Texas Instruments | DS90C387R 85MHz Dual 12-Bit Double Pumped Input LDI Transmitter - VGA/UXGA (Rev. G) | Datasheet | Texas Instruments DS90C387R 85MHz Dual 12-Bit Double Pumped Input LDI Transmitter - VGA/UXGA (Rev. G) Datasheet

Texas Instruments DS90C387R 85MHz Dual 12-Bit Double Pumped Input LDI Transmitter - VGA/UXGA (Rev. G) Datasheet
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
DS90C387R 85MHz Dual 12-Bit Double Pumped Input LDI Transmitter - VGA/UXGA
Check for Samples: DS90C387R
FEATURES
DESCRIPTION
•
The DS90C387R transmitter is designed to support
pixel data transmission from a Host to a Flat Panel
Display up to UXGA resolution. It is designed to be
compatible with Graphics Memory Controller Hub
(GMCH) by implementing two data per clock and can
be controlled by a two-wire serial communication
interface. Two input modes are supported: one port of
12-bit( two data per clock) input for 24-bit RGB, and
two ports of 12-bit( two data per clock) input for dual
24-bit RGB( 48-bit total). In both modes, input data
will be clocked on both rising and falling edges in
LVTTL level operation, or clocked on the cross over
of differential clock signals in the low swing operation.
Each input data width will be 1/2 of clock cycle. With
an input clock at 85MHz and input data at 170Mbps,
the maximum transmission rate of each LVDS line is
595Mbps, for a aggregate throughput rate of
2.38Gbps/4.76Gbps.
It
converts
24/48
bits
(Single/Dual Pixel 24-bit color) of data into 4/8 LVDS
(Low Voltage Differential Signaling) data streams.
DS90C387R can be programmed via the two-wire
serial communication interface. The LVDS output pinout is identical to DS90C387. Thus, this transmitter
can be paired up with DS90CF388, receiver of the
112MHz LDI chipset or FPD-Link Receivers in nonDC Balance mode operation which provides GUI/LCD
panel/mother board vendors a wide choice of interoperation with LVDS based TFT panels.
1
2
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Complies with Open LDI Specification for
Digital Display Interfaces
25 to 85MHz Clock Support
Supports VGA through UXGA Panel
Resolution
Up to 4.76Gbps Bandwidth in Dual 24-bit RGB
In-to-Dual Pixel Out Application
Dual 12-bit Double Pumped Input DVO Port
Pre-Emphasis Reduces Cable Loading Effects
Drives Long, Low Cost Cables
DC Balance Data Transmission Provided by
Transmitter Reduces ISI Distortion
Transmitter Rejects Cycle-to-Cycle Jitter (±2ns
of Input Bit Period)
Support both LVTTL and Low Voltage Level
Input (Capable of 1.0 to 1.8V)
Two-Wire Serial Communication Interface up
to 400 KHz
Programmable Input Clock and Control Strobe
Select
Backward Compatible Configuration with
112MHz LDI and FPD-Link
Optional Second LVDS Clock for Backward
Compatibility with FPD-Link Receivers
Compatible with TIA/EIA-644
DS90C387R also comes with features that can be
found on DS90C387. Cable drive is enhanced with a
user selectable pre-emphasis feature that provides
additional output current during transitions to
counteract cable loading effects. DC Balancing on a
cycle-to-cycle basis is also provided to reduce ISI
(Inter-Symbol Interference), control signals (VSYNC,
HSYNC, DE) are sent during blanking intervals. With
pre-emphasis and DC Balancing, a low distortion eyepattern is provided at the receiver end of the cable.
These enhancements allow cables 5 to 15+ meters in
length to be driven depending on media characteristic
and pixel clock speed. Pre-emphasis is available in
both the DC Balanced and Non-DC Balanced modes.
In the Non-DC Balanced mode backward
compatibility with FPD-Link Receivers is obtained.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2014, Texas Instruments Incorporated
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
DESCRIPTION (CONTINUED)
This chip is an ideal solution to solve EMI and cable size problems for high-resolution flat panel display
applications. It provides a reliable industry standard interface based on LVDS technology that delivers the
bandwidth needed for high-resolution panels while maximizing bit times, and keeping clock rates low to reduce
EMI and shielding requirements. For more details, please refer to the “Applications Information” section of this
datasheet.
Table 1. Mode Configuration / Performance Table
Mode
One 12-bit
Two 12-bit
Mode (GUI Out/Cable)
single/single
dual/dual
Input Clock Rate (MHz)
25-85
25-85
Input Data Rate (Mbps)
50-170
50-170
LVDS data Pairs Out
4
8
Ouput Clock Rate (MHz)
25-85
25-85
Data Rate Out (Mbps) per LVDS channel
175-595
175-595
Throughput Data Rate Out
2.38Gbps
4.76Gbps
Generalized Block Diagrams
Figure 1. DS90C387R
2
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Absolute Maximum Ratings
(1) (2)
Min
Max
Unit
Supply Voltage (VCC)
−0.3
+4
V
LVCMOS/LVTTL Output Voltage
−0.3
VCC + 0.3
V
LVDS Driver Output Voltage
−0.3
VCC + 0.3
LVDS Output Short Circuit Duration
Continuous
Junction Temperature
−65
Storage Temperature
Lead Temperature (Soldering, 4 seconds)
Maximum Package Power Dissipation Capacity at 25°C
100 TQFP Package
Package Derating
