIT
3.6
V
105
°C
Open LDI clock frequency (single link)
25
96
MHz
Open LDI clock frequency (dual link)
50
192
MHz
1
MHz
Local I2C frequency, fI2C
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Recommended Operating Conditions (continued)
Over operating free-air temperature range (unless otherwise noted)
MIN
Supply noise (1)
(1)
NOM
MAX
UNIT
V(VDD33)
100
mVP-P
V(VDDIO) = 3.3 V
100
mVP-P
V(VDDIO) = 1.8 V
50
mVP-P
V(VDD12)
25
mVP-P
DC to 50 MHz.
6.4 Thermal Information
DS90UB948-Q1
THERMAL METRIC (1)
NKD (WQFN)
UNIT
64 PINS
RθJA
Junction-to-ambient thermal resistance
24.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
6.2
°C/W
RθJB
Junction-to-board thermal resistance
3.6
°C/W
ψJT
Junction-to-top characterization parameter
0.1
°C/W
ψJB
Junction-to-board characterization parameter
3.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN/FREQ.
MIN
TYP
MAX
UNIT
858
1146
mW
40
70
mW
VDD12 = 1.2 V
169
223
mA
VDD33 = 3.6 V
168
222
mA
IDDIO
VDDIO = 1.89 V
or 3.6 V
14
19
mA
IDD12
VDD12 = 1.2 V
189
mA
VDD33 = 3.6 V
188
mA
IDDIO
VDDIO = 1.89 V
or 3.6 V
16
mA
IDD12Z
VDD12 = 1.2 V
2
30
IDD33Z Supply current,
power-down mode
IDDIOZ
VDD33 = 3.6 V
2
8
0.1
1
POWER CONSUMPTION
PT
Total power
consumption, normal
operation
PCLK = 170 MHz.
2-lane FPD-Link III input, dual-link OLDI output
PZ
Total power
consumption, powerdown mode
PDB = 0 V
VDD
SUPPLY CURRENT
IDD12
IDD33
Supply current,
normal operation
Supply current,
normal operation
IDD33
PCLK = 170 MHz.
2-lane FPD-Link III input, dual-link OLDI output
PCLK = 192 MHz
2-lane FPD-Link III input, dual link OLDI Output
PDB = 0 V
VDDIO = 1.89 V
or 3.6 V
mA
mA
3.3-V LVCMOS I/O (V(VDDIO) = 3.3 V ± 10%)
VIH
VIL
12
High level input
voltage
Low level input
voltage
2
V(VDDIO)
V
0
0.8
V
PDB, BISTEN
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
VIH
High level input
voltage
VIL
Low level input
voltage
IIN
Input current
IINSTRAP
TEST CONDITIONS
VIN = 0 V or V(VDDIO)
Strap pin input current VIN = 0V or V(VDD33)
VOH
High level output
voltage
IOH = –4 mA
VOL
Low level output
voltage
IOL = 4 mA
IOS
Output short-circuit
current
VOUT = 0 V
IOZ
Tri-state output
current
PDB = 0 V
VOUT = 0 V or V(VDDIO)
CIN
Input capacitance
PIN/FREQ.
BISTC,
GPIO[3:0],
D_GPIO[3:0],
I2S_DA,
I2S_DB,
I2S_DC,
I2S_DD,
I2S_CLK,
I2S_WC, LOCK,
PASS
IDX,
MODE_SEL0,
MODE_SEL1
BISTC,
GPIO[3:0],
D_GPIO[3:0],
I2S_DA,
I2S_DB,
I2S_DC,
I2S_DD,
I2S_CLK,
I2S_WC, LOCK,
PASS
MIN
TYP
MAX
UNIT
2
V(VDDIO)
V
0
0.8
V
–10
10
µA
-1
1
µA
2.4
V(VDDIO)
V
0
0.4
V
–55
–20
mA
20
µA
10
pF
1.5
V(VDDIO)
V
0
0.35 ×
V(VDDIO)
V
0.65 ×
V(VDDIO)
V(VDDIO)
V
0
0.35 ×
V(VDDIO)
V
–10
10
µA
V(VDDIO)
– 0.45
V(VDDIO)
V
0
0.45
V
1.8-V LVCMOS I/O (V(VDDIO) = 1.8 V ± 5%)
VIH
High level input
voltage
PDB, BISTEN
VIL
High level input
voltage
VIH
High level input
voltage
VIL
Low level input
voltage
IIN
Input current
VIN = 0V or V(VDDIO)
VOH
High level output
voltage
IOH = –4 mA
VOL
Low level output
voltage
IOL = 4 mA
IOS
Output short-circuit
current
VOUT = 0 V
IOZ
Tri-state output
current
PDB = 0 V
VOUT = 0 V or V(VDDIO)
CIN
Input capacitance
BISTC,
GPIO[3:0],
D_GPIO[3:0],
I2S_DA,
I2S_DB,
I2S_DC,
I2S_DD,
I2S_CLK,
I2S_WC, LOCK,
PASS
–35
–20
mA
20
µA
10
pF
2
V(VDDIO)
V
0
0.9
1.58
V(VDDIO)
SERIAL CONTROL BUS (V(VDDIO) = 1.8 V ± 5% OR 3.3V ±10%)
VIH
Input high level
VIL
Input low level
VIH
Input high level
V(VDDIO) = 3.0 V to 3.6 V
V(VDDIO) = 1.71 V to 1.89 V
VIL
Input low level
VHYS
Input hysteresis
VOL
Output low level
IOL = 4 mA
IIN
Input current
VIN = 0 V or V(VDDIO)
I2C_SDA,
I2C_SCL
GND
0.9
50
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V
mV
0
0.4
V
–10
10
µA
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN/FREQ.
MIN
TYP
MAX
UNIT
FPD-LINK III INPUT
VTH
Differential threshold
high voltage
VTL
Differential threshold
low voltage
VID
Input differential
threshold
VCM
Differential commonmode voltage
RT
Internal termination
resistor - differential
50
VCM = 2.1 V
RIN0+, RIN0–
RIN1+, RIN1–
mV
–50
mV
100
mV
2.1
V
80
100
120
RL =100 Ω, VOD Setting 1. See Figure 11.
See Register Maps Register 0x4B for
configuration details.
220
380
540 mVP-P
RL =100 Ω, VOD Setting 2. See Figure 11.
See Register Maps Register 0x4B for
configuration details.
370
550
730 mVP-P
RL = 100 Ω, VOD Setting 3. See Figure 11.
See Register Maps Register 0x4B for
configuration details.
460
650
840 mVP-P
530
750
970 mVP-P
Ω
LVDS DRIVER
VOD
Output voltage swing
(differential)
RL = 100 Ω, VOD Setting 4. See Figure 11.
See Register Maps Register 0x4B for
configuration details.
ΔVOD
Change in VOD
between
RL = 100 Ω
complementary output
states
VOS
Offset voltage
RL = 100 Ω. See Figure 11.
ΔVOS
Change in VOS
between
complementary
Output States
RL = 100 Ω
IOS
Output short-circuit
current
IOZ
Output tri-state LVDS
driver current
D0±, D1±, D2±,
D3±, D4±, D5±,
D6±, D7±,
CLK1±, CLK2±
1.125
1
50
1.2
1.375
1
50
-20
PDB = 0 V
–500
mV
V
mV
mA
500
µA
LOOP-THROUGH MONITOR OUTPUT
VOD
14
Differential output
voltage
RL = 100 Ω
CMLOUTP,
CMLOUTN
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6.6 AC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN/FREQ.
MIN
TYP
MAX
UNIT
GPIO BIT RATE
Single OLDI output, OLDI Clock
= 25 to 96 MHz
Rb,FC
Forward channel bit rate
Dual OLDI output, OLDI Clock =
25 to 85 MHz
Rb,BC
GPIO[3:0]
Back channel bit rate
High speed (2-lane mode), 1
D_GPIO active
See Table 3
Rb,BC
Back channel bit rate
High speed (2-lane mode), 2
D_GPIOs active
See Table 3.
D_GPIO[3:0]
High speed (2-lane mode), 4
D_GPIOs active
See Table 3
Normal mode — see Table 3
0.25 ×
OLDI
Clock
Mbps
0.25 ×
OLDI
Clock
Mbps
133
kbps
2
Mbps
1.33
Mbps
800
kbps
133
kbps
tGPIO,FC
GPIO pulse width, forward
channel
GPIO[3:0]
>2/
OLDI
Clock
tGPIO,BC
GPIO pulse width, back channel
GPIO[3:0]
20
μs
PDB reset low pulse
PDB
2
ms
s
RESET
tLRST
LOOP-THROUGH MONITOR OUTPUT
EW
Differential output eye opening
width
EH
Differential output eye height
RL = 100 Ω, jitter frequency
>OLDI Clock / 40
See Figure 3
CMLOUTP,
CMLOUTN
0.4
UI (1)
300
mV
2
ns
>2 /
OLDI
Clock
or >77
ns
I2S TRANSMITTER
tJ,I2S
Clock output jitter
tI2S
I2S clock period (2)
See Figure 15
tHC,I2S
I2S clock high time (2)
See Figure 15
0.48
tI2S
tLC,I2S
I2S clock low time (2)
See Figure 15
0.48
tI2S
tSR,I2S
I2S set-up time
See Figure 15
0.4
tI2S
tHR,I2S
I2S hold time
See Figure 15
0.4
tI2S
(1)
(2)
I2S_CLK
I2S_DA,
I2S_DB,
I2S_DC,
I2S_DD
UI – Unit Interval is equivalent to one serialized data bit width. For Single Lane mode 1UI = 1 / (35 × PCLK). For Dual Lane mode, 1UI =
1 / (35 × PCLK / 2). The UI scales with PCLK frequency.
I2S specifications for tLC,I2S and tHC,I2S pulses must each be greater than 1 OLDI clock period to ensure sampling and supersedes the
0.35 × tI2S requirement. tLC,I2S and tHC,I2S must be longer than the greater of either 0.35 × tI2S or 2 × OLDI Clock.
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6.7 Timing Requirements for the Serial Control Bus
Over I2C supply and temperature ranges unless otherwise specified.
PARAMETER
fSCL
tLOW
tHIGH
tHD;STA
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
tBUF
SCL clock frequency
SCL low period
SCL high period
TEST CONDITIONS
MIN
MAX
UNIT
Standard mode
>0
100
kHz
Fast mode
>0
400
kHz
Fast plus mode
>0
1
MHz
Standard mode
4.7
µs
Fast mode
1.3
µs
Fast plus mode
0.5
µs
Standard mode
4
µs
Fast mode
0.6
µs
Fast plus mode
0.26
µs
Standard mode
4
µs
Hold time for a start or a repeated start
condition
Fast mode
Figure 14
Fast plus mode
0.6
µs
0.26
µs
Standard mode
4.7
µs
Fast mode
0.6
µs
Fast plus mode
0.26
µs
Standard mode
0
µs
Fast mode
0
µs
Fast plus mode
0
µs
Standard mode
250
ns
Fast mode
100
ns
Set-up time for a start or a repeated
start condition
Figure 14
Data hold time
Figure 14
Data set-up time
Figure 14
Set-up time for STOP condition
Figure 14
Bus free time
between STOP and START
Figure 14
Fast plus mode
50
ns
Standard mode
4
µs
Fast mode
0.6
µs
Fast plus mode
0.26
µs
Standard mode
4.7
µs
Fast mode
1.3
µs
Fast plus mode
0.5
µs
Standard mode
tr
tf
Cb
tSP
16
SCL and SDA rise time,
Figure 14
SCL and SDA fall time,
Figure 14
Capacitive load for each bus line
Input filter
1000
ns
Fast mode
300
ns
Fast plus mode
120
ns
Standard mode
300
ns
Fast mode
300
ns
Fast plus mode
120
ns
Standard mode
400
pF
Fast mode
400
pF
Fast plus mode
200
pF
Fast mode
50
ns
Fast plus mode
50
ns
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6.8 Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN/FREQ.
MIN
TYP
MAX
UNIT
LVDS DRIVER SWITCHING CHARACTERISTICS
tLVLHT
LVDS low-to-high transition time
20% to 80% transition, 5-pF
load
See Figure 10
0.15
0.25
ns
tLVHLT
LVDS high-to-low transition time
80% to 20% transition, 5-pF
load
See Figure 10
0.15
0.25
ns
tBIT
Transmitter output bit width
tPPOS0
Transmitter output pulse
positions normalized for Bit 0
1
UI (1)
tPPOS1
Transmitter output pulse
positions normalized for Bit 1
2
UI (1)
tPPOS2
Transmitter output pulse
positions normalized for Bit 2
3
UI (1)
tPPOS3
Transmitter output pulse
positions normalized for Bit 3
4
UI (1)
tPPOS4
Transmitter output pulse
positions normalized for Bit 4
5
UI (1)
tPPOS5
Transmitter output pulse
positions normalized for Bit 5
6
UI (1)
tPPOS6
Transmitter output pulse
positions normalized for Bit 6
7
UI (1)
tPPOS
Transmitter output pulse
positions (Bit 6 - Bit 0)
normalized
< 0.1
UI (1)
tCCS
Channel-to-channel skew
tJCC
Transmitter jitter cycle-to-cycle
1/7 × T
T = 1 / OLDI clock
frequency.
See Figure 12
100
ps
2-lane FPD-Link III input,
dual openLDI output
0.16
UI (1)
2-lane FPD-Link III input,
single OpenLDI Output
0.18
UI (1)
1-lane FPD-Link III input,
dual openLDI output
0.04
UI (1)
1-lane FPD-Link III input,
single openLDI output
0.04
UI (1)
100
ns
147 × T
ns
tPDD
Transmitter power-down delay
See Figure 6
tDD
Deserializer propagation delay
T = 1 / OLDI Clock
frequency. See Figure 5
(1)
D0±, D1±,
D2±, D3±,
D4±, D5±,
D6±, D7±,
CLK1±,
CLK2±
ns
UI - Unit Interval is equal to 1 / (7 × OLDI clock).
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6.9 Timing Diagrams and Test Circuits
+VOD
CLK1±,
CLK2±
-VOD
+VOD
D1±, D3±,
D5±, D7±
-VOD
+VOD
D0±, D2±,
D4±, D6±
-VOD
Cycle N+1
Cycle N
Figure 2. Checkerboard Data Pattern
EW
VOD (+)
RIN
(Diff.)
EH
0V
EH
VOD (-)
tBIT (1 UI)
Figure 3. CML Output Driver
VDDIO
80%
20%
GND
tCLH
tCHL
Figure 4. LVCMOS Transition Times
START
STOP
BIT SYMBOL N+3 BIT
§
START
STOP
BIT SYMBOL N+2 BIT
§
§
§
START
STOP
BIT SYMBOL N+1 BIT
§
START
STOP
BIT SYMBOL N BIT
§
RIN[1:0]
§
§
DCA, DCB
tDD
CLK[2:1]
D[7:0]
SYMBOL N-3
SYMBOL N-2
SYMBOL N-1
SYMBOL N
Figure 5. Latency Delay
18
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Timing Diagrams and Test Circuits (continued)
PDB
VILmax
RIN[1:0]
X
tTPDD
LOCK
Z
PASS
Z
CLK[2:1]
Z
D[7:0]
Z
Figure 6. FPD-Link and LVCMOS Power Down Delay
VIH(min)
PDB
RIN[1:0]±
tDDLT
LOCK
VOH(min)
TRI-STATE
Figure 7. CML PLL Lock Time
RIN[1:0]+
VTL
VCM
VTH
RIN[1:0]-
GND
Figure 8. FPD-Link III Receiver DC VTH/VTL Definition
I2S_CLK,
MCLK
VDDIO
1/2 VDDIO
GND
I2S_WC,
I2S_D[D:A]
VDDIO
VOHmin
VOLmax
tROS
GND
tROH
Figure 9. Output Data Valid (Setup and Hold) Times
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Timing Diagrams and Test Circuits (continued)
+VOD
80%
D[7:0]±
CLK[1:0]±
(Differential)
0V
20%
-VOD
tLVLHT
tLVHLT
D[7:0]+
CLK[2:1]+
VOD-
VOD+
D[7:0]CLK[2:1]-
Single-Ended
Figure 10. Input Transition Times
(D[7:0]+) (D[7:0]-) or
(CLK[2:1]+) (CLK[2:1]-)
VOD+
0V
VODp-p
VOD-
Differential
VOS
Figure 11. FPD-Link Single-Ended and Differential Waveforms
tBIT
CLK[2:1]±
bit 1
n-1
D[7:0]±
tPPOS0
bit 0
n-1
bit 6
n
bit 5
n
bit 4
n
bit 3
n
bit 2
n
bit 1
n
bit 0
n
1UI
tPPOS1
2UI
tPPOS2
3UI
tPPOS3
tPPOS4
4UI
tPPOS5
5UI
tPPOS6
6UI
tPPOS7
7UI
Figure 12. FPD-Link Transmitter Pulse Positions
BISTEN
1/2 VDDIO
tPASS
PASS
(w/errors)
1/2 VDDIO
Prior BIST Result
Current BIST Test - Toggle on Error
Result Held
Figure 13. BIST PASS Waveform
20
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Timing Diagrams and Test Circuits (continued)
SDA
tf
tHD;STA
tLOW
tr
tr
tBUF
tf
SCL
tSU;STA
tHD;STA
tHIGH
tSU;STO
tSU;DAT
tHD;DAT
START
STOP
REPEATED
START
START
Figure 14. Serial Control Bus Timing Diagram
tI2S
tLC,I2S
tHC,I2S
VIH
I2S_CLK
VIL
tSR,I2S
tHR,I2S
I2S_WC
I2S_D[A,B,C,D]
Figure 15. I2S Timing
Magnitude (100mV/DIV)
OLDI Output (500 mV/DIV)
6.10 Typical Characteristics
Time (100 ps/DIV)
Figure 16. Deserializer Eye Diagram With 2.6-Gbps FPD-Link
III Rate
Time (2.5 ns/DIV)
Figure 17. OpenLDI Output With 96-MHz Clock
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7 Detailed Description
7.1 Overview
The DS90UB948-Q1 receives a 35-bit symbol over single or dual serial FPD-Link III pairs operating at up to 3.36
Gbps line rate in 1-lane FPD-Link III mode and 2.975 Gbps per lane in 2-lane FPD-Link III mode. The
DS90UB948-Q1 converts this stream into a single or dual FPD-Link Interface (4 LVDS data channels + 1 LVDS
clock, or 8 LVDS data channels + 2 LVDS clocks). The FPD-Link III serial stream contains an embedded clock,
video control signals, and the DC-balanced video data and audio data which enhance signal quality to support
AC coupling.
The DS90UB948-Q1 is intended for use with the DS90UB949-Q1 or DS90UB947-Q1 serializers, but is also
backward compatible to the DS90UB925Q-Q1 and DS90UB927Q-Q1 FPD-Link III serializers.
The DS90UB948-Q1 deserializer attains lock to a data stream without the use of a separate reference clock
source, which greatly simplifies system complexity and overall cost. The deserializer also synchronizes to the
serializer regardless of the data pattern, delivering true automatic plug and lock performance. It can lock to the
incoming serial stream without the need of special training patterns or sync characters. The deserializer recovers
the clock and data by extracting the embedded clock information, validating then deserializing the incoming data
stream.
The DS90UB948-Q1 deserializer incorporates an I2C-compatible interface. The I2C-compatible interface allows
programming of serializer or deserializer devices from a local host controller. The devices also incorporate a
bidirectional control channel (BCC) that allows communication between serializer/deserializer as well as remote
I2C slave devices.
The bidirectional control channel (BCC) is implemented through embedded signaling in the high-speed forward
channel (serializer to deserializer) combined with lower speed signaling in the reverse channel (deserializer to
serializer). Through this interface, the BCC provides a mechanism to bridge I2C transactions across the serial
link from one I2C bus to another. The implementation allows for arbitration with other I2C-compatible masters at
either side of the serial link.
RIN1-
PHY Output
CDR
RIN1+
1st Link
Open LDI LVDS
Outputs
Decoder
RIN0-
Serial to Parallel
RIN0+
Deskew / Lane Alignment
CDR
7.2 Functional Block Diagram
CMLOUTP
CMLOUTN
2nd Link
Open LDI LVDS
Outputs
Timing
and
Control
PDB
LOCK
22
4
/
I2S / GPIO
8
/
CLOCK
Open LDI LVDS
Outputs
Clock
Gen
FIFO
D_GPIOx / SPI
Encoder
MODE_SEL1
Decoder
PASS
MODE_SEL0
I2C_SDA
I2C
Controller
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7.3 Feature Description
7.3.1 High-Speed Forward Channel Data Transfer
The high-speed forward channel is composed of 35 bits of data containing RGB data, sync signals, I2C, GPIOs,
and I2S audio transmitted from serializer to deserializer. Figure 18 shows the serial stream per clock cycle. This
data payload is optimized for signal transmission over an AC-coupled link. Data is randomized, balanced, and
scrambled.
C0
C1
Figure 18. FPD-Link III Serial Stream
The DS90UB948-Q1 supports clocks in the range of 25 MHz to 96 MHz over 1 lane, or 50 MHz to 192 MHz over
2 lanes. The FPD-Link III serial stream rate is 3.36 Gbps maximum (875 Mbps minimum) or 2.975 Gbps
maximum per lane (875 Mbps minimum), respectively.
7.3.2 Low-Speed Back Channel Data Transfer
The Low-Speed Backward Channel provides bidirectional communication between the display and host
processor. The information is carried from the deserializer to the serializer as serial frames. The back channel
control data is transferred over both serial links along with the high-speed forward data, DC balance coding and
embedded clock information. This architecture provides a backward path across the serial link together with a
high-speed forward channel. The back channel contains the I2C, CRC and 4 bits of standard GPIO information
with 5-Mbps or 20-Mbps line rate (configured by MODE_SEL1).
