Texas Instruments | SNx5HVD308xE Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package (Rev. J) | Datasheet | Texas Instruments SNx5HVD308xE Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package (Rev. J) Datasheet

Texas Instruments SNx5HVD308xE Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package (Rev. J) Datasheet
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SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
SNx5HVD308xE Low-Power RS-485 Transceivers, Available in a Small MSOP-8 Package
1 Features
•
•
1
•
•
•
•
•
•
These devices are designed to operate with very low
supply current, typically 0.3 mA, exclusive of the load.
When in the inactive-shutdown mode, the supply
current drops to a few nanoamps, which makes these
devices ideal for power-sensitive applications.
Available in a Small MSOP-8 Package
Meets or Exceeds the Requirements of the
TIA/EIA-485A Standard
Low Quiescent Power
– 0.3-mA Active Mode
– 1-nA Shutdown Mode
1/8 Unit Load up to 256 Nodes on a Bus
Bus-Pin ESD Protection up to 15 kV
Industry-Standard SN75176 Footprint
Failsafe Receiver (Bus Open, Bus Shorted,
Bus Idle)
Glitch-Free Power-Up and Power-Down Bus
Inputs and Outputs
The wide common-mode range and high ESDprotection levels of these devices makes them
suitable for demanding applications such as energy
meter networks, electrical inverters, status and
command signals across telecom racks, cabled
chassis interconnects, and industrial automation
networks where noise tolerance is essential. These
devices match the industry-standard footprint of the
SN75176 device. Power-on-reset circuits keep the
outputs in a high-impedance state until the supply
voltage has stabilized. A thermal-shutdown function
protects the device from damage due to system fault
conditions. The SN75HVD3082E is characterized for
operation from 0°C to 70°C and SN65HVD308xE are
characterized for operation from –40°C to 85°C air
temperature. The D package version of the
SN65HVD3082E has been characterized for
operation from –40°C to 105°C.
2 Applications
•
•
•
•
•
•
•
Energy Meter Networks
Motor Control
Power Inverters
Industrial Automation
Building Automation Networks
Battery-Powered Applications
Telecommunications Equipment
Device Information(1)
PART NUMBER
PACKAGE
SN65HVD3082E
SN65HVD3088E
3 Description
The SNx5HVD308xE devices are half-duplex
transceivers designed for RS-485 data bus networks.
Powered by a 5-V supply, they are fully compliant
with TIA/EIA-485A standard. With controlled transition
times, these devices are suitable for transmitting data
over long twisted-pair cables. SN65HVD3082E and
SN75HVD3082E devices are optimized for signaling
rates up to 200 kbps. The SN65HVD3085E device is
suitable for data transmission up to 1 Mbps, whereas
the SN65HVD3088E device is suitable for
applications that require signaling rates up to
20 Mbps.
SN75HVD3082E
SN65HVD3085E
BODY SIZE (NOM)
SOIC (8)
4.90 mm × 3.91 mm
VSSOP (8)
3.00 mm × 3.00 mm
PDIP (8)
9.81 mm × 6.35 mm
SOIC (8)
4.90 mm × 3.91 mm
VSSOP (8)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
R
R
B
DE
D
R
A
RE
R
A
RT
RT
D
A
R
B
A
D
R RE DE D
R
RE
B
DE
D
B
D
D
R RE DE D
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
3
3
4
4
5
5
6
6
7
8
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information .................................................
Electrical Characteristics: Driver ...............................
Electrical Characteristics: Receiver .........................
Power Characteristics ...............................................
Switching Characteristics: Driver ..............................
Switching Characteristics: Receiver..........................
Typical Characteristics ............................................
Parameter Measurement Information ................ 10
Detailed Description ............................................ 14
8.1 Overview ................................................................. 14
8.2 Functional Block Diagram ....................................... 14
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 14
9
Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application ................................................. 16
10 Power Supply Recommendations ..................... 20
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 20
11.3 Thermal Considerations for IC Packages ............. 21
12 Device and Documentation Support ................. 22
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Device Support......................................................
Related Links ........................................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
22
22
22
22
22
22
22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (September 2016) to Revision J
•
Page
Changed 3.3 V to 5 V on the VCC pin in Figure 25............................................................................................................... 18
Changes from Revision H (August 2015) to Revision I
Page
•
Added text to the Description, "The D package version of the SN65HVD3082E has been characterized for operation
from -40°C to 105°C."............................................................................................................................................................. 1
•
Changed the Operating free-air temperature for SN65HVD3082E (D package) From: MAX = 85°C To: 105°C in
Recommended Operating Conditions ................................................................................................................................... 4
Changes from Revision G (May 2009) to Revision H
Page
•
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
•
Deleted Dissipation Ratings table .......................................................................................................................................... 1
•
Added storage temperature Tstg to Absolute Maximum Ratings table ................................................................................... 3
•
Deleted Package Thermal Information table ......................................................................................................................... 6
Changes from Revision F (March 2009) to Revision G
Page
•
Added Graph - Driver Rise and Fall Time vs Temperature.................................................................................................... 8
•
Added IDLE Bus to the Function Table ................................................................................................................................ 14
•
Added Receiver Failsafe section .......................................................................................................................................... 18
2
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SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
5 Pin Configuration and Functions
D, P, and DGK Packages
8-Pin SOIC, VSSOP, and PDIP
Top View
R
1
8
VCC
RE
DE
D
2
7
B
3
4
6
A
5
GND
Pin Functions
PIN
NAME
NO.
