Texas Instruments | DS90UA101-Q1 Multi-Channel Digital Audio Serializer (Rev. A) | Datasheet | Texas Instruments DS90UA101-Q1 Multi-Channel Digital Audio Serializer (Rev. A) Datasheet

Texas Instruments DS90UA101-Q1 Multi-Channel Digital Audio Serializer (Rev. A) Datasheet
DS90UA101-Q1
www.ti.com
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
DS90UA101-Q1 Multi-Channel Digital Audio Link
Check for Samples: DS90UA101-Q1
FEATURES
APPLICATIONS
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Digital Audio Serializer
Flexible Digital Audio Inputs, supporting I2S
(Stereo) or TDM (Multi-Channel) Formats
Coaxial or Single Differential Pair Interconnect
High Speed Serial Output Interface
Very Low Latency (<15µs)
Bidirectional Control Interface Channel with
I2C-Compatible Serial Control Bus
Supports up to 8 Stereo I2S or TDM Audio
Inputs
Supports Audio System Clocks from 10MHz to
50MHz
Single 1.8V Supply
1.8V or 3.3V I/O Interface
4/4 Dedicated General Purpose Inputs/Outputs
AC-Coupled STP or Coaxial Cable up to 15m
DC-Balanced & Scrambled Data w/ Embedded
Clock
Automotive Grade Product: AEC-Q100 Grade 2
Qualified
Temperature Range: -40°C to 105°C
ISO 10605 and IEC 61000-4-2 ESD Compliant
Automotive Infotainment Systems
Active Noise Cancellation Systems
Distributed Multi-Channel Audio Systems
DESCRIPTION
The DS90UA101-Q1 Serializer, in conjunction with
the DS90UA102-Q1 Deserializer, provides a solution
for distribution of digital audio in multi-channel audio
systems. It transmits a high-speed serialized interface
with an embedded clock over a single shielded
twisted pair or coaxial cable. The serial bus scheme
supports high speed forward data transmission and
low speed bidirectional control channel over the link.
Consolidation of digital audio, general-purpose IO,
and control signals over a single differential pair
reduces the interconnect size and weight, while also
reducing design challenges related to skew and
system latency.
The DS90UA101-Q1 Serializer embeds the clock and
level shifts the signals to high-speed low-voltage
differential signaling. The device serializes up to eight
digital audio data inputs, word/frame sync, bit clock,
and system clock.
Four dedicated general purpose input pins and four
general purpose output pins allow flexible
implementation of control and interrupt signals to and
from remote devices.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
DS90UA101-Q1
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
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Applications Diagrams
OSC
Digital Audio Interface
Digital Audio Interface
VDDIO
VDD
(1.8V) (1.8V or 3.3V)
VDD
(1.8V)
Serial Interface
50Q Coaxial, AC-Coupled
SCK
LRCK
BCK
DIN[7:0]
DOUT+
SCK
LRCK
BCK
DOUT[7:0]
RIN+
OEN
OSS_SEL
PDB
DS90UA102-Q1
Deserializer
LOCK
PASS
SCL
SDA
IDx
PDB
SCL
SDA
IDx
Digital Audio Interface
Digital Audio Interface
VDD
VDDIO
(1.8V or 3.3V) (1.8V)
VDD
VDDIO
(1.8V or 3.3V) (1.8V)
Analog In [3:0]
4-Channel
Audio ADC
Analog In [3:0]
TDM
I2S/TDM
DIN[7]
DOUT[7:0]
Audio
DACs
Power
Amplifiers
I2S
DIN[6]
Forward
Channel
FPD-Link
III
DIN[5]
DOUT+
RIN+
DOUTI2S/TDM
DSP
DS90UA101-Q1
LRCK
BCK
SCK
GPI[3:0]
GPO[3:0]
RIN-
Bi-Directional
Bidirectional
Back Channel
Control
Channel
DIN[4:0]
DS90UA102-Q1
OEN
OSS_SEL
PDB
LRCK
BCK
SCK
GPO[3:0]
GPIO[3:0]
««««
I2S
««««
4-Channel
Audio ADC
LRCK
BCK
SCK
Audio DAC or
DSP
GPO[3:0]
GPIO[3:0]
GPI[3:0]
GPO[3:0]
DS90UA101-Q1
Serializer
I2S Interface
Audio
Controller
or DSP
I2S Interface
VDDIO
(1.8V or 3.3V)
LOCK
PASS
PDB
IDx
SCL
SDA
IDx
SCL
SDA
Figure 1. Applications Diagrams
2
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Serializer
BCK
LRCK
Encoder
GPI
DIN
Input Latch
Block Diagram
RT
RT
DOUT-
GPO
PLL
PDB
IDx
SET
Encoder
Decoder
SCL
Timing and
Control
I2C Controller
SDA
Clock
Gen
FIFO
SCK
DOUT+
Figure 2. Block Diagram
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DIN6
DIN7
GPI0
GPI1
GPI2
GPI3
GPO0
GPO1
24
23
22
21
20
19
18
17
DS90UA101-Q1 Pin Diagram
VDDIO
25
16
GPO2
DIN5
26
15
GPO3
DIN4
27
14
VDDCML
VDDD
28
13
DOUT+
DIN3
29
12
DOUT-
DIN2
30
11
VDDT
DIN1
31
10
VDDPLL
9
PDB
DAP = GND
1
2
3
4
5
6
7
8
LRCK
SCK
SCL
SDA
IDx
RES0
SET
32
BCK
DIN0
DS90UA101-Q1
(Top View)
Figure 3. DS90UA101-Q1 — Top View
Pin Descriptions
Pin Name
Pin #
I/O, Type
Description
Digital Audio Interface
SCK
3
Input, LVCMOS w/ System clock input.
pull down
Forward channel audio data is clocked from this pin.
LRCK
2
Input, LVCMOS w/ Word clock input.
pull down
BCK
1
Input, LVCMOS w/ Bit clock input.
pull down
DIN[7:0]
23, 24, 26, 27,
29, 30, 31, 32
Inputs, LVCMOS
w/ pull down
Digital audio data inputs. Each input can be in I2S, TDM, LJ, or RJ format.
Inputs, LVCMOS
w/ pull down
General purpose inputs.
LVCMOS Parallel Interface
GPI[3:0]
19, 20, 21, 22
GPO[3:0]
15, 16, 17, 18
Outputs, LVCMOS General purpose outputs.
Control and Configuration
SCL
4
Input/Output, Open I2C clock line.
Drain
Must have an external pull-up to VDDIO. DO NOT FLOAT.
Recommended pull-up: 4.7 kΩ.
SDA
5
Input/Output, Open I2C data input/output line.
Drain
Must have an external pull-up to VDDIO. DO NOT FLOAT.
Recommended pull-up: 4.7 kΩ.
IDx
6
Input, Analog
Device I2C address select.
The IDx pin on the Serializer is used to assign its I2C device address. See Table 2. DO
NOT FLOAT.
SET
8
Input, Analog
Device SET.
Connect to external 10 kΩ pull-up to 1.8V rail and 100kΩ pull-down to GND. DO NOT
FLOAT.
4
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Pin Name
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
Pin #
PDB
I/O, Type
Description
9
Input, LVCMOS w/ Power down mode input pin.
pull down
PDB = H, device is enabled and is ON.
PDB = L, device is powered down.
When the device is in the powered down state, the transmitter outputs are both HIGH,
the PLL is shutdown, and IDD is minimized. Control registers are RESET.
DOUT+
13
Input/Output, LVDS True serial interface output.
The interconnection must be AC-coupled to this pin with a 0.1 µF capacitor.
DOUT-
12
Input/Output, LVDS Inverting serial interface output.
The interconnection must be AC-coupled to this pin with a 0.1 µF capacitor.
Serial Interface
Power and Ground
VDDPLL
10
Power
1.8V (±5%) PLL power.
VDDT
11
Power
1.8V (±5%) analog core power.
VDDCML
14
Power
1.8V (±5%) CML driver power.
VDDIO
25
Power
LVCMOS I/O power. 1.8V (±5%) or 3.3V (±10%).
VDDD
28
Power
1.8V (±5%) digital power.
DAP
Ground
DAP is the large metal contact located at the bottom center of the LLP package.
Connect to the GND plane with at least 9 vias.
7
Reserved
GND
Other
RES0
Reserved.
Connect to GND.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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ABSOLUTE MAXIMUM RATINGS (1)
−0.3V to +2.5V
Supply Voltage – VDDn (1.8V)
−0.3V to +4.0V
Supply Voltage – VDDIO
−0.3V to + (VDDIO + 0.3V)
LVCMOS I/O Voltage
−0.3V to +(VDDCML + 0.3V)
CML Driver I/O Voltage (VDDCML)
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
Maximum Package Power Dissipation Capacity
1/θJA °C/W above +25°
Package Derating:
DS90UA101-Q1 32L WQFN
θJA(based on 16 thermal vias)
38.4°C/W
θJC(based on 16 thermal vias)
6.9°C/W
ESD Rating (IEC 61000-4-2)
RD = 330Ω, CS = 150pF
Air Discharge
(DOUT+, DOUT-)
≥±25 kV
Contact Discharge
(DOUT+, DOUT-)
≥±7 kV
ESD Rating (ISO10605)
RD = 330Ω, CS = 150/330pF
ESD Rating (ISO10605)
RD = 2KΩ, CS = 150/330pF
Air Discharge
(DOUT+, DOUT–)
≥±15 kV
Contact Discharge
(DOUT+, DOUT-)
≥±8 kV
ESD Rating (HBM)
≥±8 kV
ESD Rating (CDM)
≥±1 kV
≥±250 V
ESD Rating (MM)
For soldering specifications:
(1)
see product folder at www.ti.com and www.ti.com/lit/an/snoa549c/snoa549c.pdf
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating
Conditions indicate conditions at which the device is functional; the device should not be operated beyond such conditions.
