Texas Instruments | DS92LV18 18-Bit Bus LVDS Serializer/Deserializer - 15-66 MHz (Rev. E) | Datasheet | Texas Instruments DS92LV18 18-Bit Bus LVDS Serializer/Deserializer - 15-66 MHz (Rev. E) Datasheet

Texas Instruments DS92LV18 18-Bit Bus LVDS Serializer/Deserializer - 15-66 MHz (Rev. E) Datasheet
DS92LV18
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DS92LV18 18-Bit Bus LVDS Serializer/Deserializer - 15-66 MHz
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FEATURES
DESCRIPTION
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The DS92LV18 Serializer/Deserializer (SERDES) pair
transparently translates a 18–bit parallel bus into a
BLVDS serial stream with embedded clock
information. This single serial stream simplifies
transferring a 18-bit, or less, bus over PCB traces
and cables by eliminating the skew problems
between parallel data and clock paths. It saves
system cost by narrowing data paths that in turn
reduce PCB layers, cable width, and connector size
and pins.
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15–66 MHz 18:1/1:18 Serializer/Deserializer
(2.376 Gbps Full Duplex Throughput)
Independent Transmitter and Receiver
Operation with Separate Clock, Enable, and
Power Down Pins
Hot Plug Protection (Power Up High
Impedance) and Synchronization (Receiver
Locks to Random Data)
Wide ±5% Reference Clock Frequency
Tolerance for Easy System Design Using
Locally-Generated Clocks
Line and Local Loopback Modes
Robust BLVDS Serial Transmission Across
Backplanes and Cables for Low EMI
No External Coding Required
Internal PLL, No External PLL Components
Required
Single +3.3V Power Supply
Low Power: 90mA (typ) Transmitter, 100mA
(typ) at 66 MHz with PRBS-15 Pattern
±100 mV Receiver Input Threshold
Loss of Lock Detection and Reporting Pin
Industrial −40 to +85°C Temperature Range
>2.0kV HBM ESD
Compact, Standard 80-Pin LQFP Package
This SERDES pair includes built-in system and
device test capability. The line loopback feature
enables the user to check the integrity of the serial
data transmission paths of the transmitter and
receiver while deserializing the serial data to parallel
data at the receiver outputs. The local loopback
feature enables the user to check the integrity of the
transceiver from the local parallel-bus side.
The DS92LV18 incorporates modified BLVDS
signaling on the high-speed I/O. BLVDS provides a
low power and low noise environment for reliably
transferring data over a serial transmission path. The
equal and opposite currents through the differential
data path control EMI by coupling the resulting
fringing fields together.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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Block Diagram
Figure 1. DS92LV18
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
−0.3V to +4V
Supply Voltage (VCC)
LVCMOS/LVTTL Input Voltage
−0.3V to (VCC +0.3V)
LVCMOS/LVTTL Output Voltage
−0.3V to (VCC +0.3V)
Bus LVDS Receiver Input Voltage
−0.3V to +3.9V
Bus LVDS Driver Output Voltage
−0.3V to +3.9V
Bus LVDS Output Short Circuit Duration
10ms
Junction Temperature
+150°C
Storage Temperature
−65°C to +150°C
Lead Temperature (Soldering, 4 seconds)
+260°C
Maximum Package Power Dissipation Capacity Package Derating:
80L LQFP
23.2 mW/°C above +25°C
θJA
43°C/W
θJC
11.1°C/W
ESD Rating (HBM)
(1)
(2)
>2.0kV
“Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be ensured. They are not meant to imply
that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device operation.
If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
Recommended Operating Conditions
Min
Nom
Max
Supply Voltage (VCC)
3.15
3.3
3.45
V
Operating Free Air Temperature (TA)
−40
+25
+85
°C
Clock Rate
15
66
MHz
Supply Noise
100
Units
mV
(p-p)
2
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Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Pin/Freq.
