Texas Instruments | MAX3221E 3-V to 5.5-V Single-Channel RS-232 Line Driver/Receiver With ±15-kV IEC ESD Protection (Rev. B) | Datasheet | Texas Instruments MAX3221E 3-V to 5.5-V Single-Channel RS-232 Line Driver/Receiver With ±15-kV IEC ESD Protection (Rev. B) Datasheet

Texas Instruments MAX3221E 3-V to 5.5-V Single-Channel RS-232 Line Driver/Receiver With ±15-kV IEC ESD Protection (Rev. B) Datasheet
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MAX3221E
SLLS686B – OCTOBER 2005 – REVISED SEPTEMBER 2016
MAX3221E 3-V to 5.5-V Single-Channel RS-232 Line Driver/Receiver
With ±15-kV IEC ESD Protection
1 Features
3 Description
•
The MAX3221E is a single driver, single receiver RS232 solution operating from a single VCC supply. The
RS-232 pins provide IEC 61000-4-2 ESD protection.
The device meets the requirements of TIA/EIA-232-F
and provides the electrical interface between an
asynchronous communication controller and the
serial-port connector. The charge pump and four
small external capacitors allow operation from a
single 3-V to 5.5-V supply. These devices operate at
data signaling rates up to 250 kbit/s and a maximum
of 30-V/µs driver output slew rate.
1
•
•
•
•
•
•
•
•
ESD Protection for RS-232 Pins
– ±15-kV Human-Body Model (HBM)
– ±8 kV (IEC 61000-4-2, Contact Discharge)
– ±15 kV (IEC 61000-4-2, Air-Gap Discharge)
Meets or Exceeds the Requirements of TIA/EIA232-F and ITU v.28 Standards
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
One Driver and One Receiver
Low Standby Current: 1 µA Typical
Accepts 5-V Logic Input With 3.3-V Supply
Auto-Power-Down Feature Automatically Disables
Drivers for Power Savings
Alternative High-Speed Device (1 Mbit/s)
– SN75C3221E and SN65C3221E
Flexible control options for power management are
available. Auto-power down disables driver and
charge pump when the receiver is disconnected or
the remote driver is power down. The drivers can be
manually enabled or disabled. INVALID output goes
low when receiver input is unconnected or power off.
Device Information(1)
PART NUMBER
2 Applications
•
•
•
Battery-Powered, Hand-Held, and Portable
Equipment
Notebooks and Laptops
Mobile Phones and Wireless Devices
PACKAGE
BODY SIZE (NOM)
MAX3221ECDB,
MAX3221EIDB
SSOP (16)
6.20 mm × 5.30 mm
MAX3221ECPW,
MAX3221EIPW
TSSOP (16)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
3.3V, 5V
POWER
AUTOPOWERDOWN
FORCEON
FORCEOFF
RX Enable
EN
DIN
1
1
TX
250 kb/s
ROUT
INVALID
1
RX
DOUT
RS-232
IEC 61000-4-2
1
RIN
RS-232
STATUS
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
MAX3221E
SLLS686B – OCTOBER 2005 – REVISED SEPTEMBER 2016
www.ti.com
Table of Contents
1
2
3
4
5
6
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
6.11
6.12
7
1
1
1
2
3
4
Absolute Maximum Ratings ...................................... 4
ESD Ratings.............................................................. 4
Recommended Operating Conditions....................... 4
Thermal Information .................................................. 5
Electrical Characteristics........................................... 5
Electrical Characteristics: Driver ............................... 5
Electrical Characteristics: Receiver .......................... 6
Electrical Characteristics: Auto-Power Down............ 6
Switching Characteristics: Driver .............................. 6
Switching Characteristics: Receiver........................ 6
Switching Characteristics: Auto-Power Down......... 7
Typical Characteristics ............................................ 7
Parameter Measurement Information .................. 8
8
Detailed Description ............................................ 11
8.1
8.2
8.3
8.4
9
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
11
11
11
12
Application and Implementation ........................ 13
9.1 Application Information............................................ 13
9.2 Typical Application .................................................. 13
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 16
11.1 Layout Guidelines ................................................. 16
11.2 Layout Example .................................................... 16
12 Device and Documentation Support ................. 17
12.1
12.2
12.3
12.4
12.5
Receiving Notification of Documentation Updates
Community Resource............................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
13 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (May 2006) to Revision B
Page
•
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
•
Deleted Ordering Information table; see the POA at the end of the data sheet ................................................................... 1
•
Changed RθJA thermal values: 82 to 92 for DB package and 108 to 100.3 for PW Package ................................................ 5
2
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SLLS686B – OCTOBER 2005 – REVISED SEPTEMBER 2016
5 Pin Configuration and Functions
DB or PW Package
16-Pin SSOP or TSSOP
Top View
C1+
1
2
16
15
FORCEOFF
VCC
V+
3
14
GND
C1–
4
13
DOUT
C2+
5
12
FORCEON
C2–
6
11
DIN
V–
7
10
INVALID
RIN
8
9
EN
ROUT
Not to scale
Pin Functions
PIN
NAME
NO.
