Texas Instruments | LMH0384 3-Gbps HD - SD SDI Extended Reach and Configurable Adaptive Cable Equalizer (Rev. G) | Datasheet | Texas Instruments LMH0384 3-Gbps HD - SD SDI Extended Reach and Configurable Adaptive Cable Equalizer (Rev. G) Datasheet

Texas Instruments LMH0384 3-Gbps HD - SD SDI Extended Reach and Configurable Adaptive Cable Equalizer (Rev. G) Datasheet
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LMH0384
SNLS308G – APRIL 2009 – REVISED JUNE 2015
LMH0384 3-Gbps HD - SD SDI Extended Reach and Configurable Adaptive Cable
Equalizer
1 Features
3 Description
•
The LMH0384 3-Gbps HD - SD SDI Extended Reach
and Configurable Adaptive Cable Equalizer is
designed to equalize data transmitted over cable (or
any
media
with
similar
dispersive
loss
characteristics). The equalizer operates over a wide
range of data rates from 125 Mbps to 2.97 Gbps and
supports ST 424, ST 292, ST 344, and ST 259
standards.
1
•
•
•
•
•
•
•
•
•
•
•
•
•
Compliant With ST 424, ST 292, ST 344, and ST
259
Supports DVB-ASI at 270 Mbps
Wide Range of Data Rates: 125 Mbps to 2.97
Gbps
Equalizes up to 140 Meters of Belden 1694A at
2.97 Gbps, up to 200 Meters of Belden 1694A at
1.485 Gbps, or Up to 400 Meters of Belden 1694A
at 270 Mbps
Power Save Mode With Auto Sleep Control (35
mW Typical Power Consumption in Power Save
Mode)
Optional SPI Register Access
Manual Bypass and Output Mute With a
Programmable Threshold
Internally Terminated 100-Ω LVDS Outputs With
SPI Programmable Output Common-Mode
Voltage and Swing
Programmable Launch Amplitude Optimization in
SPI Mode
Cable Length Indicator in SPI Mode
Single 3.3-V Supply Operation
16-Pin WQFN Package
Industrial Temperature Range: −40°C to +85°C
Footprint Compatible With the LMH0344,
LMH0044, and LMH0074 in Pin Mode
2 Applications
•
•
•
ST 424, ST 292, ST 344, and ST 259 Serial
Digital Interfaces
Serial Digital Data Equalization and Reception
Data Recovery Equalization (1)
The LMH0384 device includes active sensing
features and design enhancements including longer
cable equalization, lower output jitter, configurable pin
mode and SPI modes, a power-saving sleep mode,
and programmable output common-mode voltage and
swing. The LMH0384 implements DC restoration to
correctly handle pathological data conditions.
The LMH0384 includes an auto sleep mode to power
down the device when no input signal is detected.
Other features include separate carrier detect and
output mute pins which may be tied together to mute
the output when no input signal is present, and a
programmable mute reference which may be used to
mute the output at a selectable level of signal
degradation.
The LMH0384 supports two modes of operation. In
pin mode (non-SPI mode) the LMH0384 is footprint
compatible with the LMH0344 and legacy SDI
equalizers. In the optional SPI mode, the LMH0384
provides register access to all of its features along
with a cable length indicator, programmable output
common-mode voltage and swing, and launch
amplitude optimization.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LMH0384
WQFN (16)
4.00 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Functional Block Diagram
BYPASS
Output
Driver
SDI
DC
Restoration/
Level Control
Equalizer
Filter
SDI
SDO
SDO
MUTE
Energy
Detect
SPI Control
Energy
Detect
Carrier
Detect
SPI_EN
(1)
1
Due to SMPTE naming convention, all SMPTE Engineering
Documents will be numbered as a 2-letter prefix and a
number. Documents and references with the same root
number and year are functionally identical; for example ST
424-2006 and SMPTE 424M-2006 refer to the same
document.
CD
6
Automatic
Equalization
Control
AEC+
AEC-
MUTEREF
MUTEREF
AUTO SLEEP
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LMH0384
SNLS308G – APRIL 2009 – REVISED JUNE 2015
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Table of Contents
1
2
3
4
5
6
7
Features ..................................................................
Applications ...........................................................
Description .............................................................
Revision History.....................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
5
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
5
5
5
5
5
6
7
7
9
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
DC Electrical Characteristics ....................................
AC Electrical Characteristics.....................................
Timing Requirements ................................................
Switching Characteristics ..........................................
Typical Characteristics ..............................................
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 13
7.6 Register Maps ......................................................... 16
8
Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Application .................................................. 18
8.3 Dos and Don'ts........................................................ 20
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
11 Device and Documentation Support ................. 23
11.1
11.2
11.3
11.4
11.5
Documentation Support ........................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
23
23
23
23
23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (April 2013) to Revision G
Page
•
Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions;
Specifications; Applications and Implementation; Detailed Description; Layout;Device and Documentation Support;
Mechanical, Packaging, and Ordering Information ............................................................................................................... 1
•
Added "(logic zero)" to Pin 14 - MUTE - in Pin Descriptions – Pin Mode (non-SPI) / SPI_EN = GND / LMH0344
Compatible table..................................................................................................................................................................... 3
•
Added note "Typical pullup or pulldown for digital pin is 100 kΩ. The tolerance is between 69K to 131K" to DC
Electrical Characteristics ........................................................................................................................................................ 5
Changes from Revision E (April 2013) to Revision F
•
2
Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 17
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5 Pin Configuration and Functions
VEE
1
SDI
2
15
14
VCC
MUTE
16
CD
VCC
RUM Package
16-Pin WQFN
Top View
13
12
AUTO SLEEP
11
SDO
LMH0384
SPI_EN
4
9
VEE
5
6
7
8
MUTEREF
SDO
BYPASS
10
AEC-
3
AEC+
SDI
DAP = VEE
NOTE: The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Pin Functions – Pin Mode (non-SPI) / SPI_EN = GND / LMH0344 Compatible
PIN
NO.
