Texas Instruments | TUSB4020BI-Q1 Two-Port USB 2.0 Hub | Datasheet | Texas Instruments TUSB4020BI-Q1 Two-Port USB 2.0 Hub Datasheet

Texas Instruments TUSB4020BI-Q1 Two-Port USB 2.0 Hub Datasheet
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TUSB4020BI-Q1
SLLSEI1 – JULY 2015
TUSB4020BI-Q1 Two-Port USB 2.0 Hub
1 Features
3 Description
•
•
The TUSB4020BI-Q1 is a two-port USB 2.0 hub. It
provides USB high-speed/full-speed connections on
the upstream port and provides high-speed, fullspeed, or low-speed connections on the two
downstream ports. When the upstream port is
connected to an electrical environment that supports
high-speed and full-speed/low-speed connections,
high-speed
and
full-speed/low-speed
USB
connectivity is enabled on the downstream ports.
When the upstream port is connected to an electrical
environment that only supports full-speed/low-speed
connections, high-speed connectivity are disabled on
the downstream ports.
1
•
•
•
•
•
•
•
•
•
•
•
Two-Port USB 2.0 Hub
USB 2.0 Hub Features
– Multi-Transaction Translator (MTT) Hub: Two
Transaction Translators
– Four Asynchronous Endpoint Buffers per
Transaction Translator
DM/DP Polarity Swap
Type C Compatible
Supports Battery Charging
– CDP Mode (Upstream Port Connected)
– DCP Mode (Upstream Port Unconnected)
– DCP Mode Complies With Chinese
Telecommunications Industry Standard YD/T
1591-2009
– D+/D– Divider Mode
Per Port or Ganged Power Switching and
Overcurrent Notification Inputs
OTP ROM, Serial EEPROM, or I2C/SMBus Slave
Interface for Custom Configurations:
– VID and PID
– Port Customizations
– Manufacturer and Product Strings (Not by OTP
ROM)
– Serial Number (Not by OTP ROM)
Application Feature Selection Using Terminal
Selection or EEPROM/ or I2C/SMBus Slave
Interface
Provides 128-Bit Universally Unique Identifier
(UUID)
Supports On-Board and In-System OTP/EEPROM
Programming Through the USB 2.0 Upstream
Port
Single Clock Input, 24-MHz Crystal or Oscillator
No Special Driver Requirements; Works
Seamlessly on any Operating System With USB
Stack Support
48-Pin HTQFP Package (PHP)
The TUSB4020BI-Q1 supports per port or ganged
power switching and overcurrent protection.
An individually port power controlled hub switches
power on or off to each downstream port as
requested by the USB host. Also when an individually
port power controlled hub senses an over-current
event, only power to the affected downstream port
will be switched off.
A ganged hub switches on power to all its
downstream ports when power is required to be on
for any port. The power to the downstream ports is
not switched off unless all ports are in a state that
allows power to be removed. Also when a ganged
hub senses an overcurrent event, power to all
downstream ports will be switched off.
Device Information(1)
PART NUMBER
TUSB4020BI-Q1
PACKAGE
HTQFP (48)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Block Diagram
Embedded
Host
TUSB4020BI-Q1
Front Console
Convenience Port
Front Console
SD Reader
2 Applications
•
•
•
•
•
Automotive
Computer Systems
Docking Stations
Monitors
Set-Top Boxes
BODY SIZE (NOM)
7.00 mm × 7.00 mm
USB 2.0 Connection
USB 2.0 Hub
USB 2.0 Device
USB 2.0 Port
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TUSB4020BI-Q1
SLLSEI1 – JULY 2015
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Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Description (continued).........................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
3
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7
7
7
7
8
8
9
Absolute Maximum Ratings .....................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
3.3-V I/O Electrical Characteristics ...........................
Hub Input Supply Current .........................................
Power-Up Timing Requirements...............................
8.5 Programming........................................................... 13
8.6 Register Maps ......................................................... 14
9
9.1 Application Information............................................ 26
9.2 Typical Applications ................................................ 27
10 Power Supply Recommendations ..................... 33
10.1 Power Supply ........................................................ 33
10.2 Downstream Port Power ....................................... 33
10.3 Ground .................................................................. 33
11 Layout................................................................... 34
11.1 Layout Guidelines ................................................. 34
11.2 Layout Example .................................................... 35
12 Device and Documentation Support ................. 37
12.1
12.2
12.3
12.4
Detailed Description ............................................ 10
8.1
8.2
8.3
8.4
Overview .................................................................
Functional Block Diagram .......................................
Feature Description.................................................
Device Functional Modes........................................
Application and Implementation ........................ 26
10
10
11
12
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
37
37
37
37
13 Mechanical, Packaging, and Orderable
Information ........................................................... 37
4 Revision History
2
DATE
REVISION
NOTES
July 2015
*
Initial release.
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5 Description (continued)
The TUSB4020BI-Q1 provides terminal strap configuration for some features including battery charging support,
and also provides customization though OTP ROM, I2C EEPROM or through an I2C/SMBus slave interface for
PID, VID, and custom port and phy configurations. Custom string support is also available when using an I2C
EEPROM or the I2C/SMBus slave interface.
The device is available in a 48-pin HTQFP package and is designed for operation over the industrial temperature
range of –40°C to 85°C.
6 Pin Configuration and Functions
28 27
VDD33
USB_DM_UP
30 29
USB_DP_UP
RSVD
VDD
31
RSVD
RSVD
35 34 33 32
VDD
RSVD
36
37
VDD33
FULLPWRMGMTz / SMBA1
VDD33
GANGED / SMBA2
PHP Package
48-Pin HTQFP
Top View
26 25
24
USB_R1
38
23
VDD33
XO
39
22
SMBUSz
VDD33
40
21
PWRCTL_POL
USB_DP_DN1
41
20
RSVD
USB_DM_DN1
42
19
RSVD
RSVD
43
18
VDD
RSVD
44
17
RSVD
VDD
45
16
RSVD
RSVD
46
15
USB_DM_DN2
RSVD
47
14
USB_DP_DN2
VDD33
48
1
3
4
5
6
7
8
9
10 11
PWRCTL1/BATEN1
OVERCUR1z
PWRCTL2/BATEN2
VDD33
OVERCUR2z
USB_VBUS
TEST
VDD
GRSTZ
2
13
12
SCL/SMBCLK
(TOP VIEW)
SDA/SMBDAT
VDD
XI
VDD33
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Pin Functions
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
CLOCK AND RESET SIGNALS
GRSTz
11
I
PU
Global power reset. This reset brings all of the TUSB4020BI-Q1 internal registers to their
default states. When GRSTz is asserted, the device is completely nonfunctional.
XI
38
I
Crystal input. This terminal is the crystal input for the internal oscillator. The input may
alternately be driven by the output of an external oscillator. When using a crystal a 1-MΩ
feedback resistor is required between XI and XO.
XO
39
O
Crystal output. This terminal is the crystal output for the internal oscillator. If XI is driven by
an external oscillator this pin may be left unconnected. When using a crystal a 1-MΩ
feedback resistor is required between XI and XO.
USB UPSTREAM SIGNALS
USB_DP_UP
26
I/O
USB high-speed differential transceiver (positive)
USB_DM_UP
27
I/O
USB high-speed differential transceiver (negative)
USB_R1
24
I
Precision resistor reference. A 9.53-kΩ ±1% resistor should be connected between
USB_R1 and GND.