(2)
°C
+150
°C
+260
°C
2.8
W
18.2mW/°C above +25°C
HBM, 1.5kΩ, 100pF
ESD Rating
(1)
+150
EIAJ, 0Ω, 200pF
>2
kV
> 300
V
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Min
Nom
Max
All Supply Voltage
3.0
3.3
3.6
V
Operating Free Air Temperature (TA)
−10
+25
+70
°C
100
mVp-p
Supply Noise Voltage (VCC) up to 33MHz
Unit
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
LVCMOS/LVTTL DC SPECIFICATIONS ( All pins, except output pins AnP, AnM, CLKnP and CLKnM, BAL, PD pins)
VIH
High Level Input Voltage
VREF = VCC3V = VCC
2.0
VCC
V
VIL
Low Level Input Voltage
VREF = VCC3V = VCC
GND
0.8
V
VCL
Input Clamp Voltage
ICL = 18 mA
-0.8
-1.5
V
IIN
Input Current
VIN = 0.4V, or VCC
+1.8
+15
µA
VOL
Low level Open Drain Output
Voltage
VIN = GND
−15
0
IOL = 2 mA
0.1
µA
0.3
V
VCC
V
0.8
V
LVCMOS DC SPECIFICATIONS ( PD pin)
VIH
High Level Input Voltage
VREF = VCC3V = VCC
2.9
VIL
Low Level Input Voltage
VREF = VCC3V = VCC
GND
VCL
Input Clamp Voltage
ICL = 18 mA
-0.8
-1.5
V
IIN
Input Current
VIN = 0.4V, or VCC
+1.8
+15
µA
VIN = GND
−15
0
247
345
µA
LVDS DRIVER DC SPECIFICATIONS (output pins AnP, AnM, CLKnP and CLKnM)
VOD
Differential Output Voltage
ΔVOD
Change in VOD between
Complimentary Output States
VOS
Offset Voltage
ΔVOS
Change in VOS between
Complimentary Output States
IOS
Output Short Circuit Current
VOUT = 0V, RL = 100Ω
IOZ
Output TRI-STATE Current
PD = 0V, VOUT = 0V or VCC
(1)
RL = 100Ω
1.125
1.25
550
mV
35
mV
1.475
V
35
mV
−3.5
−11
mA
±1
±10
µA
Typical values are given for VCC = 3.3V and T A = +25°C. Device tested in Non-Balanced mode only.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
3
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VREF
+100mV
1.8
V
GND
VREF 100mV
V
0.5*VDDQ
1
V
f = 32.5 MHz,
DUAL = VCC
115
180
mA
f = 32.5 MHz,
DUAL = Gnd
75
f = 65 MHz,
DUAL = VCC
150
f = 65 MHz,
DUAL = Gnd
95
f = 85 MHz,
DUAL = VCC
175
f = 85 MHz,
DUAL = Gnd
110
f = 32.5 MHz,
DUAL = VCC
110
f = 32.5 MHz,
DUAL = Gnd
70
f = 65 MHz,
DUAL = VCC
135
f = 65 MHz,
DUAL = Gnd
90
f = 85 MHz,
DUAL = VCC
155
f = 85 MHz,
DUAL = Gnd
100
Low Voltage Mode DC SPECIFICATIONS( pins D0 to D23, CLKINP, CLKINM, DE, HSYNC,VSYNC)
VIHLS
Low Swing High Level Input
Voltage, VCC = 3V
VILLS
Low Swing Low Level Input
Voltage,VCC = 3V
VREF
Differential Input Reference
Voltage, VCC = 3V
(2)
Low Swing,VREF = ½VDDQ
0.45
TRANSMITTER SUPPLY CURRENT
ICCTW
Transmitter Supply Current
Worst Case
ICCTG
Transmitter Supply Current, 16
Grayscale Case
ICCTZ
(2)
Transmitter Supply Current,
Power Down
RL = 100Ω,
CL = 5 pF,
Worst Case Pattern
(Figure 4), BAL=High
(enabled),
VCC = 3.6V
RL = 100Ω,
CL = 5 pF,
16 Grayscale Pattern
(Figure 3), BAL =
High (enabled),
VCC = 3.6V
PD = Low
Driver Outputs in TRI-STATE under
Powerdown Mode
mA
215
mA
mA
235
mA
mA
170
mA
mA
205
mA
mA
225
mA
mA
4.8
85
µA
Low Swing DC threshold testing is preformed on data and control inputs only. Clock inputs tested by functional testing only.
DIGITAL DC CHARACTERISTICS for Two-Wire Serial Communication Interface
Over recommended operating supply and temperature ranges unless otherwise specified. (1)
Parameters list below only valid when I2CSEL pin = Vcc.
Symbol
Parameter
VIN(1)
Logical “ 1 ” input voltage
VIN(0)
Logical “ 0 ” input voltage
VOL
Serial Bus Low level output voltage
(1)
4
Conditions
Min
Typ
Max
2.1
Unit
V
0.8
V
IOL= 3mA
0.4
V
IOL= 6mA
0.6
V
Typical values are given for VCC = 3.3V and T A = +25°C. Device tested in Non-Balanced mode only.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. Device driving the transmitter
inputs should comply to this table of recommendations.
Min
Typ
Max
Unit
TCIT
Symbol
TxCLK IN Transition Time (Figure 6)
Parameter
DUAL = Gnd or VCC
0.8
1.2
2.4
ns
TCIP
TxCLK IN Period (Figure 7)
DUAL = Gnd or VCC
11.76
T
40
ns
TCIH
TxCLK in High Time (Figure 7)
0.4T
0.5T
0.6T
ns
TCIL
TxCLK in Low Time (Figure 7)
0.4T
0.5T
0.6T
ns
VDDQ
Low Swing Voltage Amplitude from GMCH
1.8
V
1.0
Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (1)
Symbol
LLHT
LHLT
Typ
Max
Unit
LVDS Low-to-High Transition Time (Figure 5), PRE = no connect (minimum
pre-empahsis).
Parameter
0.14
0.9
ns
LVDS Low-to-High Transition Time (Figure 5), PRE = VCC (max. preempahsis).
0.11
0.7
ns
LVDS High-to-Low Transition Time (Figure 5), PRE = no connect (mini. preempahsis).
0.16
0.9
ns
LVDS High-to-Low Transition Time (Figure 5), PRE = VCC (max. preempahsis).
0.11
0.7
ns
TCCS
TxOUT Channel to Channel Skew
TPPOS0
Transmitter Output Pulse Position for Bit0 from
TxCLKout rising edge.
TPPOS1
Min
100
(2)
ps
-300
0
+300
ps
Transmitter Output Pulse Position for Bit1 from
TxCLKout rising edge.
1.38
1.68
1.98
ns
TPPOS2
Transmitter Output Pulse Position for Bit2 from
TxCLKout rising edge.
3.06
3.36
3.66
ns
TPPOS3
Transmitter Output Pulse Position for Bit3 from
TxCLKout rising edge.
4.74
5.04
5.34
ns
TPPOS4
Transmitter Output Pulse Position for Bit4 from
TxCLKout rising edge.
6.42
6.72
7.02
ns
TPPOS5
Transmitter Output Pulse Position for Bit5 from
TxCLKout rising edge.
8.10
8.40
8.70
ns
TPPOS6
Transmitter Output Pulse Position for Bit6 from
TxCLKout rising edge.