Min
Typ (1)
Max
Units
2.0
VCC
V
GND
0.8
V
−1.5
V
LVCMOS/LVTTL DC Specifications
VIH
High Level Input Voltage
VIL
Low Level Input Voltage
VCL
Input Clamp Voltage
ICL = −18 mA
IIN
Input Current
VIN = 0V or 3.6V
VOH
High Level Output Voltage
IOH = −9 mA
VOL
Low Level Output Voltage
IOL = 9 mA
IOS
Output Short Circuit Current
VOUT = 0V
TRI-STATE Output Current
PWRDN or REN =
0.8V, VOUT = 0V or
VCC
IOZ
DEN, TCLK, TPWDN,
DIN,
SYNC, RCLK_R/F,
REN, REFCLK,
RPWDN
ROUT, RCLK, LOCK
ROUT, RCLK
-0.7
−10
±2
+10
μA
2.3
3.0
VCC
V
GND
0.33
0.5
V
−15
−48
−85
mA
−10
±0.4
+10
μA
+100
mV
Bus LVDS DC specifications
VTH (2)
VTL (2)
IIN
Differential Threshold High
Voltage
VCM = +1.1V
Differential Threshold Low
Voltage
Input Current
VOD (2)
Output Differential Voltage
(DO+) - (DO-)
ΔVOD (2)
Output Differential Voltage
Unbalance
VOS
Offset Voltage
ΔVOS
Offset Voltage Unbalance
−100
VIN = +2.4V, VCC =
3.6V or 0V
mV
RI+, RI-
VIN = 0V, VCC = 3.6V or
0V
−10
±5
+10
μA
−10
±5
+10
μA
350
500
550
mV
2
15
mV
1.2
1.25
V
2.7
15
mV
-35
-50
-70
mA
(3)
Figure 19, ,
RL = 100Ω
1.05
IOS
Output Short Circuit Current
DO = 0V, Din = H,
TPWDN and DEN =
2.4V
IOZ
TRI-STATE Output Current
TPWDN or DEN =
0.8V, DO = 0V OR
VDD
-10
±1
10
µA
IOX
Power-Off Output Current
VDD = 0V, DO = 0V or
3.6V
-10
±1
10
µA
DO+, DO-
SER/DES SUPPLY CURRENT (DVDD, PVDD and AVDD pins)
ICCT
ICCX
(1)
(2)
(3)
Total Supply Current (includes
load current)
Supply Current Powerdown
CL = 15pF,
RL = 100 Ω
f = 66 MHz, PRBS-15
pattern
190
CL = 15 pF,
RL = 100 Ω
f = 66 MHz, Worst case
pattern (Checker-board
pattern)
220
320
mA
1.5
3.0
mA
PWRDN = 0.8V, REN
= 0.8V
mA
Typical values are given for VCC = 3.3V and TA = +25°C.
Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground
except VOD, ΔVOD, VTH and VTL which are differential voltages.
The VOD specification is a measurement of the difference between the single-ended VOH and VOL output voltages across a100 ohm
load. Applying the formula OUT+ - OUT- to the differential outputs will result in a waveform with peak to peak amplitude equal to twice
the datasheet indicated VOD.
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Serializer Timing Requirements for TCLK
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
(1)
Parameter
Conditions
Min
Typ
Max
Units
tTCP
Transmit Clock Period
15.2
T
66.7
ns
tTCIH
Transmit Clock High Time
0.4T
0.5T
0.6T
ns
tTCIL
Transmit Clock Low Time
0.4T
0.5T
0.6T
ns
tCLKT
TCLK Input Transition Time
3
6
ns
tJIT
TCLK Input Jitter
80
ps
(RMS)
See
(1)
Specified by Design (SBD) using statistical analysis.
Serializer Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
(1)
(2)
Symbol
Parameter
tLLHT
Bus LVDS Low-to-High
Transition Time
tLHLT
Bus LVDS High-to-Low
Transition Time
Conditions
Min
Figure 4, (1)
RL = 100Ω,
CL=10pF to GND
(1)
tDIS
DIN (0-17) Setup to TCLK
Figure 7,
RL = 100Ω,
CL=10pF to GND
tDIH
DIN (0-17) Hold from TCLK
tHZD
DO ± HIGH to
TRI-STATE Delay
tLZD
DO ± LOW to TRI-STATE
Delay
tZHD
DO ± TRI-STATE to HIGH
Delay
tZLD
DO ± TRI-STATE to LOW
Delay
tSPW
SYNC Pulse Width
tPLD
Serializer PLL Lock Time
Figure 9, RL = 100Ω
510*tTCP
tSD
Serializer Delay
Figure 11, RL = 100Ω
tTCP + 1.0
tRJIT
Random Jitter
Room Temp., 3.3V,
66 MHz
tDJIT
Deterministic Jitter
Figure 17, (1)
Max
Units
0.2
0.4
ns
0.2
0.4
ns
2.4
ns
0
ns
Figure 8 (2) RL = 100Ω,
CL=10pF to GND
Figure 10, RL = 100Ω
Typ
2.3
10
ns
1.9
10
ns
1.0
10
ns
1.0
10
ns
6*tTCP
ns
1024*tTCP
ns
tTCP + 4.0
ns
5*tTCP
tTCP + 2.0
ps
(RMS)
4.5
15 MHz
-430
190
ps
66 MHz
-40
70
ps
Specified by Design (SBD) using statistical analysis.
Due to TRI-STATE of the Serializer, the Deserializer will lose PLL lock and have to resynchronize before data transfer.
Deserializer Timing Requirements for REFCLK
Over recommended operating supply and temperature ranges unless otherwise specified.