USB_VBUS
9
I
USB upstream port power monitor. The VBUS detection requires a voltage divider. The
signal USB_VBUS must be connected to VBUS through a 90.9-kΩ ±1% resistor, and to
ground through a
10-kΩ ±1% resistor from the signal to ground.
USB DOWNSTREAM SIGNALS
USB_DP_DN1
41
I/O
USB high-speed differential transceiver (positive) downstream port 1.
USB_DM_DN1
42
I/O
USB high-speed differential transceiver (negative) downstream port 1.
USB port 1 power-on control for downstream power or battery charging enable. The
terminal is used for control of the downstream power switch for Port 1.
PWRCTL1/BATEN1
4
I/O
PD
In addition, the value of the terminal is sampled at the deassertion of reset to determine the
value of the battery charging support for Port 1 as indicated in the Battery Charging
Support register.
0 = Battery charging not supported
1 = Battery charging supported
USB DS port 1 overcurrent detection input. This terminal is used to connect the over
current output of the downstream port power switch for port 1.
OVERCUR1z
5
I
PU
0 = An overcurrent event has occurred
1 = An overcurrent event has not occurred
If power management is enabled, the external circuitry needed should be determined by the
power switch. In ganged mode, either OVERCUR1z or OVERCUR2z can be used. In
ganged mode, the overcurrent will be reported as a hub event instead of a port event.
USB_DP_DN2
14
I/O
USB high-speed differential transceiver (positive) downstream port 2.
USB_DM_DN2
15
I/O
USB high-speed differential transceiver (negative) downstream port 2.
Power-on control /battery charging enable for downstream port 2. This terminal is used for
control of the downstream power switch for port 2.
PWRCTL2/BATEN2
6
I/O
PD
The value of the terminal is sampled at the deassertion of reset to determine the value of
the battery charging support for port 2 as indicated in the Battery Charging Support register.
0 = Battery charging not supported
1 = Battery charging supported
Overcurrent detection for downstream port 2. This terminal is used to connect the over
current output of the downstream port power switch for port 2.
OVERCUR2z
8
I
PU
0 = An overcurrent event has occurred
1 = An overcurrent event has not occurred
If power management is enabled, the external circuitry needed should be determined by the
power switch. In ganged mode either OVERCUR1z or OVERCUR2z can be used. In
ganged mode the overcurrent will be reported as a hub event instead of a port event.
(1)
4
I = input, O = output, I/O = input/output, PU = internal pullup resistor, PD = internal pulldown resistor, and PWR = power signal
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Pin Functions (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
I2C/SMBUS SIGNALS
I2C clock/SMBus clock. Function of terminal depends on the setting of the SMBUSz input.
SCL/SMBCLK
2
I/O
PD
When SMBUSz = 1, this terminal acts as the serial clock interface for an I2C
EEPROM.
When SMBUSz = 0, this terminal acts as the serial clock interface for an SMBus host.
This pin must be pulled up to use the OTP ROM.
Can be left unconnected if external interface not implemented.
I2C data/SMBus data. Function of terminal depends on the setting of the SMBUSz input.
SDA/SMBDAT
3
I/O
PD
When SMBUSz = 1, this terminal acts as the serial data interface for an I2C
EEPROM.
When SMBUSz = 0, this terminal acts as the serial data interface for an SMBus host.
This pin must be pulled up to use the OTP ROM.
Can be left unconnected if external interface not implemented.
TEST AND MISCELLANEOUS SIGNALS
SMBUS mode.
The value of the terminal is sampled at the deassertion of reset to enable I2C or SMBus
mode.
SMBUSz
22
I
PU
0 = SMBus mode selected
1 = I2C mode selected
After reset, this signal is driven low by the TUSB4020BI-Q1. Due to this behavior, it is
recommended to not tie directly to supply but instead pull-up or pull-down using external
resistor.
Power control polarity.
The value of the terminal is sampled at the deassertion of reset to set the polarity of
PWRCTL[2:1].
PWRCTL_POL
21
I/O
PD
0 = PWRCTL polarity is active high.
1 = PWRCTL polarity is active low.
After reset, this signal is driven low by the TUSB4020BI-Q1. Due to this behavior, it is
recommended to not tie directly to supply but instead pull-up or pull-down using external
resistor.
Ganged operation enable/SMBus address bit 2/ high-speed status for upstream port
The value of the terminal is sampled at the deassertion of reset to set the power switch and
over current detection mode as follows:
0 = Individual power control supported when power switching is enabled.
1 = Power control gangs supported when power switching is enabled.
GANGED/SMBA2/
HS_UP
35
I
PU
When SMBus mode is enabled using SMBUSz, this terminal sets the value of the SMBus
slave address bit 2. SMBus slave address bits 2 and 3 are always 1 for the TUSB4020BIQ1.
After reset, this signal indicates the high-speed USB connection status of the upstream
port. A value of 1 indicates the upstream port is connected to a high-speed USB capable
port.
Note: Individual power control must be enabled for battery charging applications.
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Pin Functions (continued)
PIN
NAME
NO.
TYPE (1)
DESCRIPTION
Full power management enable/ SMBus Address bit 1.
The value of the terminal is sampled at the deassertion of reset to set the power switch
control follows:
0 = Power switching supported
1 = Power switching not supported
FULLPWRMGMTz/
SMBA1
36
I, PU
Full power management is the ability to control power to the downstream ports of the
TUSB4020BI-Q1 using PWRCTL[2:1]/BATEN[2:1].
When SMBus mode is enabled using SMBUSz, this terminal sets the value of the SMBus
slave address bit 1. SMBus slave address bit 3 is always 1 for the TUSB4020BI-Q1.
Can be left unconnected if full power management and SMBus are not implemented.
After reset, this signal is driven low by the TUSB4020BI-Q1. Due to this behavior, it is
recommended to not tie directly to supply but instead pull-up or pull-down using external
resistor.
Note: Power switching must be supported for battery charging applications.
RSVD
16, 17, 19,
20, 28, 29,
31, 32, 43,
44, 46, 47
I/O
Reserved. These pins are for internal use only and should be left unconnected on PCB.
TEST
10
I
PD
TEST mode enable. When this terminal is asserted high at reset enables test mode. This
terminal is reserved for factory use. It is recommended to pull-down this terminal to ground.
POWER AND GROUND SIGNALS
VDD
1, 12, 18,
30, 34, 45
PWR
1.1-V power rail
VDD33
7, 13, 23,
25, 33, 37,
40, 48
PWR
3.3-V power rail
PAD
—
GND
6
Ground
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7 Specifications
7.1 Absolute Maximum Ratings (1)
over operating free-air temperature (unless otherwise noted)
MIN
MAX
UNIT
VDD
Steady-state supply voltage
–0.3
1.4
V
VDD33
Steady-state supply voltage
–0.3
3.8
V
Tstg
Storage temperature
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
Human body model (HBM) per AEC Q100-002 (1)
V(ESD)
(1)
Electrostatic
discharge
Charged device model (CDM) per AEQ Q100-011
UNIT
±4000
Corner pins
±1000
Other pins
±1000
V
AEC Q100-002 indicates HBM stressing is done in accordance with ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
1.1-V supply voltage
0.99
1.1
1.26
V
3.3-V supply voltage
3
3.3
3.6
V
USB_VBUS
Voltage at USB_VBUS pin
0
1.155
V
TA
Operating free-air temperature range
–40
25
85
°C
TJ
Operating junction temperature range
–40
25
105
°C
(1)
VDD33
VDD
(1)
A 1.05-V, 1.1-V, or 1.2-V supply may be used as long as minimum and maximum supply conditions are met.