I/O
DESCRIPTION
C1+
2
C2+
5
C1–
4
C2–
6
DIN
11
I
Driver input
DOUT
13
O
RS-232 driver output
EN
1
I
Low input enables receiver ROUT output. High input sets ROUT to high impedance.
FORCEOFF
16
I
Automatic power-down control input
FORCEON
12
I
Automatic power-down control input
GND
14
—
Ground
INVALID
10
O
Invalid output pin. Output low when RIN input is unpowered.
RIN
8
I
RS-232 receiver input
ROUT
9
O
Receiver output
VCC
15
—
3-V to 5.5-V supply voltage
V+
3
O
5.5-V supply generated by the charge pump
V–
7
O
–5.5-V supply generated by the charge pump
—
Positive terminals of the voltage-doubler charge pump capacitors
—
Negative terminals of the voltage-doubler charge pump capacitors
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Supply voltage (2)
VCC
(2)
V+
Positive output supply voltage
V–
Negative output supply voltage (2)
MIN
MAX
UNIT
–0.3
6
V
–0.3
7
V
0.3
–7
V
13
V
V+ – V– Supply voltage difference (2)
VI
Input voltage
VO
Output voltage
TJ
Operating virtual junction temperature
Tstg
Storage temperature
(1)
(2)
DIN, FORCEOFF, FORCEON, EN
–0.3
6
RIN
–25
25
DOUT
–13.2
13.2
ROUT, INVALID
–0.3
VCC + 0.3
–65
V
V
150
°C
150
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
V(ESD)
Electrostatic
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
discharge
IEC 61000-4-2 Contact Discharge, DOUT and RIN
IEC 61000-4-2 Air-Gap Discharge, DOUT and RIN
(1)
(2)
Pins 8 and 11
±15000
All other pins
±2000
All pins
±1500
UNIT
V
±8000
Pins 8 and 11
±15000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
See Figure 11
(1)
VCC = 3.3 V
Supply voltage
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, FORCEOFF, FORCEON, EN
VIL
Driver and control low-level input voltage
DIN, FORCEOFF, FORCEON, EN
VI
Driver and control input voltage
DIN, FORCEOFF, FORCEON
VI
Receiver input voltage
TA
(1)
4
Operating free-air temperature
MAX3221EC
MAX3221EI
VCC = 3.3 V
VCC = 5 V
MIN
NOM
MAX
3
3.3
3.6
4.5
5
5.5
2
UNIT
V
V
2.4
0.8
V
0
5.5
V
–25
25
V
0
70
–40
85
°C
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
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6.4 Thermal Information
MAX3221E
THERMAL METRIC (1)
DB (SSOP)
PW (TSSOP)
16 PINS
16 PINS
UNIT
92
100.3
°C/W
RθJA
Junction-to-ambient thermal resistance
RθJC(top)
Junction-to-case (top) thermal resistance
42.8
35.6
°C/W
RθJB
Junction-to-board thermal resistance
42.4
45.1
°C/W
ψJT
Junction-to-top characterization parameter
9.1
2.5
°C/W
ψJB
Junction-to-board characterization parameter
41.9
44.6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
II
Input leakage current
TEST CONDITIONS
FORCEOFF,
FORCEON, EN
Supply current
Powered off
VCC = 3.3 V or 5 V,
TA = 25°C
Auto-power down
enabled
(1)
(2)
TYP (2) MAX
UNIT
±0.01
±1
µA
0.3
1
mA
No load,
FORCEOFF at GND
1
10
No load, FORCEOFF at VCC,
FORCEON at GND,
All RIN are open or grounded
1
10
No load,
FORCEOFF and
FORCEON at VCC
Auto-power down
disabled
ICC
MIN
