Texas Instruments | TPD1E0B04 1-Channel ESD Protection Diode for USB Type-C and Antenna Protection (Rev. B) | Datasheet | Texas Instruments TPD1E0B04 1-Channel ESD Protection Diode for USB Type-C and Antenna Protection (Rev. B) Datasheet

Texas Instruments TPD1E0B04 1-Channel ESD Protection Diode for USB Type-C and Antenna Protection (Rev. B) Datasheet
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TPD1E0B04
SLVSDG9B – MARCH 2016 – REVISED DECEMBER 2016
TPD1E0B04 1-Channel ESD Protection Diode for USB Type-C and Antenna Protection
1 Features
3 Description
•
The TPD1E0B04 is a bidirectional TVS ESD
protection diode array for USB Type-C and
Thunderbolt 3 circuit protection. The TPD1E0B04 is
rated to dissipate ESD strikes at the maximum level
specified in the IEC 61000-4-2 international standard
(Level 4).
1
•
•
•
•
•
•
•
•
•
•
IEC 61000-4-2 Level 4 (Contact) ESD Protection
– ±8-kV Contact Discharge
– ±9-kV Air Gap Discharge
IEC 61000-4-4 EFT Protection
– 80 A (5/50 ns)
IEC 61000-4-5 Surge Protection
– 1.7 A (8/20 µs)
IO Capacitance: 0.13 to 0.15 pF (Typical),
0.15 to 0.18 pF (Maximum)
DC Breakdown Voltage: 6.7 V (Typical)
Ultra Low Leakage Current: 10 nA (Maximum)
Low ESD Clamping Voltage
Supports High Speed Interfaces up to 20 Gbps
Low Insertion Loss: >30 GHz (–3 dB Bandwidth)
Industrial Temperature Range: –40°C to +125°C
Ultra-small 0201 and 0402 footprints
2 Applications
•
•
End Equipment
– Laptops and Desktops
– Mobile and Tablets
– Set-Top Boxes
– TV and Monitors
– USB Dongles
– Docking Stations
Interfaces
– USB Type-C
– Thunderbolt 3
– USB 3.1 Gen 2
– HDMI 2.0/1.4
– USB 3.0
– DisplayPort 1.3
– PCI Express 3.0
– Antenna
This device features a 0.13-pF IO capacitance per
channel (DPL package) making it ideal for protecting
high-speed interfaces up to 20 Gbps such as USB
3.1 Gen 2, Thunderbolt 3, and Antenna. The low
dynamic resistance and low clamping voltage ensure
system level protection against transient events.
The TPD1E0B04 is offered in the industry standard
0201 (DPL) and 0402 (DPY) packages.
Device Information(1)
PART NUMBER
TPD1E0B04
PACKAGE
BODY SIZE (NOM)
X2SON (2)
0.60 mm x 0.30 mm
X1SON (2)
1.00 mm x 0.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application
USB Type-C
Connector
SSRX1P
SSRX1N
TPD1E0B04 (x4)
SSTX1P
SSTX1N
TPD4E05U06
VBUS
SBU2
CC1
DPT
DMT
TPD4E05U06
DMB
DPB
SBU1
CC2
VBUS
SSRX2N
SSRX2P
SSTX2N
TPD1E0B04 (x4)
SSTX2P
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPD1E0B04
SLVSDG9B – MARCH 2016 – REVISED DECEMBER 2016
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
4
4
4
4
4
5
6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
ESD Ratings—IEC Specification ..............................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Applications ............................................... 11
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
11 Device and Documentation Support ................. 17
11.1
11.2
11.3
11.4
11.5
11.6
Documentation Support ........................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
17
12 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
Changes from Revision A (June 2016) to Revision B
Page
•
Added "and 0402 (DPY) packages." to the Description, and package "X1SON (2)" to the Device Information table ........... 1
•
Changed the DPY Package From: Preview To Production ................................................................................................... 3
•
Added the DPY (X1SON) package to the Thermal Information table .................................................................................... 4
•
Added DPY values to CL Line capacitance in the Electrical Characteristics table ................................................................ 5
•
Added "(DPL Package)" to the title of Figure 6 ...................................................................................................................... 6
•
Added Figure 7 ...................................................................................................................................................................... 6
•
Added curves for the DPY package to Figure 10 and Figure 11 ........................................................................................... 6
•
Added curve for the DPY package to Figure 17................................................................................................................... 13
•
Added curve for the DPY package to Figure 19 .................................................................................................................. 15
•
Added curve for the DPY package to Figure 21 .................................................................................................................. 15
Changes from Original (March 2016) to Revision A
•
2
Page
Changed device status from Product Preview to Production Data ....................................................................................... 1
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5 Pin Configuration and Functions
DPL Package
2-Pin X2SON
Top View
1
2
DPY Package
2-Pin X1SON
Top View
1
2
Pin Functions
PIN
NO.