TYPE
DESCRIPTION
A
6
Bus input/output
Driver output or receiver input (complementary to B)
B
7
Bus input/output
Driver output or receiver input (complementary to A)
D
4
Digital input
Driver data input
DE
3
Digital input
Driver enable, active high
GND
5
Reference potential
Local device ground
R
1
Digital output
Receive data output
RE
2
Digital input
VCC
8
Supply
Receiver enable, active low
4.5-V to 5.5-V supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range unless otherwise noted (1)
(2)
MIN
MAX
UNIT
–0.5
7
V
–9
14
V
Voltage at any logic pin
–0.3
VCC + 0.3
V
Receiver output current
–24
24
mA
Voltage input, transient pulse, A and B, through 100 Ω (see Figure 20)
–50
50
V
Junction Temperature, TJ
170
°C
Storage temperature, Tstg
150
°C
Supply voltage, VCC
Voltage at A or B
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential I/O bus voltages, are with respect to network ground terminal.
6.2 ESD Ratings
VALUE
V(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS001 (1)
Bus pins and GND
±15000
All pins
±4000
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
Electrical Fast Transient/Burst, A, B, and GND (3)
(1)
(2)
(3)
±1000
UNIT
V
±4000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Tested in accordance with IEC 61000-4-4.
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6.3 Recommended Operating Conditions
over operating free-air temperature range unless otherwise noted (1)
MIN
NOM
MAX
UNIT
Supply voltage, VCC
4.5
5.5
Voltage at any bus terminal (separately or common mode) , VI
–7
12
High-level input voltage (D, DE, or RE inputs), VIH
2
VCC
V
Low-level input voltage (D, DE, or RE inputs), VIL
0
0.8
V
–12
12
V
–60
60
–8
8
Differential input voltage, VID
Driver
Output current, IO
Receiver
Differential load resistance, RL
54
Signaling rate, 1/tUI
0.2
SN65HVD3085E
1
SN65HVD3088E
Operating free-air temperature, TA
Mbps
20
SN65HVD3082E (D package)
–40
105
SN65HVD3082E (DGK and P packages),
SN65HVD3085E, SN65HVD3088E
–40
85
SN75HVD3082E
Junction temperature, TJ
(1)
mA
Ω
60
SN65HVD3082E, SN75HVD3082E
V
0
70
–40
130
°C
°C
The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
6.4 Thermal Information
THERMAL METRIC (1)
SN65HVD3082E, SN75HVD3082E,
SN65HVD3085E, SN65HVD3088E
SN65HVD3082E,
SN65HVD3088E
D (SOIC)
DGK (VSSOP)
P (PDIP)
8 PINS
8 PINS
8 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
130
180
70
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
80
66
80
°C/W
RθJB
Junction-to-board thermal resistance
55
110
40
°C/W
ψJT
Junction-to-top characterization parameter
7.9
4.6
17.6
°C/W
ψJB
Junction-to-board characterization parameter
47
73.1
28.3
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
6.5 Electrical Characteristics: Driver
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
IO = 0, No Load
|VOD|
Differential output voltage
RL = 54 Ω (see Figure 8)
RL = 100 Ω
Change in magnitude of differential
output voltage
VOC(SS)
Steady-state common-mode output
voltage
TYP (1)
3
4.3
1.5
2.3
MAX
UNIT
V
2
VTEST = –7 V to 12 V (see Figure 9)
Δ|VOD|
MIN
1.5
See Figure 8 and Figure 9
–0.2
0
0.2
1
2.6
3
–0.1
0
0.1
See Figure 10
V
V
ΔVOC(SS)
Change in steady-state common-mode
output voltage
VOC(PP)
Peak-to-peak common-mode output
voltage
See Figure 10
IOZ
High-impedance output current
See receiver input currents in Electrical
Characteristics: Receiver
II
Input current
D, DE
–100
100
µA
IOS
Short-circuit output current
−7 V ≤ VO ≤ 12 V (see Figure 14)
–250
250
mA
TYP (1)
MAX
UNIT
–85
–10
mV
(1)
500
mV
All typical values are at 25°C and with a 5-V supply.
6.6 Electrical Characteristics: Receiver
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
MIN
VIT+
Positive-going differential input threshold
voltage
IO = –8 mA
VIT–
Negative-going differential input threshold
voltage
IO = 8 mA
Vhys
Hysteresis voltage (VIT+ – VIT–)
VOH
High-level output voltage
VID = 200 mV, IOH = –8 mA (see Figure 15)
VOL
Low-level output voltage
VID = –200 mV, IO = 8 mA (see Figure 15)
IOZ
High-impedance-state output current
VO = 0 or VCC, RE = VCC
–115
mV
30
mV
4
4.6
V
0.15
–1
0.4
V
1
μA
VIH = 12 V, VCC = 5 V
0.04
0.1
VIH = 12 V, VCC = 0 V
0.06
0.125
II
Bus input current
IIH
High-level input current, (RE)
VIH = 2 V
IIL
Low-level input current, (RE)
VIL = 0.8 V
Cdiff
Differential input capacitance
VI = 0.4 sin (4E6πt) + 0.5 V, DE at 0 V
(1)
–200
mA
VIH = –7 V, VCC = 5 V
–0.1
–0.04
VIH = –7 V, VCC = 0 V
–0.05
–0.03
–60
–30
μA
–60
–30
μA
7
pF
All typical values are at 25°C and with a 5-V supply.