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.6 Electrical Characteristics: Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MIN
TYP (2)
VOH
High-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = GND
5
5.4
VOL
Low-level output voltage
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–5.4
IIH
High-level input current
VI = VCC
IIL
Low-level input current
VI = GND
IOS
Short-circuit
output current (3)
VCC = 3.6 V,
VO = 0 V
VCC = 5.5 V,
VO = 0 V
ro
Output resistance
VCC, V+, and V– = 0 V,
VO = ±2 V
Ioff
(1)
(2)
(3)
Output leakage current
±0.01
FORCEOFF = GND
300
MAX
UNIT
V
V
±1
µA
±0.01
±1
µA
±35
±60
±35
±60
10M
mA
Ω
VO = ±12 V,
VCC = 3 V to 3.6 V
±25
VO = ±10 V,
VCC = 4.5 V to 5.5 V
±25
µA
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one
output should be shorted at a time.
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6.7 Electrical Characteristics: Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
VOH
High-level output voltage
IOH = –1 mA
VOL
Low-level output voltage
IOL = 1.6 mA
TYP (2)
VCC – 0.6
VCC – 0.1
MAX
VCC = 3.3 V
1.6
2.4
VCC = 5 V
1.9
2.4
Positive-going input threshold voltage
VIT–
Negative-going input threshold voltage
Vhys
Input hysteresis (VIT+ – VIT–)
Ioff
Output leakage current
EN = VCC
ri
Input resistance
VI = ±3 V to ±25 V
VCC = 3.3 V
0.6
1.1
VCC = 5 V
0.8
1.4
UNIT
V
0.4
VIT+
(1)
(2)
MIN
TEST CONDITIONS
V
V
V
0.5
V
±0.05
±10
µA
5
7
kΩ
3
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.8 Electrical Characteristics: Auto-Power Down
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VT+(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
VT–(valid)
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–2.7
VT(invalid)
Receiver input threshold
for INVALID low-level output voltage
FORCEON = GND,
FORCEOFF = VCC
–0.3
VOH
INVALID high-level output voltage
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
INVALID low-level output voltage
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
MAX
2.7
UNIT
V
V
0.3
VCC – 0.6
V
V
0.4
V
6.9 Switching Characteristics: Driver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
Maximum data rate
CL = 1000 pF,
RL = 3 kΩ,
tsk(p)
Pulse skew (3)
CL = 150 pF to 2500 pF,
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate,
transition region
(see Figure 5)
(1)
(2)
(3)
VCC = 3.3 V,
RL = 3 kΩ to 7 kΩ
MIN
TYP (2)
150
250
See Figure 6
MAX
UNIT
kbit/s
100
ns
CL = 150 pF to 1000 pF
6
30
CL = 150 pF to 2500 pF
4
30
V/µs
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6.10 Switching Characteristics: Receiver
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
TYP (2)
UNIT
tPLH
Propagation delay time, low- to high-level output
CL = 150 pF, See Figure 7
150
ns
tPHL
Propagation delay time, high- to low-level output
CL = 150 pF, See Figure 7
150
ns
ten
Output enable time
CL = 150 pF, RL = 3 kΩ, See Figure 8
200
ns
tdis
Output disable time
CL = 150 pF, RL = 3 kΩ, See Figure 8
200
ns
tsk(p)
Pulse skew (3)
See Figure 7
50
ns
(1)
(2)
(3)
6
Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V.