NAME
I/O, TYPE
DESCRIPTION
1
VEE
Ground
2
SDI
I, SDI
Negative power supply (ground).
Serial data true input.
Serial data complement input.
3
SDI
I, SDI
4
SPI_EN
I, LVCMOS
SPI register access enable. This pin has an internal pulldown.
H = SPI register access mode.
L = Pin mode.
5
AEC+
I/O, Analog
AEC loop filter external capacitor (1-µF) positive connection.
6
AEC-
I/O, Analog
AEC loop filter external capacitor (1-µF) negative connection.
7
BYPASS
I, LVCMOS
Equalization bypass. This pin has an internal pulldown.
H = Equalization is bypassed (no equalization occurs).
L = Normal operation.
8
MUTEREF
I, Analog
9
VEE
I, LVCMOS
10
SDO
O, LVDS
Serial data complement output.
11
SDO
O, LVDS
Serial data true output.
12
AUTO
SLEEP
I, LVCMOS
Mute reference input. Sets the threshold for CD and (with CD tied to MUTE) determines the
maximum cable to be equalized before muting. MUTEREF may be either unconnected or
connected to ground for normal CD operation.
Connect this pin to ground or drive it logic low.
Auto Sleep. AUTO SLEEP has precedence over MUTE and BYPASS. This pin has an
internal pullup.
H = Device will power down when no input is detected.
L = Normal operation (device will not enter auto power down).
13
VCC
Power
14
MUTE
I, LVCMOS
Positive power supply (+3.3 V).
Output mute. CD may be tied to this pin to inhibit the output when no input signal is present.
MUTE has precedence over BYPASS. This pin has an internal pulldown.
H = Outputs forced to a muted state (logic zero).
L = Outputs enabled.
15
CD
O, LVCMOS
Carrier detect.
H = No input signal detected.
L = Input signal detected.
16
VCC
Power
Positive power supply (+3.3 V).
—
VEE
Ground
Connect exposed DAP to negative power supply (ground).
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VEE
1
SDI
2
VCC
MOSI
SCK
VCC
RUM Package
16-Pin WQFN
Top View
16
15
14
13
12
MISO
11
SDO
LMH0384
SPI_EN
4
9
SS
5
6
7
8
MUTEREF
SDO
CD
10
AEC-
3
AEC+
SDI
DAP = VEE
NOTE: The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative
power supply voltage.
Pin Functions – SPI Mode / SPI_EN = VCC
PIN
NO.
NAME
I/O, TYPE
DESCRIPTION
1
VEE
Ground
Negative power supply (ground).
2
SDI
I, SDI
Serial data true input.
3
SDI
I, SDI
Serial data complement input.
4
SPI_EN
I, LVCMOS
SPI register access enable. This pin has an internal pulldown.
H = SPI register access mode.
L = Pin mode.
5
AEC+
I/O, Analog
AEC loop filter external capacitor (1 µF) positive connection.
6
AEC-
I/O, Analog
AEC loop filter external capacitor (1 µF) negative connection.
7
CD
O, LVCMOS
Carrier detect.
H = No input signal detected.
L = Input signal detected.
8
MUTEREF
I, Analog
9
SS (SPI)
I, LVCMOS
10
SDO
O, LVDS
Serial data complement output.
11
SDO
O, LVDS
Serial data true output.
12
MISO (SPI)
O, LVCMOS
Mute reference input. Sets the threshold for CD and (with CD tied to MUTE) determines the
maximum cable to be equalized before muting. MUTEREF may be either unconnected or
connected to ground for normal CD operation.
SPI slave select. This pin has an internal pullup.
SPI Master Input / Slave Output. LMH0384 data transmit.
13
VCC
Power
14
SCK (SPI)
I, LVCMOS
SPI serial clock input.
15
MOSI (SPI)
I, LVCMOS
SPI Master Output / Slave Input. LMH0384 data receive.
16
VCC
Power
Positive power supply (+3.3 V).
—
VEE
Ground
Connect exposed DAP to negative power supply (ground).
4
Positive power supply (+3.3 V).
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6 Specifications
6.1 Absolute Maximum Ratings (1)
MIN
Supply voltage
−0.3
Input voltage (all inputs)
(1)
UNIT
4.0
V
VCC+0.3
V
125
°C
150
°C
Junction temperature
−65
Storage temperature
MAX
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±6500
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±2000
Machine model (MM)
±400
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±6500 V may actually have higher performance.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
6.3 Recommended Operating Conditions
VCC – VEE
Supply Voltage
MIN
NOM
MAX
3.135
3.3
3.465
Input Coupling Capacitance
V
1
AEC Capacitor (Connected between AEC+ and AEC-)
TA
UNIT
µF
1
−40
Operating Free Air Temperature
µF
85
°C
6.4 Thermal Information
LMH0384
THERMAL METRIC
(1)
WQFN (RUM)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
40
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
6
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1) (2) (3) (4)
PARAMETER
VIH
Input Voltage High Level (Logic Inputs)
VIL
Input Voltage Low Level
VSDI
Input Voltage Swing (SDI, SDI)
VCMIN
Input Common-Mode Voltage (SDI, SDI)
(1)
(2)
(3)
(4)
(5)
TEST CONDITIONS
0 m cable length
(5)
MIN
MAX
UNIT
2
VCC
V
VEE
0.8
V
950
mVP−P
720
TYP
800
1.75
V
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to VEE = 0 Volts.
