Texas Instruments | DS90UB934-Q1 12-Bit, 100-MHz FPD-Link III Deserializer for 1MP/60fps and 2MP/30fps Cameras (Rev. B) | Datasheet | Texas Instruments DS90UB934-Q1 12-Bit, 100-MHz FPD-Link III Deserializer for 1MP/60fps and 2MP/30fps Cameras (Rev. B) Datasheet

Texas Instruments DS90UB934-Q1 12-Bit, 100-MHz FPD-Link III Deserializer for 1MP/60fps and 2MP/30fps Cameras (Rev. B) Datasheet
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DS90UB934-Q1
SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
DS90UB934-Q1 12-Bit, 100-MHz FPD-Link III Deserializer
for 1MP/60fps and 2MP/30fps Cameras
1 Features
3 Description
•
•
The DS90UB934-Q1 FPD-Link III deserializer, in
conjunction
with
the
DS90UB913A/933-Q1
serializers, supports the video transport needs with
an ultra-high-speed forward channel and an
embedded bidirectional control channel. The
DS90UB934-Q1 converts the FPD-Link III stream into
a parallel CMOS output interface designed to support
automotive image sensors up to 12 bits at 100 MHz
with resolutions including 1MP/60fps and 2MP/30fps.
1
•
•
•
•
•
•
•
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified for Automotive Applications
With the Following Results:
– Device Temperature Grade 2: –40°C to
+105°C Ambient Operating Temperature
– Device HBM ESD Classification Level ±2 kV
– Device CDM ESD Classification Level C4
Operates up to 100 MHz in 12-bit Mode to
Support 1MP/60fps and 2MP/30fps Imagers as
well as Satellite RADAR
Configurable 12-bit Parallel CMOS Compatible
with DS90UB913A/933 Serializers
Adaptive Equalization Compensates for Cable
Aging and Degradation Effects
Ultra-low Latency Bi-directional Control Data
Channel with Data Protection
Cable Link Detect Diagnostics
Supports Power-over-Coax Operation (PoC)
ISO 10605 and IEC 61000-4-2 ESD Compliant
Low Radiated and Conductive Emissions
BIST (Built-In Self-Test)
•
•
The DS90UB934-Q1 is improved over prior
generations of ADAS FPD-Link III deserializer
devices (such as DS90UB914A-Q1) offering higher
bandwidth support with additional enhancements.
Device Information(1)
PART NUMBER
DS90UB934-Q1
PACKAGE
VQFN (48)
BODY SIZE (NOM)
7.00 mm × 7.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
The DS90UB933/934 chipset is fully AEC-Q100
qualified and designed to receive data across either
50-Ω single-ended coaxial or 100-Ω shielded-twisted
pair (STP) cable assemblies. The DS90UB934-Q1
uses an advanced adaptive equalizer to allow support
of various cable lengths and types with no additional
programming required.
Automotive
– Rear-View Cameras (RVC)
– Surround View Systems (SVS)
– Camera Monitor Systems (CMS)
– Forward Vision Cameras (FC)
– Driver Monitoring Systems (DMS)
– Satellite RADAR Modules
Security and Surveillance Cameras
Industrial and Medical Imaging
Typical Application Schematic
Parallel
Data In
10 or 12
Parallel
Data Out
10 or 12
FPD-Link III
2
HD Image
Sensor
HSYNC,
VSYNC
4
DS90UB933-Q1
or
DS90UB913A-Q1
GPO
2
Bidirectional
Control Bus
Serializer
2
DS90UB934-Q1
Bidirectional
Control Channel
HSYNC,
VSYNC
4
Image Signal
Processor
(ISP)
GPIO
2
Deserializer
Bidirectional
Control Bus
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS90UB934-Q1
SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
7
1
1
1
2
4
7
Absolute Maximum Ratings ...................................... 7
ESD Ratings.............................................................. 7
Recommended Operating Conditions....................... 8
Thermal Information .................................................. 8
DC Electrical Characteristics ................................... 8
AC Electrical Characteristics................................... 11
Recommended Timing for the Serial Control Bus .. 12
Typical Characteristics ............................................ 15
Detailed Description ............................................ 17
7.1
7.2
7.3
7.4
7.5
7.6
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Programming ..........................................................
Register Maps .........................................................
17
18
18
20
26
32
8
Application and Implementation ........................ 54
8.1
8.2
8.3
8.4
9
Application Information............................................
Power Over Coax....................................................
Typical Application .................................................
System Examples ..................................................
54
54
57
60
Power Supply Recommendations...................... 61
9.1
9.2
9.3
9.4
VDD Power Supply .................................................
Power-Up Sequencing ............................................
PDB Pin...................................................................
Ground ....................................................................
61
61
61
61
10 Layout................................................................... 62
10.1 Layout Guidelines ................................................. 62
10.2 Layout Example .................................................... 63
11 Device and Documentation Support ................. 64
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
64
64
64
64
64
64
12 Mechanical, Packaging, and Orderable
Information ........................................................... 64
4 Revision History
Changes from Revision A (January 2017) to Revision B
Page
•
Added that unused GPIOs can be left open or floating.......................................................................................................... 5
•
Added that PDB is internal pull down enabled ....................................................................................................................... 5
•
Added description for selecting pull up resistor for OSS_SEL ............................................................................................... 5
•
Added description for selecting pull up resistor for OEN........................................................................................................ 5
•
Removed S, PD type for RES (pin 44)................................................................................................................................... 6
•
Removed S, PD type for RES (pin 43) and added it must be tied to GND. .......................................................................... 6
•
Added PDB test conditions for the LVCMOS IO voltage parameter in the Absolute Maximum Ratings table ..................... 7
•
Changed typical LVCMOS low-to-high transition time value from: 2.5 ns to: 2 ns............................................................... 11
•
Changed maximum LVCMOS low-to-high transition time value from: 4 ns to: 3 ns ............................................................ 11
•
Changed typical LVCMOS high-to-low transition time value from: 2.5 ns to: 2 ns ............................................................. 11
•
Changed maximum LVCMOS high-to-low transition time value from: 4 ns to: 3 ns ........................................................... 11
•
Changed receiver clock jitter test condition from: SSCG[3:0] = OFF to: SSCG[0] = OFF ................................................... 11
•
Changed deserializer period jitter test condition from: SSCG[3:0] = OFF to: SSCG[0] = OFF............................................ 11
•
Changed deserializer cycle-to-cycle clock jitter test condition from: SSCG[3:0] = OFF to: SSCG[0] = OFF....................... 11
•
Changed input jitter symbol from: TOLJIT to: TIJIT ................................................................................................................ 12
•
Added reference to compatibility with DS90UB953-Q1/935-Q1 serializers ........................................................................ 17
•
Added column for DS90UB953-Q1/935-Q1 ......................................................................................................................... 20
•
Added clarification on input mode selection ........................................................................................................................ 20
•
Fixed typo in Figure 13 supply rail text ................................................................................................................................ 20
•
Changed pullup power supply node from VDDIO to V(I2C)................................................................................................. 26
•
Removed pullup resistor recommendation ........................................................................................................................... 26
•
Updated description of clock frequency during BIST operation ........................................................................................... 31
•
Fixed typos in register maps................................................................................................................................................. 32
2
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SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
Revision History (continued)
•
Updated register "TYPE" column per legend ...................................................................................................................... 32
•
Fixed typo in register name. ................................................................................................................................................. 40
•
Added Power Over Coax section ........................................................................................................................................ 54
•
Updated return loss S11 values .......................................................................................................................................... 56
•
Added STP typical connection diagram .............................................................................................................................. 58
•
Updated recommendation for common ground plane .......................................................................................................... 61
•
Updated recommendation for bypass capacitors ................................................................................................................. 62
•
Updated typical bypass capacitor value from 50uF to 47uF ................................................................................................ 62
Changes from Original (September 2016) to Revision A
Page
•
Changed product preview to production data ........................................................................................................................ 1
•
Fixed broken link in Power Over Coax section..................................................................................................................... 54
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SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
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5 Pin Configuration and Functions
VDD18_P1
IDX
VDD11_FPD
RIN1-
RIN1+
VDD18_FPD1
PDB
VDDIO
GPIO0
GPIO1
GPIO2
GPIO3/INTB
36
35
34
33
32
31
30
29
28
27
26
25
RGZ Package
48-Pin VQFN With Thermal Pad
Top View
24
ROUT0
23
ROUT1
39
22
ROUT2
VDD18_FPD0
40
21
ROUT3
RIN0+
41
20
VDD11
RIN0-
42
19
ROUT4
RES
43
18
ROUT5
RES
44
17
VDD18
VDD18_P0
45
16
ROUT6
SEL
46
15
ROUT7
PASS
47
14
ROUT8
LOCK
48
13
ROUT9
11
12
ROUT10
8
PCLK
ROUT11
7
VDDIO
10
6
BISTEN
HSYNC
5
OEN
9
4
OSS_SEL
VSYNC
3
DS90UB934-Q1
48L QFN
VDD11_D
CMLOUTN
DAP = GND
2
38
I2C_SCL
CMLOUTP
1
37
I2C_SDA
MODE
Pin Functions
PIN
NAME
NO.
I/O
TYPE
DESCRIPTION
RECEIVE DATA PARALLEL OUTPUT
ROUT0
24
ROUT1
23
ROUT2
22
ROUT3
21
ROUT4
19
ROUT5
18
ROUT6
16
ROUT7
15
ROUT8
14
ROUT9
13
ROUT10
12
ROUT11
11
HSYNC
10
4
O
RECEIVE DATA OUTPUT: This signal carries data from the FPD-LINK III deserializer to the
processor. Output is parallel, configurable for up to 12 bits (ROUT0 – ROUT11) single ended
outputs. VDDIO logic levels. For unused outputs leave as No Connect.
O
Horizontal SYNC output. VDDIO logic levels.
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SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
Pin Functions (continued)
PIN
NAME
NO.
I/O
TYPE
DESCRIPTION
VSYNC
9
O
Vertical SYNC output. VDDIO logic levels.
PCLK
8
O
Pixel clock (PCLK) output. VDDIO logic levels.
GPIO
GPIO0
28
GPIO1
27
GPIO2
I/O, PD
26
GPIO3/INTB
25
General purpose input/output: Pins can be used to control and respond to various commands.
They may be configured to be the input signals for the corresponding GPOs on the serializer or
they may be configured to be outputs to follow local register settings. At power up the GPIO are
disabled and by default include a 25-kΩ (typical) pulldown resistor. VDDIO logic levels. Unused
GPIOs can be left open or floating.
General purpose input/output: Pin GPIO3 can be configured to be an input signal for GPOs on
I/O, Open the serializer. Pin 25 is shared with INTB. Pull up with 4.7 kΩ to VDDIO. Programmable
Drain
input/output pin is an active-low open drain and controlled by the status registers. Unused
GPIOs can be left open or floating.
FPD-LINK III INTERFACE
RIN0+
41
I/O
Receive input channel 0: Differential FPD-Link receiver and bidirectional control back channel
output. The IO must be AC coupled. There is internal 100Ω differential termination between
RIN0+ and RIN0-. For applications using single-ended coaxial channel connect RIN0+ with
100-nF, AC-coupling capacitor and terminate RIN0– to GND with a 47-nF capacitor and 50-Ω
resistor. For STP applications connect both RIN0+ and RIN0- with 100-nF, AC-coupling
capacitor.
I/O
Receive input channel 1: Differential FPD-Link receiver and bidirectional control back channel
output. The IO must be AC coupled. There is internal 100Ω differential termination between
RIN1+ and RIN1–. For applications using single-ended coaxial channel connect RIN0+ with
100nF AC coupling capacitor and terminate RIN1- to Ground with a 47 nF capacitor and 50
ohm resistor. For STP applications connect both RIN1+ and RIN1– with 100 nF AC coupling
capacitor.
RIN0–
42
RIN1+
32
RIN1–
33
I2C PINS
I2C_SCL
2
I/O,
Open
Drain
I2C serial clock: Clock line for the bidirectional control bus communication.
External 2-kΩ to 4.7-kΩ pullup resistor to VI2C recommended per I2C interface standards.
1
I/O,
Open
Drain
I2C serial data: Data line for bidirectional control bus communication.
External 2-kΩ to 4.7-kΩ pullup resistor to VI2C recommended per I2C interface standards.
I2C_SDA
CONFIGURATION and CONTROL PINS
IDX
35
S
Input. I2C serial control bus device ID address
Connect to external pullup to VDD18 (pin 17) and pull down to GND to create a voltage divider.
See Table 7.
37
S
Mode select configuration input to set operating mode based on input voltage level.
Typically connected to voltage divider via external pullup to VDD18 (pin 17) and pulldown to
GND See Table 2.
30
S, PD
Power-down inverted Input Pin. This pin is internal pull down enabled. When PDB input is
brought HIGH, the device is enabled. Asserting PDB signal low powers down the device and
consume minimum power. The default function of this pin is PDB = LOW; POWER DOWN.
This pin has a 50-kΩ (typical) internal pulldown resistor. INPUT IS 3.3 V TOLERANT.
PDB = 1.8 V, device is enabled (normal operation)
PDB = 0, device is powered down.
46
S,PD
MUX select: Digital input for selecting FPD Link input channel 0 (A) or channel 1 (B). The
default state of SEL = L, selects RIN0, input A, as the active channel on the deserializer.
Asserting SEL = H selects RIN1 input B as the active channel on the deserializer. This pin has
a 25-kΩ (typical) internal pulldown resistor. VDDIO logic levels.
4
S, PD
Output sleep state select pin for enabling output sleep state. This pin has a 25-kΩ (typical)
internal pulldown resistor. If unused, connect to VDD. If using pullup resistor to connect to
VDD, the resistor value should be <= 4.3-kΩ. VDDIO logic levels. See DVP Output Control.
5
S, PD
Output enable. This pin has a 1-MΩ (typical) internal pulldown resistor. If unused, connect to
VDD. If using pullup resistor to connect to VDD, the resistor value should be <= 4.3-kΩ. VDDIO
logic levels. See DVP Output Control.
MODE
PDB
SEL
OSS_SEL
OEN
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Pin Functions (continued)
PIN
NAME
NO.
I/O
TYPE
DESCRIPTION
DIAGNOSTIC PINS
CMLOUTP
38
CMLOUTN
39
O
Channel monitor loop-through (CML) driver differential output. Typically routed to test points
and not connected. For monitoring terminate CMLOUT with a 100-Ω differential load.
S, PD
BIST enable: BISTEN = H, BIST mode is enabled BISTEN = L, BIST mode is disabled. See
Built-In Self Test (BIST) for more information. This pin has a 25-kΩ (typ) internal pulldown
resistor. VDDIO logic levels.
BISTEN
6
PASS
47
O
PASS Output: PASS = H, ERROR FREE transmission in forward channel operation. PASS = L,
one or more errors were detected in the received payload. See Built-In Self Test (BIST) for
more information. Leave No Connect if unused. Typically route to test point for monitoring.
VDDIO logic levels.
48
O
LOCK Status: Output pin for monitoring lock status of FPD-Link III channel. LOCK = H, PLL is
Locked, outputs are active. LOCK = L, PLL is unlocked, may be used as link status. VDDIO
logic levels.
RES
44
-
Reserved. Must be NC or tied to GND for normal operation.
RES
43
-
Reserved. This pin has internal pull-up resistor. Must be tied to GND for normal operation.
7,29
P
VDDIO voltage supply input: The single-ended outputs and control input are powered from
VDDIO. VDDIO can be connected to a 1.8-V, ±5% or 3-V to 3.6-V power rail. Each pin requires
a minimum 10-nF capacitor to GND.
17
P
1.8-V (±5%) power supply.
Requires 1-μF, 0.1-μF, and 0.01-μF capacitors to GND at each VDD pin.
VDD18_P0
VDD18_P1
45
36
P
1.8-V (±5%) PLL power supplies.
Requires 1-μF, 0.1-μF, and 0.01-μF capacitors to GND at each VDD pin.
VDD18_FPD0
VDD18_FPD1
40
31
P
1.8-V (±5%) high-speed transceiver (HSTRX) analog power supplies.
Requires 10-μF, 0.1-μF, and 0.01-μF capacitors to GND at each VDD pin.
34
D
Decoupling capacitor connection for internal analog regulator. Requires a minimum 4.7-μF
capacitor to GND and must not be connected to other 1.1-V supply rails.
20
D
Decoupling capacitor connection for internal mixed signal regulator. Requires a minimum 4.7μF capacitor to GND and must not be connected to other 1.1-V supply rails.
3
D
Decoupling capacitor connection for internal digital regulator. Requires a minimum 4.7-μF
capacitor to GND and must not be connected to other 1.1-V supply rails.
DAP
G
DAP is the large metal contact at the bottom side, located at the center of the QFN package.
Connect to the ground plane (GND).
LOCK
POWER AND GROUND
VDDIO
VDD18
VDD11_FPD
VDD11_DVP
VDD11_D
GND
The definitions below define the functionality of the I/O cells for each pin.
TYPE:
•
I = Input
•
O = Output
•
I/O = Input/Output
•
S = Configuration pin (All strap pins have internal pulldowns. If the default strap value needs to be changed then use an external
resistor.)
