Texas Instruments | SNx52x0 USB Port Transient Suppressors (Rev. H) | Datasheet | Texas Instruments SNx52x0 USB Port Transient Suppressors (Rev. H) Datasheet

Texas Instruments SNx52x0 USB Port Transient Suppressors (Rev. H) Datasheet
Sample &
Buy
Product
Folder
Support &
Community
Tools &
Software
Technical
Documents
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
SNx52x0 USB Port Transient Suppressors
1 Features
3 Description
•
The SN65220 device is a dual, and the SN65240 and
SN75240 devices are quadruple, unidirectional
transient voltage suppressors (TVS). These devices
provide electrical noise transient protection to
Universal Serial Bus (USB) low and full-speed ports.
The input capacitance of 35 pF makes it unsuitable
for high-speed USB 2.0 applications.
1
•
•
•
•
•
Design to Protect Submicron 3-V or 5-V
Circuits from Noise Transients
Port ESD Protection Capability Exceeds:
– 15-kV Human Body Model
– 2-kV Machine Model
Available in a WCSP Chip-Scale Package
Stand-Off Voltage: 6 V (Min)
Low Current Leakage: 1-µA Max at 6 V
Low Capacitance: 35-pF (Typ)
Any cabled I/O can be subjected to electrical noise
transients from various sources. These noise
transients can cause damage to the USB transceiver
and/or the USB ASIC if they are of sufficient
magnitude and duration.
2 Applications
•
•
The ESD performance of the SN65220, SN65240,
and SN75240 devices is measured at the system
level, according to IEC61000-4-2. However, system
design impacts the results of these tests. To
accomplish a high compliance level requires careful
board design and layout techniques.
USB Full-Speed Host, HUB, or Peripheral
Ports
Device Information(1)
PART NUMBER
PACKAGE
SN65220
SN65240
SN75240
BODY SIZE (NOM)
SOT-23 (6)
2.90 mm × 1.60 mm
DSBGA (4)
0.925 mm × 0.925 mm
PDIP (8)
9.09 mm × 6.35 mm
TSSOP (8)
3.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
TVS Current vs Voltage
4 Simplified Schematic
7.5
27O
D+
A
15kO
GND
Current – A
5
USB
Transceiver
2.5
0
-2.5
-5
SN65220 or
½ SNx5240
-7.5
15kO
B
27O
D-
-10
-10
-5
0
5
10
Voltage – V
15
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
7
8
Features ..................................................................
Applications ...........................................................
Description .............................................................
Simplified Schematic.............................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
1
2
3
3
4
8.1
8.2
8.3
8.4
8.5
8.6
4
4
4
4
4
5
Absolute Maximum Ratings ......................................
ESD Ratings..............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
9 Parameter Measurement Information .................. 5
10 Detailed Description ............................................. 6
10.1 Overview ................................................................. 6
10.2 Functional Block Diagram ....................................... 6
10.3 Feature Description................................................. 7
10.4 Device Functional Modes........................................ 7
11 Application and Implementation.......................... 8
11.1 Application Information............................................ 8
11.2 Typical Application ................................................. 8
12 Power Supply Recommendations ..................... 10
13 Layout................................................................... 10
13.1 Layout Guidelines ................................................. 10
13.2 Layout Example .................................................... 10
14 Device and Documentation Support ................. 11
14.1
14.2
14.3
14.4
14.5
Related Links ........................................................