Typical values are stated for VCC = +3.3 V and TA = +25°C.
Typical pullup or pulldown for digital pin is 100 kΩ.
Due to SMPTE naming convention, all SMPTE Engineering Documents will be numbered as a two-letter prefix and a number.
Documents and references with the same root number and year are functionally identical; for example ST 424-2006 and SMPTE 424M2006l refer to the same document.
The LMH0384 can be optimized for different launch amplitudes through the SPI.
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DC Electrical Characteristics (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)(3)(4)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VSSP-P
Differential Output Voltage, P-P (SDO,
SDO)
500
700
900
mVP-P
VOD
Differential Output Voltage (SDO, SDO)
250
350
450
mV
ΔVOD
Change in Magnitude of VOD for
Complementary Output States (SDO,
SDO)
50
mV
VOS
Offset Voltage (SDO, SDO)
ΔVOS
Change in Magnitude of VOS for
Complementary Output States (SDO,
SDO)
50
mV
IOS
Output Short Circuit Current (SDO, SDO)
30
mA
MUTEREF
MUTEREF DC Voltage (floating)
1.3
V
MUTEREF Range
0.8
V
100-Ω load, default values (6),
see Figure 1
1.125
VOH
Output Voltage High Level (CD, MISO)
IOH = -2 mA
VOL
Output Voltage Low Level (CD, MISO)
IOL = +2 mA
ICC
(6)
(7)
Supply Current
1.25
1.375
2.4
V
V
0.4
V
70
85
mA
Normal operation, equalizing cable >
140 m (Belden 1694A)
90
110
mA
Power save mode
10
14
mA
Normal operation, equalizing cable <
140m (Belden 1694A) (7)
The differential output voltage and offset voltage are adjustable through the SPI.
The equalizer automatically shifts equalization stages at cable lengths less than 140 m (Belden 1694A) to reduce power consumption.
This power savings is also achieved by setting Extended 3G Reach Mode = 1 through the SPI.
6.6 AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
PARAMETER
BRMIN
Minimum Input Data Rate (SDI,
SDI)
BRMAX
Maximum Input Data Rate (SDI,
SDI)
TEST CONDITIONS
(1)
.
MIN
TYP
125
2970
0.2
1.485 Gbps, Belden 1694A,
0 to 170 meters (2)
1.485 Gbps, Belden 1694A,
170 to 200 meters
0.25
UI
0.3
2.97 Gbps, Belden 1694A,
0-110 meters (2)
0.3
2.97 Gbps, Belden 1694A,
110 to 140 meters
tr,tf
tOS
(1)
(2)
(3)
6
Output Rise Time, Fall Time
(SDO, SDO)
20% to 80%, 100-Ω load
see Figure 1
0.35
(3)
,
80
130
ps
ps
Mismatch in Rise/Fall Time (SDO,
See
SDO)
(3)
2
15
Output Overshoot (SDO, SDO)
(3)
1%
5%
See
Mbps
0.2
270 Mbps, Belden 1694A,
350 to 400 meters
Jitter for Various Cable Lengths
UNIT
Mbps
270 Mbps, Belden 1694A,
0 to 350 meters (2)
TJRAW
MAX
Typical values are stated for VCC = +3.3 V and TA = +25°C.
Based on design and characterization data over the full range of recommended operating conditions of the device. Jitter is measured in
accordance with ST RP 184, ST RP 192, and the applicable serial data transmission standard: ST 424, ST 292, or ST 259.
Specification is ensured by characterization.
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AC Electrical Characteristics (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
PARAMETER
TEST CONDITIONS
5 MHz to 1.5 GHz
(1)
.
MIN
(4)
TYP
MAX
15
UNIT
dB
RLIN
Input Return Loss (SDI, SDI)
RIN
Input Resistance (SDI, SDI)
single-ended
1.3
kΩ
CIN
Input Capacitance (SDI, SDI)
single-ended
0.7
pF
(4)
1.5 GHz to 3.0 GHz (4)
10
dB
Input return loss is dependent onboard design. The LMH0384 exceeds this specification on the SD384 evaluation board with a return
loss network consisting of a 5.6 nH inductor in parallel with the 75-Ω series resistor on the input.
6.7 Timing Requirements
over operating free-air temperature range (unless otherwise noted)
MIN
fSCK
tPH
TYP
SCK Frequency
MAX
20
SCK Pulse Width High
SCK Pulse Width Low
tSU
MOSI Setup Time
tH
MOSI Hold Time
tSSSU
SS Setup Time
tSSH
SS Hold Time
tSSOF
SS Off Time
See Figure 2 and Figure 3
See Figure 2 and Figure 3
MHz
40
% SCK
period
40
% SCK
period
4
ns
4
ns
4
ns
4
ns
10
ns
See Figure 2 and Figure 3
tPL
UNIT
6.8 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
MIN
tODZ
MISO Driven-to-Tristate Time
tOZD
MISO Tristate-to-Driven Time
tOD
MISO Output Delay Time
TYP
See Figure 3
MAX
UNIT
15
ns
15
ns
15
ns
VODVOS
VOD+
80%
+ VOD
80%
VSSP-P
0V differential
20%
20%
- VOD
VSSP-P = (VOD+) – (VOD-)
tr
tf
Figure 1. LVDS Output Voltage, Offset, and Timing Parameters
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SS
(host)
tSSSU
tPH
tPL
tSSH
SCK
(host)
tH
tSU
MOSI
(host)
MISO
(device)
tSSOF
0
A6
A5
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
Hi-Z
Figure 2. SPI Write
SS
(host)
tSSSU
tPH
tPL
tSSH
SCK
(host)
tH
tSU
MOSI
(host)
Hi-Z
1
A6
A5
A4
A3
A2
A1
A0
tOZD
MISO
(device)
tSSOF
Hi-Z
D7
D6
tOD
D5
D4
D3
tODZ
D2
D1
D0
Hi-Z
Figure 3. SPI Read
8
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6.9 Typical Characteristics
Amplitude: 212 mV/div
Amplitude: 212 mV/div
Typical device characteristics at TA = +25°C and VDD = 3.3 V, unless otherwise noted.