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6.7 Power Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
ICC
P(AVG)
(1)
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
Driver and receiver enabled
D at VCC or open, DE at VCC,
RE at 0 V, No load
425
900
µA
Driver enabled, receiver
disabled
D at VCC or open, DE at VCC,
RE at VCC, No load
330
600
µA
Receiver enabled, driver
disabled
D at VCC or open, DE at 0 V,
RE at 0 V, No load
300
600
µA
Driver and receiver disabled
D at VCC or open, DE at 0 V,
RE at VCC
0.001
2
µA
Average power dissipation
Input to D is a 50% duty
cycle square wave at max
specified signal rate
RL = 54 Ω VCC = 5.5 V, TJ =
130°C
ALL HVD3082E
203
ALL HVD3085E
205
ALL HVD3088E
276
mW
All typical values are at 25°C and with a 5-V supply.
6.8 Switching Characteristics: Driver
over recommended operating conditions unless otherwise noted
PARAMETER
TEST CONDITIONS
Propagation delay time, low-to-high-level output RL = 54 Ω, CL = 50 pF
Propagation delay time, high-to-low-level output (see Figure 11)
tPLH
tPHL
TYP
MAX
HVD3082E
700
1300
HVD3085E
150
500
HVD3088E
12
20
HVD3082E
tr
tf
1500
200
300
HVD3088E
7
15
HVD3082E
20
200
HVD3085E
5
50
HVD3088E
1.4
2
Propagation delay time, high-impedance-toRL = 110 Ω, RE at 0 V
high-level output
(see Figure 12 and
Propagation delay time, high-impedance-to-lowFigure 13)
level output
HVD3082E
2500
7000
HVD3085E
1000
2500
HVD3088E
13
30
Propagation delay time, high-level-to-highimpedance output
Propagation delay time, low-level-to-highimpedance output
RL = 110 Ω, RE at 0 V
(see Figure 12 and
Figure 13)
HVD3082E
80
200
HVD3085E
60
100
HVD3088E
12
30
Propagation delay time, shutdown-to-high-level
output
Propagation delay time, shutdown-to-low-level
output
HVD3082E
3500
7000
RL = 110 Ω, RE at VCC
(see Figure 12)
HVD3085E
2500
4500
HVD3088E
1600
2600
Pulse skew (|tPHL – tPLH|)
tPZH
tPZL
tPHZ
tPLZ
tPZH(SHDN)
tPZL(SHDN)
6
900
HVD3085E
Differential output signal rise time
Differential output signal fall time
tsk(p)
MIN
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RL = 54 Ω, CL = 50 pF
(see Figure 11)
RL = 54 Ω, CL = 50 pF
(see Figure 11)
500
UNIT
ns
ns
ns
ns
ns
ns
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6.9 Switching Characteristics: Receiver
over recommended operating conditions unless otherwise noted
PARAMETER
tPLH
tPHL
tsk(p)
TEST CONDITIONS
HVD3082E
HVD3085E
Propagation delay time, low-to-highlevel output
Propagation delay time, high-to-lowlevel output
MIN
TYP
MAX
75
200
HVD3086E
CL = 15 pF (see
Figure 16)
HVD3082E
HVD3085E
79
HVD3088E
Output signal rise time
tf
Output signal fall time
tPZH
Output enable time to high level
VID = –1.5 V to 1.5 V,
CL = 15 pF (see Figure 16)
4
tPHZ
Output enable time to low level
Output enable time from high level
HVD3082E
HVD3085E
3
ns
3
ns
5
50
10
HVD3088E
Propagation delay time,
shutdown-to-high-level output
tPZL(SHDN)
Propagation delay time,
shutdown-to-low-level output
Copyright © 2009–2017, Texas Instruments Incorporated
CL = 15 pF, DE at 0 V,
(see Figure 19)
50
ns
30
HVD3082E
HVD3085E
5
50
ns
30
8
HVD3088E
tPZH(SHDN)
ns
30
HVD3082E
HVD3085E
Output disable time from low level
ns
1.8
HVD3088E
tPLZ
30
1.5
HVD3082E
HVD3085E
CL = 15 pF,
DE at 3 V
(see Figure 17 and
Figure 18)
ns
10
HVD3088E
tPZL
200
100
HVD3088E
tr
ns
100
HVD3082E
HVD3085E
Pulse skew (|tPHL – tPLH|)
UNIT
50
ns
30
1600
3500
ns
1700
3500
ns
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6.10 Typical Characteristics
80
10
No Load,
VCC = 5 V,
o
TA = 25 C
50% Square Wave Input
ICC - Supply Current - mA
II - Input Bias Current - mA
60
40
VCC = 0 V
20
VCC = 5 V
0
-20
Driver and Receiver
1
Receiver Only
-40
-60
0.1
-8
-6
-4
-2
0
2
4
6
8
10
12
1
10
Figure 2. SN65HVD3082E RMS Supply Current
versus Signaling Rate
Figure 1. Bus Input Current
versus Bus Input Voltage
100
No Load,
VCC = 5 V,
o
TA = 25 C
50% Square Wave Input
ICC - Supply Current - mA
ICC - Supply Current - mA
100
10
Driver and Receiver
1
Receiver Only
No Load,
VCC = 5 V,
o
TA = 25 C
50% Square Wave Input
10
Driver and Receiver
1
Receiver Only
0.1
1
10
1000
100
0.1
Signal Rate - kbps
Figure 3. SN65HVD3085E RMS Supply Current
versus Signaling Rate
Figure 4. SN65HVD3088E RMS Supply Current
versus Signal Rate
5
5
o
VOD - Differential Output Voltage - V
4
4.5
RL = 120W
VO - Receiver Output Voltage - V
TA = 25 C
VCC = 5 V
4.5
3.5
3
RL = 60W
2.5
2
1.5
