Texas Instruments | DS92LV242x 10-MHz to 75-MHz, 24-Bit Channel Link II Serializer And Deserializer (Rev. C) | Datasheet | Texas Instruments DS92LV242x 10-MHz to 75-MHz, 24-Bit Channel Link II Serializer And Deserializer (Rev. C) Datasheet

Texas Instruments DS92LV242x 10-MHz to 75-MHz, 24-Bit Channel Link II Serializer And Deserializer (Rev. C) Datasheet
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DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
DS92LV242x 10-MHz to 75-MHz, 24-Bit Channel Link II Serializer And Deserializer
1 Features
3 Description
•
•
•
The DS92LV242x chipset translates a parallel 24–bit
LVCMOS data interface into a single high-speed CML
serial interface with embedded clock information. This
single serial stream eliminates skew issues between
clock and data, reduces connector size, and reduces
interconnect cost for transferring a 24-bit or less bus
over FR-4 printed-circuit board backplanes and
balanced cables. In addition, the DS92LV242x
chipset also features a 3-bit control bus for slow
speed signals. This allows for video and display
applications with up to 24 bits per pixel (RGB).
1
•
•
•
•
•
•
•
•
24-Bit Data, 3-Bit Control, 10- to 75-MHz Clock
AC-Coupled STP Interconnect Cable up to 10 m
Integrated Terminations on Serializer and
Deserializer
At-Speed Link BIST Mode and Reporting Pin
Optional I2C-Compatible Serial Control Bus
Power-Down Mode Minimizes Power Dissipation
1.8-V or 3.3-V Compatible LVCMOS I/O Interface
–40° to 85°C Temperature Range
>8-kV HBM
Serializer (DS92LV2421)
– Data Scrambler for Reduced EMI
– DC-Balance Encoder for AC Coupling
– Selectable Output VOD and Adjustable
De-emphasis
Deserializer (DS92LV2422)
– Fast Random Data Lock; No Reference Clock
Required
– Adjustable Input Receiver Equalization
– LOCK (Real-Time Link Status) Reporting Pin
– EMI Minimization on Output Parallel Bus
(SSCG)
– Output Slew Control (OS)
Programmable
transmit
de-emphasis,
receive
equalization, on-chip scrambling, and DC balancing
enables longer distance transmission over lossy
cables
and
backplanes.
The
DS92LV2422
automatically locks to incoming data without an
external reference clock or special sync patterns,
providing easy plug-and-go operation. EMI is
minimized by the use of low voltage differential
signaling, receiver drive strength control, and spread
spectrum clocking capability.
The DS92LV242x chipset is programmable though an
I2C interface as well as through pins. A built-in, atspeed BIST feature validates link integrity and may
be used for system diagnostics. The DS92LV2421 is
offered in a 48-pin WQFN, and the DS92LV2422 is
offered in a 60-pin WQFN package. Both devices
operate over the full industrial temperature range of
–40°C to 85°C.
2 Applications
•
•
•
•
•
Device Information(1)
Embedded Videos and Displays
Medical Imaging and Factory Automation
Office Automation (Printers and Scanners)
Security and Video Surveillance
General-Purpose Data Communication
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DS92LV2421
WQFN (48)
7.00 mm × 7.00 mm
DS92LV2422
WQFN (60)
9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Block Diagram
VDDn
VDDIO
(1.8V or 3.3V) 1.8V
DI[7:0]
DI[15:8]
DI[23:16]
CI1
CI2
CI3
CLKIN
Graphic
Processor
OR
Video
Imager
OR
ASIC/FPGA
PDB
Channel Link II
1 Pair / AC Coupled
100 nF
100 nF
DOUT+
RIN+
DOUT-
RIN100 ohm STP Cable
DS92LV2421
Serializer
BISTEN
Optional
VDDn
VDDIO
1.8V (1.8V or 3.3V)
CMF
PDB
BISTEN
RFB
VODSEL
DeEmph
SCL
SDA
ID[x]
Optional
DAP
DS92LV2422
Deserializer
DO[7:0]
DO[15:8]
DO[23:16]
CO1
CO2
CO3
CLKOUT
24-bit RGB
Display
OR
ASIC/FPGA
LOCK
PASS
STRAP pins
not shown
SCL
SDA
ID[x]
DAP
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features .................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions ......................... 4
Specifications....................................................... 10
6.1
6.2
6.3
6.4
6.5
6.6
6.7
Absolute Maximum Ratings .................................... 10
ESD Ratings............................................................ 10
Recommended Operating Conditions..................... 10
Thermal Information ................................................ 11
Electrical Characteristics – Serializer DC ............... 11
Electrical Characteristics – Deserializer DC ........... 12
Electrical Characteristics – DC and AC Serial Control
Bus ........................................................................... 13
6.8 Timing Requirements – DC and AC Serial Control
Bus ........................................................................... 13
6.9 Timing Requirements – Serializer for CLKIN.......... 13
6.10 Timing Requirements – Serial Control Bus........... 14
6.11 Switching Characteristics – Serializer................... 14
6.12 Switching Characteristics – Deserializer............... 15
6.13 Typical Characteristics .......................................... 21
7
Detailed Description ............................................ 22
7.2
7.3
7.4
7.5
8
Functional Block Diagrams .....................................
Feature Description.................................................
Device Functional Modes........................................
Register Maps .........................................................
22
23
37
38
Application and Implementation ........................ 41
8.1 Application Information............................................ 41
8.2 Typical Applications ................................................ 42
9
Power Supply Recommendations...................... 46
9.1 Power-Up Requirements and PDB Pin ................... 46
10 Layout................................................................... 47
10.1 Layout Guidelines ................................................. 47
10.2 Layout Example .................................................... 49
11 Device and Documentation Support ................. 51
11.1
11.2
11.3
11.4
11.5
11.6
11.7
Device Support......................................................
Documentation Support ........................................
Related Links ........................................................
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
51
51
51
51
51
51
52
12 Mechanical, Packaging, and Orderable
Information ........................................................... 52
7.1 Overview ................................................................. 22
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (April 2013) to Revision C
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Updated thermal characteristic values based on latest simulation data ............................................................................. 11
•
Changed deserializer LVCMOS DC and supply current specification test conditions based on latest production tests .... 12
•
Changed IOL test condition for VOL at VDDIO = 3.3 V to 3 mA ............................................................................................... 12
•
Changed max value of Deserializer VOL to 0.45 V .............................................................................................................. 12
•
Changed test condition parameter for VOL Serial Control Characteristic ............................................................................ 13
•
Changed RPU = 10 kΩ condition for the Serial Control Bus Characteristics of tR and tF ................................................... 13
•
Added notes for serializer and deserializer switching characteristics verified by characterization ...................................... 14
•
Added corresponding pins for deserializer tCLH and tCHL parameter..................................................................................... 15
•
Added test condition to tDD deserializer parameter ............................................................................................................. 15
•
Changed corrected units for deserializer lock time and delay parameter ........................................................................... 15
•
Added serial stream and video control signal filter waveform to Feature Description ........................................................ 23
•
Changed "NA" and "Disable" term in Table 5 and Table 6 to "Off" ..................................................................................... 28
•
Changed output states to correct values based on OSS_SEL and PDB configuration in Table 7 ..................................... 29
•
Added details for Deserializer Map Select strap pin configuration ...................................................................................... 33
•
Added clarification on the state of deserializer outputs during BIST mode operation.......................................................... 33
•
Added statement to set input to low when entering BIST mode with DS90C241 or DS90UR241 ..................................... 33
•
Added note that ID[X] cannot be tied to VSS, as only four device addresses are supported ............................................. 35
•
Added RID tolerance and tablenote that RID ≠ 0 Ω to set ID[X] ......................................................................................... 35
•
Changed statement that CONFIG settings can also by programmed via register .............................................................. 37
2
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Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
DS92LV2421, DS92LV2422
www.ti.com
SNLS321C – MAY 2010 – REVISED MAY 2016
Revision History (continued)
•
Changed bit description to swap definition for Serializer RFB and VOD ............................................................................. 38
•
Changed bit definition for Deserializer OSS_SEL ............................................................................................................... 39
•
Changed definition from Reserved to MAP_SEL for Deserializer Reg 0x02[5:4] ............................................................... 39
Changes from Revision A (April 2013) to Revision B
•
Page
Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 49
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
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3
DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
5 Pin Configuration and Functions
DI9
DI8
DI7
DI6
DI5
BISTEN
VDDIO
DI4
DI3
DI2
DI1
DI0
36
35
34
33
32
31
30
29
28
27
26
25
RHS Package
48-Pin WQFN
Top View
DI10
37
24
VODSEL
DI11
38
23
De-Emph
DI12
39
22
VDDTX
DI13
40
21
PDB
DI14
41
20
DOUT+
DI15
42
19
DOUT-
DI16
43
18
RES2
DI17
44
17
VDDHS
DI18
45
16
RES1
DI19
46
15
RES0
DI20
47
14
VDDP
DI21
48
13
CONFIG[1]
1
2
3
4
5
6
7
8
9
10
11
12
DI22
DI23
CI2
CI3
CI1
ID[x]
VDDL
SCL
SDA
CLKIN
RFB
CONFIG[0]
DAP
Not to scale
Pin Functions: DS92LV2421 (Serializer)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION (2)
LVCMOS PARALLEL INTERFACE
DI[7:0]
34, 33, 32,
29, 28, 27,
26, 25
I
Parallel interface data input pins, LVCMOS with pulldown.
For 8-bit RED display: DI7 = R7 – MSB, DI0 = R0 – LSB.
DI[15:8]
42, 41, 40,
39, 38, 37,
36, 35
I
Parallel interface data input pins, LVCMOS with pulldown.
For 8-bit GREEN display: DI15 = G7 – MSB, DI8 = G0 – LSB.
DI[23:16]
2, 1, 48, 47,
46, 45, 44,
43
I
Parallel interface data input pins, LVCMOS with pulldown.
For 8-bit BLUE display: DI23 = B7 – MSB, DI16 = B0 – LSB.
I
Control signal input, LVCMOS with pulldown.
For display or video application: CI1 = Data enable input.
Control signal pulse width must be 3 clocks or longer to be transmitted when the Control
signal filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the control signal filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2
transitions per 130 clocks regardless of the control signal filter setting.
I
Control signal input, LVCMOS with pulldown.
For display or video application: CI2 = Horizontal sync input.
Control signal pulse width must be 3 clocks or longer to be transmitted when the control
signal filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the control signal filter is disabled (CONFIG[1:0] = 00). The signal is limited to 2
transitions per 130 clocks regardless of the control signal filter setting.
CI1
CI2
(1)
(2)
4
5
3
G = Ground, I = Input, O = Output, and P = Power
1= HIGH, 0 = LOW
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Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
DS92LV2421, DS92LV2422
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SNLS321C – MAY 2010 – REVISED MAY 2016
Pin Functions: DS92LV2421 (Serializer) (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION (2)
CI3
4
I
Control signal input, LVCMOS with pulldown.
For display or video application: CI3 = Vertical sync input.
CI3 is limited to 1 transition per 130 clock cycles. Thus, the minimum pulse width allowed is
130 clock cycles wide.
CLKIN
10
I
Clock input, LVCMOS with pulldown.
Latch or data strobe edge set by RFB pin.
I
Power-down mode input, LVCMOS with pulldown.
PDB = 1, serializer is enabled (normal operation).
Refer to Power-Up Requirements and PDB Pin.
PDB = 0, serializer is powered down. When the serializer is in the power-down state, the
driver outputs (DOUT±) are both logic high, the PLL is shutdown, IDD is minimized. Control
Registers are RESET.
I
Differential driver output voltage select (this can also be control by I2C register access),
LVCMOS with pulldown.
VODSEL = 1, LVDS VOD is ±420 mV, 840 mVp-p (typical) — long cable or de-emphasis
apps.
VODSEL = 0, LVDS VOD is ±280 mV, 560 mVp-p (typical) — short cable (no de-emphasis),
low power mode.
I
De-emphasis control (this can also be controlled by I2C register access), analog with pullup.
De-emphasis = open (float) - disabled.
To enable de-emphasis, tie a resistor from this pin to GND or control through register (see
Table 3).
I
Clock input latch or data strobe edge select (this can also be controlled by I2C register
access), LVCMOS with pulldown.
RFB = 1, parallel interface data and control signals are latched on the rising clock edge.
RFB = 0, parallel interface data and control signals are latched on the falling clock edge.
13, 12
I
LVCMOS with pulldown.
00: Control Signal Filter DISABLED.
01: Control Signal Filter ENABLED.
10: Reverse compatibility mode to interface with the DS90UR124 or DS99R124Q-Q1.
11: Reverse compatibility mode to interface with the DS90C124.
ID[X]
6
I
I2C serial control bus device ID address select (optional), analog.
Resistor to Ground and 10-kΩ pullup to 1.8-V rail (see Table 11).
SCL
8
I
I2C serial control bus clock input (optional), LVCMOS.
SCL requires an external pullup resistor to VDDIO.
SDA
9
I/O
BISTEN
31
I
BIST mode (optional), LVCMOS with pulldown.
BISTEN = 0, BIST is disabled (normal operation).
BISTEN = 1, BIST is enabled.
RES[2:0]
18, 16, 15
I
Reserved (tie low), LVCMOS with pulldown.
CONTROL AND CONFIGURATION
PDB
VODSEL
De-Emph
RFB
CONFIG[1:0]
21
24
23
11
I2C serial control bus data input or output (optional), LVCMOS (open drain).
SDA requires an external pullup resistor VDDIO.
CHANNEL-LINK II – CML SERIAL INTERFACE
DOUT+
20
O
Noninverting output, CML.
The output must be AC-coupled with a 0.1-µF capacitor.
DOUT–
19
O
Inverting output, CML.
The output must be AC-coupled with a 0.1-µF capacitor.
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
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5
DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
Pin Functions: DS92LV2421 (Serializer) (continued)
PIN
NAME
TYPE (1)
NO.
DESCRIPTION (2)
POWER AND GROUND (3)
VDDL
7
P
Logic power, 1.8 V ± 5%
VDDP
14
P
PLL power, 1.8 V ± 5%
VDDHS
17
P
TX high-speed logic power, 1.8 V ± 5%
VDDTX
22
P
Output driver power, 1.8 V ± 5%
VDDIO
30
P
LVCMOS I/O power, 1.8 V ± 5% or 3.3 V ± 10%
DAP
G
DAP is the large metal contact at the bottom side, located at the center of the WQFN
package. Connect to the ground plane (GND) with at least 9 vias.
GND
(3)
The VDD (VDDn and VDDIO) supply ramp must be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms, then a capacitor on the
PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.