Time: 50 ps/div
Time: 50 ps/div
Figure 4. 20-M B1694A PRBS10 2.97 Gbps
Figure 5. 100-M B1694A PRBS10 2.97 Gbps
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7 Detailed Description
7.1 Overview
The LMH0384 3-Gbps HD - SD SDI Extended Reach and Configurable Adaptive Cable Equalizer is designed to
equalize data transmitted over cable (or any media with similar dispersive loss characteristics). The equalizer
operates over a wide range of data rates from 125 Mbps to 2.97 Gbps and supports ST 424, ST 292, ST 344,
and ST 259 standards. The LMH0384 includes active sensing features and design enhancements including
longer cable equalization, lower output jitter, configurable pin mode and SPI modes, a power-saving sleep mode,
and programmable output common-mode voltage and swing. The LMH0384 implements DC restoration to
correctly handle pathological data conditions.
7.2 Functional Block Diagram
BYPASS
Output
Driver
SDI
DC
Restoration/
Level Control
Equalizer
Filter
SDI
SDO
SDO
MUTE
Energy
Detect
SPI Control
Energy
Detect
Carrier
Detect
SPI_EN
CD
6
Automatic
Equalization
Control
AEC+
AEC-
MUTEREF
MUTEREF
AUTO SLEEP
Figure 6. Pin Mode
7.3 Feature Description
7.3.1 Block Description
The Equalizer Filter block is a multistage adaptive filter. If BYPASS is high, the equalizer filter is disabled.
The DC Restoration / Level Control block receives the differential signals from the equalizer filter block. This
block incorporates a self-biasing DC restoration circuit to fully DC restore the signals. If BYPASS is high, this
function is disabled.
The signals before and after the DC Restoration / Level Control block are used to generate the Automatic
Equalization Control (AEC) signal. This control signal sets the gain and bandwidth of the equalizer filter. The
loop response in the AEC block is controlled by an external 1-µF capacitor placed across the AEC+ and AECpins.
The Carrier Detect block generates the carrier detect signal based on the SDI input and an adjustment from the
Mute Reference block.
10
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Feature Description (continued)
The SPI Control block uses the MOSI, MISO, SCK, and SS signals in SPI mode to control the SPI registers.
SPI_EN selects between SPI mode and pin mode. In pin mode, SPI_EN is driven logic low.
The Output Driver produces SDO and SDO.
7.3.2 Mute Reference (MUTEREF)
The mute reference sets the threshold for CD and (with CD tied to MUTE) determines the amount of cable to
equalize before automatically muting the outputs. This is set by applying a voltage inversely proportional to the
length of cable to equalize. The applied voltage must be greater than the MUTEREF floating voltage (typically 1.3
V) in order to change the CD threshold. As the applied MUTEREF voltage is increased, the amount of cable that
can be equalized before carrier detect is deasserted and the outputs are muted is decreased. MUTEREF may be
left unconnected or connected to ground for normal CD operation.
7.3.3 Carrier Detect (CD) and Mute
Carrier detect CD indicates if a valid signal is present at the LMH0384 input. If MUTEREF is used, the carrier
detect threshold will be altered accordingly. CD provides a high voltage when no signal is present at the
LMH0384 input. CD is low when a valid input signal is detected.
MUTE can be used to manually mute or enable SDO and SDO. Applying a high input to MUTE will mute the
LMH0384 outputs by forcing the output to a logic zero. Applying a low input will force the outputs to be active.
CD and MUTE may be tied together to automatically mute the output when no input signal is present.
7.3.4 Auto Sleep
The auto sleep mode allows the LMH0384 to power down when no input signal is detected. If the AUTO SLEEP
pin is set high, the LMH0384 goes into a deep power save mode when no signal is detected. The device powers
on again once an input signal is detected. The auto sleep functionality can be turned off by setting AUTO SLEEP
low or tying this pin to ground. An additional auto sleep setting available in SPI mode can be used to force the
equalizer to power down regardless of whether there is an input signal or not. Auto sleep has precedence over
mute and bypass modes.
In auto sleep mode, the time to power down the equalizer when the input signal is removed is less than 200 µs
and should not have any impact on the system timing requirements. The device will wake up automatically once
an input signal is detected (within 1 μs). The overall system will be limited only by the settling time constant of
the equalizer adaptation loop.
7.3.5 Input Interfacing
The LMH0384 accepts either differential or single-ended input. The input must be AC-coupled. Functional Block
Diagram shows the typical configuration for a single-ended input. The unused input must be properly terminated
as shown.
The LMH0384 can be optimized for different launch amplitudes through the SPI (see Launch Amplitude
Optimization in Programming).
The LMH0384 correctly handles equalizer pathological signals for standard definition and high definition serial
digital video, as described in SMPTE RP 178 and RP 198, respectively.