9.78
10.08
10.38
ns
TSTC
TxIN Setup to TxCLK IN in low swing mode at 85 MHz (Figure 8)
1.8
THTC
TxIN Hold to TxCLK IN in low swing mode at 85 MHz (Figure 8)
2
TJCC
Transmitter Jitter Cycle-to-cycle (Figure 13
Figure 14) (3), DUAL = Gnd, VCC = 3V
TPLLS
Transmitter Phase Lock Loop Set (Figure 9)
TPDD
Transmitter Powerdown Delay (Figure 10)
TPDL
Transmitter Input to Output Latency (Figure 11)
(1)
(2)
(3)
(4)
f = 85MHz
ns
ns
f = 85 MHz
110
150
ps
f = 65 MHz
80
120
ps
f = 32.5 MHz
75
115
ps
10
ms
100
ns
f = 32.5/65/85 MHz
(4)
1.5TCIP
+4.1
ns
Typical values are given for VCC = 3.3V and T A = +25°C. Device tested in Non-Balanced mode only.
The parameters are guaranteed by design. The limits are based on statistical analysis of the device performance over PVT(process,
voltage and temperature) range.
The limits are based on bench characterization of the device's jitter response over the power supply voltage range. Output clock jitter is
measured with a cycle-to-cycle jitter of ±2ns applied to the input clock signal while data inputs are switching (see Figure 13 and
Figure 14). A jitter event of 2ns, represents worse case jump in the clock edge from most graphics VGA chips currently available. This
parameter is used when calculating system margin as described in AN-1059.
From V = 1.5V of CLKINP to VDIFF= 0V of CLK1P when R_FB = High, DUAL = Low or High, BAL = Low.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
5
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
DIGITAL SWITCHING CHARACTERISTICS for Two-Wire Serial Communication Interface
Unless otherwise noted, below specifications apply for VCC=+3.3V, load capacitance on output lines = 80 pF. Load
capacitance on output lines can be up to 400 pF provided that external pull-up switch is on board. The following parameters
are the timing relationships between SCL and SDA signals related to the DS90C387R.
Symbol
Parameter
Min
Typ
Max
Unit
t1
SCL (Clock) Period
2.5
μs
t2
Data in Set-Up Time to SCL High
100
ns
t3
Data Out Stable after SCL Low
0
ns
t4
SDA Low Set-Up Time to SCL Low (Start Condition)
100
ns
t5
SDA High Hold Time after SCL High (Stop Condition)
100
ns
AC Timing Diagrams
Figure 2. Two-Wire Serial Communication Interface Timing Diagram when I2CSEL = Vcc
6
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
Figure 3. “16 Grayscale” Test Pattern
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
7
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
Figure 4. “Worst Case” Test Pattern
Figure 5. DS90C387R LVDS Output Load and Transition Times
Figure 6. DS90C387R Input Clock Transition Time
Figure 7. DS90C387R TxCLK IN Period, and High/Low Time (Falling Edge Strobe)
Figure 8. DS90C387R Setup/Hold (Falling Edge Strobe First)
8
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Figure 9. DS90C387R Phase Lock Loop Set Time
Figure 10. DS90C387R Power Down Delay
CLKINP
TPDL
All Data from
E1 and E2
E1
E2
CLK1M
VDIFF = 0V
CLK1P
A0M - A7M
All Data from E1 and E2
A0P - A7P
NOTE: From V = 1.5V of CLKINP to VDIFF= 0V of CLK1P when R_FB = High, DUAL = Low or High, BAL = Low.
Figure 11. DS90C387R Input to Output Latency
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
9
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and
max
Tppos—Transmitter output pulse position (min and max)
RSKM = Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) + ISI (Inter-symbol interference)
Cable Skew—typically 10 ps–40 ps per foot, media dependent
A.
Cycle-to-cycle jitter is less than 150 ps at 85 MHz
B.
ISI is dependent on interconnect length; may be zero
Figure 12. Receiver Skew Margin
Figure 13. TJCC Test Setup - DS90C387R
Figure 14. Timing Diagram of the Input Cycle-to-Cycle Clock Jitter
10
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
DS90C387R PIN DESCRIPTION—LDI TRANSMITTER
Pin Name
D0-D23
I/O
No.
Description
I
24
LVTTL level single-ended inputs or low swing pseduo differential inputs. Reference to VREF pin.
D0-D11 are for 12-bit input mode (24 RGB data); D0-D11 (first 12-bit port) and D12-D23
(second 12-bit port) are for two 12-bit input mode (48 RGB data).
DE
I
1
LVTTL level or low swing level inputs for data enable. This signal is HIGH when input pixel data
is valid to DS90C387R provided that R_FDE = HIGH.
HSYNC
I
1
Horizontal Sync input control signal. LVTTL level or low swing level.
VSYNC
I
1
Vertical Horizontal Sync input control signal. LVTTL level or low swing level.
AnP
O
8
Positive LVDS differential data output.
AnM
O
8
Negative LVDS differential data output.
CLKINP
I
1
In LVTTL level operation, this is a single-ended clock. In low swing operation, this is the positive
differential clock input .
CLKINM
I
1
In LVTTL level operation, no connect or connect to VREF pin. Do not connect to GND under any
condition. In low swing operation, this is negative differential clock input .
R_FB
I
1
LVTTL level input for selecting the Primary clock edge E1. Falling clock edge selected when
input is HIGH; Rising clock edge selected when input is LOW. (1)
R_FDE
I
1
LVTTL level input. Programmable control (DE) strobe select. Tie HIGH for data active when DE
is HIGH. (1)
CLK1P
O
1
Positive LVDS differential clock output.
CLK1M
O
1
Negative LVDS differential clock output.
PD
I
1
LVCMOS level input. Input = LOW will place the entire device in power down mode. Outputs of
the device will be in TRI-STATE mode to ensure low current at power down. (1)
PLLSEL
I
1
LVTTL level in. Tie to Vcc for normal operation.
BAL
I
1
LVTTL level input. Mode select for dc balanced or non-dc balanced interface. DC balance is
active when input is high. (1)
PRE
I
1
Pre-emphasis level select. Pre-emphasis is active when input is tied to VCC through external
pull-up resistor. Resistor value determines pre-emphasis level (see table in application section).
For normal LVDS drive level (minimum pre-emphasis) leave this pin open (do not tie to
ground). (1)
DUAL
I
1
LVTTL level input. Input = LOW for one 12-bit input mode, 24 RGB data in, 24 RGB data out. (1)
Input = HIGH for normal operation.
(1)
LVTTL level input. Input = VCC for two 12-bit input mode, 48 RGB data in, 48 RGB data out. (1)
VCC
I
1
Connect to power supply with voltage stated under Recommended Operating Conditions.
Power supply pin for LVTTL inputs and digital circuitry, pin53.
GND
I
4
Ground pins for LVTTL inputs and digital circuitry, pins 9, 11, 52, 77.