6
NC
BISTEN
VDDR
PASS/OP_LOW
DO0/MAP_SEL0
DO1/MAP_SEL1
DO2
VDDIO
DO3/SSC0
DO4/SSC1
DO5/SSC2
DO6/SSC3
DO7
LOCK
NC
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
NKB Package
60-Pin WQFN
Top View
NC
46
30
NC
RES
47
29
VDDL
VDDIR
48
28
DO8/OSC_SEL0
RIN+
49
27
DO9/OSC_SEL1
RIN-
50
26
DO10/OSC_SEL2
CMF
51
25
DO11
ROUT+
52
24
VDDIO
ROUT-
53
23
DO12/EQ0
VDDCMLO
54
22
DO13/EQ1
VDDR
55
21
DO14/EQ2
ID[x]
56
20
DO15/EQ3
VDDPR
57
19
DO16
VDDSC
58
18
DO17/RFB
PDB
59
17
DO18/OSS_SEL
NC
60
16
NC
14
15
DO19/OS_DATA
NC
9
DO23/CONFIG[0]
13
8
CO2
12
7
CO3
VDDIO
6
CO1
DO20/LF_MODE
5
CLKOUT
11
4
VDDSC
10
3
SCL
DO22/CONFIG[1]
2
SDA
Submit Documentation Feedback
DO21/OS_CLKOUT
1
NC
DAP
Not to scale
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
DS92LV2421, DS92LV2422
www.ti.com
SNLS321C – MAY 2010 – REVISED MAY 2016
Table 1. Pin Functions: DS92LV2422 (Deserializer)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION (2)
LVCMOS PARALLEL INTERFACE
DO[7:0]
33, 34, 35,
36, 37, 39,
40, 41
I/O
Parallel interface data output pins, STRAP and LVCMOS.
For 8-bit RED display: DO7 = R7 – MSB, DO0 = R0 – LSB.
In power down (PDB = 0), outputs are controlled by the OSS_SEL (see Table 7). These pins
are inputs during power-up (see Deserializer Strap Input Pins).
DO[15:8]
20, 21, 22,
23, 25, 26,
27, 28
I/O
Parallel interface data output pins, STRAP and LVCMOS.
For 8-bit GREEN display: DO15 = G7 – MSB, DO8 = G0 – LSB.
In power down (PDB = 0), outputs are controlled by the OSS_SEL (see Table 7). These pins
are inputs during power-up (see Deserializer Strap Input Pins).
DO[23:16]
9, 10, 11,
12, 14, 17,
18, 19
I/O
Parallel interface data input pins, STRAP and LVCMOS.
For 8-bit BLUE display: DO23 = B7 – MSB, DO16 = B0 – LSB.
In power down (PDB = 0), outputs are controlled by the OSS_SEL (see Table 7). These pins
are inputs during power-up (see Deserializer Strap Input Pins).
O
Control signal output, LVCMOS.
For display or video application: CO1 = Data enable output.
Control signal pulse width must be 3 clocks or longer to be transmitted when the control
signal filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the control signal filter is disabled (CONFIG[1:0] = 00).
The signal is limited to 2 transitions per 130 clocks regardless of the control signal filter
setting.
In power down (PDB = 0), output is controlled by the OSS_SEL pin (see Table 7).
O
Control signal output, LVCMOS.
For display or video application: CO2 = Horizontal sync output.
Control signal pulse width must be 3 clocks or longer to be transmitted when the control
signal filter is enabled (CONFIG[1:0] = 01). There is no restriction on the minimum transition
pulse when the control signal filter is disabled (CONFIG[1:0] = 00).
The signal is limited to 2 transitions per 130 clocks regardless of the control signal filter
setting.
In power down (PDB = 0), output is controlled by the OSS_SEL pin (see Table 7).
CO1
CO2
6
8
CO3
7
O
Control signal output, LVCMOS.
For display or video application: CO3 = Vertical sync output.
CO3 is different than CO1 and CO2 because it is limited to 1 transition per 130 clock cycles.
Thus, the minimum pulse width allowed is 130 clock cycles wide.
The CONFIG[1:0] pins have no effect on the CO3 signal.
In power down (PDB = 0), output is controlled by the OSS_SEL pin (see Table 7).
CLKOUT
5
O
Pixel clock output, LVCMOS.
In power down (PDB = 0), output is controlled by the OSS_SEL pin (see Table 7). Data strobe
edge set by RFB.
LOCK
32
O
LOCK status output, LVCMOS.
LOCK = 1, PLL is locked, outputs are active
LOCK = 0, PLL is unlocked, DO[23:0], CO1, CO2, CO3 and CLKOUT output states are
controlled by OSS_SEL (see Table 7).
May be used as link status or to flag when video data is active (ON/OFF).
PASS
42
O
PASS output (BIST mode), LVCMOS.
PASS = 1, error free transmission.
PASS = 0, one or more errors were detected in the received payload.
Route to test point for monitoring, or leave open if unused.
CONTROL AND CONFIGURATION – STRAP PINS (3)
CONFIG[1:0]
LF_MODE
(1)
(2)
(3)
10 [DO22],
9 [DO23]
12 [DO20]
I
STRAP or LVCMOS with pulldown.
00: Control Signal Filter DISABLED.
01: Control Signal Filter ENABLED.
10: Reverse compatibility mode to interface with the DS90UR241 or DS99R241-Q1.
11: Reverse compatibility mode to interface with the DS90C241.
I
SSCG low frequency mode, STRAP or LVCMOS with pulldown.
Only required when SSCG is enabled, otherwise LF_MODE condition is a DON’T CARE (X).
LF_MODE = 1, SSCG in low frequency mode (CLK = 10 to 20 MHz).
LF_MODE = 0, SSCG in high frequency mode (CLK = 20 to 65 MHz).
This can also be controlled by I2C register access.
G = Ground, I = Input, O = Output, and P = Power
1= HIGH, 0 = LOW
For a high state, use a 10-kΩ pullup to VDDIO; for a low state, the IO includes an internal pull down. The strap pins are read upon powerup and set device configuration. Pin number DO[23:0] listed along with shared data output name in square brackets.
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
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DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
Table 1. Pin Functions: DS92LV2422 (Deserializer) (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION (2)
OS_CLKOUT
11 [DO21]
I
Output CLKOUT slew select, STRAP or LVCMOS with pulldown.
OS_CLKOUT = 1, increased CLKOUT slew rate.
OS_CLKOUT = 0, normal CLKOUT slew rate (default).
This can also be controlled by I2C register access.
OS_DATA
14 [DO19]
I
Output DO[23:0], CO1, CO2, CO3 slew select; STRAP or LVCMOS with pulldown.
OS_DATA = 1, Increased DO slew rate.
OS_DATA = 0, Normal DO slew rate (default).
This can also be controlled by I2C register access.
I
Outputs held low when LOCK = 1, STRAP or LVCMOS with pulldown.
NOTE: Do not use any other strap options with this strap function enabled.
OP_LOW = 1, all outputs are held low during power up until released by programming
OP_LOW release/set register HIGH.
NOTE: Before the device is powered up, the outputs are in TRI-STATE (see Figure 30 and
Figure 31).
OP_LOW = 0, all outputs toggle normally as soon as LOCK goes high (default).
This can also be controlled by I2C register access.
I
Output sleep state select, STRAP or LVCMOS with pulldown.
OSS_SEL is used in conjunction with PDB to determine the state of the outputs in power
down (see Table 7).
NOTE: OSS_SEL strap cannot be used if OP_LOW = 1.
This can also be controlled by I2C register access.
OP_LOW
OSS_SEL
42 [PASS]
17 [DO18]
RFB
18 [DO17]
I
Clock output strobe edge select, STRAP or LVCMOS with pulldown.
RFB = 1, parallel interface data and control signals are strobed on the rising clock edge.
RFB = 0, parallel interface data and control signals are strobed on the falling clock edge.
This can also be controlled by I2C register access.
EQ[3:0]
20 [DO15],
21 [DO14],
22 [DO13],
23 [DO12]
I
Receiver input equalization, STRAP or LVCMOS with pulldown (see Table 4).
This can also be controlled by I2C register access.
OSC_SEL[2:0]
26 [DO10],
27 [DO9],
28 [DO8]
I
Oscillator select, STRAP or LVCMOS with pulldown (see Table 8 and Table 9).
This can also be controlled by I2C register access.
SSC[3:0]
34 [DO6],
35 [DO5],
36 [DO4],
37 [DO3]
I
Spread spectrum clock generation (SSCG) range select, STRAP or LVCMOS with pulldown
(see Table 5 and Table 6).
This can also be controlled by I2C register access.
40 [D],
41 [D]
I
Bit mapping reverse compatibility or DS90UR241 options, STRAP or LVCMOS with pulldown.
Pin or register control. Default setting is 00'b (see Table 10).
MAP_SEL[1:0]
CONTROL AND CONFIGURATION
PDB
59
I
Power-down mode input, LVCMOS with pulldown.
PDB = 1, deserializer is enabled (normal operation). Refer to Power-Up Requirements and
PDB Pin.
PDB = 0, deserializer is in power down.
When the deserializer is in the power-down state, the LVCMOS output state is determined by
Table 7. Control registers are RESET.
ID[X]
56
I
I2C serial control bus device ID Address Select (optional), analog.
Resistor to ground and 10-kΩ pullup to 1.8-V rail (see Table 11).
SCL
3
I
I2C serial control bus clock input (optional), LVCMOS.
SCL requires an external pullup resistor to VDDIO.
SDA
2
I/O
BISTEN
44
I
BIST enable input (optional), LVCMOS with pulldown.
BISTEN = 0, BIST is disabled (normal operation).
BISTEN = 1, BIST is enabled.
47
I
Reserved (tie low), LVCMOS with pulldown.
1, 15, 16,
30, 31, 45,
46, 60
—
RES
NC
8
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I2C serial control bus data input or output (optional), LVCMOS open drain.
SDA requires an external pullup resistor to VDDIO.
Not connected, leave pin open (float).
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Table 1. Pin Functions: DS92LV2422 (Deserializer) (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION (2)
CHANNEL-LINK II — CML SERIAL INTERFACE
RIN+
49
I
True input, CML. The input must be AC-coupled with a 0.1-μF capacitor.
RIN-
50
I
Inverting input, CML. The input must be AC-coupled with a 0.1-μF capacitor.
CMF
51
I
Common-mode filter, analog.
VCM center-tap is a virtual ground which may be AC-coupled to ground to increase receiver
common mode noise immunity. Recommended value is 4.7 μF or higher.
ROUT+
52
O
True output (receive signal after the equalizer), CML.
NC if not used or connect to test point for monitor. Requires I2C control to enable.
ROUT-
53
O
Inverting output (receive signal after the equalizer), CML.
NC if not used or connect to test point for monitor. Requires I2C control to enable.
POWER AND GROUND (4)
VDDL
29
P
Logic power, 1.8 V ± 5%
VDDIR
48
P
Input power, 1.8 V ± 5%
VDDR
43, 55
P
RX high-speed logic power, 1.8 V ± 5%
VDDSC
4, 58
P
SSCG power, 1.8 V ± 5%
VDDPR
57
P
PLL power, 1.8 V ± 5%
VDDCMLO
54
P
RX high-speed logic power, 1.8 V ± 5%
13, 24, 38
P
LVCMOS I/O power, 1.8 V ± 5% or 3.3 V ± 10% (VDDIO)
DAP
G
DAP is the large metal contact at the bottom side, located at the center of the WQFN
package. Connected to the ground plane (GND) with at least 9 vias.
VDDIO
GND
(4)
The VDD (VDDn and VDDIO) supply ramp must be faster than 1.5 ms with a monotonic rise. If slower then 1.5 ms, then a capacitor on the
PDB pin is needed to ensure PDB arrives after all the VDD have settled to the recommended operating voltage.
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN
MAX
UNIT
Supply voltage, VDDn (1.8 V)
–0.3
2.5
V
Supply voltage, VDDIO
–0.3
4
V
LVCMOS I/O voltage
–0.3
VDDIO + 0.3
V
Receiver input voltage
–0.3
VDD + 0.3
V
–0.3
VDD + 0.3
V
225
mW
1 / RθJA
mW/°C
Driver output voltage
48L RHS package
60L NKB package
Maximum power dissipation capacity at 25°C
Derate above 25°C
Maximum power dissipation capacity at 25°C
Derate above 25°C
525
mW
1 / RθJA
mW/°C
150
°C
150
°C
Junction temperature, TJ
Storage temperature, Tstg
(1)
(2)
(3)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
For soldering specifications, see product folder at www.ti.com and SNOA549.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
±8000
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±1000
Machine model (MM)
V(ESD)
Electrostatic discharge
IEC 61000-4-2 contact discharge
IEC 61000-4-2 air-gap discharge
(1)
(2)
UNIT
±250
DOUT+, DOUT-
≥±8000
RIN+, RIN-
≥±8000
DOUT+, DOUT-
≥±25000
RIN+, RIN-
≥±25000
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
NOM
MAX
UNIT
VDDn
Supply voltage
1.71
1.8
1.89
V
VDDIO
LVCMOS supply voltage
1.71
1.8
1.89
V
VDDIO
LVCMOS supply voltage
3
3.3
3.6
V
Clock frequency
10
Supply noise (1)
TA
(1)
10
Operating free-air temperature
–40
25
75
MHz
50
mVp-p
85
°C
Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC-coupled to the VDDn (1.8 V) supply with
amplitude = 100 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the serializer and output of the deserializer
with 10 meter cable shows no error when the noise frequency on the serializer is less than 750 kHz. The deserializer, on the other hand,
shows no error when the noise frequency is less than 400 kHz.
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6.4 Thermal Information
Over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC
(1)
DS92LV2421
DS92LV2422
RHS (WQFN)
NKB (WQFN)
48 PINS
60 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance (2)
30.3
26.9
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance (2)
11.5
9.1
°C/W
RθJB
Junction-to-board thermal resistance
7.3
6
°C/W
ψJT
Junction-to-top characterization parameter
0.1
0.1
°C/W
ψJB
Junction-to-board characterization parameter
7.3
6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
2.7
1.5
°C/W
(1)
(2)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Based on nine thermal vias.
6.5 Electrical Characteristics – Serializer DC
Over recommended operating supply and temperature ranges (unless otherwise noted). (1) (2) (3)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
LVCMOS INPUT DC SPECIFICATIONS
VIH
High level input voltage
VIL
Low level input voltage
IIN
Input current
VDDIO = 3 V to 3.6 V (DI[23:0], CI1,CI2,CI3, CLKIN, PDB,
VODSEL, RFB, BISTEN, and CONFIG[1:0] pins)
2.2
VDDIO
0.65 × VDDIO
VDDIO
VDDIO = 3 V to 3.6 V (DI[23:0], CI1,CI2,CI3, CLKIN, PDB,
VODSEL, RFB, BISTEN, and CONFIG[1:0] pins)
GND
0.8
VDDIO = 1.71 V to 1.89 V (DI[23:0], CI1,CI2,CI3, CLKIN, PDB,
VODSEL, RFB, BISTEN, and CONFIG[1:0] pins)
GND
0.35 × VDDIO
VDDIO = 1.71 V to 1.89 V (DI[23:0], CI1,CI2,CI3, CLKIN, PDB,
VODSEL, RFB, BISTEN, and CONFIG[1:0] pins)
V
VIN = 0 V or VDDIO (DI[23:0],
VDDIO = 3 V to 3.6 V
CI1,CI2,CI3, CLKIN, PDB, VODSEL,
RFB, BISTEN, and CONFIG[1:0] pins) VDDIO = 1.7 V to 1.89 V
V
–15
±1
15
–15
±1
15
μA
CML DRIVER DC SPECIFICATIONS
±205
±280
±355
Differential output voltage
RL = 100 Ω, de-emphasis = disabled
(see Figure 2; DOUT+ and DOUT–
pins)
VODSEL = 0
VOD
VODSEL = 1
±320
±420
±520
Differential output voltage
(DOUT+) – (DOUT-)
RL = 100 Ω, de-emphasis = disabled
(see Figure 2; DOUT+ and DOUT–
pins)
VODSEL = 0
560
VODp-p
VODSEL = 1
840
ΔVOD
Output voltage unbalance
RL = 100 Ω, de-emphasis = disabled, VODSEL = L (DOUT+ and
DOUT– pins)
VOS
Offset voltage
(single-ended)
At TP A and B (see Figure 1), RL =
100 Ω, de-emphasis = disabled
(DOUT+ and DOUT– pins)
ΔVOS
Offset voltage unbalance
(single-ended)
At TP A and B (see Figure 1), RL = 100 Ω,
de-emphasis = disabled (DOUT+ and DOUT– pins)
IOS
Output short circuit current
DOUT± = 0 V, de-emphasis = disabled,
VODSEL = 0 (DOUT+ and DOUT– pins)
RTO
Internal output termination
resistor
DOUT+ and DOUT– pins
(1)
(2)
(3)
1
VODSEL = 0
1.65
VODSEL = 1
1.575
80
mV
mVp-p
50
mV
V
1
mV
–36
mA
100
120
Ω
The electrical characteristics tables list verified specifications under the listed recommended operating conditions except as otherwise
modified or specified by the electrical characteristics conditions or notes. Typical specifications are estimations only and are not verified.
Typical values represent most likely parametric norms at VDD = 3.3 V, TA = 25°C, and at the recommended operation conditions at the
time of product characterization and are not verified.
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH, and VTL, which are differential voltages.
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Electrical Characteristics – Serializer DC (continued)
Over recommended operating supply and temperature ranges (unless otherwise noted).(1)(2)(3)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
75
90
UNIT
SUPPLY CURRENT
IDDT1
Serializer supply current
(includes load current)
IDDIOT1
IDDT2
Serializer supply current
(includes load current)
IDDIOT2
IDDZ
Serializer supply current
power-down
RL = 100 Ω, CLKIN = 75 MHz,
checker board pattern,
de-emphasis = 3 kΩ, VODSEL = H
(see Figure 9)
VDD = 1.89 V
RL = 100 Ω, CLKIN = 75 MHz,
checker board pattern,
de-emphasis = 6 kΩ, VODSEL = L
(see Figure 9)
PDB = 0 V, All other LVCMOS Inputs
=0V
IDDIOZ
VDDIO = 1.89 V
3
5
VDDIO = 3.6 V
11
15
VDD = 1.89 V
65
80
VDDIO = 1.89 V
3
5
VDDIO = 3.6 V
11
15
VDD = 1.89 V
40
1000
VDDIO = 1.89 V
5
10
VDDIO = 3.6 V
10
20
mA
mA
µA
6.6 Electrical Characteristics – Deserializer DC
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
3.3-V I/O LVCMOS DC SPECIFICATIONS (VDDIO = 3 V TO 3.6 V)
VIH
High level input voltage
PDB and BISTEN pins
2.2
VDDIO
VIL
Low level input voltage
PDB and BISTEN pins
GND
0.8
V
IIN
Input current
VIN = 0 V or VDDIO (PDB and BISTEN pins)
15
μA
VOH
High level output voltage
IOH = −2 mA, OS_CLKOUT/DATA = L (DO[23:0], CO1,
CO2, CO3, CLKOUT, LOCK, and PASS pins)
VOL
Low level output voltage
IOL = 3 mA, OS_CLKOUT/DATA = L (DO[23:0], CO1,
CO2, CO3, CLKOUT, LOCK, and PASS pins)
GND
Output short circuit current
VDDIO = 3.3 V, VOUT = 0 V, OS_CLKOUT/DATA = L/H
(CLKOUT pin)
36
Output short circuit current
VDDIO = 3.3 V, VOUT = 0 V, OS_CLKOUT/DATA = L/H
(output pins)
37
TRI-STATE output current
PDB = 0 V, OSS_SEL = 0 V, VOUT = H (output pins)
IOS
IOZ
−15
±1
2.4
VDDIO
V
0.4
V
mA
−15
15
µA
1.8-V I/O LVCMOS DC SPECIFICATIONS (VDDIO = 1.71 V to 1.89 V)
VIH
High level input voltage
PDB and BISTEN pins
1.235
VDDIO
V
VIL
Low level input voltage
PDB and BISTEN pins
GND
0.595
V
IIN
Input current
VIN = 0 V or VDDIO (PDB and BISTEN pins)
−15
±1
15
μA
VOH
High level output voltage
IOH = –2 mA, OS_CLKOUT/DATA = L/H (DO[23:0],
CO1, CO2, CO3, CLKOUT, LOCK, and PASS pins)
VDDIO – 0.45
VDDIO
VOL
Low level output voltage
IOL = 2 mA, OS_CLKOUT/DATA = L/H (DO[23:0],
CO1, CO2, CO3, CLKOUT, LOCK, and PASS pins)
GND
Output short circuit current
VDDIO = 1.8 V, VOUT = 0 V, OS_CLKOUT/DATA = L/H
(CLKOUT pin)
18
Output short circuit current
VDDIO = 1.8 V, VOUT = 0 V, OS_CLKOUT/DATA = L/H
(output pins)
18
TRI-STATE output current
PDB = 0 V, OSS_SEL = 0 V, VOUT = 0 V or VDDIO
(output pins)
–15
IOS
IOZ
V
0.45
V
mA
15
µA
CML RECEIVER DC SPECIFICATIONS
VTH
Differential input threshold high
voltage
VCM = 1.2 V, RIN+ and RIN- pins (Internal VBIAS)
50
VTL
Differential input threshold low voltage
VCM = 1.2 V, RIN+ and RIN- pins (Internal VBIAS)
–50
VCM
Common mode voltage
RIN+ and RIN- pins (Internal VBIAS)
IIN
Input current
VIN = 0 V or VDDIO, RIN+ and RIN- pins
RTI
Internal input termination resistor
RIN+ and RIN- pins
mV
mV
1.2
–15
80
100
V
15
µA
120
Ω
LOOP THROUGH CML DRIVER OUTPUT DC SPECIFICATIONS (EQ TEST PORT (1))
VOD
Differential output voltage
ROUT+ and ROUT- pins, RL = 100 Ω
542
mV
VOS
Offset voltage
(single-ended)
ROUT+ and ROUT- pins, RL = 100 Ω
1.4
V
(1)
12
Specification is verified by characterization and is not tested in production.
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Electrical Characteristics – Deserializer DC (continued)
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
RT
Internal termination resistor
TEST CONDITIONS
MIN
TYP
MAX
UNIT
80
100
120
Ω
VDD = 1.89 V
97
115
VDDIO = 1.89 V
40
50
VDDIO = 3.6 V
75
85
VDD = 1.89 V
100
3000
ROUT+ and ROUT- pins
SUPPLY CURRENT
IDD1
IDDIO1
IDDZ
Deserializer supply current (includes
load current)
Deserializer supply current power
down
CLKOUT = 75 MHz, checker
board pattern,
OS_CLKOUT/DATA = H,
CL = 4 pF (see Figure 9)
PDB = 0 V, All other LVCMOS
Inputs = 0 V
IDDIOZ
VDDIO = 1.89 V
6
50
VDDIO = 3.6 V
12
100
mA
µA
6.7 Electrical Characteristics – DC and AC Serial Control Bus
Over 3.3-V supply and temperature ranges (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
VIH
Input high level
SDA and SCL
2.2
VIL
Input low level voltage
SDA and SCL
GND
VHY
Input hysteresis
VOL
Output low level voltage (1)
SDA, IOL = 1.25 mA, VDDIO = 3.3 V
Iin
Input current
SDA or SCL, Vin = VDDIO or GND
Cin
Input capacitance
SDA or SCL
(1)
TYP
MAX
UNIT
VDDIO
V
0.8
>50
0
–15
V
mV
0.4
V
15
µA
<5
pF
Specification is verified by characterization and is not tested in production.
6.8 Timing Requirements – DC and AC Serial Control Bus
Over 3.3-V supply and temperature ranges (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tR
SDA rise time (read)
SDA, RPU = 10 kΩ, Cb ≤ 400 pF
40
ns
tF
SDA fall time (read)
SDA, RPU = 10 kΩ, Cb ≤ 400 pF
25
ns
tSU;DAT
Set up time (read)
520
ns
tHD;DAT
Hold up time (read)
55
ns
tSP
Input filter
50
ns
6.9 Timing Requirements – Serializer for CLKIN
Over recommended operating supply and temperature ranges (unless otherwise noted).
MIN
NOM
MAX
UNIT
tTCP
Transmit input CLKIN period
PARAMETER
10 MHz to 75 MHz (see Figure 4)
13.3
T
100
ns
tTCIH
Transmit input CLKIN high time
10 MHz to 75 MHz (see Figure 4)
0.4 × T
0.5 × T
0.6 × T
ns
tTCIL
Transmit input CLKIN low time
10 MHz to 75 MHz (see Figure 4)
0.4 × T
0.5 × T
0.6 × T
ns
tCLKT
CLKIN input transition time
10 MHz to 75 MHz (see Figure 4)
0.5
SSCIN
CLKIN input
TEST CONDITIONS
fmod (spread spectrum at 75 MHz)
fdev (spread spectrum at 75 MHz)
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2.4
ns
35
kHz
±2%
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6.10 Timing Requirements – Serial Control Bus
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
NOM
MAX
Standard mode
100
Fast mode
400
fSCL
SCL clock frequency
tLOW
SCL low period
tHIGH
SCL high period
tHD;STA
Hold time for a start or a repeated start
condition (see Figure 18)
Standard mode
Fast mode
0.6
tSU:STA
Set up time for a start or a repeated
start condition (see Figure 18)
Standard mode
4.7
Fast mode
0.6
tHD;DAT
Data hold time
(see Figure 18)
Standard mode
0
3.45
Fast mode
0
0.9
tSU;DAT
Data set up time
(see Figure 18)
Standard mode
250
Fast mode
100
tSU;STO
Set up time for STOP condition
(see Figure 18)
Standard mode
Fast mode
0.6
tBUF
Bus free time (between STOP and
START; see Figure 18)
Standard mode
4.7
Fast mode
1.3
tr
SCL and SDA rise time
(see Figure 18)
Standard mode
Fast mode
300
tf
SCL and SDA fall time
(see Figure 18)
Standard mode
300
Fast mode
300
Standard mode
4.7
Fast mode
1.3
Standard mode
kHz
μs
4
Fast mode
UNIT
μs
0.6
4
μs
μs
μs
ns
4
μs
μs
1000
ns
ns
6.11 Switching Characteristics – Serializer
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tLHT
Serializer output low-to-high
transition time (see Figure 3)
RL = 100 Ω, de-emphasis = disabled, VODSEL = 0
200
RL = 100 Ω, de-emphasis = disabled, VODSEL = 1
200
tHLT
Serializer output high-to-low
transition time (see Figure 3)
RL = 100 Ω, de-emphasis = disabled, VODSEL = 0
200
RL = 100 Ω, de-emphasis = disabled, VODSEL = 1
200
tDIS
Input data, setup time
(see Figure 4)
DI[23:0], CI1, CI2, CI3 to CLKIN
2
ns
tDIH
Input data, hold time
(see Figure 4)
CLKIN to DI[23:0], CI1, CI2, CI3
2
ns
tXZD
Serializer output active to OFF
delay (see Figure 6) (1)
tPLD
Serializer PLL lock time
(see Figure 5) (1) (2) (3)
tSD
Serializer delay, latency
(see Figure 7) (1)
(1)
(2)
(3)
14
ps
ps
8
15
ns
RL = 100 Ω
1.4
10
ms
RL = 100 Ω
144 × T
145 × T
ns
Specification is verified by characterization and is not tested in production.
tPLD and tDDLT is the time required by the serializer and deserializer, respectively, to obtain lock when exiting power-down state with an
active clock.
When the serializer output is at TRI-STATE the Deserializer loses PLL lock. Resynchronization and Re-lock must occur before data
transfer require tPLD
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Switching Characteristics – Serializer (continued)
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
Serializer output total jitter
(see Figure 8)
tDJIT
λSTXBW
δSTX
(4)
Serializer jitter transfer
(function –3 dB bandwidth)
Serializer jitter transfer
(function peaking)
TEST CONDITIONS
MIN
TYP
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 75 MHz
0.28
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 43 MHz
0.27
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 10 MHz
0.35
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 75 MHz
3.3
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 43 MHz
2.3
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 10 MHz
0.8
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 75 MHz
0.86
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 43 MHz
0.83
RL = 100 Ω, de-emphasis = disabled, RANDOM
pattern, CLKIN = 10 MHz
0.28
MAX
UNIT
UI (4)
MHz
dB
UI – Unit Interval is equivalent to one serialized data bit width (1 UI = 1 / [28 x CLK]). The UI scales with clock frequency.