•
PD = Internal pulldown
•
P, G = Power supply, ground
•
D = Decoupling pin for internal voltage rail
6
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1)
(2)
MIN
MAX
VDD18 (VDD18, VDD18_P1 , VDD18_P0 ,
VDD18_FPD0, VDD18_FPD1)
–0.3
2.16
VDDIO
–0.3
3.96
RIN0+, RIN0–, RIN1+, RIN1–
Device powered up (VDD18 and VDDIO within
recommended operating conditions)
–0.3
2.75
RIN0+, RIN0–, RIN1+, RIN1–
Device powered down (VDD18 and VDDIO below
recommended operating conditions)
Transient Voltage
–0.3
1.45
RIN0+, RIN0–, RIN1+, RIN1–
Device powered down (VDD18 and VDDIO below
recommended operating conditions)
DC Voltage
–0.3
1.35
ROUT[11:0], PCLK, VSYNC, HSYNC, GPIO0,
GPIO1, GPIO2, SEL, OSS_SEL, OEN, BISTEN,
PASS, LOCK
–0.3
V(VDDIO) + 0.3
PDB
–0.3
3.96
Configuration input voltage
MODE, IDX
–0.3
V(VDD18) + 0.3
Open-drain voltage
GPIO3/INTB, I2C_SDA, I2C_SCL
–0.3
3.96
Supply voltage
FPD-Link III input voltage
LVCMOS IO voltage
Junction temperature
Storage temperature, Tstg
(1)
(2)
–65
UNIT
V
V
V
V
150
°C
150
°C
If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office or Distributors for availability and
specifications.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Human body model (HBM), per AEC
Q100-002 (1)
RIN0+, RIN0–, RIN1+, RIN1–
±2000
Other pins
±2000
Charged device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
ESD Rating (IEC 61000-4-2)
RD= 330 Ω, CS = 150 pF
ESD Rating (ISO 10605)
RD= 330 Ω, CS = 150 pF and 330 pF
RD= 2 kΩ, CS = 150 pF and 330 pF
(1)
UNIT
±750
Contact Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)
±8000
Air Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)
±15000
Contact Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)
±8000
Air Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)
±15000
V
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
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6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V(VDD18)
1.71
1.8
1.89
V
V(VDDIO) = 1.8 V
1.71
1.8
1.89
V
V(VDDIO) = 3.3 V
3.0
3.3
3.6
V
Operating free-air temperature, TA
–40
25
105
°C
Data rate
0.7
1.87
Gbps
PCLK frequency
25
100
MHz
1
MHz
Supply voltage
LVCMOS supply voltage
Local I2C frequency, fI2C
V(VDD18)
Supply Noise (1) (2)
Power-over-Coax noise (3)
(1)
(2)
(3)
50
V(VDDIO)
50 mVP-P
RIN0+, RIN0–, RIN1+, RIN1–
20
DC-50 MHz
Specification is ensured by design and/or characterization and is not tested in production.
Measured across RIN[1:0]+ and RIN[1:0]− terminals
6.4 Thermal Information
DS90UB934-Q1
THERMAL METRIC (1)
RGZ (VQFN)
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
30.3
°C/W
RθJC(TOP)
Junction-to-case (top) thermal resistance
12.3
°C/W
RθJC(BOT)
Junction-to-case (bottom) thermal resistance
1.2
°C/W
RθJB
Junction-to-board thermal resistance
6.9
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
6.8
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics (SPRA953).
6.5 DC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN OR
FREQUENCY
MIN
TYP
MAX
V(VDD18) =
V(VDDIO) = 1.89
V
500
685
V(VDD18) = 1.89
V,
V(VDDIO) = 3.6 V
900
UNIT
TOTAL POWER CONSUMPTION
PT
8
Total Power
Consumption normal
operation
See Figure 5
Worst Case pattern
Default registers
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mW
1125
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN OR
FREQUENCY
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
IDD
IDDZ
Deserializer Supply
Current (includes load
current). See Figure 5.
Deserializer Power
Down Supply Current
f = 100 MHz, 10-bit
mode
V(VDD18) = 1.89 V
Worst Case Pattern,
Default Registers
CL = 8 pF
V(VDDIO) = 1.89
V OR 3.6 V
VDD18
250
V(VDDIO) = 1.89
V
VDDIO
60
V(VDDIO) = 3.6 V
VDDIO
145
f = 100 MHz, 12-bit
HF mode
V(VDD18) = 1.89 V
Worst Case Pattern,
Default Registers
CL = 8 pF
V(VDDIO) = 1.89
V OR 3.6 V
VDD18
270
V(VDDIO) = 1.89
V
VDDIO
90
V(VDDIO) = 3.6 V
VDDIO
170
f = 50 MHz, 12-bit LF
mode
V(VDD18) = 1.89 V
Worst Case Pattern,
Default Registers
CL = 8 pF
V(VDDIO) = 1.89
V OR 3.6 V
VDD18
240
V(VDDIO) = 1.89
V
VDDIO
80
V(VDDIO) = 3.6 V
VDDIO
155
VDD18
30
VDDIO
10
V(VDD18) = 1.89 V, V(VDDIO) = 3.6V
PDB = L, All other LVCMOS inputs =
0V, Default Registers
mA
mA
1.8-V LVCMOS I/O (1)
VOH
High Level Output
Voltage
IOH = –2 mA
V(VDDIO) = 1.71
V to 1.89 V
VOL
Low Level Output
Voltage
IOL = 2 mA
V(VDDIO) = 1.71
V to 1.89 V
VIH
High Level Input Voltage
V(VDDIO) = 1.71 V to 1.89 V
VIL
Low Level Input Voltage
V(VDDIO) = 1.71 V to 1.89 V
ROUT[11:0],
HSYNC,
VSYNC, LOCK,
PASS
Input High Current
GPIO[2:0] ,
SEL, PDB,
OSS_SEL,
BISTEN
VIN = 1.71 V to 1.89 V
V
0.45
V
V(VDDIO)
V
0.35 ×
V(VDDIO)
V
–20
20
–100
100
–20
20
μA
GPIO[3:0], PDB,
OEN, SEL,
OSS_SEL,
BISTEN
Input Low Current
VIN = 0 V
IOS
Output Short Circuit
Current
VOUT = 0 V
IOZ
TRI-STATE Output
Current
VOUT = 0 V or V(VDDIO), PDB = L
–17
μA
mA
–20
20
μA
2.4
V(VDDIO)
V
GND
0.4
V
(4)
VOH
High Level Output
Voltage
IOH = –4 mA
V(VDDIO) = 3.0 V
to 3.6 V
VOL
Low Level Output
Voltage
IOL = 4 mA
V(VDDIO) = 3.0 V
to 3.6 V
(1)
(2)
(3)
(4)
V(VDDIO)
(3)
IIL
3.3-V LVCMOS I/O
GND
0.65 ×
GPIO[3:0], PDB,
V(VDDIO)
OEN, SEL,
OSS_SEL,
GND
BISTEN
GPIO[3:0] (2),
OEN
IIH
V(VDDIO)
– 0.45
GPIO[3:0],
ROUT[11:0],
HSYNC,
VSYNC, LOCK,
PASS
V(VDDIO) = 1.8 V ± 5%
GPIO[2:0] Pulldown disabled; Register 0xBE = 0x03
GPIO[2:0] Pulldown enabled; Register 0xBE = 0x00
V(VDDIO) = 3.0 V to 3.6 V
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DC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
VIH
TEST CONDITIONS
High Level Input Voltage
VIL
Low Level Input Voltage
V(VDDIO) = 3.0 V to 3.6 V
V(VDDIO) = 3.0 V to 3.6 V
PIN OR
FREQUENCY
GPIO[3:0],
OEN, SEL,
OSS_SEL,
BISTEN
MIN
TYP
MAX
2
V(VDDIO)
PDB
1.17
V(VDDIO)
GPIO[3:0],
OEN, SEL,
OSS_SEL,
BISTEN
GND
0.8
PDB
GND
0.63
-20
20
–190
190
–20
20
UNIT
V
V
(2)
GPIO[3:0] ,
OEN, PDB
IIH
Input High Current
VIN = 3.0 V to 3.6 V
Input Low Current
VIN = 0 V
IOS
Output Short Circuit
Current
VOUT = 0 V
IOZ
TRI-STATE Output
Current
VOUT = 0 V or V(VDDIO), PDB = LOW
I2C SERIAL CONTROL BUS
GPIO[2:0] ,
SEL, OSS_SEL,
BISTEN
GPIO[3:0],
OEN, SEL,
OSS_SEL,
BISTEN, PDB
IIL
μA
(3)
–40
μA
mA
–60
60
μA
(5)
VIH
Input High Level
0.7 ×
V(VDDIO)
V(VDDIO)
V
VIL
Input Low Level
GND
0.3 ×
V(VDDIO)
V
VHY
Input Hysteresis
VOL
Output Low Level
Standard/Fast Mode - IOL = 4 mA; Fast
Plus Mode - IOL = 20 mA
IIH
Input High Current
IIL
Input Low Current
CIN
Input Capacitance (6)
I2C_SDA,
I2C_SCL
50
mV
0
0.4
V
VIN = V(VDDIO)
–10
10
µA
VIN = 0V
–10
10
µA
10
pF
5
FPD-LINK III INPUT
VCM
Common Mode Voltage
See Figure 2.
RT
Internal Termination
Resistor
1.2
V
Single Ended
40
50
60
Differential
80
100
120
Ω
FPD-LINK III BIDIRECTIONAL CONTROL CHANNEL
VOUT-BC
Back Channel SingleEnded Output Voltage
RL = 50 Ω, Coaxial configuration,
forward channel disabled
RIN0+, RIN1+
190
VOD-BC
Back Channel
Differential Output
Voltage
RL = 100 Ω, STP configuration, forward
channel disabled
RIN0+, RIN0–
RIN1+, RIN1–
380
(5)
(6)
10
260
mV
520
mV
V(VDDIO) = 1.8 V ± 5% OR 3.0 V to 3.6 V
Specification is ensured by design and/or characterization and is not tested in production.
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6.6 AC Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN OR
FREQUENCY
MIN
TYP
MAX
UNIT
LVCMOS I/O
Receiver Output Clock
Period.
See Figure 7.
tRCP
10-bit Mode
PCLK, 50 - 100 MHz
10
20
12-bit HF Mode
PCLK, 37.5 - 100
MHz
10
26.7
12-bit LF Mode
PCLK, 25 - 50 MHz
10-bit Mode
20
ns
40
45%
50%
55%
40%
50%
60%
tPDC
PCLK Duty Cycle (1)
tCLH
LVCMOS Low-to-High
Transition Time (1)
See Figure 1.
PCLK
2
2.8
ns
tCHL
LVCMOS High-to-Low
Transition Time (1)
See Figure 1.
PCLK
2
2.8
ns
tCLH
LVCMOS Low-to-High
Transition Time (1)
See Figure 1.
ROUT[11:0],
HSYNC, VSYNC,
GPIO[2:0]
2
3
ns
tCHL
LVCMOS High-to-Low
Transition Time (1)
See Figure 1.
ROUT[11:0],
HSYNC, VSYNC,
GPIO[2:0]
2
3
ns
tROS
ROUT Setup Data to PCLK (1)
See Figure 7.
PCLK, ROUT[11:0],
HSYNC, VSYNC
0.38T
0.5T
ns
tROH
ROUT Hold Data to PCLK (1)
See Figure 7.
PCLK, ROUT[11:0],
HSYNC, VSYNC
0.38T
0.5T
ns
Deserializer Delay (1)
See Figure 6.
10-bit mode
tDD
tDDLT
12-bit HF or LF Mode
V(VDDIO) = 1.71 V to 1.89 V
OR
V(VDDIO) = 3.0 V to 3.6 V
CL = 8 pF (lumped load)
Default Registers
Deserializer Data Lock Time
See Figure 3.
Receiver Clock Jitter (1)
tRCJ
tDPJ
Deserializer Period Jitter
tDCCJ
175T
185T
Default Registers (RRFB = 1) 12-bit HF mode
100T
115T
12-bit LF mode
65T
80T
10-bit mode
Digital Reset, or PDB = HIGH
12-bit HF mode
to LOCK = HIGH
12-bit LF mode
PCLK, SSCG[0] = OFF
(1)
Deserializer Cycle-to-Cycle
Clock Jitter (1) (2)
PCLK
PCLK, SSCG[0] = OFF
PCLK, SSCG[0] = OFF
ns
22
22
ms
22
10-bit mode
40
70
12-bit HF mode
52
90
12-bit LF mode
45
85
10-bit mode
885
1020
12-bit HF mode
420
880
12-bit LF mode
400
515
10-bit mode
1360
1800
12-bit HF mode
1280
1500
12-bit LF mode
890
1150
fdev
Spread Spectrum Clocking
Deviation Frequency
See Figure 9.
LVCMOS Output Bus,
SSCG[0] = ON
25 - 100 MHz
±0.5% to
±2.5%
fmod
Spread Spectrum Clocking
Modulation Frequency
See Figure 9.
LVCMOS Output Bus,
SSCG[0] = ON
25 - 100 MHz
5 to 50
ps
ps
ps
kHz
FPD-Link III
(1)
(2)
Specification is ensured by design and/or characterization and is not tested in production.
Specification is ensured by characterization
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AC Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER
TEST CONDITIONS
PIN OR
FREQUENCY
MIN
TYP
MAX
UNIT
LVCMOS I/O
VIN
Single Ended Input Voltage
See Figure 2.
Coaxial configuration. 1010
pattern applied to the far end
of a 15 meter cable.
VIN measured after the cable,
at the deserializer input pins.
VID
Differential Input Voltage
See Figure 2.
STP Configuration. 1010
pattern applied to the far end
of a 15 meter cable.
VID measured after the cable,
at the deserializer input pins.
ƒBC
Back Channel Frequency
TJ
Back Channel Jitter
TIJIT
(3)
RIN0+, RIN0–
RIN1+, RIN1–
50
mV
100
mV
3.5
(1)
Input Jitter
7
10MHz Sinusoidal Jitter
applied to FPD-Link III input
5.5
MHz
15
ns
0.4
UI (3)
1UI = 1 bit time of FPD-Link Forward channel
6.7 Recommended Timing for the Serial Control Bus
Over I2C supply and temperature ranges unless otherwise specified.
MIN
MAX
Standard-mode
>0
100
Fast-mode
>0
400
Fast-mode Plus
>0
1000
Standard-mode
4.7
Fast-mode
1.3
Fast-mode Plus
0.5
UNIT
I2C SERIAL CONTROL BUS (Figure 4)
fSCL
tLOW
SCL Clock Frequency
SCL Low Period
Standard-mode
tHIGH
SCL High Period
Fast-mode
Fast-mode Plus
Standard-mode
tHD;STA
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
Hold time for a start or a repeated start condition
Set Up time for a start or a repeated start condition
Data Hold Time
Data Set Up Time
Set Up Time for STOP Condition
Fast-mode
12
4
0.6
Standard-mode
4.7
0.6
Fast-mode Plus
0.26
Standard-mode
0
Fast-mode
0
Fast-mode Plus
0
Standard-mode
250
Fast-mode
100
Fast-mode Plus
50
Standard-mode
4
Fast-mode Plus
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µs
0.26
0.26
Fast-mode
µs
4
0.6
Fast-mode Plus
Fast-mode
kHz
0.6
µs
µs
µs
ns
µs
0.26
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Recommended Timing for the Serial Control Bus (continued)
Over I2C supply and temperature ranges unless otherwise specified.
MIN
MAX
UNIT
2
I C SERIAL CONTROL BUS (Figure 4)
tBUF
Bus Free Time Between STOP and START
Standard-mode
4.7
Fast-mode
1.3
Fast-mode Plus
0.5
µs
Standard-mode
tr
tf
Cb
tSP
(1)
SCL and SDA Rise Time
SCL and SDA Fall Time
Capacitive Load for Each Bus Line (1)
Input Filter (1)
1000
Fast-mode
300
Fast-mode Plus
120
Standard-mode
300
Fast-mode
300
Fast-mode Plus
120
Standard-mode
400
Fast-mode
400
Fast-mode Plus
550
Fast-mode
50
Fast-mode Plus
50
ns
ns
pF
ns
Specification is ensured by design and/or characterization and is not tested in production.
V(VDDIO)
80%
20%
GND
tCLH
tCHL
Figure 1. LVCMOS Transition Times
RIN+
Single Ended
or RIN-
VIN
VIN
| VCM
0V
Differential
(RIN+) - (RIN-)
VID
0V
Figure 2. FPD-Link III Receiver VID, VIN, VCM
PDB=H
tDDLT
RIN±
LOCK
V(VDDIO)/2
Figure 3. Deserializer Data Lock Time
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SDA
tf
tHD;STA
tLOW
tBUF
tr
tf
tr
SCL
tSU;STA
tHD;STA
tHIGH
tSU;STO
tSU;DAT
tHD;DAT
START
STOP
REPEATED
START
START
Figure 4. I2C Serial Control Bus Timing
Signal Pattern
Device Pin Name
tRCP
PCLK
RRFB (0x3B[0]) = 1
ROUTn
SYMBOL N + 3
| |
0V
SYMBOL N + 3
| |
SYMBOL N + 2
| |
RIN±
SYMBOL N + 1
| |
SYMBOL N
| |
Figure 5. SSO Test Pattern for Power Consumption
SYMBOL N - 3
| ||
| ||
| ||
ROUTn
V(VDDIO)/2
SYMBOL N - 2
SYMBOL N - 1
SYMBOL N
| ||
PCLK
| ||
tDD
SYMBOL N+1
Figure 6. Deserializer Delay
tRCP
PCLK
V(VDDIO)
1/2 V(VDDIO)
1/2 V(VDDIO)
0V
V(VDDIO)
ROUT[n],
VS, HS
1/2 V(VDDIO)
1/2 V(VDDIO)
0V
tROS
tROH
Figure 7. Deserializer Output Setup/Hold Times
14
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PDB= H
OEN
OSS_SEL
RIN
(Diff.)
LOCK
'RQ¶W &DUH
TRI-STATE
TRI-STATE
PASS
LOW
ACTIVE
HIGH
ROUT[0:11],
HS, VS
TRI-STATE
LOW
PCLK
RRFB (0x3B[0]) = 1
TRI-STATE
LOW
TRI-STATE
LOW
HIGH
HIGH
ACTIVE
ACTIVE
LOW
TRI-STATE
LOW
TRI-STATE
Figure 8. Output State (Setup and Hold) Times
Frequency
fdev (max)
FPCLK+
FPCLK
fdev
fdev (min)
Time
FPCLK-
1 / fmod
Figure 9. Spread Spectrum Clock Output Profile
6.8 Typical Characteristics
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Typical Characteristics (continued)
ROUT0
Output
(2 V/DIV)
100 MHz
Pixel Clock
Output
(2 V/DIV)
Time (5 ns/DIV)
Figure 10. CMLOUTP/N Loop-through Eye Diagram at 1.867
Gbps
16
Figure 11. ROUT0 Data Sampled by 100-MHz PCLK
RRFB (0x3B[0]) = 1
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7 Detailed Description
7.1 Overview
The DS90UB934-Q1 FPD-Link III deserializer, in conjunction with the DS90UB913A/933-Q1 serializers, supports
the video transport needs with a ultra-high-speed forward channel and an embedded bidirectional control
channel. The DS90UB934-Q1 deserializer selects data streams from dual camera sources and outputs the
recovered data onto a parallel LVCMOS output data bus. The DS90UB934-Q1 is designed to interface with the
DS90UB933-Q1 device and is backwards compatible with the DS90UB913A-Q1 device using a 50-Ω coax
interface. The DS90UB934-Q1 also works with the DS90UB933-Q1 or DS90UB913A-Q1 using an STP interface.