RECOMMENDED OPERATING CONDITIONS
Min
Nom
Max
Units
Supply Voltage (VDDn)
1.71
1.8
1.89
V
LVCMOS Supply Voltage (VDDIO)
OR
1.71
1.8
1.89
V
LVCMOS Supply Voltage (VDDIO)
3.0
3.3
3.6
V
VDDn (1.8V)
25
mVp-p
VDDIO (1.8V)
25
mVp-p
VDDIO (3.3V)
50
mVp-p
Supply Noise (1)
Operating Free Air Temperature (TA)
–40
+105
°C
SCK Clock Frequency (STP Cable)
10
50
MHz
SCK Clock Frequency (Coaxial Cable)
25
50
MHz
(1)
6
+25
Supply noise testing was done with minimum capacitors (as shown on Figure 32 and Figure 33 on the PCB. A sinusoidal signal is AC
coupled to the VDDn (1.8V) supply with amplitude = 25 mVp-p measured at the device VDDn pins. Bit error rate testing of input to the Ser
and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 1 MHz. The Des on the
other hand shows no error when the noise frequency is less than 750 kHz.
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ELECTRICAL CHARACTERISTICS
Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
LVCMOS DC SPECIFICATIONS 3.3V I/O (SER INPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH
High Level Input
Voltage
VIN = 3.0V to 3.6V
2.0
VIN
V
VIL
Low Level Input
Voltage
VIN = 3.0V to 3.6V
GND
0.8
V
IIN
Input Current
VIN = 0V or 3.6V
VIN = 3.0V to 3.6V
-20
+20
µA
VOH
High Level Output
Voltage
VDDIO = 3.0V to 3.6V
IOH = −4 mA
2.4
VDDIO
V
VOL
Low Level Output
Voltage
VDDIO = 3.0V to 3.6V
IOL = +4 mA
GND
0.4
V
IOS
Output Short Circuit
Current
VOUT = 0V
Serializer
GPO Outputs
IOZ
TRI-STATE Output
Current
PDB = 0V,
VOUT = 0V or VDD
LVCMOS Outputs
±1
-15
-20
mA
+20
µA
LVCMOS DC SPECIFICATIONS 1.8V I/O (SER INPUTS, GPI, GPO, CONTROL INPUTS AND OUTPUTS)
VIH
High Level Input
Voltage
VIN = 1.71V to 1.89V
VIL
Low Level Input
Voltage
IIN
0.65 VIN
VIN
VIN = 1.71V to 1.89V
GND
0.35 VIN
Input Current
VIN = 0V or 1.89V
VIN = 1.71V to 1.89V
-20
VOH
High Level Output
Voltage
VDDIO = 1.71V to 1.89V
IOH = −4 mA
IOS
Output Short Circuit
Current
VOUT = 0V
Serializer
GPO Outputs
IOZ
TRI-STATE Output
Current
PDB = 0V,
VOUT = 0V or VDD
LVCMOS Outputs
V
±1
VDDIO 0.45
+20
µA
VDDIO
V
-11
-20
mA
+20
µA
340
412
mV
50
mV
CML DRIVER DC SPECIFICATIONS (DOUT+, DOUT-)
|VOD|
Output Differential
Voltage
RL = 100Ω (Figure 8)
ΔVOD
Output Differential
Voltage Unbalance
RL = 100Ω
1
VOS
Output Differential
Offset Voltage
RL = 100Ω
(Figure 8)
VDD VOD/2
ΔVOS
Offset Voltage
Unbalance
RL = 100Ω
1
IOS
Output Short Circuit
Current
DOUT± = 0V
RT
Differential Internal
Differential across DOUT+ and DOUTTermination Resistance
80
100
120
Single-ended
DOUT+ or DOUT–
Termination Resistance
40
50
60
(1)
(2)
(3)
268
V
50
-26
mV
mA
Ω
The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise
modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not
verified.
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
Typical values represent most likely parametric norms at 1.8V or 3.3V, TA = +25°C, and at the Recommended Operation Conditions at
the time of product characterization and are not verified.
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ELECTRICAL CHARACTERISTICS
(continued)
Over recommended operating supply and temperature ranges unless otherwise specified.(1)(2)(3)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VDDIO = 1.89V
f = 50 MHz
Default Registers
1.5
3
VDDIO = 3.6V
f = 50 MHz
Default Registers
5
8
VDDIO = 1.8V
f = 24.576 MHz
Default Registers
1.5
VDDIO 1.8V
f = 12.288 MHz
Default Registers
1.5
VDDIO = 3.3V
f = 24.576 MHz
Default Registers
5
VDDIO = 3.3V
ƒ = 12.288 MHz
Default Registers
5
RL = 100Ω
WORST CASE Pattern
(Figure 5)
VDDn = 1.89V,
VDDIO = 3.6V
f = 50 MHz
Default Registers
61
RL = 100Ω
Random Pattern
VDDn = 1.8V,
VDDIO = 3.3V
f = 24.576 MHz
Default Registers
51
VDDn = 1.8V,
VDDIO = 3.3V
f = 12.288 MHz
Default Registers
49
VDDIO = 1.89V
Default Registers
300
1000
µA
VDDIO = 3.6V
Default Registers
300
1000
µA
VDDIO = 1.89V
Default Registers
15
100
µA
VDDIO = 3.6V
Default Registers
15
100
µA
SUPPLY CURRENT, DIGITAL, PLL, AND ANALOG VDD
IDDIOT
Serializer (Tx) VDDIO
Supply Current
(includes load current)
RL = 100Ω
WORST CASE Pattern
(Figure 5)
RL = 100Ω
Random Pattern
IDDT
IDDTZ
IDDIOTZ
8
Serializer (Tx) VDDn
Core Supply Current
Serializer (Tx) Supply
Current Power-down
Serializer (Tx) VDDIO
Supply Current Powerdown
PDB = 0V; All other
LVCMOS Inputs = 0V
PDB = 0V; All other
LVCMOS Inputs = 0V
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mA
80
mA
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ELECTRICAL CHARACTERISTICS:
Recommended Timing for SCK
Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3) (4)
Symbol
tTCP
Parameter
Transmit Clock Period
Min
Typ
Max
STP Cable
Conditions
SCK
Pin
20
T
100
Coaxial Cable
SCK
20
T
40
0.4
0.5
0.6
T
0.4
0.5
0.6
T
0.05
0.25
0.3
T
tTCIH
Transmit Clock Input High
Time
ƒ = 10 MHz – 50 MHz
SCK
tTCIL
Transmit Clock Input Low
Time
ƒ = 10 MHz – 50 MHz
SCK
tCLKT
SCK Input Transition Time ƒ = 10 MHz – 50 MHz
(Figure 9)
SCK
tJIT0
SCK Input Jitter
SCK
(1)
(2)
(3)
(4)
Refer to
Jitter freq>ƒ/40, ƒ = 10 MHz –
50 MHz
Units
0.1
ns
T
The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise
modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not
verified.
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
Typical values represent most likely parametric norms at 1.8V or 3.3V, TA = +25°C, and at the Recommended Operation Conditions at
the time of product characterization and are not verified.
Recommended Input Timing Requirements are input specifications and not tested in production.
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ELECTRICAL CHARACTERISTICS:
Serializer Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified. (1) (2) (3)
Typ
Max
Units
tLHT
Symbol
CML Low-to-High Transition
Time
Parameter
RL = 100Ω (Figure 6)
150
330
ps
tHLT
CML High-to-Low Transition
Time
RL = 100Ω (Figure 6)
150
330
ps
tDIS
Data Input Setup to SCK
tDIH
Data Input Hold from SCK
Serializer Data Inputs
(Figure 10)
tPLD
Serializer PLL Lock Time
tSD
Serializer Delay
tJIND
(5)
Serializer Output
Deterministic Jitter
Conditions
RL = 100Ω
Min
2
ns
2
ns
(4) (5)
, (Figure 11)
RT = 100Ω
Register 0x03h b[0] (TRFB = 1)
(Figure 12)
Serializer output intrinsic deterministic
jitter . Measured (cycle-cycle) with
PRBS-7 test pattern
11.75T
1
2
ms
13T
15T
ns
0.13
UI
0.04
UI
0.396
UI
(3) (6)
tJINR
tJINT
Serializer Output Random
Jitter
Serializer output intrinsic random jitter
(cycle-cycle). Alternating-1,0 pattern.
Peak-to-peak Serializer
Output Jitter
Serializer output peak-to-peak jitter
includes deterministic jitter, random
jitter, and jitter transfer from Serializer
input. Measured (cycle-cycle) with
PRBS-7 test pattern.