6.12 Switching Characteristics – Deserializer
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
tRCP
CLK output period
tRDC
CLK output duty cycle
TEST CONDITIONS
MIN
TYP
MAX
UNIT
13.3
T
100
ns
SSCG = OFF, 10 to 75 MHz
40%
50%
60%
SSCG = ON, 10 to 20 MHz
35%
59%
65%
SSCG = ON, 10 to 65 MHz
40%
53%
60%
tRCP = tTCP (CLKOUT)
CLKOUT
VDDIO = 1.8 V, CL = 4 pF,
OS_CLKOUT/DATA = L
2.1
VDDIO = 3.3 V, CL = 4 pF,
OS_CLKOUT/DATA = H
2
VDDIO = 1.8 V, CL = 4 pF,
OS_CLKOUT/DATA = L
1.6
VDDIO = 3.3 V, CL = 4 pF,
OS_CLKOUT/DATA = H
1.5
LVCMOS low-to-high transition
time (see Figure 10)
DO[23:0], CO1,
CO2, CO3
LVCMOS high-to-low transition
time (see Figure 10)
DO[23:0], CO1,
CO2, CO3
tROS
Data valid before CLKOUT,
setup time (see Figure 14)
VDDIO = 1.71 to 1.89 V or 3 to 3.6 V, CL = 4 pF
(lumped load), DO[23:0], CO1, CO2, CO3
0.23 × T
0.5 × T
ns
tROH
Data valid after CLKOUT, hold
time (see Figure 14)
VDDIO = 1.71 to 1.89 V or 3 to 3.6 V, CL = 4 pF
(lumped load), DO[23:0], CO1, CO2, CO3
0.33 × T
0.5 × T
ns
tCLH
tCHL
CLKOUT = 10 MHz, SSC[3:0] = OFF (1)
tDDLT
tDD
(1)
(2)
Deserializer lock time
(see Figure 13)
Deserializer delay, latency (see
Figure 11)
CLKOUT = 75 MHz, SSC[3:0] = OFF
(1)
ns
ns
3
4
CLKOUT = 10 MHz, SSC[3:0] = ON (1)
30
CLKOUT = 65 MHz, SSC[3:0] = ON (1)
6
CLKOUT = 10 to 75 MHz, SSC[3:0] = OFF (2)
139 × T
ms
140 × T
ns
tPLD and tDDLT is the time required by the serializer and deserializer, respectively, to obtain lock when exiting power-down state with an
active clock.
Specification is verified by design and is not tested in production.
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Switching Characteristics – Deserializer (continued)
Over recommended operating supply and temperature ranges (unless otherwise noted).
PARAMETER
tDPJ
Deserializer period jitter
tDCCJ
Deserializer cycle-to-cycle jitter
TEST CONDITIONS
TYP
MAX
CLKOUT = 10 MHz
500
1000
SSC[3:0] = OFF (3) (2) CLKOUT = 65 MHz
550
1250
CLKOUT = 75 MHz
435
900
CLKOUT = 10 MHz
375
900
CLKOUT = 65 MHz
500
1150
CLKOUT = 75 MHz
460
1000
jitter freq < 2 MHz
0.9
jitter freq > 6 MHz
0.5
SSC[3:0] =
OFF (4) (2) (5)
EQ = OFF,
Deserializer input jitter tolerance
SSCG = OFF,
(see Figure 16)
CLKOUT = 75 MHz
tIJT
MIN
UNIT
ps
ps
UI (6)
BIST MODE
tPASS
BIST PASS valid time
(see Figure 17)
BISTEN = 1
1
10
μs
SSCG MODE
fDEV
Spread spectrum clocking
deviation frequency
CLKOUT = 10 to 65 MHz, SSC[3:0] = ON
±0.5%
±2%
fMOD
Spread spectrum clocking
modulation frequency
CLKOUT = 10 to 65 MHz, SSC[3:0] = ON
8
100
(3)
(4)
(5)
(6)
kHz
tDPJ is the maximum amount the period is allowed to deviate over many samples.
Specification is verified by characterization and is not tested in production.
tDCCJ is the maximum amount of jitter between adjacent clock cycles.
UI – Unit Interval is equivalent to one serialized data bit width (1 UI = 1 / [28 x CLK]). The UI scales with clock frequency.
A
A'
CA
Scope
50:
50:
B
CB
B'
50:
50:
Single-Ended
Figure 1. Serializer Test Circuit
DOUT+
VOD-
VOD+
DOUT-
VOS
VOD+
(DOUT+) - (DOUT+)
VODp-p
0V
VOD-
Differential
GND
Figure 2. Serializer Output Waveforms
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+VOD
80%
(DOUT+) - (DOUT-)
0V
20%
-VOD
tLLHT
tLHLT
Figure 3. Serializer Output Transition Times
tTCIH
tTCP
CLKIN
w/ RFB = L
tTCIL
80%
20%
1/2 VDDIO
tCLKT
tDIS
GND
tCLKT
VDDIO
VIHmin
VILmax
DI[23:0],
CI1,CI2,CI3
VDDIO
GND
tDIH
Figure 4. Serializer Input CLKIN Waveform and Set and Hold Times
PDB
CLKIN
1/2 VDDIO
"X"
active
tPLD
DOUT
(Diff.)
Driver OFF, VOD = 0V
Driver On
Figure 5. Serializer Lock Time
1/2 VDDIO
PDB
CLKIN
active
"X"
tXZD
DOUT
(Diff.)
active
Driver OFF, VOD = 0V
Figure 6. Serializer Disable Time
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DIN[23:0],
CI1,CI2,CI3
SYMBOL N
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SYMBOL N+1
tSD
CLKIN
(RFB = L)
START
BIT
STOP START
BIT BIT
STOP
BIT
DOUT
(Diff.)
SYMBOL N-1
SYMBOL N
Figure 7. Serializer Latency Delay
tDJIT
tDJIT
VOD (+)
DOUT
(Diff.)
TxOUT_E_O
0V
VOD (-)
tBIT (1 UI)
Figure 8. Serializer Output Jitter
VDDIO
CLKIN/
CLKOUT
w/ RFB = L
GND
VDDIO
DI/DO (odd),
CI2/CO2, CI3/CO3
GND
VDDIO
DI/DO (even),
CI1/CO1
GND
Figure 9. Checkerboard Data Pattern
VDDIO
80%
20%
GND
tCLH
tCHL
Figure 10. Deserializer LVCMOS Transition Times
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START
BIT
STOP START
BIT BIT
STOP
BIT
RIN
(Diff.)
SYMBOL N
SYMBOL N+1
tDD
CLKOUT
(RFB = L)
DO[23:0],
CO1,CO2,CO3
SYMBOL N-2
SYMBOL N-1
SYMBOL N
Figure 11. Deserializer Delay – Latency
1/2 VDDIO
PDB
RIN
(Diff.)
active
"X"
tXZR
CLKOUT,
DO[23:0],
CO1,CO2,CO3
PASS, LOCK
active
Z (TRI-STATE)
Figure 12. Deserializer Disable Time (OSS_SEL = 0)
PDB
2.0V
0.8V
RIN
(Diff.)
'RQ¶W &DUH
tDDLT
LOCK
TRI-STATE
or LOW
Z or L
tRxZ
DO[23:0],
CO1,CO2,CO3
TRI-STATE or LOW or Pulled Up
CLKOUT
(RFB = L)
Z or L or PU
TRI-STATE or LOW
OFF
IN LOCK TIME
Z or L
ACTIVE
OFF
Figure 13. Deserializer PLL Lock Times and PDB Tri-State Delay
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VDDIO
CLKOUT
w/ RFB = H
1/2 VDDIO
GND
VDDIO
DO[23:0],
CO1,CO2,CO3
1/2 VDDIO
1/2 VDDIO
GND
tROS
tROH
Figure 14. Deserializer Output Data Valid (Setup and Hold) Times With SSCG = Off
VDDIO
CLKOUT
w/ RFB = H
1/2 VDDIO
GND
DO[23:0],
CO1,CO2,CO3
1/2 VDDIO
1/2 VDDIO
tROS
tROH
VDDIO
GND
Figure 15. Deserializer Output Data Valid (Setup And Hold) Times With SSCG = On
Ideal Data
Bit End
Sampling
Window
Ideal Data Bit
Beginning
RxIN_TOL
Left
VTH
0V
VTL
RxIN_TOL
Right
Ideal Center Position (tBIT/2)
tBIT (1 UI)
tRJIT
= RxIN_TOL (Left + Right)
- tRJIT
Sampling Window = 1 UI
Figure 16. Receiver Input Jitter Tolerance
BISTEN
1/2 VDDIO
tPASS
PASS
(w/ errors)
1/2 VDDIO
Prior BIST Result
Current BIST Test - Toggle on Error
Result Held
Figure 17. BIST Pass Waveform
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SDA
tLOW
tf
tHD;STA
tr
tf
tr
tBUF
tSP
SCL
tSU;STA
tHD;STA
tHIGH
tHD;DAT
START
tSU;STO
tSU;DAT
STOP
REPEATED
START
START
Figure 18. Serial Control Bus Timing Diagram
6.13 Typical Characteristics
Figure 19. Differential Output Voltage
vs Ambient Temperature
Figure 20. ROUT (CMLOUT) VOD
vs Ambient Temperature
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7 Detailed Description
7.1 Overview
The DS92LV242x chipset transmits and receives 24 bits of data and 3 control signals over a single serial CML
pair operating at 280 Mbps to 2.1 Gbps. The serial stream also contains an embedded clock, video control
signals, and the DC-balance information which enhances signal quality and supports AC coupling.
The deserializer can attain lock to a data stream without the use of a separate reference clock source, which
greatly simplifies system complexity and overall cost. The deserializer also synchronizes to the serializer
regardless of the data pattern, delivering true automatic plug and lock performance. It can lock to the incoming
serial stream without the need of special training patterns or sync characters. The deserializer recovers the clock
and data by extracting the embedded clock information, validating, and then deserializing the incoming data
stream, providing a parallel LVCMOS video bus to the display, ASIC, or FPGA.
The DS92LV242x chipset can operate in 24-bit color depth (with DE, HS, VS encoded within the serial data
stream). In 18-bit color applications, the three video control signals may be sent encoded within the serial bit
stream (restrictions apply, see Video Control Signal Filter – Serializer and Deserializer) along with six additional
general-purpose signals.
7.2 Functional Block Diagrams
RFB
CLKIN
PLL
Parallel to Serial
Input Latch
DI[23:0]
CI1/DE
CI2/HS
CI3/VS
DC Balance Encoder
VODSEL
De-Emph
DOUT+
DOUT-
Pattern
Generator
PDB
SCL
SCA
ID[x]
Timing and
Control
BISTEN
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Figure 21. DS92LV2421 – Serializer
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Functional Block Diagrams (continued)
STRAP INPUT
SSCG
CMF
RIN+
EQ
DO[23:0]
Output Latch
Serial to Parallel
ROUT-
DC Balance Decoder
ROUT+
CO1/DE
CO2/HS
CO3/VS
LF_MODE
OS_CLKOUT
OS_DATA
OSS_SEL
RFB
EQ [3:0]
OSC_SEL [2:0]
SSC [3:0]
RINSTRAP INPUT
Error
Detector
BISTEN
PDB
SCL
SCA
ID[x]
PASS
Clock and
Data
Recovery
Timing and
Control
OP_LOW
CLKOUT
LOCK
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Figure 22. DS92LV2422 – Deserializer
7.3 Feature Description
7.3.1 Data Transfer
The DS92LV242x chipset transmits and receives a pixel of data in the following format: C1 and C0 represent the
embedded clock in the serial stream. C1 is always high and C0 is always low. The b[23:0] contains the
scrambled LVCMOS data. DCB is the DC-Balanced control bit. DCB is used to minimize the short and long-term
DC bias on the signal lines. This bit determines if the data is unmodified or inverted. DCA is used to validate data
integrity in the embedded data stream and can also contain encoded control (VS, HS, DE). Both DCA and DCB
coding schemes are generated by the serializer and decoded by the deserializer automatically. Figure 23
illustrates the serial stream per clock cycle.
NOTE
Figure 23 only illustrates the bits but does not actually represent the bit location as the bits
are scrambled and balanced continuously.
C
1
b
0
b
1
D
C
B
b
2
b
1
2
b
3
b
1
3
b
4
b
1
4
b
5
b
1
5
b
6
b
1
6
b
7
b
1
7
b
8
b
1
8
b
9
b
1
9
b
1
0
b
2
0
b
1
1
b
2
1
D
C
A
b
2
2
b
2
3
C
0
Figure 23. Channel Link II Serial Stream (DS92LV242x)
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Feature Description (continued)
7.3.2 Video Control Signal Filter – Serializer and Deserializer
When operating the devices in normal mode, the video control signals (DE, HS, VS) have the following
restrictions:
• Normal mode with control signal filter enabled:
– DE and HS: Only 2 transitions per 130 clock cycles are transmitted, the transition pulse must be 3 CLK
cycles or longer.
• Normal mode with control signal filter disabled:
– DE and HS: Only 2 transitions per 130 clock cycles are transmitted, no restriction on minimum transition
pulse.
• VS: Only 1 transition per 130 clock cycles are transmitted, minimum pulse width is 130 clock cycles.
Video control signals are defined as low frequency signals with limited transitions. Glitches of a control signal can
cause a visual display error. This feature allows for the chipset to validate and filter out any high frequency noise
on the control signals (see Figure 24).
CLKIN
HS/VS/DE
IN
Latency
CLKOUT
HS/VS/DE
OUT
Pulses 1 or 2
CLK cycles wide
Filtered OUT
Figure 24. Video Control Signal Filter Waveform
7.3.3 Serializer Functional Description
The serializer converts a wide parallel input bus to a single serial output data stream and also acts as a signal
generator for the chipset Built In Self Test (BIST) mode. The device can be configured through external pins or
through the optional serial control bus. The serializer features enhance signal quality on the link by supporting: a
selectable VOD level, a selectable de-emphasis signal conditioning, and Channel Link II data coding that
provides randomization, scrambling, and DC balancing of the data. The serializer includes multiple features to
reduce EMI associated with display data transmission. This includes the randomization and scrambling of the
data and system spread spectrum clock support. The serializer features power-saving features with a sleep
mode, auto stop clock feature, and optional LVCMOS (1.8 V) parallel bus compatibility (see also Optional Serial
Bus Control and Built-In Self Test (BIST)).
7.3.3.1 EMI Reduction Features
7.3.3.1.1 Data Randomization and Scrambling
Channel Link II serializers and deserializers feature a three-step encoding process that enables the use of ACcoupled interconnects and also helps to manage EMI. The serializer first passes the parallel data through a
scrambler which randomizes the data. The randomized data is then DC-balanced. The DC-balanced and
randomized data then goes through a bit-shuffling circuit and is transmitted out on the serial line. This encoding
process helps to prevent static data patterns on the serial stream. The resulting frequency content of the serial
stream ranges from the parallel clock frequency to the serial Nyquist rate. For example, if the serializer and
deserializer chip set is operating at a parallel clock frequency of 75 MHz, the resulting frequency content of serial
stream ranges from 75 MHz to 1.05 GHz (75 MHz × 28 bits / 2 = 2.1 GHz / 2 = 1.05 GHz).
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Feature Description (continued)
7.3.3.1.2 Serializer Spread Spectrum Compatibility
The serializer CLKIN is capable of tracking spread spectrum clocking (SSC) from a host source. The CLKIN
accepts spread spectrum tracking up to 35-kHz modulation and ±0.5, ±1, or ±2% deviations (center spread). The
maximum conditions for the CLKIN input are: a modulation frequency of 35 kHz and amplitude deviations of ±2%
(4% total).