7.4 Thermal Information
TUSB4020BI-Q1
THERMAL METRIC (1)
PHP (HTQFP)
UNIT
48 PINS
RθJA
Junction-to-ambient thermal resistance
31.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
16.1
°C/W
RθJB
Junction-to-board thermal resistance
13
°C/W
ψJT
Junction-to-top characterization parameter
0.5
°C/W
ψJB
Junction-to-board characterization parameter
12.9
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
0.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 3.3-V I/O Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
OPERATION
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIH
High-level input voltage
(1)
VDD33
2
VDD33
V
VIL
Low-level input voltage (1)
VDD33
0
0.8
V
VI
Input voltage
0
VDD33
V
VO
Output voltage (2)
0
VDD33
V
tt
Input transition time (trise and tfall)
0
25
ns
0.13 ×
VDD33
V
(3)
Vhys
Input hysteresis
VOH
High-level output voltage
VDD33
IOH = –4 mA
VOL
Low-level output voltage
VDD33
IOL = 4 mA
0.4
V
IOZ
High-impedance, output current (2)
VDD33
VI = 0 to VDD33
±20
µA
IOZP
High-impedance, output current with
internal pullup or pulldown resistor (4)
VDD33
VI = 0 to VDD33
±225
µA
VDD33
VI = 0 to VDD33
±15
µA
II
(1)
(2)
(3)
(4)
(5)
Input current
(5)
2.4
V
Applies to external inputs and bidirectional buffers
Applies to external outputs and bidirectional buffers
Applies to GRSTz
Applies to pins with internal pullups/pulldowns
Applies to external input buffers
7.6 Hub Input Supply Current
typical values measured at TA = 25°C
VDD33
VDD11
3.3 V
1.1 V
Power-on (after reset)
5
39
mA
Disconnect from host
5
39
mA
Suspend
5
39
mA
2.0 host / 1 HS device active
48
71
mA
2.0 host / 2 HS devices active
60
80
mA
PARAMETER
UNIT
LOW-POWER MODES
ACTIVE MODES (US STATE / DS STATE)
8
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7.7 Power-Up Timing Requirements
MIN
td1
VDD33 stable before VDD stable (1)
td2
VDD and VDD33 stable before deassertion of GRSTz
tsu_io
Setup for MISC inputs (3) sampled at the deassertion of GRSTz
thd_io
Hold for MISC inputs
(3)
sampled at the deassertion of GRSTz.
NOM
MAX
UNIT
(2)
ms
3
ms
0.1
µs
see
0.1
µs
tVDD33_RAMP VDD33 supply ramp requirements
0.2
100
ms
tVDD_RAMP
0.2
100
ms
(1)
(2)
(3)
VDD supply ramp requirements
An active reset is required if the VDD33 supply is stable before the VDD11 supply. This active Reset shall meet the 3ms power-up delay
counting from both power supplies being stable to the de-assertion of GRSTz.
There is no power-on relationship between VDD33 and VDD unless GRSTz is only connected to a capacitor to GND. Then VDD must
be stable minimum of 10 μs before the VDD33.
MISC pins sampled at deassertion of GRSTz: FULLPWRMGMTz, GANGED, PWRCTL_POL, SMBUSz, BATEN[4:1], and AUTOENz.
Td2
GRSTz
VDD33
Td1
VDD
Tsu_io
Thd_io
MISC_IO
Figure 1. Power-Up Timing Requirements
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8 Detailed Description
8.1 Overview
The TUSB4020BI-Q1 is a two-port USB 2.0 hub. It provides USB high-speed/full-speed connections on the
upstream port and provides USB high-speed, full-speed, or low-speed connections on the downstream ports.
When the upstream port is connected to an electrical environment that supports high-speed and fullspeed/low-speed connections, USB high-speed and full-speed/low-speed connectivity is enabled on the
downstream ports. When the upstream port is connected to an electrical environment that only supports fullspeed/low-speed connections, USB high-speed connectivity are disabled on the downstream ports.
8.2 Functional Block Diagram
USB_VBUS
USB_DM_UP
USB_DP_UP
USB_R1
VDD33
VDD
VSS
VBUS
Detect
Power
Distribution
USB 2.0 Hub
XI
Oscillator
XO
USB_DM_DN2
USB_DP_DN2
USB_DM_DN1
USB_DP_DN1
GRSTz
Clock
and
Reset
Distribution
TEST
GANGED/SMBA2/HS_UP
FULLPWRMGMTz/SMBA1
PWRCTL_POL
SMBUSz
SCL/SMBCLK
SDA/SMBDAT
GPIO
2
I C
SMBUS
OVERCUR1z
PWRCTL1/BATEN1
Control
Registers
OTP
ROM
OVERCUR2z
PWRCTL2/BATEN2
10
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8.3 Feature Description
8.3.1 Battery Charging Features
The TUSB4020BI-Q1 provides support for battery charging. Battery charging support may be enabled on a per
port basis through the REG_6h(batEn[1:0]).
Battery charging support includes both charging downstream port (CDP) and dedicated charging port (DCP)
modes. The DCP mode is compliant with the Chinese Telecommunications Industry Standard YD/T 1591-2009.
In addition to standard DCP mode, the TUSB4020BI-Q1 provides a mode (AUTOMODE) which automatically
provides support for DCP devices and devices that support custom charging indication. AUTOMODE is disabled
by default. When in AUTOMODE, the port automatically switches between a divider mode and the DCP mode
depending on the portable device connected. The divider mode places a fixed DC voltage on the ports DP and
DM signals which allows some devices to identify the capabilities of the charger. The default divider mode
indicates support for up to 5 W. The divider mode can be configured to report a high-current setting (up to 10 W)
through REG_Ah(HiCurAcpModeEn). When AUTOMODE is enabled through REG_Ah(autoModeEnz), the CDP
mode is not functional. CDP mode can not be used when AUTOMODE is enabled.
The battery charging mode for each port depends on the state of Reg_6h(batEn[n]), the status of the VBUS
input, and the state of REG_Ah(autoModeEnz) upstream port, as identified in Table 1. Battery charging can also
be enabled through the PWRCTL1/BATEN1 and PWRCTL2/BATEN2 pins.
Table 1. TUSB4020BI-Q1 Battery Charging Modes
batEn[n]
VBUS
autoModeEnz
0
Don’t care
Don’t care
1
<4 V
>4 V
(1)
(2)
(3)
(4)
BC Mode Port x
(x = n + 1)
Don’t care
0
Automode (1)
1
DCP (3)
1
CDP
(2)
(4)
(3)
Auto-mode automatically selects divider-mode or DCP mode.
Divider mode can be configured for high-current mode through register or OTP settings.
USB device is USB Battery Charging Specification Revision 1.2 Compliant
USB device is Chinese Telecommunications Industry Standard YD/T 1591-2009
8.3.2 USB Power Management
The TUSB4020BI-Q1 can be configured for power switched applications using either per-port or ganged powerenable controls and overcurrent status inputs.
Power switch support is enabled by REG_5h(fullPwrMgmtz) and the per-port or ganged mode is configured by
REG_5h(ganged). It can also be enabled through the FULLPWRMGMTz pin. Also ganged or individual control
can be controlled by the GANGED pin.
The TUSB4020BI-Q1 supports both active-high and active-low power-enable controls. The PWRCTL[2:1] polarity
is configured by REG_Ah(pwrctlPol). The polarity can also be configured by the PWRCTL_POL pin.