(3) (6)
(3) (6)
λSTXBW
Serializer Jitter Transfer
Function -3 dB Bandwidth (7)
SCK = 50MHz
2.2
δSTX
Serializer Jitter Transfer
Function (Peaking) (7)
SCK = 50MHz
1.16
δSTXf
Serializer Jitter Transfer
Function (Peaking
Frequency) (7)
SCK = 50MHz
600
(1)
(2)
(3)
(4)
(5)
(6)
(7)
10
MHz
dB
kHz
The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise
modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not
verified.
Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
Typical values represent most likely parametric norms at 1.8V or 3.3V, TA = +25°C, and at the Recommended Operation Conditions at
the time of product characterization and are not verified.
tPLD and tDDLT is the time required by the Serializer and Deserializer to obtain lock when exiting power-down state with an active SCK.
Specification is verified by design.
UI – Unit Interval is equivalent to one ideal serialized data bit width. The UI scales with SCK frequency.
Specification is by characterization and is not tested in production.
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BIDIRECTIONAL CONTROL BUS TIMING SPECIFICATIONS
Bidirectional Control Bus: AC Timing Specifications (SCL, SDA) - I2C Compliant
Over recommended supply and temperature ranges unless otherwise specified. (Figure 4)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
Standard Mode
100
kHz
Fast Mode
400
kHz
Recommended Input Timing Requirements
fSCL
SCL Clock Frequency
tLOW
SCL Low Period
Standard Mode
4.7
µs
Fast Mode
1.3
µs
Standard Mode
4.0
µs
tHIGH
SCL High Period
Fast Mode
0.6
µs
tHD:STA
Hold time for a start or a repeated start
condition
Standard Mode
4.0
µs
Fast Mode
0.6
µs
tSU:STA
Set Up time for a start or a repeated
start condition
Standard Mode
4.7
µs
Fast Mode
0.6
tHD:DAT
Data Hold Time
tSU:DAT
Data Set Up Time
tSU:STO
Set Up Time for STOP Condition
tBUF
Bus Free time between Stop and Start
tr
SCL & SDA Rise Time
tf
SCL & SDA Fall Time
µs
Standard Mode
0
3.45
µs
Fast Mode
0
900
ns
Standard Mode
250
Fast Mode
100
ns
ns
Standard Mode
4.0
µs
Fast Mode
0.6
µs
Standard Mode
4.7
µs
Fast Mode
1.3
µs
Standard Mode
1000
ns
Fast Mode
300
ns
Standard Mode
300
ns
Fast Mode
300
ns
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Bidirectional Control Bus: DC Timing Specifications (SCL, SDA) - I2C Compliant (1)
Over recommended supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Units
VDDIO
V
Recommended Input Timing Requirements
VIH
Input High Level
SDA and SCL
0.7*VDDIO
VIL
Input Low Level
SDA and SCL
GND
VHY
Input Hysteresis
VOL
Output Low Level
SDA, IOL=0.5mA
IIN
Input Current
SDA or SCL, VIN=VDDIO OR GND
tR
SDA Rise Time-READ
430
ns
tF
SDA Fall Time-READ
SDA, RPU = 10kΩ, Cb ≤
400pF(Figure 4)
20
ns
tSU;DAT
(Figure 4)
560
ns
tHD;DAT
(Figure 4)
615
ns
tSP
CIN
(1)
12
0.3*VDDIO
>50
SDA or SCL
0
-10
V
mV
0.4
V
10
µA
50
ns
<5
pF
Specification is verified by design.
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TIMING AND CIRCUIT DIAGRAMS
SDA
tf
tHD;STA
tLOW
tBUF
tr
tf
tr
SCL
tSU;STA
tHD;STA
tHIGH
tSU;STO
tSU;DAT
tHD;DAT
START
STOP
REPEATED
START
START
Figure 4. Bidirectional Control Bus Timing
T
SCK
(RFB = H)
DIN[7:0]
Figure 5. "Worst Case" Test Pattern
80%
Vdiff
80%
20%
Vdiff = 0V
20%
tLHT
tHLT
Vdiff = (DOUT+) - (DOUT-)
Figure 6. Serializer CML Output Transition Times
0.1 µF
DOUT+
50Q
ZDiff = 100Q
SCOPE
BW 8 4.0 GHz
100Q
50Q
DOUT-
0.1 µF
Figure 7. Serializer CML Output Load
Single-Ended
§
DOUTV
V
VOD
OD+
VOS
OD-
DOUT+
Differential
V
OD+
(DOUT+) - (DOUT-)
0V
V
OD-
Figure 8. Serializer VOD and Differential Diagram
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80%
VDD
80%
SCK
20%
20%
tCLKT
0V
tCLKT
Figure 9. Serializer Input Clock Transition Times
tTCP
SCK
VDDIO/2
tDIS
VDDIO/2
VDDIO/2
tDIH
VDDIO
DIN[7:0] VDDIO/2
Setup
Hold
VDDIO/2
0V
Figure 10. Serializer Setup/Hold Times
PDB
VDDIO/2
SCK
tPLD
DOUT±
Output Active
TRI-STATE
TRI-STATE
SYMBOL N+2
SYMBOL N+3
§ §
SYMBOL N+1
§ §
SYMBOL N
§ §
DIN[7:0]
§ §
Figure 11. Serializer PLL Lock Time
tSD
VDDIO/2
SYMBOL N-2
SYMBOL N-1
§ §
§ §
SYMBOL N
0V
§ §
SYMBOL N-3
§ §
§ §
§
§
SYMBOL N-4
DOUT±
§
§
SCK
Figure 12. Serializer Delay
Ew
VOD (+)
EH
0V
EH
VOD (-)
tBIT (1 UI)
Figure 13. CML Output Driver
14
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DS90UA101-Q1 REGISTER INFORMATION
The table below contains information on the DS90UA101-Q1 control registers. These registers are accessible
locally via the I2C control interface, or remotely via the Bidirectional Control Channel. Addresses not listed are
reserved. Fields listed as reserved should not be changed from the listed default value.
Addr
(Hex)
Name
Bits
Field
R/W
Default
(Hex)
0x00
I2C Device ID
7:1
DEVICE ID
RW
0xB0
0
SER ID SEL
RW
7
RSVD
6
RDS
RW
Digital output drive strength.
1: High drive strength.
0: Low drive strength.
5
VDDIO Control
RW
Auto voltage control.
1: Enable (auto-detect mode).
0: Disable.
4
VDDIO Mode
RW
VDDIO voltage set.
1: Sets VDDIO mode to 3.3V.
0: Sets VDDIO mode to 1.8V.
3
ANAPWDN
RW
This register can be set only through local I2C access.
1: Analog power-down: Powers down the analog block in
the Serializer.
0: Analog power-up: Powers up the analog block in the
Serializer.
2
RSVD
1
Digital Reset 1
RW
1: Resets the digital block except for register values. This
bit is self-clearing.
0: Normal operation.
0
Digital Reset 0
RW
1: Resets the entire digital block including all register
values. This bit is self-clearing.
0: Normal operation.
0x01
Power and Reset
Description
7-bit address of Serializer.
0x58'h (0101_100X'b) default.
0: Serializer DEVICE ID is from IDx.
1: Register I2C DEVICE ID overrides IDx.
0x30
Reserved.
Reserved.
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Addr
(Hex)
0x03
0x06
16
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Bits
Field
General
Configuration
7
RX CRC Checker RW
Enable
6
TX Parity
RW
Generator Enable
Forward channel Parity Generator enable.
1: Enable.
0: Disable.
5
CRC Error Reset
Clear CRC error counters.
This bit is NOT self-clearing.
1: Clear counters.
0: Normal operation.
4
I2C Remote Write RW
Auto
Acknowledge
Automatically acknowledge I2C remote writes.
This mode should only be used when the system is
LOCKED.
1: Enable: When enabled, I2C writes to the Deserializer
(or any remote I2C slave, if I2C Pass All is enabled) are
immediately acknowledged without waiting for the
Deserializer to acknowledge the write. The accesses are
then remapped to the address specified in 0x06.
0: Disable.
3
I2C Pass All
RW
Pass-through all I2C transactions. For an explanation of
I2C pass-through, refer to I2C Pass-Through and Multiple
Device Addressing.
1: Enable pass-through of all I2C accesses to I2C IDs that
do not match the Serializer I2C ID. The I2C accesses are
then remapped to the address specified in register 0x06.
0: Enable pass-through only of I2C accesses to I2C IDs
matching either the remote Deserializer I2C ID or the
remote slave I2C ID.
2
I2C Pass-Through RW
I2C pass-through mode.
1: Pass-through enabled. Refer to I2C Pass-Through and
Multiple Device Addressing.
0: Pass-through disabled.
1
RSVD
RW
Reserved.
0
TRFB
RW
SCK clock edge select.
1: Parallel interface data is strobed on the rising clock
edge.
0: Parallel interface data is strobed on the falling clock
edge.
7:1
Deserializer
Device ID
RW
This field stores the 7-bit I2C address of the remote
Deserializer. If an I2C transaction (originating from the
Serializer side) is addressed to DES Alias, the
transaction will be remapped to this address before it is
passed across the Bidirectional Control Channel to the
remote Deserializer.
This field is automatically configured by the Bidirectional
Control Channel once RX LOCK has been detected.
Software may overwrite this value, but the Freeze Device
ID bit should also be asserted to prevent overwriting by
the Bidirectional Control Channel.
A value of 0 in this field disables I2C access to the
remote Deserializer. Refer to I2C Pass-Through and
Multiple Device Addressing.
0
Freeze Device ID
RW
Freeze Deserializer Device ID.
1: Prevents auto-loading of the Deserializer Device ID
from the back channel. The ID will be frozen at the value
written.
0: Allows auto-loading of the Deserializer Device ID from
the back channel.
DES ID
R/W
Default
(Hex)
Name
RW
0xC5
Description
Back channel CRC Checker enable.
1:Enable.
0:Disable.
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Addr
(Hex)
Name
Bits
Field
R/W
Default
(Hex)
0x07
DES Alias
7:1
Deserializer Alias
ID
RW
0x00
0
RSVD
0x08
Slave ID
7:1
Slave ID
RW
0x00
0
RSVD
7:1
Slave Alias ID
Description
This field stores a 7-bit I2C address. Once set, it
configures the Serializer to accept any transaction
designated for the I2C address stored in this field. The
transaction will then be remapped to the I2C address
specified in the DES ID register.
A value of 0 in this field disables I2C access to the
remote Deserializer. Refer to I2C Pass-Through and
Multiple Device Addressing.
Reserved.
This field stores the 7-bit I2C address of the remote slave
attached to the remote Deserializer. If an I2C transaction
(originating from the Serializer side) is addressed to
Slave Alias, the transaction will be remapped to this
address before it is passed across the Bidirectional
Control Channel to the remote Deserializer, where it is
then passed to the remote slave.
A value of 0 in this field disables I2C access to the
remote slave. Refer to I2C Pass-Through and Multiple
Device Addressing.
Reserved.
RW
0x00
This field stores a 7-bit I2C address. Once set, it
configures the Serializer to accept any transaction
designated for the I2C address stored in this field. The
transaction will then be remapped to the I2C address
specified in the Slave ID register.
A value of 0 in this field disables I2C access to the
remote slave. Refer to I2C Pass-Through and Multiple
Device Addressing.
0x09
Slave Alias
0
RSVD
0x0A
CRC Errors
7:0
CRC Error Byte 0 R
0x00
Number of back-channel CRC errors during normal
operation.
Least significant byte.
0x0B
CRC Errors
7:0
CRC Error Byte 1 R
0x00
Number of back-channel CRC errors during normal
operation.
Most significant byte.
0x0C
General Status
7:5
Rev-ID
R
Revision ID.
0x00: Production.
4
RX Lock Detect
R
1: RX LOCKED.
0: RX not LOCKED.
3
BIST CRC Error
Status
R
1: CRC errors in BIST mode.
0: No CRC errors in BIST mode.
2
SCK Detect
R
1: Valid SCK detected.
0: Valid SCK not detected.
1
DES Error
R
1: CRC error is detected during communication with the
Deserializer.
This bit is cleared upon loss of link or assertion of CRC
Error Reset bit in register 0x03[5].
0: No errors detected.
0
Link Detect
R
1: Cable link detected.
0: Cable link not detected.
This includes any of the following faults:
— Cable open.
— '+' and '-' shorted.
— Short to GND.
— Short to battery.
Reserved.
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Addr
(Hex)
0x0D
0x0E
18
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Name
Bits
Field
R/W
Default
(Hex)
GPO3 and GPO2
Configuration
7
GPO2 Output
Value
RW
0x55
6
GPO2 Remote
Enable
RW
Remote GPO2 control:
1: Enable GPO2 control from the remote Deserializer.
The GPO2 pin needs to be an output, and the value is
received from the remote Deserializer.
0: Disable GPO2 control from the remote Deserializer.
5
GPO2 Direction
RW
Local GPO2 direction:
1: Input.
0: Output.
4
GPO2 Enable
RW
GPO2 enable:
1: Enable GPO2 operation.
0: TRI-STATE.
3
GPO3 Output
Value
RW
Local GPO3 Output Value. This value is output on the
GPO3 pin when GPO3 is enabled, the local GPO3
direction is set to output, and remote GPO3 control is
disabled.
2
GPO3 Remote
Enable
RW
Remote GPO3 control:
1: Enable GPO3 control from the remote Deserializer.
The GPO3 pin needs to be an output, and the value is
received from the remote Deserializer.
0: Disable GPO3 control from the remote Deserializer.
1
GPO3 Direction
RW
Local GPO3 direction:
1: Input.
0: Output.
0
GPO3 Enable
RW
GPO3 enable:
1: Enable GPO3 operation.
0: TRI-STATE.
7
GPO0 Output
Value
RW
6
GPO0 Remote
Enable
RW
Remote GPO0 control:
1: Enable GPO0 control from the remote Deserializer.
The GPO0 pin needs to be an output, and the value is
received from the remote Deserializer.
0: Disable GPO0 control from the remote Deserializer.
5
GPO0 Direction
RW
Local GPO0 direction:
1: Input.
0: Output.
4
GPO0 Enable
RW
GPO0 enable:
1: Enable GPO0 operation.
0: TRI-STATE.
3
GPO1 Output
Value
RW
Local GPO1 Output Value. This value is output on the
GPO1 pin when GPO1 is enabled, the local GPO1
direction is set to output, and remote GPO1 control is
disabled.
2
GPO1 Remote
Enable
RW
Remote GPO1 control:
1: Enable GPO1 control from the remote Deserializer.
The GPO1 pin needs to be an output, and the value is
received from the remote Deserializer.
0: Disable GPO1 control from the remote Deserializer.
1
GPO1 Direction
RW
Local GPO1 direction:
1: Input.
0: Output.
0
GPO1 Enable
RW
GPO1 enable:
1: Enable GPO1 operation.
0: TRI-STATE.
GPO1 and GPO0
Configuration
0x35
Description
Local GPO2 Output Value. This value is output on the
GPO2 pin when GPO2 is enabled, the local GPO2
direction is set to output, and remote GPO2 control is
disabled.
Local GPO0 Output Value. This value is output on the
GPO0 pin when GPO0 is enabled, the local GPO0
direction is set to output, and remote GPO0 control is
disabled.
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Addr
(Hex)
Name
0x0F
I2C Master Config 7:5
0x10
I2C Control
Bits
Field
R/W
RSVD
Default
(Hex)
0x00
Description
Reserved.
4:3
SDA Output
Delay
RW
SDA output delay. This field configures the output delay
on the SDA output. Setting this value will increase the
output delay in units of 50ns. Nominal output delay
values for SCL to SDA are:
00: 350 ns
01: 400 ns
10: 450 ns
11: 500 ns
2
Local Write
Disable
RW
Disable remote writes to local registers. Setting this bit to
1 will prevent remote writes to local device registers from
across the control channel. This prevents writes to the
Serializer registers from an I2C Master attached to the
Deserializer. Setting this bit does not affect remote
access to I2C slaves at the Serializer.
1
I2C Bus Timer
Speed Up
RW
Speed up I2C bus Watchdog Timer.
1: Watchdog Timer expires after approximately 50
microseconds.
0: Watchdog Timer expires after approximately 1 second.
0
I2C Bus Timer
Disable
RW
The I2C Watchdog Timer may be used to detect when the
I2C bus is free or hung up following an invalid termination
of a transaction. If SDA is high and no signaling occurs
for approximately 1 second, the I2C bus is assumed to be
free. If SDA is low and no signaling occurs, the device
will attempt to clear the bus by driving 9 clocks on SCL.
1. Disable the I2C bus Watchdog Timer.
0: Enable the I2C bus Watchdog Timer.
7
RSVD
0x17
2
Reserved.
6:4
I C SDA Hold
Time
RW
Internal SDA hold time. This field configures the amount
of internal hold time provided for the SDA input relative to
the SCL input. Units are 50ns.
3:0
I2C Filter Depth
RW
I2C glitch filter depth. This field configures the maximum
width of glitch pulses on the SCL and SDA inputs that will
be rejected. Units are 10 ns.
0x11
SCL High Time
7:0
SCL High Time
RW
0x82
I2C Master SCL high time. This field configures the high
pulse width of the SCL output when the Serializer is the
Master on the local I2C bus. Units are 50 ns for the
nominal oscillator clock frequency. The default value is
set to satisfy a minimum (4µs + 1µs of rise time for cases
where rise time is very fast) SCL high time with the
internal oscillator clock running at 26 MHz rather than the
nominal 20MHz.
0x12
SCL Low Time
7:0
SCL Low Time
RW
0x82
I2C Master SCL low time. This field configures the low
pulse width of the SCL output when the Serializer is the
Master on the local I2C bus. This value is also used as
the SDA setup time by the I2C slave for providing data
prior to releasing SCL during accesses over the
Bidirectional Control Channel. Units are 50 ns for the
nominal oscillator clock frequency. The default value is
set to satisfy a minimum (4.7µs + 0.3µs of fall time for
cases where fall time is very fast) SCL low time with the
internal oscillator clock running at 26 MHz rather than the
nominal 20MHz.
0x13
General Purpose
Control
7:0
GPCR[7:0]
RW
0x00
Scratch register. Used to write and read 8 bits.
0x14
BIST Control
7:3
RSVD
0x00
Reserved.
Clock Source
RW
Allows the choosing of different internal oscillator clock
frequencies for forward channel frame.
The internal oscillator clock frequency is used when SCK
is idle or missing. See Table 1 for these settings.
RSVD
RW
Reserved.