7.3.6 Output Interfacing
SDO and SDO together are internally terminated 100-Ω LVDS outputs. These outputs can be DC coupled to
most common differential receivers.
The default output common-mode voltage (VOS) is 1.25 V. The output common-mode voltage may be adjusted
through the SPI in 200-mV increments, from 1.05 V to 1.85 V (see Output Driver Adjustments in Programming).
This adjustable output common-mode voltage offers flexibility for interfacing to many types of receivers.
The default differential output swing (VSSP-P) is 700 mVP-P. The differential output swing may be adjusted through
the SPI in 100 mV increments from 400 mVP-P to 800 mVP-P (see Output Driver Adjustments in Programming).
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Feature Description (continued)
The LMH0384 output should be DC coupled to the input of the receiving device as long as the common-mode
ranges of both devices are compatible. 100-Ω differential transmission lines should be used to connect between
the LMH0384 outputs and the input of the receiving device where possible. Figure 7 shows an example of a DCcoupled interface between the LMH0384 and LMH0346 SDI reclocker. All that is required is the 100-Ω differential
termination as shown. The resistor should be placed as close as possible to the LMH0346 input. If desired, this
network may be terminated with two 50-Ω resistors and a center tap capacitor to ground in place of the signal
100-Ω resistor.
Figure 8 shows an example of a DC-coupled interface between the LMH0384 and LMH0356 SDI reclocker. The
LMH0356 inputs have 50-Ω internal terminations (100-Ω differential) to terminate the transmission line, so no
additional components are required.
The LMH0384 allows flexibility when interfacing to low voltage crosspoint switches (that is, 1.8 V) and other
devices with limited input ranges. The LMH0384 outputs can be DC coupled to these devices in most cases,
avoiding the need to AC couple.
The LMH0384 may be AC-coupled to the receiving device when necessary. For example, the LMH0384 outputs
are not strictly compatible with 3.3 V CML and thus should not be connected through 50-Ω resistors to 3.3 V. If
the input common-mode range of the receiving device is not compatible with the output common-mode range of
the LMH0384, then AC coupling is required. Following the AC-coupling capacitors, the signal may have to be
biased at the input of the receiving device.
Coaxial Cable
1.0 PF
75:
SDI
1.0 PF
5.6 nH
SDI
SDO
LMH0384
SDI
LMH0346
3G/HD/SD
SDI Reclocker
100:
100: Differential T-Line
SDI
SDO
75:
37.4:
Figure 7. DC Output Interface to LMH0346 Reclocker
Coaxial Cable
75:
1.0 PF
SDI
1.0 PF
5.6 nH
SDO
LMH0384
SDI
SDI0
LMH0356
3G/HD/SD
SDI Reclocker
100: Differential T-Line
SDO
SDI0
75:
37.4:
Figure 8. DC Output Interface to LMH0356 Reclocker
7.4 Device Functional Modes
The LMH0384 supports two modes of operation: Pin and SPI Mode. In pin mode the LMH0384 is footprint
compatible with the LMH0344 and legacy SDI equalizers. In the optional SPI mode, the LMH0384 provides
register access to all of its features along with a cable length indicator, programmable output common-mode
voltage and swing, and launch amplitude optimization.
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7.5 Programming
Setting SPI_EN high enables the optional SPI register access mode. In SPI mode, the LMH0384 provides
register access to all of its features along with a cable length indicator, programmable output common-mode
voltage and swing, and launch amplitude optimization. There are five supported 8-bit registers in the device (see
Table 1). With SPI_EN set low, the device operates in pin mode and is footprint compatible with the LMH0344,
LMH0044, and LMH0074.
7.5.1 SPI Write
The SPI write is shown in Figure 2. The MOSI payload consists of a “0” (write command), seven address bits,
and eight data bits. The SS signal is driven low, and the 16 bits are sent to the LMH0384's MOSI input. Data is
latched on the rising edge of SCK. The MISO output is normally tri-stated during this operation. After the SPI
write, SS must return high.
7.5.2 SPI Read
The SPI read is shown in Figure 3. The MOSI payload consists of a “1” (read command) and seven address bits.
The SS signal is driven low, and the eight bits are sent to the LMH0384's MOSI input. The addressed location is
accessed immediately after the rising edge of the 8th clock and the eight data bits are shifted out on MISO
starting with the falling edge of the 8th clock. MOSI must be tri-stated immediately after the rising edge of the 8th
clock. After the SPI read, SS must return high.
7.5.3 Output Driver Adjustments
The output driver swing (amplitude) and offset voltage (common-mode voltage) are adjustable through SPI
register 01h.
The output swing is adjustable through bits [7:5] of SPI register 01h. The default value for these register bits is
“011” for a peak to peak differential output voltage of 700 mVP-P. The output swing can be adjusted in 100 mV
increments from 400 mVP-P to 800 mVP-P.
The offset voltage is adjustable through bits [4:2] of SPI register 01h. The default value for these register bits is
“001” for an output offset of 1.25 V. The output common-mode voltage may be adjusted in 200-mV increments,
from 1.05 V to 1.85 V. It can also be set to “101” for the maximum offset voltage. At this maximum offset voltage
setting, the outputs are referenced to the positive supply and the offset voltage is around 2.1 V.
7.5.4 Launch Amplitude Optimization
The LMH0384 can compensate for attenuation of the input signal prior to the equalizer. This compensation is
useful for applications with a passive splitter at the equalizer input or a non-ideal input termination network, and
is controlled by SPI register 02h.
Bit 7 of SPI register 02h is used for coarse control of the launch amplitude setting. At the default setting of “0”,
the LMH0384 operates normally and expects a launch amplitude of 800 mVP-P. Bit 7 may be set to “1” to optimize
the LMH0384 for input signals with 6 dB of attenuation (400 mVP-P).