1
0.5
4
TA = 25oC
VCC = 5 V
VIC = 0.75 V
3.5
3
2.5
2
1.5
1
0.5
0
0
8
100
Signal Rate - kbps
VI - Bus Input Voltage - V
10
20
30
40
50
0
-200 -180 -160 -140 -120 -100 -80 -60 -40 -20
IO - Differential Output Current - mA
VID - Differential Input Voltage - V
Figure 5. Driver Differential Output Voltage
versus Driver Output Current
Figure 6. Receiver Output Voltage
versus Differential Input Voltage
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Typical Characteristics (continued)
10
Rise/Fall Time - ns
9
8
VCC = 4.5 V
7
VCC = 5 V
VCC = 5.5 V
6
5
-40
-20
0
20
40
60
80
o
TA - Temperature - C
Figure 7. SN65HVD3088E Driver Rise and Fall Time
versus Temperature
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7 Parameter Measurement Information
Test load capacitance includes probe and jig capacitance (unless otherwise specified). Signal generator
characteristics: rise and fall time < 6 ns, pulse rate 100 kHz, 50% duty cycle. ZO = 50 Ω (unless otherwise
specified).
II
A
IOA
27 W
VOD
0 V or 3 V
B
50 pF
27 W
IOB
VOC
Figure 8. Driver Test Circuit, VOD and VOC Without Common-Mode Loading
375 W
IOA
VOD
0 V or 3 V
60 W
375 W
IOB
VTEST = -7 V to 12 V
VTEST
Figure 9. Driver Test Circuit, VOD With Common-Mode Loading
27 W
A
Signal
Generator
50 W
27 W
B
50 pF
VA
-3.25 V
VB
-1.75 V
VOC
VOC(PP)
DVOC(SS)
VOC
Figure 10. Driver VOC Test Circuit and Waveforms
3V
1.5 V
Input
1.5 V
0V
RL = 50 W
Signal
Generator
VOD
tPHL
tPLH
CL = 50 pF
50 W
0V
Output
tr
90%
10%
tf
VOD(H)
VOD(L)
Figure 11. Driver Switching Test Circuit and Waveforms
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Parameter Measurement Information (continued)
A
S1
D
0 V or 3 V
3 V if Testing A Output
0 V if Testing B Output
3V
1.5 V
DE
1.5 V
0V
0.5 V
tPZH
RL = 110 W
CL = 50 pF
DE
Signal
Generator
Output
B
VOH
2.5 V
Output
50 W
VOff0
tPHZ
Figure 12. Driver Enable and Disable Test Circuit and Waveforms, High Output
5V
A
D
0 V or 3 V
0 V if Testing A Output
3 V if Testing B Output
RL = 110 W
S1
3V
Output
B
DE
0V
tPZL
CL = 50 pF
DE
1.5 V
1.5 V
tPLZ
5V
Output
Signal
Generator
2.5 V
VOL
50 W
0.5 V
Figure 13. Driver Enable and Disable Test Circuit and Waveforms, Low Output
IOS
IO
VID
VO
VO
Voltage
Source
Figure 14. Driver Short-Circuit
Signal
Generator
Figure 15. Receiver Switching Test Circuit and
Waveforms
50 W
Input B
VID
1.5 V
A
B
Signal
Generator
50 W
R
CL = 15 pF
IO
VO
50%
Input A
0V
tPHL
tPLH
VOH
90%
Output
10%
tr
tf
VOL
Figure 16. Receiver Switching Test Circuit and Waveforms
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Parameter Measurement Information (continued)
VCC D
DE
V
CC
A
54 W
B
1 kW
R
3V
RE
1.5 V
0V
0V
RE
Signal
Generator
CL = 15 pF
tPZH
tPHZ
50 W
1.5 V
R
VOH
VOH -0.5 V
GND
Figure 17. Receiver Enable and Disable Test Circuit and Waveforms, Data Output High
0V D
DE
V
CC
A
54 W
B
R
RE
5V
1.5 V
0V
CL = 15 pF
RE
Signal
Generator
3V
1 kW
tPLZ
tPZL
50 W
VCC
R
1.5 V
VOH +0.5 V
VOL
Figure 18. Receiver Enable and Disable Test Circuit and Waveforms, Data Output Low
VCC
A
1.5 V or
-1.5 V
R
B
RE
Signal
Generator
Switch Down for V(A) = 1.5 V
Switch Up for V(A) = -1.5 V
50 W
3V
1 kW
RE
1.5 V
CL = 15 pF
0V
tPZH(SHDN)
tPZL(SHDN)
5V
VOH
R
1.5 V
VOL
0V
Figure 19. Receiver Enable From Shutdown Test Circuit and Waveforms
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Parameter Measurement Information (continued)
VTEST
100 W
0V
Pulse Generator,
15 ms Duration,
1% Duty Cycle
15 ms
-VTEST
15 ms
Figure 20. Test Circuit and Waveforms, Transient Overvoltage Test
DE Input
D and RE Input
VCC
50 kW
500 W
Input
VCC
Input
9V
500 W
50 kW
9V
A Input
B Input
VCC
VCC
36 kW
16 V
36 kW
16 V
180 kW
180 kW
Input
Input
16 V
36 kW
16 V
36 kW
A and B Output
R Output
VCC
VCC
16 V
5W
Output
Output
16 V
9V
Figure 21. Equivalent Input and Output Schematic Diagrams
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8 Detailed Description
8.1 Overview
The SNx5HVD308xE family of half-duplex RS-485 transceivers is suitable for data transmission at rates up to
200 kbps (for SN65HVD3082E and SN75HVD3082E), 1 Mbps (for SN65HVD3085E), or 20 Mbps (for
SN65HVD3088E) over controlled-impedance transmission media (such as twisted-pair cabling). Up to 256 units
of SNx5HVD308xE may share a common RS-485 bus due to the family’s low bus input currents. The devices
also feature a high degree of ESD protection and typical standby current consumption of 1 nA.