I2VCC
I
1
Connect to power supply with voltage stated under Recommended Operating Conditions, pin
68.
VCC3V
I
3
Connect to power supply with voltage stated under Recommended Operating Conditions, pins
70, 79, 95.
GND3V
I
3
Ground pin(s) for powering the data inputs, pins 71, 80, 96.
SGND
I
1
Connect to ground, pin 69.
PLLVCC
I
2
Connect to power supply with voltage stated under Recommended Operating Conditions.
Power supply pins for PLL circuitry, pin 10, 16.
PLLGND
I
3
Ground pins for PLL circuitry, pins 14, 15, 17.
LVDSVCC
I
3
Connect to power supply with voltage stated under Recommended Operating Conditions.
Power supply pins for LVDS outputs, pins 30, 40, 48.
LVDSGND
I
4
Ground pins for LVDS outputs, pins 25, 35, 43, 51.
CLK2P/NC
O
1
Additional positive LVDS differential clock output identical to CLK1P. No connect if not used.
CLK2M/NC
O
1
Additional negative LVDS differential clock output identical to CLK1M. No connect if not used.
(1)
Inputs default to “low” when left open due to internal pull-down resistor.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
11
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
DS90C387R PIN DESCRIPTION—LDI TRANSMITTER (continued)
Pin Name
VREF
I/O
I
No.
Description
1
VREF= 1/2 VDDQ, a ”Fixed “ line of differential input.
If VREF ≥ 1.8V, indicates input data is in LVTTL mode.
If VREF < 1.1V, indicates input data is in low voltage swing mode.
In low voltage swing mode, input data = logic HIGH = VREF + 100mV.
In low voltage swing mode, input data = logic LOW = VREF - 100mV.
This pin is not to be left floating. When not use in LVTTL mode, tie to Vcc
I2CSEL
I
1
HIGH to enable two-wire serial communication interface; LOW to disable the interface.
DDREN/I2Cclk
I
1
Always HIGH for one 12-bit port and two 12-bit ports operation. When I2CSEL = HIGH, this is
the clock line for the two-wire serial communication interface.
I/O
1
Differential select pin for CLKIN (HIGH = single-ended, LOW = differentail) or when I2CSEL =
HIGH, this is the Bidirectional Data line for the two-wire serial communication interface.
A0
I
1
when I2CSEL = HIGH, this is one of the Slave Device Address Lower Bits.
A1
I
1
when I2CSEL = HIGH, this is one of the Slave Device Address Lower Bits.
A2
I
1
when I2CSEL = HIGH, this is one of the Slave Device Address Lower Bits.
MSEN
O
DSEL/I2Cdat
1
Interrupt signal. This is an open drain output, pull-up resistor is required.
TST1
1
Test pin, tie to Vcc.
TST2
1
Test pin, no connect. Do not tie to ground.
RESERVED1
1
Reserved pin, tie to ground.
RESERVED2
1
Reserved pin, tie to ground.
RESERVED3
1
Reserved pin, no connect. Do not tie to ground.
RESERVED4
1
Reserved pin, tie to ground.
RESERVED5
1
Reserved pin, tie to ground.
RESERVED6
1
Reserved pin, tie to ground.
RESERVED7
1
Reserved pin, tie to ground.
RESERVED8
1
Reserved pin, tie to ground.
RESERVED9
1
Reserved pin, tie to ground.
Table 2. Control Settings for mode selection
Mode
12bit
Two 12-bit
DUAL
L
H
L/H
BAL
L/H
I2CSEL
L
L
DDREN/I2Cclk
H
H
CLKIN polarity
R_FB
R_FB
CLKIN,single-ended/ differentail
DSEL
DSEL
Description
12-bit in, 24-bit pixel out, non-DC Balanced or
DC-Balanced
Two 12-bit in, two 24-bit pixels out, non-DC
Balanced or DC-Balanced.
Table 3. Relationship between R_FB, DE, HSYNC and VSYNC pins
R_FB
Primary Edge
Secondary Edge
DE latches on
HSYNC latches on
VSYNC latches on
VCC
Falling
Rising
Rising
Falling
Falling
GND
Rising
Falling
Falling
Rising
Rising
Two-Wire Serial Communication Interface Description
The DS90C387R operates as a slave on the Serial Bus, so the SCL line is an input (no clock is generated by the
DS90C387R) and the SDA line is bi-directional. DS90C387R has a 7-bit slave address. The address bits are
controlled by the state of the address select pins A2, A1 and A0, and are set by connecting these pins to ground
for a LOW, (0) , to VCC for a HIGH, (1).
12
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Therefore, the complete slave address is:
A6
A5
A4
A3
A2
A1
A0
MSB
LSB
and is selected as follows:
Address Select Pin
State
DS90C387R Serial
Bus Slave Address
A2
A1
A0
A6:A0 binary
0
0
0
0111000
0
0
1
0111001
0
1
0
0111010
0
1
1
0111011
1
0
0
0111100
1
0
1
0111101
1
1
0
0111110
1
1
1
0111111
The DS90C387R latches the state of the address select pins during the first read or write on the Serial Bus.
Changing the state of the address select pins after the first read or write to any device on the Serial Bus will not
change the slave address of the DS90C387R.
A zero in front of the register address is required as the most left column shown in Table 4. For example, to
access register F, “0F” is the correct way of accessing the register.
Table 4. Register Mapping
Addr
Bit7
Bit6
Bit5
Bit4
Bit3
000
VND_IDL(RO)
001
VND_IDH(RO)
002
DEV_IDL(RO)
003
DEV_IDH(RO)
004
DEV_REV(RO)
005
RSVD[7:0](RO)
006
FRQ_LOW[7:0](RO)
007
FRQ_HIGH[7:0](RO)
008
009
RSVD[1:0]
VEN(RW)
VLOW(RO)
MSEL[2:0](RW)
DK[3:1](RW) (1)
00A
HEN(RW)
DSEL(RW)
TSEL(RW)
DKEN(RW) (1)
00B
CFG[7:0](RO) (1)
00C
VDJK[7:0](RW) (1)
00D
Bit1
BSEL(RW)
EDGE(RW)
RSEN(RO)
HTPLG(RO)
CTL[3:1](RW)
RSVD[3:0](RW)
Bit0
(1)
PD(RW)
MDI(RW)
RSVD(RW)
RSVD[3:0](RO)
00E
RSVD[7:0](RW)
00F
RSVD[7:0](RW)
(1)
Bit2
Features not implemented on DS90C387R
Table 5. Register Field Definitions
Field
Access
VND_IDL
RO
Vendor ID low byte, value is 05h.