Once the coarse control is set, the LMH0384 input compensation may be further fine tuned by bits [6:3] of SPI
register 02h. These bits may be used to tweak the input gain stage -22% to +40% around the coarse control
setting.
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Programming (continued)
7.5.5 Cable Length Indicator (CLI)
The Cable Length Indicator (CLI) provides an indication of the length of cable attached to the input. CLI is
accessible through bits [7:3] of SPI register 03h. The 5-bit CLI ranges in decimal value from 0 to 25 (“00000” to
“11001” binary) and increases as the cable length is increased. Figure 9 shows typical CLI values vs. Belden
1694A cable length. CLI is valid for Belden 1694A cable lengths of up to 140 m at 2.97 Gbps, 200 m at 1.485
Gbps, and 400 m at 270 Mbps.
30
CLI (decimal value)
25
20
15
10
5
0
0
50
100 150 200 250 300 350 400
BELDEN 1694A CABLE LENGTH (m)
Figure 9. CLI vs. Belden 1694A Cable Length
7.5.6 Application of CLI: Extending 3G Reach
An application of CLI is to extend the 3G reach in systems which have margin in the jitter budget. This allows for
additional cable reach at 2.97 Gbps at the expense of slightly higher output jitter. The extended 3G reach mode
provides 15m of additional Belden 1694A cable reach, with an increase of output jitter at this longer cable length
of 0.05 to 0.1 UI.
The extended 3G reach mode is accessible through bit 2 of SPI register 00h. In order to achieve longer 3G cable
reach while still maintaining the performance at HD and SD data rates, a state machine can be implemented as
shown in Figure 10. (Note: If this procedure is not followed, the maximum equalizable cable lengths for HD and
SD data rates will be limited to less than what can be achieved in normal mode).
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Programming (continued)
(CD = 0) || (CLI > 180m)
(Reg 00h, bit 7 = 0) || (Reg 03h, bits [7:3] > 10010)
Normal Mode
(CD = 1) && (CLI < 180m)
(Reg 00h, bit 7 = 1) && (Reg 03h, bits [7:3] < 10010)
Extended 3G Reach Æ Normal
Register Processing:
Normal Æ Extended 3G Reach
Register Processing:
1. Force EQ to Sleep: Reg 00h, bits [4:3] = 10
2. Force Extended 3G Reach Mode OFF: Reg 00h, bit 2 = 0
3. Wait > 1 ms
4. Set Sleep Mode to Auto: Reg 00h, bits [4:3] = 01
1. Force EQ to Sleep: Reg 00h, bits [4:3] = 10
2. Force Extended 3G Reach Mode ON: Reg 00h, bit 2 = 1
3. Wait > 1 ms
4. Set Sleep Mode to Auto: Reg 00h, bits [4:3] = 01
CD = 0
(Reg 00h, bit 7 = 0)
Extended 3G
Reach Mode
Figure 10. Extended 3G Reach Mode State Machine Example
7.5.7 Explanation of Extended 3G Reach Mode State Machine (Figure 10)
When the LMH0384 is powered on, it will be in normal mode. If there is no input signal (register 00h, bit 7 = 0) or
if the input cable is longer than a user programmable cable length (that is 180m, which means register 03h, bits
[7:3] > 10010), then the device should remain in normal mode.
Once an input signal is detected (register 00h, bit 7 = 1) AND the detected cable length is shorter than the user
programmed cable length of 180m (register 03h, bits [7:3] < 10010), then the equalizer can enter the extended
3G reach mode to allow for longer cable lengths at 2.97 Gbps. This requires the following procedure:
1. Force the equalizer to sleep by writing “10” to bits [4:3] of register 00h.
2. Turn on the extended 3G reach mode by writing “1” to bit 2 of register 00h.
3. Wait at least 1ms.
4. Set the sleep mode to auto by writing “01” to bits [4:3] of register 00h. Alternately, sleep mode may be set to
off by writing “00” to bits [4:3] of register 00h.
The equalizer remains in extended 3G reach mode until the cable length is changed. If the cable length is
changed, the input signal drops out momentarily. Once this happens (register 00h, bit 7 = 0), then the following
procedure must be used to set the device back to normal mode:
1. Force the equalizer to sleep by writing “10” to bits [4:3] of register 00h.
2. Turn off the extended 3G reach mode by writing “0” to bit 2 of register 00h.
3. Wait at least 1ms.
4. Set the sleep mode to auto by writing “01” to bits [4:3] of register 00h. Alternately, sleep mode may be set to
off by writing “00” to bits [4:3] of register 00h.
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7.6 Register Maps
Table 1. SPI Registers
ADDRESS
R/W
NAME
BITS
R/W
General Control
6
Mute
0
Mute has precedence over
Bypass.
0: Normal operation.
1: Outputs muted.
5
Bypass
0
0: Normal operation.
1: Equalizer bypassed.
01
Sleep mode control. Sleep has
precedence over Mute and
Bypass.
00: Disable sleep mode (force
equalizer to stay enabled).
01: Sleep mode active when no
input signal detected.
10: Force equalizer into sleep
mode (powered down)
regardless of whether there is
an input signal or not.
11: Reserved.
Extended 3G Reach Mode
0
Extended 3G reach mode to
extend the cable length for 2.97
Gbps applications.
0: Normal operation.
1: Extended 3G reach mode.
Reserved
00
Reserved as 00. Always write
00 to these bits.
011
Output driver swing (VSSP-P).