The DS90UB934-Q1 can also work with the DS90UB953-Q1 or DS90UB935-Q1 in the backwards compatible
mode (see the Backwards Compatibility Modes for Operation with Parallel Output Deserializers (SNLA270)). The
DS90UB933/934 FPD-link III chipsets are intended to link mega-pixel camera imagers and video processors in
ECUs. The serializer/deserializer chipset can operate from 25-MHz to 100-MHz pixel clock frequency.
7.1.1 Functional Description
The DS90UB934-Q1 converts the FPD-Link III stream into a parallel CMOS output interface designed to support
automotive image sensors up to 12 bits at 100 MHz with resolutions including 1MP/60fps and 2MP/30fps. The
DS90UB934-Q1 device recovers a high-speed FPD-Link III forward channel signal and outputs a 10- or 12-bit
wide parallel LVCMOS data bus along with generating a bidirectional control channel control signal in the reverse
channel direction. The high-speed, serial-bit stream contains an embedded clock and DC-balanced information
which enhances signal quality to support AC coupling. The DS90UB934 deserializer can accept up to:
• 12 bits of DATA + 2 SYNC bits for an input PCLK range of 37.5 MHz to 100 MHz in the 12-bit high frequency
mode. Note: No HS/VS restrictions (raw).
• 10 bits of DATA + 2 SYNC bits for an input PCLK range of 50 MHz to 100 MHz in the 10-bit mode. Note:
HS/VS restricted to no more than one transition per 10 PCLK cycles.
• 12 bits of DATA + 2 bits SYNC for an input PCLK range of 25 MHz to 50 MHz in the 12-bit low frequency
mode. Note: No HS/VS restrictions (raw).
The DS90UB934-Q1 device has a 2:1 multiplexer, which allows customers to select between two serializer
inputs. The control channel function of the DS90UB933/DS90UB934-Q1 chipset provides bidirectional
communication between the image sensor and ECUs. The integrated bidirectional control channel transfers data
bidirectionally over the same channel used for video data interface. This interface offers advantages over other
chipsets by eliminating the need for additional wires for programming and control. The bidirectional control
channel bus is controlled via an I2C port. The bidirectional control channel offers asymmetrical communication
and is not dependent on video blanking intervals. The DS90UB933/934 chipset offer customers the choice to
work with different clocking schemes. The DS90UB933/934 chipsets can use an external oscillator as the
reference clock source for the PLL or PCLK from the imager as primary reference clock to the PLL (see the
DS90UB933-Q1 data sheet).
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10 or
12
ROUT
HSYNC
VSYNC
4
GPIO[3:0]
2:1
RIN0-
Output Latch
RIN0+
Decoder
RT
Deserializer
RT
Adaptive Eq.
7.2 Functional Block Diagram
RIN1+
PCLK
Clock
Gen
CDR
OSS_SEL
RIN1-
I2C
Controller
IDX
FIFO
Decoder
Encoder
CMLOUTP
CMLOUTN
LOCK
PASS
BISTEN
PDB
OEN
MODE
Timing and
Control
SEL
I2C_SDA
I2C_SCL
Diagnostics
7.3 Feature Description
The DS90UB934-Q1 device has a 2:1 multiplexer that allows customers to select between two serializer inputs
for camera applications. Frequency range operates up to 100 MHz in 12-bit mode or in 10-bit mode to support
1MP/60fps and 2MP/30fps imagers. The device accepts FPD-Link III inputs compatible to
DS90UB933/913A/935/953 serializers. The received camera data stream from the selected input port is output
onto the parallel interface.
7.3.1 Serial Frame Format
The high-speed forward channel is composed of 28 bits of data containing video data, sync signals, I2C, and
parity bits. This data payload is optimized for signal transmission over an AC-coupled link. Data is randomized,
DC-balanced, and scrambled. The 28-bit frame structure changes in the 12-bit, low-frequency mode, 12-bit, highfrequency mode and the 10-bit mode internally and is seamless to the customer. The bidirectional control
channel data is transferred over the single serial link along with the high-speed forward data. This architecture
provides a full duplex low-speed forward and backward path across the serial link together with a high-speed
forward channel without the dependence on the video blanking phase.
7.3.2 Line Rate Calculations for the DS90UB933/934
The DS90UB933-Q1 device divides the clock internally by divide-by-1 in the 12-bit low-frequency mode, by
divide-by-2 in the 10-bit mode, and by divide-by-1.5 in the 12-bit high-frequency mode. Conversely, the
DS90UB934-Q1 multiplies the recovered serial clock to generate the proper pixel clock output frequency. Thus
the maximum line rate in the three different modes remains 1.867 Gbps. The following are the formulae used to
calculate the maximum line rate in the different modes:
• For the 12-bit mode: Line rate = ƒPCLK × (2/3) × 28; for example, ƒPCLK = 100 MHz, line rate = (100 MHz) ×
(2/3) × 28 = 1.87 Gbps
• For the 10-bit mode: Line rate = ƒPCLK / 2 × 28; for example, ƒPCLK = 100 MHz, line rate = (100 MHz/2) × 28 =
1.4 Gbps
7.3.3 Deserializer Multiplexer Input
The DS90UB934-Q1 offers a 2:1 multiplexer that can be used to select which camera is used as the input.
Figure 12 shows the operation of the 2:1 multiplexer in the deserializer. The selection of the camera can be pin
controlled as well as register controlled. Only one deserializer input can be selected at a time. If the serializer A
is selected as the active serializer, the back-channel for deserializer A turns ON and vice versa. To switch
between the two cameras, first the serializer B must be selected using the SEL pin/register on the deserializer.
After that the back channel driver for deserializer B has to be enabled using the register in the deserializer.
18
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Feature Description (continued)
Camera A
Serializer A
DATA
PCLK
DATA
PCLK
2
I C
Camera B
GPIO
GPIO
FSYNC
CMOS
Image
Sensor
Deserializer
2:1
CMOS
Image
Sensor
FSYNC
I2C
Serializer B
ECU
Module
DATA
PCLK
GPIO
FSYNC
2
I C
PC
Figure 12. Using the Multiplexer on the Deserializer to Enable a Two-Camera System
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7.4 Device Functional Modes
DS90UB934-Q1 supports the use cases shown in Table 1:
Table 1. PCLK Frequency Modes
PCLK FREQUENCY RANGE
DS90UB934-Q1 DEVICE
MODE
DS90UB913A-Q1 PARTNER
DS90UB933-Q1 PARTNER
DS90UB953-Q1/DS90UB935-Q1
PARTNER
RAW12 High-Frequency (HF)
37.5 MHz - 75 MHz
37.5 MHz - 100 MHz
37.5 MHz - 100 MHz
RAW12 Low-Frequency (LF)
25 MHz - 50 MHz
N/A
N/A
RAW10
50 MHz - 100 MHz
50 MHz - 100 MHz
50 MHz - 100 MHz
The modes control the FPD-Link III receiver operation of the device. In each of the cases, the output format for
the device is parallel.
The input mode of operation is controlled by the MODE strap pin. The input mode may also be overridden and
configured by FPD3_MODE (Register 0x6D[1:0]) setting in the Port Configuration register.
7.4.1 RX MODE Pin
Configuration of the device may be done via the MODE input strap pin, or via the configuration register bits. A
pullup resistor and a pulldown resistor of suggested values may be used to set the voltage ratio of the MODE
input (VTARGET) and V(VDD18) (pin 17) to select one of the 6 possible selected modes. Possible configurations are:
• FPD-Link III coax or STP
• 12-bit HF / 12-bit LF / 10-bit DVP modes
VVDD18
RHIGH
MODE
or IDX
VTARGET
RLOW
Deserializer
GND
Figure 13. Strap Pin Connection Diagram
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Table 2. Strap Configuration Mode Select
VTARGET VOLTAGE RANGE
MODE
NO.
VMIN
VTYP
VTARGET
STRAP
VOLTAGE
VMAX
(V); V(VDD18) =
1.8 V
0
SUGGESTED STRAP
RESISTORS (1% TOL)
RHIGH (kΩ )
RLOW (kΩ )
COAX
/STP
RX MODE
RESERVED
1
0.179 ×
V(VDD18)
0.213 ×
V(VDD18)
0.247 ×
V(VDD18)
0.374
88.7
23.2
STP
RAW12 LF
2
0.296 ×
V(VDD18)
0.330 ×
V(VDD18)
0.362 ×
V(VDD18)
0.582
75
35.7
STP
RAW12 HF
3
0.412 ×
V(VDD18)
0.443 ×
V(VDD18)
0.474 ×
V(VDD18)
0.792
71.5
56.2
STP
RAW10
4
RESERVED
5
0.642 ×
V(VDD18)
0.673 ×
V(VDD18)
0.704 ×
V(VDD18)
1.202
39.2
78.7
COAX
RAW12 LF
6
0.761 ×
V(VDD18)
0.792 ×
V(VDD18)
0.823 ×
V(VDD18)
1.42
25.5
95.3
COAX
RAW12 HF
7
0.876 ×
V(VDD18)
V(VDD18)
V(VDD18)
1.8
10
OPEN
COAX
RAW10
The strapped values can be viewed and/or modified in the following locations:
• Coax – Port configuration COAX_MODE (Register 0x6D[2])
• RX mode – Port configuration FPD3_MODE (Register 0x6D[1:0])
7.4.2 DVP Output Control
The LVCMOS outputs are controlled via the OEN and OSS_SEL pins or via register override of these values.
Register override is controlled by bits in the General Configuration register (0x02).
Table 3. Output States
INPUTS
OUTPUTS
SERIAL
INPUTS
PDB
OEN
OSS_SEL
LOCK
PASS
DATA
PCLK
X
0
X
X
Z
Z
Z
Z
X
1
0
0
L
L
L
L
X
1
0
1
Z
Z
Z
Z
static
1
1
0
L
L
L
L
static
1
1
1
L
previous state
L
L
active
1
1
0
H
L
L
L
active
1
1
1
H
valid
valid
valid
7.4.2.1 LOCK Status
In 12-bit HF mode, the LOCK pin is only high if there is a link with a serializer that has an active PCLK input.
LOCK is low if there is a serializer connected and there is a link established using the internal oscillator of the
serializer. Therefore, when using this mode, it is preferred to use the port specific LOCK_STS register (0x4D[0]),
which is high when linked to a serializer with internal oscillator. This LOCK_STS signal can also be output to a
GPIO pin for monitoring in real time. Once LOCK_STS is high for a specific port, remote I2C is available to that
serializer.
In 12-bit LF or 10-bit modes, the LOCK pin is high when there is a link with a serializer regardless of whether
there is an active PCLK input. The port specific LOCK_STS register is also valid in either of these modes.
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7.4.3 Input Jitter Tolerance
Input jitter tolerance is the ability of the CDR PLL of the receiver to track and recover the incoming serial data
stream. Jitter tolerance at a specific frequency is the maximum jitter permissible before data errors occur.
Figure 14 and Table 4 show the allowable total jitter of the receiver inputs and must be less than the values in
Table 4.
Amplitude
(UI p-p)
A1
A2
g1
g (MHz)
g2
Figure 14. Input Jitter Tolerance Plot
Table 4. Input Jitter Tolerance Limit
INTERFACE
FPD3
(1)
JITTER AMPLITUDE (UI p-p)
FREQUENCY (MHz)
(1)
A1
A2
ƒ1
ƒ2
1
0.4
FPD3_PCLK / 80
FPD3_PCLK / 15
FPD3_PCLK is equivalent to PCLK frequency based on the operating MODE:
10-bit mode: PCLK_Freq. /2
12-bit HF mode: PCLK_Freq. x 2/3
12-bit LF mode: PCLK_Freq.
7.4.4 Adaptive Equalizer
The receiver inputs provide an adaptive equalization filter in order to compensate for signal degradation from the
interconnect components. In order to determine the maximum cable reach, factors that affect signal integrity such
as jitter, skew, ISI, crosstalk, etc. must be taken into consideration. The receiver incorporates an adaptive
equalizer (AEQ), which continuously monitors cable characteristics for long-term cable aging and temperature
changes. The AEQ attempts to optimize the equalization setting of the RX receiver.
If the deserializer loses LOCK, the adaptive equalizer resets and performs the LOCK algorithm again to
reacquire the serial data stream being sent by the serializer.
7.4.5 Channel Monitor Loop-Through Output Driver
The DS90UB934-Q1 includes an internal channel monitor loop-through output on the CMLOUTP/N pins. A
buffered loop-through output driver is provided on the CMLOUTP/N for observing jitter after equalization for each
of the two RX receive channels. The CMLOUT monitors the post EQ stage, thus providing the recovered input of
the deserializer signal. The measured serial data width on the CMLOUT loop-through is the total jitter including
the internal driver, AEQ, back channel echo, etc. Each channel also has its own CMLOUT monitor and can be
used for debug purposes. This CMLOUT is useful in identifying gross signal conditioning issues. The intrinsic
jitter, JCML, represents the amount of jitter seen with a clean serial stream applied to the FPD-Link III input pins.
When the total jitter is measured on CMLOUTP and CMLOUTN, the typical intrinsic jitter value can be subtracted
to get an approximation of how much jitter is seen at the RIN[1:0]± input pins.
Table 6 includes details on selecting the corresponding RX receiver of CMLOUTP/N configuration.
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Table 5. CML Monitor Output Driver
PARAMETER
JCML
(1)
TEST CONDITIONS
CMLOUT Differential Output
Intrinsic Jitter
Clean clock fed into FPD-Link
III input
RL = 100 Ω
(Figure 15)
PIN
MIN
CMLOUTP,
CMLOUTN
TYP
MAX
0.15
UNIT
UI (1)
UI – Unit interval is equivalent to one ideal serialized data bit width. The UI scales with serializer input PCLK frequency.
10-bit mode: 1 UI = 1 / ( PCLK_Freq. /2 x 28 )
12-bit HF mode: 1 UI = 1 / ( PCLK_Freq. x 2/3 x 28 )
12-bit LF mode: 1 UI = 1 / ( PCLK_Freq. x 28 )
VOD (+)
JCML
0V
VOD (-)
tBIT (1 UI)
Figure 15. CMLOUT Output Driver
Table 6. Channel Monitor Loop-Through Output Configuration
FPD3 RX Port 0
FPD3 RX Port 1
ENABLE MAIN LOOPTHRU DRIVER
0xB0 = 0x14
0xB1 = 0x00
0xB2 = 0x80
0xB0 = 0x14
0xB1 = 0x00
0xB2 = 0x80
SELECT CHANNEL MUX
0xB1 = 0x02
0xB2 = 0x20
0xB1 = 0x03
0xB2 = 0x28
0xB1 = 0x04
0xB2 = 0x28
0xB1 = 0x02
0xB2 = 0xA0
0xB1 = 0x03
0xB2 = 0x28
0xB1 = 0x04
0xB2 = 0x28
SELECT RX PORT
0xB0 = 0x18
0xB1 = 0x0F
0xB2 = 0x01
0xB1 = 0x10
0xB2 = 0x02
0xB0 = 0x18
0xB1 = 0x0F
0xB2 = 0x01
0xB1 = 0x10
0xB2 = 0x02
7.4.5.1 Code Example for CMLOUT FPD3 RX Port 0:
board.WriteReg(0xB0,0x14)
board.WriteReg(0xB1,0x00)
board.WriteReg(0xB2,0x80)
board.WriteReg(0xB1,0x02)
board.WriteReg(0xB2,0x20)
board.WriteReg(0xB1,0x03)
board.WriteReg(0xB2,0x28)
board.WriteReg(0xB1,0x04)
board.WriteReg(0xB2,0x28)
board.WriteReg(0xB0,0x18)
board.WriteReg(0xB1,0x0F)
board.WriteReg(0xB2,0x01)
board.WriteReg(0xB1,0x10)
board.WriteReg(0xB2,0x02)
7.4.6 GPIO Support
The DS90UB934-Q1 supports 4 pins programmable for use in multiple options through the GPIOx_PIN_CTL
registers.
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7.4.6.1 Back Channel GPIO
The DS90UB934-Q1 can input data on the GPIO pins to send on the back channel to remote serializers. Each
GPIO pin can be programmed for input mode. In addition, the back channel for each FPD3 port can be
programmed to send any of the 4 GPIO pins data. The same GPIO pin can be connected to multiple back
channel GPIO signals.
In addition to sending GPIO from pins, an internally generated frame synchronization signal (FrameSync) signal
may be sent on any of the back-channel GPIOs.
For each port, the following GPIO control is available through the BC_GPIO_CTL0 register 0x6E and
BC_GPIO_CTL1 register 0x6F.
7.4.6.2 GPIO Pin Status
GPIO pin status may be read through the GPIO_PIN_STS register 0x0E. This register provides the status of the
GPIO pin independent of whether the GPIO pin is configured as an input or output.
7.4.6.3 Other GPIO Pin Controls
Each GPIO pin has a input disable and a pulldown disable. By default, the GPIO pin input paths are enabled and
the internal pulldown circuit in the GPIO is enabled. The GPIO_INPUT_CTL register 0x0F and GPIO_PD_CTL
register 0xBE allow control of the input enable and the pulldown respectively. For most applications, there is no
need to modify the default register settings.
7.4.6.4 FrameSync Operation
A FrameSync signal can be sent via the back channel using any of the back channel GPIOs. The signal can be
generated in two different methods. The first option offers sending the external FrameSync using one of the
available GPIO pins on the DS90UB934-Q1 and mapping that GPIO to a back channel GPIO on one of the FPDLink III ports.
The second option is to have the DS90UB934-Q1 internally generate a FrameSync signal to send via GPIO to
one of the attached serializers.
7.4.6.4.1 External FrameSync Control
In external FrameSync mode, an external signal is input to the DS90UB934-Q1 via one of the GPIO pins on the
device. The external FrameSync signal may be propagated to either of the attached FPD3 serializers via a GPIO
signal in the back channel.
Enabling the external FrameSync mode is done by setting the FS_MODE control in the FS_CTL (0x18) register
to a value between 0x8 (GPIO0 pin) to 0xB (GPIO3 pin). Set FS_GEN_ENABLE to 0 for this mode.
To send the FrameSync signal on the BC_GPIOx signal of a port, the BC_GPIO_CTL0 or BC_GPIO_CTL1
register must be programmed for that port to select the FrameSync signal.
7.4.6.4.2 Internally Generated FrameSync
In internal FrameSync mode, an internally generated FrameSync signal is sent to one or more of the attached
FPD3 serializers via a GPIO signal in the back channel.