8.2 Functional Block Diagram
VCC
R
RE
A
DE
B
D
GND
8.3 Feature Description
The SNx5HVD308xE provides internal biasing of the receiver input thresholds for open-circuit, bus-idle, or shortcircuit failsafe conditions. It features a typical hysteresis of 30 mV in order to improve noise immunity. Internal
ESD protection circuits protect the transceiver bus terminals against ±15-kV Human Body Model (HBM)
electrostatic discharges.
The devices protect themselves against damage due to overtemperature conditions through use a of a thermal
shutdown feature. Thermal shutdown is entered at 165°C (nominal) and causes the device to enter a low-power
state with high-impedance outputs.
8.4 Device Functional Modes
When the driver enable pin, DE, is logic high, the differential outputs A and B follow the logic states at data input
D. A logic high at D causes A to turn high and B to turn low. In this case the differential output voltage defined as
VOD = VA – VB is positive. When D is low, the output states reverse, B turns high, A becomes low, and VOD is
negative.
When DE is low, both outputs turn high-impedance. In this condition the logic state at D is irrelevant. The DE pin
has an internal pull-down resistor to ground, thus when left open the driver is disabled (high-impedance) by
default. The D pin has an internal pull-up resistor to VCC, thus, when left open while the driver is enabled, output
A turns high and B turns low.
Table 1. Driver Function Table
INPUT
(1)
14
ENABLE
(1)
OUTPUTS (1)
FUNCTION
D
DE
A
B
H
H
H
L
Actively drive bus High
L
H
L
H
Actively drive bus Low
X
L
Z
Z
Driver disabled
X
OPEN
Z
Z
Driver disabled by default
OPEN
H
H
L
Actively drive bus High by default
H = high level, L = low level, Z = high impedance, X = irrelevant, ? = indeterminate
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When the receiver enable pin, RE, is logic low, the receiver is enabled. When the differential input voltage
defined as VID = VA – VB is positive and higher than the positive input threshold, VIT+, the receiver output, R,
turns high. When VID is negative and lower than the negative input threshold, VIT–, the receiver output, R, turns
low. If VID is between VIT+ and VIT– the output is indeterminate.
When RE is logic high or left open, the receiver output is high-impedance and the magnitude and polarity of VID
are irrelevant. Internal biasing of the receiver inputs causes the output to go failsafe-high when the transceiver is
disconnected from the bus (open-circuit), the bus lines are shorted (short-circuit), or the bus is not actively driven
(idle bus).
Table 2. Receiver Function Table
DIFFERENTIAL INPUT
ENABLE
OUTPUT
VID = VA – VB
RE
R
VIT+ < VID
L
H
Receive valid bus High
VIT– < VID < VIT+
L
?
Indeterminate bus state
FUNCTION
VID < VIT–
L
L
Receive valid bus Low
X
H
Z
Receiver disabled
X
OPEN
Z
Receiver disabled by default
Open-circuit bus
L
H
Fail-safe high output
Short-circuit bus
L
H
Fail-safe high output
Idle (terminated) bus
L
H
Fail-safe high output
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The SNx5HVD308xE devices are half-duplex RS-485 transceivers commonly used for asynchronous data
transmissions. The driver and receiver enable pins allow for the configuration of different operating modes.
R
R
R
R
R
R
RE
A
RE
A
RE
A
DE
B
DE
B
DE
B
D
D
D
D
D
D
Figure 22. Half-Duplex Transceiver Configurations
Using independent enable lines provides the most flexible control as it allows for the driver and the receiver to be
turned on and off individually. While this configuration requires two control lines, it allows for selective listening
into the bus traffic whether the driver is transmitting data or not.
Combining the enable signals simplifies the interface to the controller by forming a single direction-control signal.
In this configuration, the transceiver operates as a driver when the direction-control line is high and as a receiver
when the direction-control line is low.
Additionally, only one line is required when connecting the receiver-enable input to ground and controlling only
the driver-enable input. In this configuration, a node not only receives the data from the bus, but also the data it
sends and can verify that the correct data have been transmitted.