7.3.3.2 Signal Quality Enhancers
7.3.3.2.1 Serializer VOD Select (VODSEL)
The serializer differential output voltage may be increased by setting the VODSEL pin high. When VODSEL is
low, the DC VOD is at the standard (default) level. When VODSEL is high, the VOD is increased in level. The
increased VOD is useful in extremely high noise environments and also on extra long cable length applications.
When using de-emphasis, TI recommends setting VODSEL = H to avoid excessive signal attenuation, especially
with the larger de-emphasis settings. This feature may be controlled by the external pin or by register.
Table 2. Differential Output Voltage
INPUT
7.3.3.2.2
EFFECT
VODSEL
VOD (mV)
VOD (mVp-p)
H
±420
840
L
±280
560
Serializer De-Emphasis (De-Emph)
The de-emphasis pin controls the amount of de-emphasis beginning one full bit time after a logic transition that
the serializer drives. This is useful to counteract loading effects of long or lossy cables. This pin must be left
open for standard switching currents (no de-emphasis) or if controlled by register. De-emphasis is selected by
connecting a resistor on this pin to ground, with R value between 0.5 kΩ to 1 MΩ, or by register setting. When
using de-emphasis, TI recommends to set VODSEL = H.
Table 3. De-Emphasis Resistor Value
RESISTOR VALUE (kΩ)
DE-EMPHASIS SETTING
Open
Disabled
0.6
–12 dB
1
–9 dB
2
–6 dB
5
–3 dB
0.00
VDD = 1.8V,
-2.00
TA = 25oC
DE-EMPH (dB)
-4.00
-6.00
-8.00
-10.00
-12.00
-14.00
1.0E+02
1.0E+03
1.0E+04
1.0E+05
1.0E+06
R VALUE - LOG SCALE (:)
Figure 25. De-Emphasis vs R Value
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7.3.3.3 Power-Saving Features
7.3.3.3.1 Serializer Power-Down Feature (PDB)
The serializer has a PDB input pin to enable or power down the device. This pin is controlled by the host and is
used to save power, disabling the link when it is not needed. In power-down mode, the high-speed driver outputs
are both pulled to VDD and present a 0-V VOD state.
NOTE
In power down, the optional serial bus control registers are RESET.
7.3.3.3.2 Serializer Stop Clock Feature
The serializer enters a low power SLEEP state when the CLKIN is stopped. A STOP condition is detected when
the input clock frequency is less than 3 MHz. The clock must be held at a static low or high state. When the
CLKIN starts again, the serializer locks to the valid input clock and then transmits the serial data to the
deserializer.
NOTE
In STOP CLOCK SLEEP, the optional serial bus control register values are RETAINED.
7.3.3.3.3 1.8-V or 3.3-V VDDIO Operation
The serializer parallel bus and serial bus interface can operate with 1.8-V or 3.3-V levels (VDDIO) for host
compatibility. The 1.8-V levels offer lower noise (EMI) and also system power savings.
7.3.3.3.4 Deserializer Power-Down Feature (PDB)
The deserializer has a PDB input pin to enable or power down the device. This pin can be controlled by the
system to save power, disabling the deserializer when the display is not needed. An auto-detect mode is also
available. In this mode, the PDB pin is tied high and the deserializer enters power down when the serial stream
stops. When the serial stream starts up again, the deserializer locks to the input stream and assert the LOCK pin
and output valid data. In power-down mode, the data and CLKOUT output states are determined by the
OSS_SEL status.
NOTE
In power down, the optional serial bus control registers are RESET.
7.3.3.3.5 Deserializer Stop Stream SLEEP Feature
The deserializer enters a low power SLEEP state when the input serial stream is stopped. A STOP condition is
detected when the embedded clock bits are not present. When the serial stream starts again, the deserializer
then locks to the incoming signal and recover the data.
NOTE
In STOP STREAM SLEEP, the optional serial bus control registers values are RETAINED.
7.3.3.4 Serializer Pixel Clock Edge Select (RFB)
The RFB pin determines the edge that the data is latched on. If RFB is high, input data is latched on the rising
edge of the CLKIN. If RFB is low, input data is latched on the falling edge of the CLKIN. Serializer and
deserializer may be set differently. This feature may be controlled by the external pin or by register.
7.3.3.5 Optional Serial Bus Control
See Optional Serial Bus Control.
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7.3.3.6 Optional BIST Mode
See Built-In Self Test (BIST).
7.3.4 Deserializer Functional Description
The deserializer converts a single input serial data stream to a wide parallel output bus and also provides a
signal check for the chipset Built-In Self Test (BIST) mode. The device can be configured through external pins
and strap pins or through the optional serial control bus. The deserializer features enhance signal quality on the
link by supporting an equalizer input and Channel Link II data coding that provides randomization, scrambling,
and DC balancing of the data. The deserializer includes multiple features to reduce EMI associated with display
data transmission. This includes the randomization and scrambling of the data and output spread spectrum clock
generation (SSCG) support. The deserializer features power-saving features with a power-down mode and
optional LVCMOS (1.8 V) interface compatibility.
7.3.4.1 Signal Quality Enhancers
7.3.4.1.1 Deserializer Input Equalizer Gain (EQ)
The deserializer can enable receiver input equalization of the serial stream to increase the eye opening to the
deserializer input.
NOTE
This function cannot be seen at the RxIN± input but can be observed at the serial test port
(ROUT±) enabled through the serial bus control registers. The equalization feature may be
controlled by the external pin or by register.
Table 4. Receiver Equalization Configuration Table
INPUTS
(1)
EQ3
EQ2
L
L
EFFECT
EQ1
EQ0
L
L
H
L
H
H
≈3 dB
L
H
L
H
≈4.5 dB
L
H
H
H
≈6 dB
H
L
L
H
≈7.5 dB
H
L
H
H
≈9 dB
H
H
L
H
≈10.5 dB
H
H
H
H
≈12 dB
X
X
X
L
OFF (1)
≈1.5 dB
Default Setting is EQ = Off
7.3.4.2 EMI Reduction Features
7.3.4.2.1 Deserializer Output Slew Rate Select (OS_CLKOUT/OS_DATA)
The parallel bus outputs (DO[23:0], CO[3:1], and CLKOUT) of the deserializer feature a selectable output slew.
The DATA (DO[23:0], CO[3:1]) are controlled by strap pin or register bit OS_DATA. The CLKOUT is controlled by
strap pin or register bit OS_CLKOUT. When the OS_CLKOUT/DATA = H, the maximum slew rate is selected.
When the OS_PCLK/DATA = L, the minimum slew rate is selected. Use the higher slew rate setting when driving
longer traces or a heavier capacitive load.
7.3.4.2.2 Deserializer Common-Mode Filter Pin (CMF) (Optional)
The deserializer provides access to the center tap of the internal termination. A capacitor may be placed on this
pin for additional common-mode filtering of the differential pair. This can be useful in high-noise environments for
additional noise rejection capability. A 4.7-µF capacitor may be connected from this pin to Ground.
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7.3.4.2.3 Deserializer SSCG Generation (Optional)
The deserializer provides an internally generated spread spectrum clock (SSCG) to modulate its outputs. Both
clock and data outputs are modulated. This aids to lower system EMI. Output SSCG deviations of ±2% (4% total)
at up to 100-kHz modulations are available (see Table 5). This feature may be controlled by external strap pins
or by register.
NOTE
The device supports SSCG function with CLKOUT = 10 MHz to 65 MHz. When the
CLKOUT = 65 MHz to 75 MHz, it is required to disable the SSCG function (SSC[3:0] =
0000).
Frequency
FCLKOUT+
fdev(max)
FCLKOUT
FCLKOUT-
fdev(min)
Time
1/fmod
Figure 26. SSCG Waveform
Table 5. SSCG Configuration (LF_MODE = L) – Deserializer Output
SSC[3:0] INPUTS
LF_MODE = L (20 - 65 MHz)
28
RESULT
SSC3
SSC2
SSC1
SSC0
fdev (%)
fmod (kHz)
L
L
L
L
Off
Off
L
L
L
H
±0.5
L
L
H
L
±1
L
L
H
H
±1.5
L
H
L
L
±2
L
H
L
H
±0.5
L
H
H
L
±1
L
H
H
H
±1.5
H
L
L
L
±2
H
L
L
H
±0.5
H
L
H
L
±1
H
L
H
H
±1.5
H
H
L
L
±2
H
H
L
H
±0.5
H
H
H
L
±1
H
H
H
H
±1.5
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CLK/2168
CLK/1300
CLK/868
CLK/650
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Table 6. SSCG Configuration (LF_MODE = H) – Deserializer Output
SSC[3:0] INPUTS
LF_MODE = H (10 - 20 MHz)
RESULT
SSC3
SSC2
SSC1
SSC0
fdev (%)
fmod (kHz)
L
L
L
L
L
L
L
Off
Off
H
±0.5
L
L
H
L
±1
L
L
H
H
±1.5
L
H
L
L
±2
L
H
L
H
±0.5
L
H
H
L
±1
L
H
H
H
±1.5
H
L
L
L
±2
H
L
L
H
±0.5
H
L
H
L
±1
H
L
H
H
±1.5
H
H
L
L
±2
H
H
L
H
±0.5
H
H
H
L
±1
H
H
H
H
±1.5
CLK/620
CLK/370
CLK/258
CLK/192
7.3.4.2.4 1.8-V or 3.3-V VDDIO Operation
The deserializer parallel bus and serial bus interface can operate with 1.8-V or 3.3-V levels (VDDIO) for target
(display) compatibility. The 1.8-V levels offer a lower noise (EMI) and also system power savings.
7.3.4.3 Deserializer Clock-Data Recovery Status Flag (LOCK) And Output State Select (OSS_SEL)
When PDB is driven high, the CDR PLL begins locking to the serial input and LOCK goes from TRI-STATE to
low (depending on the value of the OSS_SEL setting). After the DS92LV2422 completes its lock sequence to the
input serial data, the LOCK output is driven high, indicating valid data and clock recovered from the serial input is
available on the parallel bus and clock outputs. The CLKOUT output is held at its current state at the change
from OSC_CLK (if this is enabled through OSC_SEL) to the recovered clock (or vice versa).
If there is a loss of clock from the input serial stream, LOCK is driven low and the state of the outputs are based
on the OSS_SEL setting (strap pin configuration or register).
7.3.4.4 Deserializer Oscillator Output (Optional)
The deserializer provides an optional clock output when the input clock (serial stream) has been lost. This is
based on an internal oscillator. The frequency of the oscillator may be selected. This feature may be controlled
by the external pin or by register (see Table 8 and Table 9).
Table 7. OSS_SEL and PDB Configuration (Deserializer Outputs)
INPUTS
(1)
OUTPUTS
SERIAL
INPUT
PDB
OSS_SEL
CLKOUT
DO[23:0],
CO1, CO2,
CO3
X
L
L
Z
Z
Z
Z
LOCK
PASS
X
L
H
Z
Z
Z
Z
Static
H
L
L
L
L
L
Static
H
H
Z
Z (1)
L
L
Active
H
X
Active
Active
H
H
If DO[23:0], CO[3:1] pin is strapped high, the output is pulled up.
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Table 8. OSC (Oscillator) Mode — Deserializer Output
INPUTS
OUTPUTS
EMBEDDED CLK
CLKOUT
(1)
See
LOCK
PASS
OSC Output
L
L
H
Toggling
Active
H
H
Present
(1)
DO[23:0], CO1,
CO2, CO3
Absent and OSC_SEL ≠ 000.
PDB
(DES)
RIN
(Diff.)
active serial stream
LOCK
H
Z
DO[23:0],
CO1,CO2,CO3
X
H
L
L
L
L
L
L
Z
Z
CLKOUT*
(DES)
Z
Z
Z
Locking
OFF
Active
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
OFF
CONDITIONS: * RFB = L, and OSS_SEL Strap = L
Figure 27. Deserializer Outputs With Output State Select Low (OSS_SEL = L)
PDB
(DES)
RIN
(Diff.)
active serial stream
Z
LOCK
X
H
L
Z
H
L
DO[23:0],
CO1,CO2,CO3
Z
Z
Z
CLKOUT*
(DES)
Z
Z
Z
OFF
Locking
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
Active
OFF
CONDITIONS: * RFB = L, and OSS_SEL Strap = H
Figure 28. Deserializer Outputs With Output State Select High (OSS_SEL = H)
Table 9. OSC_SEL (Oscillator) Configuration
OSC_SEL[2:0] INPUTS
30
OSC_SEL2
OSC_SEL1
OSC_SEL0
L
L
L
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CLKOUT OSCILLATOR FREQUENCY
Off – Feature Disabled – Default
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Table 9. OSC_SEL (Oscillator) Configuration (continued)
OSC_SEL[2:0] INPUTS
OSC_SEL2
CLKOUT OSCILLATOR FREQUENCY
OSC_SEL1
OSC_SEL0
L
L
H
50 MHz ± 40%
L
H
L
25 MHz ± 40%
L
H
H
16.7 MHz ± 40%
H
L
L
12.5 MHz ± 40%
H
L
H
10 MHz ± 40%
H
H
L
8.3 MHz ± 40%
H
H
H
6.3 MHz ± 40%
PDB
(DES)
RIN
(Diff.)
active serial stream
LOCK
Z
DO[23:0],
CO1,CO2,CO3
Z
CLKOUT*
(DES)
Z
X
H
H
L
L
Z
L
L
Z
L
f
f
H
PASS
Z
OFF
Z
Locking
H
Z
L
L
Active
C0 or C1 Error
In Bit Stream
(Loss of LOCK)
Active
OFF
CONDITIONS: * RFB = L, OSS_SEL = H , and OSC_SEL not equal to 000.
Figure 29. Deserializer Outputs With Output State High and CLKOUT Oscillator Option Enabled
7.3.4.5 Deserializer OP_LOW (Optional)
The OP_LOW feature is used to hold the LVCMOS outputs (except for the LOCK output) at a low state. The user
must toggle the OP_LOW set / reset register bit to release the outputs to the normal toggling state.
NOTE
The release of the outputs can only occur when LOCK is high. When the OP_LOW feature
is enabled, anytime LOCK = low, the LVCMOS outputs toggle to a low state again. The
OP_LOW strap pin feature is assigned to output PASS pin 42.
Restrictions on other straps:
1. Other straps must not be used to keep the data and clock outputs at a true low state. Other features must be
selected through I2C.
2. The OSS_SEL function is not available when OP_LOW is enabled (tied high).
Outputs DO[23:0], CO[3:1], and CLKOUT are in TRI-STATE before PDB toggles high, because the OP_LOW
strap value has not been recognized until the DS92LV2422 powers up. Figure 30 shows the user controlled
release of OP_LOW and automatic reset of OP_LOW set on the falling edge of LOCK. Figure 31 shows the user
controlled release of OP_LOW and manual reset of OP_LOW set.
NOTE
Manual reset of OP_LOW can only occur when LOCK is high.
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2.0V
LOCK
OP_ LOW
SET
(Strap pin)
User
controlled
User
controlled
OP_ LOW
RELEASE/SET
(Register)
DO[23:0],
CO3, CO2, CO1
TRISTATE
ACTIVE
ACTIVE
CLKOUT
TRISTATE
ACTIVE
ACTIVE
Figure 30. OP_LOW Auto Set
PDB
2.0V
LOCK
OP_LOW
SET
(Strap pin)
User
controlled
User
controlled
OP_ LOW
RELEASE/SET
(Register)
DO[23:0],
CO3, CO2, CO1
TRISTATE
ACTIVE
CLKOUT
TRISTATE
ACTIVE
Figure 31. OP_LOW Manual Set or Reset
7.3.4.6 Deserializer Clock Edge Select (RFB)
The RFB pin determines the edge that the data is strobed on. If RFB is high, output data is strobed on the rising
edge of CLKOUT. If RFB is low, data is strobed on the falling edge of CLKOUT. This allows for inter-operability
with downstream devices. The deserializer output does not need to use the same edge as the serializer input.
This feature may be controlled by the external pin or by register.
7.3.4.7 Deserializer Control Signal Filter (Optional)
The deserializer provides an optional control signal (C3, C2, C1) filter that monitors the three control signals and
eliminates any pulses or glitches that are 1 or 2 CLKOUT periods wide. Control signals must be 3 parallel clock
periods wide (in its high or low state, regardless of which state is active). This is set by the CONFIG[1:0] strap
option or by I2C register control.
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7.3.4.8 Deserializer Low Frequency Optimization (LF_Mode)
This feature may be controlled by the external pin or by register.
7.3.4.9 Deserializer Map Select
This feature may be controlled by the external pin or by register.
Table 10. Map Select Configuration
INPUTS
EFFECT
MAP_SEL1
MAP_SEL0
L
L
Bit 4, Bit 5 on LSB
DEFAULT
L
H
LSB 0 or 1
H
H or L
LSB 0
7.3.4.10 Deserializer Strap Input Pins
Configuration of the device may be done through configuration input pins and the strap input pins, or through the
serial control bus. The strap input pins share select parallel bus output pins. They are used to load in
configuration values during the initial power-up sequence of the device. Only a pullup on the pin is required when
a high is desired. By default, the pad has an internal pulldown and bias low by itself. The recommended value of
the pullup is 10 kΩ to VDDIO; open (NC) for low, because no pulldown is required (internal pulldown). If using the
serial control bus, no pullups are required.
7.3.4.11 Optional Serial Bus Control
See Optional Serial Bus Control.
7.3.4.12 Optional BIST Mode
See Built-In Self Test (BIST).
7.3.5 Built-In Self Test (BIST)
An optional At-Speed Built-In Self Test (BIST) feature supports the testing of the high-speed serial link. This is
useful in the prototype stage, equipment production, in-system test, and for system diagnostics. In BIST mode,
only an input clock is required along with control to the serializer and deserializer BISTEN input pins. The
serializer outputs a test pattern (PRBS-7) and drives the link at speed. The deserializer detects the PRBS-7
pattern and monitors it for errors. A PASS output pin toggles to flag any payloads that are received with 1 to 24
errors. Upon completion of the test, the result of the test is held on the PASS output until reset (new BIST test or
power down). A high on PASS indicates NO ERRORS were detected. A low on PASS indicates one or more
errors were detected. The duration of the test is controlled by the pulse width applied to the deserializer BISTEN
pin. During the BIST duration, the deserializer data outputs toggle with a checkerboard pattern.
Inter-operability is supported between this Channel Link II device and all Channel Link II generations (Gen 1, 2,
3). See Sample BIST Sequence for entering BIST mode and control.
7.3.5.1 Sample BIST Sequence
See Figure 32 for the BIST mode flow diagram.
Step 1: Place the DS92LV2421 serializer in BIST Mode by setting serializer BISTEN = H. For the DS92LV2421
serializer or DS99R421-Q1 FPD-Link II serializer, BIST Mode is enabled through the BISTEN pin. For the
DS90C241 serializer or DS90UR241 serializer, BIST mode is entered by setting all the input data of the device to
a low state. A CLKIN is required for BIST. When the deserializer detects the BIST mode pattern and command
(DCA and DCB code), the data and control signal outputs are shut off.
Step 2: Place the DS92LV2422 deserializer in BIST mode by setting BISTEN = H. The deserializer is now in
BIST mode and checks the incoming serial payloads for errors. If an error in the payload (1 to 24) is detected,
the PASS pin switches low for one half of the clock period. During the BIST test, the PASS output can be
monitored and counted to determine the payload error rate.
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Step 3: To stop BIST mode, the deserializer BISTEN pin is set low. The deserializer stops checking the data, and
the final test result is held on the PASS pin. If the test ran error free, the PASS output is high. If there was one or
more errors detected, the PASS output is low. The PASS output state is held until a new BIST is run, the device
is RESET, or powered down. The BIST duration is user controlled by the duration of the BISTEN signal.
Step 4: To return the link to normal operation, the serializer BISTEN input is set low. The Link returns to normal
operation.
Figure 33 shows the waveform diagram of a typical BIST test for two cases. Case 1 is error-free, and Case 2
shows one with multiple errors. In most cases, it is difficult to generate errors due to the robustness of the link
(differential data transmission and so forth), thus they may be introduced by greatly extending the cable length,
faulting the interconnect, or reducing signal condition enhancements (de-emphasis, VODSEL, or Rx
equalization).
Normal
Step 1: SER in BIST
BIST
Wait
Step 2: Wait, DES in BIST
BIST
start
Step 3: DES in Normal
Mode - check PASS
BIST
stop
Step 4: SER in Normal
Figure 32. BIST Mode Flow Diagram
SER
BISTEN
(SER)
DES Outputs
BISTEN
(DES)
Case 1 - Pass
CLKOUT
(RFB = L)
DO[23:0]
CO1,CO2,CO3
DATA
(internal)
PASS
Prior Result
PASS
PASS
X
X
X
FAIL
Prior Result
Normal
PRBS
Case 2 - Fail
X = bit error(s)
DATA
(internal)
BIST
Result
Held
BIST Test
BIST Duration
Normal
Figure 33. BIST Waveforms
34
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7.3.5.2 BER Calculations
It is possible to calculate the approximate Bit Error Rate (BER). The following is required:
• Clock Frequency (MHz)
• BIST Duration (seconds)
• BIST Test Result (PASS)
The BER is less than or equal to one over the product of 24 times the CLKOUT rate times the test duration. If we
assume a 65-MHz clock, a 10-minute (600 seconds) test, and a PASS, the BER is ≤ 1.07 X 10E-12.
BIST mode runs a check on the data payload bits. The LOCK pin also provides a link status. If the recovery of
the C0 and C1 bits does not reconstruct the expected clock signal, the LOCK pin switches low. The combination
of the LOCK and At-Speed BIST PASS pin provides a powerful tool for system evaluation and performance
monitoring.
7.3.6 Optional Serial Bus Control
The serializer and deserializer may also be configured by the use of a serial control bus that is I2C protocolcompatible. By default, the I2C Reg 0x00 = 0x00, and all configuration is set by control or strap pins. Writing reg
0x00 = 0x01 enables or allows configuration by registers; this overrides the control or strap pins. Multiple devices
may share the serial control bus, because multiple addresses are supported (see Figure 34).
The serial bus is comprised of three pins. The SCL is a serial bus clock input. The SDA is the serial bus data
input or output signal. Both SCL and SDA signals require an external pullup resistor to VDDIO. For most
applications, a 4.7-kΩ pullup resistor to VDDIO may be used. The resistor value may be adjusted for capacitive
loading and data rate requirements. The signals are either pulled high or driven low.
1.8V
10 k
VDDIO
ID[X]
4.7k
HOST
4.7k
RID
SCL
SCL
SDA
SDA
SER
or
DES
To other
Devices
Figure 34. Serial Control Bus Connection
The third pin is the ID[X] pin. This pin sets one of four possible device addresses. Two different connections are
possible:
• The pin may be pulled to VDD (1.8 V, not VDDIO) with a 10-kΩ resistor.
• The pin may be pulled to VDD (1.8 V, not VDDIO) with a 10-kΩ resistor and pulled down to ground with a
recommended value RID resistor. This creates a voltage divider that sets the other three possible addresses.
See Table 11 for the serializer and Table 12 for the deserializer. Do not tie ID[X] directly to VSS.
Table 11. ID[X] Resistor Value – DS92LV2421 (Serializer)
RESISTOR
RID kΩ (1)
(5% TOL)
(1)
ADDRESS
7'b
ADDRESS
8'b
0 APPENDED (WRITE)
0.47
7b' 110 1001 (h'69)
8b' 1101 0010 (h'D2)
2.7
7b' 110 1010 (h'6A)
8b' 1101 0100 (h'D4)
8.2
7b' 110 1011 (h'6B)
8b' 1101 0110 (h'D6)
Open
7b' 110 1110 (h'6E)
8b' 1101 1100 (h'DC)
RID ≠ 0 Ω. Do not connect directly to VSS (GND). This is not a valid address.
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Table 12. ID[X] Resistor Value – DS92LV2422 Deserializer
RESISTOR
RID kΩ (1)
(5% TOL)
ADDRESS
7'b
ADDRESS
8'b
0 APPENDED (WRITE)
0.47
7b' 111 0001 (h'71)
8b' 1110 0010 (h'E2)
2.7
7b' 111 0010 (h'72)
8b' 1110 0100 (h'E4)
8.2
7b' 111 0011 (h'73)
8b' 1110 0110 (h'E6)
Open
7b' 111 0110 (h'76)
8b' 1110 1100 (h'EC)
RID ≠ 0 Ω. Do not connect directly to VSS (GND). This is not a valid address.
(1)
The serial bus protocol is controlled by START, START-repeated, and STOP phases. A START occurs when
SCL transitions low while SDA is high. A STOP occurs when SDA transition high while SCL is also high (see
Figure 35).
SDA
SCL
S
P
START condition, or
START repeat condition
STOP condition
Figure 35. START and STOP Conditions
To communicate with a remote device, the host controller (master) sends the slave address and listens for a
response from the slave. This response is referred to as an acknowledge bit (ACK). If a slave on the bus is
addressed correctly, it Acknowledges (ACKs) the master by driving the SDA bus low. If the address doesn't
match the slave address of a device, it Not-acknowledges (NACKs) the master by letting SDA be pulled high.
ACKs also occur on the bus when data is being transmitted. When the master is writing data, the slave ACKs
after every data byte is successfully received. When the master is reading data, the master ACKs after every
data byte is received to let the slave know it wants to receive another data byte. When the master wants to stop
reading, it NACKs after the last data byte and creates a stop condition on the bus. All communication on the bus
begins with either a start condition or a repeated start condition. All communication on the bus ends with a stop
condition. A READ is shown in Figure 36 and a WRITE is shown in Figure 37.
NOTE
During initial power-up, a delay of 10 ms is required before the I2C will respond.
If the serial bus is not required, the three pins may be left open (NC).
Register Address
Slave Address
S
A
2
A
1
A
0
0
Slave Address
a
c
k
a
c
k
A
2
S
A
1
A
0
Data
1
a
c
k
a
c
k
P
Figure 36. Serial Control Bus — READ
Register Address
Slave Address
S
A
2
A
1
A
0
0
a
c
k
Data
a
c
k
a
c
k
P
Figure 37. Serial Control Bus — WRITE
36
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7.4 Device Functional Modes
7.4.1 Serializer and Deserializer Operating Modes and Reverse Compatibility (CONFIG[1:0])
The DS92LV242x chipset is compatible with other single serial lane Channel Link II or FPD-Link II devices.
Configuration modes are provided for reverse compatibility with the DS90C241 / DS90C124 chipset (FPD-Link II
Generation 1) and also the DS90UR241 / DS90UR124 chipset (FPD-Link II Generation 2) by setting the
respective mode with the CONFIG[1:0] pins on the serializer or deserializer as shown in Table 13 and Table 14.
This selection also determines whether the control signal filter feature is enabled or disabled in the normal mode.
This feature may be controlled by pin or by register.
Table 13. DS92LV2421 Serializer Modes
CONFIG1
CONFIG0
MODE
COMPATIBLE DESERIALIZER DEVICE
L
L
Normal Mode, Control Signal Filter disabled
DS92LV2422, DS92LV2412,
DS92LV0422, DS92LV0412
L
H
Normal Mode, Control Signal Filter enabled
DS92LV2422, DS92LV2412,
DS92LV0422, DS92LV0412
H
L
Reverse Compatibility Mode (FPD-Link II, GEN2)
DS90UR124, DS99R124Q-Q1
H
H
Reverse Compatibility Mode (FPD-Link II, GEN1)
DS90C124
Table 14. DS92LV2422 Deserializer Modes
CONFIG1
CONFIG0
MODE
COMPATIBLE SERIALIZER DEVICE
L
L
Normal Mode, Control Signal Filter disabled
DS92LV2421, DS92LV2411, DS92LV0421,
DS92LV0411
L
H
Normal Mode, Control Signal Filter enabled
DS92LV2421, DS92LV2411, DS92LV0421,
DS92LV0411
H
L
Reverse Compatibility Mode (FPD-Link II, GEN2)
DS90UR241, DS99R421-Q1
H
H
Reverse Compatibility Mode (FPD-Link II, GEN1)
DS90C241
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7.5 Register Maps
Table 15. SERIALIZER — Serial Bus Control Registers
ADD
(DEC)
0
1
ADD
(HEX)
0
1
REGISTER
NAME
Serializer
Config 1
BIT(S)
R/W
DEFAULT
(BIN)
7
R/W
0
Reserved
Reserved
6
R/W
0
Reserved
Reserved
5
R/W
0
VODSEL
0: Low
1: High
4
R/W
0
RFB
0: Data latched on Falling edge of CLKIN
1: Data latched on Rising edge of CLKIN
38
2
DESCRIPTION
3:2
R/W
00
CONFIG
00: Normal Mode, Control Signal Filter Disabled
01: Normal Mode, Control Signal Filter Enabled
10: DS90UR124, DS99R124Q-Q1 ReverseCompatibility Mode (FPD-Link II, GEN2)
11: DS90C124 Reverse-Compatibility Mode (FPDLink II, GEN1)
1
R/W
0
SLEEP
Note – not the same function as PowerDown (PDB)
0: Normal Mode
1: Sleep Mode – Register settings retained.
0
R/W
0
REG
0: Configurations set from control pins
1: Configuration set from registers (except I2C_ID)
7
R/W
0
REG ID
0: Address from ID[X] Pin
1: Address from Register
ID[X]
Serial Bus Device ID, Four IDs are:
7b '1101 001 (h'69)
7b '1101 010 (h'6A)
7b '1101 011 (h'6B)
7b '1101 110 (h'6E)
All other addresses are reserved.