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
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6.11 Switching Characteristics: Auto-Power Down
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TYP (1)
PARAMETER
UNIT
tvalid
Propagation delay time, low- to high-level output
1
µs
tinvalid
Propagation delay time, high- to low-level output
30
µs
ten
Supply enable time
100
µs
(1)
All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
6.12 Typical Characteristics
1.2
3.5
1
3
ROUT Voltage (V)
ROUT Voltage (V)
TA = 25° C; VCC = 3.3V
0.8
0.6
0.4
0.2
2.5
2
1.5
1
0.5
0
0
0
1
2
3
4
5
6
7
ROUT Current (mA)
8
9
10
0
1
Figure 1. Receiver VOL vs Load Current
3
4
5
6
7
ROUT Current (mA)
8
9
10
D002
Figure 2. Receiver VOH vs Load Current
6
0
5
-1
DOUT Voltage (V)
DOUT Voltage (V)
2
D001
4
3
2
-2
-3
-4
-5
1
-6
0
0
3
6
9
12
15
18
21
DOUT Current (mA)
24
27
30
0
3
D003
Figure 3. Driver VOH vs Load Current
6
9
12
15
18
21
DOUT Current (mA)
24
27
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D004
Figure 4. Driver VOL vs Load Current
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7 Parameter Measurement Information
3V
Generator
(see Note B)
Input
RS-232
Output
50 Ω
RL
tTHL
CL
(see Note A)
3V
FORCEOFF
TEST CIRCUIT
0V
tTLH
3V
3V
Output
−3 V
−3 V
6V
SR(tr) =
t THL or t TLH
VOH
VOL
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 5. Driver Slew Rate
3V
Generator
(see Note B)
RS-232
Output
50 Ω
RL
Input
1.5 V
1.5 V
0V
CL
(see Note A)
tPHL
tPLH
VOH
3V
FORCEOFF
50%
50%
Output
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: PRR = 250 kbps, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 6. Driver Pulse Skew
3 V or 0 V
FORCEON
3V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
3V
FORCEOFF
tPHL
CL
(see Note A)
tPLH
VOH
50%
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 7. Receiver Propagation Delay Times
8
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Parameter Measurement Information (continued)
3V
Input
3 V or 0 V
FORCEON
VCC
S1
1.5 V
GND
0V
tPZH
(S1 at GND)
tPHZ
(S1 at GND)
RL
3 V or 0 V
1.5 V
VOH
Output
50%
Output
CL
(see Note A)
EN
Generator
(see Note B)
50 Ω
0.3 V
tPZL
(S1 at VCC)
tPLZ
(S1 at VCC)
0.3 V
Output
50%
VOL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A.
CL includes probe and jig capacitance.
B.
The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C.
tPLZ and tPHZ are the same as tdis.
D.
tPZL and tPZH are the same as ten.
Figure 8. Receiver Enable and Disable Times
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Parameter Measurement Information (continued)
2.7 V
2.7 V
0V
Receiver
Input
ROUT
Generator
(see Note B)
3V
0V
−2.7 V
−2.7 V
−3 V
50 Ω
tvalid
tinvalid
VCC
Autopowerdown
INVALID
CL = 30 pF
(see Note A)
FORCEOFF
FORCEON
DIN
DOUT
INVALID
Output
50% VCC
50% VCC
0V
ten
V+
≈V+
Supply
Voltages
0.3 V
VCC
0V
0.3 V
V−
TEST CIRCUIT
≈V−
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
0V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
† Auto-powerdown disables drivers and reduces supply
current to 1 µA.
Figure 9. INVALID Propagation Delay Times and Driver Enabling Time
10
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8 Detailed Description
8.1 Overview
The MAX3221E is a single driver, single receiver RS-232 solution operating from a single VCC supply. The RS232 pins provide IEC 61000-4-2 ESD protection. The device meets the requirements of TIA/EIA-232-F and
provides the electrical interface between an asynchronous communication controller and the serial-port
connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V
supply. These devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output
slew rate.
Flexible control options for power management are available when the serial port is inactive. The auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the
device does not sense a valid RS-232 signal on the receiver input, the driver output is disabled. If FORCEOFF is
set low and EN is high, both the driver and receiver are shut off, and the supply current is reduced to 1 µA.
Disconnecting the serial port or turning off the peripheral drivers causes the auto-power-down condition to occur.