2:1
0
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Addr
(Hex)
0x1E
0x2A
20
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Name
Bits
Field
BCC Watchdog
Control
7:1
BCC Watchdog
Timer
RW
0
BCC Watchdog
Timer Disable
RW
7:0
BIST Mode CRC
Errors Count
R
CRC Errors
R/W
Default
(Hex)
0xFE
Description
The BCC Watchdog Timer allows termination of a control
channel transaction if it fails to complete within a
programmed amount of time. This field sets the
Bidirectional Control Channel Watchdog timeout value in
units of 2ms. This field should not be set to 0.
Bidirectional Control Channel Watchdog Timer enable.
1: Disables BCC Watchdog Timer operation.
0: Enables BCC Watchdog Timer operation.
0x00
Number of CRC errors in the back channel when in BIST
mode.
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FUNCTIONAL DESCRIPTION
The DS90UA101-Q1/DS90UA102-Q1 chipset is intended to link digital audio sources with remote audio
converters and DSPs. The chipset can operate from a reference clock of 10 MHz to 50 MHz. The DS90UA101Q1 device serializes up to 8 audio inputs and 4 general purpose inputs, along with a bidirectional control
channel, into a single high-speed differential pair or single-ended coaxial cable. The high-speed serial bit stream
contains an embedded clock and DC-balanced information to enhance signal quality and support AC coupling.
The DS90UA102-Q1 device receives the single serial data stream and converts it back to digital audio outputs,
control channel data, and general purpose outputs (GPOs). The DS90UA101-Q1/DS90UA102-Q1 chipset can
accept up to 8 audio data inputs, bit clock (BCK), word clock (LRCK), and an input reference clock (SCK) ranging
from 10 MHz to 50 MHz.
The control channel function of the chipset provides bidirectional communication between the two ends of the
link, such as a digital signal processor (DSP) on one end and an audio digital-analog converter (DAC) on the
other. The integrated Bidirectional Control Channel transfers data bidirectionally over the same differential pair
used for audio data interface. This interface offers advantages over other chipsets by eliminating the need for
additional wires for programming and control. The Bidirectional Control Channel bus is controlled via an I2C port,
available on both the Serializer and Deserializer.
Transmission Media
The DS90UA101-Q1/DS90UA102-Q1 chipset is intended to be used in a point-to-point data link through a
shielded twisted pair (STP) or coaxial (coax) cable. The Serializer and Deserializer provide internal termination to
minimize impedance discontinuities. The interconnect (cable and connectors) should have a differential
impedance of 100Ω, or a single-ended impedance of 50Ω. The maximum length of cable that can be used is
dependent on the quality of the cable (gauge, impedance), connector, board (discontinuities, power plane), and
the electrical environment (e.g power stability, ground noise, input clock jitter, SCK frequency, etc). The resulting
signal quality at the receiving end of the transmission media may be assessed by monitoring the differential eye
opening of the serial data stream. This can be done by measuring the output of the CMLOUTP/N pins. These
pins should each be terminated with a 0.1 µF capacitor in series with a 50Ω resistor to GND. Figure 13 illustrates
the minimum eye width and eye height that is necessary for bit error free operation.
Operation with Audio System Clock as Reference Clock
The DS90UA101-Q1/DS90UA102-Q1 chipset is operated using the audio system clock (SCK) from the digital
audio source. The audio data, LRCK, and BCK inputs are clocked into the Serializer using SCK. Up to 4 GPI
inputs are also sampled and transported along with the digital audio inputs. Figure 14 shows the operation of the
Serializer and Deserializer with the reference clock.
Serializer
Deserializer
Forward Channel
DOUT+
RIN+
DOUT[7:0]
DIN[7:0]
LRCK
LRCK
DOUT-
BCK
Bidirectional
Control Channel
SDA
DSP
BCK
RIN-
SCL
SCK
GPI[3:0]
GPO[3:0]
GPO[3:0]
GPIO[3:0]
SCK
DAC
SDA
PLL
SCL
REF
Figure 14. Operation with SCK Reference
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The Serializer switches over to an internal reference clock when SCK is idle or missing. This frequency is
selectable via the device control registers, as shown below (Table 1).
Table 1. Internal Oscillator Frequencies for Forward Channel Frame during Normal Operation
DS90UA101-Q1
Reg 0x14 [2:1]
Frequency (MHz)
00
~25
01
~50
10
~25
11
~12.5
SET Pin on Serializer
The SET pin on the Serializer sets the internal configuration of the part for audio sources with SCK in the range
of 10 MHz to 50MHz. It requires a 10 kΩ pull-up resistor to 1.8V, and a 100 kΩ pull-down resistor to GND. The
recommended resistor tolerance is 1% (Figure 15).
1.8V
10kQ
SET
100kQ
Serializer
Figure 15. SET Pin configuration on DS90UA101-Q1
Line Rate Calculations for the DS90UA101-Q1/DS90UA102-Q1
The following formula is used to calculate the line rate for the DS90UA101-Q1/DS90UA102-Q1 chipset:
• Line rate = ƒSCK * 28
Serial Frame Format
For example, for maximum line rate, ƒSCK = 50 MHz, line rate = 50 * 28 = 1.4 Gbps.
The high-speed forward channel is composed of 28 bits of data containing digital audio data, sync signals, I2C
and parity bits. This data payload is optimized for signal transmission over an AC-coupled link. Data is
randomized, balanced and scrambled. The Bidirectional Control Channel data is transferred over the single serial
link along with the high-speed forward data. This architecture provides a full duplex, low-speed control path
across the serial link together with the high speed forward channel.
Serial Audio Formats
There are several de-facto industry standards or formats that define the required alignments and signal polarities
between the left/right clock (LRCK), bit clock (BCK), and the serial audio data. Hence, this section is dedicated to
discussing various serial audio formats.
I2S Format
An I2S bus uses three signal lines for data transfer – a frame or word clock (LRCK), a bit clock (BCK), and a
single or multiple data lines. The device which generates the appropriate BCK and LRCK signals on the bus is
called Master, whereas other devices which accept BCK and LRCK as inputs are all slaves.
22
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Bit Clock (BCK)
The bit clock pulses once for each discrete bit of data on the data lines. The bit clock frequency must be greater
than or equal to the product of the sample rate, the number of bits per sample and the number of channels
(which is 2 in normal stereo operation).
Word Select (LRCK)
The word select line indicates the channel being transmitted:
• LRCK = 0; channel 1 (left);
• LRCK = 1; channel 2 (right).
The LRCK line changes one clock period before the MSB is transmitted (Figure 16). This allows the slave
transmitter to derive synchronous timing of the serial data that will be set up for transmission. Furthermore, it
enables the receiver to store the previous word and clear the input for the next word.
Serial Data (DATA)
Serial data is transmitted in two’s complement with the MSB first (as shown in Figure 16). The MSB is
transmitted first because the transmitter and receiver may have different word lengths.
If the receiver is sent more bits than its word length, the bits after the LSB are ignored. On the other hand, if the
receiver is sent fewer bits than its word length, the missing bits are set to zero internally. And so, the MSB has a
fixed position, whereas the position of the LSB depends on the word length.
Serial data sent by the transmitter may be synchronized with either the trailing (HIGH-to-LOW) or the leading
(LOW-to-HIGH) edge of the clock signal. However, the serial data must be latched into the receiver on the
leading edge of the serial clock signal, and so there are some restrictions when transmitting data that is
synchronized with the leading edge.
LEFT Channel Data
LRCK
RIGHT Channel Data
BCK
DIN
2
MSB
1
0
2
LSB
MSB
1
0
LSB
2
Figure 16. Stereo I S Format
Left Justified Format
In this format, MSB of the word appears in synchronization with the LRCK edges. Unlike in I2S mode, there is no
lag between Data and LRCK. Left channel data word begins at falling edge of LRCK and right channel data word
begins on rising edge of the LRCK signal. Hence, as can be seen from below waveforms (Figure 17), data
appears to be left justified.
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RIGHT Channel Data
LRCK
LEFT Channel Data
BCK
DIN
2
MSB
1
0
2
LSB
MSB
1
0
N
LSB
Figure 17. Left-Justified Format
Right Justified Format
In this format, LSB of the word appears just before the LRCK edges. Left channel data word may begin at any
point depending upon the word length, but LSB of this data word must appear just before the rising edge of the
LRCK signal. Similarly, LSB of the right channel data word must appear just before falling edge of the LRCK
signal. Hence, as can be seen from below waveforms (Figure 18), data appears to be right justified.
LRCK
RIGHT Channel Data
LEFT Channel Data
BCK
DIN
0
2
MSB
1
0
LSB
2
MSB
1
0
LSB
Figure 18. Right-Justified Format
TDM Format
There are no well defined rules for TDM format and it can be implemented in large number of ways depending
upon the word length, bit clock, number of channels to be multiplexed, etc. For example, let’s assume that word
clock signal (LRCK) period = 256 * bit clock (BCK) time period. In this case, we can multiplex 4 channels with
maximum word length of 64 bits each, or 8 channels with maximum word length of 32 bits each. Figure 19
illustrates the multiplexing of 8 channels with 24 bit word length, in a format similar to I2S.
Pulse width of LRCK can be used to define a clock period for BCK or to define a slot period, i.e., the period for
which individual channel can be active on the shared data line.
If the number of audio channels is more than 8, DS90UA101-Q1/DS90UA102-Q1 can easily support multiplexed
data with additional devices to multiplex and de-multiplex the data. The number of channels multiplexed on each
data line must be selected as a power of 2, for example, 2/ 4/ 8.
24
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t1/fS (256 BCKs at Single Rate, 128 BCKs at Dual Rate)t
LRCK
BCK
I2S Mode
DIN1
(Single)
Ch 1
t32 BCKst
Ch 2
t32 BCKst
Ch 3
t32 BCKst
Ch 4
t32 BCKst
Ch 5
t32 BCKst
Ch 6
t32 BCKst
Ch 7
t32 BCKst
Ch 8
t32 BCKst
23 22
23 22
23 22
23 22
23 22
23 22
23 22
23 22
0
0
0
0
0
0
0
0
23 22
Figure 19. TDM Format
Error Detection
The chipset provides error detection operations for validating data integrity in long distance transmission and
reception. The data error detection function offers users flexibility and usability of performing bit-by-bit data
transmission error checking. The error detection operating modes support data validation of the following signals:
• Bidirectional Control Channel data across the serial link
• Parallel audio/sync data across the serial link
The chipset provides 1 parity bit on the forward channel and 4 CRC bits on the back channel for error detection
purposes. The DS90UA101-Q1/DS90UA102-Q1 chipset checks the forward and back channel serial links for
errors and stores the number of detected errors in two 8-bit registers in the Serializer and the Deserializer,
respectively.
To check parity errors on the forward channel, monitor registers 0x1A and 0x1B on the Deserializer. If there is a
loss of LOCK, then the counters on registers 0x1A and 0x1B are reset. Whenever there is a parity error on the
forward channel, the PASS pin will go low momentarily.
To check CRC errors on the back-channel, monitor registers 0x0A and 0x0B on the Serializer.
Bidirectional Control Bus and I2C
S
Register
Address
Slave
Address
7-bit Address
Bus Activity:
Slave
S
0
A
C
K
N
A
C
K
Slave
Address
7-bit Address
A
C
K
Stop
SDA Line
Start
Bus Activity:
Master
Start
The I2C compatible interface allows programming of the Serializer, Deserializer, or an external remote device
through the Bidirectional Control Channel. For example, an audio module connected to the Deserializer can
communicate with the ADC connected to the Serializer using the Bidirectional Control Channel. Register
programming transactions to/from the chipset are employed through the clock (SCL) and data (SDA) lines. These
two signals have open drain I/Os and both lines must be pulled-up to VDDIO by an external resistor. Pull-up
resistors or current sources are required on the SCL and SDA busses to pull them high when they are not being
driven low. A logic LOW is transmitted by driving the output low. Logic HIGH is transmitted by releasing the
output and allowing it to be pulled-up externally. The appropriate pull-up resistor values will depend upon the
total bus capacitance and operating speed. The DS90UA101-Q1/DS90UA102-Q1 I2C bus data rate supports up
to 400 kbps according to I2C fast mode specifications. Figure 20, Figure 21, Figure 22, Figure 23 show I2C
waveforms of read/write bytes, basic operation, and start/stop conditions.
P
1
A
C
K
Data
Figure 20. Read Byte
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Register
Address
Slave
Address
7-bit Address
Data
P
0
A
C
K
A
C
K
A
C
K
Bus Activity:
Slave
Stop
Bus Activity:
Master
Start
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Figure 21. Write Byte
SDA
1
2
6
MSB
LSB
R/W
Direction
Bit
Acknowledge
from the Device
7-bit Slave Address
SCL
ACK
LSB
MSB
7
8
9
Data Byte
*Acknowledge
or Not-ACK
1
8
2
Repeated for the Lower Data Byte
and Additional Data Transfers
START
N/ACK
9
STOP
Figure 22. Basic Operation
SDA
SCL
S
P
START condition, or
START repeat condition
STOP condition
Figure 23. Start and Stop Conditions
IDx Address Decoder on the Serializer
The IDx pin (Figure 24) on the Serializer is used to decode and set the I2C address of the Serializer. There are 6
possible I2C addresses that can be set on the Serializer. The pin must be pulled to VDD (1.8V, not VDDIO) with a
10 kΩ resistor and a pull down resistor RID) of the recommended value to set the I2C address of the Serializer
(Table 2). The recommended maximum resistor tolerance is 1%.
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1.8V
10kQ
VDDIO
IDx
RPU
RPU
RID
HOST
Serializer
SCL
SCL
SDA
SDA
To other Devices
Figure 24. IDx Address Select
Table 2. IDx Recommended Resistor Values
IDx Resistor Value
Resistor RID (kΩ)
(1% Tolerance)
7-Bit Address
8-Bit Address (0 appended)
0
0x58
0xB0
2
0x59
0xB2
4.7
0x5A
0xB4
8.2
0x5B
0xB6
14
0x5C
0xB8
100
0x5D
0xBA
Note: The I2C address of the Serializer can also be set using 0x00[7:1] once 0x00[0] is set to 1.
I2C Pass-Through
I2C pass-through is the feature that provides a way to access remote devices at the other end of the serial
interface. For example, when the I2C Master is connected to the Deserializer and I2C pass-through is enabled on
the Deserializer, any I2C traffic targeted for the remote Serializer or remote slave will be allowed to pass through
the Deserializer to reach those respective devices.
See Figure 25 for an example of this function:
• If Master (DSP) transmits an I2C transaction for SER A, then DES A with I2C pass-through enabled will
transfer that I2C command to SER A. Responses from SER A will travel from SER A --> DES A --> DSP.
• If Master transmits an I2C transaction for address 0xA0, then DES A with I2C pass-through enabled will
transfer that I2C command to SER A, which will then transfer it to remote slave Device A. Responses from
Device A will travel from Device A --> SER A --> DES A --> DSP.
• As for DES B with I2C pass-through disabled, any I2C commands for SER B or Device B will NOT be passed
on the I2C bus to SER B/Device B.
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Serializer A
Digital
Audio
Source
DIN[7:0],
BCK,LRCK
SCK
SDA
SCL
Device A
Remote Slave ID:
(0xA0)
DOUT[7:0],
BCK,LRCK,
SCK
I2C
SER A: Remote I2C
Master Proxy
Serializer B
Digital
Audio
Source
Deserializer A
I2C
DES A: Local I2C Slave
Pass-Through Enabled
Device B
Remote Slave ID:
(0xA0)
DSP
Deserializer B
DIN[7:0],
BCK,LRCK
SCK
SDA
SCL
SDA
SCL
DOUT[7:0],
BCK,LRCK,
SCK
I2C
SER B: Remote I2C
Master Proxy
I2C
SDA
SCL
DES B: Local I2C Slave
Pass-Through Disabled
Master
Figure 25. I2C Pass-Through
To setup I2C pass-through on the Serializer, set 0x03[2] = 1 and configure registers 0x06, 0x07, 0x08, and 0x09
as needed (Deserializer I2C ID, Deserializer Alias ID, remote slave I2C ID, remote slave Alias ID, respectively).
Refer to Multiple Device Addressing for information about Alias IDs and refer to DS90UA101-Q1 REGISTER
INFORMATION for information to set these registers. To communicate with the remote Deserializer from the
Serializer side, registers 0x06 and 0x07 must be configured (register 0x06 is auto-loaded by default if there is
LOCK). To communicate with the remote slave connected to the remote Deserializer, configure registers 0x08
and 0x09.
To setup I2C pass-through on the Deserializer, set 0x03[3] = 1 and configure registers 0x06 - 0x17 as needed.
To communicate with the remote Serializer from the Deserializer side, registers 0x06 and 0x07 must be
configured (register 0x06 is auto-loaded by default if there is LOCK). To communicate with one or more remote
slaves connected to the remote Serializer, configure 0x08 - 0x17 accordingly.
Multiple Device Addressing
Some applications require multiple devices with the same fixed address to be accessed on the same I2C bus.
The DS90UA101-Q1/DS90UA102-Q1 provides slave ID aliasing to generate different target slave addresses
when connecting two or more identical devices remotely. Instead of addressing their actual I2C addresses, each
remote device can be addressed through a unique alias ID by programming the Slave Alias ID register on the
Serializer/Deserializer. By addressing the Slave Alias IDs, I2C slaves with identical, fixed addresses can now be
addressed independently. On the DS90UA101-Q1, up to 1 Slave Alias ID index is supported. On the
DS90UA102-Q1, up to 8 Slave Alias IDs can be supported. The Audio Module/DSP (I2C Master) must keep track
of the alias list in order to properly address the correct device.
Refer to Figure 26 for an example of this function:
• There is a local I2C bus between Audio Module, DES A, and DES B. Audio Module is the I2C Master, and
DES A and DES B are I2C slaves.
• The I2C protocol is bridged from DES A to SER A and from DES B to SER B. SER A is the master of its own
local I2C bus, and Source A and its µC/EEPROM are slaves on this bus. SER B is also the master of its local
I2C bus, and Source B and its µC/EEPROM are the slaves.
• Audio Module can now address remote slaves connected to SER A and SER B independently.
• Case 1: If Audio Module transmits to I2C slave 0xA0, DES A (address 0xC0) will forward the transaction to
SER A, which then forwards it to remote slave Source A. Responses from Source A will travel from Source A
--> SER A --> DES A --> Audio Module.
• Case 2: If Audio Module transmits to slave address 0xA4, DES B (address 0xC2) will recognize that 0xA4 is
mapped to 0xA0 and will transmit the command to SER B, which then forwards it to remote slave Source B.
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Responses from Source B will travel from Source B --> SER B --> DES B --> Audio Module.
Case 3: If Audio Module sends command to address 0xA6, DES B (address 0xC2) will forward the
transaction to SER B, which then forwards it to Source B's µC/EEPROM. Responses from Source B's
µC/EEPROM will travel from Source B's µC/EEPROM --> SER B --> DES B --> Audio Module.
Source A
Serializer A
Slave ID: (0xA0)
Digital
Audio
Source
DIN[7:0],
BCK, LRCK,
SCK
DOUT[7:0],
BCK, LRCK,
SCK
2
SDA
SCL
I C
SER A: ID[x] (0xB0)
PC/
EEPROM
Slave ID: (0xA2)
Source B
Serializer B
Slave ID: (0xA0)
Digital
Audio
Source
Deserializer A
DES A: ID[x] (0xC0)
SLAVE ID0 (0xA0)
SLAVE ALIAS ID0 (0xA0)
SLAVE ID1 (0xA2)
SLAVE ALIAS ID1 (0xA2)
PC/
EEPROM
Slave ID: (0xA2)
Audio
Module
Deserializer B
DOUT[7:0],
BCK, LRCK,
SCK
DIN[7:0],
BCK, LRCK,
SCK
SDA
SCL
SDA
SCL
2
I C
2
I C
SER B: ID[x] (0xB2)
2
I C
SDA
SCL
DES B: ID[x] (0xC2)
SLAVE ID0 (0xA0)
SLAVE ALIAS ID0 (0xA4)
SLAVE ID1 (0xA2)
SLAVE ALIAS ID1 (0xA6)
DSP
Master
Figure 26. Multiple Device Addressing
NOTE
The alias ID must be set in order to communicate with any remote device. For example:
• When there is only one SER/DES pair and no remote slaves: if I2C Master on the DES
side wants to communicate with the remote SER, I2C pass-through must be enabled
on the DES and the SER Alias ID must also be set before the I2C Master can
communicate with the remote SER (the SER ID is automatically configured by default if
there is LOCK).
• When there is only one SER/DES pair and one remote slave connected to the SER: if
I2C Master on the DES side (with pass-through enabled) wants to communicate with
the remote slave, the Slave ID and Slave Alias ID must be set before the I2C Master
can communicate with the remote slave, even if there is only one remote slave.
Slave Clock Stretching
To communicate and synchronize with remote devices on the I2C bus through the Bidirectional Control Channel,
the chipset utilizes bus clock stretching (holding the SCL line low) during data transmission. On the 9th clock of
every I2C transfer (before the ACK signal), the local I2C slave pulls the SCL line low until a response is received
from the remote I2C bus located on the other end of the serial interface. The slave device will not control the
clock and only stretches it until the remote peripheral has responded. The I2C Master must support slave clock
stretching in order to communicate with remote devices.
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General Purpose Inputs, Outputs (GPIs, GPOs, GPIOs) Descriptions
There are 4 dedicated general purpose inputs (GPIs) on the DS90UA101-Q1 and 4 dedicated general purpose
outputs (GPOs) on the DS90UA102-Q1. Inputs to the GPI pins on the Serializer are fed to the GPO outputs on
the Deserializer. The maximum GPI data rate is defined by the SCK source (up to 50 Mbps).
In addition, there are also 4 GPOs on the DS90UA101-Q1 and 4 GPIOs on the DS90UA102-Q1. The GPOs on
the Serializer can be configured as outputs for the input signals that are fed into the Deserializer GPIOs. The
GPIO maximum data rate is up to 66 kbps when configured for communication between Deserializer GPIO to
Serializer GPO. Both the GPOs on the Serializer and GPIOs on the Deserializer can also behave as outputs
whose values are set from local registers.
LVCMOS VDDIO Option
1.8V/3.3V Serializer inputs are user configurable to provide compatibility with 1.8V and 3.3V system interfaces.
Power Up Requirements and PDB Pin
The Serializer is active when the PDB pin is driven HIGH. Driving the PDB pin LOW powers down the device and
clears all control register configurations to default values. The PDB pin must be held low until the power supplies
(VDDn and VDDIO) have settled to the recommended operating voltage. This can be done by driving PDB
externally, or an RC network can be connected to the PDB pin to ensure PDB arrives after all the power supplies
have stabilized.
Powerdown
The PDB pin's function on the Serializer is to ENABLE or powerdown the device. This pin can be controlled by
the system and can be used to disable the SER to save power. If PDB = HIGH, the SER will lock to the valid
input SCK and transmit data to the DES by sending a serial stream at 28 times the SCK frequency. If SCK is idle
or missing, the SER will output a serial stream based on its internal oscillator frequency (Table 1). When PDB =
LOW, the high-speed driver outputs are static HIGH.
SCK Clock Edge Select (TRFB)
The TRFB selects which edge of the input clock is used to latch input data. If TRFB register is 1, data is latched
on the rising edge of the SCK. If TRFB register is 0, data is latched on the falling edge of the SCK.
SCK
DIN
TRFB: 0
TRFB: 1
Figure 27. Programmable SCK Strobe Select
Built In Self Test (BIST)
An optional at-speed built in self test (BIST) feature supports the testing of the high speed serial link and lowspeed back channel. This is useful in the prototype stage, equipment production, and in-system test and also for
system diagnostics.
BIST Configuration and Status
The DS90UA101-Q1/DS90UA102-Q1 chipset can be programmed into BIST mode using either pins or registers.
By default BIST configuration is controlled through pins on the DS90UA102-Q1. BIST can also be configured via
registers using BIST Control Register 0x24 on the DS90UA102-Q1. Pin based configuration is defined as follows:
• BISTEN (on DS90UA102-Q1) = HIGH: Enable the BIST mode, BISTEN = LOW: Disable the BIST mode.
• GPIO3 and GPIO2 of DS90UA102-Q1: Defines the BIST clock source (SCK vs. various internal oscillator
frequencies). See Table 3 below.
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Table 3. BIST Pin Configuration on DS90UA102-Q1 Deserializer (1)
(1)
DS90UA102-Q1 Deserializer GPIO[3:2]
Oscillator Source
BIST Frequency (MHz)
00
External
SCK
01
Internal
~25
10
Internal
~50
11
Internal
~12.5
Note: These pin settings will only be active when 0x24[3] = 1 and BIST is on.
The BIST mode provides various options for the clock source. Either external pins (GPIO3 and GPIO2 of DES)
or register 0x24 on DES can be used to configure the BIST to use SCK or various internal oscillator frequencies
as the clock source. Refer to Table 4 below for BIST register settings.
Table 4. BIST Register Configuration on DS90UA102-Q1 Deserializer (1)
(1)
DS90UA102-Q1 Deserializer 0x24[2:1]
Oscillator Source
BIST Frequency (MHz)
00
External
SCK
01
Internal
~50
10
Internal
~25
11
Internal
~12.5
Note: These register settings will only be active when 0x24[3] = 0 and BIST is on.
The BIST status can be monitored real-time on the PASS pin. For every frame with error(s), the PASS pin
toggles low momentarily. If two consecutive frames have errors, PASS will toggle twice to allow counting of
frames with errors. Once the BIST is done, the PASS pin reflects the pass/fail status momentarily (pass = no
errors, fail = one or more errors). The BIST result can also be read through I2C for the number of frames that
errored. The status register retains results until it is reset by a new BIST session or a device reset. For all
practical purposes, the BIST status can be monitored from the BIST Error Count register 0x25 on the
DS90UA102-Q1 Deserializer.
Sample BIST Sequence (Refer to Figure 28)
Step 1: BIST mode is enabled via the BISTEN pin on the DS90UA102-Q1 Deserializer, or through the
Deserializer control registers. The clock source is selected through the GPIO3 and GPIO2 pins as shown in
Table 3.
Step 2: The DS90UA101-Q1 Serializer BIST start command is activated through the back channel.
Step 3: The BIST pattern is generated and sent through the serial interface to the Deserializer. Once the
Serializer and Deserializer are in the BIST mode and the Deserializer acquires LOCK, the PASS pin of the
Deserializer goes high and BIST starts checking the data stream. If an error in the payload is detected the PASS
pin will switch low momentarily. During the BIST test, the PASS output can be monitored and counted to
determine the payload error rate.
Step 4: To stop the BIST mode, the Deserializer BISTEN pin is set low and the Deserializer stops checking the
data. The final test result is not maintained on the PASS pin. To check the number of BIST errors, check the
BIST Error Count register, 0x25 on the Deserializer. The link returns to normal operation after the Deserializer
BISTEN pin is low.
Figure 29 below shows the waveform diagram of a typical BIST test for two cases. Case 1 is error free, and
Case 2 shows one with multiple errors. In most cases, it is difficult to generate errors due to the robustness of
the link (differential data transmission, adaptive equalization, etc.), thus they may be introduced by greatly
extending the cable length, increasing the frequency, or by reducing signal condition enhancements (Rx
equalization).