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
11
11
11
11
11
15 Mechanical, Packaging, and Orderable
Information ........................................................... 11
5 Revision History
Changes from Revision G (August 2008) to Revision H
•
2
Page
Added Pin Configuration and Functions section, ESD table, Thermal Information table, Feature Description section,
Device Functional Modes, Application and Implementation section, Power Supply Recommendations section,
Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section ................................................................................................................................................................................... 1
Submit Documentation Feedback
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
SN65220, SN65240, SN75240
www.ti.com
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
6 Device Comparison Table
PRODUCT
SUPPRESSORS
TA - RANGE
SN65220
1
–40°C to 85°C
SN65240
2
–40°C to 85°C
SN75240
2
0°C to 70°C
PACKAGE
WCSP-4
SOT23-6
DIP-8
TSSOP-8
DIP-8
TSSOP-8
7 Pin Configuration and Functions
DBV Package
6-Pin SOT-23
Top View
1
GND
2
NC
3
SADI
NC
6
A
5
GND
4
B
YZB Package
4-Pin DSBGA
Top View
A
A1
A2
GND
B
B1
B2
GND
P, PW Packages
8-Pin PDIP, TSSOP
Top View
GND
C
GND
D
1
2
3
4
8
7
6
5
A
GND
B
GND
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
DBV
YZB
P, PW
A
6
A1
8
Analog input
Transient suppressor input - Line 1
B
4
B2
6
Analog input
Transient suppressor input - Line 2
C
—
—
2
Analog input
Transient suppressor input - Line 3
D
—
—
4
Analog input
Transient suppressor input - Line 4
GND
2, 5
A2, B2
1, 3, 5, 7
Power
NC
1, 3
—
—
—
Local device ground
Internally not connected
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
Submit Documentation Feedback
3
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
60
W
Peak forward surge current
3
A
Peak reverse surge current
–9
A
150
°C
PD(peak)
Peak power dissipation
IFSM
IRSM
Tstg
Storage temperature
(1)
–65
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings
VALUE
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins (1)
±15000
Charged device model (CDM), per JEDEC specification JESD22-C101, all
pins (2)
±2000
UNIT
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
TA
Ambient temperature
SN75240
SN65220, SN65240
MIN
MAX
0
70
–40
85
UNIT
°C
8.4 Thermal Information
SN65220
THERMAL METRIC (1)
SN65240, SN75240
DBV
(SOT-23)
YZB
(DSBGA)
P
(PDIP)
6 PINS
4 BALLS
RθJA
Junction-to-ambient thermal resistance
199.5
170
67.5
RθJC(top)
Junction-to-case (top) thermal resistance
159.7
1.8
RθJB
Junction-to-board thermal resistance
51.1
43.5
ψJT
Junction-to-top characterization parameter
41
ψJB
Junction-to-board characterization parameter
50.5
(1)
PW
(TSSOP)
UNIT
8 PINS
185.3
°C/W
57.9
68.8
°C/W
44.5
114.0
°C/W
9.2
36.2
9.9
°C/W
43.5
44.5
112.3
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
8.5 Electrical Characteristics
over recommended operating conditions (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Ilkg
Leakage current
VI = 6 V at A, B, C, or D terminals
V(BR)
Breakdown voltage
VI = 1 mA at A, B, C, or D terminals
CIN
Input capacitance to ground
VI = 0.4 sin (4E6πt) + 0.5 V
4
Submit Documentation Feedback
MIN
TYP
MAX
1
6.5
7
35
8
UNIT
µA
V
pF
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
SN65220, SN65240, SN75240
www.ti.com
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
8.6 Typical Characteristics
TA = 25°C unless otherwise noted.
7.5
5
TVS Current – A
2.5
0
-2.5
-5
-7.5
-10
-10
-5
0
5
TVS Voltage – V
10
15
Figure 1. Transient-Voltage-Suppressor Current vs Voltage
9 Parameter Measurement Information
ILK
VI
DUT
Figure 2. Measurement of Leakage Current
II
VBR
DUT
Figure 3. Measurement of Breakdown Voltage
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
Submit Documentation Feedback
5
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
www.ti.com
10 Detailed Description
10.1 Overview
The SN65220, SN65240, and SN75240 devices integrate multiple unidirectional transient voltage suppressors
(TVS). Figure 4 shows the equivalent circuit diagram of a single TVS diode.
For positive transient voltages, only the Q1 transistor determines the switching characteristic. When the input
voltage reaches the Zener voltage, VZ, Zener diode D1 conducts; therefore, allowing for the base-emitter voltage,
VBE, to increase. At VIN = VZ + VBE, the transistor starts conducting. From then on, its on-resistance decreases
linearly with increasing input voltage.
For negative transient voltages, only diode D2 determines the switching characteristic. Here, switching occurs
when the input voltage exceeds the diode forward voltage, VFW.
7.5
5
Current – A
A,B,C or D
D1
Q1
D2
R1
GND
2.5
VFW
VZ
VBE
0
-2.5
-5
Measured
from A,B,C
or D to GND
-7.5
-10
-10
-5
0
5
10
Voltage – V
15
Figure 4. TVS Structure and Current — Voltage Characteristic
10.2 Functional Block Diagram
SN65240
SN75240
A C
SN65220
A
GND
GND
GND
GND
GND
GND
B
6
Submit Documentation Feedback
B
D
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
SN65220, SN65240, SN75240
www.ti.com
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
10.3 Feature Description
The SN65220, SN65240, and SN75240 family of unidirectional transient voltage suppressors provide transient
protection to Universal Serial Bus low and full−speed ports. These TVS diodes provide a minimum breakdown
voltage of 6.5V to protect USB transceivers and USB ASICs typically implemented in 3-V or 5-V digital CMOS
technology.