8.3.3 Clock Generation
The TUSB4020BI-Q1 accepts a crystal input to drive an internal oscillator or an external clock source. If a crystal
is used, a 1-MΩ shunt resistor is required. Keep the XI and XO traces as short as possible and away from any
switching leads to minimize noise coupling.
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R1
TUSB4020BI-Q1
1M
XI
XO
CL1
24MHz
CL2
Figure 2. TUSB4020BI-Q1 Clock
8.3.4 Power-Up and Reset
The TUSB4020BI-Q1 does not have specific power sequencing requirements with respect to the VDD or VDD33
power rails. The VDD or VDD33 power rails may be powered up for an indefinite period of time while the other is
not powered up if all of these constraints are met:
• All maximum ratings and recommended operating conditions are observed.
• All warnings about exposure to maximum rated and recommended conditions are observed, particularly
junction temperature. These apply to power transitions as well as normal operation.
• Bus contention while VDD33 is powered-up must be limited to 100 hours over the projected lifetime of the
device.
• Bus contention while VDD33 is powered-down may violate the absolute maximum ratings.
A supply bus is powered up when the voltage is within the recommended operating range. A supply bus is
powered down when it is below that range, either stable or in transition.
A minimum reset duration of 3 ms is required, which is defined as the time when the power supplies are in the
recommended operating range to the deassertion of GRSTz. This can be generated using programmable-delay
supervisory device or using an RC circuit.
8.4 Device Functional Modes
8.4.1 External Configuration Interface
The TUSB4020BI-Q1 supports a serial interface for configuration register access. The device may be configured
by an attached I2C EEPROM or accessed as a slave by a SMBus-capable host controller. The external interface
is enabled when both the SCL/SMBCLK and SDA/SMBDAT terminals are pulled up to 3.3 V at the deassertion of
reset. The mode, I2C master, or SMBus slave is determined by the state of SMBUSz terminal at reset.
12
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8.5 Programming
8.5.1 One-Time Programmable (OTP) Configuration
The TUSB4020BI-Q1 allows device configuration through OTP non-volatile memory (OTP). The programming of
the OTP is supported using vendor-defined USB device requests. For details using the OTP features, contact
your TI representative.
Table 2 provides a list features which may be configured using the OTP. The bit field section in Table 2 shows
which features can be controlled by OTP ROM. The bits not listed in the table are not accessible by the OTP
ROM.
Table 2. OTP Configurable Features
CONFIGURATION REGISTER OFFSET
BIT FIELD
DESCRIPTION
REG_01h
[7:0]
Vendor ID LSB
REG_02h
[7:0]
Vendor ID MSB
REG_03h
[7:0]
Product ID LSB
REG_04h
[7:0]
Product ID MSB
REG_07h
[0]
Port removable configuration for downstream ports 1. OTP configuration is
inverse of rmbl[1:0], that is:
1 = Not removable
0 = Removable
REG_07h
[1]
Port removable configuration for downstream ports 2. OTP configuration is
inverse of rmbl[1:0], that is:
1 = Not removable
0 = Removable
REG_0Ah
[1]
Automode enable
REG_0Ah
[4]
High-current divider mode enable.
REG_F2h
[3:1]
USB power switch power-on delay.
8.5.2 I2C EEPROM Operation
The TUSB4020BI-Q1 supports a single-master, standard mode (100 kbit/s) connection to a dedicated I2C
EEPROM when the I2C interface mode is enabled. In I2C mode, the TUSB4020BI-Q1 reads the contents of the
EEPROM at bus address 1010000b using 7-bit addressing starting at address 0.
If the value of the EEPROM contents at byte 00h equals 55h, the TUSB4020BI-Q1 loads the configuration
registers according to the EEPROM map. If the first byte is not 55h, the TUSB4020BI-Q1 exits the I2C mode and
continues execution with the default values in the configuration registers. The hub will not connect on the
upstream port until the configuration is completed. If the TUSB4020BI-Q1 detects an unprogrammed EEPROM
(value other than 55h), it enters programming mode and a programming endpoint within the hub is enabled.
Note, the bytes located above offset Ah are optional. The requirement for data in those addresses depends on
the options configured in the Device Configuration, Phy Custom Configuration, and Device Configuration 2
registers.
For details on I2C operation, refer to the UM10204 I2C-bus Specification and User Manual.
8.5.3 SMBus Slave Operation
When the SMBus interface mode is enabled, the TUSB4020BI-Q1 supports read block and write block protocols
as a slave-only SMBus device.
The TUSB4020BI-Q1 slave address is 1000 1xyz, where:
• x is the state of GANGED/SMBA2/HS_UP terminal at reset
• y is the state of FULLPWRMGMTz/SMBA1 terminal at reset
• z is the read/write bit; 1 = read access, 0 = write access.
If the TUSB4020BI-Q1 is addressed by a host using an unsupported protocol, it does not respond. The
TUSB4020BI-Q1 waits indefinitely for configuration by the SMBus host and does not connect on the upstream
port until the SMBus host indicates configuration is complete by clearing the CFG_ACTIVE bit.
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For details on SMBus requirements, refer to the System Management Bus Specification.
8.6 Register Maps
8.6.1 Configuration Registers
The internal configuration registers are accessed on byte boundaries. The configuration register values are
loaded with defaults but can be overwritten when the TUSB4020BI-Q1 is in I2C or SMBus mode.
Table 3. TUSB4020BI-Q1 Register Map
BYTE ADDRESS
EEPROM CONFIGURABLE
ROM Signature Register
No
01h
Vendor ID LSB
Yes
02h
Vendor ID MSB
Yes
03h
Product ID LSB
Yes
04h
Product ID MSB
Yes
05h
Device Configuration Register
Yes
06h
Battery Charging Support Register
Yes
07h
Device Removable Configuration Register
Yes
08h
Port Used Configuration Register
09h
Reserved
0Ah
Device Configuration Register 2
Yes
Yes, program to 00h
Yes
0Bh to 0Fh
Reserved
10h to 1Fh
UUID Byte [15:0]
No
20h to 21h
LangID Byte [1:0]
Yes, if customStrings is set
22h
Serial Number String Length
Yes, if customSerNum is set
23h
Manufacturer String Length
Yes, if customStrings is set
24h
Product String Length
Yes, if customStrings is set
25h to 2Fh
Reserved
30h to 4Fh
Serial Number String Byte [31:0]
Yes, if customSerNum is set
50h to 8Fh
Manufacturer String Byte [63:0]
Yes, if customStrings is set
90h to CFh
Product String Byte [63:0]
Yes, if customStrings is set
D0 to DFh
Reserved
No
F0h
Additional Feature Configuration Register
Yes
F1h
Reserved
Yes
F2h
Charging Port Control Register
Yes
Reserved
No
Device Status and Command Register
No
Reserved
No
F3 to F7h
F8h
F9 to FFh
14
CONTENTS
00h
Yes
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8.6.1.1 ROM Signature Register (offset = 0h) [reset = 0h]
Figure 3. Register Offset 0h
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 4. ROM Signature Register
Bit
7:0
Field
Type
romSignature
R/W
Reset
Description
0h
ROM Signature Register. This register is used by the TUSB4020BI-Q1 in I2C mode
to validate the attached EEPROM has been programmed. The first byte of the
EEPROM is compared to the mask 55h and if not a match, the TUSB4020BI-Q1
aborts the EEPROM load and executes with the register defaults.