NAME
I/O
DESCRIPTION
1
IO
I/O
ESD Protected Channel. If used as ESD IO, connect pin 2 to ground
2
IO
I/O
ESD Protected Channel. If used as ESD IO, connect pin 1 to ground
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
Electrical fast transient
MAX
UNIT
80
A
IEC 61000-4-5 power (tp - 8/20 µs)
15
W
IEC 61000-4-5 current (tp - 8/20 µs)
1.7
A
IEC 61000-4-5 (5/50 ns)
Peak pulse
TA
Operating free-air temperature
–40
125
°C
Tstg
Storage temperature
–65
155
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Electrostatic
discharge
V(ESD)
(1)
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 ESD Ratings—IEC Specification
VALUE
Electrostatic
discharge
V(ESD)
IEC 61000-4-2 contact discharge
±8000
IEC 61000-4-2 air-gap discharge
±9000
UNIT
V
6.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VIO
Input pin voltage
–3.6
3.6
UNIT
V
TA
Operating free-air temperature
–40
125
°C
6.5 Thermal Information
TPD1E0B04
THERMAL METRIC
(1)
DPL (X2SON)
DPY
(X1SON)
2 PINS
2 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
582
442.6
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
264.5
243.8
°C/W
RθJB
Junction-to-board thermal resistance
394.4
162.5
°C/W
ψJT
Junction-to-top characterization parameter
36.4
154.1
°C/W
ψJB
Junction-to-board characterization parameter
394.4
163.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
n/a
n/a
°C/W
(1)
4
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
VRWM
Reverse stand-off voltage
IIO < 10 nA
VBRF
Breakdown voltage, IO pin to
GND
Measured as the maximum voltage before device
snaps back into VHOLD voltage
6.7
VBRR
Breakdown voltage, GND to
IO pin
Measured as the maximum voltage before device
snaps back into VHOLD voltage
–6.7
VHOLD
Holding voltage
IIO = 1 mA, TA = 25°C
VCLAMP
Clamping voltage
–3.6
Leakage current, IO to GND
RDYN
Dynamic resistance
CL
Line capacitance
3.6
5.7
IPP = 1 A, TLP, from IO to GND
7.2
IPP = 5 A, TLP, from IO to GND
10.1
IPP = 16 A, TLP, from IO to GND
19
IPP = 1 A, TLP, from GND to IO
7.2
IPP = 5 A, TLP, from GND to IO
10.1
IPP = 16 A, TLP, from GND to IO
ILEAK
5
1
GND to IO
1
VIO = 0 V, f = 1 MHz, IO to GND
TA = 25°C
V
6.5
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V
V
nA
Ω
0.13
0.15
0.15
0.18
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V
V
10
IO to GND
DPY Package
UNIT
19
VIO = ±2.5 V
DPL Package
MAX
pF
5
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20
20
18
18
16
16
14
14
12
12
Current (A)
Current (A)
6.7 Typical Characteristics
10
8
6
10
8
6
4
4
2
2
0
0
-2
-2
0
3
6
9
12
15
18
Voltage (V)
21
24
27
0
30
3
6
Figure 1. Positive TLP Curve
12
15
18
Voltage (V)
21
24
27
D002
10
0
90
-10
80
-20
70
-30
Voltage (V)
100
60
50
40
-40
-50
-60
30
-70
20
-80
10
-90
0
-100
-10
-20
0
20
40
60
-110
-20
80 100 120 140 160 180 200 220
Time (ns)
D003
0
Figure 3. 8-kV IEC Waveform
40
60
80 100 120 140 160 180 200 220
Time (ns)
D004
0.4
20
Current
Power
1.6
20
Figure 4. –8-kV IEC Waveform
2
-40qC
25qC
85qC
125qC
0.35
16
12
0.8
8
0.4
4
Capacitance (pF)
1.2
Power (W)
0.3
Current (A)
30
Figure 2. Negative TLP Curve
110
Voltage (V)
9
D001
0.25
0.2
0.15
0.1
0.05
0
-5
0
5
0
10 15 20 25 30 35 40 45 50 55 60
Time (Ps)
D005
Figure 5. Surge Curve (tp = 8/20µs), IO Pin to GND
6
0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
