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Texas Instruments FPC401 Quad Port Controller Datasheet
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FPC401
SNLS553 – DECEMBER 2016
FPC401 Quad Port Controller
1 Features
2 Applications
•
•
1
•
•
•
•
•
•
•
•
•
•
•
Supports Control Signal Management and I2C
Aggregation Across Four Ports
Combine Multiple FPC401s to Control 56 Total
Ports Through a Single Host Interface
Eliminates Need for Discrete I2C Muxes, LED
Drivers, and High-Pin-Count FPGA/CPLD Control
Devices
Reduces PCB Routing Complexity by Handling All
Low-Speed Control Signals Close to the Port
Selectable I2C (Up to 1 MHz) or SPI (Up to 10
MHz) Host Control Interface
Automatic Pre-Fetching of Critical, User-Specified
Data From the Modules
Low Single-Port and Multi-Port Read/Write
Latency: <50 µs for SPI Mode, <400 µs for I2C
Mode
Broadcast Mode Allows Writes to All Ports
Simultaneously Across All FPC401 Controllers
Advanced LED Features for Port Status
Indication, Including Programmable Blinking and
Dimming
Customizable Interrupt Events
Separate Host-Side I/O Voltage: 1.8-V to 3.3-V
Small QFN Package Enabling Placement on
Bottom Side of PCB Underneath Ports
•
•
ToR/Aggregation/Core Switch and Router
SFP+/QSFP+ Port Control
SAS External Cable Management Interface
Control
Video Switch & Router SFP+/QSFP+ Port Control
3 Description
The FPC401 quad port controller serves as a lowspeed signal aggregator for common port types such
as SFP+, QSFP+, and SAS. The FPC401 aggregates
all low-speed control and I2C signals across four
ports and presents a single easy-to-use management
interface to the host (I2C or SPI). Multiple FPC401s
can be used in high-port-count applications with one
common control interface to the host. The FPC401 is
designed to allow placement on the bottom side of
the PCB, underneath the press fit connector, to
simplify routing. This localized control of the ports’
low-speed signals cuts system BOM cost by enabling
the use of smaller IO count control devices (FPGAs,
CPLDs, MCUs) and by reducing routing layer
congestion.
Device Information(1)
PART NUMBER
FPC401
PACKAGE
QFN (56)
BODY SIZE (NOM)
5.00 mm × 11.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
HOST
CONTROLLER
INT
SCL
SDA
FPC401 QUAD PORT CONTROLLER
PORT 0
PORT 1
PORT 2
FPC401 QUAD PORT CONTROLLER
PORT 3
PORT 0
PORT 1
PORT 2
I2C,
STATUS,
CONTROL
PORT 3
I2C,
STATUS,
CONTROL
QSFP
QSFP
QSFP
QSFP
QSFP
QSFP
PORT 0
PORT 1
PORT2
PORT 3
PORT 4
PORT 5
SFP
SFP
PORT 6
PORT 7
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
FPC401
SNLS553 – DECEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Device and Documentation Support....................
6.2
6.3
6.4
6.5
6.6
1
1
1
2
3
4
7
6.1 Documentation Support ........................................... 4
Receiving Notification of Documentation Updates....
Community Resources..............................................
Trademarks ...............................................................
Electrostatic Discharge Caution ................................
Glossary ....................................................................
4
4
4
4
4
Mechanical, Packaging, and Orderable
Information ............................................................. 4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
2
DATE
REVISION
NOTES
December 2016
*
Initial release.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: FPC401
FPC401
www.ti.com
SNLS553 – DECEMBER 2016
5 Description (continued)
The FPC401 is compatible with standard SFF-8431, SFF-8436, and SFF-8449 low-speed management
interfaces, including a dedicated 100-kHz and 400-kHz I2C interface to each port. Additional general-purpose
pins are available to perform functions such as driving port status LEDs or controlling power switches. The LED
drivers have convenience features such as programmable blinking and dimming. The interface to the host
controller can operate on a separate supply voltage between 1.8-V and 3.3-V to support low-voltage I/Os.
The FPC401 can prefetch data from user-specified registers in each module, making the data readily accessible
to the host through a fast I2C (up to 1 MHz) or SPI (up to 10 MHz) interface. In addition, the FPC401 can trigger
an interrupt to the host whenever critical, user-configurable events occur associated with any of the ports under
its control. This eliminates the need to continuously poll the modules.
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: FPC401
3
FPC401
SNLS553 – DECEMBER 2016
www.ti.com
6 Device and Documentation Support
6.1 Documentation Support
6.1.1 Related Documentation
For related documentation, see the following:
• FPC401 Programmer's Guide (SNLU221)
• FPC401 Evaluation Module (EVM) User's Guide (SNLU222)
Click here to request access to these documents in the FPC401 MySecure folder.
6.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
6.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
6.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
7 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
4
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: FPC401
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
FPC401RHUR
ACTIVE
Package Type Package Pins Package
Drawing
Qty
WQFN
RHU
56
2000
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-2-260C-1 YEAR
Op Temp (°C)
Device Marking
(4/5)
-40 to 85
FPC401
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
FPC401RHUR
Package Package Pins
Type Drawing
WQFN
RHU
56
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
24.4
Pack Materials-Page 1
5.3
B0
(mm)
K0
(mm)
P1
(mm)
11.3
1.0
8.0
W
Pin1
(mm) Quadrant
24.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Oct-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
FPC401RHUR
WQFN
RHU
56
2000
367.0
367.0
45.0
Pack Materials-Page 2
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