10.4 Device Functional Modes
TVS diodes possess two functional modes, a high-impedance and a conducting mode.
During normal operating conditions, that is in the absence of high voltage transients, the breakdown voltage of
TVS diodes is not exceeded and the devices remain high-impedance.
In the presence of high-voltage transients the breakdown voltage is exceeded. The TVS diodes then conduct and
become low-impedance. In this mode excessive transient energy is shunted directly to local circuit ground,
preventing USB transceivers from electrical damage.
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
Submit Documentation Feedback
7
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
www.ti.com
11 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
11.1 Application Information
The universal serial bus (USB) has become a popular solution to connect PC peripherals. USB allows devices to
be hot-plugged in and out of the existing PC system without rebooting or turning off the PC. Because frequent
human interaction with the USB system occurs as a result of its attractive hot-plugging ability, there is the
possibility for large ESD strikes and damage to crucial system elements. The ESD protection included on the
existing hardware is typically in the 2-kV to 4-kV range for the human body model (HBD) and 200-V to 300-V for
the machine model (MM). The ESD voltage levels found in a normal USB operating environment can exceed
these levels. The SN75240, SN65240, and SN65220 devices will increase the robustness of the existing USB
hardware to ESD strikes common to the environment in which USB is likely to be used.
11.2 Typical Application
Figure 5 illustrates a typical USB system and application of the SN75240, SN65240, and SN65220 devices.
Connections to pin A from the D+ data line, pin B from the D– data line, and the device grounds from the GND
line that already exists are necessary to increase the amount of ESD protection provided to the USB port.
The design of the suppressor gives it very low maximum current leakage of 1 μA, a very low typical capacitance
of 35 pF, and a standoff voltage minimum of 6 V. Because of these levels, the SN75240, SN65240, and
SN65220 devices will provide added protection to the USB system hardware during ESD events without
introducing the high capacitance and current leakage levels typical of external transient voltage suppressors. The
addition of an SN75240, SN65240, or SN65220 device is beneficial to both full-speed and low-speed USB 1.1
bandwidth standards.
USB
Hub Port
Transceiver
USB
Down Stream
Transceiver
27O
D+
1.5kO(1)
D+
A
15kO
GND
A
SN65220 or
½ SNx5240
15kO
27O
B
GND
SN65220 or
½ SNx5240
D-
D-
B
27O
1.5kO(2)
1) Full-speed only
2) Low-speed only
27O
Figure 5. Typical Application Schematic for ESD Protection of USB Transceivers
11.2.1 Design Requirements
For this design example, use the parameters listed in Table 1 as design parameters.
Table 1. Design Parameters
8
DESIGN PARAMETER
EXAMPLE VALUE
Minimum breakdown voltage (TVS)
6.5 V
Maximum supply voltage (USB transceiver)
5.5 V
Typical junction capacitance (TVS)
35 pF
Maximum data rate (USB transceiver)
12 Mbps
Submit Documentation Feedback
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
SN65220, SN65240, SN75240
www.ti.com
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
11.2.2 Detailed Design Procedure
To effectively protect USB transceivers, use TVS diodes with breakdown voltages close to 6 V, such as the
SN65220, SN65240, or SN75220 devices.
Because of the TVS junction capacitance of 35 pF, apply these TVS diodes only to USB transceivers with fullspeed capability that is 12 Mbps maximum.
Place the TVS diodes as close to the board connector as possible to prevent transient energies from entering
further board space.
Connect the TVS diode between the data lines (D+, D–) and local circuit ground (GND).
Because noise transient represents high-speed frequencies, ensure low-inductance return paths for the transient
currents by providing a solid ground plane and using two VIAs connecting the TVS terminals to ground.
11.2.3 Application Curve
Ipk
I(A)
90%
Ipk
10%
Ipk
tr
Time
Figure 6. HBM Curve
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
Submit Documentation Feedback
9
SN65220, SN65240, SN75240
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
www.ti.com
12 Power Supply Recommendations
Unlike other semiconductor components that require a supply voltage to operate, the SN65220, SN65240, and
SN75240 transient suppressors are combinations of multiple p-n diodes, activated by transient voltages.
Therefore, these transient suppressors do not require external voltage supplies.
13 Layout
13.1 Layout Guidelines
The multiple ground pins provided lower the connection resistance to ground. In order to improve circuit
operation, a connection to all ground pins must be provided on the system printed circuit board. Without proper
device connection to ground, the speed and protection capability of the device will be degraded.