4
Symbol
Parameter
Min
Typ
Max
Units
tRFCP
REFCLK Period
Conditions
15.2
T
66.7
ns
tRFDC
REFCLK Duty Cycle
40
50
60
%
tRFCP / tTCP
Ratio of REFCLK to TCLK
0.95
tRFTT
REFCLK Transition Time
1.05
6
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Deserializer Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol
Parameter
Conditions
Pin/Freq.
Min
tRCP
Receiver out Clock
Period
tRCP = tTCP
RCLK
15.2
RCLK
45
tRDC
RCLK Duty Cycle
tCLH
CMOS/TTL Low-toHigh Transition Time
tCHL
CMOS/TTL High-toLow Transition Time
tROS
ROUT (0-9) Setup
Data to RCLK
tROH
ROUT (0-9) Hold
Data to RCLK
tHZR
HIGH to TRI-STATE
Delay
tLZR
LOW to TRI-STATE
Delay
CL = 15 pF
Figure 5
ROUT(0-17),
LOCK,
RCLK
Typ
Max
Units
66.7
ns
50
55
%
2.2
4
ns
2.2
4
ns
0.35*tRCP
0.5*tRCP
ns
−0.35*tRCP
−0.5*tRCP
ns
Figure 13
Figure 14
ROUT(0-17),
LOCK
2.2
10
ns
2.2
10
ns
2.3
10
ns
2.9
10
ns
tZHR
TRI-STATE to HIGH
Delay
tZLR
TRI-STATE to LOW
Delay
tDD
Deserializer Delay
RCLK
1.75*tRCP + 4.0
1.75*tRCP + 6.1
ns
15MHz
3.7
10
μs
tDSR1 (1)
Deserializer PLL
Lock Time from
Powerdown (with
SYNCPAT)
66 MHz
1.9
4
μs
tDSR2 (1)
Deserializer PLL
Lock time from
SYNCPAT
15MHz
1.5
5
μs
66 MHz
0.9
2
μs
tRNMI-R
Ideal Deserializer
Noise Margin Right
Figure 18
15 MHz
1490
ps
66 MHz
180
ps
tRNMI-L
Ideal Deserializer
Noise Margin Left
Figure 18
15 MHz
1460
ps
66 MHz
330
ps
15 MHz
1060
ps
66 MHz
160
ps
tJI
(1)
(2)
(3)
(4)
(5)
Total Interconnect
Jitter Budget
1.75*tRCP + 2.1
Figure 15,
(2) (3)
Figure 16,
(2) (3)
(4) (3)
(4) (3)
See
(5)
tDSR1 is the time required by the deserializer to obtain lock when exiting powerdown mode. tDSR1 is specified with synchronization
patterns (SYNCPATs) present at the LVDS inputs (RI+ and RI-) before exiting powerdown mode. tDSR2 is the time required to obtain
lock for the powered-up and enabled deserializer when the LVDS input (RI+ and RI-) conditions change from not receiving data to
receiving synchronization patterns. Both tDSR1 and tDSR2 are specified with the REFCLK running and stable.
A sync pattern is a fixed pattern with 9-bits of data high followed by 9-bits of data low. The SYNC pattern is automatically generated by
the transmitter when the SYNC pin is pulled high.
Specified by Design (SBD) using statistical analysis.
tRNMI is a measure of how much phase noise (jitter) the deserializer can tolerate in the incoming data stream before bit errors occur. It is
a measurement in reference with the ideal bit position, please see AN-1217 (SNLA053) for detail.
Total Interconnect Jitter Budget (tJI) specifies the allowable jitter added by the interconnect assuming both transmitter and receiver are
DS92LV18 circuits. tJI is GBD using statistical analysis.
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AC Timing Diagrams and Test Circuits
Figure 2. “Worst Case” Serializer ICC Test Pattern
Figure 3. “Worst Case” Deserializer ICC Test Pattern
Figure 4. Serializer Bus LVDS Distributed Output Load and Transition Times
Figure 5. Deserializer CMOS/TTL Distributed Output Load and Transition Times
Figure 6. Serializer Input Clock Transition Time
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Figure 7. Serializer Setup/Hold Times
Figure 8. Serializer TRI-STATE Test Circuit and Timing
Figure 9. Serializer PLL Lock Time, and PWRDN TRI-STATE Delays
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Figure 10. SYNC Timing Delay
Figure 11. Serializer Delay
Figure 12. Deserializer Delay
Figure 13. Deserializer Setup and Hold Times
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Figure 14. Deserializer TRI-STATE Test Circuit and Timing
Figure 15. Deserializer PLL Lock Times and PWRDN TRI-STATE Delays
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Figure 16. Deserializer PLL Lock Time from SYNCPAT
Figure 17. Deterministic Jitter and Ideal Bit Position
tRNMI-L is the noise margin on the left of the figure above.
tRNMI-R is the noise margin on the right of the above figure.
Figure 18. Deserializer Noise Margin (tRNMI) and Sampling window
10
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VOD = (DO+)–(DO−).