Device ID
6:0
2
FUNCTION
R/W
1101000
7:5
R/W
000
4
R/W
0
3:0
R/W
000
De-Emphasis
Control
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000: set by external resistor
001: –1 dB
010: –2 dB
De-Emphasis 011: –3.3 dB
Setting
100: –5 dB
101: –6.7 dB
110: –9 dB
111: –12 dB
De-Emphasis 0: De-emphasis enabled
EN
1: De-emphasis disabled
Reserved
Reserved
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Table 16. DESERIALIZER — Serial Bus Control Registers
ADD
(DEC)
0
1
ADD
(HEX)
0
1
REGISTER
NAME
BIT(S)
R/W
DEFAULT
(BIN)
7
R/W
0
LF_MODE
0: 20 to 65 MHz SSCG Operation
1: 10 to 20 MHz SSCG Operation
6
R/W
0
OS_CLKOUT
0: Normal CLKOUT Slew Rate
1: Increased CLKOUT Slew Rate
5
R/W
0
OS_DATA
0: Normal DATA Slew Rate
1: Increased DATA Slew Rate
4
R/W
0
RFB
0: Data strobed on Falling edge of CLKOUT
1: Data strobed on Rising edge of CLKOUT
2
3:2
R/W
00
CONFIG
1
R/W
0
SLEEP
Note – not the same function as PowerDown (PDB)
0: Normal Mode
1: Sleep Mode – Register settings retained.
0
R/W
0
REG Control
0: Configurations set from control pins or strap pins
1: Configurations set from registers (except I2C_ID)
7
R/W
0
REG ID
0: Address from ID[X] Pin
1: Address from Register
ID[X]
Serial Bus Device ID, Four IDs are:
7b '1110 001 (h'71)
7b '1110 010 (h'72)
7b '1110 011 (h'73)
7b '1110 110 (h'76)
All other addresses are Reserved.
OP_LOW
0: Set outputs state LOW (except LOCK)
1: Release output LOW state, outputs toggling
normally
Note: This register only works during LOCK = 1
OSS_SEL
Output Sleep State Select
0: CLKOUT, DO[23:0], CO1, CO2, CO3 = L, LOCK =
Normal, PASS = H
1: CLKOUT, DO[23:0], CO1, CO2, CO3 = Tri-State,
LOCK = Normal, PASS = H
Special for Reverse-Compatibility Mode
00: Bit 4, 5 on LSB
01: LSB zero if all data is zero; one if any data is one
10: LSB zero
11: LSB zero
Slave ID
Deserializer
Features 1
DESCRIPTION
00: Normal Mode, Control Signal Filter Disabled
01: Normal Mode, Control Signal Filter Enabled
10: DS90UR241, DS99R241-Q1 ReverseCompatibility Mode (FPD-Link II, GEN2)
11: DS90C241 Reverse-Compatibility Mode (FPDLink II, GEN1)
Deserializer
Config 1
6:0
R/W
1110000
7
R/W
0
6
2
FUNCTION
R/W
0
5:4
R/W
00
MAP_SEL
3
R/W
0
0: Strap will determine whether OP_LOW feature is
OP_LOW
ON or OFF
Strap Bypass
1: Turns OFF OP_LOW feature
2:0
R/W
00
OSC_SEL
000:
001:
010:
011:
100:
101:
110:
111:
Disable
50 MHz ± 40%
25 MHz ± 40%
16.7 MHz ± 40%
12.5 MHz ± 40%
10 MHz ± 40%
8.3 MHz ± 40%
6.3 MHz ± 40%
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Table 16. DESERIALIZER — Serial Bus Control Registers (continued)
ADD
(DEC)
3
ADD
(HEX)
3
REGISTER
NAME
BIT(S)
40
4
DEFAULT
(BIN)
7:5
R/W
000
4
R/W
0
FUNCTION
ROUT Config
R/W
0000
DESCRIPTION
EQ Gain
000: ≈1.625 dB
001: ≈3.25 dB
010: ≈4.87 dB
011: ≈6.5 dB
100: ≈8.125 dB
101: ≈9.75 dB
110: ≈11.375 dB
111: ≈13 dB
EQ Enable
0: EQ = disable
1: EQ = enable
SSC
If LF_MODE = 0, then:
000: SSCG disable
0001: fdev = ±0.5%, fmod
0010: fdev = ±1.0%, fmod
0011: fdev = ±1.5%, fmod
0100: fdev = ±2.0%, fmod
0101: fdev = ±0.5%, fmod
0110: fdev = ±1.0%, fmod
0111: fdev = ±1.5%, fmod
1000: fdev = ±2.0%, fmod
1001: fdev = ±0.5%, fmod
1010: fdev = ±1.0%, fmod
1011: fdev = ±1.5%, fmod
1100: fdev = ±2.0%, fmod
1101: fdev = ±0.5%, fmod
1110: fdev = ±1.0%, fmod
1111: fdev = ±1.5%, fmod
If LF_MODE = 1, then:
000: SSCG disable
0001: fdev = ±0.5%, fmod
0010: fdev = ±1.0%, fmod
0011: fdev = ±1.5%, fmod
0100: fdev = ±2.0%, fmod
0101: fdev = ±0.5%, fmod
0110: fdev = ±1.0%, fmod
0111: fdev = ±1.5%, fmod
1000: fdev = ±2.0%, fmod
1001: fdev = ±0.5%, fmod
1010: fdev = ±1.0%, fmod
1011: fdev = ±1.5%, fmod
1100: fdev = ±2.0%, fmod
1101: fdev = ±0.5%, fmod
1110: fdev = ±1.0%, fmod
1111: fdev = ±1.5%, fmod
Deserializer
Features 2
3:0
4
R/W
= CLK/2168
= CLK/2168
= CLK/2168
= CLK/2168
= CLK/1300
= CLK/1300
= CLK/1300
= CLK/1300
= CLK/868
= CLK/868
= CLK/868
= CLK/868
= CLK/650
= CLK/650
= CLK/650
= CLK/620
= CLK/620
= CLK/620
= CLK/620
= CLK/370
= CLK/370
= CLK/370
= CLK/370
= CLK/258
= CLK/258
= CLK/258
= CLK/258
= CLK/192
= CLK/192
= CLK/192
7
R/W
0
Repeater
Enable
0: Output ROUT± = disable
1: Output ROUT± = enable
6:0
R/W
0000000
Reserved
Reserved
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Display Application
The DS92LV242x chipset is intended for interface between a host (graphics processor) and a display. It supports
a 24-bit color depth (RGB888) and up to 1024 x 768 display formats. In a RGB888 application, 24 color bits
(D[23:0]), Pixel Clock (CLKIN), and three control bits (C1, C2, C3) are supported across the serial link with
CLKIN rates from 10 to 75 MHz. The chipset may also be used in 18-bit color applications. In this application,
three to six general-purpose signals may also be sent from host to display.
The deserializer is expected to be placed close to its target device. The interconnect between the deserializer
and the target device is typically in the 1 to 3 inch separation range. The input capacitance of the target device is
expected to be in the 5 pF to 10 pF range. Take care of the CLKOUT output trace, as this signal is edge
sensitive and strobes the data. It is also assumed that the fanout of the deserializer is one. If additional loads
need to be driven, a logic buffer or mux device is recommended.
8.1.2 Live Link Insertion
The serializer and deserializer devices support live pluggable applications. The automatic receiver lock to
random data plug and go hot insertion capability allows the DS92LV2422 to attain lock to the active data stream
during a live insertion event.
8.1.3 Alternate Color / Data Mapping
Color Mapped Data Pin names are provided to specify a recommended mapping for 24-bit color applications.
Seven [7] is assumed to be the MSB, and Zero [0] is assumed to be the LSB. While this is recommended, it is
not required. When connecting to earlier generations of FPD-Link II serializer and deserializer devices, a color
mapping review is recommended to ensure the correct connectivity is obtained. Table 17 provides examples for
interfacing to 18-bit applications with or without the video control signals embedded. The DS92LV2422
deserializer provides additional flexibility with the MAP_SEL feature as well.
Table 17. Alternate Color and Data Mapping
18-BIT RGB
18-BIT RGB
24-BIT RGB
2421 PIN
NAME
2422 PIN
NAME
24-BIT RGB
18-BIT RGB
18-BIT RGB
LSB R0
GP0
R0
DI0
DO0
R0
GP0
LSB R0
R1
GP1
R1
DI1
DO1
R1
GP1
R1
R2
R0
R2
DI2
DO2
R2
R0
R2
R3
R1
R3
DI3
DO3
R3
R1
R3
R4
R2
R4
DI4
DO4
R4
R2
R4
MSB R5
R3
R5
DI5
DO5
R5
R3
MSB R5
LSB G0
R4
R6
DI6
DO6
R6
R4
LSB G0
G1
R5
R7
DI7
DO7
R7
R5
G1
G2
GP2
G0
DI8
DO8
G0
GP2
G2
G3
GP3
G1
DI9
DO9
G1
GP3
G3
G4
G0
G2
DI10
DO10
G2
G0
G4
MSB G5
G1
G3
DI11
DO11
G3
G1
MSB G5
LSB B0
G2
G4
DI12
DO12
G4
G2
LSB0
B1
G3
G5
DI13
DO13
G5
G3
B1
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Application Information (continued)
Table 17. Alternate Color and Data Mapping (continued)
18-BIT RGB
18-BIT RGB
24-BIT RGB
2421 PIN
NAME
2422 PIN
NAME
24-BIT RGB
18-BIT RGB
18-BIT RGB
B2
G4
G6
DI14
DO14
G6
G4
B2
B3
G5
G7
DI15
DO15
G7
G5
B3
B4
GP4
B0
DI16
DO16
B0
GP4
B4
MSB B5
GP5
B1
DI17
DO17
B1
GP5
MSB B5
HS
B0
B2
DI18
DO18
B2
B0
HS
VS
B1
B3
DI19
DO19
B3
B1
VS
DE
B2
B4
DI20
DO20
B4
B2
DE
GP0
B3
B5
DI21
DO21
B5
B3
GP0
GP1
B4
B6
DI22
DO22
B6
B4
GP1
GP2
B5
B7
DI23
DO23
B7
B5
GP2
GND
HS
HS
CI1
CO1
HS
HS
GND
GND
GND
VS
VS
CI2
CO2
VS
VS
GND
DE
DE
CI3
CO3
DE
DE
GND
Scenario 3 (1)
Scenario 2 (2)
Scenario 1 (3)
Scenario 1 (3)
Scenario 2 (2)
Scenario 3 (1)
(1)
(2)
(3)
2421 Pin Name 2422 Pin Name
Scenario 3 supports an 18-bit RGB color mapping, 3 un-embedded video control signals, and up to three general-purpose signals.
Scenario 2 supports an 18-bit RGB color mapping, 3 embedded video control signals, and up to six general-purpose signals.
Scenario 1 supports the 24-bit RGB color mapping, along with the 3 embedded video control signals. This is the native mode for the
chipset.
8.2 Typical Applications
8.2.1 DS92LV2421 Typical Connection
Figure 38 shows a typical application of the DS92LV2421 serializer in pin control mode for a 24-bit application.
The LVDS outputs require 100-nF AC-coupling capacitors to the line. The line driver includes internal
termination. Bypass capacitors are placed near the power supply pins. At a minimum, four 0.1-µF capacitors and
a 4.7-µF capacitor must be used for local device bypassing. System GPO (General Purpose Output) signals
control the PDB and BISTEN pins. In this application, the RFB pin is tied low to latch data on the falling edge of
the CLKIN. The application assumes connection to the companion deserializer (DS92LV2422), and therefore the
configuration pins CONFIG[1:0] are also both tied low. In this example, the cable is long, and therefore the
VODSEL pin is tied high and a De-Emphasis value is selected by the resistor R1. The interface to the host is
with 1.8-V LVCMOS levels, thus the VDDIO pin is connected also to the 1.8-V rail. The optional serial bus control
is not used in this example, thus the SCL, SDA, and ID[X] pins are left open. A delay cap is placed on the PDB
signal to delay the enabling of the device until power is stable.
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Typical Applications (continued)
DS92LV2421 (SER)
VDDIO
VDDIO
C9
C7
FB1
VDDTX
VDDHS
C3
DI0
DI1
DI2
DI3
DI4
DI5
DI6
DI7
C11
CI1
CI2
CI3
LVCMOS
Control
Interface
FB2
C8
C10
C5
FB3
C6
FB4
VDDL
C1
Serial
Channel Link II
Interface
DOUT+
DOUTC2
DI16
DI17
DI18
DI19
DI20
DI21
DI22
DI23
CLKIN
C4
VDDP
DI8
DI9
DI10
DI11
DI12
DI13
DI14
DI15
LVCMOS
Parallel
Video
Interface
1.8V
VDDIO
VODSEL
De-Emph
1.8V
R1
10k
BISTEN
PDB
ID[X]
SCL
SDA
C12
CONFIG1
CONFIG0
RFB
RID
NOTE:
C1-C2 = 0.1 PF (50 WV)
C3-C8 = 0.1 PF
C9-11 = 4.7 PF
C12 = >10 PF
R1 (cable specific)
RID (Use Recommended ID[x] Resistor Value)
FB1-FB4: Impedance = 1 k:,
low DC resistance (<1:)
RES2
RES1
RES0
DAP (GND)
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Figure 38. DS92LV2421 Typical Connection Diagram – Pin Control
8.2.1.1 Design Requirements
For this example, Table 18 lists the design parameters.
Table 18. Design Parameters
PARAMETER
EXAMPLE VALUE
VDDIO
1.8 V to 3.3 V
VDDL, VDDP, VDDHS, VDDTX
1.8 V
AC-Coupling Capacitor for DOUT±
100 nF
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8.2.1.2 Detailed Design Procedure
The DOUT± outputs require 100-nF AC-coupling capacitors to the line. The power supply filter capacitors are
placed near the power supply pins. A smaller capacitance capacitor must be located closer to the power supply
pins.
The VODSEL pin is tied to VDDIO for the long cable application. The de-emphasis pin may connect a resistor to
ground. Refer to Table 3. The PDB and BISTEN pins are assumed to be controlled by a microprocessor. The
PDB must remain in a low state until all power supply voltages reach the final voltage. The RFB pin is tied low to
latch data on the falling edge of the PCLK and tied high for the rising clock edge. The CONFIG[1:0] pins are set
depending on operating modes and backward compatibility. The SCL, SDA, and ID[X] pins are left open when
these serial bus control pins are unused. The RES[2:0] pins and DAP must be tied to ground.