8.6.1.2 Vendor ID LSB Register (offset = 1h) [reset = 51h]
Figure 4. Register Offset 51h
7
0
R/W
6
1
R/W
5
0
R/W
4
1
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 5. Vendor ID LSB Register
Bit
7:0
Field
Type
vendorIdLsb
R/W
Reset
Description
51h
Vendor ID LSB. Least significant byte of the unique vendor ID assigned by the
USB-IF; the default value of this register is 51h representing the LSB of the TI
Vendor ID 0451h. The value may be overwritten to indicate a customer vendor ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are
non-zero. If both values are non-zero, the value when reading this register shall
reflect the OTP ROM value.
8.6.1.3 Vendor ID MSB Register (offset = 2h) [reset = 4h]
Figure 5. Register Offset 2h
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 6. Vendor ID MSB Register
Bit
7:0
Field
vendorIdMsb
Type
R/W
Reset
Description
4h
Vendor ID MSB. Most significant byte of the unique vendor ID assigned by the
USB-IF; the default value of this register is 04h representing the MSB of the TI
Vendor ID 0451h. The value may be overwritten to indicate a customer vendor ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are
non-zero. If both values are non-zero, the value when reading this register shall
reflect the OTP ROM value.
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8.6.1.4 Product ID LSB Register (offset = 3h) [reset = 25h]
Figure 6. Register Offset 3h
7
0
R/W
6
0
R/W
5
1
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 7. Product ID LSB Register
Bit
Field
7:0
Type
productIdLsb
R/W
Reset
Description
25h
Product ID LSB. Least significant byte of the product ID assigned by TI. The default
value of this register is 25h representing the LSB of the product ID assigned by TI. The
value reported in the USB 2.0 device descriptor is the value of this register bit wise
XORed with 00000010b. The value may be overwritten to indicate a customer product
ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are nonzero. If both values are non-zero, the value when reading this register shall reflect the
OTP ROM value.
8.6.1.5 Product ID MSB Register (offset = 4h) [reset = 80h]
Figure 7. Register Offset 4h
7
1
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 8. Bit Descriptions – Product ID MSB Register
Bit
7:0
16
Field
productIdLsb
Type
R/W
Reset
Description
80h
Product ID MSB. Most significant byte of the product ID assigned by TI; the default
value of this register is 80h representing the MSB of the product ID assigned by TI. The
value may be overwritten to indicate a customer product ID.
This field is read/write unless the OTP ROM VID and OTP ROM PID values are nonzero. If both values are non-zero, the value when reading this register will reflect the
OTP ROM value.
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8.6.1.6 Device Configuration Register (offset = 5h) [reset = 1Xh]
Figure 8. Register Offset 5h
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R
3
X
R/W
2
X
R/W
1
0
R/W
0
0
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 9. Device Configuration Register
Bit
7
Field
customStrings
Type
R/W
Reset
Description
1Xh
Custom strings enable. This bit controls the ability to write to the Manufacturer String
Length, Manufacturer String, Product String Length, Product String, and Language ID
registers.
0 = The Manufacturer String Length, Manufacturer String, Product String Length, Product
String, and Language ID registers are read only.
1 = The Manufacturer String Length, Manufacturer String, Product String Length, Product
String, and Language ID registers may be loaded by EEPROM or written by SMBus.
The default value of this bit is 0.
6
customSernum
R/W
1Xh
Custom serial number enable. This bit controls the ability to write to the serial number
registers.
0 = The Serial Number String Length and Serial Number String registers are read only.
1 = The Serial Number String Length and Serial Number String registers may be loaded
by EEPROM or written by SMBus.
The default value of this bit is 0.
5
RSVD
R/W
1Xh
Reserved. This bit is reserved.
4
RSVD
R
1Xh
Reserved. This bit is reserved and returns 1 when read.
1Xh
Ganged. This bit is loaded at the deassertion of reset with the value of the
GANGED/SMBA2/HS_UP terminal.
0 = When fullPwrMgmtz = 0, each port is individually power switched and enabled by the
PWRCTL[2:1]/BATEN[2:1] terminals
1 = When fullPwrMgmtz = 0, the power switch control for all ports is ganged and enabled
by the PWRCTL1/BATEN1 terminal
When the TUSB4020BI-Q1 is in I2C mode, the TUSB4020BI-Q1 loads this bit from the
contents of the EEPROM.
When the TUSB4020BI-Q1 is in SMBUS mode, the value may be overwritten by an
SMBus host.
3
ganged
R/W
2
fullPwrMgmtz
R/W
1Xh
Full Power Management. This bit is loaded at the deassertion of reset with the value of
the FULLPWRMGMTz/SMBA1 terminal.
0 = Port power switching and over-current status reporting is enabled
1 = Port power switching and over-current status reporting is disabled
When the TUSB4020BI-Q1 is in I2C mode, the TUSB4020BI-Q1 loads this bit from the
contents of the EEPROM.
When the TUSB4020BI-Q1 is in SMBUS mode, the value may be overwritten by an
SMBus host.
1
RSVD
R/W
1Xh
Reserved. This bit is reserved and should not be altered from the default.
0
RSVD
R
1Xh
Reserved. This field is reserved and returns 0 when read.
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8.6.1.7 Battery Charging Support Register (offset = 6h) [reset = 0Xh]
Figure 9. Register Offset 6h
7
0
R
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
X
R/W
0
X
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 10. Battery Charging Support Register
Bit
Field
Type
Reset
Description
7:2
RSVD
R
0Xh
Reserved. Read only, returns 0 when read.
0Xh
Battery Charger Support. The bits in this field indicate whether the downstream port
implements the charging port features.
0 = The port is not enabled for battery charging support features
1 = The port is enabled for battery charging support features
Each bit corresponds directly to a downstream port, that is batEn0 corresponds to
downstream port 1, and batEN1 corresponds to downstream port 2.
The default value for these bits are loaded at the deassertion of reset with the value of
PWRCTL/BATEN[1:0].
When in I2C/SMBus mode the bits in this field may be overwritten by EEPROM contents or
by an SMBus host.
1:0
batEn[1:0]
R/W
8.6.1.8 Device Removable Configuration Register (offset = 7h) [reset = 0Xh]
Figure 10. Register Offset 7h
7
0
R/W
6
0
R
5
0
R
4
0
R
3
0
R
2
0
R
1
X
R
0
X
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 11. Device Removable Configuration Register
Bit
7
6:2
1:0
18
Field
Type
Reset
Description
customRmbl
R/W
0Xh
Custom removable status. When this field is a 1, the TUSB4020BI-Q1 uses rmbl bits in
this register to identify removable status for the ports.
RSVD
R
0Xh
Reserved. Read only, returns 0 when read. Bits 3:2 are RW. They are reserved and
return 0 when read.
0Xh
Removable. The bits in this field indicate whether a device attached to downstream
ports 2 through 1 are removable or permanently attached.
0 = The device attached to the port is not removable
1 = The device attached to the port is removable
Each bit corresponds directly to a downstream port n + 1, that is rmbl0 corresponds to
downstream port 1, rmbl1 corresponds to downstream port 2, and so forth.
This field is read only unless the customRmbl bit is set to 1. Otherwise the value of this
filed reflects the inverted values of the OTP ROM non_rmb[1:0] field.
rmbl[1:0]
R/W
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8.6.1.9 Port Used Configuration Register (offset = 8h) [reset = 0h]
Figure 11. Register Offset 8h
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
2
0
R
1
1
R
0
1
R
1
1
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 12. Port Used Configuration Register
Bit
Field
Type
Reset
Description
7:0
RSVD
R
0h
Reserved. Read only.