Differential output signal is shown as (DO+)–(DO−), device in Data Transfer mode.
Figure 19. VOD Diagram
110
90
CURRENT (mA)
90
3.45V
80
70
60
3.30V
3.15V
50
50
40
30
10
10
20
30
40
50
60
70
FREQUENCY (MHz)
Figure 20. Typical ICC vs. Frequency with PRBS-15 Pattern (Transmitter Only)
110
110
3.45V
100
CURRENT (mA)
90
70
60
3.30V
50
50
3.15V
30
30
10
10
20
30
40
50
60
70
FREQUENCY (MHz)
Figure 21. Typical ICC vs. Frequency with PRBS-15 Pattern (Receiver Only)
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FUNCTIONAL DESCRIPTION
The DS92LV18 combines a serializer and deserializer onto a single chip. The serializer accepts an 18-bit
LVCMOS or LVTTL data bus and transforms it into a BLVDS serial data stream with embedded clock
information. The deserializer then recovers the clock and data to deliver the resulting 18-bit wide words to the
output.
The device has a separate transmit block and receive block that can operate independently of each other. Each
has a power down control to enable efficient operation in various applications. For example, the transceiver can
operate as a standby in a redundant data path but still conserve power. The part can be configured as a
Serializer, Deserializer, or as a Full Duplex SER/DES.
The DS92LV18 serializer and deserializer blocks each have three operating states. They are the Initialization,
Data Transfer, and Resynchronization states. In addition, there are two passive states: Powerdown and TRISTATE.
The following sections describe each operation mode and passive state.
Initialization
Before the DS92LV18 sends or receives data, it must initialize the links to and from another DS92LV18.
Initialization refers to synchronizing the Serializer's and Deserializer's PLL's to local clocks. The local clocks must
be the same frequency or within a specified range if from different sources. After the Serializers synchronize to
the local clocks, the Deserializers synchronize to the Serializers as the second and final initialization step.
Step 1: When VCC is applied to both Serializer and/or Deserializer, the respective outputs are held in TRI-STATE
and internal circuitry is disabled by on-chip power-on circuitry. When VCC reaches VCC OK (2.2V) the PLL in each
device begins locking to a local clock. For the Serializer, the local clock is the transmit clock, TCLK. For the
Deserializer, the local clock is applied to the REFCLK pin. A local on-board oscillator or other source provides
the specified clock input to the TCLK and REFCLK pin.
The Serializer outputs are held in TRI-STATE while the PLL locks to the TCLK. After locking to TCLK, the
Serializer block is now ready to send data or synchronization patterns. If the SYNC pin is high, then the Serializer
block generates and sends the synchronization patterns (sync-pattern).
The Deserializer output will remain in TRI-STATE while its PLL locks to the REFCLK. Also, the Deserializer
LOCK output will remain high until its PLL locks to incoming data or a sync-pattern on the RIN pins.
Step 2: The Deserializer PLL must synchronize to the Serializer to complete the initialization. The Serializer that
is generating the stream to the Deserializer must send random (non-repetitive) data patterns or sync-patterns
during this step of the Initialization State. The Deserializer will lock onto sync-patterns within a specified amount
of time. The lock to random data depends on the data patterns and therefore, the lock time is unspecified.
In order to lock to the incoming LVDS data stream, the Deserializer identifies the rising clock edge in a syncpattern and locks to it. If the Deserializer is locking to a random data stream from the Serializer, then it performs
a series of operations to identify the rising clock edge and locks to it. Because this locking procedure depends on
the data pattern, it is not possible to specify how long it will take. At the point when the Deserializer's PLL locks
to the embedded clock, the LOCK pin goes low and valid data appears on the output. Note that the LOCK signal
is synchronous to valid data appearing on the outputs.
The user's application determines whether SYNC or lock-to-random-data mode is the preferred method for
synchronization. If sync-patterns are preferred, the associated Deserializer’s LOCK pin is a convenient way to
provide control of the Serializer’s SYNC pin.
Data Transfer
After initialization, the DS92LV18 Serializer is able to transfer data to the Deserializer. The serial data stream
includes a start bit and stop bit appended by the serializer, which frames the eighteen data bits. The start bit is
always high and the stop bit is always low. The start and stop bits also function as clock bits embedded in the
serial stream.
The Serializer block accepts data from the DIN0-DIN17 parallel inputs. The TCLK signal latches the incoming
data on the rising edge. If the SYNC input is high for 6 TCLK cycles, the DS92LV18 does not latch data from
DIN0-DIN17.
12
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The Serializer transmits the data and clock bits (18+2 bits) at 20 times the TCLK frequency. For example, if
TCLK is 60 MHz, the serial rate is 60 X 20= 1200 Mbps. Since only 18 bits are from input data, the serial
'payload' rate is 18 times the TCLK frequency. For instance, if TCLK = 60 MHz, the payload data rate is 60 X 18
= 1080 Mbps. TCLK is provided by the data source and must be in the range of 15 MHz to 66 MHz.