FrameSync operation is controlled by the FS_CTL 0x18, FS_HIGH_TIME_x, and FS_LOW_TIME_x 0x19–0x1A
registers. The resolution of the FrameSync generator clock (FS_CLK_PD) is derived from the back channel
frame period (BC_FREQ_SELECT register). For 2.5-Mbps back-channel operation, the frame period is 12 µs (30
bits × 400 ns/bit).
Once enabled, the FrameSync signal is sent continuously based on the programmed conditions.
Enabling the internal FrameSync mode is done by setting the FS_GEN_ENABLE control in the FS_CTL (0x18)
register to a value of 1. The FS_MODE field controls the clock source used for the FrameSync generation. The
FS_GEN_MODE field configures whether the duty cycle of the FrameSync is 50/50 or whether the high and low
periods are controlled separately. The FrameSync high and low periods are controlled by the FS_HIGH_TIME
and FS_LOW_TIME registers.
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The accuracy of the internally generated FrameSync is directly dependent on the accuracy of the internal
oscillator used to generate the back-channel reference clock. The internal oscillator has ±5% variation over
process, voltage, and temperature.
FS_HIGH
FS_LOW
FS_LOW = FS_LOW_TIME * FS_CLK_PD
FS_HIGH = FS_HIGH_TIME * FS_CLK_PD
where FS_CLK_PD is the resolution of the FrameSync generator clock
Figure 16. Internal FrameSync Signal
The following example shows generation of a FrameSync signal at 60 pulses per second. Mode settings:
• Programmable high/low periods: FS_GEN_MODE 0x18[1]=0
• Use port 0 back channel frame period: FS_MODE 0x18[7:4]=0x0
• Back channel rate of 2.5 Mbps: BC_FREQ_SELECT for port 0 0x58[2:0]=0x0
• Initial FS state of 0: FS_INIT_STATE 0x18[2]=0
Based on mode settings, the FrameSync is generated based upon FS_CLK_PD of 12 μs.
The total period of the FrameSync is (1 sec / 60 Hz) / 12 µs or approximately 1,389 counts.
For a 10% duty cycle, set the high time to 139 (0x008A) cycles, and the low time to 1,250 (0x04E1) cycles:
• FS_HIGH_TIME_1: 0x19 = 0x00
• FS_HIGH_TIME_0: 0x1A = 0x8A
• FS_LOW_TIME_1: 0x1B = 0x04
• FS_LOW_TIME_0: 0x1C = 0xE1
7.4.6.4.2.1 Code Example for Internally Generated FrameSync
WriteI2C(0x4C,0x01)
WriteI2C(0x6E,0xAA)
WriteI2C(0x4C,0x12)
WriteI2C(0x6E,0xAA)
WriteI2C(0x10,0x91)
WriteI2C(0x58,0x58)
WriteI2C(0x19,0x00)
WriteI2C(0x1A,0x8A)
WriteI2C(0x1B,0x04)
WriteI2C(0x1C,0xE1)
WriteI2C(0x18,0x01)
#
#
#
#
#
#
#
#
#
#
#
RX0
BC_GPIO_CTL0: FrameSync signal to GPIO0/1
RX1
BC_GPIO_CTL0: FrameSync signal to GPIO0/1
FrameSync signal; Device Status; Enabled
BC FREQ SELECT: 2.5 Mbps
FS_HIGH_TIME_1
FS_HIGH_TIME_0
FS_LOW_TIME_1
FS_LOW_TIME_0
Enable FrameSync
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7.5 Programming
7.5.1 Serial Control Bus
The DS90UB934-Q1 implements an I2C-compatible serial control bus. The I2C is for local device configuration
and incorporates a bidirectional control channel (BCC) that allows communication with a remote serializers as
well as remote I2C slave devices.
The device address is set via a resistor divider (RHIGH and RLOW — see Figure 17) connected to the IDX pin.
VDD18
VI2C VI2C
RHIGH
IDX
RPU
RPU
RLOW
HOST
Deserializer
SCL
SCL
SDA
SDA
To other Devices
Figure 17. Serial Control Bus Connection
The serial control bus consists of two signals, SCL and SDA. SCL is a serial bus clock input. SDA is the serial
bus data input/output signal. Both SCL and SDA signals require an external pullup resistor to 1.8-V or 3.3-V
V(VI2C). The pullup resistor value may be adjusted for capacitive loading and data rate requirements. The signals
are either pulled high or driven low.
The IDX pin configures the control interface to one of 8 possible device addresses. A pullup resistor and a
pulldown resistor may be used to set the appropriate voltage ratio between the IDX input pin (V(IDX)) and V(VI2C),
each ratio corresponding to a specific device address (see Table 7).
Table 7. Serial Control Bus Addresses for IDX
VIDX TARGET
VOLTAGE
VIDX VOLTAGE RANGE
NO.
26
VMIN
SUGGESTED STRAP
RESISTORS (1% TOL)
ASSIGNED I2C ADDRESS
VTYP
VMAX
(V); V(VDD18) =
1.8 V
RHIGH (kΩ )
RLOW (kΩ )
7-BIT
8-BIT
0
0
0
0.131 × V(VDD18)
0
OPEN
10.0
0x30
0x60
1
0.179 ×
V(VDD18)
0.213 ×
V(VDD18)
0.247 × V(VDD18)
0.374
88.7
23.2
0x32
0x64
2
0.296 ×
V(VDD18)
0.330 ×
V(VDD18)
0.362 × V(VDD18)
0.582
75.0
35.7
0x34
0x68
3
0.412 ×
V(VDD18)
0.443 ×
V(VDD18)
0.474 × V(VDD18)
0.792
71.5
56.2
0x36
0x6C
4
0.525 ×
V(VDD18)
0.559 ×
V(VDD18)
0.592 × V(VDD18)
0.995
78.7
97.6
0x38
0x70
5
0.642 ×
V(VDD18)
0.673 ×
V(VDD18)
0.704 × V(VDD18)
1.202
39.2
78.7
0x3A
0x74
6
0.761 ×
V(VDD18)
0.792 ×
V(VDD18)
0.823 × V(VDD18)
1.420
25.5
95.3
0x3C
0x78
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Programming (continued)
Table 7. Serial Control Bus Addresses for IDX (continued)
VIDX TARGET
VOLTAGE
VIDX VOLTAGE RANGE
SUGGESTED STRAP
RESISTORS (1% TOL)
ASSIGNED I2C ADDRESS
NO.
VMIN
VTYP
VMAX
(V); V(VDD18) =
1.8 V
RHIGH (kΩ )
RLOW (kΩ )
7-BIT
8-BIT
7
0.876 ×
V(VDD18)
V(VDD18)
V(VDD18)
1.8
10
OPEN
0x3D
0x7A
The serial bus protocol is controlled by START, START-Repeated, and STOP phases. A START occurs when
SDA transitions low while SCL is high. A STOP occurs when SDA transitions high while SCL is also high. See
Figure 18.
SDA
SCL
S
P
START condition, or
START repeat condition
STOP condition
Figure 18. START and STOP Conditions
S
Register
Address
Slave
Address
7-bit Address
S
0
A
C
K
Bus Activity:
Slave
N
A
C
K
Slave
Address
7-bit Address
A
C
K
Stop
SDA Line
Start
Bus Activity:
Master
Start
To communicate with a remote device, the host controller (master) sends the slave address and listens for a
response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is
addressed correctly, it acknowledges (ACKs) the master by driving the SDA bus low. If the address does not
match the slave address of a device, it not-acknowledges (NACKs) the master by letting SDA be pulled High.
ACKs also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs
after every data byte is successfully received. When the master is reading data, the master ACKs after every
data byte is received to let the slave know it wants to receive another data byte. When the master wants to stop
reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus
begins with either a START condition or a REPEATED-START condition. All communication on the bus ends
with a STOP condition. A READ is shown in Figure 19 and a WRITE is shown in Figure 20.
P
1
A
C
K
Data
SDA Line
S
Register
Address
Slave
Address
7-bit Address
Data
P
0
A
C
K
Bus Activity:
Slave
Stop
Bus Activity:
Master
Start
Figure 19. Serial Control Bus — READ
A
C
K
A
C
K
Figure 20. Serial Control Bus — WRITE
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SDA
tf
tHD;STA
tLOW
tr
tr
tBUF
tf
SCL
tSU;STA
tHD;STA
tHIGH
tHD;DAT
START
tSU;STO
tSU;DAT
STOP
REPEATED
START
START
Figure 21. Basic Operation
The I2C master located at the deserializer must support I2C clock stretching. For more information on I2C
interface requirements and throughput considerations, refer to AN-2173 I2C Communication Over FPD-Link III
with Bidirectional Control Channel (SNLA131).
7.5.2 Interrupt Support
Interrupts can be brought out on the INTB pin as controlled by the INTERRUPT_CTL 0x23 and
INTERRUPT_STS 0x24 registers. The main interrupt control registers provide control and status for interrupts
from each of the two FPD3 receive ports. Clearing interrupt conditions requires reading the associated status
register for the source. The setting of the individual interrupt status bits is not dependent on the related interrupt
enable controls. The interrupt enable controls whether an interrupt is generated based on the condition, but does
not prevent the interrupt status assertion.
For an interrupt to be generated based on one of the interrupt status assertions, both the individual interrupt
enable and the INT_EN control must be set in the INTERRUPT_CTL 0x23 register. For example, to generate an
interrupt if IS_RX0 is set, both the IE_RX0 and INT_EN bits must be set. If IE_RX0 is set but INT_EN is not, the
INT status is indicated in the INTERRUPT_STS register, and the INTB pin does not indicate the interrupt
condition.
See INTERRUPT_CTL 0x23 and INTERRUPT_STS 0x24 in Table 9 for details.
7.5.2.1 Code Example to Enable Interrupts
# RX0/1 INTERRUPT_CTL enable
# "RX0 INTERRUPT_CTL enable"
WriteI2C(0x4C,0x01) # RX0
WriteI2C(0x23,0x81) # RX0 & INTB PIN EN
# "RX1 INTERRUPT_CTL enable"
WriteI2C(0x4C,0x12) # RX1
WriteI2C(0x23,0x82) # RX1 & INTB PIN EN
7.5.2.2 FPD-Link III Receive Port Interrupts
For each FPD-Link III receive port, multiple options are available for generating interrupts. Interrupt generation is
controlled via the PORT_ICR_HI 0xD8 and PORT_ICR_LO 0xD9 registers. In addition, the PORT_ISR_HI 0xDA
and PORT_ISR_LO 0xDB registers provide read-only status for the interrupts. Clearing of interrupt conditions is
handled by reading the RX_PORT_STS and RX_PORT_STS2 registers. The status bits in the PORT_ISR_HI/LO
registers are copies of the associated bits in the main status registers.
To enable interrupts from one of the receive port interrupt sources:
1. Enable the interrupt source by setting the appropriate interrupt enable bit in the PORT_ICR_HI or
PORT_ICR_LO register
2. Set the RX port X Interrupt control bit (IE_RXx) in the INTERRUPT_CTL register
3. Set the INT_EN bit in the INTERRUPT_CTL register to allow the interrupt to assert the INTB pin low
To clear interrupts from one of the receive port interrupt sources:
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1. (optional) Read the INTERRUPT_STS register to determine which RX port caused the interrupt
2. (optional) Read the PORT_ISR_HI and PORT_ISR_LO registers to determine source of interrupt
3. Read the appropriate RX_PORT_STS1, RX_PORT_STS2 register to clear the interrupt.
The first two steps are optional. The interrupt could be determined and cleared by just reading the status
registers.
7.5.2.3 Code Example to Readback Interrupts
INTERRUPT_STS = ReadI2C(0x24) # 0x24 INTERRUPT_STS
if ((INTERRUPT_STS & 0x80) >> 7):
print "# GLOBAL INTERRUPT DETECTED "
if ((INTERRUPT_STS & 0x02) >> 1):
print "# IS_RX1 DETECTED "
if ((INTERRUPT_STS & 0x01) ):
print "# IS_RX0 DETECTED "
# "################################################"
# "RX0 status"
# "################################################"
WriteReg(0x4C,0x01) # RX0
PORT_ISR_LO = ReadI2C(0xDB)
print "0xDB PORT_ISR_LO : ", hex(PORT_ISR_LO) # readout; cleared by RX_PORT_STS2
if ((PORT_ISR_LO & 0x04) >> 2):
print "# IS_FPD3_PAR_ERR DETECTED "
if ((PORT_ISR_LO & 0x02) >> 1):
print "# IS_PORT_PASS DETECTED "
if ((PORT_ISR_LO & 0x01) ) :
print "# IS_LOCK_STS DETECTED "
################################################
PORT_ISR_HI = ReadI2C(0xDA)
print "0xDA PORT_ISR_HI : ", hex(PORT_ISR_HI) # readout; cleared by RX_PORT_STS2
if ((PORT_ISR_HI & 0x04) >> 2):
print "# IS_FPD3_ENC_ERR DETECTED "
if ((PORT_ISR_HI & 0x02) >> 1):
print "# IS_BCC_SEQ_ERR DETECTED "
if ((PORT_ISR_HI & 0x01) ) :
print "# IS_BCC_CRC_ERR DETECTED "
################################################
RX_PORT_STS1 = ReadI2C(0x4D) # R/COR
elif ((RX_PORT_STS1 & 0xc0) >> 6) == 1:
print "# RX_PORT_NUM = RX1"
elif ((RX_PORT_STS1 & 0xc0) >> 6) == 0:
print "# RX_PORT_NUM = RX0"
if ((RX_PORT_STS1 & 0x20) >> 5):
print "# BCC_CRC_ERR DETECTED "
if ((RX_PORT_STS1 & 0x10) >> 4):
print "# LOCK_STS_CHG DETECTED "
if ((RX_PORT_STS1 & 0x08) >> 3):
print "# BCC_SEQ_ERROR DETECTED "
if ((RX_PORT_STS1 & 0x04) >> 2):
print "# PARITY_ERROR DETECTED "
if ((RX_PORT_STS1 & 0x02) >> 1):
print "# PORT_PASS=1 "
if ((RX_PORT_STS1 & 0x01) ):
print "# LOCK_STS=1 "
################################################
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RX_PORT_STS2 = ReadI2C(0x4E)
if ((RX_PORT_STS2 & 0x20) >> 5):
print "# FPD3_ENCODE_ERROR DETECTED "
if ((RX_PORT_STS2 & 0x04) >> 2):
print "# FREQ_STABLE DETECTED "
if ((RX_PORT_STS2 & 0x02) >> 1):
print "# NO_FPD3_CLK DETECTED "
################################################
# "################################################"
# "RX1 status"
# "################################################"
WriteReg(0x4C,0x12) # RX1
PORT_ISR_LO = ReadI2C(0xDB) # PORT_ISR_LO readout; cleared by RX_PORT_STS2
if ((PORT_ISR_LO & 0x04) >> 2):
print "# IS_FPD3_PAR_ERR DETECTED "
if ((PORT_ISR_LO & 0x02) >> 1):
print "# IS_PORT_PASS DETECTED "
if ((PORT_ISR_LO & 0x01) ) :
print "# IS_LOCK_STS DETECTED "
################################################
PORT_ISR_HI = ReadI2C(0xDA) # readout; cleared by RX_PORT_STS2
if ((PORT_ISR_HI & 0x04) >> 2):
print "# IS_FPD3_ENC_ERR DETECTED "
if ((PORT_ISR_HI & 0x02) >> 1):
print "# IS_BCC_SEQ_ERR DETECTED "
if ((PORT_ISR_HI & 0x01) ) :
print "# IS_BCC_CRC_ERR DETECTED "
################################################
RX_PORT_STS1 = ReadI2C(0x4D) # R/COR
elif ((RX_PORT_STS1 & 0xc0) >> 6) == 1:
print "# RX_PORT_NUM = RX1"
elif ((RX_PORT_STS1 & 0xc0) >> 6) == 0:
print "# RX_PORT_NUM = RX0"
if ((RX_PORT_STS1 & 0x20) >> 5):
print "# BCC_CRC_ERR DETECTED "
if ((RX_PORT_STS1 & 0x10) >> 4):
print "# LOCK_STS_CHG DETECTED "
if ((RX_PORT_STS1 & 0x08) >> 3):
print "# BCC_SEQ_ERROR DETECTED "
if ((RX_PORT_STS1 & 0x04) >> 2):
print "# PARITY_ERROR DETECTED "
if ((RX_PORT_STS1 & 0x02) >> 1):
print "# PORT_PASS=1 "
if ((RX_PORT_STS1 & 0x01) ):
print "# LOCK_STS=1 "
################################################
RX_PORT_STS2 = ReadI2C(0x4E)
if ((RX_PORT_STS2 & 0x20) >> 5):
print "# FPD3_ENCODE_ERROR DETECTED "
if ((RX_PORT_STS2 & 0x04) >> 2):
print "# FREQ_STABLE DETECTED "
if ((RX_PORT_STS2 & 0x02) >> 1):
print "# NO_FPD3_CLK DETECTED "
################################################
30
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7.5.2.4 Built-In Self Test (BIST)
An optional at-speed BIST feature supports testing of the high-speed serial link and the back channel without
external data connections. This is useful in the prototype stage, equipment production, in-system test, and
system diagnostics.
7.5.2.4.1 BIST Configuration and Status
The BIST mode is enabled by BIST configuration register 0xB3. The test may select either an external PCLK or
the internal oscillator clock (OSC) frequency in the serializer. In the absence of PCLK, the user can select the
internal OSC frequency at the deserializer through the BIST configuration register. When BIST is activated at the
deserializer, a BIST enable signal is sent to the serializer through the back channel. The serializer outputs a
continuous stream of a pseudo-random sequence and drives the link at speed. The deserializer detects the test
pattern and monitors it for errors. The serializer also tracks errors indicated by the CRC fields in each back
channel frame. While the lock indications are required to identify the beginning of proper data reception, for any
link failures or data corruption, the best indication is the contents of the error counter in the BIST_ERR_COUNT
register 0x57 for each RX port.
The clock frequency that is output onto the PCLK pin during BIST mode is based on an internal FPD-Link III
clock, and may not match the expected PCLK coming from the serializer.