8.6.1.10 PHY Custom Configuration Register (offset = 9h) [reset = 0h]
Figure 12. Register Offset 9h
7
0
R
6
0
R
5
0
R/W
4
0
R
3
0
R
2
0
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 13. PHY Custom Configuration Register
Bit
Field
Type
Reset
Description
7:6
RSVD
R
0h
Reserved. Read only, returns 0 when read.
5
RSVD
R/W
0h
Reserved. This bit is reserved and should not be altered from the default.
4:2
RSVD
R
0h
Reserved. Read only, returns 0 when read.
1:0
RSVD
R/W
0h
Reserved. This field is reserved and should not be altered from the default.
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8.6.1.11 Device Configuration Register 2 (offset = Ah)
Figure 13. Register Offset Ah
7
0
R
6
0
RW
5
X
RW
4
0
RW
3
0
RW
2
0
RW
1
0
RW
0
0
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 14. Bit Descriptions – Device Configuration Register 2
Bit
Field Name
Access
7
RSVD
RO
Reset
Description
Reserved. Read only, returns 0 when read.
Custom Battery Charging Feature Enable. This bit controls the ability to write to the
battery charging feature configuration controls.
6
customBCfeatures
RW
0 = The HiCurAcpModeEn and AutoModeEnz bits are read only and the values
are loaded from the OTP ROM.
1 = The HiCurAcpModeEn and AutoModeEnz bits are read/write and can be
loaded by EEPROM or written by SMBus. from this register.
This bit may be written simultaneously with HiCurAcpModeEn and AutoModeEnz.
Power enable polarity. This bit is loaded at the deassertion of reset with the inverse
value of the PWRCTL_POL terminal.
0 = PWRCTL polarity is active low
5
pwrctlPol
RW
1 = PWRCTL polarity is active high
When the TUSB4020BI-Q1 is in I2C mode, the TUSB4020BI-Q1 loads this bit from the
contents of the EEPROM.
When the TUSB4020BI-Q1 is in SMBUS mode, the value may be overwritten by an
SMBus host.
High-current ACP mode enable. This bit enables the high-current tablet charging mode
when the automatic battery charging mode is enabled for downstream ports.
4
HiCurAcpModeEn
RO/RW
0 = High current divider mode disabled
1 = High current divider mode enabled
This bit is read only unless the customBCfeatures bit is set to 1. Otherwise the value of
this bit reflects the value of the OTP ROM HiCurAcpModeEn bit.
3
RSVD
RW
Reserved
DSPort ECR enable. This bit enables full implementation of the DSPORT ECR (April
2013).
2
dsportEcrEn
RW
0 = DSPort ECR (April 2013) is enabled with the exception of changes related
to the CCS bit is set upon entering U0, and changes related to avoiding or
reporting compliance mode entry.
1 = The full DSport ECR (April 2013) is enabled.
Automatic Mode Enable. This bit is loaded from the OTP ROM.
The automatic mode only applies to downstream ports with battery charging enabled
when the upstream port is not connected. Under these conditions:
0 = Automatic mode battery charging features are enabled. Only battery
charging DCP and custom BC (divider mode) is enabled.
1
autoModeEnz
RO/RW
1 = Automatic mode is disabled; only battery charging DCP and CDP mode is
supported.
Note: When the upstream port is connected, battery charging CDP mode is supported
on all ports when this field is one.
This bit is read only unless the customBCfeatures bit is set to 1. Otherwise the value of
this bit reflects the value of the OTP ROM AutoModeEnz bit.
0
20
RSVD
RO
Reserved. Read only, returns 0 when read.
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8.6.1.12 UUID Registers (offset = 10h to 1Fh)
Figure 14. Register Offset 10h to 1Fh
7
X
R
6
X
R
5
X
R
4
X
R
3
X
R
2
X
R
1
X
R
0
X
R
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 15. Bit Descriptions – UUID Byte N Register
Bit
Field Name
Access
7:0
uuidByte[n]
RO
Reset
Description
UUID byte N. The UUID returned in the Container ID descriptor. The value of this register
is provided by the device and is meets the UUID requirements of Internet Engineering
Task Force (IETF) RFC 4122 A UUID URN Namespace.
8.6.1.13 Language ID LSB Register (offset = 20h)
Figure 15. Register Offset 20h
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
1
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 16. Bit Descriptions – Language ID LSB Register
Bit
7:0
Field Name
Access
langIdLsb
Reset
Description
Language ID least significant byte. This register contains the value returned in the
LSB of the LANGID code in string index 0. The TUSB4020BI-Q1 only supports one
language ID. The default value of this register is 09h representing the LSB of the
LangID 0409h indicating English United States. When customStrings is 1, this field
may be overwritten by the contents of an attached EEPROM or by an SMBus host.
RW
8.6.1.14 Language ID MSB Register (offset = 21h)
Figure 16. Register Offset 21h
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
1
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 17. Bit Descriptions – Language ID MSB Register
Bit
7:0
Field Name
langIdMsb
Access
Reset
RO/RW
Description
Language ID most significant byte. This register contains the value returned in the MSB of
the LANGID code in string index 0. The TUSB4020BI-Q1 only supports one language ID.
The default value of this register is 04h representing the MSB of the LangID 0409h
indicating English United States.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
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8.6.1.15 Serial Number String Length Register (offset = 22h)
Figure 17. Register Offset 22h
7
0
R/W
6
0
R/W
5
0
R/W
4
1
R/W
3
1
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 18. Bit Descriptions – Serial Number String Length Register
Bit
Field Name
Access
7:6
RSVD
RO
5:0
serNumStringLen
Reset
Description
Reserved. Read only, returns 0 when read.
Serial number string length. The string length in bytes for the serial number string. The
default value is 18h indicating that a 24-byte serial number string is supported. The
maximum string length is 32 bytes.
When customSernum is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a serial number string of serNumbStringLen bytes is
returned at string index 1 from the data contained in the Serial Number String registers.
RO/RW
8.6.1.16 Manufacturer String Length Register (offset = 23h)
Figure 18. Register Offset 23h
7
0
R
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Bit Descriptions – Manufacturer String Length Register
Bit
Field Name
Access
7
RSVD
RO
6:0
mfgStringLen
Reset
Description
Reserved. Read only, returns 0 when read.
Manufacturer string length. The string length in bytes for the manufacturer string. The default
value is 0, indicating that a manufacturer string is not provided. The maximum string length is
64 bytes.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a manufacturer string of mfgStringLen bytes is returned at string
index 3 from the data contained in the Manufacturer String registers.
RO/RW
8.6.1.17 Product String Length Register (offset = 24h)
Figure 19. Register Offset 24h
7
0
R
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Bit Descriptions – Product String Length Register
Bit
Field Name
Access
7
RSVD
RO
6:0
22
prodStringLen
Reset
RO/RW
Description
Reserved. Read only, returns 0 when read.
Product string length. The string length in bytes for the product string. The default value is
0, indicating that a product string is not provided. The maximum string length is 64 bytes.
When customStrings is 1, this field may be overwritten by the contents of an attached
EEPROM or by an SMBus host.
When the field is non-zero, a product string of prodStringLen bytes is returned at string
index 2 from the data contained in the Product String registers.