When the Deserializer channel synchronizes to the input from a Serializer, it drives its LOCK pin low and
synchronously delivers valid data on the output. The Deserializer locks to the embedded clock, uses it to
generate multiple internal data strobes, and then drives the recovered clock to the RCLK pin. The recovered
clock (RCLK output pin) is synchronous to the data on the ROUT[0:17] pins. While LOCK is low, data on
ROUT[0:17] is valid. Otherwise, ROUT[0:17] is invalid.
ROUT[0:17], LOCK, and RCLK signals will drive a minimum of three CMOS input gates (15pF total load) at a 66
MHz clock rate. This drive capacity allows bussing outputs of multiple Deserializers to multiple destination ASIC
inputs. REN controls TRI-STATE for ROUTn and the RCLK pin on the Deserializer.
The Deserializer input pins are high impedance during receiver powerdown (RPWDN low) and power-off (VCC =
0V).
Resynchronization
If the Deserializer loses lock, it will automatically try to resynchronize. For example, if the embedded clock edge
is not detected two times in succession, the PLL loses lock and the LOCK pin is driven high. The Deserializer
then enters the operating mode where it tries to lock to a random data stream. It looks for the embedded clock
edge, identifies it and then proceeds through the synchronization process.
The logic state of the LOCK signal indicates whether the data on ROUT is valid; when it is low, the data is valid.
The system must monitor the LOCK pin to determine whether data on the ROUT is valid. Because there is a
short delay in the LOCK signal’s response to the PLL losing synchronization to the incoming data stream, the
system must determine the validity of data for the cycles before the LOCK signal goes high.
The user can choose to resynchronize to the random data stream or to force fast synchronization by pulsing the
Serializer’s SYNC pin. Lock times depend on serial data stream characteristics. The primary constraint on the
"random" lock time is the initial phase relation between the incoming data and the REFCLK when the
Deserializer powers up. An advantage of using the SYNC pattern to force synchronization is the ability for the
user to predict the delay before the PLL regains lock. This scheme is left up to the user discretion. One
recommendation is to provide a feedback loop using the LOCK pin itself to control the sync request of the
Serializer, which is the SYNC pin.
If a specific pattern is repetitive, the Deserializer’s PLL will not lock in order to prevent the Deserializer from
locking to the data pattern rather than the clock. We refer to such pattern as a repetitive multi-transition, RMT.
This occurs when more than one Low-High transition takes places in a clock cycle over multiple cycles. This
occurs when any bit, except DIN 17, is held at a low state and the adjacent bit is held high, creating a 0-1
transition. The internal circuitry accomplishes this by detecting more than one potential position for clocking bits.
Upon detection, the circuitry will prevent the LOCK output from becoming active until the RMT pattern changes.
Once the RMT pattern changes and the internal circuitry recognizes the clock bits in the serial data stream, the
PLL of the Deserializer will lock, which will drive the LOCK output to low and the output data ROUTn will become
valid.
Powerdown
The Powerdown state is a low power sleep mode that the Serializer and Deserializer will occupy while waiting for
initialization. You can also use TPWDN and RPWDN to reduce power when there are no pending data transfers.
The Deserializer enters powerdown mode when RPWDN is driven low. In powerdown mode, the PLL stops and
the outputs enter TRI-STATE, which reduces supply current to the μA range.
To bring the Deserializer block out of the Powerdown state, the system drives RPWDN high. When the
Deserializer exits Powerdown, it automatically enters the Initialization state. The system must then allow time for
Initialization before data transfer can begin.
The TPWDN pin driven low forces the Serializer block into low power consumption, where the supply current is in
the μA range. The Serializer PLL stops and the output goes into a TRI-STATE condition.
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To bring the Serializer block out of the powerdown state, the system drives TPWDN high. When the Serializer
exits Powerdown, its PLL must lock to TCLK before it is ready for the Initialization state. The system must then
allow time for Initialization before data transfer can begin.
TRI-STATE
When the system drives the REN pin low, the Deserializer’s outputs enter TRI-STATE. This will TRI-STATE the
receiver output pins (ROUT[0:17]) and RCLK. When the system drives REN high, the Deserializer will return to
the previous state as long as all other control pins remain static (RPWDN).
When the system drives the DEN pin low, the Serializer’s LVDS outputs enter TRI-STATE. When the system
drives the DEN signal high, the Serializer output will return to the previous state as long as all other control and
data input pins remain in the same condition before DEN was driven low.
Loopback Test Operation
The DS92LV18 includes two Loopback modes for testing the device functionality and the transmission line
continuity. Asserting the Line Loopback control signal connects the serial data input (RIN±) to the serial data
output (DO±) and to the parallel data output (ROUT[0:17]). The serial data goes through deserializer and
serializer blocks.