Bias Voltage (V)
3
3.3 3.6
D006
Figure 6. Capacitance vs. Bias Voltage (DPL Package)
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Typical Characteristics (continued)
0.4
1000
-40qC
25qC
85qC
125qC
Capacitance (pF)
0.3
800
Leakage Current (pA)
0.35
0.25
0.2
0.15
0.1
600
400
200
0.05
0
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
Bias Voltage (V)
3
0
-40
3.3 3.6
Figure 7. Capacitance vs. Bias Voltage (DPY Package)
-10
5
0.3
0.8
0.27
0.6
0.24
0.4
0.21
0.2
0
-0.2
-0.4
80
95
110 125
D007
DPL Package
DPY Package
0.18
0.15
0.12
0.09
-0.6
0.06
-0.8
0.03
-1
20 35 50 65
Temperature (qC)
Figure 8. Leakage Current vs. Temperature
1
Capacitance (pF)
Current (mA)
-25
D011
0
-7
-6
-5
-4
-3
-2
-1 0 1
Voltage (V)
2
3
4
5
6
7
2
4
6
D008
Figure 9. DC Voltage Sweep I-V Curve
8
10 12 14 16 18 20 22 24 26 28 30
Frequency (GHz)
D009
Figure 10. Capacitance vs. Frequency
0.5
0
Insertion Loss (dB)
-0.5
-1
-1.5
-2
-2.5
-3
-3.5
-4
0.1
DPL Package
DPY Package
0.2 0.3 0.5 0.7 1
2 3 4 5 6 78 10
Frequency (GHz)
20 30 40
D010
Figure 11. Insertion Loss
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Typical Characteristics (continued)
Figure 12. USB3.1 Gen 2 10-Gbps Eye Diagram
(Bare Board)
8
Figure 13. USB3.1 Gen 2 10-Gbps Eye Diagram
(with TPD1E0B04DPL)
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7 Detailed Description
7.1 Overview
The TPD1E0B04 device is a bidirectional ESD Protection Diode with ultra-low capacitance. This device can
dissipate ESD strikes at the maximum level specified by the IEC 61000-4-2 International Standard (contact). The
ultra-low capacitance makes this device ideal for protecting any super high-speed signal pins including
Thunderbolt 3. The low capacitance allows for extremely low losses even at RF frequencies such as USB 3.1
Gen 2, Thunderbolt 3, or antenna applications.
7.2 Functional Block Diagram
IO
GND
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7.3 Feature Description
7.3.1 IEC 61000-4-2 ESD Protection
The I/O pins can withstand ESD events up to ±8-kV contact and ±9-kV air gap. An ESD-surge clamp diverts the
current to ground.
7.3.2 IEC 61000-4-4 EFT Protection
The I/O pins can withstand an electrical fast transient burst of up to 80 A (5/50 ns waveform, 4 kV with 50-Ω
impedance). An ESD-surge clamp diverts the current to ground.
7.3.3 IEC 61000-4-5 Surge Protection
The I/O pins can withstand surge events up to 1.7 A and 15 W (8/20 µs waveform). An ESD-surge clamp diverts
this current to ground.
7.3.4 IO Capacitance
The capacitance between each I/O pin to ground is 0.13 pF (typical) and 0.15 pF (maximum). This device
supports data rates in excess of 20 Gbps.
7.3.5 DC Breakdown Voltage
The DC breakdown voltage of each I/O pin is ±6.7 V (typical). This ensures that sensitive equipment is protected
from surges above the reverse standoff voltage of ±3.6 V.
7.3.6 Ultra Low Leakage Current
The I/O pins feature an ultra-low leakage current of 10 nA (maximum) with a bias of ±2.5 V
7.3.7 Low ESD Clamping Voltage
The I/O pins feature an ESD clamp that is capable of clamping the voltage to 10.1 V (IPP = 5 A).
7.3.8 Supports High Speed Interfaces
This device is capable of supporting high speed interfaces in excess of 20 Gbps, because of the extremely low
IO capacitance.