Auto-power down can be disabled when FORCEON and FORCEOFF are high. With auto-power down enabled,
the device is activated automatically when a valid signal is applied to the receiver input. The INVALID output
notifies the user if an RS-232 signal is present at the receiver input. INVALID is high (valid data) if the receiver
input voltage is greater than 2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30
µs. INVALID is low (invalid data) if the receiver input voltage is between –0.3 V and 0.3 V for more than 30 µs.
See Figure 5 for receiver input levels.
8.2 Functional Block Diagram
3.3V, 5V
POWER
AUTOPOWERDOWN
FORCEON
FORCEOFF
RX Enable
EN
DIN
1
1
TX
250 kb/s
ROUT
INVALID
1
RX
DOUT
RS-232
IEC 61000-4-2
1
RIN
RS-232
STATUS
Copyright © 2016, Texas Instruments Incorporated
Figure 10. Logic Diagram (Positive Logic)
8.3 Feature Description
8.3.1 Power
The power block increases, inverts, and regulates voltage at V+ and V- pins using a charge pump that requires
four external capacitors. Auto-power-down feature for driver is controlled by FORCEON and FORCEOFF inputs.
Receiver is controlled by EN input. When MAX3221E is unpowered, it can be safely connected to an active
remote RS-232 device.
8.3.2 RS-232 Driver
One driver interfaces standard logic levels to RS-232 levels. DIN input must be valid high or low.
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Feature Description (continued)
8.3.3 RS-232 Receiver
One receiver interfaces RS-232 levels to standard logic levels. An open input results in a high output on ROUT.
RIN input includes an internal standard RS-232 load. A logic high input on the EN pin shuts down the receiver
output.
8.3.4 RS-232 Status
The INVALID output goes low when RIN input is unpowered for more than 30 µs. The INVALID output goes high
when receiver has a valid input. The INVALID output is active when Vcc is powered irregardless of FORCEON
and FORCEOFF inputs (see Table 3).
8.4 Device Functional Modes
Table 1, Table 2, and Table 3 show the behavior of the driver, receiver, and INVALID features under all possible
relevant combinations of inputs.
Table 1. Function Tables Each Driver (1)
INPUTS
DIN
(1)
FORCEON
FORCEOFF
VALID RIN
RS-232 LEVEL
OUTPUT
DOUT
DRIVER STATUS
X
X
L
X
Z
Powered off
L
H
H
X
H
H
H
H
X
L
Normal operation with
auto-power down disabled
L
L
H
Yes
H
H
L
H
Yes
L
L
L
H
No
Z
H
L
H
No
Z
Normal operation with
auto-power down enabled
Powered off by
auto-power down feature
H = high level, L = low level, X = irrelevant, Z = high impedance
Table 2. Each Receiver (1)
INPUTS
(1)
RIN
EN
VALID RIN
RS-232 LEVEL
OUTPUT
ROUT
L
L
X
H
L
X
H
L
X
H
X
Z
Open
L
No
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off),
Open = disconnected input or connected driver off
Table 3. INVALID (1)
INPUTS
(1)
12
OUTPUT
RIN
FORCEON
FORCEOFF
EN
INVALID
L
X
X
X
H
H
X
X
X
H
Open
X
X
X
L
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
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MAX3221E
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SLLS686B – OCTOBER 2005 – REVISED SEPTEMBER 2016
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The MAX3221E line driver and receiver is a specialized device for 3-V to 5.5-V RS-232 communication
applications. This application is a generic implementation of this device with all required external components.
For proper operation, add capacitors as shown in Figure 11.
9.2 Typical Application
ROUT and DIN connect to UART or general purpose logic lines. FORCEON and FORCEOFF may be connected
general purpose logic lines or tied to ground or VCC. INVALID may be connected to a general purpose logic line
or left unconnected. RIN and DOUT lines connect to a RS-232 connector or cable. DIN, FORCEON, and
FORCEOFF inputs must not be left unconnected.
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Typical Application (continued)
EN
1
16
2
V CC
C1+
15
+
3
C1
+
+
−
−
V+
AutoPowerdown
C3 (1)
4
GND
−
14
13
12
C2
6
C2−
7
11
FORCEON
DIN
V−
10
C4
+
RIN
DOUT
C2+
+
−
C BYPASS = 0.1 mF
C1−
5
−
FORCEOFF
8
9
INVALID
ROUT
5 kW
(1) C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected
as shown.