Asserting the Local Loopback control signal connects the parallel data input (DIN[0:17]) back to the parallel data
output (ROUT[0:17]). The connection route includes all the functional blocks of the SER/DES Pair. The serial
data output (DO±) is automatically disabled during the Local Loopback operating mode.
Please note that when switching between normal, line, or loopback modes, the deserializer will need to relock. In
order for the serializer and deserializer to resync, the TCLK and REFCLK frequencies must be within ±5% of
each other.
Application Information
USING THE DS92LV18
The DS92LV18 combines a Serializer and Deserializer onto a single chip that sends 18 bits of parallel TTL data
over a serial Bus LVDS link up to 1.32 Gbps. Serialization of the input data is accomplished using an on-board
PLL at the Serializer which embeds two clock bits with the data. The Deserializer uses a separate reference
clock (REFCLK) and an on-board PLL to extract the clock information from the incoming data stream and
deserialize the data. The Deserializer monitors the incoming clock information to determine lock status and will
indicate loss of lock by asserting the LOCK output high.
POWER CONSIDERATIONS
An all CMOS design of the Serializer and Deserializer makes them inherently low power devices. Additionally,
the constant current source nature of the LVDS outputs minimize the slope of the speed vs. ICC curve of CMOS
designs.
POWERING UP THE DESERIALIZER
The REFCLK input can be running before the Deserializer is powered up and it must be running in order for the
Deserializer to lock to incoming data. The Deserializer outputs will remain in TRI-STATE until the Deserializer
detects data transmission at its inputs and locks to the incoming serial data stream.
NOISE MARGIN
The Deserializer noise margin is the amount of input jitter (phase noise) that the Deserializer can tolerate and still
reliably recover data. Various environmental and systematic factors include:
Serializer: TCLK jitter, VCC noise (noise bandwidth and out-of-band noise)
Media: ISI, VCM noise
Deserializer: VCC noise
For a graphical representation of noise margin, please see Figure 18.
14
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RECOVERING FROM LOCK LOSS
In the case where the Serializer loses lock during data transmission, up to 5 cycles of data that were previously
received could be invalid. This is due to a delay in the lock detection circuit. The lock detect circuit requires that
invalid clock information be received 2 times in a row to indicate loss of lock. Since clock information has been
lost, it is possible that data was also lost during these cycles. If the Deserializer LOCK pin goes low, data from at
least the previous 5 cycles should be resent upon regaining lock.
Lock can be regained at the Deserializer by causing the Serializer to resend SYNC patterns as described above
or by random data locking which can take more time depending upon the data patterns being received.
INPUT FAILSAFE
In the event that the Deserializer is disconnected from the Serializer, or the Deserializer loses lock, the failsafe
circuitry is designed to reject a certain amount of noise from being interpreted as data or clock. The Deserializer
outputs (ROUT [0:17] and RCLK) will be asserted HIGH.
HOT INSERTION
All of TI’s LVDS devices are hot pluggable if you follow a few rules. When inserting, ensure the Ground pin(s)
makes contact first, then the VCC pin(s), then the I/O pin(s). When removing, the I/O pins should be unplugged
first, then VCC, then Ground.
PCB LAYOUT AND POWER SYSTEM CONSIDERATIONS
Circuit board layout and stack-up for the BLVDS devices should be designed to provide low-noise power feed to
the device. Good layout practice will also separate high-frequency or high-level inputs and outputs to minimize
unwanted stray noise pickup, feedback and interference. Power system performance may be greatly improved by
using thin dielectrics (2 to 4 mils) for power / ground sandwiches. This arrangement provides plane capacitance
for the PCB power system with low-inductance parasitics, which has proven especially effective at high
frequencies above approximately 50MHz, and makes the value and placement of external bypass capacitors less
critical. External bypass capacitors should include both RF ceramic and tantalum electrolytic types. RF capacitors
may use values in the range of 0.01 uF to 0.1 uF. Tantalum capacitors may be in the 2.2 uF to 10 uF range.
Voltage rating of the tantalum capacitors should be at least 5X the power supply voltage being used.
It is a recommended practice to use two vias at each power pin as well as at all RF bypass capacitor terminals.
Dual vias reduce the interconnect inductance by up to half, thereby reducing interconnect inductance and
extending the effective frequency range of the bypass components. Locate RF capacitors as close as possible to
the supply pins, and use wide low impedance traces (not 50 Ohm traces). Surface mount capacitors are
recommended due to their smaller parasitics. When using multiple capacitors per supply pin, locate the smaller
value closer to the pin. A large bulk capacitor is recommend at the point of power entry. This is typically in the
50uF to 100uF range and will smooth low frequency switching noise. It is recommended to connect power and
ground pins directly to the power and ground planes with bypass capacitors connected to the plane with via on
both ends of the capacitor. Connecting power or ground pins to an external bypass capacitor will increase the
inductance of the path.