7.3.3 FPD-Link III Port Register Access
Because the DS90UB948-Q1 contains two ports, some registers must be duplicated to allow control and
monitoring of the two ports. To facilitate this, PORT1_SEL and PORT0_SEL bits (0x34[1:0]) register controls
access to the two sets of registers. Registers that are shared between ports (not duplicated) are available
independent of the settings in the PORT_SEL register.
Setting the PORT1_SEL and PORT0_SEL bit allows a read of the register for the selected port. If both bits are
set, port1 registers are returned. Writes occur to ports for which the select bit is set, allowing simultaneous writes
to both ports if both select bits are set.
7.3.4 Oscillator Output
The deserializer provides an optional CLK[2:1]± output when the input clock (serial stream) has been lost. This is
based on an internal oscillator and may be controlled from register 0x02, bit 5 (OSC Clock Output Enable). See
Register Maps.
7.3.5 Clock and Output Status
When PDB is driven HIGH, the CDR PLL begins locking to the serial input and LOCK is tri-state or LOW
(depending on the value of the OUTPUT ENABLE setting). After the deserializer completes its lock sequence to
the input serial data, the LOCK output is driven HIGH, indicating valid data and clock recovered from the serial
input is available on the LVCMOS and LVDS outputs. The state of the outputs is based on the OUTPUT
ENABLE and OUTPUT SLEEP STATE SELECT register settings. See register 0x02 in Register Maps.
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Feature Description (continued)
Table 1. Output State Table
INPUTS
OUTPUTS
PDB
OUTPUT ENABLE
Reg 0x02 [7]
OUTPUT SLEEP
STATE SELECT
Reg 0x02 [4]
X
L
X
X
Z
Z
Z
X
H
L
L
L
L
L
L
X
H
L
H
L or H
Z
Z
Z
Static
H
H
L
L
L
L
L/OSC (Register
EN)
Static
H
H
H
L
Previous status
L
L
Active
H
H
L
L
L
L
L
Active
H
H
H
H
Valid
Valid
Valid
Serial
INPUT
LOCK
PASS
Data
GPIO / D_GPIO
I2S
D[7:0] /
CLK[2:1]
Z
7.3.6 LVCMOS VDDIO Option
The 1.8-V or 3.3-V inputs and outputs are powered from a separate VDDIO supply to offer compatibility with
external system interface signals.
NOTE
When configuring the VDDIO power supplies, all the single-ended data and control input
pins for device must scale together with the same operating VDDIO levels.
7.3.7 Power Down (PDB)
The deserializer has a PDB input pin to ENABLE or POWER DOWN the device. This pin can be controlled by
the host or through the VDDIO, where VDDIO = 3 V to 3.6 V or VDD33. To save power, disable the link when the
display is not needed (PDB = LOW). When the pin is driven by the host, make sure to release it after VDD33 and
VDDIO have reached final levels; no external components are required. This pin is preferred to drive PDB pin
through microcontroller where the RC filter is optional. In the case of driven by the VDDIO = 3 V to 3.6 V or
VDD33 directly, a 10-kΩ resistor to the VDDIO = 3 V to 3.6 V or VDD33 and a > 10-µF capacitor to the GND, are
required (see Figure 48).
7.3.8 Interrupt Pin — Functional Description and Usage (INTB_IN)
The INTB_IN pin is an active low interrupt input pin. The INTB_IN pin may act as an output driver and pull low
when PDB is low. This interrupt signal, when configured, propagates to the paired serializer. Consult the
appropriate serializer data sheet for details of how to configure this interrupt functionality.
1. On the serializer, set register 0xC6[5] = 1 and 0xC6[0] = 1
2. Deserializer INTB_IN (pin 4) is set LOW by some downstream device.
3. Serializer pulls INTB pin LOW. The signal is active LOW, so a LOW indicates an interrupt condition.
4. External controller detects INTB = LOW; to determine interrupt source, read ISR register.
5. A read to ISR clears the interrupt at the Serializer, releasing INTB.
6. The external controller typically must then access the remote device to determine downstream interrupt
source and clear the interrupt driving the deserializer INTB_IN. This would be when the downstream device
releases the INTB_IN (pin 4) on the deserializer. The system is now ready to return to step (2) at next falling
edge of INTB_IN.
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Feature Description (continued)
7.3.9 General-Purpose I/O (GPIO)
7.3.9.1 GPIO[3:0] and D_GPIO[3:0] Configuration
In normal operation, GPIO[3:0] may be used as GPIOs in either forward channel (outputs) or back channel
(inputs) mode. GPIO and D_GPIO modes may be configured from the registers (Table 10). The same registers
configure either GPIO or D_GPIO, depending on the status of PORT1_SEL and PORT0_SEL bits (0x34[1:0]).
D_GPIO operation requires 2-lane FPD-Link III mode. Consult the appropriate serializer data sheet for details on
D_GPIO configuration. Note: if paired with a DS90UB925Q-Q1 serializer, the devices must be configured into 18bit mode to allow usage of GPIO pins on the serializer. To enable 18-bit mode, set serializer register 0x12[2] = 1.
18-bit mode is auto-loaded into the deserializer from the serializer. See Table 2 for GPIO enable and
configuration.
Table 2. GPIO Enable and Configuration
DESCRIPTION
DEVICE
FORWARD CHANNEL
BACK CHANNEL
GPIO3 / D_GPIO3
Serializer
0x0F[3:0] = 0x3
0x0F[3:0] = 0x5
GPIO2 / D_GPIO2
GPIO1 / D_GPIO1
GPIO0 / D_GPIO0
Deserializer
0x1F[3:0] = 0x5
0x1F[3:0] = 0x3
Serializer
0x0E[7:4] = 0x3
0x0E[7:4] = 0x5
Deserializer
0x1E[7:4] = 0x5
0x1E[7:4] = 0x3
0x0E[3:0] = 0x5
Serializer
0x0E[3:0] = 0x3
Deserializer
0x1E[3:0] = 0x5
0x1E[3:0] = 0x3
Serializer
0x0D[3:0] = 0x3
0x0D[3:0] = 0x5
Deserializer
0x1D[3:0] = 0x5
0x1D[3:0] = 0x3
The input value present on GPIO[3:0] or D_GPIO[3:0] may also be read from register or configured to local
output mode (Table 10).
7.3.9.2 Back Channel Configuration
The D_GPIO[3:0] pins can be configured to obtain different sampling rates depending on the mode as well as
back channel frequency. The mode is controlled by register 0x43 (Table 10). The back channel frequency can be
controlled several ways:
1. Register 0x23[6] sets the divider that controls the back channel frequency based on the internal oscillator.
0x23[6] = 0 sets the divider to 4 and 0x23[6] = 1 sets the divider to 2. As long as BC_HS_CTL (0x23[4]) is
set to 0, the back channel frequency is either 5 Mbps or 10 Mbps, based on this bit.
2. Register 0x23[4] enables the high-speed back channel. This can also be pin-strapped through MODE_SEL1
(see Table 3). This bit overrides 0x23[6] and sets the divider for the back channel frequency to 1. Setting this
bit to 1 sets the back channel frequency to 20 Mbps.
The back channel frequency has variation of ±20%. Note: The back channel frequency must be set to 5 Mbps
when paired with a DS90UB925Q-Q1, DS90UB925AQ-Q1, or DS90UB927Q-Q1. See Table 3 for details about
configuring the D_GPIOs in various modes.
The HSCC modes replace normal back-channel signaling with dedicated GPIOs or SPI data, allowing greater
bandwidth for those functions. The HSCC Modes are enabled by setting the HSCC_MODE field in the
HSCC_CONTROL register 0x43[2:0] in the DS90UB948-Q1. The HSCC modes eliminate the normal signaling
such as Device ID, Capabilities, and RX Lock detect. It is intended to be turned on after obtaining RX Lock in
normal back channel mode. Hence, the serializer properly determines capabilities prior to HSCC mode initiation.
HSCC mode prevents loading capabilities, and it should only be enabled after RX Lock is established.
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Table 3. Back Channel D_GPIO Effective Frequency
HSCC_MODE
(0x43[2:0])
MODE
NUMBER OF
D_GPIOs
SAMPLES
PER FRAME
000
Normal
4
1
011
Fast
4
6
010
Fast
2
10
001
Fast
1
15
(1)
(2)
(3)
(4)
D_GPIO EFFECTIVE FREQUENCY (1) (kHz)
10 Mbps BC (3)
20 Mbps BC (4)
D_GPIOs
ALLOWED
33
66
133
D_GPIO[3:0]
200
400
800
D_GPIO[3:0]
333
666
1333
D_GPIO[1:0]
500
1000
2000
D_GPIO0
5 Mbps BC (2)
The effective frequency assumes the worst-case back channel frequency (–20%) and a 4×sampling rate.
5 Mbps corresponds to BC FREQ SELECT = 0 & BC_HS_CTL = 0.
10 Mbps corresponds to BC FREQ SELECT = 1 & BC_HS_CTL = 0.
20 Mbps corresponds to BC FREQ SELECT = X & BC_HS_CTL = 1.
7.3.9.3 GPIO Register Configuration
GPIO_REG[8:5] are register-only GPIOs and may be programmed as outputs or read as inputs through local
register bits only. Where applicable, these bits are shared with I2S pins and will override I2S input if enabled into
GPIO_REG mode. See Table 4 for GPIO enable and configuration.
NOTE
Local GPIO value may be configured and read either through local register access, or
remote register access through the low-speed bidirectional control channel. Configuration
and state of these pins are not transported from serializer to deserializer as is the case for
GPIO[3:0].
26
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Table 4. GPIO_REG and GPIO Local Enable and Configuration
DESCRIPTION
GPIO9
GPIO_REG8
GPIO_REG7
GPIO_REG6
GPIO_REG5
GPIO3
GPIO2
GPIO1
GPIO0
REGISTER CONFIGURATION
FUNCTION
0x1A[3:0] = 0x1
Output, L
0x1A[3:0] = 0x9
Output, H
0x1A[3:0] = 0x3
Input, Read: 0x6F[1]
0x21[7:4] = 0x1
Output, L
0x21[7:4] = 0x9
Output, H
0x21[7:4] = 0x3
Input, Read: 0x6F[0]
0x21[3:0] = 0x1
Output, L
0x21[3:0] = 0x9
Output, H
0x21[3:0] = 0x3
Input, Read: 0x6E[7]
0x20[7:4] = 0x1
Output, L
0x20[7:4] = 0x9
Output, H
0x20[7:4] = 0x3
Input, Read: 0x6E[6]
0x20[3:0] = 0x1
Output, L
0x20[3:0] = 0x9
Output, H
0x20[3:0] = 0x3
Input, Read: 0x6E[5]
0x1F[3:0] = 0x1
Output, L
0x1F[3:0] = 0x9
Output, H
0x1F[3:0] = 0x3
Input, Read: 0x6E[3]
0x1E[7:4] = 0x1
Output, L
0x1E[7:4] = 0x9
Output, H
0x1E[7:4] = 0x3
Input, Read: 0x6E[2]
0x1E[3:0] = 0x1
Output, L
0x1E[3:0] = 0x9
Output, H
0x1E[3:0] = 0x3
Input, Read: 0x6E[1]
0x1D[3:0] = 0x1
Output, L
0x1D[3:0] = 0x9
Output, H
0x1D[3:0] = 0x3
Input, Read: 0x6E[0]
7.3.10 SPI Communication
The SPI control channel uses the secondary link in a 2-lane FPD-Link III implementation. Two possible modes
are available: forward channel and reverse channel modes. In forward channel mode, the SPI master is located
at the serializer, such that the direction of sending SPI data is in the same direction as the video data. In reverse
channel mode, the SPI master is located at the deserializer, such that the direction of sending SPI data is in the
opposite direction as the video data.
The SPI control channel can operate in a high-speed mode when writing data, but must operate at lower
frequencies when reading data. During SPI reads, data is clocked from the slave to the master on the SPI clock
falling edge. Thus, the SPI read must operate with a clock period that is greater than the round trip data latency.
On the other hand, for SPI writes, data can be sent at much higher frequencies where the MISO pin can be
ignored by the master.
SPI data rates are not symmetrical for the two modes of operation. Data over the forward channel can be sent
much faster than data over the reverse channel.
NOTE
SPI cannot be used to access serializer or deserializer registers.
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7.3.10.1 SPI Mode Configuration
SPI is configured over I2C using the high-speed control channel configuration (HSCC_CONTROL) register, 0x43
(Register Maps). HSCC_MODE (0x43[2:0]) must be configured for either high-speed, forward channel SPI mode
(110) or high-speed, reverse channel SPI mode (111).
7.3.10.2 Forward Channel SPI Operation
In forward channel SPI operation, the SPI master located at the serializer generates the SPI clock (SPLK),
master out / slave in data (MOSI), and active low slave select (SS). The serializer oversamples the SPI signals
directly using the video pixel clock. The three sampled values for SPLK, MOSI, and SS are each sent on data
bits in the forward channel frame. At the deserializer, the SPI signals are regenerated using the pixel clock. To
preserve setup and hold time, the deserializer holds MOSI data while the SPLK signal is high. The deserializer
also delays SPLK by one pixel clock relative to the MOSI data, increasing setup by one pixel clock.
SERIALIZER
SS
SPLK
MOSI
D0
D1
D2
D3
DN
SS
DESERIALIZER
SPLK
MOSI
D0
D1
D2
D3
DN
Figure 19. Forward Channel SPI Write
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SERIALIZER
SS
SPLK
MOSI
D0
D1
MISO
RD0
RD1
SS
DESERIALIZER
SPLK
D0
MOSI
MISO
RD0
RD1
Figure 20. Forward Channel SPI Read
7.3.10.3 Reverse Channel SPI Operation
In reverse channel SPI operation, the deserializer samples the slave select (SS), SPI clock (SCLK) into the
internal oscillator clock domain. Upon detection of the active SPI clock edge, the deserializer also samples the
SPI data (MOSI). The SPI data samples are stored in a buffer to be passed to the serializer over the back
channel. The deserializer sends SPI information in a back channel frame to the serializer. In each back channel
frame, the deserializer sends an indication of the SS value. The SS must be inactive (high) for at least one backchannel frame period to ensure propagation to the serializer.
Because data is delivered in separate back channel frames and buffered, the data may be regenerated in bursts.
Figure 21 shows an example of the SPI data regeneration when the data arrives in three back channel frames.
The first frame delivered the SS active indication, the second frame delivered the first three data bits, and the
third frame delivers the additional data bits.
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DESERIALIZER
SS
SPLK
MOSI
D0
D1
D2
D3
DN
SS
SERIALIZER
SPLK
D0
MOSI
D1
D2
D3
DN
Figure 21. Reverse Channel SPI Write
For reverse channel SPI reads, the SPI master must wait for a round-trip response before generating the
sampling edge of the SPI clock. This is similar to operation in forward channel mode. Note that at most one
data/clock sample is sent per back channel frame.
DESERIALIZER
SS
SPLK
MOSI
D0
D1
MISO
RD0
RD1
SS
SERIALIZER
SPLK
D0
MOSI
MISO
RD0
RD1
Figure 22. Reverse Channel SPI Read
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For both reverse-channel SPI writes and reads, the SPI_SS signal must be deasserted for at least one backchannel frame period.
Table 5. SPI SS Deassertion Requirement
BACK CHANNEL FREQUENCY
DEASSERTION REQUIREMENT
5 Mbps
7.5 µs
10 Mbps
3.75 µs
20 Mbps
1.875 µs
7.3.11 Backward Compatibility
The DS90UB948-Q1 is also backward compatible to the DS90UB925Q-Q1 and DS90UB927Q-Q1 for PCLK
frequencies ranging from 25 MHz to 85 MHz. Backward compatibility does not need to be enabled. When paired
with a backward-compatible device, the deserializer auto-detects to 1-lane FPD-Link III on the primary channel
(RIN0±).
7.3.12 Adaptive Equalizer
The FPD-Link III receiver inputs incorporate an adaptive equalizer (AEQ) to compensate for signal degradation
from the communications channel and interconnect components. Each RX port signal path continuously monitors
cable characteristics for long-term cable aging and temperature changes. The AEQ is primarily intended to adapt
and compensate for channel losses over the lifetime of a cable installed in an automobile. The AEQ attempts to
optimize the equalization setting of the RX receiver. This adaption includes compensating insertion loss from
temperature effects and aging degradation due to bending and flexion. To determine the maximum cable reach,
factors that affect signal integrity such as jitter, skew, inter-symbol interference (ISI), crosstalk, and so forth, must
also be considered. The equalization configuration programmed in registers 0x35 (AEQ_CTL1) and 0x45
(AEQ_CTL2).
7.3.12.1 Transmission Distance
When designing the transmission channel, consider the total insertion loss of all components in the signal path
between a serializer and a deserializer. An example of the transmission channel connects from a FPD-Link
serializer (SER) to a deserializer would consist of a serializer PCB, two or more connectors, one or more cables,
and a deserializer PCB as shown in Figure 23
Serializer PCB
Deserializer PCB
SER
DES
Dacar 535-2
Dacar 302
Dacar 535-2
Figure 23. Typical Transmission Channel Components With Coaxial Cables
Table 6 depicts the maximum attenuation using DS90UB948-Q1. The PCLK is the maximum frequency based on
the channel attenuation. The attenuation increases with cable length and frequency. The trace length of the PCB
has very small contribution to the differential insertion loss of the transmission channel. Table 6 shows the
maximum attenuation that the AEQ can compensate for at the given PCLK and resultant Nuyquist frequency.
Table 6. Insertion Loss
PCLK (MHz)
FPD-LINK LINE RATE
(Gbps)
NYQUIST FREQUENCY
(GHz)
CHANNEL ATTENUATION
(dB)
TYP CABLE LENGTH
(m)
170
2.97
1.48
-15
10
188
3.29
1.64
-12
7
192
3.36
1.71
-9
5
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7.3.12.2 Adaptive Equalizer Algorithm
The AEQ process steps through allowed values of the equalizer controls find a value that allows the Clock Data
Recovery (CDR) circuit to maintain valid lock condition. For each EQ setting, the circuit waits for a programmed
re-lock time period, then checks results for valid lock. If valid lock is detected, the circuit will stop at the current
EQ setting and maintain constant value as long as lock state persists. If the deserializer loses LOCK, the
adaptive equalizer will resume the LOCK algorithm and the EQ setting is incremented to the next valid state.
Once lock is lost, the circuit will continue searching EQ settings to find a valid setting to reacquire the serial data
stream sent by the serializer that remains locked.
7.3.12.3 AEQ Settings
7.3.12.3.1 AEQ Start-Up and Initialization
The AEQ circuit can be restarted at any time by setting the AEQ_RESTART bit in the AEQ_CTL1 register 0x35.
Once the deserializer is powered on, the AEQ is continually searching through EQ settings and could be at any
setting when signal is supplied from the serializer. If the Rx Port CDR locks to the signal, it may be good enough
for low bit errors, but could be not optimized or over-equalized. For a consistent initial EQ setting, TI
recommends that the user applies AEQ_RESTART or DIGITAL_RESET0 when the serializer input signal
frequency is stable to restart adaption from the minimum EQ gain value.
7.3.12.3.2 AEQ Range
The user can program the AEQ circuit with the minimum AEQ level setting used during the EQ adaption. Using
the full AEQ range will provide the most flexible solution, however, if the channel conditions are known and an
improved deserializer lock time can be achieved by narrowing the search window for allowable EQ gain settings.
For example, in a system use case with a longer cable and multiple interconnects creating a higher channel
attenuation, the AEQ would not adapt to the minimum EQ gain settings. In this case, starting the adaptation from
a higher AEQ level would improve lock time. The AEQ range is determined by the AEQ_CTL2 register 0x45
where the ADAPTIVE_EQ_FLOOR_VALUE determines the starting value for EQ gain adaption. The maximum
AEQ limit is not adjustable. To enable the minimum AEQ limit, OVERRIDE_AEQ_FLOOR and
SET_AEQ_FLOOR bits in the AEQ_CTL1 register must also be set. The setting for the AEQ after adaption can
be readback from the AEQ_STATUS register 0x3B.
7.3.12.3.3 AEQ Timing
The dwell time for AEQ to wait for either the lock or error-free status is also programmable. When checking each
EQ setting, the AEQ will wait for a time interval, controlled by the ADAPTIVE_EQ_RELOCK_TIME field in the
AEQ_CTL2 register (see Register Maps) before incrementing to the next allowable EQ gain setting. The default
wait time is set to 2.62 ms. Once the maximum setting is reached, if there is no lock acquired during the
programmed relock time, the AEQ will restart adaption at the minimum setting or AEQ_FLOOR value.
7.3.13 I2S Audio Interface
This deserializer features six I2S output pins that, when paired with a compatible serializer, support surroundsound audio applications. The bit clock (I2S_CLK) supports frequencies between 1 MHz and the smaller of <
PCLK/2 or < 13 MHz. Four I2S data outputs carry two channels of I2S-formatted digital audio each, with each
channel delineated by the word select (I2C_WC) input.
Deserializer
MCLK
I2S_CLK
I2S_WC
I2S_Dx
System Clock
Bit Clock
Word Select
4
Data
I2S Receiver
Figure 24. I2S Connection Diagram
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I2S_WC
I2S_CLK
I2S_Dx
MSB
LSB
MSB
LSB
Figure 25. I2S Frame Timing Diagram
When paired with a DS90UB925Q, the deserializer I2S interface supports a single I2S data output through
I2S_DA (24-bit video mode) or two I2S data outputs through I2S_DA and I2S_DB (18-bit video mode).