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7.6 Register Maps
In the register definitions under the TYPE and DEFAULT heading, the following definitions apply:
• R = Read only access
• R/W = Read / Write access
• R/RC = Read only access, Read to Clear
• (R/W)/SC = Read / Write access, Self-Clearing bit
• (R/W)/S = Read / Write access, Set based on strap pin configuration at startup
• LL = Latched Low and held until read
• LH = Latched High and held until read
• S = Set based on strap pin configuration at startup
7.6.1 Register Description
The DS90UB934-Q1 implements the following register blocks, accessible via I2C as well as the bi-directional
control channel:
• Main registers
• FPD3 RX port registers (separate register block for each of the two RX ports)
• DVP port registers
Table 8. Main Register Map Descriptions
ADDRESS
RANGE
DESCRIPTION
ADDRESS MAP
0x00-0x31
Digital Shared Registers
0x32-0x3A
Reserved
0x3B-0x3F
Digital DVP Registers
0x4C-0x7F
Digital RX Port Registers
(paged)
0x80-0xAF
Reserved
0xB0-0xB2
Indirect Access Registers
Shared
0xB0-0xBF
Digital Share Registers
Shared
0xC0-0xCF
Reserved
0xD0-0xDF
Digital RX Port Test Mode Registers
0xE0-0xEF
Reserved
0xF0-0xF5
FPD3 RX ID
0xF6-0xF7
Reserved
0xF8-0xFB
Port I2C Addressing
0xFC-0xFF
Reserved
32
Shared
Reserved
Shared
FPD3 RX Port 0
R: 0x4C[5:4]=00
W: 0x4C[0]=1
FPD3 RX Port 1
R: 0x4C[5:4]=01
W: 0x4C[1]=1
Reserved
Reserved
FPD3 RX Port 0
FPD3 RX Port 1
Reserved
Shared
Reserved
Shared
Reserved
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Table 9. Serial Control Bus Registers
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Share
0x00
I2C Device ID
7:1
DEVICE ID
(R/W)/S 0x3D
7-bit I2C ID of deserializer
Defaults to address configured by IDX strap
pin.
This field always indicates the current value of
the I2C ID. When bit 0 of this register is 0, this
field is read-only and shows the strapped ID.
When bit 1 of this register is 1, this field is
read/write and can be used to assign any valid
I2C ID.
0
DES ID
R/W
0x0
0: Device ID is from IDX strap pin
1: Register I2C device ID overrides strapped
value
7:3
RESERVED
R/W
0x0
Reserved
2
RESTART_AUTOLO
AD
(R/W)/S 0x0
C
Restart ROM auto-load
Setting this bit to 1 causes a re-load of the
ROM. This bit is self-clearing. Software may
check for auto-load complete by checking the
CFG_INIT_DONE bit in the DEVICE_STS
register.
1
DIGITAL RESET1
(R/W)/S 0x0
C
Digital reset
Resets the entire digital block including
registers. This bit is self-clearing.
1: Reset
0: Normal operation
0
DIGITAL RESET0
(R/W)/S 0x0
C
Digital reset
Resets the entire digital block except registers.
This bit is self-clearing.
1: Reset
0: Normal operation
Share
Share
0x01
0x02
Reset
General Configuration 7
Default Description
INPUT_PORT_OVER R/W
RIDE
0x0
Input port override bit allows control of the
input port selection via the INPUT_PORT_SEL
bit in this register.
6
INPUT_PORT_SEL
R/W
0x0
Input port select. This bit either controls the
input mode (if INPUT_PORT_OVERRIDE is
set) or indicates the status of the SEL pin.
5
OUTPUT_OVERRID
E
R/W
0x0
Output Control Override bit. The
OUTPUT_ENABLE and
OUTPUT_SLEEP_STATE_SEL values
typically come from the device input pins. If this
bit is set, the register values in this register will
be used instead.
4
RESERVED
R/W
0x1
Reserved
3
OUTPUT_ENABLE
R/W
0x1
Output enable control (in conjunction with
output sleep state select)
If OUTPUT_SLEEP_STATE_SEL is set to 1
and this bit is set to 0, the TX outputs will be
forced into a high impedance state. If
OUTPUT_OVERRIDE is 0, this register
indicates the value on the OEN pin. See
Table 3.
2
OUTPUT_SLEEP_ST R/W
ATE_SEL
0x1
OSS Select controls the output state when
LOCK is low (used in conjunction with Output
Enable)
When this bit is set to 0, the TX outputs is
forced into a HS-0 state. If
OUTPUT_OVERRIDE is 0, this register
indicates the value on the OSS_SEL pin. See
Table 3.
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Share
0x03
Revision/Mask ID
Share
0x04
DEVICE_STS
Bit(s)
Field
Type
Default Description
1
RX_PARITY_CHECK R/W
ER_EN
0x1
FPD3 Receiver Parity Checker Enable. When
enabled, the parity check function is enabled
for the FPD3 receiver. This allows detection of
errors on the FPD3 receiver data bits.
0: Disable
1: Enable
0
Reserved
R/W
0x0
Reserved
7:4
REVISION_ID
R
0x0
Revision ID
0000: Production release
3:0
RESERVED
R
0x0
Reserved
7
CFG_CKSUM_STS
R
0x1
Config Checksum passed
This bit is set following initialization if the
configuration data in the eFuse ROM had a
valid checksum
6
CFG_INIT_DONE
R
0x1
Power-up initialization complete
This bit is set after Initialization is complete.
Configuration from eFuse ROM has completed.
5:4
RESERVED
R
0x0
Reserved
3
PASS
R, LH
0x0
Device PASS status This bit indicates the
PASS status for the device. The value in this
register matches the indication on the PASS
pin.
2
LOCK
R, LH
0x0
Device LOCK status This bit indicates the
LOCK status for the device. The value in this
register matches the indication on the LOCK
pin.
1:0
RESERVED
R
0x0
Reserved
7:0
PAR_ERR_THOLD_
HI
R/W
0x01
FPD3 parity error threshold high byte
This register provides the 8 most significant
bits of the parity error threshold value. For
each port, if the FPD-Link III receiver detects a
number of parity errors greater than or equal to
this value, the PARITY_ERROR flag is set in
the RX_PORT_STS1 register.
Share
0x05
PAR_ERR_THOLD_
HI
Share
0x06
PAR_ERR_THOLD_L 7:0
O
PAR_ERR_THOLD_L R/W
O
0x0
FPD3 parity error threshold low byte
This register provides the 8 least significant
bits of the parity error threshold value. For
each port, if the FPD-Link III receiver detects a
number of parity errors greater than or equal to
this value, the PARITY_ERROR flag is set in
the RX_PORT_STS1 register.
Share
0x07
BCC Watchdog
Control
7:1
BCC WATCHDOG
TIMER
R/W
0x7F
The watchdog timer allows termination of a
control channel transaction if it fails to
complete within a programmed amount of time.
This field sets the bidirectional control channel
watchdog timeout value in units of 2
milliseconds. Do not set this field to 0.
0
BCC WATCHDOG
TIMER DISABLE
R/W
0x0
Disable bidirectional control channel watchdog
timer
1: Disables BCC watchdog timer operation
0: Enables BCC watchdog timer operation
7
LOCAL WRITE
DISABLE
R/W
0x0
Disable remote writes to local registers
Setting this bit to a 1 prevents remote writes to
local device registers from across the control
channel. This prevents writes to the
deserializer registers from an I2C master
attached to the serializer. Setting this bit does
not affect remote access to I2C slaves at the
deserializer.
Share
34
0x08
I2C Control 1
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Table 9. Serial Control Bus Registers (continued)
Page
Share
Share
Addr
(hex)
0x09
0x0A
Register Name
I2C Control 2
SCL High Time
Bit(s)
Field
Type
Default Description
6:4
I2C SDA HOLD
R/W
0x1
Internal SDA hold time
This field configures the amount of internal
hold time provided for the SDA input relative to
the SCL input. Units are 50 nanoseconds.
3:0
I2C FILTER DEPTH
R/W
0xC
I2C glitch filter depth
This field configures the maximum width of
glitch pulses on the SCL and SDA inputs that
will be rejected. Units are 5 nanoseconds.
7:4
SDA Output Setup
R/W
0x1
Remote Ack SDA output setup
When a control channel (remote) access is
active, this field configures setup time from the
SDA output relative to the rising edge of SCL
during ACK cycles. Setting this value will
increase setup time in units of 640ns. The
nominal output setup time value for SDA to
SCL when this field is 0 is 80 ns.
3:2
SDA Output Delay
R/W
0x0
SDA output delay
This field configures additional delay on the
SDA output relative to the falling edge of SCL.
Setting this value increases output delay in
units of 40 ns. Nominal output delay values for
SCL to SDA are:
00: 240 ns
01: 280 ns
10: 320 ns
11: 360 ns
1
I2C BUS TIMER
SPEEDUP
R/W
0x0
Speed up I2C bus watchdog timer
1: Watchdog Timer expires after approximately
50 microseconds
0: Watchdog Timer expires after approximately
1 second.
0
I2C BUS TIMER
DISABLE
R/W
0x0
Disable I2C bus watchdog timer
When enabled the I2C Watchdog Timer may
be used to detect when the I2C bus is free or
hung up following an invalid termination of a
transaction. If SDA is high and no signaling
occurs for approximately 1 second, the I2C bus
is assumed to be free. If SDA is low and no
signaling occurs, the device will attempt to
clear the bus by driving 9 clocks on SCL.
7:0
SCL HIGH TIME
R/W
0x7A
I2C Master SCL high time
This field configures the high pulse width of the
SCL output when the Serializer is the Master
on the local I2C bus. Units are 40 ns for the
nominal oscillator clock frequency. The default
value is set to approximately 100 kHz with the
internal oscillator clock running at nominal 25
MHz. Delay includes 4 additional oscillator
clock periods.
Nominal High Time = 40 ns × (TX_SCL_HIGH
+ 4)
The internal oscillator has ±10% variation
which must be taken into account when setting
the SCL High and Low Time registers.
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
Share
0x0B
SCL Low Time
7:0
SCL LOW TIME
R/W
0x7A
I2C SCL low time
This field configures the low pulse width of the
SCL output when the serializer is the master
on the local I2C bus. This value is also used as
the SDA setup time by the I2C Slave for
providing data prior to releasing SCL during
accesses over the Bidirectional control
channel. Units are 40 ns for the nominal
oscillator clock frequency. The default value is
set to approximately 100 kHz with the internal
oscillator clock running at nominal 25 MHz.
Delay includes 4 additional clock periods.
Nominal low time = 40 ns × (TX_SCL_LOW +
4)
The internal oscillator has ±10% variation
which must be taken into account when setting
the SCL High and Low Time registers.
Share
0x0C
RESERVED
7:0
RESERVED
R/W
0x0
Reserved
Share
0x0D
IO_CTL
7
SEL3P3V
R/W
0x0
3.3-V I/O Select on pins INTB, I2C
0: 1.8-V I/O Supply
1: 3.3-V I/O Supply
If IO_SUPPLY_MODE_OV is 0, a read of this
register returns the detected I/O voltage level.
6
IO_SUPPLY_MODE_ R/W
OV
0x0
Override I/O Supply Mode bit
If set to 0, the detected voltage level is used
for both SEL3P3V and IO_SUPPLY_MODE
controls.
If set to 1, the values written to the SEL3P3V
and IO_SUPPLY_MODE fields is used.
5:4
IO_SUPPLY_MODE
R/W
0x0
I/O supply mode
00: 1.8 V
11: 3.3 V
If IO_SUPPLY_MODE_OV is 0, a read of this
register returns the detected I/O voltage level.
3:0
RESERVED
R/W
0x9
Reserved
7:4
RESERVED
R/W
0x0
Reserved
3:0
GPIO_STS
R
0x0
GPIO pin status
This register reads the current values on each
of the 4 GPIO pins. Bit 3 reads GPIO3 and bit
0 reads GPIO0.
7:4
RESERVED
R/W
0x7
Reserved
3
GPIO3_INPUT_EN
R/W
0x1
GPIO3 input enable
0: Disabled
1: Enabled
2
GPIO2_INPUT_EN
R/W
0x1
GPIO2 input enable
0: Disabled
1: Enabled
1
GPIO1_INPUT_EN
R/W
0x1
GPIO1 input enable
0: Disabled
1: Enabled
0
GPIO0_INPUT_EN
R/W
0x1
GPIO0 input enable
0: Disabled
1: Enabled
Share
Share
36
0x0E
0x0F
GPIO_PIN_STS
GPIO_INPUT_CTL
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
Share
0x10
GPIO0_PIN_CTL
7:5
GPIO0_OUT_SEL
R/W
0x0
GPIO0 output select
Determines the output data for the selected
source.
If GPIO0_OUT_SRC is set to 0xx (one of the
RX Ports), the following selections apply:
000 : Received GPIO0
001 : Received GPIO1
010 : Received GPIO2
011 : Received GPIO3
100 : RX port lock indication
101 : RX port pass indication
110- 111 : Reserved
If GPIO0_OUT_SRC is set to 100 (Device
Status), the following selections apply:
000 : Value in GPIO0_OUT_VAL
001 : Logical OR of Lock indication from
enabled RX ports
010 : Logical AND of Lock indication from
enabled RX ports
011 : Logical AND of Pass indication from
enabled RX ports
100 : FrameSync signal
101 - 111 : Reserved
4:2
GPIO0_OUT_SRC
R/W
0x0
GPIO0 Output source select
Selects output source for GPIO0 data:
000 : RX Port 0
001 : RX Port 1
01x : Reserved
100 : Device status
101 - 111 : Reserved
1
GPIO0_OUT_VAL
R/W
0x0
GPIO0 output value
This register provides the output data value
when the GPIO pin is enabled to output the
local register controlled value.
0
GPIO0_OUT_EN
R/W
0x0
GPIO0 Output Enable
0: Disabled
1: Enabled
7:5
GPIO1_OUT_SEL
R/W
0x0
GPIO1 Output Select
Determines the output data for the selected
source.
If GPIO1_OUT_SRC is set to 0xx (one of the
RX Ports), the following selections apply:
000 : Received GPIO0
001 : Received GPIO1
010 : Received GPIO2
011 : Received GPIO3
100 : RX Port Lock indication
101 : RX Port Pass indication
110- 111 : Reserved
If GPIO1_OUT_SRC is set to 100 (Device
Status), the following selections apply:
000 : Value in GPIO1_OUT_VAL
001 : Logical OR of Lock indication from
enabled RX ports
010 : Logical AND of Lock indication from
enabled RX ports
011 : Logical AND of Pass indication from
enabled RX ports
100 : FrameSync signal
101 - 111 : Reserved
Share
0x11
GPIO1_PIN_CTL
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Table 9. Serial Control Bus Registers (continued)
Page
Share
38
Addr
(hex)
0x12
Register Name
GPIO2_PIN_CTL
Bit(s)
Field
Type
Default Description
4:2
GPIO1_OUT_SRC
R/W
0x0
GPIO1 Output Source Select
Selects output source for GPIO1 data:
000 : RX port 0
001 : RX port 1
01x : Reserved
100 : Device status
101 - 111 : Reserved
1
GPIO1_OUT_VAL
R/W
0x0
GPIO1 output value
This register provides the output data value
when the GPIO pin is enabled to output the
local register controlled value.
0
GPIO1_OUT_EN
R/W
0x0
GPIO1 output enable
0: Disabled
1: Enabled
7:5
GPIO2_OUT_SEL
R/W
0x0
GPIO2 output select
Determines the output data for the selected
source.
If GPIO2_OUT_SRC is set to 0xx (one of the
RX Ports), the following selections apply:
000 : Received GPIO0
001 : Received GPIO1
010 : Received GPIO2
011 : Received GPIO3
100 : RX port lock indication
101 : RX port pass indication
110- 111 : Reserved
If GPIO2_OUT_SRC is set to 100 (Device
Status), the following selections apply:
000 : Value in GPIO2_OUT_VAL
001 : Logical OR of Lock indication from
enabled RX ports
010 : Logical AND of Lock indication from
enabled RX ports
011 : Logical AND of Pass indication from
enabled RX ports
100 : FrameSync signal
101 - 111 : Reserved
4:2
GPIO2_OUT_SRC
R/W
0x0
GPIO2 output source select
Selects output source for GPIO2 data:
000 : RX port 0
001 : RX port 1
01x : Reserved
100 : Device status
101 - 111 : Reserved
1
GPIO2_OUT_VAL
R/W
0x0
GPIO2 output value
This register provides the output data value
when the GPIO pin is enabled to output the
local register controlled value.
0
GPIO2_OUT_EN
R/W
0x0
GPIO2 output enable
0: Disabled
1: Enabled
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SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
Share
0x13
GPIO3_PIN_CTL
7:5
GPIO3_OUT_SEL
R/W
0x0
GPIO3 output select
Determines the output data for the selected
source.
If GPIO3_OUT_SRC is set to 0xx (one of the
RX Ports), the following selections apply:
000 : Received GPIO0
001 : Received GPIO1
010 : Received GPIO2
011 : Received GPIO3
100 : RX port lock indication
101 : RX port pass indication
110- 111 : Reserved
If GPIO2_OUT_SRC is set to 100 (Device
Status), the following selections apply:
000 : Value in GPIO3_OUT_VAL
001 : Logical OR of lock indication from
enabled RX ports
010 : Logical AND of lock indication from
enabled RX ports
011 : Logical AND of pass indication from
enabled RX ports
100 : FrameSync signal
101 - 111 : Reserved
4:2
GPIO3_OUT_SRC
R/W
0x0
GPIO3 output source select
Selects output source for GPIO3 data:
000 : RX port 0
001 : RX port 1
01x : Reserved
100 : Device Status
101 - 111 : Reserved
1
GPIO3_OUT_VAL
R/W
0x0
GPIO3 output value
This register provides the output data value
when the GPIO pin is enabled to output the
local register controlled value.
0
GPIO3_OUT_EN
R/W
0x0
GPIO3 output enable
0: Disabled
1: Enabled
Share
0x14 - RESERVED
0x17
7:0
RESERVED
R/W
0x0
Reserved
Share
0x18
7:4
FS_MODE
R/W
0x0
FrameSync mode
0000: Internal generated FrameSync, use
back-channel frame clock from port 0
0001: Internal generated FrameSync, use
back-channel frame clock from port 1
0010 : Reserved
0011: Reserved
01xx: Internal generated FrameSync, use 25MHz (typical) clock
1000: External FrameSync from GPIO0
1001: External FrameSync from GPIO1
1010: External FrameSync from GPIO2
1011: External FrameSync from GPIO3
1100 - 1111: Reserved
3
FS_SINGLE
(R/W)/S 0x0
C
Generate single FrameSync pulse
When this bit is set, a single FrameSync pulse
is generated. The system waits for the full
duration of the desired pulse before generating
another pulse. When using this feature, the
FS_GEN_ENABLE bit remains set to 0. This
bit is self-clearing and always returns to 0.
2
FS_INIT_STATE
R/W
Initial State
This register controls the initial state of the
FrameSync signal.
0: FrameSync initial state is 0
1: FrameSync initial state is 1
FS_CTL
0x0
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
1
FS_GEN_MODE
R/W
0x0
FrameSync Generation Mode
This control selects between Hi/Lo and 50/50
modes. In High/Lo mode, the FrameSync
generator uses the FS_HIGH_TIME and
FS_LOW_TIME register values to separately
control the high and low periods for the
generated FrameSync signal. In 50/50 mode,
the FrameSync generator uses the values in
the FS_HIGH_TIME_0, FS_LOW_TIME_1 and
FS_LOW_TIME_0 registers as a 24-bit value
for both the high and low periods of the
generated FrameSync signal.
0: Hi/Lo
1: 50/50
0
FS_GEN_ENABLE
R/W
0x0
FrameSync generation enable
0: Disabled
1: Enabled
Share
0x19
FS_HIGH_TIME_1
7:0
FRAMESYNC_HIGH
_TIME_1
R/W
0x0
FrameSync high time bits 15:8
The value programmed to the FS_HIGH_TIME
register should be reduced by 1 from the
desired delay. For example, a value of 0 in the
FRAMESYNC_HIGH_TIME field results in a 1
cycle high pulse on the FrameSync signal.
Share
0x1A
FS_HIGH_TIME_0
7:0
FRAMESYNC_HIGH
_TIME_0
R/W
0x0
FrameSync High Time bits 7:0
The value programmed to the FS_HIGH_TIME
register should be reduced by 1 from the
desired delay. For example, a value of 0 in the
FRAMESYNC_HIGH_TIME field results in a 1
cycle high pulse on the FrameSync signal.
Share
0x1B
FS_LOW_TIME_1
7:0
FRAMESYNC_LOW_ R/W
TIME_1
0x0
FrameSync Low Time bits 15:8
The value programmed to the FS_LOW_TIME
register should be reduced by 1 from the
desired delay. For example, a value of 0 in the
FRAMESYNC_LOW_TIME field results in a 1
cycle low pulse on the FrameSync signal.
Share
0x1C
FS_LOW_TIME_0
7:0
FRAMESYNC_LOW_ R/W
TIME_0
0x0
FrameSync Low Time bits 7:0
The value programmed to the FS_LOW_TIME
register should be reduced by 1 from the
desired delay. For example, a value of 0 in the
FRAMESYNC_LOW_TIME field results in a 1
cycle low pulse on the FrameSync signal.
Share
0x1D - RESERVED
0x22
7:0
RESERVED
R
0x00
Reserved
Share
0x23
7
INT_EN
R/W
0x0
Global interrupt enable
Enables interrupt on the interrupt signal to the
controller.
6:2
RESERVED
R/W
0x0
Reserved
1
IE_RX1
R/W
0x0
RX port 1 Interrupt:
Enable interrupt from receiver port 1.
0
IE_RX0
R/W
0x0
RX Port 0 Interrupt:
Enable interrupt from receiver port 0.
7
INT
R
0x0
Global Interrupt:
Set if any enabled interrupt is indicated in the
individual status bits in this register. The
setting of this bit is not dependent on the
INT_EN bit in the INTERRUPT_CTL register
but does depend on the IE_xxx bits. For
example, if IE_RX0 and IS_RX0 are both
asserted, the INT bit is set to 1.
6:2
RESERVED
R
0x0
Reserved
Share
40
0x24
INTERRUPT_CTL
INTERRUPT_STS
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Table 9. Serial Control Bus Registers (continued)
Page
Share
Addr
(hex)
0x25
Register Name
FS_CONFIG
Bit(s)
Field
Type
Default Description
1
IS_RX1
R
0x0
RX port 1 interrupt:
An interrupt has occurred for receive port 1.
This interrupt is cleared by reading the
associated status register(s) for the event(s)
that caused the interrupt. The status registers
are RX_PORT_STS1 and RX_PORT_STS2.
0
IS_RX0
R
0x0
RX Port 0 Interrupt:
An interrupt has occurred for receive port 0.
This interrupt is cleared by reading the
associated status register(s) for the event(s)
that caused the interrupt. The status registers
are RX_PORT_STS1 and RX_PORT_STS2.
7
RESERVED
R/W
0x0
Reserved
6
FS_POLARITY
R/W
0x0
Framesync Polarity
Indicates active edge of FrameSync signal
0: Rising edge
1: Falling edge
5:0
RESERVED
R/W
0x00
Reserved
Share
0x26 - RESERVED
0x3A
7:0
RESERVED
R/W
0x00
Reserved
DVP
0x3B
7:1
RESERVED
R/W
0x00
Reserved
0
RRFB
R/W
0x1
Pixel clock edge select (relative to the sink)
1: Parallel interface data is driven on the falling
clock edge and sampled on the rising clock
edge
0: Parallel interface data is driven on the rising
clock edge and sampled on the falling clock
edge
7:5
RESERVED
R/W
0x0
Reserved
4:0
FPD3_FREQ_LO_TH R/W
R
0x14
Frequency low threshold
Sets the low threshold for the CDR Clock
frequency detect circuit in MHz. This value is
used to determine if the clock frequency is too
low for proper operation.
7:6
RESERVED
R
0x0
Reserved
5
RESERVED
R/W
0x0
Reserved
4
SSCG_ENABLE
R/W
0x0
Enable SSCG modulation
0 : SSCG modulation is disabled
1 : SSCG modulation is enabled
Prior to enabling SSCG, the
SSCG_MOD_RATE must be set. This requires
a separate write to set the SSCG_MOD_RATE
with SSCG disabled, then a write to set the
SSCG_ENABLE with the same
SSCG_MOD_RATE setting. In addition, when
changing the SSCG_MOD_RATE, disable the
SSCG first.
3:1
RESERVED
R/W
0x0
Reserved
0
SSCG_MOD_RATE
R/W
0x0
SSCG modulation frequency with its deviation
0: Reserved
1: frequency modulation PCLK/3168 ±1%
7:0
RESERVED
R/W
0x00
Reserved
DVP
DVP
Share
0x3C
0x3E
DVP_CLK_CTL
DVP_FREQ_DET0
DVP_SSCG_CTL
0x44 - RESERVED
0x4B
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
Share
0x4C
FPD3_PORT_SEL
7:6
PHYS_PORT_NUM
R
0x0
5
RESERVED
4
RX_READ_PORT
R/W
0x0
Select RX port for register read
This bit selects one of the two RX port register
blocks for readback. This applies to all paged
FPD3 receiver port registers.
0: Port 0 registers
1: Port 1 registers
When accessed via local I2C interfaces, the
default setting is 0. When accessed via
bidirectional control channel, the default value
is the port number of the receive port
connection.
3:2
RESERVED
R/W
0x0
Reserved
1
RX_WRITE_PORT_1 R/W
0x0
Write Enable for RX port 1 registers
This bit enables writes to RX port 1 registers.
Any combination of RX port registers can be
written simultaneously. This applies to all
paged FPD3 Receiver port registers.
0: Writes disabled
1: Writes enabled
When accessed via bidirectional control
channel, the default value is 1 if accessed over
RX port 1.
0
RX_WRITE_PORT_0 R/W
0x0
Write Enable for RX port 0 registers
This bit enables writes to RX port 0 registers.
Any combination of RX port registers can be
written simultaneously. This applies to all
paged FPD3 receiver port registers.
0: Writes disabled
1: Writes enabled
When accessed via Bidirectional Control
Channel, the default value is 1 if accessed
over RX port 0.
7
RESERVED
R
0x0
Reserved
6
RX_PORT_NUM
R
0x0
RX port number
This read-only field indicates the number of the
currently selected RX read port.
5
BCC_CRC_ERROR
R, LH
0x0
Bidirectional control channel CRC error
detected
This bit indicates a CRC error has been
detected in the forward control channel. If this
bit is set, an error may have occurred in the
control channel operation. This bit is cleared
on read.
4
LOCK_STS_CHG
R, LH
0x0
Lock status changed
This bit is set if a change in receiver lock
status has been detected since the last read of
this register. Current lock status is available in
the LOCK_STS bit of this register
This bit is cleared on read.
RX
42
0x4D
RX_PORT_STS1
Physical port number
This field provides the physical port connection
when reading from a remote device via the
bidirectional control channel.
When accessed via local I2C interfaces, the
value returned is always 0. When accessed via
bidirectional control channel, the value
returned is the port number of the receive port
connection.
Reserved
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Table 9. Serial Control Bus Registers (continued)
Page
RX
Addr
(hex)
0x4E
Register Name
RX_PORT_STS2
Bit(s)
Field
Type
Default Description
3
BCC_SEQ_ERROR
R, LH
0x0
Bidirectional control channel sequence error
detected
This bit indicates a sequence error has been
detected in the forward control channel. If this
bit is set, an error may have occurred in the
control channel operation. This bit is cleared
on read.
2
PARITY_ERROR
R, LH
0x0
FPD3 parity errors detected
This flag is set when the number of parity
errors detected is greater than the threshold
programmed in the PAR_ERR_THOLD
registers.
1: Number of FPD3 parity errors detected is
greater than the threshold
0: Number of FPD3 parity errors is below the
threshold.
This bit is cleared when the
RX_PAR_ERR_HI/LO registers are cleared.
1
PORT_PASS
R
0x0
Receiver PASS indication This bit indicates the
current status of the Receiver PASS indication.
The requirements for setting the Receiver
PASS indication are controlled by the
PORT_PASS_CTL register.
1: Receive input has met PASS criteria
0: Receive input does not meet PASS criteria
0
LOCK_STS
R
0x0
FPD-Link III receiver is locked to incoming data
1: Receiver is locked to incoming data
0: Receiver is not locked
7:6
RESERVED
R
0x0
Reserved
5
FPD3_ENCODE_ER
ROR
R, LH
0x0
FPD3 encoder error detected
If set, this flag indicates an error in the FPDLink III encoding has been detected by the
FPD-Link III receiver.
This bit is cleared on read.
4:3
RESERVED
R
0x0
Reserved
2
FREQ_STABLE
R
0x0
Frequency measurement stable
1
NO_FPD3_CLK
R
0x0
No FPD-Link III input clock detected
0
RESERVED
R
0x0
Reserved
RX
0x4F
RX_FREQ_HIGH
7:0
FREQ_CNT_HIGH
R
0x0
FPD Link-III frequency measurement high byte
(MHz) The frequency counter reports the
measured frequency for the FPD3 receiver.
This portion of the field is the integer value in
MHz. Frequency measurements scales with
reference clock frequency.
RX
0x50
RX_FREQ_LOW
7:0
FREQ_CNT_LOW
R
0x0
FPD Link-III frequency measurement low byte
(1/256 MHz) The Frequency counter reports
the measured frequency for the FPD3
Receiver. This portion of the field is the
fractional value in 1/256 MHz. Values scales
with reference clock frequency.
RX
0x51
RESERVED
7:0
RESERVED
R
0x0
Reserved
RX
0x52
RESERVED
7:0
RESERVED
R
0x0
Reserved
RX
0x53
RESERVED
7:0
RESERVED
R
0x0
Reserved
RX
0x54
RESERVED
7:0
RESERVED
R
0x0
Reserved
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
RX
0x55
RX_PAR_ERR_HI
7:0
PAR ERROR BYTE 1 R
0x0
Number of FPD3 parity errors – 8 most
significant bits.
The parity error counter registers return the
number of data parity errors that have been
detected on the FPD3 Receiver data since the
last detection of valid lock or last read of the
RX_PAR_ERR_LO register. For accurate
reading of the parity error count, disable the
RX_PARITY_CHECKER_ENABLE bit in
register 0x02 prior to reading the parity error
count registers. This register is cleared upon
reading the RX_PAR_ERR_LO register.
RX
0x56
RX_PAR_ERR_LO
7:0
PAR ERROR BYTE 0 R
0x0
Number of FPD3 parity errors – 8 least
significant bits.
The parity error counter registers return the
number of data parity errors that have been
detected on the FPD3 Receiver data since the
last detection of valid lock or last read of the
RX_PAR_ERR_LO register. For accurate
reading of the parity error count, disable the
RX_PARITY_CHECKER_ENABLE bit in
register 0x02 prior to reading the parity error
count registers. This register will be cleared on
read.
RX
0x57
BIST_ERR_COUNT
7:0
BIST ERROR
COUNT
R
0x0
BIST error count
Returns BIST error count
RX
0x58
BCC_CONFIG
7
I2C PASS
THROUGH ALL
R/W
0x0
I2C pass-through all transactions
0: Disabled
1: Enabled
6
I2C PASS
THROUGH
R/W
0x0
I2C pass-through to serializer if decode
matches
0: Pass-through disabled
1: Pass-through enabled
5
AUTO ACK ALL
R/W
0x0
Automatically acknowledge all I2C writes
independent of the forward channel lock state
or status of the remote acknowledge
1: Enable
0: Disable
4
BACK CHANNEL
ENABLE FOR
CAMERA MODE
R/W
0x1
Back channel enable for camera mode (display
mode BC is always enabled)
1: Enable
0: Disable
3
BC CRC
GENERATOR
ENABLE
R/W
0x1
Back Channel CRC Generator Enable
0: Disable
1: Enable
2
RESERVED
R/W
0x0
Reserved
1:0
BC FREQ SELECT
(R/W)/S 0x0
Back channel frequency select
00: 2.5 Mbps (default)
01: 1.5625 Mbps
10 - 11 : Reserved
Note that changing this setting results in some
errors on the back channel for a short period of
time. If set over the control channel, first
program the deserializer to Auto-Ack operation
to avoid a control channel timeout due to lack
of response from the serializer.
Type
Default Description
RX
0x59
RESERVED
7:0
RESERVED
R/W
0x0
Reserved
RX
0x5A
RESERVED
7:0
RESERVED
R/W
0x0
Reserved
RX
0x5B
SER_ID
7:1
SER ID
R/W
0x00
Remote serializer ID
This field is normally loaded automatically from
the remote serializer.
44
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Table 9. Serial Control Bus Registers (continued)
Page
RX
RX
Addr
(hex)
0x5C
0x5D
Register Name
SER_ALIAS_ID
SlaveID[0]
RX
0x5E
SlaveID[1]
RX
0x5F
SlaveID[2]
RX
0x60
SlaveID[3]
RX
0x61
SlaveID[4]
Bit(s)
Field
Type
Default Description
0
FREEZE DEVICE ID
R/W
0x0
Freeze serializer device ID
Prevent auto-loading of the serializer device ID
from the forward channel. The ID is frozen at
the value written.
7:1
SER ALIAS ID
R/W
0x0
7-bit remote serializer alias ID
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote deserializer. The
transaction will be remapped to the address
specified in the slave ID register. A value of 0
in this field disables access to the remote I2C
slave.
0
SER AUTO ACK
R/W
0x0
Automatically acknowledge all I2C writes to the
remote serializer independent of the forward
channel lock state or status of the remote
serializer acknowledge
1: Enable
0: Disable
7:1
SLAVE ID0
R/W
0x0
7-bit remote slave device ID 0
Configures the physical I2C address of the
remote I2C slave device attached to the
remote serializer. If an I2C transaction is
addressed to the slave alias ID0, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID1
R/W
0x0
7-bit remote slave device ID 1
Configures the physical I2C address of the
remote I2C Slave device attached to the
remote Serializer. If an I2C transaction is
addressed to the slave alias ID1, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID2
R/W
0x0
7-bit remote slave device ID 2
Configures the physical I2C address of the
remote I2C Slave device attached to the
remote Serializer. If an I2C transaction is
addressed to the Slave Alias ID2, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID3
R/W
0x0
7-bit remote slave device ID 3
Configures the physical I2C address of the
remote I2C slave device attached to the
remote serializer. If an I2C transaction is
addressed to the slave alias ID3, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID4
R/W
0x0
7-bit remote slave device ID 4
Configures the physical I2C address of the
remote I2C slave device attached to the
remote Serializer. If an I2C transaction is
addressed to the Slave Alias ID4, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
RX
0x62
SlaveID[5]
RX
0x63
SlaveID[6]
RX
0x64
SlaveID[7]
RX
0x65
SlaveAlias[0]
RX
46
0x66
SlaveAlias[1]
Bit(s)
Field
Type
Default Description
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID5
R/W
0x0
7-bit remote slave device ID 5
Configures the physical I2C address of the
remote I2C slave device attached to the
remote serializer. If an I2C transaction is
addressed to the slave alias ID5, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID6
R/W
0x0
7-bit remote slave device ID 6
Configures the physical I2C address of the
remote I2C slave device attached to the
remote serializer. If an I2C transaction is
addressed to the slave alias ID6, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ID7
R/W
0x0
7-bit remote slave device ID 7
Configures the physical I2C address of the
remote I2C slave device attached to the
remote serializer. If an I2C transaction is
addressed to the slave alias ID7, the
transaction is remapped to this address before
passing the transaction across the bidirectional
control channel to the serializer.
0
RESERVED
R
0x0
Reserved
7:1
SLAVE ALIAS ID0
R/W
0x0
7-bit remote slave device alias ID 0
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID0 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 0
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 0 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:1
SLAVE ALIAS ID1
R/W
0x0
7-bit remote slave device alias ID 1
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID1 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 1
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 1 independent of the forward
channel lock state or status of the remote
serializer acknowledge
1: Enable
0: Disable
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SNLS507B – SEPTEMBER 2016 – REVISED OCTOBER 2018
Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
RX
0x67
SlaveAlias[2]
7:1
SLAVE ALIAS ID2
R/W
0x0
7-bit remote slave device alias ID 2
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID2 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 2
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 2 independent of the forward
channel lock state or status of the remote
serializer acknowledge
1: Enable
0: Disable
7:1
SLAVE ALIAS ID3
R/W
0x0
7-bit remote slave device alias ID 3
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID3 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 3
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 3 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:1
SLAVE ALIAS ID4
R/W
0x0
7-bit remote slave device alias ID 4
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID4 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 4
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 4 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:1
SLAVE ALIAS ID5
R/W
0x0
7-bit remote slave device alias ID 5
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID5 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 5
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 5 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:1
SLAVE ALIAS ID6
R/W
0x0
7-bit remote slave device alias ID 6
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID6 register. A value of 0
in this field disables access to the remote I2C
slave.