Description
VND_IDH
RO
Vendor ID high byte, value is 13h.
DEV_IDL
RO
Device ID low byte, value is 24h.
DEV_IDH
RO
Device ID high byte, value is 67h.
DEV_REV
RO
Device revision, value is 00h.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
13
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
Table 5. Register Field Definitions (continued)
Field
Access
FRQ_LOW
RO
25 MHz is Low frequency limit for the current mode, value is 19h.
Description
FRQ_HIGH
RO
85 MHz is High frequency limit for the current mode, value is 55h.
PD
RW
Power down mode, default = 1.
0 - power down only the LVDS drivers. Output of this device will be in TRI-STATE mode. Other
circuitry are still active.
1 - normal operation.
EDGE
RW
Edge select (same function as R_FB pin), default = 1.
0 - input data is rising edge latched (rising edge latched first in 12-bit and two 12-bit mode).
1 - input data is falling edge latched (falling edge latched first in 12-bit and two 12-bit mode).
BSEL
RW
Input bus select (same as DUAL pin), default = 0.
0 - one 12-bit bus.
1 - two 12-bit bus.
DSEL
RW
Dual level clock select (same function as DSEL pin), default = 1.
0 - input clock is differential.
1 - input clock is single-ended (up to 65MHz). CLKINM and VREF pin are internally connected.
HEN
RW
Horizontal sync enable, default = 1.
0 - HSYNC input is transmitted as fixed LOW.
1 - HSYNC input is transmitted as it is.
VEN
RW
Vertical sync enable, default = 1.
0 - VSYNC input is transmitted as fixed LOW.
1 - VSYNC input is transmitted as it is.
MDI
RW
Monitor Detect Interrupt, default = 1.
0 - Detection signal has changed logical level (write "1" to this bit to clear).
1 - Detection signal has not changed state.
HTPLG
(1)
RO
Feature not implemented.
RSEN
RO
This bit is a ”1 “ if a powered on receiver is connected to the transmitter outputs, ” 0 “ otherwsie.
This function is only available for use in DC-coupled systems. Default=0.
TSEL
RW
Interrupt generation method, default=0.
0 - Interrupt bit (MDI) is generated by monitoring RSEN.
1 - Interrupt bit (MDI) is generated by monitoring HTPLG.
MSEL [2:0]
RW
Select source for the MSEN output pin. Default valus is 001.
000 - Force MSEN output HIGH (disabled).
001 - Output the value of MDI bit (interrupt). This is default.
010 - Output the value of RSEN bit (receiver detect).
011 - Output the value of HTPLG bit (hot plug detect).
1xx - Reserved.
VLOW
RO
This bit is an 1 if the VREF signal indicates low swing inputs. Default=1.
It is a 0 if VREF indicates high swing inputs.
CTL [3:1]
RW
General purpose inputs.
CFG [7:0] (1)
RO
Feature not implemented.
VDJK [7:0] (1)
RW
Reserved.
RW
Feature not implemented.
RW
Feature not implemented.
DK [3:1]
(1)
DKEN (1)
(1)
14
Features not implemented on DS90C387R
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Communicating with the DS90C387R through Registers
There are 31 data registers in the DS90C387R, and can be accessed through sixteen register addresses. All
registers are predefined as read only, or read and write. The device will always attempt to detect if a LCD
panel/monitor is connected.
A Write to the DS90C387R will always include the slave address byte, data register address byte, a data byte.
Reading the DS90C387R can take place either of two ways:
1. If the location latched in the data register addresses is correct , then the read can simply consist of a slave
address byte, followed by retrieving the data byte.
2. If the data register address needs to be set, then a slave address byte, data register address will be sent
first, then the master will repeat start, send the slave address byte and data byte to accomplish a read.
The data byte has the most significant bit first. At the end of a read, the DS90C387R can accept either
Acknowledge or No Acknowledge from the Master (No Acknowledge is typically used as a signal for the slave
that the Master has read its last byte).
Two-Wire Serial Communication Interface for Slave
The DS90C387R slave state machine does not require an internal clock and it supports only byte read and write.
Page mode is not supported. The 7-bit binary address is “0111A2A1A0”, where A2A1A0 are pin programmable to “
1” or “ 0 ” and the “ 0111 ” is hardwired internally.
Figure 15. Byte Read
The master must generate a “ Start ” by sending the 7-bit slave address plus a 0 first, and wait for acknowledge
from DS90C387R. When DS90C387R acknowledges (the 1st ACK) that the master is calling, the master then
sends the data register address byte and waits for acknowledge from the slave. When the slave acknowledges
(the 2nd ACK), the master repeats the “ Start ” by sending the 7-bit slave address plus a 1 (indicating that READ
operation is in progress) and waits for acknowledge from DS90C387R. After the slave responds (the 3rd ACK),
the slave sends the data to the bus and waits for acknowledge from the master. When the master acknowledges
(the 4th ACK), it generates a “ Stop ”. This completes the “ READ ”.
Figure 16. Byte Write
The master must generate a “ Start ”, by sending the 7-bit slave address plus a 0 and wait for acknowledge from
DS90C387R. When DS90C387R acknowledges (the 1st ACK) that the master is calling, the master then sends
the data register address byte and waits for acknowledge from the slave. When the slave acknowledges (the 2nd
ACK), the master sends the data byte and wait for acknowledge from the slave. When the slave acknowledges
(the 3rd ACK), the master generates a “ Stop ”. This completes the “ WRITE ”.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
15
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
LVDS Interface
Table 6. LVDS data bit naming convention (1)
X
Y
Z
Description
X=R
Red
X=G
Green
X=B
Blue
Y=1
Odd (First) Pixel
Y=2
Even (Second) Pixel
Z=0-7
(1)
LVDS bit number (not VGA controller LSB to MSB)
For a 48-bit dual pixel application - LSB (Less Significant Bit) = R16,G16,B16,R26,G26,B26 and MSB
(Most Significant Bit) = R15,G15,B15,R25,G25,B25.