A small body size X7R chip capacitor, such as 0603, is recommended for external bypass. Its small body size
reduces the parasitic inductance of the capacitor. The user must pay attention to the resonance frequency of
these external bypass capacitors, usually in the range of 20-30 MHz range. To provide effective bypassing,
multiple capacitors are often used to achieve low impedance between the supply rails over the frequency of
interest. At high frequency, it is also a common practice to use two vias from power and ground pins to the
planes, reducing the impedance at high frequency.
Some devices provide separate power and ground pins for different portions of the circuit. This is done to isolate
switching noise effects between different sections of the circuit. Separate planes on the PCB are typically not
required. Pin Description tables typically provide guidance on which circuit blocks are connected to which power
pin pairs. In some cases, an external filter many be used to provide clean power to sensitive circuits such as
PLLs.
Use at least a four layer board with a power and ground plane. Locate CMOS (TTL) signals away from the LVDS
lines to prevent coupling from the CMOS lines to the LVDS lines. Closely-coupled differential lines of 100 Ohms
are typically recommended for LVDS interconnect. The closely-coupled lines help to ensure that coupled noise
will appear as common-mode and thus is rejected by the receivers. The tightly coupled lines will also radiate
less.
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Termination of the LVDS interconnect is required. For point-to-point applications, termination should be located at
the load end. Nominal value is 100 Ohms to match the line's differential impedance. Place the resistor as close
to the receiver inputs as possible to minimize the resulting stub between the termination resistor and receiver.
Additional general guidance can be found in the LVDS Owner's Manual - available in PDF format from the TI
web site at: www.ti.com/lvds.
Specific guidance for this device is provided next.
DS92LV18 BLVDS SER/DES PAIR
General device specific guidance is given below. Exact guidance can not be given as it is dictated by other board
level /system level criteria. This includes the density of the board, power rails, power supply, and other integrated
circuit power supply needs.
DVDD = DIGITAL SECTION POWER SUPPLY
These pins supply the digital portion of the device as well as the receiver output buffers. The Deserializer’s
DVDD requires more bypass to power the outputs under synchronous switching conditions. The Serializer’s
DVDD is less critical. The receiver’s DVDD pins power 4 outputs from each DVDD pin. An estimate of local
capacitance required indicates a minimum of 22nF is required. This is calculated by taking 4 times the maximum
short current (4 X 70 = 280mA), multiplying by the rise time of the part (4ns), and dividing by the maximum
allowed droop in VDD (assume 50mV) yields 22.4nF. Rounding up to a standard value, 0.1uF is selected for
each DVDD pin.
PVDD = PLL SECTION POWER SUPPLY
The PVDD pin supplies the PLL circuit. Note that the DS92LV18 has two separate PLL and supply pins. The
PLL(s) require clean power for the minimization of Jitter. A supply noise frequency in the 300 kHz to 1 MHz
range can cause increased output jitter. Certain power supplies may have switching frequencies or high
harmonic content in this range. If this is the case, filtering of this noise spectrum may be required. A notch filter
response is best to provide a stable VDD, suppression of the noise band, and good high-frequency response
(clock fundamental). This may be accomplished with a pie filter (CRC or CLC). If employed, a separate pie filter
is recommended for each PLL to minimize drop in potential due to the series resistance. The pie filter should be
located close to the PVDD power pin. Separate power planes for the PVDD pins is typically not required.
AVDD = LVDS SECTION POWER SUPPLY
The AVDD pins power the LVDS portion of the circuit. The DS92LV18 has four AVDD pins. Due to the nature of
the design, current draw is not excessive on these pins. A 0.1uF capacitor is sufficient for these pins. If space is
available, a 0.01uF capacitor may be used in parallel with the 0.1uF capacitor for additional high frequency
filtering.
GROUNDS
The AGND pin should be connected to the signal common in the cable for the return path of any common-mode
current. Most of the LVDS current will be odd-mode and return within the interconnect pair. A small amount of
current may be even-mode due to coupled noise and driver imbalances. This current should return via a low
impedance known path.
A solid ground plane is recommended for both DVDD, PVDD or AVDD. Using a split plane may cause ground
loops or a difference in ground potential at various ground pins of the device.
16
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Truth Tables
Transmitter Truth Table
TPWDN (Pin 42)
DEN (Pin 19)
TX PLL Status (Internal)
LVDS Outputs (Pins 13 and 14)
L
X
X
Hi Z
H
L
X
Hi Z
H
H
Not Locked
Hi Z
H
H
Locked
Serialized Data with Embedded Clock
Receiver Truth Table
RPWDN (Pin 01)
REN (Pin 02)
RX PLL Status (Internal)
ROUTn & RCLK
(See Pin Diagram)
LOCK (Pin 63)
L
X
X
Hi Z
Hi Z
H
L
X
Hi Z
L = PLL Locked;
H = PLL Unlocked
H
H
Not Locked
H
H
H
H
Locked
Data & CLK Active
L
Footprint Changes between the DS92LV16 and the DS92LV18
DS92LV16 vs. DS92LV18 Footprint Changes
Pin Number
DS92LV16
DS92LV18
3
CONFIG1
DIN17
18
CONFIG2
DIN16
62
DVDD
ROUT16
80
DGND
ROUT17
PCB Compatibility Between the DS92LV16 and DS92LV18
Figure 22.