RX
RX
RX
RX
0x68
0x69
0x6A
0x6B
SlaveAlias[3]
SlaveAlias[4]
SlaveAlias[5]
SlaveAlias[6]
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Table 9. Serial Control Bus Registers (continued)
Page
RX
RX
RX
48
Addr
(hex)
0x6C
0x6D
0x6E
Register Name
SlaveAlias[7]
PORT_CONFIG
BC_GPIO_CTL0
Bit(s)
Field
Type
Default Description
0
SLAVE AUTO ACK 6
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 6 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:1
SLAVE ALIAS ID7
R/W
0x0
7-bit remote slave device alias ID 7
Configures the decoder for detecting
transactions designated for an I2C slave
device attached to the remote serializer. The
transaction is remapped to the address
specified in the slave ID7 register. A value of 0
in this field disables access to the remote I2C
slave.
0
SLAVE AUTO ACK 7
R/W
0x0
Automatically acknowledge all I2C writes to the
remote slave 7 independent of the forward
channel lock state or status of the remote
serializer acknowledge.
1: Enable
0: Disable
7:3
RESERVED
R/W
0x0F
Reserved
2
COAX_MODE
(R/W)/S 0x0
Enable coax cable mode
0: Shielded twisted pair (STP) mode
1: Coax mode
This bit is loaded from the MODE pin strap at
power-up.
1:0
FPD3_MODE
(R/W)/S 0x0
FPD3 input mode
00: Reserved
01: RAW12 LF mode
10: RAW12 HF mode
11: RAW10 mode
This field is loaded from the MODE pin strap at
power-up.
7:4
BC_GPIO1_SEL
R/W
0x8
Back channel GPIO1 select:
Determines the data sent on GPIO1 for the
port back channel.
0000 : GPIO Pin 0
0001 : GPIO Pin 1
0010 : GPIO Pin 2
0011 : GPIO Pin 3
0100 - 0111 : Reserved
1000 : Constant value of 0
1001 : Constant value of 1
1010 : FrameSync signal
1011 - 1111 : Reserved
3:0
BC_GPIO0_SEL
R/W
0x8
Back channel GPIO0 Select:
Determines the data sent on GPIO0 for the
port back channel.
0000 : GPIO Pin 0
0001 : GPIO Pin 1
0010 : GPIO Pin 2
0011 : GPIO Pin 3
0100 - 0111 : Reserved
1000 : Constant value of 0
1001 : Constant value of 1
1010 : FrameSync signal
1011 - 1111 : Reserved
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
RX
0x6F
BC_GPIO_CTL1
7:4
BC_GPIO3_SEL
R/W
0x8
Back channel GPIO3 select:
Determines the data sent on GPIO3 for the
port back channel.
0000 : GPIO Pin 0
0001 : GPIO Pin 1
0010 : GPIO Pin 2
0011 : GPIO Pin 3
0100 - 0111 : Reserved
1000 : Constant value of 0
1001 : Constant value of 1
1010 : FrameSync signal
1011 - 1111 : Reserved
3:0
BC_GPIO2_SEL
R/W
0x8
Back channel GPIO2 select:
Determines the data sent on GPIO2 for the
port back channel.
0000 : GPIO Pin 0
0001 : GPIO Pin 1
0010 : GPIO Pin 2
0011 : GPIO Pin 3
0100 - 0111 : Reserved
1000 : Constant value of 0
1001 : Constant value of 1
1010 : FrameSync signal
1011 - 1111 : Reserved
RX
0x70 - RESERVED
0x76
7:0
RESERVED
R/W
0x00
Reserved
RX
0x77
7:6
FREQ_HYST
R/W
0x3
Frequency detect hysteresis:
The frequency detect hysteresis controls
reporting of the FPD3 Clock frequency stability
via the FREQ_STABLE status in the
RX_PORT_STS2 register. The frequency is
considered stable when the frequency remains
within a range of +/- the FREQ_HYST value
from the previous measurement. The
FREQ_HYST setting is in MHz.
5:4
FREQ_STABLE_THR R/W
0x0
Frequency stability threshold:
The frequency detect circuit can be used to
detect a stable clock frequency. The stability
threshold determines the amount of time
required for the clock frequency to stay within
the FREQ_HYST range to be considered
stable:
00 : 40 µs
01 : 80 µs
10 : 320 µs
11 : 1.28 ms
3:0
FREQ_LO_THR
R/W
0x5
Frequency low threshold:
Sets the low threshold for the clock frequency
detect circuit in MHz. If the input clock is below
this threshold, the NO_FPD3_CLK status is set
to 1.
FREQ_DET_CTL
RX
0x78
MAILBOX_1
7:0
MAILBOX_0
R/W
0x0
Mailbox register
This register is an unused read/write register
that can be used for any purpose such as
passing messages between I2C masters on
opposite ends of the link.
RX
0x79
MAILBOX_2
7:0
MAILBOX_1
R/W
0x01
Mailbox register
This register is an unused read/write register
that can be used for any purpose such as
passing messages between I2C masters on
opposite ends of the link.
RX
0x7A - RESERVED
0x7F
7:0
RESERVED
R
0x0
Reserved
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
Share
0xB0
IND_ACC_CTL
7:6
RESERVED
R
0x0
Reserved
5:2
IA_SEL
R/W
0x0
Indirect Access register select:
Selects target for register access
0000 : Reserved
0001 : FPD3 RX Port 0 registers
0010 : FPD3 RX Port 1 registers
0011 : Reserved
0100 : Reserved
0101 : FPD3 RX Shared registers
0110 : Simultaneous write to FPD3 RX Port 01 registers
0111 : Reserved
1
IA_AUTO_INC
R/W
0x0
Indirect access auto increment:
Enables auto-increment mode. Upon
completion of a read or write, the register
address automatically increments by 1
0
IA_READ
R/W
0x0
Indirect access read:
Setting this allows generation of a read strobe
to the selected register block upon setting of
the IND_ACC_ADDR register. In autoincrement mode, read strobes is also asserted
following a read of the IND_ACC_DATA
register. This function is only required for
blocks that need to pre-fetch register data.
Share
0xB1
IND_ACC_ADDR
7:0
IA_ADDR
R/W
0x0
Indirect access register offset:
This register contains the 8-bit register offset
for the indirect access.
Share
0xB2
IND_ACC_DATA
7:0
IA_DATA
R/W
0x0
Indirect access data:
Writing this register causes an indirect write of
the IND_ACC_DATA value to the selected
analog block register. Reading this register
returns the value of the selected block register
Share
0xB3
BIST Control
7:6
BIST_OUT_MODE
R/W
0x0
BIST output mode
00 : No toggling
01 : Alternating 1/0 toggling
1x : Toggle based on BIST data
5:4
RESERVED
R/W
0x0
Reserved
3
BIST PIN CONFIG
R/W
0x1
BIST Configured through pin
1: BIST configured through pin
0: BISTconfigured through bits 2:0 in this
register
2:1
BIST CLOCK
SOURCE
R/W
0x0
BIST Clock Source
This register field selects the BIST clock
source at the Serializer. These register bits are
automatically written to the CLOCK SOURCE
bits (register offset 0x14) in the serializer after
BIST is enabled. See the appropriate serializer
register descriptions for details.
Note: When connected to a DS90UB913A or
DS90UB933, a setting of 0x3 may result in a
clock frequency that is too slow for proper
recovery.
0
BIST_EN
R/W
0x0
BIST Control
1: Enabled
0: Disabled
7
IDX_DONE
R
0x1
IDX Done:
If set, indicates the IDX decode has completed
and latched into the IDX status bits.
6:4
IDX
R
0x0
IDX Decode
3-bit decode from IDX pin
Share
50
0xB8
MODE_IDX_STS
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Table 9. Serial Control Bus Registers (continued)
Page
Share
RX
RX
Addr
(hex)
0xBE
0xD0
0xD8
Register Name
GPIO_PD_CTL
PORT DEBUG
PORT_ICR_HI
Bit(s)
Field
Type
Default Description
3
MODE_DONE
R
0x1
MODE Done:
If set, indicates the MODE decode has
completed and latched into the MODE status
bits.
2:0
MODE
R
0x0
MODE Decode
3-bit decode from MODE pin
7:3
RESERVED
R/W
0x0
Reserved
2
GPIO2_PD_DIS
R/W
0x0
GPIO2 pulldown resistor disable:
The GPIO pins by default include a pulldown
resistor that is automatically enabled when the
GPIO is not in an output mode. When this bit is
set, the pulldown resistor is also disabled when
the GPIO pin is in an input only mode.
1 : Disable GPIO pulldown resistor
0 : Enable GPIO pulldown resistor
1
GPIO1_PD_DIS
R/W
0x0
GPIO1 pulldown resistor disable:
The GPIO pins by default include a pulldown
resistor that is automatically enabled when the
GPIO is not in an output mode. When this bit is
set, the pulldown resistor is also disabled when
the GPIO pin is in an input only mode.
1 : Disable GPIO pulldown resistor
0 : Enable GPIO pulldown resistor
0
GPIO0_PD_DIS
R/W
0x0
GPIO0 pulldown resistor disable:
The GPIO pins by default include a pulldown
resistor that is automatically enabled when the
GPIO is not in an output mode. When this bit is
set, the pulldown resistor is also disabled when
the GPIO pin is in an input only mode.
1 : Disable GPIO pulldown resistor
0 : Enable GPIO pulldown resistor
7:6
RESERVED
R/W
0x0
Reserved
5
SER BIST ACT
R
0x0
Serializer BIST Active
This register indicates whether the serializer is
in BIST mode.
0: BIST mode not active
1: BIST mode active
If the deserializer is not in BIST mode, this bit
being 1 could indicate an error condition.
4:2
RESERVED
R/W
0x0
Reserved
1
FORCE BC ERRORS R/W
0x0
This bit introduces continuous errors into the
back channel frame.
0
FORCE 1 BC
ERROR
(R/W)/S 0x0
C
This bit introduces typically one, worst case
two, errors into the back channel frame. Self
clearing bit.
7:3
Reserved
R
0x0
Reserved
2
IE_FPD3_ENC_ERR
R/W
0x0
Interrupt on FPD-Link III receiver encoding
error
When enabled, an interrupt is generated on
detection of an encoding error on the FPD-Link
III interface for the receive port as reported in
the FPD3_ENC_ERROR bit in the
RX_PORT_STS2 register
1
IE_BCC_SEQ_ERR
R/W
0x0
Interrupt on BCC SEQ sequence error
When enabled, an interrupt is generated if a
sequence error is detected for the bidirectional
control channel forward channel receiver as
reported in the BCC_SEQ_ERROR bit in the
RX_PORT_STS1 register.
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Table 9. Serial Control Bus Registers (continued)
Page
RX
RX
RX
52
Addr
(hex)
0xD9
0xDA
0xDB
Register Name
PORT_ICR_LO
PORT_ISR_HI
PORT_ISR_LO
Bit(s)
Field
Type
Default Description
0
IE_BCC_CRC_ERR
R/W
0x0
Interrupt on BCC CRC error detect
When enabled, an interrupt is generated if a
CRC error is detected on a bidirectional control
channel frame received over the FPD-Link III
forward channel as reported in the
BCC_CRC_ERROR bit in the
RX_PORT_STS1 register.
7:3
RESERVED
R/W
0x0
Reserved
2
IE_FPD3_PAR_ERR
R/W
0x0
Interrupt on FPD-Link III receiver parity error
When enabled, an interrupt is generated on
detection of parity errors on the FPD-Link III
interface for the receive port. Parity error status
is reported in the PARITY_ERROR bit in the
RX_PORT_STS1 register.
1
IE_PORT_PASS
R/W
0x0
Interrupt on change in port PASS status
When enabled, an interrupt is generated on a
change in receiver port valid status as reported
in the PORT_PASS bit in the PORT_STS1
register.
0
IE_LOCK_STS
R/W
0x0
Interrupt on change in lock status
When enabled, an interrupt is generated on a
change in lock status. Status is reported in the
LOCK_STS_CHG bit in the RX_PORT_STS1
register.
7:3
Reserved
R
0x0
Reserved
2
IS_FPD3_ENC_ERR
R
0x0
FPD-Link III receiver encode error interrupt
status
An encoding error on the FPD-Link III interface
for the receive port has been detected. Status
is reported in the FPD3_ENC_ERROR bit in
the RX_PORT_STS2 register.
This interrupt condition is cleared by reading
the RX_PORT_STS2 register.
1
IS_BCC_SEQ_ERR
R
0x0
BCC CRC sequence error interrupt status
A sequence error has been detected for the
bidirectional control channel forward channel
receiver. Status is reported in the
BCC_SEQ_ERROR bit in the
RX_PORT_STS1 register.
This interrupt condition is cleared by reading
the RX_PORT_STS1 register.
0
IS_BCC_CRC_ERR
R
0x0
BCC CRC error detect interrupt status
A CRC error has been detected on a
bidirectional control channel frame received
over the FPD-Link III forward channel. Status
is reported in the BCC_CRC_ERROR bit in the
RX_PORT_STS1 register.
This interrupt condition is cleared by reading
the RX_PORT_STS1 register.
7:3
Reserved
R
0x0
Reserved
2
IS_FPD3_PAR_ERR
R
0x0
FPD-Link III receiver parity error interrupt
status
A parity error on the FPD-Link III interface for
the receive port has been detected. Parity error
status is reported in the PARITY_ERROR bit in
the RX_PORT_STS1 register.
This interrupt condition is cleared by reading
the RX_PORT_STS1 register.
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Table 9. Serial Control Bus Registers (continued)
Page
Addr
(hex)
Register Name
Bit(s)
Field
Type
Default Description
1
IS_PORT_PASS
R
0x0
Port valid interrupt status
A change in receiver port valid status as
reported in the PORT_PASS bit in the
PORT_STS1 register. This interrupt condition
is cleared by reading the RX_PORT_STS1
register.
0
IS_LOCK_STS
R
0x0
Lock interrupt status
A change in lock status has been detected.
Status is reported in the LOCK_STS_CHG bit
in the RX_PORT_STS1 register.
This interrupt condition is cleared by reading
the RX_PORT_STS1 register.
Share
0xF0
FPD3_RX_ID0
7:0
FPD3_RX_ID0
R
0x5F
FPD3_RX_ID0: First byte ID code: ‘_’
Share
0xF1
FPD3_RX_ID1
7:0
FPD3_RX_ID1
R
0x55
FPD3_RX_ID1: 2nd byte of ID code: ‘U’
Share
0xF2
FPD3_RX_ID2
7:0
FPD3_RX_ID2
R
0x42
FPD3_RX_ID2: 3rd byte of ID code: ‘B’
Share
0xF3
FPD3_RX_ID3
7:0
FPD3_RX_ID3
R
0x39
FPD3_RX_ID3: 4th byte of ID code: ‘9’
Share
0xF4
FPD3_RX_ID4
7:0
FPD3_RX_ID4
R
0x33
FPD3_RX_ID4: 5th byte of ID code: '3'
Share
0xF5
FPD3_RX_ID5
7:0
FPD3_RX_ID5
R
0x34
FPD3_RX_ID5: 6th byte of ID code: '4'
Share
0xF8
I2C_RX0_ID
7:1
RX_PORT0_ID
R/W
0x00
7-bit Receive Port 0 I2C ID
Configures the decoder for detecting
transactions designated for Receiver port 0
registers. This provides a simpler method of
accessing device registers specifically for port
0 without having to use the paging function to
select the register page. A value of 0 in this
field disables the Port0 decoder.
0
RESERVED
R
0x0
Reserved
Share
0xF9
I2C_RX1_ID
7:1
RX_PORT1_ID
R/W
0x00
7-bit Receive Port 1 I2C ID
Configures the decoder for detecting
transactions designated for Receiver port 1
registers. This provides a simpler method of
accessing device registers specifically for port
1 without having to use the paging function to
select the register page. A value of 0 in this
field disables the Port1 decoder.
0
RESERVED
R
0x0
Reserved
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The DS90UB933/934 chipset supports video transport and bidirectional control over a single coaxial or STP
cable targeted at ADAS applications, such as front, rear, and surround-view cameras, camera monitoring
systems, and sensor fusion.
8.2 Power Over Coax
The DS90UB34-Q1 is designed to support the Power-over-Coax (PoC) method of powering remote sensor
systems. With this method, the power is delivered over the same medium (a coaxial cable) used for high-speed
digital video data and bidirectional control and diagnostics data transmission. The method utilizes passive
networks or filters that isolate the transmission line from the loading of the DC-DC regulator circuits and their
connecting power traces on both sides of the link as shown in Figure 22.
Sensor Module
Automotive ECU
DC-DC
Regulators
Power
Source
PoC
POWER
CAC1
Image Sensor
PoC
Coaxial Cable
FPD-Link III
Serializer
CAC1
FPD-Link III
Deserializer
FPD-Link III
CAC2
RTERM
Braided
Shield
Processor
SoC
CAC2
RTERM
Figure 22. Power Over Coax (PoC) System Diagram
The PoC networks' impedance of ≥ 2 kΩ over a specific frequency band is typically sufficient to isolate the
transmission line from the loading of the regulator circuits. The lower limit of the frequency band is defined as ½
of the frequency of the bidirectional control channel, fBCC. The upper limit of the frequency band is the frequency
of the forward high-speed channel, fFC.
Figure 23 shows a PoC network recommended for a FPD-Link III consisting of DS90UB913A-Q1/DS90UB933Q1 and DS90UB934-Q1 pair with the bidirectional channel operating at 5 Mbps (½ fBCC = 2.5 MHz) and the
forward channel operating at 1.87 Gbps (fFC = 1GHz).
54
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Power Over Coax (continued)
VPoC
R1
2.0 k:
L1
100 PH
R2
C1
0.1 PF
C2
>10 PF
L2
2.0 k:
4.7 PH ± 22 PH
FB1
CAC1
RIN+
100 nF
R3
CAC2
RIN-
49.9 :
47 nF
Figure 23. Typical PoC Network for a 2G FPD-Link III
Table 10 lists essential components for this particular PoC network.