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Normal
Step 1: DES in BIST
BIST
Wait
Step 2: Wait, SER in
BIST
BIST
start
Step 3: SER/DES in
BIST ± monitor
PASS
BIST
stop
Step 4: DES/SER in
Normal, check register
0x25 on DES
Figure 28. BIST System Flow Diagram
DES Outputs
BISTEN
(DES)
LOCK
SCK
(RFB = L)
Case 1 - Pass
SSO
DOUT[7:0]
DATA
(internal)
PASS
Prior Result
PASS
PASS
X
X
X
FAIL
Prior Result
Normal
Case 2 - Fail
X = bit error(s)
DATA
(internal)
BIST Test
BIST Duration
BIST
Result
Held
Normal
Figure 29. BIST Timing Diagram
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APPLICATIONS INFORMATION
AC Coupling
The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced coding scheme.
External AC coupling capacitors must be placed in series with the serial interface signal path as illustrated in
Figure 30 or Figure 31. Applications utilizing STP cable require a 0.1 µF coupling capacitor on both outputs
(DOUT+, DOUT-). Applications utilizing single-ended 50Ω coaxial cable require a 0.1 µF capacitor on the true
serial interface output (DOUT+). The unused data pin (DOUT-) requires a 0.047 µF capacitor coupled to a 50Ω
resistor to GND.
DOUT+
RIN+
DOUT-
RIN-
SER
DES
Figure 30. AC-Coupled Connection (STP)
DOUT+
RIN+
SER
DES
DOUT-
50Q
50Q
RIN-
Figure 31. AC-Coupled Connection (Coaxial)
For high-speed serial transmissions, the smallest available package should be used for the AC coupling
capacitor. This will help minimize degradation of signal quality due to package parasitics.
Typical Application Connection
Figure 32 and Figure 33 show typical application connections of the DS90UA101-Q1 Serializer. The serial
interface outputs must have external 0.1 µF coupling capacitors connected to the high-speed interconnect. The
Serializer has internal termination.
Bypass capacitors are placed near the power supply pins. Ferrite beads should also be used for effective noise
suppression. The digital audio electrical interface is LVCMOS format. The VDDIO pin may be connected to 3.3V or
1.8V. Device I2C address select is configured via the IDx pin.
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DS90UA101-Q1
VDDIO
VDDIO
C3
1.8V
VDDT
C4
C8
C9
C13
1.8V
VDDPLL
C5
SCK
LRCK
BCK
DIN0
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
Digital
Audio
Interface
C14
C10
FB1
1.8V
VDDCML
C6
C11
C15
C7
C12
FB2
1.8V
VDDD
C1
DOUT+
DOUT-
Serial
Interface
C2
50Q
1.8V
PDB
GPI
Interface
GPO
Interface
GPI0
GPI1
GPI2
GPI3
IDx
GPO0
GPO1
GPO2
GPO3
SET
10 kQ
1.8V
RID
10kQ
100kQ
VDDIO
RPU
I2C
Bus
Interface
RPU
SCL
SDA
RES0
DAP (GND)
NOTE:
C1 = 0.1 µF (50 WV)
C2 = 0.047 µF (50 WV)
C3 ± C7 = 0.01 µF
C8 - C12 = 0.1 µF
C13 - C14 = 4.7 µF
C15 = 22 µF
RPU = 4.7 kQ
RID (see IDx Resistor Value Table)
FB1, FB2: Impedance = 1 kQ (@ 100 MHz)
low DC resistance (<1Q)
Figure 32. DS90UA101-Q1 Typical Connection Diagram (Coaxial Interconnect)
34
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: DS90UA101-Q1
DS90UA101-Q1
www.ti.com
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
DS90UA101-Q1
VDDIO
VDDT
VDDIO
C3
1.8V
C4
C8
C9
C13
1.8V
VDDPLL
C5
SCK
LRCK
BCK
DIN0
DIN1
DIN2
DIN3
DIN4
DIN5
DIN6
DIN7
Digital
Audio
Interface
C14
C10
FB1
1.8V
VDDCML
C6
C11
C15
C7
C12
FB2
1.8V
VDDD
C1
DOUT+
DOUT-
Serial
Interface
C2
1.8V
PDB
GPI
Interface
GPO
Interface
GPI0
GPI1
GPI2
GPI3
IDx
GPO0
GPO1
GPO2
GPO3
SET
10 kQ
1.8V
RID
10kQ
100kQ
VDDIO
RPU
I2C
Bus
Interface
RPU
SCL
SDA
RES0
DAP (GND)
NOTE:
C1, C2 = 0.1 µF (50 WV)
C3 ± C7 = 0.01 µF
C8 - C12 = 0.1 µF
C13 - C14 = 4.7 µF
C15 = 22 µF
RPU = 4.7 kQ
RID (see IDx Resistor Value Table)
FB1, FB2: Impedance = 1 kQ (@ 100 MHz)
low DC resistance (<1Q)
Figure 33. DS90UA101-Q1 Typical Connection Diagram (STP Interconnect)
PCB Layout and Power System Considerations
Circuit board layout and stack-up for the Ser/Des devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies, and makes the value and placement of external bypass capacitors less critical. External bypass
capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors may use values in the
range of 0.01 µF to 0.1 µF. Tantalum capacitors may be in the 2.2 µF to 10 µF range. Voltage rating of the
tantalum capacitors should be at least 5X the power supply voltage being used.
Surface mount capacitors are recommended due to their smaller parasitics. When using multiple capacitors per
supply pin, locate the smaller value closer to the pin. A large bulk capacitor is recommend at the point of power
entry. This is typically in the 50 µF to 100 µF range and will smooth low frequency switching noise. It is
recommended to connect power and ground pins directly to the power and ground planes with bypass capacitors
connected to the plane with via on both ends of the capacitor. Connecting power or ground pins to an external
bypass capacitor will increase the inductance of the path.
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Product Folder Links: DS90UA101-Q1
35
DS90UA101-Q1
SNLS441A – JULY 2013 – REVISED SEPTEMBER 2013
www.ti.com
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20-30 MHz. To provide effective bypassing, multiple
capacitors are often used to achieve low impedance between the supply rails over the frequency of interest. At
high frequency, it is also a common practice to use two vias from power and ground pins to the planes, reducing
the impedance at high frequency.
Some devices provide separate power for different portions of the circuit. This is done to isolate switching noise
effects between different sections of the circuit. Separate planes on the PCB are typically not required. Pin
Description tables typically provide guidance on which circuit blocks are connected to which power pin pairs. In
some cases, an external filter many be used to provide clean power to sensitive circuits such as PLLs.
Use at least a four-layer board with a power and ground plane. Locate LVCMOS signals away from the
differential lines to prevent coupling from the LVCMOS lines to the differential lines. Closely-coupled differential
lines of 100Ω are typically recommended for differential interconnect. The closely coupled lines help to ensure
that coupled noise will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines
will also radiate less.
Information on the LLP style package is provided in TI Application Note 1187.
Interconnect Guidelines
See AN-1108 and AN-905 for full details.
• Use 100Ω coupled differential pairs
• Use the S/2S/3S rule in spacings
– – S = space between the pair
– – 2S = space between pairs
– – 3S = space to LVCMOS signal
• Minimize the number of Vias
• Use differential connectors when operating above 500 Mbps line speed
• Maintain balance of the traces
• Minimize skew within the pair
Additional general guidance can be found in the LVDS Owner’s Manual - available in PDF format from the Texas
Instrument web site at: www.ti.com/lvds.
36
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Product Folder Links: DS90UA101-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
DS90UA101TRTVJQ1
ACTIVE
WQFN
RTV
32
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UA101Q
DS90UA101TRTVRQ1
ACTIVE
WQFN
RTV
32
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UA101Q
DS90UA101TRTVTQ1
ACTIVE
WQFN
RTV
32
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 105
UA101Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-May-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DS90UA101TRTVJQ1
WQFN
RTV
32
2500
330.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
DS90UA101TRTVRQ1
WQFN
RTV
32
1000
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
DS90UA101TRTVTQ1
WQFN
RTV
32
250
178.0
12.4
5.3
5.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-May-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS90UA101TRTVJQ1
WQFN
RTV
32
2500
367.0
367.0
35.0
DS90UA101TRTVRQ1
WQFN
RTV
32
1000
210.0
185.0
35.0
DS90UA101TRTVTQ1
WQFN
RTV
32
250
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE OUTLINE
RTV0032A
WQFN - 0.8 mm max height
SCALE 2.500
PLASTIC QUAD FLATPACK - NO LEAD
5.15
4.85
B
A
PIN 1 INDEX AREA
5.15
4.85
0.8
0.7
C
SEATING PLANE
0.05
0.00
0.08 C
2X 3.5
SYMM
EXPOSED
THERMAL PAD
(0.1) TYP
9
16
8
17
SYMM
33
2X 3.5
3.1 0.1
28X 0.5
1
PIN 1 ID
24
32
25
32X
0.5
0.3
32X
0.30
0.18
0.1
0.05
C A B
4224386/B 04/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
RTV0032A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(3.1)
SYMM
32
25
SEE SOLDER MASK
DETAIL
32X (0.6)
1
24
32X (0.24)
28X (0.5)
(3.1)
33
SYMM
(4.8)
(1.3)
8
17
(R0.05) TYP
( 0.2) TYP
VIA
9
16
(1.3)
(4.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
OPENING
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4224386/B 04/2019
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
RTV0032A
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.775) TYP
32
25
32X (0.6)
32X (0.24)
1
24
28X (0.5)
(0.775) TYP
33
(4.8)
SYMM
(R0.05) TYP
4X (1.35)
8
17
9
16
4X (1.35)
SYMM
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 33
76% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4224386/B 04/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
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