• The ground termination pads should be connected directly to a ground plane on the board for optimum
performance. A single trace ground conductor will not provide an effective path for fast rise-time transient
events including ESD due to parasitic inductance.
• Nominal inductive values of a PCB trace are approximately 20 nH/cm. This value may seem small, but an
apparent “short length” of trace may be sufficient to produce significant L(di/dt) effects with fast rise-time ESD
spikes.
• Mount the TVS as close as possible to the I/O socket to reduce radiation originating from the transient as it is
routed to ground.
NOTE
Direct connective paths of the traces are taken to the suppressor mounting pads to
minimize parasitic inductance in the surge-current conductive path, thus minimizing
L(di/dt) effects.
13.2 Layout Example
USB
Connector
VIA to Power Ground Plane
VIA to Power Supply Plane
GND
USB
Transceiver
15kO
27O
NC SN65220
27O
D+
A
GND
GND
NC
B
D-
15kO
VBUS
Figure 7. Layout Example of a 4-Layer Board With SN65220
10
Submit Documentation Feedback
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
SN65220, SN65240, SN75240
www.ti.com
SLLS266H – FEBRUARY 1997 – REVISED MAY 2015
14 Device and Documentation Support
14.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
SN65220
Click here
Click here
Click here
Click here
Click here
SN65240
Click here
Click here
Click here
Click here
Click here
SN75240
Click here
Click here
Click here
Click here
Click here
14.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
14.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
14.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
14.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
15 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1997–2015, Texas Instruments Incorporated
Product Folder Links: SN65220 SN65240 SN75240
Submit Documentation Feedback
11
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN65220DBVR
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
SADI
SN65220DBVRG4
ACTIVE
SOT-23
DBV
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
SADI
SN65220DBVT
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
SADI
SN65220DBVTG4
ACTIVE
SOT-23
DBV
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
SADI
SN65240P
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN65240P
SN65240PE4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
-40 to 85
SN65240P
SN65240PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A65240
SN65240PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A65240
SN65240PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A65240
SN65240PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
A65240
SN75240P
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
0 to 70
SN75240P
SN75240PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A75240
SN75240PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A75240
SN75240PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A75240
SN75240PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
A75240
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN65220 :
• Automotive: SN65220-Q1
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Aug-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
SN65220DBVR
SOT-23
DBV
6
3000
178.0
SN65220DBVT
SOT-23
DBV
6
250
SN65240PWR
TSSOP
PW
8
2000
SN75240PWR
TSSOP
PW
8
2000
B0
(mm)
K0
(mm)
P1
(mm)
9.0
3.23
3.17
1.37
4.0
178.0
9.0
3.23
3.17
1.37
330.0
12.4
7.0
3.6
1.6
330.0
12.4
7.0
3.6
1.6
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
8.0
Q3
4.0
8.0
Q3
8.0
12.0
Q1
8.0
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Aug-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN65220DBVR
SOT-23
DBV
6
3000
180.0
180.0
18.0
SN65220DBVT
SOT-23
DBV
6
250
180.0
180.0
18.0
SN65240PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
SN75240PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
C
6.6
TYP
6.2
SEATING PLANE
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
1
3.1
2.9
NOTE 3
2X
1.95
4
5
B
4.5
4.3
NOTE 4
SEE DETAIL A
8X
0.30
0.19
0.1
C A
1.2 MAX
B
(0.15) TYP
0.25
GAGE PLANE
0 -8
0.15
0.05
0.75
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
1
8
(R0.05)
TYP
SYMM
6X (0.65)
5
4
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45)
SYMM
(R0.05) TYP
1
8
SYMM
6X (0.65)
5
4
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
PACKAGE OUTLINE
DBV0006A
SOT-23 - 1.45 mm max height
SCALE 4.000
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
1.75
1.45
PIN 1
INDEX AREA
1
0.1 C
B
A
6
2X 0.95
1.9
1.45 MAX
3.05
2.75
5
2
4
0.50
6X
0.25
0.2
C A B
3
(1.1)
0.15
TYP
0.00
0.25
GAGE PLANE
8
TYP
0
0.22
TYP
0.08
0.6
TYP
0.3
SEATING PLANE
4214840/B 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X (0.95)
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4214840/B 03/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0006A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
6X (1.1)
1
6X (0.6)
6
SYMM
2
5
3
4
2X(0.95)
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214840/B 03/2018
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising