Texas Instruments | DS150DF1610 12.5 to 15 Gbps 16-Channel Retimer | Datasheet | Texas Instruments DS150DF1610 12.5 to 15 Gbps 16-Channel Retimer Datasheet

Texas Instruments DS150DF1610 12.5 to 15 Gbps 16-Channel Retimer Datasheet
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DS150DF1610
SNLS490 – NOVEMBER 2014
DS150DF1610 12.5 to 15 Gbps 16-Channel Retimer
1 Features
3 Description
•
The DS150DF1610 is a sixteen-channel multi-rate
retimer with integrated signal conditioning features.
The device includes a fully adaptive Continuous Time
Linear Equalizer (CTLE), Decision Feedback
Equalizer (DFE), clock and data recovery (CDR), and
a transmit FIR filter to enhance the reach and
robustness over long, lossy, crosstalk impaired high
speed serial links to achieve BER < 1×10-15.
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Pin-Compatible Family
– DS150DF1610: 12.5 to 15G
– DS125DF1610: 9.8 to 12.5G
– DS110DF1610: 8.5 to 11.3G
Fully Adaptive CTLE
Self tuning DFE, with Optional Continuous
Adaption
Configurable VGA
Adjustable Transmit VOD
Adjustable 3-tap Transmit FIR Filter
On-chip AC Coupling on Receive Inputs
Locks to Half/Quarter/Eighth Data Rates for
Legacy Support
On-chip Eye Monitor(EOM), PRBS Checker,
Pattern Generator
Supports JTAG Boundary Scan
Programmable Output Polarity Inversion
Input Signal Detection, CDR Lock Detection
Single 2.5 V ±5% Power Supply
SMBus Based Register Configuration
Optional EEPROM Configuration
15 mm x 15 mm, 196-pin FCBGA Package
Operating Temp Range : –10°C to +85°C
Each channel of the DS150DF1610 independently
locks to serial data rates between 12.5 and 15 Gbps
plus the divide by 2, 4 and 8 sub-multiples. A simple
external oscillator (±100ppm) that is synchronous or
asynchronous with the incoming data stream is used
as a calibration clock.
A programmable transmit Finite Impulse Response
(FIR) filter offers control of the pre-cursor, main tap
and post-cursor for transmit equalization. The fully
adaptive receive equalization (CTLE and DFE)
enables longer distance transmission in lossy copper
interconnects
and
backplanes
with
multiple
connectors.
A non-disruptive mission mode eye-monitor feature
allows link monitoring internal to the receiver. The
built-in PRBS generator and checker compliment the
internal diagnostic features to complete standalone
BERT measurements. Built-in JTAG enables
manufacturing tests.
To download the full datasheet, please send a
request to: highspeed_datasheets@list.ti.com
2 Applications
•
Backplane/Midplane reach extension
Device Information(1)
PART NUMBER
DS150DF1610
PACKAGE
BODY SIZE NOM
FCBGA (196)
15.00 mm x 15.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet
DS150DF1610
.
.
.
TX_0_0P
TX_0_0N
RX_1_7P
RX_1_7N
TX_1_7P
TX_1_7N
__________
INTERR_IO
_________
.
.
.
TDI_IO
TDO_IO
TRST_IO
TMS_IO
TCK_IO
312.5 MHz
1F
2.5V
1F
22F
(1x)
0.1F
(8x)
100nF
RX_0_0P
RX_0_0N
REF_CLK_P
REF_CLK_N
VDD
GND
.
.
.
. 100nF
.
. 100nF
2.5V or 3.3V
2k:
100nF
2k:
2k:
2k:
RESET_IO
SDA_IO
SCL_IO
CLK_MON_P
CLK_MON_N
EN_SMB
READ_EN
ADDR0
ADDR1
1k:
1k:
1k:
1k:
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
PRODUCT PREVIEW
1
DS150DF1610
SNLS490 – NOVEMBER 2014
www.ti.com
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE
REVISION
COMMENTS
November 2014
*
Initial Release
5 Device and Documentation Support
5.1 Trademarks
All trademarks are the property of their respective owners.
5.2 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
5.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
PRODUCT PREVIEW
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designed devices. This data is subject to change without notice and revision of this
document. For browser-based versions of this data sheet, refer to the left-hand navigation.
2
Submit Documentation Feedback
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: DS150DF1610
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS150DF1610FB/NOPB
ACTIVE
FCBGA
ABB
196
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72 HR
-10 to 85
DS150
DF1610
DS150DF1610FBE/NOPB
ACTIVE
FCBGA
ABB
196
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-4-245C-72 HR
-10 to 85
DS150
DF1610
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
24-Aug-2018
Addendum-Page 2
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