9.2 Typical Application
An RS-485 bus consists of multiple transceivers connecting in parallel to a bus cable. To eliminate line
reflections, each cable end is terminated with a termination resistor, RT, whose value matches the characteristic
impedance, Z0, of the cable. This method, known as parallel termination, allows for higher data rates over longer
cable length.
R
R
B
DE
D
R
A
RE
R
A
RT
RT
D
A
R
B
A
D
R RE DE D
R
RE
B
DE
D
B
D
D
R RE DE D
Figure 23. Typical Application Circuit
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Typical Application (continued)
9.2.1 Design Requirements
RS-485 is a robust electrical standard suitable for long-distance networking that may be used in a wide range of
applications with varying requirements, such as distance, data rate, and number of nodes.
9.2.1.1 Data Rate and Bus Length
There is an inverse relationship between data rate and bus length, meaning the higher the data rate, the shorter
the cable length; and conversely, the lower the data rate, the longer the cable may be without introducing data
errors. While most RS-485 systems use data rates between 10 kbps and 100 kbps, some applications require
data rates up to 250 kbps at distances of 4,000 feet and longer. Longer distances are possible by allowing for
small signal jitter of up to 5 or 10%.
10000
Cable Length (ft)
5%, 10%, and 20% Jitter
1000
Conservative
Characteristics
100
10
100
1k
10k
100k
1M
10M
100M
Data Rate (bps)
Figure 24. Cable Length vs Data Rate Characteristic
9.2.1.2 Stub Length
When connecting a node to the bus, the distance between the transceiver inputs and the cable trunk, known as
the stub, must be as short as possible. Stubs present a non-terminated piece of bus line which can introduce
reflections as the length of the stub increases. As a general guideline, the electrical length, or round-trip delay, of
a stub must be less than one-tenth of the rise time of the driver, thus giving a maximum physical stub length as
shown in Equation 1.
Lstub ≤ 0.1 × tr × v × c
where:
•
•
•
tr is the 10/90 rise time of the driver
c is the speed of light (3 × 108 m/s)
v is the signal velocity of the cable or trace as a factor of c
(1)
9.2.1.3 Bus Loading
The RS-485 standard specifies that a compliant driver must be able to driver 32 unit loads (UL), where 1 unit
load represents a load impedance of approximately 12 kΩ. Because the SNx5HVD308xE is a 1/8 UL transceiver,
it is possible to connect up to 256 receivers to the bus.
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Typical Application (continued)
9.2.1.4 Receiver Failsafe
The differential receiver is fail-safe to invalid bus states caused by:
• open bus conditions such as a disconnected connector,
• shorted bus conditions such as cable damage shorting the twisted-pair together, or
• idle bus conditions that occur when no driver on the bus is actively driving
In any of these cases, the differential receiver outputs a failsafe logic High state, so that the output of the
receiver is not indeterminate.
Receiver failsafe is accomplished by offsetting the receiver thresholds so that the input indeterminate range does
not include zero volts differential. To comply with the RS-422 and RS-485 standards, the receiver output must
output a High when the differential input VID is more positive than +200 mV, and must output a Low when the VID
is more negative than –200 mV. The receiver parameters which determine the failsafe performance are VIT+ and
VIT– and VHYS. As seen in the table, differential signals more negative than –200 mV will always cause a Low
receiver output. Similarly, differential signals more positive than +200 mV will always cause a High receiver
output.
When the differential input signal is close to zero, it will still be above the VIT+ threshold, and the receiver output
is High. Only when the differential input is more negative than VIT– will the receiver output transition to a Low
state. So, the noise immunity of the receiver inputs during a bus fault condition includes the receiver hysteresis
value VHYS (the separation between VIT+ and VIT– ) as well as the value of VIT+.
9.2.2 Detailed Design Procedure
In order to protect bus nodes against high-energy transients, the implementation of external transient protection
devices is necessary.
5V
100 nF
100 nF
10 kΩ
VCC
R1
R
RxD
MCU/
UART
DIR
RE
A
DE
B
TVS
D
TxD
R2
GND
10 kΩ
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Figure 25. Transient Protection Against ESD, EFT, and Surge Transients
Figure 25 suggests a protection circuit against 10-kV ESD (IEC 61000-4-2), 4-kV EFT (IEC 61000-4-4), and 1-kV
surge (IEC 61000-4-5) transients. Table 3 shows the associated Bill of Materials.
Table 3. Bill of Materials
DEVICE
FUNCTION
ORDER NUMBER
MANUFACTURER
XCVR
RS-485 Transceiver
SNx5HVD308xE
R1, R2
10-Ω, Pulse-Proof Thick-Film Resistor
CRCW060310RJNEAHP
Vishay
TVS
Bidirectional 400-W Transient Suppressor
CDSOT23-SM712
Bourns
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9.2.2.1 Power Usage in an RS-485 Transceiver
Power consumption is a concern in many applications. Power supply current is delivered to the bus load as well
as to the transceiver circuitry. For a typical RS-485 bus configuration, the load that an active driver must drive
consists of all of the receiving nodes, plus the termination resistors at each end of the bus.
The load presented by the receiving nodes depends on the input impedance of the receiver. The TIA/EIA-485-A
standard defines a unit load as allowing up to 1 mA. With up to 32 unit loads allowed on the bus, the total current
supplied to all receivers can be as high as 32 mA. The HVD308xE is rated as a 1/8 unit load device. As shown
in , the bus input current is less than 1/8 mA, allowing up to 256 nodes on a single bus.
The current in the termination resistors depends on the differential bus voltage. The standard requires active
drivers to produce at least 1.5 V of differential signal. For a bus terminated with one standard 120-Ω resistor at
each end, this sums to 25 mA differential output current whenever the bus is active. Typically the HVD308xE can
drive more than 25-mA to a 60-Ω load, resulting in a differential output voltage higher than the minimum required
by the standard (see Figure 3).
Overall, the total load current can be 60 mA to a loaded RS-485 bus. This is in addition to the current required by
the transceiver itself; the HVD308xE circuitry requires only about 0.4 mA with both driver and receiver enabled,
and only 0.3 mA with either the driver enabled or with the receiver enabled. In low-power shutdown mode,
neither the driver nor receiver is active, and the supply current is low.
Supply current increases with signaling rate primarily due to the totem pole outputs of the driver (see Figure 2).
When these outputs change state, there is a moment when both the high-side and low-side output transistors are
conducting and this creates a short spike in the supply current. As the frequency of state changes increases,
more power is used.
9.2.2.2 Low-Power Shutdown Mode
When both the driver and receiver are disabled (DE low and RE high) the device is in shutdown mode. If the
enable inputs are in this state for less than 60 ns, the device does not enter shutdown mode. This guards against
inadvertently entering shutdown mode during driver or receiver enabling. Only when the enable inputs are held in
this state for 300 ns or more, the device is assured to be in shutdown mode. In this low-power shutdown mode,
most internal circuitry is powered down, and the supply current is typically 1 nA. When either the driver or the
receiver is re-enabled, the internal circuitry becomes active.
If only the driver is re-enabled (DE transitions to high) the driver outputs are driven according to the D input after
the enable times given by tPZH(SHDN) and tPZL(SHDN) in the driver switching characteristics. If the D input is open
when the driver is enabled, the driver outputs defaults to A high and B low, in accordance with the driver failsafe
feature.
If only the receiver is re-enabled (RE transitions to low) the receiver output is driven according to the state of the
bus inputs (A and B) after the enable times given by tPZH(SHDN) and tPZL(SHDN) in the receiver switching
characteristics. If there is no valid state on the bus the receiver responds as described in the failsafe operation
section.
If both the receiver and driver are re-enabled simultaneously, the receiver output is driven according to the state
of the bus inputs (A and B) and the driver output is driven according to the D input.
NOTE
The state of the active driver affects the inputs to the receiver. Therefore, the receiver
outputs are valid as soon as the driver outputs are valid.
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10 Power Supply Recommendations
To ensure reliable operation at all data rates and supply voltages, each supply must be decoupled with a 100-nF
ceramic capacitor located as close to the supply pins as possible. This helps to reduce supply voltage ripple
present on the outputs of switched-mode power supplies and also helps to compensate for the resistance and
inductance of the PCB power planes.
11 Layout
11.1 Layout Guidelines
Robust and reliable bus node design often requires the use of external transient protection devices in order to
protect against EFT and surge transients that may occur in industrial environments. Because these transients
have a wide frequency bandwidth (from approximately 3 MHz to 3 GHz), high-frequency layout techniques must
be applied during PCB design.
• Place the protection circuitry close to the bus connector to prevent noise transients from entering the board.
• Use VCC and ground planes to provide low-inductance.
NOTE
High-frequency currents follow the path of least inductance and not the path of least
impedance.
•
•
•
•
•
•
Design the protection components into the direction of the signal path. Do not force the transients currents to
divert from the signal path to reach the protection device.
Apply 100-nF to 220-nF bypass capacitors as close as possible to the VCC pins of transceiver, UART, and
controller ICs on the board.
Use at least two vias for VCC and ground connections of bypass capacitors and protection devices to
minimize effective via-inductance.
Use 1-kΩ to 10-kΩ pullup or pulldown resistors for enable lines to limit noise currents in these lines during
transient events.
Insert series pulse-proof resistors into the A and B bus lines if the TVS clamping voltage is higher than the
specified maximum voltage of the transceiver bus pins. These resistors limit the residual clamping current into
the transceiver and prevent it from latching up.
While pure TVS protection is sufficient for surge transients up to 1 kV, higher transients require metal-oxide
varistors (MOVs) which reduce the transients to a few hundred volts of clamping voltage, and transient
blocking units (TBUs) that limit transient current to 200 mA.
11.2 Layout Example
5
R
Via to ground
Via to VCC
4
6 R
1
R
MCU
R
7
5
R
6 R
SN65HVD3082E
JMP
C
TVS
5
Figure 26. SNx5HVD308xE Layout Example
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11.3 Thermal Considerations for IC Packages
θJA (Junction-to-Ambient Thermal Resistance) is defined as the difference in junction temperature to ambient
temperature divided by the operating power.
θJA is not a constant and is a strong function of:
• the PCB design (50% variation)
• altitude (20% variation)
• device power (5% variation)
θJA can be used to compare the thermal performance of packages if the specific test conditions are defined and
used. Standardized testing includes specification of PCB construction, test chamber volume, sensor locations,
and the thermal characteristics of holding fixtures. θJA is often misused when it is used to calculate junction
temperatures for other installations.