7.3.9 Industrial Temperature Range
This device features an industrial operating range of –40°C to +125°C.
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Feature Description (continued)
7.3.10 Industry Standard Package
The layout of this device makes it simple and easy to add protection to an existing layout. The package is offered
in industry standard 0201 and 0402 footprints, requiring minimal modification to an existing layout.
7.4 Device Functional Modes
The TPD1E0B04 device is a passive integrated circuit that triggers when voltages are above VBRF or below VBRR.
During ESD events, voltages as high as ±9 kV (air) can be directed to ground via the internal diode network.
When the voltages on the protected line fall below the trigger levels of TPD1E0B04 (usually within 10s of nanoseconds) the device reverts to passive.
10
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPD1E0B04 is a diode type TVS which is used to provide a path to ground for dissipating ESD events on
high-speed signal lines between a human interface connector and a system. As the current from ESD passes
through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to the
protected IC. The low RDYN of the triggered TVS holds this voltage, VCLAMP, to a safe level for the protected IC.
8.2 Typical Applications
8.2.1 USB Type-C Application
USB Type-C
Connector
SSRX1P
SSRX1N
TPD1E0B04 (x4)
SSTX1P
SSTX1N
TPD4E05U06
VBUS
SBU2
CC1
DPT
DMT
TPD4E05U06
DMB
DPB
SBU1
CC2
VBUS
SSRX2N
SSRX2P
SSTX2N
TPD1E0B04 (x4)
SSTX2P
Figure 14. USB Type-C for Thunderbolt 3 ESD Schematic
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Typical Applications (continued)
8.2.1.1 Design Requirements
For this design example eight TPD1E0B04 devices and two TPD4E05U06 devices are being used in a USB
Type-C for Thunderbolt 3 application. This provides a complete ESD protection scheme.
Given the Thunderbolt 3 application, the parameters listed in Table 1 are known.
Table 1. Design Parameters
DESIGN PARAMETER
VALUE
Signal range on superspeed Lines
0 V to 3.6 V
Operating frequency on superspeed Lines
up to 10 GHz
Signal range on CC, SBU, and DP/DM Lines
0 V to 5 V
Operating frequency on CC, SBU, and DP/DM Lines
up to 480 MHz
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Signal Range
The TPD1E0B04 supports signal ranges between –3.6 V and 3.6 V, which supports the SuperSpeed pairs on the
USB Type-C application. The TPD4E05U06 supports signal ranges between 0 V and 5.5 V, which supports the
CC, SBU, and DP-DM lines.
8.2.1.2.2 Operating Frequency
The TPD1E0B04 has a 0.13 pF (typical) capacitance, which supports the Thunderbolt 3 data rates of 20 Gbps.
The TPD4E05U06 has a 0.5-pF (typical) capacitance, which easily supports the CC, SBU, and DP-DM data
rates.
12
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8.2.1.3 Application Curves
Figure 15. USB 3.1 Gen 2 10-Gbps Eye Diagram
(Bare Board)
Figure 16. USB 3.1 Gen 2 10-Gbps Eye Diagram
(with TPD1E0B04DPL)
0.5
0
Insertion Loss (dB)
-0.5
-1
-1.5
-2
-2.5
-3
-3.5
-4
0.1
DPL Package
DPY Package
0.2 0.3 0.5 0.7 1
2 3 4 5 6 78 10
Frequency (GHz)
20 30 40
D010
Figure 17. Insertion Loss
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8.2.2 WiFi Antenna Application
WiFi
Transceiver
Power
Amplifier
Filtering
Network
TPD1E0B04
Figure 18. WiFi Antenna Schematic
8.2.2.1 Design Requirements
For this design example one TPD1E0B04 device for a 5-GHz WiFi antenna application. This provides a complete
ESD protection scheme.
Given the WiFi antenna application, the parameters listed in Table 2 are known.
Table 2. Design Parameters
DESIGN PARAMETER
VALUE
Signal range
–3.16 V to +3.16 V
Operating frequency
5.170 GHz to 5.835 GHz
8.2.2.2 Detailed Design Procedure
8.2.2.2.1 Signal Range
The TPD1E0B04 supports signal ranges between –3.6 V and 3.6 V, which supports the antenna signal range.
The signal range shown assumes maximum transmit power of 200 mW into a 50-Ω antenna.
8.2.2.2.2 Operating Frequency
The TPD1E0B04 has a 0.13 pF (typical) capacitance, which supports extremely high data rates. The capacitance
vs. frequency and bias voltages are exceedingly low, allowing for very low RF loss and known impedance
characteristics. Since capacitance and loss changes very little across the operating frequencies, there must be
minimal disturbance on the line.
14
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8.2.2.3 Application Curves
0.4
0.3
DPL Package
DPY Package
0.27
0.24
0.3
0.21
Capacitance (pF)
Capacitance (pF)
-40qC
25qC
85qC
125qC
0.35
0.18
0.15
0.12
0.09
0.25
0.2
0.15
0.1
0.06
0.05
0.03
0
0
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30
Frequency (GHz)
D009
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7
Bias Voltage (V)
3
3.3 3.6
D006
Figure 20. Capacitance vs. Bias Voltage
Figure 19. Capacitance vs. Frequency
0.5
0
Insertion Loss (dB)
-0.5
-1
-1.5
-2
-2.5
-3
-3.5
-4
0.1
DPL Package
DPY Package
0.2 0.3 0.5 0.7 1
2 3 4 5 6 78 10
Frequency (GHz)
20 30 40
D010
Figure 21. Insertion Loss
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TPD1E0B04
SLVSDG9B – MARCH 2016 – REVISED DECEMBER 2016
www.ti.com
9 Power Supply Recommendations
This device is a passive ESD device so there is no need to power it. Take care not to violate the recommended
I/O specification to ensure the device functions properly.
10 Layout
10.1 Layout Guidelines
•
•
•
The optimum placement is as close to the connector as possible.
– EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces,
resulting in early system failures.
– The PCB designer must minimize the possibility of EMI coupling by keeping any unprotected traces away
from the protected traces which are between the TVS and the connector.
Route the protected traces as straight as possible.
Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded
corners with the largest radii possible.
– Electric fields tend to build up on corners, increasing EMI coupling.
TPD1E0B04 (x4)
Top and bottom layer
TPD4E05U06
TPD4E05U06
TPD1E0B04 (x4)
Top and bottom layer
10.2 Layout Example
Legend
Top Layer
Bottom Layer
Pin to GND
VIA to VBUS Plane
VIA to other layer
VIA to GND Plane
Figure 22. USB Type-C Mid-Mount, Hybrid Connector ESD Layout
16
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Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPD1E0B04
TPD1E0B04
www.ti.com
SLVSDG9B – MARCH 2016 – REVISED DECEMBER 2016
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
TPD1E0B04 Evaluation Module User's Guide, SLVUAN6
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPD1E0B04
17
PACKAGE OPTION ADDENDUM
www.ti.com
3-Mar-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TPD1E0B04DPLR
ACTIVE
X2SON
DPL
2
15000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
8
TPD1E0B04DPLT
ACTIVE
X2SON
DPL
2
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
8
TPD1E0B04DPYR
ACTIVE
X1SON
DPY
2
10000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
5D
TPD1E0B04DPYT
ACTIVE
X1SON
DPY
2
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
5D
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
3-Mar-2017
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TPD1E0B04DPLR
X2SON
DPL
2
15000
178.0
12.3
0.39
0.68
0.38
2.0
8.0
Q1
TPD1E0B04DPLR
X2SON
DPL
2
15000
178.0
8.4
0.36
0.66
0.33
2.0
8.0
Q1
TPD1E0B04DPLT
X2SON
DPL
2
250
178.0
8.4
0.36
0.66
0.33
2.0
8.0
Q1
TPD1E0B04DPYR
X1SON
DPY
2
10000
180.0
9.5
0.66
1.15
0.66
2.0
8.0
Q1
TPD1E0B04DPYT
X1SON
DPY
2
250
180.0
9.5
0.66
1.15
0.66
2.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jul-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD1E0B04DPLR
X2SON
DPL
2
15000
184.0
184.0
19.0
TPD1E0B04DPLR
X2SON
DPL
2
15000
205.0
200.0
33.0
TPD1E0B04DPLT
X2SON
DPL
2
250
205.0
200.0
33.0
TPD1E0B04DPYR
X1SON
DPY
2
10000
184.0
184.0
19.0
TPD1E0B04DPYT
X1SON
DPY
2
250
184.0
184.0
19.0
Pack Materials-Page 2
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