000: VSSP-P = 400 mVP-P.
001: VSSP-P = 500 mVP-P.
010: VSSP-P = 600 mVP-P.
011: VSSP-P = 700 mVP-P.
100: VSSP-P = 800 mVP-P.
101, 110, 111: Reserved.
4:3
1:0
7:5
16
R/W
DESCRIPTION
Carrier Detect
2
01h
DEFAULT
0: No carrier detected.
1: Carrier detected.
7
00h
FIELD
Sleep Mode
Output Swing
4:2
Offset Voltage
001
Output driver offset voltage
(common-mode voltage).
000: VOS = 1.05V.
001: VOS = 1.25V.
010: VOS = 1.45V.
011: VOS = 1.65V.
100: VOS = 1.85V.
101: VOS referenced to positive
supply.
110, 111: Reserved.
1:0
Reserved
00
Reserved as 00. Always write
00 to these bits.
Output Driver
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Register Maps (continued)
Table 1. SPI Registers (continued)
ADDRESS
R/W
NAME
BITS
7
02h
R/W
FIELD
Coarse Control
DEFAULT
DESCRIPTION
0
Coarse launch amplitude
optimization.
0: Normal optimization with no
external attenuation (800 mVP-P
launch amplitude).
1: Optimized for 6 dB external
attenuation (400 mVP-P launch
amplitude).
6:3
Fine Control
0000
Launch amplitude optimization
fine tuning.
0000: Nominal.
0001: -4% from nominal.
0010: -8% from nominal.
0011: -11% from nominal.
0100: -14% from nominal.
0101: -17% from nominal.
0110: -20% from nominal.
0111: -22% from nominal.
1000: Nominal.
1001: +4% from nominal.
1010: +9% from nominal.
1011: +14% from nominal.
1100: +20% from nominal.
1101: +26% from nominal.
1110: +33% from nominal.
1111: +40% from nominal.
2:0
Reserved
000
Reserved as 000. Always write
000 to these bits.
Launch Amplitude
03h
R
CLI
04h
R
Device ID
7:3
CLI
2:0
Reserved
7:0
Die Revision
Cable Length Indicator.
Provides an indication of the
length of cable attached to the
input. CLI increases as the
cable length increases.
000
00000010
Reserved.
Die revision.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LMH0384 is a single-channel, 3-Gbps HD - SD SDI Adaptive Cable Equalizer designed to equalize data
transmitted over cable or any media with similar dispersive loss characteristics. The equalizer operates over a
wide range of data rates from 125 Mbps to 2.97 Gbps and supports ST 424, ST 292, ST 344, and ST 259.
Additional features include separate carrier detect and output mute pins which may be tied together to mute the
output when no signal is present. A programmable mute reference is provided to mute the output at a selectable
level of signal degradation. The bypass pin allows the adaptive equalizer to be bypassed. The LMH0384 accepts
either a differential or single-ended input. The input must be AC-coupled.
The LMH0384 correctly handles equalizer pathological signals for standard definition and high definition serial
digital video, as described in ST RP 178 and RP 198, respectively.
8.1.1 Replacing the LMH0344
In pin mode, the LMH0384 is a drop-in replacement for the LMH0344SQ SDI cable equalizer. When replacing an
LMH0344 with an LMH0384, it is important to consider the following points:
1. The LMH0384 auto sleep function is mapped to pin 12 which is a ground pin on the LMH0344SQ. When this
pin is grounded on the LMH0384, the auto sleep function is disabled. To enable auto sleep mode on the
LMH0384, pin 12 must be pulled high.
2. Pin 4 and pin 9 on the LMH0344SQ are true ground pins. For the LMH0384, pin 4 and pin 9 may be driven
logic low in pin mode (they do not require a true ground connection).
3. The LMH0384 has lower input capacitance than the LMH0344 which allows for improved input return loss.
The input return loss network may need to be modified. In most cases, the LMH0384 should provide superior
input return loss.
4. The LMH0384 default output common-mode voltage is different than that of the LMH0344. In most cases,
this should not cause an issue. The LMH0384 and LMH0344 outputs can both be DC coupled to TI's SDI
reclockers and cable drivers. In addition, the LMH0384 output can be DC coupled to LVDS and other inputs
that require lower input common-mode voltages than the LMH0344. The LMH0384 output common-mode
voltage is adjustable through the SPI.
8.2 Typical Application
Figure 11 and Figure 12 show the application circuit for the LMH0384 in SPI mode and Pin mode.
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Typical Application (continued)
(SPI) MISO
(SPI) SCK
(SPI) MOSI
VCC
VCC
0.1 PF
VCC
4
13
VCC
14
SCK
15
SDI
SDO
SPI_EN
5
37.4:
MUTEREF
1.0 PF
75:
LMH0384
AEC+
5.6 nH
SDO
SDI
CD
3
MISO
SS
12
11
Differential
Output
10
9
DAP
8
2
VEE
7
1.0 PF
6
75:
AEC-
1
Coaxial Cable
MOSI
VCC
16
0.1 PF
1.0 PF
CD
MUTEREF
(SPI) SS
Figure 11. Application Circuit (SPI Mode)
Coaxial Cable
LMH0384 3G SDI
Adaptive Cable
Equalizer
75:
1.0 PF
SDO
SDI
SDI
TXOUT
RXIN0
RXIN0
TXOUT
Reclocked
Loopthrough
SDO
1.0 PF
MUTE
75:
MUTE
To FPGA
RXCLK
CD
BYPASS
AUTO SLEEP
SPI_EN
AEC+
37.4:
RX[4:0]
MUTEREF
5-bit LVDS
+ clk
AEC-
5.6 nH
LMH0341 3G SDI
Deserializer
MUTEREF
CD
BYPASS
AUTO SLEEP
1.0 PF
Figure 12. Typical Application (Pin Mode)
8.2.1 Design Requirements
Table 2 lists the design parameters for the LMH0384.