Table 7. 12-bit (two data per clock) data mapping (1)
VGA - TFT Data Signals
Color Bits
Transmitter input pin names
Receiver output pin names
24-bit
DS90C387R
DS90CF388
R0
E2-D4
R16
R0
R1
E2-D5
R17
R1
R2
E2-D6
R10
R0
R2
R3
E2-D7
R11
R1
R3
R4
E2-D8
R12
R2
R4
R5
E2-D9
R13
R3
R5
R6
E2-D10
R14
R4
R6
MSB
R7
E2-D11
R15
R5
LSB
G0
E1-D8
G16
G1
E1-D9
G17
G2
E1-D10
G10
G0
G2
G3
E1-D11
G11
G1
G3
G4
E2-D0
G12
G2
G4
G5
E2-D1
G13
G3
G5
G6
E2-D2
G14
G4
G6
MSB
G7
E2-D3
G15
G5
G7
LSB
B0
E1-D0
B16
B1
E1-D1
B17
B2
E1-D2
B10
B0
B2
B3
E1-D3
B11
B1
B3
B4
E1-D4
B12
B2
B4
B5
E1-D5
B13
B3
B5
B6
E1-D6
B14
B4
B6
B7
E1-D7
B15
B5
B7
LSB
MSB
(1)
TFT Panel Data Signals
18-bit
24-bit
R7
G0
G1
B0
B1
DUAL=GND, BAL=Vcc/GND, only A0-A3 are used
Table 8. Two 12-bit (two data per clock) data mapping (1)
VGA - TFT Data Signals
Color Bits
Transmitter input pin names
Receiver output pin names
DS90C387R
DS90CF388
24-bit
TFT Panel Data Signals
18-bit
24-bit
Port 1-Primary (odd pixel/first RGB pixel)
LSB
(1)
16
R0
E2-D4
R16
R0
DUAL=GND, BAL=Vcc/GND, only A0-A3 are used
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Table 8. Two 12-bit (two data per clock) data mapping(1) (continued)
VGA - TFT Data Signals
Color Bits
Transmitter input pin names
Receiver output pin names
TFT Panel Data Signals
R1
E2-D5
R17
R2
E2-D6
R10
R0
R2
R3
E2-D7
R11
R1
R3
R4
E2-D8
R12
R2
R4
R5
E2-D9
R13
R3
R5
R6
E2-D10
R14
R4
R6
MSB
R7
E2-D11
R15
R5
LSB
G0
E1-D8
G16
G1
E1-D9
G17
G2
E1-D10
G10
G0
G2
G3
E1-D11
G11
G1
G3
G4
E2-D0
G12
G2
G4
G5
E2-D1
G13
G3
G5
R1
R7
G0
G1
G6
E2-D2
G14
G4
G6
MSB
G7
E2-D3
G15
G5
G7
LSB
B0
E1-D0
B16
B1
E1-D1
B17
B2
E1-D2
B10
B0
B2
B3
E1-D3
B11
B1
B3
B4
E1-D4
B12
B2
B4
B5
E1-D5
B13
B3
B5
B6
E1-D6
B14
B4
B6
MSB
B7
E1-D7
B15
B5
B7
LSB
R0
E2-D16
R26
R0
R1
E2-D17
R27
R1
R2
E2-D18
R20
R0
R2
R3
E2-D19
R21
R1
R3
R4
E2-D20
R22
R2
R4
R5
E2-D21
R23
R3
R5
R6
B0
B1
Port 2-Secondary (even pixel/second RGB pixel)
R6
E2-D22
R24
R4
MSB
R7
E2-D23
R25
R5
LSB
G0
E1-D20
G26
G1
E1-D21
G27
G2
E1-D22
G20
G0
G2
G3
E1-D23
G21
G1
G3
G4
E2-D12
G22
G2
G4
G5
E2-D13
G23
G3
G5
G6
E2-D14
G24
G4
G6
MSB
G7
E2-D15
G25
G5
G7
LSB
B0
E1-D12
B26
B1
E1-D13
B27
B2
E1-D14
B20
B0
B2
B3
E1-D15
B21
B1
B3
B4
E1-D16
B22
B2
B4
B5
E1-D17
B23
B3
B5
B6
E1-D18
B24
B4
B6
R7
G0
G1
B0
B1
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
17
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
Table 8. Two 12-bit (two data per clock) data mapping(1) (continued)
VGA - TFT Data Signals
Color Bits
MSB
Transmitter input pin names
Receiver output pin names
E1-D19
B25
B7
TFT Panel Data Signals
B5
B7
Figure 17. How ds90c387r Latch Data
Table 9. 12-bit (two data per clock) input application data mapping with GMCH.
P0
18
P1
P2
P0L
P0H
P1L
P1H
Pin Name
Low
High
Low
High
Low
High
D11
G0[3]
R0[7]
G1[3]
R1[7]
G2[3]
R2[7]
D10
G0[2]
R0[6]
G1[2]
R1[6]
G2[2]
R2[6]
D9
G0[1]
R0[5]
G1[1]
R1[5]
G2[1]
R2[5]
D8
G0[0]
R0[4]
G1[0]
R1[4]
G2[0]
R2[4]
D7
B0[7]
R0[3]
B1[7]
R1[3]
B2[7]
R2[3]
D6
B0[6]
R0[2]
B1[6]
R1[2]
B2[6]
R2[2]
D5
B0[5]
R0[1]
B1[5]
R1[1]
B2[5]
R2[1]
D4
B0[4]
R0[0]
B1[4]
R1[0]
B2[4]
R2[0]
D3
B0[3]
G0[7]
B1[3]
G1[7]
B2[3]
G2[7]
D2
B0[2]
G0[6]
B1[2]
G1[6]
B2[2]
G2[6]
D1
B0[1]
G0[5]
B1[1]
G1[5]
B2[1]
G2[5]
Submit Documentation Feedback
P2L
P2H
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Table 9. 12-bit (two data per clock) input application data mapping with GMCH. (continued)
P0
P0L
P1
P0H
P1L
P2
P1H
P2L
P2H
Pin Name
Low
High
Low
High
Low
High
D0
B0[0]
G0[4]
B1[0]
G1[4]
B2[0]
G2[4]
Figure 18. TTL Data Inputs Mapped to LVDS Outputs
Non-DC Balanced Mode (Backward Compatible, BAL=Low, A0 to A3 for Port1, A4 to A7 for Port2)
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
19
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
Figure 19. 48 Parallel TTL Data Inputs Mapped to LVDS Outputs
DC Balanced Mode (Data Enabled, BAL=High, A0 to A3 for Port1, A4 to A7 for Port2)
Figure 20. Control Signals Transmitted During Blanking in DC-Balance mode
Table 10. Control Signals Transmitted During Blanking in DC-Balance mode
Control Signal
Signal
Level
Channel
Pattern
DE
HIGH
CLK1
1111000 or 1110000
LOW
HSYNC
HIGH
1111100 or 1100000
A0
LOW
VSYNC
HIGH
LOW
20
1100000 or 1111100
1110000 or 1111000
A1
1100000 or 1111100
1110000 or 1111000
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
APPLICATIONS INFORMATION
How to configure the DS90C387R to work with DS90CF384/DS90CF384A/DS90CF386 or DS90CF388 for
most common application:
1. To configure for single pixel application using the DS90C387R to interface with GMCH host, please see table
below for reference pin connection and configuration. Due to the implementation differences among various
GMCH vendors, the table is using the GMCH vendor located in Santa Clara, California, USA as an example. A
two-wire serial communication interface based EEPROM containing EDID 128 bytes LCD timing information may
be required depending on device driver implementation.