7.3.13.1 I2S Transport Modes
By default, packetized audio is received during video blanking periods in dedicated data island transport frames.
The transport mode is set in the serializer and auto-loaded into the deserializer by default. The audio
configuration may be disabled from control registers if forward channel frame transport of I2S data is desired. In
frame transport, only I2S_DA is received to the deserializer. Surround sound mode, which transmits all four I2S
data inputs (I2S_D[D:A]), may only be operated in data island transport mode. This mode is only available when
connected to a DS90UB927Q, DS90UB949-Q1, DS90UB947-Q1, or DS90UB929-Q1 serializer. If connected to a
DS90UB925Q serializer, only I2S_DA and I2S_DB may be received.
7.3.13.2 I2S Repeater
I2S audio may be fanned-out and propagated in the repeater application. By default, data is propagated via data
island transport on the FPD-Link interface during the video blanking periods. If frame transport is desired,
connect the I2S pins from the deserializer to all serializers. Activating surround sound at the top-level serializer
automatically configures downstream serializers and deserializers for surround-sound transport utilizing data
island transport. If 4-channel operation utilizing I2S_DA and I2S_DB only is desired, this mode must be explicitly
set in each serializer and deserializer control register throughout the repeater tree (Register Maps).
A DS90UB948-Q1 deserializer configured in repeater mode may also regenerate I2S audio from its I2S input
pins in lieu of data island frames. See Figure 28 and the I2C Control Registers (Register Maps) for additional
details.
7.3.13.3 I2S Jitter Cleaning
This device features a standalone PLL to clean the I2S data jitter, supporting high-end car audio systems. If
I2S_CLK frequency is less than 1MHz, this feature must be disabled through register 0x2B[7]. See the section.
7.3.13.4 MCLK
The deserializer has an I2S Master Clock Output (MCLK). It supports x1, x2, or x4 of I2S CLK Frequency. When
the I2S PLL is disabled, the MCLK output is off. Table 7 covers the range of I2S sample rates and MCLK
frequencies. By default, all the MCLK output frequencies are x2 of the I2S CLK frequencies. The MCLK
frequencies can also be enabled through the register bits 0x3A[6:4] (I2S DIVSEL), shown in . To select desired
MCLK frequency, write 0x3A[7], then write to bit [6:4] accordingly.
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Table 7. Audio Interface Frequencies
SAMPLE RATE
(kHz)
I2S DATA WORD SIZE
(BITS)
32
1.024
44.1
48
1.4112
16
96
6.144
32
1.536
44.1
2.117
24
96
9.216
32
2.048
44.1
2.8224
32
96
192
34
2.304
4.608
192
48
1.536
3.072
192
48
I2S CLK
(MHz)
3.072
6.144
12.288
MCLK OUTPUT
(MHz)
REGISTER 0x3A[6:4]'b
I2S_CLK x1
000
I2S_CLK x2
001
I2S_CLK x4
010
I2S_CLK x1
000
I2S_CLK x2
001
I2S_CLK x4
010
I2S_CLK x1
000
I2S_CLK x2
001
I2S_CLK x4
010
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
010
I2S_CLK x2
011
I2S_CLK x4
100
I2S_CLK x1
000
I2S_CLK x2
001
I2S_CLK x4
010
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
010
I2S_CLK x2
011
I2S_CLK x4
100
I2S_CLK x1
011
I2S_CLK x2
100
I2S_CLK x4
101
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
001
I2S_CLK x2
010
I2S_CLK x4
011
I2S_CLK x1
010
I2S_CLK x2
011
I2S_CLK x4
100
I2S_CLK x1
011
I2S_CLK x2
100
I2S_CLK x4
110
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7.3.14 Repeater
The supported repeater application provides a mechanism to extend transmission over multiple links to multiple
display devices.
7.3.14.1 Repeater Configuration
In the repeater application, this document refers to the DS90UB947-Q1 serializer or as the transmitter (TX), and
refers to the DS90UB948-Q1 as the Receiver (RX). Figure 26 shows the maximum configuration supported for
repeater implementations. Two levels of repeaters are supported with a maximum of three transmitters per
receiver.
1:3 Repeater
1:3 Repeater
TX
Source
TX
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
TX
RX
Display
RX
RX
TX
TX
1:3 Repeater
RX
1:3 Repeater
RX
Figure 26. Maximum Repeater Application
In a repeater application, the I2C interface at each TX and RX is configured to transparently pass I2C
communications upstream or downstream to any I2C device within the system. This includes a mechanism for
assigning alternate IDs (Slave Aliases) to downstream devices in the case of duplicate addresses.
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Repeater Node
Transmitter
I2C
Master
Upstream
Transmitter
Downstream
Receiver
or
Repeater
I2C
Slave
I2C
FPD-Link
(LVDS)
Receiver
Transmitter
I2S Audio
Downstream
Receiver
or
Repeater
I2C
Slave
FPD-Link III interfaces
Copyright © 2016, Texas Instruments Incorporated
Figure 27. 1:2 Repeater Configuration
7.3.14.2 Repeater Connections
The repeater requires the following connections between the receiver and each transmitter Figure 28.
1. Video data – Connect all FPD-Link data and clock pairs. Single FPD-Link (D[3:0]) or Dual FPD-Link (D[7:0])
are both possible, provided the deserializer and all serializers are configured in the same mode.
2. I2C – Connect SCL and SDA signals. Both signals must be pulled up to VDD33 or VDDIO = 3 V to 3.6 V
with 4.7-kΩ resistors.
3. Audio (optional) – Connect I2S_CLK, I2S_WC, and I2S_Dx signals. Audio is normally transported on the
FPD-Link interface.
4. IDx pin – Each transmitter and receiver must have an unique I2C address.
5. REPEAT & MODE_SEL pins — All transmitters and receivers must be set into repeater mode.
6. Interrupt pin – Connect DS90UB948-Q1 INTB_IN pin to the DS90UB947-Q1 INTB pin. The signal must be
pulled up to VDDIO with a 10-kΩ resistor.
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Deserializer
Serializer
D[7:0]+
D[7:0]+
D[7:0]-
D[7:0]-
CLK1+
CLK+
CLK1-
CLK-
VDD33
VDD33
MODE_SEL
REPEAT
I2S_CLK
I2S_CLK
I2S_WC
I2S_WC
I2S_Dx
I2S_Dx
Optional
VDD33
VDD33
VDDIO
IDx
INTB
INTB_IN
IDx
VDD33
SDA
SDA
SCL
SCL
Figure 28. Repeater Connection Diagram
7.3.14.2.1 Repeater Fan-Out Electrical Requirements
Repeater applications requiring fan-out from one DS90UB948-Q1 deserializer to up to three DS90UB947-Q1
serializers requires special considerations for routing and termination of the FPD-Link differential traces.
Figure 29 details the requirements that must be met for each signal pair:
L3 < 60 mm
TX
RX
R1=100
R2=100
L1 < 75 mm
TX
L2 < 60 mm
TX
L3 < 60 mm
Figure 29. FPD-Link Fan-Out Electrical Requirements
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7.3.15 Built-In Self Test (BIST)
An optional at-speed built-in self test (BIST) feature supports testing of the high-speed serial link and the lowspeed back channel without external data connections. This is useful in the prototype stage, equipment
production, in-system test, and system diagnostics.
7.3.15.1 BIST Configuration and Status
The BIST mode is enabled at the deserializer by pin (BISTEN) or BIST configuration register. The test may
select either an external PCLK or the 33-MHz internal oscillator clock (OSC) frequency in the serializer. In the
absence of PCLK, the user can select the internal OSC frequency at the deserializer through the BISTC pin or
BIST configuration register.
When BIST is activated at the deserializer, a BIST enable signal is sent to the serializer through the back
channel. The serializer outputs a test pattern and drives the link at speed. The deserializer detects the test
pattern and monitors it for errors. The deserializer PASS output pin toggles to flag each frame received
containing one or more errors. The serializer also tracks errors indicated by the CRC fields in each back channel
frame.
The BIST status can be monitored real time on the deserializer PASS pin, with each detected error resulting in a
half pixel clock period toggled LOW. After BIST is deactivated, the result of the last test is held on the PASS
output until reset (new BIST test or power down). A high on PASS indicates NO ERRORS were detected. A Low
on PASS indicates one or more errors were detected. The duration of the test is controlled by the pulse width
applied to the deserializer BISTEN pin. LOCK status is valid throughout the entire duration of BIST.
See Figure 30 for the BIST mode flow diagram.
7.3.15.1.1 Sample BIST Sequence
Note: Before BIST can be enabled, D_GPIO0 (pin 19) must be strapped HIGH and D_GPIO[3:1] (pins 16, 17,
and 18) must be strapped LOW.
1. BIST Mode is enabled through the BISTEN pin of deserializer. The desired clock source is selected through
the deserializer BISTC pin.
2. The serializer is awakened through the back channel if it is not already on. An all-zeros pattern is balanced,
scrambled, randomized, and sent through the FPD-Link III interface to the deserializer. Once the serializer
and the deserializer are in BIST mode and the deserializer acquires LOCK, the PASS pin of the deserializer
goes high and BIST starts checking the data stream. If an error in the payload (1 to 35) is detected, the
PASS pin switches low for one half of the clock period. During the BIST test, the PASS output can be
monitored and counted to determine the payload error rate per 35 bits.
3. To stop BIST mode, set the BISTEN pin LOW. The deserializer stops checking the data, and the final test
result is held on the PASS pin. If the test ran error-free, the PASS output remains HIGH. If there one or more
errors were detected, the PASS output outputs constant LOW. The PASS output state is held until a new
BIST is run, the device is RESET, or the device is powered down. BIST duration is user-controlled and may
be of any length.
The link returns to normal operation after the deserializer BISTEN pin is low. Figure 31 shows the waveform
diagram of a typical BIST test for two cases. Case 1 is error-free, and Case 2 shows one with multiple errors. In
most cases, it is difficult to generate errors due to the robustness of the link (differential data transmission, and
so forth). Errors may be introduced by greatly extending the cable length, faulting the interconnect medium, or
reducing signal condition enhancements (Rx equalization).
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Normal
Step 1: DES in BIST
BIST
Wait
Step 2: Wait, SER in BIST
BIST
start
Step 3: DES in Normal
Mode - check PASS
BIST
stop
Step 4: DES/SER in Normal
Figure 30. BIST Mode Flow Diagram
7.3.15.2 Forward Channel and Back Channel Error Checking
The deserializer, on locking to the serial stream, compares the recovered serial stream with all-zeroes and
records any errors in status registers. Errors are also dynamically reported on the PASS pin of the deserializer.
Forward channel errors may also be read from register 0x25 (Register Maps).
The back-channel data is checked for CRC errors once the serializer locks onto the back-channel serial stream,
as indicated by link detect status (register bit 0x0C[0] - Register Maps). CRC errors are recorded in an 8-bit
register in the serializer. The register is cleared when the serializer enters the BIST mode. As soon as the
serializer enters BIST mode, the functional mode CRC register starts recording any back channel CRC errors.
The BIST mode CRC error register is active in BIST mode only and keeps the record of the last BIST run until
either the error is cleared or the serializer enters BIST mode again.
DES Outputs
BISTEN
(DES)
CLK[2:1]
Case 1 - Pass
D[7:0]
7 bits/frame
DATA
(internal)
PASS
Prior Result
PASS
DATA
(internal)
PASS
X
X
X
FAIL
Prior Result
Normal
SSO
Case 2 - Fail
X = bit error(s)
BIST Test
BIST Duration
BIST
Result
Held
Normal
Figure 31. BIST Waveforms
7.3.16 Internal Pattern Generation
The deserializer supports the internal pattern generation feature. It allows basic testing and debugging of an
integrated panel. The test patterns are simple and repetitive and allow for a quick visual verification of panel
operation. As long as the device is not in power down mode, the test pattern is displayed even if no parallel input
is applied. If no PCLK is received, the test pattern can be configured to use a programmed oscillator frequency.
For detailed information, refer to Exploring the Internal Test Pattern Generation Feature of 720p FPD-Link III
Devices (SNLA132).
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7.4 Device Functional Modes
7.4.1 Configuration Select MODE_SEL[1:0]
The DS90UB948-Q1 can be configured for several different operating modes via the MODE_SEL[1:0] input pins,
or via the register bits 0x23 [4:2] (MODE_SEL1) and 0x49 (MODE_SEL0).
The DS90UB948-Q1 is capable of operating in either in 1-lane or 2-lane mode for FPD-Link III. By default, the
FPD-Link III receiver automatically configures the input based on 1- or 2-lane mode operation. Programming
register 0x34 [4:3] settings will override the automatic detection. For each FPD-Link III pair, the serial datastream
is composed of a 35-bit symbol.
The DS90UB948-Q1 recovers the FPD-Link III serial datastream(s) and produces video data driven to the
OpenLDI (LVDS) interface. OpenLDI single link and dual link are supported with color depths of 18 bits per pixel
or 24 bits per pixel. There are 8 differential data pairs (D0 through D7) and two clock pairs (CLK1 and CLK2) on
the OpenLDI interface. The number of data lines may vary, depending on the pixel formats supported. For singlelink output the pixel clock is limited to 96 MHz. In the case of dual link, the pixel clock is limited to 192 MHz (or
96 MHz per LVDS port). When in a dual-link configuration, LVDS channels D0 to D3 carry ODD pixel data, and
LVDS channels D4 to D7 carry EVEN pixel data.
The device can be configured in following modes:
• 1-lane FPD-Link III input, single-link OpenLDI output
• 1-lane FPD-Link III Input, Dual Link OpenLDI output
• 2-lane FPD-Link III Input, dual-link OpenLDI output
• 2-lane FPD-Link III Input, single-link OpenLDI output
• 2-lane FPD-Link III Input, single-link OpenLDI output (replicate)
7.4.1.1 1-Lane FPD-Link III Input, Single Link OpenLDI Output
In this configuration the PCLK rate embedded within the 1-lane FPD-Link III frame can range from 25 MHz to 96
MHz, resulting in a link rate of 875 Mbps (35 bit × 25 MHz) to 3.36 Gbps (35 bit × 96 MHz). Each LVDS data
lane operates at a speed of 7 bits per LVDS clock cycle; resulting in a serial line rate of 175 Mbps to 672 Mbps.
CLK1 operates at the same rate as PCLK with a duty cycle ratio of 57:43.
7.4.1.2 1-Lane FPD-Link III Input, Dual Link OpenLDI Output
The input RGB data is split into odd and even pixels starting with the ODD (first) pixel outputs D0 to D3 and then
the EVEN (second) pixel outputs D4 to D7. The splitting of the data signals starts with DE (data enable)
transitioning from logic LOW to HIGH indicating active data.
In this configuration the PCLK rate embedded within the 1-lane FPD-Link III frame can range from 50 MHz to 96
MHz, resulting in a link rate of 1.75 Gbps (35 bit × 50 MHz) to 3.36 Gbps (35 bit × 96 MHz). Each LVDS data
lane operates at a speed of 7 bits per 2 LVDS clock cycles, resulting in a serial line rate of 175 Mbps to 336
Mbps. CLK1 and CLK2 operate at half the rate as PCLK with a duty cycle ratio of 57:43.
7.4.1.3 2-Lane FPD-Link III Input, Dual Link OpenLDI Output
The input RGB data is split into odd and even pixels starting with the ODD (first) pixel outputs D0 to D3 and then
the EVEN (second) pixel outputs D4 to D7. The splitting of the data signals starts with DE (data enable)
transitioning from logic LOW to HIGH indicating active data.
In this configuration the PCLK rate embedded within 2-lane FPD-Link III frame can range from 50 MHz to 192
MHz, resulting in a link rate of 875 Mbps (35 bit × 25 MHz) to 3.36 Gbps (35 bit × 96 MHz). Each LVDS data
lane will operate at a speed of 7 bits per 2 LVDS clock cycles, resulting in a serial line rate of 175 Mbps to 672
Mbps. CLK1 and CLK2 operate at half the rate as PCLK with a duty cycle ratio of 57:43.
7.4.1.4 2-Lane FPD-Link III Input, Single Link OpenLDI Output
In this configuration the PCLK rate embedded within 2-lane FPD-Link III frame can range from 50 MHz to 192
MHz, resulting in a link rate of 875 Mbps (35 bit × 25 MHz) to 3.36 Gbps (35 bit × 96 MHz). Each LVDS data
lane will operate at a speed of 7 bits per LVDS clock cycle; resulting in a serial line rate of 350 Mbps to 1344
Mbps. CLK1 operates at the twice the rate as PCLK with a duty cycle ratio of 57:43.
40
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Device Functional Modes (continued)
7.4.1.5 1-Lane FPD-Link III Input, Single Link OpenLDI Output (Replicate)
Same as 1-lane FPD-Link III input, single-link OpenLDI output mode, and duplicates the LVDS signal on D4 to
D7 outputs.
7.4.2 MODE_SEL[1:0]
Possible configurations are shown in Figure 32. These are described above (Configuration Select
MODE_SEL[1:0]).
1-lane FPD-Link III Input, Single Link OpenLDI Output
2-lane FPD-Link III Input, Dual Link OpenLDI Output
948
948
D0
D1
D2
CLK1 25 t 96 MHz
D3
875 Mbps t 3.36 Gbps
RIN0
Disabled
RIN1
D4
D5
D6
CLK2
D7
875 Mbps t 3.36 Gbps
RIN0
875 Mbps t 3.36 Gbps
RIN1
D0
D1
D2
CLK1 25 t 96 MHz
D3
D4
D5
D6
CLK2 25 t 96 MHz
D7
Hi-Z
1-lane FPD-Link III Input, Dual Link OpenLDI Output
2-lane FPD-Link III Input, Single Link OpenLDI Output
948
948
D0
D1
D2
CLK1 25 t 48 MHz
D3
1.75 Gbps t 3.36 Gbps
RIN0
D4
D5
D6
CLK2 25 t 48 MHz
D7
Disabled
RIN1
875 Mbps t 3.36 Gbps
RIN0
875 Mbps t 3.36 Gbps
RIN1
D0
D1
D2
CLK1
D3
50 t 192 MHz
D4
D5
D6
CLK2
D7
Hi-Z
1-lane FPD-Link III Input, Single Link OpenLDI Output (Replicate)
948
D0
D1
D2
CLK1 25 t 96 MHz
D3
875 Mbps t 3.36 Gbps
RIN0
D4
D5
D6
CLK2 25 t 96 MHz
D7
Disabled
RIN1
Figure 32. Data-Path Configurations
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Device Functional Modes (continued)
VDD33
R1
VMODE
MODE_SEL[1:0]
R2
Deserializer
Figure 33. MODE_SEL[1:0] Connection Diagram
Table 8. Configuration Select (MODE_SEL0)
NO.
VMODE
VOLTAGE
VMODE
TARGET
VOLTAGE
SUGGESTED STRAP
RESISTORS
(1% tolerance)
MAP_SEL
OUTPUT_MOD
E [1:0]
OUTPUT MODE
Dual OLDI output
V (TYP)
VDD33 = 3.3 V
R1 (kΩ)
R2 (kΩ)
0
0
0
Open
10
0
00
1
0.169 x V(VDD33)
0.559
73.2
15
0
01
Dual SWAP output
2
0.230 x V(VDD33)
0.757
66.5
20
0
10
Single OLDI output
3
0.295 x V(VDD33)
0.974
59
24.9
0
11
Replicate
4
0.376 x V(VDD33)
1.241
49.9
30.1
1
00
Dual OLDI output
5
0.466 x V(VDD33)
1.538
46.4
40.2
1
01
Dual SWAP output
6
0.556 x V(VDD33)
1.835
40.2
49.9
1
10
Single OLDI output
7
0.801 x V(VDD33)
2.642
18.7
75
1
11
Replicate
Table 9. Configuration Select (MODE_SEL1)
NO.
VMODE
VOLTAGE
VMODE
TARGET
VOLTAGE
SUGGESTED STRAP
RESISTORS
(1% tolerance)
REPEATE
R
MODE
HIGH-SPEED
BACK
CHANNEL
INPUT
MODE
V (TYP)
VDD33 = 3.3 V
R1 (kΩ)
R2 (kΩ)
0
0
0
Open
10
0
00
5 Mbps
STP
1
0.169 x V(VDD33)
0.559
73.2
15
0
01
5 Mbps
Coax
2
0.230 x V(VDD33)
0.757
66.5
20
0
10
20 Mbps
STP
3
0.295 x V(VDD33)
0.974
59
24.9
0
11
20 Mbps
Coax
4
0.376 x V(VDD33)
1.241
49.9
30.1
1
00
5 Mbps
STP
5
0.466 x V(VDD33)
1.538
46.4
40.2
1
01
5 Mbps
Coax
6
0.556 x V(VDD33)
1.835
40.2
49.9
1
10
20 Mbps
STP
7
0.801 x V(VDD33)
2.642
18.7
75
1
11
20 Mbps
Coax
7.4.3 OpenLDI Output Frame and Color Bit Mapping Select
The DS90UB948-Q1 can be configured to output 24-bit color (RGB888) or 18-bit color (RGB666) with 2 different
mapping schemes, shown in Figure 34 and Figure 35. Each frame corresponds to a single pixel clock (PCLK)
cycle. The LVDS clock output from CLK1± and CLK2± follows a 4:3 duty cycle scheme, with each 28-bit pixel
frame starting with two LVDS bit clock periods high, three low, and ending with two high. The mapping scheme is
controlled by MODE_SEL0 pin or by Register (Register Maps).
42
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G10
R15
R14
R13
R12
R11
R10
D1 +/-
B11
B10
G15
G14
G13
G12
G11
D2 +/-
DE
VS
HS
B15
B14
B13
B12
D3 +/-
--
B17
B16
G17
G16
R17
R16
D4 +/-
G20
R25
R24
R23
R22
R21
R20
D5 +/-
B21
B20
G25
G24
G23
G22
G21
D6 +/-
DE
VS
HS
B25
B24
B23
B22
D7 +/-
--
B27
B26
G27
G26
R27
R26
CLK2 +/(Differential)
Figure 34. 24-Bit Color Dual FPD-Link Mapping: MSBs on D3/D7 (MAPSEL = H)
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G12
R17
R16
R15
R14
R13
R12
D1 +/-
B13
B12
G17
G16
G15
G14
G13
D2 +/-
DE
VS
HS
B17
B16
B15
B14
D3 +/-
--
B11
B10
G11
G10
R11
R10
D4 +/-
G22
R27
R26
R25
R24
R23
R22
D5 +/-
B23
B22
G27
G26
G25
G24
G23
D6 +/-
DE
VS
HS
B27
B26
B25
B24
D7 +/-
--
B21
B20
G21
G20
R21
R20
CLK2 +/(Differential)
Figure 35. 24-Bit Color Dual FPD-Link Mapping: LSBs on D3/D7 (MAPSEL = L)
44
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G10
R15
R14
R13
R12
R11
R10
D1 +/-
B11
B10
G15
G14
G13
G12
G11
D2 +/-
DE
VS
HS
B15
B14
B13
B12
D3 +/-
--
B17
B16
G17
G16
R17
R16
D4~D7 +/-
Figure 36. 24-Bit Color Single FPD-Link Mapping: MSBs on D3 (MAPSEL = H)
CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G12
R17
R16
R15
R14
R13
R12
D1 +/-
B13
B12
G17
G16
G15
G14
G13
D2 +/-
DE
VS
HS
B17
B16
B15
B14
D3 +/-
--
B11
B10
G11
G10
R11
R10
D4~D7 +/-
Figure 37. 24-Bit Color Single FPD-Link Mapping: LSBs on D3 (MAPSEL = L)
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
--
R13
R12
R11
R10
--
--
D1 +/-
--
--
G13
G12
G11
G10
--
D2 +/-
DE
VS
HS
B13
B12
B11
B10
D3 +/-
--
B15
B14
G15
G14
R15
R14
D4 +/-
--
R23
R22
R21
R20
--
--
D5 +/-
--
--
G23
G22
G21
G20
--
D6 +/-
DE
VS
HS
B23
B22
B21
B20
D7 +/-
--
B25
B24
G25
G24
R25
R24
CLK2 +/(Differential)
Figure 38. 18-Bit Color Dual FPD-Link Mapping (MAPSEL = H)
46
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G10
R15
R14
R13
R12
R11
R10
D1 +/-
B11
B10
G15
G14
G13
G12
G11
D2 +/-
DE
VS
HS
B15
B14
B13
B12
D4 +/-
G20
R25
R24
R23
R22
R21
R20
D5 +/-
B21
B20
G25
G24
G23
G22
G21
D6 +/-
DE
VS
HS
B25
B24
B23
B22
D3 +/-
D7 +/CLK2 +/(Differential)
Figure 39. 18-Bit Color Dual FPD-Link Mapping (MAPSEL = L)
CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
--
R13
R12
R11
R10
--
--
D1 +/-
--
--
G13
G12
G11
G10
--
D2 +/-
DE
VS
HS
B13
B12
B11
B10
D3 +/-
--
B15
B14
G15
G14
R15
R14
D4~D7 +/-
Figure 40. 18-Bit Color Single FPD-Link Mapping (MAPSEL = H)
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CLK1 +/(Differential)
Previous cycle
Current cycle
D0 +/-
G10
R15
R14
R13
R12
R11
R10
D1 +/-
B11
B10
G15
G14
G13
G12
G11
D2 +/-
DE
VS
HS
B15
B14
B13
B12
D3~D7 +/-
Figure 41. 18-Bit Color Single FPD-Link Mapping (MAPSEL = L)
7.5 Image Enhancement Features
Several image enhancement features are provided. The white-balance LUTs allow the user to define and map
the color profile of the display. Adaptive Hi-FRC dithering enables the presentation of 'true color' images on an
18-bit display.
7.5.1 White Balance
The white-balance feature enables similar display appearance when using LCD’s from different vendors. It
compensates for native color temperature of the display, and adjusts relative intensities of R, G, and B to
maintain specified color temperature. Programmable control registers are used to define the contents of three
LUTs (8-bit color value for Red, Green and Blue) for the white-balance feature. The LUTs map input RGB values
to new output RGB values. There are three LUTs, one LUT for each color. Each LUT contains 256 entries, 8-bits
per entry with a total size of 6144 bits (3 × 256 x 8). All entries are readable and writable. Calibrated values are
loaded into registers through the I2C interface (deserializer is a slave device). This feature may also be applied
to lower color depth applications such as 18-bit (666) and 16-bit (565). White balance is enabled and configured
via serial control bus register.
7.5.2 LUT Contents
The user must define and load the contents of the LUT for each color (R,G,B). Regardless of the color depth
being driven (888, 666, 656), the user must always provide contents for 3 complete LUTs: 256 colors × 8 bits × 3
tables. Unused bits – LSBs – shall be set to 0 by the user. When 24-bit (888) input data is being driven to a 24bit display, each LUT (R, G and B) must contain 256 unique 8-bit entries. The 8-bit white balanced data is then
available at the output of the deserializer, and driven to the display.
Alternatively, with 6-bit input data the user may choose to load complete 8-bit values into each LUT. This mode
of operation provides the user with finer resolution at the LUT output to more closely achieve the desired white
point of the calibrated display. Although 8-bit data is loaded, only 64 unique 8-bit white balance output values are
available for each color (R, G and B). The result is 8-bit white balanced data. Before driving to the output of the
deserializer, the 8-bit data must be reduced to 6-bit with an FRC dithering function. To operate in this mode, the
user must configure the deserializer to enable the FRC2 function.
Examples of the three types of LUT configurations described are shown in Figure 42.
7.5.3 Enabling White Balance
The user must load all 3 LUTs prior to enabling the white balance feature. The following sequence must be
followed by the user.
48
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Image Enhancement Features (continued)
To initialize white balance after power-on:
1. Load contents of all 3 LUTs . This requires a sequential loading of LUTs - first RED, second GREEN, third
BLUE. 256, 8-bit entries must be loaded to each LUT. Page registers must be set to select each LUT.
2. Enable white balance. By default, the LUT data may not be reloaded after initialization at power-on.
An option does exist to allow LUT reloading after power-on and initial LUT loading (as previously described). This
option may only be used after enabling the white-balance reload feature via the associated serial control bus
register. In this mode the LUTs may be reloaded by the master controller via I2C. This provides the user with the
flexibility to refresh LUTs periodically, or upon system requirements, to change to a new set of LUT values. The
host controller loads the updated LUT values via the serial bus interface. There is no need to disable the white
balance feature while reloading the LUT data. Refreshing the white balance to the new set of LUT data is
seamless — no interruption of displayed data.
Note that initial loading of LUT values requires that all 3 LUTs be loaded sequentially. When reloading, partial
LUT updates may be made; the LUT cannot be read.
8-bit in / 8 bit out
Gray level
Entry
Data Out
(8-bits)
00000000b
N/A
N/A
N/A
00000100b
N/A
N/A
N/A
00001000b
N/A
N/A
N/A
248
249
250
251
252
253
254
255
11111000b
N/A
N/A
N/A
11111100b
N/A
N/A
N/A
0
1
2
3
4
5
6
7
8
9
10
11
00000001b
N/A
N/A
N/A
00000110b
N/A
N/A
N/A
00001011b
N/A
N/A
N/A
248
249
250
251
252
253
254
255
11111010b
N/A
N/A
N/A
11111111b
N/A
N/A
N/A
«
«
0
1
2
3
4
5
6
7
8
9
10
11
Data Out
(8-bits)
«
11111010b
11111010b
11111011b
11111011b
11111110b
11111101b
11111101b
11111111b
Data Out
(8-bits)
«
248
249
250
251
252
253
254
255
6-bit in / 8 bit out
Gray level
Entry
«
00000000b
00000001b
00000011b
00000011b
00000110b
00000110b
00000111b
00000111b
00001000b
00001010b
00001001b
00001011b
«
0
1
2
3
4
5
6
7
8
9
10
11
6-bit in / 6 bit out
Gray level
Entry
Figure 42. White-Balance LUT Configuration
7.5.4 Adaptive Hi-FRC Dithering
The adaptive frame rate control FRC dithering feature delivers product-differentiating image quality. It reduces
24-bit RGB (8 bits per sub-pixel) to 18-bit RGB (6 bits per sub-pixel), smoothing color gradients, and allowing the
flexibility to use lower cost 18-bit displays. FRC dithering is a method to emulate missing colors on a lower color
depth LCD display by changing the pixel color slightly with every frame. FRC is achieved by controlling on and
off pixels over multiple frames (temporal). Static dithering regulates the number of on and off pixels in a small
defined pixel group (spatial). The FRC module includes both temporal and spatial methods and also Hi-FRC.
Conventional FRC can display only 16,194,277 colors with 6-bit RGB source. Hi-FRC enables full (16,777,216)
color on an 18-bit LCD panel. The adaptive FRC module also includes input pixel detection to apply specific
Spatial dithering methods for smoother gray level transitions. When enabled, the lower LSBs of each RGB output
are not active; only 18-bit data (6 bits per R,G and B) are driven to the display. This feature is enabled via serial
control bus register. Two FRC functional blocks are available, and may be independently enabled. FRC1
precedes the white-balance LUT, and is intended to be used when 24-bit data is being driven to an 18-bit display
with a white-balance LUT that is calibrated for an 18-bit data source. The second FRC block, RC2, follows the
white balance block and is intended to be used when fine adjustment of color temperature is required on an 18bit color display, or when a 24-bit source drives an 18-bit display with a white-balance LUT calibrated for 24-bit
source data.
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Image Enhancement Features (continued)
For proper operation of the FRC dithering feature, the user must provide a description of the display timing
control signals. The timing mode, sync mode (HS, VS) or DE only must be specified, along with the active
polarity of the timing control signals. All this information is entered to device control registers via the serial bus
interface.
Adaptive Hi-FRC dithering consists of several components. Initially, the incoming 8-bit data is expanded to 9-bit
data. This allows the effective dithered result to support a total of 16.7 million colors. The incoming 9-bit data is
evaluated, and one of four possible algorithms is selected. The majority of incoming data sequences are
supported by the default dithering algorithm. Certain incoming data patterns (black/white pixel, full on/off subpixel) require special algorithms designed to eliminate visual artifacts associated with these specific gray level
transitions. Three algorithms are defined to support these critical transitions.
An example of the default dithering algorithm is shown in Figure 43. The 1 or 0 value shown in Figure 43
Figure 43 describes whether the 6-bit value is increased by 1 (“1”) or left unchanged (“0”). In this case, the 3
truncated LSBs are 001.
Frame = 0, Line = 0
F0L0
Pixel Index
PD1
Pixel Data one
Cell Value 010
R[7:2]+0, G[7:2]+1, B[7:2]+0
LSB=001
three lsb of 9 bit data (8 to 9 for Hi-Frc)
PD1
PD2
PD3
PD4
PD5
PD6
PD7
PD8
F0L0
010
000
000
000
000
000
010
000
F0L1
101
000
000
000
101
000
000
000
R = 4/32
F0L2
000
000
010
000
010
000
000
000
G = 4/32
F0L3
000
000
101
000
000
000
101
000
B = 4/32
F1L0
000
000
000
000
000
000
000
000
F1L1
000
111
000
000
000
111
000
000
R = 4/32
F1L2
000
000
000
000
000
000
000
000
G = 4/32
F1L3
000
000
000
111
000
000
000
111
B = 4/32
F2L0
000
000
010
000
010
000
000
000
F2L1
000
000
101
000
000
000
101
000
R = 4/32
F2L2
010
000
000
000
000
000
010
000
G = 4/32
F2L3
101
000
000
000
101
000
000
000
B = 4/32
F3L0
000
000
000
000
000
000
000
000
F3L1
000
000
000
111
000
000
000
111
R = 4/32
F3L2
000
000
000
000
000
000
000
000
G = 4/32
F3L3
000
111
000
000
000
111
000
000
B = 4/32
LSB=001
LSB = 001
Figure 43. Default FRC Algorithm
50
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7.6 Programming
7.6.1 Serial Control Bus
The device may also be configured by the use of a I2C-compatible serial control bus. Multiple devices may share
the serial control bus (up to eight device addresses supported). The device address is set through a resistor
divider (RHIGH and RLOW — see Figure 44 below) connected to the IDx pin.
VDDIO
RHIGH
VI2C
VIDX
RPU
RPU
IDX
RLOW
HOST
Deserializer
SCL
SCL
SDA
SDA
To other
Devices
Figure 44. Serial Control Bus Connection
The serial control bus consists of two signals, SCL and SDA. SCL is a serial bus clock input. SDA is the serial
bus data input / output signal. Both SCL and SDA signals require an external pullup resistor to 1.8-V or 3.3-V
VI2C. For most applications, TI recommends that the user adds a 4.7-kΩ pullup resistor to the VDD33 or 2.2 kΩ
resistor to the VDD18. However, the pullup resistor value may be adjusted for capacitive loading and data rate
requirements. The signals are either pulled high or driven low. For more details information on how to calculate
the pullup resistor, see I2C Bus Pullup Resistor Calculation (SLVA689).
The IDx pin configures the control interface to one of eight possible device addresses. A pullup resistor and a
pulldown resistor may be used to set the appropriate voltage ratio between the IDx input pin (VLOW) and VDD33,
each ratio corresponding to a specific device address. See Table 10 for more information.
Table 10. Serial Control Bus Addresses for IDx
NO.
VIDX
VOLTAGE
VIDX
TARGET VOLTAGE
SUGGESTED STRAP RESISTORS
(1% tolerance)
PRIMARY ASSIGNED I2C ADDRESS
V (TYP)
VDD = 3.3 V
R1 (kΩ)
R2 (kΩ)
7-BIT
0
0
0
Open
10
0x2C
8-BIT
0x58
1
0.169 x V(VDD33)
0.559
73.2
15
0x2E
0x5C
2
0.230 x V(VDD33)
0.757
66.5
20
0x30
0x60
3
0.295 x V(VDD33)
0.974
59
24.9
0x32
0x64
4
0.376 x V(VDD33)
1.241
49.9
30.1
0x34
0x68
5
0.466 x V(VDD33)
1.538
46.4
40.2
0x36
0x6C
6
0.556 x V(VDD33)
1.835
40.2
49.9
0x38
0x70
7
0.801 x V(VDD33)
2.642
18.7
75
0x3C
0x78
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The serial bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when
SDA transitions low while SCL is high. A STOP occurs when SCL transitions high while SDA is also HIGH. See
Figure 45.
SDA
SCL
P
S
START condition, or
START repeat condition
STOP condition
Figure 45. START and STOP Conditions
To communicate with a remote device, the host controller (master) sends the slave address and listens for a
response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is
addressed correctly, it acknowledges (ACKs) the master by driving the SDA bus low. If the address does not
match the slave address of a device, the slave not-acknowledges (NACKs) the master by letting the SDA be
pulled High. ACKs also occur on the bus when data is transmitted. When the master writes data, the slave sends
an ACK after every data byte is successfully received. When the master reads data, the master sends an ACK
after every data byte is received to let the slave know that the master is ready to receive another data byte.
When the master wants to stop reading, the master sends a NACK after the last data byte to create a stop
condition on the bus. All communication on the bus begins with either a start condition or a repeated Start
condition. All communication on the bus ends with a stop condition. A READ is shown in Figure 46 and a WRITE
is shown in Figure 47.
Register Address
Slave Address
A
2
S
A
1
A
0
0
Slave Address
a
c
k
a
c
k
A
2
Sr
A
1
Data
A
0
1
a
c
k
a
c
k
P
Figure 46. Serial Control Bus — READ
Register Address
Slave Address
S
A
2
A
1
A
0
0
Data
a
c
k
a
c
k
a
c
k
P
Figure 47. Serial Control Bus — WRITE
The I2C master located in the deserializer must support I2C clock stretching. For more information on I2C
interface requirements and throughput considerations, refer to the I2C Communication Over FPD-Link III with
Bidirectional Control Channel (SNLA131).
7.6.2 Multi-Master Arbitration Support
The bidirectional control channel in the FPD-Link III devices implements I2C-compatible bus arbitration in the
proxy I2C master implementation. When sending a data bit, each I2C master senses the value on the SDA line.
If the master sends a logic 1 but senses a logic 0, the master loses arbitration. The master will stop driving SDA
and retry the transaction when the bus becomes idle. Thus, multiple I2C masters may be implemented in the
system.
52
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For example, there might also be a local I2C master at each camera. The local I2C master could access the
image sensor and EEPROM. The only restriction would be that the remote I2C master at the camera should not
attempt to access a remote slave through the BCC that is located at the host controller side of the link. In other
words, the control channel should only operate in camera mode for accessing remote slave devices to avoid
issues with arbitration across the link. The remote I2C master should also not attempt to access the deserializer
registers to avoid a conflict in register access with the Host controller.
If the system does require master-slave operation in both directions across the BCC, some method of
communication must be used to ensure only one direction of operation occurs at any time. The communication
method could include using available R/W registers in the deserializer to allow masters to communicate with
each other to pass control between the two masters. An example would be to use register 0x18 or 0x19 in the
deserializer as a mailbox register to pass control of the channel from one master to another.
7.6.3 I2C Restrictions on Multi-Master Operation
The I2C specification does not provide for arbitration between masters under certain conditions. The system
should make sure the following conditions cannot occur to prevent undefined conditions on the I2C bus:
• One master generates a repeated start while another master is sending a data bit.
• One master generates a stop while another master is sending a data bit.
• One master generates a repeated start while another master sends a stop.
Note that these restrictions mainly apply to accessing the same register offsets within a specific I2C slave.
7.6.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
When using the latest generation of FPD-Link III devices (DS90UB94x-Q1), serializers or deserializer registers
may be accessed simultaneously from both local and remote I2C masters. These devices have internal logic to
properly arbitrate between sources to allow proper read and write access without risk of corruption.
Access to remote I2C slaves is still be allowed in only one direction at a time (camera or display mode).
7.6.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
When using older FPD-Link III devices (in backward compatible mode), simultaneous access to serializer or
deserializer registers from both local and remote I2C masters may cause incorrect operation. Thus, restrictions
must be imposed on accessing of serializer and deserializer registers. The likelihood of an error occurrence is
relatively small, but it is possible for collision on reads and writes to occur, resulting in a read or write error.
TI recommends two basic options:
• Allow device register access only from one controller.
In a display mode system, this would allow only the host controller to access the serializer registers (local)
and the deserializer registers (remote). A controller at the deserializer (local to the display) would not be
allowed to access the deserializer or serializer registers.
• Allow local register access only with no access to remote serializer or deserializer registers.
The host controller would be allowed to access the serializer registers while a controller at the deserializer
could access those register only. Access to remote I2C slaves would still be allowed in one direction (camera
or display mode).
In a very limited case, remote and local access could be allowed to the deserializer registers at the same time.
Register access is ensured to work correctly if both local and remote masters are accessing the same
deserializer register. This allows a simple method of passing control of the bidirectional control channel from one
master to another.
7.6.6 Restrictions on Control Channel Direction for Multi-Master Operation
Only display or camera mode operation should be active at any time across the bidirectional control channel. If
both directions are required, some method of transferring control between I2C masters should be implemented.
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7.7 Register Maps
In the register definitions under the TYPE and DEFAULT heading, the following definitions apply:
• R = Read only access
• R/W = Read / Write access
• R/RC = Read only access, Read to Clear
• (R/W)/SC = Read / Write access, Self-Clearing bit
• (R/W)/S = Read / Write access, Set based on strap pin configuration at start-up
• LL = Latched Low and held until read
• LH = Latched High and held until read
• S = Set based on strap pin configuration at start-up
7.7.1 DS90UB948-Q1 Registers
Table 11 lists the memory-mapped registers for the DS90UB948-Q1 registers. All register offset addresses not
listed in Table 11 should be considered as reserved locations and the register contents should not be modified.