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Pin Diagram
Figure 23. DS92LV18
80-Pin LQFP
Top View
18
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Table 1. PIN DESCRIPTIONS
Pin #
Pin Name
I/O
1
RPWDN
CMOS, I
RPWDN = Low will put the Receiver in low power, stand-by, mode.
Note: The Receiver PLL will lose lock. (1)
2
REN
CMOS, I
REN = Low will disable the Receiver outputs. Receiver PLL remains
locked. (See LOCK pin description) (1)
4
REFCLK
CMOS, I
Frequency reference clock input for the receiver.
5, 10, 11, 15
AVDD
6,9,12,16
AGND
7
RIN+
Description
Analog Voltage Supply
Analog Ground
LVDS, I
Receiver LVDS True Input
8
RIN-
LVDS, I
Receiver LVDS Inverting Input
13
DO+
LVDS, O
Transmitter LVDS True Output
14
DO-
LVDS, O
Transmitter LVDS Inverting Output
17
TCLK
CMOS, I
Transmitter reference clock. Used to strobe data at the DIN Inputs and
to drive the transmitter PLL. See TCLK Timing Requirements.
19
DEN
CMOS, I
DEN = Low will disable the Transmitter outputs. The transmitter PLL will
remain locked. (1)
20
SYNC
CMOS, I
SYNC = High will cause the transmitter to ignore the data inputs and
send SYNC patterns to provide a locking reference to receiver(s). See
Functional Description. (1)
DIN (0:17)
CMOS, I
Transmitter data inputs. (1)
3, 18,21, 22, 23, 24, 25,
26, 27, 28, 33, 34, 35, 36,
37, 38, 39, 40
29,32
PGND
PLL Ground.
30,31
PVDD
PLL Voltage supply.
41, 44, 51, 52, 59, 60, 61,
68
DGND
Digital Ground.
42
43, 50, 53, 58, 69
45, 46, 47, 48, 54, 55, 56,
57, 62, 64, 65, 66, 67, 70,
71, 72, 73, 80
(1)
TPWDN
CMOS, I
DVDD
TPWDN = Low will put the Transmitter in low power, stand-by mode.
Note: The transmitter PLL will lose lock. (1)
Digital Voltage Supplies.
ROUT (0:17)
CMOS, O
Receiver Outputs.
49
RCLK
CMOS, O
Recovered Clock. Parallel data rate clock recovered from embedded
clock. Used to strobe ROUT (0:17). LVCMOS Level output.
63
LOCK
CMOS, O
LOCK indicates the status of the receiver PLL. LOCK = H - receiver PLL
is unlocked, LOCK = L - receiver PLL is locked.
74,76
PGND
PLL Grounds.
75,77
PVDD
PLL Voltage Supplies.
78
LINE_LE
CMOS, I
LINE_LE = High enables the receiver loopback mode. Data received at
the RIN± inputs is fed back through the DO± outputs. (1)
79
LOCAL_LE
CMOS, I
LOCAL_LE = High enables the transmitter loopback mode. Data
received at the DIN inputs is fed back through the ROUT outputs. (1)
Input defaults to "low" state when left open due to an internal on-chip pull-down circuit.
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
20
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 19
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PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2015
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
DS92LV18TVV/NOPB
ACTIVE
LQFP
PN
80
119
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
DS92LV18TVV
>B
DS92LV18TVVX/NOPB
ACTIVE
LQFP
PN
80
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
DS92LV18TVV
>B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jun-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DS92LV18TVVX/NOPB
Package Package Pins
Type Drawing
LQFP
PN
80
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
1000
330.0
24.4
Pack Materials-Page 1
14.65
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
14.65
2.15
24.0
24.0
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Jun-2015
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS92LV18TVVX/NOPB
LQFP
PN
80
1000
367.0
367.0
45.0
Pack Materials-Page 2
MECHANICAL DATA
MTQF010A – JANUARY 1995 – REVISED DECEMBER 1996
PN (S-PQFP-G80)
PLASTIC QUAD FLATPACK
0,27
0,17
0,50
0,08 M
41
60
61
40
80
21
0,13 NOM
1
20
Gage Plane
9,50 TYP
12,20
SQ
11,80
14,20
SQ
13,80
0,25
0,05 MIN
0°– 7°
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040135 / B 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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