Table 10. Suggested Components for a 2G FPD-Link III PoC Network
COUNT
1
1
1
REF DES
L1
L2
FB1
PART NUMBER
MFR
Inductor, 100 µH, 0.310 Ω maximum, 710 mA minimum (Isat, Itemp)
7.2-MHz SRF typical, 6.6 mm × 6.6 mm, AEC-Q200
DESCRIPTION
MSS7341-104ML
Coilcraft
Inductor, 4.7 µH, 0.350 Ω maximum, 700 mA minimum (Isat, Itemp)
160-MHz SRF typical, 3.8 mm x 3.8 mm, AEC-Q200
1008PS-472KL
Coilcraft
CBC3225T4R7MRV
Taiyo
Yuden
Ferrite Bead, 1500 kΩ at 1 GHz, 0.5 Ω maximum at DC
500-mA at 85°C, SM0603, General-Purpose
BLM18HE152SN1
Murata
Ferrite Bead, 1500 kΩ at 1 GHz, 0.5 Ω maximum at DC
500-mA at 85°C, SM0603, AEC-Q200
BLM18HE152SZ1
Murata
Inductor, 4.7 µH, 0.130 Ω maximum, 830 mA minimum (Isat, Itemp),
70-MHz SRF typical, 3.2 mm × 2.5 mm, AEC-Q200
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Application report Sending Power over Coax in DS90UB913A Designs (SNLA224) discusses defining PoC
networks in more detail.
In addition to the PoC network components selection, their placement and layout play a critical role as well.
• Place the smallest component, typically a ferrite bead or a chip inductor, as close to the connector as
possible. Route the high-speed trace through one of its pads to avoid stubs.
• Use the smallest component pads as allowed by manufacturer's design rules. Add anti-pads in the inner
planes below the component pads to minimize impedance drop.
• Consult with connector manufacturer for optimized connector footprint. If the connector is mounted on the
same side as the IC, minimize the impact of the thru-hole connector stubs by routing the high-speed signal
traces on the opposite side of the connector mounting side.
• Use coupled 100-Ω differential signal traces from the device pins to the AC-coupling caps. Use 50-Ω singleended traces from the AC-coupling capacitors to the connector.
• Terminate the inverting signal traces close to the connectors with standard 49.9-Ω resistors.
The suggested characteristics for single-ended PCB traces (microstrips or striplines) for serializer or deserializer
boards are detailed in Table 11. The effects of the PoC networks need to be accounted for when testing the
traces for compliance to the suggested limits.
Table 11. Suggested Characteristics for Single-Ended PCB Traces With Attached PoC Networks
PARAMETER
MIN
Ltrace
Single-ended PCB trace length from the device pin to the connector pin
Ztrace
Single-ended PCB trace characteristic impedance
45
Zcon
Connector (mounted) characteristic impedance
40
RL
Return Loss, S11
IL
56
Insertion Loss, S12
½ fBCC < f < 0.1 GHz
0.1 GHz < f < 1 GHz (f in GHz)
f <0.5 GHz
f=1 GHz
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TYP
MAX
UNIT
5
cm
50
55
Ω
50
60
Ω
–20
dB
–12+8*log(f)
dB
-0.35
dB
–0.6
dB
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The VPOC noise needs to be kept to 10 mVp-p or lower on the source / deserializer side of the system. The VPOC
fluctuations on the serializer side, caused by the transient current draw of the sensor and the DC resistance of
cables and PoC components, need to be kept at minimum as well. Increasing the VPOC voltage and adding extra
decoupling capacitance (> 10 µF) help reduce the amplitude and slew rate of the VPOC fluctuations.
8.3 Typical Application
VDD11_FPD [34]
C10
C7
4.7µF
C11
C8
4.7µF
C12
C9
4.7µF
VDD11_D [3]
VDD11 [20]
V(VDDIO)
1µF
0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
FPD-Link III
VDDIO [7]
[36] VDD18_P1
[40] VDD18_FPD0
[31] VDD18_FPD1
[17] VDD18
1.8V
0.01µF
t 0.1µF
0.1µF
1µF
10µF
FB1
0.1µF
1µF
10µF
FB2
0.1µF
1µF
10µF
FB3
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
R1
C1
C2
RTERM
VDDIO [29]
[45] VDD18_P0
RIN0+ [41]
RIN0> [42]
C3
C4
RIN1+ [32]
RIN1> [33]
R2
[35] IDX
[37] MODE
0.1µF
R3
R4
0.1µF
RTERM
(TEST_PAD)
C5
C6
CMLOUTP [38]
CMLOUTN [39]
V(VI2C)
4.7k
4.7k
I2C_SDA [1]
I2C_SCL [2]
I2C
1.8V
10k
PDB [30]
>10µF
BISTEN [6]
10k
Control
[24] ROUT0
[23] ROUT1
[22] ROUT2
[21] ROUT3
[19] ROUT4
[18] ROUT5
[16] ROUT6
[15] ROUT7
[14]IN_D2N
ROUT8
[13] ROUT9
[12] ROUT10
[11] ROUT11
[10] HSYNC
[9] VSYNC
[8] PCLK
LVCMOS
Video Output
OSS_SEL [4]
OEN [5]
SEL [46]
[48] LOCK
[47] PASS
V(VDDIO)
Status
4.7k
GPIO / Status
GPIO3 / INTB [25]
GPIO2 [26]
GPIO1 [27]
GPIO0 [28]
[43] RES
NOTE:
FB1-FB3: DCR<=25mQ; Z=120Q@100MHz
C1,C3,C5,C6
= 100nF (50 WV; 0402)
C2,C4
= 47nF (50 WV; 0402)
C7, C8, C9
= 0.1 ± 0.47 F
C10, C11, C12
= 0.01 ± 0.047…F
R1 and R2 (see IDX Resistor Values Table)
R3 and R4 (see MODE Resistor Values Table)
RTERM = 50Ÿ
[44] RES
DAP
Copyright © 2017, Texas Instruments Incorporated
Figure 24. Typical Connection Diagram Coaxial
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Typical Application (continued)
VDD11_FPD [34]
C10
C7
4.7µF
C11
C8
4.7µF
C12
C9
4.7µF
VDD11_D [3]
VDD11 [20]
V(VDDIO)
1µF
0.01µF
t 0.1µF
0.1µF
0.01µF
t 0.1µF
VDDIO [29]
VDDIO [7]
[40] VDD18_FPD0
[31] VDD18_FPD1
[17] VDD18
0.1µF
1µF
10µF
FB1
0.1µF
1µF
10µF
FB2
0.1µF
1µF
10µF
FB3
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
0.01µF
t 0.1µF
RIN0+ [41]
RIN0> [42]
FPD-Link III
C3
C4
RIN1+ [32]
RIN1> [33]
C5
C6
(TEST_PAD)
CMLOUTP [38]
CMLOUTN [39]
V(VI2C)
4.7k
I2C_SDA [1]
I2C_SCL [2]
I2C
1.8V
10k
PDB [30]
>10µF
BISTEN [6]
10k
Control
[36] VDD18_P1
1.8V
0.01µF
t 0.1µF
R1
C1
C2
4.7k
[45] VDD18_P0
R2
[35] IDX
[37] MODE
0.1µF
R3
R4
[24] ROUT0
[23] ROUT1
[22] ROUT2
[21] ROUT3
[19] ROUT4
[18] ROUT5
[16] ROUT6
[15] ROUT7
[14]IN_D2N
ROUT8
[13] ROUT9
[12] ROUT10
[11] ROUT11
[10] HSYNC
[9] VSYNC
[8] PCLK
0.1µF
LVCMOS
Video Output
OSS_SEL [4]
OEN [5]
SEL [46]
[48] LOCK
[47] PASS
V(VDDIO)
Status
4.7k
GPIO3 / INTB [25]
GPIO2 [26]
GPIO1 [27]
GPIO0 [28]
GPIO / Status
[43] RES
NOTE:
FB1-FB3: DCR<=25mQ; Z=120Q@100MHz
C1,C3,C5,C6
= 100nF (50 WV; 0402)
C2,C4
= 47nF (50 WV; 0402)
C7, C8, C9
= 0.1 ± 0.47 F
C10, C11, C12
= 0.01 ± 0.047…F
R1 and R2 (see IDX Resistor Values Table)
R3 and R4 (see MODE Resistor Values Table)
RTERM = 50Ÿ
[44] RES
DAP
Figure 25. Typical Connection Diagram STP
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Typical Application (continued)
8.3.1 Design Requirements
For the typical FPD-Link III serializer and deserializer applications, use the input parameters in Table 12.
Table 12. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
V(VI2C)
1.8 V or 3.3 V
V(VDD18)
1.8 V
AC-coupling capacitor for STP: RIN[1:0]±
100 nF (50 WV 0402)
AC-coupling capacitor for coaxial: RIN[1:0]+
100 nF (50 WV 0402)
AC-coupling capacitor for coaxial: RIN[1:0]-
47 nF (50 WV 0402)
8.3.2 Detailed Design Procedure
The serializer and deserializer support only AC-coupled interconnects through an integrated DC-balanced
decoding scheme. External AC-coupling capacitors must be placed in series in the FPD-Link III signal path as
shown in Figure 26. For applications utilizing single-ended 50-Ω coaxial cable, terminate the unused data pins
(RIN0–, RIN1–, RIN2–, RIN3–) with AC coupling capacitor and a 50-Ω resistor.
DOUT+
RIN+
SER
DES
RIN-
DOUT-
Figure 26. AC-Coupled Connection (STP)
DOUT+
RIN+
SER
DES
DOUT-
50Q
RIN-
50Q
Figure 27. AC-Coupled Connection (Coaxial)
For high-speed FPD–Link III transmissions, use the smallest available package for the AC-coupling capacitor.
This helps minimize degradation of signal quality due to package parasitics.
8.3.3 Application Curves
ROUT0
Output
(2 V/DIV)
100 MHz
Pixel Clock
Output
(2 V/DIV)
Time (5 ns/DIV)
Figure 28. CMLOUTP/N Loop-through Eye Diagram at
1.867 Gbps
15 Meters of DACAR 462 Cable
Figure 29. ROUT0 Data Sampled by 100-MHz PCLK
RRFB (0x3B[0]) = 1
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8.4 System Examples
The DS90UB934-Q1 has two input ports that operate as a multiplexer controlled by the SEL pin. A single camera
can be connected to either Rx input port 0 or Rx input port 1 (Figure 30).
Two cameras can be connected simultaneously, but only one is active at a time (Figure 31). The SEL pin can be
toggled on-the-fly to select which camera is forwarded to the DVP output.
DVP
Output
DS90UB933-Q1
Serializer
Parallel LVCMOS
Host / ISP
DS90UB934-Q1
2:1
DS90UB933-Q1
Serializer
DVP
Output
Figure 30. DS90UB933-Q1 Camera Data to 1 Rx Port
Parallel LVCMOS
Host / ISP
DS90UB933-Q1
Serializer
DS90UB934-Q1
Copyright © 2016, Texas Instruments Incorporated
Figure 31. Two DS90UB933-Q1 Camera Data to 2 Rx Ports
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9 Power Supply Recommendations
This device provides separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. provide guidance on which circuit blocks are connected to which power pin pairs. In some cases, an
external filter may be used to provide clean power to sensitive circuits such as PLLs.
9.1 VDD Power Supply
Each VDD power supply pin must have a 10-nF capacitor to ground connected as close as possible to the
DS90UB934-Q1 device. TI recommends having additional decoupling capacitors (0.1 µF, 1 µF, and 10 µF) on it.
It is also recommended to have the pins connected to a solid power plane.
9.2 Power-Up Sequencing
All inputs must not be driven until both power supplies have reached steady state. The power-up sequence for
the DS90UB934-Q1 is as follows:
Table 13. Timing Diagram for the Power-Up Sequence
PARAMETER
MIN
T0
V(VDDIO) to V(VDD18)
T1
T2
TYP
MAX
UNIT
NOTES
0
ms
V(VDDIO) must come before (or
at the same time as) V(VDD18)
V(VDDIO) rise time
1
ms
rise time = 10/90%
V(VDD18) rise time
1
ms
rise time = 10/90%
T3
V(VDDIO) / V(VDD18) stable to PDB
0
ms
PDB = H must come after
supplies are stable
T4
PDB pulse width
2
ms
Hard reset
VDDIO
T1
T0
VDD18
T2
T3
T4
Hard
Reset
PDB
Figure 32. Power-Up Sequencing
9.3 PDB Pin
The PDB pin is internal pull down enabled with 50k Ohm resistor. It is active HIGH and must remain LOW until
the power supplies are within the recommended operating conditions. An external RC network on the PDB pin
may be connected to ensure PDB arrives after all the supply pins have settled to the recommended operating
voltage. When PDB pin is pulled up to VDD18, a 10-kΩ pullup and a >10-μF capacitor to GND are required to
delay the PDB input signal rise.
9.4 Ground
TI recommends that common ground plane be used in the design. This provides the best image plane for signal
traces running above the plane. Connect the thermal pad of the DS90UB934-Q1 to this plane with vias.
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10 Layout
10.1 Layout Guidelines
Circuit board layout and stack-up for the FPD-Link III devices must be designed to provide low-noise power feed
to the device. Good layout practice also separates high-frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback, and interference. Power system performance may be greatly improved
by using thin dielectrics (2 to 4 mils) for power/ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies and makes the value and placement of external bypass capacitors less critical. External bypassing
should be low-ESR ceramic capacitors with high-quality dielectric. Voltage rating of the tantalum capacitors must
be at least 5× the power supply voltage being used
TI recommends surface mount capacitors due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 47-µF to 100-µF range and smooths low frequency switching noise. TI recommends
connecting power and ground pins directly to the power and connecting ground planes with bypass capacitors to
the plane with via on both ends of the capacitor. Connecting power or ground pins to an external bypass
capacitor increases the inductance of the path.
A small body size X7R chip capacitor, such as 0603 or 0402, is recommended for external bypass. Its small body
size reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin function tables typically provide guidance on which circuit blocks are connected to which power pin
pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as PLLs.
Use at least a four-layer board with a power and ground plane. Locate LVCMOS signals away from the
differential lines to prevent coupling from the LVCMOS lines to the differential lines. Differential impedance of 100
Ω are typically recommended for STP interconnect and single-ended impedance of 50 Ω for coax interconnect.
The closely coupled lines help to ensure that coupled noise appears as common-mode and thus is rejected by
the receivers. The tightly coupled lines also radiate less.
10.1.1 DVP Interface Guidelines
1. Route ROUT[11:0] with controlled 50-Ω single-ended impedance (±15%).
2. Keep away from other high speed signals.
3. Keep lengths to within 5 mils of each other.
4. Length matching must be near the location of mismatch.
5. Separate each signal by at least by 3 times the signal trace width.
6. Keep the use of bends in traces to a minimum. When bends are used, the number of left and right bends
must be as equal as possible, and the angle of the bends must be ≥ 135 degrees. This arrangement
minimizes any length mismatch caused by the bends, and therefore minimizes the impact that bends have
on EMI.
7. Route all signals on the same layer
8. The number of vias should be kept to a minimum. TI recommends keeping the via count to 2 or fewer.
9. Keep traces on layers adjacent to ground plane.
10. Do NOT route signals over any GND plane split.
11. Adding test points causes impedance discontinuity and therefore negatively impacts signal performance. If
test points are used, place them in series and symmetrically. They must not be placed in a manner that
causes a stub.
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10.2 Layout Example
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the VQFN package is highly recommended to improve
board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP.
Figure 33 shows a PCB layout example derived from the layout design of the DS90UB934-Q1EVM Evaluation
Board. The graphic and layout description are used to determine proper routing when designing the board. The
FPD-Link III traces leading to RIN0+, RIN0−, RIN1+, RIN1− carry critical high-speed signals, and have highest
priority in routing.
For STP applications, the positive and negative traces are tightly coupled with differential 100-Ω characteristic
impedance.
For coaxial applications, the FPD-Link III traces must have 50-Ω characteristic impedance. As a secondary
priority, loosely couple the traces with differential 100-Ω characteristic impedance.
Figure 33. DS90UB934-Q1 Example PCB Layout
1. Place vias, AC-coupling capacitors, and common-mode chokes (if used) on the FPD-Link III traces closely
together so that the impedance discontinuity appears as tightly grouped as possible.
2. If PoC is used, place a ferrite bead placed as close as possible to the FPD-Link III trace to minimize the stub
seen due to the filter network.
3. The high-speed FPD-Link III traces are routed differentially up to the connector. For the layout of a coaxial
interconnects, use coupled traces with the RINx– termination near to the connector.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
• DS90UB934-Q1EVM User's Guide
• FPD-Link Learning Center
• Backwards Compatibility Modes for Operation with Parallel Output Deserializers
• I2C over DS90UB913/4 FPD-Link III with Bidirectional Control Channel
• Sending Power Over Coax in DS90UB913A Designs
• I2C Bus Pullup Resistor Calculation
• Soldering Specifications Application Report
• Semiconductor and IC Package Thermal Metrics Application Report
• Leadless Leadframe Package (LLP) Application Report
• LVDS Owner's Manual
• An EMC/EMI System-Design and Testing Methodology for FPD-Link III SerDes
• Ten Tips for Successfully Designing with Automotive EMC/EMI Requirements
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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28-Dec-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90UB934TRGZRQ1
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
UB934Q
DS90UB934TRGZTQ1
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 105
UB934Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
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28-Dec-2017
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Dec-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90UB934TRGZRQ1
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
DS90UB934TRGZTQ1
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.1
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Dec-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90UB934TRGZRQ1
VQFN
RGZ
48
2500
367.0
367.0
38.0
DS90UB934TRGZTQ1
VQFN
RGZ
48
250
210.0
185.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGZ 48
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
7 x 7, 0.5 mm pitch
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224671/A
www.ti.com
PACKAGE OUTLINE
RGZ0048B
VQFN - 1 mm max height
SCALE 2.000
PLASTIC QUAD FLATPACK - NO LEAD
7.15
6.85
B
A
PIN 1 INDEX AREA
7.15
6.85
1 MAX
C
SEATING PLANE
0.05
0.00
0.08 C
2X 5.5
4.1 0.1
(0.2) TYP
44X 0.5
12
25
49
2X
5.5
SYMM
36
1
37
48
PIN 1 ID
(OPTIONAL)
EXPOSED
THERMAL PAD
24
13
SYMM
48X
0.30
0.18
0.1
C B A
0.05
48X
0.5
0.3
4218795/B 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
RGZ0048B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 4.1)
(1.115) TYP
(0.685)
TYP
48
48X (0.6)
37
1
36
48X (0.24)
(1.115)
TYP
44X (0.5)
SYMM
(0.685)
TYP
49
( 0.2) TYP
VIA
(6.8)
(R0.05)
TYP
25
12
13
24
SYMM
(6.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4218795/B 02/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
RGZ0048B
VQFN - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.37)
TYP
48
37
48X (0.6)
1
36
48X (0.24)
44X (0.5)
(1.37)
TYP
SYMM
49
(R0.05) TYP
(6.8)
9X
( 1.17)
METAL
TYP
25
12
13
24
SYMM
(6.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
73% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:12X
4218795/B 02/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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