8.2.1.3 Application Curve
Figure 39. Eye Diagram at CLK = 20 MHz
8.2.2 DS92LV2422 Typical Connection
Figure 40 shows a typical application of the DS92LV2422 deserializer in pin or strap control mode for a 24-bit
application. The LVDS inputs use 100-nF coupling capacitors to the line, and the receiver provides internal
termination. Bypass capacitors are placed near the power supply pins. At a minimum, seven 0.1-µF capacitors
and two 4.7-µF capacitors must be used for local device bypassing. System General Purpose Output (GPO)
signals control the PDB and the BISTEN pins. In this application, the RFB pin is tied low to strobe the data on the
falling edge of the CLKOUT.
Because the device is in pin or strap control mode, four 10-kΩ pullup resistors are used on the parallel output
bus to select the desired device features. CONFIG[1:0] is set to 01'b for normal mode with control signal filter
enabled, and this is accomplished with the strap pullup on DO23. The receiver input equalizer is also enabled
and set to provide 7.5 dB of gain, and this is accomplished with EQ[3:0] set to 1001'b with strap pullups on DO12
and DO15. To reduce parallel bus EMI, the SSCG feature is enabled and set to fmod = CLK/2168 and ±1% with
SSC[3:0] set to 0010'b and a strap pullup on DO4. The desired features are set with the use of the four pullup
resistors.
The interface to the target display is with 3.3-V LVCMOS levels, thus the VDDIO pin is connected to the 3.3-V
rail. The optional serial bus control is not used in this example, thus the SCL, SDA and ID[X] pins are left open. A
delay cap is placed on the PDB signal to delay the enabling of the device until power is stable.
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DS92LV2422 (DES)
1.8V
VDDL
C13
C11
VDDIO
VDDIO
C8
C3
VDDSC
C12
C14
VDDIO
C9
C4
VDDPR
VDDIO
C10
C5
VDDR
C15
C6
VDDIR
VDDIO
EXAMPLE:
STRAP
Input
Pull-Ups
(10k)
VDDCMLO
C16
C7
C1
Serial
Channel Link II
Interface
RIN+
RINCMF
C2
C17
TP_A
ROUT+
ROUT-
TP_B
BISTEN
PDB
Host
Control
C18
1.8V
10k
ID[X]
SCL
SDA
RID
NOTE:
C1 - C2 = 0.1 PF (50 WV)
C3 - C12 = 0.1 PF
C13, C16 = 4.7 PF
C17, C18 = >10 PF
RID (Use Recommended ID[x] Resistor Value)
FB1-FB4: Impedance = 1 k:,
low DC resistance (<1:)
8
NC
DO0
DO1
DO2
DO3
DO4
DO5
DO6
DO7
DO8
DO9
DO10
DO11
DO12
DO13
DO14
DO15
LVCMOS
Parallel
Video
Interface
DO16
DO17
DO18
DO19
DO20
DO21
DO22
DO23
CO1
CO2
CO3
CLKOUT
RES
DAP (GND)
LOCK
PASS
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Figure 40. DS92LV2422 Typical Connection Diagram — Pin Control
8.2.2.1 Design Requirements
For this example, Table 19 lists the design parameters.
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Table 19. Design Parameters
PARAMETER
EXAMPLE VALUE
VDDIO
1.8 V to 3.3 V
VDDL, VDDSC, VDDPR, VDDR,
VDDIR, VDDCMLO
1.8 V
AC-Coupling Capacitor for DOUT±
100 nF
8.2.2.2 Detailed Design Procedure
The RIN± inputs require 100-nF AC-coupling capacitors to the line. The power supply filter capacitors are placed
near the power supply pins. A smaller capacitance capacitor must be placed closer to the power supply pins.
The device has 22 control and configuration pins that are called strap pins. These pins include an internal
pulldown. For a high state, use a 10-kΩ resistor pullup to VDDIO.
The PDB and BISTEN pins are assumed to be controlled by a microprocessor. The PDB has to be in a low state
until all power supply voltages reach the final voltage. The SCL, SDA, and ID[X] pins are left open when these
serial bus control pins are unused.
The RES pin and DAP must be tied to ground.
8.2.2.3 Application Curves
Figure 41. Eye Diagram at CLK = 45 MHz
Figure 42. Eye Diagram at CLK = 65 MHz
9 Power Supply Recommendations
9.1 Power-Up Requirements and PDB Pin
The VDD (VDDn and VDDIO) supply ramp must be faster than 1.5 ms with a monotonic rise. If slower then 1.5
ms, then a capacitor on the PDB pin is needed to ensure PDB arrives after all the VDD have settled to the
recommended operating voltage. When PDB pin is pulled to VDDIO, TI recommends using a 10-kΩ pullup and a
22-µF capacitor to GND to delay the PDB input signal.
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10 Layout
10.1 Layout Guidelines
Circuit board layout and stack-up for the LVDS serializer and deserializer devices must be designed to provide
low-noise power feed to the device. Good layout practice also separates high frequency or high-level inputs and
outputs to minimize unwanted stray noise pickup, feedback, and interference. Power system performance may
be greatly improved by using thin dielectrics (2 to 4 mils) for power or ground sandwiches. This arrangement
provides plane capacitance for the PCB power system with low-inductance parasitics, which has proven
especially effective at high frequencies and makes the value and placement of external bypass capacitors less
critical. External bypass capacitors must include both RF ceramic and tantalum electrolytic types. RF capacitors
may use values in the range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2 µF to 10 µF range.
Voltage rating of the tantalum capacitors must be at least 5x the power supply voltage being used.
Surface-mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, place the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50 µF to 100 µF range and smooths low frequency switching noise. TI recommends
connecting power and ground pins directly to the power and ground planes with bypass capacitors connected to
the plane, with vias on both ends of the capacitor. Connecting power or ground pins to an external bypass
capacitor increases the inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20 to 30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter may be used to provide clean power to sensitive circuits such as
PLLs.
Use at least a four-layer board with a power and ground plane. Place LVCMOS signals away from the CML lines
to prevent coupling from the LVCMOS lines to the CML lines. Closely-coupled differential lines of 100 Ω are
typically recommended for LVDS interconnects. The closely coupled lines help to ensure that coupled noise
appears as common mode and thus is rejected by the receivers. The tightly coupled lines also radiate less.
10.1.1 WQFN (LLP) Stencil Guidelines
Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste
deposition. Inspection of the stencil prior to placement of the LLP (WQFN) package is highly recommended to
improve board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow
unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:
Figure 43. No Pullback LLP, Single Row Reference Diagram
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Layout Guidelines (continued)
Table 20. No Pullback LLP Stencil Aperture Summary for DS92LV2421 and DS92LV2422
STENCIL DAP
APERTURE
(mm)
NUMBER OF
DAP
APERTURE
OPENINGS
GAP BETWEEN
DAP APERTURE
(Dim A mm)
0.25 × 0.7
1.1 × 1.1
16
0.2
0.25 × 0.9
1.16 × 1.16
25
0.3
DEVICE
PIN
COUNT
MKT
DWG
PCB I/O
PAD SIZE
(mm)
PCB
PITCH
(mm)
PCB DAP
SIZE (mm)
STENCIL I/O
APERTURE
(mm)
DS92LV2421
48
SQA48A
0.25 × 0.6
0.5
5.1 × 5.1
DS92LV2422
60
SQA60B
0.25 × 0.8
0.5
7.2 × 7.2
Figure 44. 48-Pin WQFN Stencil Example of Via and Opening Placement
Information on the WQFN style package is provided in Leadless Leadframe Package (LLP) Application Report
(SNOA401).
10.1.2 Transmission Media
The serializer and deserializer chipset is intended to be used in a point-to-point configuration through a PCB
trace or through twisted pair cable. The serializer and deserializer provide internal terminations for a clean
signaling environment. The interconnect for CML must present a differential impedance of 100 Ω. Use cables and
connectors that have matched differential impedance to minimize impedance discontinuities. Shielded or unshielded cables may be used depending upon the noise environment and application requirements.
10.1.3 LVDS Interconnect Guidelines
See AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines (SNLA008) and AN-905 Transmission
Line RAPIDESIGNER Operation and Applications Guide (SNLA035) for full details.
• Use 100-Ω coupled differential pairs
• Use the S, 2S, 3S rule in spacings
– S = space between the pair
– 2S = space between pairs
– 3S = space to LVCMOS signal
• Minimize the number of vias
• Use differential connectors when operating above 500-Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
48
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
DS92LV2421, DS92LV2422
www.ti.com
•
SNLS321C – MAY 2010 – REVISED MAY 2016
Terminate as close to the TX outputs and RX inputs as possible
Additional general guidance can be found in the LVDS Owner’s Manual, available in PDF format from the TI web
site at: www.ti.com/lvds.
10.2 Layout Example
The following PCB layout examples are derived from the layout design of the LV24EVK01 Evaluation Module.
These graphics and additional layout description are used to demonstrate both proper routing and proper solder
techniques when designing in the serializer and deserializer pair.
Figure 45. DS92LV2421 Serializer Example Layout
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
Submit Documentation Feedback
49
DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
Layout Example (continued)
Figure 46. DS92LV2422 Deserializer Example Layout
50
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
DS92LV2421, DS92LV2422
www.ti.com
SNLS321C – MAY 2010 – REVISED MAY 2016
11 Device and Documentation Support
11.1 Device Support
11.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
11.1.2 Development Support
For development support see the following:
LVDS Owner’s Manual, www.ti.com/lvds
11.2 Documentation Support
11.2.1 Related Documentation
For related documentation see the following:
• Absolute Maximum Ratings for Soldering, SNOA549
• Leadless Leadframe Package (LLP) Application Report, SNOA401
• AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
• AN-905 Transmission Line RAPIDESIGNER Operation and Applications Guide, SNLA035
11.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 21. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
DS92LV2421
Click here
Click here
Click here
Click here
Click here
DS92LV2422
Click here
Click here
Click here
Click here
Click here
11.4 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
Submit Documentation Feedback
51
DS92LV2421, DS92LV2422
SNLS321C – MAY 2010 – REVISED MAY 2016
www.ti.com
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
52
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Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: DS92LV2421 DS92LV2422
PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS92LV2421SQ/NOPB
ACTIVE
WQFN
RHS
48
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2421SQ
DS92LV2421SQE/NOPB
ACTIVE
WQFN
RHS
48
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2421SQ
DS92LV2421SQX/NOPB
ACTIVE
WQFN
RHS
48
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2421SQ
DS92LV2422SQ/NOPB
ACTIVE
WQFN
NKB
60
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2422SQ
DS92LV2422SQE/NOPB
ACTIVE
WQFN
NKB
60
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2422SQ
DS92LV2422SQX/NOPB
ACTIVE
WQFN
NKB
60
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
LV2422SQ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
21-Apr-2015
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DS92LV2421SQ/NOPB
WQFN
RHS
48
DS92LV2421SQE/NOPB
WQFN
RHS
DS92LV2421SQX/NOPB
WQFN
RHS
DS92LV2422SQ/NOPB
WQFN
DS92LV2422SQE/NOPB
DS92LV2422SQX/NOPB
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
48
250
178.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
48
2500
330.0
16.4
7.3
7.3
1.3
12.0
16.0
Q1
NKB
60
1000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
WQFN
NKB
60
250
178.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
WQFN
NKB
60
2000
330.0
16.4
9.3
9.3
1.3
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS92LV2421SQ/NOPB
WQFN
RHS
48
1000
367.0
367.0
38.0
DS92LV2421SQE/NOPB
WQFN
RHS
48
250
210.0
185.0
35.0
DS92LV2421SQX/NOPB
WQFN
RHS
48
2500
367.0
367.0
38.0
DS92LV2422SQ/NOPB
WQFN
NKB
60
1000
367.0
367.0
38.0
DS92LV2422SQE/NOPB
WQFN
NKB
60
250
210.0
185.0
35.0
DS92LV2422SQX/NOPB
WQFN
NKB
60
2000
367.0
367.0
38.0
Pack Materials-Page 2
PACKAGE OUTLINE
NKB0060B
VQFN - 0.8 mm max height
SCALE 1.500
PLASTIC QUAD FLATPACK - NO LEAD
9.1
8.9
B
A
PIN 1 INDEX AREA
9.1
8.9
0.8
0.7
C
SEATING PLANE
0.05
0.00
0.08 C
2X 7
6.3 0.1
EXPOSED
THERMAL PAD
SYMM
16
15
31
SYMM
61
2X 7
1
56X 0.5
PIN 1 ID
(0.1) TYP
30
45
60
46
0.7
60X
0.5
60X
0.3
0.2
0.1
0.05
C A B
4214995/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
NKB0060B
VQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 6.3)
SYMM
60X (0.8)
46
60
SEE SOLDER MASK
DETAIL
60X (0.25)
1
45
56X (0.5)
(1.1) TYP
(1.2) TYP
(R0.05) TYP
( 0.2) TYP
VIA
SYMM
61
(0.6) TYP
15
(8.6)
31
16
30
(0.6) TYP
(1.2) TYP
(1.1) TYP
(8.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4214995/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
NKB0060B
VQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
25X ( 1)
(1.2) TYP
60X (0.8)
60
46
60X (0.25)
1
45
56X (0.5)
(R0.05) TYP
(1.2) TYP
61
SYMM
(8.6)
15
31
30
16
SYMM
(8.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
EXPOSED PAD 61
63% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4214995/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
RHS0048A
WQFN - 0.8 mm max height
SCALE 1.800
PLASTIC QUAD FLATPACK - NO LEAD
7.15
6.85
A
B
PIN 1 INDEX AREA
0.5
0.3
7.15
6.85
0.30
0.18
DETAIL
OPTIONAL TERMINAL
TYPICAL
0.8
0.7
C
SEATING PLANE
0.05
0.00
0.08 C
2X 5.5
(0.2)
5.1 0.1
(A) TYP
24
13
44X 0.5
DIM A
OPT 1
OPT 2
(0.1)
(0.2)
12
25
EXPOSED
THERMAL PAD
2X
5.5
49
SYMM
SEE TERMINAL
DETAIL
1
PIN 1 ID
(OPTIONAL)
36
48
37
SYMM
48X
0.5
0.3
48X
0.30
0.18
0.1
0.05
C A B
4214990/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RHS0048A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
( 5.1)
SYMM
37
48
48X (0.6)
1
36
48X (0.25)
(1.05) TYP
44X (0.5)
(1.25) TYP
49
SYMM
(6.8)
(R0.05)
TYP
( 0.2) TYP
VIA
25
12
13
24
(1.25)
TYP
(1.05)
TYP
(6.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:12X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL EDGE
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214990/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RHS0048A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.625) TYP
(1.25)
TYP
37
48
48X (0.6)
1
36
49
48X (0.25)
44X (0.5)
(1.25)
TYP
(0.625) TYP
SYMM
(6.8)
(R0.05) TYP
METAL
TYP
25
12
13
16X
( 1.05)
24
SYMM
(6.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 49
68% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:15X
4214990/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
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TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
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