Table 2. LMH0384 Design Parameters
DESIGN PARAMETER
Input AC-coupling capacitors
REQUIREMENT
Required. A common type of AC-coupling capacitor is 1 µF ±10% X7R ceramic
capacitor (0402 or 0201 size). Capacitors may be implemented on the PCB or in the
connector.
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Typical Application (continued)
Table 2. LMH0384 Design Parameters (continued)
DESIGN PARAMETER
REQUIREMENT
Output AC-coupling capacitors
The user should check input common mode voltage. If AC coupling capacitor is
required, SDO AC-coupling capacitor is expected to be 4.7 µF ±10%.
Distance from Device to BNC
Keep this distance as short as possible to minimize parasitic
Input launch amplitude
Refer to DC Electrical Characteristics
8.2.2 Detailed Design Procedure
1. Maximum power draw for PCB regulator selection. For this use maximum power consumption in the data
sheet.
2. Closely compare schematic against typical connection diagram in the data sheet.
3. Plan out the PCB layout and component placement to minimize parasitic.
4. Consult the BNC vendor for optimum BNC landing pattern.
8.2.3 Application Curves
Amplitude: 212 mV/div
Amplitude: 212 mV/div
Figure 13 and Figure 14 depict the differential output eye diagrams for SDO, SDO at 2.97 Gbps. Measurements
were done at default operating conditions.
Time: 50 ps/div
Time: 50 ps/div
Figure 13. 1-M B1694A PRBS10 2.97 Gbps
Figure 14. 100-M B1694A PRBS10 2.97 Gbps
8.3 Dos and Don'ts
Pay special attention to the PCB layout for the high speed signals. The SMPTE specifies the requirements for
the Serial Digital Interface to transport digital video at SD, HD, and 3 Gbps data rates over coaxial cables. One of
the requirements is meeting the required Return Loss. This requirement specifies how closely the port resembles
75-Ω impedance across a specified frequency band. The SMPTE specifications also defines the use of ACcoupling capacitors for transporting uncompressed serial data streams with heavy low frequency content. This
specification requires the use of a 1-µF AC-coupling capacitors on the input of the LMH0384 to avoid low
frequency DC wander.
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9 Power Supply Recommendations
Follow these general guidelines when designing the power supply:
1. The power supply should be designed to provide the recommended operating conditions in terms of DC
voltage, and maximum current consumption.
2. The maximum current draw for the LMH0384 is provided in the data sheet. This figure can be used to
calculate the maximum current the supply must provide. Current consumption can be derived from the typical
power consumption specification in the data sheet.
3. The LMH0384 does not require any special power supply filtering, provided the recommended operating
conditions are met. Only standard supply decoupling is required.
10 Layout
10.1 Layout Guidelines
For information on layout and soldering of the WQFN package, please refer to the following application note: AN1187 Leadless Leadframe Package (LLP) (SNOA401).
The ST 424, 292, and 259 standards have stringent requirements for the input return loss of receivers, which
essentially specify how closely the input must resemble a 75-Ω network. Any non-idealities in the network
between the BNC and the equalizer will degrade the input return loss. Take care to minimize impedance
discontinuities between the BNC and the equalizer to ensure that the characteristic impedance of this trace is 75
Ω.
Please consider the following PCB recommendations:
• Use surface-mount components, and use the smallest components available. In addition, use the smallest
size component pads.
• Select trace widths that minimize the impedance mismatch between the BNC and the equalizer.
• Select a board stack up that supports both 75-Ω single-ended traces and 100-Ω loosely-coupled differential
traces.
• Place return loss components closest to the equalizer input pins.
• Maintain symmetry on the complementary signals.
• Route 100-Ω traces uniformly (keep trace widths and trace spacing uniform along the trace).
• Avoid sharp bends in the signal path; use 45° or radial bends.
• Place bypass capacitors close to each power pin, and use the shortest path to connect equalizer power and
ground pins to the respective power or ground planes.
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10.2 Layout Example
Figure 15 and Figure 16 demonstrate the LMH0384EVM PCB layout. Ground and supply relief under the return
loss passive components and pads reduces parasitic - improving return loss performance. Note 5 vias without
solder paste are located between 4 squares solder paste mainly for thermal as well as to improve soldering
during board assembly.
Figure 15. LMH0384EVM Top Etch Layout Example
Figure 16. LMH384EVM Top Solder Paste Mask
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For additional information, see the following:
Application Note AN- 1187, Leadless Leadframe Package (LLP) (SNOA401).
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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2-Apr-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
LMH0384SQ/NOPB
ACTIVE
WQFN
RUM
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0384
LMH0384SQE/NOPB
ACTIVE
WQFN
RUM
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0384
LMH0384SQX/NOPB
ACTIVE
WQFN
RUM
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
L0384
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
2-Apr-2015
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
LMH0384SQ/NOPB
WQFN
RUM
16
LMH0384SQE/NOPB
WQFN
RUM
LMH0384SQX/NOPB
WQFN
RUM
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LMH0384SQ/NOPB
WQFN
RUM
16
1000
210.0
185.0
35.0
LMH0384SQE/NOPB
WQFN
RUM
16
250
210.0
185.0
35.0
LMH0384SQX/NOPB
WQFN
RUM
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RUM0016A
SQB16A (Rev A)
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
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