Texas Instruments | Quadruple Low-Power Differential Receiver, SN55LBC173-DIE | Datasheet | Texas Instruments Quadruple Low-Power Differential Receiver, SN55LBC173-DIE Datasheet

Texas Instruments Quadruple Low-Power Differential Receiver, SN55LBC173-DIE Datasheet
SN55LBC173-DIE
www.ti.com
SGLS413 – JUNE 2013
QUADRUPLE LOW-POWER DIFFERENTIAL RECEIVER
Check for Samples: SN55LBC173-DIE
FEATURES
1
•
2
•
•
Meets EIA Standards RS-422-A, RS-423-A,
RS-485, and CCITT V.11
Designed to Operate With Pulse Durations
Designed for Multipoint Bus Transmission on
Long Bus Lines in Noisy Environments
•
•
Low-Power Consumption
Open-Circuit Fail-Safe Design
DESCRIPTION
The SN55LBC173-DIE is a monolithic quadruple differential line receiver with 3-state outputs designed to meet
the requirements of the EIA standards RS-422-A, RS-423-A, RS-485, and CCITT V.11. This device is optimized
for balanced multipoint bus transmission at data rates. The four receivers share two ORed enable inputs, one
active when high, the other active when low. Each receiver features high input impedance, input hysteresis for
increased noise immunity. Fail-safe design ensures that if the inputs are open circuited, the output is always
high. The SN55LBC173-DIE is designed using the Texas Instruments proprietary LinBiCMOSE™ technology that
provides low power consumption, high switching speeds, and robustness.
ORDERING INFORMATION (1)
(1)
(2)
PRODUCT
PACKAGE
DESIGNATOR
PACKAGE
SN55LBC173
TD
Bare die in waffle pack (2)
ORDERABLE PART NUMBER
PACKAGE QUANTITY
SN55LBC173TDA1
100
SN55LBC173TDA2
10
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinBiCMOSE is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
SN55LBC173-DIE
SGLS413 – JUNE 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
2
DIE THICKNESS
BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
10.5 mils.
Silicon with backgrind
Floating
AlSi(1%)Cu(0.5%)TiW
1850 nm
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN55LBC173-DIE
SN55LBC173-DIE
www.ti.com
SGLS413 – JUNE 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
Y MIN
X MAX
Y MAX
1B
1
626.5
1695
740.5
1809.5
1A
2
222.5
1690.7
323
1791.3
1Y
3
167.9
1432.1
274.8
1539
G
4
171.4
614.1
278.3
721
2Y
5
166.6
392.1
273.5
499
2A
6
279.2
132
379.7
232.6
2B
7
704.8
132
805.3
232.6
GND
8
966.2
132
1066.7
232.6
3B
9
1237.2
132
1337.7
232.6
3A
10
1626.7
132
1727.2
232.6
3Y
11
1758.7
403.7
1865.6
510.6
G
12
1758.5
749
1865.4
855.9
4Y
13
1750.1
1408.4
1857
1515.3
4A
14
1702.2
1698.4
1802.7
1799
4B
15
1296.7
1698.4
1397.2
1799
VCC
16
1024.2
1671.9
1124.7
1772.5
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: SN55LBC173-DIE
3
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2017
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
SN55LBC173TDA1
ACTIVE
0
100
TBD
Call TI
N / A for Pkg Type
25 to 25
SN55LBC173TDA2
ACTIVE
0
10
TBD
Call TI
N / A for Pkg Type
25 to 25
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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