TI uses two test PCBs as defined by JEDEC specifications. The low-k board gives average in-use condition
thermal performance and consists of a single trace layer 25-mm long and 2-oz thick copper. The high-k board
gives best case in-use condition and consists of two 1-oz buried power planes with a single trace layer 25-mm
long with 2-oz thick copper. A 4% to 50% difference in θJA can be measured between these two test cards.
θJC (Junction-to-Case Thermal Resistance) is defined as difference in junction temperature to case divided by the
operating power. It is measured by putting the mounted package up against a copper block cold plate to force
heat to flow from die, through the mold compound into the copper block.
θJC is a useful thermal characteristic when a heatsink is applied to package. It is NOT a useful characteristic to
predict junction temperature as it provides pessimistic numbers if the case temperature is measured in a nonstandard system and junction temperatures are backed out. It can be used with θJB in 1-dimensional thermal
simulation of a package system.
θJB (Junction-to-Board Thermal Resistance) is defined to be the difference in the junction temperature and the
PCB temperature at the center of the package (closest to the die) when the PCB is clamped in a cold-plate
structure. θJB is only defined for the high-k test card.
θJB provides an overall thermal resistance between the die and the PCB. It includes a bit of the PCB thermal
resistance (especially for BGAs with thermal balls) and can be used for simple 1-dimensional network analysis of
package system (see Figure 27).
Ambient Node
qCA Calculated
Surface Node
qJC Calculated/Measured
Junction
qJB Calculated/Measured
PC Board
Figure 27. Thermal Resistance
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 4. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN65HVD3082E
Click here
Click here
Click here
Click here
Click here
SN75HVD3082E
Click here
Click here
Click here
Click here
Click here
SN65HVD3085E
Click here
Click here
Click here
Click here
Click here
SN65HVD3088E
Click here
Click here
Click here
Click here
Click here
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
22
Submit Documentation Feedback
Copyright © 2009–2017, Texas Instruments Incorporated
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E
SN65HVD3082E, SN75HVD3082E, SN65HVD3085E, SN65HVD3088E
www.ti.com
SLLS562J – AUGUST 2009 – REVISED OCTOBER 2017
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2009–2017, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: SN65HVD3082E SN75HVD3082E SN65HVD3085E SN65HVD3088E
23
PACKAGE OPTION ADDENDUM
www.ti.com
7-May-2019
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN65HVD3082ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3082
SN65HVD3082EDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3082
SN65HVD3082EDGK
ACTIVE
VSSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWN
SN65HVD3082EDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWN
SN65HVD3082EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3082
SN65HVD3082EDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3082
SN65HVD3082EP
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD3082
SN65HVD3082EPE4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
65HVD3082
SN65HVD3085ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3085
SN65HVD3085EDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3085
SN65HVD3085EDGK
ACTIVE
VSSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWK
SN65HVD3085EDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWK
SN65HVD3085EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3085
SN65HVD3088ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3088
SN65HVD3088EDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3088
SN65HVD3088EDGK
ACTIVE
VSSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWH
SN65HVD3088EDGKG4
ACTIVE
VSSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWH
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
7-May-2019
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN65HVD3088EDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWH
SN65HVD3088EDGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
NWH
SN65HVD3088EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3088
SN65HVD3088EDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
VP3088
SN75HVD3082ED
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN3082
SN75HVD3082EDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN3082
SN75HVD3082EDGK
ACTIVE
VSSOP
DGK
8
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
NWM
SN75HVD3082EDGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-1-260C-UNLIM
0 to 70
NWM
SN75HVD3082EDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN3082
SN75HVD3082EDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
VN3082
SN75HVD3082EP
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
75HVD3082
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(4)
7-May-2019
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Dec-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN65HVD3082EDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65HVD3082EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD3082EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD3085EDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65HVD3085EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN65HVD3088EDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN65HVD3088EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
SN75HVD3082EDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
SN75HVD3082EDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Dec-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65HVD3082EDGKR
VSSOP
DGK
8
2500
350.0
350.0
43.0
SN65HVD3082EDR
SOIC
D
8
2500
367.0
367.0
35.0
SN65HVD3082EDR
SOIC
D
8
2500
340.5
338.1
20.6
SN65HVD3085EDGKR
VSSOP
DGK
8
2500
350.0
350.0
43.0
SN65HVD3085EDR
SOIC
D
8
2500
340.5
338.1
20.6
SN65HVD3088EDGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
SN65HVD3088EDR
SOIC
D
8
2500
340.5
338.1
20.6
SN75HVD3082EDGKR
VSSOP
DGK
8
2500
350.0
350.0
43.0
SN75HVD3082EDR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 2
PACKAGE OUTLINE
D0008A
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
A
.004 [0.1] C
PIN 1 ID AREA
6X .050
[1.27]
8
1
2X
.150
[3.81]
.189-.197
[4.81-5.00]
NOTE 3
4X (0 -15 )
4
5
B
8X .012-.020
[0.31-0.51]
.010 [0.25]
C A B
.150-.157
[3.81-3.98]
NOTE 4
.069 MAX
[1.75]
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
[0.11-0.25]
0 -8
.016-.050
[0.41-1.27]
DETAIL A
(.041)
[1.04]
TYPICAL
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
SEE
DETAILS
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
.0028 MAX
[0.07]
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED
METAL
.0028 MIN
[0.07]
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM
1
8
8X (.024)
[0.6]
6X (.050 )
[1.27]
SYMM
5
4
(R.002 ) TYP
[0.05]
(.213)
[5.4]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
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