Table 11. DS90UB948-Q1 Registers
Address
54
Acronym
Register Name
Section
0x0
I2C_DEVICE_ID
Go
0x1
RESET
Go
0x2
GENERAL_CONFIGURATION_0
Go
0x3
GENERAL_CONFIGURATION_1
Go
0x4
BCC_WATCHDOG_CONTROL
Go
0x5
I2C_CONTROL_1
Go
0x6
I2C_CONTROL_2
Go
0x7
REMOTE_ID
Go
0x8
SLAVEID_0
Go
0x9
SLAVEID_1
Go
0xA
SLAVEID_2
Go
0xB
SLAVEID_3
Go
0xC
SLAVEID_4
Go
0xD
SLAVEID_5
Go
0xE
SLAVEID_6
Go
0xF
SLAVEID_7
Go
0x10
SLAVEALIAS_0
Go
0x11
SLAVEALIAS_1
Go
0x12
SLAVEALIAS_2
Go
0x13
SLAVEALIAS_3
Go
0x14
SLAVEALIAS_4
Go
0x15
SLAVEALIAS_5
Go
0x16
SLAVEALIAS_6
Go
0x17
SLAVEALIAS_7
Go
0x18
MAILBOX_18
Go
0x19
MAILBOX_19
Go
0x1A
GPIO_9__and_GLOBAL_GPIO_CONFIG
Go
0x1B
FREQUENCY_COUNTER
Go
0x1C
GENERAL_STATUS
Go
0x1D
GPIO0_CONFIG
Go
0x1E
GPIO1_2_CONFIG
Go
0x1F
GPIO3_CONFIG
Go
0x20
GPIO5_6_CONFIG
Go
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Table 11. DS90UB948-Q1 Registers (continued)
Address
Acronym
Register Name
Section
0x21
GPIO7_8_CONFIG
Go
0x22
DATAPATH_CONTROL
Go
0x23
RX_MODE_STATUS
Go
0x24
BIST_CONTROL
Go
0x25
BIST_ERROR_COUNT
Go
0x26
SCL_HIGH_TIME
Go
0x27
SCL_LOW_TIME
Go
0x28
DATAPATH_CONTROL_2
Go
0x29
FRC_CONTROL
Go
0x2A
WHITE_BALANCE_CONTROL
Go
0x2B
I2S_CONTROL
Go
0x2E
PCLK_TEST_MODE
Go
0x34
DUAL_RX_CTL
Go
0x35
AEQ_TEST
Go
0x37
MODE_SEL
Go
0x3A
I2S_DIVSEL
Go
0x3B
EQ_STATUS
Go
0x41
LINK_ERROR_COUNT
Go
0x43
HSCC_CONTROL
Go
0x44
ADAPTIVE_EQ_BYPASS
Go
0x45
ADAPTIVE_EQ_MIN_MAX
Go
0x49
FPD_TX_MODE
Go
0x4B
LVDS_CONTROL
Go
0x52
CML_OUTPUT_CTL1
Go
0x56
CML_OUTPUT_ENABLE
Go
0x57
CML_OUTPUT_CTL2
Go
0x63
CML_OUTPUT_CTL3
Go
0x64
PGCTL
Go
0x65
PGCFG
Go
0x66
PGIA
Go
0x67
PGID
Go
0x68
PGDBG
Go
0x69
PGTSTDAT
Go
0x6E
GPI_PIN_STATUS_1
Go
0x6F
GPI_PIN_STATUS_2
Go
0xF0
RX_ID0
Go
0xF1
RX_ID1
Go
0xF2
RX_ID2
Go
0xF3
RX_ID3
Go
0xF4
RX_ID4
Go
0xF5
RX_ID5
Go
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7.7.1.1 I2C_DEVICE_ID Register (Address = 0x0) [reset = STRAP]
I2C_DEVICE_ID is shown in and described in Table 12.
Return to Summary Table.
Table 12. I2C_DEVICE_ID Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
DEVICE_ID
R/W
STRAP
7-bit address of Deserializer
Defaults to address configured by the IDX strap pin
DES_ID
R/W
0x0
0: Device ID is from IDX strap
1: Register I2C Device ID overrides IDX strap
0
7.7.1.2 RESET Register (Address = 0x1) [reset = 0x0]
RESET is described in Table 13.
Return to Summary Table.
Table 13. RESET Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
RESERVED
R
0x0
Reserved
5
RESERVED
R
0x0
Reserved
4
RESERVED
R
0x0
Reserved
3
RESERVED
R
0x0
Reserved
2
RESERVED
R
0x0
Reserved
1
DIGITAL_RESET0
R/W
0x0
Digital Reset
Resets the entire digital block including registers. This bit is selfclearing.
1: Reset
0: Normal operation
Registers which are loaded by pin strap will be restored to their
original strap value when this bit is set. These registers show 'Strap '
as their default value in this table.
0
DIGITAL_RESET1
R/W
0x0
Digital Reset
Resets the entire digital block except registers. This bit is selfclearing.
1: Reset
0: Normal operation
7.7.1.3 GENERAL_CONFIGURATION_0 Register (Address = 0x2) [reset = 0x0]
GENERAL_CONFIGURATION_0 is described in Table 14.
Return to Summary Table.
Table 14. GENERAL_CONFIGURATION_0 Register Field Descriptions
Bit
56
Field
Type
Reset
Description
7
OUTPUT_ENABLE
R/W
0x0
Output Enable Override Value (in conjunction with Output Sleep
State Select)
If the Override control is not set, the Output Enable will be set to 1.
A Digital reset 0x01[0] should be asserted after toggling Output
Enable bit LOW to HIGH
6
OUTPUT_ENABLE_OVE
RRIDE
R/W
0x0
Overrides Output Enable and Output Sleep State default
0: Disable override
1: Enable override
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Table 14. GENERAL_CONFIGURATION_0 Register Field Descriptions (continued)
Bit
Reset
Description
5
Field
OSC_CLOCK_OUTPUT_ R/W
ENABLE__AUTO_CLOCK
_EN
Type
0x0
OSC clock output enable
If loss of lock OSC clock is output onto PCLK. The frequency is
selected in register 0x24.
1: Enable
0: Disable
4
OUTPUT_SLEEP_STATE R/W
_SELECT
0x0
OSS Select Override value to control output state when LOCK is low
(used in conjunction with Output Enable)
If the Override control is not set, the Output Sleep State Select will
be set to 1.
3
RESERVED
R
0x0
Reserved
2
RESERVED
R
0x0
Reserved
1
RESERVED
R
0x0
Reserved
0
RESERVED
R
0x0
Reserved
7.7.1.4 GENERAL_CONFIGURATION_1 Register (Address = 0x3) [reset = 0x70]
GENERAL_CONFIGURATION_1 is described in Table 15.
Return to Summary Table.
Table 15. GENERAL_CONFIGURATION_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
BC_CRC_GENERATOR_
ENABLE
R/W
0x1
Back Channel CRC Generator Enable
0: Disable
1: Enable
5
FAILSAFE_LOW
R/W
0x1
Controls the pull direction for undriven LVCMOS inputs
1: Pull down
0: Pull up
4
FILTER_ENABLE
R/W
0x1
HS,VS,DE two clock filter
When enabled, pulses less than two full PCLK cycles on the DE, HS,
and VS inputs will be rejected. For HS, It is a 2-clock filter for single
FPD3 mode and a 4-clock filter for dual FPD3 mode.
1: Filtering enable
0: Filtering disable
3
I2C_PASS_THROUGH
R/W
0x0
I2C Pass-Through to Serializer if decode matches
0: Pass-Through Disabled
1: Pass-Through Enabled
2
AUTO_ACK
R/W
0x0
Automatically Acknowledge I2C writes independent of the forward
channel lock state
1: Enable
0: Disable
1
DE_GATE_RGB
R/W
0x0
Gate RGB data with DE signal. RGB data is gated with DE in order
to allow packetized audio and block unencrypted data when paired
with a serializer that supports HDCP. When paired with a serializer
that does not support HDCP, RGB data is not gated with DE by
default. However, to enable packetized autio this bit must be set.
1: Gate RGB data with DE (has no effect when paired with a
serializer that supports HDCP)
0: Pass RGB data independent of DE (has no effect when paired
with a serializer that does not support HDCP)
0
RESERVED
R
0x0
Reserved
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7.7.1.5 BCC_WATCHDOG_CONTROL Register (Address = 0x4) [reset = 0xFE]
BCC_WATCHDOG_CONTROL is described in Table 16.
Return to Summary Table.
Table 16. BCC_WATCHDOG_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
BCC_WATCHDOG_TIME
R
R/W
0x7F
The watchdog timer allows termination of a control channel
transaction if it fails to complete within a programmed amount of
time. This field sets the Bidirectional Control Channel Watchdog
Timeout value in units of 2 milliseconds. This field should not be set
to 0.
0
BCC_WATCHDOG_TIME
R_DISABLE
R/W
0x0
Disable Bidirectional Control Channel Watchdog Timer
1: Disables BCC Watchdog Timer operation
0: Enables BCC Watchdog Timer operation
7.7.1.6 I2C_CONTROL_1 Register (Address = 0x5) [reset = 0x1E]
I2C_CONTROL_1 is described in Table 17.
Return to Summary Table.
Table 17. I2C_CONTROL_1 Register Field Descriptions
Bit
Reset
Description
I2C_PASS_THROUGH_A R/W
LL
0x0
I2C Pass-Through All Transactions
0: Disabled
1: Enabled
6-4
I2C_SDA_HOLD
R/W
0x1
Internal SDA Hold Time
This field configures the amount of internal hold time provided for the
SDA input relative to the SCL input. Units are 50 nanoseconds.
3-0
I2C_FILTER_DEPTH
R/W
0xE
I2C Glitch Filter Depth
This field configures the maximum width of glitch pulses on the SCL
and SDA inputs that will be rejected. Units are 5 nanoseconds.
7
Field
Type
7.7.1.7 I2C_CONTROL_2 Register (Address = 0x6) [reset = 0x0]
I2C_CONTROL_2 is described in Table 18.
Return to Summary Table.
Table 18. I2C_CONTROL_2 Register Field Descriptions
Bit
Type
Reset
Description
7
FORWARD_CHANNEL_S R
EQUENCE_ERROR
0x0
Control Channel Sequence Error Detected
This bit indicates a sequence error has been detected in forward
control channel. If this bit is set, an error may have occurred in the
control channel operation.
6
CLEAR_SEQUENCE_ER
ROR
R/W
0x0
Clears the Sequence Error Detect bit
5
RESERVED
R
0x0
Reserved
SDA_Output_Delay
R/W
0x0
SDA Output Delay
This field configures output delay on the SDA output. Setting this
value will increase output delay in units of 50ns. Nominal output
delay values for SCL to SDA are:
00: 250ns
01: 300ns
10: 350ns
11: 400ns
4-3
58
Field
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Table 18. I2C_CONTROL_2 Register Field Descriptions (continued)
Bit
Reset
Description
2
Field
LOCAL_WRITE_DISABLE R/W
Type
0x0
Disable Remote Writes to Local Registers
Setting this bit to a 1 will prevent remote writes to local device
registers from across the control channel. This prevents writes to the
Deserializer registers from an I2C master attached to the Serializer.
Setting this bit does not affect remote access to I2C slaves at the
Deserializer.
1
I2C_BUS_TIMER_SPEED R/W
UP
0x0
Speed up I2C Bus Watchdog Timer
1: Watchdog Timer expires after approximately 50 microseconds
0: Watchdog Timer expires after approximately 1 second.
0
I2C_BUS_TIMER_DISAB
LE
0x0
Disable I2C Bus Watchdog Timer
When the I2C Watchdog Timer may be used to detect when the I2C
bus is free or hung up following an invalid termination of a
transaction. If SDA is high and no signalling occurs for approximately
1 second, the I2C bus will assumed to be free. If SDA is low and no
signaling occurs, the device will attempt to clear the bus by driving 9
clocks on SCL
R/W
7.7.1.8 REMOTE_ID Register (Address = 0x7) [reset = 0x0]
REMOTE_ID is described in Table 19.
Return to Summary Table.
Table 19. REMOTE_ID Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
REMOTE_ID
R/W
0x0
7-bit Serializer Device ID
Configures the I2C Slave ID of the remote Serializer. A value of 0 in
this field disables I2C access to the remote Serializer. This field is
automatically loaded from the Serializer once RX Lock has been
detected. Software may overwrite this value, but should also assert
the FREEZE DEVICE ID bit to prevent loading by the Bidirectional
Control Channel.
FREEZE_DEVICE_ID
R/W
0x0
Freeze Serializer Device ID
Prevent auto-loading of the Serializer Device ID from the Forward
Channel. The ID will be frozen at the value written.
0
7.7.1.9 SLAVEID_0 Register (Address = 0x8) [reset = 0x0]
SLAVEID_0 is described in Table 20.
Return to Summary Table.
Table 20. SLAVEID_0 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID0
R/W
0x0
7-bit Remote Slave Device ID 0
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID0, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
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7.7.1.10 SLAVEID_1 Register (Address = 0x9) [reset = 0x0]
SLAVEID_1 is described in Table 21.
Return to Summary Table.
Table 21. SLAVEID_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID1
R/W
0x0
7-bit Remote Slave Device ID 1
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID1, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.11 SLAVEID_2 Register (Address = 0xA) [reset = 0x0]
SLAVEID_2 is described in Table 22.
Return to Summary Table.
Table 22. SLAVEID_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID2
R/W
0x0
7-bit Remote Slave Device ID 2
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID2, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.12 SLAVEID_3 Register (Address = 0xB) [reset = 0x0]
SLAVEID_3 is described in Table 23.
Return to Summary Table.
Table 23. SLAVEID_3 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID3
R/W
0x0
7-bit Remote Slave Device ID 3
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID3, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.13 SLAVEID_4 Register (Address = 0xC) [reset = 0x0]
SLAVEID_4 is described in Table 24.
Return to Summary Table.
Table 24. SLAVEID_4 Register Field Descriptions
60
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID4
R/W
0x0
7-bit Remote Slave Device ID 4v Configures the physical I2C
address of the remote I2C Slave device attached to the remote
Serializer. If an I2C transaction is addressed to the Slave Alias ID4,
the transaction will be remapped to this address before passing the
transaction across the Bidirectional Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
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7.7.1.14 SLAVEID_5 Register (Address = 0xD) [reset = 0x0]
SLAVEID_5 is described in Table 25.
Return to Summary Table.
Table 25. SLAVEID_5 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID5
R/W
0x0
7-bit Remote Slave Device ID 5
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID5, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.15 SLAVEID_6 Register (Address = 0xE) [reset = 0x0]
SLAVEID_6 is described in Table 26.
Return to Summary Table.
Table 26. SLAVEID_6 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID6
R/W
0x0
7-bit Remote Slave Device ID 6
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID6, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.16 SLAVEID_7 Register (Address = 0xF) [reset = 0x0]
SLAVEID_7 is described in Table 27.
Return to Summary Table.
Table 27. SLAVEID_7 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ID7
R/W
0x0
7-bit Remote Slave Device ID 7
Configures the physical I2C address of the remote I2C Slave device
attached to the remote Serializer. If an I2C transaction is addressed
to the Slave Alias ID7, the transaction will be remapped to this
address before passing the transaction across the Bidirectional
Control Channel to the Serializer.
0
RESERVED
R
0x0
Reserved
7.7.1.17 SLAVEALIAS_0 Register (Address = 0x10) [reset = 0x0]
SLAVEALIAS_0 is described in Table 28.
Return to Summary Table.
Table 28. SLAVEALIAS_0 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID0
R/W
0x0
7-bit Remote Slave Device Alias ID 0
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID0 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
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7.7.1.18 SLAVEALIAS_1 Register (Address = 0x11) [reset = 0x0]
SLAVEALIAS_1 is described in Table 29.
Return to Summary Table.
Table 29. SLAVEALIAS_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID1
R/W
0x0
7-bit Remote Slave Device Alias ID 1
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID1 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.19 SLAVEALIAS_2 Register (Address = 0x12) [reset = 0x0]
SLAVEALIAS_2 is described in Table 30.
Return to Summary Table.
Table 30. SLAVEALIAS_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID2
R/W
0x0
7-bit Remote Slave Device Alias ID 2
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID2 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.20 SLAVEALIAS_3 Register (Address = 0x13) [reset = 0x0]
SLAVEALIAS_3 is described in Table 31.
Return to Summary Table.
Table 31. SLAVEALIAS_3 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID3
R/W
0x0
7-bit Remote Slave Device Alias ID 3
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID3 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.21 SLAVEALIAS_4 Register (Address = 0x14) [reset = 0x0]
SLAVEALIAS_4 is described in Table 32.
Return to Summary Table.
Table 32. SLAVEALIAS_4 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID4
R/W
0x0
7-bit Remote Slave Device Alias ID 4
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID4 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
62
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7.7.1.22 SLAVEALIAS_5 Register (Address = 0x15) [reset = 0x0]
SLAVEALIAS_5 is described in Table 33.
Return to Summary Table.
Table 33. SLAVEALIAS_5 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID5
R/W
0x0
7-bit Remote Slave Device Alias ID 5
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID5 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.23 SLAVEALIAS_6 Register (Address = 0x16) [reset = 0x0]
SLAVEALIAS_6 is described in Table 34.
Return to Summary Table.
Table 34. SLAVEALIAS_6 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID6
R/W
0x0
7-bit Remote Slave Device Alias ID 6
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID6 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.24 SLAVEALIAS_7 Register (Address = 0x17) [reset = 0x0]
SLAVEALIAS_7 is described in Table 35.
Return to Summary Table.
Table 35. SLAVEALIAS_7 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
SLAVE_ALIAS_ID7
R/W
0x0
7-bit Remote Slave Device Alias ID 7
Configures the decoder for detecting transactions designated for an
I2C Slave device attached to the remote Serializer. The transaction
will be remapped to the address specified in the Slave ID7 register.
A value of 0 in this field disables access to the remote I2C Slave.
RESERVED
R
0x0
Reserved
0
7.7.1.25 MAILBOX_18 Register (Address = 0x18) [reset = 0x0]
MAILBOX_18 is described in Table 36.
Return to Summary Table.
Table 36. MAILBOX_18 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MAILBOX_18
R/W
0x0
Mailbox Register
This register is an unused read/write register that can be used for
any purpose such as passing messages between I2C masters on
opposite ends of the link.
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7.7.1.26 MAILBOX_19 Register (Address = 0x19) [reset = 0x1]
MAILBOX_19 is described in Table 37.
Return to Summary Table.
Table 37. MAILBOX_19 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
MAILBOX_19
R/W
0x1
Mailbox Register
This register is an unused read/write register that can be used for
any purpose such as passing messages between I2C masters on
opposite ends of the link.
7.7.1.27 GPIO_9__and_GLOBAL_GPIO_CONFIG Register (Address = 0x1A) [reset = 0x0]
GPIO_9__and_GLOBAL_GPIO_CONFIG is described in Table 38.
Return to Summary Table.
Table 38. GPIO_9__and_GLOBAL_GPIO_CONFIG Register Field Descriptions
Bit
64
Field
Type
Reset
Description
7
GLOBAL_GPIO_OUTPUT R/W
_VALUE
0x0
Global GPIO Output Value
This value is output on each GPIO pin when the individual pin is not
otherwise enabled as a GPIO and the global GPIO direction is
Output
6
RESERVED
0x0
Reserved
5
GLOBAL_GPIO_FORCE_ R/W
DIR
0x0
The GLOBAL GPIO DIR and GLOBAL GPIO EN bits configure the
pad in input direction or output direction for functional mode or GPIO
mode. The GLOBAL bits are overridden by the individual GPIO DIR
and GPIO EN bits.
{GLOBAL GPIO DIR, GLOBAL GPIO EN}
00: Functional mode; output
10: Tri-state
01: Force mode; output
11: Force mode; input
4
GLOBAL_GPIO_FORCE_ R/W
EN
0x0
This bit grouped together with bit 5 to form the configuration of GPIO
DIR and GPIO EN.
3
GPIO9_OUTPUT_VALUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
2
RESERVED
R
0x0
Reserved
1
GPIO9_DIR
R/W
0x0
The GPIO DIR and GPIO EN bits configure the pad in input direction
or output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO9_EN
R/W
0x0
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
R
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7.7.1.28 FREQUENCY_COUNTER Register (Address = 0x1B) [reset = 0x0]
FREQUENCY_COUNTER is shown in and described in Table 39.
Return to Summary Table.
Table 39. FREQUENCY_COUNTER Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
Frequency_Count
R/W
0x0
Frequency Counter control
A write to this register will enable a frequency counter to count the
number of pixel clock during a specified time interval. The time
interval is equal to the value written multiplied by the oscillator clock
period (nominally 50ns). A read of the register returns the number of
pixel clock edges seen during the enabled interval. The frequency
counter will freeze at 0xff if it reaches the maximum value. The
frequency counter will provide a rough estimate of the pixel clock
period. If the pixel clock frequency is known, the frequency counter
may be used to determine the actual oscillator clock frequency.
7.7.1.29 GENERAL_STATUS Register (Address = 0x1C) [reset = 0x0]
GENERAL_STATUS is described in Table 40.
Return to Summary Table.
Table 40. GENERAL_STATUS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-6
RESERVED
R
0x0
Reserved
5
DUAL_TX_STS
R
0x0
Transmitter Dual Link Status:
This bit indicates the current operating mode of the FPD-Link
Transmit port
1: Dual-link mode active
0: Single-link mode active
4
DUAL_RX_STS
R
0x0
Receiver Dual Link Status:
This bit indicates the current operating mode of the FPD-Link III
Receive port
1: Dual-link mode active
0: Single-link mode active
3
I2S_LOCKED
R
0x0
I2S LOCK STATUS
0: I2S PLL controller not locked
1: I2S PLL controller locked to input i2s clock
2
RESERVED
R
0x0
Reserved
1
SIGNAL_DETECT
R
0x0
1: Serial input detected
0: Serial input not detected
0
LOCK
R
0x0
De-Serializer CDR, PLL's clock to recovered clock frequency
1: De-Serializer locked to recovered clock
0: De-Serializer not locked
In Dual-link mode, this indicates both channels are locked.
7.7.1.30 GPIO0_CONFIG Register (Address = 0x1D) [reset = 0x3]
GPIO0_CONFIG is described in Table 41.
Return to Summary Table.