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8.6.1.18 Serial Number Registers (offset = 30h to 4Fh)
Figure 20. Register Offset 30h to 4Fh
7
X
R/W
6
X
R/W
5
x
R/W
4
x
R/W
3
x
R/W
2
x
R/W
1
x
R/W
0
x
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 19. Bit Descriptions – Serial Number Registers
Bit
Field Name
Access
7:0
serialNumber[n]
RO/RW
Reset
Description
Serial Number byte N. The serial number returned in the Serial Number string descriptor
at string index 1. The default value of these registers is set by TI. When customSernum is
1, these registers may be overwritten by EEPROM contents or by an SMBus host.
8.6.1.19 Manufacturer String Registers (offset = 50h to 8Fh)
Figure 21. Register Offset 50h to 8Fh
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 20. Bit Descriptions – Manufacturer String Registers
Bit
7:0
Field Name
Access
mfgStringByte[n]
Reset
Description
Manufacturer string byte N. These registers provide the string values returned for string
index 3 when mfgStringLen is greater than 0. The number of bytes returned in the string is
equal to mfgStringLen.
The programmed data should be in UNICODE UTF-16LE encodings as defined by The
Unicode Standard, Worldwide Character Encoding, Version 5.0.
RO/RW
8.6.1.20 Product String Registers (offset = 90h to CFh)
Figure 22. Register Offset 90h to CFh
7
0
R/W
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 21. Bit Descriptions – Product String Byte N Register
Bit
7:0
Field Name
prodStringByte[n]
Access
Reset
RW
Description
Product string byte N. These registers provide the string values returned for string
index 2 when prodStringLen is greater than 0. The number of bytes returned in the
string is equal to prodStringLen.
The programmed data should be in UNICODE UTF-16LE encodings as defined by
The Unicode Standard, Worldwide Character Encoding, Version 5.0.
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8.6.1.21 Additional Feature Configuration Register (offset = F0h)
Figure 23. Register Offset F0h
7
0
R
6
0
R/W
5
0
R/W
4
0
R/W
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 22. Bit Descriptions – Additional Feature Configuration Register
Bit
Field Name
Access
7:1
RSVD
RO
0
RSVD
RW
Reset
Description
Reserved. Read only, returns 0 when read.
Reserved
This bit is loaded at the deassertion of reset with the value of the SCL/SMBCLK terminal.
8.6.1.22 Charging Port Control Register (offset = F2h)
Figure 24. Register Offset F2h
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R/W
2
0
R/W
1
0
R/W
0
0
R/W
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 23. Bit Descriptions – Charging Port Control Register
Bit
Field Name
Access
7:4
RSVD
RO
Reserved. Read only, returns 0 when read.
RW
Power-On Delay Time. When dsportEcrEn is set, this field sets the delay time from the
removal disable of PWRCTL to the enable of PWRCTL when transitioning battery charging
modes. For example, when disabling the power on a transition from custom charging mode
to Dedicated Charging Port Mode. The nominal timing is defined as follows:
3:1
pwronTime
Reset
Description
TPWRON_EN = (pwronTime + 1) × 200 ms
(1)
These registers may be overwritten by EEPROM contents or by an SMBus host.
0
24
RSVD
RW
Reserved. This bit is reserved and should not be altered from the default.
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8.6.1.23 Device Status and Command Register (offset = F8h)
Figure 25. Register Offset F8h
7
0
R
6
0
R
5
0
R
4
0
R
3
0
R
2
0
R
1
0
RSU
0
0
RCU
LEGEND: R/W = Read/Write; R = Read only; –n = value after reset
Table 24. Bit Descriptions – Device Status and Command Register
Bit
Field Name
Access
7:2
RSVD
R
1
smbusRst
RSU
SMBus interface reset. This bit loads the registers back to their GRSTz values.
This bit is set by writing a 1 and is cleared by hardware on completion of the reset. A
write of 0 has no effect.
RCU
Configuration active. This bit indicates that configuration of the TUSB4020BI-Q1 is
currently active. The bit is set by hardware when the device enters the I2C or SMBus
mode. The TUSB4020BI-Q1 will not connect on the upstream port while this bit is 1.
When in the SMBus mode, this bit must be cleared by the SMBus host to exit the
configuration mode and allow the upstream port to connect.
The bit is cleared by a writing 1. A write of 0 has no effect.
0
cfgActive
Reset
Description
Reserved. Read only, returns 0 when read.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TUSB4020BI-Q1 is a two-port USB 2.0 hub. It provides USB high-speed/full-speed connections on the
upstream port and provides USB high-speed, full-speed, or low-speed connections on the downstream port. The
TUSB4020BI-Q1 can be used in any application that needs additional USB compliant ports. For example, a
specific notebook may only have two downstream USB ports. By using the TUSB4020BI-Q1, the notebook can
increase the downstream port count to three.
USB
Type B
Connector
DC
PWR
US Port
TUSB4020BI
Q1
USB
PWR
SWITCH
DS Port 1
DS Port 2
USB Type A
Connector
USB Type A
Connector
Figure 26. Discrete USB Hub Product
9.1.1 Crystal Requirements
The crystal must be fundamental mode with load capacitance of 12 to 24 pF and frequency stability rating of
±100 PPM or better. To ensure proper startup oscillation condition, TI recommends a maximum crystal
equivalent series resistance (ESR) of 50 Ω. A parallel load capacitor should be used if a crystal source is used.
The exact load capacitance value used depends on the crystal vendor. Refer to application note Selection and
Specification of Crystals for Texas Instruments USB 2.0 Devices (SLLA122) for details on how to determine the
load capacitance value.
26
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Application Information (continued)
9.1.2 Input Clock Requirements
When using an external clock source such as an oscillator, the reference clock should have a ±100 PPM or
better frequency stability and have less than 50-ps absolute peak-to-peak jitter. XI should be tied to the 1.8-V
clock source and XO should be left floating.
9.2 Typical Applications
A common application for the TUSB4020BI-Q1 is as a self-powered standalone USB hub product. The product is
powered by an external 5-V DC power adapter. In this application using a USB cable, TUSB4020BI-Q1 device’s
upstream port is plugged into a USB host controller. The downstream ports of the TUSB4020BI-Q1 are exposed
to users for connecting USB hard drives, camera, flash drive, and so forth.
9.2.1 Upstream Port Implementation
Figure 27. Upstream Port Implementation Schematic
9.2.1.1 Design Requirements
Table 25. Input Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VDD supply
1.1 V
VDD33 supply
3.3 V
Upstream port USB support (HS, FS)
HS, FS
Downstream port 1 USB support (HS, FS, LS)
HS, FS, LS
Downstream port 2 USB support (HS, FS, LS)
HS, FS, LS
Number of removable downstream ports
2
Number of non-removable downstream ports
0
Full power management of downstream ports
Yes (FULLPWRMGMTZ = 0)
Individual control of downstream port power switch
Power switch enable polarity
Yes (GANGED = 0)
Active high (PWRCTL_POL = 0)
Battery charge support for downstream port 1
Yes
Battery charge support for downstream port 2
Yes
2
I C EEPROM support
No
24-MHz clock source
Crystal
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9.2.1.2 Detailed Design Procedure
The upstream of the TUSB4020BI-Q1 is connected to a USB2 type B connector. This particular example has
GANGED terminal and FULLPWRMGMTZ terminal pulled low, which results in individual power support each
downstream port. The VBUS signal from the USB2 type B connector is fed through a voltage divider. The
purpose of the voltage divider is to make sure the level meets USB_VBUS input requirements.