From DS90C387R
To GMCH
data signal connection
D0
D0
D1
D1
D2
D2
D3
D3
D4
D4
D5
D5
D6
D6
D7
D7
D8
D8
D9
D9
D10
D10
D11
D11
CLKINP
CLK1
CLKINM
CLK0
DE
BLANK
HSYNC
HSYNC
VSYNC
VSYHC
configuration for other pins
DDRENI2Cclk
I2CCLK
DSELI2Cdat
I2CDATA
A0
GND
A1
GND
A2
GND
PLLSEL
Vcc
DUAL
GND
BAL
GND
D12 to D23
No connect
RESERVED1
GND
RESERVED2
GND
RESERVED3
No connect
RESERVED4
GND
RESERVED5
GND
RESERVED6
GND
RESERVED7
GND
RESERVED8
GND
RESERVED9
GND
TST1
Vcc
TST2
No connect
VREF
VREF
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
21
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
From DS90C387R
To GMCH
MSEN
INT#
2. To configure for single pixel application using the DS90C387R with single DS90CF384 or DS90CF384A or
DS90CF386 LVDS based LCD panel or monitor, the “DUAL” pin must be set to Gnd (single RGB), and “BAL” pin
must be set to Gnd to disable the feature for DS90CF384/DS90CF386 doesn't support DC balance function. For
cable length more than two meters, pre-emphasis feature is recommended. Please see table below for reference
pin connection.
From DS90C387R Output Pins
To LVDS based LCD monitor
data signal connection
A0M
RxIN0−
A0P
RxIN0+
A1M
RxIN1−
A1P
RxIN1+
A2M
RxIN2−
A2P
RxIN2+
CLK1M
RxCLKIN0−
CLK1P
RxCLKIN0+
A3M(valid for 8-bit LCD only; no
connect for 6-bit LCD)
RxIN3−(valid for 8-bit LCD only; no
connect for 6-bit LCD)
A3P(valid for 8-bit LCD only; no
connect for 6-bit LCD)
RxIN3+(valid for 8-bit LCD only; no
connect for 6-bit LCD)
A4M
No connect
A4P
No connect
A5M
No connect
A5P
No connect
A6M
No connect
A6P
No connect
A7M
No connect
A7P
No connect
CLK2M
No connect
CLK2P
No connect
3. To configure for single pixel or dual pixel application using the DS90C387R with DS90CF388, the “DUAL” pin
must be set to Vcc (dual RGB) or Gnd (single RGB). Also, “BAL” pins on both devices have to in the same logic
state. For cable length more than two meters, pre-emphasis feature is recommended.
4. In dual mode, DS90C387R has two LVDS clock outputs enabling an interface to two FPD-Link 'notebook'
receivers (DS90CF384/DS90CF386). “BAL” pin must be set to Gnd to disable DC balance function for
DS90CF384/DS90CF386 doesn't support DC balance function. In single mode, outputs A4-to-A7 and CLK2 are
disabled which reduces power dissipation. For cable length more than two meters, pre-emphasis feature is
recommended.
The DS90CF388 is able to support single or dual pixel interface up to 112MHz operating frequency. This receiver
may also be used to interface to a VGA controller with an integrated LVDS transmitter without DC balance data
transmission. In this case, the receivers “BAL” pin must be tied low (DC balance disabled).
Features Description:
1. Pre-emphasis: adds extra current during LVDS logic transition to reduce the cable loading effects. Preemphasis strength is set via a DC voltage level applied from min to max (0.75V to Vcc) at the “PRE” pin. A
higher input voltage on the ”PRE” pin increases the magnitude of dynamic current during data transition. The
“PRE” pin requires one pull-up resistor (Rpre) to Vcc in order to set the DC level. There is an internal resistor
network, which cause a voltage drop. Please refer to the tables below to set the voltage level.
22
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Table 11. Pre-emphasis DC voltage level with (Rpre)
Rpre
Resulting PRE
Voltage
Effects
1MΩ or NC
0.75V
Standard LVDS
50kΩ
1.0V
9kΩ
1.5V
3kΩ
2.0V
1kΩ
2.6V
100Ω
Vcc
50% pre-emphasis
100% pre-emphasis
Table 12. Pre-emphasis needed per cable length
Frequency
PRE Voltage
Typical cable length
85MHz
1.5V
7 meters
65MHz
1.5V
10 meters
2. DC Balance: In the balanced operating modes, in addition to pixel and control information an additional bit is
transmitted on every LVDS data signal line during each cycle of active data as shown in Figure 19. This bit is the
DC balance bit (DCBAL). The purpose of the DC Balance bit is to minimize the short- and long-term DC bias on
the signal lines. This is achieved by selectively sending the pixel data either unmodified or inverted.
The value of the DC balance bit is calculated from the running word disparity and the data disparity of the current
word to be sent. The data disparity of the current word shall be calculated by subtracting the number of bits of
value 0 from the number of bits value 1 in the current word. Initially, the running word disparity may be any value
between +7 and −6. The running word disparity shall be calculated as a continuous sum of all the modified data
disparity values, where the unmodified data disparity value is the calculated data disparity minus 1 if the data is
sent unmodified and 1 plus the inverse of the calculated data disparity if the data is sent inverted. The value of
the running word disparity shall saturate at +7 and −6.
The value of the DC balance bit (DCBAL) shall be 0 when the data is sent unmodified and 1 when the data is
sent inverted. To determine whether to send pixel data unmodified or inverted, the running word disparity and the
current data disparity are used. If the running word disparity is positive and the current data disparity is positive,
the pixel data shall be sent inverted. If the running word disparity is positive and the current data disparity is zero
or negative, the pixel data shall be sent unmodified. If the running word disparity is negative and the current data
disparity is positive, the pixel data shall be sent unmodified. If the running word disparity is negative and the
current data disparity is zero or negative, the pixel data shall be sent inverted. If the running word disparity is
zero, the pixel data shall be sent inverted.
Cable drive is enhanced with a user selectable pre-emphasis feature that provides additional output current
during transitions to counteract cable loading effects. DC balancing on a cycle-to-cycle basis, is also provided to
reduce ISI (Inter-Symbol Interference). With pre-emphasis and DC balancing, a low distortion eye-pattern is
provided at the receiver end of the cable. These enhancements allow cables 5 to 10+ meters in length to be
driven. Quality of the cable can affect the length.