GPIO0 and D_GPIO0 Configuration: If PORT1_SEL is set, this register controls the D_GPIO0 pin
Table 41. GPIO0_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
Rev_ID
R
0x0
Revision ID
0001: B1
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Table 41. GPIO0_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
3
GPIO0_OUTPUT_VALUE
_D_GPIO0_OUTPUT_VA
LUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
2
GPIO0_REMOTE_ENABL R/W
E
_D_GPIO0_REMOTE_EN
ABLE
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
1
GPIO0_DIR
_D_GPIO0_DIR
R/W
0x1
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO0_EN
_D_GPIO0_EN
R/W
0x1
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
7.7.1.31 GPIO1_2_CONFIG Register (Address = 0x1E) [reset = 0x3]
GPIO1_2_CONFIG is described in Table 42.
Return to Summary Table.
GPIO1/GPIO2 and D_GPIO1/D_GPIO2 Configuration: If PORT1_SEL is set, this register controls the D_GPIO1
and D_GPIO2 pins
Table 42. GPIO1_2_CONFIG Register Field Descriptions
Bit
66
Field
Type
Reset
Description
7
GPIO2_OUTPUT_VALUE
_D_GPIO2_OUTPUT_VA
LUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
6
GPIO2_REMOTE_ENABL R/W
E
_D_GPIO2_REMOTE_EN
ABLE
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
5
GPIO2_DIR
_D_GPIO2_DIR
R/W
0x0
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
4
GPIO2_EN
_D_GPIO2_EN
R/W
0x0
This bit grouped together with bit 5 to form the configuration of GPIO
DIR and GPIO EN.
3
GPIO1_OUTPUT_VALUE
_D_GPIO1_OUTPUT_VA
LUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
2
GPIO1_REMOTE_ENABL R/W
E
_D_GPIO1_REMOTE_EN
ABLE
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
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Table 42. GPIO1_2_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
1
GPIO1_DIR
_D_GPIO1_DIR
R/W
0x1
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO1_EN
_D_GPIO1_EN
R/W
0x1
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
7.7.1.32 GPIO3_CONFIG Register (Address = 0x1F) [reset = 0x2]
GPIO3_CONFIG is described in Table 43.
Return to Summary Table.
GPIO3 and D_GPIO3 Configuration: If PORT1_SEL is set, this register controls the D_GPIO3 pin
Table 43. GPIO3_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
RESERVED
R
0x0
Reserved
3
GPIO3_OUTPUT_VALUE
_D_GPIO3_OUTPUT_VA
LUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
2
GPIO3_REMOTE_ENABL R/W
E
_D_GPIO3_REMOTE_EN
ABLE
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
1
GPIO3_DIR
_D_GPIO3_DIR
R/W
0x1
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO3_EN
_D_GPIO3_EN
R/W
0x0
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
7.7.1.33 GPIO5_6_CONFIG Register (Address = 0x20) [reset = 0x0]
GPIO5_6_CONFIG is described in Table 44.
Return to Summary Table.
Table 44. GPIO5_6_CONFIG Register Field Descriptions
Bit
Field
Type
Reset
Description
7
GPIO6_OUTPUT_VALUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
6
GPIO6_REMOTE_ENABL R/W
E
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
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Table 44. GPIO5_6_CONFIG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
5
GPIO6_DIR
R/W
0x0
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
4
GPIO6_EN
R/W
0x0
This bit grouped together with bit 5 to form the configuration of GPIO
DIR and GPIO EN.
3
GPIO5_OUTPUT_VALUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
2
GPIO5_REMOTE_ENABL R/W
E
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
1
GPIO5_DIR
R/W
0x0
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO5_EN
R/W
0x0
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
7.7.1.34 GPIO7_8_CONFIG Register (Address = 0x21) [reset = 0x0]
GPIO7_8_CONFIG is described in Table 45.
Return to Summary Table.
Table 45. GPIO7_8_CONFIG Register Field Descriptions
Bit
68
Field
Type
Reset
Description
7
GPIO8_OUTPUT_VALUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
6
GPIO8_REMOTE_ENABL R/W
E
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
5
GPIO8_DIR
R/W
0x0
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
4
GPIO8_EN
R/W
0x0
This bit grouped together with bit 5 to form the configuration of GPIO
DIR and GPIO EN.
3
GPIO7_OUTPUT_VALUE
R/W
0x0
Local GPIO Output Value
This value is output on the GPIO pin when the GPIO function is
enabled, the local GPIO direction is Output, and remote GPIO
control is disabled.
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Table 45. GPIO7_8_CONFIG Register Field Descriptions (continued)
Bit
Reset
Description
2
Field
GPIO7_REMOTE_ENABL R/W
E
Type
0x0
Remote GPIO Control
1: Enable GPIO control from remote Serializer. The GPIO pin will be
an output, and the value is received from the remote Serializer.
0: Disable GPIO control from remote Serializer.
1
GPIO7_DIR
R/W
0x0
The GPIO DIR and GPIO EN configures the pad in input direction or
output direction for functional mode or GPIO mode.
{GPIO DIR, GPIO EN}
00: Functional mode; output
10: Tri-state
01: GPIO mode; output
11: GPIO mode; input
0
GPIO7_EN
R/W
0x0
This bit grouped together with bit 1 to form the configuration of GPIO
DIR and GPIO EN.
7.7.1.35 DATAPATH_CONTROL Register (Address = 0x22) [reset = 0x0]
DATAPATH_CONTROL is described in Table 46.
Return to Summary Table.
Table 46. DATAPATH_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7
OVERRIDE_FC_CONFIG
R/W
0x0
1: Disable loading of this register from the forward channel, keeping
locally written values intact 0: Allow forward channel loading of this
register
6
PASS_RGB
R/W
0x0
Setting this bit causes RGB data to be sent independent of DE. This
allows operation in systems which may not use DE to frame video
data or send other data when DE is deasserted. Note that setting
this bit prevents HDCP operation and blocks packetized audio. This
bit does not need to be set in DS90UB928 or in Backward
Compatibility mode.
1: Pass RGB independent of DE
0: Normal operation
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
5
DE_POLARITY
R/W
0x0
This bit indicates the polarity of the DE (Data Enable) signal.
1: DE is inverted (active low, idle high)
0: DE is positive (active high, idle low)
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
4
I2S_RPTR_REGEN
R/W
0x0
This bit controls whether the HDCP Receiver outputs packetized
Auxiliary/Audio data on the RGB video output pins.
1: Don't output packetized audio data on RGB video output pins
0: Output packetized audio on RGB video output pins.
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
3
I2S_4_CHANNEL_ENABL R/W
E_OVERRIDE
0x0
1: Set I2S 4-Channel Enable from bit of of this register
0: Set I2S 4-Channel disabled
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
2
18_BIT_VIDEO_SELECT
R/W
0x0
1: Select 18-bit video mode
0: Select 24-bit video mode
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
1
I2S_TRANSPORT_SELE
CT
R/W
0x0
1: Enable I2S In-Band Transport
0: Enable I2S Data Island Transport
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
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Table 46. DATAPATH_CONTROL Register Field Descriptions (continued)
Bit
0
Field
Type
I2S_4_CHANNEL_ENABL R/W
E
Reset
Description
0x0
I2S 4-Channel Enable
1: Enable I2S 4-Channel
0: Disable I2S 4-Channel
Note: this bit is automatically loaded from the remote serializer
unless bit 7 of this register is set.
7.7.1.36 RX_MODE_STATUS Register (Address = 0x23) [reset = X]
RX_MODE_STATUS is described in Table 47.
Return to Summary Table.
Table 47. RX_MODE_STATUS Register Field Descriptions
Bit
70
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
BC_FREQ_SELECT
R/W
0x0
Back Channel Frequency Select
0: Divide-by-4 frequency based on the OSC CLOCK DIVIDER in
Register 0x32
1: Divide-by-2 frequency ba
sed on the OSC CLOCK DIVIDER in Register 0x32 This bit will be
ignored if BC_HIGH_SPEED is set to a 1.
Note that changing this setting will result in some errors on the back
channel for a short period of time. If set over the control channel, the
Serializer should first be programmed to Auto-Ack operation
(Serializer register 0x03, bit 5) to avoid a control channel timeout
due to lack of response from the Deserializer.
5
AUTO_I2S
R/W
0x1
Auto I2S
Determine I2S mode from the AUX data codes.
4
BC_HIGH_SPEED
R/W
X
Back-Channel High-Speed control
Enables high-speed back-channel at 20Mbps This bit will override
the BC_FREQ_SELECT setting Note that changing this setting will
result in some errors on the back channel for a short period of time.
If set over the control channel, the Serializer should first be
programmed to Auto-Ack operation (Serializer register 0x03, bit 5) to
avoid a control channel timeout due to lack of response from the
Deserializer.
BC_HIGH_SPEED is loaded from the MODE_SEL1 pin strap
options.
3
COAX_MODE
R/W
X
Coax Mode
Configures the FPD3 Receiver for operation over Coax or STP
cabling:
0 : Shielded Twisted pair (STP)
1 : Coax
Coax Mode is loaded from the MODE_SEL1 pin strap options.
2
REPEATER_MODE
R
X
Repeater Mode
Indicates device is strapped to repeater mode. Repeater Mode is
loaded from the MODE_SEL1 pin strap options.
1
RESERVED
R
0x0
Reserved
0
RESERVED
R
0x0
Reserved
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7.7.1.37 BIST_CONTROL Register (Address = 0x24) [reset = 0x8]
BIST_CONTROL is described in Table 48.
Return to Summary Table.
Table 48. BIST_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-6
BIST_OUT_MODE
R/W
0x0
BIST Output Mode
00 : No toggling
01 : Alternating 1/0 toggling
1x : Toggle based on BIST data
5-4
AUTO_OSC_FREQ
R/W
0x0
When register 0x02 bit 5 (AUTO)CLOCK_EN) is set, this field
controls the nominal frequency of the oscillator-based receive clock.
00: 50 MHz
01: 25 MHz
10: 10 MHz
11: Reserved (selects analog 25 MHz, but not for customer use)
3
BIST_PIN_CONFIG
R/W
0x1
Bist Configured through Pin.
1: Bist configured through pin.
0: Bist configured through bits 2:0 in this register
BIST_CLOCK_SOURCE
R/W
0x0
BIST Clock Source
This register field selects the BIST Clock Source at the Serializer.
These register bits are automatically written to the CLOCK SOURCE
bits (register offset 0x14) in the Serializer after BIST is enabled. See
the appropriate Serializer register descriptions for details.
BIST_EN
R/W
0x0
BIST Control
1: Enabled
0: Disabled
2-1
0
7.7.1.38 BIST_ERROR_COUNT Register (Address = 0x25) [reset = 0x0]
BIST_ERROR_COUNT is described in Table 49.
Return to Summary Table.
Table 49. BIST_ERROR_COUNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
BIST_ERROR_COUNT
R
0x0
Bist Error Count
Returns BIST error count for selected port. Port selected is based on
the PORT1_SEL control in the DUAL_RX_CTL register.
7.7.1.39 SCL_HIGH_TIME Register (Address = 0x26) [reset = 0x83]
SCL_HIGH_TIME is described in Table 50.
Return to Summary Table.
Table 50. SCL_HIGH_TIME Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
SCL_HIGH_TIME
R/W
0x83
I2C Master SCL High Time
This field configures the high pulse width of the SCL output when the
De-Serializer is the Master on the local I2C bus. Units are 50 ns for
the nominal oscillator clock frequency. The default value is set to
provide a minimum 5us SCL high time with the internal oscillator
clock running at 26MHz rather than the nominal 20MHz.
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7.7.1.40 SCL_LOW_TIME Register (Address = 0x27) [reset = 0x84]
SCL_LOW_TIME is described in Table 51.
Return to Summary Table.
Table 51. SCL_LOW_TIME Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
SCL_LOW_TIME
R/W
0x84
I2C SCL Low Time
This field configures the low pulse width of the SCL output when the
De-Serializer is the Master on the local I2C bus. This value is also
used as the SDA setup time by the I2C Slave for providing data prior
to releasing SCL during accesses over the Bidirectional Control
Channel. Units are 50 ns for the nominal oscillator clock frequency.
The default value is set to provide a minimum 5us SCL low time with
the internal oscillator clock running at 26MHz rather than the nominal
20MHz.
7.7.1.41 DATAPATH_CONTROL_2 Register (Address = 0x28) [reset = 0x20]
DATAPATH_CONTROL_2 is described in Table 52.
Return to Summary Table.
Table 52. DATAPATH_CONTROL_2 Register Field Descriptions
Bit
72
Field
Type
Reset
Description
7
OVERRIDE_FC_CONFIG
R/W
0x0
1: Disable loading of this register from the forward channel, keeping
locally witten values intact
0: Allow forward channel loading of this register
6
RESERVED
R
0x0
Reserved
5
VIDEO_DISABLED
R/W
0x1
Forward channel video disabled
0 : Normal operation
1 : Video is disabled, control channel is enabled
This is a status bit indicating the forward channel is not sending
active video. In this mode, the control channel and GPIO functions
are enabled.
4
DUAL_LINK
R/W
0x0
1: Dual-Link mode enabled
0: Single-Link mode enabled
This bit indicates whether the FPD3 serializer is in single link or dual
link mode. This control is used for recovering forward channel data
when the FPD3 Reciever is in auto-detect mode. To force
DUAL_LINK receive mode, use the RX_PORT_SEL register
(address 0x34).
3
ALTERNATE_I2S_ENABL R/W
E
0x0
1: Enable alternate I2S output on GPIO1 (word clock) and GPIO0
(data)
0: Normal Operation
2
I2S_DISABLED
R/W
0x0
1: I2S DISABLED
0: Normal Operation
1
28_BIT_VIDEO
R/W
0x0
1: 28 bit Video enable. i.e. HS, VS, DE are present in forward
channel.
0: Normal Operation
0
I2S_SURROUND
R/W
0x0
1: I2S Surround enabled
0: I2S Surround disabled
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7.7.1.42 FRC_CONTROL Register (Address = 0x29) [reset = 0x0]
FRC_CONTROL is described in Table 53.
Return to Summary Table.
Table 53. FRC_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7
Timing_Mode_Select
R/W
0x0
Select display timing mode
0: DE only Mode
1: Sync Mode (VS,HS)
6
HS_Polarity
R/W
0x0
0: Active High
1: Active Low
5
VS_Polarity
R/W
0x0
0: Active High
1: Active Low
4
DE_Polarity
R/W
0x0
0: Active High
1: Active Low
3
FRC2_Enable
R/W
0x0
0: FRC2 disable
1: FRC2 enable
2
FRC1_Enable
R/W
0x0
0: FRC1 disable
1: FRC1 enable
1
Hi-FRC2_Disable
R/W
0x0
0: Hi-FRC2 enable
1: Hi-FRC2 disable
0
Hi-FRC1_Disable
R/W
0x0
0: Hi-FRC1 enable
1: Hi-FRC1 disable
7.7.1.43 WHITE_BALANCE_CONTROL Register (Address = 0x2A) [reset = 0x0]
WHITE_BALANCE_CONTROL is described in Table 54.
Return to Summary Table.
Table 54. WHITE_BALANCE_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-6
Page_Setting
R/W
0x0
Page setting
00: Configuration Registers
01: Red LUT
10: Green LUT
11: Blue LUT
5
White_Balance_Enable
R/W
0x0
0: White Balance Disable
1: White Balance Enable
4
LUT_Reload_Enable
R/W
0x0
0: Reload Disable
1: Reload Enable
3
RESERVED
R
0x0
Reserved
2
RESERVED
R
0x0
Reserved
1-0
RESERVED
R
0x0
Reserved
7.7.1.44 I2S_CONTROL Register (Address = 0x2B) [reset = 0x0]
I2S_CONTROL is described in Table 55.
Return to Summary Table.
Table 55. I2S_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
RESERVED
R
0x0
Reserved
5-4
RESERVED
R
0x0
Reserved
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Table 55. I2S_CONTROL Register Field Descriptions (continued)
Bit
Reset
Description
3
Field
I2S_FIFO_OVERRUN_ST R
ATUS
Type
0x0
I2S FIFO Overrun Status
2
I2S_FIFO_UNDERRUN_S R
TATUS
0x0
I2S FIFO Underrun Status
1
I2S_FIFO_ERROR_RESE R/W
T
0x0
I2S Fifo Error Reset
1: Clears FIFO Error
0
I2S_DATA_FALLING_ED
GE
0x0
I2S Clock Edge Select
1: I2S Data is strobed on the Rising Clock Edge.
0: I2S Data is strobed on the Falling Clock Edge.
R/W
7.7.1.45 PCLK_TEST_MODE Register (Address = 0x2E) [reset = 0x0]
PCLK_TEST_MODE is described in Table 56.
Return to Summary Table.
Table 56. PCLK_TEST_MODE Register Field Descriptions
Bit
7
6-0
Field
Type
Reset
Description
EXTERNAL_PCLK
R/W
0x0
Select pixel clock from BISTC input
RESERVED
R
0x0
Reserved
7.7.1.46 DUAL_RX_CTL Register (Address = 0x34) [reset = 0x1]
DUAL_RX_CTL is described in Table 57.
Return to Summary Table.
Table 57. DUAL_RX_CTL Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
RX_LOCK_MODE
R/W
0x0
RX Lock Mode:
Determines operating conditions for indication of RX_LOCK and
generation of video data.
0 : RX_LOCK asserted only when receiving active video (Forward
channel VIDEO_DISABLED bit is 0)
1 : RX_LOCK asserted when device is linked to a Serializer even if
active video is not being sent.
This allows indication of valid link where Bidirectional Control
Channel is enabled, but Deserializer is not receiving Audio/Video
data.
5
RAW_2ND_BC
R/W
0x0
Enable Raw Secondary Back channel
if this bit is set to a 1, the secondary back channel will operate in a
raw mode, passing D_GPIO0 from the Deserializer to the Serializer,
without any oversampling or filtering.
FPD3_INPUT_MODE
R/W
0x0
FPD-Link III Input Mode
Determines operating mode of dual FPD-Link III Receive interface
00: Auto-detect based on received data
01: Forced Mode: Dual link
10: Forced Mode: Single link, primary input
11: Forced Mode: Single link, secondary input
2
RESERVED
R
0x0
Reserved
1
PORT1_SEL
R/W
0x0
Selects Port 1 for Register Access from primary I2C Address
For writes, port1 registers and shared registers will both be written.
For reads, port1 registers and shared registers will be read. This bit
must be cleared to read port0 registers.
4-3
74
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Table 57. DUAL_RX_CTL Register Field Descriptions (continued)
Bit
0
Field
Type
Reset
Description
PORT0_SEL
R/W
0x1
Selects Port 0 for Register Access from primary I2C Address
For writes, port0 registers and shared registers will both be written.
For reads, port0 registers and shared registers will be read. Note
that if PORT1_SEL is also set, then port1 registers will be read.
7.7.1.47 AEQ_TEST Register (Address = 0x35) [reset = 0x0]
AEQ_TEST is described in Table 58.
Return to Summary Table.
AEQ Test register: If PORT1_SEL is set, this register sets port1 AEQ controls.
Table 58. AEQ_TEST Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6
AEQ_RESTART
R/W
0x0
Set high to restart AEQ adaptation from initial value. Method is write
HIGH then write LOW - not self clearing. Adaption will be restarted
on both ports.
5
OVERRIDE_AEQ_FLOO
R
R/W
0x0
Enable operation of SET_AEQ_FLOOR
4
SET_AEQ_FLOOR
R/W
0x0
AEQ adaptation starts from a pre-set floor value rather than from
zero - good in long cable situations
3-1
RESERVED
R
0x0
Reserved
0
RESERVED
R
0x0
Reserved
7.7.1.48 MODE_SEL Register (Address = 0x37) [reset = 0x0]
MODE_SEL is described in Table 59.
Return to Summary Table.
Table 59. MODE_SEL Register Field Descriptions
Bit
7
6-4
Field
Type
Reset
Description
MODE_SEL1_DONE
R
0x0
MODE_SEL1 Done:
0: indicates the MODE_SEL1 decode has not been latched into the
MODE_SEL1 status bits.
1: indicates the MODE_SEL1 decode has completed and latched
into the MODE_SEL1 status bits.
If set, indicates the MODE_SEL1 decode has completed and latched
into the MODE_SEL1 status bits.
MODE_SEL1
R
0x0
MODE_SEL1 Decode
3-bit decode from MODE_SEL1 pin, see MODE_SEL1 Table 9 first
column "#" for mode selection:
000: 5 Mbps/STP (#1 on MODE_SEL1)
001: 5 Mbps/Coax (#2 on MODE_SEL1)
010: 20 Mbps/STP (#3 on MODE_SEL1)
011: 20 Mbps/Coax (#4 on MODE_SEL1)
100: 5 Mbps/STP (#5 on MODE_SEL1)
101: 5 Mbps/Coax (#6 on MODE_SEL1)
110: 20 Mbps/STP (#7 on MODE_SEL1)
111: 20 Mbps/Coax (#8 on MODE_SEL1)
Note: 0x37[6] is the MSB; 0x37[4] is the LSB
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Table 59. MODE_SEL Register Field Descriptions (continued)
Bit
3
2-0
Field
Type
Reset
Description
MODE_SEL0_DONE
R
0x0
MODE_SEL0 Done:
0: indicates the MODE_SEL0 decode has not been latched into the
MODE_SEL0 status bits.
1: indicates the MODE_SEL0 decode has completed and latched
into the MODE_SEL0 status bits.
If set, indicates the MODE_SEL0 decode has completed and latched
into the MODE_SEL0 status bits.
MODE_SEL0
R
0x0
MODE_SEL0 Decode
3-bit decode from MODE_SEL0 pin, see MODE_SEL0 in Table 8
first column "#" for mode selection:
000: Dual OLDI output (#1 on MODE_SEL0)
001: Dual SWAP output (#2 on MODE_SEL0)
010: Single OLDI output (#3 on MODE_SEL0)
011: Replicate (#4 on MODE_SEL0)
100: Dual OLDI output (#5 on MODE_SEL0)
101: Dual SWAP output (#6 on MODE_SEL0)
110: Single OLDI output (#7 on MODE_SEL0)
111: Replicate (#8 on MODE_SEL0)
Note: 0x37[2] is the MSB; 0x37[0] is the LSB
7.7.1.49 I2S_DIVSEL Register (Address = 0x3A) [reset = 0x0]
I2S_DIVSEL is described in Table 60.
Return to Summary Table.
Table 60. I2S_DIVSEL Register Field Descriptions
Bit
Field
Type
Reset
Description
reg_ov_mdiv
R/W
0x0
0: No override for MCLK divider
1: Override divider select for MCLK
reg_mdiv
R/W
0x0
Divide ratio select for VCO output (32*REF/M)
000: Divide by 32 (=REF/M)
001: Divide by 16 (=2*REF/M)
010: Divide by 8 (=4*REF/M)
011: Divide by 4 (=8*REF/M)
100,
101: Divide by 2 (=16*REF/M)
110,
111: Divide by 1 (32*REF/M)
3
RESERVED
R
0x0
Reserved
2
reg_ov_mselect
R/W
0x0
0: Divide ratio of reference clock VCO selected by PLL-SM
1: Override divide ratio of clock to VCO
reg_mselect
R/W
0x0
Divide ratio select for VCO input (M)
00: Divide by 1
01: Divide by 2
10: Divide by 4
11: Divide by 8
7
6-4
1-0
7.7.1.50 EQ_STATUS Register (Address = 0x3B) [reset = 0x0]
EQ_STATUS is described in Table 61.
Return to Summary Table.
Equalizer Status register: If PORT1_SEL is set, this register returns port1 status.
Table 61. EQ_STATUS Register Field Descriptions
76
Bit
Field
Type
Reset
Description
7-6
RESERVED
R
0x0
Reserved
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Table 61. EQ_STATUS Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
5-0
EQ_status
R
0x0
EQ Status - setting direct to analog
If Adaptive EQ is bypassed, these values are the {EQ2, EQ1}
settings from the ADAPTIVE EQ BYPASS register (0x44). If
Adaptive EQ is enabled, the EQ status is determined by the adaptive
Equalizer.
7.7.1.51 LINK_ERROR_COUNT Register (Address = 0x41) [reset = 0x3]
LINK_ERROR_COUNT is described in Table 62.
Return to Summary Table.
Table 62. LINK_ERROR_COUNT Register Field Descriptions
Bit
Field
Type
Reset
Description
7
RESERVED
R
0x0
Reserved
6-5
RESERVED
R
4
3-0
0x0
Reserved
LINK_ERROR_COUNT_E R/W
NABLE
0x0
Enable serial link data integrity error count
1: Enable error count
0: DISABLE
LINK_ERROR_COUNT
0x3
Link error count threshold. Counter is pixel clock based. clk0, clk1
and DCA are monitored for link errors, if error count is enabled,
deserializer loose lock once error count reaches threshold. If
disabled deserilizer loose lock with one error.
R/W
7.7.1.52 HSCC_CONTROL Register (Address = 0x43) [reset = 0x0]
HSCC_CONTROL is described in Table 63.
Return to Summary Table.
Table 63. HSCC_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
RESERVED
R
0x0
Reserved
4
SPI_MISO_MODE
R/W
0x0
SPI MISO pin mode during Reverse SPI mode During Reverse SPI
mode, SPI_MISO is typically an output signal. For bused SPI
applications, it may be necessary to tri-state the SPI_MISO output if
the device is not selected (SPI_SS = 0).
0 : Always enable SPI_MISO output driver
1 : Tri-state SPI_MISO output if SPI_SS is not asserted (low)
3
SPI_CPOL
R/W
0x0
SPI Clock Polarity Control
0 : SPI Data driven on Falling clock edge, sampled on Rising clock
edge
1 : SPI Data driven on Rising clock edge, sampled on Falling clock
edge
HSCC_MODE
R/W
0x0
High-Speed Control Channel Mode Enables high-speed modes for
the secondary link back-channel, allowing higher speed signaling of
GPIOs or SPI interface:
These bits indicates the High Speed Control Channel mode of
operation:
000: Normal frame, GPIO mode
001: High Speed GPIO mode, 1 GPIO
010: High Speed GPIO mode, 2 GPIOs
011: High Speed GPIO mode: 4 GPIOs
100: Reserved
101: Reserved
110: High Speed, Forward Channel SPI mode
111: High Speed, Reverse Channel SPI mode
2-0
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7.7.1.53 ADAPTIVE_EQ_BYPASS Register (Address = 0x44) [reset = 0x60]
ADAPTIVE_EQ_BYPASS is described in Table 64.
Return to Summary Table.
Adaptive Equalizer Bypass register: If PORT1_SEL is set, this register sets port1 AEQ controls.
Table 64. ADAPTIVE_EQ_BYPASS Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
EQ_STAGE_1_SELECT_
VALUE
R/W
0x3
EQ select value[2:0] - Used if adaptive EQ is bypassed. When
ADAPTIVE_EQ_BYPASS is set to 1, these bits will be reflected in
EQ Status[2:0] (register 0x3B)
RESERVED
R
0x0
Reserved
3-1
4
EQ_STAGE_2_SELECT_
VALUE
R/W
0x0
EQ select value[5:3] - Used if adaptive EQ is bypassed. When
ADAPTIVE_EQ_BYPASS is set to 1, these bits will be reflected in
EQ Status[5:3] (register 0x3B)
0
ADAPTIVE_EQ_BYPASS
R/W
0x0
1: Disable adaptive EQ
0: Enable adaptive EQ
7.7.1.54 ADAPTIVE_EQ_MIN_MAX Register (Address = 0x45) [reset = 0x8]
ADAPTIVE_EQ_MIN_MAX is described in Table 65.
Return to Summary Table.
Adaptive Equalizer Configuration: If PORT1_SEL is set, this register sets port1 AEQ configuration.
Table 65. ADAPTIVE_EQ_MIN_MAX Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
RESERVED
R
0x0
Reserved
4
RESERVED
R
0x0
Reserved
ADAPTIVE_EQ_FLOOR_
VALUE
R/W
0x8
When AEQ floor is enabled byregister {reg_35[5:4]} the starting
setting is given by this register.
3-0
7.7.1.55 FPD_TX_MODE Register (Address = 0x49) [reset = X]
FPD_TX_MODE is described in Table 66.
Return to Summary Table.
Table 66. FPD_TX_MODE Register Field Descriptions
Bit
78
Field
Type
Reset
Description
7
MAPSEL_MODE
R
X
Mapsel Pin Status
Strap option on the MODE_SEL0 pin
6
MAPSEL_OVER_WRITE
R/W
0x0
Mapsel Over Write enable from register configuration
5
MAPSEL_REG_BIT
R/W
0x0
Register setting of MAPSEL mode if MAPSEL OVER WRITE is set
4-2
RESERVED
R
0x0
Reserved
1-0
FPD_OUT_MODE
R/W
X
FPD/OLDI output mode
Controls single/dual operation of the FPD Transmit ports
00 : Dual FPD/OLDI output
01 : Dual SWAP FPD/OLDI output
10 : Single FPD/OLDI output
11 : Replicate FPD/OLDI output
The FPD_OUT_MODE register bits are loaded at reset from the
MODE_SEL0 pin strap options.
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7.7.1.56 LVDS_CONTROL Register (Address = 0x4B) [reset = 0x0]
LVDS_CONTROL is described in Table 67.
Return to Summary Table.
Table 67. LVDS_CONTROL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-6
RESERVED
R
0x0
Reserved
5-4
RESERVED
R
0x0
Reserved
3-2
RESERVED
R
0x0
Reserved
1-0
LVDS_VOD_Control
R/W
0x0
FPD/OLDI Output VOD Setting
00: Setting 1 - 190mV typical voltage swing
01: Setting 2 - 275mV typical voltage swing
10: Setting 3 - 325mV typical voltage swing
11: Setting 4 - 375mV typical voltage swing
(single-ended)
(single-ended)
(single-ended)
(single-ended)
7.7.1.57 CML_OUTPUT_CTL1 Register (Address = 0x52) [reset = 0x0]
CML_OUTPUT_CTL1 is described in Table 68.
Return to Summary Table.
Table 68. CML_OUTPUT_CTL1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
CML_Channel_Select_1
R/W
0x0
Selects between PORT0 and PORT1 to output onto CMLOUT±.
0: Recovered forward channel data from RIN0± is output on
CMLOUT±
1: Recovered forward channel data from RIN1± is output on
CMLOUT±
CMLOUT driver must be enabled by setting 0x56[3] = 1. Note: This
bit must match 0x57[2:1] setting for PORT0 or PORT1.
6
RESERVED
R
0x0
Reserved
5-2
RESERVED
R
0x0
Reserved
1-0
RESERVED
R
0x0
Reserved
7.7.1.58 CML_OUTPUT_ENABLE Register (Address = 0x56) [reset = 0x0]
CML_OUTPUT_ENABLE is described in Table 69.
Return to Summary Table.
Table 69. CML_OUTPUT_ENABLE Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
RESERVED
R
0x0
Reserved
4
RESERVED
R
0x0
Reserved
3
CML_Output_Enable
R/W
0x0
Enable CMLOUT± Loop-through Driver
0: Disabled (Default)
1: Enabled
2-1
RESERVED
R
0x0
Reserved
0
RESERVED
R
0x0
Reserved
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7.7.1.59 CML_OUTPUT_CTL2 Register (Address = 0x57) [reset = 0x0]
CML_OUTPUT_CTL2 is described in Table 70.
Return to Summary Table.
Table 70. CML_OUTPUT_CTL2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-3
RESERVED
R
0x0
Reserved
2-1
CML_CHANNEL_SELEC
T_2
R/W
0x0
Selects between PORT0 and PORT1 to output onto CMLOUT±.
01: Recovered forward channel data from RIN0± is output on
CMLOUT±
10: Recovered forward channel data from RIN1± is output on
CMLOUT±
CMLOUT driver must be enabled by setting 0x56[3] = 1. Note: This
must match 0x52[7] setting for PORT0 or PORT1.
RESERVED
R
0x0
Reserved
0
7.7.1.60 CML_OUTPUT_CTL3 Register (Address = 0x63) [reset = 0x0]
CML_OUTPUT_CTL3 is described in Table 71.
Return to Summary Table.
Table 71. CML_OUTPUT_CTL3 Register Field Descriptions
80
Bit
Field
Type
Reset
Description
7-6
RESERVED
R
0x0
Reserved
5
RESERVED
R
0x0
Reserved
4
RESERVED
R
0x0
Reserved
3
RESERVED
R
0x0
Reserved
2
RESERVED
R
0x0
Reserved
1
RESERVED
R
0x0
Reserved
0
CML_TX_PWDN
R/W
0x0
Powerdown CML TX
0: CML TX powered up
1: CML TX powered down
NOTE: CML TX must be powered down prior to enabling Pattern
Generator.
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7.7.1.61 PGCTL Register (Address = 0x64) [reset = 0x10]
PGCTL is described in Table 72.
Return to Summary Table.
Table 72. PGCTL Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
PATGEN_SEL
R/W
0x1
Fixed Pattern Select:
This field selects the pattern to output when in Fixed Pattern Mode.
Scaled patterns are evenly distributed across the horizontal or
vertical active regions. This field is ignored when Auto-Scrolling
Mode is enabled. The following table shows the color selections in
non-inverted followed by inverted color mode:
0000: Reserved
0001: White/Black
0010: Black/White
0011: Red/Cyan
0100: Green/Magenta
0101: Blue/Yellow
0110: Horizontally Scaled Black to White/White to Black
0111: Horizontally Scaled Black to Red/White to Cyan
1000: Horizontally Scaled Black to Green/White to Magenta
1001: Horizontally Scaled Black to Blue/White to Yellow
1010: Vertically Scaled Black to White/White to Black
1011: Vertically Scaled Black to Red/White to Cyan
1100: Vertically Scaled Black to Green/White to Magenta
1101: Vertically Scaled Black to Blue/White to Yellow
1110: Custom color (or its inversion) configured in PGRS, PGGS,
PGBS registers
1111: Reserved
3
PATGEN_UNH
R/W
0x0
Enables the UNH-IOL compliance test pattern:
0: Pattern type selected by PATGEN_SEL
1: Compliance test pattern is selected. Value of PATGEN_SEL is
ignored.
2
PATGEN_COLOR_BARS
R/W
0x0
Enable Color Bars:
0: Color Bars disabled
1: Color Bars enabled (White, Yellow, Cyan, Green, Magenta, Red,
Blue, Black)
1
PATGEN_VCOM_REV
R/W
0x0
Reverse order of color bands in VCOM pattern:
0: Color sequence from top left is (Yellow, Cyan, Blue, Red)
1: Color sequence from top left is (Blue, Cyan, Yellow, Red)
0
PATGEN_EN
R/W
0x0
Pattern Generator Enable:
1: Enable Pattern Generator
0: Disable Pattern Generator
NOTE: CML TX must be powered down prior to enabling Pattern
Generator by setting register bit 0x63[0]=1.
7.7.1.62 PGCFG Register (Address = 0x65) [reset = 0x0]
PGCFG is described in Table 73.
Return to Summary Table.
Table 73. PGCFG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-5
RESERVED
R
0x0
Reserved
PATGEN_18B
R/W
0x0
18-bit Mode Select:
1: Enable 18-bit color pattern generation. Scaled patterns will have
64 levels of brightness and the R, G, and B outputs use the six most
significant color bits.
0: Enable 24-bit pattern generation. Scaled patterns use 256 levels
of brightness.
4
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Table 73. PGCFG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
3
PATGEN_EXTCLK
R/W
0x0
Select External Clock Source:
1: Selects the external pixel clock when using internal timing.
0: Selects the internal divided clock when using internal timing
This bit has no effect in external timing mode (PATGEN_TSEL = 0).
2
PATGEN_TSEL
R/W
0x0
Timing Select Control:
1: The Pattern Generator creates its own video timing as configured
in the Pattern Generator Total Frame Size, Active Frame Size,
Horizontal Sync Width, Vertical Sync Width, Horizontal Back Porch,
Vertical Back Porch, and Sync Configuration registers.
0: the Pattern Generator uses external video timing from the pixel
clock, Data Enable, Horizontal Sync, and Vertical Sync signals.
1
PATGEN_INV
R/W
0x0
Enable Inverted Color Patterns:
1: Invert the color output.
0: Do not invert the color output.
0
PATGEN_ASCRL
R/W
0x0
Auto-Scroll Enable:
1: The Pattern Generator will automatically move to the next enabled
pattern after the number of frames specified in the Pattern Generator
Frame Time (PGFT) register.
0: The Pattern Generator retains the current pattern.
7.7.1.63 PGIA Register (Address = 0x66) [reset = 0x0]
PGIA is described in Table 74.
Return to Summary Table.
Table 74. PGIA Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PATGEN_IA
R/W
0x0
Indirect Address:
This 8-bit field sets the indirect address for accesses to indirectlymapped registers. It should be written prior to reading or writing the
Pattern Generator Indirect Data register.
7.7.1.64 PGID Register (Address = 0x67) [reset = 0x0]
PGID is described in Table 75.
Return to Summary Table.
Table 75. PGID Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
PATGEN_ID
R/W
0x0
Indirect Data:
When writing to indirect registers, this register contains the data to
be written. When reading from indirect registers, this register
contains the readback value.
7.7.1.65 PGDBG Register (Address = 0x68) [reset = 0x0]
PGDBG is described in Table 76.
Return to Summary Table.
Table 76. PGDBG Register Field Descriptions
Bit
Field
Type
Reset
Description
7-4
RESERVED
R
0x0
Reserved
PATGEN_BIST_EN
R/W
0x0
Pattern Generator BIST Enable:
Enables Pattern Generator in BIST mode. Pattern Generator will
compare received video data with local generated pattern. Upstream
device must be programmed to the same pattern.
3
82
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Table 76. PGDBG Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
2
RESERVED
R
0x0
Reserved
1
RESERVED
R
0x0
Reserved
0
RESERVED
R
0x0
Reserved
7.7.1.66 PGTSTDAT Register (Address = 0x69) [reset = 0x0]
PGTSTDAT is described in Table 77.
Return to Summary Table.
Table 77. PGTSTDAT Register Field Descriptions
Bit
Field
Type
Reset
Description
7
PATGEN_BIST_ERR
R
0x0
Pattern Generator BIST Error Flag
During Pattern Generator BIST mode, this bit indicates if the BIST
engine has detected errors. If the BIST Error Count (available in the
Pattern Generator indirect registers) is non-zero, this flag will be set.
6
RESERVED
R
0x0
Reserved
5-0
RESERVED
R
0x0
Reserved
7.7.1.67 GPI_PIN_STATUS_1 Register (Address = 0x6E) [reset = 0x0]
GPI_PIN_STATUS_1 is described in Table 78.
Return to Summary Table.
Table 78. GPI_PIN_STATUS_1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7
GPI7_Pin_Status
R
0x0
GPI7/I2S_WC pin status
6
GPI6_Pin_Status
R
0x0
GPI6/I2S_DA pin status
5
GPI5_Pin_Status
R
0x0
GPI5/I2S_DB pin status
4
RESERVED
R
0x0
Reserved
3
GPI3_Pin_Status
R
0x0
GPI3 / I2S_DD pin status
2
GPI2_Pin_Status
R
0x0
GPI2 / I2S_DC pin status
1
GPI1_Pin_Status
R
0x0
GPI1 pin status
0
GPI0_Pin_Status
R
0x0
GPI0 pin status
7.7.1.68 GPI_PIN_STATUS_2 Register (Address = 0x6F) [reset = 0x0]
GPI_PIN_STATUS_2 is described in Table 79.
Return to Summary Table.
Table 79. GPI_PIN_STATUS_2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-1
RESERVED
R
0x0
Reserved
GPI8_Pin_Status
R
0x0
GPI8/I2S_CLK pin status
0
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7.7.1.69 RX_ID0 Register (Address = 0xF0) [reset = 0x5F]
RX_ID0 is described in Table 80.
Return to Summary Table.
Table 80. RX_ID0 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
RX_ID0
R
0x5F
RX_ID0: First byte ID code, '_ '
7.7.1.70 RX_ID1 Register (Address = 0xF1) [reset = 0x55]
RX_ID1 is described in Table 81.
Return to Summary Table.
Table 81. RX_ID1 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
RX_ID1
R
0x55
RX_ID1: 2nd byte of ID code, 'U '
7.7.1.71 RX_ID2 Register (Address = 0xF2) [reset = 0x48]
RX_ID2 is described in Table 82.
Return to Summary Table.
Table 82. RX_ID2 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
RX_ID2
R
0x48
RX_ID2: 3rd byte of ID code. Value will be either 'B ' or 'H '. 'H '
indicates an HDCP capable device.
7.7.1.72 RX_ID3 Register (Address = 0xF3) [reset = 0x39]
RX_ID3 is described in Table 83.
Return to Summary Table.
Table 83. RX_ID3 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
RX_ID3
R
0x39
RX_ID3: 4th byte of ID code: '9 '
7.7.1.73 RX_ID4 Register (Address = 0xF4) [reset = 0x32]
RX_ID4 is described in Table 84.
Return to Summary Table.
Table 84. RX_ID4 Register Field Descriptions
Bit
Field
Type
Reset
Description
7-0
RX_ID4
R
0x32
RX_ID4: 5th byte of ID code.
7.7.1.74 RX_ID5 Register (Address = 0xF5) [reset = 0x38]
RX_ID5 is described in Table 85.
Return to Summary Table.
Table 85. RX_ID5 Register Field Descriptions
84
Bit
Field
Type
Reset
Description
7-0
RX_ID5
R
0x38
RX_ID5: 6th byte of ID code.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1
Application Information
The DS90UB948-Q1 is a FPD-Link III deserializer which, in conjunction with the DS90UB949/947-Q1 serializers,
converts 1-lane or 2-lane FPD-Link III streams into a FPD-Link (OpenLDI) interface. The deserializer is capable
of operating over cost-effective 50-Ω single-ended coaxial or 100-Ω differential shielded twisted-pair (STP)
cables. It recovers the data from two FPD-Link III serial streams and translates it into dual pixel FPD-Link (data
lanes + clock) supporting video resolutions up to WUXGA and 2K with 24-bit color depth. This provides a bridge
between HDMI enabled sources such as GPUs to connect to existing LVDS displays or application processors.
8.2 Typical Applications
Bypass capacitors must be placed near the power supply pins. At a minimum, use four (4) 10-µF capacitors for
local device bypassing. Ferrite beads are placed on the two sets of supply pins (VDD33 and VDDIO ) for
effective noise suppression. The interface to the graphics source is LVDS. The VDDIO pins may be connected to
3.3 V or 1.8 V. A capacitor and resistor are placed on the PDB pin to delay the enabling of the device until power
is stable. See Figure 48 for a typical STP connection diagram and Figure 49 for a typical coax connection
diagram.
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Typical Applications (continued)
VDD33
VDDP12_CH0
1.2V
FB1
10µF
1µF
VDD33_A
0.01µF
t 0.1µF
0.1µF
VDDR12_CH0
VDD33_B
VDDP12_CH1
VDDIO
0.01µF
t 0.1µF
FB2
10µF
1µF
0.01µF
t 0.1µF
0.1µF
VDDR12_CH1
CMF
VDD12_LVDS
CAP_I2S
0.01µF
t 0.1µF
FB3
10µF
1µF
0.01µF
t 0.1µF
0.1µF
VDD25_CAP
VDDP12_LVDS
0.01µF
t 0.1µF
FB4
10µF
1µF
3.3V
0.01µF
t 0.1µF
0.1µF
1µF
10µF
0.1µF
1µF
10µF
FB5
0.01µF
t 0.1µF
VDDIO
0.01µF
t 0.1µF
FB6
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
VDDL12_0
0.01µF
t 0.1µF
0.1µF
0.01µF
t 0.1µF
VDD33
(Filtered 3.3V)
VDDL12_1
R1
R2
BISTEN
BISTC
Control
C1
C2
0.1µF
IDx
MODE_SEL0
MODE_SEL1
RIN0+
RIN0-
R3
R4
0.1µF
R5
R6
RTERM
FPD-Link III
C3
C4
RIN1+
RIN1-
D0D0+
D1D1+
D2D2+
CLK1CLK1+
IN_D2D3D3+
RTERM
SWC
SDOUT
Aux Audio
MOSI
MISO
SPLK
SS
SPI
Monitoring
(Optional)
RPU
CMLOUTP
CMLOUTN
RT
C6
RPU
I2C_SDA
I2C_SCL
I2C
HW Control Option
SW Control
(Recommended)
VDDIO
10k
PDB
>10µF
LOCK
PASS
I2S_WC
I2S_CLK
I2S_DA
I2S_DB
I2S_DC
I2S_DD
MCLK
I2S Audio
D0D0+
D1D1+
D2D2+
CLK1CLK1+
D3D3+
100Q
D4D4+
D5D5+
D6D6+
CLK2CLK2+
D7D7+
100Q
100Q
100Q
100Q
100Q
LVDS Output
D4D4+
D5D5+
D6D6+
CLK2CLK2+
IN_D2D7D7+
C5
V(I2C)
0.1µF
RES0
RES1
Status
100Q
100Q
100Q
100Q
LVDS
Termination
0.01µF t 0.1µF
or No Connect
0.01µF t 0.1µF
or No Connect
DAP
NOTES:
FB1 ± FB4: '&5 ” 25 mQ; Z = 120 Q @ 100 MHz
FB5, FB6: DCR ” 0.3 Q; Z = 1 KQ @ 100 MHz
C1 ± C6 = 33 nF ± 100 nF (50 V / X7R / 0402)
R1, R2 (see IDx Resistor Values Table)
R3 ± R6 (see MODE_SEL Resistor Values Table)
RTERM = 49.9 Ÿ
RT = 100 Ÿ
RPU = 2.2 NŸ IRU 9(I2C) = 1.8 V
= 4.7 NŸ IRU 9(I2C) = 3.3 V
DS90Ux948-Q1
Copyright © 2018, Texas Instruments Incorporated
Figure 48. Typical Connection Diagram (Coax)
86
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Typical Applications (continued)
VDD33
VDDP12_CH0
1.2V
FB1
10µF
1µF
VDD33_A
0.01µF
t 0.1µF
0.1µF
VDDR12_CH0
VDD33_B
VDDP12_CH1
VDDIO
0.01µF
t 0.1µF
FB2
10µF
1µF
0.01µF
t 0.1µF
0.1µF
VDDR12_CH1
CMF
VDD12_LVDS
CAP_I2S
0.01µF
t 0.1µF
FB3
10µF
1µF
0.01µF
t 0.1µF
0.1µF
VDD25_CAP
VDDP12_LVDS
0.01µF
t 0.1µF
FB4
10µF
1µF
3.3V
0.01µF
t 0.1µF
0.1µF
1µF
10µF
0.1µF
1µF
10µF
FB5
0.01µF
t 0.1µF
VDDIO
0.01µF
t 0.1µF
FB6
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
VDDL12_0
0.01µF
t 0.1µF
0.1µF
0.01µF
t 0.1µF
VDD33
(Filtered 3.3V)
VDDL12_1
R1
R2
BISTEN
BISTC
Control
C1
C2
RIN0+
RIN0-
C3
C4
RIN1+
RIN1-
0.1µF
IDx
MODE_SEL0
MODE_SEL1
R3
R4
0.1µF
R5
R6
0.1µF
FPD-Link III
D0D0+
D1D1+
D2D2+
CLK1CLK1+
IN_D2D3D3+
SWC
SDOUT
Aux Audio
MOSI
MISO
SPLK
SS
SPI
Monitoring
(Optional)
RPU
SW Control
(Recommended)
I2S Audio
C6
RPU
I2C_SDA
I2C_SCL
I2C
HW Control Option
CMLOUTP
CMLOUTN
RT
VDDIO
10k
>10µF
100Q
D4D4+
D5D5+
D6D6+
CLK2CLK2+
D7D7+
100Q
100Q
100Q
100Q
100Q
LVDS Output
D4D4+
D5D5+
D6D6+
CLK2CLK2+
IN_D2D7D7+
C5
V(I2C)
D0D0+
D1D1+
D2D2+
CLK1CLK1+
D3D3+
PDB
LOCK
PASS
I2S_WC
I2S_CLK
I2S_DA
I2S_DB
I2S_DC
I2S_DD
MCLK
RES0
RES1
Status
100Q
100Q
100Q
100Q
LVDS
Termination
0.01µF t 0.1µF
or No Connect
NOTES:
FB1 ± FB4: '&5 ” 25 mQ; Z = 120 Q @ 100 MHz
FB5, FB6: '&5 ” 0.3 Q; Z = 1 KQ @ 100 MHz
C1 ± C6 = 33 nF ± 100 nF (50 V / X7R / 0402)
R1, R2 (see IDx Resistor Values Table)
R3 ± R6 (see MODE_SEL Resistor Values Table)
RTERM = 49.9 Ÿ
RT = 100 Ÿ
RPU = 2.2 NŸ IRU 9(I2C) = 1.8 V
= 4.7 NŸ IRU 9(I2C) = 3.3 V
0.01µF t 0.1µF
or No Connect
DAP
DS90Ux948-Q1
Copyright © 2018, Texas Instruments Incorporated
Figure 49. Typical Connection Diagram (STP)
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FPD-Link III
2 lanes
HDMI
or
D3±
DP++
IN_CLK-/+
Mobile
Device
or
Graphics
Processor
FPD-Link
Open LDI
IN_D0-/+
IN_D1-/+
DOUT0+
RIN0+
DOUT0-
RIN0-
DOUT1+
RIN1+
D0±
DOUT1-
RIN1-
CLK1±
D2±
D1±
D4±
IN_D2-/+
D5±
DS90UB949-Q1
Serializer
CEC
DDC
HPD
Display
or
Graphics
Processor
DS90UB948-Q1
Deserializer
D6±
D7±
CLK2±
I2C
IDx
I2C
IDx
HS_GPIO
(SPI)
HS_GPIO
(SPI)
Copyright © 2018, Texas Instruments Incorporated
Figure 50. Typical Display System Diagram
8.2.1 Design Requirements
For the typical design application, use the following as input parameters.
Table 86. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VDD33
3.3 V
VDDIO
1.8 or 3.3 V
VDD12
1.2 V
AC-coupling capacitor for STP with 925/927: RIN[1:0]±
100 nF
AC-coupling capacitor for STP with 929/947/949: RIN[1:0]±
33 nF - 100 nF
AC-coupling capacitor for Coax with 921: RIN[1:0]+
100 nF
AC-coupling capacitor for Coax with 921: RIN[1:0]-
47 nF
AC-coupling capacitor for Coax with 929/947/949: RIN[1:0]+
33 nF - 100 nF
AC-coupling capacitor for Coax with 929/947/949: RIN[1:0]+
15 nF - 47 nF
The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced decoding scheme.
External AC-coupling capacitors must be placed in series in the FPD-Link III signal path as shown in Figure 51.
For applications using single-ended 50-Ω coaxial cable, the unused data pins (RIN0– and RIN1–) must use a 15nF to 47-nF capacitor and must be terminated with a 50-Ω resistor.
DOUT+
RIN+
DOUT-
RIN-
SER
DES
Figure 51. AC-Coupled Connection (STP)
DOUT+
RIN+
DOUT-
RIN-
SER
DES
50Q
50Q
Figure 52. AC-Coupled Connection (Coaxial)
For high-speed FPD–Link III transmissions, use the smallest available package for the AC-coupling capacitor.
This minimizes degradation of signal quality due to package parasitics.
88
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8.2.2 Detailed Design Procedure
8.2.2.1 FPD-Link III Interconnect Guidelines
See AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) and AN-905 Transmission
Line RAPIDESIGNER Operation and Application Guide (SNLA035) for full details.
• Use 100-Ω coupled differential pairs
• Use the S/2S/3S rule in spacings
– S = space between the pair
– 2S = space between pairs
– 3S = space to LVCMOS signal
• Minimize the number of Vias
• Maintain balance of the traces
• Minimize skew within the pair
• Terminate as close to the TX outputs and RX inputs as possible
Additional general guidance can be found in the LVDS Owner’s Manual (SNLA187) available in PDF format from
the Texas Instruments web site.
8.2.2.2 AV Mute Prevention
The "UH" Deserializers support AV MUTE functionality when receiving the specifically defined data pattern
(0x666666) during the blanking period (DE = LOW). Once the device enters the AV MUTE state, the device
mutes both audio and video outputs resulting in a black display screen.
Be advised if the video source continues sending random data during blanking interval, the DS90UB948-Q1 may
inadvertently enter the AV MUTE state upon receiving random data matching the AV MUTE command pattern.
When paired with a UB version FPD-Link compatible serializer, setting the gate DE Register 0x04[4] will prevent
video signals from being sent during the blanking interval. This will ensure AV MUTE mode is not entered during
normal operation. By default the Data Enable (DE) signal is assumed to be active high. If DE is active low, then
setting DE_POLARITY register bit 0x12 bit[5] = 1 is also required. With the DE permanently LOW, deserializers
do not check for the AV Mute conditions, so the AV Mute is not an issue when operating with HSYNC/VSYNC
only mode displays.
If unexpected AV MUTE state is seen, it is recommended to verify checking the data path control setting of the
paired Serializer. This setting is not accessible from DS90UB948Q-Q1.
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8.2.2.3 Prevention of I2C Errors During Abrupt System Faults
In rare instances, FPD-Link III bi-directional control channel data errors caused by system fault conditions (e.g.
abrupt power downs of the remote serializer or cable disconnects) may result in the DS90UB948Q-Q1 sending
inadvertent I2C transactions on the local I2C bus prior to determining loss of valid signal.
For minimizing impact of these types of events, TI suggests the following precautions:
• Set DS90UB948Q-Q1 register 0x04 = 0x02 to minimize the duration of inadvertent I2C events
• Ensure all I2C masters on the bus support multi-master arbitration
• Assign I2C addresses with more than a single bit set to 1 for all devices on the I2C bus
– 0x6A, 0x7B, and 0x37 are examples of good choices for an I2C address
– 0x40 and 0x20 are examples of bad choices for an I2C address
8.2.3 Application Curves
Magnitude (100mV/DIV)
The plots below correspond to 1080p60 video application with a 2-lane FPD-Link III input and dual OpenLDI
output.
Time (100 ps/DIV)
Figure 53. Loop-Through CML Output at 2.6-Gbps Serial
Line Rate
Figure 54. OpenLDI Clock and Data Output at 74.25-MHz
Pixel Clock
9 Power Supply Recommendations
This device provides separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. provides guidance on which circuit blocks are connected to which power pin pairs. In some cases, an
external filter many be used to provide clean power to sensitive circuits such as PLLs.
9.1 Power-Up Requirements and PDB Pin
When power is applied, power from the highest voltage rail to the lowest voltage rail on any of the supply pins.
For 3.3-V IO operation, VDDIO and VDD33 can be powered by the same supply and ramped simultaneously.
Use a large capacitor on the PDB pin to ensure PDB arrives after all the supply pins have settled to the
recommended operating voltage. When PDB pin is pulled up to VDD33, a 10-kΩ pullup and a > 10–μF capacitor
to GND are required to delay the PDB input signal rise. All inputs must not be driven until both VDD33 and
VDDIO has reached steady state. Pins VDD33_A and VDD33_B must both be externally connected, bypassed,
and driven to the same potential (they are not internally connected).
90
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9.2 Power Sequence
tr0
VDD33
GND
tr0
t0
VDDIO
GND
tr1
t1
VDD12
GND
t2
PDB(*)
VDDIO
VPDB_HIGH
VPDB_LOW
GND
t4
t3
t5
t3
RIN±
GPIO
t6
(*)
It is recommended to assert PDB (active High) with a microcontroller rather than an RC filter network to help ensure
proper sequencing of PDB pin after settling of power supplies.
Figure 55. Power Sequence
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Power Sequence (continued)
Table 87. Power-Up Sequencing Constraints
PARAMETER
UNIT
NOTES
0.2
ms
@10/90%
0.05
ms
@10/90%
VDD33 to VDDIO delay
0
ms
VDD33 / VDDIO to VDD12 delay
0
ms
t2
VDDx to PDB delay
0
ms
t3
PDB to I2C ready delay
2
ms
t4
PDB pulse width
2
ms
Hard reset
tr0
VDD33 / VDDIO rise time
tr1
VDD12 rise time
t0
t1
MIN
TYP
MAX
Release PDB after all supplies are up
and stable.
t5
Valid data on RIN± to VDDx delay
0
ms
Provide valid data from a compatible
Serializer before power-up . (1)
t6
PDB to GPIO delay
2
ms
Keep GPIOs low or high until PDB is
high.
(1)
92
Note that the DS90UB948Q-Q1 should be powered up after a compatible Serializer has started sending valid video data. If this condition
is not satisfied, then a digital (software) reset or hard reset (toggling PDB pin) is required after receiving the input data. This requirement
prevents the DS90UB948Q-Q1 from locking to any random or noise signal, ensures DS90UB948Q-Q1 has a deterministic startup
behavior, specified lock time, and optimal adaptive equalizer setting.
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10 Layout
10.1 Layout Guidelines
Circuit board layout and stack-up for the FPD-Link III devices must be designed to provide low-noise power feed
to the device. Good layout practice also separates high frequency or high-level inputs and outputs to minimize
unwanted stray noise pick-up, feedback, and interference. Power system performance may be greatly improved
by using thin dielectrics (2 to 4 mils) for power/ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 μF to 0.1 μF. Ceramic capacitors may be in the 2.2-μF to 10-μF range. The voltage rating of the
ceramic capacitors must be at least 5× the power supply voltage being used.
TI recommends surface-mount capacitors due to their smaller parasitics. When using multiple capacitors per
supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50-μF to 100-μF range, which smooths low frequency switching noise. TI
recommends connecting power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor increases the inductance of the path.
A small body size X7R chip capacitor, such as 0603 or 0402, is recommended for external bypass. The small
body size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance
frequency of these external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective
bypassing, multiple capacitors are often used to achieve low impedance between the supply rails over the
frequency of interest. At high frequency, it is also common practice to use two vias from power and ground pins
to the planes to reduce the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as
PLLs.
Locate LVCMOS signals away from the differential lines to prevent coupling from the LVCMOS lines to the
differential lines. Differential impedance of 100 Ω are typically recommended for STP interconnect and singleended impedance of 50 Ω for coaxial interconnect. The closely coupled lines help to ensure that coupled noise
appears as common-mode and thus is rejected by the receivers. The tightly coupled lines also radiate less.
Information on the WQFN package is provided AN-1187 Leadless Leadframe Package (LLP) (SNOA401).
10.2 Ground
TI recommends that a consistent ground plane reference for the high-speed signals in the PCB design to provide
the best image plane for signal traces running parallel to the plane. Connect the thermal pad of the device to this
plane with vias.
At least 32 thermal vias are necessary from the device center DAP to the ground plane. They connect the device
ground to the PCB ground plane, as well as conduct heat from the exposed pad of the package to the PCB
ground plane. More information on the WQFN style package, including PCB design and manufacturing
requirements, is provided in AN-1187 Leadless Leadframe Package (LLP) (SNLU165).
10.3 Routing FPD-Link III Signal Traces
Routing the FPD-Link III signal traces between the RIN pins and the connector is the most critical pieces of a
successful PCB layout. Figure 57 shows an example PCB layout. For additional PCB layout details of the
example, refer to the DS90UH948-Q1EVM User's Guide (SNLU162).
The following list provides essential recommendations for routing the FPD-Link III signal traces between the
receiver input pins (RIN) and the connector.
• The routing of the FPD-Link III traces may be all on the top layer or partially embedded in middle layers if EMI
is a concern.
• The AC-coupling capacitors should be on the top layer and very close to the receiver input pins.
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Routing FPD-Link III Signal Traces (continued)
•
•
•
94
Route the RIN traces between the AC-coupling capacitor and the connector as a 100-Ω differential micro-strip
with tight impedance control (±10%). Calculate the proper width of the traces for a 100-Ω differential
impedance based on the PCB stack-up.
When choosing to implement a common mode choke for common mode noise reduction, minimize the effects
of any impedance mismatch.
Consult with connector manufacturer for optimized connector footprint. If the connector is mounted on the
same side as the IC, minimize the impact of the thru-hole connector stubs by routing the high-speed signal
traces on the opposite side of the connector mounting side.
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10.4 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown in Figure 56:
Table 88. No Pullback WQFN Stencil Aperture Summary
DEVICE
PIN COUNT
MKT DWG
PCB I/O Pad
SIZE (mm)
PCB PITCH
(mm)
PCB DAP
SIZE(mm)
STENCIL I/O
APERTURE
(mm)
STENCIL DAP
APERTURE
(mm)
NUMBER OF
DAP
APERTURE
OPENINGS
GAP
BETWEEN
DAP
APERTURE
(Dim A mm)
DS90UB948-Q1
64
NKD
0.25 × 0.6
0.5
7.2 x 7.2
0.25 x 0.6
1.16 × 1.16
25
0.2
SYMM
64X (0.6)
64
(1.36) TYP
49
64X (0.25)
1
48
(1.36)
TYP
60X (0.5)
SYMM
(8.8)
METAL
TYP
33
16
32
17
25X
(1.16)
(8.8)
Figure 56. 64-Pin WQFN SOLDERPASTE
Stencil ExampleEXAMPLE
of Via and Opening Placement
(Dimensions in mm)
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Figure 57 (PCB layout example) is derived from a layout design of the DS90UB948-Q1. This graphic and
additional layout description are used to demonstrate both proper routing and proper solder techniques when
designing in the Deserializer.
Figure 57. DS90UB948-Q1 Deserializer Example Layout
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• Soldering Specifications Application Report (SNOA549)
• Semiconductor and IC Package Thermal Metrics Application Report (SPRA953)
• AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008)
• AN-905 Transmission Line RAPIDESIGNER Operation and Application Guide (SNLA035)
• AN-1187 Leadless Leadframe Package (LLP) (SNOA401)
• LVDS Owner's Manual (SNLA187)
• AN-2173 I2C Communication Over FPD-Link III with Bidirectional Control Channel (SNLA131)
• Using the I2S Audio Interface of DS90Ux92x FPD-Link III Devices (SNLA221)
• AN-2198 Exploring the Internal Test Pattern Generation Feature of 720p FPD-Link III Devices (SNLA132)
• I2C Bus Pullup Resistor Calculation (SLVA689)
• FPD-Link™ Learning Center
• An EMC/EMI System-Design and Testing Methodology for FPD-Link III SerDes (SLYT719)
• Ten Tips for Successfully Designing With Automotive EMC/EMI Requirements (SLYT636)
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
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12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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17-Feb-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90UB948TNKDRQ1
ACTIVE
WQFN
NKD
64
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
90UB948Q1
DS90UB948TNKDTQ1
ACTIVE
WQFN
NKD
64
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
90UB948Q1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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17-Feb-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90UB948TNKDRQ1
WQFN
NKD
64
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
DS90UB948TNKDTQ1
WQFN
NKD
64
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Feb-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90UB948TNKDRQ1
WQFN
NKD
64
2000
367.0
367.0
38.0
DS90UB948TNKDTQ1
WQFN
NKD
64
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
NKD0064A
WQFN - 0.8 mm max height
SCALE 1.600
WQFN
9.1
8.9
B
A
PIN 1 INDEX AREA
0.5
0.3
9.1
8.9
0.3
0.2
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8 MAX
C
SEATING PLANE
(0.1)
TYP
7.2 0.1
SEE TERMINAL
DETAIL
32
17
60X 0.5
33
16
4X
7.5
1
PIN 1 ID
(OPTIONAL)
48
64
49
64X
0.5
0.3
64X
0.3
0.2
0.1
0.05
C A
C
B
4214996/A 08/2013
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
NKD0064A
WQFN - 0.8 mm max height
WQFN
(
7.2)
SYMM
64X (0.6)
64X (0.25)
64
SEE DETAILS
49
1
48
60X (0.5)
SYMM
(8.8)
(1.36)
TYP
( 0.2) VIA
TYP
8X (1.31)
16
33
32
17
(1.36) TYP
8X (1.31)
(8.8)
LAND PATTERN EXAMPLE
SCALE:8X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214996/A 08/2013
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, refer to QFN/SON PCB application note
in literature No. SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
NKD0064A
WQFN - 0.8 mm max height
WQFN
SYMM
64X (0.6)
64X (0.25)
(1.36) TYP
64
49
1
48
(1.36)
TYP
60X (0.5)
SYMM
(8.8)
METAL
TYP
33
16
32
17
25X
(1.16)
(8.8)
SOLDERPASTE EXAMPLE
BASED ON 0.125mm THICK STENCIL
EXPOSED PAD
65% PRINTED SOLDER COVERAGE BY AREA
SCALE:10X
4214996/A 08/2013
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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