V CC vs CAPACITOR VALUES
V CC
C1
C2, C3, and C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 mF
0.047 mF
0.1 mF
0.1 mF
0.33 mF
0.47 mF
Copyright © 2016, Texas Instruments Incorporated
Figure 11. Typical Operating Circuit and Capacitor Values
9.2.1 Design Requirements
•
•
•
Recommended VCC is 3.3 V or 5 V.
– 3 V to 5.5 V is also possible
Maximum recommended bit rate is 250 kbps.
Use capacitors as shown in Figure 11.
9.2.2 Detailed Design Procedure
•
•
14
DIN, FORCEOFF and FORCEON inputs must be connected to valid low or high logic levels.
Select capacitor values based on VCC level for best performance.
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Typical Application (continued)
9.2.3 Application Curves
8
8
DIN
DOUT
ROUT
DIN
DOUT
ROUT
6
Waveform Voltage (V)
Waveform Voltage (V)
6
4
2
0
-2
-4
4
2
0
-2
-4
-6
-6
0
1
2
3
4
5
6
Time (us)
7
8
9
10
0
1
D005
Figure 12. Loopback Waveforms
VCC = 3.3 V, Data Rate 250 kbit/s
2
3
4
5
6
Time (us)
7
8
9
10
D006
Figure 13. Loopback Waveforms with 1-nF load
VCC = 3.3 V, Data Rate 250 kbit/s
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MAX3221E
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10 Power Supply Recommendations
TI recommends a 0.1-µF capacitor to filter noise on the power supply pin. For additional filter capability, a
0.01-μF capacitor may be added in parallel as well. Power supply input voltage is recommended to be any valid
level in Recommended Operating Conditions.
11 Layout
11.1 Layout Guidelines
Keep the external capacitor traces short. This is more important on C1 and C2 nodes that have the fastest rise
and fall times. Make the impedance from MAX3221E ground pin and circuit board's ground plane as low as
possible for best ESD performance. Use wide metal and multiple vias on both sides of ground pin.
11.2 Layout Example
1 EN
Ground
C3
2 C1+
FORCEOFF 16
VCC 15
VCC
PF
C1
3 V+
GND 14
4 C1-
DOUT 13
5 C2+
FORCEON 12
6 C2-
DIN 11
Ground
C2
7 V-
Ground
INVALID 10
C4
8 RIN
ROUT 9
Figure 14. MAX3221E Layout Example
16
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MAX3221E
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SLLS686B – OCTOBER 2005 – REVISED SEPTEMBER 2016
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resource
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Product Folder Links: MAX3221E
17
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
MAX3221ECDB
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECDBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221ECPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
MP221EC
MAX3221EIDB
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIDBG4
ACTIVE
SSOP
DB
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIDBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIDBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIPW
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIPWE4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIPWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIPWR
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU | CU SN
Level-1-260C-UNLIM
-40 to 85
MP221EI
MAX3221EIPWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
MP221EI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
MAX3221ECPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX3221EIPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX3221EIPWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
MAX3221EIPWRG4
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Dec-2018
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
MAX3221ECPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
MAX3221EIPWR
TSSOP
PW
16
2000
367.0
367.0
35.0
MAX3221EIPWR
TSSOP
PW
16
2000
364.0
364.0
27.0
MAX3221EIPWRG4
TSSOP
PW
16
2000
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OUTLINE
PW0016A
TSSOP - 1.2 mm max height
SCALE 2.500
SMALL OUTLINE PACKAGE
SEATING
PLANE
C
6.6
TYP
6.2
A
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1
4.9
NOTE 3
4.55
8
9
B
0.30
0.19
0.1
C A B
16X
4.5
4.3
NOTE 4
1.2 MAX
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0 -8
0.75
0.50
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SYMM
16X (1.5)
(R0.05) TYP
1
16
16X (0.45)
SYMM
14X (0.65)
8
9
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
0.05 MAX
ALL AROUND
NON-SOLDER MASK
DEFINED
(PREFERRED)
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
16X (1.5)
SYMM
(R0.05) TYP
1
16X (0.45)
16
SYMM
14X (0.65)
8
9
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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