The data enable control signal (DE) is used in the DC balanced mode to distinguish between pixel data and
control information being sent. It must be continuously available to the device in order to correctly separate pixel
data from control information. For this reason, DE shall be sent on the clock signals, LVDS CLK1 and CLK2,
when operating in the DC balanced mode. If the value of the control to be sent is 1 (active display), the value of
the control word sent on the clock signals shall be 1111000 or 1110000. If the value of the control to be sent is 0
(blanking time), the value of the control word sent on the clock signals shall be 1111100 or 1100000.
The control information, such as HSYNC and VSYNC, is always sent unmodified. The value of the control word
to send is determined by the running word disparity and the value of the control to be sent. If the running word
disparity is positive and the value of the control to be sent is 0, the control word sent shall be 1110000. If the
running word disparity is zero or negative and the control word to be sent is 0, the control word sent shall be
1111000. If the running word disparity is positive and the value of the control to be sent is 1, the control word
sent shall be 1100000. If the running word disparity is zero or negative and the value of the control to be sent is
1, the control word sent shall be 1111100. The DC Balance bit shall be sent as 0 when sending control
information during blanking time. See Figure 20.
In backward compatible mode (BAL=low) control and data is sent as regular LVDS data. See Figure 18.
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
23
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
Backwards Compatible Mode with FPD-Link
The transmitter provides a second LVDS output clock. Both LVDS clocks will be identical in 'Dual pixel mode'.
This feature supports backward compatibility with the previous generation of devices - the second clock allows
the transmitter to interface to panels using a 'dual pixel' configuration of two 24-bit or 18-bit 'notebook' receivers.
Pre-emphasis feature is available for use in both the DC balanced and non-DC balanced (backwards compatible)
modes.
Information on Jitter Rejection:
The transmitter is designed to reject cycle-to-cycle jitter which may be seen at the transmitter input clock. Very
low cycle-to-cycle jitter is passed on to the transmitter outputs. This significantly reduces the impact of jitter
provided by the input clock source, and improves the accuracy of data sampling. Data sampling is further
enhanced by automatically calibrated data sampling strobes at the receiver inputs. Timing and control signals
(VSYNC, HSYNC, DE) are sent during blanking intervals to guarantee correct reception of these critical signals.
The transmitter is offered with programmable primary clock edge for convenient interface with a variety of
graphics controllers. The transmitter can be programmed for rising edge strobe or falling edge strobe through a
dedicated pin. A rising edge transmitter will inter-operate with a falling edge receiver without any translation logic.
Transmitter Block Diagram
24
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
DS90C387R
www.ti.com
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
Configuration Table
Table 13. Transmitter / DS90CF388 Receiver configuration table
Pin
Condition
R_FB (Tx only)
R_FDE (both Tx and Rx)
BAL (both Tx and Rx)
DUAL (Tx only)
Configuration
R_FB = VCC
Primary clock edge selected as Falling Edge
R_FB = GND
Primary clock edge selected as Rising Edge
R_FDE = VCC
Active data DE = High
R_FDE = GND
Active data DE = Low
BAL=VCC
DC Balanced enabled
BAL=Gnd
DC Balanced disabled (backward compatible to FPD-Link)
DUAL=VCC
48-bit color (dual pixel) support
DUAL=Gnd
24-bit color (single pixel) support
RESERVED3
RESERVED2
RESERVED5
RESERVED4
DDREN/I2Cclk
59 58 57 56 55 54 53 52
51
VCC
LVDSGND
61 60
RESERVED6
DSEL/I2Cdat
RESERVED7
I2CSEL
A1
A0
RESERVED8
A2
I2CVCC
RESERVED9
VCC3V
SGND
71 70 69 68 67 66 65 64 63 62
GND
75 74 73 72
GND3V
TST1
VSYNC
TST2
HSYNC
Pin Diagram
DE
76
50
A0M
GND
77
49
A0P
V REF
78
48
LVDSVCC
VCC3V
79
47
A1M
GND3V
80
46
A1P
D11
81
45
A2M
D10
82
44
A2P
D9
83
43
LVDSGND
D8
84
42
CLK1M
D7
85
41
CLK1P
D6
86
40
LVDSVCC
CLKINP
87
39
A3M
CLKINM
88
38
A3P
D5
89
37
A4M
D4
90
36
A4P
DS90C387R
A6M
VCC3V
95
31
A6P
GND3V
96
30
LVDSVCC
D23
97
29
A7M
D22
98
28
A7P
D21
99
27
CLK2M/NC
D20
100
26
CLK2P/NC
LVDSGND
BAL
DUAL
21 22 23 24 25
PD
20
MSEN
R_FDE
11 12 13 14 15 16 17 18 19
RESERVED1
10
R_FB
9
PLLVCC
8
PLLGND
7
PLLGND
6
PLLGND
5
PRE
4
PLLSEL
3
GND
2
PLLVCC
1
D12
A5P
32
GND
33
94
D13
93
D0
D14
D1
D16
A5M
D15
LVDSGND
34
D17
35
92
D19
91
D18
D3
D2
Figure 21. Transmitter-DS90C387R
See Package Number NEZ100A
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
25
DS90C387R
SNLS062G – NOVEMBER 2000 – REVISED JANUARY 2014
www.ti.com
REVISION HISTORY
Changes from Revision E (April 2013) to Revision F
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 25
Changes from Revision F (April 2013) to Revision G
•
26
Page
Page
Corrected the pin names in Figure 21 ................................................................................................................................ 25
Submit Documentation Feedback
Copyright © 2000–2014, Texas Instruments Incorporated
Product Folder Links: DS90C387R
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS90C387RVJD/NOPB
ACTIVE
TQFP
NEZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90C387RVJD
>B
DS90C387RVJDX/NOPB
ACTIVE
TQFP
NEZ
100
1000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-10 to 70
DS90C387RVJD
>B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Sep-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS90C387RVJDX/NOPB
Package Package Pins
Type Drawing
TQFP
NEZ
100
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
32.4
Pack Materials-Page 1
18.0
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
18.0
1.6
24.0
32.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Sep-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90C387RVJDX/NOPB
TQFP
NEZ
100
1000
367.0
367.0
55.0
Pack Materials-Page 2
MECHANICAL DATA
NEZ0100A
PFD0100A
TYPICAL
VJD100A (Rev C)
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Related manuals

Download PDF

advertising