9.2.1.3 Application Curves
Figure 28. HighSpeed TX Eye for Downstream Port 1
28
Figure 29. HighSpeed TX Eye for Downstream Port 2
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9.2.2 Downstream Port 1 Implementation
The downstream port 1 of the TUSB4020BI-Q1 is connected to a USB2 type A connector. With BATEN1 terminal
pulled up, battery charge support is enabled for port 1. If battery charge support is not needed, then the pullup
resistor on BATEN1 should be uninstalled. The PWRCTL_POL is pulled-down, which results in active-high power
enable (PWRCTL1 and PWRCTL2) for a USB VBUS power switch.
Figure 30. Downstream Port 1 Implementation Schematic
9.2.3 Downstream Port 2 Implementation
The downstream port 2 of the TUSB4020BI-Q1 is connected to a USB2 type A connector. With BATEN2 terminal
pulled up, battery charge support is enabled for port 2. If battery charge support is not needed, then the pullup
resistor on BATEN2 should be uninstalled.
Figure 31. Downstream Port 2 Implementation Schematic
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9.2.4 VBUS Power Switch Implementation
This particular example uses the TI TPS2561 dual-channel precision adjustable current-limited power switch. For
details on this power switch or other power switches available from TI, refer to www.ti.com.
Figure 32. Power Switch Implementation Schematic
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9.2.5 Clock, Reset, and Miscellaneous
Figure 33. Clock, Reset, and Miscellaneous Schematic
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9.2.6 Power Implementation
Figure 34. Power Implementation Schematic
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10 Power Supply Recommendations
10.1 Power Supply
VDD should be implemented as a single power plane, as should VDD33.
• The VDD terminals of the TUSB4020BI-Q1 supply 1.1-V (nominal) power to the core of the TUSB4020BI-Q1.
This power rail can be isolated from all other power rails by a ferrite bead to reduce noise.
• The DC resistance of the ferrite bead on the core power rail can affect the voltage provided to the device due
to the high current draw on the power rail. The output of the core voltage regulator may need to be adjusted
to account for this or a ferrite bead with low DC resistance (less than 0.05 Ω) can be selected.
• The VDD33 terminals of the TUSB4020BI-Q1 supply 3.3-V power rail to the I/O of the TUSB4020BI-Q1. This
power rail can be isolated from all other power rails by a ferrite bead to reduce noise.
• All power rails require a 10-µF capacitor or 1-µF capacitors for stability and noise immunity. These bulk
capacitors can be placed anywhere on the power rail. The smaller decoupling capacitors should be placed as
close to the TUSB4020BI-Q1 power pins as possible with an optimal grouping of two of differing values per
pin.
10.2 Downstream Port Power
•
•
•
The downstream port power, VBUS, must be supplied by a source capable of supplying 5 V and at least
500 mA per port. Downstream port power switches can be controlled by the TUSB4020BI-Q1 signals. It is
possible to leave the downstream port power always enabled.
Each downstream port’s VBUS requires a large bulk low-ESR capacitor of 22 µF or larger to limit in-rush
current.
TI recommends ferrite beads on the VBUS pins of the downstream USB port connections for both ESD and
EMI reasons. A 0.1-µF capacitor on the USB connector side of the ferrite provides a low-impedance path to
ground for fast rise time ESD current that might have coupled onto the VBUS trace from the cable.
10.3 Ground
TI recommends to use only one board ground plane in the design. This provides the best image plane for signal
traces running above the plane. The thermal pad of the TUSB4020BI-Q1 and any of the voltage regulators
should be connected to this plane with vias. An earth or chassis ground is only implemented near the USB port
connectors on a different plane for EMI and ESD purposes.
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11 Layout
11.1 Layout Guidelines
11.1.1 Placement
1. A 9.53-kΩ ±1% resistor connected to terminal USB_R1 should be placed as close as possible to the
TUSB4020BI-Q1.
2. A 0.1-µF capacitor should be placed as close as possible on each VDD and VDD33 power pin.
3. The ESD and EMI protection devices (if used) should also be placed as possible to the USB connector.
4. If a crystal is used, it must be placed as close as possible to the TUSB4020BI-Q1 device’s XI and XO
terminals.
5. Place voltage regulators as far away as possible from the TUSB4020BI-Q1, crystal, and differential pairs.
6. In general, the large bulk capacitors associated with each power rail should be placed as close as possible to
the voltage regulators.
11.1.2 Package Specific
1. The TUSB4020BI-Q1 package has a 0.5-mm pin pitch.
2. The TUSB4020BI-Q1 package has a 3.6-mm × 3.6-mm thermal pad. This thermal pad must be connected to
ground through a system of vias.
3. All vias under device, except for those connected to thermal pad, should be solder masked to avoid potential
issues with thermal pad layouts.
11.1.3 Differential Pairs
This section describes the layout recommendations for all of the TUSB4020BI-Q1 differential pairs: USB_DP_XX,
USB_DM_XX.
• Must be designed with a differential impedance of 90 Ω ±10%.
• To minimize crosstalk, TI recommends to keep high-speed signals away from each other. Each pair should
be separated by at least 5× the signal trace width. Separating with ground as depicted in the layout example
also helps minimize crosstalk.
• Route all differential pairs on the same layer adjacent to a solid ground plane.
• Do not route differential pairs over any plane split.
• Adding test points causes impedance discontinuity, and therefore, negatively impacts signal performance. If
test points are used, they should be placed in series and symmetrically. They must not be placed in a manner
that causes stub on the differential pair.
• Avoid 90° turns in trace. The use of bends in differential traces should be kept to a minimum. When bends
are used, the number of left and right bends should be as equal as possible and the angle of the bend should
be ≥135°. Taking this action minimizes any length mismatch caused by the bends, and therefore, minimizes
the impact bends have on EMI.
• Minimize the trace lengths of the differential pair traces. Eight inches is the maximum recommended trace
length for USB 2.0 differential-pair signals. Longer trace lengths require very careful routing to assure proper
signal integrity.
• Match the etch lengths of the differential pair traces (that is DP and DM). The USB 2.0 differential pairs
should not exceed 50-mils relative trace length difference.
• Minimize the use of vias in the differential-pair paths as much as possible. If this is not practical, ensure that
the same via type and placement are used for both signals in a pair. Any vias used should be placed as close
as possible to the TUSB4020BI-Q1 device.
• Do not place power fuses across the differential-pair traces.
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11.2 Layout Example
Figure 35 shows an example layout of the upstream port to a USB3 Type B connector. The routing to a USB2
Type B connector will be similar.
Figure 35. Upstream Port
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Layout Example (continued)
Figure 36 shows an example layout of the Downstream Port to a USB3 Type A connector. The routing to a USB2
Type A connector will be similar.
Figure 36. Downstream Port
Figure 37. Thermal Pad
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12 Device and Documentation Support
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TUSB4020BIPHPQ1
ACTIVE
HTQFP
PHP
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T4020BIQ1
TUSB4020BIPHPRQ1
ACTIVE
HTQFP
PHP
48
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
T4020BIQ1
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
28-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TUSB4020BI-Q1 :
• Catalog: TUSB4020BI
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jan-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TUSB4020BIPHPRQ1
Package Package Pins
Type Drawing
HTQFP
PHP
48
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
16.4
Pack Materials-Page 1
9.6
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.6
1.5
12.0
16.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jan-2019
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TUSB4020BIPHPRQ1
HTQFP
PHP
48
1000
336.6
336.6
31.8
Pack Materials-Page 2
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